Semiconductor device surface modification pretreatment device

Abstract

The invention discloses a semiconductor device surface modification pretreatment device, and belongs to the technical field of semiconductor devices. A semiconductor device surface modification pretreatment device comprises a soaking treatment box and a device positioning plate arranged in the soaking treatment box in a sliding mode, a pretreatment assembly is arranged on one side of the soaking treatment box, and two guide grooves are fixedly connected to the inner wall of the soaking treatment box; a plurality of connecting rods on the surface are controlled to rotate through rotation of a rotating rod, cleaning liquid medicine in the soaking treatment box is stirred, and the cleaning liquid medicine in the soaking treatment box is in a flowing state on a device positioning plate; the generated water flow impact force can help to loosen and remove impurities such as particulate pollutants, organic matter residues and metal ions attached to the surface of the semiconductor device, the cleaning efficiency of the semiconductor device is greatly improved, the cleaning time is shortened, the surface pretreatment efficiency of the semiconductor device is higher, and the subsequent processing efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a surface modification pretreatment device for semiconductor devices. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators, which use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. In the semiconductor manufacturing process, the immersion cleaning and surface modification pretreatment are optimized and controlled as an overall process link to improve the stability and repeatability of the process. At present, when semiconductor devices are pretreated, they are usually transported to special processing equipment for pretreatment operations.

[0003] After searching, the Chinese patent publication number CN213988828U discloses a pretreatment device for passivation of the surface of semiconductor materials, including a box body, a driving motor is installed at the bottom of one side of the box body, a rotating shaft is installed at the output end of the driving motor, a fixed sleeve is installed at the bottom of the box body, a rotating seat is installed with a thread inside the fixed sleeve, a second rotating column is arranged on the top of the rotating seat, fixed shafts are installed at both ends of the second rotating column, the fixed shaft at one end of the second rotating column is fixedly connected with the rotating seat, a receiving seat is installed on the top of the fixed shaft at the other end of the second rotating column, a friction sleeve is rotatably installed on the outer side of the fixed shaft, a one-way rotating mechanism is installed between the friction sleeve and the fixed shaft, a first driving mechanism is installed between the second rotating column and the third transmission gear, an immersion box is rotatably installed on the top of the receiving seat, support plates are installed on the top of both ends of the immersion box, and a reciprocating screw is installed in the middle of the support plate. The above patent has the following deficiencies: although it is capable of performing pretreatment operations on semiconductor devices, when the semiconductor devices are immersed and cleaned, the semiconductor devices are immersed in close proximity to the cleaning solution in the immersion box. The fluidity of the cleaning solution in the immersion box is poor, and it is not easy to break the boundary layer on the surface of the semiconductor devices. It is impossible to effectively remove some particles, organic residues, metal ions and other impurities on the surface of the semiconductor devices, resulting in low efficiency of the equipment in treating semiconductor devices. In view of this, the present application specifically proposes a semiconductor device surface modification pretreatment device to solve this problem. Summary of the invention

[0004] The purpose of the present invention is to solve the problem in the prior art that when semiconductor devices are pre-soaked and cleaned in equipment, the efficiency is low and the fluidity of the cleaning liquid is poor, which affects the pre-treatment efficiency of the semiconductor devices, and to propose a semiconductor device surface modification pre-treatment device.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A semiconductor device surface modification pretreatment device comprises an immersion treatment box and a device positioning plate slidably arranged in the immersion treatment box, a pretreatment component is arranged on one side of the immersion treatment box, two guide grooves are fixedly connected to the inner wall of the immersion treatment box, and the device also comprises a rotating rod rotatably connected to the immersion treatment box, a plurality of connecting rods are fixedly connected to a peripheral surface of the rotating rod, a resistance block is fixedly connected to the bottom of one side of the device positioning plate, a toggle plate is hinged on the rotating rod, an L-shaped baffle is fixedly connected to the rotating rod, a torsion spring is fixedly connected between the toggle plate and the rotating rod, and a first spring is arranged between the device positioning plate and the guide groove.

[0007] Preferably, a workbench is fixedly installed at the bottom of the immersion treatment box, the pretreatment component includes a cleaning liquid storage tank arranged at the bottom of the workbench, a liquid level sensor is arranged on the cleaning liquid storage tank, and a circulation pump is fixedly installed on the workbench.

[0008] Preferably, an extraction pipe and a water inlet pipe are fixedly connected between the circulation pump and the cleaning liquid storage tank and the immersion treatment box respectively, a water outlet hole is opened at the bottom of the immersion treatment box, and a water outlet pipe is fixedly connected between the water outlet hole and the cleaning liquid storage tank.

[0009] Preferably, a motor is fixedly installed on one side of the immersion treatment box, the output end of the motor extends to the inside of the immersion treatment box and is fixedly connected to the rotating rod, guide rods are fixedly connected in the two guide grooves, plug blocks are fixedly connected to the bottom of both sides of the device positioning plate, a slot plate is slidably connected to the guide rod, the plug block is slidably connected in the slot plate, and the resistance block is slidably connected to the guide rod.

[0010] Preferably, the first spring is sleeved on the guide rod, and the two ends of the first spring are respectively against the inner walls of the slot plate and the guide groove, a reciprocating screw is rotatably connected to the inner wall of the immersion treatment box, a synchronous belt is transmission-connected between the reciprocating screw and the rotating rod, and a fixed rod is fixedly connected to the inner wall of the immersion treatment box.

[0011] Preferably, a rectangular plate is threadedly connected to the reciprocating screw rod, and the side of the rectangular plate away from the reciprocating screw rod is slidably connected to the fixed rod. Both ends of the rectangular plate are slidably connected to sliding rods, and the bottoms of the two sliding rods are fixedly connected to arc-shaped scrapers, and the two sliding rods are both sleeved with a second spring.

[0012] Preferably, the two ends of the second spring are respectively against the arc scraper and the rectangular plate, an inclined plate is fixedly connected to the bottom wall of the immersion treatment box, a filter plate is slidably connected in the water outlet, sliders are fixedly connected to the bottom of both sides of the filter plate, a sliding groove corresponding to the slider is opened on the inner wall of the water outlet, and a third spring is fixedly connected between the slider and the inner wall of the sliding groove of the water outlet.

[0013] Preferably, a protrusion is fixedly connected to the end of the reciprocating screw away from the motor, a strip plate is fixedly connected to the inner wall of the immersion treatment box close to the protrusion, a push rod is slidably connected to the strip plate, and a knocking block is fixedly connected to the bottom of the push rod.

[0014] Preferably, a fourth spring is sleeved on the push rod, and the two ends of the fourth spring are respectively fixedly connected to the strip plate and the push rod. The top of the filter plate is rotatably connected to a round rod, a spiral groove is provided on the round rod, and a scraping strip is fixedly connected to one side of the bottom of the round rod.

[0015] Preferably, a communicating cavity is formed at the bottom of the push rod and the knocking block, and a driving rod corresponding to the spiral groove is fixedly connected to the inner wall of the cavity of the knocking block.

[0016] Compared with the prior art, the present invention provides a semiconductor device surface modification pretreatment device, which has the following beneficial effects:

[0017] 1. The semiconductor device surface modification pretreatment device controls the rotation of multiple connecting rods on the surface by rotating the rotating rod to stir the cleaning solution in the immersion treatment box. At the same time, when the toggle plate on the rotating rod rotates and contacts the abutment block, the abutment block drives the device positioning plate to slide in the guide groove to compress the first spring. When the device positioning plate cannot continue to slide, the toggle plate can automatically disengage from the abutment block by compressing the torsion spring. Then the device positioning plate automatically resets under the action of the first spring. In this process, the cleaning solution in the immersion treatment box forms a flowing state on the device positioning plate. The generated water flow impact force can help loosen and remove particulate pollutants, organic residues, metal ions and other impurities attached to the surface of the semiconductor device. It can also avoid some special parts such as grooves and gaps of the semiconductor device to avoid local insufficient cleaning. It can also make the semiconductor device on the device positioning plate shake. Appropriate shaking can make the semiconductor device have a certain micro-motion on the device positioning plate, thereby dispersing stress and reducing the risk of damage to the device due to stress concentration, greatly improving the cleaning efficiency of the semiconductor device, shortening the cleaning time, and thus making the surface pretreatment efficiency of the semiconductor device higher, so as to improve the efficiency of subsequent processing.

[0018] 2. The semiconductor device surface modification pretreatment device drives the rotating rod to rotate by starting the motor, and the rotating rod drives the reciprocating screw to rotate through the synchronous belt, so that the rectangular plate slides on the reciprocating screw and drives the arc scraper at the bottom to slide along the inclined surface of the inclined plate, so as to scrape the impurities generated during the immersion cleaning process of the semiconductor device to the water outlet. Under the action of the second spring, the arc scraper is always kept against the inclined plate, so that the impurities generated during the cleaning process of the semiconductor device can be scraped better, which is convenient for the centralized treatment of impurities in the immersion treatment box and avoids the backflow of impurities. It is beneficial to the subsequent process, and can also enhance the effect of the cleaning liquid, improve the overall cleaning effect of the semiconductor device, and make the pretreatment efficiency of the semiconductor device higher.

[0019] 3. The semiconductor device surface modification pretreatment device can drive the protrusion to rotate while rotating the reciprocating screw rod. The protruding part of the protrusion reciprocates with the push rod, so that the knocking block repeatedly knocks on the filter plate that is filtering the cleaning liquid, causing the filter plate to continuously vibrate, thereby preventing the filter plate from being blocked when filtering impurities in the cleaning liquid, and making the cleaning liquid in the immersion treatment box more fluid, further promoting higher efficiency during the immersion treatment of semiconductor devices, and improving the overall efficiency of the semiconductor device pretreatment equipment.

[0020] 4. The semiconductor device surface modification pretreatment device knocks the filter plate downward through the push rod and the knocking block, and the round rod on the filter plate automatically enters through the cavity on the push rod and the knocking block. The driving rod on the inner wall of the knocking block automatically contacts and slides along the spiral groove on the round rod, so that the round rod drives the scraper bar to rotate on the filter plate to scrape the impurities accumulated on the filter plate to avoid blockage caused by excessive accumulation of impurities and affect the fluidity of the cleaning solution. When the push rod and the knocking block are upward, the driving rod automatically moves upward to make the round rod rotate in the opposite direction, and the filter plate reciprocates. At the same time, the filter plate vibrates back and forth, and the impurities accumulated on the filter plate can be scraped by the scraper bar while rotating forward and reversely, which further prevents the accumulation of impurities on the semiconductor device, improves the fluidity of the cleaning solution in the immersion treatment box, and makes the pretreatment efficiency of the semiconductor device higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the front structure of a semiconductor device surface modification pretreatment device proposed by the present invention;

[0022] Figure 2 A schematic diagram of the side structure of a semiconductor device surface modification pretreatment device proposed by the present invention;

[0023] Figure 3 This is a schematic diagram of the back structure of a semiconductor device surface modification pretreatment device proposed by the present invention;

[0024] Figure 4This is a schematic diagram of the structure inside the immersion treatment box in a semiconductor device surface modification pretreatment device proposed by the present invention;

[0025] Figure 5 This is a schematic structural diagram of a transfer rod, a connecting rod, a toggle plate, a resistance block, and a slot plate in a semiconductor device surface modification pretreatment device proposed by the present invention;

[0026] Figure 6 This is a structural schematic diagram of a reciprocating screw rod, a device positioning plate, and a guide groove in a semiconductor device surface modification pretreatment device proposed by the present invention;

[0027] Figure 7 This is a schematic structural diagram of a device positioning plate, an arc-shaped scraper plate, and an inclined plate in a semiconductor device surface modification pretreatment device proposed by the present invention;

[0028] Figure 8 The present invention proposes Figure 7 The structural diagram of part A in the figure;

[0029] Fig. 9 The present invention proposes Figure 7 The structural diagram of part B;

[0030] Fig.10 The present invention proposes Figure 7 Schematic diagram of the structure of part C;

[0031] Fig.11 This is a schematic structural diagram of a water outlet and a filter plate in a semiconductor device surface modification pretreatment device proposed by the present invention;

[0032] Fig.12 The present invention proposes Fig.11 The structural diagram of the D part;

[0033] Fig.13 The present invention provides a schematic structural diagram of a cavity, a driving rod, a round rod, a spiral groove and a scraping strip of a push rod and a knocking block in a semiconductor device surface modification pretreatment device proposed by the present invention.

[0034] In the figure: 1, immersion treatment box; 2, device positioning plate; 3, workbench; 4, pretreatment component; 401, cleaning liquid storage tank; 402, circulation pump; 403, extraction pipe; 404, water inlet pipe; 405, water outlet hole; 406, water outlet pipe; 5, guide groove; 6, rotating rod; 7, connecting rod; 8, resistance block; 9, toggle plate; 10, L-shaped baffle; 11, torsion spring; 12, first spring; 13, motor; 14, guide rod; 15, Insert block; 16, slot plate; 17, reciprocating screw rod; 18, synchronous belt; 19, fixed rod; 20, rectangular plate; 21, slide rod; 22, arc scraper; 23, second spring; 24, inclined plate; 25, filter plate; 26, slider; 27, third spring; 28, bump; 29, strip plate; 30, push rod; 31, knock block; 32, fourth spring; 33, round rod; 34, scraper strip; 35, drive rod; 36, spiral slide. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0036] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] Example 1: Reference Figure 1-Figure 13 A semiconductor device surface modification pretreatment device comprises an immersion treatment box 1 and a device positioning plate 2 slidably arranged in the immersion treatment box 1, a pretreatment component 4 is arranged on one side of the immersion treatment box 1, two guide grooves 5 are fixedly connected to the inner wall of the immersion treatment box 1, and also comprises a rotating rod 6 rotatably connected in the immersion treatment box 1, a plurality of connecting rods 7 are fixedly connected to a peripheral surface of the rotating rod 6, a resistance block 8 is fixedly connected to the bottom of one side of the device positioning plate 2, a toggle plate 9 is hinged on the rotating rod 6, an L-shaped baffle 10 is fixedly connected to the rotating rod 6, a torsion spring 11 is fixedly connected between the toggle plate 9 and the rotating rod 6, and a first spring 12 is arranged between the device positioning plate 2 and the guide groove 5.

[0038] In the present invention, when the semiconductor device is soaked, the semiconductor device is placed on the device positioning plate 2 for positioning, and then cleaning solution is added to the soaking treatment box 1 through the pretreatment component 4 until the semiconductor device is submerged, and then the plurality of connecting rods 7 on the surface are rotated by the rotating rod 6 to stir the cleaning solution in the soaking treatment box 1. At the same time, when the toggle plate 9 on the rotating rod 6 rotates and contacts the abutment block 8, the abutment block 8 drives the device positioning plate 2 to slide in the guide groove 5, compressing the first spring 12. When the device positioning plate 2 cannot continue to slide, the toggle plate 9 can automatically disengage from the abutment block 8 by compressing the torsion spring 11, and then the device positioning plate 2 automatically resets under the action of the first spring 12. In this process, the cleaning solution in the soaking treatment box 1 forms a flowing state on the device positioning plate 2, producing The impact force of the generated water flow can help loosen and remove impurities such as particulate contaminants, organic residues and metal ions attached to the surface of semiconductor devices. It can also avoid some special parts such as grooves and gaps of semiconductor devices to avoid insufficient local cleaning. It can also cause the semiconductor devices on the device positioning plate 2 to shake. Appropriate shaking can make the semiconductor devices have a certain micro-movement on the device positioning plate 2, thereby dispersing stress and reducing the risk of damage to the device due to stress concentration, greatly improving the cleaning efficiency of semiconductor devices, shortening the cleaning time, and thus making the surface pretreatment efficiency of semiconductor devices higher, so as to improve the efficiency of subsequent processing; it should be noted that the device positioning plate 2 can position the semiconductor device in the immersion treatment box 1, so that the semiconductor device is more stable during the pretreatment process and the pretreatment efficiency is higher.

[0039] Example 2: Reference Figure 1-Figure 10 , which is basically the same as the first embodiment, and further, a workbench 3 is fixedly installed at the bottom of the immersion treatment box 1, the pretreatment component 4 includes a cleaning liquid storage tank 401 arranged at the bottom of the workbench 3, a liquid level sensor is arranged on the cleaning liquid storage tank 401, and a circulation pump 402 is fixedly installed on the workbench 3.

[0040] An extraction pipe 403 and a water inlet pipe 404 are fixedly connected between the circulation pump 402 and the cleaning liquid storage tank 401 and the immersion treatment box 1 respectively. A water outlet hole 405 is opened at the bottom of the immersion treatment box 1, and a water outlet pipe 406 is fixedly connected between the water outlet hole 405 and the cleaning liquid storage tank 401.

[0041] In the present invention, the liquid level sensor on the cleaning liquid storage tank 401 is used to monitor the liquid level of the cleaning liquid, and can be replenished in time when the liquid level is too low; by starting the circulation pump 402, the cleaning liquid can be extracted from the cleaning liquid storage tank 401 through the extraction pipe 403, and then enter the immersion treatment box 1 through the water inlet pipe 404. When the cleaning in the immersion treatment box 1 reaches the required capacity, the valve on the water outlet pipe 406 can be closed, and then the semiconductor device can be processed in the immersion treatment box 1.

[0042] A motor 13 is fixedly installed on one side of the immersion treatment box 1, and the output end of the motor 13 extends to the inside of the immersion treatment box 1 and is fixedly connected to the rotating rod 6. Guide rods 14 are fixedly connected in the two guide grooves 5, and plug blocks 15 are fixedly connected to the bottom of both sides of the device positioning plate 2. A slot plate 16 is slidably connected to the guide rod 14, and the plug block 15 is slidably connected in the slot plate 16. The resistance block 8 is slidably connected to the guide rod 14.

[0043] In the present invention, when the semiconductor device is immersed, the semiconductor devices are first fixed one by one on the device positioning plate 2, and then the device positioning plate 2 is inserted into the slot plate 16 through the plug blocks 15 on both sides of the bottom of the device positioning plate 2, and then the immersion treatment operation can be carried out. When the resistance block 8 is resisted by the toggle plate 9, the device positioning plate 2 slides on the guide rod 14 through the slot plate 16 to compress the first spring 12. It should be noted that the torsion force of the torsion spring 11 is greater than the elastic force of the first spring 12. Until the device positioning plate 2 is in contact with the inner wall of the immersion treatment box 1, the toggle plate 9 will automatically compress the torsion spring 11 and separate it from the resistance block 8. Then the first spring 12 automatically resets the device positioning plate 2 and generates shaking. This reciprocating movement will cause the device positioning plate 2 to shake back and forth in the immersion treatment box 1, thereby enhancing the impact force of the cleaning liquid on the tiny parts such as grooves and gaps on the semiconductor device, enhancing the cleaning effect of the semiconductor device, and improving the efficiency of the surface modification pretreatment of the semiconductor device.

[0044] Example 3: Reference Figure 2 , Figure 4 , Figure 6 , Figure 7 , Fig. 9 , Fig.11 , which is basically the same as the first embodiment, and further, the first spring 12 is sleeved on the guide rod 14, and the two ends of the first spring 12 are respectively against the inner wall of the slot plate 16 and the guide groove 5, and a reciprocating screw 17 is rotatably connected to the inner wall of the immersion treatment box 1, and a synchronous belt 18 is transmission-connected between the reciprocating screw 17 and the rotating rod 6, and a fixed rod 19 is fixedly connected to the inner wall of the immersion treatment box 1.

[0045] A rectangular plate 20 is threadedly connected to the reciprocating screw rod 17, and the side of the rectangular plate 20 away from the reciprocating screw rod 17 is slidably connected to the fixed rod 19. Both ends of the rectangular plate 20 are slidably connected to sliding rods 21, and the bottoms of the two sliding rods 21 are fixedly connected to arc-shaped scrapers 22. The two sliding rods 21 are both sleeved with second springs 23.

[0046] The two ends of the second spring 23 are respectively against the arc-shaped scraper 22 and the rectangular plate 20 , and an inclined plate 24 is fixedly connected to the bottom wall of the immersion treatment box 1 .

[0047] In the present invention, the rotating rod 6 can be driven to rotate by starting the motor 13, and the rotating rod 6 drives the reciprocating screw 17 to rotate synchronously through the synchronous belt 18. Then, under the guiding effect of the fixed rod 19 on the rectangular plate 20, the rectangular plate 20 slides on the reciprocating screw 17 and drives the arc scraper 22 at the bottom to slide along the inclined surface of the inclined plate 24, so as to scrape the impurities generated by the semiconductor device during the immersion cleaning process to the water outlet 405. It should be noted that the immersion treatment box 1 is inclined in order to facilitate the discharge of the cleaning liquid from the water outlet pipe 406. When the arc scraper 22 slides along the inclined plate 24, the impurities generated by the semiconductor device during the immersion cleaning process are scraped to the water outlet 405. When the arc scraper 22 slides on the inclined surface, the arc scraper 22 will automatically move downward under the action of the second spring 23. When the arc scraper 22 slides in the opposite direction to reset, it will automatically compress the second spring 23 to reset upward under the guidance of the slide bar 21, which helps to keep the arc scraper 22 always against the inclined plate 24, so that the impurities generated during the cleaning process of the semiconductor device can be scraped off better, the impurities in the immersion treatment box 1 can be concentratedly treated, and the impurities can be avoided from flowing back, which is beneficial to the subsequent process. It can also enhance the effect of the cleaning liquid, improve the overall cleaning effect of the semiconductor device, and make the pretreatment efficiency of the semiconductor device higher.

[0048] Example 4: Reference Fig.11 , Fig.12 , which is basically the same as the first embodiment, and further, a filter plate 25 is slidably connected in the water outlet hole 405, sliders 26 are fixedly connected to the bottom of both sides of the filter plate 25, a slide groove corresponding to the slider 26 is opened on the inner wall of the water outlet hole 405, and a third spring 27 is fixedly connected between the slider 26 and the inner wall of the slide groove of the water outlet hole 405.

[0049] A protrusion 28 is fixedly connected to the end of the reciprocating screw 17 away from the motor 13, a strip plate 29 is fixedly connected to the inner wall of the immersion treatment box 1 near the protrusion 28, a push rod 30 is slidably connected to the strip plate 29, and a knocking block 31 is fixedly connected to the bottom of the push rod 30.

[0050] A fourth spring 32 is sleeved on the push rod 30 , and two ends of the fourth spring 32 are fixedly connected to the strip plate 29 and the push rod 30 respectively.

[0051] In the present invention, when the arc-shaped scraper 22 reciprocates to scrape the impurities to the water outlet 405, in order to improve the cleaning efficiency of the semiconductor device, the cleaning liquid in the immersion treatment box 1 is usually kept fluid, and the cleaning liquid continuously flows from the water outlet pipe 406 into the cleaning liquid storage tank 401, and then is continuously extracted by the circulation pump 402, and enters the immersion treatment box 1 through the water inlet pipe 404. However, in order to improve the overall processing efficiency of the semiconductor device, it is necessary to filter the impurities generated in the cleaning process of the semiconductor device in the cleaning liquid before the cleaning liquid enters the cleaning liquid storage tank 401.

[0052] When the reciprocating screw 17 rotates, the protrusion 28 can also be driven to rotate. When the protruding part of the protrusion 28 rotates and conflicts with the push rod 30, the push rod 30 will automatically slide downward on the strip plate 29 and compress the fourth spring 32, driving the knocking block 31 to knock the filter plate 25 downward. The filter plate 25 will automatically slide in the chute on the inner wall of the water outlet 405 through the sliders 26 on both sides thereof when receiving the knocking force, and compress the third spring 27. When the protruding part of the protrusion 28 does not conflict with the push rod 30, the fourth spring 32 automatically makes the knocking block 31 resets upward, the third spring 27 automatically resets the filter plate 25 upward and generates shaking. As the protruding part of the protrusion 28 reciprocates with the push rod 30, the knocking block 31 repeatedly knocks on the filter plate 25 that is filtering the cleaning liquid, causing the filter plate 25 to continuously vibrate, thereby preventing the filter plate 25 from being blocked when filtering impurities in the cleaning liquid, promoting better fluidity of the cleaning liquid in the immersion treatment box 1, and thus making the semiconductor device more efficient during the immersion treatment, thereby improving the overall efficiency of the semiconductor device pretreatment equipment.

[0053] Example 5: Reference Fig.13 , which is basically the same as the first embodiment, and further, a round rod 33 is rotatably connected to the top of the filter plate 25, a spiral groove 36 is provided on the round rod 33, a scraping strip 34 is fixedly connected to one side of the bottom of the round rod 33, a connected cavity is provided at the bottom of the push rod 30 and the knocking block 31, and a driving rod 35 corresponding to the spiral groove 36 is fixedly connected to the inner wall of the cavity of the knocking block 31.

[0054] In the present invention, while the push rod 30 and the knocking block 31 knock the filter plate 25 downward, the round rod 33 on the filter plate 25 automatically enters through the cavity on the push rod 30 and the knocking block 31. At the same time, the driving rod 35 on the inner wall of the knocking block 31 automatically contacts and slides along the spiral groove 36 on the round rod 33, so that the round rod 33 drives the scraper bar 34 to rotate on the filter plate 25, scraping the impurities accumulated on the filter plate 25 to avoid blockage caused by excessive accumulation of impurities and affecting the fluidity of the cleaning liquid. When the push rod 30 and the knocking block 31 are upward, the driving rod 35 automatically moves upward to make the round rod 33 rotate in the opposite direction. In this way, while the filter plate 25 vibrates back and forth, the impurities accumulated on the filter plate 25 can also be scraped by the scraper bar 34 while rotating forward and reversely, further preventing the accumulation of impurities on the semiconductor device, making the fluidity of the cleaning liquid in the immersion treatment box 1 better, and making the pretreatment efficiency of the semiconductor device higher.

[0055] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor device surface modification pretreatment device, comprising: An immersion treatment box (1) and a device positioning plate (2) slidably arranged in the immersion treatment box (1), wherein a pretreatment component (4) is arranged on one side of the immersion treatment box (1), characterized in that two guide grooves (5) are fixedly connected to the inner wall of the immersion treatment box (1), and further comprising: A rotating rod (6) is rotatably connected to the immersion treatment box (1), a plurality of connecting rods (7) are fixedly connected to a peripheral surface of the rotating rod (6), a resistance block (8) is fixedly connected to a bottom of one side of the device positioning plate (2), a toggle plate (9) is hingedly connected to the rotating rod (6), an L-shaped baffle plate (10) is fixedly connected to the rotating rod (6), a torsion spring (11) is fixedly connected between the toggle plate (9) and the rotating rod (6), and a first spring (12) is provided between the device positioning plate (2) and the guide groove (5).

2. A semiconductor device surface modification pretreatment device according to claim 1, characterized in that: A workbench (3) is fixedly mounted at the bottom of the immersion treatment box (1); the pretreatment component (4) comprises a cleaning liquid storage tank (401) arranged at the bottom of the workbench (3); a liquid level sensor is arranged on the cleaning liquid storage tank (401); and a circulation pump (402) is fixedly mounted on the workbench (3).

3. A semiconductor device surface modification pretreatment device according to claim 2, characterized in that: An extraction pipe (403) and a water inlet pipe (404) are fixedly connected between the circulation pump (402) and the cleaning liquid storage tank (401) and the soaking treatment box (1), respectively; a water outlet hole (405) is provided at the bottom of the soaking treatment box (1); and a water outlet pipe (406) is fixedly connected between the water outlet hole (405) and the cleaning liquid storage tank (401).

4. A semiconductor device surface modification pretreatment device according to claim 3, characterized in that: A motor (13) is fixedly mounted on one side of the immersion treatment box (1), the output end of the motor (13) extends into the interior of the immersion treatment box (1) and is fixedly connected to the rotating rod (6), the two guide grooves (5) are fixedly connected with guide rods (14), the bottoms of both sides of the device positioning plate (2) are fixedly connected with plug blocks (15), the guide rods (14) are slidably connected with slot plates (16), the plug blocks (15) are slidably connected in the slot plates (16), and the abutment blocks (8) are slidably connected to the guide rods (14).

5. A semiconductor device surface modification pretreatment device according to claim 4, characterized in that: The first spring (12) is sleeved on the guide rod (14), and the two ends of the first spring (12) are respectively abutted against the slot plate (16) and the inner wall of the guide groove (5). A reciprocating screw rod (17) is rotatably connected to the inner wall of the immersion treatment box (1), a synchronous belt (18) is transmission-connected between the reciprocating screw rod (17) and the rotating rod (6), and a fixed rod (19) is fixedly connected to the inner wall of the immersion treatment box (1).

6. A semiconductor device surface modification pretreatment device according to claim 5, characterized in that: A rectangular plate (20) is threadedly connected to the reciprocating screw rod (17); a side of the rectangular plate (20) away from the reciprocating screw rod (17) is slidably connected to a fixed rod (19); both ends of the rectangular plate (20) are slidably connected to sliding rods (21); arc-shaped scrapers (22) are fixedly connected to the bottoms of the two sliding rods (21); and a second spring (23) is sleeved on the two sliding rods (21).

7. A semiconductor device surface modification pretreatment device according to claim 6, characterized in that: The two ends of the second spring (23) are respectively against the arc scraper (22) and the rectangular plate (20); an inclined plate (24) is fixedly connected to the bottom wall of the immersion treatment box (1); a filter plate (25) is slidably connected in the water outlet hole (405); sliders (26) are fixedly connected to the bottom of both sides of the filter plate (25); a slide groove corresponding to the slider (26) is opened on the inner wall of the water outlet hole (405); and a third spring (27) is fixedly connected between the slider (26) and the inner wall of the slide groove of the water outlet hole (405).

8. A semiconductor device surface modification pretreatment device according to claim 7, characterized in that: A protrusion (28) is fixedly connected to one end of the reciprocating screw rod (17) away from the motor (13), a strip plate (29) is fixedly connected to the inner wall of the immersion treatment box (1) close to the protrusion (28), a push rod (30) is slidably connected to the strip plate (29), and a knocking block (31) is fixedly connected to the bottom of the push rod (30).

9. A semiconductor device surface modification pretreatment device according to claim 8, characterized in that: A fourth spring (32) is sleeved on the push rod (30), and the two ends of the fourth spring (32) are respectively fixedly connected to the strip plate (29) and the push rod (30). The top of the filter plate (25) is rotatably connected to a round rod (33), and a spiral groove (36) is provided on the round rod (33). A scraping strip (34) is fixedly connected to one side of the bottom of the round rod (33).

10. A semiconductor device surface modification pretreatment device according to claim 9, characterized in that: The bottoms of the push rod (30) and the knocking block (31) are provided with a connected cavity, and the inner wall of the cavity of the knocking block (31) is fixedly connected with a driving rod (35) corresponding to the spiral slide groove (36).

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