Silicon wafer box door plate detection method and silicon wafer box door plate detection system

Abstract

The invention provides a silicon wafer box door plate detection method and a silicon wafer box door plate detection system. The method comprises the following steps: separating a silicon wafer box body and a silicon wafer box door plate of a silicon wafer box; detecting whether a silicon wafer supporting piece of the silicon wafer box door plate meets a target abnormal condition or not; the target abnormal condition comprises one or more of installation not in place, deformation and protrusion. Firstly, a silicon wafer box body and a silicon wafer box door plate of the silicon wafer box are separated, and the silicon wafer box door plate is exposed. Then, detecting a silicon wafer supporting piece on the silicon wafer box door plate to determine whether the silicon wafer supporting piece meets the target abnormal condition or not; according to the invention, before the silicon wafer box door plate enters the wafer box cleaning machine, the state of the corresponding silicon wafer supporting piece meets the equipment operation requirement, and the hardware damage of the wafer box cleaning machine and the poor quality of the silicon wafer box caused by the abnormity of the silicon wafer supporting piece are effectively reduced.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer cleaning and silicon wafer box accessories inspection, and in particular to a silicon wafer box door panel inspection method and a silicon wafer box door panel inspection system. Background Art

[0002] Wafer box cleaning machines are widely used to clean silicon wafer boxes that carry silicon wafers, thereby ensuring the cleanliness of the silicon wafer boxes and reducing the contamination introduced by the silicon wafer boxes when carrying silicon wafers. The silicon wafer supports (i.e., Retainers) on the door panels of the silicon wafer boxes are responsible for supporting the silicon wafers. If the silicon wafer supports are not installed in place, or have problems such as deformation or bulging, when the door panels of the silicon wafer boxes are separated from the silicon wafer box body, the silicon wafer supports may collide with the wafer box cleaning machine, causing hardware damage to the wafer box cleaning machine. In addition, such collisions and scratches will also have an adverse effect on the quality of the silicon wafer boxes and affect the subsequent silicon wafer manufacturing process. However, it is difficult for related wafer box cleaning machines to detect whether the silicon wafer supports on the door panels of the silicon wafer boxes are installed in place, deformed, or bulged.

[0003] Based on this, the present application provides a detection method and a detection system for a silicon wafer box door panel to improve the relevant technology. Summary of the invention

[0004] The purpose of the present application is to provide a detection method and a detection system for a silicon wafer box door panel.

[0005] The purpose of this application is achieved by the following technical solutions:

[0006] In a first aspect, the present application provides a method for detecting a silicon wafer box door panel, the method comprising: separating a silicon wafer box body and a silicon wafer box door panel of a silicon wafer box; detecting whether a silicon wafer support of the silicon wafer box door panel meets a target abnormal condition; the target abnormal condition comprises one or more of improper installation, deformation and bulge.

[0007] In some embodiments, the method further includes: in case it is detected that the silicon wafer support meets the target abnormal condition, press-fitting the silicon wafer support, and detecting again whether the silicon wafer support meets the target abnormal condition.

[0008] In some embodiments, the method further includes: when it is detected that the silicon wafer support does not meet the target abnormal condition, assembling the silicon wafer box body and the silicon wafer box door panel into the silicon wafer box so that a wafer box cleaning machine can clean the silicon wafer box.

[0009] In some embodiments, the process of detecting whether the silicon wafer support meets the target abnormal condition includes: detecting the silicon wafer support to obtain detection data corresponding to the silicon wafer support; and judging whether the silicon wafer support meets the target abnormal condition based on the detection data corresponding to the silicon wafer support.

[0010] In some embodiments, judging whether the silicon wafer support meets the target abnormal condition based on the detection data corresponding to the silicon wafer support includes: generating a detection curve corresponding to the detection data; comparing the detection curve with a set curve to judge whether the silicon wafer support meets the target abnormal condition.

[0011] In the second aspect, the present application provides a detection system for a silicon wafer box door panel, the detection system comprising: a loading platform for carrying a silicon wafer box; a flipping platform for performing a first flipping operation to fix the silicon wafer box door panel connected to the silicon wafer box; and performing a second flipping operation to flip the silicon wafer box; the first flipping operation is opposite to the flipping direction of the second flipping operation; a first robotic arm for separating the silicon wafer box body and the silicon wafer box door panel of the silicon wafer box; a detection device for detecting the silicon wafer support of the silicon wafer box door panel to obtain corresponding detection data of the silicon wafer support; a control module for receiving the detection data from the detection device, and judging whether the silicon wafer support meets the target abnormal condition according to the detection data; the target abnormal condition includes one or more of inadequate installation, deformation and protrusion.

[0012] In some embodiments, the silicon wafer box door panel is provided with a door lock, and the door lock has a locked state and an unlocked state; when the door lock is in the locked state, the silicon wafer box door panel cannot be separated from the silicon wafer box body; when the door lock is in the unlocked state, the silicon wafer box door panel can be separated from the silicon wafer box body; the detection system also includes: a vacuum suction cup, installed on the flip platform, the vacuum suction cup is used to adsorb the silicon wafer box door panel to achieve a fixed connection between the flip platform and the silicon wafer box door panel; a door lock key, installed on the flip platform, the door lock key corresponds to the door lock position of the silicon wafer box door panel, and the door lock key is used to unlock the door lock so that the door lock is in the unlocked state so that the first robotic arm can separate the silicon wafer box body and the silicon wafer box door panel.

[0013] In some embodiments, the detection device includes: a guide rail; a movable slider for moving on the guide rail; a detection sensor installed on the movable slider, and the detection sensor is used to detect the silicon wafer support to obtain the detection data.

[0014] In some embodiments, the detection device further includes: a driving cylinder for driving the movable slider to move on the guide rail.

[0015] In some embodiments, the detection system further includes: a pressing block; and a second robotic arm, configured to manipulate the pressing block to move downward to press-fit the silicon wafer support that meets the target abnormal condition.

[0016] The present application provides a detection method for a silicon wafer box door panel and a detection system for a silicon wafer box door panel. First, the silicon wafer box body and the silicon wafer box door panel of the silicon wafer box are separated to expose the silicon wafer box door panel. Then, the silicon wafer support (Retainer) on the silicon wafer box door panel is scanned to determine whether it meets the target abnormality condition. The target abnormality condition includes one or more of whether the support is not installed in place, whether it is deformed, or whether a bulge appears. The present application can automatically determine whether there is an abnormality in the silicon wafer support through accurate detection of the silicon wafer support, and trigger subsequent processing when it is abnormal, such as marking as NG, re-pressing and correcting, etc. The present application ensures that before the silicon wafer box door panel enters the wafer box cleaning machine, the state of the corresponding silicon wafer support meets the equipment operation requirements, effectively reducing the hardware damage of the wafer box cleaning machine and the poor quality of the silicon wafer box caused by the abnormality of the silicon wafer support. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present application is further described below in conjunction with the accompanying drawings and specific implementation methods.

[0018] Figure 1 It is a structural schematic diagram of a silicon wafer box door panel detection system provided in an embodiment of the present application.

[0019] Figure 2 It is a structural schematic diagram of a silicon wafer box door panel detection system provided in an embodiment of the present application (separating the silicon wafer box body and the silicon wafer box door panel).

[0020] Figure 3 It is a top view of a silicon wafer support, a detection sensor and a sensor amplifier provided in an embodiment of the present application.

[0021] Figure 4 It is a side view of a silicon wafer support, a detection sensor and a sensor amplifier provided in an embodiment of the present application.

[0022] Figure 5 It is a schematic diagram of a detection curve of an OK silicon wafer box provided in an embodiment of the present application.

[0023] Figure 6 It is a schematic diagram of a detection curve of an NG silicon wafer box provided in an embodiment of the present application.

[0024] Figure 7It is a structural schematic diagram of a silicon wafer box door panel detection system provided in an embodiment of the present application (pressed silicon wafer box door panel).

[0025] Figure 8 It is a structural schematic diagram of a wafer box cleaning machine and a silicon wafer box provided in an embodiment of the present application (a collision occurs when separating the door panels of the silicon wafer box).

[0026] Fig. 9 It is a structural schematic diagram of a wafer box cleaning machine and a silicon wafer box provided in an embodiment of the present application (the silicon wafer box door panel and the silicon wafer box body are cleaned separately).

[0027] In the figure: 1. code reader; 2. isolation window; 3. loading platform; 4. flip platform; 5. flip axis; 6. door lock key; 7. vacuum suction cup; 8. guide rail; 9. first detection sensor; 10. second detection sensor; 11. first sensor amplifier; 12. second sensor amplifier; 13. first drive cylinder; 14. second drive cylinder; 15. manipulator; 16. manipulator body; 17. wafer box; 18. mushroom head; 19. wafer box body; 20. wafer box door panel; 21. wafer support; 22. support buckle; 23. pressing block; 24. second manipulator; 25. cleaning chamber; 26. body carrier; 27. manipulator clamp; 28. door panel carrier. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in this application to clearly and completely describe the technical solutions in the implementation mode of this application. Obviously, the described implementation mode is only a part of the implementation mode of this application, not all the implementation modes. Based on the implementation mode in this application, all other implementation modes obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0029] In the description of the embodiments of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0030] In the field of semiconductor silicon wafers (i.e., silicon chips), cassette cleaning machines are widely used. They can clean cassettes (i.e., silicon chips) that carry wafers (i.e., silicon chips) to ensure the cleanliness of the cassettes, making it less likely for the cassettes to contaminate the wafers during the process of carrying the wafers.

[0031] The quality of the incoming wafer cassette is particularly important for the stability of the wafer cassette cleaning machine. Among them, whether the silicon wafer support on the wafer cassette door panel (i.e., the wafer cassette door panel) is installed in place is a very important factor. When the silicon wafer support (i.e., the Ret ainer) of the wafer cassette door panel is not installed in place, the silicon wafer support will be partially raised, and when the robot arm gripper separates the wafer cassette door panel from the wafer cassette body (i.e., the wafer cassette body), a collision will occur, causing damage to the hardware of the wafer cassette cleaning machine. In addition, such collisions and scratches will also affect the quality of the wafer cassette.

[0032] Currently, it is difficult for a wafer cassette cleaning machine to detect whether the silicon wafer retainer on the wafer cassette door panel is properly installed and whether it is deformed.

[0033] See also Figure 1 and Figure 2 , Figure 1 2 is a schematic diagram of a structure of a detection system for a silicon wafer box door panel 20 provided in an embodiment of the present application. Figure 2 It is a structural schematic diagram of a detection system for a wafer box door panel 20 provided in an embodiment of the present application (separating a wafer box body 19 and a wafer box door panel 20).

[0034] like Figure 1 and Figure 2 As shown, the embodiment of the present application provides a detection system for a wafer box door panel 20, the detection system comprising a loading platform 3 (also known as a wafer box loading platform), a flipping platform 4 (also known as a wafer box flipping platform), a first mechanical arm and a detection device. The loading platform 3 is used to carry a wafer box 17. The flipping platform 4 is used to perform a first flipping operation to fix the wafer box door panel 20 connected to the wafer box 17; and to perform a second flipping operation to flip the wafer box 17; the flipping direction of the first flipping operation is opposite to that of the second flipping operation. The first mechanical arm is used to separate the wafer box body 19 and the wafer box door panel 20 of the wafer box 17. The detection device is used to detect the wafer support 21 of the wafer box door panel 20 to obtain the corresponding detection data of the wafer support 21. The control module is used to receive the detection data from the detection device, and to determine whether the wafer support 21 meets the target abnormal condition according to the detection data; the target abnormal condition includes one or more of the incomplete installation, deformation and protrusion.

[0035] That is, the control module can process the detection data to determine whether the silicon wafer support 21 is installed in place, deformed, or bulged. The above embodiment does not limit the control module, which can adopt a PLC (Programmable Logic Controller) system, for example.

[0036] In some embodiments, the detection system may further include a code reader 1 , which is installed on the uploading platform 3 and is used to read the code of the silicon wafer box 17 for confirmation after the silicon wafer box 17 is uploaded to the uploading platform 3 .

[0037] In some embodiments, the detection system may further include an isolation window 2, and the isolation window 2 is used to isolate the loading platform 3 and the flipping platform 4. As an example, the barcode reader 1 performs barcode reading confirmation on the wafer box 17. After the confirmation is completed, the wafer box 17 performs loading (for example, information flow interaction with related automation equipment to confirm that the wafer box 17 is uploaded) and the isolation window 2 is opened synchronously.

[0038] In some embodiments, the detection system may further include a flip axis 5 , and the flip axis 5 is used to define a flip direction of the flip platform 4 .

[0039] In some embodiments, the wafer box door panel 20 may be provided with a door lock, and the door lock has a locked state and an unlocked state; when the door lock is in the locked state, the wafer box door panel 20 cannot be separated from the wafer box body 19; when the door lock is in the unlocked state, the wafer box door panel 20 can be separated from the wafer box body 19. The detection system may further include a vacuum suction cup 7 and a door lock key 6. The vacuum suction cup 7 is mounted on the flip platform 4, and the vacuum suction cup 7 is used to absorb the wafer box door panel 20 to achieve a fixed connection between the flip platform 4 and the wafer box door panel 20. The door lock key 6 is mounted on the flip platform 4, and the door lock key 6 corresponds to the door lock position of the wafer box door panel 20. The door lock key 6 is used to unlock the door lock, so that the door lock is in the unlocked state, so that the first robot arm separates the wafer box body 19 and the wafer box door panel 20.

[0040] The above embodiment uses the vacuum suction cup 7 to fix the silicon wafer box door panel 20 on the flip platform 4. In actual applications, magnetic suction, mortise and tenon connection and other methods can also be used to achieve a fixed connection between the flip platform 4 and the silicon wafer box door panel 20. The embodiment of the present application does not limit this.

[0041] In some embodiments, the first robot arm includes a robot arm body 16 and a robot hand 15 mounted on the robot arm body 16 .

[0042] See also Figure 3 and Figure 4 , Figure 3 1 is a top view of a silicon wafer support 21, a detection sensor and a sensor amplifier provided in an embodiment of the present application. Figure 4It is a side view of a silicon wafer support 21, a detection sensor and a sensor amplifier provided in an embodiment of the present application.

[0043] Please combine Figures 1 to 4 In some embodiments, the detection device may include a guide rail 8 (also called a moving slide rail), a moving slider, and a detection sensor. The moving slider is used to move on the guide rail 8. The detection sensor is installed on the moving slider, and the detection sensor is used to detect the silicon wafer support 21 to obtain the detection data. Among them, the detection sensor can be a high-precision sensor.

[0044] like Figure 3 As shown, in some embodiments, the detection system may further include one or more support buckles 22 mounted on the flip platform 4 , and the support buckles 22 are used to be clamped with the silicon wafer support 21 .

[0045] The above embodiment does not limit the number of detection sensors, which can be, for example, 1, 2, 3, 4, 6, etc. When the number of detection sensors is greater than 2, the multiple detection sensors can be located on the same straight line. As an example, the multiple detection sensors can be located on the same straight line, and the spacing between any two adjacent detection sensors is equal.

[0046] In some embodiments, the detection device may further include a driving cylinder, and the driving cylinder is used to drive the movable slider to move on the guide rail 8. For example, Figure 2 and Figure 3 As shown, there are two guide rails 8, which are respectively located on both sides of the first direction of the flip platform 4, and the first direction is parallel to the flip axis 5; there are two movable sliders, each of which corresponds to a guide rail 8; there are two driving cylinders, for example, including a first driving cylinder 13 and a second driving cylinder 14, each of which corresponds to a movable slider, and the driving cylinder is used to drive the corresponding movable slider to move on the corresponding guide rail 8, and the moving direction is perpendicular to the first direction, and the first direction and the moving direction are parallel or approximately parallel to the ground at the location.

[0047] See also Figure 5 and Figure 6 , Figure 5 1 is a schematic diagram of a detection curve of an OK silicon wafer box 17 provided in an embodiment of the present application. Figure 6 It is a detection curve diagram of an NG silicon wafer box 17 provided in an embodiment of the present application.

[0048] In some embodiments, the detection device may further include a sensor amplifier corresponding to the detection sensor. As an example, the detection sensor is used to scan the silicon wafer support 21 and output a detection signal; the sensor amplifier is used to receive and amplify the detection signal and output detection data. Figure 3 As shown, the number of detection sensors is 2, for example, including a first detection sensor 9 and a second detection sensor 10; correspondingly, the number of sensor amplifiers is 2, for example, including a first sensor amplifier 11 and a second sensor amplifier 12, the first sensor amplifier 11 corresponds to the first detection sensor 9 to receive and amplify the detection signal from the first detection sensor 9, and the second sensor amplifier 12 corresponds to the second detection sensor 10 to receive and amplify the detection signal from the second detection sensor 10. As an example, the sensor amplifier uploads the detection data to the control module, and the control module processes the detection data to generate a corresponding detection curve, and compares the detection curve with the set curve to determine whether the silicon wafer box is OK or NG. The corresponding detection curve of the OK silicon wafer box 17 is as shown in FIG. Figure 5 As shown, the corresponding detection curve of NG silicon wafer box 17 is as follows Figure 6 shown.

[0049] The detection data output by the sensor amplifier is used to represent the distance between the scanning surface of the silicon wafer support 21 and the detection sensor. For example, when the detection sensor scans the silicon wafer support 21, when the scanning surface of the silicon wafer support 21 is closer to the detection sensor, the detection data output by the sensor amplifier will become smaller, and when the scanning surface of the silicon wafer support 21 is farther from the detection sensor, the detection data output by the sensor amplifier will become larger. Since the silicon wafer support 21 is a regular and undulating object, the detection data output by the sensor amplifier will be a regular value. The regular value is entered into the software (for example, the software executed on the PLC system) during the scanning process, and a regular data line (for example, a detection curve) will be generated. The intact silicon wafer support 21 generates data lines that match the original data (for example, the corresponding data of the standard silicon wafer support), while the deformed and convex silicon wafer support 21 will generate uneven data lines. By comparing the data, the characteristics of the silicon wafer support 21 can be determined: for example, the edge data lines do not match, which mostly indicates the edge protrusion of the silicon wafer support 21; the middle data lines do not match, which mostly indicates the center protrusion of the silicon wafer support 21.

[0050] See also Figure 7 , Figure 7 It is a structural schematic diagram of a detection system for a silicon wafer box door panel 20 provided in an embodiment of the present application (press-fitted silicon wafer box door panel 20).

[0051] In some embodiments, the detection system may further include a pressing block 23 and a second mechanical arm 24. The second mechanical arm 24 is used to manipulate the pressing block 23 to move downward to press-fit the silicon wafer support 21 that meets the target abnormal condition. As an example, before manipulating the pressing block 23, the guide rail 8 is first manipulated to move downward to lower the entire detection device to prevent the pressing block 23 from colliding with the detection device during the process of pressing the silicon wafer support 21.

[0052] See also Figure 8 and Fig. 9 , Figure 8 1 is a schematic diagram of the structure of a wafer box cleaning machine and a silicon wafer box 17 provided in an embodiment of the present application (collision occurs when separating the silicon wafer box door panel 20). Fig. 9 It is a structural schematic diagram of a wafer box cleaning machine and a silicon wafer box 17 provided in an embodiment of the present application (the silicon wafer box door panel 20 and the silicon wafer box body 19 are cleaned separately).

[0053] In a specific application scenario, such as Figure 1 As shown, after the wafer box 17 is uploaded to the loading platform 3, the wafer box 17 is read and confirmed by the barcode reader 1; after the confirmation is completed, the wafer box 17 is loaded and the isolation window 2 is opened synchronously. Among them, the detection system supports manual loading of the wafer box 17 to the loading platform 3, and loading of the wafer box 17 to the loading platform 3 from the automated overhead crane (OHT, Overhead Hoist Transfer, overhead crane transport equipment).

[0054] like Figure 2 As shown, the flip platform 4 starts to move, first flipping 90° counterclockwise, and the vacuum suction cup 7 and the door lock key 6 push into the wafer box door panel 20. Then, the vacuum suction cup 7 starts to draw a vacuum to absorb the wafer box 17. Next, the flip platform 4 flips clockwise to 0° to turn the wafer box 17 over. After the wafer box 17 is flipped, the door lock key 6 rotates 90° to unlock the door lock of the wafer box 17, and the wafer box body 19 can be taken away. The first robot arm grabs the mushroom head 18 of the wafer box 17 and lifts the wafer box 17 vertically, so that the wafer box door panel 20 is exposed on the flip platform 4.

[0055] like Figure 3 and Figure 4 As shown, the moving slider in the detection device moves horizontally from right to left, and the two detection sensors (for example, the first detection sensor 9 and the second detection sensor 10) scan and detect the silicon wafer support 21 (Retainer), and synchronously and continuously record the detection data obtained by the sensor amplifier (for example, the first sensor amplifier 11 and the second sensor amplifier 12) and upload it to the control module.

[0056] like Figure 5 and Figure 6 As shown, assuming that the control module adopts a PLC system, the PLC system can process the detection data to generate a corresponding detection curve, compare it with the set curve, and determine whether the silicon wafer support 21 (Retainer) has bulges, deformation (for example, micro-deformation), is not installed properly (that is, not installed in place), etc., and obtain an OK or NG judgment result. Among them, the set curve can be pre-set or directly specified, for example. As an example, the PLC system performs a judgment process, and determines that the silicon wafer box 17 (or the corresponding silicon wafer box door panel 20) that does not meet the target abnormal condition is OK (that is, the test passes), and the silicon wafer box 17 (or the corresponding silicon wafer box door panel 20) that meets the target abnormal condition is NG (that is, the test fails). The OK silicon wafer box 17 will close the lid normally, and after Unloading (for example, interacting with the relevant automation equipment for information flow to confirm that the unloading of the silicon wafer box 17 is complete), it will be uploaded to the wafer box cleaning machine for normal cleaning. The NG wafer box will be held (that is, maintained) by the detection system after Unloading, reducing the impact of continued production on the quality of the silicon wafer.

[0057] like Figure 7 As shown, for the silicon wafer box 17 that is determined to be not installed properly (NG), the detection device descends, and the second robot arm 24 (for example, a movable robot arm) presses the silicon wafer support 21 (Retainer) that meets the target abnormal condition again. After the pressing is completed, the detection device detects again, and the PLC system determines again whether the target abnormal condition is met.

[0058] like Fig. 9 As shown, an OK silicon wafer box 17 can be unloaded normally and enter the cleaning chamber 25 of the wafer box cleaning machine for cleaning. For example, the silicon wafer box body 19 can be placed on the body carrier 26 for cleaning, and the silicon wafer box door panel 20 can be clamped by the robot arm clamp 27 to be separated from the silicon wafer box body 19, and after separation, placed on the door panel carrier 28 for cleaning.

[0059] As can be seen, Figure 8 As shown, if the NG silicon wafer box 17 enters the wafer box cleaning machine, the following may occur: Figure 8 The collision shown in the figure causes hardware damage to the wafer box cleaning machine. In addition, such collision and scratching will also affect the quality of the silicon wafer box 17. In the above embodiment, the silicon wafer box 17 that is still NG will be held by the detection system after unloading. Next, the held silicon wafer box 17 can be manually or automatically disposed of, thereby reducing the equipment damage and silicon wafer box 17 damage caused by the NG silicon wafer box 17 directly entering the wafer box cleaning machine.

[0060] The above-mentioned embodiment can detect the silicon wafer box door panel 20, detect the silicon wafer support 21 that is not installed properly, protruding, or deformed, and can re-press and correct (or re-install) the NG silicon wafer box door panel 20, thereby reducing the risk of damage to the wafer box cleaning machine. The detection system supports manual loading of silicon wafer boxes 17 and automated overhead crane loading of silicon wafer boxes 17, and supports linkage with related automated equipment to hold problematic silicon wafer boxes 17 (i.e., NG silicon wafer boxes 17). The above-mentioned embodiment can not only detect and press-fit correct the silicon wafer support 21 to ensure material safety, but also the micro-deformation of the silicon wafer support 21 can be detected and automatically held, thereby reducing the risk of poor quality.

[0061] An embodiment of the present application provides a method for detecting a silicon wafer box door panel, the method comprising: separating a silicon wafer box body and a silicon wafer box door panel of a silicon wafer box; detecting whether a silicon wafer support of the silicon wafer box door panel meets a target abnormal condition; the target abnormal condition comprises one or more of improper installation, deformation and protrusion.

[0062] In some embodiments, the method may further include: in the case where it is detected that the silicon wafer support meets the target abnormal condition, press-fitting the silicon wafer support, and detecting again whether the silicon wafer support meets the target abnormal condition.

[0063] In some embodiments, the method may further include: when it is detected that the silicon wafer support does not meet the target abnormal condition, assembling the silicon wafer box body and the silicon wafer box door panel into the silicon wafer box so that a wafer box cleaning machine can clean the silicon wafer box.

[0064] In some embodiments, the process of detecting whether the silicon wafer support meets the target abnormal condition may include: detecting the silicon wafer support to obtain detection data corresponding to the silicon wafer support; and judging whether the silicon wafer support meets the target abnormal condition based on the detection data corresponding to the silicon wafer support.

[0065] In some embodiments, judging whether the silicon wafer support meets the target abnormal condition based on the detection data corresponding to the silicon wafer support may include: generating a detection curve corresponding to the detection data; comparing the detection curve with a set curve to judge whether the silicon wafer support meets the target abnormal condition.

[0066] The above embodiment effectively reduces equipment damage and poor quality of silicon wafer boxes caused by abnormal silicon wafer supports by detecting whether the silicon wafer supports are installed in place, deformed or bulged. Secondly, it is possible to monitor the quality of silicon wafer boxes in real time in an automated detection system, automatically identify silicon wafer boxes that meet target abnormal conditions, and take timely corrective measures when abnormalities occur, such as press-fit correction or marking as unqualified (i.e., NG), to ensure the stability of the production process and the quality of silicon wafer boxes. In addition, the operating efficiency and reliability of the wafer box cleaning machine are improved, reducing the errors and workload of manual inspection, helping to reduce production costs and improve the cleanliness and pass rate of silicon wafers in the semiconductor manufacturing process.

[0067] It should be noted that each embodiment in the present application is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the product embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0068] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0069] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0070] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0071] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A method for detecting a silicon wafer box door panel, characterized in that: The method comprises: A silicon wafer box body and a silicon wafer box door panel are separated from the silicon wafer box; Detect whether the silicon wafer support of the silicon wafer box door panel meets the target abnormal condition; the target abnormal condition includes one or more of incomplete installation, deformation and protrusion.

2. The method for detecting a silicon wafer box door panel according to claim 1, characterized in that: The method further comprises: When it is detected that the silicon wafer support meets the target abnormal condition, the silicon wafer support is press-fitted, and the silicon wafer support is detected again to see whether it meets the target abnormal condition.

3. The method for detecting a silicon wafer box door panel according to claim 1, characterized in that: The method further comprises: When it is detected that the silicon wafer support does not meet the target abnormal condition, the silicon wafer box body and the silicon wafer box door panel are assembled into the silicon wafer box so that a wafer box cleaning machine can clean the silicon wafer box.

4. The method for detecting a silicon wafer box door panel according to claim 1 or 2, characterized in that: The process of detecting whether the silicon wafer support meets the target abnormal condition includes: Detecting the silicon wafer support to obtain corresponding detection data of the silicon wafer support; According to the corresponding detection data of the silicon wafer support, it is determined whether the silicon wafer support meets the target abnormal condition.

5. The method for detecting a silicon wafer box door panel according to claim 4, characterized in that: The step of judging whether the silicon wafer support meets the target abnormal condition according to the detection data corresponding to the silicon wafer support comprises: Generating a detection curve corresponding to the detection data; The detection curve is compared with a set curve to determine whether the silicon wafer support meets the target abnormal condition.

6. A detection system for a silicon wafer box door panel, characterized in that: The detection system comprises: A loading platform for carrying silicon wafer boxes; A flipping platform, used to perform a first flipping operation to fix a wafer box door panel connected to the wafer box; and to perform a second flipping operation to flip the wafer box; the first flipping operation and the second flipping operation are in opposite flipping directions; A first mechanical arm, used for separating a silicon wafer box body and a silicon wafer box door panel of the silicon wafer box; A detection device, used for detecting the silicon wafer support of the silicon wafer box door panel to obtain corresponding detection data of the silicon wafer support; A control module is used to receive detection data from the detection device, and to determine whether the silicon wafer support meets the target abnormality condition based on the detection data; the target abnormality condition includes one or more of incomplete installation, deformation and protrusion.

7. The detection system for silicon wafer box door panel according to claim 6, characterized in that: The wafer box door panel is provided with a door lock, and the door lock has a locked state and an unlocked state; when the door lock is in the locked state, the wafer box door panel cannot be separated from the wafer box body; When the door lock is in the unlocked state, the wafer box door panel can be separated from the wafer box body; The detection system also includes: A vacuum suction cup is installed on the flip platform, and the vacuum suction cup is used to absorb the wafer box door panel to achieve a fixed connection between the flip platform and the wafer box door panel; A door lock key is installed on the flip platform, the door lock key corresponds to the door lock position of the silicon wafer box door panel, and the door lock key is used to unlock the door lock so that the door lock is in the unlocked state so that the first robotic arm can separate the silicon wafer box body and the silicon wafer box door panel.

8. The detection system for silicon wafer box door panel according to claim 6, characterized in that: The detection device comprises: guide; A movable slider, used for moving on the guide rail; A detection sensor is installed on the moving slider, and the detection sensor is used to detect the silicon wafer support to obtain the detection data.

9. The detection system for silicon wafer box door panel according to claim 8, characterized in that: The detection device also includes: A driving cylinder is used to drive the movable slider to move on the guide rail.

10. The detection system for silicon wafer box door panel according to claim 6, characterized in that: The detection system also includes: Press block; The second robot arm is used to manipulate the pressing block to move downward to press-fit the silicon wafer support that meets the target abnormal condition.

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