Crystal ingot shaping processing equipment

Abstract

The invention relates to crystal ingot shaping processing equipment, and relates to the technical field of semiconductor manufacturing. Comprising a headstock, a headstock workpiece clamping module, a tailstock workpiece clamping module, a tailstock and a grinding carriage rotary table module, the headstock workpiece clamping module is installed at one end of the headstock, the tailstock workpiece clamping module is installed at one end of the tailstock, and the tailstock workpiece clamping module and the headstock workpiece clamping module are oppositely arranged and used for clamping, positioning and clamping crystal ingot workpieces; the crystal orientation detector is arranged on one side of the headstock workpiece clamping module and is used for detecting the crystal orientation of the crystal ingot workpiece and outputting a detection result; the grinding carriage rotary table module is arranged on one side of the tailstock workpiece clamping module and used for adjusting the machining angle of the crystal ingot workpiece. An end face grinding wheel module, an outer circle grinding wheel module and a slotting grinding wheel module are installed on the grinding wheel frame rotary table module and used for machining a crystal ingot workpiece. The processing precision and the equipment compatibility are improved, diversified processing requirements can be met, and the overall level of the crystal ingot processing link in the semiconductor manufacturing process is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a crystal ingot shaping processing equipment. Background Art

[0002] At a time when the semiconductor industry is booming, the processing link from ingot to wafer is the key foundation for determining the quality and performance of semiconductor products. However, existing ingot processing technologies generally have problems such as inaccurate positioning, inefficient crystal orientation detection and angle adjustment, lack of flexibility in processing technology, and poor equipment compatibility. These defects directly affect the processing quality and production efficiency of wafers, increase the scrap rate, and fail to meet the market's requirements for high precision, high efficiency, and diversification.

[0003] Positioning accuracy problem: The traditional method of fixing and positioning the ingot makes it difficult to ensure that the ingot is always in the precise position during the processing. Whether in the initial clamping stage or in the subsequent complex processing steps, the slight displacement of the ingot may lead to dimensional deviation and quality defects of the final product.

[0004] Defects in crystal orientation detection and angle adjustment: Existing crystal orientation detection methods are often inefficient and cannot quickly and accurately obtain the crystal orientation information of the ingot. At the same time, angle adjustment based on the detection results mostly relies on manual experience and judgment, which is not only time-consuming and labor-intensive, but also difficult to ensure accuracy. This makes it impossible for the ingot to be at the optimal processing angle when entering the subsequent processing steps, seriously affecting the processing quality and efficiency.

[0005] Insufficient processing flexibility: With the increasing diversification of semiconductor market demand, customers' requirements for ingot processing are no longer limited to conventional cutting and grinding. However, the existing processing technology is difficult to quickly respond to customers' special needs, such as ingot processing of special materials, customized wafers with complex structures, etc., which limits the competitiveness of enterprises in the market.

[0006] Poor equipment compatibility: Ingots of different specifications differ in size, material properties, etc., and most traditional ingot processing equipment can only process ingots of a single specification. This means that if an enterprise wants to process ingots of multiple specifications, it needs to purchase multiple sets of equipment, which not only increases equipment costs, but also takes up a lot of production space and reduces production efficiency. Summary of the invention

[0007] In order to solve at least one technical problem in the background technology, the present invention provides a crystal ingot shaping processing equipment, which improves the processing accuracy and equipment compatibility, can meet diversified processing needs, and improve the overall level of the crystal ingot processing link in the semiconductor manufacturing process.

[0008] To achieve the above-mentioned purpose, the present invention provides a crystal ingot shaping processing equipment, including: a head frame, a head frame workpiece clamping module, a tail frame workpiece clamping module, a tail frame, a grinding wheel frame turntable module and a crystal orientation detector, wherein the head frame workpiece clamping module is installed at one end of the head frame, and the tail frame workpiece clamping module is installed at one end of the tail frame, and the tail frame workpiece clamping module is arranged relative to the head frame workpiece clamping module, and is used for clamping, positioning and clamping the crystal ingot workpiece; the crystal orientation detector is arranged on one side of the head frame workpiece clamping module, and is used for detecting the crystal orientation of the crystal ingot workpiece and outputting the detection result; the grinding wheel frame turntable module is arranged on one side of the tail frame workpiece clamping module, and is used for adjusting the processing angle of the crystal ingot workpiece; the grinding wheel frame turntable module is installed with an end grinding wheel module, an outer cylindrical grinding wheel module and a slotting grinding wheel module, and different processes are respectively performed on the crystal ingot workpiece.

[0009] Furthermore, it also includes a slicing module, which is arranged at one end of the headstock away from the tailstock workpiece clamping module.

[0010] Furthermore, the slicing module uses an electric spark, a diamond wire module or a water-conducting laser module to cut the ingot workpiece.

[0011] Furthermore, the head frame is mounted on a head frame mounting base plate, and the head frame mounting base plate is mounted on a head frame rotating base.

[0012] Further, the tailstock is mounted on a tailstock mounting base plate, and the tailstock mounting base plate is mounted on a tailstock base.

[0013] Furthermore, the grinding wheel frame turntable module is installed on the grinding wheel frame moving X-axis slide, and the grinding wheel frame moving X-axis slide is installed on the grinding wheel frame moving Z-axis slide.

[0014] The beneficial effects of the present invention are:

[0015] The present invention provides a method and device for processing a crystal ingot into a wafer, which integrates high-precision positioning, efficient crystal orientation detection and angle adjustment, flexible processing technology and wide equipment compatibility. By adopting special workpiece clamping module clamping, vacuum adsorption positioning, rotation angle evaluation, modular design and other technical means, the processing accuracy and equipment compatibility are improved, and it can meet diversified processing needs to improve the overall level of the crystal ingot processing link in the semiconductor manufacturing process, thereby improving the processing accuracy and reducing the scrap rate; enhancing equipment compatibility and being adaptable to crystal ingots of various specifications; through flexible modular design, meeting the diverse needs of customers; improving production efficiency and product quality, and enhancing market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional schematic diagram of the present invention Figure 1 ;

[0017] Figure 2 It is a three-dimensional schematic diagram of the present invention Figure 2 ;

[0018] Figure 3 It is a front view of the present invention;

[0019] Figure 4 This is a working status diagram of the slicing module of the present invention.

[0020] In the figure: 1-slicing module, 2-headstock, 3-headstock workpiece clamping module, 4-ingot workpiece, 5-tailstock workpiece clamping module, 6-grinding wheel frame turntable module, 7-tailstock, 8-end grinding wheel module, 9-external cylindrical grinding wheel module, 10-slotting grinding wheel module, 11-headstock rotating base, 12-headstock mounting base plate, 13-tailstock base, 14-crystal direction detector, 15-tailstock mounting base plate, 16-grinding wheel frame moving Z-axis slide, 17-grinding wheel frame moving X-axis slide. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0023] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0024] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0025] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0026] To achieve the above purpose, Figure 1-3 As shown, the present invention provides a crystal ingot shaping processing equipment, including: a head frame 2, a head frame workpiece clamping module 3, a tail frame workpiece clamping module 5, a tail frame 7, a grinding wheel frame turntable module 6 and a crystal direction detector 14, the head frame workpiece clamping module 3 is installed at one end of the head frame 2, the tail frame workpiece clamping module 5 is installed at one end of the tail frame 7, the tail frame workpiece clamping module 5 and the head frame workpiece clamping module 3 are arranged opposite to each other, and are used for clamping, positioning and clamping the crystal ingot workpiece 4; the crystal direction detector 14 is arranged on one side of the head frame workpiece clamping module 3, and is used for detecting the crystal direction of the crystal ingot workpiece 4 and outputting the detection result; the grinding wheel frame turntable module 6 is arranged on one side of the tail frame workpiece clamping module 5, and is used for adjusting the processing angle of the crystal ingot workpiece 4; the grinding wheel frame turntable module 6 is installed with an end grinding wheel module 8, an outer cylindrical grinding wheel module 9 and a slotting grinding wheel module 10, which respectively perform different processes on the crystal ingot workpiece 4. It also includes a slicing module 1, which is arranged at one end of the headstock 2 away from the tailstock workpiece clamping module 5. Figure 4 The slicing module 1 can use an electric spark, a diamond wire module or a water-conducting laser module to cut the ingot workpiece 4, thereby meeting special order requirements for processing the ingot workpiece 4.

[0027] The present invention aims to solve the problems of inaccurate positioning, inefficient crystal orientation detection and angle adjustment, lack of flexibility in processing technology, and poor equipment compatibility in existing crystal ingot processing technology. During the processing, the crystal ingot workpiece 4 is first fixed on the vacuum adsorption plate of the headstock workpiece clamping module 3 for positioning, and then the crystal ingot workpiece 4 is clamped by the working head, and the end face grinding wheel module 8 is used to perform preliminary grinding on the end face of the crystal ingot workpiece 4 using the outer diameter clamping capacity. After the preliminary grinding of the end face of the crystal ingot, the crystal orientation is detected by X-ray XRD in the crystal orientation detector 14. Based on the detected crystal orientation data, the angle to be rotated is comprehensively evaluated with the help of an intelligent algorithm, and then the headstock rotating base 11 is automatically rotated to the angle. Afterwards, according to the requirements of the process and process parameters, end face grinding, outer cylindrical grinding and slotting grinding are performed successively. During outer cylindrical grinding and slotting grinding, the outer cylindrical clamping mode of the workpiece head is changed to suction cup clamping. The tailstock is moved to install the base plate 13, and the workpiece is clamped by the tailstock workpiece clamping module 5 to grind the other end face of the workpiece. In response to the diverse needs of customers, the present invention has strong customization capabilities. The EDM and diamond wire modules can be equipped for ingot cutting. If the customer has special order requirements, the water-guided laser module can be equipped. This module can accurately realize the laser cutting of ingots according to the customer's specific requirements for ingot processing, meeting the different processing needs of customers. The present invention is suitable for the processing of ingots of various specifications, and has a modular design to improve compatibility and flexibility.

[0028] To further optimize the technical solution, the head frame 2 is mounted on a head frame mounting base plate 12 , and the head frame mounting base plate 12 is mounted on a head frame rotating base 11 .

[0029] To further optimize the technical solution, the tailstock 7 is mounted on a tailstock mounting base plate 15 , and the tailstock mounting base plate 15 is mounted on a tailstock base 13 .

[0030] To further optimize the technical solution, the grinding wheel frame turntable module 6 is installed on the grinding wheel frame moving X-axis slide 17, and the grinding wheel frame moving X-axis slide 17 is installed on the grinding wheel frame moving Z-axis slide 16.

[0031] The present invention provides a method and equipment for processing ingots into wafers that integrates high-precision positioning, efficient crystal orientation detection and angle adjustment, flexible processing technology, and wide equipment compatibility. By adopting special workpiece clamping module clamping, vacuum adsorption positioning, evaluation of rotation angle, modular design and other technical means, the processing accuracy and equipment compatibility are improved, which can meet the diversified processing needs and improve the overall level of ingot processing in the semiconductor manufacturing process. Thereby, the processing accuracy can be improved and the scrap rate can be reduced; the equipment compatibility can be enhanced, and various specifications of ingots can be adapted; through flexible modular design, the diversified needs of customers can be met; production efficiency and product quality can be improved, and market competitiveness can be enhanced.

[0032] The working principle of the present invention is as follows:

[0033] Ingot fixing and preliminary processing:

[0034] The outer centering chuck of the headstock workpiece clamping module 3 is used to clamp the outer circle of the ingot workpiece 4, so as to achieve the initial centering of the ingot workpiece 4; at the same time, the vacuum suction cup set at the center of the chuck is activated to firmly absorb the end face of the ingot workpiece 4, thereby ensuring that the ingot workpiece 4 remains stable during the subsequent processing. The end face grinding wheel module 8 is used to perform a rough grinding operation on the end face of the ingot workpiece 4, providing a suitable detection basis for the subsequent crystal orientation detection process.

[0035] Crystal orientation detection and angle adjustment: Use the crystal orientation detector 14 X-ray XRD to detect the crystal orientation, and automatically adjust the angle of the headstock rotating base 11 according to the detection result, so that the crystal orientation of the ingot workpiece 4 is consistent with the radial direction of the end grinding wheel module 8.

[0036] Composite processing: The headstock workpiece clamping module 3 clamps the outer cylindrical surface of the ingot workpiece 4, and the end face grinding wheel module 8 performs fine grinding on the end face of the ingot workpiece 4; after the fine grinding is completed, the centering clamping claws of the headstock workpiece clamping module 3 are loosened and retracted, the tailstock 7 is moved, and the flexible pressure plate at the spindle center of the tailstock workpiece clamping module 5 extends outward to press against the end face of the ingot workpiece 4 on the headstock 2, the grinding wheel frame turntable module 6 is rotated, and the outer cylindrical grinding wheel module 9 is selected to grind the outer cylindrical surface of the ingot workpiece 4; the grinding wheel frame turntable module 6 is rotated, and the slotting grinding wheel module 10 is selected to grind The notch of the ingot workpiece 4 is removed, and the tailstock mounting base plate 15 is moved to make the vacuum suction cup of the tailstock workpiece clamping module 5 contact with the end face of the ingot workpiece 4 to adsorb the ingot workpiece 4; the vacuum suction cup of the headstock workpiece clamping module 3 is released, the headstock 2 is retracted, the tailstock mounting base plate 15 is moved to the processing position, the grinding wheel frame turntable module 6 is rotated, and the end face grinding wheel module 8 is selected to grind the other end face of the ingot workpiece 4; the headstock rotating base 11 is rotated to the slicing module 1 position, and the headstock mounting base plate 12 is moved to the slicing module 1 processing position to realize the slicing processing of the slicing module 1.

[0037] Modular customization: The slicing processing module 1 can be optionally equipped with an EDM module, a diamond wire cutting module, and a water-guided laser module. In conjunction with the ingot cutting process, the head frame rotating base 11 rotates according to the processing requirements to achieve personalized processing.

[0038] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A crystal ingot shaping processing equipment, characterized in that: include: A headstock (2), a headstock workpiece clamping module (3), a tailstock workpiece clamping module (5), a tailstock (7), a grinding wheel frame turntable module (6) and a crystal orientation detector (14), wherein the headstock workpiece clamping module (3) is mounted at one end of the headstock (2), the tailstock workpiece clamping module (5) is mounted at one end of the tailstock (7), and the tailstock workpiece clamping module (5) is arranged opposite to the headstock workpiece clamping module (3) and is used for clamping, positioning and clamping a crystal ingot workpiece (4); the crystal orientation detector The instrument (14) is arranged on one side of the headstock workpiece clamping module (3) and is used to detect the crystal orientation of the ingot workpiece (4) and output the detection result; the grinding wheel frame turntable module (6) is arranged on one side of the tailstock workpiece clamping module (5) and is used to adjust the processing angle of the ingot workpiece (4); the grinding wheel frame turntable module (6) is equipped with an end face grinding wheel module (8), an outer cylindrical grinding wheel module (9) and a slotting grinding wheel module (10), which respectively perform different processes on the ingot workpiece (4).

2. The ingot shaping equipment according to claim 1, characterized in that: It also comprises a slicing module (1), wherein the slicing module (1) is arranged at one end of the headstock (2) away from the tailstock workpiece clamping module (5).

3. The ingot shaping equipment according to claim 2, characterized in that: The slicing module (1) uses an electric spark, a diamond wire module or a water-conducting laser module to cut the ingot workpiece (4).

4. The ingot shaping equipment according to claim 1 or 3, characterized in that: The head frame (2) is mounted on a head frame mounting base plate (12), and the head frame mounting base plate (12) is mounted on a head frame rotating base (11).

5. The ingot shaping equipment according to claim 1, characterized in that: The tailstock (7) is mounted on a tailstock mounting base plate (15), and the tailstock mounting base plate (15) is mounted on a tailstock base (13).

6. The ingot shaping equipment according to claim 1, characterized in that: The grinding wheel frame turntable module (6) is mounted on a grinding wheel frame movable X-axis slide (17), and the grinding wheel frame movable X-axis slide (17) is mounted on a grinding wheel frame movable Z-axis slide (16).

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