Micro-electro-mechanical device

Abstract

The invention relates to a microelectromechanical device (110) comprising a carrier substrate (100) having a substrate surface (100a) and a plurality of MEMS modules (120), where each module comprises an ASIC layer (140) having an ASIC layer front side (140a) and an ASIC layer rear side (140b), a backplane (160) having a backplane front side (160a) and a backplane rear side (160b), and a plurality of microelectromechanical components (130) having a component rear side (130b). The backplane (160) is arranged on the front side (140a) of the ASIC layer and the backplane rear side (160b) is collectively connected to the front side of the ASIC layer by electrical contact points (144). The components (130) are arranged on the floor front side (160a) and their component rear sides (130b) are connected to the floor front side. The contact point (144) is partially surrounded by a protective frame (195) disposed between the backplane (160) and the ASIC layer (140). The ASIC layer (140) has an ASIC for controlling the component (130), wherein the ASIC is electrically connected to the component using a portion of the contact points (144). The module (120) is arranged on the substrate surface (100a), and the ASIC layer rear side (140b) of the module is connected to the substrate surface.

Description

Technical Field

[0001] The present invention relates to the field of micro-electromechanical devices, in particular micro-mirror arrays, and to a micro-electromechanical device; an illumination optical unit; an illumination system for a projection exposure device; a corresponding projection exposure device and a method for manufacturing a micro-electromechanical device. Background Art

[0002] Devices comprising displaceable micromirrors arranged in a matrix, known as micromirror arrays or micromirror actuators, are now used in a variety of devices, such as smartphones, projectors, head-up displays, barcode readers, mask exposure units in semiconductor manufacturing, and microscopes. Corresponding micromirror arrays are known, for example, from the following documents: DE 10 2013 208 446 A1, EP 0 877 272 A1 and WO 2010 / 049076 A2. Disclosures of suitable actuator units for displacing individual mirrors (i.e. micromirrors) in micromirror arrays are specifically described, for example, in DE 10 2013 206 529 A1, DE 10 2013 206531 A1 and DE 10 2015 204 874 A1. Summary of the invention

[0003] According to the invention, a microelectromechanical device, an illumination system and a projection exposure apparatus comprising an illumination optical unit of the microelectromechanical device and each having a corresponding illumination optical unit, and a method for producing the microelectromechanical device according to the invention are proposed.

[0004] According to a first aspect of the invention, a micro-electromechanical device is proposed, which comprises a carrier substrate with a substrate surface and a plurality of MEMS modules (MEMS: Micro-Electromechanical System). In this case, each of the plurality of MEMS modules comprises: an ASIC layer, preferably exactly one, having an ASIC layer front side and an ASIC layer rear side positioned opposite the ASIC layer front side; a base plate, having a base plate front side and a base plate rear side positioned opposite the base plate front side; and a plurality of micro-electromechanical components having component rear sides. The micro-electromechanical components do not need to be identical in terms of their construction and / or function, although this may be the case. The base plate is arranged on the ASIC layer front side, and the base plate rear side is polymerically connected to the ASIC layer front side via electrical contact points. Polymeric connection by soldering or preferably sintering or eutectic bonding is particularly suitable for this. As an example, a silver sintering paste can be used as sintering material. A plurality of micro-electromechanical components are also arranged on the base plate front side and their component rear sides are connected to the base plate front side. In this case, the electrical contacts between the base plate and the ASIC layer are at least partially, preferably completely, surrounded by at least one protective frame, which is arranged between the base plate and the ASIC layer and can also be conductive. It is conceivable here that there are embodiments with multiple protective frames in one MEMS module, in which case each of these protective frames surrounds different parts of the electrical contacts between the base plate and the ASIC layer, but preferably there is only one protective frame for each MEMS module. The ASIC layer of each MEMS module has one or more ASICs (application-specific integrated circuits) for controlling a plurality of micro-electromechanical components, wherein the one or more ASICs are electrically connected to the micro-electromechanical components using at least a portion of the electrical contacts, wherein the electrical contacts are usually further guided to the micro-electromechanical components in the base plate through electrical connections such as through holes. For example, in order to make electrical connections between other electronic components located on the carrier substrate and the micro-electromechanical components, the ASIC layer can also selectively include an interposer and / or other components in addition to the ASIC. The ASIC layer of the MEMS module can be a continuous ASIC layer or a non-continuous ASIC layer. The term continuity of an ASIC layer means that all elements of the ASIC layer are mechanically connected to each other via the layer itself. This mechanical connection via the ASIC layer between two elements can be achieved via the elements themselves and / or via other elements of the layer, such as the ASIC, the interposer, suitable connecting elements, filling materials and / or bonding materials. In the case of a non-continuous ASIC layer, for example, this layer has elements such as ASICs and / or interposers, which are not mechanically connected to each other via the layer itself. The ASIC layer thus has gaps. The electrical connection can be further guided via electrical contact points between the ASIC layer and the base plate. For example, a suitable interposer is in particular a silicon-based interposer with electrical connections, such as through-silicon vias (TSVs), such as copper-based through vias (Cu vias).A plurality of MEMS modules are arranged on a substrate surface of a carrier substrate, and the rear side of the ASIC layer of the plurality of MEMS modules is connected to the substrate surface. This connection is also usually implemented in a polymeric manner and is preferably implemented by sintering. The other electronic components on the carrier substrate may be, for example, other ASICs for controlling the entire electromechanical device, passive components and / or connecting elements (e.g., plugs, cables), for example, for making electrical connections to external control devices such as computing units and for power supply purposes. The carrier substrate as a whole serves as a component carrier and may include electrical connections such as through-holes for guiding electrical signals from one surface of the carrier substrate to another surface of the carrier substrate. In this regard, for example, it may be advantageous to arrange the other electronic components on a substrate surface of the carrier substrate that is positioned relative to the substrate surface having the MEMS modules. The carrier substrate may, for example, be substantially composed of ceramic, which may, for example, be Al. 2 O 3 Base ceramic.

[0005] This micro-electromechanical device therefore subdivides its multiple micro-electromechanical components into individual groups, each group including multiple micro-electromechanical components, which are referred to as MEMS modules in the context of the present invention. Multiple MEMS modules can each have, for example, just 2, 3, 4, 5, 6, 9, 12, 16, 20, 25, 30, 36, 42, 49, 56, 64, 72 or 81 multiple micro-electromechanical components, and other numbers ≥ 2 are also conceivable. Multiple micro-electromechanical components can be arranged in a rectangular grid composed of rows and columns, for example, composed of two rows and two columns, two rows and three columns, three rows and three columns, three rows and four columns, four rows and four columns, four rows and five columns, five rows and five columns, five rows and six columns, six rows and six columns, six rows and seven columns, seven rows and seven columns, seven rows and eight columns, eight rows and eight columns, eight rows and nine columns or nine rows and nine columns. Alternatively, for example, a hexagonal grid is conceivable. The electromechanical device according to the invention may comprise, for example, exactly 2, 3, 4, 5, 6, 9, 12, 16, 20, 25, 30, 36, 42, 49, 56, 64, 72 or 81 MEMS modules, other numbers ≥ 2 are also conceivable. The MEMS modules may also be arranged in a rectangular grid consisting of rows and columns, for example consisting of two rows and two columns, two rows and three columns, three rows and three columns, three rows and four columns, four rows and four columns, four rows and five columns, five rows and five columns, five rows and six columns, six rows and six columns, six rows and seven columns, seven rows and seven columns, seven rows and eight columns, eight rows and eight columns, eight rows and nine columns or nine rows and nine columns. Here, for example, alternatively, a hexagonal grid is also conceivable.

[0006] An advantageous aspect of subdividing the microelectromechanical device in this way is that the complexity of the structure and the susceptibility to failure are reduced by the subdivision into MEMS modules. It has been established that a plurality of MEMS modules with a reduced number of microelectromechanical components are easier to handle during the manufacturing process than a single unit with the same total number of microelectromechanical components. In particular, the yield during the manufacturing process can be significantly increased by the method according to the invention, since MEMS modules that exclusively include fully functional microelectromechanical components can be selected in a targeted manner during manufacturing. In addition, it is conceivable to further connect a plurality of such microelectromechanical devices according to the invention to form a superordinate unit, for example in order to cover a larger area than can be achieved with a single microelectromechanical device according to the invention. The arrangement of the protective frame between the base plate and the ASIC layer according to the invention ensures that no damage occurs in the area surrounded by the protective frame. In particular, the structures and electrical contacts of the ASIC located in these areas are thus protected from damage and contamination such as can occur during the manufacture of the microelectromechanical device according to the invention and also during the subsequent operation. The protective frame is thus used to isolate the environment. At the same time, the mechanical cohesion between the ASIC layer and the base plate is also enhanced. Preferably, the protection frame of the MEMS module is implemented such that deformations of the MEMS module, in particular due to temperature, are reduced.

[0007] Furthermore, the protective frames can preferably be shaped such that they surround or they themselves cover the entire ASIC layer top side and the entire bottom side of the base plate. The protective frames thus preferably extend along the edges of the ASIC layer top side and the bottom side of the base plate. Preferably, in this case, the protective frame of the MEMS module does not protrude laterally beyond the base plate, in order to enable the closest possible arrangement of the MEMS module on the carrier substrate, i.e. a high fill factor. Also in order to achieve a high fill factor, preferably, the ASIC layer of the MEMS module also does not protrude laterally beyond the base plate. The ASIC layer of the MEMS module thus preferably has a size that is equal to or smaller than the base plate.

[0008] A particularly important embodiment of the present invention is the use of a micromirror as a microelectromechanical component. The microelectromechanical device can thus be in particular a micromirror array. In this case, each of the plurality of microelectromechanical components comprises a reflector element having a reflective surface for reflecting light, and a displacement unit for displacing the reflector element of each microelectromechanical component, wherein one or more ASICs are configured to control the displacement unit. In this case, displacement means movement relative to at least one degree of freedom. The displacement can include linear movement and rotation. The reflector element can be or can particularly include a Bragg mirror. The displacement unit can be, for example, an electrostatic actuator, for example with comb electrodes. Suitable actuators are, for example, those described in the following documents: DE 10 2013 206 529 A1, DE 10 2013 206 531 A1 and DE 10 2015 204 874 A1.

[0009] Furthermore, it is particularly advantageous if each of the plurality of microelectromechanical components in each of the plurality of MEMS modules has a substantially rectangular, preferably square, base surface or a substantially hexagonal base surface. A substantially rectangular or hexagonal base surface means that relatively slight deviations from a rectangular or respectively hexagonal base surface are conceivable, for example due to rounded corners and / or concavities and / or convexities.

[0010] According to a preferred configuration of the present invention, at least one protection frame of each of the plurality of MEMS modules is a part of the aggregate connection from the back side of the base plate to the front side of the ASIC layer in the corresponding one of the plurality of MEMS modules. This enables the protection frame of the device according to the present invention to be particularly simple to implement during the manufacturing process.

[0011] In order to be able to place (i.e., grasp, move and / or position) the MEMS modules on the substrate surface during the manufacturing process, for example by means of suitable machines, the MEMS modules must be capable of being grasped without being damaged. For this purpose, the MEMS modules may each include a frame which laterally delimits the MEMS module and at which the MEMS modules can be grasped and subsequently moved and / or positioned. This frame may be identical to the protective frame of the respective MEMS module, but is preferably different.

[0012] According to a second aspect of the invention, an illumination optical unit for a microelectromechanical device is proposed for directing illumination radiation to an object field, the illumination optical unit comprising at least one microelectromechanical device according to the invention, wherein each of a plurality of microelectromechanical components comprises a mirror element having a reflective surface and a displacement unit for displacing the mirror element of the respective microelectromechanical component, wherein one or more ASICs are configured to control the displacement unit. The illumination optical unit according to the invention thus uses the microelectromechanical device according to the invention as a micromirror array. It may also in particular comprise a plurality of such micromirror arrays according to the invention, for example in order to achieve a larger overall micromirror array by means of the arrangement of such a plurality of micromirror arrays, which makes it possible to deflect an incident light beam having a larger beam diameter.

[0013] According to a third aspect, an illumination system for a projection exposure apparatus is also proposed, which illumination system comprises an illumination optical unit according to the invention and a radiation source, in particular an EUV radiation source.

[0014] According to a fourth aspect, a microlithography projection exposure apparatus is proposed, comprising an illumination optical unit according to the invention and a projection optical unit for projecting a reticle arranged in an object field into an image field.

[0015] The illumination optical unit according to the invention, the illumination system according to the invention and the projection exposure apparatus according to the invention can be part of an EUV lithography apparatus. For these, an adjustable light path to the photomask (also called reticle) is advantageous, which can be realized by a micromirror array in the light path as a microelectromechanical device according to the invention. The reflective surface of the mirror element can be provided with a Bragg coating, which provides a particularly good reflection of the central wavelength of the light used for exposure.

[0016] For further details about the general settings of the corresponding projection exposure apparatus and the associated illumination optics unit and the associated illumination system, reference should be made to DE 10 2015 204 874 A1 and DE 10 2016 213 026 A1, which are hereby fully incorporated into the present application as a part thereof.

[0017] According to a fifth aspect of the present invention, a method for manufacturing a microelectromechanical device is provided, preferably a microelectromechanical device according to the first aspect of the present invention, comprising a carrier substrate and a plurality of MEMS modules. Each MEMS module comprises preferably exactly one ASIC layer, which has one or more ASICs (and optionally also other elements such as one or more interposers) and an ASIC layer front side and an ASIC layer back side; a base plate, which has a base plate front side and a base plate back side; and a plurality of microelectromechanical components, wherein the base plate is arranged on the ASIC layer front side and the base plate back side is connected to the ASIC layer front side. The ASIC layer of the MEMS module can be configured as a continuous ASIC layer or a discontinuous ASIC layer. The method according to the present invention involves providing a MEMS substrate having a structure of a base plate for microelectromechanical components and a plurality of MEMS modules. The provided MEMS substrate thus comprises a structure of a base plate for microelectromechanical components and a plurality of MEMS modules. Such a substrate is usually present in the form of a wafer (MEMS wafer) and can be manufactured by the method described in, for example, DE 10 2015 206 996 A1. This also involves providing an ASIC substrate with a structure of an ASIC layer for a microelectromechanical device, likewise usually in the form of a wafer (ASIC wafer). From these two substrates, a coupling substrate, usually in the form of a coupling wafer, is manufactured by connection (in the case of wafers: wafer bonding), in particular a polymer connection (for example soldering, sintering, for example using a silver sintering paste, or eutectic bonding), wherein for each of a plurality of MEMS modules, a plurality of assigned electrical contact points and preferably exactly one at least one assigned protection frame between the MEMS substrate and the ASIC substrate are formed, so that for each MEMS module, the at least one protection frame assigned to the MEMS module at least partially surrounds, preferably surrounds all, the electrical contact points assigned to the MEMS module. Then, in order to obtain a plurality of MEMS modules, the coupling substrate is segmented along predefined separation lines, for example along the lattice structure, for example by sawing with a saw or cutting with a laser beam. The segmentation can also be carried out using etching methods such as deep reactive ion etching (DRIE). In this method step, the protective frame protects the area of ​​the contact points from contamination and possible damage and also protects the structures of the corresponding ASIC layer located there. In addition, the protective frame ensures that the MEMS module has improved cohesion of the coupling substrate before, during and after singulation.

[0018] Furthermore, a carrier substrate is provided, on which further electronic components and / or other components may be mounted, if appropriate. A plurality of MEMS modules are placed on the substrate surface of the carrier substrate. Subsequently, the rear sides of the ASIC layers of the plurality of MEMS modules are polymerically connected (e.g., by welding or sintering, e.g., using a silver sintering paste) to the substrate surface. Preferably, before manufacturing the coupling substrate, the microelectromechanical structure of the MEMS substrate and / or the structure of the ASIC substrate are tested in order to ensure functionality. Preferably, in order to ensure functionality, it is also possible to perform testing of the MEMS modules after manufacturing the coupling substrate and / or to perform testing of the entire completed microelectromechanical device after polymerizing the rear sides of the ASIC layers of the plurality of MEMS modules to the substrate surface.

[0019] Advantages of the present invention

[0020] The present invention provides a method for a micro-electromechanical device, such as a micro-mirror array, comprising a plurality of micro-electromechanical components arranged on the same carrier substrate.

[0021] In particular, by subdividing the microelectromechanical component according to the invention into individual smaller units (MEMS modules), the yield in the manufacturing process can be significantly increased, since the individual MEMS modules can be tested in a targeted manner during manufacturing, and those exclusively containing fully functional microelectromechanical components can be selected subsequently. Furthermore, the use of a protective frame to surround the critical areas of the MEMS module including the relevant electrical contacts results in protection thereof from damage and contamination, in particular during the segmentation required for manufacturing the MEMS modules during the manufacturing method according to the invention, and when the MEMS modules are used in an aggressive environment. Furthermore, such a protective frame also increases the mechanical stability of the connection between the MEMS substrate and the ASIC substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Embodiments of the present invention are explained in more detail with reference to the drawings and the following description. In the drawings:

[0023] Figure 1 A schematic diagram showing a portion of an exemplary micro-electromechanical device according to the present invention in side view;

[0024] Figure 2 A schematic diagram showing a MEMS module of a second exemplary micro-electromechanical device according to the present invention in a side view, and also showing a schematic diagram for explaining the arrangement of a protection frame; and

[0025] Figure 3 A flow chart of a method according to the invention for producing a micro-electromechanical device is schematically shown. DETAILED DESCRIPTION

[0026] In the following description of embodiments of the invention, identical or similar elements are denoted by the same reference symbols, and a repeated description of these elements is omitted in individual cases. The drawings merely schematically illustrate the subject matter of the invention.

[0027] Figure 1 A schematic diagram of a portion of an exemplary micro-electromechanical device 110 according to the present invention, in which a micro-mirror array is marked in a side view. In the illustrated example, two MEMS modules 120 (left MEMS module: 120a, right MEMS module: 120b) are arranged on a substrate surface 100a of a carrier substrate 100, each of the MEMS modules comprising a plurality of micro-electromechanical components 130, Figure 1 Four of these are shown in various cases. In the case shown, the microelectromechanical components 130 are micromirrors. These micromirrors each include a mirror element 134, which in turn has a reflective surface 136 for reflecting light. These mirror elements 134 can be moved by means of a displacement unit 132. An ASIC is used for controlling the displacement unit 132, which is arranged in the form of a bare die below the displacement unit 132 in the ASIC layer 140 and is likewise part of the corresponding MEMS module 120. Further electronic components (e.g. likewise for controlling the displacement unit 132, e.g. in the form of further ASICs) can be arranged (not shown) for example on the rear side 100b of the carrier substrate 100.

[0028] Within the MEMS module 120, a microelectromechanical component 130 is arranged on a front side 160a of a base plate 160. In this case, the base plate front side 160a is connected to a rear side 130b of the microelectromechanical component 130. In the example shown, two base plates 160 are visible, with correspondingly four visible microelectromechanical components 130 shown being located on each base plate. The microelectromechanical component 130 is connected to an ASIC of a corresponding ASIC layer 140 via electrical contacts 144. The ASIC of the ASIC layer 140 can in turn be connected to further electronic components (not shown) via electrical contacts 146, which can be arranged, for example, on the carrier substrate 100. Furthermore, for example, through-silicon vias (TSVs) 142 can be present in the ASIC layer 140 and can be used, for example, to produce an electrical connection between such further electronic components on the carrier substrate 100 and the microelectromechanical component 130. This through-via 142 can also be realized, for example, via an interposer, which can likewise be part of the ASIC layer 140, or via a bare die of the ASIC.

[0029] In addition, Figure 1, for each of the two MEMS modules 120 shown, a protective frame 195 is visible, which protects the area between the base plate 160 and the ASIC layer 140 and therefore also the electrical contacts 144 (the electrical contacts between the ASIC and the base plate and the electrical contacts which are the continuation of the through-holes 142) from damage. Furthermore, optionally, a further frame 170 can in each case be part of the MEMS module 120, which laterally delimits the MEMS module 120 and enables the MEMS module 120 to be placed on the carrier substrate 100 without the risk of damaging the MEMS module 120 and in particular its microelectromechanical components 130, or protects them from the ingress of particles.

[0030] Figure 2 The upper sub-figure shows a schematic diagram of a MEMS module 220 of a second exemplary micro-electromechanical device 210 according to the present invention in a side view, and the lower sub-figure also shows a schematic diagram of a cross section A for explaining the arrangement of a protection frame 295 in the MEMS module 220. Figure 1 As shown, it can be seen in the side view in the upper sub-figure that the MEMS module 220 depicted here also has four micro-electromechanical components 230. Overall, as is apparent from the lower sub-figure, the MEMS module 220 depicted has 16 micro-electromechanical components 230, each of which has a displacement unit 232 for displacing a mirror element 234 having a reflective surface. There are electrical contact points 244a, 244b, 244c, 244d located between the ASIC layer 240 and the base plate 260, which are partly a continuation of the electrical connection, which can be, for example, a through hole 142 in the ASIC layer 240. These electrical contact points 244a, 244b, 244c, 244d are at least partially surrounded by a protective frame 295. Preferably and as shown Figure 2 As shown, all electrical contact points 244a, 244b, 244c, 244d are located within the area defined by the protective frame 295. The entire MEMS module 220 is arranged on a carrier substrate 200, which is substantially composed of ceramic, for example, wherein the ASIC layer back side 240b of the ASIC layer 240 is, for example, polymerically connected to the substrate surface 200a of the carrier substrate 200.

[0031] A section A at the level of the electrical contacts 244a, 244b, 244c, 244d is shown in plan view in the lower sub-figure. It can be seen that the exemplary MEMS module 220 is composed of four by four micro-electromechanical components 230, each of which is assigned 25 electrical contacts 244a, 244b, 244c, 244d.

[0032] at last, Figure 3A flow chart of a method for manufacturing a micro-electromechanical device 110, 210 according to the present invention is schematically shown, wherein the micro-electromechanical device 110, 210 includes a carrier substrate 100, 200 and a plurality of MEMS modules 120, 220, wherein each of the MEMS modules 120, 220 includes an ASIC layer 140, 240, which includes one or more ASICs having an ASIC layer front side 140a, 240a and an ASIC layer back side 140b, 240b; a base plate 160, 260, which has a base plate front side 160a and a base plate back side 160b; and a plurality of micro-electromechanical components 130, 230, wherein the base plate 160, 260 is arranged on the ASIC layer front side 140a, and the base plate back side 160b is connected to the ASIC layer front side 140a. This involves providing 310 a MEMS substrate having a structure of a base plate 160, 260 for microelectromechanical components 130, 230 and a plurality of MEMS modules 120, 220. This also involves providing 320 an ASIC substrate having a structure of an ASIC layer 140, 240 for a plurality of MEMS modules 120, 220. Thereby, a coupling substrate is manufactured by a polymer connection such as soldering, sintering or eutectic bonding, wherein for each of the plurality of MEMS modules 120, 220, a plurality of assigned electrical contact points 144 are formed between the MEMS substrate and the ASIC substrate. Subsequently, this coupling substrate is divided along predefined separation lines such as a lattice structure to obtain a plurality of MEMS modules 120, 220. Furthermore, a carrier substrate 100, 200 is provided, on which further electronic components can be mounted if appropriate. A plurality of MEMS modules 120, 220 are placed on a substrate surface 100a, 200a of the carrier substrate 100, 200. Finally, in step 370 , the ASIC layer backside 140 b of the plurality of MEMS modules 120 , 220 are aggregately connected to the substrate surface 100 a , 200 a .

[0033] Preferably, the microelectromechanical structure of the MEMS substrate is tested 315 and / or the structure of the ASIC substrate is tested 325 to ensure functionality before the coupling substrate is manufactured. Additionally or alternatively, to ensure functionality, it is also possible to perform a test 345 of the MEMS modules 120, 220 after manufacturing the coupling substrate and / or to test 375 the entire completed microelectromechanical device 110, 210 after polymerizing the ASIC layer back side 140b of the plurality of MEMS modules 120, 220 to the substrate surface 100a.

[0034] The invention is not limited to the exemplary embodiments described herein and the aspects emphasized therein. On the contrary, numerous modifications are possible within the scope of the capabilities of a person skilled in the art within the scope indicated in the claims.

Claims

1. A micro-electromechanical device (110, 210), comprising a carrier substrate (100, 200) having a substrate surface (100a, 200a) and a plurality of MEMS modules (120, 220), Each of the plurality of MEMS modules (120, 220) comprises an ASIC layer (140) having an ASIC layer front side (140a) and an ASIC layer back side (140b), a base plate (160, 260) having a base plate front side (160a) and a base plate back side (160b), and a plurality of micro-electromechanical components (130, 230) having a component back side (130b), The base plate (160, 260) is arranged on the front side (140a) of the ASIC layer and the back side (160b) of the base plate is connected to the front side (140a) of the ASIC layer via electrical contact points (144, 244a, 244b, 244c, 244d) and the plurality of micro-electromechanical components (130, 230) are arranged on the front side (160a) of the base plate and their component back sides (130b) are connected to the front side (160a) of the base plate. wherein the electrical contact point (144, 244a, 244b, 244c, 244d) is at least partially surrounded by at least one protective frame (195, 295) arranged between the base plate (160, 260) and the ASIC layer (140), wherein the ASIC layer (140) has one or more ASICs for controlling the plurality of micro-electromechanical components (130, 230), wherein the one or more ASICs use at least a portion of the electrical contact points (144, 244a, 244b, 244c, 244d) to be electrically connected to the micro-electromechanical components (130, 230), The plurality of MEMS modules (120, 220) are arranged on the substrate surface (100a, 200a), and the ASIC layer back side (140b) of the plurality of MEMS modules (120, 220) is connected to the substrate surface (100a, 200a).

2. The micro-electromechanical device (110, 210) according to claim 1, characterized in that: Each of the plurality of micro-electromechanical components (130, 230) comprises a reflector element (134, 234) having a reflective surface (136), and a displacement unit (132) for displacing the reflector element (134, 234) of the respective micro-electromechanical component (130, 230), wherein the one or more ASICs are configured to control the displacement unit (132).

3. The micro-electromechanical device (110, 210) according to any one of the preceding claims, characterized in that Each of the plurality of MEMS modules (120, 220) has exactly 2, 3, 4, 6, 9, 12, 16, 20, 25, 30, 36, 42, 49, 56, 64, 72 or 81 of the plurality of micro-electromechanical components (130, 230).

4. The micro-electromechanical device (110, 210) according to any one of the preceding claims, characterized in that Each of the plurality of micro-electromechanical components (130, 230) of each of the plurality of MEMS modules (120, 220) has a substantially rectangular, preferably square, or substantially hexagonal base surface.

5. The micro-electromechanical device (110, 210) according to any one of the preceding claims, characterized in that The at least one protection frame (195, 295) of each of the plurality of MEMS modules (120, 220) is part of a polymeric connection of the backplane back side (160b) to the ASIC layer front side (140a) in each of the plurality of MEMS modules (120, 220).

6. An illumination optical unit for a projection exposure apparatus for guiding illumination radiation to an object field, comprising one or more micro-electromechanical devices (110, 210) according to claim 2 and preferably according to any one of claims 3 to 5.

7. An illumination system for a projection exposure apparatus, comprising an illumination optical unit according to claim 6 and a radiation source, preferably an EUV radiation source.

8. A microlithography projection exposure apparatus comprising an illumination optical unit according to claim 6 and a projection optical unit for projecting a reticle arranged in an object field into an image field.

9. A method for manufacturing a microelectromechanical device (110, 210), preferably according to any one of claims 1 to 5, comprising a carrier substrate (100, 200) and a plurality of MEMS modules (120, 220), wherein each of the MEMS modules (120, 220) comprises: An ASIC layer (140) comprising one or more ASICs having an ASIC layer front side (140a) and an ASIC layer back side (140b); a base plate (160, 260) having a base plate front side (160a) and a base plate back side (160b), and a plurality of micro-electromechanical components (130, 230), wherein the base plate (160, 260) is arranged on the ASIC layer front side (140a) and the base plate back side (160b) is connected to the ASIC layer front side (140a), the method comprising the following steps: a. Providing (310) a MEMS substrate having a structure of the base plate (160, 260) for the micro-electromechanical component (130, 230) and the plurality of MEMS modules (120, 220); b. Providing (320) an ASIC substrate having a structure of the ASIC layer (140) for the plurality of MEMS modules (120, 220); c. manufacturing (330) a coupling substrate by polymerically connecting the MEMS substrate to the ASIC substrate, wherein for each of the plurality of MEMS modules (120, 220), at least one assigned protection frame (195, 295) and a plurality of assigned electrical contact points (144, 244a, 244b, 244c, 244d) are formed between the MEMS substrate and the ASIC substrate, such that for each MEMS module (120, 220), the at least one protection frame (195, 295) assigned to the MEMS module (120, 220) at least partially surrounds the electrical contact points (144, 244a, 244b, 244c, 244d) assigned to the MEMS module (120, 220); d. In order to obtain the plurality of MEMS modules (120, 220), dividing (340) the coupling substrate along a predefined separation line; e. providing (350) the carrier substrate (100, 200); f. placing (360) the plurality of MEMS modules (120) on the substrate surface (100a, 200a) of the carrier substrate (100, 200); and g. polymerically connecting (370) the ASIC layer backside (140b) of the plurality of MEMS modules (120, 220) to the substrate surface (100a, 200a).

10. The method according to claim 9, characterized in that ・Before manufacturing (330) the coupling substrate, testing (315) the structure of the MEMS substrate and / or testing (325) the structure of the ASIC substrate; and / or ・After manufacturing (330) the coupling substrate, testing (345) the MEMS module (120, 220); and / or After the ASIC layer backside (140b) of the plurality of MEMS modules (120, 220) are polymerically connected (370) to the substrate surface (100a, 200a), the manufactured micro-electromechanical device (110, 210) is tested (375).

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