Laser etching device and method for large-breadth and large-size sample

Abstract

The invention provides a laser etching device and method for a large-breadth large-size sample, which are used for solving the problems that when an existing galvanometer axis and motion axis linkage laser processing mode faces a complex filled pattern, due to the response speed difference of a fast axis and a slow axis, the processing speed of different pattern sections is not uniform, and the processing efficiency is low. And splicing traces with inconsistent response speeds are formed. According to the laser etching method for the large-breadth and large-size sample provided by the invention, the laser etching device for the large-breadth and large-size sample is composed of a laser scanning part, a sample moving part, a bracket and a controller, and laser etching processing without splicing traces is realized by adopting a method of combining'track decomposition and multilayer filling '; the problem of splicing traces caused by inconsistent speed response brought by a traditional fast and slow axis linkage system is avoided, and the reliability and consistency of large-area etching processing are guaranteed.

Description

Technical Field

[0001] The invention relates to a laser etching device and method, and in particular to a laser etching device and method for large-format and large-size samples. Background Art

[0002] Laser etching is a technique that uses a high-energy laser beam to etch or carve a material surface, which is used to precisely remove a portion of the material to form a specific pattern, structure or texture. Laser etching is widely used in microelectronics, semiconductor manufacturing, micromachining and surface modification, and has the advantages of high precision, non-contact processing, diversity and processing flexibility.

[0003] Laser etching technology has obvious defects in surface etching processing of large-format and large-size samples. At present, laser etching systems are all implemented by scanning galvanometers, which need to be used with f-Theta field lenses. Due to the limited processing field of view of f-Theta field lenses, which is a maximum of 200-300mm, the scanning galvanometer cannot completely cover the processing area of ​​large-format samples. The motion axis needs to drive the sample to move its unprocessed area to the processing range of the field lens for secondary processing. Since the motion axis needs to drive the sample to move for multiple processing, there are splicing marks between sample processing, which is unacceptable for high-precision processing. In addition to the galvanometer splicing processing method, there is currently a laser processing method in which the galvanometer axis and the motion axis are linked. This processing method uses the fast and slow axis linkage to solve the splicing problem of multiple processing. However, for complex filled graphics, due to the difference in response speed between the fast and slow axes, the acceleration and deceleration of the slow axis is much lower than that of the fast axis, resulting in uneven processing speeds of different graphic segments, forming splicing marks with inconsistent response speeds. The current linkage system makes the responsiveness of the fast axis match the slow axis by sacrificing efficiency, which greatly limits the application and processing efficiency of the fast and slow axis linkage. The splicing problem caused by the difference in response speed of the galvanometer etching system is the key technical bottleneck that needs to be solved to achieve non-splicing large-format etching processing. Summary of the invention

[0004] The purpose of the present invention is to solve the technical problem that when facing complex filled graphics, the existing laser processing method in which the galvanometer axis and the motion axis are linked, the processing speed of different graphic segments is uneven due to the difference in response speed between the fast axis and the slow axis, resulting in splicing marks with inconsistent response speeds, and to provide a laser etching device and method for large-format and large-size samples.

[0005] In order to achieve the above object, the solution of the present invention is as follows:

[0006] A laser etching device for large-format and large-size samples, which is special in that it includes a laser scanning part, a sample moving part, a bracket and a controller;

[0007] The laser scanning part includes a laser system, a Z motion axis and a paraxial CCD; the sample motion part includes an X motion axis and a Y motion axis;

[0008] The length direction of the bracket is defined as the X direction, the width direction is defined as the Y direction, and the height direction is defined as the Z direction. The X motion axis, the Y motion axis, and the Z motion axis respectively reciprocate along the X direction, the Y direction, and the Z direction. The Z motion axis, the X motion axis, and the Y motion axis are sequentially installed on the bracket from top to bottom, and the X motion axis is connected to the motion end of the Y motion axis.

[0009] A fixture is installed on the upper surface of the moving end of the X-movement axis for clamping the sample;

[0010] The laser system and the paraxial CCD (34) are both mounted on the Z motion axis and are used to follow the Z motion axis and move synchronously in the Z direction; the laser system comprises a laser and a galvanometer deflection mirror, and the laser emitted by the laser is deflected by the galvanometer deflection mirror; the position on the fixture for clamping the sample is located on the laser light path after the laser is deflected by the galvanometer deflection mirror, and the laser acts on the sample surface through the galvanometer deflection mirror, so as to perform laser processing on the sample; the paraxial CCD uses a visual method to locate the sample to obtain the location coordinates of the sample;

[0011] The controller stores the trajectory of the image to be processed and the required scanning speed value, and is electrically connected to the X-axis, Y-axis, Z-axis, paraxial CCD and galvanometer deflection mirror respectively, for receiving the positioning coordinates of the sample collected by the paraxial CCD, and allocating the processing coordinates of the X-axis, Y-axis and Z-axis according to the positioning coordinates of the sample in combination with the laser etching method, so as to control the movement of the X-axis, Y-axis and Z-axis in each direction, and at the same time control the processing speed of the galvanometer deflection mirror to realize laser etching processing.

[0012] Furthermore, the X motion axis, the Y motion axis, and the Z motion axis all adopt linear motion modules.

[0013] Further, the controller is arranged on a bracket;

[0014] The clamp is an adsorption type clamp or a mechanical clamp.

[0015] In addition, the present invention also provides a laser etching method for large-format and large-size samples, which uses the above-mentioned laser etching device for large-format and large-size samples, and its special feature is that it includes the following steps:

[0016] S1, parameter calibration and sample clamping;

[0017] The motion axis is controlled to be located at the set standard zero position, and the galvanometer deflection mirror is calibrated; then the sample is clamped on the fixture, and the sample is aligned using the paraxial CCD; the motion axis includes the X motion axis, the Y motion axis and the Z motion axis;

[0018] S2, import the drawing to be processed and perform multi-layer linear rotation filling;

[0019] Import the graphics to be processed into the controller, perform n-layer filling on the graphics to be processed to form n-layer graphics; perform straight line filling on each layer of graphics to generate multiple equally spaced straight lines in the area to be processed of the graphics, and the starting point and end point of the straight line are the boundaries of the graphics; the direction of the straight line filled with the first layer of graphics is used as the reference line direction, and the angle between the straight line filled with each subsequent layer of graphics and the reference line is increased by a preset angle increment, so that a rotation filling is formed between the n layers of graphics;

[0020] S3, graphical decomposition;

[0021] Decompose each layer of graphics into m feature points according to the set spacing, and generate m geometric tangent lines corresponding to the m feature points;

[0022] S4, calculation of the graphics corner matrix;

[0023] The angle between the geometric tangents corresponding to two adjacent feature points in each layer of graphics is recorded as a corner, then there are m-1 corners, and then m-1 corner vectors are obtained; the corner matrix of each layer of graphics is calculated according to the m-1 corner vectors of each layer of graphics;

[0024] S5, coordinate and speed distribution of each axis;

[0025] The corner reference g and the processing scanning speed value u are set according to the processing requirements, and then the judgment reference value M is calculated; the processing coordinates and processing speeds of the galvanometer deflection mirror and the motion axis are allocated according to the calculated judgment reference value M, so as to form m-1 galvanometer deflection mirror processing vectors and m-1 motion axis processing vectors; the galvanometer deflection mirror processing matrix K of the corresponding layer is calculated according to the m-1 galvanometer deflection mirror processing vectors in each layer of graphics, and the motion axis processing matrix F of the corresponding layer is calculated according to the m-1 motion axis processing vectors in each layer of graphics;

[0026] S6, input the galvanometer deflection mirror processing matrix and the motion axis processing matrix of each layer of graphics into the controller respectively, and set the processing parameters of the laser system; the controller controls the X motion axis, Y motion axis, and Z motion axis to move to corresponding positions respectively according to the positioning coordinates of the sample collected by the paraxial CCD34 in step S1 and the corresponding motion axis processing matrix F of each layer, and controls the processing speed of the galvanometer deflection mirror through the corresponding galvanometer deflection mirror processing matrix K of each layer to complete laser etching.

[0027] Furthermore, in step S5, the determination reference value M is calculated by the following formula:

[0028]

[0029] Among them, G m is the corner value of the feature point in the corner matrix.

[0030] Furthermore, in step S5, the processing coordinates and processing speeds of the galvanometer deflection mirror (28) and the motion axis are allocated according to the calculated judgment reference value M as follows:

[0031] It is determined whether the reference value M is greater than 1. If so, the processing coordinates and processing speeds of the galvanometer deflection mirror (28) and the motion axis need to be allocated; if not, only the processing speeds of the galvanometer deflection mirror (28) and the motion axis are allocated.

[0032] Furthermore, in step S5, the distribution formula of the processing speed of the galvanometer deflection mirror (28) is as follows:

[0033]

[0034] Among them, u k is the deflection speed value after the galvanometer deflection mirror is allocated, u f It is the speed value after the motion axis is allocated, and H is the speed allocation ratio.

[0035] Furthermore, in step S5, the processing coordinate allocation formula of the galvanometer deflection mirror is as follows:

[0036]

[0037] Among them, x k The x-direction coordinate after the galvanometer deflection mirror is assigned, k is the y-direction coordinate after the galvanometer deflection mirror is assigned, x is the x-direction coordinate before the galvanometer deflection mirror is assigned, y is the y-direction coordinate before the galvanometer deflection mirror is assigned, R is a preset constant, and its physical meaning is the length of the trajectory extending along the geometric normal of the feature point, α is the angle between the geometric normal of the feature point and the horizontal line in the x-direction; θ is the angle between the geometric tangents corresponding to two adjacent feature points;

[0038] In step S5, the machining coordinate allocation formula of the motion axis is:

[0039]

[0040] In the formula, x f The x-direction coordinate after the motion axis is assigned, f is the y-direction coordinate after the motion axis is assigned, x is the x-direction coordinate before the motion axis is assigned, and y is the y-direction coordinate before the motion axis is assigned.

[0041] Furthermore, in step S5, the galvanometer deflection mirror processing vector The x-coordinate x after being assigned by the galvanometer deflection mirror k , y-direction coordinate y after the galvanometer deflection mirror is assigned k , the velocity value u after the galvanometer deflection mirror is distributed k The composition is expressed as follows:

[0042]

[0043] The motion axis machining vector The x-coordinate x after being assigned by the motion axis f , y-direction coordinate y after motion axis allocation f , the speed value u after the motion axis is assigned f The composition is expressed as follows:

[0044]

[0045] The expressions of the galvanometer deflection mirror processing matrix K and the motion axis processing matrix F are as follows:

[0046]

[0047]

[0048] in, They are respectively m-1 galvanometer deflection mirror processing vectors, They are respectively the processing vectors of m-1 motion axes.

[0049] Further, in step S1, the standard zero position is a mechanical zero position or a photoelectric sensor zero position.

[0050] Compared with the prior art, the present invention has the following beneficial effects:

[0051] 1. The present invention provides a laser etching method for large-format and large-size samples, which adopts a method combining "trajectory decomposition + multi-layer filling" to achieve laser etching processing without splicing marks, avoiding the splicing mark problem caused by the inconsistent speed response brought by the traditional fast and slow axis linkage system, and ensuring the reliability and consistency of large-area etching processing.

[0052] 2. The laser etching method for large-format and large-size samples of the present invention supports CAD programming and automated operation, and realizes the manufacture of complex patterns. The whole method has a simple process, is easy to operate, and is suitable for industrial applications.

[0053] 3. The laser etching device for large-format and large-size samples provided by the present invention has a simple structure and is easy to operate, and is particularly suitable for engineering production applications of large-scale laser etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 It is a structural schematic diagram of an embodiment of a laser etching device for large-format and large-size samples of the present invention;

[0055] Figure 2 It is a schematic diagram of the principle of an embodiment of a laser etching device for large-format and large-size samples of the present invention;

[0056] Figure 3 It is a schematic flow chart of an embodiment of a laser etching method for large-format and large-size samples of the present invention;

[0057] Figure 4 is a schematic diagram of three-layer graphic filling in step 2 of an embodiment of the present invention;

[0058] Figure 5 This is a schematic diagram of step 3 of an embodiment of the present invention;

[0059] Figure 6 This is a schematic diagram of the distribution of the galvanometer axis trajectory in step 4 of an embodiment of the present invention;

[0060] Figure 7 It is a schematic diagram of motion axis trajectory allocation in step 4 of an embodiment of the present invention.

[0061] The specific figures are:

[0062] 27-Z motion axis, 28-galvanometer axis, 29-sample, 30-fixture, 31-X motion axis, 32-Y motion axis, 33-controller, 34-paraxial CCD, 35-bracket. DETAILED DESCRIPTION

[0063] In order to make the advantages and features of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0064] A laser etching device for large-format and large-size samples, such as Figure 1 As shown, it includes a laser scanning part, a sample moving part, a bracket 35 and a controller 33. The laser scanning part and the sample moving part are physically separated and not directly connected. The laser scanning part includes a laser system, a Z moving axis 27 and a paraxial CCD 34, and the sample moving part includes an X moving axis 31 and a Y moving axis 32.

[0065] The X-axis 31, the Y-axis 32, and the Z-axis 27 all use linear motion modules, which are composed of motors, guide rails, encoders, grating rulers, etc. The Z-axis 27, the X-axis 31, and the Y-axis 32 are sequentially installed on the bracket 35 from top to bottom, and the X-axis 31 is connected to the moving end of the Y-axis 32, and the two are combined in a cross shape to achieve linkage. The length direction of the bracket 35 is defined as the X direction, the width direction is the Y direction, and the height direction is the Z direction. Then, the X-axis 31 reciprocates along the X direction, the Y-axis 32 reciprocates along the Y direction, and the Z-axis 27 reciprocates along the Z direction.

[0066] A fixture 30 is installed on the upper surface of the moving end of the X-motion axis 31, which is used to clamp the sample 29. In this embodiment, the sample 29 is clamped on the fixture 30 by adsorption clamping, and the sample 29 can move synchronously in the X direction and the Y direction following the X-motion axis 31 and the Y-motion axis 32. The laser system and the paraxial CCD 34 are both installed on the Z-motion axis 27, which are used to move synchronously in the Z direction following the Z-motion axis 27. The laser system includes a laser and a galvanometer deflection mirror 28. The laser emitted by the laser is deflected by the galvanometer deflection mirror 28, that is, the galvanometer deflection mirror 28 controls the laser to move in two dimensions in the plane, including the U and V axes. The position on the fixture 30 for clamping the sample 29 is located on the laser light path after the laser is deflected by the galvanometer deflection mirror 28. The laser emitted by the laser acts on the surface of the sample 29 through the galvanometer deflection mirror 28, which is used to perform laser processing on the sample 29. The rangefinder CCD34 is composed of an industrial camera and a lens, which uses a visual method to locate the sample 29 to obtain the positioning coordinates of the sample 29, that is, to photograph the positioning features of the sample 29, and correct the coordinate position of the sample 29 according to the position of the positioning features in the coordinate system, thereby obtaining the positioning coordinates of the sample 29.

[0067] Since the laser system and the paraxial CCD34 are both installed on the Z motion axis 27, during the positioning process, the Z motion axis 27 needs to move up and down to drive the paraxial CCD34 to move to the required clear positioning position, that is, the position where the sample 29 can be clearly photographed. During the processing process, the Z motion axis 27 needs to move up and down to drive the galvanometer deflection mirror 28 to move, so that the processing focus position of the galvanometer deflection mirror 28 coincides with the position of the sample 29.

[0068] like Figure 2As shown, the controller 33 stores the trajectory of the image to be processed and the required scanning speed value, and is electrically connected to the X-axis 31, the Y-axis 32, the Z-axis 27, the paraxial CCD 34, and the galvanometer deflection mirror 28, respectively, for receiving the positioning coordinates of the sample 29 collected by the paraxial CCD 34, and allocating the processing coordinates of the X-axis 31, the Y-axis 32, and the Z-axis 27 according to the positioning coordinates of the sample 29 combined with the laser etching method, so as to control the movement of the X-axis 31, the Y-axis 32, and the Z-axis 27 in each direction, and at the same time control the processing speed of the galvanometer deflection mirror 28 to achieve laser etching processing. In this embodiment, the controller 33 is placed on the bracket 35.

[0069] Based on the above-mentioned laser etching device for large-format and large-size samples, the present invention also provides a laser etching method for large-format and large-size samples, such as Figure 3 As shown, the specific steps include:

[0070] S1, parameter calibration and sample clamping.

[0071] First, the motion axis is controlled to be located at the set standard photoelectric sensor zero point position to ensure the reference datum of the initial coordinate system of the sample 29. Among them, the motion axis includes the X motion axis 31, the Y motion axis 32 and the Z motion axis 27. Then the galvanometer deflection mirror 28 is calibrated by dotting. Specifically, the galvanometer deflection mirror 28 is dotted according to the predetermined spacing. The result after dotting is measured by the standard measuring equipment. The measured spacing is compared and calibrated with the predetermined spacing to complete the initialization of the galvanometer deflection mirror 28. Finally, the sample 29 is clamped on the fixture 30, and the sample 29 is aligned by the paraxial CCD 34.

[0072] S2, import the drawing to be processed and perform multi-layer linear rotation filling.

[0073] The drawing to be processed is imported into the controller 33. The drawing to be processed is a closed figure in the format of dxf, dwg, etc. In the present invention, the drawing to be processed is multi-layered filled to form a multi-layered figure. Each layer of the figure is filled with straight lines, and rotation filling is formed between the multi-layered figures.

[0074] Line filling refers to generating multiple equally spaced straight lines at a preset spacing in the area to be processed of the figure, with the starting and ending points of the straight lines being the boundaries of the figure. During the processing, the laser moves along the generated multiple equally spaced straight lines, and multiple lines are processed in parallel on the surface of the sample 29. The spacing between adjacent straight lines should be smaller than the diameter of the laser spot to ensure that the surface to be processed of the sample 29 is completely covered by the laser.

[0075] The direction of the straight line filled with the first layer of graphics is used as the reference line direction, and the angle between the straight line filled with each subsequent layer of graphics and the reference line is increased by a preset angle increment, so that a rotating filling is formed between multiple layers of graphics. The purpose is to even out the splicing marks caused by inconsistent speed response and ensure the uniform effect of the final processing. In this embodiment, there are three layers of filling. The direction of the straight line L1 filled with the first layer of graphics is the reference line direction, and the angle between the straight line filled with each subsequent layer of graphics and the reference line is increased by an angle increment of 60 degrees; Figure 4 As shown, the angle between the straight line L1 filled by the first layer of graphics and the reference line is 0 degrees, the angle between the straight line L2 filled by the second layer of graphics and the reference line is 60 degrees, and the angle between the straight line L3 filled by the third layer of graphics and the reference line is 120 degrees. The spacing between two adjacent straight lines in each layer of graphics is 0.008 mm.

[0076] S3, Graphical decomposition.

[0077] Each layer of graphics is decomposed into 11 feature points according to the set spacing, and 11 geometric tangents corresponding to the 11 feature points are generated. The spacing is set as a length unit, which represents the length of the graphics between two adjacent feature points, such as Figure 5 As shown, one of the feature points is recorded as feature point A, and the feature point adjacent to it is recorded as feature point B. The set spacing is the length of the figure between feature point A and feature point B, and straight line C and straight line D are the geometric tangents corresponding to feature point A and feature point B respectively. The set spacing is determined according to the complexity of the figure. If the figure is large and smoother as a whole, the set spacing is set larger. If the figure is small or has more overall features, the set spacing is set smaller. In this embodiment, the size of the figure is 20×20mm, and 100 circles with a diameter of 0.35mm are evenly distributed inside, so the set spacing is set to 0.1mm.

[0078] S4, calculation of the graphics corner matrix.

[0079] like Figure 5 As shown, the angle θ between the geometric tangents corresponding to two adjacent feature points in each layer of the figure is recorded as the corner, then the x-coordinate, y-coordinate and angle θ of the figure form a corner vector It is worth noting that the angle θ in the present invention is the acute angle formed by the intersection of two geometric tangents. In this embodiment, each layer of graphics has 11 feature points, so each layer of graphics has 10 corners, each corner corresponds to a corner vector, and a total of 10 corner vectors are obtained. All corner vectors of each layer of graphics form a corner matrix G, and the three layers of graphics form corner matrices G1, G2, and G3 respectively.

[0080] S5, coordinate and speed distribution of each axis.

[0081] S5.1, set the corner reference g and processing scanning speed value u according to different processing requirements, and calculate the judgment reference value M according to the following formula:

[0082]

[0083] In the formula, G m is the corner value of the feature point in the corner matrix.

[0084] For processing with higher corner requirements, the corner reference g is usually set smaller, and for processing with lower corner requirements, the corner reference g is usually set larger. In this embodiment, the corner reference g is 20 degrees, and the processing scanning speed value u is 400 mm / s. In this embodiment, the M value corresponding to the initial feature point of each layer of graphics is 3.

[0085] S5.2, allocating the processing coordinates and processing speeds of the galvanometer deflection mirror 28 and the motion axis according to the calculated judgment reference value M.

[0086] The processing coordinates and processing speed of the galvanometer deflection mirror 28 and the motion axis refer to the mapping of the deflection speed of the galvanometer deflection mirror 28 and the motion speed of the motion axis. First, it is determined whether the reference value M is greater than 1. If so, it is necessary to allocate the processing coordinates and processing speed of the galvanometer deflection mirror 28 and the motion axis; if not, only the processing speed of the galvanometer deflection mirror 28 and the motion axis is allocated.

[0087] The processing speed distribution formula of the galvanometer deflection mirror 28 and the motion axis is as follows:

[0088]

[0089] In the formula, u k is the deflection speed value after the galvanometer deflection mirror 28 is allocated, u f It is the speed value after the motion axis is allocated, H is the speed allocation ratio, if M is less than 0, H is the preset constant D. The following is a parameter example, D is 0.9. If M is greater than 0, the calculation formula of H is:

[0090]

[0091] It can be seen that the larger the corner of the figure, the larger the M value, the larger the H value, and the greater the distribution speed of the galvanometer deflection mirror 28. Due to the advantage of the extremely small inertia of the galvanometer deflection mirror 28, the speed distribution at the corner should tend to the galvanometer deflection mirror 28. On the contrary, the smaller the corner of the figure, the smaller the M value, the smaller the H value, and the greater the distribution speed of the motion axis, which can better achieve smooth processing of large-format and large-size samples. In this embodiment, D is 0.9, M is 3, and the calculated H value is 0.6. The final speed value u after the galvanometer deflection mirror 28 is distributed k The speed value u after the motion axis is allocated is 240 mm / s.f The speed of the moving axis is 160 mm / s, and the speed of the moving axis is allocated to the X moving axis 31 and the Y moving axis 32 according to the trajectory direction of the image to be processed.

[0092] The machining coordinate allocation formula of the galvanometer deflection mirror 28 is as follows:

[0093]

[0094] In the formula, x k is the x-direction coordinate after the galvanometer deflection mirror 28 is assigned, and y k is the y-direction coordinate after the galvanometer deflection mirror 28 is assigned, x is the x-direction coordinate before the galvanometer deflection mirror 28 is assigned, y is the y-direction coordinate before the galvanometer deflection mirror 28 is assigned, R is a preset constant, and its physical meaning is the length of the trajectory extending along the geometric normal of the feature point, and α is the angle between the geometric normal of the feature point and the horizontal line in the x-direction.

[0095] like Figure 6 As shown, a feature point on the initial trajectory S of the image to be processed is selected as the initial feature point E, and the geometric normal of the initial feature point E is recorded as the feature point normal F, and the straight line passing through the initial feature point E along the X direction is recorded as the galvanometer axis horizontal line L; in the normal direction, the initial feature point E is calculated by the above formula to form the galvanometer axis feature point E′ after allocation, and the difference between the initial feature point E and the galvanometer axis feature point E′ after allocation is the galvanometer axis feature point change, and the value of the galvanometer axis feature point change is sinθ×R. For the case where the graph is relatively smooth and the corner is zero, the sinθ term is zero, and the coordinates of the galvanometer deflection mirror 28 after allocation are consistent with the coordinates before allocation, and no trajectory optimization is required. For the case where there is a sudden change in the graph, the sinθ term is a constant between 0-1, and the coordinates of the galvanometer deflection mirror 28 in the x-direction and y-direction extend outward along the normal direction based on the original coordinates, and the trajectory changes in the direction of the larger corner, giving full play to the advantage of the small inertia of the galvanometer deflection mirror 28, and the larger the corner, the larger the extension length. The maximum angle is 90°, at which time the value of the sinθ term is 1, and the length of the extension is equal to the value of the preset constant R. In this embodiment, the value of the preset constant R is 0.5 mm. The angle between the feature point normal F and the galvanometer axis horizontal line L is recorded as α, and the normal distance of the trajectory extension is distributed to the x direction and y direction through the angle α between the feature point normal F and the galvanometer axis horizontal line L, which is used to update the processing coordinates of the galvanometer axis feature point E′ in the x direction and y direction after allocation. The change in the galvanometer axis feature point is projected in the x direction and y direction respectively to obtain the change in the x direction of the galvanometer axis Δx and the change in the y direction of the galvanometer axis Δy. After allocation, the coordinate of the galvanometer axis feature point E′ in the x direction is the coordinate of the initial feature point E in the x direction plus the change in the x direction of the galvanometer axis Δx, and the coordinate of the galvanometer axis feature point E′ in the y direction is the coordinate of the initial feature point E in the y direction plus the change in the y direction of the galvanometer axis Δy.

[0096] After all the characteristic points on the initial trajectory S are assigned processing coordinates according to the above method, the formed trajectory M is the motion trajectory of the galvanometer deflection mirror 28 , and the motion trajectory of the galvanometer deflection mirror 28 is on the convex side of the initial trajectory S.

[0097] The machining coordinate allocation formula of the motion axis is:

[0098]

[0099] In the formula, x f The x-direction coordinate after the motion axis is assigned, f is the y-direction coordinate after the motion axis is assigned, x is the x-direction coordinate before the motion axis is assigned, and y is the y-direction coordinate before the motion axis is assigned.

[0100] like Figure 7 As shown, the same feature point on the initial trajectory S is selected as the initial feature point E, and the geometric normal of the initial feature point E is recorded as the feature point normal F. The straight line passing through the initial feature point E along the X direction is recorded as the motion axis horizontal line P, which is the same straight line as the galvanometer axis horizontal line L; in the normal direction, the initial feature point E is calculated by the above formula to form the motion axis feature point E″ after allocation, and the difference between the initial feature point E and the motion axis feature point E″ after allocation is the motion axis feature point change, and the value of the motion axis feature point change is sinθ×R, and its various parameters are basically consistent with the allocation of the galvanometer deflection mirror 28. For the motion axis, due to the small inertia, the trajectory allocation needs to be smoother, so the allocated coordinates are the original coordinates minus the normal term, that is, the trajectory changes in the direction of the corner becoming smaller, and the trajectory of the motion axis changes in the direction of the inward concave, and the larger the corner, the larger the length of the inward concave, so as to achieve the effect of smoothing the motion axis trajectory. The angle between the feature point normal F and the horizontal line P of the moving axis is denoted as β. The normal distance of the concave trajectory is allocated to the x direction and the y direction through the angle β between the feature point normal F and the horizontal line P of the moving axis, and is used to update the processing coordinates of the moving axis feature point E″ in the x direction and the y direction after allocation. The change in the moving axis feature point is projected in the x direction and the y direction respectively to obtain the change in the x direction Δx′ and the change in the y direction Δy′ of the moving axis. The coordinate of the moving axis feature point E″ in the x direction after allocation is the coordinate of E in the x direction plus the change in the x direction Δx′ of the moving axis. The coordinate of the moving axis feature point E″ in the y direction after allocation is the coordinate of E in the y direction plus the change in the y direction Δy′ of the moving axis.

[0101] After all the characteristic points on the initial trajectory S are assigned processing coordinates according to the above method, the formed trajectory N is the motion trajectory of the motion axis, and the motion trajectory of the motion axis is on the concave side of the initial trajectory S.

[0102] Galvanometer deflection mirror processing vector The motion axis processing vector is composed of the x-direction coordinate, y-direction coordinate and speed value assigned by the galvanometer deflection mirror 28. It consists of the x-direction coordinate, y-direction coordinate and speed value after the motion axis is allocated. The formulas are as follows:

[0103]

[0104]

[0105] Since there are 10 corners on each layer of the graphics in this embodiment, each corner corresponds to a galvanometer deflection mirror processing vector and a motion axis processing vector. Therefore, there are 10 galvanometer deflection mirror processing vectors and 10 motion axis processing vectors. The 10 galvanometer deflection mirror processing vectors are respectively recorded as The processing vectors of the 10 motion axes are recorded as Then the galvanometer deflection mirror processing matrix Motion axis processing matrix

[0106] S6, the galvanometer deflection mirror processing matrix K and the motion axis processing matrix F of each layer of graphics are respectively input into the controller 33, and the processing parameters of the laser system are set, such as the focus position, laser power, laser frequency and other parameters. The controller 33 controls the X motion axis 31, the Y motion axis 32, and the Z motion axis 27 to move to the corresponding positions according to the positioning coordinates of the sample 29 collected by the paraxial CCD 34 in step S1 and the motion axis processing matrix F corresponding to each layer, and controls the processing speed of the galvanometer deflection mirror 28 through the galvanometer deflection mirror processing matrix K corresponding to each layer to complete the laser etching.

[0107] The present invention adopts two technical means to improve the splicing problem caused by the difference in response speed. One is to decompose the graphics to be processed by cutting corners to form a corner matrix of the graphics, distinguish the corner differences of different graphic segments, and decompose the corner graphics trajectory into corner trajectory and smooth trajectory for places with larger corners. The corner trajectory is assigned to the galvanometer axis with better speed responsiveness, and the smooth trajectory is assigned to the motion axis with poor speed responsiveness to adapt to axis systems with different speed responsiveness. The other is to optimize the filling method of the graphics, and use a multi-layer rotation filling method to perform etching processing to homogenize the splicing marks. The use of the above-mentioned technical means for laser etching processing not only gives play to the advantages of the large motion amplitude of the motion axis and no multiple processing splicing marks, but also solves the problem of poor speed responsiveness of the motion axis and inability to match the galvanometer axis. The speed response consistency of the processing is guaranteed, and the splicing problem caused by the speed response difference brought about by the traditional linkage processing method is completely solved.

[0108] The above description is only used to illustrate the technical solution of the present invention rather than to limit it. For ordinary professional and technical personnel in the field, the specific technical solution recorded in the above embodiment can be modified, or some of the technical features therein can be replaced by equivalents, and these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution protected by the present invention.

Claims

1. A laser etching device for large-format and large-size samples, characterized in that: It includes a laser scanning part, a sample moving part, a support (35) and a controller (33); The laser scanning part includes a laser system, a Z motion axis (27) and a paraxial CCD (34); the sample motion part includes an X motion axis (31) and a Y motion axis (32); The length direction of the bracket (35) is defined as the X direction, the width direction is defined as the Y direction, and the height direction is defined as the Z direction. The X motion axis (31), the Y motion axis (32), and the Z motion axis (27) respectively reciprocate along the X direction, the Y direction, and the Z direction. The Z motion axis (27), the X motion axis (31), and the Y motion axis (32) are sequentially installed on the bracket (35) from top to bottom, and the X motion axis (31) is connected to the motion end of the Y motion axis (32). A fixture (30) is installed on the upper surface of the moving end of the X-movement axis (31) for clamping the sample (29); The laser system and the paraxial CCD (34) are both mounted on the Z motion axis (27) and are used to follow the Z motion axis (27) and move synchronously in the Z direction; the laser system comprises a laser and a galvanometer deflection mirror (28), and the laser emitted by the laser is deflected by the galvanometer deflection mirror (28); the position on the fixture (30) for clamping the sample (29) is located on the laser light path after the laser is deflected by the galvanometer deflection mirror (28), and the laser acts on the surface of the sample (29) through the galvanometer deflection mirror (28), so as to perform laser processing on the sample (29); the paraxial CCD (34) uses a visual method to locate the sample (29) to obtain the location coordinates of the sample (29); The controller (33) stores the trajectory of the image to be processed and the required scanning speed value, and is electrically connected to the X-axis (31), the Y-axis (32), the Z-axis (27), the paraxial CCD (34) and the galvanometer deflection mirror (28) respectively, and is used to receive the positioning coordinates of the sample (29) collected by the paraxial CCD (34), and allocate the processing coordinates of the X-axis (31), the Y-axis (32) and the Z-axis (27) according to the positioning coordinates of the sample (29) in combination with the laser etching method, so as to control the movement of the X-axis (31), the Y-axis (32) and the Z-axis (27) in various directions, and at the same time control the processing speed of the galvanometer deflection mirror (28), so as to realize laser etching processing.

2. The laser etching device for large-format and large-size samples according to claim 1, characterized in that: The X motion axis (31), the Y motion axis (32), and the Z motion axis (27) all adopt linear motion modules.

3. A laser etching device for large-format and large-size samples according to claim 1 or 2, characterized in that: The controller (33) is arranged on a bracket (35); The clamp (30) is an adsorption type clamp or a mechanical clamp.

4. A laser etching method for large-format and large-size samples, using the laser etching device for large-format and large-size samples according to any one of claims 1 to 3, characterized in that: The following steps are involved: S1, parameter calibration and sample clamping; The motion axis is controlled to be located at a set standard zero point position, and the galvanometer deflection mirror (28) is calibrated by marking points; then the sample (29) is clamped on the fixture (30), and the sample (29) is aligned using a paraxial CCD (34); the motion axis includes an X motion axis (31), a Y motion axis (32), and a Z motion axis (27); S2, import the drawing to be processed and perform multi-layer linear rotation filling; Importing the to-be-processed drawing into the controller (33), performing n-layer filling on the to-be-processed drawing to form n-layer graphics; performing straight line filling on each layer of graphics to generate a plurality of equally spaced straight lines in the to-be-processed area of ​​the graphics, wherein the starting point and the end point of the straight line are the boundaries of the graphics; The direction of the straight line filled by the first layer of graphics is used as the direction of the reference line. The angle between the straight line filled by each subsequent layer of graphics and the reference line is increased by a preset angle increment, so that a rotational filling is formed between n layers of graphics. S3, graphical decomposition; Decompose each layer of graphics into m feature points according to the set spacing, and generate m geometric tangent lines corresponding to the m feature points; S4, calculation of the graphics corner matrix; The angle between the geometric tangents corresponding to two adjacent feature points in each layer of graphics is recorded as a corner, then there are m-1 corners, and then m-1 corner vectors are obtained; the corner matrix of each layer of graphics is calculated according to the m-1 corner vectors of each layer of graphics; S5, coordinate and speed distribution of each axis; According to the processing requirements, a corner reference g and a processing scanning speed value u are set, and then a judgment reference value M is calculated; according to the calculated judgment reference value M, the processing coordinates and processing speeds of the galvanometer deflection mirror (28) and the motion axis are allocated to form m-1 galvanometer deflection mirror processing vectors and m-1 motion axis processing vectors; according to the m-1 galvanometer deflection mirror processing vectors in each layer of graphics, a galvanometer deflection mirror processing matrix K of the corresponding layer is calculated, and according to the m-1 motion axis processing vectors in each layer of graphics, a motion axis processing matrix F of the corresponding layer is calculated; S6, inputting the galvanometer deflection mirror processing matrix and the motion axis processing matrix of each layer of graphics into the controller respectively, and setting the processing parameters of the laser system; the controller (33) controls the X motion axis (31), the Y motion axis (32), and the Z motion axis (27) to move to corresponding positions respectively according to the positioning coordinates of the sample (29) collected by the paraxial CCD34 in step S1 and the motion axis processing matrix F corresponding to each layer, and controls the processing speed of the galvanometer deflection mirror (28) through the galvanometer deflection mirror processing matrix K corresponding to each layer, thereby completing laser etching.

5. The laser etching method for large-format and large-size samples according to claim 4, characterized in that: In step S5, the determination reference value M is calculated by the following formula: Among them, G m is the corner value of the feature point in the corner matrix.

6. The laser etching method for large-format and large-size samples according to claim 5, characterized in that: In step S5, the processing coordinates and processing speeds of the galvanometer deflection mirror (28) and the motion axis are allocated according to the calculated judgment reference value M, specifically: It is determined whether the reference value M is greater than 1. If so, the processing coordinates and processing speeds of the galvanometer deflection mirror (28) and the motion axis need to be allocated; if not, only the processing speeds of the galvanometer deflection mirror (28) and the motion axis are allocated.

7. The laser etching method for large-format and large-size samples according to claim 6, characterized in that: In step S5, the distribution formula of the processing speed of the galvanometer deflection mirror (28) is as follows: Among them, u k is the deflection speed value after allocation of the galvanometer deflection mirror (28), u f It is the speed value after the motion axis is allocated, and H is the speed allocation ratio.

8. The laser etching method for large-format and large-size samples according to claim 7, characterized in that: In step S5, the processing coordinate allocation formula of the galvanometer deflection mirror (28) is as follows: Among them, x k is the x-coordinate of the galvanometer deflection mirror (28) after allocation, k is the y-direction coordinate after the galvanometer deflection mirror (28) is assigned, x is the x-direction coordinate before the galvanometer deflection mirror (28) is assigned, y is the y-direction coordinate before the galvanometer deflection mirror (28) is assigned, R is a preset constant, and its physical meaning is the length of the trajectory extending along the geometric normal of the feature point, α is the angle between the geometric normal of the feature point and the horizontal line in the x-direction; θ is the angle between the geometric tangents corresponding to two adjacent feature points; In step S5, the machining coordinate allocation formula of the motion axis is: In the formula, x f The x-direction coordinate after the motion axis is assigned, f is the y-direction coordinate after the motion axis is assigned, x is the x-direction coordinate before the motion axis is assigned, and y is the y-direction coordinate before the motion axis is assigned.

9. The laser etching method for large-format and large-size samples according to claim 8, characterized in that: In step S5, the galvanometer deflection mirror processing vector The x-direction coordinate x assigned by the galvanometer deflection mirror (28) k , the y-direction coordinate y after the galvanometer deflection mirror (28) is allocated k , the velocity value u after the galvanometer deflection mirror (28) is distributed k The composition is expressed as follows: The motion axis machining vector The x-coordinate x after being assigned by the motion axis f , y-direction coordinate y after motion axis allocation f , the speed value u after the motion axis is assigned f The composition is expressed as follows: The expressions of the galvanometer deflection mirror processing matrix K and the motion axis processing matrix F are as follows: in, They are respectively m-1 galvanometer deflection mirror processing vectors, They are respectively the processing vectors of m-1 motion axes.

10. The laser etching method for large-format and large-size samples according to claim 1, characterized in that: In step S1, the standard zero position is a mechanical zero position or a photoelectric sensor zero position.

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