Vehicle-gauge-level multi-lead SMD (Surface Mounted Device) packaging piece and preparation method thereof

Abstract

The invention discloses a vehicle-gauge-level multi-lead SMD packaging piece and a preparation method thereof, and relates to the technical field of electronic component structures, and a first end face of the packaging piece is provided with a mounting groove for accommodating an electronic device along a first direction; a guide channel is formed in the packaging piece and extends to the first end face from the groove bottom wall of the mounting groove; a pin of the electronic device at least partially passes through the guide channel and extends to the first end face. Through the arrangement of the guide channel, the pins of the THT components controllably extend to the first end face in the packaging piece, and most of the pins need to penetrate through the guide channel, so that the risk of short circuit is reduced, the minimum safety distance between the components is further reduced, and the integration density of the circuit board is improved; meanwhile, through the design of the packaging piece body, conversion from THT components to SMD packaging is achieved, the installation mode of SMD components can be simulated through the THT components in the development stage, and then the integration density of a vehicle gauge circuit board is improved on the premise that the development cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component structures, and in particular to an automotive-grade multi-lead SMD package and a preparation method thereof. Background Art

[0002] With the rapid development of new energy vehicles, the application of electronic components in them is becoming more and more extensive. Electronic components include power semiconductors, sensors, capacitors, resistors, etc. Most of the above electronic components are in the form of THT components (Through-hole technology) or SMD components (Surface Mount Technology).

[0003] Specifically, THT components need to be inserted into the circuit board through the holes on the circuit board, and then connected by manual or automatic welding. Due to the limitation that THT components need to open holes on the circuit board, the integration density of the circuit board is difficult to further improve. At the same time, new energy vehicles usually need to meet the requirements of high integration and miniaturization in the design of electronic systems, which poses higher challenges to THT components; in order to achieve high-density and compact circuit board layout, engineers usually prefer to use SMD components, but in the actual research and development process, due to the supply types and costs of suppliers, it is difficult for electronic components to adopt SMD components in all aspects, resulting in the need to open holes on the circuit board for THT components, resulting in a reduction in the integration density of the circuit board; if SMD components with parameters equivalent to THT components are directly customized, it will often bring higher development costs during the development stage.

[0004] It can be seen that the types of electronic components in the existing technology are difficult to meet the development requirements of automotive circuit boards regarding integration density under the premise of low development costs. Summary of the invention

[0005] The purpose of the present invention is to provide an automotive-grade multi-lead SMD package and a preparation method thereof, so as to solve the problem in the prior art that it is difficult to increase the integration density of automotive-grade circuit boards during the development stage under the premise of low development costs.

[0006] To achieve this object, the present invention adopts the following technical solutions: An automotive-grade multi-lead SMD package comprises a package, wherein a first end surface of the package is provided with a mounting groove for accommodating an electronic device along a first direction; A guide channel is formed in the package, and the guide channel extends from the bottom wall of the mounting groove to the first end surface; the pins of the electronic device at least partially pass through the guide channel and extend to the first end surface for surface mounting; Wherein, a side surface of the packaging component is provided with an avoidance groove, and at least a portion of the guide channel is covered by the avoidance groove along an extension direction of the avoidance groove.

[0007] Optionally, the guide channel includes a first channel, a second channel and a third channel connected in sequence; the first channel is opened on the bottom wall of the mounting groove and extends to the second end face of the package; the second channel is arranged parallel to the second end face; the third channel extends to the first end face.

[0008] Optionally, the number of the pins is two, the first channel is the same as the pin, and the two first channels are arranged at intervals along the second direction; the two second channels are respectively extended in opposite directions along the second direction; and the two third channels are arranged at intervals along the second direction; Bending grooves are formed on the first end surface respectively corresponding to the outlets of the third channels, and the bending grooves are used to accommodate the pins that pass through the third channels and are bent.

[0009] Optionally, the two bending grooves are respectively extended in opposite directions along a third direction, and the third direction is respectively perpendicular to the first direction and the second direction.

[0010] Optionally, the package corresponds to the position of each of the second channel and the third channel, a first avoidance groove is formed from the first side of the package, and a second avoidance groove is formed from the second side of the package; the first avoidance groove extends to the second channel, and the second avoidance groove extends to the third channel; The first avoidance groove covers the second channel along a direction perpendicular to the first side surface, and the second avoidance groove covers the third channel along a direction perpendicular to the second side surface.

[0011] Optionally, the first avoidance groove extends to the farthest second channel to form a limiting groove between two adjacent second channels; The limiting groove is connected between the two second channels, and two bending parts are detachably slidably connected in the limiting groove, one bending part extends from the limiting groove to the outside of one first avoidance groove, and the other bending part extends from the limiting groove to the outside of another first avoidance groove.

[0012] Optionally, the bending part includes a bending main body portion that passes through the first avoidance groove and the second channel, the bending main body portion is connected to a bending transition portion in the limiting groove, and the bending transition portion is arranged parallel to the second channel; the bending transition portion is connected to a bending connection portion; wherein the two bending connection portions are connected by a tension spring.

[0013] Optionally, a positioning block is protruding from the second end surface of the packaging component, and a positioning hole is formed on the positioning block.

[0014] Optionally, along the first direction, the second avoidance groove passes through the first end surface and the second end surface.

[0015] A method for preparing an automotive-grade multi-lead SMD package, which is applied to the automotive-grade multi-lead SMD package as described above, comprises: Place the electronic device into the mounting groove, and bend the pins along the guide channel to the first end surface.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides an automotive-grade multi-lead SMD package and a preparation method thereof, which allows the pins of THT components to extend to the first end face in a controlled manner inside the package through the setting of a guide channel, and most of the pins need to pass through the guide channel, thereby reducing the risk of short circuit, further reducing the minimum safe distance between components, and improving the integration density of the circuit board; at the same time, through the design of the package body, the conversion of THT components to SMD packaging is realized to meet the requirements of new energy vehicle electronic systems for high integration and miniaturization, and can simulate the installation method of SMD components with THT components in the development stage, thereby meeting the development requirements of new energy vehicle electronic systems, and then improving the integration density of automotive-grade circuit boards while reducing development costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0019] Figure 1 A schematic diagram of the overall structure of an automotive-grade multi-lead SMD package provided by an embodiment of the present invention; Figure 2 A schematic diagram of a partial cross-sectional structure of an automotive-grade multi-lead SMD package provided by an embodiment of the present invention; Figure 3A schematic diagram of the side structure of an automotive-grade multi-lead SMD package provided by an embodiment of the present invention; Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure along AA; Figure 5 A schematic diagram of the top view of the automotive-grade multi-lead SMD package provided by an embodiment of the present invention; Figure 6 for Figure 5 Schematic diagram of the cross-section structure along BB; Illustrations: 100, package; 101, first end face; 102, second end face; 103, mounting groove; 104, first side face; 105, second side face; 106, first avoidance groove; 107, second avoidance groove; 108, limiting groove; 120, guide channel; 121, first channel; 122, second channel; 123, third channel; 124, bending groove; 130, positioning block; 131, positioning hole; 200, electronic device; 210, pin; 300, bending part; 310, bending main body; 320, bending transition part; 330, bending connection part. DETAILED DESCRIPTION

[0020] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0022] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0023] Embodiment 1: The automotive-grade multi-lead SMD package provided in this embodiment is designed to meet the high requirements for integration and miniaturization in current automotive-grade electronic systems; by improving the automotive-grade multi-lead SMD package, it not only solves the problem of low circuit board integration, but also reduces the cost expenditure in the development process to a certain extent; specifically, during the development stage, engineers can use THT components that simulate the installation method of SMD components, which greatly reduces the risk and cost of prototype development. In addition, the design of the automotive-grade multi-lead SMD package has the advantage of high reliability and can meet the needs of new energy vehicle electronic systems to resist complex working conditions such as vibration and temperature changes.

[0024] like Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, the automotive-grade multi-lead SMD package in this embodiment includes a package 100, and a first end face 101 of the package 100 is provided with a mounting groove 103 for accommodating the electronic device 200 along a first direction; a guide channel 120 is formed in the package 100, and the guide channel 120 extends from the bottom wall of the mounting groove 103 to the first end face 101; the pin 210 of the electronic device 200 at least partially passes through the guide channel 120 and extends to the first end face 101 for surface mounting.

[0025] Among them, the first direction is also the mounting direction of the automotive-grade multi-lead SMD package, and the first end face 101 is the mounting surface of the automotive-grade multi-lead SMD package on the circuit board. In this embodiment, after the electronic device 200 is placed in the installation groove 103, its pin 210 is correspondingly inserted into the guide channel 120, and then with the help of a bending machine or manual bending, the pin 210 can be bent along the guide channel 120 and extended to the first end face 101, thereby being used for surface mounting; the electronic device 200 includes but is not limited to power semiconductors, sensors, capacitors, resistors, etc.

[0026] Specifically, the automotive-grade multi-lead SMD package in this embodiment allows the pins 210 of the THT components to extend to the first end surface 101 in a controlled manner inside the package 100 through the setting of the guide channel 120. Most of the pins 210 need to pass through the guide channel 120, thereby reducing the risk of short circuits, further reducing the minimum safe spacing between components, and improving the integration density of the circuit board; at the same time, through the design of the package 100 body, the conversion of THT components to SMD packages is realized to meet the requirements of new energy vehicle electronic systems for high integration and miniaturization, and THT components can be used to simulate the installation method of SMD components during the development stage, thereby meeting the development requirements of new energy vehicle electronic systems, and further improving the integration density of automotive-grade circuit boards while reducing development costs.

[0027] Furthermore, if Figure 5 and Figure 6 As shown, the guide channel 120 includes a first channel 121, a second channel 122 and a third channel 123 connected in sequence; the first channel 121 is opened at the bottom wall of the mounting groove 103 and extends to the second end surface 102 of the package 100; the second channel 122 is arranged parallel to the second end surface 102; the third channel 123 extends to the first end surface 101. Exemplarily, the connected first channel 121, the second channel 122 and the third channel 123 are in a "J" shape as a whole, and overlap with the electronic device 200 in the projection in the first direction, thereby controlling the pins 210 in a more compact space and further improving the integration density of the circuit board.

[0028] Furthermore, the package 100 is provided with guide channels 120 at positions corresponding to the pins 210, and each guide channel 120 includes a first channel 121, a second channel 122 and a third channel 123 connected to each other. The guide channels 120 are independently arranged, and the package 100 is provided with double sidewall surfaces corresponding to each pin 210. For example, when the electronic device 200 has two pins 210, the package 100 includes four sidewall surfaces, and the whole is rectangular; the electronic device 200 has four pins 210. 210, the package 100 includes eight sidewalls and is octagonal as a whole; in addition, a side of the package 100 is provided with an avoidance groove, and at least a portion of the guide channel 120 is covered by the avoidance groove along the extension direction of the avoidance groove, so that the pins 210 in part of the guide channel 120 can be pressed through the space reserved by the avoidance groove, that is, pressure can be applied to the pins 210 through the aperture reserved by the avoidance groove to bend the pins 210, thereby realizing quick bending of the pins 210, thereby improving process efficiency; Taking the electronic device 200 with two pins 210 as an example, the package 100 includes four side walls, namely two first side surfaces 104 and two second side surfaces 105. The package 100 corresponds to the positions of the second channels 122 and the third channels 123, and a first avoidance groove 106 is opened from the first side surface 104 of the package 100, and a second avoidance groove 107 is opened from the second side surface 105 of the package 100; the first avoidance groove 106 extends to the second channel 122, and the second avoidance groove 107 extends to the third channel 123; wherein the first avoidance groove 106 covers the second channel 122 along a direction perpendicular to the first side surface 104, and the second avoidance groove 107 covers the third channel 123 along a direction perpendicular to the second side surface 105.

[0029] It should be supplemented that the first avoidance groove 106 is opened from the first side surface 104 and extends inward until it overlaps with the first channel 121, so as to form the second channel 122 and the first avoidance groove 106 connected to the second channel 122. At this time, pressure can be applied to the pin 210 through the space reserved by the first avoidance groove 106 to bend the pin 210. Similarly, the second avoidance groove 107 is opened from the second side surface 105 and extends inward until it overlaps with the second channel 122, so as to form the third channel 123 and the second avoidance groove 107 connected to the third channel 123. At this time, pressure can be applied to the pin 210 through the space reserved by the second avoidance groove 107 to bend the pin 210. At the same time, to ensure that the portion of the pin 210 beyond the first channel 121 can be bent to the second channel 122 , the first avoidance groove 106 is further extended upward from the second end surface 102 to avoid the path of the pin 210 bending to the second channel 122 .

[0030] To facilitate understanding by those skilled in the art, this embodiment also provides a method for preparing an automotive-grade multi-lead SMD package, and the specific steps include: Step S201, placing the electronic device 200 into the mounting slot 103, allowing the pins 210 to pass through the first channel 121; Step S202, applying pressure along the second direction to the portion of the pin 210 located in the first avoidance groove 106 and the portion of the pin 210 extending beyond the first avoidance groove 106, so that the pin 210 is bent toward the second channel 122; Step S203, applying pressure along the first direction to the portion of the pin 210 located in the second avoidance groove 107 and the portion of the pin 210 extending beyond the second avoidance groove 107, so that the pin 210 is bent toward the third channel 123; It should be noted that the length of the pin 210 extending from the third channel 123 can be shorter, that is, the extending distance of the pin 210 relative to the first end surface 101 is shorter. At this time, the protruding part of the pin 210 can be set as a pad, that is, the length of the pin 210 extending from the third channel 123 matches the thickness of the pad.

[0031] As another optional implementation, the length of the pin 210 extending from the third channel 123 can be longer; the number of pins 210 is two, the first channel 121 is the same as the pin 210, and the two first channels 121 are spaced apart along the second direction; the two second channels 122 are respectively extended in opposite directions along the second direction; the two third channels 123 are spaced apart along the second direction; bending grooves 124 are provided on the first end surface 101 corresponding to the outlets of the third channels 123, and the bending grooves 124 are used to place the pins 210 that pass through the third channel 123 and are bent.

[0032] It can be understood that the two second channels 122 extend back to back, respectively, so that the arrangement of the pins 210 is more flexible and more efficient space utilization can be achieved on the first end surface 101 of the package 100, while reducing the risk of interference and electrical short circuit between the pins 210; at the same time, the setting of the bending groove 124 ensures that the pins 210 can be reliably bent to the corresponding position after passing through the third channel 123, which not only improves the stability of the package 100, but also leaves a sufficiently long pin 210, so that the subsequent connection between the pins 210 and the circuit board is more secure, avoiding the problem of poor welding caused by improper position of the pins 210.

[0033] Specifically, Figure 5 As shown, the two bending grooves 124 are respectively extended in opposite directions, and the third direction is respectively perpendicular to the first direction and the second direction. At this time, it means that the two pins 210 are finally extended in opposite directions, which can increase the spacing between the pins 210 to improve the overall safety. As another optional embodiment, the two bending grooves 124 can be extended in the same direction.

[0034] To facilitate understanding by those skilled in the art, this embodiment also provides a method for preparing an automotive-grade multi-lead SMD package, and the specific steps include: Step S201, placing the electronic device 200 into the mounting slot 103, allowing the pins 210 to pass through the first channel 121; Step S202, applying pressure along the second direction to the portion of the pin 210 located in the first avoidance groove 106 and the portion of the pin 210 extending beyond the first avoidance groove 106, so that the pin 210 is bent toward the second channel 122; Step S203, applying pressure along the first direction to the portion of the pin 210 located in the second avoidance groove 107 and the portion of the pin 210 extending beyond the second avoidance groove 107, so that the pin 210 is bent toward the third channel 123; Step S204 , applying pressure along the third direction to the portion of the pin 210 that extends beyond the third channel 123 , so that the pin 210 is bent toward the bending groove 124 .

[0035] Furthermore, if Figures 1 to 6 As shown, the first avoidance groove 106 extends to the farthest second channel 122 to form a limiting groove 108 between two adjacent second channels 122; the limiting groove 108 is connected between the two second channels 122, and two bending parts 300 are detachably slidably connected in the limiting groove 108, one bending part 300 extends from the limiting groove 108 to the outside of a first avoidance groove 106, and the other bending part 300 extends from the limiting groove 108 to the outside of another first avoidance groove 106.

[0036] To facilitate understanding by those skilled in the art, step S202 is described in detail. Step S202 specifically includes: Step S2021, push the bending member 300 to slide along the limiting groove 108 along the second direction, so that the bending member 300 moves in a direction close to the corresponding third channel 123. It can be understood that the bending member 300 corresponds to the first avoidance groove 106 one by one, and the first avoidance groove 106 corresponds to the second channel 122 and the third channel 123 one by one. Therefore, when the bending member 300 moves in a direction close to the third channel 123, it will apply pressure to the pin 210, so that the part of the pin 210 that exceeds the first channel 121 is bent in a direction close to the second channel 122.

[0037] Specifically, in the above steps, in step S202 to step S204, the bending step can be achieved by a bending machine or manually; after the bending piece 300 is introduced, it means that all the bending steps are implemented above the second end face 102, for example, by cooperating with the second end face 102 through a clamp (the clamp needs to have an avoidance groove corresponding to the position of the pin 210), the package 100 is initially clamped and positioned, and after the electronic device 200 is inserted into the mounting groove 103, pressure can be applied to the bending piece 300 on the first side 104 to apply pressure to the pin 210 through the bending piece 300, so that the pin 210 is bent toward the second channel 122. At this time, the end of the pin 210 has moved from the bottom of the package 100 to the side, which is convenient for subsequent bending by manual labor or a bending machine.

[0038] It should be supplemented that, along the first direction, the second avoidance groove 107 penetrates the first end surface 101 and the second end surface 102 , so as to facilitate the pin 210 to extend beyond the second channel 122 and bend toward the third channel 123 .

[0039] To facilitate understanding by those skilled in the art, the channel formation method of the package 100 is described below: Step S101, providing a package 100 with a mounting groove 103; the electronic device 200 includes two pins 210; Step S102, a first channel 121 is opened at a position of the bottom wall of the installation groove 103 corresponding to the pin 210, and the first channel 121 penetrates the bottom wall of the installation groove 103; Step S103, a first avoidance groove 106 is formed at a position corresponding to a first channel 121 on a first side surface 104 of the package 100, and the first avoidance groove 106 extends to the first channel 121 and overlaps with the first channel 121; a first avoidance groove 106 is formed at a position corresponding to another first channel 121 on another first side surface 104 of the package 100, and the first avoidance groove 106 extends to the first channel 121 and overlaps with the first channel 121; the two first avoidance grooves 106 are connected to form a limiting groove 108; Step S104, a second avoidance groove 107 is formed at a position corresponding to a second channel 122 on a second side surface 105 of the package 100, and the second avoidance groove 107 extends to the second channel 122 and overlaps with the second channel 122; a second avoidance groove 107 is formed at a position corresponding to another second channel 122 on another second side surface 105 of the package 100, and the second avoidance groove 107 extends to the second channel 122 and overlaps with the second channel 122; Step S105 , passing a bending member 300 through a first avoidance groove 106 and assembled in the limiting groove 108 , and passing another bending member 300 through another first avoidance groove 106 and assembled in the limiting groove 108 .

[0040] As a preferred embodiment, the bending member 300 includes a bending body 310 penetrating the first avoidance groove 106 and the second channel 122, the bending body 310 is connected to a bending transition portion 320 in the limiting groove 108, and the bending transition portion 320 is arranged in parallel with the second channel 122; the bending transition portion 320 is connected to a bending connection portion 330; wherein the two bending connection portions 330 are connected by a tension spring. In order to ensure the directional movement of the bending member 300 along the second direction, a structure such as a slide rail and a slider can be provided in the first avoidance groove 106, so that the bending member 300 can slide in the first avoidance groove 106 along the second direction; the bending member can also be clamped by a robot to ensure that the bending member 300 can slide in the first avoidance groove 106 along the second direction, which is not limited in this embodiment.

[0041] It should be noted that in the bending part 300, the bending main body part 310 and the bending transition part 320 are arranged in an "L" shape, which can increase the contact area for the pin 210, ensure that the pin 210 always extends accurately along the predetermined trajectory during the bending process, and ensure the accuracy and stability of the pin 210 during the assembly process; then, the extended bending connection part 330 is slidably connected in the limit groove 108, which initially ensures the smooth movement of the bending part 300, and then, the two bending connection parts 330 are pulled by the tension spring, so that the tension spring can evenly distribute the pressure applied to the bending part 300, thereby avoiding uneven bending or damage of the pin 210 caused by excessive force on one side, and further ensuring that the two bending parts 300 can be pushed outward smoothly and evenly. More specifically, when the bending piece 300 needs to move and apply pressure, the tension spring can effectively provide a reverse force, ensuring that the two bending pieces 300 are always in a stable state during the bending process of the pin 210, ensuring that the pin 210 will not undergo uneven deformation during the entire assembly process, ensuring the bending accuracy of the pin, and further improving the quality of assembly.

[0042] On the basis of the above-mentioned embodiment, the package 100 is provided with a positioning block 130 protruding from the second end surface 102, and a positioning hole 131 is provided on the positioning block 130. The positioning hole 131 is used for clamping and positioning by a clamp, and in combination with the use of the bending member 300, the bending step can be integrated above the second end surface 102, thereby simplifying the bending step and reducing the bending difficulty, and the subsequent bending action can be completed by a single clamp positioning.

[0043] Embodiment 2: This embodiment further provides a method for preparing an automotive-grade multi-lead SMD package, which is applied to the automotive-grade multi-lead SMD package in the first embodiment, comprising: Step S101, providing a package 100 with a mounting groove 103; the electronic device 200 includes two pins 210; Step S102, a first channel 121 is opened at a position of the bottom wall of the installation groove 103 corresponding to the pin 210, and the first channel 121 penetrates the bottom wall of the installation groove 103; Step S103, a first avoidance groove 106 is formed at a position corresponding to a first channel 121 on a first side surface 104 of the package 100, and the first avoidance groove 106 extends to the first channel 121 and overlaps with the first channel 121; a first avoidance groove 106 is formed at a position corresponding to another first channel 121 on another first side surface 104 of the package 100, and the first avoidance groove 106 extends to the first channel 121 and overlaps with the first channel 121; the two first avoidance grooves 106 are connected to form a limiting groove 108; Step S104, a second avoidance groove 107 is formed at a position corresponding to a second channel 122 on a second side surface 105 of the package 100, and the second avoidance groove 107 extends to the second channel 122 and overlaps with the second channel 122; a second avoidance groove 107 is formed at a position corresponding to another second channel 122 on another second side surface 105 of the package 100, and the second avoidance groove 107 extends to the second channel 122 and overlaps with the second channel 122; Step S105, passing a bending member 300 through a first avoidance groove 106 and assembled in the limiting groove 108, passing another bending member 300 through another first avoidance groove 106 and assembled in the limiting groove 108; Step S200, placing the electronic device into the mounting groove 103, and bending the pins along the guide channel to the first end surface; Step S200 specifically includes: Step S201, placing the electronic device 200 into the mounting slot 103, allowing the pins 210 to pass through the first channel 121; Step S202, applying pressure along the second direction to the portion of the pin 210 located in the first avoidance groove 106 and the portion of the pin 210 extending beyond the first avoidance groove 106, so that the pin 210 is bent toward the second channel 122; Step S203, applying pressure along the first direction to the portion of the pin 210 located in the second avoidance groove 107 and the portion of the pin 210 extending beyond the second avoidance groove 107, so that the pin 210 is bent toward the third channel 123; Step S204, applying pressure along the third direction to the portion of the pin 210 that extends beyond the third channel 123, so that the pin 210 is bent toward the bending groove 124; Step S205 , taking out the bent part 300 to obtain an automotive-grade multi-lead SMD package.

[0044] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automotive grade multi-lead SMD package, characterized in that: A packaging component is included, wherein a first end surface of the packaging component is provided with a mounting groove for accommodating an electronic device along a first direction; A guide channel is formed in the package, and the guide channel extends from the bottom wall of the mounting groove to the first end surface; the pins of the electronic device at least partially pass through the guide channel and extend to the first end surface for surface mounting; Wherein, a side surface of the packaging component is provided with an avoidance groove, and at least a portion of the guide channel is covered by the avoidance groove along an extension direction of the avoidance groove.

2. The automotive grade multi-lead SMD package according to claim 1, characterized in that: The guide channel includes a first channel, a second channel and a third channel connected in sequence; the first channel is opened on the bottom wall of the mounting groove and extends to the second end surface of the package; the second channel is arranged parallel to the second end surface; the third channel extends to the first end surface.

3. The automotive grade multi-lead SMD package according to claim 2, characterized in that: The number of the pins is two, the first channel is the same as the pins, and the two first channels are arranged at intervals along the second direction; the two second channels are respectively extended in opposite directions along the second direction; and the two third channels are arranged at intervals along the second direction; Bending grooves are formed on the first end surface respectively corresponding to the outlets of the third channels, and the bending grooves are used to accommodate the pins that pass through the third channels and are bent.

4. The automotive grade multi-lead SMD package according to claim 3, characterized in that: The two bending grooves are respectively extended in opposite directions along a third direction, and the third direction is respectively perpendicular to the first direction and the second direction.

5. The automotive grade multi-lead SMD package according to claim 3, characterized in that: The package corresponds to the positions of the second channels and the third channels, a first avoidance groove is formed from the first side of the package, and a second avoidance groove is formed from the second side of the package; the first avoidance groove extends to the second channel, and the second avoidance groove extends to the third channel; The first avoidance groove covers the second channel along a direction perpendicular to the first side surface, and the second avoidance groove covers the third channel along a direction perpendicular to the second side surface.

6. The automotive grade multi-lead SMD package according to claim 5, characterized in that: The first avoidance groove extends to the farthest second channel to form a limiting groove between two adjacent second channels; The limiting groove is connected between the two second channels, and two bending parts are detachably slidably connected in the limiting groove, one bending part extends from the limiting groove to the outside of one first avoidance groove, and the other bending part extends from the limiting groove to the outside of another first avoidance groove.

7. The automotive grade multi-lead SMD package according to claim 6, characterized in that: The bending part includes a bending main body portion that penetrates the first avoidance groove and the second channel, the bending main body portion is connected to a bending transition portion in the limiting groove, and the bending transition portion is arranged parallel to the second channel; the bending transition portion is connected to a bending connection portion; wherein the two bending connection portions are connected by a tension spring.

8. The automotive grade multi-lead SMD package according to claim 6, characterized in that: The packaging component is provided with a positioning block protruding on the second end surface, and the positioning block is provided with a positioning hole.

9. The automotive-grade multi-lead SMD package according to claim 5, characterized in that: Along the first direction, the second avoidance groove penetrates the first end surface and the second end surface.

10. A method for preparing an automotive-grade multi-lead SMD package, characterized in that: Applied to the automotive-grade multi-lead SMD package as claimed in any one of claims 1 to 9, comprising: Place the electronic device into the mounting groove, and bend the pins along the guide channel to the first end surface.

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