Automatic feeding equipment for chip packaging

Abstract

The invention discloses an automatic loading device for chip packaging, which relates to the technical field of chip packaging, and comprises a frame, wherein the frame is provided with a plurality of loading mechanisms for placing substrates, a material moving mechanism arranged at the upper end of the loading mechanism and used for grabbing the substrate, and a conveying mechanism arranged at one side of the material moving mechanism; the material moving mechanism comprises a gantry, a horizontal moving component arranged on the gantry, and at least one group of grabbing components arranged at the lower end of the horizontal moving component and used for grabbing the substrate; the grabbing component comprises an adsorption component, a microneedle pasting component arranged on the adsorption component, and an airbag flattening component; when the grabbing component grabs the substrate, the adsorption unit in the adsorption component completes the adsorption work of the substrate, and at the same time, the microneedle unit in the microneedle pasting component is attached to the upper surface of the substrate, and the flattening unit in the airbag flattening component flattens the edge of the substrate; the invention avoids the curling and deformation of the edge of the substrate at the beginning of adsorption, thereby ensuring the adsorption effect of the substrate.

Description

Technical Field

[0001] The present invention relates to the technical field related to chip packaging, and in particular to automatic feeding equipment for chip packaging. Background Art

[0002] Chip packaging refers to attaching the chip to the corresponding PCB substrate through SMT patch technology, and then performing wire bonding. Chip packaging not only fixes the chip, but also connects the chips to each other. The typical packaging process is: dicing-chip mounting-bonding-plastic sealing-deburring-electroplating-printing-rib cutting and molding-appearance inspection-finished product testing-packaging and shipment. In simple terms, it is to isolate the semiconductor components from the air to prevent impurities in the air from corroding the chip circuit and causing a decrease in electrical performance. On the other hand, the packaged chip is also easier to install and transport.

[0003] Before the packaging process, the PCB substrate needs to be loaded online. Usually, the substrate is loaded by adsorbing it through a pneumatic suction nozzle and then transferring it. However, due to the fast transportation speed of the substrate during the transportation process, and some substrates are thin and large in size, the edge of the substrate may vibrate due to air turbulence or mechanical vibration, resulting in unstable contact of the suction nozzle. In addition, if the substrate is thin, the edge of the substrate will curl and deform during vacuum adsorption due to insufficient rigidity, resulting in pickup failure. Summary of the invention

[0004] In order to solve the defects in the prior art, the present invention provides an automatic feeding device for chip packaging.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] The present invention provides an automatic feeding device for chip packaging, comprising:

[0007] A frame, wherein the frame is provided with a plurality of groups of loading mechanisms for placing substrates, a material moving mechanism provided at the upper end of the loading mechanism and used for grabbing the substrates, and a conveying mechanism provided at one side of the material moving mechanism;

[0008] The material moving mechanism comprises a gantry, a horizontal moving assembly arranged on the gantry, and at least one group of grabbing assemblies arranged at the lower end of the horizontal moving assembly and used for grabbing the substrate;

[0009] The grabbing component includes an adsorbent, a microneedle fitting component arranged on the adsorbent, and an airbag flattening component;

[0010] When the grabbing assembly grabs the substrate, the adsorption unit in the adsorption piece completes the adsorption work on the substrate, and at the same time, the microneedle unit in the microneedle laminating piece adheres to the upper surface of the substrate, and the flattening unit in the airbag flattening piece flattens the edge of the substrate.

[0011] As a preferred technical solution of the present invention, the adsorption component includes a fixed plate fixedly connected to the horizontal moving component, a first lifting unit installed on the fixed plate, a mounting plate arranged at the lower end of the first lifting unit, and several groups of adsorption units arranged on the mounting plate.

[0012] As a preferred technical solution of the present invention, the microneedle patch includes several groups of vibration units fixedly arranged at the lower end of the mounting plate, a microneedle plate connected to the vibration unit through a connecting rod, and a microneedle unit arranged at the lower end of the microneedle plate.

[0013] As a preferred technical solution of the present invention, the microneedle unit is made of a carbon nanotube-polyurethane composite material.

[0014] As a preferred technical solution of the present invention, the end of the microneedle unit close to the microneedle plate is cylindrical and the bottom is conical.

[0015] As a preferred technical solution of the present invention, the airbag flattening member includes at least one group of air pump units fixedly arranged on the mounting plate, a flattening unit pneumatically connected to the air pump unit, and a covering unit pneumatically connected to the air pump unit and arranged on one side of the flattening unit.

[0016] As a preferred technical solution of the present invention, the flattening unit and the covering unit are respectively provided with two groups, and the flattening unit includes several groups of second lifting units fixedly arranged on the mounting plate, a lifting block arranged at the lower end of the second lifting unit, a connecting plate connected to the lifting block through a connecting rod, and a first airbag arranged at the lower end of the connecting plate.

[0017] As a preferred technical solution of the present invention, the covering unit includes an air supply valve having one end fixedly connected to the first airbag and the other end connected to the air pump unit, and a second airbag and a third airbag respectively connected to the air supply valve;

[0018] The third airbag is arranged closely to the lower surface of the base plate after being inflated.

[0019] As a preferred technical solution of the present invention, the loading mechanism includes a loading frame for placing the substrate and a lifting assembly arranged at the lower end of the loading frame;

[0020] The top material assembly comprises:

[0021] A driving unit, the output end of which is transmission-connected to the lifting screw;

[0022] A lifting plate, which is transmission-arranged with the lifting screw and on which at least one set of lifting guide rods is fixedly arranged;

[0023] The lifting support plate is fixedly arranged on the upper end of the lifting guide rod.

[0024] As a preferred technical solution of the present invention, an ion wind rod is fixedly provided at the lower end of the gantry, and the air outlet of the ion wind rod is arranged toward the loading frame.

[0025] The beneficial effects of the present invention are:

[0026] 1. In the present invention, by providing a microneedle fitting member and an airbag flattening member, the top of the microneedle unit is wide and the bottom is slender, which can increase the contact area between the microneedle unit and the substrate surface and enhance the adhesion between the microneedle and the substrate. This design can effectively reduce the shaking of the substrate caused by external factors such as air turbulence or mechanical vibration, thereby improving the grasping stability. In addition, the flattening unit in the airbag flattening member can flatten the edge of the substrate to avoid curling and deformation of the edge of the substrate at the beginning of adsorption, thereby ensuring the adsorption effect on the substrate.

[0027] 2. In the present invention, the airbag flattening member includes a flattening unit and a covering unit. On the one hand, the flattening unit can flatten the edge of the substrate from top to bottom before adsorbing the substrate. After the substrate is adsorbed and lifted upward, the covering unit can cover and support the lower surface of the edge of the substrate to ensure that the edge of the substrate will not vibrate due to air turbulence or mechanical vibration during high-speed transportation, thereby further improving the stability of adsorption. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0030] Figure 2 It is a schematic diagram of the local structure of the present invention.

[0031] Figure 3 It is a structural schematic diagram of the material transfer mechanism.

[0032] Figure 4 It is a side structural schematic diagram of the material transfer mechanism.

[0033] Figure 5 Schematic diagram of the structure of the microneedle patch.

[0034] Figure 6 for Figure 5 A local enlarged schematic diagram of point A in the middle.

[0035] Figure 7 It is a schematic diagram of the structure of the airbag flattening part.

[0036] Figure 8 A schematic plan view of the third airbag when inflated.

[0037] Fig. 9 A schematic plan view of the second airbag when inflating.

[0038] Fig.10 It is a structural schematic diagram of the loading mechanism.

[0039] In the figure: 1, frame; 2, material loading mechanism; 21, material loading frame; 22, material lifting assembly; 221, driving unit; 222, lifting screw rod; 223, lifting plate; 224, lifting guide rod; 225, lifting support plate; 3, material moving mechanism; 4, conveying mechanism; 5, gantry; 6, horizontal moving assembly; 7, grabbing assembly; 71, adsorption member; 711, fixing plate; 712, first lifting unit; 713, mounting plate; 714, adsorption unit; 72, microneedle laminating member ; 721, vibration unit; 722, connecting rod; 723, microneedle plate; 724, microneedle unit; 73, airbag flattening piece; 731, air pump unit; 732, flattening unit; 7321, second lifting unit; 7322, lifting block; 7323, connecting plate; 7324, first airbag; 733, covering unit; 7331, air supply valve; 7332, second airbag; 7333, third airbag; 8, ion wind rod; 9, radiation sensor; 100, substrate. DETAILED DESCRIPTION

[0040] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0041] like Figure 1-Figure 9 As shown, an automatic loading device for chip packaging includes a frame 1, a loading mechanism 2, a moving mechanism 3 and a conveying mechanism 4, wherein the frame 1 is provided with a plurality of loading mechanisms 2 for placing substrates 100, a moving mechanism 3 arranged at the upper end of the loading mechanism 2 and used for grabbing the substrate 100, and a conveying mechanism 4 arranged at one side of the moving mechanism 3; the moving mechanism 3 includes a gantry 5, a horizontal moving component 6 arranged on the gantry 5, and at least one group of grabbing components 7 arranged at the lower end of the horizontal moving component 6 and used for grabbing the substrate 100; the grabbing component 7 includes an adsorption member 71, a microneedle pasting member 72 arranged on the adsorption member 71, and an airbag flattening member 73; when the grabbing component 7 grabs the substrate 100, the adsorption unit 714 in the adsorption member 71 completes the adsorption work of the substrate 100, and at the same time, the microneedle unit 724 in the microneedle pasting member 72 is attached to the upper surface of the substrate 100, and the flattening unit 732 in the airbag flattening member 73 flattens the edge of the substrate 100.

[0042] Among them, by setting the microneedle fitting part 72 and the airbag flattening part 73, the top of the microneedle unit 724 is wide and the bottom is slender, which can increase the contact area between the microneedle unit 724 and the surface of the substrate 100, and enhance the adhesion between the microneedle and the substrate 100. This design can effectively reduce the shaking of the substrate 100 caused by external factors such as air turbulence or mechanical vibration, thereby improving the grasping stability. In addition, the flattening unit 732 in the airbag flattening part 73 can flatten the edge of the substrate 100 to avoid curling and deformation of the edge of the substrate 100 when the adsorption is just started, thereby ensuring the adsorption effect on the substrate 100.

[0043] In detail, the rack 1 not only provides support, but also ensures the relative position accuracy between the modules of the equipment. The loading mechanism 2 places the substrates 100 in a designated area in an orderly manner through multiple loading positions for placing the substrates 100, ensuring smooth and accurate material transmission. Through precise positioning and handling, the loading mechanism 2 effectively reduces the possible deviation or damage of the substrates 100 during the loading process.

[0044] The gantry 5 serves as a supporting structure for the material transfer mechanism 3 and provides a rigid structure required for moving and positioning the substrate 100. The design of the gantry 5 generally ensures that the equipment can freely and accurately perform moving tasks in three-dimensional space. The horizontal moving component 6 is arranged on the gantry 5 and is used for moving the substrate 100 in the horizontal direction. The precise control of the component ensures that the substrate 100 can be smoothly transferred between different workstations.

[0045] It should be noted that the horizontal moving assembly 6 and the conveying mechanism 4 are commonly used existing technologies, and their specific structures are not repeated here. The conveying mechanism 4 is used to transfer the substrate 100 to the station to be packaged.

[0046] Further, if Figure 3-Figure 4 As shown, the adsorption component 71 includes a fixed plate 711 fixedly connected to the horizontal moving component 6, a first lifting unit 712 installed on the fixed plate 711, a mounting plate 713 arranged at the lower end of the first lifting unit 712, and several groups of adsorption units 714 arranged on the mounting plate 713.

[0047] The adsorption unit 714 in the adsorption member 71 adsorbs the substrate 100 through the principle of air pressure. The adsorption unit 714 usually has a fine-tuning function, and can adjust the adsorption force according to the material, size or shape of the substrate 100 to ensure that the substrate 100 can be firmly adsorbed without damaging its surface. When working, the adsorption member 71 moves to the upper end of the loading mechanism 2 under the drive of the horizontal moving component 6, and then the first lifting unit 712 works and drives the mounting plate 713 to descend, and finally the adsorption unit 714 completes the adsorption work of the substrate 100.

[0048] Further, if Figure 5-Figure 6 As shown, the microneedle patch 72 includes several groups of vibration units 721 fixedly arranged at the lower end of the mounting plate 713, a microneedle plate 723 connected to the vibration unit 721 through a connecting rod 722, and a microneedle unit 724 arranged at the lower end of the microneedle plate 723.

[0049] Among them, the microneedle fitting 72 can realize the precise control of the movement of the microneedle array to contact and detach from the target surface during operation;

[0050] When the microneedle unit 724 needs to be separated from the substrate 100, the vibration unit 721 generates lateral micro-vibration with a vibration frequency of 1kHz through electric, piezoelectric or other forms of vibration driving technology. The vibration of the vibration unit 721 is effectively transmitted to the microneedle plate 723 through the connecting rod 722, thereby allowing the microneedle unit 724 to easily detach from the surface of the substrate 100.

[0051] Further, if Figure 6 As shown, the microneedle unit 724 is made of a carbon nanotube-polyurethane composite material. The end of the microneedle unit 724 close to the microneedle plate 723 is cylindrical and the bottom is conical. The height of the microneedle unit 724 is between 20 and 50 μm.

[0052] Among them, carbon nanotubes have excellent mechanical properties, can provide extremely high rigidity, and have extremely strong tensile strength and corrosion resistance. In the microneedle design, carbon nanotubes can effectively improve the overall strength of the microneedles and avoid breakage or deformation during the grasping process. Polyurethane has good flexibility, wear resistance and biocompatibility, which can increase the durability and fatigue resistance of microneedles. Combined with the rigidity of carbon nanotubes, polyurethane can enhance the toughness of microneedles and reduce the risk of brittle fracture during the grasping process.

[0053] When the microneedle unit 724 contacts the surface of the substrate 100, the van der Waals force generated by the molecular interaction between the surface of the microneedle unit 724 and the substrate 100 significantly improves the adhesion. The structure of the microneedle unit 724 with a wide top and a slender bottom helps to maximize the effect of the van der Waals force.

[0054] The smaller diameter at the bottom of the microneedle unit 724 enables the tip of the microneedle unit 724 to enter the microscopic irregular structure on the surface of the substrate 100, forming more physical contact points. The enhancement of the van der Waals force is achieved through the contact between the tip of the microneedle and the substrate 100, thereby increasing the adhesion. The wider design of the top of the microneedle increases the contact area, thereby further enhancing the effect of the van der Waals force. In addition, the shape of the microneedle helps to avoid stress concentration caused by the sharp shape, reducing the risk of the microneedle damaging the substrate 100.

[0055] In this embodiment, the height of the microneedle unit 724 is between 20 and 50 μm. This range of selection can not only effectively adapt to substrates 100 of different thicknesses, but also ensure the flexibility and strength of the microneedle during the grasping process. Too high a microneedle may cause the microneedle to break or deform, while too low a microneedle may not be enough to provide a sufficient contact area.

[0056] The top diameter is about 10 μm, and the bottom diameter is smaller, usually 2-5 μm. This design ensures the sharpness and good contact of the microneedle tip. The wider top portion provides a stable contact force, while the elongated bottom enhances the microneedle's ability to grasp the surface of the substrate 100.

[0057] The height distribution of the top and bottom of the microneedle is crucial to the mechanical properties and adhesion of the microneedle. The top height usually accounts for 1 / 3 to 1 / 2 of the total height (i.e., 10~25μm), while the bottom height accounts for 2 / 3 to 1 / 2 of the total height (i.e., 15~30μm). This distribution enables the top of the microneedle to provide support when grasping an object, while the bottom can effectively penetrate into the surface of the substrate 100, thereby enhancing the effect of the van der Waals force.

[0058] Optionally, the carbon nanotube-polyurethane composite material is prepared by the following method:

[0059] The uniformly dispersed carbon nanotube solution is mixed with the polyurethane solution to obtain a carbon nanotube-polyurethane composite solution, and the solvent in the composite solution is gradually evaporated by controlling the temperature and the solvent volatilization rate to form a composite material of carbon nanotubes and polyurethane;

[0060] Design a microneedle mold, pour the carbon nanotube-polyurethane composite material solution into the microneedle mold, solidify and shape it, and finally demold it;

[0061] If necessary, the microneedle unit 724 needs to be trimmed to remove any irregular parts or excess materials or to smooth its surface to improve its surface quality and adhesion performance.

[0062] Further, if Figure 7 As shown, the airbag flattening member 73 includes at least one set of air pump units 731 fixedly arranged on the mounting plate 713 , a flattening unit 732 pneumatically connected to the air pump unit 731 , and a covering unit 733 pneumatically connected to the air pump unit 731 and arranged on one side of the flattening unit 732 .

[0063] Among them, the airbag flattening member 73 includes a flattening unit 732 and a covering unit 733. On the one hand, the flattening unit 732 can flatten the edge of the substrate 100 from top to bottom before adsorbing the substrate 100. After the substrate 100 is adsorbed and lifted upward, the covering unit 733 can cover and support the lower surface of the edge of the substrate 100 to ensure that the edge of the substrate 100 will not vibrate due to air turbulence or mechanical vibration during high-speed transportation of the substrate 100, thereby further improving the stability of adsorption.

[0064] Further, if Figure 7-Figure 9 As shown, the flattening unit 732 and the covering unit 733 are respectively provided with two groups, and the flattening unit 732 includes several groups of second lifting units 7321 fixedly arranged on the mounting plate 713, a lifting block 7322 arranged at the lower end of the second lifting unit 7321, a connecting plate 7323 connected to the lifting block 7322 through a connecting rod, and a first airbag 7324 arranged at the lower end of the connecting plate 7323.

[0065] The main function of the flattening unit 732 is to keep the edge of the substrate 100 flat by flattening from top to bottom before the substrate 100 is adsorbed;

[0066] During operation, the air pump unit 731 inflates the first airbag 7324 in advance, and generally speaking, the first airbag 7324 is always in an inflated state, and then the flattening unit 732 follows the mounting plate 713 to descend synchronously. When the mounting plate 713 descends to a predetermined position, the second lifting unit 7321 works and drives the connecting plate 7323 and the first airbag 7324 to descend through the lifting block 7322 until the first airbag 7324 is in close contact with the upper surface of the substrate 100.

[0067] The arrangement of the lifting block 7322, the connecting rod and the connecting plate 7323 helps to ensure the flatness and stability of the first airbag 7324, and ensures that the edge of the substrate 100 is evenly flattened. During the flattening process, the contact between the first airbag 7324 and the surface of the substrate 100 can effectively eliminate the unevenness of the edge of the substrate 100, thereby reducing the edge vibration caused by air or vibration when the substrate 100 is transported.

[0068] It should be noted that the flattening unit 732 and the covering unit 733 are respectively provided with two groups. Therefore, in this embodiment, two groups of air pump units 731 are also provided. Each group of air pump units 731 is respectively provided corresponding to a group of flattening units 732 and covering units 733. The air pump units 731 are used to inflate or deflate the flattening units 732 and covering units 733.

[0069] Further, if Figure 7-Figure 9As shown, the covering unit 733 includes an air supply valve 7331, one end of which is fixedly connected to the first air bag 7324 and the other end of which is connected to the air pump unit 731, and a second air bag 7332 and a third air bag 7333 respectively connected to the air supply valve 7331;

[0070] The third airbag 7333 is disposed closely against the lower surface of the substrate 100 after being inflated.

[0071] The design of the coating unit 733 is to further ensure the stability of the substrate 100 after adsorption, especially in the high-speed transportation process, to prevent the lower surface of the edge of the substrate 100 from being deformed or unstable due to external interference.

[0072] One end of the air supply valve 7331 is fixedly connected to the first airbag 7324, and the other end is connected to the air pump unit 731, so as to control the airflow and the inflation of the airbag of the covering unit 733. By adjusting the air supply valve 7331, the working state of the covering unit 733 can be accurately controlled, that is, the second airbag 7332 is inflated and the third airbag 7333 is deflated, or the third airbag 7333 is inflated and the second airbag 7332 is deflated.

[0073] After the substrate 100 is adsorbed and lifted upward, the air supply valve 7331 works and transfers the airflow in the air pump unit 731 from the second air bag 7332 to the third air bag 7333. During the inflation of the third air bag 7333, the third air bag 7333 gradually approaches the lower surface of the substrate 100 and supports the lower surface of the substrate 100. When the lower surface of the substrate 100 does not need to be supported (unloading is required), the air supply valve 7331 works and transfers the airflow in the air pump unit 731 from the third air bag 7333 to the second air bag 7332. As the gas in the third air bag 7333 becomes less and less, the third air bag 7333 gradually moves away from the substrate 100 under the action of gravity and the inflation of the second air bag 7332, thereby ensuring the subsequent unloading of the substrate 100.

[0074] This structural design enables the lower surface of the substrate 100 to be effectively supported during the transportation process, preventing the edge of the substrate 100 from being deformed or vibrating due to lack of support. The airbag of the covering unit 733 is in close contact with the substrate 100, further improving the stability of the substrate 100 during high-speed transportation.

[0075] The air supply valve 7331 can be a solenoid valve or a gas-controlled valve.

[0076] Further, if Fig.10 As shown, the loading mechanism 2 includes a loading frame 21 for placing the substrate 100 and a lifting assembly 22 disposed at the lower end of the loading frame 21;

[0077] The lifting assembly 22 includes a driving unit 221, a lifting screw 222, a lifting plate 223, a lifting guide rod 224 and a lifting support plate 225. The output end of the driving unit 221 is transmission-connected to the lifting screw 222; the lifting plate 223 is transmission-connected to the lifting screw 222 and at least one group of lifting guide rods 224 is fixedly arranged on the lifting plate 223; the lifting support plate 225 is fixedly arranged on the upper end of the lifting guide rod 224.

[0078] The lifting assembly 22 can lift the substrate 100 in the loading frame 21 upward, and then the substrate 100 can be grasped in cooperation with the material moving mechanism 3 .

[0079] In detail, when the grabbing work is performed, the driving unit 221 works and drives the lifting screw 222 to rotate. Due to the transmission setting of the lifting screw 222 and the lifting plate 223, the lifting plate 223 and the lifting guide rod 224 will rise synchronously and drive the lifting support plate 225 to rise. Subsequently, the lifting support plate 225 will lift the substrate 100 inside the loading frame 21 upward.

[0080] It should be noted that a group of radiation sensors 9 are arranged on the outer side of the upper end of the loading frame 21. In this way, when the lifting assembly drives the uppermost substrate 100 inside the loading frame 21 to move to the height of the radiation sensor 9, the lifting assembly can stop working. At this time, the uppermost substrate 100 can be quickly grabbed by the material moving mechanism 3.

[0081] Further, if Figure 2 As shown, an ion wind rod 8 is fixedly provided at the lower end of the gantry 5, and the air outlet of the ion wind rod 8 is arranged toward the loading frame 21. The ion wind rod 8 can quickly remove foreign matter and dust on the surface of the object and neutralize the static electricity on the surface of the object, thereby achieving the purpose of eliminating static electricity.

[0082] Working process:

[0083] The loading mechanism 2 is ready, and the substrate 100 in the loading frame 21 is pushed upward to a set height by the lifting assembly 22 to ensure that the substrate 100 is ready to be grabbed by the moving mechanism 3;

[0084] The lifting assembly 22 works, the driving unit 221 starts and finally drives the substrate 100 inside the loading frame 21 to lift up through the lifting support plate 225. When the substrate 100 reaches the height set by the beam sensor 9, the lifting assembly 22 stops working, and the uppermost substrate 100 is in a position to be grasped, ready to be transported by the material moving mechanism 3.

[0085] The material moving mechanism 3 grabs the substrate 100, and the adsorption member 71 moves to the upper end of the material loading mechanism 2 with the drive of the horizontal moving component 6 to grab the substrate 100 to be taken. The microneedle unit 724 enhances the adhesion by contacting with the surface of the substrate 100 to ensure that the substrate 100 is not easily affected by external disturbances. The flattening unit 732 of the airbag flattening member 73 ensures that the edge of the substrate 100 is flat to prevent the substrate 100 from curling or deformation during adsorption.

[0086] The horizontal moving component 6 drives the material moving mechanism 3 to move the grabbing component 7 adsorbing the substrate 100 to the target position;

[0087] Once the substrate 100 is adsorbed and lifted, the airbag of the covering unit 733 is inflated according to the control of the air supply valve 7331, so that the third airbag 7333 is closely attached to the lower surface of the substrate 100;

[0088] After being adsorbed and supported by the airbag, the substrate 100 is accurately transported to the target position. During unloading, the airflow in the third airbag 7333 is transferred to the second airbag 7332 through the air supply valve 7331, so that the third airbag 7333 gradually moves away from the substrate 100.

[0089] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An automatic feeding device for chip packaging, characterized in that: include: A frame, wherein the frame is provided with a plurality of groups of loading mechanisms for placing substrates, a material moving mechanism provided at the upper end of the loading mechanism and used for grabbing the substrates, and a conveying mechanism provided at one side of the material moving mechanism; The material moving mechanism comprises a gantry, a horizontal moving assembly arranged on the gantry, and at least one group of grabbing assemblies arranged at the lower end of the horizontal moving assembly and used for grabbing the substrate; The grabbing component includes an adsorbent, a microneedle fitting component arranged on the adsorbent, and an airbag flattening component; When the grabbing assembly grabs the substrate, the adsorption unit in the adsorption member completes the adsorption work on the substrate, and at the same time, the microneedle unit in the microneedle laminating member is attached to the upper surface of the substrate, and the flattening unit in the airbag flattening member flattens the edge of the substrate; The microneedle fitting comprises a plurality of groups of vibration units fixedly arranged at the lower end of the mounting plate, a microneedle plate connected to the vibration unit via a connecting rod, and a microneedle unit arranged at the lower end of the microneedle plate; The airbag flattening member comprises at least one set of air pump units fixedly arranged on the mounting plate, a flattening unit pneumatically connected to the air pump unit, and a covering unit pneumatically connected to the air pump unit and arranged on one side of the flattening unit; The flattening unit and the covering unit are respectively provided with two groups, and the flattening unit includes several groups of second lifting units fixedly arranged on the mounting plate, a lifting block arranged at the lower end of the second lifting unit, a connecting plate connected to the lifting block through a connecting rod, and a first airbag arranged at the lower end of the connecting plate.

2. The automatic feeding equipment for chip packaging according to claim 1, characterized in that: The adsorption member comprises a fixed plate fixedly connected to the horizontal moving assembly, a first lifting unit installed on the fixed plate, a mounting plate arranged at the lower end of the first lifting unit, and a plurality of adsorption units arranged on the mounting plate.

3. The automatic feeding equipment for chip packaging according to claim 2, characterized in that: The microneedle unit is made of a carbon nanotube-polyurethane composite material.

4. The automatic feeding equipment for chip packaging according to claim 2, characterized in that: The end of the microneedle unit close to the microneedle plate is cylindrical, and the bottom is conical.

5. The automatic feeding equipment for chip packaging according to claim 2, characterized in that: The covering unit includes an air supply valve, one end of which is fixedly connected to the first airbag and the other end of which is connected to the air pump unit, and a second airbag and a third airbag respectively connected to the air supply valve; The third airbag is arranged closely to the lower surface of the base plate after being inflated.

6. The automatic feeding equipment for chip packaging according to claim 1, characterized in that: The loading mechanism comprises a loading frame for placing the substrate and a lifting assembly arranged at the lower end of the loading frame; The top material assembly comprises: A driving unit, the output end of which is transmission-connected to the lifting screw; A lifting plate, which is transmission-arranged with the lifting screw and on which at least one set of lifting guide rods is fixedly arranged; The lifting support plate is fixedly arranged on the upper end of the lifting guide rod.

7. The automatic feeding equipment for chip packaging according to claim 6, characterized in that: An ion wind rod is fixedly arranged at the lower end of the gantry, and an air outlet of the ion wind rod is arranged toward the loading frame.

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