Display screen assembly and electronic equipment

Abstract

The invention provides a display screen assembly and electronic equipment, the display screen assembly comprises a display screen module and a liquid cooling module, the liquid cooling module comprises a liquid cooling membrane and at least one piezoelectric driving piece, the liquid cooling membrane is attached to the back surface of the display screen module, and the piezoelectric driving piece is fixed to the side, away from the display screen module, of the liquid cooling membrane; the piezoelectric driving piece comprises a pump cavity, and a first pump cavity opening and a second pump cavity opening which are communicated with the pump cavity; the liquid cooling diaphragm internally comprises at least one liquid cooling channel, a first liquid cooling opening and a second liquid cooling opening, the first liquid cooling opening and the second liquid cooling opening are communicated with the liquid cooling channel, a liquid cooling medium is arranged in the liquid cooling channel, and a first pump cavity opening of the piezoelectric driving part is in sealed butt joint with and communicated with the first liquid cooling opening of the liquid cooling diaphragm; and a second pump cavity opening of the piezoelectric driving piece is in sealed butt joint with and communicates with a second liquid cooling opening of the liquid cooling membrane, and the piezoelectric driving piece is used for driving the liquid cooling medium to flow in the liquid cooling channel, so that the liquid cooling medium can flow in different areas of the back surface of the display screen module, the heat dissipation area is increased, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a display screen assembly and an electronic device. Background Art

[0002] With the development of science and technology, people have more and more functional requirements for electronic devices such as smart phones. In order to meet the increasing functional requirements of mobile phones, the operating speed of the chips on the motherboard of electronic devices has increased, so the heat generated by the chips on the motherboard increases. Excessive temperature may cause the processor to downclock, reduce the operating speed and slow the response time. Continuous high temperature will damage the hardware components inside the mobile phone and cause hardware failures. Therefore, how to further increase the heat dissipation area and improve the heat dissipation efficiency has become a technical problem that needs to be solved. Summary of the invention

[0003] The present application provides a display screen assembly with increased heat dissipation area and improved heat dissipation efficiency, and an electronic device having the display screen assembly.

[0004] In a first aspect, an embodiment of the present application provides a display screen assembly, the display screen assembly comprising:

[0005] A display screen module, comprising an exterior surface and a back surface disposed opposite to each other;

[0006] A liquid cooling module, wherein the liquid cooling module comprises a liquid cooling diaphragm and at least one piezoelectric driving component, wherein the liquid cooling diaphragm is attached to the back side of the display screen module, and the piezoelectric driving component is fixed to the side of the liquid cooling diaphragm away from the display screen module; the piezoelectric driving component comprises a pump chamber, at least one first pump chamber opening and at least one second pump chamber opening connected to the pump chamber; the liquid cooling diaphragm comprises at least one liquid cooling channel, a first liquid cooling port and a second liquid cooling port connected to the liquid cooling channel, the liquid cooling channel has a liquid cooling medium, the first pump chamber opening of the piezoelectric driving component is sealed and connected to the first liquid cooling port of the liquid cooling diaphragm, the second pump chamber opening of the piezoelectric driving component is sealed and connected to the second liquid cooling port of the liquid cooling diaphragm, and the piezoelectric driving component is used to drive the liquid cooling medium to flow in the liquid cooling channel.

[0007] The present application provides a display screen assembly, which includes a display screen module and a liquid cooling module. The display screen module includes an appearance surface and a back surface arranged opposite to each other; the liquid cooling module includes a liquid cooling diaphragm and at least one piezoelectric driver, the liquid cooling diaphragm is attached to the back surface of the display screen module, and the piezoelectric driver is fixed to the side of the liquid cooling diaphragm away from the display screen module; the piezoelectric driver includes a pump chamber, a first pump chamber port and a second pump chamber port connected to the pump chamber; the liquid cooling diaphragm includes at least one liquid cooling channel, a first liquid cooling port and a second liquid cooling port connected to the liquid cooling channel, and the liquid cooling channel has a liquid cooling medium, the first pump chamber port of the piezoelectric driver is sealed and connected to the first liquid cooling port of the liquid cooling diaphragm, the second pump chamber port of the piezoelectric driver is sealed and connected to the second liquid cooling port of the liquid cooling diaphragm, and the piezoelectric driver is used to drive the liquid cooling medium to flow in the liquid cooling channel, so that the liquid cooling medium can flow in different areas on the back of the display screen module to bring local heat to other areas, enhance the heat dissipation in the plane where the display screen module is located, increase the heat dissipation area and improve the heat dissipation efficiency.

[0008] In a second aspect, an embodiment of the present application provides an electronic device, the electronic device comprising a frame, a middle frame module and a display screen assembly as described in the first aspect, the middle frame module is arranged in the frame, the peripheral side of the middle frame module is connected to the inner side of the frame, the liquid cooling module is located between the middle frame module and the display screen module, a buffer gap is provided between the middle frame module and the liquid cooling diaphragm, and at least a portion of the piezoelectric driver is arranged in the buffer gap.

[0009] In a third aspect, an electronic device is provided by an embodiment of the present application, the electronic device also includes a display screen module, a liquid cooling module, a middle frame module, a mainboard, a preset chip and a battery module, the display screen module, the middle frame module and the mainboard are arranged in sequence along the thickness direction, the preset chip is arranged on the side of the mainboard facing the middle frame module, the liquid cooling module is arranged on the side of the middle frame module facing the mainboard; or, the liquid cooling module is arranged on the side of the middle frame module facing the display screen module, the battery module and the mainboard are arranged along the length direction, and the battery module and the mainboard are both opposite to the middle frame module, a part of the liquid cooling module is opposite to and in contact with the preset chip on the mainboard, and another part of the liquid cooling module is opposite to the battery module. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments are briefly introduced below.

[0011] Figure 1 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0012] Figure 2is a schematic diagram of an exploded structure of an electronic device provided in an embodiment of the present application;

[0013] Figure 3 A schematic diagram of a cross section of an electronic device along the length direction provided in an embodiment of the present application Figure 1 ;

[0014] Figure 4 It is a structural schematic diagram of a liquid cooling module provided in an embodiment of the present application;

[0015] Figure 5 A schematic diagram of a cross section of an electronic device along the length direction provided in an embodiment of the present application Figure 2 ;

[0016] Figure 6 A cross-sectional view of a liquid cooling module provided in an embodiment of the present application along the length direction Figure 1 ;

[0017] Figure 7 It is a three-dimensional schematic diagram of a display screen assembly and a liquid cooling module provided in an embodiment of the present application;

[0018] Figure 8 A cross-sectional view of a liquid cooling module provided in an embodiment of the present application along the length direction Figure 2 ;

[0019] Fig. 9 is an exploded schematic diagram of a liquid cooling module provided in an embodiment of the present application;

[0020] Fig.10 A cross-sectional view of a liquid cooling module provided in an embodiment of the present application along the length direction Figure 3 ;

[0021] Fig.11 This is a schematic diagram of the electrical connection between the piezoelectric driver, the control module and the mainboard provided in the embodiment of the present application. Figure 1 ;

[0022] Fig.12 This is a schematic diagram of the electrical connection between the piezoelectric driver, the control module and the mainboard provided in the embodiment of the present application. Figure 2 ;

[0023] Fig.13 This is a schematic diagram of the electrical connection between the piezoelectric driver, the control module and the mainboard provided in the embodiment of the present application. Figure 3 ;

[0024] Fig.14 A schematic diagram of a cross section of an electronic device along the length direction provided in an embodiment of the present application Figure 3 ;

[0025] Fig.15A schematic diagram of a cross section of an electronic device along the length direction provided in an embodiment of the present application Figure 4 ;

[0026] Fig.16 is a top view of a first liquid cooling channel provided in an embodiment of the present application;

[0027] Fig.17 is a schematic diagram of the structure of a second liquid cooling channel provided in an embodiment of the present application;

[0028] Fig.18a is a schematic diagram of the structure of the third liquid cooling channel provided in an embodiment of the present application;

[0029] Fig.18b is a schematic structural diagram of a fourth liquid cooling channel provided in an embodiment of the present application;

[0030] Fig.19 is a schematic structural diagram of a fifth liquid cooling channel provided in an embodiment of the present application;

[0031] Fig. 20 is a schematic structural diagram of a sixth liquid cooling channel provided in an embodiment of the present application;

[0032] Fig.21 is a schematic structural diagram of a seventh liquid cooling channel provided in an embodiment of the present application;

[0033] Fig. 22 is a schematic structural diagram of an eighth liquid cooling channel provided in an embodiment of the present application;

[0034] Fig.23 is a schematic structural diagram of a ninth liquid cooling channel provided in an embodiment of the present application;

[0035] Fig.24 A schematic diagram of a cross section of an electronic device along the length direction provided in an embodiment of the present application Figure 5 ;

[0036] Fig.25 A schematic diagram of a cross section of an electronic device along the length direction provided in an embodiment of the present application Figure 6 .

[0037] Description of Figure Numbers:

[0038] Electronic device 1000, display screen assembly 100, middle frame module 300, middle plate 310, frame 320, back cover 400, main board 600, battery module 700, sub-plate 800, top frame 321, first side frame 322, second side frame 323, bottom frame 324, display screen module 10, liquid cooling module 20, liquid cooling diaphragm 21, piezoelectric drive element 22, pump chamber 221, first pump chamber port 222, second pump chamber port 223, piezoelectric actuator 224, spacer 225, diaphragm 226, connecting portion 227, cover plate 228, liquid cooling channel 211, first liquid cooling port 212, second liquid cooling port 213, first area 101, second area 102, top edge 11, bottom edge 12, first part 2111, second part 2112, a third part 2113, a fourth part 2114, a first side 13, a second side 14, a first copper foil 15, a first diaphragm 214, a supporting film 215, a second diaphragm 216, a supporting frame 2151, a supporting retaining wall 2152, a control module 23, a display flexible circuit board 16, a first flexible circuit board 17, a buffer gap 330, a receiving groove 340, a preset chip 610, a heat conducting part 620, a shielding cover 410, a first sub-heat conducting part 621, a second sub-heat conducting part 622, a first piezoelectric driver 2201, a second piezoelectric driver 2202, a first liquid cooling channel 211a, a second liquid cooling channel 211b, a first sub-channel 241, a second sub-channel 242, a third sub-channel 243, and a fourth sub-channel 244. DETAILED DESCRIPTION

[0039] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in the present application are only a part of the embodiments, not all of the embodiments. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the present application.

[0040] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it mutually exclusive, independent, or alternative to other embodiments. It can be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0041] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example: a component or device including one or more parts is not limited to the one or more parts listed, but optionally includes one or more parts that are not listed but inherent to the exemplified product, or one or more parts that it should have based on the described function.

[0042] With the development of science and technology, people have more and more functional demands on smartphones. In order to meet the increasing functional demands of mobile phones, the platform and power consumption have been upgraded, and the corresponding mobile phone temperature has deteriorated. When the mobile phone runs at high temperature, there are the following problems: 1) It will cause the processor to downclock, reduce the running speed and response time of the mobile phone, thereby affecting the user experience; 2) Overheating of the mobile phone may cause safety problems. In the most serious cases, it may cause the battery to swell or even explode; 3) An overheated mobile phone not only feels hot to the touch, but may also cause software failures and system crashes, affecting the user experience; 4) Continuous high temperature will damage the internal hardware components of the mobile phone, such as the processor, memory chips, etc., causing hardware failures.

[0043] When users use mobile phones, their skin is in direct contact with the outer surface temperature of the mobile phone case. Therefore, the outer surface temperature of the mobile phone case also needs to be controlled, and the performance of the mobile phone heating chip can be controlled based on the outer surface temperature of the mobile phone case (such as frequency control, frame rate control, current control, brightness control, data transmission control, etc.).

[0044] Therefore, the operation of mobile phones requires a certain heat dissipation solution design, and an appropriate temperature control solution to ensure the user's performance experience and safety of use.

[0045] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of an electronic device 1000 provided in the first embodiment of the present application. The electronic device 1000 includes but is not limited to a mobile phone, a tablet computer, a laptop computer, a computer, a wearable device, a drone, a robot, a digital camera and other devices with communication functions. The present embodiment of the application is described by taking a mobile phone as an example, and other electronic devices can refer to this embodiment.

[0046] See also Figure 2 , Figure 21 is a partial exploded schematic diagram of an electronic device 1000 provided in Embodiment 1 of the present application. The working environment of the display screen assembly 100 is illustrated by taking the electronic device 1000 as a mobile phone as an example. The electronic device 1000 includes a display screen assembly 100, a middle frame module 300 and a back cover 400 arranged in sequence along the thickness direction Z. Among them, the middle frame module 300 includes a middle plate 310 and a frame 320 surrounding the periphery of the middle plate 310. The frame 320 is a conductive frame, such as a metal frame. A receiving space is formed between the display screen assembly 100 and the middle plate 310, and between the middle plate 310 and the back cover 400 to accommodate the main board 600, the camera module, the receiver module, the battery module 700, the sub-board 800 and various sensors and other devices. One side of the frame 320 along the thickness direction Z is surrounded by the edge of the display screen assembly 100, and the other side of the frame 320 along the thickness direction Z is surrounded by the edge of the back cover 400 to form a complete appearance structure of the electronic device 1000. In this embodiment, the frame 320 and the middle plate 310 are an integral structure, and the frame 320 and the back cover 400 are a separate structure. The above is the working environment of the display screen assembly 100 taking a mobile phone as an example, but the display screen assembly 100 of the present application is not limited to the above working environment.

[0047] See also Figure 2 and Figure 3 The frame 320 includes a top frame 321 and a bottom frame 324 that are arranged opposite to each other, and a first side frame 322 and a second side frame 323 that are connected to the top frame 321 and the bottom frame 324. The top frame 321 is the side away from the ground when the user holds the electronic device 1000 and uses it in portrait mode, and the bottom frame 324 is the side facing the ground when the user holds the electronic device 1000 and uses it in portrait mode. The first side frame 322 is the left side when the user holds the electronic device 1000 and uses it in portrait mode. The second side frame 323 is the right side when the user holds the electronic device 1000 and uses it in portrait mode. Of course, the first side frame 322 can also be the right side when the user holds the electronic device 1000 and uses it. The second side frame 323 is the left side when the user holds the electronic device 1000 and uses it in portrait mode.

[0048] Optionally, the top frame 321 is a straight frame, the first side frame 322 and the second side frame 323 are both straight frames in the middle, and the two ends are bent frames, wherein the bending angles of the bent frames at the two ends of the first side frame 322 are close to or 90°. The bending angles of the bent frames at the two ends of the second side frame 323 are close to or 90°. The bent frames are curved in an arc. The bottom frame 324 is a straight frame.

[0049] See also Figure 3 The display screen assembly 100 includes a display screen module 10 and a liquid cooling module 20 .

[0050] See also Figure 3 The display screen module 10 includes an appearance surface and a back surface that are arranged opposite to each other. The appearance surface is used to present a display image.

[0051] The structure of the liquid cooling module 20 is described below with reference to the accompanying drawings.

[0052] See also Figure 4 and Figure 5 The liquid cooling module 20 includes a liquid cooling diaphragm 21 and at least one piezoelectric driving element 22 .

[0053] See also Figure 3 and Figure 5 The liquid cooling film 21 is attached to the back of the display screen module 10 .

[0054] Taking the surface parallel to the back as the reference surface, the size of the liquid cooling film 21 in the reference surface is close to the size of the back of the display screen module 10. For example, the size of the liquid cooling film 21 in the reference surface is 70% to 100% of the size of the back of the display screen module 10. In this way, the heat dissipation area of ​​the liquid cooling film 21 is large, which can disperse the local heat, increase the heat dissipation area in the reference surface, and improve the heat dissipation efficiency.

[0055] See also Figure 3 and Figure 5 The piezoelectric driver 22 is fixed to the side of the liquid cooling diaphragm 21 away from the display screen module 10. The piezoelectric driver 22 is generally block-shaped. The piezoelectric driver 22 and the liquid cooling diaphragm 21 are superimposed in the thickness direction Z. The piezoelectric driver 22 is convexly disposed on the liquid cooling diaphragm 21 in the thickness direction Z.

[0056] In this embodiment, the piezoelectric driver 22 is fixed to the side of the liquid cooling diaphragm 21 away from the display screen module 10, so that the piezoelectric driver 22 does not occupy the space between the liquid cooling diaphragm 21 and the back of the display screen module 10, which is conducive to the liquid cooling diaphragm 21 being attached to the back of the display screen module 10.

[0057] See also Figure 6 The piezoelectric driving element 22 includes a pump chamber 221 , at least one first pump chamber port 222 communicating with the pump chamber 221 , and at least one second pump chamber port 223 .

[0058] Specifically, the piezoelectric driving element 22 includes but is not limited to a piezoelectric micro pump and the like.

[0059] For example, see Figure 6The piezoelectric driving member 22 includes a piezoelectric actuator 224, a spacer 225, a diaphragm 226, a connecting portion 227 and a cover plate 228. The piezoelectric actuator 224, the spacer 225, the diaphragm 226, the connecting portion 227 and the cover plate 228 are fixedly connected in sequence in the thickness direction Z. The spacer 225 is annular, and the piezoelectric actuator 224, the spacer 225 and the diaphragm 226 surround and form an excitation cavity. The connecting portion 227 is annular, and the diaphragm 226, the connecting portion 227 and the cover plate 228 surround and form a pump chamber 221.

[0060] See also Figure 6 The cover plate 228 is provided with a first pump cavity port 222 and a second pump cavity port 223 , and the first pump cavity port 222 and the second pump cavity port 223 are connected to the pump chamber 221 .

[0061] See also Figure 6 The liquid cooling membrane 21 includes at least one liquid cooling channel 211, a first liquid cooling port 212 and a second liquid cooling port 213 connected to the liquid cooling channel 211. The liquid cooling channel 211 contains a liquid cooling medium. The liquid cooling medium includes but is not limited to liquids such as water.

[0062] See also Figure 6 The first pump cavity port 222 of the piezoelectric driver 22 is sealed and connected to the first liquid cooling port 212 of the liquid cooling diaphragm 21. The second pump cavity port 223 of the piezoelectric driver 22 is sealed and connected to the second liquid cooling port 213 of the liquid cooling diaphragm 21.

[0063] For example, the first pump cavity port 222 is a liquid inlet, and the second pump cavity port 223 is a liquid outlet. The first pump cavity port 222 has a one-way valve on the side facing the pump cavity 221, which opens when the liquid cooling medium enters the pump cavity 221 from the liquid cooling channel 211, and prevents the liquid cooling medium in the pump cavity 221 from flowing from the pump cavity 221 to the liquid cooling channel 211. The second pump cavity port 223 has a one-way valve on the side facing the liquid cooling channel 211, which opens when the liquid cooling medium enters the liquid cooling channel 211 from the pump cavity 221, and prevents the liquid cooling medium in the liquid cooling channel 211 from flowing from the liquid cooling channel 211 to the pump cavity 221.

[0064] The piezoelectric driver 22 is used to drive the liquid cooling medium to flow in the liquid cooling channel 211 .

[0065] Specifically, the piezoelectric actuator 224 includes but is not limited to at least one piezoelectric element. The piezoelectric element is electrically connected to a power supply unit. The external electric field causes the charge distribution of the piezoelectric material in the piezoelectric element to change, thereby causing the material to deform, and then causing the piezoelectric element to deform or vibrate. The power supply unit provides a square wave or a sine wave, causing the piezoelectric element to deform or vibrate periodically, thereby causing the diaphragm 226 to reciprocate in the thickness direction Z, so that the pump chamber 221 periodically forms a positive pressure chamber or a negative pressure chamber to drive the liquid cooling medium in the liquid cooling channel 211 to flow.

[0066] Optionally, the liquid-cooled diaphragm 21 has a high heat conduction efficiency. The liquid-cooled diaphragm 21 is provided with a liquid-cooled channel 211, and a liquid-cooled medium is provided in the liquid-cooled channel 211. The theoretical thermal conductivity of the flowing liquid-cooled medium can reach more than 2000W / mK, which is much greater than the thermal conductivity of copper foil / copper / graphite of about 200-400W / mK. In particular, as the liquid-cooled medium flows, the thermal conductivity of the liquid-cooled diaphragm 21 parallel to the reference surface increases. In other words, the liquid-cooled diaphragm 21 has a smaller thermal resistance than copper foil / copper / graphite, etc.

[0067] The present application provides a display screen assembly 100 that forms a liquid-cooled screen module. The display screen assembly 100 includes a display screen module 10 and a liquid cooling module 20. The display screen module 10 includes an appearance surface and a back surface that are arranged opposite to each other. The liquid cooling module 20 includes a liquid cooling diaphragm 21 and at least one piezoelectric driver 22. The liquid cooling diaphragm 21 is attached to the back surface of the display screen module 10. The piezoelectric driver 22 is fixed to the side of the liquid cooling diaphragm 21 that is away from the display screen module 10. The piezoelectric driver 22 includes a pump chamber 221, a first pump chamber port 222 and a second pump chamber port 223 that are connected to the pump chamber 221. The liquid cooling diaphragm 21 includes at least one liquid cooling channel 211, a first pump chamber port 222 and a second pump chamber port 223 that are connected to the pump chamber 221. The first liquid cooling port 212 and the second liquid cooling port 213 of the piezoelectric drive component 211, the liquid cooling channel 211 has a liquid cooling medium, the first pump cavity port 222 of the piezoelectric drive component 22 is sealed and connected with the first liquid cooling port 212 of the liquid cooling diaphragm 21, and the second pump cavity port 223 of the piezoelectric drive component 22 is sealed and connected with the second liquid cooling port 213 of the liquid cooling diaphragm 21, and the piezoelectric drive component 22 is used to drive the liquid cooling medium to flow in the liquid cooling channel 211, so that the liquid cooling medium can flow in different areas on the back of the display screen module 10, so as to bring local heat to other areas, enhance the heat dissipation in the plane where the display screen module 10 is located, increase the heat dissipation area and improve the heat dissipation efficiency.

[0068] For further information, see Figure 3 The display screen assembly 100 can be applied to electronic devices such as mobile phones, and the liquid cooling module 20 of the display screen assembly 100 can be directly opposite to the preset chip 610 on the motherboard 600. The preset chip 610 is a chip that generates a high amount of heat during operation or a chip that generates a high amount of heat due to a high operating frequency. The number of the preset chips 610 can be one or more.

[0069] In the comparative example of the display screen without a liquid cooling module, when the display screen is facing the preset chip 610 on the main board 600, the heat of the preset chip 610 on the main board 600 is mainly conducted to the outer surface of the screen in the thickness direction Z. Due to the small conduction area, the heat dissipation is slow. On the other hand, it causes a temperature difference on the display screen module 10. For example, the temperature of a local area of ​​the display screen module 10 facing the preset chip 610 of the main board 600 is high, which can easily cause the local temperature to exceed the temperature threshold, thereby causing the processor to downclock, the operating speed to decrease, the response time to slow down, and even cause problems such as device or circuit failure.

[0070] The display screen assembly 100 provided in this embodiment uses the high thermal conductivity of the flowing liquid in the liquid-cooling diaphragm 21 to quickly disperse the heat of the preset chip 610 on the mainboard 600 in the planar direction. The dispersed heat is also transferred to the outer surface of the screen through heat conduction in the thickness direction Z, thereby increasing the conduction area and the external heat dissipation area, and avoiding excessive temperature in the local area of ​​the display screen module 10 facing the preset chip 610 of the mainboard 600, causing the local temperature to exceed the temperature threshold, thereby causing the processor to downclock, reduce the operating speed and slow the response time, and even cause problems such as device or circuit failure.

[0071] Optional, see Figure 3 The back side of the display screen module 10 includes a first area 101 and a second area 102 .

[0072] The top edge 11 of the display screen module 10, the first area 101, the second area 102, and the bottom edge 12 of the display screen module 10 are sequentially arranged adjacent to each other. In other words, the top edge 11 of the display screen module 10, the first area 101, the second area 102, and the bottom edge 12 of the display screen module 10 are sequentially arranged along the length direction.

[0073] The first area 101 is used to face the main board 600 of the electronic device 1000. Furthermore, a heat generating chip (the aforementioned preset chip 610) is provided on the main board 600.

[0074] The second area 102 is used to face the battery module 700 of the electronic device 1000 .

[0075] A portion of the liquid cooling channel 211 faces the first region 101 , and another portion of the liquid cooling channel 211 faces the second region 102 .

[0076] Furthermore, a portion of the liquid cooling channel 211 faces the preset chip 610 on the aforementioned mainboard 600 , and another portion of the liquid cooling channel 211 faces the aforementioned battery module 700 .

[0077] The heat emitted by the preset chip 610 on the mainboard 600 is first conducted to a portion of the liquid cooling channel 211 along the thickness direction Z. The liquid cooling medium in the liquid cooling channel 211 conducts the heat along the length direction to avoid the heat emitted by the preset chip 610 on the mainboard 600 from being concentrated in the first area 101 of the display module 10, which is beneficial for the heat to be dispersed within the reference plane, so that the heat is dispersed along the plane direction, the heat dissipation area is increased, and the heat dissipation efficiency is improved.

[0078] Optional, see Figure 7 The first portion 2111 of the liquid cooling channel 211 is disposed adjacent to the top edge 11 of the display screen module 10. The second portion 2112 of the liquid cooling channel 211 is disposed adjacent to the bottom edge 12 of the display screen module 10. The top edge 11 of the display screen module 10 and the bottom edge 12 of the display screen module 10 are disposed opposite to each other in the length direction.

[0079] At least part of the liquid cooling channel 211 extends along the length direction of the electronic device 1000. In this way, after the heat from the chip of the mainboard 600 is conducted to the liquid cooling channel 211, the liquid cooling channel 211 conducts the heat along the length direction. By setting the first part 2111 of the liquid cooling channel 211 adjacent to the top edge 11 of the display screen module 10, and the second part 2112 of the liquid cooling channel 211 adjacent to the bottom edge 12 of the display screen module 10, it is convenient to conduct as much energy of the chip on the mainboard 600 as possible to a farther position, for example, the heat of the chip of the mainboard 600 is conducted longitudinally to the bottom edge 12 of the display screen module 10, so that the heat conduction length in the length direction Y within the reference plane is longer, and the heat is dispersed along the length direction Y, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

[0080] Optional, see Figure 7 The third portion 2113 of the liquid cooling channel 211 is disposed adjacent to the first side edge 13 of the display screen module 10, and the fourth portion 2114 of the liquid cooling channel 211 is disposed adjacent to the second side edge 14 of the display screen module 10. The first side edge 13 of the display screen module 10 and the second side edge 14 of the display screen module 10 are disposed opposite to each other in the width direction X.

[0081] At least part of the liquid cooling channel 211 extends along the width direction X of the electronic device 1000. In this way, after the heat from the chip of the mainboard 600 is conducted to the liquid cooling channel 211, the liquid cooling channel 211 conducts the heat along the width direction X. By setting the third part 2113 of the liquid cooling channel 211 adjacent to the first side 13 of the display screen module 10, and the fourth part 2114 of the liquid cooling channel 211 adjacent to the second side 14 of the display screen module 10, it is convenient to conduct as much energy of the chip on the mainboard 600 as possible to a wider width, for example, the heat of the chip of the mainboard 600 is conducted to the two side edges of the display screen module 10 in the lateral direction, so that the width of the heat conduction in the width direction X in the reference plane is wider, and the heat is dispersed along the width direction X, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

[0082] In combination with the aforementioned embodiment in which the first part 2111 of the liquid cooling channel 211 is arranged adjacent to the top edge 11 of the display screen module 10, and the second part 2112 of the liquid cooling channel 211 is arranged adjacent to the bottom edge 12 of the display screen module 10, after the heat from the chip of the main board 600 is conducted to the liquid cooling channel 211, the liquid cooling channel 211 conducts the heat along the width direction X and the length direction Y, and conducts the heat of the chip of the main board 600 horizontally to the two side edges of the display screen module 10, and conducts the heat of the chip of the main board 600 vertically to the bottom edge 12 of the display screen module 10, so that the heat is fully dispersed within the reference plane, the heat dissipation area is increased, and the heat dissipation efficiency is improved.

[0083] Further optionally, multiple sub-channels of the liquid cooling channel 211 extend and distribute in the longitudinal direction, and multiple sub-channels of the liquid cooling channel 211 extend and distribute in the transverse direction. In this way, within a limited area, the liquid cooling channel 211 occupies a larger area, thereby increasing the heat dissipation area.

[0084] Specifically, the size of the liquid cooling membrane 21 may be close to the area of ​​the back of the display screen module 10. Furthermore, the distribution area of ​​the liquid cooling channel 211 on the liquid cooling membrane 21 may occupy the entire area where the liquid cooling membrane 21 is located.

[0085] In an alternative implementation, see Figure 8 , a first copper foil 15 is provided on the back of the display screen module 10. The first copper foil 15 is provided on the back of the display screen module 10 to support the layer structure of the display screen module 10 and also to dissipate heat. The liquid cooling diaphragm 21 is attached to the first copper foil 15. The piezoelectric drive element 22 is fixed to the side of the liquid cooling diaphragm 21 away from the first copper foil 15.

[0086] The structure of the liquid cooling diaphragm 21 is described below by way of example with reference to the accompanying drawings.

[0087] Optional, see Fig. 9The liquid cooling membrane 21 includes a first membrane 214, a supporting membrane 215 and a second membrane 216. The supporting membrane 215 is sandwiched between the first membrane 214 and the second membrane 216. The first membrane 214, the supporting membrane 215 and the second membrane 216 surround and form at least one liquid cooling channel 211. The supporting membrane 215 includes a supporting frame 2151 and a supporting retaining wall 2152 disposed in the supporting frame 2151 to form at least one liquid cooling channel 211.

[0088] The first film 214 is attached to the back side of the display module 10 .

[0089] In an optional embodiment, the material of the first diaphragm 214 includes any one or more of copper, copper alloy, aluminum, aluminum alloy, stainless steel, and polymer. The polymer includes polyimide (PI), polyester (PET), or polyetheretherketone (PEEK).

[0090] Optionally, the first diaphragm 214 is a hard diaphragm, and the material of the first diaphragm 214 includes copper, copper alloy, aluminum, aluminum alloy, stainless steel, etc. Optionally, the first diaphragm 214 is a flexible diaphragm, and the material of the first diaphragm 214 includes polyimide (PI), polyester (PET), or polyetheretherketone (PEEK), etc.

[0091] When the first film 214 is a hard film, it is convenient for the first film 214 to fit closely with the back of the display module 10 to reduce fitting bubbles. The first film 214 can even replace the first copper foil 15 as a supporting structure for the back of the display module 10 .

[0092] When the first film 214 is a flexible film, on the one hand, it is convenient for the first film 214 to be sealed and attached to the back of the display screen module 10 , and on the other hand, the liquid cooling film 21 can be applied to the bendable display screen assembly 100 .

[0093] Further optionally, the material of the first diaphragm 214 can also be a composite material, and the first diaphragm 214 includes a composite of a substrate and a diaphragm material. For example, the first diaphragm 214 includes a sheet-shaped substrate and a diaphragm material layer provided on the substrate. The substrate includes but is not limited to copper, copper alloy, aluminum, aluminum alloy, stainless steel, etc., and the diaphragm material includes but is not limited to a polymer. The polymer includes polyimide (PI), polyester (PET), or polyetheretherketone (PEEK), etc.

[0094] Among them, the base material is a hard layer, and the membrane material is a flexible layer.

[0095] In an optional implementation, the material of the support film 215 includes any one or more of copper, copper alloy, aluminum, aluminum alloy, stainless steel, and polymer.

[0096] Optionally, the support film 215 is a hard film, and the material of the support film 215 includes copper, copper alloy, aluminum, aluminum alloy, stainless steel, etc. Optionally, the support film 215 is a flexible film, and the material of the support film 215 includes polyimide (PI), polyester (PET), or polyetheretherketone (PEEK), etc.

[0097] Furthermore, the material of the support film 215 can also be a composite material, and the support film 215 includes a composite of a substrate and a diaphragm material, wherein the substrate includes but is not limited to copper, copper alloy, aluminum, aluminum alloy, stainless steel, etc., and the diaphragm material includes but is not limited to a polymer, wherein the polymer includes polyimide (PI), polyester (PET), or polyetheretherketone (PEEK), etc.

[0098] In this embodiment, the support film 215 may be made of a hard material to enclose one or more liquid cooling channels 211 and maintain the radial dimensions of the liquid cooling channels 211 .

[0099] In an optional implementation, the material of the second diaphragm 216 includes any one or more of copper, copper alloy, aluminum, aluminum alloy, stainless steel, and polymer.

[0100] Furthermore, the material of the second diaphragm 216 can also be a composite material, and the second diaphragm 216 includes a composite of a substrate and a diaphragm material, wherein the substrate includes but is not limited to copper, copper alloy, aluminum, aluminum alloy, stainless steel, etc., and the diaphragm material includes but is not limited to a polymer. Among them, the polymer includes polyimide (PI), polyester (PET), or polyetheretherketone (PEEK), etc.

[0101] Optionally, the second diaphragm 216 is a hard diaphragm, and the material of the second diaphragm 216 includes copper, copper alloy, aluminum, aluminum alloy, stainless steel, etc. Optionally, the second diaphragm 216 is a flexible diaphragm, and the material of the second diaphragm 216 includes polyimide (PI), polyester (PET), or polyetheretherketone (PEEK), etc.

[0102] Further optionally, the material of the second diaphragm 216 can also be a composite material, and the second diaphragm 216 includes a composite of a substrate and a diaphragm material. For example, the second diaphragm 216 includes a sheet-shaped substrate and a diaphragm material layer provided on the substrate. The substrate includes but is not limited to copper, copper alloy, aluminum, aluminum alloy, stainless steel, etc., and the diaphragm material includes but is not limited to a polymer. The polymer includes polyimide (PI), polyester (PET), or polyetheretherketone (PEEK), etc.

[0103] Among them, the base material is a hard layer, and the membrane material is a flexible layer.

[0104] In an optional implementation, the first membrane 214 and the second membrane 216 are both made of flexible materials, and the supporting membrane 215 is made of hard material.

[0105] In another optional implementation, the first membrane 214 and the second membrane 216 are both made of a hard material. The support membrane 215 is made of a hard material.

[0106] Optional, see Fig.10 The first diaphragm 214, the supporting film 215 and the second diaphragm 216 are an integrated structure. The first diaphragm 214, the supporting film 215 and the second diaphragm 216 are made of any one of copper, copper alloy, aluminum, aluminum alloy and stainless steel.

[0107] For example, the first diaphragm 214 and the second diaphragm 216 are both made of copper foil, which is equivalent to embedding the liquid cooling channel 211 in the copper foil. For example, the liquid cooling channel 211 is embedded in the original first copper foil 15. In other words, the copper foil with the embedded liquid cooling channel 211 replaces the original first copper foil 15 as a support and heat dissipation structure.

[0108] Further optionally, the flow channel height of the liquid cooling channel 211 is ≥80μm. Further, the flow channel height of the liquid cooling channel 211 is ≤1mm. For example, the flow channel height of the liquid cooling channel 211 includes but is not limited to 80μm, 90μm, 100μm, 200μm, 300μm, 400μm, 500μm, 600μm, 700μm, 800μm, 900μm, 1mm, etc. or any value between two values.

[0109] If the flow channel height of the liquid cooling channel 211 is too large, the thickness of the liquid cooling membrane 21 may be too large, which is not conducive to forming a thin and light display screen assembly 100. If the flow channel height of the liquid cooling channel 211 is too small, on the one hand, it makes it difficult to manufacture the liquid cooling channel 211, and on the other hand, it is easy to cause bubbles when the liquid is poured into the liquid cooling channel 211, thereby reducing the heat conduction efficiency. On the other hand, if the flow channel height of the liquid cooling channel 211 is too small, it may cause large flow resistance and low flow rate, resulting in low heat conduction efficiency.

[0110] The flow channel height of the liquid cooling channel 211 provided in the present application is ≤1mm and ≥80μm, which not only makes manufacturing easier, but also avoids the generation of bubbles when pouring liquid into the liquid cooling channel 211, and avoids the problems of large flow resistance and low flow rate. At the same time, it also does not cause the thickness of the liquid cooling membrane 21 to be too large, so as to form a lightweight display screen assembly 100.

[0111] Optionally, the water vapor permeability of the first membrane 214 is ≤1 g / m 2 / 24hr, the water vapor permeability of the second membrane 216 is ≤1g / m 2 / 24hr. If the water vapor permeability of the first diaphragm 214 and the second diaphragm 216 is too high, on the one hand, the liquid cooling medium in the liquid cooling channel 211 is easily volatilized, and bubbles are generated in the liquid cooling channel 211 after volatilization, resulting in reduced heat conduction capacity. On the other hand, after the liquid cooling medium in the liquid cooling channel 211 leaks out of the liquid cooling diaphragm 21, other electronic components may be damaged. The water vapor permeability of the first diaphragm 214 provided in this embodiment is ≤1g / m 2 / 24hr, the water vapor permeability of the second membrane 216 is ≤1g / m 2 / 24hr to prevent the liquid cooling medium in the liquid cooling channel 211 from volatilizing and generating bubbles in the liquid cooling channel 211 after volatilization, and also to prevent the liquid cooling medium from leaking out of the liquid cooling membrane 21, which may cause damage to other electronic components, thereby improving the performance stability of the liquid cooling membrane 21.

[0112] Optionally, the display screen module 10 is a bendable screen, for example, the bendable screen includes but is not limited to a foldable screen, a curved screen, or a flexible screen, etc.

[0113] The material of the first membrane 214 is polymer. The first membrane 214 is a flexible membrane.

[0114] The material of the second diaphragm 216 is a polymer. The second diaphragm 216 is a flexible film. The liquid cooling diaphragm 21 is a flexible structure. When the liquid cooling diaphragm 21 is attached to the back of the display screen module 10, the liquid cooling diaphragm 21 can bend along with the bending of the display screen module 10, thereby increasing the heat dissipation area and improving the heat dissipation efficiency when the display screen module 10 is a foldable screen.

[0115] Optional, see Fig.11 The liquid cooling module 20 further includes a control module 23. The control module 23 includes but is not limited to a control circuit or a control chip. The control module 23 is disposed on the flexible circuit board 22a of the piezoelectric driver 22.

[0116] One end of the control module 23 is electrically connected to the piezoelectric driver 22 .

[0117] See also Fig.11 The display screen module 10 further includes a display screen flexible circuit board 16. One end of the display screen flexible circuit board 16 is electrically connected to the display circuit structure of the display screen module 10, and the other end of the display screen flexible circuit board 16 is bent to the side of the liquid cooling membrane 21 away from the display screen module 10. That is, the piezoelectric driving component 22 and the display screen flexible circuit board 16 are both arranged on the side of the liquid cooling membrane 21 away from the display screen module 10.

[0118] For the first optional implementation, please refer to Fig.11The piezoelectric drive element 22 is disposed adjacent to the display screen flexible circuit board 16. The flexible circuit board 22a of the piezoelectric drive element 22 is electrically connected to the display screen flexible circuit board 16. The other end of the control module 23 is electrically connected to the display screen flexible circuit board 16. The display screen flexible circuit board 16 is electrically connected to the main board 600 (see Figure 2 ), so the piezoelectric drive element 22 is electrically connected to the main board 600 through the display flexible circuit board 16 (see Figure 2 ).

[0119] For the second optional implementation, please refer to Fig.12 The other end of the control module 23 is used to electrically connect to the main board 600 of the electronic device 1000 through the first flexible circuit board 17 (see Figure 2 Optionally, the first flexible circuit board 17 may be a flexible circuit board 22a of the piezoelectric driver 22, one end of the first flexible circuit board 17 is fixedly connected to the piezoelectric driver 22, and the other end of the first flexible circuit board 17 is detachably electrically connected to the main board 600 (see Figure 2 Alternatively, the first flexible circuit board 17 is a transfer flexible circuit board, one end of the first flexible circuit board 17 is detachably electrically connected to one end of the flexible circuit board 22a of the piezoelectric driver 22, and the other end of the first flexible circuit board 17 is detachably electrically connected to the main board 600 (see Figure 2 ).

[0120] For a third optional implementation, please refer to Fig.13 The other end of the control module 23 is used to electrically connect to the main board 600 of the electronic device 1000. The control module 23 is arranged on the flexible circuit board 22a of the piezoelectric driver 22, and the flexible circuit board 22a of the piezoelectric driver 22 is directly electrically connected to the main board 600 of the electronic device 1000 (see Figure 2 ).

[0121] Optional, see Figure 2 The electronic device 1000 includes the aforementioned frame 320, the aforementioned middle frame module 300 and the display screen assembly 100 described in any one of the aforementioned embodiments.

[0122] See also Figure 2 The middle frame module 300 is disposed in the frame 320 . The peripheral side of the middle frame module 300 is connected to the inner side of the frame 320 . The display screen assembly 100 and the middle frame module 300 are stacked in the thickness direction Z. The peripheral side of the display screen assembly 100 is connected to the inner side of the frame 320 .

[0123] See also Figure 3The liquid cooling module 20 is located between the middle frame module 300 and the display screen module 10. A buffer gap 330 is provided between the middle frame module 300 and the liquid cooling film 21, and the buffer gap 330 is used to prevent the display screen assembly 100 from having a hard collision with the middle frame module 300 when the electronic device 1000 falls or collides, so as to ensure the reliability of the whole device.

[0124] See also Figure 5 At least a portion of the piezoelectric driver 22 is disposed in the buffer gap 330 .

[0125] For further information, see Figure 5 , a receiving groove 340 is provided on the side of the middle frame module 300 facing the display assembly 100. The receiving groove 340 is arranged opposite to the piezoelectric driver 22 to receive the piezoelectric driver 22. Furthermore, there is a gap between the piezoelectric driver 22 and the bottom of the receiving groove 340 to prevent the piezoelectric driver 22 from having a hard collision with the middle frame module 300 when the electronic device 1000 falls or collides.

[0126] See also Fig.14 The electronic device 1000 further includes the aforementioned mainboard 600 , the aforementioned preset chip 610 and a heat conducting portion 620 .

[0127] See also Fig.14 The mainboard 600 is disposed on a side of the middle frame module 300 away from the display screen assembly 100 . The preset chip 610 is located on a side of the mainboard 600 facing the middle frame module 300 .

[0128] See also Fig.14 , a portion of the heat conducting portion 620 contacts the preset chip 610, and another portion of the heat conducting portion 620 contacts the middle frame module 300 (see Figure 2 ) of the middle plate 310. The heat conducting portion 620 is used to conduct the heat of the preset chip 610 to the middle frame module 300 (see Figure 2 ) and is conducted to the liquid cooling diaphragm 21 through the middle plate 310 of the middle frame module 300 and the buffer gap 330 (see Figure 6 ) part, the liquid cooling medium is cooled in the liquid cooling channel 211 (see Figure 6 ) to achieve heat conduction within the plane of the liquid-cooled diaphragm 21, thereby increasing the heat conduction area and rapidly reducing the local temperature of the liquid-cooled diaphragm 21 and the temperature of the preset chip 610.

[0129] The heat conducting part 620 includes but is not limited to heat conducting gel or heat conducting silica gel.

[0130] Optional, see Fig.14 , the electronic device 1000 also includes a shielding cover 410 .

[0131] See also Fig.14 , the shielding cover 410 is arranged on the side of the mainboard 600 facing the middle frame module 300. The shielding cover 410 is arranged on the preset chip 610. The heat conducting part 620 includes a first sub-heat conducting part 621 and a second sub-heat conducting part 622. The first sub-heat conducting part 621 contacts between the preset chip 610 and the inner wall of the shielding cover 410 to reduce thermal resistance. The second sub-heat conducting part 622 contacts between the outer wall of the shielding cover 410 and the middle frame module 300 to reduce thermal resistance. The first sub-heat conducting part 621 includes but is not limited to thermal conductive gel, thermal conductive silica gel, etc. The second sub-heat conducting part 622 includes but is not limited to thermal conductive gel, thermal conductive silica gel, etc.

[0132] The shielding cover 410 is made of metal and plays the role of heat dissipation and electromagnetic interference shielding.

[0133] Furthermore, the shielding cover 410 is coated with copper foil to further enhance heat dissipation, and contacts the middle frame module 300 and the liquid cooling film 21 through the second sub-heat conducting portion 622 to quickly conduct the heat of the preset chip 610 to the middle frame module 300 .

[0134] The first sub-heat-conducting part 621 includes but is not limited to heat-conducting gel or heat-conducting silica gel, etc. The second sub-heat-conducting part 622 includes but is not limited to heat-conducting gel or heat-conducting silica gel, etc.

[0135] See also Fig.14 The electronic device 1000 further includes a battery module 700. The battery module 700 and the mainboard 600 are arranged in the frame 320 along the length direction Y of the electronic device 1000.

[0136] See also Fig.14 The electronic device 1000 further includes the aforementioned back cover 400 . The battery module 700 is disposed between the middle frame module 300 and the back cover 400 .

[0137] A portion of the liquid cooling channel 211 faces the preset chip 610 in the thickness direction Z of the electronic device 1000 , and another portion of the liquid cooling channel 211 faces the battery module 700 in the thickness direction Z of the electronic device 1000 .

[0138] See also Fig.15 , when the heat generating chip faces the middle frame module 300 (see Figure 2) on one side of the middle plate 310, the heat emitted by the preset chip 610 on the main board 600 is conducted to the first sub-heat conducting part 621 along the thickness direction Z and is surface-conducted on the first heat conducting part 620 in parallel to the reference surface; the heat is then conducted to the shielding cover 410 along the thickness direction Z and is surface-conducted on the shielding cover 410 in parallel to the reference surface; the heat is then conducted to the second sub-heat conducting part 622 along the thickness direction Z and is surface-conducted on the second heat conducting part 620 in parallel to the reference surface; the heat is then conducted to the middle frame module 300 along the thickness direction Z and is surface-conducted on the middle frame module 300 in parallel to the reference surface; the heat is then conducted to the buffer gap 330 along the thickness direction Z, and is conducted through the buffer gap 330 in parallel to the reference surface; the heat is then conducted to the liquid cooling diaphragm 21 along the thickness direction Z (see Figure 6 ), and conducts through the liquid cooling film 21 along a surface parallel to the reference surface; the heat is then conducted to the display screen module 10 along the thickness direction Z, and conducts through the display screen module 10 along a surface parallel to the reference surface.

[0139] On the one hand, after the heat of the heat generating chip passes through the above heat conduction path, the heat emitted by the preset chip 610 can be quickly conducted over a larger conduction area to avoid heat concentration and exceeding the upper temperature threshold; on the other hand, by arranging the liquid cooling film 21 on the back of the display screen module 10, for example, on the first copper foil 15 (combined with the first copper foil 15) of the display screen module 10, Figure 8 ) on the back side or replaces the first copper foil 15, which can not only transform the original local heat dissipation into a larger area of ​​surface heat dissipation, but also accelerate the surface conduction of heat on the liquid-cooled diaphragm 21 parallel to the reference surface, thereby improving the heat conduction efficiency.

[0140] Optional, see Fig. 9 At least one of the piezoelectric driving components 22 includes a first piezoelectric driving component 2201 and a second piezoelectric driving component 2202 .

[0141] See also Fig.16 At least one liquid cooling channel 211 includes a first liquid cooling channel 211a and a second liquid cooling channel 211b. The first liquid cooling channel 211a and the second liquid cooling channel 211b are connected or independent of each other.

[0142] In this embodiment, the first liquid cooling channel 211a and the second liquid cooling channel 211b are connected as an example, and the pump cavity opening of the first piezoelectric driver 2201 is sealed and connected with the liquid cooling port of the first liquid cooling channel 211a. Specifically, the first pump cavity opening 222 of the first piezoelectric driver 2201 is connected with the first liquid cooling port 212 of the first liquid cooling channel 211a (combined with Figure 6 ) are sealed and connected, the second pump cavity port 223 of the first piezoelectric driving element 2201 is connected to the second liquid cooling port 213 (combined with the first liquid cooling channel 211a) Figure 6Specifically, the first pump cavity port 222 of the second piezoelectric driver 2202 is sealed and connected with the first liquid cooling port 212 of the second liquid cooling channel 211b, and the second pump cavity port 223 of the second piezoelectric driver 2202 is sealed and connected with the second liquid cooling port 213 of the second liquid cooling channel 211b.

[0143] Each liquid-cooling channel 211 extends along the length direction Y to a greater length. Furthermore, each liquid-cooling channel 211 extends along the width direction X to a greater width.

[0144] At least a portion of the first liquid cooling channel 211a faces the preset chip 610 in the thickness direction Z. At least a portion of the first liquid cooling channel 211a faces the battery module 700 in the thickness direction Z. The liquid cooling medium in the first liquid cooling channel 211a is used to conduct the heat emitted by the preset chip 610 along the length direction Y and the width direction X, and conduct it within the surface of the liquid cooling diaphragm 21.

[0145] At least a portion of the second liquid cooling channel 211b faces the preset chip 610 in the thickness direction Z, and at least a portion of the second liquid cooling channel 211b faces the battery module 700 in the thickness direction Z. The liquid cooling medium in the second liquid cooling channel 211b is used to conduct the heat emitted by the preset chip 610 along the length direction Y and the width direction X, and conduct it within the surface of the liquid cooling diaphragm 21.

[0146] In this embodiment, a plurality of liquid cooling channels 211 are provided, and each of the liquid cooling channels 211 is driven by a piezoelectric driver 22 to drive the flow of the liquid cooling medium. This can not only ensure that the liquid cooling channels 211 on the liquid cooling diaphragm 21 occupy a larger area, but also ensure that the length of the liquid cooling channel 211 driven by each piezoelectric driver 22 is relatively short, thereby ensuring that the fluidity of the liquid cooling medium is relatively fast and the flow rate is relatively fast, thereby improving the heat dissipation rate. At the same time, it also reduces the difficulty of manufacturing the liquid cooling channel 211 and reduces the number of bubbles when the liquid is poured into the liquid cooling channel 211.

[0147] Optional, see Fig.16 The first liquid cooling channel 211a includes a plurality of first sub-channels 241 and a plurality of second sub-channels 242.

[0148] The first sub-channel 241 is connected to the second sub-channel 242. The first sub-channel 241 extends along the width direction X of the display screen assembly 100. The second sub-channel 242 extends along the length direction Y of the display screen assembly 100. The first sub-channel 241 may be a transverse channel, and the second sub-channel 242 may be a longitudinal channel.

[0149] Optionally, the first sub-channel 241 is directly opposite to the preset chip 610 in the thickness direction Z. The heat emitted by the preset chip 610 is conducted to the liquid cooling medium in the first sub-channel 241. Under the action of the piezoelectric driver 22, the liquid cooling medium flows the heat along the liquid cooling channel 211 to conduct it in the plane, thereby increasing the heat conduction area.

[0150] The orthographic projection of one end of the second sub-channel 242 in the thickness direction Z is adjacent to the preset chip 610, and the orthographic projection of the other end of the second sub-channel 242 in the thickness direction Z is located on the side of the battery module 700 away from the main board 600. In this way, the heat emitted by the preset chip 610 is transferred to the liquid cooling medium in the first sub-channel 241. Under the action of the piezoelectric driver 22, the liquid cooling medium flows along the liquid cooling channel 211 to transfer the heat to the second sub-channel 242 in the plane, such as above the battery module 700, to increase the heat transfer area.

[0151] For example, the first liquid-cooling channel 211a includes a first first sub-channel 241, a first second sub-channel 242, a second first sub-channel 241, a second second sub-channel 242, a third second sub-channel 242, a third first sub-channel 241, a fourth second sub-channel 242, and a fourth first sub-channel 241. The fourth first sub-channel 241 is connected to the first first sub-channel 241.

[0152] Optional, see Fig.16 The second liquid-cooling channel 211b includes a plurality of third sub-channels 243 and a plurality of fourth sub-channels 244.

[0153] The third sub-channel 243 is connected to the fourth sub-channel 244. The third sub-channel 243 extends along the width direction X of the display screen assembly 100. The fourth sub-channel 244 extends along the length direction Y of the display screen assembly 100. The third sub-channel 243 may be a transverse channel, and the fourth sub-channel 244 may be a longitudinal channel.

[0154] For example, the second liquid-cooling channel 211b includes a first fourth sub-channel 244, a first third sub-channel 243, a second fourth sub-channel 244, a third fourth sub-channel 244, a second third sub-channel 243, and a fourth fourth sub-channel 244. The fourth fourth sub-channel 244 is connected to the first fourth sub-channel 244.

[0155] Optionally, the orthographic projection of the first sub-channel 241 in the thickness direction Z is adjacent to the preset chip 610. One end of the second sub-channel 242 is directly opposite to the preset chip 610 in the thickness direction Z, and the orthographic projection of the other end of the second sub-channel 242 in the thickness direction Z is located on the side of the battery module 700 away from the main board 600. In this way, the heat emitted by the preset chip 610 is transferred to the liquid cooling medium in the second sub-channel 242. Under the action of the piezoelectric driver 22, the liquid cooling medium flows the heat along the liquid cooling channel 211 to transfer the heat to the second sub-channel 242 in the plane, such as above the battery module 700, to increase the heat conduction area.

[0156] Optionally, the liquid cooling channel 211 performs local heat dissipation on the preset chip 610 on the mainboard 600. The liquid cooling film 21 has an area facing the preset chip 610. Part of the liquid cooling channel 211 is located in the area facing the preset chip 610.

[0157] For the first optional implementation, please refer to Fig.17 The liquid cooling channel 211 extends along the length direction Y. The liquid cooling channel 211 is annular.

[0158] One end of the liquid cooling channel 211 faces the preset chip 610 on the mainboard 600 , and the other end of the liquid cooling channel 211 extends to the bottom edge of the display screen assembly 100 .

[0159] For the second optional implementation, please refer to Fig.18a and Fig.18b , the liquid cooling channel 211 is ring-shaped.

[0160] The liquid cooling channel 211 is annular and folded once. The structure of the liquid cooling channel 211 provided in this embodiment allows the liquid cooling medium to quickly flow from the area facing the preset chip 610 to the area outside the preset chip 610, so as to reduce the heat accumulation in the area facing the preset chip 610, so as to conduct away the heat in the area facing the preset chip 610 as soon as possible. Among them, the piezoelectric drive element 22 can be one or more.

[0161] For a third optional implementation, please refer to Fig.19 The number of the liquid cooling channels 211 is multiple, and the multiple liquid cooling channels 211 are connected in parallel. Each liquid cooling channel 211 is annular. One end of each liquid cooling channel 211 faces the preset chip 610 on the mainboard 600, and the other end of the liquid cooling channel 211 extends to the bottom edge of the display screen assembly 100.

[0162] For a fourth optional implementation, see Fig. 20, the number of the liquid cooling channel 211 is one. The liquid cooling channel 211 is annular. The bent portion of the liquid cooling channel 211 faces the preset chip 610 on the main board 600, and the other portion of the liquid cooling channel 211 extends to the bottom edge of the display screen assembly 100, and extends and distributes toward the first side edge and the second side edge of the display screen assembly 100 after bending, so as to conduct the heat of the area facing the preset chip 610 along the length direction Y and the width direction X as quickly as possible.

[0163] In the fifth optional implementation, please refer to Fig.21 , there are multiple liquid cooling channels 211. Each liquid cooling channel 211 is annular. The bent portion of each liquid cooling channel 211 faces the preset chip 610 on the main board 600, and the other portion of each liquid cooling channel 211 extends to the bottom edge of the display screen assembly 100, and extends toward the first side edge or the second side edge of the display screen assembly 100 after bending, so as to conduct the heat of the area facing the preset chip 610 along the length direction Y and the width direction X as quickly as possible.

[0164] In the sixth optional implementation, please refer to Fig. 22 and Fig.23 , there are multiple preset chips 610, and each preset chip 610 corresponds to a group of liquid cooling channels 211 and piezoelectric driving components 22. Each liquid cooling channel 211 is annular. The bent portion of each liquid cooling channel 211 faces the preset chip 610 on the main board 600, and the other portion of each liquid cooling channel 211 extends to the bottom edge of the display screen assembly 100, so as to conduct the heat of the area facing the preset chip 610 along the length direction Y as quickly as possible.

[0165] Furthermore, the electronic device 1000 also includes at least one temperature sensor.

[0166] Optionally, the temperature sensor is used to detect the temperature of the preset chip 610. The temperature sensor is electrically connected to the control module 23. When the temperature sensor detects that the temperature is greater than or equal to the preset temperature, the control module 23 controls the piezoelectric driver 22 to start working. When the temperature sensor detects that the temperature is less than the preset temperature, the control module 23 controls the piezoelectric driver 22 to stop working, so as to control the temperature below the preset temperature.

[0167] When there are multiple preset chips 610 , there may also be multiple temperature sensors, each of which is used to detect the temperature of a preset chip 610 and control the corresponding liquid cooling channel 211 and piezoelectric driver 22 to work.

[0168] See also Fig.24 and Fig.25, an electronic device 1000 provided in a second embodiment of the present application, the electronic device 1000 further includes a display screen module 10, a liquid cooling module 20, a middle frame module 300, a mainboard 600, a preset chip 610 and a battery module 700.

[0169] The display screen module 10, the middle plate 310 of the middle frame module 300, and the main board 600 are sequentially arranged along the thickness direction Z. The preset chip 610 is arranged on the main board 600 and faces the middle frame module 300 (see Figure 2 ) on one side of the middle plate 310 of the middle frame module 300. The liquid cooling module 20 is arranged on the middle plate 310 of the middle frame module 300 and faces the side of the main board 600; or, the liquid cooling module 20 is arranged on the middle plate 310 of the middle frame module 300 and faces the side of the display screen module 10. The battery module 700 and the main board 600 are arranged along the length direction Y, and the battery module 700 and the main board 600 are both opposite to the middle plate 310 of the middle frame module 300. A part of the liquid cooling module 20 is opposite to and in contact with the preset chip 610 on the main board 600, and another part of the liquid cooling module 20 is opposite to the battery module 700.

[0170] The electronic device 1000 provided in the present application is configured such that the liquid cooling module 20 is disposed on the middle frame module 300 and faces the side of the main board 600; or, the liquid cooling module 20 is disposed on the middle frame module 300 and faces the side of the display screen module 10, and the preset chip 610 on the main board 600 faces the liquid cooling module 20, so that the heat conducted from the preset chip 610 to the local part of the liquid cooling module 20 can be quickly dispersed in the plane direction and the thickness direction Z, thereby reducing the thermal resistance in the plane direction and the thickness direction Z. Compared with the case where the liquid cooling module 20 is not disposed, the heat conduction efficiency in both the thickness direction Z and the plane direction is improved in the present embodiment.

[0171] Compared with the electronic device 1000 provided in the first embodiment, the liquid cooling module 20 provided in this embodiment is closer to the preset chip 610 on the mainboard 600, and can dissipate the preset chip 610 on the mainboard 600 more quickly in the form of surface conduction, thereby improving the heat dissipation efficiency.

[0172] In other embodiments, the liquid cooling module 20 may be embedded in the middle frame module 300 .

[0173] The structure of the liquid cooling module 20 in this embodiment may refer to the structure of the liquid cooling module 20 in the aforementioned first embodiment of the present application.

[0174] In an optional embodiment, taking the electronic device 1000 as a mobile phone as an example, the display screen assembly 100 provided in the present application is a liquid-cooled display screen module 10. A water-cooling channel is provided inside the liquid-cooling diaphragm 21 of the liquid-cooled display screen module 10, and water in the water-cooling channel flows under the action of the piezoelectric drive 22 to disperse the heat. The theoretical thermal conductivity of the liquid-cooled display screen module 10 can reach more than 2000W / mK, which is much greater than the thermal conductivity of copper foil / copper graphite (about 200-400W / mK). Through the efficient thermal conductivity of the liquid-cooled display screen module 10, the thermal resistance of the display screen module 10 in the plane direction and the thickness direction Z can be effectively reduced, and the heat transferred from the preset chip 610 to the display screen module 10 can be quickly dispersed first, and the dispersed heat is conducted along the thickness direction Z of the display screen module 10 to the outer surface of the screen for heat dissipation. By increasing the conduction area, the ability to absorb heat generated by the mobile phone's heating chip is greatly improved, so that the heat exchange rate between the heat conducted to the outer surface of the screen and the external environment is also greatly improved, thereby improving the heat dissipation efficiency of the preset chip 610, and quickly reducing the temperature of the preset chip 610 and the outer surface temperature of the mobile phone screen, which helps to further smoothly release the performance of the mobile phone while ensuring the outer surface temperature of the mobile phone, thereby improving the user's comfort experience.

[0175] Taking the conventional copper foil material heat dissipation solution of the mobile phone display module 10 as a comparative example, this solution uses a liquid-cooled display module 10 solution. Through the high thermal conductivity of the flowing liquid in the liquid cooling diaphragm 21, the heat conducted from the preset chip 610 to the display module 10 is quickly dispersed in the plane direction, and the dispersed heat is transferred to the outer surface of the screen through heat conduction in the thickness direction Z, thereby increasing the conduction area and the external heat dissipation area, absorbing the heat generated by the preset chip 610 of the mobile phone when it is working, and effectively reducing the temperature of the preset chip 610 and the outer surface temperature of the screen, thereby ensuring the high-performance and smooth operation of the mobile phone while ensuring the outer surface temperature of the mobile phone, thereby improving the user's comfort experience.

[0176] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present application, and these improvements and modifications are also regarded as the scope of protection of the present application.

Claims

1. A display screen assembly, characterized in that: include: A display screen module, comprising an exterior surface and a back surface disposed opposite to each other; and A liquid cooling module, wherein the liquid cooling module comprises a liquid cooling diaphragm and at least one piezoelectric driving component, wherein the liquid cooling diaphragm is attached to the back side of the display screen module, and the piezoelectric driving component is fixed to the side of the liquid cooling diaphragm away from the display screen module; the piezoelectric driving component comprises a pump chamber, at least one first pump chamber opening and at least one second pump chamber opening connected to the pump chamber; the liquid cooling diaphragm comprises at least one liquid cooling channel, a first liquid cooling port and a second liquid cooling port connected to the liquid cooling channel, the liquid cooling channel has a liquid cooling medium, the first pump chamber opening of the piezoelectric driving component is sealed and connected to the first liquid cooling port of the liquid cooling diaphragm, the second pump chamber opening of the piezoelectric driving component is sealed and connected to the second liquid cooling port of the liquid cooling diaphragm, and the piezoelectric driving component is used to drive the liquid cooling medium to flow in the liquid cooling channel.

2. The display screen assembly according to claim 1, characterized in that: The liquid cooling module further comprises a control module, one end of which is electrically connected to the piezoelectric driving element; The display screen module further includes a display screen flexible circuit board, the piezoelectric driver is arranged adjacent to the display screen flexible circuit board, and the other end of the control module is electrically connected to the display screen flexible circuit board; or, The other end of the control module is used to electrically connect to the mainboard of the electronic device through the first flexible circuit board; or, The other end of the control module is used to electrically connect to a mainboard of the electronic device.

3. The display screen assembly according to claim 1, characterized in that: The back side of the display screen module includes a first area and a second area. The top edge of the display screen module, the first area, the second area, and the bottom edge of the display screen module are arranged adjacent to each other in sequence. The first area is used to face the mainboard of the electronic device, and the second area is used to face the battery module of the electronic device. A part of the liquid cooling channel faces the first area, and another part of the liquid cooling channel faces the second area.

4. The display screen assembly according to claim 3, characterized in that: The first portion of the liquid cooling channel is disposed adjacent to the top edge of the display screen module, and the second portion of the liquid cooling channel is disposed adjacent to the bottom edge of the display screen module.

5. The display screen assembly according to claim 3, characterized in that: The third portion of the liquid cooling channel is disposed adjacent to the first side edge of the display screen module, and the fourth portion of the liquid cooling channel is disposed adjacent to the second side edge of the display screen module.

6. The display screen assembly according to any one of claims 1 to 5, characterized in that: A first copper foil is disposed on the back of the display screen module, the liquid cooling membrane is attached to the first copper foil, and the piezoelectric driving component is fixed to a side of the liquid cooling membrane away from the first copper foil.

7. The display screen assembly according to any one of claims 1 to 5, characterized in that: The liquid cooling film comprises a first film, a supporting film and a second film, wherein the supporting film is sandwiched between the first film and the second film, and the first film, the supporting film and the second film surround and form at least one liquid cooling channel, and the first film is attached to the back of the display screen module; The material of the first diaphragm includes any one or more of copper, copper alloy, aluminum, aluminum alloy, stainless steel, and polymer; The material of the support film includes any one or more of copper, copper alloy, aluminum, aluminum alloy, stainless steel, and polymer; The material of the second diaphragm includes any one or more of copper, copper alloy, aluminum, aluminum alloy, stainless steel, and polymer.

8. The display screen assembly according to claim 7, characterized in that: The first diaphragm, the supporting film and the second diaphragm are an integrated structure, and the materials of the first diaphragm, the supporting film and the second diaphragm are any one of copper, copper alloy, aluminum, aluminum alloy and stainless steel.

9. The display screen assembly according to claim 7, wherein: The flow channel height of the liquid cooling channel is ≥80 μm, and the water vapor permeability of the first membrane is ≤1 g / m 2 / 24hr; the water vapor permeability of the second membrane is ≤1g / m 2 / 24hr.

10. The display screen assembly according to claim 7, characterized in that: The display screen module is a bendable screen, the first diaphragm is made of a polymer, and the first diaphragm is a flexible film; the second diaphragm is made of a polymer, and the second diaphragm is a flexible film, and the liquid-cooled diaphragm can bend as the display screen module is bent.

11. An electronic device, characterized in that: The electronic device includes a frame, a middle frame module and a display screen assembly as described in any one of claims 1 to 10, the middle frame module is arranged in the frame, the peripheral side of the middle frame module is connected to the inner side of the frame, the liquid cooling module is located between the middle frame module and the display screen module, a buffer gap is provided between the middle frame module and the liquid cooling diaphragm, and at least a portion of the piezoelectric driver is arranged in the buffer gap.

12. The electronic device according to claim 11, characterized in that: The electronic device also includes a mainboard, a preset chip and a heat conducting part. The mainboard is arranged on a side of the middle frame module away from the display screen assembly, the preset chip is located on a side of the mainboard facing the middle frame module, a part of the heat conducting part contacts the preset chip, and another part of the heat conducting part contacts the middle frame module.

13. The electronic device according to claim 12, characterized in that: The electronic device also includes a shielding cover, which is arranged on a side of the mainboard facing the middle frame module, and the shielding cover is arranged to cover the preset chip. The heat conducting part includes a first sub-heat conducting part and a second sub-heat conducting part, the first sub-heat conducting part contacts between the preset chip and the inner wall of the shielding cover, and the second sub-heat conducting part contacts between the outer wall of the shielding cover and the middle frame module.

14. The electronic device according to claim 12, characterized in that: The electronic device also includes a battery module, and the battery module and the mainboard are arranged in the frame along the length direction of the electronic device. A part of the liquid cooling channel faces the preset chip in the thickness direction of the electronic device, and another part of the liquid cooling channel faces the battery module in the thickness direction of the electronic device.

15. The electronic device according to claim 14, characterized in that: At least one of the piezoelectric driving components includes a first piezoelectric driving component and a second piezoelectric driving component, the at least one liquid cooling channel includes a first liquid cooling channel and a second liquid cooling channel, the first liquid cooling channel is connected to the second liquid cooling channel or is independent of each other, and the pump cavity port of the first piezoelectric driving component is sealed and connected to the liquid cooling port of the first liquid cooling channel; At least a portion of the first liquid cooling channel faces the preset chip in the thickness direction, and at least a portion of the first liquid cooling channel faces the battery module in the thickness direction; At least a portion of the second liquid-cooling channel faces the preset chip in the thickness direction, and at least a portion of the second liquid-cooling channel faces the battery module in the thickness direction.

16. The electronic device according to claim 15, characterized in that: The first liquid cooling channel includes a plurality of first sub-channels and a plurality of second sub-channels, the first sub-channels are connected to the second sub-channels, the first sub-channels extend along the width direction of the display screen assembly, and the second sub-channels extend along the length direction of the display screen assembly; The first subchannel faces the preset chip in the thickness direction, the orthographic projection of one end of the second subchannel in the thickness direction is adjacent to the preset chip, and the orthographic projection of the other end of the second subchannel in the thickness direction is located on the side of the battery module away from the main board; or, The orthographic projection of the first subchannel in the thickness direction is adjacent to the preset chip, one end of the second subchannel is opposite to the preset chip in the thickness direction, and the orthographic projection of the other end of the second subchannel in the thickness direction is located on the side of the battery module away from the mainboard.

17. An electronic device, characterized in that: The electronic device also includes a display screen module, a liquid cooling module, a middle frame module, a mainboard, a preset chip and a battery module. The display screen module, the middle frame module and the mainboard are arranged in sequence along the thickness direction. The preset chip is arranged on the side of the mainboard facing the middle frame module, and the liquid cooling module is arranged on the side of the middle frame module facing the mainboard; or, the liquid cooling module is arranged on the side of the middle frame module facing the display screen module, the battery module and the mainboard are arranged along the length direction, and the battery module and the mainboard are both opposite to the middle frame module, a part of the liquid cooling module is opposite to and in contact with the preset chip on the mainboard, and another part of the liquid cooling module is opposite to the battery module.

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