Continuous pressing device and process for quantum dot film preparation

By designing a continuous pressing device for preparation of quantum dot films with sliding shells and scrapers, the problems of overflow and solidification of the film edge quantum dispenser are solved, and the uniformity of the thickness of the quantum dot film and the optical performance are improved.

CN119871913AActive Publication Date: 2025-04-25NANJING BREADY ELECTRONICS CO LTD
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Patent Information

Application Number
CN202510002249.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-02
Publication Date
2025-04-25
Estimated Expiration
2045-01-02

AI Technical Summary

Technical Problem

When the existing continuous compression device presses the quantum dot film, the quantum dispenser at the edge of the film is prone to overflow and solidify, resulting in uneven film thickness, affecting optical performance and usage effect.

Method used

A continuous pressing device for preparation of quantum dot films is designed, using a sliding shell and scraper structure. Through the positioning mechanism and the continuous scraping mechanism, the scraper accurately scrapes the overflow glue on the pressing roller, and removes bubbles on the surface of the film through the bending mechanism to ensure uniform film thickness.

Benefits of technology

It effectively prevents the quantum dispenser from solidifying on the pressing roller, ensures the effective pressing distance of the edge of the quantum dot film, ensures the uniformity of the film thickness, and improves optical performance and use effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of quantum dot film preparation, and particularly discloses a continuous pressing device and process for quantum dot film preparation. Comprising a machine tool, and two winding rollers and a plurality of guide rollers are mounted on the machine tool; the two fixing frames are both fixedly connected to the machine tool, two supporting sliding blocks are connected to the fixing frames in a sliding mode, and the supporting sliding blocks on the same side of the different fixing frames are jointly and rotationally connected with pressing rollers; and the connecting frame is fixedly connected to the supporting sliding block, the connecting frame is in limited sliding connection with a sliding shell, the sliding shell is in sliding connection with a scraping plate, and the scraping plate extrudes the adjacent pressing rollers. According to the device, the sliding shell moves on the connecting frame, so that the scraping plate accurately scrapes excessive glue on the pressing roller, the possibility that the excessive glue is gathered and solidified on the pressing roller is reduced, the effective pressing distance of the edge of the quantum dot film is controlled to be unchanged, and it is guaranteed that the quantum dot film with the uniform thickness is prepared.
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Description

Technical Field

[0001] The invention relates to the technical field of quantum dot film preparation, and specifically discloses a continuous pressing device and process for preparing quantum dot films. Background Art

[0002] Quantum dot film is a film made of nano-scale semiconductor materials (i.e. quantum dots). Due to its excellent optical properties and efficient light conversion capabilities, it is widely used in display technology and lighting fields. The specific steps for preparing quantum dot film are as follows: first, evenly apply quantum dot glue on a layer of high water vapor barrier film, then cover another layer of high water vapor barrier film on the quantum dot glue, and finally press the two layers of high water vapor barrier film together through two extrusion rollers to complete the preparation of the quantum dot film.

[0003] However, during the operation of the existing continuous lamination device, when two extrusion rollers press two films, quantum dot glue may overflow from the edge of the film. As the lamination device continues to work, the overflowed quantum dot glue will gradually accumulate and solidify at the contact position between the extrusion roller and the edge of the film, reducing the lamination thickness of the edge of the quantum dot film, thereby causing the thickness of the prepared quantum dot film to be uneven, affecting its optical properties and use effect. Summary of the invention

[0004] Regarding the problem that glue overflowing from the edge of the quantum dot film adheres and solidifies on the extrusion roller, affecting the effective lamination distance of the edge of the quantum dot film, the present invention provides a continuous lamination device and process for preparing a quantum dot film.

[0005] The technical solution of the present invention is: a continuous pressing device for preparing quantum dot films, comprising: a machine tool, on which two winding rollers and a plurality of guide rollers are installed; two fixed frames, both fixedly connected to the machine tool, on which two supporting sliders are slidably connected, and on different fixed frames, the supporting sliders on the same side are rotatably connected with a pressing roller, and the two pressing rollers jointly limit the thickness of the prepared quantum dot film; four connecting frames, respectively fixedly connected to the corresponding supporting sliders, the connecting frames are limitedly slidably connected with a sliding shell, the sliding shell is slidably connected with a scraper, a first spring is fixedly connected between the scraper and the sliding shell, and the scraper is used to scrape off the quantum dot glue on the pressing roller; four positioning mechanisms are respectively arranged on the corresponding sliding shells for positioning the edge of the quantum dot film; four continuous scraping mechanisms are respectively arranged on the corresponding sliding shells for scraping off the overflowing glue on the edge surface of the quantum dot film.

[0006] As a preferred embodiment of the present invention, the positioning mechanism includes: a limit bending rod, which is slidably connected to the sliding shell, a first tension spring is fixedly connected between the limit bending rod and the sliding shell, an inclined surface is arranged on the lower side of the limit bending rod, the sliding shell is slidably connected to a sliding plate, and the limit bending rod is used to squeeze the sliding plate; two limit blocks, both of which are slidably connected to the sliding shell, two grooves are arranged in the sliding shell, and the limit blocks are used to squeeze the sliding shell and the connecting frame; two U-shaped frames are respectively fixedly connected to the corresponding limit blocks, the limit bending rod is provided with a cross bar, the cross bar of the limit bending rod is used to squeeze the two U-shaped frames, a second tension spring is fixedly connected between the two limit blocks, and the connecting frame is slidably connected to a cylindrical rod, and the cylindrical rod is used to squeeze the sliding shell; a reset component is arranged on the cylindrical rod, and is used to release the lock of the sliding shell.

[0007] As a preferred embodiment of the present invention, the sliding plate is located at the horizontal plane where the pressed quantum dot film is located, and the moving range of the sliding plate is located within the range of the vertical plane where the contact edge of the scraper and the pressing roller is located.

[0008] As a preferred embodiment of the present invention, the reset assembly includes: a piston rod, which is fixedly connected to the cylindrical rod, a cavity is provided in the sliding shell, the cylindrical rod slides in a sealed manner in the cavity of the sliding shell, a first telescopic rod is fixedly connected to the sliding shell, the first telescopic rod is connected to the cavity of the sliding shell through a pipeline, a third tension spring is fixedly connected between the connecting frame and the sliding shell, and the cavity of the sliding shell and the first telescopic rod are both filled with hydraulic oil; a fixed support rod, which is fixedly connected to the telescopic end of the first telescopic rod, and the fixed support rod is used to squeeze the two U-shaped frames; a fixed bent rod, which is fixedly connected to the connecting frame, and the fixed bent rod is used to push the sliding plate to move.

[0009] As a preferred embodiment of the present invention, the continuous scraping mechanism includes: a rotating column, rotatably connected to the sliding shell, the sliding shell is equipped with a motor, and the output shaft of the motor is fixedly connected to the rotating column; a plurality of sliding straight plates, all slidably connected to the rotating column, a second spring is fixedly connected between the sliding straight plates and the rotating column, and the sliding straight plates are used to scrape off the overflowed glue on the edge surface of the quantum dot film; a cleaning component is arranged on the sliding shell, and is used to remove the residual glue on the surface of the sliding straight plates.

[0010] As a preferred embodiment of the present invention, the cleaning assembly includes: a sliding rod, slidably connected to the sliding shell, an inclined surface is provided on the lower side of the sliding rod, the inclined surface of the sliding rod is used to squeeze the adjacent sliding straight plate, and a third spring is fixedly connected between the sliding rod and the sliding shell; a sliding connecting rod, slidably connected to the lower part of the sliding rod, a fourth tension spring is fixedly connected between the sliding rod and the sliding connecting rod, and the sliding connecting rod is used to clean the surface of the sliding straight plate; a limiting rod, slidably connected to the sliding rod, a fifth tension spring is fixedly connected between the limiting rod and the sliding rod, and a plurality of grooves are provided on the upper part of the rotating column, and the grooves of the rotating column are used to limit the limiting rod.

[0011] As a preferred embodiment of the present invention, it also includes: a bending mechanism, which is arranged on the machine tool and is used to remove bubbles in the quantum dot glue sprayed on the surface of the film, and the bending mechanism includes: a fixed shell, which is fixed to the machine tool, and the lower part of the fixed shell is provided with a plurality of evenly distributed air holes, all the air holes in the fixed shell are connected to an air guide tube, and the fixed shell is used to adsorb the film to make it bend and deform; a suction control component, which is arranged on the fixed shell and is used to control the force with which the fixed shell adsorbs the film.

[0012] As a preferred embodiment of the present invention, the upper side surface of the fixed shell is a concave surface, and rotating rollers are provided at the highest point and the lowest point of the concave surface of the fixed shell. The rotating rollers of the fixed shell are used to assist the stable movement of the film sprayed with quantum dot glue.

[0013] As a preferred embodiment of the present invention, the suction control assembly includes: a second telescopic rod, fixedly connected to the fixed shell, the fixed shell being slidably connected to a sliding baffle, the sliding baffle being used to cover all the air holes in the fixed shell, the telescopic end of the second telescopic rod being fixedly connected to the sliding baffle; a third telescopic rod, fixedly connected to the adjacent supporting slider, the telescopic end of the third telescopic rod being fixedly connected to another supporting slider on the same fixed frame, the second telescopic rod and the third telescopic rod being connected by a pipeline, and the second telescopic rod and the third telescopic rod are both filled with hydraulic oil.

[0014] A continuous pressing process for preparing a quantum dot film, based on the above-mentioned continuous pressing device for preparing a quantum dot film, comprises the following steps: S1: Install two rolls of film on the winding roller, pull out the two films and pass them through the two laminating rollers, change the positions of the two supporting sliders, adjust the distance between the two laminating rollers, and change the area of ​​the vent hole in the fixed shell covered by the sliding baffle through the hydraulic oil transmission between the second telescopic rod and the third telescopic rod, so as to control the strength of the fixed shell to absorb the film; S2: After the distance between the two fixed shells is adjusted, the cylindrical rod is pushed toward the film. When the sliding plate contacts the edge of the quantum dot film, the sliding plate and the limit bending rod are dislocated. The limit bending rod controls the two limit blocks to fix the sliding shell on the connecting frame. The scraper cleans the residual glue on the laminating roller and controls the fixed shell to absorb the film so that the film is concave when passing through the fixed shell. S3: When the two laminating rollers continuously press the quantum dot film, the motor is started at a fixed time, and the sliding straight plate in contact with the scraped quantum dot film is switched by the rotating column. The sliding straight plate pushes the sliding rod to move up and down. Combined with the limit of the limit rod and the groove on the rotating column, the sliding connecting rod sequentially cleans all the residual glue on the sliding straight plate, and the prepared quantum dot film is rolled up in real time; S4: When the device is used, the fixed shell is controlled to stop adsorbing the film, the four cylindrical rods are pulled out to reset, the fixed support rod releases the fixation of the limit block, the sliding shell moves to reset, and the fixed bent rod resets the limit bent rod through the sliding plate.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The present invention enables the scraper to accurately scrape off the overflow glue on the laminating roller by moving the sliding shell on the connecting frame, thereby reducing the possibility of the overflow glue gathering and solidifying on the laminating roller, controlling the effective laminating distance of the edge of the quantum dot film to remain unchanged, and ensuring the preparation of a quantum dot film with uniform thickness.

[0016] 2. The present invention achieves mutual dislocation of the limit bending rod and the sliding plate in the positioning mechanism, so that the sliding shell can quickly locate the edge of the quantum dot film and lock it, thereby keeping the position of the scraper scraping the laminating roller stable.

[0017] 3. The present invention rotates the rotating column in the continuous scraping mechanism to enable the sliding straight plate to continuously scrape the residual glue on the upper and lower surfaces of the edge of the quantum dot film, thereby avoiding the problem of adhesion of the quantum dot film in the rolled state.

[0018] 4. The present invention uses a fixed shell in a bending mechanism to adsorb the film, so that the film passes through a depression during transportation, and the bubbles in the quantum dot glue are squeezed out by the film deformation, thereby ensuring the stability of the quality of the quantum dot film prepared by the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a three-dimensional structural schematic diagram of the parts of the fixing frame and the supporting sliding block of the present invention; Figure 3 It is a three-dimensional structural schematic diagram of the parts of the supporting slider and the laminating roller of the present invention; Figure 4 It is a three-dimensional structural schematic diagram of the parts of the connecting frame and the scraper of the present invention; Figure 5It is a three-dimensional structural schematic diagram of the parts of the connecting frame and the sliding shell of the present invention; Figure 6 It is a three-dimensional structural schematic diagram of the parts of the limit bending rod and the sliding plate of the present invention; Figure 7 It is a three-dimensional structural schematic diagram of the parts of the piston rod and the first telescopic rod of the present invention; Figure 8 It is a three-dimensional structural schematic diagram of the parts of the sliding housing and the first telescopic rod of the present invention; Fig. 9 It is a three-dimensional structural schematic diagram of the rotating column and the motor parts of the present invention; Fig.10 It is a three-dimensional structural schematic diagram of the parts of the sliding connecting rod and the limiting rod of the present invention; Fig.11 It is a three-dimensional structural schematic diagram of the parts of the fixed shell and the second telescopic rod of the present invention; Fig.12 It is a schematic diagram of the three-dimensional structure of the parts at the second telescopic rod and the sliding baffle of the present invention.

[0020] Markings in the accompanying drawings: 1-machine tool, 2-winding roller, 3-guide roller, 4-fixed frame, 5-support slider, 6-pressing roller, 7-connecting frame, 8-sliding shell, 9-scraper, 201-limiting bent rod, 202-sliding plate, 203-limiting block, 204-U-shaped frame, 205-cylindrical rod, 301-piston rod, 302-first telescopic rod, 303-fixed support rod, 304-fixed bent rod, 401-rotating column, 402-motor, 403-sliding straight plate, 501-sliding rod, 502-sliding connecting rod, 503-limiting rod, 601-fixed shell, 602-air guide tube, 701-second telescopic rod, 702-sliding baffle, 703-third telescopic rod. DETAILED DESCRIPTION

[0021] The following is combined with Figure 1 -Attached Fig.12 , the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0022] Example 1: In the process of preparing quantum dot film by the existing continuous lamination device, glue overflow will appear on the edges of the two films when the extrusion rollers extrude the films. As the continuous lamination device continues to work, the overflowed quantum dot glue will accumulate and solidify at the edge of the film on the extrusion roller, shortening the effective lamination distance of the edge of the quantum dot film, thereby causing the thickness of the prepared quantum dot film to be uneven, affecting its optical properties and use effect.

[0023] A continuous pressing device for preparing quantum dot films, please refer to the attached Figure 1 -Attached Figure 4 As shown, it includes: a machine tool 1, on which two winding rollers 2 and a plurality of guide rollers 3 are installed; two fixed frames 4, both of which are fixedly connected to the machine tool 1, and two supporting sliders 5 are slidably connected to the fixed frames 4, and the supporting sliders 5 on the same side of different fixed frames 4 are rotatably connected with a pressing roller 6, and the two pressing rollers 6 jointly limit the thickness of the prepared quantum dot film; four connecting frames 7, respectively fixedly connected to the corresponding supporting sliders 5, the connecting frames 7 are limitedly slidably connected to the sliding shells 8, the sliding shells 8 are slidably connected to the scraper 9, and a first spring is fixedly connected between the scraper 9 and the sliding shell 8, and the scraper 9 is used to scrape off the quantum dot glue on the pressing roller 6; four positioning mechanisms are respectively arranged on the corresponding sliding shells 8, and are used to position the edge of the quantum dot film; four continuous scraping mechanisms are respectively arranged on the corresponding sliding shells 8, and are used to scrape off the overflow glue on the edge surface of the quantum dot film.

[0024] In the above scheme, it is intended to solve the problem that when two films and quantum dot glue are pressed together, the quantum dot glue at the edge of the film overflows onto the pressing roller 6 and solidifies, resulting in a shortened effective pressing distance of the edge of the quantum dot film; a control panel is provided on the machine tool 1, and a winding mechanism (not shown in the figure, it is an existing mechanism) is provided on the right side of the machine tool 1. The winding roller 2 and the pressing roller 6 are both electrically controlled parts, which are used to control the tension during the film conveying process. The winding mechanism is used to wind up the prepared quantum dot film and control the tension during the film conveying process. A uniform glue spraying mechanism is provided on the left side of the machine tool 1, and a plurality of uniformly distributed nozzles are provided on the lower side of the uniform glue spraying mechanism, which are used to evenly spray the quantum dot glue on the surface of the film. The winding roller 2, the pressing roller 6, the uniform glue spraying mechanism, and the winding mechanism are all electrically connected to the control panel. The supporting sliders 5 are connected by bolts. By turning the bolts, the gap between the two laminating rollers 6 can be changed. The bolts at the two fixed frames 4 need to be turned synchronously at the same time to keep the two laminating rollers 6 in a parallel state. The sliding shell 8 is an assembled part. The cross-section of the sliding position of the sliding shell 8 on the connecting frame 7 is C-shaped. The first spring connected to the scraper 9 is always in a compressed state, which is used to keep the scraper 9 stably attached to the laminating roller 6 and scrape off the overflow glue on the laminating roller 6. A groove is provided on the lower scraper 9 for temporarily storing the scraped overflow glue. By changing the position of the sliding shell 8 on the connecting frame 7, the scraper 9 can accurately scrape off the overflow glue on the laminating roller 6, reduce the possibility of the overflow glue gathering and solidifying on the laminating roller 6, control the effective laminating distance of the edge of the quantum dot film to remain unchanged, and ensure the preparation of a quantum dot film with uniform thickness.

[0025] Workflow: In the process of using the device to prepare quantum dot film, first install two rolls of film on the winding roller 2, then pull out the two films and make them pass through the gap between the two laminating rollers 6 and the winding mechanism in turn, multiple guide rollers 3 guide the film, and adjust the tension of the film through the winding roller 2 and the winding mechanism. Finally, turn the bolts on the fixed frame 4, and make the gap between the two laminating rollers 6 reach the set value through the two supporting sliders 5 (the set value is calculated by the production staff according to the thickness of the film and the spraying thickness of the quantum dot glue). The operator moves the sliding shell 8 through the positioning mechanism to make the sliding shell 8 close to the edge of the film, and the scraper 9 continuously scrapes the laminating roller 6. The overflow glue scraped off by the side scraper 9 falls onto the lower scraper 9, and finally enters the groove of the lower scraper 9 for temporary storage, thus completing the initial accurate operation of the device. The operator starts the winding roller 2, the laminating roller 6, the uniform glue spraying mechanism and the winding mechanism through the control panel. The winding roller 2 rotates to release the film, and the prepared quantum dot film is collected in combination with the winding mechanism to keep a stable tension of the film during transportation. The two films are stably transported to the right, and the uniform glue spraying mechanism continues to spray quantum dot glue on the upper surface of the lower film. The two laminating rollers 6 rotate at the same speed as the film movement speed, and at the same time, the two films and the quantum dot glue between them are pressed.

[0026] During the continuous operation of the device, when glue overflow occurs on the edges of the two films, the overflow glue adheres to the contact position between the lamination roller 6 and the edge of the film. As the lamination roller 6 rotates, the scraper 9 scrapes off the overflow glue on the lamination roller 6 in time, and the continuous scraping mechanism continuously scrapes off the overflow glue attached to the edge surface of the film. The laminated quantum dot film finally enters the winding mechanism for collection. When the device completes the preparation of the quantum dot film, the operator turns off the winding roller 2, the lamination roller 6, the uniform glue spraying mechanism and the winding mechanism through the control panel. Finally, the operator moves the sliding shell 8 to reset through the positioning mechanism. At this point, all parts are restored to their initial positions.

[0027] For further information, please refer to the attached Figure 3 -Attached Figure 8As shown, the positioning mechanism includes: a limit bending rod 201, which is slidably connected to the sliding shell 8, a first tension spring is fixedly connected between the limit bending rod 201 and the sliding shell 8, an inclined surface is arranged on the lower side of the limit bending rod 201, the sliding shell 8 is slidably connected to the sliding plate 202, and the limit bending rod 201 is used to squeeze the sliding plate 202; two limit blocks 203, both of which are slidably connected to the sliding shell 8, two grooves are arranged in the sliding shell 8, and the limit blocks 203 are used to squeeze the sliding shell 8 and the connecting frame 7; two U-shaped frames 204 are respectively fixedly connected to the corresponding limit blocks 203, the limit bending rod 201 is provided with a cross bar, the cross bar of the limit bending rod 201 is used to squeeze the two U-shaped frames 204, a second tension spring is fixedly connected between the two limit blocks 203, and the connecting frame 7 is slidably connected to the cylindrical rod 205, and the cylindrical rod 205 is used to squeeze the sliding shell 8; a reset component is arranged on the cylindrical rod 205, and is used to release In addition to locking the sliding shell 8, the sliding plate 202 is located at the horizontal plane where the quantum dot film is located after the pressing, and the moving range of the sliding plate 202 is located within the range of the vertical plane where the contact edge of the scraper 9 and the pressing roller 6 is located. The reset component includes: a piston rod 301, which is fixedly connected to the cylindrical rod 205. A cavity is provided in the sliding shell 8. The cylindrical rod 205 slides in a sealed manner in the cavity of the sliding shell 8. A first telescopic rod 302 is fixedly connected in the sliding shell 8. The first telescopic rod 302 is connected to the cavity of the sliding shell 8 through a pipeline. A third tension spring is fixedly connected between the connecting frame 7 and the sliding shell 8. The cavity of the sliding shell 8 and the first telescopic rod 302 are both filled with hydraulic oil; a fixed support rod 303, which is fixedly connected to the telescopic end of the first telescopic rod 302, and the fixed support rod 303 is used to squeeze the two U-shaped frames 204; a fixed bent rod 304, which is fixedly connected to the connecting frame 7, and the fixed bent rod 304 is used to push the sliding plate 202 to move.

[0028] In the above scheme, it is intended to solve the problem that for quantum dot films of different widths or specifications, the diffusion range of the overflow glue at the edge of the film on the laminating roller 6 is different, resulting in a complicated positioning process of the sliding shell 8 on the connecting frame 7; the first tension spring connected to the limit bending rod 201 is initially in a stretched state. Initially, the lower end of the limit bending rod 201 contacts the upper side of the sliding plate 202, and the sliding plate 202 slides freely on the sliding shell 8. When the sliding plate 202 contacts and squeezes the edge of the film, the edge of the film does not deform. The limit bending rod 201 is misaligned with the sliding plate 202, so that the limit bending rod 201 moves downward to complete the positioning of the edge of the quantum dot film, and the sliding plate 202 squeezes the limit bending rod 201. The inclined surface of the positioning bending rod 201 resets the limiting bending rod 201. The inclined surface of the limiting bending rod 201 tilts from top to bottom in the direction of the quantum point membrane. The two U-shaped frames 204 are staggered into an X shape, which is used to make the two U-shaped frames 204 move synchronously in opposite directions. The two limiting blocks 203 are respectively inserted into the two grooves of the sliding shell 8. The limiting blocks 203 are combined to extrude the connecting frame 7, so that the sliding shell 8 is locked in position on the connecting frame 7 to ensure that the contact range between the subsequent scraper 9 and the pressing roller 6 remains unchanged. The limiting block 203 is a wedge-shaped block. The width of the limiting block 203 is smaller than the width of the U-shaped frame 204, which is used to ensure the moving range of the limiting block 203 so that the limiting block 203 does not take effect when the sliding shell 8 moves.

[0029] Workflow: After the operator completes the installation of the two rolls of film and the gap adjustment of the lamination roller 6, taking the sliding shell 8 at the upper front side as an example, the operator pushes the sliding shell 8 backwards through the cylindrical rod 205, and the third tension spring between the sliding shell 8 and the connecting frame 7 is stretched, and the sliding shell 8 gradually approaches the edge of the film. After the sliding plate 202 approaches and contacts the edge of the film, the sliding plate 202 stops moving. As the sliding shell 8 moves backward, the sliding plate 202 moves forward relative to the sliding shell 8, and the sliding plate 202 is misaligned with the limit bending rod 201. The limit bending rod 201 moves downward under the tension of the connected first tension spring. The upper cross bar of the limit bending rod 201 pushes the two limit blocks 203 away from each other through the two U-shaped frames 204, the second tension spring between the two limit blocks 203 is stretched, and the limit block 203 is inserted into the groove of the sliding shell 8, locking the sliding shell 8 on the connecting frame 7. At this time, the contact range of the scraper 9 and the laminating roller 6 is located within the diffusion range of the overflow glue at the edge of the film. The movement and fixation of the sliding shell 8 is completed, and then the above-mentioned quantum dot film preparation operation is performed. The overflow glue is scraped off at both ends of the two laminating rollers 6 by four scrapers 9, and the continuous scraping mechanism scrapes off the overflow glue on the edge surface of the laminating quantum dot film.

[0030] When the device completes the preparation of the quantum dot film, the operator closes the winding roller 2, the pressing roller 6, the uniform glue spraying mechanism and the winding mechanism, and then the operator pulls out the cylindrical rod 205. The sliding shell 8 does not move because it is fixed to the connecting frame 7. The cylindrical rod 205 drives the piston rod 301 to move forward, and the piston rod 301 moves forward in the cavity of the sliding shell 8. The hydraulic oil in the cavity of the sliding shell 8 enters the first telescopic rod 302 through the pipeline. The telescopic end of the first telescopic rod 302 extends out and drives the fixed support rod 303 to move upward. The fixed support rod 303 squeezes the two U-shaped frames 204 to make the two limit blocks 203 approach each other. The limit blocks 203 are moved out of the groove of the sliding shell 8, and the lock between the sliding shell 8 and the connecting frame 7 is released. The sliding shell 8 is The piston rod 301 moves forward and resets under the tension of the third tension spring, and moves backward and resets in the cavity of the sliding shell 8. The hydraulic oil in the first telescopic rod 302 flows back into the cavity of the sliding shell 8 through the pipeline. The telescopic end of the first telescopic rod 302 contracts and drives the fixed support rod 303 to reset, and the cylindrical rod 205 resumes contact with the sliding shell 8. In the process of the sliding shell 8 moving forward, the fixed bent rod 304 contacts and pushes the sliding plate 202 to move and reset. The sliding plate 202 squeezes the inclined surface of the limit bent rod 201, and the limit bent rod 201 moves upward and stretches the connected first tension spring. The limit bent rod 201 moves and resets, and the limit bent rod 201 resumes the state of squeezing the sliding plate 202. When the sliding shell 8 moves and resets, all parts return to their initial positions.

[0031] For further information, please refer to the attached Figure 4 , Attachment Fig. 9 and attached Fig.10 As shown, the continuous scraping mechanism includes: a rotating column 401, which is rotatably connected to the sliding shell 8, and the sliding shell 8 is equipped with a motor 402, and the output shaft of the motor 402 is fixedly connected to the rotating column 401; a plurality of sliding straight plates 403, which are all slidably connected to the rotating column 401, and a second spring is fixedly connected between the sliding straight plates 403 and the rotating column 401, and the sliding straight plates 403 are used to scrape the overflow glue on the edge surface of the quantum dot film; a cleaning component, which is arranged on the sliding shell 8, and is used to remove the residual glue on the surface of the sliding straight plates 403, and the cleaning component includes: a sliding rod 501, which is slidably connected to the sliding shell 8, and the lower side of the sliding rod 501 is provided with an inclined Inclined surface, the inclined surface of the sliding rod 501 is used to squeeze the adjacent sliding straight plate 403, and a third spring is fixedly connected between the sliding rod 501 and the sliding shell 8; the sliding connecting rod 502 is slidably connected to the lower part of the sliding rod 501, and a fourth tension spring is fixedly connected between the sliding rod 501 and the sliding connecting rod 502, and the sliding connecting rod 502 is used to clean the surface of the sliding straight plate 403; the limiting rod 503 is slidably connected to the sliding rod 501, and a fifth tension spring is fixedly connected between the limiting rod 503 and the sliding rod 501, and a plurality of grooves are arranged on the upper part of the rotating column 401, and the grooves of the rotating column 401 are used to limit the limiting rod 503.

[0032] In the above scheme, the problem of glue overflow adhering to the upper and lower surfaces of the edge of the quantum dot film is solved, which not only affects the appearance quality of the product, but also causes adhesion in subsequent processing; the plane where the lower side of the sliding straight plate 403 is located coincides with the surface of the pressed quantum dot film, and the sliding straight plate 403 only has a slight squeezing force on the surface of the quantum dot film, which does not cause the quantum dot film to deform, thereby ensuring the uniformity of the thickness of the quantum dot film. The sliding straight plate 403 is used to scrape off the residual glue on the upper and lower surfaces of the edge of the quantum dot film. The number of sliding straight plates 403 in the device and the number of grooves on the rotating column 401 are both three. The projection of the groove on the rotating column 401 on the horizontal plane is located between two adjacent sliding straight plates 403. The three sliding straight plates 403 are circumferentially arranged at the lower part of the rotating column 401. Evenly distributed, there is always one sliding straight plate 403 in contact with the quantum dot film among the three sliding straight plates 403, and there is an angle between the sliding straight plate 403 located on the quantum dot film and the edge of the quantum dot film. The residual glue on the surface of the quantum dot film after pressing is removed through the contact between the sliding straight plate 403 and the surface at the edge of the quantum dot film, so as to avoid the problem of adhesion of the quantum dot film in the rolled-up state. The height of the projection of the lower inclined surface of the sliding rod 501 in the vertical direction is greater than the height of the sliding straight plate 403, so that when the sliding straight plate 403 rotates, the sliding rod 501 moves upward and passes over the sliding straight plate 403, and the sliding rod 501 drives the sliding connecting rod 502 to remove the residual glue on the surfaces of the three sliding straight plates 403 in turn. The fifth tension spring connected to the limit rod 503 is initially in a stretched state.

[0033] Workflow: When the device is started and continues to press the quantum dot film, taking the rotating column 401 on the front side as an example, there is always a sliding straight plate 403 on the lower side of the rotating column 401 to keep in contact with the edge surface of the quantum dot film, and the sliding straight plate 403 scrapes the residual glue on the edge surface of the quantum dot film. As the residual glue accumulates on the sliding straight plate 403, due to the angle between the sliding straight plate 403 and the edge of the quantum dot film, the residual glue moves along the inclined direction of the sliding straight plate 403 and falls to the ground. After the sliding straight plate 403 has worked for a period of time, the control panel starts the motor 402, and the output shaft of the motor 402 drives the rotating column 401 to rotate counterclockwise (from top to bottom). After the next sliding straight plate 403 moves to the set position, the control panel turns off the motor 402. Through the intermittent start-up of the motor 402, the sliding straight plate 403 in contact with the film is continuously switched to prevent the sliding straight plate 403 from being in contact with the residual glue for too long, and the residual glue solidifies on the sliding straight plate 403, which affects the residual glue scraping effect of the sliding straight plate 403.

[0034] When the rotating column 401 drives the sliding straight plate 403 to rotate, the sliding straight plate 403 squeezes the inclined surface of the sliding rod 501, the sliding rod 501 moves upward and compresses the third spring, and the sliding link 502 moves backward relative to the sliding rod 501 and stretches the fourth tension spring. When the limiting rod 503 is aligned with one of the grooves on the rotating column 401, the limiting rod 503 moves and is inserted into the groove of the rotating column 401 under the tension of the connected fifth tension spring, and the sliding link 502 loses contact with the sliding straight plate 403. The sliding link 502 moves and resets under the tension of the connected fourth tension spring. As the rotating column 401 rotates, the groove of the rotating column 401 will limit The positioning rod 503 is pushed out, and the limiting rod 503 stretches the fifth tension spring connected to it. At this time, the next sliding straight plate 403 just moves to the bottom of the sliding connecting rod 502, and the sliding rod 501 moves downward under the elastic force of the third tension spring connected to it. The sliding connecting rod 502 scrapes off the residual glue on the surface of the sliding straight plate 403, and the above-mentioned rotation of the rotating column 401 and the scraping of the sliding straight plate 403 are repeated continuously to continuously scrape off the residual glue on the upper and lower surfaces of the edge of the quantum dot film. When the preparation of the quantum dot film is completed, the operator repeats the above-mentioned resetting operation of the sliding shell 8, and the sliding straight plate 403 loses contact with the quantum dot film. At this point, all parts are restored to their initial positions.

[0035] Example 2: Based on Example 1, please refer to the attached Figure 2 , Attachment Fig.11 and attached Fig.12 As shown, it also includes: a bending mechanism, which is arranged on the machine tool 1 and is used to remove bubbles in the quantum dot glue sprayed on the surface of the film. The bending mechanism includes: a fixed shell 601, which is fixedly connected to the machine tool 1. The lower part of the fixed shell 601 is provided with a plurality of evenly distributed vents. All the vents in the fixed shell 601 are connected to an air guide pipe 602. The fixed shell 601 is used to adsorb the film to make it bend and deform; a suction control component, which is arranged on the fixed shell 601 and is used to control the strength of the fixed shell 601 to adsorb the film. The upper side surface of the fixed shell 601 is a concave surface. The highest point and the lowest point of the concave surface of the fixed shell 601 are both provided with rotating rollers. The rotating rollers of the fixed shell 601 are used to assist To help the film sprayed with quantum dot glue to move stably, the suction control component includes: a second telescopic rod 701, fixedly connected to the fixed shell 601, the fixed shell 601 is slidably connected to a sliding baffle 702, the sliding baffle 702 is used to cover all the vents in the fixed shell 601, and the telescopic end of the second telescopic rod 701 is fixedly connected to the sliding baffle 702; a third telescopic rod 703, fixedly connected to an adjacent supporting slider 5, the telescopic end of the third telescopic rod 703 is fixedly connected to another supporting slider 5 on the same fixed frame 4, the second telescopic rod 701 and the third telescopic rod 703 are connected by a pipeline, and the second telescopic rod 701 and the third telescopic rod 703 are both filled with hydraulic oil.

[0036] In the above scheme, it is intended to solve the problem that there are still some bubbles in the quantum dot glue sprayed on the film, which leads to the decrease of light transmittance and uniformity of the pressed quantum dot film; the fixed shell 601 is located to the right of the uniform spraying mechanism in the device, and the fixed shell 601 is located below the film with the quantum dot glue layer. The air guide tube 602 is externally connected to a vacuum pump, and the vacuum pump is electrically connected to the control panel to extract the gas in the fixed shell 601, so that the fixed shell 601 adsorbs the film, and the sliding baffle 702 will not completely block the ventilation of the fixed shell 601. The fixed shell 601 has a hole, and the cross-sectional range of the air extraction in the fixed shell 601 is covered by the film. The fixed shell 601 stably adsorbs the film, thereby causing the film to be concave, so that the bubbles in the quantum dot glue are squeezed out by the deformation of the film. At the same time, when the film passes through the concave part during transportation, after the film is bent and unfolded, the uneven quantum dot glue on the film becomes more uniform through diffusion and migration. The adsorption force of the fixed shell 601 on the film is changed according to the thickness of the prepared quantum dot film through the flow of hydraulic oil between the second telescopic rod 701 and the third telescopic rod 703.

[0037] Working process: when the operator turns the bolts at the fixed frame 4 to reduce the distance between the two pressing rollers 6, the two supporting sliders 5 on the front side approach each other, causing the telescopic end of the third telescopic rod 703 to shrink, and the hydraulic oil in the third telescopic rod 703 enters the second telescopic rod 701 through the pipeline, and the telescopic end of the second telescopic rod 701 extends and pushes the sliding baffle 702 into the fixed shell 601. The sliding baffle 702 blocks the increase in the area of ​​the vent hole in the fixed shell 601, thereby reducing the adsorption force of the fixed shell 601 on the covered film, so as to achieve the purpose that the smaller the thickness of the prepared quantum dot film, the smaller the thickness of the film, and the smaller the adsorption force of the fixed shell 601. When the uniform spraying mechanism is started, the control panel starts the vacuum pump synchronously, and the vacuum pump extracts gas through the vent hole of the fixed shell 601. The fixed shell 601 adsorbs the film to make it concave, and the rotating roller on the fixed shell 601 assists in film transportation. When the device completes the preparation of the quantum dot film, the control panel turns off the vacuum pump, and all parts are restored to their initial positions.

[0038] Example 3: Based on Example 2, a continuous pressing process for preparing a quantum dot film is applied to the above-mentioned continuous pressing device for preparing a quantum dot film, comprising the following steps: S1: Install two rolls of film on the winding roller 2, pull out the two films and pass them through the two laminating rollers 6, change the positions of the two supporting sliders 5, adjust the distance between the two laminating rollers 6, and change the area of ​​the vent hole in the fixed shell 601 covered by the sliding baffle 702 through the hydraulic oil transmission between the second telescopic rod 701 and the third telescopic rod 703, so as to control the strength of the fixed shell 601 to absorb the film; S2: When the distance between the two fixed shells 601 is adjusted, the cylindrical rod 205 is pushed toward the film. When the sliding plate 202 contacts the edge of the quantum dot film, the sliding plate 202 and the limit bending rod 201 are misaligned. The limit bending rod 201 controls the two limit blocks 203 to fix the sliding shell 8 on the connecting frame 7. The scraper 9 cleans the residual glue on the laminating roller 6 and controls the fixed shell 601 to absorb the film so that the film is concave when passing through the fixed shell 601. S3: During the process of the two laminating rollers 6 continuously laminating the quantum dot film, the motor 402 is started at a fixed time, and the sliding straight plate 403 in contact with the scraped quantum dot film is switched through the rotating column 401, and the sliding straight plate 403 pushes the sliding rod 501 to move up and down, and the limiting rod 503 and the groove on the rotating column 401 are combined to make the sliding connecting rod 502 clean all the residual glue on the sliding straight plate 403 in turn, and the prepared quantum dot film is rolled up in real time; S4: When the device is used, the fixed shell 601 is controlled to stop adsorbing the film, the four cylindrical rods 205 are pulled out and reset, the fixed support rod 303 releases the fixation of the limit block 203, the sliding shell 8 moves and resets, and the fixed curved rod 304 resets the limit curved rod 201 through the sliding plate 202.

[0039] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A continuous pressing device for preparing a quantum dot film, characterized in that it comprises: A machine tool (1), wherein two winding rollers (2) and a plurality of guide rollers (3) are installed on the machine tool (1); Two fixed frames (4) are both fixedly connected to the machine tool (1); two supporting slide blocks (5) are slidably connected to the fixed frames (4); the supporting slide blocks (5) on the same side of different fixed frames (4) are rotatably connected to a pressing roller (6); the two pressing rollers (6) jointly define the thickness of the prepared quantum dot film; Four connecting frames (7) are respectively fixedly connected to the corresponding supporting sliders (5); the connecting frames (7) are limitedly slidably connected to a sliding shell (8); the sliding shell (8) is slidably connected to a scraper (9); a first spring is fixedly connected between the scraper (9) and the sliding shell (8); the scraper (9) is used to scrape off the quantum dot glue on the laminating roller (6); Four positioning mechanisms, respectively arranged on the corresponding sliding shells (8) and used for positioning the edge of the quantum dot film; Four continuous scraping mechanisms are respectively arranged on the corresponding sliding shells (8) and are used to scrape off the overflowing glue on the edge surface of the quantum dot film.

2. A continuous pressing device for preparing a quantum dot film according to claim 1, characterized in that: The positioning mechanism comprises: A limit bending rod (201) is slidably connected to the sliding shell (8), a first tension spring is fixedly connected between the limit bending rod (201) and the sliding shell (8), an inclined surface is provided on the lower side of the limit bending rod (201), the sliding shell (8) is slidably connected to a sliding plate (202), and the limit bending rod (201) is used to press the sliding plate (202); Two limit blocks (203) are both slidably connected in the sliding shell (8), the sliding shell (8) is provided with two grooves, and the limit blocks (203) are used to squeeze the sliding shell (8) and the connecting frame (7); Two U-shaped frames (204) are respectively fixed to the corresponding limiting blocks (203); the limiting bent rod (201) is provided with a cross bar, the cross bar of the limiting bent rod (201) is used to squeeze the two U-shaped frames (204); a second tension spring is fixed between the two limiting blocks (203); the connecting frame (7) is slidably connected to a cylindrical rod (205), and the cylindrical rod (205) is used to squeeze the sliding shell (8); A reset assembly is arranged on the cylindrical rod (205) and is used to release the lock of the sliding shell (8).

3. A continuous pressing device for preparing a quantum dot film according to claim 2, characterized in that: The sliding plate (202) is located at a horizontal plane where the pressed quantum dot film is located, and the moving range of the sliding plate (202) is located within the range of a vertical plane where the contact edge of the scraper (9) and the pressing roller (6) is located.

4. A continuous pressing device for preparing a quantum dot film according to claim 3, characterized in that: The reset component comprises: A piston rod (301) is fixedly connected to the cylindrical rod (205); a cavity is provided in the sliding shell (8); the cylindrical rod (205) slides in a sealed manner in the cavity of the sliding shell (8); a first telescopic rod (302) is fixedly connected in the sliding shell (8); the first telescopic rod (302) and the cavity of the sliding shell (8) are connected via a pipeline; a third tension spring is fixedly connected between the connecting frame (7) and the sliding shell (8); and hydraulic oil is filled in the cavity of the sliding shell (8) and the first telescopic rod (302); A fixed support rod (303) fixedly connected to the telescopic end of the first telescopic rod (302), the fixed support rod (303) being used to squeeze the two U-shaped frames (204); A fixed bent rod (304) is fixedly connected to the connecting frame (7), and the fixed bent rod (304) is used to push the sliding plate (202) to move.

5. A continuous pressing device for preparing a quantum dot film according to claim 4, characterized in that: The continuous scraping mechanism comprises: A rotating column (401) is rotatably connected to the sliding shell (8); the sliding shell (8) is equipped with a motor (402); an output shaft of the motor (402) is fixedly connected to the rotating column (401); A plurality of sliding straight plates (403) are all slidably connected to the rotating column (401), a second spring is fixedly connected between the sliding straight plates (403) and the rotating column (401), and the sliding straight plates (403) are used to scrape off the overflowed glue on the edge surface of the quantum dot film; A cleaning component is arranged on the sliding shell (8) and is used to remove residual glue on the surface of the sliding straight plate (403).

6. A continuous pressing device for preparing a quantum dot film according to claim 5, characterized in that: The cleaning component includes: A sliding rod (501) is slidably connected to the sliding shell (8); an inclined surface is provided on the lower side of the sliding rod (501); the inclined surface of the sliding rod (501) is used to press the adjacent sliding straight plate (403); and a third spring is fixedly connected between the sliding rod (501) and the sliding shell (8); A sliding connecting rod (502) is slidably connected to the lower part of the sliding rod (501), a fourth tension spring is fixedly connected between the sliding rod (501) and the sliding connecting rod (502), and the sliding connecting rod (502) is used to clean the surface of the sliding straight plate (403); A limiting rod (503) is slidably connected to the sliding rod (501), a fifth tension spring is fixedly connected between the limiting rod (503) and the sliding rod (501), a plurality of grooves are arranged on the upper part of the rotating column (401), and the grooves of the rotating column (401) are used to limit the limiting rod (503).

7. The continuous pressing device for preparing a quantum dot film according to claim 1, characterized in that include: A bending mechanism is arranged on the machine tool (1) and is used to remove bubbles in the quantum dot glue sprayed on the surface of the film. The bending mechanism comprises: A fixed shell (601) is fixedly connected to the machine tool (1), a plurality of evenly distributed ventilation holes are arranged at the bottom of the fixed shell (601), all ventilation holes in the fixed shell (601) are connected to an air guide pipe (602), and the fixed shell (601) is used to absorb the film to make it bend and deform; A suction control component is arranged on the fixed shell (601) and is used to control the force with which the fixed shell (601) adsorbs the film.

8. The continuous pressing device for preparing a quantum dot film according to claim 7, characterized in that: The upper side surface of the fixed shell (601) is a concave surface, and rotating rollers are provided at the highest point and the lowest point of the concave surface of the fixed shell (601). The rotating rollers of the fixed shell (601) are used to assist the stable movement of the film sprayed with quantum dot glue.

9. A continuous pressing device for preparing a quantum dot film according to claim 8, characterized in that: The suction control assembly comprises: a second telescopic rod (701) fixedly connected to the fixed shell (601); the fixed shell (601) is slidably connected to a sliding baffle (702); the sliding baffle (702) is used to cover all vent holes in the fixed shell (601); the telescopic end of the second telescopic rod (701) is fixedly connected to the sliding baffle (702); The third telescopic rod (703) is fixedly connected to the adjacent supporting slider (5); the telescopic end of the third telescopic rod (703) is fixedly connected to another supporting slider (5) on the same fixing frame (4); the second telescopic rod (701) and the third telescopic rod (703) are connected through a pipeline; and hydraulic oil is filled in the second telescopic rod (701) and the third telescopic rod (703).

10. A continuous lamination process for preparing a quantum dot film, according to claim 9, a continuous lamination device for preparing a quantum dot film, wherein the specific method of use comprises the following steps: S1: installing two rolls of film on the winding roller (2), pulling out the two films and passing them through the two laminating rollers (6), changing the positions of the two supporting sliders (5), adjusting the distance between the two laminating rollers (6), changing the area of ​​the vent hole in the fixed shell (601) covered by the sliding baffle (702) through the transmission of hydraulic oil between the second telescopic rod (701) and the third telescopic rod (703), and controlling the strength of the fixed shell (601) adsorbing the film; S2: When the spacing between the two fixed shells (601) is adjusted, the cylindrical rod (205) is pushed toward the film. When the sliding plate (202) contacts the edge of the quantum dot film, the sliding plate (202) and the limit bending rod (201) are misaligned. The limit bending rod (201) controls the two limit blocks (203) to fix the sliding shell (8) on the connecting frame (7). The scraper (9) cleans the residual glue on the laminating roller (6). At the same time, the fixed shell (601) is controlled to absorb the film so that the film is recessed when passing through the fixed shell (601). S3: During the process of the two laminating rollers (6) continuously laminating the quantum dot film, the motor (402) is started at a fixed time, and the sliding straight plate (403) in contact with the scraped quantum dot film is switched through the rotating column (401), and the sliding straight plate (403) pushes the sliding rod (501) to move up and down, and combined with the limit of the limit rod (503) and the groove on the rotating column (401), the sliding connecting rod (502) sequentially cleans all the residual glue on the sliding straight plate (403), and the prepared quantum dot film is rolled up in real time; S4: When the device is used, the fixed shell (601) is controlled to stop adsorbing the film, the four cylindrical rods (205) are pulled out and reset, the fixed support rod (303) releases the fixation of the limit block (203), the sliding shell (8) moves and resets, and the fixed curved rod (304) resets the limit curved rod (201) through the sliding plate (202).

Citation Information

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