Process for solving chip falling in product processing procedure

Abstract

The invention provides a process for solving chip falling in a product processing procedure, which enables a composite circular ring to be reliably adhered to the upper surface of a molded release film, avoids chip falling in a waste discharge process, and ensures reliable and efficient production of the product. The molding release film is punched and molded in advance, and then the second double-sided adhesive layer, the foam or silicone rubber layer and the first double-sided adhesive layer are compounded and pressed on the upper surface of the molding release film. Then, circular rings are punched on the second double-sided layer, the foam or silicon rubber layer and the first double-sided adhesive layer through an outer circular knife and an inner circular knife respectively, and meanwhile, the upper surface of the second double-sided adhesive layer is covered with a transition release film during punching; and finally, taking away the transition release film and wastes generated by punching the second double-sided adhesive layer, the foam or silicone rubber layer and the first double-sided adhesive layer, covering the transfer release film, and slicing and sub-packaging a product formed by the second double-sided adhesive layer, the foam or silicone rubber layer, the first double-sided adhesive layer and the molding release film through a rear slicing process.

Description

Technical Field

[0001] The invention relates to the technical field of die-cut product processing, and in particular to a process for solving the problem of sheet falling during product processing. Background Art

[0002] Make as Figure 1 The die-cut product shown in the figure includes a release film, a first double-sided adhesive layer, a foam or silicone rubber layer, and a second double-sided adhesive layer, wherein the release film is in a shaped form, and is used to cover a composite circular ring formed by the combination of the first double-sided adhesive layer, the foam or silicone rubber layer, and the second foam layer. In the existing manufacturing process, the composite circular ring is generally punched out by a circular knife, and then the composite circular ring is compounded on the upper surface of the release film, and then the shape of the release film is punched out on the upper surface of the release film. Since a transfer film needs to be laminated on the upper surface of the release film during punching, the composite circular ring is easily taken away from the production line during the actual transfer of the transfer film. Therefore, it is urgently necessary to develop a processing technology that can prevent the composite circular ring from falling off during the product production process. Summary of the invention

[0003] In view of the above problems, the present invention provides a process for solving the problem of flakes falling during product processing, which enables the composite ring to be reliably adhered to the upper surface of the formed release film, and the product does not fall off during the waste discharge process, ensuring reliable and efficient production of the product.

[0004] A process for solving the problem of film falling during product processing, characterized in that: a modeling release film is punched and formed in advance, and then a second double-sided adhesive layer, a foam or silicone rubber layer, and a first double-sided adhesive layer are compositely pressed onto the upper surface of the modeling release film, and then circular rings are punched out on the second double-sided layer, the foam or silicone rubber layer, and the first double-sided adhesive layer by an external circular knife and an internal circular knife respectively, and at the same time, a transition release film is covered on the upper surface of the second double-sided adhesive layer during punching, and finally, waste materials generated by punching the transition release film and the second double-sided adhesive layer, the foam or silicone rubber layer, and the first double-sided adhesive layer are taken away, and finally, the transfer release film is covered, and the product slices formed by the second double-sided adhesive layer, the foam or silicone rubber layer, the first double-sided adhesive layer, and the modeling release film are divided into packages through a rear slicing process.

[0005] It is further characterized by:

[0006] It includes the following steps,

[0007] S1, compounding the first release film, the second protective film, and the first protective film, and then punching out the outer contour of the release film and the inner circle notch by using an A knife;

[0008] S2, discharging the outer waste and the inner waste of the formed release film through the first protective film, so that the production line retains the punched first release film and the second protective film;

[0009] S3, compounding the first double-sided adhesive layer of the composite layer of the second release film, the second double-sided adhesive layer, the foam or silicone rubber layer, and the first double-sided adhesive layer on the upper surface of the first release film, and compounding the original film on the lower surface of the second protective film, and under the action of the pressing roller, the original film penetrates the inner circular notch and is closely attached to the first double-sided adhesive layer;

[0010] S4, punching the second release film, the second double-sided adhesive layer, the foam or silicone rubber layer, and the first double-sided adhesive layer to form an outer circumference by using knife B;

[0011] S5, collecting the second release film, the second double-sided adhesive layer, the foam or silicone rubber layer, and the peripheral waste edge formed by punching the first double-sided adhesive layer with a B knife through the sealing tape, and at the same time discharging the second release film as a whole;

[0012] S6, compounding a third release film on the upper surface of the second double-sided adhesive layer;

[0013] S7, punching the third release film, the second double-sided adhesive layer, the foam or silicone rubber layer, and the first double-sided adhesive layer to form an inner circumference by using a C knife;

[0014] S8, collecting the entire third release film, the center circle waste edge of the second double-sided adhesive layer, the foam or silicone rubber layer by means of the sealing tape, while at the same time the original film at the bottom drives the center circle waste edge of the first double-sided adhesive layer to be discharged;

[0015] S9, covering the upper surface of the punched second double-sided adhesive layer with a fourth release film, and at the same time, rolling up the second protective film at the bottom;

[0016] S10, slicing and packaging the product formed by the fourth release film, the second double-sided adhesive layer, the foam or silicone rubber layer, the first double-sided adhesive layer, and the first release film with a shape through a rear slicing process.

[0017] It is further characterized by:

[0018] In step S8, the third release film is collected as a whole by the sealing tape, and at the same time, the original film at the bottom drives the first double-sided adhesive layer, the foam or silicone rubber layer, and the center circle waste edge of the second double-sided adhesive layer to be discharged.

[0019] Another feature of the invention is that:

[0020] The knife A punches the outer contour of the first release film and punches the inner circular notch shape to the second protective film at the same time, so that the first release film and the second protective film are punched to form an inner circular notch;

[0021] The knife A simultaneously punches out first positioning holes in the first release film and the second protective film;

[0022] The B knife is provided with a first alignment pin corresponding to the first positioning hole;

[0023] The C knife punches the product positioning hole to the first release film while punching the inner circumference, and the C knife is provided with a second alignment pin corresponding to the positioning hole;

[0024] The number of first positioning holes arranged on both sides of the material width direction is different, which is convenient for distinguishing the positions on both sides;

[0025] The thickness of the original film is 0.1 mm, ensuring reliable adhesion to the first double-sided adhesive layer;

[0026] The first double-sided adhesive layer and the second double-sided adhesive layer are the same double-sided adhesive layers with the same thickness and the same surface area.

[0027] The invention provides a process for solving the problem of chip falling in a product processing process. The process punches and forms a modeling release film in advance, and then a second double-sided adhesive layer, a foam or silicone rubber layer, and a first double-sided adhesive layer are compositely pressed onto the upper surface of the modeling release film. Then, annular rings are punched out on the second double-sided layer, the foam or silicone rubber layer, and the first double-sided adhesive layer by an outer circular knife and an inner circular knife respectively. Simultaneously, a transitional release film is covered on the upper surface of the second double-sided adhesive layer during punching. Finally, waste generated by punching the transitional release film, the second double-sided adhesive layer, the foam or silicone rubber layer, and the first double-sided adhesive layer is removed, and finally the thickness of the transfer release film is covered. The product formed by the second double-sided adhesive layer, the foam or silicone rubber layer, the first double-sided adhesive layer, and the modeling release film is sliced ​​and packaged through a rear slicing process, so that the composite circular ring is reliably adhered to the upper surface of the formed release film, the product does not fall off during the waste discharge process, and reliable and efficient production of the product is ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A front view of a product manufactured corresponding to the present invention;

[0029] Figure 2 An exploded view of a product manufactured in accordance with the present invention;

[0030] Figure 3 A schematic diagram of the A knife of the present invention and the corresponding punching layer;

[0031] Figure 4 Schematic diagram of the B knife of the present invention and the corresponding punching layer;

[0032] Figure 5 Schematic diagram of the C-knife of the present invention and the corresponding punching layer;

[0033] Figure 6 It is a schematic diagram of the process flow of the present invention;

[0034] The reference numerals are as follows:

[0035] The first double-sided adhesive layer 1, the foam or silicone rubber layer 2, the second double-sided adhesive layer 3, the first release film 4, the product positioning hole 401, the second protective film 5, the first protective film 6, the second release film 7, the original film 8, the third release film as a whole 9, the fourth release film 10, the product composite layer 11, the B knife 20, the outer circle knife 21, the first alignment needle 22, the C knife 30, the inner circle knife 31, the lower convex blade 32, the second alignment needle 33, the A knife 40, the outer contour blade 41, the inner circle notch blade 42, and the positioning blade 43. DETAILED DESCRIPTION

[0036] The product to be manufactured consists of a release film, a first double-sided adhesive layer 1, a foam or silicone rubber layer 2, and a second double-sided adhesive layer 3, wherein the release film is a release film with a shaped shape obtained by subsequent punching of the first release film 4, and the first double-sided adhesive layer 1, the foam or silicone rubber layer 2, and the second double-sided adhesive layer 3 are combined to form a composite ring, and a product positioning hole 401 is also provided at one end of the composite ring corresponding to the principle of the release film.

[0037] Figure 4-Figure 5 In the figure, the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, and the first double-sided adhesive layer 1 are compounded into a product compound layer 11 for marking and explanation.

[0038] A process to solve the problem of chip falling during product processing, see Figure 1-Figure 6 : It pre-cuts the shape release film, then presses the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, and the first double-sided adhesive layer 1 on the upper surface of the shape release film, and then uses an outer circular knife as a B knife 20 and an inner circular knife as a C knife 30 to punch out circles on the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, and the first double-sided adhesive layer 1, and at the same time, when punching, the upper surface of the second double-sided adhesive layer 3 is covered with a transition release film, and finally the waste generated by the punching of the transition release film and the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, and the first double-sided adhesive layer 1 is removed, and finally the transfer release film is covered, and the product formed by the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, the first double-sided adhesive layer 1, and the shape release film is sliced ​​and packaged through the rear slicing process.

[0039] In a specific implementation, the A knife 40 includes an outer contour blade 41 of a formed release film made according to the product, an inner circle notch blade 42, and a positioning blade 43 of a first positioning hole;

[0040] The B knife 20 includes an outer circle knife 21 made according to the outer circle of the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, and the first double-sided adhesive layer 1, and a first alignment needle 22 matched with the first positioning hole;

[0041] The C knife 30 includes an inner circle knife 31 made according to the outer circle of the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, and the first double-sided adhesive layer 1, a lower convex blade 32 for punching product positioning holes, and a second alignment needle 33 matching the first positioning hole.

[0042] The whole process specifically includes the following steps:

[0043] S1, after compounding the first release film 4, the second protective film 5 and the first protective film 6, the outer contour of the release film and the inner circle notch are punched out by the A knife 40, wherein the outer contour blade 41 only punches the first release film but does not punch the second protective film 5, and the inner edge notch blade 42 punches the first release film 4 and the second protective film 5 but does not punch the first protective film 6;

[0044] S2, the outer waste and the inner waste of the first release film 4 are discharged through the first protective film 6, so that the production line retains the punched first release film 4 and the second protective film 5;

[0045] S3, compound the first double-sided adhesive layer 1 of the composite layer of the second release film 7, the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, and the first double-sided adhesive layer 1 on the upper surface of the first release film 4, and compound the original film 8 on the lower surface of the second protective film 5, and under the action of the pressing roller, the original film 8 penetrates the inner circle notch and adheres closely to the first double-sided adhesive layer 1;

[0046] S4, punching the second release film 7, the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, and the first double-sided adhesive layer 1 to form an outer circumference by using a B knife 20;

[0047] S5, collecting the second release film 7, the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, and the peripheral waste edge formed by punching the first double-sided adhesive layer 1 by the sealing tape, and at the same time discharging the second release film 7 as a whole;

[0048] S6, compounding a third release film 9 on the upper surface of the second double-sided adhesive layer 3;

[0049] S7, punching the third release film 9, the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, and the first double-sided adhesive layer 1 to form an inner circumference by using a C knife 30;

[0050] S8, collecting the third release film as a whole 9, the second double-sided adhesive layer 3, and the center circle waste edge of the foam or silicone rubber layer 2 by means of the sealing tape, while at the same time the original film 8 at the bottom drives the center circle waste edge of the first double-sided adhesive layer 1 to be discharged;

[0051] Or the third release film 9 is collected as a whole by the sealing tape, and at the same time, the original 8 at the bottom drives the first double-sided adhesive layer 1, the foam or silicone rubber layer 2, and the central circle waste edge of the second double-sided adhesive layer 3 to discharge waste;

[0052] S9, covering the upper surface of the punched second double-sided adhesive layer 3 with the fourth release film 10, and at the same time, rolling up the second protective film 5 at the bottom;

[0053] S10, slicing and packaging the product formed by the fourth release film 10, the second double-sided adhesive layer 3, the foam or silicone rubber layer 2, the first double-sided adhesive layer 1, and the first release film 4 with a shape through a rear slicing process.

[0054] In a specific implementation, knife A punches out first positioning holes of the first release film and the second protective film at the same time;

[0055] The B knife is provided with a first alignment pin corresponding to the first positioning hole, and the first alignment pin is located at the first positioning hole to perform knife alignment operation;

[0056] While punching the inner circumference, the C knife punches the product positioning hole 401 at the corresponding position of the first release film 4 through the lower convex blade 32. The C knife is provided with a second alignment needle 33 corresponding to the positioning hole 401, and the first alignment needle 33 is aligned with the first positioning hole for knife alignment.

[0057] In a specific implementation, the number of the first positioning holes arranged on both sides in the width direction of the material is one on one side and two on the other side, so as to facilitate the distinction of the positions on both sides.

[0058] In specific implementation, the thickness of the original film 8 is 0.1 mm, ensuring reliable adhesion to the first double-sided adhesive layer 1;

[0059] The first double-sided adhesive layer 1 and the second double-sided adhesive layer 3 are the same double-sided adhesive layers, both with a thickness of 0.3 mm and the same surface area; the thickness of the foam or silicone rubber layer 2 is 1.0 mm, so that the thickness of the entire product composite layer is 1.6 mm.

[0060] The principle is as follows: the molded release film is punched and formed in advance, and then the second double-sided adhesive layer, the foam or silicone rubber layer, and the first double-sided adhesive layer are compositely pressed on the upper surface of the molded release film. At the same time, the original film is composited on the bottom of the molded release film, so that the original film is bonded to the first double-sided adhesive layer through the inner circle notch under the pressure of the pressure roller, and then the second double-sided layer, the foam or silicone rubber layer, and the first double-sided adhesive layer are punched out of the ring by the outer circle knife and the inner circle knife respectively. At the same time, the upper surface of the second double-sided adhesive layer is covered with The transition release film is finally taken away, and the waste generated by punching the transition release film and the second double-sided adhesive layer, foam or silicone rubber layer, and the first double-sided adhesive layer is removed. The original film reliably takes away the inner circle waste of the first double-sided adhesive layer, and finally covers the thickness of the transfer release film. The product formed by the second double-sided adhesive layer, foam or silicone rubber layer, first double-sided adhesive layer, and molded release film is sliced ​​and packaged through the rear slicing process, which makes the composite ring reliably adhere to the upper surface of the formed release film, and the product does not fall off during the waste discharge process, ensuring reliable and efficient production of the product.

[0061] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and range of equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0062] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A process for solving the problem of chip falling during product processing, characterized in that: The molding release film is punched and formed in advance, and then the second double-sided adhesive layer, foam or silicone rubber layer, and the first double-sided adhesive layer are compositely pressed onto the upper surface of the molding release film, and then circular rings are punched out on the second double-sided adhesive layer, foam or silicone rubber layer, and the first double-sided adhesive layer by an external circular knife and an internal circular knife respectively, and at the same time, a transition release film is covered on the upper surface of the second double-sided adhesive layer during punching, and finally the waste generated by the punching of the transition release film and the second double-sided adhesive layer, foam or silicone rubber layer, and the first double-sided adhesive layer is removed, and finally the transfer release film is covered, and the product formed by the second double-sided adhesive layer, foam or silicone rubber layer, the first double-sided adhesive layer, and the molding release film is sliced ​​and packaged through a rear slicing process.

2. A process for solving the problem of chip falling during product processing according to claim 1, characterized in that , which includes the following steps: S1, compounding the first release film, the second protective film, and the first protective film, and then punching out the outer contour of the release film and the inner circle notch by using an A knife; S2, discharging the outer waste and the inner waste of the formed release film through the first protective film, so that the production line retains the punched first release film and the second protective film; S3, compounding the first double-sided adhesive layer of the composite layer of the second release film, the second double-sided adhesive layer, the foam or silicone rubber layer, and the first double-sided adhesive layer on the upper surface of the first release film, and compounding the original film on the lower surface of the second protective film, and under the action of the pressing roller, the original film penetrates the inner circular notch and is closely attached to the first double-sided adhesive layer; S4, punching the second release film, the second double-sided adhesive layer, the foam or silicone rubber layer, and the first double-sided adhesive layer to form an outer circumference by using knife B; S5, collecting the second release film, the second double-sided adhesive layer, the foam or silicone rubber layer, and the peripheral waste edge formed by punching the first double-sided adhesive layer with a B knife through the sealing tape, and at the same time discharging the second release film as a whole; S6, compounding a third release film on the upper surface of the second double-sided adhesive layer; S7, punching the third release film, the second double-sided adhesive layer, the foam or silicone rubber layer, and the first double-sided adhesive layer to form an inner circumference by using a C knife; S8, collecting the entire third release film, the center circle waste edge of the second double-sided adhesive layer, the foam or silicone rubber layer by means of the sealing tape, while at the same time the original film at the bottom drives the center circle waste edge of the first double-sided adhesive layer to be discharged; S9, covering the upper surface of the punched second double-sided adhesive layer with a fourth release film, and at the same time, rolling up the second protective film at the bottom; S10, slicing and packaging the product formed by the fourth release film, the second double-sided adhesive layer, the foam or silicone rubber layer, the first double-sided adhesive layer, and the first release film with a shape through a rear slicing process.

3. A process for solving the problem of chip falling during product processing according to claim 2, characterized in that: In step S8, the third release film is collected as a whole by the sealing tape, and at the same time, the original film at the bottom drives the first double-sided adhesive layer, the foam or silicone rubber layer, and the center circle waste edge of the second double-sided adhesive layer to be discharged.

4. A process for solving the problem of chip falling during product processing according to claim 2 or 3, characterized in that: The A knife punches the inner circular notch shape to the second protective film while punching the outer contour of the first release film, so that the first release film and the second protective film are punched to form an inner circular notch.

5. A process for solving the problem of chip falling during product processing according to claim 4, characterized in that: The A knife punches out the first positioning holes of the first release film and the second protective film at the same time.

6. A process for solving the problem of chip falling during product processing according to claim 5, characterized in that: The B knife is provided with a first alignment pin corresponding to the first positioning hole.

7. A process for solving the problem of chip falling during product processing according to claim 6, characterized in that: The C knife punches the product positioning hole to the first release film while punching the inner circumference, and the C knife is provided with a second alignment pin corresponding to the positioning hole.

8. The process for solving the problem of chip falling during product processing according to claim 5, characterized in that: The numbers of the first positioning holes arranged on both sides of the material width direction are different, so it is convenient to distinguish the positions on both sides.

9. The process for solving the problem of chip falling during product processing according to claim 2, characterized in that: The thickness of the original film is 0.1 mm, ensuring reliable adhesion to the first double-sided adhesive layer.

10. The process for solving the problem of chip falling during product processing according to claim 2, characterized in that: The first double-sided adhesive layer and the second double-sided adhesive layer are the same double-sided adhesive layers with the same thickness and the same surface area.

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