Electronic device including a conductive layer

Abstract

An electronic device including a conductive layer is disclosed. An electronic device according to various embodiments of the present invention may comprise: a printed circuit board in which at least one electrical component and a plurality of wirings connected to the electrical component are arranged on a first surface facing a first direction; a wiring exposure portion in which at least one of the plurality of wirings is exposed on a side surface of the printed circuit board, the side surface being a surface facing a direction perpendicular to the first direction; and a conductive layer in electrical contact with the wiring exposed portion.

Description

Technical Field

[0001] Various embodiments disclosed in this document relate to electronic devices, and more particularly, to electronic devices including a conductive layer. Background Art

[0002] The electronic device may use various wireless communication technologies (such as LTE, 5G, GPS and / or Wi-Fi) to communicate with the outside. The electronic device may include an antenna for wireless communication. The antenna may be included in the electronic device as a separate component, a part of the housing of the electronic device may be used as an antenna, or the antenna may be formed by a conductive pattern formed on a substrate portion of the electronic device. In addition, the electronic device may include a shield for blocking electromagnetic noise generated from the antenna and a controller for wireless communication. In order to connect to the antenna and / or the shield, the substrate portion of the electronic device may include a portion of exposed wiring, such as a connector or an electrical contact.

[0003] Electronic devices may be miniaturized to improve portability and convenience. To miniaturize an electronic device, components disposed inside the electronic device (such as a substrate portion, an antenna, and / or a shield) may be reduced in size or omitted. Summary of the invention

[0004] Technical Solution

[0005] In order to achieve miniaturization of electronic devices while maintaining the performance and stability of the electronic devices, there are certain limitations in reducing the area of ​​the substrate. In addition, since such contact points on the substrate occupy the area of ​​the substrate in order to improve the transmission and reception performance of the antenna of the electronic device and the shielding performance of the shield, the substrate may hinder the miniaturization of the electronic device.

[0006] Various embodiments disclosed in this document may provide electronic devices with reduced substrate area.

[0007] An electronic device according to various embodiments of the present invention may include: a printed circuit board, in which at least one electrical component and a plurality of wirings connected to the electrical component are arranged on a first surface facing a first direction; a wiring exposure portion, in which at least one of the plurality of wirings is exposed on a side surface of the printed circuit board, the side surface of the printed circuit board being a surface facing a direction perpendicular to the first direction; and a conductive layer in electrical contact with the wiring exposure portion.

[0008] In various embodiments, the conductive layer may include a shielding member surrounding at least a portion of the printed circuit board.

[0009] In various embodiments, the conductive layer may include a conductive pattern electrically separated from the shielding member.

[0010] In various embodiments, the conductive pattern may be electrically separated from the shielding member by an insulating region between the conductive pattern and the shielding member.

[0011] In various embodiments, the electronic device may include a molded portion that is configured to at least partially cover a first surface of a printed circuit board and an electrical component arranged on the first surface and includes a non-conductive material.

[0012] In various embodiments, the conductive layer may be formed by coating a conductive material on at least a portion of a side surface of the printed circuit board and a surface of the molded portion, and the insulating region may be a region formed by removing the coated conductive material.

[0013] In various embodiments, the conductive layer may extend along a side surface of the molding portion, the side surface of the molding portion being a surface facing a direction perpendicular to the first direction among surfaces of the molding portion.

[0014] In various embodiments, the conductive layer may extend from a side surface of the molding portion to a surface of the molding portion facing the first direction, the side surface of the molding portion being a surface facing a direction perpendicular to the first direction among surfaces of the molding portion.

[0015] In various embodiments, the conductive pattern may include an antenna pattern for wireless communication of the electronic device.

[0016] In various embodiments, the electronic device may further include an antenna for wireless communication of the electronic device, the antenna being located outside the printed circuit board, and the conductive pattern may include a contact pad that makes electrical contact with the antenna.

[0017] According to various embodiments of the present invention, a substrate portion of an electronic device including a plurality of electrical components may include: a printed circuit board, in which at least one of the electrical components and a plurality of wirings connected to the electrical components are arranged on a first surface facing a first direction; a wiring exposure portion, in which at least one of the plurality of wirings is exposed on a side surface of the printed circuit board, the side surface of the printed circuit board being a surface facing a direction perpendicular to the first direction; and a conductive layer in electrical contact with the wiring exposure portion.

[0018] In various embodiments, the conductive layer may include a shielding member surrounding at least a portion of the printed circuit board.

[0019] In various embodiments, the conductive layer may include a conductive pattern electrically separated from the shielding member.

[0020] In various embodiments, the conductive pattern may be electrically separated from the shielding member by an insulating region between the conductive pattern and the shielding member.

[0021] In various embodiments, the substrate portion may include a molded portion that is configured to at least partially cover the first surface of the printed circuit board and the electrical components arranged on the first surface and includes a non-conductive material.

[0022] In various embodiments, the conductive layer may be formed by coating a conductive material on at least a portion of a side surface of the printed circuit board and a surface of the molding part, and

[0023] The insulating region may be a region formed by removing the applied conductive material.

[0024] In various embodiments, the conductive layer may extend along a side surface of the molding portion, the side surface of the molding portion being a surface facing a direction perpendicular to the first direction among surfaces of the molding portion.

[0025] In various embodiments, the conductive layer may extend from a side surface of the molding portion to a surface of the molding portion facing the first direction, the side surface of the molding portion being a surface facing a direction perpendicular to the first direction among surfaces of the molding portion.

[0026] In various embodiments, the conductive pattern may include an antenna pattern for wireless communication of the electronic device.

[0027] In various embodiments, the electronic device may further include an antenna for wireless communication of the electronic device, the antenna being located outside the printed circuit board.

[0028] The conductive pattern may include a contact pad that makes electrical contact with the antenna.

[0029] According to various embodiments disclosed in this document, the exposed portions of the wiring exposed on the side surface of the printed circuit board are electrically connected to a conductive layer such as an antenna, a shielding member and / or a contact, so that the area of ​​the printed circuit board occupied by the conductive layer for the wiring connected to the board can be reduced, and an electronic device with a reduced board area can be provided.

[0030] Effects obtainable from the present disclosure are not limited to those described above, and other effects not mentioned will be clearly understood from the following description by a person of ordinary skill in the art to which the present disclosure pertains. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Regarding the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.

[0032] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0033] Figure 2 is a perspective view showing an electronic device according to some embodiments of the present disclosure.

[0034] Figure 3 is a diagram showing various embodiments according to the present disclosure Figure 2 A perspective view of a rear surface of an electronic device.

[0035] Figure 4 is a diagram showing various embodiments according to the present disclosure Figure 2 An exploded perspective view of an electronic device.

[0036] Figure 5a is a plan view showing a substrate portion and a conductive layer of an electronic device according to various embodiments of the present disclosure.

[0037] Figure 5b is a plan view illustrating a state in which a conductive layer and a molded portion are excluded from a printed circuit board according to various embodiments of the present disclosure.

[0038] Figure 5c is a cross-sectional view illustrating a printed circuit board according to various embodiments of the present disclosure.

[0039] Figure 6a is a schematic diagram illustrating formation of a wiring exposure portion according to various embodiments of the present disclosure.

[0040] Figure 6b is a side view showing a wiring exposure portion according to various embodiments of the present disclosure.

[0041] Figure 7a is a perspective view showing a substrate portion according to various embodiments.

[0042] Figure 7b is a cross-sectional view showing a substrate portion according to various embodiments.

[0043] Figure 7c is an enlarged view showing a conductive pattern according to various embodiments.

[0044] Figure 7d is a cross-sectional view showing a substrate portion according to various embodiments.

[0045] Figure 7e is a schematic diagram illustrating formation of a conductive pattern according to various embodiments.

[0046] Figure 8a is a perspective view showing a substrate portion of an electronic device according to various embodiments.

[0047] Figure 8b is an enlarged perspective view showing a conductive pattern according to various embodiments.

[0048] Figure 8c is an enlarged perspective view showing a conductive pattern according to various embodiments. DETAILED DESCRIPTION

[0049] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0050] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0051] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0052] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0053] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0054] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0055] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0056] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0057] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0058] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0059] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0060] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0061] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0062] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0063] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0064] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0065] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0066] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0067] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0068] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0069] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0070] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0071] Figure 2 is a perspective view showing a front surface of an electronic device according to an embodiment. Figure 3 is a perspective view showing a rear surface of an electronic device according to an embodiment. Figure 4 is a diagram showing a method according to an embodiment Figure 2 An exploded perspective view of an electronic device.

[0072] Reference Figure 2 and Figure 3According to one embodiment, the electronic device 101 may include: a housing 210 having a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B; and fastening members 250 and 260 connected to at least a portion of the housing 210 and configured to detachably fasten the electronic device 101 to a part of the user's body (e.g., a wrist or an ankle). The fastening members 250 and 260 may be, for example, a band that is wrapped around the user's wrist to fix the electronic device 101. In another embodiment (not shown), the housing may refer to a member that forms a Figure 1 The structure of a part of the first surface 210A, the second surface 210B and the side surface 210C. According to one embodiment, the first surface 210A can be formed by a front plate 201 that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coatings). The second surface 210B can be formed by a rear plate 207. The rear plate 207 can be formed by a combination of at least two of coated glass or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or the foregoing materials. The side surface 210C can be formed by a side frame structure (or "side member") 206, which joins the front plate 201 and the rear plate 207 and includes metal and / or polymer. In some embodiments, the rear plate 207 and the side frame structure 206 can be formed integrally and include the same material (e.g., a metal material, such as aluminum). Fastening members 250 and 260 can be formed by various materials and shapes. The integrated plurality of unit links may be formed of fabric, leather, rubber, synthetic resin, metal, ceramic, or a combination of at least two of the above materials so as to be movable relative to each other.

[0073] According to one embodiment, the electronic device 101 may include a display 220 (see Figure 3 ), audio modules 205 and 208, a sensor module 211, key input devices 202, 203 and 204, and a connector hole 209. In some embodiments, the electronic device 101 may omit at least one of the above components (e.g., key input devices 202, 203 and 204, connector hole 209, or sensor module 211), or may additionally include other components.

[0074] The display 220 may be visually exposed, for example, through a substantial portion of the front plate 201. The shape of the display 220 may correspond to the shape of the front plate 201, and may be circular, oval, or polygonal. The display 220 may be combined with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0075] The audio modules 205 and 208 may have a microphone hole 205 and a speaker hole 208. In the microphone hole 205, a microphone may be placed to obtain external sound, and in some embodiments, multiple microphones may be placed to detect the direction of the sound. The speaker hole 208 may be used as an external speaker and a receiver for calls. In some embodiments, the speaker hole 208 and the microphone hole 203 may be implemented as one hole, or a speaker (e.g., a piezoelectric speaker) may be included without the speaker hole 208.

[0076] The sensor module 211 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 101. The sensor module 211 may include, for example, a biometric sensor module (e.g., an HRM sensor, an oxygen saturation sensor, and / or a blood glucose sensor) arranged toward the second surface 210B of the housing 210. The electronic device 101 may also include at least one of a sensor module (e.g., a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor) not shown.

[0077] The key input devices 202, 203, and 204 may include a wheel key 202 disposed on the first surface 210A of the housing 210 and rotatable in at least one direction and / or side key buttons 203 and 204 disposed on the side surface 210C of the housing 210. The wheel key 202 may have a shape corresponding to the shape of the front plate 201. In another embodiment, the electronic device 101 may not include some or all of the above-mentioned key input devices 202, 203, and 204, and the key input devices 202, 203, and / or 204 not included may be implemented in the form of soft keys or touch keys on the display 220. The connector hole 209 may accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data to and from an external electronic device, and may include another connector hole (not shown) for accommodating a connector for transmitting and receiving audio signals to and from an external electronic device. The electronic device 101 may further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole 209 and prevents external foreign matter from flowing into the connector hole 209 .

[0078] The fastening members 250 and 260 may be detachably fastened to at least a portion of the housing 210 by locking members 251 and 261. The fastening members 250 and 260 may include one or more of a fixing member 252, a fixing member fastening hole 253, a belt guide member 254, and a belt fixing ring 255.

[0079] The fixing member 252 may be configured to fix the housing 210 and the fastening members 250 and 260 to a part of the user's body (e.g., a wrist, an ankle). The fixing member fastening hole 253 may fix the housing 210 and the fastening members 250 and 260 to a part of the user's body in response to the fixing member 252. The belt guide member 254 is configured to limit the range of movement of the fixing member 252 when the fixing member 252 is fastened to the fixing member fastening hole 253, thereby allowing the fastening members 250 and 260 to be fastened in close contact with a part of the user's body. The belt fixing ring 255 may limit the range of movement of the fastening members 250 and 260 when the fixing member 252 and the fixing member fastening hole 253 are fastened.

[0080] Reference Figure 4 , the electronic device 101 may include a side frame structure 210, a scroll wheel key 420, a front panel 201, a display 220, a first antenna 450, a second antenna 455, a support member 460 (e.g., a bracket), a battery 470, a printed circuit board 480, a front frame 490, a rear panel 207, and fastening members 495 and 497. The support member 460 may be disposed inside the electronic device 101 and connected to the side frame structure 410, or may be formed integrally with the side frame structure 410. The support member 460 may be formed of, for example, a metal material and / or a non-metallic (e.g., polymer) material. The support member 460 may be combined with the display 220 on one side and with the printed circuit board 480 on the other side. The printed circuit board 480 may be equipped with a processor (e.g., Figure 1 processor 120 in the processor 120), memory (e.g., Figure 1 130) and / or an interface (e.g., Figure 1 The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit (GPU), an application processor, a sensor processor, or a communication processor.

[0081] The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 101 to an external electronic device, and may include, for example, a USB connector, an SD card / MMC connector, or an audio connector.

[0082] Battery 470 (e.g., Figure 1The battery 470 is a device for supplying power to at least one component of the electronic device 101, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 470 may be disposed on substantially the same plane as, for example, the printed circuit board 480. The battery 470 may be integrally disposed within the electronic device 101, or may be disposed to be detachable from the electronic device 101.

[0083] The first antenna 450 may overlap with the second antenna 455 and be disposed between the circuit board 480 and the back plate 207. The first antenna 450 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The first antenna 450 may, for example, communicate with an external device over a short distance, wirelessly transmit and receive power required for charging, and send a short-distance communication signal or a magnetic-based signal including payment data. In another embodiment, the antenna structure may be formed by a portion or combination of the side frame structure 410 and / or the support member 460. In yet another embodiment, the first antenna 450 may be disposed on the circuit board 480 in the form of a chip antenna.

[0084] The second antenna 455 may be disposed between the circuit board 480 and the back plate 207. The second antenna 455 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The second antenna 455 may, for example, communicate with an external device over a short distance, wirelessly transmit and receive power required for charging, and send a short-distance communication signal including payment data or a magnetic-based signal. In another embodiment, the antenna structure may be formed by a portion or combination of the side frame structure 410 and / or the support member 460.

[0085] The biosensor module 211 may be disposed adjacent to the rear plate 207 so as to face the body of the wearer from the rear plate 207. The biosensor module 211 may transmit signals of various wavelength bands to the body of the wearer and measure various biometric information (e.g., heartbeat, blood sugar, and / or oxygen saturation) from the signals of the wavelength bands reflected, scattered, and / or absorbed by the body of the user. The rear plate 207 may have a rear window 207a through which the above-mentioned signals are transmitted to or from the body of the user.

[0086] The front frame 490 may be disposed to face one side of the printed circuit board 480 and configured to support the printed circuit board 480 within the electronic device 101 .

[0087] Figure 5a 5 is a plan view showing a substrate portion 501 and a conductive layer 520 of an electronic device according to various embodiments of the present disclosure.

[0088] Figure 5b5 is a plan view illustrating a state in which a conductive layer 520 and a mold portion 530 are excluded from a printed circuit board 510 according to various embodiments of the present disclosure.

[0089] Figure 5c is a cross-sectional view showing a substrate portion 501 according to various embodiments of the present disclosure.

[0090] Figure 5c The cross-section is along Figure 5a A cross-sectional view taken along the A-A' direction.

[0091] Reference Figure 5a to Figure 5c , electronic devices (e.g. Figures 1 to 4 The substrate portion 501 of the electronic device 101 in the embodiment may include a printed circuit board 510 (eg, Figure 4 480 in the printed circuit board 510) and the conductive layer 520. The printed circuit board 510 may be a member having at least one surface (e.g., a surface facing the z-axis direction), on which the electrical components 502 of the electronic device (such as an integrated circuit (IC) 502A and an active or passive component 502b) are arranged. The IC 502A may include, for example, an application processor (AP), a display driver IC (DDI), a power management IC (PMIC), and / or a communication chipset (e.g., a modem). The active or passive component 502b may include an active component (such as a MOSFET, a diode, an OP AMP) and / or a passive component (such as a resistor, a capacitor, an MLCC, a chip inductor). The printed circuit board 510 may include wiring 511 for connecting the electrical components 502 arranged on the printed circuit board 510. At least a portion of the wiring 511 may be exposed through a side surface of the printed circuit board 510 (that is, a surface substantially perpendicular to the surface on which the electrical components 502 are arranged (e.g., a surface facing the x-axis and / or y-axis direction)), thereby forming a wiring exposure portion 512.

[0092] The conductive layer 520 may be a portion having a conductive material (e.g., copper, aluminum, and / or carbon black) and electrically connected to the wiring exposed portion 512. The conductive layer 520 may include a shielding member 521 that shields the electrical components 502 disposed on the printed circuit board 510 from electromagnetic interference (EMI) caused by the outside and / or other electrical components 502.

[0093] The wiring exposed portion 512 of the printed circuit board 510 may be a portion where the ground wiring 511a is exposed to the side surface of the printed circuit board 510. The shielding member 521 may be connected to the ground wiring 511a of the wiring 511 through the wiring exposed portion 512 of the printed circuit board 510. Therefore, the shielding member 521 may shield the electronic device from electromagnetic interference by allowing electromagnetic energy introduced into the electronic device from the outside or generated from the electric component 502 (such as an RF circuit) to flow through the ground circuit.

[0094] Reference Figure 5a and Figure 5c In various embodiments, the substrate portion 501 of the electronic device may include a molded portion 530. The molded portion 530 may be provided to at least partially cover the surface of the printed circuit board 510 on which the electrical components 502 are arranged, and may be a member that protects the electrical components 502 of the printed circuit board 510 from external physical impacts and / or improves insulation to prevent failures such as short circuits. In various embodiments, the molded portion 530 may be formed by applying a molding compound (such as a polymer having insulating properties, such as epoxy resin) to the surface of the printed circuit board 510 and then curing it, or by melting and curing a polymer molding powder.

[0095] In various embodiments, the conductive layer 520 may be formed by coating a conductive material (e.g., aluminum, copper, and / or carbon black) on the surface of the molded portion 530 formed on the surface of the printed circuit board 510. For example, the conductive layer 520 may be formed by metallizing the surface of the molded portion 530 through a method such as spraying (e.g., cold spraying, flame spraying, and / or arc spraying), deposition, and / or sputtering.

[0096] Figure 6a is a schematic diagram illustrating formation of a wiring exposure portion 512 according to various embodiments of the present disclosure.

[0097] Figure 6b is a side view illustrating a wiring exposed portion 512 according to various embodiments of the present disclosure.

[0098] Figure 6a yes Figure 5b Magnified view of the X region.

[0099] Figure 6b The cross section is viewed from the Y direction along Figure 6a The image is taken in the B-B' direction.

[0100] Reference Figure 6a and Figure 6bAccording to various embodiments of the present invention, when manufacturing the printed circuit board 510, a substrate extension portion 513 and a wiring extension portion 514 may be formed in the printed circuit board 510. The substrate extension portion 513 may be a portion of the printed circuit board 510 extending an outer region where the wiring exposure portion 512 will be formed. The wiring extension portion 511 may be a portion where the wiring 511 to be connected to the wiring exposure portion 512 is extended to the substrate extension portion 513. After the substrate extension portion 513 and the wiring extension portion 514 are formed, the substrate extension portion 513 and the wiring extension portion 514 may be cut (e.g., cut in the BB' direction). By cutting the substrate extension portion 513 and the wiring extension portion 514, the wiring exposure portion 512 may be formed on the side surface of the printed circuit board 510. Tools for cutting the printed circuit board 510 may include, for example, machining (such as milling and / or sawing) and / or laser machining.

[0101] Figure 7a is a perspective view showing a substrate portion 501 according to various embodiments.

[0102] Figure 7b is a cross-sectional view illustrating a substrate portion 501 according to various embodiments.

[0103] Figure 7c is an enlarged view showing a conductive pattern 522 according to various embodiments.

[0104] Figure 7d is a cross-sectional view illustrating a substrate portion 501 according to various embodiments.

[0105] Figure 7e is a schematic diagram illustrating formation of a conductive pattern 522 according to various embodiments.

[0106] Figure 7b The cross section is along Figure 7a The C-C' direction is intercepted.

[0107] Figure 7c yes Figure 7a Magnified view of the Y region.

[0108] Reference Figures 7a to 7c In various embodiments, the conductive layer 520 of the substrate portion 501 may include a conductive pattern 522. The conductive pattern 522 may be a member electrically separated from the shielding member 521 by an insulating region 523 between the conductive pattern 522 and the shielding member 521. In various embodiments, the conductive pattern 522 may be located on the side surfaces of the molding portion 530 and the substrate portion 501. In various embodiments, the conductive pattern 522 may extend from the side surface of the molding portion 530 to the upper surface of the molding portion 530.

[0109] In various embodiments, the conductive pattern 522 may include a contact pad 522a and / or an antenna pattern 522b. Figure 7d The contact pad 522a may be a member for connecting the printed circuit board 510 to a component (such as the antenna structure 601) disposed outside the substrate portion 501. The antenna structure 601 may be electrically connected to the contact pad 522a through a mechanical member (such as a C-clip 602), or may be connected to the contact pad 522a through a bonding member (such as soldering or surface mount technology (SMT)). The contact pad 522a may be electrically connected to, for example, the wiring 511 for wireless communication, thereby connecting the antenna structure 601 and the wireless communication module (for example, Figure 1 The wireless communication module 192) is electrically connected.

[0110] Reference Figure 7e , an insulating region 523 electrically isolating the conductive pattern 522 and the shielding member 521 can be formed by removing a portion of the conductive material 529 coated on the surface of the molded portion 530. The conductive layer 520 including the conductive pattern 522 and the shielding member 521 can be formed by coating the conductive material 529 on the surface of the molded portion 530. When the conductive material 529 is removed from the insulating region 523, the insulating region 523 exposes the molded portion 530, and since the molded portion 530 has a non-conductive material (e.g., acrylic resin), current cannot flow through the insulating region 523. Therefore, an insulating region 523 through which current cannot flow can be formed between the conductive pattern 522 and the shielding member 521. The insulating region 523 can be formed on the side surface and / or the upper surface of the molded portion. For example, as a tool for removing the conductive material 529 to form the insulating region 523, mechanical processing such as milling, chemical removal such as etching, and / or laser cutting can be used.

[0111] Figure 8a is a perspective view showing a substrate portion 501 of an electronic device according to various embodiments.

[0112] Figure 8b is an enlarged perspective view showing a conductive pattern 522 according to various embodiments.

[0113] Figure 8c is an enlarged perspective view showing a conductive pattern 522 according to various embodiments.

[0114] Figure 8b and Figure 8c is with Figure 8a The Z region corresponds to the enlarged view of the area.

[0115] Reference Figure 8a and Figure 8b, the conductive pattern 522 may extend from the side surface of the printed circuit board 510 and the side surface of the molded portion 530 to the upper surface of the molded portion 530. The conductive pattern 522 may form a contact point on the upper surface of the molded portion 530 for connecting to a component (e.g., antenna structure 601) located outside the substrate portion 501, or may form an antenna pattern 522b. The length and shape of the antenna pattern 522b may be adjusted so that it may have an impedance optimized for a frequency band used by the electronic device for communication. The antenna pattern 522b may be formed into various patterns, such as a linear (e.g., monopole) pattern, as well as a ring, spiral, slot, and / or meandering pattern.

[0116] Reference Figure 8c , the conductive pattern 522 may extend on the side surface of the molded portion 530. The length and shape of the conductive pattern 522 extending on the side surface of the molded portion 530 may be adjusted to have an impedance optimized for a frequency band used by the antenna. The conductive pattern 522 extending on the side surface allows the antenna pattern 522b to be disposed on the side surface of the molded portion 530 while allowing the upper surface of the molded portion 530 to be used as a space for arranging other components of the electronic device.

[0117] An electronic device 101 according to various embodiments of the present invention may include: a printed circuit board 510, in which at least one electrical component 502 and a plurality of wirings 511 connected to the electrical component 502 are arranged on a first surface facing a first direction; a wiring exposure portion 512, in which at least one of the plurality of wirings 511 is exposed on a side surface of the printed circuit board 510, the side surface of the printed circuit board 510 being a surface facing a direction perpendicular to the first direction; and a conductive layer 520, which is in electrical contact with the wiring exposure portion 512.

[0118] In various embodiments, the conductive layer 520 may include a shielding member 521 surrounding at least a portion of the printed circuit board 510 .

[0119] In various embodiments, the conductive layer 520 may include a conductive pattern 522 electrically separated from the shielding member 521 .

[0120] In various embodiments, the conductive pattern 522 may be electrically separated from the shielding member 521 by an insulating region 523 between the conductive pattern 522 and the shielding member 521 .

[0121] In various embodiments, the electronic device 101 may include a molded portion 530 disposed to at least partially cover the first surface of the printed circuit board 510 and the electrical component 502 arranged on the first surface, and including a non-conductive material.

[0122] In various embodiments, the conductive layer 520 may be formed by coating a conductive material 529 on at least a portion of the side surface of the printed circuit board 510 and the surface of the molded portion 530 , and the insulating region 523 may be a region formed by removing the coated conductive material 529 .

[0123] In various embodiments, the conductive layer 520 may extend along a side surface of the molding portion 530 , which is a surface facing a direction perpendicular to the first direction among surfaces of the molding portion 530 .

[0124] In various embodiments, the conductive layer 520 may extend from a side surface of the molded portion 530 to a surface of the molded portion 530 facing the first direction, the side surface of the molded portion 530 being a surface facing a direction perpendicular to the first direction among surfaces of the molded portion 530 .

[0125] In various embodiments, the conductive pattern 522 may include an antenna pattern 522 b for wireless communication of the electronic device 101 .

[0126] In various embodiments, the electronic device 101 may further include an antenna for wireless communication of the electronic device 101 , the antenna being located outside the printed circuit board 510 , and the conductive pattern 522 may include a contact pad 522 a that makes electrical contact with the antenna.

[0127] According to various embodiments of the present invention, a substrate portion 501 of an electronic device 101 including a plurality of electrical components 502 may include: a printed circuit board 510, in which at least one of the electrical components 502 and a plurality of wirings 511 connected to the electrical components 502 are arranged on a first surface facing a first direction; a wiring exposure portion 512, in which at least one of the plurality of wirings 511 is exposed on a side surface of the printed circuit board 510, the side surface of the printed circuit board 510 being a surface facing a direction perpendicular to the first direction; and a conductive layer 520, which is in electrical contact with the wiring exposure portion 512.

[0128] In various embodiments, the conductive layer 520 may include a shielding member 521 surrounding at least a portion of the printed circuit board 510 .

[0129] In various embodiments, the conductive layer 520 may include a conductive pattern 522 electrically separated from the shielding member 521 .

[0130] In various embodiments, the conductive pattern 522 may be electrically separated from the shielding member 521 by an insulating region 523 between the conductive pattern 522 and the shielding member 521 .

[0131] In various embodiments, the substrate portion 501 may include a molded portion 530 disposed to at least partially cover the first surface of the printed circuit board 510 and the electrical component 502 arranged on the first surface, and including a non-conductive material.

[0132] In various embodiments, the conductive layer 520 may be formed by coating a conductive material 529 on at least a portion of the side surface of the printed circuit board 510 and the surface of the molded portion 530 , and the insulating region 523 may be a region formed by removing the coated conductive material 529 .

[0133] In various embodiments, the conductive layer 520 may extend along a side surface of the molding portion 530 , which is a surface facing a direction perpendicular to the first direction among surfaces of the molding portion 530 .

[0134] In various embodiments, the conductive layer 520 may extend from a side surface of the molded portion 530 to a surface of the molded portion 530 facing the first direction, the side surface of the molded portion 530 being a surface facing a direction perpendicular to the first direction among surfaces of the molded portion 530 .

[0135] In various embodiments, the conductive pattern 522 may include an antenna pattern 522 a for wireless communication of the electronic device 101 .

[0136] In various embodiments, the electronic device 101 may further include an antenna for wireless communication of the electronic device 101 , the antenna being located outside the printed circuit board 510 , and the conductive pattern 522 may include a contact pad 522 a that forms electrical contact with the antenna.

[0137] In addition, the embodiments disclosed in the specification and drawings of this document are only specific examples presented to easily explain the technical content according to the disclosed embodiments and to help understand the disclosed embodiments, and are not intended to limit the scope of the disclosed embodiments. Therefore, the scope of the various disclosed embodiments should be interpreted as including all changes or modifications based on the technical ideas of the various disclosed embodiments in addition to the disclosed embodiments.

Claims

1. An electronic device, comprising: a printed circuit board in which at least one electrical component and a plurality of wirings connected to the electrical component are arranged on a first surface facing a first direction; a wiring exposure portion in which at least one of the plurality of wirings is exposed on a side surface of the printed circuit board, the side surface of the printed circuit board being a surface facing a direction perpendicular to the first direction; as well as The conductive layer is in electrical contact with the exposed portion of the wiring.

2. The electronic device according to claim 1, wherein the conductive layer comprises: a shielding member surrounding at least a portion of the printed circuit board; as well as The conductive pattern is electrically separated from the shielding member. 3 . The electronic device according to claim 2 , wherein the conductive pattern is electrically separated from the shield member by an insulating region between the conductive pattern and the shield member.

4. The electronic device according to claim 3, comprising: a molded portion, arranged to at least partially cover the first surface of the printed circuit board and the electrical components arranged on the first surface, and comprising a non-conductive material, wherein the conductive layer is formed by coating a conductive material on at least a portion of the side surface of the printed circuit board and the surface of the molding portion, and The insulating region is a region formed by removing the applied conductive material. 5 . The electronic device according to claim 4 , wherein the conductive layer extends along a side surface of the molded portion, the side surface of the molded portion being a surface facing a direction perpendicular to the first direction among the surfaces of the molded portion.

6. An electronic device according to claim 4, wherein the conductive layer extends from a side surface of the molded portion to a surface of the molded portion facing the first direction, and the side surface of the molded portion is a surface of the surfaces of the molded portion facing a direction perpendicular to the first direction. 7 . The electronic device according to claim 2 , wherein the conductive pattern comprises an antenna pattern for wireless communication of the electronic device.

8. The electronic device according to claim 2, further comprising: an antenna, used for wireless communication of the electronic device, the antenna being located outside the printed circuit board, The conductive pattern includes a contact pad that forms electrical contact with the antenna.

9. A substrate portion of an electronic device, the electronic device comprising a plurality of electrical components, the substrate portion comprising: a printed circuit board in which at least one of the electrical components and a plurality of wirings connected to the electrical components are arranged on a first surface facing a first direction; a wiring exposure portion in which at least one of the plurality of wirings is exposed on a side surface of the printed circuit board, the side surface of the printed circuit board being a surface facing a direction perpendicular to the first direction; as well as The conductive layer is in electrical contact with the exposed portion of the wiring.

10. The substrate portion of an electronic device according to claim 9, wherein the conductive layer comprises: a shielding member surrounding at least a portion of the printed circuit board; and The conductive pattern is electrically separated from the shielding member.

11. The substrate portion of the electronic device according to claim 10, comprising: a molded portion, arranged to at least partially cover the first surface of the printed circuit board and the electrical components arranged on the first surface, and comprising a non-conductive material, wherein the conductive pattern is electrically separated from the shield member by an insulating region between the conductive pattern and the shield member, wherein the conductive layer is formed by coating a conductive material on at least a portion of the side surface of the printed circuit board and the surface of the molding portion, and The insulating region is a region formed by removing the applied conductive material. 12 . The substrate portion of an electronic device according to claim 11 , wherein the conductive layer extends along a side surface of the molded portion, the side surface of the molded portion being a surface facing a direction perpendicular to the first direction among the surfaces of the molded portion.

13. A substrate portion of an electronic device according to claim 11, wherein the conductive layer extends from a side surface of the molded portion to a surface of the molded portion facing the first direction, and the side surface of the molded portion is a surface among the surfaces of the molded portion that faces a direction perpendicular to the first direction. 14 . The substrate portion of an electronic device according to claim 10 , wherein the conductive pattern includes an antenna pattern for wireless communication of the electronic device.

15. The substrate portion of the electronic device according to claim 10, wherein the electronic device further comprises an antenna for wireless communication of the electronic device, the antenna being located outside the printed circuit board, and The conductive pattern includes a contact pad that forms electrical contact with the antenna.

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