Laser system

Abstract

The invention discloses a laser system, and belongs to the technical field of photoelectricity. The laser system comprises a laser and a circuit board, the laser comprises a bottom plate, a frame body located on the bottom plate, a light-emitting chip located on the bottom plate and surrounded by the frame body, and a conductive structure embedded in the frame body and communicating the interior and exterior of a surrounding area of the frame body, and a first area of the conductive structure is located in the surrounding area of the frame body and electrically connected with the light-emitting chip; the circuit board is provided with a bonding pad connected with the power supply, the laser is located on the circuit board, and the bottom plate is close to the circuit board; the second area of the conductive structure is located outside the surrounding area of the frame body and is electrically connected with the bonding pad. The problem that electric connection between the laser and the circuit board is complex is solved. The invention is used for emitting light.

Description

Laser system

[0001] This application claims priority to Chinese patent application No. 202211732590.8, filed on December 30, 2022, with the invention name “Laser System”, and Chinese patent application No. 202211732527.4, filed on December 30, 2022, with the invention name “Laser System”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of optoelectronic technology, and in particular to a laser system. Background Art

[0003] With the development of optoelectronic technology, lasers are widely used, and the requirements for lasers in all aspects are becoming higher and higher.

[0004] In related art, a laser is electrically connected to a circuit board, which is used to power the laser. The laser includes a baseboard, an enclosure secured to the baseboard, and a light-emitting chip within the enclosure. The baseboard is provided with circuitry connected to the circuit board, and the enclosure contains a conductive structure. The light-emitting chip is connected to the circuitry on the baseboard via the conductive structure within the enclosure. Current is then transmitted to the light-emitting chip via the circuit board, the circuitry, and the conductive structure, causing the chip to emit light.

[0005] However, in the related art, the process of setting up the circuit on the circuit board is relatively complicated, and therefore the process of achieving electrical connection between the laser and the circuit board is relatively complicated.

[0006] Summary of the Invention

[0007] The present application provides a laser system that can solve the problem of the relatively complex process of achieving electrical connection between the laser and the circuit board. The laser system includes: a laser and a circuit board;

[0008] The laser comprises: a base plate, a frame located on the base plate, a light-emitting chip located on the base plate and surrounded by the frame, and a conductive structure embedded in the frame and connected to the inside and outside of an enclosed area of ​​the frame, wherein a first area of ​​the conductive structure is located within the enclosed area of ​​the frame and is electrically connected to the light-emitting chip;

[0009] The circuit board has a solder pad connected to a power source, the laser is located on the circuit board, and the bottom plate is close to the circuit board;

[0010] The second area of ​​the conductive structure is located outside the surrounding area of ​​the frame and is electrically connected to the pad.

[0011] The beneficial effects of the technical solution provided by this application include at least:

[0012] In the laser system provided by the present application, a frame is disposed on a base plate, and a conductive structure is embedded in the frame to connect the inside and outside of the frame's enclosed area. One end of the conductive structure located within the frame's enclosed area is electrically connected to the light-emitting chip, while the other end located outside the frame's enclosed area is electrically connected to a pad on the circuit board, thereby enabling current to be transmitted to the light-emitting chip through the circuit board. Thus, when securing the laser to the circuit board, only the end of the conductive structure located outside the frame's enclosed area needs to be connected to the pad on the circuit board, simplifying the electrical connection between the laser and the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0014] FIG1 is a schematic structural diagram of a laser system provided in the related art;

[0015] FIG2 is a schematic structural diagram of a laser system provided in an embodiment of the present application;

[0016] FIG3 is a schematic structural diagram of another laser system provided in an embodiment of the present application;

[0017] FIG4 is a schematic structural diagram of a laser provided in an embodiment of the present application;

[0018] FIG5 is a schematic structural diagram of another laser provided in an embodiment of the present application;

[0019] FIG6 is a schematic structural diagram of a frame provided in an embodiment of the present application;

[0020] FIG7 is a schematic structural diagram of another laser system provided in an embodiment of the present application;

[0021] FIG8 is a schematic structural diagram of another laser system provided in an embodiment of the present application;

[0022] FIG9 is a schematic structural diagram of another laser provided in an embodiment of the present application;

[0023] FIG10 is a schematic structural diagram of another laser provided in an embodiment of the present application;

[0024] FIG11 is a schematic structural diagram of another laser provided in another embodiment of the present application;

[0025] FIG12 is a schematic structural diagram of a laser system provided in another embodiment of the present application;

[0026] FIG13 is a schematic structural diagram of a conductive structure provided in an embodiment of the present application;

[0027] FIG14 is a schematic structural diagram of a base plate provided in an embodiment of the present application;

[0028] FIG15 is a schematic structural diagram of another laser system provided in another embodiment of the present application;

[0029] FIG16 is a schematic structural diagram of yet another laser system provided in another embodiment of the present application;

[0030] FIG17 is a schematic structural diagram of a laser provided by another embodiment of the present application;

[0031] FIG18 is a schematic structural diagram of a laser system provided in an embodiment of the present application;

[0032] FIG19 is a schematic structural diagram of another laser system provided in an embodiment of the present application;

[0033] FIG20 is a schematic structural diagram of a laser provided in an embodiment of the present application;

[0034] FIG21 is a schematic structural diagram of another laser provided in an embodiment of the present application;

[0035] FIG22 is a schematic structural diagram of another laser provided in an embodiment of the present application;

[0036] FIG23 is a schematic structural diagram of another laser system provided in an embodiment of the present application;

[0037] FIG24 is a schematic structural diagram of another laser provided in an embodiment of the present application;

[0038] FIG25 is a schematic structural diagram of a frame provided in an embodiment of the present application;

[0039] FIG26 is a schematic structural diagram of a laser provided by another embodiment of the present application;

[0040] FIG27 is a schematic structural diagram of a conductive structure provided in an embodiment of the present application;

[0041] FIG28 is a schematic structural diagram of another laser provided by another embodiment of the present application;

[0042] FIG29 is a schematic structural diagram of another laser system provided in an embodiment of the present application;

[0043] FIG30 is a schematic structural diagram of a laser system provided by another embodiment of the present application;

[0044] FIG31 is a schematic structural diagram of another laser system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0045] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0046] With the development of optoelectronic technology, the application of lasers is becoming more and more extensive, and the requirements for the ease of preparation of lasers and the ease of connection with other devices are also getting higher and higher. The laser needs to be connected to a circuit board to transmit current to the laser through the circuit board to stimulate the light-emitting chip in the laser to emit laser light. Figure 1 is a structural schematic diagram of a laser system provided by the relevant technology. As shown in Figure 1, the laser system includes a laser 00 and a circuit board 01, and the laser 00 is located on the circuit board 01. The laser 00 includes: a base plate 001, a packaging shell 002 fixed on the base plate 001, and a light-emitting chip 003 located in the packaging shell 002. The base plate is made of metal, and a circuit layer connected to the circuit board 01 is provided between the base plate 001 and the packaging shell 002 (not shown in the figure), and an insulating layer (not shown in the figure) is also laid between the circuit layer and the base plate 001 and between the circuit layer and the packaging shell 002. A conductive structure (not shown in the figure) is embedded in the packaging shell 002, and the two ends of the conductive structure are respectively connected to the light-emitting chip 003 and the circuit layer on the base plate 001, so that the current can be transmitted to the light-emitting chip 003 through the circuit board 01 and the conductive structure to make the light-emitting chip 003 emit light.

[0047] In this laser 00, the insulating layer and circuit layer need to be set up on the base plate 001. This setting process is relatively complicated, and the preparation process of the laser 00 is relatively complicated. Correspondingly, the process of achieving electrical connection between the laser 00 and the circuit board 01 is relatively complicated. In addition, the conductive structure in the laser 00 must first be accurately electrically connected to the corresponding position in the circuit layer, and then the circuit layer must be accurately electrically connected to the circuit board 01, further increasing the complexity of achieving the electrical connection between the laser 00 and the circuit board 01. The insulating layer may be damaged or the laying quality may be poor in some places. This may cause the conductive structure to be conductive to the base plate 001, or different conductive structures to short-circuit, resulting in a poor electrical connection between the laser 00 and the circuit board 01. Because the circuit layer is located inside the laser 00, if there is a problem with the electrical connection between the laser 00 and the circuit board 01, it is difficult and costly to repair.

[0048] The following embodiments of the present application provide a laser system, in which the preparation process of the laser is relatively simple, the implementation complexity of the electrical connection between the laser and the circuit board is relatively low, and the electrical connection effect between the laser and the circuit board is relatively good.

[0049] FIG2 is a schematic diagram of the structure of a laser system provided in an embodiment of the present application. As shown in FIG2 , the laser system includes a laser 10 and a circuit board 20. The laser 10 is located on the circuit board 20 and can be electrically connected to the circuit board 20. The circuit board 20 is also known as a printed circuit board (PCB).

[0050] The circuit board 20 has a plate-like structure having two opposing, larger surfaces and a plurality of smaller side surfaces connecting the two surfaces. The two surfaces may be parallel. The two surfaces may be a first surface B1 and a second surface B2. A pad H connected to a power source is provided on the surface of the circuit board 20 near the laser 10. The pad H may serve as either a positive or negative electrode for supplying power to the laser 10.

[0051] In this embodiment, the laser 10 includes: a base plate 101, a frame 102 located on the base plate 101, a light-emitting chip 103 located on the base plate 101 and surrounded by the frame 102, and a conductive structure 104 embedded in the frame 102 and connected to the inside and outside of the enclosed area of ​​the frame 102. The first area of ​​the conductive structure 104 is located within the enclosed area of ​​the frame 102 and is electrically connected to the light-emitting chip 103. The circuit board 20 has a solder pad H connected to a power source. The laser 10 is located on the circuit board 20, and the base plate 101 is close to the circuit board 20. The second area of ​​the conductive structure 104 is located outside the enclosed area of ​​the frame 102 and is electrically connected to the solder pad H.

[0052] The base plate 101 is roughly a plate-shaped structure, and the frame 102 and the light-emitting chip 103 are located on a surface of the base plate 101. The frame 102 is a frame-shaped structure, and the frame-shaped structure has two opposite annular end surfaces at both ends in the axial direction (such as the z direction), and also has an inner wall and an outer wall connecting the two end surfaces. An end surface of the frame 102 in the axial direction is fixed to the surface of the base plate 101, and the frame 102 and the base plate 101 enclose a groove, which is also an accommodating space for accommodating the light-emitting chip 103 and other components. The base plate 101 in the laser 10 is close to the circuit board 20, and the laser 10 is fixed to the circuit board 20 using the base plate 101.

[0053] In the laser system 10 provided in the present application, a frame 102 is disposed on a base plate 101, and a conductive structure 104 is embedded in the frame 102 to connect the inside and outside of the enclosed area of ​​the frame 102; one end of the conductive structure 104 located within the enclosed area of ​​the frame 102 is electrically connected to the light-emitting chip 103, and the other end located outside the enclosed area of ​​the frame 102 is electrically connected to the solder pad H on the circuit board 20, thereby enabling current to be transmitted to the light-emitting chip 103 through the circuit board 20. In this way, when fixing the laser 10 to the circuit board 20, it is only necessary to connect the end of the conductive structure 104 located outside the enclosed area of ​​the frame 102 to the solder pad H on the circuit board 20, thereby simplifying the electrical connection method between the laser 10 and the circuit board 20.

[0054] In the embodiments of the present application, two methods for achieving electrical connection between the conductive structure 104 and the pad H are provided. In the first implementation, the pad H on the circuit board 20 can be located outside the coverage area of ​​the laser 10, which can refer to the orthographic projection area of ​​the laser 10 on the circuit board 20, and the conductive structure 104 and the pad H are indirectly electrically connected. In the second implementation, at least a portion of the pad H on the circuit board 20 can be located within the coverage area of ​​the laser 10, which can refer to the orthographic projection area of ​​the laser 10 on the circuit board 20, and the conductive structure 104 and the pad H are directly electrically connected. The above two implementations are described below.

[0055] The first implementation method:

[0056] FIG3 is a schematic diagram of the structure of another laser system provided in an embodiment of the present application. FIG3 may be a top view of the laser system shown in FIG2 , and FIG2 may be a schematic diagram of the cross section a-a′ of the laser system shown in FIG3 .

[0057] In this embodiment, the laser system further includes a soldering piece 30 , which is located outside the surrounding area of ​​the frame 102 . The second area of ​​the conductive structure 104 is electrically connected to the soldering pad H through the soldering piece 30 .

[0058] In this way, the light emitting chip 103 and the solder pad H can be electrically connected through the conductive structure 104 and the solder tab 30 , and thus current can be transmitted to the light emitting chip 103 to excite the light emitting chip 103 to emit laser light.

[0059] In the laser system of the embodiment of the present application, the frame 102 of the laser 10 is located on the base plate 101, and the light-emitting chip 103 is located on the base plate 101 and surrounded by the frame 102. This is equivalent to eliminating the bottom of the package shell in the related art, so the thickness of the laser 10 can be smaller, which is conducive to the miniaturization of the laser 10. The light-emitting chip 103 in the laser 10 can be directly connected to the circuit board 20 through the conductive structure 104 and the soldering piece 30. There is no need to set an insulating layer and a circuit layer on the base plate 101, and the preparation of the laser 10 is relatively simple. When electrically connecting the laser 10 to the circuit board 20, it is only necessary to fix the soldering piece 30 between the conductive structure 104 of the laser 10 and the soldering pad H in the circuit board 20. This connection method is relatively simple. If there is a problem with the electrical connection between the laser 10 and the circuit board 20, it can be repaired by re-fixing the soldering piece 30. The repair difficulty is low and the cost is also low.

[0060] In summary, in the laser system provided by the embodiments of the present application, a frame is disposed on a base plate, and a conductive structure is embedded in the frame to connect the inside and outside of the frame's enclosed area; one end of the conductive structure located within the frame's enclosed area is electrically connected to the light-emitting chip, and the other end located outside the frame's enclosed area is electrically connected to the pad on the circuit board via a solder tab, thereby enabling current to be transmitted to the light-emitting chip via the circuit board and the solder tab. In this way, when securing the laser to the circuit board, it is only necessary to provide a solder tab between the end of the conductive structure located outside the frame's enclosed area and the pad on the circuit board, thereby simplifying the electrical connection method between the laser and the circuit board.

[0061] In the embodiment of the present application, the number of light-emitting chips 103 in the laser 10 can be one or more. Figures 2 and 3 take the example of the laser 10 including 6 light-emitting chips 103 arranged in two rows and three columns, with the row direction being the x direction and the column direction being the y direction. The number and arrangement of the light-emitting chips 103 can also be arbitrarily designed, and are not limited in the embodiment of the present application. The number of conductive structures 104 is multiple, and different conductive structures 104 are spaced apart from each other. The number of soldering pads 30 is the same as the number of conductive structures 104, and each conductive structure 104 corresponds to a soldering pad 30, and each conductive structure 104 is electrically connected to a soldering pad H on the circuit board 20 through the corresponding soldering pad 30. The number of soldering pads H in the circuit board 20 is also the same as the number of conductive structures 104.

[0062] The number of conductive structures 104 is related to the number and connection method of the light-emitting chips 103. Each light-emitting chip 103 is electrically connected to two conductive structures 104, and the two conductive structures 104 are connected to the positive and negative poles of the power supply via solder tabs 30 and solder pads H, respectively. If each row of light-emitting chips 103 is connected in series and two conductive structures 104 are required at each end, the number of conductive structures 104 can be twice the number of rows of light-emitting chips 103, and each conductive structure 104 can be located on either side of the light-emitting chip 103 in the row direction. In the laser system shown in Figure 3, the laser 10 includes four conductive structures 104, the laser system includes four solder tabs 30, and the circuit board 20 has four solder pads H corresponding to the four conductive structures 104. The four conductive structures 104 and the four solder pads H are respectively connected via four solder tabs 30.

[0063] In the embodiment of the present application, a conductive structure 104 and its corresponding soldering piece 30 and soldering pad H in the laser 10 are mainly introduced. Other conductive structures 104, soldering pieces 30 and soldering pads H can refer to the introduction, and the embodiment of the present application will not be described in detail.

[0064] The frame 102 in the laser 10 can be surrounded by multiple sidewalls. For example, the frame 102 in the embodiment of the present application is rectangular and surrounded by four sidewalls. Each conductive structure 104 is embedded in a sidewall of the frame 102. In the embodiment of the present application, the multiple conductive structures 104 of the laser 10 are embedded in two opposite sidewalls of the frame 102 as an example. The laser 10 in the embodiment of the present application can have various optional structures. Two optional structures of the laser 10 are described below.

[0065] In the first optional structure, Figure 4 is a structural schematic diagram of a laser provided in an embodiment of the present application, and Figure 5 is a structural schematic diagram of another laser provided in an embodiment of the present application. Figure 5 may be a left view of the laser shown in Figure 4. Figures 4 and 5 illustrate the laser 10 in the laser system shown in Figures 2 and 3. Figure 6 is a structural schematic diagram of a frame provided in an embodiment of the present application, and the frame may be the frame 102 of the laser 10 shown in Figures 4 and 5. Referring to Figures 2 to 6, the outer wall of the frame 102 is flat, and the second area of ​​the conductive structure 104 is located on the outer wall of the frame 102. The end surface M2 of the second area of ​​the conductive structure 104 may be flush with the outer wall of the frame 102. Optionally, the second area of ​​the conductive structure 104 may also protrude relative to the outer wall of the frame 102, but this application does not illustrate this method.

[0066] In the second optional structure, Figure 7 is a schematic structural diagram of another laser system provided in an embodiment of the present application, and Figure 8 is a schematic structural diagram of another laser system provided in an embodiment of the present application. Figure 8 may be a top view of the laser system shown in Figure 7, and Figure 7 may be a schematic diagram of the cross section a-a' of the laser system shown in Figure 8. Figure 9 is a schematic structural diagram of another laser provided in an embodiment of the present application, and Figure 10 is a schematic structural diagram of another laser provided in an embodiment of the present application, and Figure 10 may be a left view of the laser shown in Figure 9. Figures 9 and 10 show the laser 10 in the laser system shown in Figures 7 and 8. Figure 11 is a schematic structural diagram of another frame provided in an embodiment of the present application, and the frame may be the frame 102 of the laser 10 shown in Figures 9 and 10.

[0067] Please refer to Figures 7 to 11. The outer wall of the frame 102 has a first boss T1 at one end close to the base plate 101. The portion of the conductive structure 104 outside the enclosed area close to the frame 102 is embedded in the first boss T1, and the second area of ​​the conductive structure 104 is located on the first boss T1. For example, the first boss T1 is prismatic, and the surface of the first boss T1 close to the base plate 101 is called the bottom surface of the first boss T1, the surface opposite to the bottom surface is called the top surface of the first boss T1, and the other surfaces are called the side surfaces of the first boss T1. The second area of ​​the conductive structure 104 can be located on the side surface of the first boss T1, such as on the side surface of the first boss T1 away from the enclosed area of ​​the frame 102. Optionally, Figure 12 is a structural schematic diagram of a laser system provided by another embodiment of the present application. As shown in Figure 12, the second area of ​​the conductive structure 104 can also be located on the top surface of the first boss T1.

[0068] This embodiment of the present application uses the example of the end surface M2 of the second region of the conductive structure 104 being flush with the surface on which it resides within the first boss T1. As shown in Figure 7 , the end surface M2 of the second region of the conductive structure 104 is flush with the side surface of the first boss T1 that is away from the surrounding area of ​​the frame 102. As shown in Figure 12 , the end surface M2 of the second region of the conductive structure 104 is flush with the top surface of the first boss T1. Alternatively, the end surface M2 of the second region of the conductive structure 104 may protrude relative to the surface on which it resides within the first boss T1.

[0069] Continuing with Figures 7 to 12 , each conductive structure 104 in the laser 10 may correspond to a first boss T1 within the frame 102. The area of ​​each first boss T1 may be slightly larger than the area of ​​the end surface M2 of the second region of the corresponding conductive structure 104. The outer wall of the frame 102, in which the multiple conductive structures 104 are embedded, may have multiple, spaced-apart first bosses T1 corresponding one-to-one to the multiple conductive structures 104. The portion of each conductive structure 104 outside the enclosed region of the frame 102 is embedded within the corresponding first boss T1, and the second region of each conductive structure 104 is located on the corresponding first boss T1.

[0070] Optionally, the outer wall of the sidewall of the frame 102 in which the conductive structure 104 is embedded may have only one strip-shaped first protrusion T1. The length of the first protrusion T1 may be equal to the length of the sidewall, and the first protrusion T1 may cover the entire area of ​​the sidewall near the end of the base plate 101. When multiple conductive structures 104 are embedded in the sidewall, the portions of the multiple conductive structures 104 outside the enclosed area near the frame 102 are all embedded in the same first protrusion T1. The second regions of the multiple conductive structures 104 are all located on the first protrusion T1, and the second regions of the various conductive structures 104 are spaced apart from each other.

[0071] In the second structure of the laser 10, the second region of the conductive structure 104 is located farther from the base plate 101. This reduces the risk of solder overflowing onto the base plate 101 when soldering the second region of the conductive structure 104 to the solder tab 30, thereby reducing the risk of misconnection between the conductive structure 104 and the base plate 101. Since the solder pads H on the circuit board 101 are located outside the coverage area of ​​the laser 10, the distance between the solder pads H and the base plate 101 can also be greater, thereby reducing the risk of solder overflowing onto the base plate 101 when soldering the solder tab 30 to the solder pads H, thereby reducing the risk of misconnection.

[0072] Continuing with reference to FIG. 2 to FIG. 12 , the inner wall of the frame 102 may have a second boss T2, such as the inner wall of the side wall where each conductive structure 104 is located may have a second boss T2. The second boss T2 may be located at one end of the inner wall of the frame 102 close to the base plate 101. The portion of the conductive structure 104 within the enclosed area close to the frame 102 is embedded in the second boss T2. The first region of the conductive structure 104 is located on the surface of the second boss T2 away from the base plate 101, which makes it easier to set the wire X on the first region. For example, the end surface M1 of the first region of the conductive structure 104 may be flush with the surface of the second boss T2 away from the base plate 101, or it may protrude relative to the surface of the second boss T2 away from the base plate 101.

[0073] As shown in Figures 2 to 12, the second boss T2 on each side wall of the frame 102 in which the conductive structure 104 is embedded can be strip-shaped, the length of the second boss T2 can be equal to the length of the side wall, and the second boss T2 covers the entire area of ​​the side wall at one end close to the base plate 101. The side wall in which the conductive structure 104 is embedded in the laser 10 of Figures 2 to 6 can be L-shaped, and the side wall in which the conductive structure 104 is embedded in the laser 10 of Figures 7 to 12 can be roughly T-shaped. Optionally, the side wall in which multiple conductive structures 104 are embedded can also have multiple second bosses T2 spaced apart from each other, each conductive structure 104 is embedded in a corresponding second boss T2, and the first area of ​​each conductive structure 104 is located on the corresponding second boss T2.

[0074] FIG13 is a schematic diagram of a conductive structure provided in an embodiment of the present application. As shown in FIG13 , the conductive structure 104 may include a first region 1041, a second region 1042, and a middle portion 1043 located between the first region 1041 and the second region 1042. The end surface M1 of the first region 1041 is exposed within the enclosed area of ​​the frame 102 and is used for electrical connection to the light-emitting chip 103. The end surface M2 of the second region 1043 is exposed outside the enclosed area of ​​the frame 102 and is used for electrical connection to the solder tab 30. The dimensions of the first region 1041 and the second region 1042 may be slightly larger than the dimensions of the middle portion 1043 to facilitate connection to the light-emitting chip 103 and the solder tab 30.

[0075] In an embodiment of the present application, the material of the frame 102 may be an insulating material, such as the material of the frame 102 may include ceramic. The material of the conductive structure 104 may include metal, such as the material of the conductive structure 104 may include tungsten. The frame 102 may be prepared using a ceramic printing process, and a metal material (such as tungsten) may be pre-placed during the ceramic printing process, so that after the ceramic printing structure is formed, an integrated frame 102 and conductive structure 104 are obtained. The thickness and number of layers of the metal material during the printing process can be designed according to the size of the current required to pass through the conductive structure 104. Alternatively, an independent conductive structure 104 may be prepared first, and then ceramic printing may be performed outside the conductive structure 104 to prepare the frame 102, so that the conductive structure 104 can be embedded in the frame 102 during the preparation of the frame 102.

[0076] After the frame 102 and the conductive structure 104 are prepared, the frame 102 and the base plate 101 can be soldered together. For example, a soldering material can be placed between the end surface of the frame 102 and the base plate 101, and then the solder can be melted to fix the frame 102 and the base plate 101. Optionally, the soldering material can be a metal solder such as tin, silver, and copper.

[0077] FIG14 is a schematic diagram of the structure of a base plate provided in an embodiment of the present application. As shown in FIG14 , the base plate 101 may have a first area D1 and a second area D2 surrounding the first area D1. The first area D1 is used for mounting components such as the light-emitting chip 103, and the second area D2 is used for fixing to the frame 102. The first area D1 may be raised relative to the second area D2, so the strength of the first area D1 may be higher, which is conducive to ensuring a higher flatness of the first area D1 and ensuring a better mounting effect of the light-emitting chip 103. Optionally, the material of the base plate 101 in the laser 10 may include metal, such as if the material of the base plate 101 includes copper, the material of the base plate 101 may be oxygen-free copper.

[0078] A certain safety distance can be reserved between the conductive structure 104 and the upper and lower ends of the frame 102 to prevent the conductive structure 104 from misconnecting with the base plate 101 at the bottom, and to prevent the conductive structure 104 from affecting the fixation of the frame 102 and other components at the top. For example, the side of the frame 102 away from the base plate 101 needs to be fixed to a component with a thermal expansion coefficient that is relatively close to the frame 102. However, the thermal expansion coefficient of the conductive structure 104 is significantly different from that of the frame 102. Therefore, the conductive structure 104 is kept farther away from the component fixed above the frame 102. This can prevent the conductive structure 104 from affecting the fixation effect when fixing the component, thereby ensuring the reliability of the manufacturing of the laser 100.

[0079] For example, the minimum spacing between the conductive structure 104 and the base plate 101 is greater than or equal to 0.5 mm, and / or the minimum spacing between the conductive structure 104 and the surface of the frame 102 away from the base plate 101 is greater than or equal to 0.5 mm. The minimum spacing between the conductive structure 104 and another component refers to the minimum value of the spacing between each position in the conductive structure 104 and the component. The spacing between each position in the conductive structure 104 and the metal base plate 101 is greater than or equal to 0.5 mm, and the spacing between each position and the surface of the frame 102 away from the metal base plate 101 is also greater than or equal to 0.5 mm. As shown in Figures 2 and 7, the minimum distance between the conductive structure 104 and the base plate 101 is the distance d1 in the direction perpendicular to the base plate 101 (such as the z direction). d1 can also be said to be the distance between the conductive structure 104 and the end surface of the frame 102 close to the base plate 101; the minimum distance between the conductive structure 104 and the surface of the frame 102 away from the base plate 101 is the distance d2 in the z direction. Both d1 and d2 are greater than or equal to 0.5 mm.

[0080] In the embodiment of the present application, the soldering tab 30 in the laser system can be a bent structure. The soldering tab 30 can have one bent portion or multiple bent portions. The shape of the soldering tab 30 can also be designed accordingly based on the different conductive structures 104.

[0081] In one optional embodiment, as shown in Figures 2, 3, 7, 8, and 12, the soldering tab 30 may have a bend, and the soldering tab 30 may be roughly L-shaped, including a first connecting portion L1 and a second connecting portion L2 that are interconnected and both have plate-like shapes. The plate surface of the first connecting portion L1 and the plate surface of the second connecting portion L2 may be perpendicular to each other, such as the plate surface of the first connecting portion L1 being parallel to the plate surface of the base plate 101, and the plate surface of the second connecting portion L2 being perpendicular to the plate surface of the base plate 101. Optionally, the angle between the plate surface of the first connecting portion L1 and the plate surface of the second connecting portion L2 may also be an acute angle or an obtuse angle, which is not limited in the present embodiment.

[0082] The first connection portion L1 is connected to the conductive structure 104, and the second connection portion L2 is connected to the solder pad H. The end of the first connection portion L1 away from the second connection portion L2 is fixed to the second region of the conductive structure 104, while the end of the second connection portion L2 away from the first connection portion L1 is fixed to the solder pad H. As shown in Figures 2, 3, 7, and 8, the end surface of the first connection portion L1 away from the second connection portion L2 is connected and fixed to the end surface M2 of the second region of the conductive structure 104. As shown in Figure 12, the end of the second connection portion L1 on the surface near the base plate 101 away from the second connection portion L2 is connected and fixed to the end surface M2 of the second region of the conductive structure 104.

[0083] For example, conductive solder can be disposed between the first connection portion L1 and the second region of the conductive structure 104 to achieve fixation and electrical connection. Conductive solder can also be disposed between the second connection portion L2 and the pad H to achieve fixation and electrical connection. When solder is disposed between the conductive structure 104 and the first connection portion L1, it can be disposed on the side of the first connection portion L1 away from the base plate 101. This allows the first connection portion L1 to block the solder to a certain extent, preventing the solder from overflowing onto the base plate 101 and causing miscommunication between the conductive structure 104 and the base plate 101.

[0084] In another alternative embodiment, Figure 15 is a schematic diagram of the structure of another laser system provided in another embodiment of the present application. As shown in Figure 15, based on the laser shown in Figure 12, the welding tab 30 in the laser system can have two bends and can be roughly U-shaped.

[0085] In another alternative embodiment, Figure 16 is a schematic structural diagram of another laser system provided in another embodiment of the present application. As shown in Figure 16, the welding piece 30 in the laser system can also be arc-shaped.

[0086] In the drawings of the embodiments of the present application, the area of ​​the surface of the soldering piece 30 fixed to the soldering pad H is equal to the area of ​​the soldering pad H. Optionally, the area of ​​the surface of the soldering piece 30 fixed to the soldering pad H may be larger or smaller than the area of ​​the soldering pad H, and the embodiments of the present application are not limited thereto.

[0087] Please continue to refer to the laser 10 in Figures 2 to 16. The laser 10 may also include a heat sink 105 and a reflective prism 106. Each light-emitting chip 103 corresponds to a heat sink 105 and a reflective prism 107. The heat sink 105 is located on the base plate 101, and the light-emitting chip 103 is located on the surface of the heat sink 105 away from the base plate 101. The heat sink 105 is used to assist the light-emitting chip 103 in dissipating heat. The material of the heat sink 105 may include ceramic. The reflective prism 106 is located on the light-emitting side of the corresponding light-emitting chip 103. The laser emitted by the light-emitting chip 103 can be directed to the corresponding reflective prism 106. The reflective prism 106 can reflect the received laser in a direction away from the base plate 101, so that the laser is emitted out of the accommodation space enclosed by the base plate 101 and the frame 102.

[0088] FIG17 is a schematic structural diagram of a laser provided in another embodiment of the present application. As shown in FIG17 , based on the laser 10 shown in FIG2 , the laser 10 may further include a light-transmitting sealing component 107. The light-transmitting sealing component 107 may be in the shape of a plate. The light-transmitting sealing component 107 is located on the side of the frame 102 away from the base plate 101 and is used to seal the accommodation space enclosed by the frame 102 and the base plate 101 to prevent external pollutants such as water and oxygen from damaging the light-emitting chip 103. The edge area of ​​the surface of the light-transmitting sealing component 107 close to the base plate 101 is fixed to the surface of the frame 102 away from the base plate 101. For example, the edge area of ​​the light-transmitting sealing component 107 may be pre-set with solder. The light-transmitting sealing component 107 may be placed on the side of the frame 102 away from the base plate 101, and the solder is in contact with the surface of the frame 102 away from the base plate 101. Then, the frame 102 and the light-transmitting sealing component 107 are placed together in a high-temperature furnace to melt the solder and then weld the frame 102 and the light-transmitting sealing component 107 together.

[0089] Continuing with FIG17 , the laser 10 may further include a collimator lens assembly 108 located on a side of the light-transmitting sealing member 107 away from the base plate 101. The collimator lens assembly 108 may include a plurality of collimator lenses corresponding to each light-emitting chip 103. Laser light emitted by each light-emitting chip 103 is reflected by the corresponding reflective prism 106 and then directed toward the corresponding collimator lens. The collimator lens collimates the received laser light and then emits it, making the laser light nearly parallel.

[0090] In summary, in the laser system provided by the embodiments of the present application, a frame is disposed on a base plate, and a conductive structure is embedded in the frame to connect the inside and outside of the frame's enclosed area; one end of the conductive structure located within the frame's enclosed area is electrically connected to the light-emitting chip, and the other end located outside the frame's enclosed area is electrically connected to the pad on the circuit board via a solder tab, thereby enabling current to be transmitted to the light-emitting chip via the circuit board and the solder tab. In this way, when securing the laser to the circuit board, it is only necessary to provide a solder tab between the end of the conductive structure located outside the frame's enclosed area and the pad on the circuit board, thereby simplifying the electrical connection method between the laser and the circuit board.

[0091] The second implementation method:

[0092] Figure 18 is a schematic diagram of the structure of a laser system provided in an embodiment of the present application, and Figure 19 is a schematic diagram of the structure of another laser system provided in an embodiment of the present application. Figure 19 is an exploded view of the laser system shown in Figure 18, which may be a schematic cross-sectional view of the laser system shown in Figure 19. Figure 20 is a schematic diagram of the structure of a laser provided in an embodiment of the present application, and Figure 20 shows a view of the side of the laser 10 located on the first surface B1. In conjunction with Figures 18 to 20, in this embodiment, the end surface of the frame located at one axial end is flush with the first surface of the base plate, which is the side of the base plate closest to the circuit board. The second region of the conductive structure is at least partially located on the end surface of the frame. The edge of the first surface of the base plate near the frame has a clearance groove, which is used to separate the first surface and the second region of the conductive structure. The second region of the conductive structure covers the solder pad and is electrically connected to the solder pad.

[0093] In the laser system of the present embodiment, the inner wall of the frame 102 of the laser 10 is fixed to the side of the base plate 101, and the light-emitting chip 103 is located on the second surface B2 of the base plate 101 and surrounded by the frame 102. This is equivalent to eliminating the bottom of the package shell in the related art, so the thickness of the laser 10 can be reduced, which facilitates the miniaturization of the laser 10. The light-emitting chip 103 in the laser 10 can be directly connected to the circuit board 20 via the conductive structure 104, eliminating the need for an insulating layer or circuit layer on the base plate 101, making the laser 10 relatively simple to manufacture. When electrically connecting the laser 10 to the circuit board 20, only the conductive structure 104 of the laser 10 needs to be fixed to the solder pad H on the circuit board 20, making this connection method relatively simple. Because the conductive structure 104 extends outside the laser 10, any problems with the electrical connection between the laser 10 and the circuit board 20 can be easily repaired, making maintenance easier and less expensive.

[0094] In summary, in the laser system provided by the embodiment of the present application, the inner wall of the frame is fixed to the side of the base plate, and the end face of the frame in the axial direction is flush with the first plate surface of the base plate. The conductive structure is embedded in the frame, the first region of the conductive structure is located within the enclosed area of ​​the frame and is electrically connected to the light-emitting chip, and the second region is located on the end face of the frame. The second region can directly cover the solder pad in the circuit board and be electrically connected to the solder pad, thereby transmitting current to the light-emitting chip through the circuit board and the conductive structure. In this way, when electrically connecting the laser to the circuit board, it is only necessary to directly fix and electrically connect the second region of the conductive structure in the laser to the solder pad, which can simplify the electrical connection method between the laser and the circuit board.

[0095] In addition, an air avoidance groove is provided in the edge of the first surface of the base plate near the frame, which can prevent the solder from flowing from the second area of ​​the conductive structure and the solder pad to the base plate, thereby avoiding misconduct between the conductive structure and the base plate, and further avoiding the influence of the misconduct on the luminous effect of the light-emitting chip.

[0096] In the embodiment of the present application, the number of light-emitting chips 103 in the laser 10 can be one or more. Figures 18 and 19 take the laser 10 as an example, in which the laser 10 includes six light-emitting chips 103 arranged in two rows and three columns, with the row direction being the x direction and the column direction being the y direction. The number and arrangement of the light-emitting chips 103 can also be arbitrarily designed and are not limited in the embodiment of the present application. The number of conductive structures 104 is multiple, and different conductive structures 104 are spaced apart from each other. Each conductive structure 104 is electrically connected to a pad H on the circuit board 20. The number of pads H in the circuit board 20 can be the same as the number of conductive structures 104.

[0097] The number of conductive structures 104 is related to the number and connection method of the light-emitting chips 103. Each light-emitting chip 103 is electrically connected to two conductive structures 104. These two conductive structures 104 and the soldering pads H are connected to the positive and negative poles of the power supply, respectively. If each row of light-emitting chips 103 is connected in series and requires two conductive structures 104 at each end, the number of conductive structures 104 can be twice the number of rows of light-emitting chips 103. Each conductive structure 104 can be located on either side of the light-emitting chip 103 in the row direction. In the laser system shown in Figure 19, the laser 10 includes four conductive structures 104, and the circuit board 20 has four soldering pads H corresponding to each of the four conductive structures 104. The four conductive structures 104 are connected to the four soldering pads H.

[0098] In the embodiment of the present application, the main focus is on one conductive structure 104 and its corresponding pad H in the laser 10. The other conductive structures 104 and pads H can refer to the introduction, and the embodiment of the present application will not be described in detail. The frame 102 in the laser 10 can be surrounded by multiple side walls. For example, the frame 102 in the embodiment of the present application is rectangular and surrounded by four side walls. Each conductive structure 104 is embedded in a side wall of the frame 102. In the embodiment of the present application, the multiple conductive structures 104 of the laser 10 are respectively embedded in two opposite side walls of the frame 102 as an example.

[0099] In the embodiment of the present application, the air-avoiding groove C on the bottom plate 101 may have a variety of optional structures, and two of the optional structures are described below as examples.

[0100] In the first optional structure of the air-avoidance grooves C, please continue to refer to Figures 18 to 20. The edge of the first surface B1 of the base plate 101 in the laser 10 near the frame 102 has multiple air-avoidance grooves C spaced apart from each other. These multiple air-avoidance grooves C correspond one-to-one with the multiple conductive structures 104 in the laser 10. Each air-avoidance groove C is located near the second region of the corresponding conductive structure 104 and is used to separate the second region of the conductive structure 104 from the first surface B1 of the base plate 101. The arrangement direction of each air-avoidance groove C and the second region of the corresponding conductive structure 104 can be parallel to the arrangement direction of the base plate 101 and the sidewall where the conductive structure 104 is located.

[0101] Optionally, the width of the avoidance groove C in a direction parallel to the wall of the frame 102 can be greater than or equal to the width of the corresponding second region of the conductive structure 104. As shown in FIG20 , in the y-direction, the width of the avoidance groove C can be greater than the width of the corresponding second region of the conductive structure 104. This ensures that any conductive solder overflowing from the second region is contained within the avoidance groove C.

[0102] The air-avoiding groove C can be semicircular or rectangular. The shape of the air-avoiding groove C described in the embodiment of the present application refers to the shape of the opening of the air-avoiding groove C. The air-avoiding groove C has an opening and a bottom. The opening is the portion of the air-avoiding groove C away from the second plate surface B2 of the bottom plate 101, and the bottom is the portion of the air-avoiding groove C close to the second plate surface B2. When the air-avoiding groove C is semicircular, when the bottom plate 101 is subjected to force, the stress on the area around the air-avoiding groove C can be distributed more evenly, ensuring that the strength of the bottom plate 101 is high. Optionally, the air-avoiding groove C can also be in other shapes, such as a pentagon or a hexagon, etc., which is not limited in the embodiment of the present application.

[0103] In the embodiment of the present application, the air-avoiding groove C is taken as an example, having a flat bottom opposite to the opening, and the bottom has the same shape and size as the opening. For example, the bottom of the air-avoiding groove C and the opening are congruent semicircular. Alternatively, the bottom of the air-avoiding groove C may not be flat, but may be concave-convex or tapered.

[0104] In a second optional structure for the air gap C, Figure 21 is a schematic diagram of another laser structure provided in an embodiment of the present application. As shown in Figure 21, a strip-shaped air gap C is provided between each sidewall of the frame 102 where a conductive structure 104 is embedded and the first surface B1 of the bottom plate 101. The air gap C is used to separate all conductive structures 104 embedded in the sidewall from the first surface B1 of the bottom plate 101.

[0105] Optionally, the length of the air-avoidance groove C can be equal to the length of the sidewall. Furthermore, the length of the air-avoidance groove C can be greater than or equal to the maximum distance between the second regions of the two most distant conductive structures 104 in the sidewall. This simplifies the preparation process for the air-avoidance groove C and maximizes the strength of the base plate 101 while ensuring that all conductive structures 104 are isolated from the first plate surface B1.

[0106] Alternatively, the first plate surface B1 of the bottom plate 101 may have an annular air-avoiding groove C to isolate the first end surfaces of all side walls from the first plate surface B1 . This embodiment of the present application does not illustrate this method.

[0107] Since the strength of the position where the air-avoiding groove C is set on the bottom plate 101 will be weakened to a certain extent, in order to ensure the reliability of the bottom plate 101, the thickness of the bottom plate 101 where the air-avoiding groove C is located in the embodiment of the present application can be greater than or equal to 1 mm.

[0108] In the embodiment of the present application, insulating materials such as insulating paint may be filled in the air-avoiding groove C. This can further ensure a better spacing effect between the second area of ​​the conductive structure 104 and the first surface of the bottom plate 101 .

[0109] Continuing with Figures 18 to 21 , in the embodiment of the present application, the end surface M2 of the second region of the conductive structure 104 can be flush with the first end surface of the frame 102. The solder pads H on the circuit board 20 can also be flush with the surface of the circuit board 20. In this way, the second region of the conductive structure 104 can be directly aligned with the corresponding solder pads H and secured by soldering.

[0110] In another optional implementation, FIG22 is a schematic diagram of the structure of another laser provided in an embodiment of the present application, and FIG23 is a schematic diagram of the structure of another laser system provided in an embodiment of the present application. The laser system shown in FIG23 may include the laser 10 shown in FIG22. As shown in FIG22 and FIG23, the second region of the conductive structure 104 may protrude relative to the first end face of the frame 102. The circuit board 20 has a groove (not shown) where the pad H is located, and the pad H may be located in the groove. When fixing the laser 10 and the circuit board 20, the second region of the conductive structure 104 can be inserted into the groove where the pad H is located to be fixed and electrically connected to the pad H. In this manner, alignment of the conductive structure 104 with the pad H is relatively simple, and the distance between the second region of the conductive structure 104 and the first surface B1 of the base plate 101 is further increased, which can further reduce misdirection of the conductive structure 104 and the base plate 101.

[0111] The bottom plate 101 of the laser 10 in the embodiment of the present application has four sides. The laser 10 can have a variety of optional structures, and different optional structures can have different fixing methods for the bottom plate 101 and the frame 102. Two optional structures of the laser 10 are introduced below.

[0112] In a first optional structure, the inner walls of some side walls in the frame 102 are fixed to some side surfaces of the base plate 101. Figure 24 is a structural schematic diagram of another laser provided in an embodiment of the present application, and Figure 24 is a view of the side where the second plate surface B2 of the base plate 101 of the laser 10 is located. Figure 25 is a structural schematic diagram of a frame provided in an embodiment of the present application, and the frame may be the frame 102 in the laser 10 shown in Figures 18 to 24. In conjunction with Figures 18 to 24, the inner walls of two opposite side walls of the four side walls of the frame 102 are fixed to two opposite side surfaces of the four side surfaces of the base plate 101, and the two side walls are side walls embedded with the conductive structure 104. The first end surface of the frame 102 that is flush with the first plate surface B1 of the base plate 101 includes: the surface of the two side walls that is axially away from the second end surface of the frame 102. The other two side walls of the four side walls are located on the second plate surface B2 of the bottom plate 101 , and surfaces of the other two side walls away from the second end surface of the frame body 102 in the axial direction of the frame body 102 are fixed to the second plate surface B2 .

[0113] In a second optional structure, the inner walls of each side wall of the frame 102 are fixed to each side surface of the base plate 101 in a one-to-one correspondence, and the frame 102 surrounds the base plate 101. Figure 26 is a schematic structural diagram of a laser provided by another embodiment of the present application. Figure 26 is a view of the side of the base plate 101 of the laser 10 where the second plate surface B2 is located. As shown in Figure 26, the inner walls of the four side walls of the frame 102 are respectively fixed to the four side surfaces of the base plate 101, and the first end surface of the frame 102 that is flush with the first plate surface B1 of the base plate 101 includes: the surface of the four side walls that is axially away from the second end surface of the frame 102.

[0114] Continuing with reference to Figures 18 to 26, the inner wall of the frame 102 may have a third boss T, such as the inner wall of the side wall where each conductive structure 104 is located may have a third boss T. The third boss T may be located in the inner wall of the frame 102, close to the second plate surface B2 of the base plate 101. The portion of the conductive structure 104 within the enclosed area close to the frame 102 is embedded in the third boss T. The first area of ​​the conductive structure 104 is located on the surface of the third boss T away from the base plate 101, which makes it easy to set the wire X on the first area. For example, the end surface M1 of the first area of ​​the conductive structure 104 may be flush with the surface of the third boss T away from the base plate 101, or it may protrude relative to the surface of the third boss T away from the base plate 101.

[0115] As shown in Figures 18 to 26, the third boss T on each sidewall of the frame 102 in which the conductive structure 104 is embedded can be strip-shaped, and the length of the third boss T can be equal to the length of the sidewall, and the third boss T covers the entire position of the sidewall near the base plate 101. Optionally, the sidewall in which multiple conductive structures 104 are embedded can also have multiple third bosses T spaced apart from each other, with each conductive structure 104 embedded in a corresponding third boss T, and the first region of each conductive structure 104 located on the corresponding third boss T.

[0116] FIG27 is a schematic diagram of a conductive structure provided in an embodiment of the present application. As shown in FIG27 , the conductive structure 104 may include a first region 1041, a second region 1042, and a middle portion 1043 located between the first region 1041 and the second region 1042. The end surface M1 of the first region 1041 is exposed within the enclosed area of ​​the frame 102 and is used for electrical connection to the light-emitting chip 103. The end surface M2 of the second region 1042 is exposed outside the enclosed area of ​​the frame 102 and is used for electrical connection to the solder pad H on the circuit board 20. The dimensions of the first region 1041 and the second region 1042 may be slightly larger than the dimensions of the middle portion 1043 to facilitate connection to the light-emitting chip 103 and the solder pad H.

[0117] In an embodiment of the present application, the material of the frame 102 may be an insulating material, such as the material of the frame 102 may include ceramic. The material of the conductive structure 104 may include metal, such as the material of the conductive structure 104 may include tungsten. The frame 102 may be prepared using a ceramic printing process, and a metal material (such as tungsten) may be pre-placed during the ceramic printing process, so that after the ceramic printing structure is formed, an integrated frame 102 and conductive structure 104 are obtained. The thickness and number of layers of the metal material during the printing process can be designed according to the size of the current required to pass through the conductive structure 104. Alternatively, an independent conductive structure 104 may be prepared first, and then ceramic printing may be performed outside the conductive structure 104 to prepare the frame 102, so that the conductive structure 104 can be embedded in the frame 102 during the preparation of the frame 102.

[0118] After the frame 102 and the conductive structure 104 are prepared, the frame 102 and the base plate 101 can be soldered together. For example, a soldering material can be placed between the end surface of the frame 102 and the base plate 101, and then the solder can be melted to fix the frame 102 and the base plate 101. Optionally, the soldering material can be a metal solder such as tin, silver, and copper.

[0119] The base plate 101 includes a first area and a second area surrounding the first area. The first area is used to mount the light-emitting chip 103 and other components, while the second area is used to secure the base plate 102. The first area can be raised relative to the second area, thereby increasing the strength of the first area and ensuring a high degree of flatness in the first area, thereby ensuring a good mounting effect for the light-emitting chip 103 and other components.

[0120] A certain safety distance can be reserved between the conductive structure 104 and the base plate 101 to prevent miscommunication between the conductive structure 104 and the base plate 101. A certain safety distance can be reserved between the conductive structure 104 and the second end surface of the frame 102 to prevent the conductive structure 104 from affecting the fixation of the frame 102 and other components from above. For example, the side of the frame 102 away from the base plate 101 needs to be fixed to a component with a thermal expansion coefficient that is relatively close to the frame 102. However, the thermal expansion coefficient of the conductive structure 104 is significantly different from that of the frame 102. Therefore, the conductive structure 104 is further away from the component fixed above the frame 102. This can avoid the fixing effect caused by the conductive structure 104 when fixing the component, thereby ensuring the manufacturing reliability of the laser 100.

[0121] For example, the minimum spacing between the conductive structure 104 and the base plate 101 is greater than or equal to 0.5 mm, and / or the minimum spacing between the conductive structure 104 and the surface of the frame 102 away from the base plate 101 is greater than or equal to 0.5 mm. The minimum spacing between the conductive structure 104 and another component refers to the minimum value of the spacing between each position in the conductive structure 104 and the component. The spacing between each position in the conductive structure 104 and the base plate 101 is greater than or equal to 0.5 mm, and the spacing between each position and the surface of the frame 102 away from the base plate 101 is also greater than or equal to 0.5 mm. As shown in Figure 18, the minimum spacing between the conductive structure 104 and the base plate 101 is the distance d1 in the x-direction, which can also be regarded as the distance between the second region of the conductive structure 104 and the side surface of the base plate 101; the minimum spacing between the conductive structure 104 and the surface of the frame 102 away from the base plate 101 is the distance d2 in the z-direction, and both d1 and d2 are greater than or equal to 0.5 mm.

[0122] Please continue to refer to the laser 10 in Figures 18, 24 and 26. The laser 10 may also include a heat sink 105 and a reflective prism 106. Each light-emitting chip 103 corresponds to a heat sink 105 and a reflective prism 107. The heat sink 105 is located on the base plate 101, and the light-emitting chip 103 is located on the surface of the heat sink 105 away from the base plate 101. The heat sink 105 is used to assist the light-emitting chip 103 in dissipating heat. The material of the heat sink 105 may include ceramic. The reflective prism 106 is located on the light-emitting side of the corresponding light-emitting chip 103. The laser emitted by the light-emitting chip 103 can be directed to the corresponding reflective prism 106. The reflective prism 106 can reflect the received laser in a direction away from the base plate 101, so that the laser is emitted out of the accommodation space enclosed by the base plate 101 and the frame 102.

[0123] FIG28 is a schematic structural diagram of another laser provided in another embodiment of the present application. As shown in FIG28 , based on the laser 10 shown in FIG18 , the laser 10 may further include a light-transmitting sealing component 107. The light-transmitting sealing component 107 may be in the shape of a plate. The light-transmitting sealing component 107 is located on the side of the frame 102 away from the base plate 101 and is used to seal the accommodation space enclosed by the frame 102 and the base plate 101 to prevent external pollutants such as water and oxygen from damaging the light-emitting chip 103. The edge area of ​​the surface of the light-transmitting sealing component 107 close to the base plate 101 is fixed to the surface of the frame 102 away from the base plate 101. For example, the edge area of ​​the light-transmitting sealing component 107 may be pre-set with solder. The light-transmitting sealing component 107 may be placed on the side of the frame 102 away from the base plate 101, and the solder is in contact with the surface of the frame 102 away from the base plate 101. Then, the frame 102 and the light-transmitting sealing component 107 are placed together in a high-temperature furnace to melt the solder and then weld the frame 102 and the light-transmitting sealing component 107 together.

[0124] Continuing with FIG28 , the laser 10 may further include a collimator lens assembly 108 located on a side of the light-transmitting sealing member 107 away from the base plate 101. The collimator lens assembly 108 may include a plurality of collimator lenses corresponding to each light-emitting chip 103. Laser light emitted by each light-emitting chip 103 is reflected by the corresponding reflective prism 106 and then directed toward the corresponding collimator lens. The collimator lens collimates the received laser light and then emits it, making the laser light nearly parallel.

[0125] Figure 29 is a schematic diagram of the structure of another laser system provided in an embodiment of the present application, and Figure 30 is a schematic diagram of the structure of a laser system provided in another embodiment of the present application. Figure 30 is an exploded view of the laser system shown in Figure 29, and Figure 29 may be a cross-sectional schematic diagram of the laser system shown in Figure 30. As shown in Figures 29 and 30, the circuit board 20 in the embodiment of the present application may have a hollow area, and the pad H is located outside the hollow area. The base plate 101 in the laser 10 can cover the hollow area, and the area of ​​the base plate 101 is larger than the area of ​​the hollow area. The hollow area can be used to set a radiator, and the cold head of the radiator can extend into the hollow area and contact the base plate 101 of the laser 10 to achieve a better heat dissipation effect for the laser 10.

[0126] FIG31 is a schematic structural diagram of another laser system provided in an embodiment of the present application. As shown in FIG31 , the second region of the conductive structure 104 can be located at other positions of the frame 102 in addition to the end surface of the frame 102 .

[0127] For example, in this embodiment, the second region of the conductive structure 104 is at least partially located on the side surface of the frame 102 . The side surface of the frame 102 is the side of the frame 102 away from the base 101 , and the side surface of the frame 102 is connected to the end surface of the frame 102 .

[0128] When soldering the conductive structure 104 to the pad H on the circuit board 20, additional solder can be placed on the circuit board 20. This allows the solder to melt and, under the mutual pressure of the end surface of the frame 102 and the circuit board 20, overflow the end surface of the frame 102 and spread to the side surface of the frame 102. This allows the second area of ​​the conductive structure 104 located on the side surface of the frame 102 to be electrically connected to the pad H via the solder. This significantly increases the second area of ​​the conductive structure 104, thereby enhancing the current-carrying capacity of the conductive structure 104. Furthermore, the significantly increased second area of ​​the conductive structure 104 can also facilitate heat dissipation under high current conditions.

[0129] In summary, in the laser system provided by the embodiment of the present application, the inner wall of the frame is fixed to the side of the base plate, and the end face of the frame in the axial direction is flush with the first plate surface of the base plate. The conductive structure is embedded in the frame, the first region of the conductive structure is located within the enclosed area of ​​the frame and is electrically connected to the light-emitting chip, and the second region is located on the end face of the frame. The second region can directly cover the solder pad in the circuit board and be electrically connected to the solder pad, thereby transmitting current to the light-emitting chip through the circuit board and the conductive structure. In this way, when electrically connecting the laser to the circuit board, it is only necessary to directly fix and electrically connect the second region of the conductive structure in the laser to the solder pad, which can simplify the electrical connection method between the laser and the circuit board.

[0130] In addition, an air avoidance groove is provided in the edge of the first surface of the base plate near the frame, which can prevent the solder from flowing from the second area of ​​the conductive structure and the solder pad to the base plate, thereby avoiding misconduct between the conductive structure and the base plate, and further avoiding the influence of the misconduct on the luminous effect of the light-emitting chip.

[0131] The laser system in the embodiments of the present application can be used in laser projection as a light source in a projection device. In addition to the laser system, the projection light source may also include other optical components, such as a light homogenization component, a shaping component, and a converging lens. The light homogenization component is used to homogenize the laser light emitted by the laser system, the shaping component can shape the laser spot into the shape required to form the projection image, and the converging lens can converge the laser light to subsequent components. For example, the light homogenization component can be a light pipe.

[0132] Embodiments of the present application also provide a projection device, which may include the aforementioned light source assembly, a light valve, and a lens. Laser light emitted by the aforementioned light source assembly may be directed toward the light valve, modulated by the light valve, and then directed toward the lens. The lens can then project the received laser light to form a projection image. Because the laser light emitted by the projection light source is of high quality, the display quality of the projection image formed by the laser light is also good, thereby enhancing the display quality of the projection device.

[0133] In this application, the terms "at least one of A and B" and "A and / or B" are merely a description of the association relationship of associated objects, indicating that there can be three kinds of relationships, namely, A exists alone, A and B exist at the same time, and B exists alone. The term "at least one of A, B, and C" indicates that there can be seven kinds of relationships, which can represent seven situations: A exists alone, B exists alone, C exists alone, A and B exist at the same time, A and C exist at the same time, C and B exist at the same time, and A, B, and C exist at the same time. In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. The term "at least one" refers to one or more, and the term "multiple" refers to two or more, unless otherwise expressly defined.

[0134] The words "include" and "including" mentioned throughout the specification and claims are open-ended terms and should be interpreted as "including but not limited to". "Approximately" means that within an acceptable error range, those skilled in the art can solve the technical problem and basically achieve the technical effect. Certain words are used in the specification and claims to refer to specific components. Those skilled in the art should understand that manufacturers may use different terms to refer to the same component. This specification and claims do not use differences in name as a way to distinguish components, but rather use differences in the functions of the components as the criterion for distinction.

[0135] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A laser system, characterized in that: The laser system includes: a laser and a circuit board; The laser comprises: a base plate, a frame located on the base plate, a light-emitting chip located on the base plate and surrounded by the frame, and a conductive structure embedded in the frame and connecting the inside and outside of an enclosed area of ​​the frame, wherein a first area of ​​the conductive structure is located in the frame near the enclosed area and is electrically connected to the light-emitting chip; The circuit board has a solder pad connected to a power source, the laser is located on the circuit board, and the bottom plate is close to the circuit board; The second area of ​​the conductive structure is located in the frame body away from the surrounding area and is electrically connected to the pad.

2. The laser system according to claim 1, wherein: The laser system also includes a welding piece; The welding piece is located outside the surrounding area of ​​the frame; The second region of the conductive structure is electrically connected to the pad through the solder tab.

3. The laser system according to claim 2, wherein: The welding piece is L-shaped, and includes a first connecting portion and a second connecting portion that are connected to each other and are both plate-shaped; One end of the first connection portion away from the second connection portion is fixed to the conductive structure, and one end of the second connection portion away from the first connection portion is fixed to the pad.

4. The laser system according to claim 3, characterized in that The welding piece is arc-shaped or U-shaped.

5. The laser system according to any one of claims 2 to 4, characterized in that: The outer wall of the frame is flat, and the second area of ​​the conductive structure is located on the outer wall.

6. The laser system according to any one of claims 2 to 4, characterized in that: An end of the outer wall of the frame body close to the bottom plate has a first boss, a portion of the conductive structure is embedded in the first boss, and the second area of ​​the conductive structure is located on the first boss.

7. The laser system according to claim 6, characterized in that The second region of the conductive structure is flush with a surface of the first boss away from the surrounding region of the frame, or is flush with a surface of the first boss away from the bottom plate.

8. The laser system according to claim 6, wherein: The laser includes a plurality of conductive structures, the outer wall has a plurality of first bosses corresponding to the plurality of conductive structures, and the second region of each conductive structure is located on the corresponding first boss.

9. The laser system according to any one of claims 2 to 4, characterized in that: The inner wall of the frame body has a second boss, and a portion of the conductive structure is embedded in the second boss; The first region of the conductive structure is located on a surface of the second platform away from the bottom plate.

10. The laser system according to claim 1, wherein: An end surface of the frame located at one end in the axial direction is flush with the first surface of the bottom plate, and the first surface of the bottom plate is a surface of the bottom plate close to the circuit board; The second region of the conductive structure is at least partially located on the end surface of the frame; The first plate surface of the bottom plate has an air-avoiding groove at an edge close to the frame, and the air-avoiding groove is used to separate the first plate surface and the second area of ​​the conductive structure; The second region of the conductive structure covers the pad and is electrically connected to the pad.

11. The laser system according to claim 10, wherein: The laser includes a plurality of conductive structures, and the edge of the first plate surface of the bottom plate close to the frame body has a plurality of air-avoiding grooves corresponding to the plurality of conductive structures one by one; Each of the air-avoiding grooves is close to the second region of the corresponding conductive structure and is used to separate the second region from the first plate surface.

12. The laser system according to claim 11, wherein: The air-avoiding groove is semicircular or rectangular.

13. The laser system according to claim 10, wherein: The air-avoiding groove is filled with insulating material.

14. The laser system according to any one of claims 10 to 13, characterized in that: The second region of the conductive structure is flush with the end surface.

15. The laser system according to any one of claims 10 to 13, characterized in that: The second region of the conductive structure protrudes relative to the end surface, and a groove is provided in the circuit board where the solder pad is located, and the solder pad is located in the groove; The second region is inserted into the groove and electrically connected to the pad.

16. The laser system according to any one of claims 10 to 13, characterized in that: The bottom plate has four side surfaces, and the frame is surrounded by four side walls; The inner walls of two opposite side walls among the four side walls are fixed to two opposite side surfaces among the four side surfaces, and the end surface of the frame body that is flush with the first plate surface of the bottom plate includes: a surface of the two side walls located at one end of the frame body in the axial direction; The other two side walls of the four side walls are located on the second plate surface of the bottom plate, and surfaces of the other two side walls located at one end of the frame in the axial direction are fixed to the second plate surface.

17. The laser system according to any one of claims 10 to 13, characterized in that: The inner wall of the frame body has a third boss, and a portion of the conductive structure is embedded in the third boss; The first region of the conductive structure is located on a surface of the third platform away from the bottom plate.

18. The laser system according to any one of claims 10 to 13, characterized in that: The second region of the conductive structure is at least partially located on a side surface of the frame body. The side surface of the frame body is a side of the frame body away from the bottom plate, and the side surface of the frame body is connected to an end surface of the frame body.

19. The laser system according to claim 1, wherein: The minimum distance between the conductive structure and the bottom plate is greater than or equal to 0.5 mm, and / or the minimum distance between the conductive structure and the surface of the frame away from the bottom plate is greater than or equal to 0.5 mm.

20. The laser system of claim 1, wherein: The laser meets at least one of the following conditions: The material of the bottom plate includes metal; The material of the frame includes ceramic; And the material of the conductive structure includes tungsten.

Images