Clamp

Abstract

The invention provides a clamp, and relates to the technical field of semiconductor lasers, the clamp provided by the invention is used for clamping a chip in a groove in a storage box, the circumferential direction of the groove is provided with an avoiding groove communicating the inside and the outside of the groove, the clamp comprises a clamping block, the clamping block is provided with a clamping unit; the clamping unit comprises an adsorption part and a sealing block arranged around the adsorption part in the circumferential direction. An air port is formed in the adsorption part, and the chip can be adsorbed to the adsorption part through negative pressure generated by the air port; the sealing block is used for being inserted into the receding groove when the adsorption part is right opposite to the opening of the groove and blocking the receding groove.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor lasers, and in particular to a clamp. Background Art

[0002] In the prior art, semiconductor chips are conventionally packaged in the form of COS, i.e., Chip On Substrate packaging. After the chip is packaged, the bottom of the COS is deformed due to dust or fixtures, which indirectly affects the heat dissipation of the chip COS, resulting in failure of the module product.

[0003] like Figure 1-Figure 3 As shown, a plurality of chips 2 are stored in the groove 12 in the storage box 1 , and there is an escape groove 11 on the side of the groove 12 , the escape groove 11 is connected to the groove 12 , and the escape groove 11 is used to avoid tweezers.

[0004] When chip 2 is welded to the COS heat sink, wires 21 will be bonded. If you want to observe the bottom morphology, you need to manually insert tweezers into the avoidance groove 11 to clamp the heat sink out of the groove 12, and then flip it 180°, which can easily cause mechanical damage to the product and takes a long time. Summary of the invention

[0005] The purpose of the present invention is to provide a fixture to alleviate the technical problem that the existing chip heat sink back side inspection process is very likely to cause mechanical damage to the product and takes a long time.

[0006] The present invention provides a clamp for clamping a chip in a groove in a storage box, wherein a circumference of the groove is provided with an escape groove connecting the inside and outside of the groove, comprising: a clamping block, on which a clamping unit is provided; The clamping unit includes an adsorption portion and a sealing block circumferentially arranged around the adsorption portion; The adsorption part is provided with an air port, and the negative pressure generated by the air port can adsorb the chip to the adsorption part; The sealing block is used to be inserted into the avoidance groove when the adsorption portion is directly opposite to the opening of the groove, and to block the avoidance groove.

[0007] Furthermore, the adsorption portion includes a convex block protruding outward from the outer wall of the clamping block, and the convex block is used to be inserted into the groove.

[0008] Furthermore, the bump is provided with a receiving chamber for avoiding wire bonding on the chip; Alternatively, the number of bumps corresponding to the same groove is at least two, and a receiving chamber for bonding wires on the chip is defined between two adjacent bumps.

[0009] Furthermore, the adsorption portion includes a recessed portion sunken inwardly from the outer wall of the clamping block, and the negative pressure generated by the rear air port when the opening of the recess faces the opening of the groove can suck the chip in the groove into the recess.

[0010] Furthermore, in the depth direction of the concave portion, the cross-sectional area of ​​the concave portion gradually decreases from the opening close to the concave portion to the opening far away from the concave portion; There is a limit position in the recess, and the circumferential side wall of the recess at the limit position is used to stop the chip from moving in the direction away from the opening of the recess. When the chip is at the limit position, there is space between the inner wall surface of the recess opposite to its opening and the chip to accommodate the chip's wire bonding.

[0011] Furthermore, the recess includes a first recess and a second recess which are arranged in sequence along the direction from the opening close to the recess to the opening away from the recess, and a step surface is formed at the connection between the first recess and the second recess. The step surface is used to stop the chip entering the first recess from entering the second recess, and when the chip abuts against the step surface, there is space for accommodating the chip's wire bonding between the inner wall surface of the recess opposite to its opening and the chip.

[0012] Furthermore, an air circuit is provided in the clamping block, the clamping unit is connected to the air circuit through its air port, and at least two clamping units are connected to the air circuit, and the air circuit is connected to a negative pressure air source; A negative pressure transmission membrane is arranged in the air circuit, and the air port of each clamping unit is covered by one of the negative pressure transmission membranes respectively.

[0013] Furthermore, the adsorption part includes a concave part which is sunken inward from the outer wall of the clamping block, the opening of the concave part forms a suction port, and the suction port is connected to a negative pressure transmission membrane which closes the suction port; The air port is communicated with the recessed portion, so that after negative pressure is generated in the air port, the negative pressure transmission membrane can move toward the inside of the recessed portion.

[0014] Furthermore, at least two air paths independent of each other are provided on the clamping block; at least one clamping unit is connected to one of the air paths through its air port; At least one other clamping unit is connected to another air path through its air port.

[0015] Furthermore, the fixture includes a positive pressure air source and a negative pressure air source, and the air circuit can be switchably connected to the positive pressure air source and the negative pressure air source so that the air port generates positive pressure or negative pressure.

[0016] The present invention has at least the following advantages or beneficial effects: The clamp provided by the present invention is used to clamp the chip in the groove of the storage box, and the circumference of the groove is provided with an avoidance groove connecting the inside and outside of the groove, comprising: a clamping block, on which a clamping unit is provided; the clamping unit comprises an adsorption portion, and a sealing block arranged around the circumference of the adsorption portion; the adsorption portion is provided with an air port, and the negative pressure generated by the air port can adsorb the chip to the adsorption portion; the sealing block is used to be inserted into the avoidance groove when the adsorption portion is facing the opening of the groove, and block the avoidance groove, so as to improve the adsorption effect of the clamp and more reliably adsorb the chip.

[0017] When in use, align the adsorption unit on the clamping block with the chip in the storage box, align the adsorption part with the groove, align the sealing block with the avoidance groove, and then put the storage box and the clamping block in place. At this time, the sealing block enters the avoidance groove of the storage box and cuts off the avoidance groove to prevent the negative pressure in the groove from leaking from the avoidance groove. At this time, the negative pressure generated at the air port can act more on the front of the chip, thereby adsorbing the chip. Then flip the clamping block, and the chip can be flipped 180° at the same time. The negative pressure adsorption method will not cause greater damage to the chip, which is both safe and fast. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of a storage box in the prior art; Figure 2 for Figure 1 A partial enlarged view of position A in the middle; Figure 3 It is a partial schematic diagram of a storage box after a chip is placed in the prior art; Figure 4 A schematic diagram of a clamp provided in Example 1 of the present invention; Figure 5 for Figure 4 A partial enlarged view of position B in the middle; Figure 6 A cross-sectional view of a clamp provided in Example 1 of the present invention; Figure 7 A schematic diagram of a clamping block in a clamp provided in Example 1 of the present invention after the top cover is removed; Figure 8 A bottom view of a clamping unit of a clamp provided in Example 2 of the present invention; Fig. 9 A cross-sectional view of a clamping unit of a clamp provided in Example 2 of the present invention before clamping; Fig.10 A cross-sectional view of the clamping unit of the clamp provided in Example 2 of the present invention after clamping; Fig.11 A cross-sectional view of a clamping unit of a clamp provided in Example 3 of the present invention before clamping; Fig.12 A cross-sectional view of the clamping unit of the clamp provided in Example 3 of the present invention after clamping; Fig.13 A cross-sectional view of a clamping unit of a clamp provided in Example 4 of the present invention before clamping; Fig.14 A cross-sectional view of a clamping unit of a clamp provided in Example 4 of the present invention after clamping; Fig.15 A cross-sectional view of the clamp provided in Example 5 of the present invention before negative pressure is applied; Fig.16 This is a cross-sectional view of the clamp provided in Example 5 of the present invention after negative pressure is applied.

[0020] Icons: 1-storage box; 11-avoidance slot; 12-groove; 2-chip; 21-bonding; 3-sealing block; 4-air port; 51-bump; 511-accommodating chamber; 6- Gas circuit; 71-recess; 711-first recess; 712-second recess; 713-step surface; 81 - suction port; 82 - negative pressure transmission membrane; 83 - elastic skirt. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0024] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0025] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0026] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] Example 1 The clamp provided by the present invention includes a clamping block, which is roughly in the shape of a cuboid, and at least one clamping unit can be arranged on the clamping surface of the clamping block. In this embodiment, the clamping surface is the bottom surface of the clamping block. Of course, in other feasible solutions, the clamping surface can also be arranged on other surfaces.

[0028] like Figure 1-Figure 4 As shown, the arrangement of the clamping units is the same as the arrangement of the grooves 12 in the existing storage box 1. In this embodiment, a 5*6 array arrangement is adopted.

[0029] Each clamping unit includes an adsorption portion and a sealing block 3 arranged circumferentially around the adsorption portion. The setting position and number of the sealing blocks 3 also match the avoidance grooves 11 in the storage box 1. In this embodiment, in the corresponding storage box 1, an avoidance groove 11 is arranged around a groove 12. Therefore, a sealing block 3 is also arranged around the adsorption portion of this embodiment, so that after the clamp is docked with the storage box, the sealing block 3 seals the avoidance grooves 11 around the groove 12 to prevent the negative pressure in the groove 12 from leaking from the avoidance groove 11.

[0030] like Figure 4 , Figure 6 and Figure 7 As shown, the adsorption part is provided with an air port 4, which can be connected to a negative pressure air source. Specifically, an air path 6 can be provided in the clamping block, one end of the air path 6 is connected to the air port 4, and the other end is connected to the negative pressure air source. The negative pressure generated by the air port 4 can adsorb the chip 2 onto the adsorption part, thereby completing the clamping of the chip 2.

[0031] When in use, align the adsorption units on the clamping block with the chips 2 in the storage box 1 one by one, align the adsorption part with the groove 12, align the sealing block 3 with the avoidance groove 11, and then put the storage box 1 and the clamping block tightly in place. At this time, the sealing block 3 enters the avoidance groove 11 of the storage box 1 and cuts off the avoidance groove 11. At this time, the negative pressure generated at the air port 4 can act more on the front of the chip 2, thereby adsorbing the chip 2. Then flip the clamping block, you can flip multiple chips 2 180° at the same time, and the negative pressure adsorption method will not cause significant damage to the chip 2, which is both safe and fast.

[0032] like Figure 5 As shown, in this embodiment, the adsorption portion includes a protrusion 51 protruding outward from the outer wall of the clamping block. When the clamp is assembled with the storage box 1, the protrusion 51 can be inserted into the groove 12 from the outside to the inside, and the sealing block 3 is inserted into the avoidance groove 11. The air port 4 can be set on the side of the protrusion 51 facing the chip 2 (the bottom surface of the protrusion 51). When the protrusion 51 is inserted into the groove 12, the air port 4 can face the chip 2, so that the chip 2 is directly adsorbed on the bottom surface of the protrusion 51.

[0033] like Figure 5 As shown, in this embodiment, the number of bumps 51 corresponding to one groove 12 is two, and the two bumps 51 are respectively abutted against the two parts connected to the bonding wires 21 on the chip 2, and the gap between the two adjacent bumps 51 forms a accommodating chamber 511 to accommodate the bonding wires 21 on the chip 2 to avoid damage to the chip 2 during adsorption.

[0034] In another feasible solution, a receiving chamber 511 for avoiding the wire bonding 21 on the chip 2 is provided on the bottom surface of the bump 51. In this embodiment, the receiving chamber 511 is groove-shaped, and the receiving chamber 511 does not separate a completed bump 51 into two independent parts.

[0035] At least two independent air paths 6 are provided on the clamping block; at least one clamping unit is connected to one of the air paths 6 through its air port 4; and at least another clamping unit is connected to another air path 6 through its air port 4.

[0036] like Figure 7As shown, in this embodiment, three air paths 6 separated from each other are arranged inside the clamping block, and multiple clamping units are respectively installed below the three air paths 6, that is, negative pressure can be applied to only one of the air paths 6, and multiple clamping units corresponding to the air path 6 adsorb the chip 2, while the clamping units below other air paths 6 do not adsorb the chip 2, thereby adjusting the adsorption quantity of the chip 2. The clamping block includes a box body and a top cover, the box body forms a separated air path 6 by a partition, the top cover covers the opening of the box body, the negative pressure gas source is connected to the top cover, and the adsorption part is connected to the box body.

[0037] The fixture may include a positive pressure gas source and a negative pressure gas source, and the gas path 6 can be switched to be connected to the positive pressure gas source or the negative pressure gas source to generate positive pressure or negative pressure at the gas port 4. The positive pressure gas source, the negative pressure gas source and the inlet of the gas path 6 on the clamping block can be connected through a tee, and the positive pressure gas source or the negative pressure gas source can be connected to the gas path 6 by adjusting the tee. The chip 2 can be purged with the positive pressure gas source before adsorption to remove impurities, and then the negative pressure gas source can be used for adsorption.

[0038] Example 2 like Figure 8-Figure 10 As shown, the difference from Example 1 is that the adsorption portion includes a recessed portion 71 that is recessed inward from the outer wall of the clamping block, and the air port 4 can be arranged on the inner wall surface of the recessed portion 71 opposite to its opening. The sealing block 3 can play a positioning role. When the sealing block 3 enters the avoidance groove 11, the opening of the recessed portion 71 is directly opposite to the opening of the groove 12, and there is no or very small gap between the two openings, so that the negative pressure generated by the air port 4 can suck the chip 2 in the groove 12 into the recessed portion 71.

[0039] In this embodiment, the longitudinal cross-section of the recess 71 is roughly an "inverted trapezoid". In the depth direction of the recess 71, the shape of the cross section of the recess 71 is consistent with the shape of the cross section of the chip 2, both of which are rectangular. From the opening close to the recess 71 to the opening away from the recess 71, the area of ​​the cross section of the recess 71 gradually decreases. There is a limit position in the recess 71, which can be the middle position of the recess 71. The area of ​​the cross section of the recess 71 at the limit position is consistent with the area of ​​the cross section of the chip 2. When the chip 2 moving from bottom to top moves to the limit position, it will not be able to continue to rise. Fig.10As shown, when the chip 2 is in the limiting position, there is space between the inner wall surface of the recess 71 opposite to its opening and the chip 2 to accommodate the bonding wire 21 of the chip 2, thereby preventing the bonding wire 21 from being damaged. The recess 71 with a longitudinal cross-section that is roughly an "inverted trapezoid" has a larger opening, so that the chip 2 can enter the recess 71 more easily and then be stuck in the limiting position, thereby protecting the bonding wire 21 and other structures on the front of the chip 2 from being damaged. Moreover, the cross-sectional area of ​​the recess 71 gradually decreases from the outside to the inside, so that it can naturally adapt to chips of various sizes, that is, when the areas of the adsorbed chips 2 are different, different chips 2 can be stuck in their corresponding limiting positions, thereby improving practicality.

[0040] Example 3 like Fig.11 and Fig.12 As shown, the same as Example 2 is that the adsorption portion in this embodiment is also a recess 71, but the shape of the recess 71 is different. In this embodiment, the recess 71 includes a first recess 711 and a second recess 712 which are arranged in sequence along the opening close to the groove 12 to the opening away from the groove 12, wherein the bottom area of ​​the first recess 71 is larger than the opening area of ​​the second recess 712, so that a step surface 713 is formed at the connection between the first recess 711 and the second recess 712, and the step surface 713 is used to limit the chip 2, and the step surface 713 is used to stop the chip 2 entering the first recess 711 from entering the second recess 712, and when the chip 2 abuts against the step surface 713, there is a space for accommodating the bonding wire 21 of the chip 2 between the inner wall surface of the recess 71 opposite to its opening and the chip 2, so as to avoid damage to the bonding wire 21.

[0041] The longitudinal cross-sections of the first recess 711 and the second recess 712 may both be in the shape of an inverted trapezoid or a rectangle. The air port 4 is disposed on the bottom surface of the second recess 712 .

[0042] In this solution, after the chip 2 is clamped, it can be more evenly abutted against the stepped surface 713 . After detection, the chip 2 can fall back into the storage box 1 horizontally to prevent the chip 2 from tilting.

[0043] Example 4 like Fig.13 and Fig.14As shown, the difference from Example 1 is that in this embodiment, the adsorption part includes a concave part 71 that is recessed inward from the outer wall of the clamping block, and the opening of the concave part 71 forms a suction port 81. The suction port 81 is connected with a negative pressure transmission film 82 that closes the suction port 81, and the negative pressure transmission film 82 can be deformed. The outer surface of the negative pressure transmission film 82 faces the chip 2, and after the clamp is placed in the storage box, the suction port 81 can be close to the chip 2, and the air port 4 is connected to the concave part 71. When the negative pressure is generated by the air port 4, the negative pressure transmission film 82 can move toward the inside of the concave part 71, and negative pressure is generated between the negative pressure transmission film 82 and the chip 2. In this way, when the negative pressure gas source applies negative pressure to the air port 4, negative pressure is generated in the concave part 71, and the negative pressure transmission film 82 can adsorb the chip 2 below. When there is no chip 2 below the negative pressure transmission film 82, the suction port 81 will not release pressure, so that the clamp in this embodiment can be used to clamp several chips 2 in the storage box 1 that is not full.

[0044] Furthermore, an elastic skirt 83 is provided on the outside of the suction port 81, and the cross-sectional area of ​​the elastic skirt 83 gradually decreases from the outside to the inside. When the sealing block 3 on the clamping block is positioned and inserted into the avoidance groove 11, the elastic skirt 83 can be buckled on the chip 2 and deformed, so that the edge of the outer opening of the skirt is better in contact with the surface of the chip 2, reducing negative pressure leakage.

[0045] Example 5 like Fig.15 and Fig.16 As shown, the difference from Example 1 is that, in this embodiment, an air circuit 6 is provided in the clamping block, the clamping unit is connected to the air circuit 6 through its air port 4, and at least two clamping units are connected to the air circuit 6, and the air circuit 6 is connected to the negative pressure gas source; a negative pressure transfer membrane 82 is provided in the air circuit 6, and the air port 4 of each clamping unit is covered by a negative pressure transfer membrane 82. Specifically, a negative pressure transfer membrane 82 covering all the air ports 4 of a clamping unit (in this embodiment, one clamping unit corresponds to four air ports 4) is provided in the air circuit 6 of the clamping block. The number of negative pressure transfer membranes 82 is the same as the number of clamping units, and they correspond one to one. When the negative pressure gas source applies negative pressure in the air circuit 6, the negative pressure transfer membrane 82 is deformed inwardly, and negative pressure is generated in the air port 4, thereby forming a negative pressure at the outer port of the air port 4 (the opening close to the chip 2), and the chip 2 is adsorbed. Negative pressure is transmitted by the negative pressure transmission membrane 82, and the air port 4 will not be depressurized, so that the clamp in this embodiment can be used to clamp several chips 2 in a storage box 1 that is not full.

[0046] The negative pressure transmission membrane 82 and the clamping block can be connected in various ways, for example: (1) Direct bonding: Material selection of negative pressure transmission membrane 82: Select materials with high elasticity, wear resistance, chemical corrosion resistance and a certain thickness, such as silicone, rubber or special elastic polymer. Bonding method: Use adhesive (such as double-sided tape, special sealant) to directly bond the negative pressure transmission membrane 82 around the air port 4 to ensure sealing without leakage.

[0047] (2) Mechanical clamping type: A mechanical clamping device, such as a clamping ring or a clamp, is provided to firmly clamp the edge of the negative pressure transfer membrane 82 around the air port 4. Negative pressure transfer membrane 82 installation: The negative pressure transfer membrane 82 is placed on the air port 4 and then fixed using a clamping device. Advantages: No adhesive is required, and the negative pressure transfer membrane 82 is easy to replace and maintain.

[0048] (3) Edge sealing type: Sealing structure: A sealing structure such as an O-ring, lip seal or labyrinth seal is provided at the edge of the gas port 4. Negative pressure transmission membrane 82 installation: The negative pressure transmission membrane 82 is placed on the sealing structure, and sealing is achieved through the elasticity or compressibility of the sealing structure. Advantages: Good sealing effect, suitable for high pressure difference or high temperature environment.

[0049] (4) Embedded: Embedding of the negative pressure transmission membrane 82: A groove 12 is designed around the air port, and the negative pressure transmission membrane 82 is embedded therein. Fixing method: The negative pressure transmission membrane 82 can be fixed in the groove 12 using an adhesive or mechanical means (such as screws or buckles). Applicable scenarios: Applicable to occasions that require higher sealing performance and stability.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A clamp for clamping a chip (2) in a groove (12) in a storage box (1), wherein the groove (12) is provided with an escape groove (11) in the circumference thereof and communicating with the inside and outside of the groove (12), wherein: include: A clamping block, wherein a clamping unit is provided on the clamping block; The clamping unit comprises a suction portion and a sealing block (3) arranged circumferentially around the suction portion; The adsorption portion is provided with an air port (4), and the negative pressure generated by the air port (4) can adsorb the chip (2) onto the adsorption portion; The sealing block (3) is used to be inserted into the avoidance groove (11) when the adsorption portion is facing the opening of the groove (12), and to block the avoidance groove (11).

2. The clamp according to claim 1, characterized in that: The adsorption portion comprises a convex block (51) protruding outward from the outer wall of the clamping block, and the convex block (51) is used to be inserted into the groove (12).

3. The clamp according to claim 2, characterized in that: The bump (51) is provided with a receiving chamber (511) for accommodating wires (21) on the chip (2); Alternatively, the number of bumps (51) corresponding to the same groove (12) is at least two, and a receiving chamber (511) for bonding wires (21) on the chip (2) is defined between two adjacent bumps (51).

4. The clamp according to claim 1, characterized in that: The adsorption portion comprises a recess (71) recessed inwardly from the outer wall of the clamping block, and when the opening of the recess (71) is aligned with the opening of the groove (12), the negative pressure generated by the air port (4) can suck the chip (2) in the groove (12) into the recess (71).

5. The clamp according to claim 4, characterized in that: In the depth direction of the recess (71), the area of ​​the cross section of the recess (71) gradually decreases from the opening close to the recess (71) to the opening away from the recess (71); There is a limit position in the recess (71), and the circumferential side wall of the recess (71) at the limit position is used to stop the chip (2) from moving in a direction away from the opening of the recess (71), and when the chip (2) is at the limit position, there is space between the inner wall surface of the recess (71) opposite to its opening and the chip (2) to accommodate the bonding wire (21) of the chip (2).

6. The clamp according to claim 4, characterized in that: The recess (71) comprises a first recess (711) and a second recess (712) which are arranged in sequence along a direction from an opening close to the groove (12) to an opening away from the groove (12), and a step surface (713) is formed at the connection between the first recess (711) and the second recess (712), the step surface (713) being used to stop the chip (2) entering the first recess (711) from entering the second recess (712), and when the chip (2) abuts against the step surface (713), there is a space for accommodating the bonding wire (21) of the chip (2) between the inner wall surface of the recess (71) opposite to its opening and the chip (2).

7. The clamp according to any one of claims 1 to 6, characterized in that: An air circuit (6) is provided in the clamping block, the clamping unit is connected to the air circuit (6) via its air port (4), and at least two of the clamping units are connected to the air circuit (6), and the air circuit (6) is connected to a negative pressure air source; A negative pressure transmission membrane (82) is provided in the air path (6), and the air port (4) of each clamping unit is respectively covered by one of the negative pressure transmission membranes (82).

8. The clamp according to claim 1, characterized in that: The adsorption portion comprises a recess (71) recessed inwardly from the outer wall of the clamping block, the opening of the recess (71) forms a suction port (81), and the suction port (81) is connected to a negative pressure transmission membrane (82) that closes the suction port (81); The air port (4) is in communication with the recess (71), so that after negative pressure is generated in the air port (4), the negative pressure transmission membrane (82) can move toward the inside of the recess (71).

9. The clamp according to any one of claims 1 to 6, characterized in that: At least two air paths (6) independent of each other are provided on the clamping block; at least one of the clamping units is connected to one of the air paths (6) via its air port (4); At least another one of the clamping units is connected to another one of the air paths (6) via its air port (4).

10. The clamp according to claim 9, characterized in that The clamp comprises a positive pressure air source and a negative pressure air source, and the air path (6) can be switchably connected to the positive pressure air source and the negative pressure air source so that the air port (4) generates positive pressure or negative pressure.

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