A laser etching device and method for large-format large-size samples

By using a laser etching device and method for large-format, large-size samples, the problem of splicing marks caused by the difference in response speed between the fast and slow axes has been solved, achieving laser etching processing without splicing marks, which is suitable for industrial applications.

CN119870718BActive Publication Date: 2025-12-12XIAN INST OF OPTICS & PRECISION MECHANICS CHINESE ACAD OF SCI
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Patent Information

Application Number
CN202411995082.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2025-12-12
Estimated Expiration
2044-12-31

AI Technical Summary

Technical Problem

The existing laser processing method that links the galvanometer axis and the motion axis suffers from uneven processing speeds in different graphic segments when dealing with complex filled patterns due to the difference in response speed between the fast and slow axes, resulting in splicing marks with inconsistent response speeds.

Method used

A large-format, large-size laser etching device is used, which includes a laser scanning part, a sample movement part, a support and a controller. By defining the reciprocating motion of the X, Y and Z motion axes, and combining it with the off-axis CCD for positioning, the controller assigns processing coordinates and speeds. The 'trajectory decomposition + multi-layer filling' method is used to allocate processing tasks to the galvanometer deflector and motion axis.

Benefits of technology

It achieves seamless laser etching, ensuring the reliability and consistency of large-area etching, supports CAD programming and automated operation, and is suitable for industrial applications.

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Abstract

The application provides a laser etching device and method for large-format and large-size samples, and aims to solve the technical problem that the laser processing mode of linkage of the fast axis and the slow axis of the existing galvanometer causes the non-uniform processing speed of different pattern segments due to the speed difference of the fast axis and the slow axis, and forms the splicing trace with inconsistent response speed when facing complex filled patterns. The laser etching method for large-format and large-size samples provided by the application is realized by the laser etching device for large-format and large-size samples composed of a laser scanning part, a sample movement part, a bracket and a controller, and the method of combining "trajectory decomposition + multi-layer filling" is adopted to realize the laser etching processing without splicing traces, thereby avoiding the splicing trace problem caused by the inconsistent speed response of the traditional linkage system of the fast axis and the slow axis, and ensuring the reliability and consistency of the large-area etching processing.
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