Heat management integration module substrate, heat management integration module and vehicle
By adopting a coolant communication plate and valve terminal structure in the thermal management integration module, the integration of the refrigerant side and the coolant side is achieved, and the heat loss and energy consumption problems caused by the integration of the thermal management integration module in the prior art are solved, thereby achieving more efficient thermal management and cost savings.
Patent Information
- Application Number
- CN202510036020.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2025-04-18
AI Technical Summary
The existing thermal management integration module does not realize the integration between the refrigerant side and the coolant side, resulting in too long pipes or large amounts of heat exchange, causing large heat losses, affecting energy consumption and increasing vehicle costs.
The integrated module substrate of the thermal management is adopted, including a coolant communication plate, a first valve island and a second valve island. The battery cooling circuit, an electric drive and an electric control cooling circuit, a water-cooled condenser coolant circuit and a waste heat recovery coolant circuit are connected to the air conditioning pipeline through the coolant communication plate. The valve island is used to connect the air conditioning pipeline to realize the partition of the low-temperature area and the high-temperature area of the refrigerant.
It reduces pipeline complexity and heat exchange, reduces system heat loss and energy consumption, reduces vehicle pipeline costs, and saves the use of valves and brackets.
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Figure CN119855107A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of thermal management technology, and in particular to a thermal management integrated module substrate, a thermal management integrated module and a vehicle. Background Art
[0002] In the field of thermal management, the thermal management system has been changed from the original engine circuit and low-temperature circuit to a battery system, electric drive system and heating system; compared with the original plan, the thermal management parts have eliminated the engine assembly and added electronic auxiliary water pumps, multi-way water valves, waste heat recovery devices, water-cooled condensers, refrigerant check valves and other categories. The system principle is more complex and the layout is more cumbersome.
[0003] Although the existing public technology for the thermal management circuit switching device of the automobile presents a certain integration concept, it has not realized the integration of the refrigerant side and the coolant side. The pipes cross, are too long or have a large amount of heat exchange, resulting in large heat loss during the operation of the system, affecting energy consumption and increasing the cost of the entire vehicle. Summary of the invention
[0004] In view of the defects existing in the prior art, the purpose of the present invention is to provide a thermal management integrated module substrate, a thermal management integrated module and a vehicle, which can solve the problems in the prior art that the thermal management integrated module fails to realize the integration of the refrigerant side and the coolant side, the pipelines are too long or a large amount of heat exchange occurs, resulting in large heat loss, affecting energy consumption and increasing the cost of the whole vehicle.
[0005] In order to achieve the above purpose, the technical solution adopted by the present invention is:
[0006] In a first aspect, the present invention provides a thermal management integrated module substrate, comprising:
[0007] A coolant connecting plate, which is used to connect the battery cooling circuit, the electric drive and electronic control cooling circuit, the water-cooled condenser coolant circuit and the waste heat recovery device coolant circuit with the multi-way valve;
[0008] A first valve island connected to the coolant connecting plate, used to connect the outlets of the water-cooled condenser refrigerant pipeline and the off-vehicle condenser to the inlet of the liquid storage tank, and to connect the outlet of the liquid storage tank to the inlet of the refrigerant pipeline of the evaporator and the waste heat recovery device;
[0009] The second valve island is connected to the coolant connecting plate and is used to connect the outlet of the compressor to the built-in condenser and the external condenser.
[0010] In some optional solutions, the coolant connecting plate includes:
[0011] An upper plate, one side of which is used for mounting the multi-way valve;
[0012] a sandwich plate, which is attached to the other side of the upper plate, and forms a first flow channel cavity and a fifth flow channel cavity connecting the two ends of the electric drive and electric control cooling circuit, and a second flow channel cavity connecting one end of the battery cooling circuit, between the sandwich plate and the upper plate;
[0013] The lower plate is attached to the other side of the sandwich plate, and forms a third flow channel cavity and a fourth flow channel cavity between the sandwich plate for connecting the two ends of the waste heat recovery device coolant circuit, a sixth flow channel cavity and a seventh flow channel cavity for connecting the two ends of the water-cooled condenser coolant circuit, and an eighth flow channel cavity for connecting the other end of the battery cooling circuit.
[0014] In some optional solutions, the upper plate is provided with circumferentially arranged communication holes corresponding to the multi-way valve communication ports one by one, including:
[0015] A first communication hole, which is communicated with the first flow channel cavity;
[0016] a second communication hole, which is in communication with the second flow channel cavity;
[0017] a fourth communication hole, which is communicated with the fourth flow channel cavity;
[0018] a fifth communication hole, which is communicated with the fifth flow channel cavity;
[0019] a sixth communication hole, which is communicated with the sixth flow channel cavity;
[0020] a seventh communication hole, which is communicated with the seventh flow channel cavity;
[0021] an eighth communication hole, which is communicated with the eighth flow channel cavity;
[0022] A third communicating hole is communicated with the third flow channel cavity.
[0023] In some optional solutions, a blocking plate is provided in the middle of the connection between the upper plate and the multi-way valve, and the communicating holes are arranged along the circumference of the blocking plate;
[0024] The sandwich plate is provided with an eighth flow hole corresponding to the blocking plate, a fourth flow hole corresponding to the fourth connecting hole, a sixth flow hole corresponding to the sixth connecting hole, a seventh flow hole corresponding to the seventh connecting hole, and a third flow hole corresponding to the third connecting hole, and an eighth connecting cavity connected to the eighth flow hole is also formed between the upper plate and the sandwich plate, and the eighth connecting cavity corresponds to the position of the eighth connecting hole.
[0025] In some optional solutions, the side of the upper plate away from the sandwich plate is provided with:
[0026] A first water pump installation position, which is provided on the first flow channel cavity and is used to install a first water pump in the battery cooling circuit;
[0027] The second water pump installation position is arranged on the second flow channel cavity and is used for installing the second water pump in the electric drive and electronic control cooling circuit.
[0028] In some optional solutions, the side of the lower plate away from the sandwich plate is provided with:
[0029] A waste heat recovery device installation position, which is provided with a sixth connection port for connecting two ends of the waste heat recovery device coolant circuit to the sixth flow channel cavity and a seventh connection port of the seventh flow channel cavity;
[0030] The water-cooled condenser installation position is provided with a third connection port of the third flow channel cavity and a fourth connection port of the fourth flow channel cavity for connecting two ends of the coolant circuit of the water-cooled condenser.
[0031] In some optional solutions, a first one-way valve installation position, a second one-way valve installation position and a liquid storage tank installation position are provided on one side of the first valve island, and the liquid storage tank installation position is provided with a liquid storage tank liquid inlet and a liquid storage tank liquid outlet for connecting to the liquid storage tank;
[0032] The first valve island is provided with a first liquid outlet cavity and a second liquid outlet cavity which are connected to the liquid outlet of the liquid storage tank, the first liquid outlet cavity is used to connect to the evaporator, and the second liquid outlet cavity is used to connect to the refrigerant pipeline of the waste heat recovery device;
[0033] The first valve island is also provided with a first liquid inlet cavity and a second liquid inlet cavity which are connected with the liquid inlet of the liquid storage tank. The first liquid inlet cavity is used to connect the external condenser of the vehicle, and the second liquid inlet cavity is used to connect the refrigerant pipeline of the water-cooled condenser. The first one-way valve installation position is located on the first liquid inlet cavity, and the second one-way valve installation position is located on the second liquid inlet cavity.
[0034] In some optional solutions, a first stop valve installation position, a second stop valve installation position and a first sensor installation position are provided on one side of the second valve island;
[0035] A liquid inlet channel connected to the first sensor installation position is provided in the second valve island, and the liquid inlet channel is used to be connected to the compressor;
[0036] The second valve island is also provided with a first liquid outlet channel and a second liquid outlet channel connected to the first sensor installation position. The first liquid outlet channel is used to connect the built-in condenser, and the second liquid outlet channel is used to connect the external condenser. The first stop valve installation position is located on the first liquid outlet channel, and the second stop valve installation position is located on the second liquid outlet channel.
[0037] In a second aspect, the present invention further provides a thermal management integrated module, comprising any one of the thermal management integrated module substrates described above.
[0038] In a third aspect, the present invention further provides a vehicle, comprising the above-mentioned thermal management integrated module.
[0039] Compared with the prior art, the advantages of the present invention are: using a coolant connecting plate to replace the cooling water pipe for connection can reduce the complexity of the pipeline, reduce the problem of cooling water pipe crossing the cabin, improve the utilization rate of the cabin space, greatly reduce the length of the connecting pipeline, reduce the heat exchange with the environment, reduce the heat loss of the system, reduce energy consumption, and reduce the pipeline cost of the whole vehicle; in addition, the use of valves is reduced, so the use of brackets can also be reduced to save costs. The first valve island and the second valve island are used to connect the air conditioning pipelines, reduce the heat exchange between the overly long air conditioning pipelines and the air, and simultaneously reduce energy consumption. The first valve island connects the outlet of the water-cooled condenser refrigerant pipeline and the external condenser to the inlet of the liquid storage tank, and connects the outlet of the liquid storage tank to the inlet of the evaporator and the waste heat recovery device refrigerant pipeline. The second valve island connects the outlet of the compressor to the built-in condenser and the external condenser, realizing the partition of the low-temperature area and the high-temperature area of the refrigerant, reducing the mutual heat between the high and low temperature refrigerants, reducing the heat loss of the system and reducing energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS
[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0041] Figure 1 is a rear view schematic diagram of a thermal management integrated module in an embodiment of the present invention;
[0042] Figure 2 A schematic front view of a thermal management integrated module according to an embodiment of the present invention;
[0043] Figure 3 A schematic diagram of installing a control module in a thermal management integrated module according to an embodiment of the present invention;
[0044] Figure 4 This is a schematic diagram of the thermal management integrated module circuit connection in an embodiment of the present invention;
[0045] Figure 5 An exploded view of a coolant connecting plate in an embodiment of the present invention;
[0046] Figure 6 Schematic diagram of the front view of the cooling liquid connecting plate in the embodiment of the present invention;
[0047] Figure 7 is a rear view schematic diagram of an upper plate in an embodiment of the present invention;
[0048] Figure 8 is a schematic front view of a sandwich panel in an embodiment of the present invention;
[0049] Fig. 9 is a rear view schematic diagram of a sandwich panel in an embodiment of the present invention;
[0050] Fig.10 It is a schematic diagram of the front view of the lower plate in the embodiment of the present invention;
[0051] Fig.11 is a rear view schematic diagram of a coolant connecting plate in an embodiment of the present invention;
[0052] Fig.12 Schematic diagram of the working state switching of the multi-way valve in an embodiment of the present invention;
[0053] Fig.13 Schematic diagram of the structure of the first valve island and the second valve island in an embodiment of the present invention;
[0054] Fig.14 Schematic diagram of the structure of the mounting bracket in the embodiment of the present invention.
[0055] In the figure: 1, coolant connecting plate; 11, upper plate; 111, blocking plate; 112, first water pump installation position; 113, second water pump installation position; 12, sandwich plate; 13, lower plate;
[0056] 101, first flow channel cavity; 102, second flow channel cavity; 103, third flow channel cavity; 104, fourth flow channel cavity; 105, fifth flow channel cavity; 106, sixth flow channel cavity; 107, seventh flow channel cavity; 108, eighth flow channel cavity; 109, ninth flow channel cavity;
[0057] 2011, first connection port; 2012, water tank connection port; 2021, second connection port; 2022, third sensor interface; 203, third connection port; 204, fourth connection port; 205, fifth connection port; 206, sixth connection port; 207, seventh connection port; 208, eighth connection port; 2091, ninth connection port; 2092, radiator interface; 2093, fourth sensor interface;
[0058] 2. First valve island; 21. First check valve installation position; 22. Second check valve installation position; 23. Liquid storage tank installation position; 231. Liquid storage tank liquid inlet; 232. Liquid storage tank liquid outlet; 24. First check valve; 25. Second check valve;
[0059] 2001, water outlet interface of the external condenser; 2002, refrigerant pipeline interface of the water-cooled condenser; 2003, evaporator interface; 2004, refrigerant pipeline interface of the waste heat recovery device;
[0060] 3. Multi-way valve; 31. First communication port; 32. Second communication port; 33. Third communication port; 34. Fourth communication port; 35. Fifth communication port;
[0061] 4. Second valve island; 41. First stop valve installation position; 42. Second stop valve installation position; 43. First sensor installation position; 44. First stop valve; 45. Second stop valve; 46. First sensor;
[0062] 401, water inlet interface of the external condenser; 402, water inlet interface of the built-in condenser; 403, compressor interface;
[0063] 5. External condenser; 6. Liquid storage tank; 7. Evaporator; 8. Compressor; 9. Internal condenser; 10. Control module; 14. First water pump; 15. Second water pump; 16. Water storage tank; 17. Waste heat recovery device; 171. Second connecting pipeline; 172. Electronic expansion valve; 18. Water-cooled condenser; 181. First connecting pipeline;
[0064] 19. Mounting bracket; 191. Upper bracket; 1911. First shock-absorbing rubber pad; 192. Right bracket; 193. Lower bracket; 194. Left bracket; 1941. Second shock-absorbing rubber pad. DETAILED DESCRIPTION
[0065] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.
[0066] The embodiments of the present invention are further described in detail below with reference to the accompanying drawings.
[0067] like Figure 1-Figure 4 As shown, in a first aspect, the present invention provides a thermal management integrated module substrate, comprising: a cooling liquid connecting plate 1, a first valve island 2 and a second valve island 4.
[0068] The coolant connecting plate 1 is used to connect the battery cooling circuit, the electric drive and electronic control cooling circuit, the water-cooled condenser coolant circuit and the waste heat recovery device coolant circuit with the multi-way valve 3; the first valve island 2 is connected to the coolant connecting plate 1, and is used to connect the outlet of the water-cooled condenser refrigerant pipeline and the external condenser 5 to the inlet of the liquid storage tank 6, and to connect the outlet of the liquid storage tank 6 to the evaporator 7 and the inlet of the waste heat recovery device refrigerant pipeline; the second valve island 4 is connected to the coolant connecting plate 1, and is used to connect the outlet of the compressor 8 to the built-in condenser 9 and the external condenser 5.
[0069] In this solution, the battery cooling circuit, the electric drive and electronic control cooling circuit, the water-cooled condenser coolant circuit and the waste heat recovery device coolant circuit are connected through the coolant connecting plate 1, and the heat exchange in the above-mentioned coolant circuits is realized through the multi-way valve 3. The coolant connecting plate 1 is used to replace the cooling water pipe that serves as a connection, which can reduce the complexity of the pipeline, reduce the problem of the cooling water pipe crossing the cabin, and improve the utilization rate of the cabin space. The length of the connecting pipeline is greatly reduced, and the heat exchange with the environment is reduced, so that the heat loss of the system is reduced, the energy consumption is reduced, and the pipeline cost of the whole vehicle is reduced; in addition, the use of valves is reduced, so the use of brackets can also be reduced to save costs.
[0070] The first valve island 2 and the second valve island 4 are used to connect the air conditioning pipelines, reducing the heat exchange between the long air conditioning pipelines and the air, and reducing energy consumption at the same time. In addition, the first valve island 2 connects the outlet of the water-cooled condenser refrigerant pipeline and the outlet of the vehicle-outside condenser 5 to the inlet of the liquid storage tank 6, and connects the outlet of the liquid storage tank 6 to the inlet of the evaporator 7 and the waste heat recovery device refrigerant pipeline. The second valve island 4 connects the outlet of the compressor 8 to the built-in condenser 9 and the vehicle-outside condenser 5, realizing the partition of the refrigerant low-temperature area and the high-temperature area. The high and low temperature partition design is adopted in design, which reduces the mutual heat exchange between the high and low temperature refrigerants, reduces the heat loss of the system, and reduces energy consumption.
[0071] In addition, in this embodiment, the first valve island 2 and the second valve island 4 are spaced apart to further reduce the mutual heat transfer between high and low temperature refrigerants and reduce energy loss.
[0072] In addition, the coolant connecting plate 1 is used to connect the coolant pipelines, and the first valve island 2 and the second valve island 4 are used to connect the air-conditioning pipelines. The coolant pipelines and the air-conditioning pipelines are all converged at the thermal management integrated module substrate, thereby facilitating the centralized arrangement of sensors and valves and pumps. This can facilitate the arrangement of the control module 10. Arranging the control module 10 on or next to the thermal management integrated module substrate can reduce the length of the sensor signal line and the control signal line, facilitate the arrangement of the sensor signal line and the control signal line, and further improve the utilization of the space.
[0073] like Figure 5-Figure 10As shown, in some optional embodiments, the coolant connecting plate 1 includes: an upper plate 11, an interlayer plate 12 and a lower plate 13.
[0074] Among them, one side of the upper plate 11 is used to install the multi-way valve 3; the interlayer plate 12 is attached to one side of the upper plate 11, and forms a first flow channel cavity 101 and a fifth flow channel cavity 105 connecting the two ends of the electric drive and electric control cooling circuit, and a second flow channel cavity 102 connecting one end of the battery cooling circuit between the upper plate 11; the lower plate 13 is attached to the other side of the interlayer plate 12, and forms a third flow channel cavity 103 and a fourth flow channel cavity 104 connecting the two ends of the waste heat recovery device coolant circuit, a sixth flow channel cavity 106 and a seventh flow channel cavity 107 connecting the two ends of the water-cooled condenser coolant circuit, and an eighth flow channel cavity 108 connecting the other end of the battery cooling circuit between the interlayer plate 12.
[0075] In this embodiment, the coolant connecting plate 1 is designed as a three-layer plate structure including an upper plate 11, an interlayer plate 12 and a lower plate 13, so that a first flow channel cavity 101, a fifth flow channel cavity 105 and a second flow channel cavity 102 are formed between the upper plate 11 and the interlayer plate 12, and a third flow channel cavity 103, a fourth flow channel cavity 104, a sixth flow channel cavity 106, a seventh flow channel cavity 107 and an eighth flow channel cavity 108 are formed between the interlayer plate 12 and the lower plate 13. This is equivalent to using a three-layer plate to realize a two-layer flow channel design space, which can reduce the occupied area of the entire coolant connecting plate 1, make the design of the flow channel cavity simpler, and make the flow channel cavity structure simpler and more convenient to process. In addition, when the two-layer flow channel design space is realized to design the above-mentioned flow channel cavities, each flow channel cavity can have more design space, providing conditions for integrating sensors and valves into the coolant connecting plate 1.
[0076] The material of the upper plate 11, the sandwich plate 12 and the lower plate 13 is PP-GF20, and the upper plate 11, the sandwich plate 12 and the lower plate 13 are formed by infrared welding, wherein the inner flow channel wall thickness is 3 mm, which greatly reduces the heat transfer loss caused by the temperature difference on the coolant side and reduces the energy loss of the coolant.
[0077] In addition, the first flow channel cavity 101, the fifth flow channel cavity 105, the second flow channel cavity 102, the third flow channel cavity 103, the fourth flow channel cavity 104, the sixth flow channel cavity 106, the seventh flow channel cavity 107 and the eighth flow channel cavity 108 are all formed by splicing flow channel grooves arranged on the plates on both sides thereof. The flow channel grooves can be sink grooves directly excavated on the plates, or can be grooves formed by partitions arranged on the plates.
[0078] Preferably, the upper plate 11 is provided with communicating holes which correspond one-to-one with the communicating ports of the multi-way valve 3 and are arranged circumferentially, including in sequence: a first communicating hole ①, which is connected to the first flow channel cavity 101; a second communicating hole ②, which is connected to the second flow channel cavity 102; a fourth communicating hole ④, which is connected to the fourth flow channel cavity 104; a fifth communicating hole ⑤, which is connected to the fifth flow channel cavity 105; a sixth communicating hole ⑥, which is connected to the sixth flow channel cavity 106; a seventh communicating hole ⑦, which is connected to the seventh flow channel cavity 107; an eighth communicating hole ⑧, which is connected to the eighth flow channel cavity 108; and a third communicating hole ③, which is connected to the third flow channel cavity 103.
[0079] In order to realize the switching connection between different coolant circuits through the multi-way valve 3 to correspond to different working conditions, connecting holes corresponding to the connecting ports of the multi-way valve 3 and arranged circumferentially are provided on the upper plate 11. After the multi-way valve 3 is installed on the upper plate 11, the valve core of the multi-way valve 3 is rotated to switch the connection state between the connecting holes, thereby realizing the ability to switch between 5 modes and having the ability of proportional adjustment, which is applicable to many scenarios; the switching time between adjacent modes is ≤2s, which can realize rapid switching between different modes of the heat pump system and reduce the risk of heat conduction caused by untimely switching.
[0080] The valve core of the multi-way valve 3 used includes a first communication port 31, a second communication port 32, a third communication port 33, a fourth communication port 34 and a fifth communication port 35 which are arranged in a circumferential direction in sequence. The first communication port 31, the second communication port 32, the third communication port 33, the fourth communication port 34 and the fifth communication port 35 are all flow chambers separated by a partition. Among them, the second communication port 32 and the fifth communication port 35 are connected to each other, and the communication holes corresponding to the two positions can be connected. The first communication port 31, the third communication port 33 and the fourth communication port 34 can all connect two adjacent communication holes.
[0081] In this example, the cross-sections of the first connecting port 31, the second connecting port 32, the third connecting port 33, the fourth connecting port 34 and the fifth connecting port 35 are all roughly fan-shaped areas, arranged at circumferential intervals, and separated into flow cavities by partitions, and the second connecting port 32 and the fifth connecting port 35 are connected through the middle area.
[0082] See also Figure 6-Figure 12 As shown, preferably, a blocking plate 111 is provided in the middle of the connection between the upper plate 11 and the multi-way valve 3, and all the connecting holes are arranged circumferentially along the blocking plate 111; the interlayer plate 12 is provided with an eighth flow hole corresponding to the blocking plate 111, a fourth flow hole corresponding to the fourth connecting hole ④, a sixth flow hole corresponding to the sixth connecting hole ⑥, a seventh flow hole corresponding to the seventh connecting hole ⑦ and a third flow hole corresponding to the third connecting hole ③, and an eighth connecting cavity connected to the eighth flow hole is also formed between the upper plate 11 and the interlayer plate, and the eighth connecting cavity corresponds to the position of the eighth connecting hole ⑧.
[0083] In this example, a first flow channel cavity 101, a fifth flow channel cavity 105 and a second flow channel cavity 102 are formed between the upper plate 11 and the interlayer plate 12, and directly extend to the corresponding first connecting hole ①, fifth connecting hole ⑤ and second connecting hole ②, so that the first connecting hole ① is connected with the first flow channel cavity 101, the fifth connecting hole ⑤ is connected with the fifth flow channel cavity 105, and the second connecting hole ② is connected with the second flow channel cavity 102.
[0084] Since the third flow channel cavity 103, the fourth flow channel cavity 104, the sixth flow channel cavity 106, the seventh flow channel cavity 107 and the eighth flow channel cavity 108 are located between the sandwich plate 12 and the lower plate 13, they cannot be directly connected to the corresponding third connecting hole ③, the fourth connecting hole ④, the sixth connecting hole ⑥, the seventh connecting hole ⑦ and the eighth connecting hole ⑧, therefore, a fourth flow hole corresponding to the fourth connecting hole ④, a sixth flow hole corresponding to the sixth connecting hole ⑥, a seventh flow hole corresponding to the seventh connecting hole ⑦ and a third flow hole corresponding to the third connecting hole ③ are provided on the sandwich plate 12, so that the third flow channel cavity 103, the fourth flow channel cavity 104, the sixth flow channel cavity 106 and the seventh flow channel cavity 107 are connected to the corresponding connecting holes on the upper plate 11 through the third flow hole, the fourth flow hole, the sixth flow hole and the seventh flow hole. The correspondence between the above-mentioned flow holes and the connecting holes refers to the position correspondence.
[0085] In order to facilitate the connection between the eighth flow channel cavity 108 and its corresponding cooling circuit, the eighth flow channel cavity 108 is arranged between the fourth flow channel cavity 104 and the sixth flow channel cavity 106. However, the eighth connecting hole ⑧ corresponding to the eighth flow channel cavity 108 is located between the third connecting hole ③ and the seventh connecting hole ⑦, and it is impossible to open a flow hole corresponding to the position of the eighth connecting hole ⑧ on the interlayer plate 12.
[0086] In this solution, a blocking plate 111 is provided in the middle of the connection between the upper plate 11 and the multi-way valve 3, and an eighth flow hole corresponding to the blocking plate 111 is provided on the sandwich plate 12, and an eighth connecting cavity connected to the eighth flow hole is also formed between the upper plate 11 and the sandwich plate, and the eighth connecting cavity corresponds to the position of the eighth connecting hole⑧, and the eighth flow hole is connected to the eighth flow channel cavity 108, so that the eighth flow channel cavity 108, the eighth flow hole, and the eighth connecting cavity to the eighth connecting hole⑧ are connected. Through this structural design, the eighth flow channel cavity 108 is set between the sandwich plate 12 and the lower plate 13, and can be relatively flexibly set between the fourth flow channel cavity 104 and the sixth flow channel cavity 106, so that the eighth flow channel cavity 108 is connected to the eighth connecting hole⑧, and the connecting hole with the cooling circuit can be set on the side of the lower plate 13 away from the sandwich plate, which is convenient for the setting of the interface.
[0087] More specifically, the first connecting hole ①, the second connecting hole ②, the fourth connecting hole ④, the fifth connecting hole ⑤, the sixth connecting hole ⑥, the seventh connecting hole ⑦, the eighth connecting hole ⑧ and the third connecting hole ③ arranged along the circumference of the blocking plate 111 are all fan-shaped with the same curvature.
[0088] In some optional embodiments, a ninth flow channel cavity 109 is further provided between the upper plate 11 and the interlayer plate 12, and the ninth flow channel cavity 109 is used to connect between the low-temperature radiator and the electric drive and electronic control cooling circuit in the electric drive and electronic control cooling circuit, and the connecting hole also includes a ninth connecting hole ⑨ connected to the ninth flow channel cavity 109, and the ninth connecting hole ⑨ is located between the fifth connecting hole ⑤ and the sixth connecting hole ⑥.
[0089] In this example, the fifth connection port 205 corresponding to the fifth flow channel cavity 105 is also arranged on the side of the upper plate 11 away from the sandwich plate 12, and is used to connect to the inlet of the low-temperature radiator in the electric drive and electric control cooling circuit.
[0090] The ninth connecting hole ⑨ and the fifth connecting hole ⑤ are located in the same sector and share a sector-shaped area. A ninth connecting port 2091 connected to the water inlet of the electric drive and electronic control cooling pipeline is arranged on the side of the upper plate 11, and a radiator interface 2092 is arranged on the ninth flow channel cavity 109 for connecting to the outlet of the low-temperature radiator in the electric drive and electronic control cooling circuit. The radiator interface 2092 is located on the side of the upper plate 11 away from the sandwich plate 12. Such a design can connect the ninth flow channel cavity 109 between the low-temperature radiator and the electric drive and electronic control cooling pipeline in the electric drive and electronic control cooling circuit.
[0091] The second communication port 32 and the fifth communication port 35 can be selectively connected to the ninth communication hole ⑨ or the fifth communication hole ⑤. The first communication port 31, the third communication port 33 and the fourth communication port 34 can connect the fourth communication hole ④ with the fifth communication hole ⑤ and the ninth communication hole ⑨ together or connect with the ninth communication hole ⑨ alone, or connect the sixth communication hole ⑥ with the fifth communication hole ⑤ and the ninth communication hole ⑨ together or connect with the fifth communication hole ⑤ alone.
[0092] In addition, a fourth sensor interface 2093 is provided on the ninth flow channel cavity 109 , and is also located on a side of the upper plate 11 away from the sandwich plate 12 , so as to facilitate the installation of the fourth sensor.
[0093] See also Fig.12 , turn the valve core of the multi-way valve 3 to switch the working mode as follows:
[0094] For example, in the first operating mode, when realizing passenger compartment cooling + battery cooling and electric drive cooling, the first connecting port 31 of the multi-way valve 3 is used to connect the second connecting hole ② and the fourth connecting hole ④, so as to realize the connection between the second flow channel cavity 102 and the fourth flow channel cavity 104; the second connecting port 32 and the fifth connecting port 35 are used to connect the first connecting hole ① and the fifth connecting hole ⑤, so as to realize the connection between the first flow channel cavity 101 and the fifth flow channel cavity 105; the third connecting port 33 is used to connect the eighth connecting hole ⑧ and the third connecting hole ③, so as to realize the connection between the eighth flow channel cavity 108 and the third flow channel cavity 103; the fourth connecting port 34 is used to connect the sixth connecting hole ⑥ and the seventh connecting hole ⑦, so as to realize the connection between the sixth flow channel cavity 106 and the seventh flow channel cavity 107.
[0095] In the second working mode, when realizing passenger compartment heating + battery cooling, the first connecting port 31 is used to connect the sixth connecting hole ⑥ and the seventh connecting hole ⑦, so as to realize the connection between the sixth flow channel cavity 106 and the seventh flow channel cavity 107; the second connecting port 32 and the fifth connecting port 35 are used to connect the eighth connecting hole ⑧ and the fifth connecting hole, so as to realize the connection between the eighth flow channel cavity 108 and the fifth flow channel cavity 105; the third connecting port 33 is used to connect the second connecting hole ② and the fourth connecting hole ④, so as to realize the connection between the second flow channel cavity 102 and the fourth flow channel cavity 104; the fourth connecting port 34 is used to connect the first connecting hole ① and the third connecting hole ③, so as to realize the connection between the first flow channel cavity 101 and the third flow channel cavity 103.
[0096] In the third working mode, when realizing passenger compartment heating + battery heating, the first connecting port 31 is used to connect the fourth connecting hole ④ with the fifth connecting hole ⑤ and the ninth connecting hole ⑨ together or to connect it alone with the ninth connecting hole ⑨, so as to realize the connection between the fourth flow channel cavity 104 and the fifth flow channel cavity 105 or the ninth flow channel cavity 109; the second connecting port 32 and the fifth connecting port 35 are used to connect the second connecting hole ② and the sixth connecting hole ⑥, so as to realize the connection between the second flow channel cavity 102 and the sixth flow channel cavity 106; the third connecting port 33 is used to connect the first connecting hole ① and the third connecting hole ③, so as to realize the connection between the first flow channel cavity 101 and the third flow channel cavity 103; the fourth connecting port 34 is used to connect the seventh connecting hole ⑦ and the eighth connecting hole ⑧, so as to realize the connection between the seventh flow channel cavity 107 and the eighth flow channel cavity 108.
[0097] If the heat generated by the electric drive stall is greater than the required heating amount of the battery, the first connecting port 31 connects the fourth connecting hole ④ with the fifth connecting hole ⑤ and the ninth connecting hole ⑨, and the first connecting port 31 can adjust the ratio of the fifth connecting hole ⑤ and the ninth connecting hole ⑨, and adjust the ratio of the heat generated by the electric drive stall for battery heating. By rotating the valve core, the first connecting port 31 connects the fourth connecting hole ④ with the fifth connecting hole ⑤ and the ninth connecting hole ⑨, part of the flow is switched to the fifth connecting hole ⑤, and part of the flow flows through the ninth connecting hole ⑨ to heat the battery, and the excess heat is taken away from the low-temperature radiator.
[0098] When the heat of the electric drive stall is less than or equal to the battery heating amount, switch to the single connection of the ninth connecting hole ⑨, use the first connecting port 31 to connect the fourth connecting hole ④ with the ninth connecting hole ⑨ alone, and all the heat is used to heat the battery to avoid insufficient battery heating.
[0099] In the fourth working mode, when realizing passenger compartment heating + battery temperature equalization, the first connecting hole ① is connected with the third connecting hole ③ by means of the first connecting port 31, so as to realize the connection between the first flow channel cavity 101 and the third flow channel cavity 103; the second connecting hole ② and the eighth connecting hole ⑧ are connected by means of the second connecting port 32 and the fifth connecting port 35, so as to realize the connection between the second flow channel cavity 102 and the eighth flow channel cavity 108; the sixth connecting hole ⑥ and the seventh connecting hole ⑦ are connected by means of the third connecting port 33, so as to realize the connection between the sixth flow channel cavity 106 and the seventh flow channel cavity 107; the fourth connecting hole ④ is connected with the fifth connecting hole ⑤ and the ninth connecting hole ⑨ together or with the ninth connecting hole ⑨ alone by means of the fourth connecting port 34, so as to realize the connection between the fourth flow channel cavity 104 and the fifth flow channel cavity 105 or the ninth flow channel cavity 109.
[0100] In the fifth operating mode, during after-sales maintenance and refueling, the first connecting port 31 is used to connect the fifth connecting hole ⑤ and the sixth connecting hole ⑥, so as to realize the connection between the fifth flow channel cavity 105 and the sixth flow channel cavity 106; the second connecting port 32 and the fifth connecting port 35 are used to connect the fourth connecting hole ④ and the seventh connecting hole ⑦, so as to realize the connection between the fourth flow channel cavity 104 and the seventh flow channel cavity 107; the third connecting port 33 is used to connect the first connecting hole ① and the second connecting hole ②, so as to realize the connection between the first flow channel cavity 101 and the second flow channel cavity 102; the fourth connecting port 34 is used to connect the eighth connecting hole ⑧ and the third connecting hole ③, so as to realize the connection between the eighth flow channel cavity 108 and the third flow channel cavity 103.
[0101] See also Figure 6 and Figure 8 Preferably, the side of the upper plate 11 away from the sandwich plate 12 is provided with: a first water pump installation position 112 and a second water pump installation position 113, wherein the first water pump installation position 112 is arranged on the first flow channel cavity 101, and is used to install the first water pump 14 in the battery cooling circuit; the second water pump installation position 113 is arranged on the second flow channel cavity 102, and is used to install the second water pump 15 in the electric drive and electronic control cooling circuit.
[0102] A first water pump installation position 112 and a second water pump installation position 113 are set on the upper plate 11, which are used to install the first water pump 14 in the battery cooling circuit and the second water pump 15 in the electric drive and electronic control cooling circuit. The first water pump 14 and the second water pump 15 can be integrated into the coolant connecting plate 1, and the first water pump 14 is directly arranged on the first flow channel cavity 101, that is, the first flow channel cavity 101 is cut off, and the two sections of the first flow channel cavity 101 are respectively connected to the water inlet and the water outlet of the first water pump 14, and the second water pump 15 is arranged on the second flow channel cavity 102, that is, the second flow channel cavity 102 is cut off, and the two sections of the second flow channel cavity 102 are respectively connected to the water inlet and the water outlet of the second water pump 15, which can save the connecting pipeline connecting the first water pump 14 and the second water pump 15, and can save the mounting brackets of the first water pump 14 and the second water pump 15, so as to save costs.
[0103] In this example, the multi-way valve 3, the first water pump 14 and the second water pump 15 are all located on the side of the upper plate 11 away from the interlayer plate 12, and the first water pump 14 is located between the multi-way valve 3 and the second water pump 15. An installation notch for installing a water tank 16 is reserved on the coolant connecting plate 1, and a water tank connecting port 2012 is provided at the installation notch, and the water tank connecting port 2012 is connected to the first flow channel cavity 101, so that the cooling circuit connected to the water tank 16 and the first flow channel cavity 101 is connected.
[0104] In addition, the first connection port 2011 connecting the first flow channel cavity 101 and the electric drive and electric control cooling circuit is located on the side of the upper plate 11 away from the sandwich plate 12, and is located at the edge of the upper plate 11. At the staggered position of the first flow channel cavity 101 and the second flow channel cavity 102, a protruding flow channel cavity is set on the side of the upper plate 11 away from the sandwich plate 12, or a connecting cavity is set between the sandwich plate 12 and the lower plate 13 to achieve the continuity of the first flow channel cavity 101 and the second flow channel cavity 102. A third sensor interface 2022 is also provided on the second flow channel cavity 102 for installing a third sensor. The third sensor interface 2022 is also located on the side of the upper plate 11 away from the sandwich plate 12.
[0105] The second connection port 2021 connecting the second flow channel cavity 102 with the battery cooling circuit is located on the side of the sandwich plate 12 away from the upper plate 11, and a gap is left at the corresponding position of the second connection port 2021 on the lower plate 13 to facilitate the connection between the second flow channel cavity 102 and the battery cooling circuit.
[0106] See also Fig.11Preferably, the side of the lower plate 13 away from the interlayer plate 12 is provided with: a waste heat recovery device installation position and a water-cooled condenser installation position, the waste heat recovery device installation position is provided with a sixth connection port 206 for connecting the two ends of the waste heat recovery device cooling liquid circuit to the sixth flow channel cavity 106 and a seventh connection port 207 of the seventh flow channel cavity 107; the water-cooled condenser installation position is provided with a third connection port 203 for connecting the two ends of the water-cooled condenser cooling liquid circuit to the third flow channel cavity 103 and a fourth connection port 204 of the fourth flow channel cavity 104.
[0107] In this example, a waste heat recovery device installation position and a water-cooled condenser installation position are set on the side of the lower plate 13 away from the interlayer plate 12, and a sixth connection port 206 and a seventh connection port 207 are set at the waste heat recovery device installation position for installing and connecting the waste heat recovery device 17, and a third connection port 203 and a fourth connection port 204 are set at the water-cooled condenser installation position for installing and connecting the water-cooled condenser 18, thereby reducing the connecting pipelines, integrating the waste heat recovery device 17 and the water-cooled condenser 18 into the coolant connecting plate 1, reducing the space occupied by the thermal management system, and reducing the brackets of the waste heat recovery device 17 and the water-cooled condenser 18, thereby saving costs.
[0108] In addition, the eighth flow channel cavity 108 and the eighth connection port 208 of the battery cooling circuit are also arranged on the side of the lower plate 13 away from the sandwich plate 12 to facilitate the connection between the eighth connection port 208 and the battery cooling circuit.
[0109] See also Fig.13 Preferably, a first one-way valve installation position 21, a second one-way valve installation position 22 and a liquid storage tank installation position 23 are provided on one side of the first valve island 2, and the liquid storage tank installation position 23 is provided with a liquid storage tank inlet 231 and a liquid storage tank outlet 232 for connecting to the liquid storage tank 6.
[0110] The first valve island 2 is provided with a first liquid outlet cavity and a second liquid outlet cavity which are connected with the liquid outlet port 232 of the liquid storage tank. The first liquid outlet cavity is used to connect to the evaporator 7, and the second liquid outlet cavity is used to connect to the refrigerant pipeline of the waste heat recovery device.
[0111] The first valve island 2 is also provided with a first liquid inlet cavity and a second liquid inlet cavity which are connected to the liquid inlet port 231 of the liquid storage tank. The first liquid inlet cavity is used to connect to the external condenser 5, and the second liquid inlet cavity is used to connect to the refrigerant pipeline of the water-cooled condenser. The first one-way valve installation position 21 is located on the first liquid inlet cavity, and the second one-way valve installation position 22 is located on the second liquid inlet cavity.
[0112] In this embodiment, the lower plate 13 has a gap for installing the first valve island 2 and the second valve island 4. The first valve island 2 and the second valve island 4 are installed on the sandwich plate 12 and are located in the area where the flow channel cavity is not set between the sandwich plate 12 and the upper plate 11 to avoid heat exchange between the refrigerant and the cooling; the first valve island 2 and the second valve island 4 are arranged at intervals to avoid heat exchange between the high-temperature refrigerant and the low-temperature refrigerant. That is, the first valve island 2 and the second valve island 4 and the waste heat recovery device 17 and the water-cooled condenser 18 are located on the same side of the sandwich plate 12, which can facilitate the connection of the refrigerant pipeline interface of the waste heat recovery device 17 and the water-cooled condenser 18 with the first valve island 2.
[0113] In addition, installing the first one-way valve 24, the second one-way valve 25 and the liquid storage tank 6 on the first valve island 2 can reduce the use of connecting pipes, reduce the space occupied by the thermal management system, and reduce the installation bracket of the liquid storage tank 6, saving costs.
[0114] The first one-way valve installation position 21, the second one-way valve installation position 22 and the liquid storage tank installation position 23 are all arranged on the outside of the first valve island 2, that is, on the side away from the multi-way valve 3. The liquid inlet of the first liquid inlet cavity is the external condenser water outlet interface 2001, and the liquid inlet of the second liquid inlet cavity is the water-cooled condenser refrigerant pipeline interface 2002, which is connected to the refrigerant pipeline of the water-cooled condenser 18 through the first connecting pipeline 181. The external condenser water outlet interface 2001 is arranged on the side away from the lower plate 13, and the water-cooled condenser refrigerant pipeline interface 2002 is arranged on the outside of the first valve island 2. The liquid outlet of the first liquid outlet channel is the evaporator interface 2003, which is arranged on the side away from the lower plate 13. The liquid outlet of the second liquid outlet channel is the waste heat recovery device refrigerant pipeline interface 2004, which is located on the outside of the first valve island 2 and is connected to the refrigerant pipeline of the waste heat recovery device 17 through the second connecting pipeline 171. The second connecting pipeline 171 is provided with an electronic expansion valve 172. The liquid inlet 231 and the liquid outlet 232 of the liquid storage tank are both located on the outside of the first valve island 2, which is convenient for the installation of the liquid storage tank 6.
[0115] See also Fig.13 Preferably, a first stop valve installation position 41 , a second stop valve installation position 42 and a first sensor installation position 43 are provided on one side of the second valve island 4 .
[0116] A liquid inlet channel communicating with the first sensor installation position 43 is provided in the second valve island 4 , and the liquid inlet channel is used to be connected to the compressor 8 .
[0117] The second valve island 4 is also provided with a first liquid outlet channel and a second liquid outlet channel connected to the first sensor installation position 43. The first liquid outlet channel is used to connect the built-in condenser 9, and the second liquid outlet channel is used to connect the external condenser 5. The first stop valve installation position 41 is located on the first liquid outlet channel, and the second stop valve installation position 42 is located on the second liquid outlet channel.
[0118] In this embodiment, the first liquid outlet channel and the second liquid outlet channel are arranged in parallel, and are both connected to the liquid inlet channel, and the first sensor installation position 43 is arranged at the connection between the first liquid outlet channel, the second liquid outlet channel and the liquid inlet channel. The first stop valve installation position 41, the second stop valve installation position 42 and the first sensor installation position 43 are all located on the outside of the second valve island 4, and are used to install the first stop valve 44, the second stop valve 45 and the first sensor 46. The liquid outlet of the first liquid outlet channel is the water inlet interface 401 of the external condenser, the liquid outlet of the second liquid outlet channel is the water inlet interface 402 of the built-in condenser, the liquid inlet channel is the compressor interface 403, and the water inlet interface 401 of the external condenser, the water inlet interface 402 of the built-in condenser and the compressor interface 403 are all located on the side away from the lower plate 13.
[0119] In addition, the control module 10 is also arranged on the coolant connecting plate 1, and is located on the same side as the first water pump 14, the second water pump 15 and the multi-way valve 3. The control module 10 is located on the upper side of the figure relative to the first water pump 14 and the second water pump 15. The control module 10 is used to collect signals from the first sensor 46, the third sensor, the fourth sensor, the first water pump 14, the second water pump 15, the multi-way valve 3, the first stop valve 44 and the second stop valve 45. The control chips of the first water pump 14, the second water pump 15 and the multi-way valve 3 are cancelled, and they are all centrally controlled by the control module 10, thereby improving the control integration and chip utilization.
[0120] The first valve island 2 provides an installation position for the liquid storage tank 6, and is also provided with a first one-way valve installation position 21 and a second one-way valve installation position 22 for installing a first one-way valve 24 and a second one-way valve 25; the second valve island 4 is provided with a first stop valve installation position 41, a second stop valve installation position 42 and a first sensor installation position 43 for installing a first stop valve 44, a second stop valve 45 and a first sensor 46.
[0121] See also Fig.14 In some optional embodiments, the thermal management integrated module substrate also includes a mounting bracket 19, which is made of structural steel and includes an upper bracket 191, a right bracket 192, a lower bracket 193 and a left bracket 194 connected in sequence, the upper bracket 191 is embedded with two first shock-absorbing rubber pads 1911, the first shock-absorbing rubber pad 1911 is embedded with a metal bushing, and the first shock-absorbing rubber pad 1911 is connected to the mounting crossbeam by bolts; a second shock-absorbing rubber pad 1941 is installed on the left bracket 194, which is embedded with a metal bushing and connected to the vehicle body bracket by bolts; it is used to install the coolant connecting plate 1, the first valve island 2 and the second valve island 4.
[0122] The second valve island 4 is provided with a bayonet on the lower side for being clamped on the second shock-absorbing rubber pad 1941. The second valve island 4 is provided with three installation points, the lower two points are installed on the installation bracket 19, and the upper point is installed on the water sandwich plate 12; the first valve island 2 is installed at three points, the upper two points are installed on the installation bracket 19, and the lower right point is installed on the sandwich plate 12.
[0123] In a second aspect, the present invention further provides a thermal management integrated module, comprising any one of the thermal management integrated module substrates described above.
[0124] In this solution, the battery cooling circuit, the electric drive and electronic control cooling circuit, the water-cooled condenser coolant circuit and the waste heat recovery device coolant circuit are connected through the coolant connecting plate 1, and the heat exchange in the above-mentioned coolant circuits is realized through the multi-way valve 3. The coolant connecting plate 1 is used to replace the cooling water pipe that serves as a connection, which can reduce the complexity of the pipeline, reduce the problem of the cooling water pipe crossing the cabin, and improve the utilization rate of the cabin space. The length of the connecting pipeline is greatly reduced, and the heat exchange with the environment is reduced, so that the heat loss of the system is reduced, the energy consumption is reduced, and the pipeline cost of the whole vehicle is reduced; in addition, the use of valves is reduced, so the use of brackets can also be reduced to save costs.
[0125] The first valve island 2 and the second valve island 4 are used to connect the air conditioning pipelines, reducing the heat exchange between the long air conditioning pipelines and the air, and reducing energy consumption at the same time. In addition, the first valve island 2 connects the outlet of the water-cooled condenser refrigerant pipeline and the outlet of the vehicle-outside condenser 5 to the inlet of the liquid storage tank 6, and connects the outlet of the liquid storage tank 6 to the inlet of the evaporator 7 and the waste heat recovery device refrigerant pipeline. The second valve island 4 connects the outlet of the compressor 8 to the built-in condenser 9 and the vehicle-outside condenser 5, realizing the partition of the refrigerant low-temperature area and the high-temperature area. The high and low temperature partition design is adopted in design, which reduces the mutual heat exchange between the high and low temperature refrigerants, reduces the heat loss of the system, and reduces energy consumption.
[0126] In addition, the coolant connecting plate 1 also provides installation positions for the multi-way valve 3, the first water pump 14, the second water pump 15, the water storage tank 16, the water-cooled condenser 18 and the waste heat recovery device 17, as well as installation positions for multiple sensors. The above-mentioned components can be integrated and installed on the coolant connecting plate 1, which can reduce the use of mounting brackets for the above-mentioned components and reduce the installation space required. The flow channel cavity set in the coolant connecting plate 1 can also reduce the use of connecting pipes to improve the cleanliness of the entire cabin.
[0127] Similarly, the first valve island 2 provides an installation position for the liquid storage tank 6, and also sets a first one-way valve installation position 21 and a second one-way valve installation position 22 for installing the first one-way valve 24 and the second one-way valve 25; the second valve island 4 sets a first stop valve installation position 41, a second stop valve installation position 42 and a first sensor installation position 43 for installing the first stop valve 44, the second stop valve 45 and the first sensor 46, which can also save connecting pipes and brackets.
[0128] In addition, the thermal management integrated module substrate in the thermal management integrated module corresponds to the aforementioned thermal management integrated module substrate in the embodiment, and the structures and functions of its components are not described one by one here.
[0129] In a third aspect, the present invention further provides a vehicle, comprising the above-mentioned thermal management integrated module.
[0130] The vehicle adopting this solution integrates multiple parts on the coolant connecting plate 1, which can reduce the use of pipelines and brackets, save the space occupied by the cabin, and save costs.
[0131] Specifically, the use of the coolant connecting plate 1 to replace the cooling water pipe for connection can reduce the complexity of the pipeline, reduce the problem of cooling water pipes crossing the cabin, improve the utilization rate of the cabin space, greatly reduce the length of the connecting pipeline, reduce the heat exchange with the environment, reduce the heat loss of the system, reduce energy consumption, and reduce the pipeline cost of the whole vehicle; in addition, the use of valves is reduced, so the use of brackets can also be reduced to save costs. In addition, the first valve island 2 connects the outlet of the water-cooled condenser refrigerant pipeline and the external condenser 5 to the inlet of the liquid storage tank 6, and connects the outlet of the liquid storage tank 6 to the inlet of the evaporator 7 and the waste heat recovery device refrigerant pipeline. The second valve island 4 connects the outlet of the compressor 8 to the built-in condenser 9 and the external condenser 5, realizing the partition of the low-temperature area and the high-temperature area of the refrigerant. The high and low temperature partition design is adopted in design, which reduces the mutual heat between the high and low temperature refrigerants, reduces the heat loss of the system, and reduces energy consumption.
[0132] The thermal management integrated module in the vehicle corresponds to the aforementioned embodiment of the thermal management integrated module, and the structures and functions of its components are not described in detail here.
[0133] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.
[0134] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.
[0135] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.
Claims
1. A thermal management integrated module substrate, characterized in that: include: A coolant connecting plate (1) is used to connect a battery cooling circuit, an electric drive and electric control cooling circuit, a water-cooled condenser coolant circuit and a waste heat recovery device coolant circuit to a multi-way valve (3); A first valve island (2) connected to the coolant connecting plate (1) and used to connect the outlets of the water-cooled condenser refrigerant pipeline and the off-vehicle condenser (5) to the inlet of the liquid storage tank (6), and to connect the outlet of the liquid storage tank (6) to the inlet of the evaporator (7) and the refrigerant pipeline of the waste heat recovery device; The second valve island (4) is connected to the coolant connecting plate (1) and is used to connect the outlet of the compressor (8) to the built-in condenser (9) and the off-vehicle condenser (5).
2. The thermal management integrated module substrate according to claim 1, characterized in that: The cooling liquid connecting plate (1) comprises: An upper plate (11), one side of which is used to mount the multi-way valve (3); a sandwich plate (12) attached to the other side of the upper plate (11), and forming a first flow channel cavity (101) and a fifth flow channel cavity (105) connecting the two ends of the electric drive and electric control cooling circuit, and a second flow channel cavity (102) connecting one end of the battery cooling circuit, between the sandwich plate (12) and the upper plate (11); The lower plate (13) is attached to the other side of the sandwich plate (12), and forms a third flow channel cavity (103) and a fourth flow channel cavity (104) for connecting the two ends of the waste heat recovery device coolant circuit, a sixth flow channel cavity (106) and a seventh flow channel cavity (107) for connecting the two ends of the water-cooled condenser coolant circuit, and an eighth flow channel cavity (108) for connecting the other end of the battery cooling circuit.
3. The thermal management integrated module substrate according to claim 2, characterized in that: The upper plate (11) is provided with communication holes which correspond to the communication ports of the multi-way valve (3) one by one and are arranged circumferentially, and sequentially include: A first communication hole, which is in communication with the first flow channel cavity (101); A second communication hole, which is in communication with the second flow channel cavity (102); a fourth communication hole, which is in communication with the fourth flow channel cavity (104); a fifth communication hole, which is in communication with the fifth flow channel cavity (105); a sixth communication hole, which is in communication with the sixth flow channel cavity (106); a seventh communication hole, which is in communication with the seventh flow channel cavity (107); an eighth communication hole, which is in communication with the eighth flow channel cavity (108); A third communicating hole is communicated with the third flow channel cavity (103).
4. The thermal management integrated module substrate according to claim 3, characterized in that: A blocking plate (111) is provided in the middle of the connection between the upper plate (11) and the multi-way valve (3), and the communication holes are arranged along the circumference of the blocking plate (111); The sandwich plate (12) is provided with an eighth flow hole corresponding to the blocking plate (111), a fourth flow hole corresponding to the fourth connecting hole, a sixth flow hole corresponding to the sixth connecting hole, a seventh flow hole corresponding to the seventh connecting hole, and a third flow hole corresponding to the third connecting hole, and an eighth connecting cavity connected to the eighth flow hole is formed between the upper plate (11) and the sandwich plate, and the eighth connecting cavity corresponds to the position of the eighth connecting hole.
5. The thermal management integrated module substrate according to claim 2, characterized in that: The upper plate (11) is provided with a side away from the sandwich plate (12): A first water pump installation position (112), which is arranged on the first flow channel cavity (101) and is used to install a first water pump (14) in the battery cooling circuit; A second water pump installation position (113) is provided on the second flow channel cavity (102) and is used for installing a second water pump (15) in the electric drive and electric control cooling circuit.
6. The thermal management integrated module substrate according to claim 2, characterized in that: The lower plate (13) is provided on a side away from the sandwich plate (12): A waste heat recovery device installation position, which is provided with a sixth connection port for connecting two ends of the waste heat recovery device coolant circuit to the sixth flow channel cavity (106) and a seventh connection port of the seventh flow channel cavity (107); A water-cooled condenser installation position is provided with a third connection port for connecting two ends of the water-cooled condenser coolant circuit to the third flow channel cavity (103) and a fourth connection port of the fourth flow channel cavity (104).
7. The thermal management integrated module substrate according to claim 1, characterized in that: A first one-way valve installation position (21), a second one-way valve installation position (22) and a liquid storage tank installation position (23) are provided on one side of the first valve island (2); the liquid storage tank installation position (23) is provided with a liquid storage tank liquid inlet (231) and a liquid storage tank liquid outlet (232) for connecting to the liquid storage tank (6); The first valve island (2) is provided with a first liquid outlet cavity and a second liquid outlet cavity which are connected to the liquid outlet (232) of the liquid storage tank, the first liquid outlet cavity being used to connect to the evaporator (7), and the second liquid outlet cavity being used to connect to the refrigerant pipeline of the waste heat recovery device; The first valve island (2) is also provided with a first liquid inlet cavity and a second liquid inlet cavity which are connected to the liquid inlet port (231) of the liquid storage tank, wherein the first liquid inlet cavity is used to connect to the off-vehicle condenser (5), and the second liquid inlet cavity is used to connect to the refrigerant pipeline of the water-cooled condenser, the first one-way valve installation position (21) is located on the first liquid inlet cavity, and the second one-way valve installation position (22) is located on the second liquid inlet cavity.
8. The thermal management integrated module substrate according to claim 1, characterized in that: A first stop valve installation position (41), a second stop valve installation position (42) and a first sensor installation position (43) are provided on one side of the second valve island (4); The second valve island (4) is provided with a liquid inlet channel connected to the first sensor installation position (43), and the liquid inlet channel is used to be connected to the compressor (8); The second valve island (4) is also provided with a first liquid outlet channel and a second liquid outlet channel connected to the first sensor installation position (43); the first liquid outlet channel is used to connect to the built-in condenser (9); the second liquid outlet channel is used to connect to the external condenser (5); the first stop valve installation position (41) is located on the first liquid outlet channel; and the second stop valve installation position (42) is located on the second liquid outlet channel.
9. A thermal management integrated module, characterized in that: It comprises a thermal management integrated module substrate as described in any one of claims 1 to 8.
10. A vehicle, characterized in that: Comprising the thermal management integrated module as claimed in claim 9.