Electrical connection device

Abstract

The electrical connection device includes a probe and a probe head. The probe head has a structure in which a first guide plate and a second guide plate, each having a guide hole formed therein, are disposed apart from each other along a surface normal direction of a main surface of the first guide plate. The position of the guide hole of the first guide plate and the position of the guide hole of the second guide plate through which the same probe passes are arranged so as to be parallel to and offset from the main surface of the first guide plate. The direction in which the positions of the guide holes are shifted intersects obliquely with respect to the arrangement direction of the inspection pads of the subject.

Description

Technical Field

[0001] The present invention relates to an electrical connection device used for measuring electrical characteristics of a test object. Background Art

[0002] In order to measure the electrical characteristics of an object to be inspected, such as an integrated circuit, without separating the object to be inspected from a wafer, an electrical connection device having a probe that contacts the object to be inspected and a probe head that holds the probe is used (see Patent Document 1). The electrical connection device uses a probe head having a plurality of guide plates with a hollow portion between the guide plates. The probe passes through a guide hole formed in the guide plate and is held in the probe head in a state of being bent in the hollow portion.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-118064 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] In the electrical connection device, the probes are arranged at positions corresponding to the inspection pads of the object to be inspected. Therefore, if the arrangement interval of the inspection pads becomes narrower due to the miniaturization of the object to be inspected, the arrangement interval of the probes also becomes narrower. If the arrangement interval of the probes is narrowed, when the probes bend at the hollow part inside the probe head during the inspection of the object to be inspected, adjacent probes may contact each other and cause a short circuit of the probes.

[0008] In view of the above-mentioned problems, an object of the present invention is to provide an electrical connection device capable of suppressing a short circuit between probes.

[0009] Solutions for solving problems

[0010] According to a technical solution of the present invention, an electrical connection device is provided, the electrical connection device includes a probe and a probe head, the probe head having a first guide plate and a second guide plate each having a guide hole formed therein. The probe head has a structure in which the first guide plate and the second guide plate are arranged to be separated from each other along the surface normal direction of the main surface of the first guide plate. The position of the guide hole of the first guide plate and the position of the guide hole of the second guide plate, which are penetrated by the same probe, are arranged to be staggered parallel to the main surface of the first guide plate. The direction in which the position of the guide hole is staggered is obliquely intersected with respect to the arrangement direction of the inspection pads.

[0011] Effects of the Invention

[0012] According to the present invention, it is possible to provide an electrical connection device capable of suppressing a short circuit between probes. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram showing the structure of the electrical connecting device according to the first embodiment of the present invention.

[0014] Figure 2 It is a schematic diagram showing the relationship between the cross-sectional shape of the probe and the offset direction of the electrical connection device according to the first embodiment of the present invention.

[0015] Figure 3 It is a schematic diagram showing the relationship between the shape of the guide hole and the offset direction of the electrical connecting device according to the first embodiment of the present invention.

[0016] Figure 4 It is a schematic diagram showing an example of arrangement of inspection pads of a subject.

[0017] Figure 5 It is a schematic diagram showing the interval between probes of the probe head of the comparative example.

[0018] Figure 6 It is a schematic diagram showing the intervals between probes of the probe head of the electrical connection device according to the first embodiment of the present invention.

[0019] Figure 7 It is a schematic diagram showing an example of the shape of the guide hole of the electrical connecting device according to the first embodiment of the present invention.

[0020] Figure 8 It is a schematic diagram showing another example of the shape of the guide hole of the electrical connecting device according to the first embodiment of the present invention.

[0021] Fig. 9A It is a schematic cross-sectional view showing an example of the shape of the opening of the guide hole of the electrical connecting device according to the first embodiment of the present invention.

[0022] Fig. 9B This is a schematic cross-sectional view showing another example of the shape of the opening of the guide hole of the electrical connecting device according to the first embodiment of the present invention.

[0023] Fig.10 It is a schematic diagram showing an example of arrangement of inspection pads of a subject.

[0024] Fig.11 It means Fig.10 Schematic diagram of an example of arrangement of guide holes of the electrical connection device according to the first embodiment of the present invention corresponding to the arrangement of the inspection pads shown.

[0025] Fig.12 It is a schematic diagram showing the structure of an electrical connecting device according to a second embodiment of the present invention.

[0026] Fig.13It is a schematic diagram for explaining an example in which probes come into contact with each other.

[0027] Fig.14 It is a schematic cross-sectional view showing a cover of a probe arranged in an electrical connecting device according to a second embodiment of the present invention. DETAILED DESCRIPTION

[0028] Next, the embodiments of the present invention will be described with reference to the accompanying drawings. In the description of the following drawings, the same or similar parts are marked with the same or similar figure marks. However, the drawings are schematic, and it should be noted that the ratio of the thickness of each part is different from the actual one. In addition, it goes without saying that the drawings also include parts with different dimensional relationships and proportions. The embodiments shown below illustrate the devices and methods for concretizing the technical ideas of the present invention. The materials, shapes, structures, configurations and manufacturing methods of the structural components of the embodiments of the present invention are not specific to the following contents.

[0029] (First embodiment)

[0030] like Figure 1 As shown, the electrical connection device 1 of the first embodiment has a plurality of probes 10 and a probe head 20 for holding the probes 10. The probes 10 are in contact with the subject when inspecting the subject. Hereinafter, the end of the probe 10 that is in contact with the subject is referred to as the "front end 11", and the end on the other side is referred to as the "base end 12". The front end 11 is in contact with, for example, an inspection pad arranged on the subject. The base end 12 is connected to, for example, an electrode arranged on a printed circuit board not shown. The electrodes of the printed circuit board are electrically connected to an inspection device such as a tester. An electrical signal is transmitted between the inspection device and the subject via the electrical connection device 1.

[0031] The probe head 20 includes a first guide plate 211, a second guide plate 212, and a third guide plate 213. The first guide plate 211, the second guide plate 212, and the third guide plate 213 are arranged in multiple layers separated from each other along the surface normal direction of the main surface of the first guide plate 211. The area near the base end 12 of the probe 10 passes through the first guide plate 211. The area near the front end 11 of the probe 10 passes through the third guide plate 213. The second guide plate 212 is arranged between the first guide plate 211 and the third guide plate 213, and the middle part between the front end 11 and the base end 12 of the probe 10 passes through the second guide plate 212.

[0032] Hereinafter, the first guide plate 211, the second guide plate 212, and the third guide plate 213 are referred to as the guide plate 21 without being respectively defined. Figure 1In other words, the probe head 20 holds the probe 10 in a state of passing through the guide holes formed in the guide plates 21. In addition, the first guide plate 211, the second guide plate 212, and the third guide plate 213 are sometimes referred to as "top guide plate", "middle guide plate", and "bottom guide plate", respectively.

[0033] The probe head 20 includes a first hollow portion 221 disposed between the first guide plate 211 and the second guide plate 212 and a second hollow portion 222 disposed between the second guide plate 212 and the third guide plate 213. Figure 1 In the probe head 20 shown, the first hollow portion 221 is formed by arranging the partition 23 between the outer edge of the first guide plate 211 and the outer edge of the second guide plate 212. In addition, a recess is provided on the main surface of the third guide plate 213 that faces the second guide plate 212 to form the second hollow portion 222. It goes without saying that the method of forming the first hollow portion 221 and the second hollow portion 222 is not limited to these methods.

[0034] In the description of the embodiments of the present invention, Figure 1 The X direction, Y direction, and Z direction are defined as shown. Figure 1 In the figure, the X direction is the left-right direction of the paper, the Y direction is the depth direction of the paper, and the Z direction is the up-down direction of the paper. In the Z direction, the direction in which the first guide plate 211 is located when viewed from the third guide plate 213 is set as the upper direction, and the direction in which the third guide plate 213 is located when viewed from the first guide plate 211 is set as the lower direction. In addition, regarding the main surface of the guide plate 21, the main surface facing the upper direction is also called the upper surface, and the main surface facing the lower direction is called the lower surface. That is, the surface normal direction of the upper surface and the lower surface of the guide plate 21 is the Z direction. The guide hole passes through from the upper surface to the lower surface of the guide plate 21. The upper surface and the lower surface of the guide plate 21 are parallel to the XY plane defined by the X direction and the Y direction.

[0035] When viewed from the surface normal direction (Z direction) of the main surface of the first guide plate 211, the position of the guide hole of the first guide plate 211 and the position of the guide hole of the second guide plate 212 for the same probe 10 to pass through are offset and arranged parallel to the main surface of the first guide plate 211. Hereinafter, the configuration in which the positions of the guide holes are offset parallel to the main surface of the first guide plate 211 is referred to as an "offset configuration." In addition, the direction in which the position of the guide hole 220 of the first guide plate 211 and the position of the guide hole 220 of the second guide plate 212 in the offset configuration are offset is referred to as an "offset direction." Figure 1 In the illustrated probe head 20 , the deflection direction is parallel to the X direction.

[0036] The probe 10 is made of an elastic material having conductivity. Since the probe 10 has elasticity, the guide hole of the first guide plate 211 and the guide hole of the second guide plate 212 are offset and arranged, so that the probe 10 is bent by elastic deformation inside the first hollow portion 221 provided between the first guide plate 211 and the second guide plate 212. In other words, the probe head 20 maintains the probe 10 in a bent state.

[0037] By disposing the first guide plate 211 and the second guide plate 212 in an offset manner, the probe 10 is bent in an aligned manner so that the outer side of the arc protrudes in the offset direction. In other words, when viewed from the Z direction, the probe 10 extends in the offset direction. That is, the probe head 20 controls the direction in which the probe 10 is bent by the offset configuration. Hereinafter, the surface of the bent probe 10 facing the offset direction is also referred to as an "offset surface". In addition, the surface of the probe 10 opposite to the offset surface is also referred to as an "opposite surface".

[0038] The probe 10 is held in the probe head 20 in a bent state, so that when the distal end portion 11 of the probe 10 contacts the subject with the base end portion 12 being fixed, the probe 10 is bent more at the first hollow portion 221. That is, when the subject is examined, the probe 10 is bent longitudinally between the first guide plate 211 and the second guide plate 212 by flexural deformation.

[0039] In the contact state where the probe 10 is in contact with the object, the probe 10 is further bent relative to the non-contact state where the probe 10 is not in contact with the object, so that the probe 10 is in contact with the object at a predetermined pressure. Therefore, by the offset configuration, the electrical characteristics of the object can be stably measured using the probe 10. The probes 10 are respectively passed through the second guide plate 212, so that the adjacent probes 10 in the first hollow portion 221 are prevented from contacting each other.

[0040] In the probe head 20, when viewed from the Z direction, the position of the guide hole of the second guide plate 212 and the position of the guide hole of the third guide plate 213 are substantially consistent. Therefore, the probe 10 extends linearly along the surface normal direction of the lower surface of the third guide plate 213 in the second hollow portion 222 provided between the second guide plate 212 and the third guide plate 213. As a result, the tip of the probe 10 stably contacts the inspection pad of the subject.

[0041] In addition, in order to bend the probe 10 in a desired direction by the offset configuration, it is preferred that a cross section perpendicular to the central axis direction of the probe 10 (hereinafter referred to as a "cross section") includes a straight line side perpendicular to the offset direction. For example, the cross section of the probe 10 may also be a rectangular shape. In the case where the cross section of the probe 10 is a rectangular shape, as shown in FIG. Figure 2As shown, it is preferred that the side perpendicular to the offset direction F is set as the long side, and the side parallel to the offset direction is set as the short side. By setting the side perpendicular to the offset direction F as the long side, all the probes 10 held by the probe head 20 can be bent in a predetermined direction in an aligned manner. Here, the direction in which the position of the guide hole of the second guide plate 212 is shifted when viewed from the guide hole of the first guide plate 211 is set as the offset direction F (the same below).

[0042] In order to suppress the misalignment of the probe 10 inside the guide hole on the XY plane, it is preferred that the shape of the guide hole formed in the guide plate 21 as viewed from the Z direction (hereinafter referred to as "shape") is similar to the shape of the cross section of the probe 10. Therefore, the guide hole through which the probe 10 having a side perpendicular to the offset direction F passes also includes a straight line side perpendicular to the offset direction F. Moreover, the length direction of the shape of the guide hole is perpendicular to the offset direction F. For example, Figure 2 The shape of the guide hole 220 through which the probe 10 passes may also be Figure 3 The rectangular shape shown. Figure 3 As shown, the long side direction of the guide hole 220 viewed from the Z direction is perpendicular to the offset direction F.

[0043] The probe 10 has elasticity that allows the probe 10 to return to the shape before contact with the subject when the probe 10 and the subject are in a non-contact state. Tungsten (W) or the like is used as the material of the probe 10. Alternatively, copper (Cu) alloy, palladium (Pd) alloy, nickel (Ni) alloy, W alloy or the like may be used as the material of the probe 10. A ceramic material or the like is preferably used as the material of the guide plate 21 of the probe head 20. For example, silicon nitride ceramic or the like may be used as the material of the guide plate 21.

[0044] As described below, in the electrical connection device 1, when viewed from the Z direction, the offset direction obliquely intersects with the arrangement direction of the inspection pads of the subject 2. By obliquely intersecting with the arrangement direction of the inspection pads, the interval in the bending direction (offset direction) between adjacent probes 10 can be increased. The angle formed by the arrangement direction of the inspection pads and the offset direction is, for example, 45 degrees.

[0045] Here, for Figure 4 The spacing of the probe 10 when the plurality of inspection pads 200 of the subject 2 are arranged in a matrix when viewed from the Z direction is studied. When viewed from the Z direction, the inspection pads 200 are arranged in a matrix along a first direction M1 and a second direction M2 orthogonal to the first direction M1. The plane defined by the first direction M1 and the second direction M2 is parallel to the XY plane. Figure 4As shown in FIG. 1 , the arrangement interval of the inspection pads 200 in the first direction M1 is a pitch P. In addition, the arrangement interval of the inspection pads 200 is the distance between the centers of the inspection pads 200 .

[0046] Figure 5 The spacing W1 of the probes 10 of the probe head 20A of the comparative example in which the offset direction F is the first direction M1 is shown. The spacing of the probes 10 is the distance between the centers of the probes 10 along the offset direction F (the same applies below). Figure 5 As shown, the interval W1 along the offset direction F of the probes 10 held in the probe head 20A of the comparative example is approximately the same as the pitch P which is the arrangement interval in the first direction M1 of the inspection pads 200 .

[0047] Figure 6 FIG. 2 shows the interval W2 between the probes 10 of the probe head 20 of the electrical connection device 1. Figure 6 As shown in FIG. 1 , the offset direction F of the probe head 20 obliquely intersects with both the first direction M1 and the second direction M2, which are the arrangement directions of the inspection pads 200. As a result, Figure 6 As shown, the interval W2 of the probes 10 along the deviation direction F can be made wider than the pitch P of the inspection pads 200 .

[0048] As described above, compared with the comparative example in which the arrangement direction of the inspection pads 200 and the offset direction F are the same, in the probe head 20, the intervals in the bending direction of the adjacent probes 10 are widened while the arrangement intervals of the inspection pads 200 are maintained. In other words, according to the electrical connection device 1 in which the offset direction obliquely intersects with the arrangement direction of the inspection pads 200, the intervals of the probes 10 along the offset direction F can be widened without widening the arrangement intervals of the inspection pads 200. As described above, according to the probe head 20 in which the intervals of the probes 10 along the offset direction F can be widened, since the intervals of the probes 10 in the state in which the probes 10 are bent longitudinally become narrower, contact between the probes 10 can be suppressed.

[0049] As described above, in the electrical connection device 1 of the first embodiment, the arrangement direction of the inspection pads 200 and the offset direction are obliquely intersected. Therefore, according to the electrical connection device 1, it is possible to suppress the contact between adjacent probes 10 when the probes 10 are bent. As a result, a short circuit between the probes 10 (hereinafter, also referred to as "short circuit between probes") caused by the contact between adjacent probes 10 can be prevented.

[0050] exist Figure 3The guide hole 220 is shown in the example of a rectangular shape, but the shape of the guide hole 220 is not limited to a rectangular shape. For example, the guide hole 220 may be in a trapezoidal shape, a parallelogram shape, or a square shape. In addition, the guide hole 220 may be in a rectangular shape with its corners chamfered in an R shape. Alternatively, Figure 7 As shown, the shape of the guide hole 220 is an elliptical shape. Figure 7 The major axis direction of the guide hole 220 shown is perpendicular to the offset direction F, and the minor axis direction is parallel to the offset direction F. In other words, when the guide hole 220 is elliptical, the length direction of the guide hole 220 is also perpendicular to the offset direction.

[0051] Alternatively, you can Figure 8 As shown, the guide hole 220 is a rectangular shape with an escape process (corner escape) performed to enlarge the corners. By forming the corner escape portion at the corner of the guide hole 220, damage to the probe 10 and the guide plate 21 caused by contact between the corner of the guide hole 220 and the probe 10 can be suppressed.

[0052] In addition, the opening portion of the guide hole 220 in the cross section of the guide plate 21 along the thickness direction may be as follows: Fig. 9A As shown, it can also be formed vertically as Fig. 9B In other words, even if the cross-sectional shape of the opening of the guide hole 220 changes due to the processing method of forming the guide hole 220 in the guide plate 21, the effect of the electrical connection device 1 is not affected.

[0053] <Modification>

[0054] In the above Figure 6 2 shows an example in which the inspection pads 200 are arranged in a matrix, but the electrical connection device 1 of the first embodiment can be applied even if the inspection pads 200 are not arranged in a matrix. For example, the inspection pads 200 may be arranged in a staggered manner. Fig.10 FIG. 2 shows an example of arrangement of the inspection pads 200 at the corners of the arrangement area of ​​the inspection pads 200 when the inspection pads 200 are arranged in a staggered manner. The unit of the dimensional numbers in the figure is μm. Fig.10 In the illustrated arrangement example, in the arrangement region of the inspection pads 200 , the inner inspection pads 200 are arranged to be shifted with respect to the outer inspection pads 200 along the first direction M1 and the second direction M2 .

[0055] Fig.11 Shown with Fig.10 The configuration of the inspection pad 200 shown in FIG. Fig.11As shown, even when the inspection pads 200 are arranged in a staggered manner, by making the offset direction F inclined with respect to the arrangement direction of the inspection pads 200 , short circuits between the probes caused by contact between adjacent probes 10 can be suppressed.

[0056] (Second embodiment)

[0057] like Fig.12 As shown in FIG. 1 , the electrical connection device 1 according to the second embodiment of the present invention has a plurality of insulating covers 13 disposed on the surface of the probe 10. The covers 13 are disposed to be separated from each other along the central axis direction of the probe. Fig.12 The electrical connection device 1 shown is different from the electrical connection device 1 of the first embodiment in that a cover 13 is arranged on the surface of the probe 10. The electrical connection device 1 of the second embodiment is the same as the first embodiment in other structures. For example, the offset direction of the offset arrangement of the position of the guide hole of the guide plate 21 is obliquely intersecting with the arrangement direction of the inspection pads.

[0058] When the guide holes of the guide plate 21 are offset, the probes 10 may bend longitudinally inside the first hollow portion 221 of the probe head 20 during inspection of the subject, which may cause a short circuit between the probes. Fig.12 In the electrical connection device 1 shown, the insulating cover 13 disposed on the surface of the probe 10 is brought into contact with the adjacent probe 10 , thereby preventing a short circuit between the probes due to the longitudinal bending of the probe 10 .

[0059] In order to prevent a short circuit between the probes when the probe 10 is bent longitudinally, it is considered that the cover 13 is only arranged on the offset surface or the opposite surface of the probe 10. However, in the probe 10 in which the cover 13 is arranged only on one surface, when the interval between the probes 10 is narrower than the predetermined interval, when the probe 10 is bent in a staggered manner from the offset direction, etc., it is possible that the surfaces of the probes 10 where the cover 13 is not arranged are in contact with each other. For example, due to the difference (gap) between the outer diameter of the probe 10 and the inner diameter of the guide hole, the probe 10 is sometimes offset inside the guide hole. Due to the offset of the probe 10, there is a risk that the probe 10 is not accurately bent in the offset direction, and the surface of the probe 10 where the cover 13 is not arranged contacts the surface of the adjacent probe 10 where the cover 13 is not arranged. As a result, a short circuit between the probes occurs.

[0060] Alternatively, when the intervals between the probes 10 are determined, there is a risk that the surfaces of the probes 10 not provided with the covers 13 may come into contact with each other. Fig.13As shown, when the interval between the probes 10 in the direction perpendicular to the offset direction F is narrow, there is a risk that the outer edge of the offset surface of the probe 10 where the cover 13 is not disposed will contact the opposing surface of the adjacent probe 10 as shown by arrow T. As a result, a short circuit occurs between the probes.

[0061] As described above, in the probe 10 in which the cover 13 is arranged only on the offset surface or the opposite surface, a short circuit between the probes may occur. In order to prevent the short circuit between the probes as described above, it is preferable to arrange the cover 13 also on the side surface of the probe 10 connected to the offset surface. Fig.14 The probe 10 shown has a rectangular cross section defined by an offset surface 101, an opposing surface 102, and a first side surface 103 and a second side surface 104 connected to the offset surface 101 and the opposing surface 102, and a cover 13 is continuously arranged on three side surfaces. Fig.14 In the probe 10 shown in the figure, the cover 13 is arranged on the offset surface 101 of the probe 10 and the first side surface 103 and the second side surface 104 connected to the offset surface. In other words, the cover 13 is arranged continuously on the surface of the probe 10 from the first side surface 103 to the second side surface 104 via the offset surface 101. Fig.14 In the illustrated probe 10 , even if the probes come into contact with each other, the cover 13 can prevent a short circuit between the probes.

[0062] In addition, if Fig.12 As shown, the cover 13 is intermittently arranged in the portion passing through the first hollow portion 221 of the probe 10, including at least the curved portion. In contrast, if the cover 13 continuously covers the surface of the probe 10 along the central axis direction from the front end portion 11 to the base end portion 12, the probe 10 is prone to warping. Fig.12 In the probe 10 shown, the cover 13 is intermittently arranged along the central axis direction, so that the warping of the probe 10 can be suppressed. Therefore, the intervals of the cover 13 along the axis direction are set in a manner to suppress the warping of the probe 10 and to minimize the portions where the probes 10 contact each other and cause short circuits between the probes. A plurality of cover members 13 are arranged on the surface of the probe 10 at the set intervals, separated from each other.

[0063] In addition, in order to set the probe 10 in the probe head 20, the probe 10 is passed through the guide hole 220 of the guide plate 21. For example, in a state where the central axes of the guide holes 220 of all the guide plates 21 are aligned, the probe 10 is continuously passed through the guide holes 220 of the guide plate 21. Therefore, the sum of the outer diameter of the probe 10 and the thickness of the cover 13 is set smaller than the inner diameter of the guide hole 220.

[0064] The material of the cover 13 may be, for example, resin, glass fiber, permanent resist, ceramic vapor deposition, etc. In order to form the cover 13 at a predetermined position on the surface of the probe 10, the cover 13 may be patterned using photolithography technology, etc., after the cover 13 is formed on the surface of the probe 10.

[0065] The narrower the spacing of the cover 13 along the central axis direction, the more it can prevent short circuits between probes. The length and spacing of the cover 13 in the central axis direction can be arbitrarily set in accordance with the thickness and material of the probe 10 within a range where the probe 10 does not warp. For example, the cover 13 is arranged on the surface of the probe 10 at intervals of 50 μm. In addition, the thickness of the cover 13 is set to a thickness that can prevent short circuits between probes within a range that can ensure a gap between the sum of the outer diameter of the probe 10 and the thickness of the cover 13 and the inner diameter of the guide hole 220.

[0066] As described above, according to the electrical connection device 1 of the second embodiment, in addition to the arrangement direction of the inspection pads 200 and the offset direction obliquely intersecting, the short circuit between the probes can be suppressed by arranging the cover 13 on the surface of the probe 10. In other respects, the electrical connection device 1 of the second embodiment is the same as the first embodiment, and repeated description is omitted.

[0067] (Other embodiments)

[0068] As described above, the present invention is described through the embodiments, but it should not be understood that the description and drawings constituting a part of this disclosure limit the present invention. Based on this disclosure, various alternative embodiments, examples, and application technologies will be apparent to those skilled in the art.

[0069] For example, in the above description, the case where the shape of the cross section of the probe 10 is a rectangular shape is described, but the cross section of the probe 10 may also be other shapes. For example, the cross section of the probe 10 may also be a polygonal shape other than a rectangular shape. In addition, the case where the guide plates 21 of the probe head 20 are three is described, but the guide plates 21 of the probe head 20 may also be four or more.

[0070] In the second embodiment, the cover 13 is disposed on the offset surface 101, the first side surface 103, and the second side surface 104 of the probe 10 having a rectangular cross section. However, the cover 13 may be disposed on four surfaces of the probe 10 including the opposing surface 102. Alternatively, the cover 13 may be disposed continuously on three surfaces of the opposing surface 102, the first side surface 103, and the second side surface 104 of the probe 10. Furthermore, in the case where only one side surface of the probe 10 has a possibility of contacting the adjacent probe 10 due to the relationship between the intervals between the probes, the cover 13 may be disposed on both the side surface having a possibility of contacting the adjacent probe 10 and the offset surface or the opposing surface.

[0071] As described above, it goes without saying that the present invention includes various embodiments and the like that are not described herein.

[0072] Description of Reference Numerals

[0073] 1. Electrical connection device; 2. Test object; 10. Probe; 11. Front end portion; 12. Base end portion; 13. Cover; 20. Probe head; 21. Guide plate; 211. First guide plate; 212. Second guide plate; 213. Third guide plate; 220. Guide hole; 30. Wiring substrate; 101. Offset surface; 102. Opposite surface; 103. First side surface; 104. Second side surface; 200. Inspection pad.

Claims

1. An electrical connection device for measuring electrical characteristics of a subject, wherein: The electrical connection device comprises: A plurality of probes are arranged so that their front ends are in contact with a plurality of inspection pads of the object; and A probe head having a structure in which a first guide plate and a second guide plate each having a guide hole formed therein are arranged to be separated from each other along a surface normal direction of a main surface of the first guide plate, the probe being maintained in a state of penetrating the guide holes of the first guide plate and the second guide plate, The position of the guide hole of the first guide plate and the position of the guide hole of the second guide plate through which the same probe penetrates are offset and arranged in parallel with the main surface of the first guide plate. An offset direction in which the positions of the guide holes in the offset arrangement are offset is obliquely intersecting with respect to an arrangement direction of the inspection pads.

2. The electrical connection device according to claim 1, wherein: A cross-sectional shape of the guide hole viewed in a surface normal direction of a main surface of the first guide plate includes a linear side perpendicular to the offset direction.

3. The electrical connection device according to claim 1, wherein: A longitudinal direction of a cross-sectional shape of the guide hole as viewed in a surface normal direction of a main surface of the first guide plate is perpendicular to the offset direction.

4. The electrical connection device according to claim 1, wherein: The inspection pads are arranged in a matrix in a first direction and a second direction orthogonal to the first direction, and the offset direction obliquely intersects both the first direction and the second direction.

5. The electrical connection device according to any one of claims 1 to 4, wherein: The probe includes a plurality of insulating covers disposed on a surface of the probe so as to be separated from each other along a central axis direction of the probe.

6. The electrical connection device according to claim 5, wherein: The probe head holds the probe in a state of being bent in the offset direction at a hollow portion between the first guide plate and the second guide plate, The cover is disposed at least on a curved portion of the probe.

7. The electrical connection device according to claim 5, characterized in that: The cross section of the probe perpendicular to the central axis direction is a rectangular shape defined by an offset surface of the probe facing the offset direction, an opposite surface opposite to the offset surface, and a first side surface and a second side surface respectively connected to the offset surface and the opposite surface. The cover is disposed continuously from the first side surface to the second side surface via the offset surface.

8. The electrical connection device according to claim 5, wherein: A sum of an outer diameter of the probe and a thickness of the cover is smaller than an inner diameter of the guide hole.

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