Laser-based valve sleeve orifice machining method, device, equipment and medium

Abstract

The present disclosure provides a laser-based valve sleeve throttling square hole processing method, device, equipment and medium. The processing method can include: obtaining initial processing parameters related to a femtosecond laser; performing micro-hole simulation processing on the valve sleeve based on the initial processing parameters, and updating the initial processing parameters to obtain target processing parameters according to the deviation between the simulation processing result and the expected result; and performing square hole processing on the valve sleeve by using a laser beam provided by the femtosecond laser according to the target processing parameters to obtain a target valve sleeve throttling square hole.

Description

Technical Field

[0001] This disclosure relates to the field of laser processing technology, and in particular to a laser-based method, apparatus, equipment and medium for processing valve sleeve throttling square holes. Background Technology

[0002] Hydraulic servo systems, as hydraulic feedback automatic control systems that use hydraulic power as a source and electrical means for signal transmission and control, play a crucial role in high-end industrial control fields such as aviation, aerospace, and robotics due to their superior control precision, rapid response speed, strong load capacity, and smooth transmission performance. In these systems, valve sleeves, as core components of hydraulic valves, have a direct and significant impact on the performance indicators of the hydraulic valve, such as dead zone, overlap, hysteresis, and internal leakage, due to the geometry and morphology of their throttling orifices.

[0003] Currently, the machining of throttling square holes in valve sleeves mainly relies on electrical discharge machining (EDM). First, a small-hole milling machine is needed to drill the wire thread, followed by precision finishing using a slow wire EDM machine to ensure the accuracy and surface quality of the throttling square hole. However, this machining process is not only complex, but also lacks control over the hole diameter, shape, and inclination angle during machining. Furthermore, it demands extremely high stability and efficiency from the pulse power supply. The electro-erosion layer generated during EDM and slow wire EDM processes negatively impacts the lifespan of the final product. Therefore, developing a new machining technology to achieve high-precision and high-efficiency machining and overcome the limitations of existing processes has become an urgent need for industry development. Summary of the Invention

[0004] In view of this, the present disclosure aims to provide a laser-based method, apparatus, equipment, and medium for machining throttling square holes in valve sleeves; which can improve the efficiency and accuracy of machining throttling square holes in valve sleeves.

[0005] The technical solution disclosed herein is implemented as follows:

[0006] In a first aspect, this disclosure provides a laser-based method for machining a valve sleeve throttling square hole, the machining method comprising:

[0007] Obtain the initial processing parameters related to the femtosecond laser;

[0008] The valve sleeve is subjected to micro-hole simulation machining based on the initial machining parameters, and the initial machining parameters are updated according to the deviation between the simulation machining results and the expected results to obtain the target machining parameters.

[0009] Based on the target processing parameters, a square hole is machined on the valve sleeve using a laser beam provided by a femtosecond laser to obtain the target valve sleeve throttling square hole.

[0010] Secondly, this disclosure provides a laser-based valve sleeve throttling square hole processing device, the processing device comprising: an acquisition part, a simulation part, and a processing part, wherein,

[0011] The acquisition section is configured to acquire initial processing parameters related to the femtosecond laser.

[0012] The simulation section is configured to perform micro-hole simulation processing on the valve sleeve based on the initial processing parameters, and update the initial processing parameters to obtain the target processing parameters based on the deviation between the simulation processing results and the expected results.

[0013] The processing section is configured to use a laser beam provided by a femtosecond laser to process a square hole in the valve sleeve according to the target processing parameters to obtain the target valve sleeve throttling square hole.

[0014] Thirdly, this disclosure provides a computing device, the computing device comprising: a processor and a memory; the processor is configured to execute instructions stored in the memory to implement the laser-based valve sleeve throttling square hole processing method described in the first aspect.

[0015] Fourthly, this disclosure provides a computer storage medium storing at least one instruction, which is executed by a processor to implement the laser-based valve sleeve throttling square hole processing method as described in the first aspect.

[0016] This disclosure provides a laser-based method, apparatus, equipment, and medium for machining throttling square holes in valve sleeves. A femtosecond laser is used as the machining light source, leveraging its high energy density, high peak power, and low heat accumulation effect to achieve precision machining of the valve sleeve, reducing the heat-affected zone and improving the surface quality and performance of the product. Before actual machining, the valve sleeve is simulated using initial machining parameters. The simulation predicts and corrects potential machining errors, thereby reducing deviations during machining and improving machining accuracy. Based on the deviation between the simulation results and the expected results, the initial machining parameters are adjusted to obtain more precise target machining parameters. Based on the target machining parameters, the valve sleeve is machined using the laser beam provided by the femtosecond laser, achieving high-precision and high-efficiency machining of the throttling square holes in the valve sleeve, while reducing material waste and post-processing requirements. Furthermore, laser machining eliminates the need for the wire threading step before the slow wire machining in electrical discharge machining, reducing machining time and improving machining efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of an exemplary valve sleeve square hole machining system that can be applied to this disclosure;

[0018] Figure 2A flowchart of a laser-based method for machining a valve sleeve throttling square hole is provided in this disclosure;

[0019] Figure 3 This is a schematic diagram of a valve sleeve square hole machining technology solution provided in this disclosure;

[0020] Figure 4 This is a schematic diagram of the thermal effect of processing using a long-pulse laser, as provided in this disclosure;

[0021] Figure 5 This is a schematic diagram of the thermal effect of processing using an ultrashort pulse laser, provided in this disclosure;

[0022] Figure 6 This is a comparison chart of thermal effect results provided in this disclosure;

[0023] Figure 7 This is a schematic diagram of a laser processing optical path provided in this disclosure;

[0024] Figure 8 This is a schematic diagram of beam processing trajectory filling provided in this disclosure;

[0025] Figure 9 This is another schematic diagram of beam processing trajectory filling provided in this disclosure;

[0026] Figure 10 This is another schematic diagram of beam processing trajectory filling provided in this disclosure;

[0027] Figure 11 This is a schematic diagram of a focusing lens focusing process provided in this disclosure;

[0028] Figure 12 This is a schematic diagram of a laser-based valve sleeve throttling square hole processing device provided in this disclosure;

[0029] Figure 13 This is a schematic diagram of the structure of a computing device provided in this disclosure. Detailed Implementation

[0030] The technical solutions in this disclosure will now be clearly and completely described with reference to the accompanying drawings.

[0031] As a key component of hydraulic valves in hydraulic servo systems, the valve sleeve's geometric dimensions and morphological characteristics of its throttling square orifice significantly influence the valve's performance, including dead zone, overlap, hysteresis, and internal leakage. Hydraulic valves in hydraulic servo systems control and regulate hydraulic energy, accurately controlling fluid pressure, flow rate, and direction to achieve precise control of actuators. Therefore, the machining accuracy and surface quality of the valve sleeve are crucial to the reliability, stability, and service life of the hydraulic servo system. To meet the quality and precision requirements of various applications, the surface of the throttling square orifice in the valve sleeve is typically finished after grinding and boring.

[0032] In related technologies, the throttling square hole of the valve sleeve is usually processed by electrical discharge machining (EDM). However, EDM will generate an electro-erosion layer, which will negatively affect the service life of the final product. In addition, the processing procedure is complicated and inefficient, and it is impossible to process throttling square holes with a diameter of less than 0.1 mm.

[0033] Based on this, this disclosure aims to provide a laser-based machining technology for valve sleeve throttling square holes. This technology allows for flexible control of the hole shape, diameter, and radius (R-angle) of the valve sleeve throttling square hole, and prevents the formation of an electrolytic corrosion layer during machining. It should be noted that the R-angle refers to the inner and / or outer radius of the valve sleeve throttling square hole. See also... Figure 1 It shows a schematic diagram of an exemplary valve sleeve square hole machining system 100 that can be applied to this disclosure. It should be noted that... Figure 1 The processing system 100 shown is for illustrative purposes only and is not intended to be limiting in any way. Figure 1As shown, the processing system 100 may include a laser source 101, an optical path transmission system 102, a beam scanning module 103, a beam focusing module 104, an axis motion control system 105, and a valve sleeve square hole 106. The laser source 101 includes an emission module and a focusing module, used to amplify laser power and provide laser energy. The laser beam generated by the source performs micro-hole processing on the valve sleeve. The micro-hole can be a circular hole, elliptical hole, square hole, irregularly shaped hole, or conical hole. In this disclosure, a femtosecond laser is used as the laser source 101. The parameters involved include wavelength, pulse width, laser power, and repetition frequency, taking the processing of a throttling square hole on the valve sleeve as an example. The optical path transmission system 102 is used to transmit the laser energy generated by the laser source 101 to the area to be processed. During laser transmission, to ensure stability and accuracy, it typically includes optical fibers, mirrors, and other optical components to guide and adjust the direction and shape of the laser beam. The parameters involved include at least the beam expansion factor and divergence angle. Specifically, the optical path transmission system 102 is used to shape, homogenize, expand, and collimate the laser beam before it enters the beam scanning module 103 through a collimated optical path. The beam scanning module 103 is used to control the movement and scanning of the laser beam in the area to be processed, and the parameters involved include at least the scanning processing trajectory, scanning speed, single-layer feed, and number of layers. Different scanning modes can be configured according to scanning requirements to achieve different scanning imaging functions, including large field-of-view imaging, small field-of-view high-resolution imaging, and large field-of-view high-resolution imaging. The beam focusing module 104 is used to focus the laser beam onto the valve sleeve to be processed to achieve precise micro-hole processing, and the parameters involved include focal length, depth of focus, and focal spot size. The focusing characteristics of the laser beam can be controlled to achieve focusing, such as increasing the depth of focus, dividing the focal point into several equal focal points, or using lasers of different wavelengths all focused on the same plane. The axis motion control system 105 is used to precisely control the mechanical motion during the valve sleeve micro-hole processing, including the movement of linear and rotary axes. For example, the speed and position axis process objects can be configured, and speed and position control programs can be written to achieve precise position control and motion synchronization, and ensure the coplanarity of the valve sleeve square hole 106. The valve sleeve square hole 106 is the final machining result, that is, the throttling square hole to be machined on the valve sleeve, and the parameters involved include at least machining quality, hole diameter accuracy, and taper. The geometric dimensions and morphological characteristics of the valve sleeve square hole 106 have a direct impact on the performance of the hydraulic valve, therefore, high machining accuracy is required. In addition, in some examples, air blowing for slag removal may also be included, and the parameters involved may include the air blowing method and air pressure.

[0034] Combination Figure 1 The machining system 100 shown is designed to obtain a high-precision valve sleeve square hole 106. (See also...) Figure 2The diagram shows a flow chart of a laser-based valve sleeve throttling square hole processing method provided in this disclosure, which includes steps S201 to S203.

[0035] S201: Obtain initial processing parameters related to the femtosecond laser.

[0036] A femtosecond laser is a device that emits ultrashort laser pulses, capable of generating lasers with pulse widths in the femtosecond range. This allows femtosecond lasers to achieve temporal and spatial resolution in material processing. Because the pulse energy is concentrated and released within a short time, extremely high peak power can be generated, enabling nonlinear optical effects and precision machining at the micron or even nanometer scale, such as micro-hole drilling, microstructure etching, and non-metallic cutting. Furthermore, due to the extremely short pulse duration, the heat accumulation effect is small, resulting in a very small heat-affected zone during material processing using femtosecond lasers, making them suitable for processing heat-sensitive materials. The initial processing parameters related to femtosecond lasers include at least wavelength, pulse width, repetition rate, and average power. Among these, the wavelength of the femtosecond laser determines the characteristics of the laser-material interaction. Commonly used wavelengths for femtosecond lasers include 1030 nm, 515 nm, 343 nm, and 258 nm, with different wavelengths suitable for different materials and processing requirements. Pulse width typically ranges from a few femtoseconds to tens of femtoseconds, and this parameter directly affects the accuracy and quality of the machining process. Repetition rate refers to the number of pulses emitted per second by the femtosecond laser, with an adjustable range typically from 1Hz to 1000kHz; this parameter affects the machining speed and efficiency. Average power refers to the total energy output of the femtosecond laser. For femtosecond lasers, higher average power means higher energy output, allowing for more complex machining tasks. Furthermore, the appropriate type of femtosecond laser, such as a fiber laser or a solid-state laser, can be selected based on specific application requirements, considering its performance indicators such as stability and reliability. Based on the working principle and parameter design of the femtosecond laser, preliminary process parameters suitable for the machining task are set.

[0037] S202: Perform micro-hole simulation machining on the valve sleeve based on the initial machining parameters, and update the initial machining parameters to obtain the target machining parameters based on the deviation between the simulation machining results and the expected results.

[0038] Simulation-based machining is a method that predicts machining results by simulating the micro-hole machining process of a femtosecond laser on a valve sleeve in simulation software before actual machining. The machining results can include groove depth, width, heat-affected zone, and material removal rate. Simulation-based machining can reduce trial-and-error costs and time in actual machining. Based on the deviation between the simulation and predicted machining results, the initial machining parameters are adjusted and optimized. For example, orthogonal correlation experiments can be used to obtain more accurate target machining parameters. For instance, based on the relationship between the orthogonal correlation experiment results and the simulation results of the initial machining parameters, a multi-parameter control model can be constructed. This model can be used to more accurately adjust and optimize the initial machining parameters to obtain the target machining parameters, and based on the target machining parameters, a machining result closer to the expected result can be obtained.

[0039] S203: Based on the target processing parameters, use the laser beam provided by the femtosecond laser to process the square hole of the valve sleeve to obtain the target valve sleeve throttling square hole.

[0040] Using preset target processing parameters, such as laser power, scanning speed and beam tilt angle, a high-energy laser beam emitted by a femtosecond laser is used to perform actual and precise square hole processing on the valve sleeve under the precise control of the optical path transmission system 102 and the beam scanning module 103. At the same time, the axis motion control system 105 is used to ensure the mechanical motion accuracy during the processing, and finally the valve sleeve square hole 106 that meets the design specifications is formed, namely the target valve sleeve throttling square hole.

[0041] according to Figure 2 The technical solution presented uses a femtosecond laser as the processing light source. Leveraging the high energy density, high peak power, and low heat accumulation effect of the femtosecond laser, it achieves precision machining of the valve sleeve, reducing the heat-affected zone and improving the surface quality and performance of the product. Before actual machining, micro-hole machining of the valve sleeve is simulated using initial machining parameters. This simulation predicts and corrects potential machining errors, thereby reducing deviations during machining and improving machining accuracy. Based on the deviation between the simulation results and the expected results, the initial machining parameters are adjusted to obtain more precise target machining parameters. According to the target machining parameters, the actual throttling square hole machining of the valve sleeve is performed using the laser beam provided by the femtosecond laser. This achieves high-precision and high-efficiency machining of the throttling square hole in the valve sleeve, while reducing material waste and post-processing requirements. Furthermore, laser machining eliminates the need for the wire threading step before the slow wire machining in electrical discharge machining, reducing processing time and improving processing efficiency.

[0042] Based on the foregoing Figure 2 The technical solution described herein aims to achieve precision machining of the throttling square hole in the valve sleeve, such as... Figure 3As shown, control of the recast layer, diameter accuracy, positional accuracy and coplanarity, and radius (R-angle) of the valve sleeve square hole is required. Control of the recast layer utilizes the short pulse duration and low thermal accumulation effect of the femtosecond laser to prevent the formation of a recast layer during material processing. Diameter accuracy control involves adjusting initial processing parameters based on the deviation between simulation results and expected results to obtain more precise target processing parameters. These initial processing parameters include at least the femtosecond laser's emission power, focal length, R-angle of the valve sleeve square hole, and air blowing method. Positional accuracy and coplanarity control utilizes... Figure 1 The axis motion control system 105 in the machining system 100 shown uses the laser beam provided by the femtosecond laser to perform actual throttling square hole machining on the valve sleeve according to the target machining parameters, so as to achieve high precision and high efficiency machining of the throttling square hole of the valve sleeve.

[0043] Currently, the machining of the throttling square hole in valve sleeves mainly relies on electrical discharge machining (EDM), a type of electro-erosion machining that uses electrical sparks to remove material. However, during EDM or wire EDM, the high-temperature material surface melts and then rapidly solidifies to form a layer, known as the electro-erosion layer. Because this layer undergoes melting and re-solidification, its crystal structure and physical properties differ from the base material, leading to residual stress and cracks. Therefore, this can negatively impact the long-term service life of the valve sleeve.

[0044] For example, compared to electrical discharge machining (EDM), the control of the recast layer in the square hole of the valve sleeve employs ultrashort pulse laser processing. This method utilizes an ultrashort pulse laser provided by a femtosecond laser to process the valve sleeve. The processing principle relies on extremely high power density to directly break the molecular bonds of the material in a very short time, disrupting the micro-explosion mechanism of the surface material to achieve material removal. The process generates low heat energy, thus exhibiting minimal thermal effect, low heat diffusion, and strong material applicability, enabling nanoscale material removal. Compared to EDM, ultrashort pulse laser processing is a non-contact cold processing method, eliminating the formation of a remelted layer. Therefore, it offers high processing efficiency and greater freedom in selecting the material, shape, and size of the processed object, making it suitable for automated precision machining. It should be noted that the recast layer typically refers to the surface layer formed during laser cutting, laser welding, or other thermal processing when the material melts at high temperatures and then resolidifies during cooling.

[0045] In light of the advantages of ultrashort pulse lasers described above, see [link to relevant documentation]. Figure 4 The thermal effects of long-pulse laser processing shown Figure 5The schematic diagram of the thermal effects of ultrashort pulse laser processing illustrates that the process and results of long pulse laser processing differ significantly from those of ultrashort pulse laser processing. Specifically, long pulse laser processing refers to the technique of processing materials using long pulse laser beams. In long pulse laser processing, due to the longer pulse width, the interaction time between the laser and the material is longer, generating more heat and transferring it to the surrounding material, resulting in significant thermal effects. These thermal effects cause molten material to sputter from the molten zone, producing surface debris, a recast layer, and surface ripples and microcracks caused by shock waves, as well as damage to adjacent structures. Therefore, the heat-affected zone of long pulse laser processing is larger, affecting the microstructure and physical properties of the material.

[0046] Ultrashort pulse laser processing refers to the technology of processing materials using ultrashort pulse lasers, such as femtosecond lasers. With their extremely short pulse widths and high peak power, they can achieve a "cold processing" effect on materials. In this processing method, the material is directly converted into a plasma state, achieving material removal through ejection. The heat-affected zone is small, and the processing precision is high. Specifically, during ultrashort pulse laser processing, electrons absorb laser energy and are rapidly ionized, generating plasma or an electron beam. The material is then removed through the interaction between the plasma flow and the laser. This processing method has no molten zone, does not produce molten material, surface debris, or recast layers, and also produces no oscillation waves, thus avoiding microcracks and damage to critical structures. Furthermore, the resulting low thermal effects have minimal impact on the material, resulting in good processing quality. For example, to ensure no ablation, no residue, and satisfactory roughness, a femtosecond laser with an extremely short pulse width of 1030 nm and a pulse width of 250 fs is used. The lower pulse energy achieves extremely high peak power, largely avoiding the material melting and continuous evaporation phenomena caused by long-pulse-width, low-intensity lasers. Material removal relies on intermolecular Coulomb forces. Due to the ultrashort pulse duration of femtosecond laser processing, the heat accumulation effect is small, resulting in a very small heat-affected zone, which helps maintain the original properties of the material. Then, orthogonal correlation experiments were conducted on multiple parameters within several critical parameter ranges, including repetition rate, scanning speed, feed rate, and air blowing rate, to obtain the parameter combination that satisfies the requirements for roughness and no remelted layer.

[0047] Based on the aforementioned analysis of long-pulse laser processing and ultrashort-pulse laser processing, it is understandable that long-pulse laser processing technology, due to its strong thermal effect and poor processing quality, produces obvious heat-affected zones, recast layers, and microcracks, failing to meet the requirements of high-quality micro-hole processing. The significant thermal effect of long-pulse laser processing leads to thermal damage to the material surface and surrounding areas, such as expansion of the heat-affected zone and changes in material properties. Ultrashort-pulse laser processing, on the other hand, can significantly reduce thermal damage, achieving high-precision and high-quality micro-machining, and is particularly suitable for processing precision components and fragile materials. Therefore, compared to long-pulse laser processing, ultrashort-pulse laser processing allows for more precise control of the processing, reduces thermal impact, and provides higher processing quality, making it especially suitable for high-precision and high-requirement applications. Figure 6 The comparison of thermal effects between long-pulse laser processing and ultrashort-pulse laser processing is shown in the diagram. As indicated by the arrows, in ultrashort-pulse laser processing, the thermal effect increases sequentially for micro-holes with apertures of 60μm and 70μm using femtosecond (fs), picosecond (ps), and nanosecond (ns) lasers. Therefore, it can be concluded that femtosecond laser processing produces the least thermal effect and has the least impact on the material.

[0048] To meet the development requirements of high-precision square hole processing, in some examples, the valve sleeve is subjected to micro-hole simulation processing based on initial processing parameters. The initial processing parameters are then updated to obtain target processing parameters based on the deviation between the simulation results and the expected results. This process may include acquiring a 3D model of the throttling square hole in the valve sleeve to be processed, layering the 3D model using a beam scanning module, and determining the beam processing trajectory of the femtosecond laser in each layer based on the initial processing parameters; performing micro-hole simulation processing on the 3D model based on the beam processing trajectory to obtain the simulation results; and updating the initial processing parameters to obtain the target processing parameters based on the deviation between the simulation results and the expected results.

[0049] For the above example, specifically, exemplarily, such as Figure 1The beam scanning module 103 shown is a 5D programmable beam scanning module. The focused spot size of this module is 10-20 μm, the optical axis angle is ±7.5°, the single-pass processing area is 2.5 mm, the ultimate processing accuracy can reach ±1 μm, and the scanning speed reaches 600 Hz. First, a precise 3D model of the valve sleeve throttling square hole to be processed is obtained using 3D modeling software, providing necessary geometric information for subsequent simulation processing. Then, the 5D programmable beam scanning module precisely layers the 3D model, with each layer representing a processing height, and the beam processing trajectory of the femtosecond laser in each layer is planned based on the initial processing parameters. Next, micro-hole simulation processing is performed on the 3D model according to the beam processing trajectory, generating simulation processing results. Finally, the deviation between the simulation processing results and the expected target is compared, and the initial processing parameters are adjusted and optimized accordingly to determine the final target processing parameters, ensuring processing accuracy and efficiency.

[0050] In some examples, the femtosecond laser includes an emission module, and the initial processing parameters include the blowing method and the emission power of the emission module; the three-dimensional model is subjected to micro-hole simulation processing based on the beam processing trajectory to obtain the simulation processing results, which may include determining the emission power of the emission module corresponding to each position in the beam processing trajectory; the three-dimensional model is subjected to micro-hole simulation processing based on the beam processing trajectory, emission power and blowing method to obtain the simulation processing results.

[0051] Specifically, in the example above, the femtosecond laser's emission module is first configured, and its emission power and air blowing method are adjusted as initial processing parameters. The emission power controls the laser's energy output, while the air blowing method helps control material removal and cooling during the processing. Based on the model data for each layer and the initial processing parameters, the femtosecond laser's beam processing trajectory in each layer is determined, ensuring the accuracy and consistency of the beam processing trajectory. Using simulation software, micro-hole simulation processing is performed on the 3D model according to the determined beam processing trajectory to simulate the actual processing process and obtain the simulation processing results.

[0052] For example, see Figure 7This disclosure illustrates a laser processing optical path diagram. Specifically, a femtosecond laser with a wavelength of 1030 nm, a pulse width of 250 fs, a beam quality M² less than 1.2, and an exit spot circularity greater than 98% is used as the light source. The beam undergoes shaping, homogenization, beam expansion, and collimation before entering the 5D programmable beam scanning module in a collimated optical path. More specifically, the exit spot of the femtosecond laser is detected and its beam attitude is adjusted by a 45° reflector before entering the beam expander coaxially and collimated. By adjusting the magnification and divergence angle of the beam expander, the reflected light generated after the spot size is magnified 2-3 times is collimated and propagates. Stray light of non-specific wavelengths is filtered out by reflective and absorptive filters. The linearly polarized light is converted to circularly polarized light by a quarter-wave plate before entering the 5D programmable beam scanning module. Based on the 5D programmable beam scanning module and other methods... Figures 8 to 10 The diagram shows a schematic of any beam processing trajectory filling. Simulation processing of the valve sleeve throttling square hole is performed, and normal and Z-axis positioning corrections are achieved using a charge-coupled device (CCD) camera and a laser rangefinder. Material is removed through layer-by-layer feeding, and a hole-making process is developed that meets the requirements for aperture accuracy and hole shape by controlling multiple process parameters such as laser power, scanning speed, feed method, feed amount, defocus position, and repetition frequency. Figures 8 to 10 The schematic diagram of the optical path processing trajectory filling shown illustrates that filling with equally spaced spiral lines can ensure the consistency of the hole removal effect.

[0053] It should be noted that after the 5D programmable beam scanning module is configured, a CCD camera and a laser rangefinder are used for positioning correction. The CCD camera captures images of the valve sleeve, and image processing technology is used to identify feature points of the valve sleeve to achieve precise positioning. The laser rangefinder measures the distance from the valve sleeve surface to the laser beam, ensuring that the laser beam is perpendicular to the valve sleeve surface (normal positioning). During processing, the distance between the valve sleeve and the laser beam is monitored in real time, and the Z-axis position is adjusted to ensure that the laser beam is always focused at the same depth on the valve sleeve (Z-axis positioning correction).

[0054] Material removal via layer-by-layer feeding is a process that allows for precise control of material removal, ensuring hole diameter accuracy and surface quality. Specifically, after importing the 3D model into a 5D programmable beam scanning module, the model is sliced ​​and layered, with each layer representing a processing height. On each layer, the laser beam scans along a predetermined processing trajectory, removing material and forming a portion of the hole. After each layer is completed, the worktable or valve sleeve moves along the Z-axis to the next layer, repeating the feeding process until the entire hole is machined.

[0055] Furthermore, during processing, a proper air blowing method helps reduce heat accumulation in the processing area and prevents the expansion of the heat-affected zone, thereby controlling the thermal effect. In addition, the effective application of air blowing can improve material removal efficiency, reduce slag and spatter during processing, and improve processing quality. High-precision machining of the valve sleeve throttling square hole is achieved by precisely controlling the emission power of the femtosecond laser and the air blowing method. Through simulation processing and result analysis, the processing effect can be predicted and optimized before actual processing, reducing trial-and-error costs and improving processing efficiency.

[0056] To control the radius (R) angle of the square hole in the valve sleeve, in some examples, the femtosecond laser includes a focusing module, and the initial processing parameters also include the focal length of the focusing module. Micro-hole simulation processing is performed on the 3D model based on the beam processing trajectory to obtain the simulation processing result. This may include adjusting the focal length of the focusing module by comparing the R angle in the simulation processing result with the R angle in the expected result, where the R angle is the inner and / or outer arc angle of the valve sleeve hole. Micro-hole simulation processing is performed on the 3D model based on the beam processing trajectory, focal length, and air blowing method to obtain the simulation processing result.

[0057] Specifically, in the above example, firstly, the initial processing parameters of the femtosecond laser are determined, including the air blowing method, the emission power of the emission module, and the focal length of the focusing module. The 3D model is then layered using a beam scanning module, and the beam processing trajectory of the femtosecond laser in each layer is determined based on the initial processing parameters. Micro-hole simulation processing is performed on the 3D model according to the beam processing trajectory to obtain the simulation processing results. The radius (R) angle in the simulation processing results is compared with the expected R angle, and the focal length of the focusing module is adjusted to optimize the processing effect of the inner and / or outer arc angles of the valve sleeve throttling square hole. For example, the main factors affecting the R angle are the laser power and the focal length of the focusing lens. Generally, the shorter the focal length of the focusing lens, the smaller the focal diameter, and the smaller the R angle of the processed hole. Therefore, using a 60mm focusing lens with a shorter focal length can effectively reduce the hole R angle, such as... Figure 11 As shown, the focal diameter of the left focusing lens is larger than that of the right focusing lens. Using a focusing lens with a shorter focal length and combining it with multi-parameter control can achieve a machining hole radius (R-angle) of less than 0.02mm in valve sleeve machining. Micro-hole machining simulation is performed on the 3D model based on the beam machining trajectory, focal length, and air blowing method to obtain simulation results. The machining parameters are then further optimized based on the results.

[0058] As illustrated in the preceding example, the ultrashort pulse duration and ultra-high peak power of the femtosecond laser induce a nonlinear absorption effect in the material, resulting in a focal spot with a size far smaller than the diffraction limit, thus significantly improving the spatial resolution of the processing. Because the pulse duration of the femtosecond laser is much shorter than the thermal relaxation time, almost no heat is generated during processing, commonly known as "cold" processing, avoiding overheating cracking, oxidation, melting, and other phenomena, significantly improving processing quality. After being focused, the femtosecond laser pulse can form a micrometer-scale focal spot with an extremely high peak energy density in the central region, directly breaking the chemical bonds between atoms in the material and achieving material removal. By adjusting the laser incident angle in real time, the hole taper can be precisely controlled, enabling the processing of microholes with no taper or negative taper, significantly improving the installation accuracy, positioning, and assembly accuracy of parts, and enhancing microfluidic flow efficiency. In summary, this implementation method, through precise control of the femtosecond laser parameters and the air blowing method, combined with simulation optimization, achieves high-precision and high-efficiency processing of the valve sleeve throttling square hole, while reducing material waste and post-processing requirements, improving product quality and performance.

[0059] In some examples, updating the initial machining parameters to obtain the target machining parameters based on the deviation between the simulated machining results and the expected results may include performing square hole simulation machining on the valve sleeve based on the initial machining parameters to obtain a simulated valve sleeve throttling square hole; or updating the initial machining parameters to obtain the target machining parameters based on the deviation between the simulated valve sleeve throttling square hole and the standard valve sleeve throttling square hole.

[0060] In some examples, the valve sleeve is simulated to obtain a throttling square hole based on the initial machining parameters. This includes constructing a multi-parameter control model based on the relationship between the orthogonal correlation experimental results and the simulation machining results of the initial machining parameters; and performing square hole machining on the valve sleeve based on the multi-parameter control model to obtain a throttling square hole for the simulated valve sleeve.

[0061] For the example above, firstly, initial processing parameters for the femtosecond laser are set, such as laser power, scanning speed, feed method, defocus position, air blowing method, and focal length of the focusing module. Based on the relationship between the orthogonal correlation experimental results and the simulated processing results of the initial processing parameters, a multi-parameter control model is constructed. This multi-parameter control model considers the influence of multiple parameters, including laser power, repetition frequency, defocus amount, scanning speed, and number of scans, on the processing results. Using the constructed multi-parameter control model, a square hole is simulated for the valve sleeve to obtain the simulated throttling square hole. Based on the deviation between the simulation results and the standard, the initial processing parameters, such as the focal length, are adjusted to optimize the processing effect of the square hole in the valve sleeve, thereby obtaining the target processing parameters. This step requires multiple iterations until the simulated processing results meet the design requirements.

[0062] The control of the coplanarity and positional accuracy of the square hole in the valve sleeve is achieved by, for example... Figure 1The axis motion control system 105 shown in the diagram completes the control. Specifically, it determines the axis accuracy clamping and positioning method of the five-axis machine tool and the consistency of the hole diameter during machining through the axis motion control system 105. In some examples, based on the target machining parameters, a square hole is machined on the valve sleeve using a laser beam provided by a femtosecond laser to obtain the target valve sleeve throttling square hole. This may include acquiring the valve sleeve to be machined and fixing it on the machine tool; using a camera to extract a positioning template for automatic positioning of the valve sleeve to be machined, and obtaining the focal position of the valve sleeve to be machined on a distance sensor through coordinate transformation; inputting the target machining parameters to the control module of the machine tool, and using the laser beam provided by the femtosecond laser to complete the machining of the valve sleeve to be machined based on the focal position to obtain the target valve sleeve throttling square hole.

[0063] In the above example, specifically, the repeatability of the linear axis of the five-axis machine tool is less than 0.005 mm, and the repeatability of the rotary axis is less than 20 arcseconds. The fixture uses a custom valve sleeve mandrel with blind holes machined on its axial surface for slag removal and anti-wall-alignment purposes. The clamping gap between the positioning surfaces at both ends and the inner wall of the valve sleeve is less than 0.01 mm, which is close to a tight fit. After the valve sleeve to be processed is installed on the mandrel, it is locked with a nut and installed on the five-axis machine tool. The installation position of the valve sleeve is adjusted using a dial indicator to ensure that the runout between the valve sleeve and the C-axis is within two micrometers. After clamping, a high-precision camera is first used to extract the positioning template and automatically position the valve sleeve to be processed. Then, the focal position is found under the range sensor through coordinate transformation. Finally, the micro-hole processing is completed under the beam scanning device. Since the holes to be processed on each row are axially symmetrically distributed, they are processed by rotating 180 degrees.

[0064] Through the above example, a high-precision camera is used to automatically position the valve sleeve to be processed. Precise initial positioning is achieved by extracting a positioning template, quickly and effectively acquiring the position information of the valve sleeve to be processed, providing accurate reference for subsequent processing. Coordinate transformation is used to find the focal point under the guidance of a range sensor, ensuring that the laser beam accurately acts on the predetermined position of the valve sleeve to be processed. This step requires precise calibration and transformation algorithms, involving the transformation from the camera coordinate system to the processing coordinate system. Using a high-precision camera and range sensor in conjunction with precise coordinate transformation algorithms can significantly improve processing accuracy and flexibly meet the processing requirements of valve sleeves of different shapes and sizes, enhancing the adaptability and flexibility of the processing process. Precise control of the laser beam's processing trajectory and parameters, under the beam scanning module, utilizes the laser beam provided by a femtosecond laser to complete the throttling square hole processing of the valve sleeve to be processed. This reduces the heat-affected zone and material deformation during processing, improving processing quality. In the processing of the throttling square hole in the valve sleeve, it can reduce the roughness of the hole wall and the heat-affected zone. The 180-degree rotation processing method can reduce processing time and complexity, and can significantly improve processing efficiency when processing valve sleeves with high symmetry requirements.

[0065] Based on the same inventive concept as the aforementioned technical solution, see [link to inventive concept]. Figure 12 This disclosure illustrates a laser-based valve sleeve throttling square hole processing apparatus 1200. The processing apparatus 1200 may include an acquisition section 1201, a simulation section 1202, and a processing section 1203, wherein...

[0066] Acquisition section 1201 is configured to acquire initial processing parameters related to the femtosecond laser;

[0067] The simulation section 1202 is configured to perform micro-hole simulation machining on the valve sleeve based on the initial machining parameters, and update the initial machining parameters to obtain the target machining parameters based on the deviation between the simulation machining results and the expected results.

[0068] The machining section 1203 is configured to use a laser beam provided by a femtosecond laser to machine a square hole in the valve sleeve according to the target machining parameters to obtain the target valve sleeve throttling square hole.

[0069] In some examples, simulation section 1202 is configured as follows:

[0070] A three-dimensional model of the throttling square hole of the valve sleeve to be processed is obtained. The three-dimensional model is layered by the beam scanning module, and the beam processing trajectory of the femtosecond laser in each layer is determined according to the initial processing parameters.

[0071] Micro-hole simulation processing is performed on the 3D model based on the beam processing trajectory to obtain the simulation processing results;

[0072] Based on the deviation between the simulation results and the expected results, the initial processing parameters are updated to obtain the target processing parameters.

[0073] In some examples, simulation section 1202 is configured as follows:

[0074] Determine the emission power of the emission module at each position in the beam processing trajectory;

[0075] Micro-hole simulation processing is performed on the 3D model based on the beam processing trajectory, emission power, and air blowing method to obtain the simulation processing results.

[0076] In some examples, simulation section 1202 is configured as follows:

[0077] Based on the comparison between the R-angle in the simulation processing results and the R-angle in the expected results, the focal length of the focusing module is adjusted, where the R-angle is the inner arc angle and / or outer arc angle of the valve sleeve hole.

[0078] Micro-hole simulation processing is performed on the 3D model based on the beam processing trajectory, focal length, and air blowing method to obtain the simulation processing results.

[0079] In some examples, machining section 1203 is configured as follows:

[0080] Obtain the valve sleeve to be processed and fix it on the machine tool;

[0081] A positioning template is extracted using a camera to automatically position the valve sleeve to be processed, and the focal position of the valve sleeve to be processed is obtained on the ranging sensor through coordinate transformation;

[0082] The target machining parameters are input into the control module of the machine tool, and the laser beam provided by the femtosecond laser is used to process the valve sleeve to be processed according to the focal position to obtain the target valve sleeve throttling square hole.

[0083] In some examples, simulation section 1202 is configured as follows:

[0084] Based on the initial machining parameters, the valve sleeve is simulated to obtain the simulated valve sleeve throttling square hole.

[0085] Based on the deviation between the simulated valve sleeve throttling square hole and the standard valve sleeve throttling square hole, the initial machining parameters are updated to obtain the target machining parameters.

[0086] In some examples, simulation section 1202 is configured as follows:

[0087] Based on the relationship between the orthogonal correlation experimental results and the simulation results of the initial processing parameters, a multi-parameter control model is constructed.

[0088] The valve sleeve is machined with a square hole according to the multi-parameter control model to obtain the simulated valve sleeve throttling square hole.

[0089] It is understood that the exemplary technical solution of the laser-based valve sleeve throttling square hole processing device 1200 described above belongs to the same concept as the aforementioned laser-based valve sleeve throttling square hole processing method. Therefore, all details not described in detail in the technical solution of the laser-based valve sleeve throttling square hole processing device 1200 can be found in the description of the aforementioned laser-based valve sleeve throttling square hole processing method. This disclosure will not elaborate further on these details.

[0090] Please refer to Figure 13This illustration shows a schematic diagram of the hardware structure of a computing device provided in an exemplary embodiment of this disclosure. In some examples, the computing device can be at least one of devices such as a smartphone, smartwatch, desktop computer, laptop, virtual reality terminal, augmented reality terminal, wireless terminal, and laptop computer. The computing device has communication functions and can access wired or wireless networks. The computing device can refer to one of multiple terminals; those skilled in the art will understand that the number of such terminals can be more or less. In some examples, the computing device can receive data from a satellite fault diagnosis method based on wavelet convolution based on the accessed wired or wireless network. It is understood that the computing device undertakes the computation and processing work of the technical solution of this disclosure, and this disclosure does not limit it in this regard.

[0091] like Figure 13 As shown, the computing device in this disclosure may include one or more of the following components: processor 1310 and memory 1320.

[0092] Optionally, the processor 1310 connects various parts within the computing device using various interfaces and lines, and performs various functions and processes data by running or executing instructions, programs, code sets, or instruction sets stored in the memory 1320, and by calling data stored in the memory 1320. Optionally, the processor 1310 can be implemented using at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). The processor 1310 can integrate one or a combination of several of the following: Central Processing Unit (CPU), Graphics Processing Unit (GPU), Neural-network Processing Unit (NPU), and baseband chip. The CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the content required to be displayed on the touch screen; the NPU is used to implement Artificial Intelligence (AI) functions; and the baseband chip is used to handle wireless communication. It is understandable that the aforementioned baseband chip may not be integrated into the processor 1310, but may be implemented using a separate chip.

[0093] The memory 1320 may include random access memory (RAM) or read-only memory (ROM). Optionally, the memory 1320 may include a non-transitory computer-readable storage medium. The memory 1320 may be used to store instructions, programs, code, code sets, or instruction sets. The memory 1320 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as touch function, sound playback function, image playback function, etc.), instructions for implementing the various method embodiments described above, etc.; the data storage area may store data created according to the use of the computing device, etc.

[0094] In addition, those skilled in the art will understand that the structure of the computing device shown in the above figures does not constitute a limitation on the computing device. The computing device may include more or fewer components than shown, or combine certain components, or have different component arrangements. For example, the computing device may also include a display screen, camera assembly, microphone, speaker, radio frequency circuit, input unit, sensors (such as accelerometer, angular velocity sensor, fiber optic sensor, etc.), audio circuit, WiFi module, power supply, Bluetooth module, etc., which will not be described in detail here.

[0095] This disclosure also provides a computer-readable storage medium storing at least one instruction, which is executed by a processor to implement the laser-based valve sleeve throttling square hole processing method of the various embodiments described above.

[0096] This disclosure also provides a computer program product including computer instructions stored in a computer-readable storage medium; a processor of a computing device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computing device to perform the laser-based valve sleeve throttling square hole processing method of the various embodiments described above.

[0097] Those skilled in the art will recognize that the functions described in this disclosure in one or more of the foregoing examples can be implemented using hardware, software, firmware, or any combination thereof. When implemented in software, these functions can be stored in a computer-readable medium or transmitted as one or more instructions or code on a computer-readable medium. Computer-readable media include computer-readable storage media and communication media, wherein communication media include any medium that facilitates the transfer of a computer program from one place to another. A readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0098] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A laser-based method for machining a valve sleeve throttling square hole, characterized in that, The processing method includes: Obtain the initial processing parameters related to the femtosecond laser; The valve sleeve is subjected to micro-hole simulation machining based on the initial machining parameters, and the initial machining parameters are updated according to the deviation between the simulation machining results and the expected results to obtain the target machining parameters. According to the target processing parameters, the valve sleeve is processed with a square hole using a laser beam provided by a femtosecond laser to obtain the target valve sleeve throttling square hole; The process of performing micro-orifice simulation machining on the valve sleeve based on the initial machining parameters, and updating the initial machining parameters to obtain the target machining parameters according to the deviation between the simulation machining results and the expected results, includes: A three-dimensional model of the throttling square hole of the valve sleeve to be processed is obtained. The three-dimensional model is layered by a beam scanning module, and the beam processing trajectory of the femtosecond laser in each layer is determined according to the initial processing parameters. The three-dimensional model is subjected to micro-hole simulation processing based on the beam processing trajectory to obtain the simulation processing results; Based on the deviation between the simulation processing results and the expected results, the initial processing parameters are updated to obtain the target processing parameters; The femtosecond laser includes a focusing module, and the initial processing parameters also include the air blowing method and the focal length of the focusing module; the process of performing micro-hole simulation processing on the three-dimensional model according to the beam processing trajectory to obtain the simulation processing results includes: Based on the comparison between the R-angle in the simulation processing results and the R-angle in the expected results, the focal length of the focusing module is adjusted, wherein the R-angle is the inner arc angle and / or outer arc angle of the valve sleeve hole. The three-dimensional model is subjected to micro-hole simulation processing based on the beam processing trajectory, the focal length, and the air blowing method to obtain the simulation processing results.

2. The processing method according to claim 1, characterized in that, The femtosecond laser includes an emission module, and the initial processing parameters include the emission power of the emission module; the process of performing micro-hole simulation processing on the three-dimensional model according to the beam processing trajectory to obtain simulation processing results includes: Determine the emission power of the emission module corresponding to each position in the beam processing trajectory; The three-dimensional model is subjected to micro-hole simulation processing based on the beam processing trajectory, the emission power, and the air blowing method to obtain the simulation processing results.

3. The processing method according to claim 1, characterized in that, The step of machining a square hole in the valve sleeve using a laser beam provided by a femtosecond laser according to the target machining parameters to obtain the target valve sleeve throttling square hole includes: Obtain the valve sleeve to be processed and fix the valve sleeve to be processed on the machine tool; The camera is used to extract the positioning template to automatically position the valve sleeve to be processed, and the focal position of the valve sleeve to be processed is obtained on the ranging sensor through coordinate transformation. The target machining parameters are input to the control module of the machine tool, and the laser beam provided by the femtosecond laser is used to process the valve sleeve to be processed according to the focal position to obtain the target valve sleeve throttling square hole.

4. The processing method according to claim 1, characterized in that, The processing method further includes: Based on the initial machining parameters, the valve sleeve is simulated to obtain a simulated valve sleeve throttling square hole. Based on the deviation between the simulated valve sleeve throttling square hole and the standard valve sleeve throttling square hole, the initial machining parameters are updated to obtain the target machining parameters.

5. The processing method according to claim 4, characterized in that, The step of performing square hole simulation machining on the valve sleeve based on the initial machining parameters to obtain a simulated valve sleeve throttling square hole includes: Based on the relationship between the orthogonal correlation experimental results and the simulation results of the initial processing parameters, a multi-parameter control model is constructed. The valve sleeve is machined with a square hole according to the multi-parameter control model to obtain a simulated valve sleeve throttling square hole.

6. A laser-based valve sleeve throttling square hole processing device, characterized in that, The processing apparatus is used to perform the steps of the laser-based valve sleeve throttling square hole processing method as described in any one of claims 1 to 5, the processing apparatus comprising: an acquisition section, a simulation section, and a processing section, wherein... The acquisition section is configured to acquire initial processing parameters related to the femtosecond laser. The simulation part is configured to perform micro-hole simulation processing on the valve sleeve based on the initial processing parameters, and update the initial processing parameters to obtain the target processing parameters according to the deviation between the simulation processing results and the expected results; The processing section is configured to use a laser beam provided by a femtosecond laser to process a square hole in the valve sleeve according to the target processing parameters to obtain a target valve sleeve throttling square hole. The simulation section is also configured to acquire a three-dimensional model of the throttling square hole of the valve sleeve to be processed, and to divide the three-dimensional model into layers through a beam scanning module, and to determine the beam processing trajectory of the femtosecond laser in each layer of the model according to the initial processing parameters. The three-dimensional model is subjected to micro-hole simulation processing based on the beam processing trajectory to obtain the simulation processing results; Based on the deviation between the simulation processing results and the expected results, the initial processing parameters are updated to obtain the target processing parameters; The femtosecond laser includes a focusing module, and the initial processing parameters also include the air blowing method and the focal length of the focusing module; the focal length of the focusing module is adjusted by comparing the R-angle in the simulation processing result with the R-angle in the expected result, wherein the R-angle is the inner arc angle and / or outer arc angle of the valve sleeve hole; and the three-dimensional model is subjected to micro-hole simulation processing according to the beam processing trajectory, the focal length and the air blowing method to obtain the simulation processing result.

7. A computing device, characterized in that, The computing device includes a processor and a memory; the processor is used to execute instructions stored in the memory to implement the laser-based valve sleeve throttling square hole processing method as described in any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores at least one instruction, which is executed by a processor to implement the laser-based valve sleeve throttling square hole machining method as described in any one of claims 1 to 5.

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