An electronic device

Abstract

An electronic device is provided. The electronic device includes a device housing, a heat dissipation housing, a blocking piece, a fan and a heating device. The heat dissipation housing is arranged on the device housing, and the heat dissipation housing has an air duct with an air inlet and an air outlet. The fan is arranged towards the air duct, and under the driving of the fan, air flow can enter the heat dissipation housing from the air inlet, flow along the air duct inside the heat dissipation housing, and finally flow out of the heat dissipation housing from the air outlet. The blocking piece is movably connected with the heat dissipation housing, and the blocking piece and the heat dissipation housing have a first positional relationship and a second positional relationship. When the blocking piece and the heat dissipation housing are in the first positional relationship, the blocking piece avoids at least part of the air inlet and at least part of the air outlet. When the blocking piece and the heat dissipation housing are in the second positional relationship, the blocking piece blocks the air inlet and the air outlet.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and more particularly to an electronic device. Background Technology

[0002] As electronic devices become more functional, their applications are also becoming increasingly diverse. In scenarios where electronic devices run 3D software, games, video editing software, etc., the power consumption of the device chips will increase significantly. With this increased power consumption, the device chips will also generate a large amount of heat. If the heat generated by the device chips cannot be dissipated in time, it may lead to thermal failure of the entire device, resulting in problems such as device crashes and damage to internal chip circuits, affecting user experience. Current technologies have relatively low heat dissipation efficiency for device chips, which cannot meet the heat dissipation requirements in special scenarios, thus increasing the probability of device failure due to thermal failure. Summary of the Invention

[0003] This application provides an electronic device, which includes a heat sink housing and a fan disposed on the heat sink housing, to improve the heat dissipation effect of heat-generating components in the electronic device.

[0004] This application provides an electronic device including a device housing, a heat sink housing, a fan, and a heating element. The heat sink housing is disposed within the device housing and has an air duct with an inlet and an outlet. The fan is located within the air duct. Driven by the fan, airflow enters the heat sink housing through the inlet, flows along the air duct inside the heat sink housing, and finally exits the heat sink housing through the outlet. The heating element is located within the device housing and is thermally connected to the air duct. When airflow passes through the air duct, the heating element exchanges heat with the airflow, thereby lowering its temperature.

[0005] In addition to the aforementioned components, the electronic device also includes a sealing element, which is movably connected to a heat sink housing, and the sealing element and the heat sink housing have a first positional relationship and a second positional relationship. When the sealing element and the heat sink housing are in the first positional relationship, the sealing element avoids at least a portion of the air inlet and at least a portion of the air outlet, thereby allowing the air inlet and air outlet to be in a ventilated state. When the sealing element and the heat sink housing are in the second positional relationship, the sealing element blocks the air inlet and air outlet, thereby allowing the air inlet and air outlet to be in a blocked state. By controlling the relative movement of the sealing element and the heat sink housing, the air inlet and air outlet can be switched between the aforementioned ventilated state and blocked state.

[0006] In practical applications, in scenarios where the heat-generating components produce a significant amount of heat, the sealing components and heat sink can be adjusted to the primary position, ensuring ventilation at the air inlet and outlet, thus providing air cooling for the heat-generating components when the fan is turned on. In scenarios where the heat-generating components produce less heat, the sealing components and heat sink can be adjusted to the secondary position, effectively sealing the air inlet and outlet, preventing dust, moisture, and other contaminants from the external environment from entering the electronic device, thereby improving its dustproof and waterproof performance.

[0007] In some embodiments, the electronic device further includes a heat-conducting component that is thermally connected to a heat-generating device within the electronic device, and the heat-conducting component is at least partially located within an air duct. The heat-conducting component can conduct heat generated by the heat-generating device to the air duct, allowing this heat to be dissipated into the external environment with the airflow. Furthermore, the connection of the heat-conducting component allows for more flexible arrangement of the heat-generating device. For example, the heat-generating device can be positioned close to the air duct or away from it.

[0008] In the specific configuration of the air ducts, the heat dissipation housing can have multiple air ducts, and each air duct can be equipped with at least one fan. For any two of the aforementioned multiple air ducts, the extension paths of these two air ducts are different, and their air inlets can be the same or different. Similarly, the air outlets of these two air ducts can be the same or different. Specifically, for ease of description, the two air ducts mentioned above are referred to as the first air duct and the second air duct, respectively. In one possible configuration, the first air duct and the second air duct have the same air inlet, and the first air duct and the second air duct have different air outlets. In another possible configuration, the first air duct and the second air duct have different air inlets, and the first air duct and the second air duct also have different air outlets.

[0009] In forming the aforementioned air duct, multiple baffles can be installed inside the heat dissipation housing, forming the air duct. Alternatively, ventilation ducts can be installed inside the heat dissipation housing, forming the air duct. Of course, other methods can also be used to form the air duct, which will not be listed here. The aforementioned air duct can guide airflow along a predetermined path, thereby improving the heat dissipation effect of the heat-generating device. Furthermore, the aforementioned air duct can isolate the internal environment of the equipment housing, thereby improving the dustproof and waterproof performance of the equipment housing.

[0010] In the specific design of the heat dissipation housing, the heat dissipation housing can protrude from the surface of the device housing, and the heat dissipation housing is provided with a transparent window that allows light to pass through. In one possible configuration, the heat dissipation housing includes a side wall and a top wall, wherein the side wall of the heat dissipation housing is connected to the device housing, and the top wall of the heat dissipation housing is provided with the aforementioned transparent window. Additionally, the aforementioned electronic device also includes a camera module, which has a light-incident surface, and at least a portion of the projection of the light-incident surface along a third direction lies within the projection of the transparent window along a third direction. The aforementioned third direction is perpendicular to the plane containing the transparent window. During operation, light from the external environment can enter the light-incident surface through the transparent window and then enter the camera module, where it is processed to form an image. Specifically, when setting the transparent window, a transparent film can be provided at the transparent window to block external dust and moisture from entering.

[0011] In the above technical solution, the heat dissipation housing forms a receiving cavity on the side facing the device housing. This cavity can accommodate a fan or an air duct, allowing the fan and duct to occupy little or no internal space within the device housing. The cavity can also provide additional space for components with complex structures within the device housing. For example, when arranging a camera module, at least part of the camera module can be located within the cavity, providing more installation space and enabling the use of higher-performance, more complex camera modules to improve the image quality of the electronic device.

[0012] When providing air inlets and outlets on the walls of the aforementioned heat dissipation housing, both air inlets and outlets can be located on the side walls. Alternatively, one of the air inlets and outlets can be located on the side wall, and the other on the top wall. For example, the air inlet can be located on the top wall, and the air outlet on the side wall.

[0013] In one specific technical solution, the heat dissipation housing has multiple air inlets and multiple air outlets, wherein the multiple air inlets are spaced apart along a first direction, and the multiple air outlets are spaced apart along a second direction. The sealing member includes a first sealing member and a second sealing member, wherein the first sealing member extends along the first direction and has multiple first ventilation openings along the first direction, with a first gap between adjacent first ventilation openings. The second sealing member extends along the second direction and has multiple second ventilation openings along the second direction, with a second gap between adjacent second ventilation openings.

[0014] In specific connection, the heat sink housing and the first sealing member can be slidably connected along a first direction, and the heat sink housing and the second sealing member can be slidably connected along a second direction. By allowing the heat sink housing and the sealing member to slide relative to each other, the positional relationship between the heat sink housing and the sealing member can be adjusted, thereby changing the ventilation conditions of the air inlet and outlet. Specifically, during the relative sliding process of the sealing member and the heat sink housing, when the sealing member and the heat sink housing are in the first positional relationship, the air inlet and the first ventilation opening at least partially overlap, and the air outlet and the second ventilation opening at least partially overlap. At this time, both the air inlet and the air outlet are in a ventilated state. When the sealing member and the heat sink housing are in the second positional relationship, the first gap portion blocks the air inlet, and the second gap portion blocks the air outlet. At this time, both the air inlet and the air outlet are in a blocked state.

[0015] In another specific technical solution, the heat dissipation housing has a first central axis, and the air inlet and outlet are arranged circumferentially around the first central axis. The sealing member is an annular structure, and the annular structure is arranged around the aforementioned first central axis. The annular structure has multiple vents, which are arranged sequentially at intervals along the circumference, and there is a gap between two adjacent vents.

[0016] In a specific connection, the sealing component and the heat sink housing can be rotatably connected, allowing them to rotate relative to each other around the first central axis. During this relative rotation, the positional relationship between the sealing component and the heat sink housing will change, and the ventilation conditions at the air inlet and outlet will also change.

[0017] Specifically, the aforementioned multiple ventilation openings include a third ventilation opening and a fourth ventilation opening, and the aforementioned partitions include a third partition and a fourth partition. When the sealing member and the heat dissipation housing have a first positional relationship, the third ventilation opening and the air inlet at least partially overlap, and the fourth ventilation opening and the air outlet at least partially overlap; at this time, both the air inlet and the air outlet are in a ventilated state. When the sealing member and the heat dissipation housing have a second positional relationship, the third partition blocks the air inlet, and the fourth partition blocks the air outlet; at this time, both the air inlet and the air outlet are in a blocked state.

[0018] In another specific technical solution, the heat sink housing has a first central axis, and the air inlet and outlet are arranged circumferentially around the first central axis. The sealing member is an annular structure, which is arranged around the first central axis and is slidably connected to the heat sink housing along the first central axis. That is, under the drive of an external force, the annular structure and the heat sink housing can move up and down along the first central axis, and the annular structure and the heat sink housing have a first positional relationship and a second positional relationship. When the sealing member and the heat sink housing have the first positional relationship, the annular structure avoids the air inlet and outlet, and at this time, both the air inlet and outlet are in a ventilated state. When the sealing member and the heat sink housing have the second positional relationship, the annular structure blocks the air inlet and outlet, and at this time, both the air inlet and outlet are in a blocked state.

[0019] To drive relative movement between the heat sink and the sealing element, the electronic device also includes a drive assembly, which can be connected to either the heat sink or the sealing element to drive their relative movement. In one specific technical solution, the drive assembly is connected to the sealing element, and the drive assembly drives the sealing element to move, causing the sealing element to avoid at least part of the air inlet and at least part of the air outlet, or to completely block the air inlet and air outlet. In the specific arrangement of the sealing element, the heat sink can protrude from the surface of the device housing, and a receiving cavity can be formed on the side of the heat sink facing the device housing, thereby placing the sealing element within the receiving cavity. Placing the sealing element within the receiving cavity avoids exposing it to the external environment, helps maintain cleanliness at the gap between the sealing element and the heat sink, and facilitates smoother relative movement between the sealing element and the heat sink. Furthermore, placing the sealing element inside the heat sink can also improve the appearance of the electronic device.

[0020] During use, the aforementioned electronic device, by adjusting the sealing component and the heat dissipation housing to a first position and activating the fan, allows airflow to enter the heat dissipation housing, thereby cooling the heat-generating components using a wind-cooling method. In specific implementations, the electronic device can automatically operate in this wind-cooling mode through various means. In one possible technical solution, the electronic device further includes a controller and an operating unit, with the controller, operating unit, drive assembly, and fan respectively connected. The operating unit has a first trigger state, and the controller, when the operating unit is in the first trigger state, controls the drive assembly to drive the heat dissipation housing and the sealing component to move relative to each other, placing them in the first position and activating the fan.

[0021] In specific configurations, the aforementioned operating unit can be a control bar located on the casing frame. When the heat-generating device needs heat dissipation, the user can press the control bar to switch to the aforementioned first trigger state. Alternatively, the aforementioned operating unit can also be a control window located on the touchscreen of the electronic device. When the heat-generating device needs heat dissipation, the user can click the window to switch to the aforementioned first trigger state.

[0022] During the implementation of the above technical solution, the user needs to subjectively judge whether it is necessary to run the air cooling mode to dissipate heat from the heat-generating device. When the user believes that it is necessary to run the air cooling mode to dissipate heat from the heat-generating device, the user can trigger the operation unit to put the operation unit into the first trigger state, so that the controller can control the drive component, so that the drive component drives the sealing part and the heat sink housing to move relative to each other, so that the heat sink housing and the sealing part are in the first position relationship, and control the fan to start.

[0023] In another possible technical solution, a detection component can be set up to detect a first operating indicator of the heat-generating device. When the first operating indicator exceeds a first threshold, it indicates that the heat-generating device is generating too much heat and requires air cooling mode to dissipate heat. In specific implementation, the detection component is connected to a controller. The controller is used to control the drive component to drive the heat sink and the sealing component to move relative to each other when the first operating indicator exceeds the first threshold, so that the heat sink and the sealing component are in a first position relationship, and then start the fan. The first operating indicator includes, but is not limited to, the power consumption indicator or temperature indicator of the heat-generating device.

[0024] In another possible technical solution, the heat-generating device is specifically a chip, which is used to run the first application. During operation, the first application generates significant heat on the chip, necessitating the use of a fan-cooled cooling mode. Specifically, when the first application is running, the controller controls the drive component to move the heat sink and the sealing component relative to each other, positioning them in a first position and activating the fan. The first application includes, but is not limited to, applications such as 3D modeling, games, and video editing.

[0025] In specific implementation, when any one of the following conditions is met, such as "the operation unit is in the first trigger state", "the detection component detects that the first operating index is greater than the first threshold" and "the first application is in the running state", the controller can control the drive component to drive the heat sink housing and the sealing component to move relative to each other, thereby placing the heat sink housing and the sealing component in the first position relationship and starting the fan to perform air cooling heat dissipation on the heat-generating device.

[0026] During use, the aforementioned electronic device can also automatically shut down the air-cooling mode in various ways. For example, the operating unit also has a second trigger state. When the operating unit is in the second trigger state, the controller controls the drive component to drive the heat sink and the sealing component to move relative to each other, so that the heat sink and the sealing component are in a second position relationship, and the fan is turned off. Alternatively, the controller can also control the drive component to drive the heat sink and the sealing component to move relative to each other, so that the heat sink and the sealing component are in a second position relationship, and the fan is turned off when the first operating indicator is less than or equal to the first threshold. Yet another example is that the controller can also control the drive component to drive the heat sink and the sealing component to move relative to each other, so that the heat sink and the sealing component are in a second position relationship, and the fan is turned off when the first application is in a stopped state.

[0027] In practice, the controller can control the drive component to drive the heat sink and the sealing component to move relative to each other when the conditions of "the operation unit is in the second trigger state", "the detection component detects that the first operating index is less than or equal to the first threshold" and "the first application is in the closed state" are met simultaneously. This causes the heat sink and the sealing component to be in the second position relationship, and the fan is turned off, thereby stopping the air cooling of the heat-generating device.

[0028] In one specific configuration, the electronic device also includes a display screen disposed on the surface of the housing. Since the side of the housing away from the display screen has a larger installation space, the heat dissipation housing can be positioned on the side of the housing away from the display screen when arranging the heat dissipation housing. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of an electronic device provided in an embodiment of this application;

[0030] Figure 2 This is a schematic diagram of the overall structure of another electronic device provided in an embodiment of this application;

[0031] Figure 3 A cross-sectional view (AA) of an electronic device provided in an embodiment of this application;

[0032] Figure 4 A cross-sectional view (AA) of another electronic device provided in the embodiments of this application;

[0033] Figure 5 A schematic diagram of the layout of an air duct provided in an embodiment of this application;

[0034] Figure 6 Another schematic diagram of the air duct layout provided in the embodiments of this application;

[0035] Figure 7A schematic diagram of a combination of a sealing component and a heat dissipation housing provided in an embodiment of this application;

[0036] Figure 8 A schematic diagram illustrating another combination of the sealing component and the heat dissipation housing provided in an embodiment of this application;

[0037] Figure 9 This is a schematic diagram of another combination of the sealing element and the heat dissipation housing provided in the embodiments of this application.

[0038] Figure label:

[0039] 1-Equipment housing; 2-Heat dissipation housing; 21-Side wall; 22-Top wall; 201-Air duct; 202-Air inlet; 203-Air outlet; 204-Transparent window; 3-Fan; 4-Heat conduction component; 41-Substrate; 42-Heat dissipation fins; 43-Heat pipe; 5-Sealing component; 51-First sealing component; 52-Second sealing component; 501-First vent; 502-Second vent; 503-Third vent; 504-Fourth vent; 511-First spacer; 512-Second spacer; 513-Third spacer; 514-Fourth spacer; 6-Heat-generating device; 7-Camera module; 701-Light-incident surface. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0041] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “the” are intended to include expressions such as “one or more” unless the context clearly indicates otherwise.

[0042] References to "one embodiment" or "some embodiments" as described in this application's specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0043] Furthermore, in the specification of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0044] To facilitate understanding of the electronic device provided in the embodiments of this application, its application scenario is first introduced below. The electronic device described in this application can specifically be a mobile phone, tablet computer, e-reader, etc. Electronic devices can have multiple functions, such as communication, entertainment, and camera functions. Furthermore, with technological advancements, the functions of electronic devices are continuously optimized to meet higher consumer demands. Electronic devices contain various electronic components, such as chips, batteries, and sensors. Under normal operating conditions, these components ensure the electronic device performs its corresponding functions and provides a good user experience. One factor affecting the normal operation of electronic components is overheating. When electronic components generate a lot of heat but have low heat dissipation efficiency, the heat cannot be dissipated in time, resulting in high temperatures and reduced performance and lifespan, thus affecting the normal operation of the electronic device. Therefore, this application provides an electronic device including a heat sink and a fan disposed within the heat sink, which can solve the heat dissipation problem of some electronic components within the electronic device. The following embodiments, in conjunction with the accompanying drawings, illustrate the electronic device in the technical solution of this application.

[0045] Figure 1 This is a schematic diagram of the overall structure of an electronic device provided in an embodiment of this application, such as... Figure 1 As shown, in one embodiment, the electronic device includes a device housing 1 and a heat sink 2. The device housing 1 is a housing structure with a receiving space, capable of accommodating electronic components for realizing various functions of the electronic device. The heat sink 2 is disposed on the device housing 1. In optional embodiments, from an external perspective, the surface of the heat sink 2 can be flush with the surface of the device housing 1 or protrude from the surface of the device housing 1. During manufacturing, the heat sink 2 and the device housing 1 can be manufactured using an integral molding process. Specifically, the integral molding process includes, but is not limited to, stamping and injection molding. Alternatively, in other embodiments, the heat sink 2 and the device housing 1 can be manufactured separately and connected by a connecting structure. For example, the heat sink 2 and the device housing 1 can be bonded using an adhesive layer; or, for example, the heat sink 2 and the device housing 1 can be fixed using fasteners or snap-fit ​​structures.

[0046] The location of the heat sink 2 is not limited. To allow for a larger installation space, the heat sink 2 can be positioned on the side of the device housing 1 with a larger area. In one specific embodiment, the electronic device includes a display screen located on the surface of the device housing 1. When specifically arranging the heat sink 2, it can be positioned on the side of the device housing 1 opposite to the display screen.

[0047] Please continue to refer to this. Figure 1 In one embodiment, the heat dissipation housing 2 protrudes from the surface of the device housing 1, and the orthographic projection of the outer periphery of the heat dissipation housing 2 onto the surface of the device housing 1 is a circle. Figure 2 This is a schematic diagram of the overall structure of another electronic device provided in an embodiment of this application, such as... Figure 2 As shown, in another embodiment, the heat sink 2 also protrudes from the surface of the device housing 1, and the orthographic projection of the outer periphery of the heat sink 2 onto the surface of the device housing 1 is rectangular. In other embodiments, in addition to the above-described shape, the orthographic projection of the outer periphery of the heat sink 2 onto the surface of the device housing 1 can also be other shapes, which will not be listed one by one in this application.

[0048] Figure 3 An AA cross-sectional view of an electronic device provided in an embodiment of this application, such as... Figure 3 As shown, in one embodiment, the electronic device further includes a heat-generating device 6, which is disposed within the device housing 1. The heat-generating device 6 refers to an electronic component that generates significant heat during operation. If the heat generated by the heat-generating device 6 is not dissipated in a timely manner, it may affect the normal operation of the heat-generating device 6, leading to malfunction of the electronic device. Specifically, the heat-generating device 6 includes, but is not limited to, chips or batteries.

[0049] Please continue to refer to this. Figure 3In the above embodiment, the heat dissipation housing 2 has an internal air duct 201, which has an air inlet 202 and an air outlet 203. Additionally, the electronic device also includes a fan 3, which is disposed within the heat dissipation housing 2 and faces the air duct 201. Specifically, the fan 3 can be installed at both ends of the air duct 201, or it can be installed inside the air duct 201, located between its two ends. Driven by the fan 3, airflow can enter the heat dissipation housing 2 from the air inlet 202, flow along the air duct 201 inside the heat dissipation housing 2, and finally exit from the air outlet 203. The air duct 201 and the heat-generating device 6 inside the device housing 1 are thermally connected. When airflow passes through the air duct 201, the airflow can exchange heat with the heat-generating device 6, causing the temperature of the heat-generating device 6 to decrease, thereby achieving the effect of heat dissipation for the heat-generating device 6. In addition, since the air inlet 202, air outlet 203 and air duct 201 are all located in the heat dissipation housing 2, the airflow path is relatively short, which can reduce wind resistance, accelerate airflow circulation, and improve the heat dissipation effect of the heat-generating device 6.

[0050] To conduct the heat generated by the heating element 6 to the air duct 201, the heating element 6 can be arranged in several possible ways. In one possible arrangement, a portion of the heating element 6 can be placed inside the air duct 201, allowing the airflow to pass over the surface of the heating element 6 as it passes through the air duct 201, thus directly exchanging heat with the heating element 6. In another possible arrangement, the heating element 6 can be placed outside the air duct 201, with the heating element 6 and the outer wall of the air duct 201 thermally connected, allowing the airflow to indirectly exchange heat with the heating element 6 through the wall of the air duct 201 as it passes through the air duct 201. In yet another possible arrangement, such as... Figure 3 As shown, the electronic device may further include a heat-conducting component 4, and the heat-conducting component 4 and the heat-generating device 6 are thermally connected, so that the heat generated by the heat-generating device 6 can be conducted to the heat-conducting component 4. In order for the heat-conducting component 4 to transfer heat to the airflow in the air duct 201, at least a portion of the heat-conducting component 4 may be located inside the air duct 201, or at least a portion of the heat-conducting component 4 may be thermally connected to the outer wall of the air duct 201. In the above arrangement, the heat generated by the heat-generating device 6 can be conducted to the air duct 201 through the heat-conducting component 4, and then dissipated to the external environment through the airflow. In a specific embodiment, the heat-conducting component 4 can be understood as a heat sink thermally connected to the heat-generating device 6. The arrangement of the heat-conducting component 4 allows for flexible installation of the heat-generating device 6; for example, the heat-generating device 6 can be installed close to the air duct 201 or away from the air duct 201.

[0051] In specific embodiments, the structure of the heat-conducting component 4 can be selected in various ways. For example, in one possible structure, the heat-conducting component 4 includes a substrate 41 and a plurality of heat dissipation fins 42 disposed on the surface of the substrate 41. The substrate 41 and the heat-generating device 6 are thermally connected, and at least a portion of the heat dissipation fins 42 are located within the air duct 201. The heat dissipation fins 42 have a large heat exchange area, and during the flow of air through the air duct 201, the airflow can exchange heat with the heat dissipation fins 42, thereby reducing the temperature of the heat-generating device 6. In another possible structure, such as... Figure 3 As shown, the heat-conducting component 4 includes a substrate 41, heat dissipation fins 42, and a heat pipe 43. One end of the heat pipe 43 is connected to the heating device 6, and the other end is connected to the substrate 41. The heat dissipation fins 42 are disposed on the surface of the substrate 41, and at least a portion of the heat dissipation fins 42 is located within the air duct 201. The heat pipe 43 can conduct heat generated by the heating device 6 to the heat dissipation fins 42. The heat dissipation fins 42 exchange heat with the airflow to achieve the purpose of dissipating heat from the heating device 6. The aforementioned heat pipe 43 generally consists of a shell, a porous capillary core, and a working medium. The end of the heat pipe 43 connected to the heating device 6 is the evaporation end, and the end connected to the substrate 41 is the condensation end. When the evaporation end is heated, the liquid working medium in the porous capillary core rapidly evaporates into a gaseous state. The gaseous working medium flows to the condensation end under a small pressure difference, and after releasing heat at the condensation end, it re-condenses into a liquid state. The liquid working medium flows back to the evaporation end under the action of capillary force, completing one cycle. During the reciprocating cycle of the working medium between the evaporation end and the condensation end, the heat generated by the heating device 6 is continuously transferred to the substrate 41. The substrate 41 then transfers the heat to the airflow through the heat dissipation fins 42, thereby achieving the effect of heat dissipation for the heating device 6.

[0052] Of course, the heat-conducting component 4 may also have other structures, which will not be listed in this application.

[0053] Figure 4 A cross-sectional view (AA) of another electronic device provided in the embodiments of this application, such as Figure 4 As shown, in another embodiment, the heat dissipation housing 2 protrudes from the surface of the device housing 1, and the heat dissipation housing 2 is provided with a transparent window 204, which allows light to pass through. A transparent film can be provided at the transparent window 204 to block external dust and moisture from entering the electronic device. Additionally, the electronic device also includes a camera module 7, which has a light-incident surface 701, and at least a portion of the projection of the light-incident surface 701 along a third direction Z lies within the projection of the transparent window 204 along the third direction Z. The third direction Z is perpendicular to the plane containing the transparent window 204. During operation, light from the external environment can enter the light-incident surface 701 through the transparent window 204 and then enter the camera module 7, where it is processed to form an image.

[0054] Continue to refer to Figure 2 The heat dissipation housing 2 includes a side wall 21 and a top wall 22, wherein the side wall 21 and the top wall 22 are connected, and the side wall 21 is also connected to the device housing 1. The transparent window 204 can be specifically disposed on the top wall 22 of the heat dissipation housing 2, and the aforementioned third direction Z specifically refers to the thickness direction of the electronic device. Furthermore, the side wall 21 and the top wall 22 can also form a receiving cavity, which can be used to accommodate the fan 3 or to form an air duct 201. This allows components such as the fan 3 and the air duct 201 to not occupy the internal space of the device housing 1, or allows components such as the fan 3 and the air duct 201 to occupy only a small portion of the device housing 1, thereby facilitating the thinning design of the device housing 1. Simultaneously, when installing the camera module 7, at least a portion of the camera module 7 can be accommodated within the aforementioned receiving cavity, thereby providing the camera module 7 with a larger installation space and making it possible to use a higher-performance, more complex camera module 7 to improve the shooting quality of the electronic device.

[0055] It is understandable that, in the specific layout, the air duct 201 can be made to avoid the camera module 7, and the airflow in the air duct 201 can be isolated from the camera module 7, so as to prevent moisture and other substances from spreading into the camera module 7 and affecting the normal operation of the camera module 7.

[0056] When the air inlet 202 and air outlet 203 are provided on the wall of the aforementioned heat dissipation housing 2, there are several possible arrangements. In one possible arrangement, both the air inlet 202 and air outlet 203 can be located on the side wall 21. By placing the air inlet 202 and air outlet 203 on the side wall 21, it is beneficial to reduce wind resistance and make the airflow path smoother; on the other hand, it can make full use of the area of ​​the side wall 21 of the heat dissipation housing 2 and improve the overall appearance. In another possible arrangement, one of the air inlet 202 and air outlet 203 can be located on the side wall 21, and the other can be located on the top wall 22. For example, the air inlet 202 can be located on the top wall 22, and the air outlet 203 can be located on the side wall 21. In yet another possible arrangement, both the air inlet 202 and air outlet 203 can be located on the top wall 22.

[0057] Specifically, when forming an air duct 201 within the heat dissipation housing 2, multiple partitions can be installed within the heat dissipation housing 2, and the air duct 201 can be formed by the partitions. Alternatively, ventilation ducts can be installed within the heat dissipation housing 2, and the air duct 201 can be formed by the ventilation ducts. The aforementioned air duct 201 can guide airflow along a predetermined path, thereby improving the heat dissipation effect of the heat-generating device 6. Furthermore, the aforementioned air duct 201 can isolate the internal environment of the equipment housing 1, thereby improving the dustproof and waterproof performance of the equipment housing 1.

[0058] The number of air ducts 201 is not limited; there can be one or more. For any air duct 201, the number of air inlets 202 can be one or more; this application does not limit this. Similarly, the number of air outlets 203 can be one or more; this application does not limit this. It can be understood that the aforementioned air duct 201 can have either one large-opening air inlet 202 or air outlet 203, or multiple small-opening air inlets 202 or multiple small-opening air outlets 203. When the aforementioned air duct 201 has multiple small-opening air inlets 202 or multiple small-opening air outlets 203, adjacent air inlets 202 are spaced apart, and adjacent air outlets 203 are spaced apart.

[0059] Figure 5 This is a schematic diagram of the layout of an air duct provided in an embodiment of this application, such as... Figure 5 As shown, in one embodiment, the heat dissipation housing 2 has an air duct 201, and the air inlet 202 and air outlet 203 of the air duct 201 are located on opposite sides of the heat dissipation housing 2.

[0060] Figure 6 This is another schematic diagram of the air duct layout provided in the embodiments of this application, as shown below. Figure 6 As shown, in one embodiment, the heat dissipation housing 2 has multiple air ducts 201, and each air duct 201 is equipped with at least one fan 3. During the use of the electronic device, all the fans 3 in the multiple air ducts 201 can be turned on, so that airflow passes through each air duct 201. Alternatively, some of the fans 3 in the air ducts 201 can be turned on, and some of the fans 3 in the air ducts 201 can be turned off. Or, all the fans 3 in the multiple air ducts 201 can be turned off. The turning on and off of the fans 3 can be configured according to the heat generation of the heat-generating device 6, so that the heat dissipation capacity of the heat dissipation housing 2 matches the heat generation of the heat-generating device 6.

[0061] The heat dissipation housing 2 includes multiple air ducts 201, each with a different extension path. The air inlets 202 of different air ducts 201 can be the same or different. Similarly, the air outlets 203 of different air ducts 201 can be the same or different. For ease of description, any two air ducts 201 are referred to as the first air duct and the second air duct. In one possible configuration, the first air duct and the second air duct have the same air inlet 202, and the first air duct and the second air duct have different air outlets 203. This configuration can also be understood as the air inlets 202 of the first air duct and the air inlets 202 of the second air duct being located at the same position on the heat dissipation housing 2 and coinciding; and the air outlets 203 of the first air duct and the air outlets 203 of the second air duct being located at different positions on the heat dissipation housing 2. During the heat dissipation process, driven by the fan 3, the airflow in the external environment can enter the heat dissipation shell 2 through the same air inlet 202, and then split into two streams. One stream enters the first air duct, and the other stream enters the second air duct. These two streams flow along different paths and finally flow out of the heat dissipation shell 2 through different air outlets 203.

[0062] In another possible configuration, the first and second air ducts have different air inlets 202, and both have the same air outlet 203. This configuration can also be understood as follows: the air inlets 202 of the first and second air ducts are located at different positions on the heat dissipation housing 2, while the air outlets 203 of the first and second air ducts are located at the same and overlapping position on the heat dissipation housing 2. During heat dissipation, driven by the fan 3, two airflows from the external environment enter the heat dissipation housing 2 through different air inlets 202, then flow along the first and second air ducts respectively, and finally exit the heat dissipation housing 2 through the same air outlet 203.

[0063] In another possible configuration, the first and second air ducts have different air inlets 202 and different air outlets 203. This configuration can also be understood as the air inlets 202 of the first and second air ducts being located at different positions on the heat dissipation housing 2, and the air outlets 203 of the first and second air ducts also being located at different positions on the heat dissipation housing 2. During heat dissipation, driven by the fan 3, two airflows from the external environment enter the heat dissipation housing 2 through different air inlets 202, then flow along the first and second air ducts respectively, and finally exit the heat dissipation housing 2 through different air outlets 203.

[0064] In specific settings, the air inlet 202, air outlet 203, and extension path of the air duct 201 can be arranged according to the overall architecture distribution of the electronic equipment.

[0065] Understandably, in scenarios where heat dissipation is needed for the heat-generating device 6, both the air inlet 202 and the air outlet 203 are in a ventilated state. This allows airflow, driven by the fan 3, to pass through the heat sink 2 and exchange heat with the heat-generating device 6, thus achieving air cooling. In other scenarios, the heat generated by the heat-generating device 6 is relatively small, and the heat can be dissipated to the external environment through the device housing 1, eliminating the need to open the air inlet 202 and the air outlet 203 for air cooling. In these scenarios, to ensure the dustproof and waterproof performance of the electronic device, the air inlet 202 and the air outlet 203 can be sealed to prevent dust, moisture, etc., from entering the electronic device.

[0066] Figure 7 This is a schematic diagram of a combination of the sealing component and the heat dissipation housing provided in an embodiment of this application, as shown below. Figure 7 As shown, in one embodiment, the electronic device further includes a sealing member 5, which is movably connected to the heat sink 2. The sealing member 5 and the heat sink 2 are capable of relative movement, thereby changing their relative positions and allowing the air inlet 202 and the air outlet 203 to be in a ventilated or blocked state. When the air inlet 202 and the air outlet 203 are in a ventilated state, airflow from the external environment can enter the air duct 201 through the air inlet 202 and exit the air duct 201 through the air outlet 203. When the air inlet 202 and the air outlet 203 are in a blocked state, airflow from the external environment cannot enter the air duct 201 through the air inlet 202, and airflow within the air duct 201 cannot exit through the air outlet 203.

[0067] In specific implementation, the sealing member 5 and the heat dissipation housing 2 are movably connected, and the sealing member 5 and the heat dissipation housing 2 have a first positional relationship and a second positional relationship. When the sealing member 5 and the heat dissipation housing 2 are in the first positional relationship, the sealing member 5 can avoid at least part of the air inlet 202 and at least part of the air outlet 203, thereby allowing the air inlet 202 and the air outlet 203 to be in a ventilated state. That is, when the sealing member 5 and the heat dissipation housing 2 are in the first positional relationship, at least part of the air inlet 202 is not blocked by the sealing member 5, thereby allowing the ventilation duct 201 to connect with the external environment; at least part of the air outlet 203 is not blocked by the sealing member 5, thereby allowing the ventilation duct 201 to connect with the external environment. When the sealing member 5 and the heat dissipation housing 2 are in the second positional relationship, the sealing member 5 can completely block the air inlet 202 and the air outlet 203, thereby allowing the air inlet 202 and the air outlet 203 to be in a blocked state. During the use of electronic devices, the positional relationship between the sealing component 5 and the heat sink 2 can be adjusted according to the specific application scenario, thereby switching the air inlet 202 and the air outlet 203 between a ventilation state and a sealing state. For example, in scenarios where the heat-generating device 6 generates a lot of heat, the sealing component 5 and the heat sink 2 can be adjusted to the first positional relationship, so that the air inlet 202 and the air outlet 203 are in a ventilation state, thereby providing air cooling for the heat-generating device 6. In scenarios where the heat-generating device 6 generates less heat, the sealing component 5 and the heat sink 2 can be adjusted to the second positional relationship, so that the air inlet 202 and the air outlet 203 are in a sealing state, thereby improving the dustproof and waterproof performance of the electronic device.

[0068] When specifically setting the connection relationship between the sealing component 5 and the heat sink 2, the sealing component 5 and the heat sink 2 can be slidably connected, rotatably connected, or movably connected in other ways; this application does not impose any limitations. When specifically setting the driving method for the sealing component 5 and the heat sink 2, they can be manually driven, meaning that a force can be manually applied to the sealing component 5 or the heat sink 2 to cause relative movement between them. Alternatively, a driving assembly can be provided, connected to the sealing component 5 or the heat sink 2, thereby causing relative movement between the sealing component 5 and the heat sink 2 under the drive of the aforementioned driving assembly.

[0069] Regarding the sealing element 5, the sealing element 5 includes various possible structures, such as a strip-shaped structure or a ring-shaped structure. Of course, the sealing element 5 may also have other structures, which will not be listed one by one in this application.

[0070] like Figure 7As shown, in one embodiment, the heat dissipation housing 2 has multiple air inlets 202, which are arranged at intervals along a first direction OM. The sealing member 5 includes a first sealing member 51, which is movably connected to the heat dissipation housing 2 and is used to avoid or block the multiple air inlets 202. The first sealing member 51 can have various possible structures. In one possible structure, the first sealing member 51 also extends along the first direction OM and has multiple first ventilation openings 501 along the first direction OM, with a first spacing portion 511 between adjacent first ventilation openings 501. Specifically, the first sealing member 51 can be a first strip structure, the extension direction of which is the same as the arrangement direction of the air inlets 202, both being the first direction OM, and the first strip structure also has first ventilation openings 501 and first spacing portions 511 alternately arranged along the first direction OM.

[0071] When switching between the ventilation and blocking states of the air inlet 202, the first blocking member 51 and the heat sink 2 can be slidably connected along the first direction OM, allowing them to slide relative to each other. During this sliding process, the positional relationship between the first blocking member 51 and the heat sink 2 will change, and the first vent 501 and the air inlet 202 may or may not have overlapping areas. Specifically, when the blocking member 501 and the heat sink 2 have a first positional relationship, the first vent 501 and the air inlet 202 at least partially overlap. At this time, driven by the fan 3, airflow from the external environment can pass through the overlapping portion of the first vent 501 and the air inlet 202 and enter the interior of the heat sink 2, thus putting the air inlet 202 in a ventilation state. When the blocking member 501 and the heat sink 2 have a second positional relationship, the first vent 501 and the air inlet 202 are completely misaligned, and the first gap 511 blocks the air inlet 202. The first partition 511 isolates the internal environment of the heat dissipation housing 2 from the external environment, thereby blocking the air inlet 202.

[0072] Please continue to refer to this. Figure 7 In the above embodiment, the heat dissipation housing 2 also has multiple air outlets 203, and the multiple air outlets 203 are spaced apart along the second direction ON. In addition to the first sealing member 51 described above, the sealing member 5 also includes a second sealing member 52. The function of the second sealing member 52 is similar to that of the first sealing member 51 described above. Specifically, the second sealing member 52 is used to avoid or block the multiple air outlets 203 of the heat dissipation housing 2.

[0073] When specifically configuring the second sealing member 52, the second sealing member 52 includes several possible structures. In one possible structure, the second sealing member 52 extends along the second direction ON, and the second sealing member 52 has multiple second vents 502 along the second direction ON, with a second spacing portion 512 between two adjacent second vents 502. Specifically, the second sealing member 52 can be a second strip structure, the extension direction of the second strip structure is the same as the arrangement direction of the air outlet 203, both being the second direction ON, and the second strip structure also has second vents 502 and second spacing portions 512 alternately arranged along the second direction ON.

[0074] When switching between the ventilation and blocking states of the air outlet 203, the second blocking member 52 and the heat sink 2 can be slidably connected along the second direction ON, allowing them to slide relative to each other. During this sliding process, the positional relationship between the second blocking member 52 and the heat sink 2 will change, and the second vent 502 and the air outlet 203 may or may not have overlapping areas. Specifically, when the blocking member 502 and the heat sink 2 have a first positional relationship, the second vent 502 and the air outlet 203 at least partially overlap, thus placing the air outlet 203 in a ventilation state. When the blocking member 502 and the heat sink 2 have a second positional relationship, the second vent 502 and the air outlet 203 are completely offset. In this case, the second gap 512 blocks the air outlet 203, thus placing the air outlet 203 in a blocked state.

[0075] The first direction OM and the second direction ON mentioned above can be the same direction or different directions. For example... Figure 6 In the illustrated embodiment, the first direction OM and the second direction ON are in the same direction. The heat dissipation housing 2 has a rectangular structure, with the air inlet 202 and the air outlet 203 located on opposite sides of the heat dissipation housing 2. Driven by the fan 3, the airflow can flow in opposite directions and penetrate through the heat dissipation housing 2, thereby helping to reduce wind resistance and shorten the airflow path.

[0076] In the aforementioned sealing component 5, the first sealing component 51 and the second sealing component 52 can be independent of each other, or they can be connected as a whole through a connecting component, thereby achieving synchronous movement. By setting a connecting component to connect the first sealing component 51 and the second sealing component 52 as a whole, the air inlet 202 and the air outlet 203 can be switched to the ventilation state synchronously, or the air inlet 202 and the air outlet 203 can be switched to the sealing state synchronously, thus ensuring that the states of the air inlet 202 and the air outlet 203 are consistent. In specific implementation, the aforementioned first sealing component 51 and the second sealing component 52 can share a set of drive components, thereby reducing the number of drive components required, improving control accuracy, and saving space.

[0077] It is worth noting that in the above embodiments, the heat dissipation housing 2 may have one air duct 201 or multiple air ducts 201. When the heat dissipation housing 2 has one air duct 201, one end of the air duct 201 has multiple air inlets 202, and the multiple air inlets 202 are spaced apart along the first direction OM. The other end of the air duct 201 has multiple air outlets 203, and the multiple air outlets 203 are spaced apart along the second direction ON. The first sealing member 51 can block or avoid the air inlets 202 of the air duct 201, and the second sealing member 52 can block or avoid the air outlets 203 of the air duct 201. When the heat dissipation housing 2 has multiple air ducts 201, each air duct 201 may have one or more air inlets 202 and one or more air outlets 203, and the air inlets 202 of the multiple air ducts 201 are spaced apart along the first direction OM, and the air outlets 203 of the multiple air ducts 201 are spaced apart along the second direction ON. The first sealing component 51 can simultaneously block or avoid the air inlets 202 of the multiple air ducts 201, and the second sealing component 52 can simultaneously block or avoid the air outlets 203 of the multiple air ducts 201.

[0078] Figure 8 This is a schematic diagram illustrating another combination of the sealing component and the heat dissipation housing provided in an embodiment of this application, as shown below. Figure 8 As shown, in one embodiment, the heat dissipation housing 2 has a first central axis, and the air inlet 202 and air outlet 203 are arranged circumferentially around the first central axis. Specifically, the heat dissipation housing 2 includes a side wall 21 and a top wall 22, with the air inlet 202 and air outlet 203 located on the side wall 21. The sealing member 5 is an annular structure, and the annular structure is arranged around the first central axis. The annular structure has multiple ventilation openings, and the multiple ventilation openings are arranged sequentially at intervals along the circumference, with a gap between two adjacent ventilation openings.

[0079] When switching between the ventilation and blocking states of the air inlet 202, the blocking component 5 and the heat sink 2 can be rotatably connected, allowing them to rotate relative to each other around the first central axis. During this relative rotation, the positional relationship between the blocking component 5 and the heat sink 2 will change, as will the overlap between the ventilation opening and the air inlet 202, and the overlap between the ventilation opening and the air outlet 203. Please refer to [further details]. Figure 8In the illustrated embodiment, the plurality of vents includes a third vent 503 and a fourth vent 504, and the spacers include a third spacer 513 and a fourth spacer 514. When the sealing member 5 and the heat sink housing 2 are in a first positional relationship, the third vent 503 and the air inlet 202 at least partially overlap, thereby ventilating the air inlet 202. Furthermore, the fourth vent 504 and the air outlet 203 at least partially overlap, thereby ventilating the air outlet 203. When the sealing member 5 and the heat sink housing 2 are in a second positional relationship, the third vent 503 and the air inlet 202 are completely offset. At this time, the third spacer 513 blocks the air inlet 202, thereby blocking the air inlet 202. Furthermore, the fourth vent 504 and the air outlet 203 are completely offset. At this time, the fourth spacer 514 blocks the air outlet 203, thereby blocking the air outlet 203.

[0080] During the relative rotation of the sealing component 5 and the heat dissipation housing 2, any one of the vents may at least partially overlap with the air inlet 202 or the air outlet 203 at any given time. Therefore, the aforementioned third vent 503 and fourth vent 504 refer to two different vents and are not specified as two specific vents. Similarly, any one of the partitions may be used to block the air inlet 202 or the air outlet 203 at any given time. Therefore, the aforementioned third partition 513 and fourth partition 514 refer to two different partitions and are not specified as two specific partitions.

[0081] Figure 9 This is a schematic diagram illustrating another combination of the sealing component and the heat dissipation housing provided in an embodiment of this application, as shown below. Figure 9 As shown, in one embodiment, the structure of the heat dissipation housing 2 and Figure 8 The structures of the heat sink housings 2 shown are basically the same. Both have a first central axis OP, and the air inlet 202 and air outlet 203 are arranged circumferentially around the first central axis OP. Specifically, the air inlet 202 and air outlet 203 can be located on the side wall 21 of the heat sink housing 2. The structure of the sealing member 5 is similar to... Figure 8 The sealing element 5 shown has both similarities and differences in structure. The similarity lies in that both are annular structures, and these annular structures are arranged around the first central axis OP. The difference lies in... Figure 9In the illustrated embodiment, the annular structure does not have a vent. Due to structural differences, the annular structure and the heat sink 2 can be slidably connected along the first central axis OP. That is, the relative movement of the annular structure and the heat sink 2 is a lifting and lowering motion along the first central axis OP, so that when the sealing member 5 and the heat sink 2 have a first positional relationship, the annular structure can avoid the air inlet 202 and the air outlet 203; when the sealing member 5 and the heat sink 2 have a second positional relationship, the annular structure can block the air inlet 202 and the air outlet 203.

[0082] In the above embodiments, the sealing member 5 can be relatively misaligned with the surface of the heat dissipation housing 2, thereby avoiding or blocking the air inlet 202 and the air outlet 203. Of course, in addition to the above connection methods, the sealing member 5 and the heat dissipation housing 2 can also have other connection methods, which will not be listed one by one in this application.

[0083] In one specific structure of the heat sink 2, the heat sink 2 protrudes from the surface of the device housing 1, and the side of the heat sink 2 facing the device housing 1 has a receiving cavity. The sealing member 5 can be located inside or outside the receiving cavity. In some embodiments, the sealing member 5 can be disposed inside the receiving cavity, thereby preventing the sealing member 5 from being exposed to the external environment, which helps to keep the connection between the sealing member 5 and the heat sink 2 clean, and makes the relative movement between the sealing member 5 and the heat sink 2 smoother. In addition, arranging the sealing member 5 inside the heat sink 2 can also improve the appearance of the electronic device.

[0084] In the above embodiments, in order to drive the sealing member 5 and the heat sink 2 to move relative to each other, the electronic device may further include a drive assembly connected to the sealing member 5. The drive assembly is used to drive the sealing member 5 to move, so that the sealing member 5 avoids the air inlet 202 and the air outlet 203, or to block the air inlet 202 and the air outlet 203. In a specific embodiment, the drive assembly includes a motor, which can provide driving force to drive the sealing member 5 and the heat sink 2 to move relative to each other. The type of motor is not limited; the motor can be a linear motor, which can drive the sealing member 5 to move linearly relative to the heat sink 2. The motor can also be a rotary motor, and a transmission member can be provided between the rotary motor and the sealing member 5. In one embodiment, the transmission member can transmit the torque of the motor to the sealing member 5, so that the sealing member 5 can rotate relative to the heat sink 2. In another embodiment, the transmission member can also convert the torque of the motor into a thrust or pull force, so that the sealing member 5 can move linearly relative to the heat sink 2.

[0085] In some embodiments, the electronic device may further include a controller, which is connected to the drive assembly and the fan 3. In scenarios where air cooling of the heat-generating device 6 is required, the controller can be used to control the drive assembly to drive the sealing member 5 and the heat sink 2 to move relative to each other, thereby placing the sealing member 5 and the heat sink 2 in a first position relationship, and correspondingly putting the air inlet 202 and the air outlet 203 in a ventilation state. Furthermore, in the above scenario, the controller can also be used to control the fan 3 to start, thereby providing power for airflow. Conversely, when air cooling of the heat-generating device 6 is not required, the controller can be used to control the drive assembly to drive the sealing member 5 and the heat sink 2 to move relative to each other, thereby placing the sealing member 5 and the heat sink 2 in a second position relationship, and correspondingly putting the air inlet 202 and the air outlet 203 in a blocked state. Furthermore, the controller can also be used to control the fan 3 to turn off.

[0086] Specifically, different trigger conditions can be set to trigger the controller, causing the controller to control the drive assembly and fan 3 in the manner described above. For example, in one possible triggering method, the electronic device further includes an operating unit, which is connected to the controller. The operating unit has a first trigger state and a second trigger state. When the heat-generating device 6 needs air cooling, the operating unit can be in the first trigger state. When the heat-generating device 6 does not need air cooling, the operating unit can be in the second trigger state. The controller is used to control the drive assembly to move the heat sink 2 and the sealing member 5 relative to each other when the operating unit is in the first trigger state, so that the heat sink 2 and the sealing member 5 are in a first position relationship, and to start the fan 3. At this time, the air inlet 202 and the air outlet 203 of the heat sink 2 are both in a ventilation state. Driven by the fan 3, the airflow can enter the heat sink 2 and cool the heat-generating device 6. The controller is also used to control the drive assembly to move the heat sink 2 and the sealing member 5 relative to each other when the operating unit is in the second trigger state, so that the heat sink 2 and the sealing member 5 are in a second position relationship, and to turn off the fan 3. At this time, the air inlet 202 and air outlet 203 of the heat sink 2 are both blocked, which can prevent external moisture, dust and other substances from entering the heat sink 2, thus achieving the effect of waterproofing and dustproofing.

[0087] When specifically configuring the aforementioned operating unit, it can take various forms. For example, the operating unit can be a control button located on the edge of the housing, allowing users to switch between a first trigger state and a second trigger state by pressing the control bar. Alternatively, the operating unit can be a control window located on the touchscreen of an electronic device, allowing users to switch between the first and second trigger states by clicking the control window.

[0088] For example, in another possible triggering method, the electronic device also includes a detection component connected to the aforementioned controller. Specifically, the detection component is used to detect a first operating indicator of the heat-generating device 6. This first operating indicator includes, but is not limited to, the power consumption or temperature of the heat-generating device 6. When the first operating indicator is greater than a first threshold, the controller controls the drive component to move the heat sink 2 and the sealing member 5 relative to each other, placing them in a first position relationship, and starts the fan 3. At this time, both the air inlet 202 and the air outlet 203 of the heat sink 2 are in a ventilation state. Driven by the fan 3, airflow can enter the heat sink 2 and cool the heat-generating device 6. In addition, the controller is also used to control the drive component to move the heat sink 2 and the sealing member 5 relative to each other when the first operating indicator is less than or equal to the first threshold, placing them in a second position relationship, and then shutting off the fan 3. At this time, both the air inlet 202 and the air outlet 203 of the heat sink 2 are blocked, thereby preventing external moisture and dust from entering the heat sink 2 and achieving the effect of waterproofing and dustproofing.

[0089] For example, in other possible triggering methods, the heat-generating device 6 can specifically be a chip, which is used to run the first application. The first application includes, but is not limited to, applications such as 3D modeling, games, or video editing. The first application has a running state and a stopped state. When the first application is running, it leads to an increase in chip power consumption, resulting in increased heat generation and a rise in chip temperature.

[0090] The controller is used to control the drive assembly to move the heat sink 2 and the sealing member 5 relative to each other when the first application is in the above-mentioned running state, so that the heat sink 2 and the sealing member 5 are in a first position relationship, and to start the fan 3. At this time, both the air inlet 202 and the air outlet 203 of the heat sink 2 are in a ventilation state. Driven by the fan 3, the airflow can enter the heat sink 2 and cool down the heat-generating device 6. In addition, the controller is also used to control the drive assembly to move the heat sink 2 and the sealing member 5 relative to each other when the first application is in a closed state, so that the heat sink 2 and the sealing member 5 are in a second position relationship, and to turn off the fan 3.

[0091] During use, when any one of the following conditions is met—"the operating unit is in a first triggered state," "the detection component detects that a first operating indicator is greater than a first threshold," or "the first application is in a running state"—the controller can control the drive component to move the heat sink 2 and the sealing component 5 relative to each other, thereby placing the heat sink 2 and the sealing component 5 in a first position relationship and activating the fan 3 to provide air cooling for the heat-generating device 6. When simultaneously meeting the following conditions—"the operating unit is in a second triggered state," "the detection component detects that a first operating indicator is less than or equal to the first threshold," and "the first application is in a closed state"—the controller can control the drive component to move the heat sink 2 and the sealing component 5 relative to each other, thereby placing the heat sink 2 and the sealing component 5 in a second position relationship and shutting off the fan 3 to stop air cooling for the heat-generating device 6.

[0092] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope and intent of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application is also intended to include such modifications and variations.

Claims

1. An electronic device, characterized in that, It includes a device housing, a heat dissipation housing, a sealing component, a fan, a camera module, and a heat-generating device, wherein the sealing component, the camera module, and the heat-generating device are different components; The heat dissipation housing is disposed on the device housing, the heat dissipation housing has an air duct, and the air duct has an air inlet and an air outlet; the fan is disposed facing the air duct, the heat dissipation housing forms a receiving cavity on the side facing the device housing, at least a portion of the camera module is located in the receiving cavity, and the air duct and the camera module are isolated from each other; The heat dissipation housing protrudes from the surface of the device housing, and the wall of the heat dissipation housing is provided with a transparent window; the camera module has a light-incident surface, and at least a portion of the projection of the light-incident surface along a third direction is located within the projection of the transparent window along the third direction; the third direction is perpendicular to the plane where the transparent window is located; The sealing member and the heat dissipation housing are movably connected, and the sealing member and the heat dissipation housing have a first positional relationship and a second positional relationship; when the sealing member and the heat dissipation housing are in the first positional relationship, the sealing member avoids at least part of the air inlet and at least part of the air outlet; when the sealing member and the heat dissipation housing are in the second positional relationship, the sealing member blocks the air inlet and the air outlet; The heating element is located in the device housing, and the heating element and the air duct are thermally connected. The heat dissipation housing is provided with multiple partitions that form the air duct, or the heat dissipation housing is provided with ventilation pipes that form the air duct.

2. The electronic device as claimed in claim 1, characterized in that, The electronic device further includes a heat-conducting component, which is thermally connected to the heat-generating device, and the heat-conducting component is at least partially located in the air duct.

3. The electronic device as described in claim 1 or 2, characterized in that, The heat dissipation housing has multiple air ducts, and each air duct is provided with at least one fan; The plurality of air ducts includes a first air duct and a second air duct, the first air duct and the second air duct having the same air inlet and different air outlets; Alternatively, the first air duct and the second air duct may have different air inlets and the first air duct and the second air duct may have the same air outlet. Alternatively, the first air duct and the second air duct may have different air inlets and different air outlets.

4. The electronic device according to any one of claims 1 to 3, characterized in that, The heat dissipation housing protrudes from the surface of the device housing, and the heat dissipation housing includes a connected side wall and a top wall, and the side wall is connected to the device housing; At least one of the air inlet and the air outlet is disposed on the side wall.

5. The electronic device according to any one of claims 1 to 4, characterized in that, The number of air inlets is multiple, and the multiple air inlets are spaced apart along a first direction; the number of air outlets is multiple, and the multiple air outlets are spaced apart along a second direction. The sealing element includes a first sealing element and a second sealing element. The first sealing element extends along the first direction and has a plurality of first ventilation openings along the first direction, with a first gap between two adjacent first ventilation openings. The second sealing member extends along the second direction and has a plurality of second vents along the second direction, with a second gap between two adjacent second vents; When the sealing component and the heat dissipation housing have the first positional relationship, the air inlet and the first ventilation opening at least partially overlap, and the air outlet and the second ventilation opening at least partially overlap; When the sealing member and the heat dissipation housing have the second positional relationship, the first gap portion blocks the air inlet, and the second gap portion blocks the air outlet.

6. The electronic device according to any one of claims 1 to 4, characterized in that, The heat dissipation housing has a first central axis, and the air inlet and air outlet are arranged circumferentially around the first central axis; The sealing element is a ring-shaped structure, which is arranged around the first central axis; the ring-shaped structure has multiple ventilation openings, which are arranged sequentially at intervals along the circumference, and there is a gap between two adjacent ventilation openings; The plurality of ventilation openings includes a third ventilation opening and a fourth ventilation opening. When the sealing member and the heat dissipation housing have the first positional relationship, the third ventilation opening and the air inlet at least partially overlap, and the fourth ventilation opening and the air outlet at least partially overlap. The spacer includes a third spacer and a fourth spacer. When the sealing member and the heat dissipation housing have the second positional relationship, the third spacer blocks the air inlet, and the fourth spacer blocks the air outlet.

7. The electronic device according to any one of claims 1 to 4, characterized in that, The heat dissipation housing has a first central axis, and the air inlet and the air outlet are arranged circumferentially around the first central axis; the sealing member is an annular structure, the annular structure is arranged around the first central axis, and the annular structure and the heat dissipation housing are slidably connected along the first central axis; When the sealing component and the heat dissipation housing have the first positional relationship, the annular structure avoids the air inlet and the air outlet; When the sealing component and the heat dissipation housing have the second positional relationship, the annular structure blocks the air inlet and the air outlet.

8. The electronic device according to any one of claims 1 to 7, characterized in that, The electronic device further includes a drive assembly connected to the sealing member; the drive assembly is used to drive the sealing member to move, so that the sealing member avoids at least part of the air inlet and at least part of the air outlet, or so that the sealing member blocks the air inlet and the air outlet.

9. The electronic device as claimed in claim 8, characterized in that, The electronic device further includes a controller and an operating unit, which are respectively connected to the controller, the operating unit, the drive assembly, and the fan. The operating unit has a first trigger state. When the operating unit is in the first trigger state, the controller controls the drive assembly to drive the sealing member to move relative to the heat dissipation housing, so that the heat dissipation housing and the sealing member are in the first position relationship, and starts the fan.

10. The electronic device as claimed in claim 8 or 9, characterized in that, The electronic device further includes a controller and a detection component, wherein the controller, the detection component, the drive component, and the fan are respectively connected; The detection component is used to detect the first operating indicator of the heating device; The controller is used to control the drive component to drive the sealing member to move relative to the heat dissipation housing when the first operating index is greater than the first threshold, so that the heat dissipation housing and the sealing member are in the first position relationship, and to start the fan.

11. The electronic device according to any one of claims 8 to 10, characterized in that, The electronic device also includes a controller, which is connected to the drive assembly and the fan respectively; the heating element is a chip, which is used to run the first application. The controller is used to control the drive component to drive the sealing member to move relative to the heat dissipation housing when the first application is running, so that the heat dissipation housing and the sealing member are in the first position relationship, and to start the fan.

12. The electronic device according to any one of claims 8 to 11, characterized in that, The electronic device further includes a controller, an operating unit, and a detection component, and the controller is connected to the operating unit, the detection component, the drive component, and the fan, respectively. The operating unit has a second trigger state; the detection component is used to detect a first operating indicator of the heating device; The heating device is a chip, which is used to support the operation of the first application. The controller is configured to control the drive component to drive the sealing member to move relative to the heat dissipation housing when the operation unit is in the second triggered state, the first operating index is less than or equal to the first threshold, and the first application is in a stopped state, so that the heat dissipation housing and the sealing member are in the second position relationship, and to shut down the fan.

13. The electronic device according to any one of claims 1 to 12, characterized in that, The electronic device also includes a display screen disposed on the surface of the device housing; the heat dissipation housing is located on the side of the device housing opposite to the display screen.

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