Machining device and machining process

Abstract

The invention provides a machining device and a machining process which do not need a driving source, reduce cost and improve productivity in machining of a part to be machined. A processing apparatus (10) capable of heating, pressurizing, and atmosphere controlling a substrate (90) is provided with a movable chamber (20) having a chamber part (212) in which the substrate (90) is disposed. When the chamber part (212) is vacuumized during atmosphere control, the predetermined region of the substrate (90) can be pressurized by the negative pressure generated by the vacuumization.

Description

Technical Field

[0001] The present invention relates to a processing device and a processing technology for processing a processed component such as a substrate. Background Art

[0002] In recent years, research and development that contributes to energy efficiency has been conducted in order to ensure that more people have access to affordable, reliable, and sustainable modern energy.

[0003] There is also a demand for processing devices and processes for processing workpieces such as substrates that contribute to energy efficiency. For example, Patent Document 1 describes a processing device that can reduce the pressing force required for crimping.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2009-061487 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, the processing device of Patent Document 1 requires a driving source for generating a pressing force, and thus there is room for improvement in terms of cost reduction and productivity.

[0009] The present invention provides a processing device and a processing process which do not require a driving source, reduce costs, and improve productivity in processing a workpiece.

[0010] Means for solving problems

[0011] The first aspect of the present invention is a processing device, which can heat, pressurize and control the atmosphere of a processed part, wherein:

[0012] The processing device includes a chamber device having a chamber portion in which the workpiece is arranged.

[0013] When the chamber portion is evacuated during the atmosphere control, a predetermined region of the workpiece can be pressurized by the negative pressure generated by the evacuation.

[0014] The second aspect of the present invention is a processing technology for heating, pressurizing and controlling the atmosphere of a processed part, wherein:

[0015] When the atmosphere of the workpiece is evacuated, a predetermined region of the workpiece is pressurized by negative pressure generated by the evacuation.

[0016] Effects of the Invention

[0017] According to the present invention, a driving source for pressurizing a predetermined region of a workpiece is not required, so that the cost is reduced and the productivity in machining the workpiece is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a perspective view of a movable chamber in a processing device according to one embodiment of the present invention.

[0019] Figure 2 yes Figure 1 Side view of the movable chamber.

[0020] Figure 3 yes Figure 2 A sectional view of the main parts of the movable chamber.

[0021] Figure 4 It is a schematic diagram of a heating device in a processing device according to one embodiment of the present invention.

[0022] Figure 5 Yes means Figures 1 to 4 A flowchart of an example of a process for processing a substrate by a processing apparatus shown.

[0023] Description of Reference Numerals

[0024] 10 Processing equipment

[0025] 20 Movable chamber (chamber device)

[0026] 212 Chamber

[0027] 231a Bearing

[0028] 24 Pressure shaft

[0029] 241 Bottom

[0030] 26 Vacuum valve

[0031] 30 Heating device

[0032] 90 Substrate (processed part)

[0033] S1 Bottom area (area)

[0034] S2 Area of ​​the pressurized part (area) DETAILED DESCRIPTION

[0035] Hereinafter, an embodiment of the processing device and the processing process of the present invention will be described based on the accompanying drawings. In addition, the accompanying drawings are viewed along the direction of the reference numerals.

[0036] (Structure of processing equipment)

[0037] The processing device 10 of this embodiment can heat, pressurize, and control the atmosphere of a substrate 90 as a workpiece. The processing device 10 includes a movable chamber 20 (see Figures 1 to 3 ) and the heating device 30 (refer to Figure 4 ).

[0038] like Figures 1 to 3 As shown, the movable chamber 20 includes: a base member 21; a mounting table 22, which is mounted on the base member 21 and is used to mount the substrate 90; a cover member 23, which covers the upper portion of the base member 21; a pressurizing shaft 24, which is used to pressurize the substrate 90; a vacuum tube 25, which is connected to the base member 21; and a vacuum valve 26, which is arranged on the vacuum tube 25.

[0039] The base member 21 includes a base portion 211 , a chamber portion 212 , a flow path portion 213 , and a vacuum introduction port 214 .

[0040] The base 211 includes a bottom 211a having a substantially disk shape and a side wall 211b having a substantially cylindrical shape extending upward from the outer peripheral edge of the bottom 211a. Seal grooves 211c and 211d are formed on the inner peripheral surface and the upper surface of the side wall 211b, respectively, and O-rings 211e and 211f are disposed in the seal grooves 211c and 211d, respectively.

[0041] The chamber portion 212 is a space surrounded by the side wall portions 211 b of the base member 21 in the front, rear, left, and right directions, and surrounded by the bottom portion 211 a of the base member 21 in the lower direction.

[0042] One end of the flow path portion 213 opens from the side wall portion 211 b of the base portion 211 , and the other end thereof communicates with the chamber portion 212 .

[0043] The vacuum introduction port 214 is provided at an opening of the flow path portion 213 formed in the side wall portion 211 b of the base portion 211 .

[0044] The mounting table 22 is mounted on the bottom 211a of the base 211 in the chamber 212 of the base member 21. The mounting table 22 includes a mounting portion 221 having a concave shape recessed downward, and the substrate 90 can be positioned and accommodated in the concave portion of the mounting portion 221.

[0045] The cover member 23 is a member that covers the upper portion of the chamber portion 212 of the base member 21 and is substantially annular when viewed from above. A shaft insertion portion 231 extending substantially cylindrically downward from the upper surface of the cover member 23 is formed at the center of the cover member 23. The shaft insertion portion 231 is formed so that the pressurizing shaft 24 can slide in the up-down direction.

[0046] The lower surface of the cover member 23 contacts an O-ring 211e, which is arranged in a sealing groove 211c formed on the inner peripheral surface of the side wall portion 211b of the base 211, and the outer peripheral surface of the shaft insertion portion 231 contacts an O-ring 211f, which is arranged in a sealing groove 211d formed on the upper surface of the side wall portion 211b of the base 211. Thus, the cover member 23 is sealed and fitted with the base member 21. In addition, the cover member 23 is fixed to the base member 21 by a fixing member such as a bolt. In the present embodiment, the cover member 23 is fastened to the upper surface of the base member 21 by a bolt.

[0047] A bearing 231a having a shaft seal is formed on the inner peripheral surface of the shaft insertion portion 231. In the present embodiment, the bearing 231a having a shaft seal is formed in two layers, one above the other.

[0048] The pressure shaft 24 is formed into a substantially cylindrical shape having a bottom 241. The pressure shaft 24 is inserted into the shaft insertion portion 231 of the cover member 23. The pressure shaft 24 is supported by a bearing 231a having a shaft seal formed on the inner circumferential surface of the shaft insertion portion 231 of the cover member 23, and at least a portion of the pressure shaft 24 can slide in the vertical direction inside the chamber portion 212 in a state where the pressure shaft 24 and the cover member 23 are sealed.

[0049] As a result, the upper portion of the chamber portion 212 of the base member 21 is closed by the cover member 23 and the pressurizing shaft 24 , and the chamber portion 212 of the base member 21 becomes a sealed space.

[0050] One end of the vacuum tube 25 is connected to the vacuum introduction port 214 of the base member 21. The other end of the vacuum tube 25 is detachably connected to a vacuum pump (not shown).

[0051] The vacuum valve 26 is provided in the vacuum tube 25. The vacuum valve 26 is, for example, a diaphragm valve and is a normally closed valve. The vacuum valve 26 preferably has a small leakage when closed. In addition, the vacuum valve 26 has heat resistance so that it can function even when heated to a predetermined temperature in the heating device 30 described later.

[0052] When processing the substrate 90, after the substrate 90 is placed on the placement portion 221, the positioning member 27 is arranged on the placement portion 221 and the upper surface of the substrate 90. The positioning member 27 has a flat plate shape and is arranged to cover the placement portion 221 and the upper surface of the substrate 90 from above. A pressing member arrangement hole 271 is formed in the substantially central portion of the positioning member 27 in the front, back, left, and right directions and penetrates in the up-down direction.

[0053] When processing the substrate 90, the pressing member 28 having substantially the same shape as the pressing member placement hole 271 and being insertable through the pressing member placement hole 271 is placed. The pressing member 28 is thicker than the positioning member 27 in the vertical direction.

[0054] When a vacuum pump is connected to the other end of the vacuum tube 25 to evacuate the air, the air is exhausted from the chamber portion 212 which is a sealed space, and the chamber portion 212 is at a negative pressure.

[0055] Then, the pressure shaft 24 is pulled into the chamber 212 and slides downward by the negative pressure of the chamber 212. In addition, the thickness of the pressing member 28 in the vertical direction is thicker than that of the positioning member 27, so the pressure shaft 24 contacts the pressing member 28 before the positioning member 27 and presses the pressing member 28 downward. Thus, a predetermined area of ​​the substrate 90 can be pressurized via the pressure shaft 24 through the pressing member 28.

[0056] In this way, a predetermined region of the substrate 90 can be pressurized by utilizing the negative pressure of the chamber portion 212 generated by vacuuming.

[0057] This eliminates the need for a drive source for operating the pressurizing shaft 24 , thereby reducing costs and improving productivity in processing the substrate 90 .

[0058] Furthermore, a predetermined area of ​​the substrate 90 can be pressurized with a simple structure that does not require a driving source.

[0059] At this time, the bottom area S1 of the bottom 241 of the pressurizing shaft 24 is 7 times or more, preferably 99 times or more, the area S2 of the pressed portion of the substrate 90 pressurized by the pressurizing shaft 24 via the pressing member 28 .

[0060] Then, after the chamber portion 212 is in a substantially vacuum state, the vacuum pump is removed from the other end of the vacuum tube 25. At this time, even if the vacuum pump is removed from the other end of the vacuum tube 25, the substantially vacuum state of the chamber portion 212 can be maintained by the vacuum valve 26. Thus, the movable chamber 20 can move while the substantially vacuum state of the chamber portion 212 is maintained.

[0061] Thus, the chamber portions 212 of the plurality of movable chambers 20 can be sequentially brought into a substantially vacuum state by using one vacuum pump, so that the number of vacuum pumps can be reduced and / or the vacuum pumps can be miniaturized, thereby reducing costs.

[0062] like Figure 4 As shown, the heating device 30 includes a conveyor 31 capable of conveying the movable chamber 20 , and an inline oven 32 through which the movable chamber 20 conveyed by the conveyor 31 passes, thereby being capable of heating the substrate 90 accommodated in the movable chamber 20 .

[0063] The movable chamber 20 that can be moved while maintaining a substantially vacuum state of the chamber portion 212 by removing the vacuum pump from the other end of the vacuum tube 25 is placed on the conveyor 31, and the conveyor 31 is driven. Then, the movable chamber 20 passes through the inline oven 32, whereby the substrate 90 accommodated in the movable chamber 20 is heated to a predetermined temperature.

[0064] In this way, the substrate 90 accommodated in the movable chamber 20 can be heated to a predetermined temperature while the chamber portion 212 is maintained in a substantially vacuum state and the substrate 90 is pressurized by the press shaft 24 via the pressing member 28, so that the substrate 90 can be heated, pressurized, and atmosphere controlled simultaneously.

[0065] This further improves the productivity when processing the substrate 90 .

[0066] The heating device 30 for heating the substrate 90 is provided separately from the movable chamber 20 including the chamber portion 212 for accommodating the substrate 90 to form a sealed space and the pressurizing shaft 24 for pressurizing the substrate 90. Furthermore, the substrate 90 is heated by the heating device 30 which is separated from the movable chamber 20 including the chamber portion 212 for accommodating the substrate 90 to form a sealed space and the pressurizing shaft 24 for pressurizing the substrate 90.

[0067] Thus, the substrates 90 accommodated in the plurality of movable chambers 20 can be heated by one heating device 30 , thereby further improving the productivity when processing the substrates 90 .

[0068] (An example of a process for processing a substrate by a processing device)

[0069] Next, refer to Figure 5 The processing of the substrate 90 by the processing device 10 will be described. The processing example described here is to bond elements by diffusion bonding of the bonding materials using gold and nickel as bonding materials on the substrate 90 on which an integrated circuit made of copper is formed.

[0070] First, a substrate 90 is prepared, wherein the substrate 90 is formed with a copper-based integrated circuit, gold and nickel are coated on the copper-based integrated circuit as bonding materials, and components are temporarily bonded through the bonding materials. In addition, the bonding materials are diffusely bonded by heating and pressurizing, and the components are bonded to the substrate 90.

[0071] Then, the substrate 90 to which the components are temporarily bonded via the bonding material is placed in the recess of the mounting portion 221 of the mounting table 22 provided inside the chamber portion 212 of the base member 21 and the substrate 90 is aligned in the recess (step S101 ).

[0072] After the substrate 90 is placed on the placement portion 221 , the positioning member 27 is aligned and arranged on the placement portion 221 and the upper surface of the substrate 90 (step S102 ). Then, the pressing member 28 is arranged in the pressing member arrangement hole 271 formed in the positioning member 27 (step S103 ).

[0073] Next, the cover member 23 with the pressurizing shaft 24 inserted into the shaft insertion portion 231 is fitted to the base member 21 in a sealed state, and the cover member 23 is fastened to the upper surface of the base member 21 by bolts (step S104 ).

[0074] Thus, the movable chamber 20 storing the substrate 90 is assembled in the chamber portion 212 which is a sealed space.

[0075] Thereafter, a vacuum pump (not shown) is attached to the other end of the vacuum tube 25 of the movable chamber 20 (step S105 ). Then, the vacuum pump is driven to evacuate the chamber portion 212 (step S106 ).

[0076] Then, the pressure shaft 24 is pulled into the chamber 212 and slides downward by the negative pressure of the chamber 212. Furthermore, the pressure shaft 24 contacts the pressing member 28 before the positioning member 27, and presses the pressing member 28 downward. Thus, a state is achieved in which the pressure shaft 24 presses a predetermined area of ​​the substrate 90 at a predetermined pressure via the pressing member 28.

[0077] This eliminates the need for a drive source for operating the pressurizing shaft 24 , thereby reducing costs and improving productivity in processing the substrate 90 .

[0078] Furthermore, a predetermined area of ​​the substrate 90 can be pressurized with a simple structure that does not require a driving source.

[0079] At this time, the bottom area S1 of the bottom 241 of the pressurizing shaft 24 is 7 times or more, preferably 99 times or more, the area S2 of the pressed portion, which is a predetermined area of ​​the substrate 90 pressed by the pressing member 28 via the pressurizing shaft 24 .

[0080] After the chamber part 212 is in a substantially vacuum state and the predetermined region of the substrate 90 is pressurized at a predetermined pressure by the pressurizing shaft 24 via the pressing member 28, the vacuum pump is removed from the other end of the vacuum tube 25 of the movable chamber 20 (step S107). At this time, even if the vacuum pump is removed from the other end of the vacuum tube 25, the substantially vacuum state of the chamber part 212 can be maintained by the vacuum valve 26. Thus, the movable chamber 20 can move while maintaining the substantially vacuum state of the chamber part 212.

[0081] Thus, the chamber portions 212 of the plurality of movable chambers 20 can be sequentially brought into a substantially vacuum state by using one vacuum pump, so that the number of vacuum pumps can be reduced and / or the vacuum pumps can be miniaturized, thereby reducing costs.

[0082] Next, the movable chamber 20 is placed on the conveyor 31 while the chamber part 212 is maintained in a substantially vacuum state and a predetermined region of the substrate 90 is pressurized at a predetermined pressure (step S108 ).

[0083] Then, the conveyor 31 is driven at a predetermined speed so that the movable chamber 20 placed on the conveyor 31 passes through the inline oven 32 in a predetermined time (step S109 ). Thus, the substrate 90 accommodated in the chamber portion 212 of the movable chamber 20 passing through the inline oven 32 is heated to a predetermined temperature.

[0084] Therefore, the substrate 90 is heated by the heating device 30 which is separate from the movable chamber 20 including the chamber portion 212 which accommodates the substrate 90 to form a sealed space and the pressurizing shaft 24 which pressurizes the substrate 90 .

[0085] Thus, the substrates 90 accommodated in the plurality of movable chambers 20 can be heated by one heating device 30 , thereby further improving the productivity when processing the substrates 90 .

[0086] In this way, the substrate 90 accommodated in the movable chamber 20 can be heated to a predetermined temperature while the chamber portion 212 is maintained in a substantially vacuum state and the substrate 90 is pressurized by the press shaft 24 via the pressing member 28, so that the substrate 90 can be heated, pressurized, and atmosphere controlled simultaneously.

[0087] This further improves the productivity when processing the substrate 90 .

[0088] In this way, in a substantially vacuum state and heated to a predetermined temperature, a predetermined area of ​​the substrate 90 accommodated in the chamber portion 212 of the movable chamber 20 passing through the in-line oven 32 is pressurized at a predetermined pressure. Thus, heating, pressurization, and atmosphere control of the substrate 90 can be performed simultaneously, and the bonding material is diffusely bonded to bond the element to the substrate 90.

[0089] After that, the movable chamber 20 is cooled after passing through the in-line oven 32 , and a series of processes are completed.

[0090] In this process, Figure 3 As shown, the bottom area S1 of the pressurizing shaft 24 is seven times or more the predetermined area of ​​the substrate 90 pressurized by the pressing member 28 via the pressurizing shaft 24, that is, the pressed portion area S2, so that the bonding material can be reliably diffusion-bonded.

[0091] In addition, the bottom area S1 of the pressure shaft 24 is more than 99 times the specified area of ​​the substrate 90 pressurized by the pressing member 28 via the pressure shaft 24, that is, the area S2 of the pressed portion, thereby enabling the bonding material to be diffusely bonded more firmly and the element to be bonded to the substrate 90 with a high bonding rate.

[0092] Above, one embodiment of the present invention has been described with reference to the accompanying drawings, but the present invention is certainly not limited to this embodiment. Obviously, those skilled in the art can think of various variations or modifications within the scope of the technical solution, and it should be understood that these variations and modifications also belong to the technical scope of the present invention. In addition, the various constituent elements in the above-mentioned embodiment can also be arbitrarily combined within the scope of the main purpose of the invention.

[0093] For example, in the present embodiment, one pressurizing shaft 24 is provided in one movable chamber 20, but a plurality of pressurizing shafts 24 may be provided in one movable chamber 20. In this case, it is preferable to provide the same number of mounting tables 22 as the number of pressurizing shafts 24 in the chamber portion 212, so that the same number of substrates 90 as the number of pressurizing shafts 24 can be accommodated. In addition, the same number of positioning members 27 and pressing members 28 as the number of pressurizing shafts 24 and mounting tables 22 are provided. Thus, the processing amount per unit time can be further increased, and the productivity can be further improved.

[0094] At least the following matters are described in this specification: In parentheses, corresponding components in the above-mentioned embodiment are shown as an example, but the present invention is not limited to this.

[0095] (1) A processing device (processing device 10) capable of heating, pressurizing, and controlling the atmosphere of a workpiece (substrate 90), wherein:

[0096] The processing device includes a chamber device (movable chamber 20 ) having a chamber portion (chamber portion 212 ) in which the workpiece is arranged.

[0097] When the chamber portion is evacuated during the atmosphere control, a predetermined region of the workpiece can be pressurized by the negative pressure generated by the evacuation.

[0098] According to (1), a driving source for pressurizing a predetermined region of the workpiece is not required, so that the cost is reduced and the productivity in machining the workpiece is improved.

[0099] (2) The processing device according to (1), wherein:

[0100] The chamber device further includes a pressurizing shaft (pressurizing shaft 24 ) supported by a bearing (bearing 231 a ) having a shaft seal and at least a portion of which is slidable inside the chamber portion.

[0101] When the chamber portion is evacuated, the pressurizing shaft slides due to the negative pressure generated by the evacuation, and pressurizes the predetermined region of the workpiece.

[0102] According to (2), a predetermined region of the workpiece can be pressurized with a simple structure that does not require a driving source.

[0103] (3) The processing device according to (2), wherein:

[0104] The pressure shaft is cylindrical and has a bottom (bottom 241).

[0105] The area of ​​the bottom portion of the pressurizing shaft (bottom portion area S1 ) is 7 times or more the area of ​​the predetermined region of the workpiece (pressurized portion area S2 ).

[0106] According to (3), when the element is bonded to the workpiece by diffusion bonding the bonding material, the bonding material can be reliably diffusion bonded.

[0107] (4) The processing device according to (2), wherein:

[0108] The pressure shaft is cylindrical and has a bottom (bottom 241).

[0109] The area of ​​the bottom portion of the pressurizing shaft (bottom portion area S1 ) is 99 times or more the area of ​​the predetermined region of the workpiece (pressurized portion area S2 ).

[0110] According to (4), when the element is bonded to the workpiece by diffusion bonding the bonding material, the bonding material can be more firmly diffusion bonded, and the element can be bonded to the workpiece at a high bonding rate.

[0111] (5) The processing device according to (1) or (2), wherein:

[0112] By heating while maintaining the vacuum state of the chamber portion, the workpiece can be heated, pressurized, and atmosphere-controlled at the same time.

[0113] According to (5), the productivity when processing the workpiece is further improved.

[0114] (6) The processing device according to (1) or (2), wherein:

[0115] The chamber device includes a vacuum valve (vacuum valve 26) capable of maintaining the chamber portion in a vacuum state.

[0116] A vacuum pump may be detachably connected to the chamber device while maintaining the chamber portion in a vacuum state.

[0117] According to (6), the chambers of the plurality of chamber devices can be brought into a substantially vacuum state sequentially by using one vacuum pump, so that the number of vacuum pumps can be reduced and / or the vacuum pumps can be miniaturized, thereby reducing costs.

[0118] (7) The processing device according to (1) or (2), wherein:

[0119] The processing device includes a heating device (heating device 30 ) which is provided separately from the chamber device.

[0120] According to (7), the workpieces accommodated in a plurality of chamber devices can be heated by one heating device, thereby further improving the productivity when processing the workpieces.

[0121] (8) A processing technique for heating, pressurizing and controlling the atmosphere of a processed component (substrate 90), wherein:

[0122] When the atmosphere of the workpiece is evacuated, a predetermined region of the workpiece is pressurized using negative pressure generated by the evacuation.

[0123] According to (8), a driving source for pressurizing a predetermined region of the workpiece is not required, so that the cost is reduced and the productivity in machining the workpiece is improved.

[0124] (9) The processing method according to (8), wherein:

[0125] The predetermined region of the workpiece is pressurized using a pressurizing shaft (pressurizing shaft 24 ) that is slidably supported by a bearing (bearing 231 a ) having a shaft seal.

[0126] When the atmosphere of the workpiece is evacuated, the pressurizing shaft is slid by the negative pressure generated by the evacuation, thereby pressurizing the predetermined region of the workpiece.

[0127] According to (9), a predetermined region of the workpiece can be pressurized with a simple structure that does not require a driving source.

[0128] (10) The processing method according to (9), wherein:

[0129] The pressure shaft is cylindrical and has a bottom (bottom 241).

[0130] The area of ​​the bottom portion of the pressurizing shaft (bottom portion area S1 ) is 7 times or more the area of ​​the predetermined region of the workpiece (pressurized portion area S2 ).

[0131] According to (10), when the element is bonded to the workpiece by diffusion bonding the bonding material, the bonding material can be reliably diffusion bonded.

[0132] (11) The processing method according to (9), wherein:

[0133] The pressure shaft is cylindrical and has a bottom (bottom 241).

[0134] The area of ​​the bottom portion of the pressurizing shaft (bottom portion area S1 ) is 99 times or more the area of ​​the predetermined region of the workpiece (pressurized portion area S2 ).

[0135] According to (11), when the element is bonded to the workpiece by diffusion bonding the bonding material, the bonding material can be more firmly diffusion bonded, and the element can be bonded to the workpiece at a high bonding rate.

[0136] (12) The processing method according to (8) or (9), wherein:

[0137] By heating the workpiece while maintaining the atmosphere of the workpiece in a vacuum state, the workpiece is heated, pressurized, and the atmosphere is controlled at the same time.

[0138] According to (12), the productivity when processing the workpiece is further improved.

[0139] (13) The processing method according to (8) or (9), wherein:

[0140] The processing process processes the workpiece using a chamber device (movable chamber 20 ) having a vacuum valve (vacuum valve 26 ) capable of maintaining the atmosphere of the workpiece in a vacuum state.

[0141] The processing process includes the step of removing a vacuum pump from the chamber device while maintaining an atmosphere of the workpiece in a vacuum state by the vacuum valve before heating the workpiece.

[0142] According to (13), the chambers of the plurality of chamber devices can be sequentially brought into a substantially vacuum state using one vacuum pump, so that the number of vacuum pumps can be reduced and / or the vacuum pumps can be miniaturized, thereby reducing costs.

[0143] (14) The processing method according to (8) or (9), wherein:

[0144] The chamber device (movable chamber 20 ) that accommodates the workpiece can be used to pressurize and control the atmosphere of the workpiece.

[0145] The workpiece is heated using a heating device (heating device 30 ) provided separately from the chamber device.

[0146] According to (14), the workpieces accommodated in a plurality of chamber devices can be heated by one heating device, thereby further improving the productivity when processing the workpieces.

Claims

1. A processing device capable of heating, pressurizing and controlling the atmosphere of a processed part. in, The processing device includes a chamber device having a chamber portion in which the workpiece is arranged. When the chamber portion is evacuated during the atmosphere control, a predetermined region of the workpiece can be pressurized by the negative pressure generated by the evacuation.

2. The processing device according to claim 1, wherein: The chamber device further includes a pressurizing shaft supported by a bearing having a shaft seal and at least a portion of which is slidable inside the chamber portion. When the chamber portion is evacuated, the pressurizing shaft slides due to the negative pressure generated by the evacuation, and pressurizes the predetermined region of the workpiece.

3. The processing device according to claim 2, wherein: The pressure shaft is in the shape of a cylinder with a bottom. The area of ​​the bottom portion of the pressurizing shaft is 7 times or more the area of ​​the predetermined region of the workpiece.

4. The processing device according to claim 2, wherein: The pressure shaft is in the shape of a cylinder with a bottom. The area of ​​the bottom portion of the pressurizing shaft is 99 times or more the area of ​​the predetermined region of the workpiece.

5. The processing device according to claim 1 or 2, wherein: By heating while maintaining the vacuum state of the chamber portion, the workpiece can be heated, pressurized, and atmosphere-controlled at the same time.

6. The processing device according to claim 1 or 2, wherein: The chamber device includes a vacuum valve capable of maintaining the chamber portion in a vacuum state. A vacuum pump may be detachably connected to the chamber device while maintaining the chamber portion in a vacuum state.

7. The processing device according to claim 1 or 2, wherein: The processing device includes a heating device, and the heating device is provided separately from the chamber device.

8. A processing technology for heating, pressurizing and controlling the atmosphere of the processed parts. in, When the atmosphere of the workpiece is evacuated, a predetermined region of the workpiece is pressurized using negative pressure generated by the evacuation.

9. The processing technology according to claim 8, wherein: The predetermined area of ​​the workpiece is pressurized using a pressurizing shaft that is slidably supported by a bearing having a shaft seal, When the atmosphere of the workpiece is evacuated, the pressurizing shaft is slid by the negative pressure generated by the evacuation, thereby pressurizing the predetermined region of the workpiece.

10. The processing method according to claim 9, wherein: The pressure shaft is in the shape of a cylinder with a bottom. The area of ​​the bottom portion of the pressurizing shaft is 7 times or more the area of ​​the predetermined region of the workpiece.

11. The processing method according to claim 9, wherein: The pressure shaft is in the shape of a cylinder with a bottom. The area of ​​the bottom portion of the pressurizing shaft is 99 times or more the area of ​​the predetermined region of the workpiece.

12. The processing technology according to claim 8 or 9, wherein: By heating the workpiece while maintaining the atmosphere of the workpiece in a vacuum state, the workpiece is heated, pressurized, and the atmosphere is controlled at the same time.

13. The processing method according to claim 8 or 9, wherein: The processing process processes the workpiece using a chamber device having a vacuum valve capable of maintaining the atmosphere of the workpiece in a vacuum state. The processing process includes the step of removing a vacuum pump from the chamber device while maintaining an atmosphere of the workpiece in a vacuum state by the vacuum valve before heating the workpiece.

14. The processing method according to claim 8 or 9, wherein: The chamber device for storing the workpiece can be used to pressurize and control the atmosphere of the workpiece. The workpiece is heated using a heating device that is separately provided from the chamber device.

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