Touch system and electronic equipment

Abstract

The invention relates to the field of touch control, and discloses a touch control system and electronic equipment, and the touch control system comprises a touch control module and a control module; the touch module comprises a glass layer, a first indium tin oxide electrode layer, a polyvinylidene fluoride layer and a second indium tin oxide electrode layer which are sequentially contacted from top to bottom; the touch module is used for generating ultrasonic waves through vibration, receiving echo signals and generating an electric field; the control module is used for generating a wave signal for triggering the touch module to vibrate and sending the wave signal to the touch module; determining charges according to the electric field; and determining touch information according to the echo signal and the charge. The touch module is light in weight; ultrasonic waves are generated and ultrasonic echo signals are received through the first indium tin oxide electrode layer, the polyvinylidene fluoride layer and the second indium tin oxide electrode layer, so that a touch system is simpler, and system integration is facilitated; in addition, the touch module can generate an electric field, charges can be determined through the control module according to the electric field, touch information is determined together with the ultrasonic echo signals, and sensitivity and accuracy can be improved.

Description

Technical Field

[0001] The present application relates to the field of touch control, and in particular to a touch control system and an electronic device. Background Art

[0002] Ultrasonic transducers are widely used in the field of ultrasonic touch. Both traditional capacitive touch and resistive touch cannot break through the stringent restrictions on touch panel materials, and have poor anti-interference capabilities against dust or water stains. Ultrasonic touch can not only achieve the above functions, but can even operate normally in extremely harsh environments such as underwater, which greatly expands the application scenarios of ultrasonic touch products. However, most of the current ultrasonic systems that achieve touch are through piezoelectric blocks or probes, which greatly increases the weight and complexity of the system, and is not conducive to the integrated development of the system; in addition, the sensitivity of ultrasonic echo positioning is poor, and the touch experience is not good.

[0003] In summary, it is necessary to provide a touch control system and electronic device that can reduce weight, facilitate integration and have high sensitivity. Summary of the invention

[0004] In order to solve the above problems, the present application proposes a touch control system and an electronic device.

[0005] On the one hand, the present application proposes a touch control system, including: a touch control module and a control module;

[0006] The touch module comprises a glass layer, a first indium tin oxide electrode layer, a polyvinylidene fluoride layer, and a second indium tin oxide electrode layer which are in contact with each other from top to bottom;

[0007] The touch control module is used to generate ultrasonic waves through vibration, receive echo signals and generate electric fields;

[0008] The control module is used to generate a wave signal that triggers the touch module to vibrate, and send the wave signal to the touch module; determine the charge according to the electric field; and determine the touch information according to the echo signal and the charge.

[0009] Preferably, the first indium tin oxide electrode layer includes a plurality of parallel first indium tin oxide electrode chains, and each of the first indium tin oxide electrode chains includes a plurality of connected first indium tin oxide electrode units.

[0010] Preferably, the second indium tin oxide electrode layer includes a plurality of parallel second indium tin oxide electrode chains, each of which includes a plurality of connected second indium tin oxide electrode units; and the second indium tin oxide electrode chains are perpendicular to the first indium tin oxide electrode chains in a horizontal direction.

[0011] Preferably, the plurality of first indium tin oxide electrode units are connected via a plurality of first indium tin oxide electrode connecting portions;

[0012] The plurality of second indium tin oxide electrode units are connected via a plurality of second indium tin oxide electrode connecting portions.

[0013] Preferably, each of the first indium tin oxide electrode chains is connected to a first pad;

[0014] Each of the second indium tin oxide electrode chains is connected to a second solder pad;

[0015] The side lengths of the first pad and the second pad are both 100 micrometers.

[0016] Preferably, the polyvinylidene fluoride layer includes a plurality of polyvinylidene fluoride units, and each of the polyvinylidene fluoride electrode units is connected to a plurality of adjacent polyvinylidene fluoride units via a polyvinylidene fluoride connecting portion.

[0017] Preferably, the polyvinylidene fluoride unit overlaps with the first indium tin oxide electrode unit and the second indium tin oxide electrode unit adjacent thereto in a vertical direction to form a touch control unit.

[0018] Preferably, the diameters of the polyvinylidene fluoride unit, the first indium tin oxide electrode unit and the second indium tin oxide electrode unit are all 200 micrometers;

[0019] The thickness of the first indium tin oxide electrode layer and the second indium tin oxide electrode layer are both 135 microns;

[0020] The thickness of the polyvinylidene fluoride layer is 10 microns;

[0021] The thickness of the glass layer is 500 micrometers.

[0022] Preferably, the control module comprises: a transmitting and receiving switch unit, an amplifier unit, a processing unit, a signal generating unit and a capacitive sensor unit;

[0023] The processing unit is connected to the amplifier unit and the capacitive sensor unit;

[0024] The signal generating unit is connected to the transmitting and receiving switch unit;

[0025] The transmitting and receiving switch unit is connected to one end of each of the first indium tin oxide electrode chains and one end of each of the second indium tin oxide electrode chains;

[0026] The capacitive sensor unit is connected to one end of each of the first indium tin oxide electrode chains and one end of each of the second indium tin oxide electrode chains.

[0027] In a second aspect, the present application proposes an electronic device, comprising a touch control system as described in any one of the first aspects.

[0028] The advantages of the present application are: the touch module includes a glass layer, a first indium tin oxide electrode layer, a polyvinylidene fluoride layer, and a second indium tin oxide electrode layer that are in contact with each other from top to bottom, and is light in weight; ultrasonic waves are generated and ultrasonic echo signals are received by the first indium tin oxide electrode layer, the polyvinylidene fluoride layer, and the second indium tin oxide electrode layer, thereby making the touch system simpler and facilitating system integration; the touch module can also generate an electric field, and the control module can determine the charge according to the electric field, and determine the touch information together with the ultrasonic echo signal, thereby improving sensitivity and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not to be considered as limiting the present application. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0030] Figure 1 is a schematic diagram of a touch control system provided by the present application;

[0031] Figure 2 is a schematic diagram of a touch control module of a touch control system provided by the present application;

[0032] Figure 3 is a schematic diagram of a first indium tin oxide electrode layer of a touch control system provided by the present application;

[0033] Figure 4 is a schematic diagram of a second indium tin oxide electrode layer of a touch control system provided by the present application;

[0034] Figure 5 is a schematic diagram of a polyvinylidene fluoride layer of a touch control system provided by the present application;

[0035] Figure 6 is a schematic diagram of a touch control unit of a touch control system provided by the present application;

[0036] Figure 7 is a schematic diagram of a control module of a touch control system provided by the present application;

[0037] Figure 8 is a schematic diagram of the preparation of a touch control module of a touch control system provided by the present application;

[0038] Fig. 9 is a schematic diagram of preparing another touch control module of a touch control system provided by the present application;

[0039] Fig.10 is another schematic diagram of a touch control system provided by the present application;

[0040] Fig.11 It is a schematic diagram of a display module of a touch control system provided in the present application. DETAILED DESCRIPTION

[0041] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0042] The advantage of ultrasonic touch is that it can achieve multi-touch on a variety of solid surfaces such as metal and glass. There is almost no restriction on the material of the touch panel. At the same time, it can resist the interference of stains and dust. Not only that, ultrasonic echo positioning can allow touch devices to maintain good touch capabilities in extreme application scenarios such as underwater. This greatly expands the application scenarios. However, most of the ultrasonic systems that currently achieve touch are through piezoelectric blocks or probes, which greatly increases the weight and complexity of the system and is not conducive to the integrated development of the system; and the materials currently used to prepare ultrasonic probes are mostly opaque, which also makes it difficult to have both touch and screen display functions; in addition, the sensitivity of ultrasonic echo positioning is poorer than that of capacitive touch, and it is difficult to achieve the same touch experience; the positioning method using a single ultrasound also reduces the sensitivity of positioning.

[0043] Polyvinylidene fluoride (PVDF) is a piezoelectric material with good piezoelectric properties and high transparency in the thickness (d33) working mode; indium tin oxide (ITO) has high conductivity and good transparency; therefore, combining the two to prepare an ultrasonic transducer is not only light in weight and easy to integrate, but also can achieve good ultrasonic transceiver performance without affecting the image display on the screen.

[0044] The implementation method of the present application performs a series of array designs on piezoelectric micromechanical ultrasonic transducers, adopts a new type of laminate based on polyvinylidene fluoride piezoelectric material, on the one hand, utilizes the thickness mode (d33) of polyvinylidene fluoride, and realizes ultrasonic-based surface touch detection through ultrasonic pulse echo positioning, and on the other hand, based on polyvinylidene fluoride and indium tin oxide, utilizes the mutual capacitance between the top electrode rows to realize capacitance-based surface touch (capacitive touch). Finally, by combining the touch results of the two methods, a hybrid touch function of ultrasound and capacitance is realized. In addition, it is processed through the relevant processes of micro-electro-mechanical system (MEMS), and the preparation cost is low, which is conducive to large-scale use.

[0045] In the first aspect, in order to solve the above problems, the embodiments of the present application provide a touch control system, such as Figure 1 As shown, it includes: a touch module 100 and a control module 200. Figure 2 As shown, the touch module 100 includes a glass layer 101, a first indium tin oxide electrode layer 102, a polyvinylidene fluoride layer 103 and a second indium tin oxide electrode layer 104 that are in contact from top to bottom; the touch module 100 is used to generate ultrasonic waves by vibration, receive echo signals and generate electric fields; the control module 200 is used to generate a wave signal that triggers the vibration of the touch module 100 and sends it to the touch module 100; determine the charge according to the electric field; and determine the touch information according to the echo signal and the charge.

[0046] The touch information includes: touch position and touch area, etc. The first indium tin oxide electrode layer 102 is a bottom electrode layer, the second indium tin oxide electrode layer 104 is a top electrode layer, and the polyvinylidene fluoride layer 103 is a piezoelectric layer.

[0047] like Figure 3 As shown, the first ITO electrode layer 102 includes a plurality of parallel first ITO electrode chains 120 , and each first ITO electrode chain 120 includes a plurality of connected first ITO electrode units 121 .

[0048] like Figure 4 As shown, the second ITO electrode layer 104 includes a plurality of parallel second ITO electrode chains 140 , each of which includes a plurality of connected second ITO electrode units 141 ; the second ITO electrode chains 140 are perpendicular to the first ITO electrode chains 120 in the horizontal direction.

[0049] like Figure 5 As shown, the polyvinylidene fluoride layer 103 includes a plurality of polyvinylidene fluoride units 131 , and each polyvinylidene fluoride electrode unit is connected to a plurality of adjacent polyvinylidene fluoride units 131 via a polyvinylidene fluoride connecting portion 132 .

[0050] The polyvinylidene fluoride layer 103 may be patterned by etching the to-be-etched area 133 .

[0051] like Figure 6 As shown, the polyvinylidene fluoride unit 131 overlaps with the first indium tin oxide electrode unit 121 and the second indium tin oxide electrode unit 141 adjacent thereto in a vertical direction to form a touch control unit 105 .

[0052] like Figure 6As shown, the touch control unit 105 includes: a first indium tin oxide electrode unit 121, a polyvinylidene fluoride unit 131 and a second indium tin oxide electrode unit 141 which are overlapped in sequence in the vertical direction.

[0053] like Figure 3 and Figure 4 As shown, the plurality of first ITO electrode units 121 are connected via a plurality of first ITO electrode connecting portions 122 ; and the plurality of second ITO electrode units 141 are connected via a plurality of second ITO electrode connecting portions 142 .

[0054] The length of the connection portion includes a length range of greater than or equal to 20 μm (micrometers) and less than or equal to 80 μm; since the smaller the pitch of the touch unit 105, the more array elements (touch unit 105) there are under the same area, and the higher the positioning accuracy, but this will also increase the number of signal channels and slow down the data processing speed at the back end, so the length of the connection portion can be 50 μm. The width of the connection portion includes a length range of greater than or equal to 5 μm and less than or equal to 15 μm. If the connection portion is too thin, higher process requirements are required, and if it is too thick, the parasitic capacitance will be too large, thereby affecting the measurement accuracy. Therefore, the width of the connection portion can be 10 μm.

[0055] The implementation method of the present application performs a series of array designs on the piezoelectric micromechanical ultrasonic transducer, realizing a simple touch unit 105 with ultrasonic positioning function and capacitive positioning function. In addition, by simultaneously adopting the two methods of ultrasonic echo touch positioning and capacitive sensing positioning, while improving the touch sensitivity and accuracy, it also retains a strong anti-interference ability for stains and water stains, and can be used underwater, providing a more accurate and reliable touch solution for devices that need touch in extreme environments. Since the materials are all transparent, it will not affect the image display on the screen.

[0056] like Figure 3 and Figure 4 As shown, each first ITO electrode chain 120 is connected to a first pad 123; each second ITO electrode chain 140 is connected to a second pad 143; the side lengths of the first pad 123 and the second pad 143 are both 100 microns. The four sides of the first pad 123 and the second pad 143 may all be 100 microns.

[0057] The first pad 123 is in the first indium tin oxide electrode layer 102 and is also made of indium tin oxide. A first indium tin oxide electrode chain 120 can be connected to the first pad 123 via a first indium tin oxide electrode connecting portion 122. The second pad 143 is in the second indium tin oxide electrode layer 104 and is also made of indium tin oxide. A second indium tin oxide electrode chain 140 can be connected to the second pad 143 via a second indium tin oxide electrode connecting portion 142.

[0058] The first pad 123 and the second pad 143 can both be connected to the gold fingers of the external control circuit through a wire check process.

[0059] The diameters of the polyvinylidene fluoride unit 131, the first indium tin oxide electrode unit 121 and the second indium tin oxide electrode unit 141 are all 200 microns; the thicknesses of the first indium tin oxide electrode layer 102 and the second indium tin oxide electrode layer 104 are both 135 microns; the thickness of the polyvinylidene fluoride layer 103 is 10 microns; and the thickness of the glass layer 101 is 500 microns.

[0060] like Figure 7 As shown, the control module 200 includes: a transmitting and receiving switch unit 201, an amplifier unit 202, a processing unit 203, a signal generating unit 204 and a capacitive sensor unit 205. The processing unit 203 is connected to the amplifier unit 202 and the capacitive sensor unit 205; the signal generating unit 204 is connected to the transmitting and receiving switch unit 201; the transmitting and receiving switch unit 201 is connected to one end of each first indium tin oxide electrode chain 120 and one end of each second indium tin oxide electrode chain 140; the capacitive sensor unit 205 is connected to one end of each first indium tin oxide electrode chain 120 and one end of each second indium tin oxide electrode chain 140.

[0061] The calculation of the touch results is completed through machine learning methods. Specifically: first, use PDMS to simulate the finger (it can also be replaced with other materials, such as metal, depending on the application scenario), place the entire device underwater or in the air (depending on the application scenario), and use the translation stage to let the simulated finger touch enough points on the touch panel. The pulse echo time and capacitance of each point are collected according to the row and column addressing method, and these two data are used together with the coordinate position as a data set for machine learning training. When using it after the training is completed, you only need to input the pulse echo time and capacitance of each position into the model to get the touch position. This method can meet customized usage needs in different scenarios.

[0062] Below, the implementation methods of the present application are further described.

[0063] like Figure 8As shown, the initial stacking is first deposited, which includes, from top to bottom, a 10 μm thick polyvinylidene fluoride layer 103, a 135 nm thick first indium tin oxide electrode layer 102, and a 500 μm thick glass layer 101 (glass passive layer). Fig. 9 As shown, after that, the polyvinylidene fluoride layer 103 and the first indium tin oxide electrode layer 102 are patterned by an etching process, and a first indium tin oxide electrode chain 120 is formed in the first indium tin oxide electrode layer 102. Then, the second indium tin oxide electrode layer 104 is deposited and patterned, and other hardware preparation processes are performed to form a second indium tin oxide electrode chain 140 in the second indium tin oxide electrode layer 104. Among them, the first indium tin oxide electrode layer 102 is used as a bottom electrode layer, the second indium tin oxide electrode layer 104 is used as a top electrode layer, and the polyvinylidene fluoride layer 103 is used as a piezoelectric layer.

[0064] The implementation of the present application mainly utilizes the d33 piezoelectric coefficient of polyvinylidene fluoride, that is, the thickness vibration mode. In the layout design, the second indium tin oxide electrode unit 141 as the top electrode, the polyvinylidene fluoride unit 131 as the piezoelectric layer, and the first indium tin oxide electrode unit 121 as the bottom electrode have the same graphics, all of which are circles with a diameter of 200μm. The three are stacked in sequence to form a touch unit 105 as an array element. Among them, multiple second indium tin oxide electrode units 141 are connected in series in columns to form a second indium tin oxide electrode chain 140, and multiple first indium tin oxide electrode units 121 are connected in series in rows to form a first indium tin oxide electrode chain 120. Each first indium tin oxide electrode chain 120 is connected to a first pad 123 (pad) with a side length of 100μm through a series connection line, and each second indium tin oxide electrode chain 140 is connected to a second pad 143 (pad) with a side length of 100μm through a series connection line.

[0065] By patterning the piezoelectric layer, the mechanical crosstalk of the array element to nearby array elements can be reduced when the array element vibrates, while also reducing the interference with mutual capacitance detection and improving detection accuracy.

[0066] like Fig.10As shown, a touch module 100 including 8×8 touch units 105, totaling 64. The working process of the embodiment of the present application includes two stages, namely, an ultrasonic positioning stage 231 and a capacitive positioning stage 232. In the ultrasonic positioning stage, based on the row-column addressing method, a column of the second indium tin oxide electrode chain 140 (top electrode) and a row of the first indium tin oxide electrode chain 120 (bottom electrode) connected to each other are controlled, a touch unit 105 is stimulated to vibrate by a signal generator, and the touch unit 105 is used to receive the ultrasonic echo (pulse echo) signal generated after the vibration, and the amplitude of the echo signal is analyzed to determine whether the finger is above the current array element, and the echo scanning of all array elements is completed by row-column scanning. The information in all echo signals is received by the transmitting and receiving switch unit 201 (T / R switch), and transmitted to the processing unit 203 through the amplifier unit 202 for processing, and the final touch position (such as finger position), touch area (such as pressing area) and other ultrasonic positioning information are located by the existing algorithm. In the capacitance positioning stage, by controlling the voltage applied on a column of the second indium tin oxide electrode chain 140 (top electrode), and then by detecting the charge on a row of the first indium tin oxide electrode chain 120 (bottom electrode), it is determined whether a finger is hovering above one of the touch units 105, and the mutual capacitance of all positions is measured through row and column addressing to obtain capacitance positioning information. Finally, the results of the two positioning information are combined through the existing algorithm to determine the accurate touch information.

[0067] like Fig.11 As shown, the embodiment of the present application further includes a display module 300, and the display module 300 is placed below the second indium tin oxide electrode layer. The display module 300 includes a display screen, such as a digital display screen (digital display screen), etc.

[0068] like Fig.11 As shown, in the embodiment of the present application, the glass layer 101 faces upward and the second indium tin oxide electrode layer (top electrode layer) faces downward, and the second indium tin oxide electrode layer and the display module 300 (such as a digital display screen) below the second indium tin oxide electrode layer can be connected by an adhesive.

[0069] Since the materials of all layers of the touch module 100 in the embodiment of the present application are transparent and the passive layer is glass, it does not affect the light transmission of the bottom digital display screen, and also does not affect the touch effect and experience.

[0070] The embodiment of the present application adjusts the size, number, spacing and wiring of the touch control unit, and combines the piezoelectric micromechanical ultrasonic transducer stacking design with excellent performance, so that the touch control unit can have the functions of ultrasonic touch and capacitive touch at the same time.

[0071] For ultrasonic touch, it is necessary to send ultrasonic waves through the material of the touch panel through a piezoelectric micromechanical ultrasonic transducer. If the finger on the upper side of the touch panel is pressing, the ultrasonic wave will be reflected at the interface between the finger and the panel. The ultrasonic echo is captured by the piezoelectric mechanical ultrasonic transducer at the bottom and converted into a voltage signal to obtain the touch position based on ultrasound. In this application, a thin and transparent touch unit is used as a piezoelectric micromechanical ultrasonic transducer. At the same time, during the operation, a DC voltage is applied column by column, and the change in the mutual capacitance formed between the current column and all rows is detected in the control module 200 to determine the pressing position of the finger. After completion, the scanning continues column by column and row by row, and finally the capacitive touch detection of the entire array is completed. Finally, it is compared with the result of ultrasonic touch (ultrasonic positioning information) to obtain the final touch information such as the touch position.

[0072] In the implementation of the present application, any solid interface can also be used as the panel of the touch module 100 by replacing the substrate material. At the same time, since ultrasonic touch is detected by using the reflection caused by the difference in acoustic impedance between different objects, it can be applied in more harsh scenes such as underwater, which greatly broadens the application range of the product. In order to take into account both anti-interference ability and compatibility, the implementation of the present application can use the position of the capacitive touch to correct the final result when the touch conditions allow, and achieve the effect of hybrid touch without changing the design of the touch module 100 and the complexity of the system. Not only that, the implementation of the present application not only reduces the crosstalk during ultrasonic emission, but also reduces the mutual capacitance formed between the electrodes, thereby further improving the anti-interference ability and sensitivity. In the implementation of the present application, a glass substrate is used, and the touch module 100 is bonded to the digital display screen. The high light transmittance of the transparent material of the touch module 100 ensures that the image displayed on the screen can pass through the touch module 100.

[0073] In a second aspect, according to an embodiment of the present application, an electronic device is further provided, comprising a touch control system as described in any one of the first aspects.

[0074] In the method of the present application, the touch module includes a glass layer, a first indium tin oxide electrode layer, a polyvinylidene fluoride layer, and a second indium tin oxide electrode layer, which are in contact from top to bottom, and are light in weight; ultrasonic waves are generated by the first indium tin oxide electrode layer, the polyvinylidene fluoride layer, and the second indium tin oxide electrode layer, and ultrasonic echo signals are received, so that the touch system is more concise and convenient for system integration; the touch module can also generate an electric field, and the control module can determine the charge according to the electric field, and determine the touch information together with the ultrasonic echo signal, which can improve the sensitivity and accuracy. By designing the size, radius, arrangement mode, and wiring of the array, the size of the touch unit and the size of the connection part are limited, and the influence of parasitic capacitance on the touch unit can be reduced, thereby improving the sensitivity. Through the graphical design of the polyvinylidene fluoride layer, mechanical crosstalk is reduced, and the ultrasonic positioning accuracy and capacitance measurement accuracy are improved. By reusing the touch units in the same array, ultrasonic sensing and capacitive sensing are realized at the same time, which can provide strong anti-interference ability while improving the touch accuracy, eliminating the selection restrictions on the touch medium and screen material. The preparation of the piezoelectric micro-ultrasonic transducer of the touch unit is completed through more excellent lamination and MEMS processing technology, which reduces the size of the touch unit, reduces the processing cost, and is conducive to the intensive design of the system. Through the transparent piezoelectric layer material PVDF and the transparent electrode layer material ITO, the touch module is guaranteed to have high light transmittance in extreme environments and the application of special materials without affecting the function of the screen display. Through the row and column addressing method, multiple array elements are connected to the transmitting and receiving switch unit as the ultrasonic transceiver system and the capacitive sensor unit as the capacitive detection system using n+n channels, which can reduce hardware complexity while reducing costs.

[0075] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A touch control system, characterized in that: include: Touch module and control module; The touch module comprises a glass layer, a first indium tin oxide electrode layer, a polyvinylidene fluoride layer, and a second indium tin oxide electrode layer which are in contact with each other from top to bottom; The touch control module is used to generate ultrasonic waves through vibration, receive echo signals and generate electric fields; The control module is used to generate a wave signal that triggers the touch module to vibrate, and send the wave signal to the touch module; determine the charge according to the electric field; and determine the touch information according to the echo signal and the charge.

2. The touch control system according to claim 1, wherein: The first indium tin oxide electrode layer includes a plurality of parallel first indium tin oxide electrode chains, and each of the first indium tin oxide electrode chains includes a plurality of connected first indium tin oxide electrode units.

3. The touch control system according to claim 2, wherein: The second indium tin oxide electrode layer includes a plurality of parallel second indium tin oxide electrode chains, each of which includes a plurality of connected second indium tin oxide electrode units; the second indium tin oxide electrode chains are perpendicular to the first indium tin oxide electrode chains in a horizontal direction.

4. The touch control system according to claim 3, wherein: The plurality of first indium tin oxide electrode units are connected via a plurality of first indium tin oxide electrode connecting portions; The plurality of second indium tin oxide electrode units are connected via a plurality of second indium tin oxide electrode connecting portions.

5. The touch control system according to claim 3, wherein: Each of the first indium tin oxide electrode chains is connected to a first solder pad; Each of the second indium tin oxide electrode chains is connected to a second solder pad; The side lengths of the first pad and the second pad are both 100 micrometers.

6. The touch control system according to claim 3, wherein: The polyvinylidene fluoride layer includes a plurality of polyvinylidene fluoride units, and each of the polyvinylidene fluoride electrode units is connected to a plurality of adjacent polyvinylidene fluoride units via a polyvinylidene fluoride connecting portion.

7. The touch control system according to claim 6, wherein: The polyvinylidene fluoride unit overlaps with the first indium tin oxide electrode unit and the second indium tin oxide electrode unit adjacent to the polyvinylidene fluoride unit in a vertical direction to form a touch control unit.

8. The touch control system according to claim 6, wherein: The diameters of the polyvinylidene fluoride unit, the first indium tin oxide electrode unit and the second indium tin oxide electrode unit are all 200 micrometers; The thickness of the first indium tin oxide electrode layer and the second indium tin oxide electrode layer are both 135 microns; The thickness of the polyvinylidene fluoride layer is 10 microns; The thickness of the glass layer is 500 micrometers.

9. The touch control system according to claim 3, wherein: The control module includes: a transmitting and receiving switch unit, an amplifier unit, a processing unit, a signal generating unit and a capacitive sensor unit; The processing unit is connected to the amplifier unit and the capacitive sensor unit; The signal generating unit is connected to the transmitting and receiving switch unit; The transmitting and receiving switch unit is connected to one end of each of the first indium tin oxide electrode chains and one end of each of the second indium tin oxide electrode chains; The capacitive sensor unit is connected to one end of each of the first indium tin oxide electrode chains and one end of each of the second indium tin oxide electrode chains.

10. An electronic device, characterized in that: The invention comprises a touch control system as claimed in any one of claims 1 to 9.

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