Ultrasonic vibration spiral grinding method

Abstract

The invention relates to an ultrasonic vibration spiral grinding method which comprises the following steps that an ultrasonic vibration structure is installed on a machining tool, and a grinding tool is installed on the ultrasonic vibration structure; a to-be-machined part is installed on the machining machine tool, and the grinding tool is moved to make contact with the to-be-machined hole wall of the to-be-machined hole in the to-be-machined part; setting separation conditions of the grinding tool and the to-be-machined hole wall; and the machining tool and the ultrasonic vibration structure are started to control the grinding tool to conduct high-speed spiral grinding machining on the to-be-machined hole wall. Before the to-be-machined hole wall is ground, the separation condition between the grinding tool and the to-be-machined hole wall is set firstly, so that the grinding speed of the grinding tool can be increased, high precision and high efficiency of spiral grinding are achieved, the grinding precision of the to-be-machined hole is guaranteed, the temperature of the grinding tool is reduced, and the service life of the grinding tool is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of precision high-speed machining, and in particular to an ultrasonic vibration spiral grinding method. Background Art

[0002] High-speed grinding technology is mainly used in aerospace, automotive and other fields. It can realize the manufacturing of parts with difficult-to-process materials such as titanium alloys and nickel-based high-temperature alloys, achieve efficient material removal rates, and at the same time improve the surface quality of parts.

[0003] Due to the high cutting speed during high-speed grinding, the friction and heat accumulation between the grinding head and the workpiece are large, which can easily lead to the increase of workpiece surface temperature and defects such as burns, and at the same time cause the grinding head to wear more, affecting the processing quality and accuracy. Therefore, improving the cooling effect and reducing the grinding force on the basis of high-speed grinding is the key to ensure precision processing.

[0004] At present, the main research ideas to break through the speed limit of grinding technology include trace gas cooling and intelligent temperature monitoring, but there are still limitations in production costs and efficiency, and it is difficult to arrange them in the processing of internal hole structures.

[0005] Ultrasonic vibration cutting has the advantages of reducing cutting force, reducing cutting temperature, improving extreme cutting ability and processing quality. However, for traditional ultrasonic vibration cutting, in order to ensure the effect of intermittent separation, the cutting speed needs to be limited to not be too large. Once the cutting speed exceeds the limit value, the advantages brought by ultrasonic vibration will be lost, which greatly limits the application of ultrasonic vibration cutting.

[0006] That is, currently when processing parts with inner hole structures, ultrasonic vibration cutting is usually adopted, which improves the ultimate cutting ability and processing quality while reducing the cutting temperature. However, the current ultrasonic vibration cutting limits the cutting speed, reduces the cutting accuracy, and limits the application of ultrasonic cutting vibration. Summary of the invention

[0007] Based on this, it is necessary to provide an ultrasonic vibration spiral grinding method to address the problem of reduced cutting speed in order to improve processing quality in the current ultrasonic vibration cutting. The method can indirectly contact and grind with the wall of the hole to be processed on the workpiece to be processed, so as to increase the grinding speed, achieve high-precision and high-efficiency processing of the hole to be processed, reduce the temperature of the grinding tool, and extend the service life of the grinding tool.

[0008] An ultrasonic vibration spiral grinding method comprises the following steps:

[0009] Installing an ultrasonic vibration structure on a processing machine tool, and installing a grinding tool on the ultrasonic vibration structure;

[0010] Mounting the workpiece to be processed on the processing machine, and moving the grinding tool so that the grinding tool contacts the wall of the hole to be processed of the workpiece to be processed;

[0011] Setting the separation condition between the grinding tool and the hole wall to be processed;

[0012] The processing machine tool and the ultrasonic vibration structure are turned on to control the grinding tool to perform high-speed spiral grinding on the hole wall to be processed.

[0013] In one embodiment of the present application, the grinding tool includes a grinding head and abrasive particles, and the abrasive particles are protrudingly disposed on the outer peripheral surface of the grinding head;

[0014] The number of the abrasive grains is one, or the number of the abrasive grains is at least two, and at least two of the abrasive grains are spaced apart along the axial direction of the grinding head.

[0015] In one embodiment of the present application, when the number of the abrasive particles is at least two, the at least two abrasive particles are made of at least one of different materials, different bonding methods, and different particle sizes.

[0016] In one embodiment of the present application, when the grinding tool is moved to make the grinding tool contact with the wall of the hole to be processed, the end of the abrasive particle contacts with the wall of the hole to be processed.

[0017] In one embodiment of the present application, the separation condition of setting the grinding tool and the wall of the hole to be processed includes:

[0018] Setting the high-speed spiral grinding parameters of the grinding tool and / or the vibration parameters of the ultrasonic vibration structure;

[0019] According to the high-speed spiral grinding parameter and / or the vibration parameter, determining whether the grinding tool and the hole wall to be processed meet the separation condition during the high-speed spiral grinding process;

[0020] If yes, controlling the grinding tool to perform high-speed spiral grinding on the hole to be processed;

[0021] If not, adjust the high-speed spiral grinding parameters and / or the vibration parameters until the grinding tool meets the separation condition from the hole wall to be processed during the grinding process.

[0022] In one embodiment of the present application, the separation condition of setting the grinding tool and the wall of the hole to be processed further includes:

[0023] When the grinding tool meets the separation condition from the hole wall to be processed during the grinding process, the grinding tool performs repeated grinding multiple times with overlapping high-speed grinding tracks.

[0024] In one embodiment of the present application, the high-speed spiral grinding parameters include one or more combinations of the rotation speed of the grinding tool, the feed speed of the grinding tool, the pitch of the grinding tool during the high-speed spiral grinding process, and the grinding depth of the grinding tool;

[0025] And / or, the vibration parameter includes the amplitude of the ultrasonic vibration structure and / or the frequency of the ultrasonic vibration structure.

[0026] In one embodiment of the present application, when the grinding tool meets the separation condition of the hole wall to be processed, the high-speed spiral grinding parameter and / or the vibration parameter should satisfy the following formula:

[0027]

[0028] Wherein, M is the number of abrasive grains whose front and rear grinding trajectories intersect, Δl is the distance between two adjacent abrasive grains, n is the rotation speed of the grinding tool, r is the radius of the grinding tool, f is the pitch of the grinding tool during high-speed spiral grinding, R is the radius of the hole to be processed, v is the feed speed of the grinding tool, A is the amplitude of the ultrasonic vibration structure, and α is the angle that a single abrasive grain rotates through when it contacts the wall of the hole to be processed from cutting in to cutting out after one rotation.

[0029] In one embodiment of the present application, after the grinding tool is installed on the ultrasonic vibration structure, the grinding tool can generate axial vibration or axial vibration component.

[0030] In one embodiment of the present application, the ultrasonic vibration structure includes an ultrasonic transducer and a horn, the ultrasonic transducer is externally connected to an AC power supply, and the horn is installed at the output end of the ultrasonic transducer;

[0031] The grinding tool is arranged at the output end of the amplitude transformer.

[0032] After adopting the above technical solution, this application has at least the following technical effects:

[0033] The ultrasonic vibration spiral grinding method of the present application can grind the wall of the hole to be processed of the workpiece to be processed, install the ultrasonic vibration structure on the processing machine, install the grinding tool on the ultrasonic vibration structure, install the workpiece to be processed on the processing machine, move the grinding tool, so that the grinding tool extends into the hole to be processed of the workpiece to be processed and contacts the wall of the hole to be processed. After setting the separation conditions of the grinding tool and the wall of the hole to be processed, start the processing machine and the ultrasonic transducer to control the grinding tool to perform high-speed spiral grinding on the wall of the hole to be processed.

[0034] The ultrasonic vibration spiral grinding method sets the separation condition between the grinding tool and the hole wall to be processed before grinding the hole wall to be processed. During the high-speed spiral grinding process, the ultrasonic vibration structure can make the grinding tool and the hole wall to be processed intermittently contact each other. In this way, when the grinding tool contacts the hole wall to be processed, the hole wall to be processed can be ground, and when the grinding tool separates from the hole wall to be processed, the grinding tool does not contact the hole wall to be processed. In this way, the grinding speed of the grinding tool can be increased, the high precision and efficiency of spiral grinding can be achieved, the grinding accuracy of the hole to be processed can be guaranteed, and the temperature of the grinding tool can be reduced, thereby extending the service life of the grinding tool. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 Flow chart of an ultrasonic vibration spiral grinding method according to an embodiment of the present application.

[0036] Figure 2 This is a schematic diagram of the ultrasonic vibration structure of the present application driving the grinding tool to grind the workpiece.

[0037] Figure 3 for Figure 2 Schematic diagram of the ultrasonic vibration structure installed on the grinding tool.

[0038] Figure 4 for Figure 2 The diagram shows the motion trajectory of the abrasive particles of the grinding tool grinding the wall of the hole to be processed.

[0039] Figure 5 for Figure 1 The flowchart of the method for separating the grinding tool from the hole wall to be processed in the ultrasonic vibration spiral grinding method is shown.

[0040] Figure 6 This is a schematic diagram of high-speed grinding using the ultrasonic vibration spiral grinding method of the present application.

[0041] Figure 7 This is a schematic diagram of the current ultrasonic vibration grinding for low-speed grinding of the hole wall to be processed.

[0042] Figure 8 for Figure 2 Schematic diagram of axial separation of adjacent grains of a grinding tool shown.

[0043] Fig. 9 for Figure 2 Schematic diagram of axial and axial separation of adjacent abrasive grains of a grinding tool shown.

[0044] Fig.10 The figure is a comparison chart of the grinding amount and roughness of the ultrasonic vibration spiral grinding of the present application and the conventional grinding under one process parameter.

[0045] Fig.11 This is a comparison chart of the grinding amount and roughness of the ultrasonic vibration spiral grinding of the present application and the conventional grinding under another process parameter.

[0046] Fig.12 This is a comparison chart of the grinding amount and roughness grinding force of ultrasonic vibration spiral grinding and conventional grinding under different process parameters.

[0047] Wherein: 100, ultrasonic vibration structure; 200, grinding tool; 210, grinding head; 220, abrasive particles; 300, workpiece to be processed; 310, hole to be processed; 311, hole wall to be processed. DETAILED DESCRIPTION

[0048] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0049] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0050] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0051] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0052] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "on" or "below" a second feature, etc., or the like, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0053] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0054] High-speed grinding technology is mainly used in aerospace, automotive and other fields. It can realize the manufacturing of parts with difficult-to-process materials such as titanium alloys and nickel-based high-temperature alloys, achieve efficient material removal rates, and at the same time improve the surface quality of parts.

[0055] Ultrasonic vibration cutting has the advantages of reducing cutting force, reducing cutting temperature, improving the ultimate cutting ability and processing quality. At present, ultrasonic vibration cutting is usually used when processing parts with inner hole structures. While reducing cutting temperature, it improves the ultimate cutting ability and processing quality. However, the current ultrasonic vibration cutting limits the cutting speed, reduces the cutting accuracy, and limits the application of ultrasonic cutting vibration.

[0056] For this purpose, see Figure 1 and Figure 2The present application provides an ultrasonic vibration spiral grinding method, which can perform grinding on a workpiece 300. Figure 1 This is a flow chart of an ultrasonic vibration spiral grinding method according to an embodiment of the present application. Figure 2 It is a schematic diagram of the ultrasonic vibration structure 100 of the present application driving the grinding tool 200 to grind the workpiece 300 .

[0057] It can be understood that grinding is a mechanical processing method for removing materials. When the grinding tool 200 rotates at high speed, it can remove excess material on the workpiece 300 to perform precision processing on the workpiece 300, improve the processing accuracy of the workpiece 300, and ensure the quality of the workpiece 300.

[0058] In this embodiment, the workpiece 300 to be processed has a hole 310 to be processed. Figure 2 The hole 310 to be processed is located in the middle area of ​​the workpiece 300 to be processed. The hole 310 to be processed extends in the axial direction (height direction, up and down direction). The grinding tool 200 can extend into the hole 310 to grind the hole wall 311 of the hole 310 to be processed.

[0059] Moreover, the present application is described with the axial direction of the hole 310 to be processed as the orientation reference. It can be understood that the workpiece 300 to be processed is a component of a difficult-to-process material such as a titanium alloy or a nickel-based high-temperature alloy, which can be applied to the fields of aerospace, automobiles, etc. Of course, in other embodiments of the present application, the workpiece 300 to be processed can also be other components whose inner holes need to be ground.

[0060] Furthermore, the shape of the workpiece 300 is not limited in principle. Figure 2 The workpiece 300 shown in the figure is a schematic diagram of a cutout portion. The workpiece 300 may also be in other shapes. The shape of the workpiece 300 will not be described in the following description of the ultrasonic vibration spiral grinding method.

[0061] The ultrasonic vibration spiral grinding method of the present application uses a grinding tool 200 to perform high-speed spiral grinding on the hole wall 311 when grinding the workpiece 300. The grinding tool 200 here is a grinding head 210 with abrasive particles 220, and its specific structure is described below.

[0062] The ultrasonic vibration spiral grinding method of the present application can perform indirect contact grinding with the to-be-machined hole wall 311 of the to-be-machined hole 310 on the to-be-machined workpiece 300, so as to increase the grinding speed, realize high-precision and high-efficiency machining of the to-be-machined hole 310, and reduce the temperature of the grinding tool 200, thereby extending the service life of the grinding tool 200. The ultrasonic vibration spiral grinding method of the present application is described below.

[0063] See also Figure 1 and Figure 2 In one embodiment, the ultrasonic vibration spiral grinding method comprises the following steps:

[0064] S1 , installing the ultrasonic vibration structure 100 on a processing machine tool, and installing the grinding tool 200 on the ultrasonic vibration structure 100 .

[0065] The ultrasonic vibration structure 100 can receive the ultrasonic frequency of the external alternating current, and can output vibration motion at the ultrasonic frequency. The top of the ultrasonic vibration structure 100 is mounted on the processing machine tool, that is, the fixed end of the ultrasonic vibration structure 100 is mounted on the processing machine tool.

[0066] The grinding tool 200 is installed at the output end of the ultrasonic vibration structure 100. When the ultrasonic vibration structure 100 outputs vibration motion, it can drive the grinding tool 200 to vibrate synchronously. At the same time, the processing machine can also drive the ultrasonic vibration structure 100 to rotate, and then the ultrasonic vibration structure 100 can drive the grinding tool 200 to rotate to perform high-speed spiral grinding operation.

[0067] It is understandable that the processing machine tool in the present application can be a vertical grinder or a vertical milling machine. The processing machine tool has a spindle and a chuck, the chuck is arranged at the end of the spindle, and the chuck can clamp the fixed end of the ultrasonic vibration structure 100 to achieve the fixation of the ultrasonic vibration structure 100.

[0068] The processing machine tool drives the spindle to rotate, and then the spindle drives the ultrasonic vibration structure 100 and the grinding tool 200 to rotate around the axis of the spindle through the three-jaw chuck. In this application, the rotation speed of the grinding tool 200 is the rotation speed of the spindle, that is, Figure 2 The speed n is shown.

[0069] At the same time, the spindle can also drive the ultrasonic vibration structure 100 and the grinding tool 200 to move axially along the spindle through the three-jaw chuck, so as to perform feeding operations while rotating. In addition, the ultrasonic vibration structure 100 drives the grinding tool 200 to vibrate, so that the grinding tool 200 can perform high-speed spiral grinding operations.

[0070] like Figure 2 As shown, when the grinding tool 200 performs high-speed spiral grinding operation, the grinding tool 200 moves axially at a feed speed v, the grinding tool 200 performs spiral motion at a pitch f, and the ultrasonic vibration structure 100 drives the grinding tool 200 to vibrate at an amplitude A.

[0071] It is worth noting that the focus of this application is to use the ultrasonic vibration spiral grinding method of this application to perform high-speed spiral grinding on the processing hole wall 311. The type, structure and working principle of the processing machine tool are not the focus of this application and will not be repeated below.

[0072] S2, installing the workpiece 300 on the processing machine, moving the grinding tool 200, so that the grinding tool 200 is in contact with the hole wall 311 of the hole 310 on the workpiece 300.

[0073] After the grinding tool 200 and the ultrasonic vibration structure 100 are installed on the processing machine, the workpiece 300 is fixed to the processing machine, and the hole 310 to be processed of the workpiece 300 is exposed. Subsequently, the position of the grinding tool 200 is adjusted by the processing machine so that the grinding tool 200 can be moved into the hole 310 to be processed.

[0074] It is understandable that after the workpiece 300 is installed on the processing machine, the hole 310 to be processed can be set corresponding to the grinding tool 200. In this way, the processing machine controls the main shaft to drive the ultrasonic vibration structure 100 and the grinding tool 200 to perform the moving operation, and the grinding tool 200 can be moved into the hole 310 to be processed.

[0075] After the grinding tool 200 moves to the hole 310 to be processed, the outer wall of the grinding tool 200 contacts the hole wall 311 of the hole 310 to be processed. When the spindle drives the grinding tool 200 to rotate at high speed through the ultrasonic vibration structure 100, the grinding tool 200 can perform high-speed spiral grinding on the hole wall 311 to be processed.

[0076] S3, setting the separation condition between the grinding tool 200 and the hole wall 311 to be processed.

[0077] After the grinding tool 200 moves into the hole 310 to be processed and contacts the hole wall 311 to be processed, it is necessary to set a separation condition between the grinding tool 200 and the hole wall 311 to be processed. The separation condition here means that the grinding tool 200 is separated from the hole wall 311 to be processed.

[0078] That is, the grinding tool 200 is in indirect contact with the hole wall 311 to be processed, and the grinding tool 200 uses intermittent grinding to grind the hole wall 311 to be processed. During the high-speed spiral grinding process, the grinding tool 200 is in contact with the hole wall 311 to be processed for a period of time to perform the high-speed spiral grinding operation.

[0079] In the next period of time, the grinding tool 200 is separated from the wall of the hole to be processed 310. At this time, the grinding tool 200 no longer performs high-speed spiral grinding operation on the wall of the hole to be processed 310, but the spindle still drives the grinding tool 200 to rotate. In another period of time, the grinding tool 200 contacts the wall 311 of the hole to be processed.

[0080] In this way, during the high-speed spiral grinding process, the relationship between the grinding tool 200 and the hole wall 311 to be processed is: the grinding tool 200 is in contact with the hole wall 311 to be processed - the grinding tool 200 is not in contact with the hole wall 311 to be processed - the grinding tool 200 is in contact with the hole wall 311 to be processed - the grinding tool 200 is not in contact with the hole wall 311 to be processed - the grinding tool 200 is in contact with the hole wall 311 to be processed -…

[0081] In this way, when the ultrasonic vibration structure 100 is used to drive the grinding tool 200 to perform ultrasonic vibration spiral grinding, it has the advantages of reducing cutting force, reducing cutting temperature, improving ultimate cutting ability and processing quality. At the same time, by setting the separation condition between the grinding tool 200 and the hole wall 311 to be processed, the grinding speed can be increased, and high precision and efficiency of spiral grinding can be achieved.

[0082] Moreover, during the high-speed spiral grinding process, the grinding tool 200 is separated from the hole wall 311 to be processed, which can also extend the life of the grinding tool 200. It can be understood that the separation of the high-speed spiral grinding process can improve the cooling effect, reduce the grinding force, slow down the wear of the grinding tool 200, and thus extend the service life of the grinding tool 200.

[0083] The wear of the grinding tool 200 is divided into three stages: initial wear, stable wear, and severe wear. Correspondingly, the roughness will first decrease and stabilize, and then increase sharply as the grinding tool 200 wears. Therefore, when the roughness increases sharply, the grinding tool 200 is considered to be ineffective, and the experiment is stopped. The cumulative grinding removal at this time is the life of the grinding tool 200.

[0084] S4, turning on the processing machine tool and the ultrasonic vibration structure 100 to control the grinding tool 200 to perform high-speed spiral grinding on the hole wall 311 to be processed.

[0085] After the separation condition between the grinding tool 200 and the hole wall 311 to be processed is set, the grinding tool 200 can perform a grinding operation. At this time, the processing machine and the ultrasonic vibration structure 100 are turned on, and the processing machine can drive the grinding tool 200 to rotate and move (feed) through the ultrasonic vibration structure 100. At the same time, the ultrasonic vibration structure 100 can drive the grinding tool 200 to vibrate, so that the grinding tool 200 can perform a high-speed spiral grinding operation on the hole wall 311 to be processed.

[0086] In the ultrasonic vibration spiral grinding method of the above embodiment, before grinding the hole wall 311 to be processed, the separation condition between the grinding tool 200 and the hole wall 311 to be processed is first set. During the high-speed spiral grinding process, the ultrasonic vibration structure 100 can make intermittent contact between the grinding tool 200 and the hole wall 311 to be processed. In this way, when the grinding tool 200 contacts the hole wall 311 to be processed, the hole wall 311 to be processed can be ground. When the grinding tool 200 separates from the hole wall 311 to be processed, the grinding tool 200 does not contact the hole wall 311 to be processed. In this way, the grinding speed of the grinding tool 200 can be improved, the high precision and efficiency of spiral grinding can be achieved, the grinding accuracy of the hole 310 to be processed is guaranteed, and the temperature of the grinding tool 200 is reduced, thereby extending the service life of the grinding tool 200.

[0087] See also Figure 1 , Figure 3 and Figure 4 In one embodiment, the grinding tool 200 includes a grinding head 210 and abrasive particles 220, and the abrasive particles 220 are protrudingly arranged on the outer peripheral surface of the grinding head 210. The number of the abrasive particles 220 is one, or the number of the abrasive particles 220 is at least two, and at least two abrasive particles 220 are arranged at intervals along the axial direction and / or circumferential direction of the grinding head 210. Figure 3 for Figure 2 The schematic diagram of the ultrasonic vibration structure 100 installed with the grinding tool 200 is shown. Figure 4 for Figure 2 The diagram shows the motion trajectory of the abrasive grains 220 of the grinding tool 200 grinding the hole wall 311 to be processed.

[0088] The grinding head 210 is the main body of the grinding tool 200. The grinding head 210 is cylindrical. The central axis of the grinding head 210 is installed to the output end of the ultrasonic vibration structure 100. The abrasive particles 220 are components for the grinding tool 200 to perform grinding operations. The abrasive particles 220 are arranged on the outer peripheral surface of the grinding head 210, and the abrasive particles 220 are arranged to protrude from the outer peripheral surface of the grinding head 210.

[0089] When the grinding tool 200 performs high-speed spiral grinding on the hole wall 311 to be processed, the abrasive particles 220 can contact the surface of the hole wall to be processed and perform a grinding operation on the hole wall 311 to be processed to remove excess material of the hole wall 311 to be processed and reduce the surface roughness of the hole wall 311 to be processed.

[0090] In this embodiment, the grinding tool 200 includes at least two abrasive grains 220, and at least two abrasive grains 220 are arranged at intervals on the outer peripheral surface of the grinding head 210. In this way, the plurality of abrasive grains 220 can contact the hole wall 311 to be processed respectively, thereby increasing the contact area between the grinding tool 200 and the hole wall 311 to be processed and improving the grinding efficiency.

[0091] At the same time, after the previous abrasive particle 220 contacts the hole wall 311 to be processed, the next abrasive particle 220 can contact the hole wall 311 to be processed in the area where the previous abrasive particle 220 did not contact. In this way, the height of the unprocessed area is reduced, the area of ​​the unprocessed area is reduced, the grinding quality is improved, and the surface roughness of the hole wall 311 to be processed is reduced.

[0092] Of course, in other embodiments of the present application, an abrasive grain 220 may also be provided on the grinding head 210 , and the grinding operation is performed on the hole wall 311 to be processed by the abrasive grain 220 .

[0093] It is worth noting that the grinding principle of the grinding tool 200 having one abrasive grain 220 is substantially the same as that of the grinding tool 200 having at least two abrasive grains 220 . When the front and rear abrasive grains 220 grind the hole wall 311 to be processed, it can correspond to two processings of one abrasive grain 220 .

[0094] The following description will only take the grinding tool 200 having at least two abrasive grains 220 as an example, and the grinding tool 200 having one abrasive grain 220 will not be described in detail.

[0095] Figure 4 The schematic diagram of the motion trajectory of a single abrasive grain 220 in the grinding tool 200 is shown. The spindle drives the grinding tool 200 to rotate at high speed and feed axially through the ultrasonic vibration structure 100. At the same time, the ultrasonic vibration structure 100 drives the grinding tool 200 to vibrate along the axial direction. In this way, the grinding tool 200 can perform high-speed spiral motion, and then the abrasive grain 220 on the grinding tool 200 can be subjected to high-speed spiral grinding.

[0096] Figure 4 In the figure, the left side is a schematic diagram of the overall motion trajectory of a single abrasive particle 220, and the right side is a partial enlarged view of the motion trajectory. It can be seen from the figure that the grinding tool 200 can perform spiral motion as a whole when rotating itself, so as to perform high-speed spiral grinding operation on the hole wall 311 to be processed.

[0097] In one embodiment, when the number of the abrasive particles 220 is at least two, the at least two abrasive particles 220 are made of at least one of different materials, different bonding methods, and different particle sizes.

[0098] The materials of at least two abrasive grains 220 in the grinding tool 200 are different, for example, the materials of the abrasive grains 220 are boron carbide, chrome corundum, silicon carbide, etc. In this way, the at least two abrasive grains 220 have different processing effects on the hole wall 311 to be processed, so that the hole wall 311 to be processed reaches the required surface roughness after processing.

[0099] The bonding methods of at least two abrasive grains 220 in the grinding tool 200 are different. For example, the abrasive grains 220 are set on the grinding head 210 by electroplating, or the abrasive grains 220 can be set on the grinding head 210 by bonding, etc. In this way, the abrasive grains 220 have different processing effects on the hole wall 311 to be processed due to different bonding methods, so that the hole wall 311 to be processed can achieve the desired surface roughness after processing.

[0100] At least two abrasive grains 220 in the grinding tool 200 have different particle sizes. The particle size refers to the size of the abrasive grain 220, and the particle size is measured by the diameter (generally the long diameter or the median diameter) of the abrasive grain 220. In this way, the processing effects of the abrasive grains 220 on the hole wall 311 to be processed are different due to different particle sizes, so that the hole wall 311 to be processed can achieve the desired surface roughness after processing.

[0101] In the grinding tool 200 used in the ultrasonic vibration spiral grinding method of the present application, at least two abrasive particles 220 may have at least one of different materials, different bonding methods and different particle sizes, so that the processing effects of the abrasive particles 220 on the hole wall 311 to be processed are also different, so that the hole wall 311 to be processed can achieve the desired surface roughness after processing.

[0102] like Figure 2 As shown, in one embodiment, after the grinding tool 200 is installed on the processing machine tool through the ultrasonic vibration structure 100, the grinding tool 200 can vibrate in the axial direction or the component of the axial vibration. In this way, the ultrasonic vibration structure 100 can drive the grinding tool 200 to vibrate in the axial direction to reduce the grinding force in the high-speed spiral grinding process, reduce the grinding temperature, and improve the ultimate grinding ability and processing quality.

[0103] like Figure 2 As shown, in one embodiment, after the grinding tool 200 is installed on the processing machine tool through the ultrasonic vibration structure 100, the grinding tool 200 can vibrate in the axial direction. In this way, the ultrasonic vibration structure 100 can drive the grinding tool 200 to vibrate in the axial direction to reduce the grinding force during high-speed spiral grinding, reduce the grinding temperature, and improve the ultimate grinding ability and processing quality.

[0104] like Figure 2 As shown, in one embodiment, the vibration direction of the ultrasonic vibration structure 100 coincides with the central axis of the grinding tool 200. In this way, the ultrasonic vibration structure 100 can accurately vibrate in the axial direction.

[0105] like Figure 2As shown, in one embodiment, when the grinding tool 200 is moved to make the grinding tool 200 contact the hole wall 311 to be processed, the end of the abrasive grain 220 contacts the hole wall 311 to be processed. That is, after the grinding tool 200 moves to the hole 310 to be processed, the top of the abrasive grain 220, that is, the end of the abrasive grain 220 away from the grinding head 210 can contact the hole wall 311 to be processed.

[0106] That is, when the grinding tool 200 has no feed, the grinding tool 200 has not yet been ground, and the grinding depth is zero, the top of the abrasive grain 220 can contact the hole wall 311 to be processed. In this way, when the main shaft drives the grinding head to rotate through the ultrasonic vibration structure 100, the grinding head can perform a grinding operation on the hole wall 311 to be processed.

[0107] See also Figure 1 , Figure 2 and Figure 5 , Figure 5 for Figure 1 The flowchart of the method for setting the separation of the grinding tool 200 and the hole wall 311 to be processed in the ultrasonic vibration spiral grinding method is shown. In one embodiment, the separation condition of setting the grinding tool 200 and the hole wall 311 to be processed includes:

[0108] Setting the high-speed spiral grinding parameters of the grinding tool 200 and / or the vibration parameters of the ultrasonic vibration structure 100;

[0109] According to the high-speed spiral grinding parameter and / or the vibration parameter, determining whether the grinding tool 200 and the to-be-processed hole wall 311 satisfy the separation condition during the high-speed spiral grinding process;

[0110] If yes, control the grinding tool 200 to perform high-speed spiral grinding on the hole to be processed 310;

[0111] If not, adjust the high-speed spiral grinding parameters and / or the vibration parameters until the grinding tool 200 meets the separation condition from the hole wall 311 to be processed during the grinding process.

[0112] In the ultrasonic vibration spiral grinding method of the present application, by setting the high-speed spiral grinding parameters of the grinding tool 200 and the vibration parameters of the ultrasonic vibration structure 100, the abrasive particles 220 of the grinding head 210 meet the separation conditions from the hole wall 311 to be processed during the high-speed spiral grinding process.

[0113] Before starting the processing machine tool and the ultrasonic vibration structure 100, first set the high-speed spiral grinding parameters of the grinding tool 200 and the vibration parameters of the ultrasonic vibration structure 100. According to the high-speed spiral parameters and the vibration parameters, determine whether the grinding tool 200 and the hole wall 311 to be processed meet the separation conditions during the high-speed spiral grinding process.

[0114] If the grinding tool 200 and the hole wall 311 to be processed meet the separation condition during the high-speed spiral grinding process, the processing machine tool and the ultrasonic vibration structure 100 are turned on. At this time, the processing machine tool can drive the grinding height to rotate at a high speed through the ultrasonic vibration structure 100. At the same time, the ultrasonic vibration structure 100 can drive the grinding tool 200 to vibrate, so that the grinding tool 200 performs a high-speed spiral grinding operation on the hole wall 311 to be processed.

[0115] If the grinding tool 200 and the hole wall 311 to be processed do not meet the separation condition during the high-speed spiral grinding process, adjust the high-speed spiral grinding parameters of the grinding tool 200, and / or adjust the vibration parameters of the ultrasonic vibration structure 100, and then judge whether the grinding tool 200 and the hole wall 311 to be processed meet the separation condition during the high-speed spiral grinding process based on the adjusted high-speed spiral grinding parameters and / or vibration parameters.

[0116] If the grinding tool 200 and the hole wall 311 to be processed still do not meet the separation condition during the high-speed spiral grinding process, continue to adjust the high-speed spiral grinding parameters of the grinding tool 200, and / or adjust the vibration parameters of the ultrasonic vibration structure 100 until the grinding tool 200 and the hole wall 311 to be processed meet the separation condition during the high-speed spiral grinding process, and then the grinding tool 200 can be controlled to perform a high-speed spiral grinding operation.

[0117] See also Figure 1 , Figure 2 , Figure 5 and Figure 6 , Figure 6 Schematic diagram of high-speed grinding by the ultrasonic vibration spiral grinding method of the present application. In one embodiment, the separation condition of the grinding tool 200 and the hole wall 311 to be processed is set, and further includes:

[0118] When the grinding tool 200 meets the separation condition from the to-be-machined hole wall 311 during the grinding process, the grinding tool 200 performs repeated grinding multiple times with overlapping high-speed grinding tracks.

[0119] It is understandable that when the processing machine tool drives the grinding tool 200 to rotate, the rotation speed of the grinding tool 200 is generally greater than or equal to 3000 rpm. The rotation speed of the grinding tool 200 is relatively high. When the grinding tool 200 grinds one circle, the grinding tool 200 has not yet been fed downward. At this time, the grinding tool 200 can repeatedly grind the same position through the abrasive particles 220, so that the grinding tracks at high speed overlap.

[0120] In this way, the grinding tool 200 can repeatedly grind the hole wall 311 to be processed at the same position through the abrasive particles 220, thereby obtaining a surface morphology with a smaller residual height and a regular arrangement, thereby reducing the surface roughness of the hole wall 311 to be processed. Figure 4 shown.

[0121] like Figure 2 , Figure 6 and Figure 7 As shown, the ultrasonic vibration spiral method of the present application is compared with the current ultrasonic vibration grinding for processing the hole wall 311 to be processed of the present application. Figure 7 It is a schematic diagram of the current ultrasonic vibration grinding for low-speed grinding of the hole wall 311 to be processed.

[0122] exist Figure 6 and Figure 7 In the figure, n is the rotation speed of the grinding tool 200, v is the feed speed of the grinding tool 200, the spiral line is the cutting trajectory of the abrasive grains 220, and the thickness of the removed material is the grinding depth.

[0123] exist Figure 7 It can be seen that the grinding tool 200 rotates at a low speed and performs low-speed spiral grinding on the hole wall 311 to be processed. The abrasive particles 220 perform a grinding process at the same position. Less material is removed from the hole wall 311 to be processed, and more material remains at the hole wall 311 to be processed. The surface roughness of the hole wall 311 to be processed is higher.

[0124] exist Figure 6 It can be seen that when the hole wall 311 to be processed is subjected to high-speed spiral grinding, the abrasive particles 220 are repeatedly ground at the same position for multiple times, and the grinding tool 200 can remove excess material of the hole wall 311 to be processed, leaving a surface morphology with a smaller residual height and a regular arrangement, thereby reducing the surface roughness of the hole wall 311 to be processed.

[0125] And, in Figure 6 In comparison with Figure 7 In particular, when the ultrasonic vibration spiral grinding method of the present application performs high-speed spiral grinding on the hole wall 311 to be processed, the grinding tool 200 can grind the hole wall 311 to be processed to a deeper grinding depth, so that the material of the hole wall 311 to be processed can be removed as much as possible, reducing the surface roughness of the hole wall 311 to be processed.

[0126] See also Figure 1 , Figure 2 and Figure 4 In one embodiment, the high-speed spiral grinding parameters include one or more combinations of the rotation speed of the grinding tool 200, the feed speed of the grinding tool 200, the pitch of the grinding tool 200 during the high-speed spiral grinding process, and the grinding depth of the grinding tool 200.

[0127] It is understandable that the high-speed spiral grinding parameters of the grinding tool 200 are related to the rotation speed, feed speed, pitch and grinding depth of the grinding tool 200. The rotation speed of the grinding tool 200 here is higher than the ordinary grinding rotation speed.

[0128] If the grinding tool 200 and the hole wall 311 to be processed do not meet the separation condition during the high-speed spiral grinding process, one or more of the high-speed spiral parameters of the grinding tool 200, including the rotation speed, feed speed, pitch and grinding depth of the grinding tool 200 during the high-speed spiral grinding process, can be adjusted to make the grinding tool 200 and the hole wall 311 to be processed meet the separation condition during the high-speed spiral grinding process.

[0129] See also Figure 1 , Figure 2 and Figure 4 In one embodiment, the vibration parameter includes the amplitude of the ultrasonic vibration structure 100 and / or the frequency of the ultrasonic vibration structure 100. It can be understood that the vibration parameter of the ultrasonic vibration structure 100 is related to the amplitude and frequency of the ultrasonic vibration structure 100.

[0130] If the grinding tool 200 and the hole wall 311 to be processed do not meet the separation condition during the high-speed spiral grinding process, the amplitude and / or frequency of the ultrasonic vibration structure 100 can be adjusted in the ultrasonic vibration structure 100 so that the grinding tool 200 and the hole wall 311 to be processed meet the separation condition during the high-speed spiral grinding process.

[0131] See also Figures 1 to 5 , Figure 8 and Fig. 9 , Figure 8 for Figure 2 The schematic diagram of the axial separation of adjacent abrasive grains 220 of the grinding tool 200 shown in FIG. Fig. 9 for Figure 2 The schematic diagram of the axial and axial separation of adjacent abrasive grains 220 of the grinding tool 200 is shown. In one embodiment, when the grinding tool 200 meets the separation condition of the hole wall 311 to be processed, the high-speed spiral grinding parameter and / or the vibration parameter should satisfy the following formula:

[0132]

[0133] Among them, M is the number of abrasive grains 220 intersecting the front and rear grinding trajectories of the grinding tool 200, Δl is the distance between two adjacent abrasive grains 220, n is the rotation speed of the grinding tool 200, r is the radius of the grinding tool 200, f is the pitch of the grinding tool 200 during high-speed spiral grinding, R is the radius of the hole 310 to be processed, v is the feed speed of the grinding tool 200, A is the amplitude of the ultrasonic vibration structure 100, and α is the angle that a single abrasive grain 220 rotates through when it contacts the wall 311 of the hole to be processed from cutting in to cutting out.

[0134] It can be understood that in a certain processing area of ​​the hole wall 311 to be processed, the motion trajectory of the abrasive grains 220 in the grinding tool 200 is a sine curve. When the grinding tool 200 rotates at a high speed, the latter abrasive grain 220 in the grinding tool 200 will overlap with the area that has been processed by the former abrasive grain 220, resulting in the latter abrasive grain 220 being separated from the hole wall 311 to be processed in this area, such as Figure 8 shown.

[0135] exist Figure 8 In, G N-1 Schematic diagram of the motion trajectory of the previous abrasive particle 220, G N Schematic diagram of the motion trajectory of the next abrasive particle 220. A is the amplitude of the ultrasonic vibration structure 100. Figure 8 Middle, front abrasive 220G N-1 The motion trajectory of the latter abrasive particle 220G N The axial spacing of the motion trajectory is less than 2A.

[0136] from Figure 8 It can be seen that the previous abrasive 220G N-1 After grinding the hole wall 311 to be processed, a wave-shaped structure is formed on the surface of the hole wall 311 to be processed. N After grinding the hole wall 311 at the same position, it will be ground with the previous abrasive 220G N-1 There are overlapping areas in the motion trajectories, which affects the separation effect.

[0137] G N’ The motion trajectory of the third abrasive particle 220 is shown. Figure 8 Middle and rear abrasive 220G N And the third abrasive 220G N’ The motion trajectory of the previous abrasive particle is roughly the same as that of the previous abrasive particle 220G N-1 The motion trajectory of the third abrasive 220G N’ When the axial spacing between the motion trajectories is equal to 2A, the third abrasive particle 220G N’ The motion trajectory of the previous abrasive particle 220G N-1There is no overlapping area between the motion trajectories, which will not affect the separation effect.

[0138] G N” Schematic diagram of the motion trajectory of the fourth abrasive particle 220. Figure 8 Middle and rear abrasive 220G N And the fourth abrasive 220G N” The motion trajectory of the previous abrasive particle is roughly the same as that of the previous abrasive particle 220G N-1 The motion trajectory of the fourth abrasive 220G N” When the axial spacing between the motion trajectories is greater than 2A, the fourth abrasive particle 220G N” The movement trajectory is far away from the previous abrasive particle 220G N-1 There is no overlapping area between the two, which will not affect the separation effect.

[0139] It can be seen that the separation condition of the grinding tool 200 and the hole wall 311 to be processed is related to the high-speed spiral grinding parameters and the amplitude of the ultrasonic vibration. According to the different relationships between the motion parameters and the amplitude of the ultrasonic vibration, the separation process is also different. The separation effect can only be achieved when the axial spacing of the wear marks is less than 2A, and the larger the A, the larger the separation area, ensuring the separation effect of the grinding tool 200 and the hole wall 311 to be processed.

[0140] At the same time, since the circumferential cutting arc length of a single abrasive grain 220 on the hole wall 311 to be processed is limited, when multiple abrasive grains 220 are ground, the front and rear abrasive grains 220 need to meet the trajectory intersection in the circumferential and axial directions of the hole wall at the same time, that is, the front abrasive grain 220G N With the latter abrasive 220G N+1 , Another abrasive 220G N+2 The best separation effect can be achieved by enclosing the separation areas. Fig. 9 shown.

[0141] Therefore, when setting the separation conditions between the grinding tool 200 and the hole wall 311 to be processed, the high-speed spiral grinding parameters, the relevant parameters of the abrasive 220 and the vibration parameters are substituted into the above formula to determine whether the above formula is valid, thereby being able to determine whether the grinding tool 200 and the hole wall 311 to be processed meet the separation conditions.

[0142] In one embodiment, the ultrasonic vibration structure 100 includes an ultrasonic transducer and a horn, the ultrasonic transducer is externally connected to an AC power source, and the horn is installed at the output end of the ultrasonic transducer. The grinding tool 200 is arranged at the output end of the horn.

[0143] In this way, the ultrasonic transducer is connected to an external ultrasonic power supply to output ultrasonic frequency alternating current to drive the ultrasonic transducer to generate vibration. After the amplitude of the ultrasonic transducer is amplified by the amplitude transformer, it finally drives the tool to achieve axial stable ultrasonic frequency vibration.

[0144] The ultrasonic vibration spiral grinding method of the present application breaks through the cutting speed limit of traditional ultrasonic vibration cutting, improves the processing difficulties of the surface roughness, accuracy and efficiency of the hole 310 to be processed due to the small aperture and large depth, and realizes high-precision and high-efficiency processing of the hole 310 to be processed.

[0145] At the same time, the ultrasonic vibration spiral grinding method can effectively reduce the surface roughness of the hole wall 311 to be processed, breaking through the processing parameter limitations, such as Fig.10 and Fig.11 As shown, Fig.10 The figure is a comparison chart of the grinding amount and roughness of the ultrasonic vibration spiral grinding and the conventional grinding of the present application under one process parameter. Fig.11 This is a comparison chart of the grinding amount and roughness of the ultrasonic vibration spiral grinding of the present application and the conventional grinding under another process parameter.

[0146] Fig.10 In the experiment, the rotation speed n is 5000 rpm, the feed speed v is 600 mm / min, and the pitch is 0.1 mm. Fig.11 In the experiment, the rotation speed n is 7000 rpm, the feed speed v is 600 mm / min, and the pitch is 0.1 mm.

[0147] Taking the roughness of 1.6μm as the standard, compared with ordinary grinding, when the rotation speed n is 5000r / min, the roughness of ordinary processing is basically above 1.6μm, and it is considered that it is not possible to process under this condition, while ultrasonic spiral grinding can stably process and reduce the roughness of the hole wall 311 to be processed. The roughness can be reduced by about 63.7% at most. When the rotation speed n is 7000r / min, most of the ordinary processing roughness is above 1.6μm, while ultrasonic spiral grinding can stably process and reduce the roughness of the hole wall 311 to be processed.

[0148] At the same time, the ultrasonic vibration spiral grinding method of the present application can effectively extend the service life of the grinding tool 200 and improve the wear of the grinding tool 200. Fig.10 and Fig.11 The cumulative grinding amount that the grinding tool 200 can normally grind can be increased by up to 97%, and the roughness can be reduced at the same cumulative grinding amount.

[0149] like Fig.12 As shown, Fig.12The figure is a comparison of the grinding amount and roughness of ultrasonic vibration spiral grinding and conventional grinding under different process parameters. Using the ultrasonic vibration spiral grinding method of the present application, the grinding force can be effectively reduced under different processing parameters, and the effect of reducing the grinding force is better as the amplitude of the ultrasonic vibration increases. When the amplitude of the ultrasonic vibration is 12μm, the grinding force can be reduced by about 52.9% at most.

[0150] The high-speed ultrasonic spiral grinding method of the present application can achieve the separation conditions of high-speed spiral grinding by adjusting the processing parameters, improve the grinding speed, and achieve high precision and efficiency of spiral grinding. At the same time, it can reduce the temperature of the grinding tool 200 and extend the service life of the grinding tool 200.

[0151] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0152] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An ultrasonic vibration spiral grinding method, characterized in that: The steps include: Installing an ultrasonic vibration structure on a processing machine tool, and installing a grinding tool on the ultrasonic vibration structure; Mounting the workpiece to be processed on the processing machine, and moving the grinding tool so that the grinding tool contacts the wall of the hole to be processed of the workpiece to be processed; Setting the separation condition between the grinding tool and the hole wall to be processed; The processing machine tool and the ultrasonic vibration structure are turned on to control the grinding tool to perform high-speed spiral grinding on the hole wall to be processed.

2. The ultrasonic vibration spiral grinding method according to claim 1, characterized in that: The grinding tool comprises a grinding head and abrasive particles, wherein the abrasive particles are protrudingly arranged on the outer peripheral surface of the grinding head; The number of the abrasive grains is one, or the number of the abrasive grains is at least two, and at least two of the abrasive grains are spaced apart along the axial direction and / or circumferential direction of the grinding head.

3. The ultrasonic vibration spiral grinding method according to claim 2, characterized in that: When the number of the abrasive particles is at least two, the at least two abrasive particles are made of at least one of different materials, different bonding methods, and different particle sizes.

4. The ultrasonic vibration spiral grinding method according to claim 2, characterized in that: When the grinding tool is moved to make it contact with the wall of the hole to be processed, the end of the abrasive grain contacts with the wall of the hole to be processed.

5. The ultrasonic vibration spiral grinding method according to any one of claims 1 to 4, characterized in that: The separation condition of setting the grinding tool and the hole wall to be processed includes: Setting the high-speed spiral grinding parameters of the grinding tool and / or the vibration parameters of the ultrasonic vibration structure; According to the high-speed spiral grinding parameter and / or the vibration parameter, determining whether the grinding tool and the hole wall to be processed meet the separation condition during the high-speed spiral grinding process; If yes, controlling the grinding tool to perform high-speed spiral grinding on the hole to be processed; If not, adjust the high-speed spiral grinding parameters and / or the vibration parameters until the grinding tool meets the separation condition from the hole wall to be processed during the grinding process.

6. The ultrasonic vibration spiral grinding method according to claim 5, characterized in that: The step of setting the separation condition between the grinding tool and the hole wall to be processed further includes: When the grinding tool meets the separation condition from the hole wall to be processed during the grinding process, the grinding tool performs repeated grinding multiple times with overlapping high-speed grinding tracks.

7. The ultrasonic vibration spiral grinding method according to claim 5, characterized in that: The high-speed spiral grinding parameters include one or more combinations of the rotation speed of the grinding tool, the feed speed of the grinding tool, the pitch of the grinding tool during the high-speed spiral grinding process, and the grinding depth of the grinding tool; And / or, the vibration parameter includes the amplitude of the ultrasonic vibration structure and / or the frequency of the ultrasonic vibration structure.

8. The ultrasonic vibration spiral grinding method according to claim 5, characterized in that: When the grinding tool meets the separation condition of the hole wall to be processed, the high-speed spiral grinding parameter and / or the vibration parameter should satisfy the following formula: Wherein, M is the number of abrasive grains whose front and rear grinding trajectories intersect, Δl is the distance between two adjacent abrasive grains, n is the rotation speed of the grinding tool, r is the radius of the grinding tool, f is the pitch of the grinding tool during high-speed spiral grinding, R is the radius of the hole to be processed, v is the feed speed of the grinding tool, A is the amplitude of the ultrasonic vibration structure, and α is the angle that a single abrasive grain rotates through when it contacts the wall of the hole to be processed from cutting in to cutting out after one rotation.

9. The ultrasonic vibration spiral grinding method according to any one of claims 1 to 4, characterized in that: After the grinding tool is mounted on the ultrasonic vibration structure, the grinding tool can generate axial vibration or axial vibration components.

10. The ultrasonic vibration spiral grinding method according to any one of claims 1 to 4, characterized in that: The ultrasonic vibration structure comprises an ultrasonic transducer and a horn, the ultrasonic transducer is externally connected to an AC power supply, and the horn is installed at the output end of the ultrasonic transducer; The grinding tool is arranged at the output end of the amplitude transformer.

Images