Packaging equipment for resin mold

Abstract

The invention discloses packaging equipment for a resin mold, and the packaging equipment comprises a mold restraining mechanism which is used for fixing the resin mold and enabling the resin mold to be driven to rotate during use; the pose adjusting mechanism is used for driving the mold restraining mechanism to convert the set direction when the resin mold is in place, so that the pose of the resin mold is adjusted; the winding mechanism is used for packaging the resin mold; according to the packaging equipment for the resin mold, automatic packaging of the resin mold can be achieved, manual packaging is not needed, the packaging efficiency can be improved, meanwhile, the packaging quality can be guaranteed, meanwhile, the rotary table can be operated to rotate, the position of the resin mold can be conveniently adjusted in time, and the packaging requirements of resin molds of different shapes can be met.

Description

Technical Field

[0001] The invention relates to the technical field of packaging equipment, and in particular to a packaging equipment for a resin mold. Background Art

[0002] With the rapid development of manufacturing industry and the increasing maturity of automation technology, the production and application of resin molds have become particularly critical, especially in the encapsulation process of resin molds, the demand for efficient and accurate encapsulation equipment is growing. At present, the encapsulation of resin molds is mainly done by manual wrapping with tape. With the diversity of product types and the increase in production batches, the manual encapsulation method is labor-intensive, inefficient, and lacks consistency in encapsulation quality, which will lead to increased production costs and make it difficult to meet the needs of modern production. Most of the existing encapsulation equipment on the market is only suitable for boxes with regular and square shapes. For resin molds of different shapes and sizes, the encapsulation effect is not good.

[0003] Therefore, there is a need to improve the packaging equipment of resin molds in the prior art so as to realize automatic packaging of resin molds of different shapes and sizes, so as to improve production efficiency, save labor costs and improve the consistency of the packaging process. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a packaging device for resin molds, which can realize automatic packaging of resin molds of different shapes and sizes, so as to improve production efficiency, save labor costs and improve the consistency of packaging process.

[0005] The packaging device for resin mold of the present invention comprises:

[0006] A mold restraining mechanism, used to fix the resin mold and enable the resin mold to be driven to rotate when in use;

[0007] A posture adjustment mechanism, used for driving the mold constraint mechanism to convert a set orientation when the resin mold is in place, thereby adjusting the posture of the resin mold;

[0008] The winding mechanism is used to encapsulate the resin mold.

[0009] Furthermore, the mold restraint mechanism includes a loading platform, a rotating table assembly and a clamping mechanism. The rotating table assembly is arranged on the loading platform. When in use, the resin mold is placed on the rotating table assembly and can be driven to rotate. The clamping mechanism is used to press the resin mold onto the rotating table assembly.

[0010] Further, the rotating table assembly includes a rotating table, a rotating table bracket and a rotating table driving mechanism, the rotating table bracket is fixedly connected to the loading platform, the rotating table is used to place the resin mold and is rotatably arranged on the rotating table bracket, and the rotating table driving mechanism is used to drive the rotating table to rotate;

[0011] The turntable driving mechanism includes a driving motor I, and the output shaft of the driving motor I is connected to the turntable through a belt drive to drive the turntable to rotate.

[0012] Furthermore, the clamping mechanism includes a gantry, a clamping piece and a cylinder. The gantry is arranged on the loading platform and spans across both sides of the rotating table assembly. The cylinder is arranged on the top of the gantry and the piston rod of the cylinder is fixedly connected to the clamping piece for driving the clamping piece to move and clamp the resin mold by moving.

[0013] Furthermore, the posture adjustment mechanism includes a support platform and a plurality of drive cylinders. The plurality of drive cylinders change the posture of the support platform by changing the drive length, thereby driving the mold constraint mechanism to switch to a set orientation.

[0014] Furthermore, the support platform and the loading platform are detachably connected via a flange;

[0015] The posture adjustment mechanism further includes a base, the base is used to support the plurality of drive cylinders, and the two ends of the plurality of drive rods are respectively hinged to the base and the support platform;

[0016] There are six driving cylinders in total, which are arranged in pairs in a V shape and evenly distributed in the circumferential direction of the base.

[0017] Furthermore, it also includes a support frame for forming a support, the support frame is a stepped structure, including a first step surface and a second step surface, the second step surface is higher than the first step surface, and the base is arranged on the first step surface.

[0018] Furthermore, it also includes a linear slide mechanism, which includes a sliding drive mechanism, a column and two guide bearing seat assemblies, wherein the column is arranged on the second step surface, two slide rails are arranged on the column at intervals, and the two guide bearing seat assemblies are respectively arranged at the bottom and the top of the column and located between the two slide rails;

[0019] The sliding drive mechanism includes a drive motor II, a coupling and a sliding screw. The drive motor II is arranged on the second step surface and the output shaft passes through the second step surface and is connected to the sliding screw through a coupling. The sliding screw passes through two guide bearing seats and a slider is arranged on the sliding screw. The slider is provided with a sliding groove that cooperates with the sliding rail, and the slider can be driven to slide along the sliding rail.

[0020] Further, the winding mechanism can be driven to move, including a packaging member, and the packaging member can be operated to be wound on the resin mold and can be cut;

[0021] The winding mechanism further includes a placing frame, a tool assembly and a tool driving mechanism III, the placing frame is fixedly connected to the slider, the packaging member is arranged on the placing frame, one end of the placing frame is provided with two guide pillars arranged at intervals, and an accommodation gap is formed between the two guide pillars, and one end of the packaging member can pass through the accommodation gap;

[0022] The tool assembly includes a tool holder and a tool fixedly mounted on the tool holder, the placement rack is provided with a mounting lug for mounting the tool holder, the tool holder is sleeved on the mounting lug and can be driven to move, and is used to drive the tool to cut the package;

[0023] The tool driving mechanism III includes a driving motor III and a cam, and the cam is movably connected to the tool holder to drive the tool holder to move.

[0024] Furthermore, it also includes a control mechanism, including a visual recognition unit, an encoder and a control unit. The encoder is set corresponding to the drive motor I, and is used to monitor the rotation angle and rotation speed of the motor shaft of the drive motor I and transmit the acquired information to the control unit. The visual recognition unit is used to collect point cloud data of the resin mold and transmit the acquired point cloud data to the control unit. The control unit is used to issue operation commands to the drive motor I, the drive motor II, the drive motor III, the drive cylinder and the cylinder.

[0025] Beneficial effects of the present invention: The packaging equipment for resin molds of the present invention can adjust the position of the resin mold in real time during the packaging process by setting a mold constraint mechanism and a posture adjustment mechanism, so that when the resin mold is packaged, it can adapt to resin molds of different sizes and shapes. Compared with the manual packaging of the prior art, it can save labor costs and at the same time can greatly improve the packaging efficiency, ensure the consistency of the packaging, and improve the packaging quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0027] Figure 1 It is a structural schematic diagram of the present invention;

[0028] Figure 2 is a structural schematic diagram of a rotating table assembly;

[0029] Figure 3 for Figure 2 Exploded diagram of

[0030] Figure 4 It is a structural schematic diagram of the winding mechanism;

[0031] Figure 5 for Figure 4 A schematic diagram of the structure from another perspective;

[0032] Figure 6 It is a structural schematic diagram of the linear slide mechanism;

[0033] Figure 7 It is a structural schematic diagram of the clamping mechanism;

[0034] Figure 8 It is a structural schematic diagram of the posture adjustment mechanism;

[0035] Fig. 9 is a schematic block diagram of a control unit;

[0036] The above drawings contain the following reference numerals:

[0037] 1. Support frame; 101. First step surface; 102. Second step surface; 2. Linear slide mechanism; 201. Column; 202. Drive motor II; 203. Slide rail; 204. Slide screw; 205. Coupling; 206. Guide bearing seat assembly; 207. Sliding block; 208. Connecting block; 209. Slide groove; 3. Winding mechanism; 301. Upper bending part; 302. Encapsulation; 303. Lower bending part; 304. Guide column; 305. Drive motor III; 306. Tool; 307. Tool holder; 3071. Slide groove; 308. Limit block; 309, mounting lug; 310, cam; 311, horizontal part; 4, clamping mechanism; 401, cylinder; 402, gantry; 403, clamping piece; 5, rotary table assembly; 501, turntable; 5011, mounting part; 502, turntable bracket; 5021, mounting hole; 503, drive motor I; 504, encoder; 505, belt; 6, posture adjustment mechanism; 601, base; 602, support platform; 603, drive cylinder; 604, lower articulated seat; 605, upper articulated seat; 7, loading platform; 701, flange. DETAILED DESCRIPTION

[0038] Figure 1 It is a structural schematic diagram of the present invention, Figure 2 is a schematic diagram of the structure of the rotating table assembly. Figure 3 for Figure 2Exploded diagram of Figure 4 is the structural diagram of the winding mechanism. Figure 5 for Figure 4 Another structural diagram from another perspective. Figure 6 It is the structural diagram of the linear slide mechanism. Figure 7 is the structural diagram of the clamping mechanism. Figure 8 is the structural diagram of the posture adjustment mechanism. Fig. 9 is a schematic block diagram of a control unit, such as Figure 1-9 As shown: The packaging device for the resin mold of this embodiment includes:

[0039] The mold restraining mechanism is used to fix the resin mold and enable the resin mold to be driven to rotate when in use; when in use, the mold restraining mechanism is used to fix the resin mold to be packaged. When the resin mold is fixed, the resin mold can be driven to rotate, thereby changing the posture of the resin mold. The rotation of the resin mold can be achieved through the matching structure of the turntable 501 (the resin mold is placed on the turntable 501) and the motor (used to drive the turntable 501 to rotate). Of course, other structures can also be used to facilitate the packaging of the resin mold;

[0040] The posture adjustment mechanism 6 is used to drive the mold constraint mechanism to convert the set position when the resin mold is in place, so as to adjust the posture of the resin mold; when the resin mold is in place, that is, when the resin mold is fixed by the mold constraint mechanism, the posture adjustment mechanism 6 drives the mold constraint mechanism to convert the set position, such as by rotating to change the position or displacement, etc. The posture adjustment mechanism 6 can be a six-degree-of-freedom parallel mechanism, etc. At this time, the position of the resin mold can be adjusted in multiple directions, so that the resin mold can be encapsulated in multiple directions, thereby improving the encapsulation effect of the resin mold;

[0041] The winding mechanism 3 is used to encapsulate the resin mold; in this structure, when the resin mold is in a state to be packaged, that is, in this state, the outside of the resin mold is covered with packaging paper or packaging film, the resin mold in the state to be packaged is constrained by the mold constraint mechanism, so as to encapsulate the resin mold. The shape and size of the resin mold can be any shape or size. Of course, the maximum specification does not exceed the maximum size that the device can accommodate. The winding mechanism 3 is set, and through the movement of the posture adjustment mechanism 6 and / or the mold constraint mechanism, while driving the resin mold to adjust its posture, it can drive the winding mechanism 3 to move, so as to complete the encapsulation of the resin mold, so there is no need to set up a special winding drive device, thereby reducing the use of parts. At the same time, the whole process can realize the automatic packaging of the resin mold, which greatly improves the working efficiency compared with manual packaging, and the packaging quality is high.

[0042] In the prior art, most of the existing packaging equipment on the market is only suitable for boxes with regular square shapes, and the packaging effect is not good for resin molds of different shapes and sizes. The packaging equipment for resin molds of the present invention, by setting a mold constraint mechanism and a posture adjustment mechanism 6, can adjust the position of the resin mold in real time during the packaging process, so that when the resin mold is packaged, it can adapt to resin molds of different sizes and shapes. Compared with the manual packaging of the prior art, it can save labor costs and at the same time can greatly improve the packaging efficiency, ensure the consistency of the packaging, and improve the packaging quality.

[0043] In this embodiment, the mold restraining mechanism includes a loading platform 7, a rotating table assembly 5 and a clamping mechanism 4. The rotating table assembly 5 is arranged on the loading platform 7. When in use, the resin mold is placed on the rotating table assembly 5 and can be driven to rotate. The clamping mechanism 4 is used to press the resin mold on the rotating table assembly 5; the loading platform 7 is a flat plate structure, the rotating table assembly 5 is placed on the loading platform 7, and the resin mold is placed on the rotating table assembly 5. When the resin mold is packaged, the clamping mechanism 4 presses the resin mold on the rotating table assembly 5. The rotation of the rotating table assembly 5 drives the resin mold to rotate, and the packaging component 302 can be wrapped around the circumference of the resin mold.

[0044] In this embodiment, the rotating table assembly 5 includes a turntable 501, a turntable bracket 502 and a turntable driving mechanism. The turntable bracket is fixedly connected to the loading platform 7. The turntable 501 is used to place the resin mold and is rotatably arranged on the turntable bracket 502. The turntable 501 driving mechanism is used to drive the turntable 501 to rotate. The cross-section of the turntable 501 is a T-shaped structure. The turntable 501 is provided with a mounting portion 5011, and the turntable bracket 502 is provided with a mounting hole 5021 adapted to the mounting portion 5011. The mounting portion 5011 The turntable bracket 502 is mounted on the mounting hole 5021 through a bearing. The turntable bracket 502 includes a fixed end and a support ear end. The fixed end is an annular structure. The mounting hole 5021 is set at the fixed end. The fixed end is fixedly connected to the loading platform 7. The support ear end is a triangular structure and is suspended relative to the loading platform 7 (that is, one end of the support ear end is connected to the upper part of the fixed end and maintains a certain distance from the loading platform 7). A sink groove is formed in the mounting hole 5021, and the bearing is placed on the sink groove, so that the turntable 501 can be rotatably set on the turntable bracket 502;

[0045] The turntable driving mechanism includes a driving motor I503, the output shaft of which is connected to the turntable 501 via a belt 505, so as to drive the turntable 501 to rotate; the driving motor I503 can be a stepping motor, which is arranged on the loading platform 7 and is located below the support ear end. At the same time, the output shaft of the driving motor I503 passes through the support ear end and is provided with a pulley, on which a belt 505 is provided, which is connected to the mounting portion 5011 via the belt 505. By arranging a bearing on the mounting portion 5011, the turntable 501 rotates smoothly and reduces the operating noise.

[0046] In this embodiment, the clamping mechanism 4 includes a gantry 402, a clamping member 403 and a cylinder 401. The gantry 402 is arranged on the loading platform 7 and spans across the two sides of the rotating table assembly 5. The cylinder 401 is arranged on the top of the gantry 402 and the piston rod of the cylinder 401 is fixedly connected to the clamping member 403, which is used to drive the clamping member 403 to move and clamp the resin mold by moving; the gantry 402 is fixedly connected to the loading platform 7, and the two ends of the gantry 402 are arranged on the two sides of the rotating table assembly 5, so that the rotating table assembly 5 is arranged on the gantry 40 2, the driving method of the cylinder 401 is an application of the prior art, which will not be described in detail here. The cylinder 401 is provided with an air pressure control valve. By providing the air pressure control valve, the extension and retraction speed of the piston rod of the cylinder 401 can be controlled, thereby controlling the pressing force of the pressing member 403. The pressing member 403 can be a disc structure. By providing the pressing member 403 as a disc structure, it can be ensured that the pressure applied to the resin mold during pressing is uniform, thereby avoiding damage to the resin mold. At the same time, the cylinder 401 is provided at the top of the gantry 402. When the resin mold is pressed, the piston rod moves from top to bottom (relative to Figure 1 When the pressing member 403 moves downward (in the up and down directions), the gantry 402 can also provide support and guidance for the pressing member 403 to ensure that the pressing member 403 runs smoothly during use. When the pressing member 403 moves downward, it presses the resin mold, and when it moves upward, it releases the resin mold.

[0047] In this embodiment, the posture adjustment mechanism 6 includes a support platform 602 and a plurality of drive cylinders 603. The plurality of drive cylinders 603 realize the posture change of the support platform 602 by changing the driving length, thereby driving the mold constraint mechanism to be converted to a set position; the posture adjustment mechanism 6 is a six-degree-of-freedom parallel mechanism, and the plurality of drive cylinders 603 are arranged below the support platform 602 and are hinged to the support platform 602. By changing the telescopic length of the plurality of drive cylinders 603, the posture change of the support platform 602 can be realized, and the mold constraint mechanism can be driven to be converted to a set position, thereby realizing the circumferential packaging of the resin mold.

[0048] In this embodiment, the support platform 602 and the loading platform 7 are detachably connected via a flange 701; the support platform 602 is disposed below the loading platform 7 and the loading platform 7 is detachably connected to the support platform 602 via a flange 701 and bolts, etc., to facilitate the disassembly and installation of the entire device;

[0049] The posture adjustment mechanism 6 also includes a base 601, and the base 601 is used to support the plurality of drive cylinders 603. The two ends of the plurality of drive rods are respectively hinged to the base 601 and the support platform 602; the drive cylinder 603 can be an electric cylinder or a hydraulic cylinder, etc. The base 601 is arranged below the support platform 602, that is, the plurality of drive cylinders 603 are arranged between the base 601 and the support platform 602, and the two ends of the plurality of drive cylinders 603 are respectively hinged to the base 601 and the support platform 602, and can be hinged to the base 601 and the support platform 602 by a ball joint or a Hooke's joint. An upper connecting end and a lower connecting end are respectively arranged at both ends of the drive cylinder 603, and the support platform An upper hinge seat 605 is provided on the table 602 corresponding to the upper connecting end, and a lower hinge seat 604 is provided on the base 601 corresponding to the lower connecting end. The upper connecting end is connected to the upper hinge seat 605 through a Hook's joint or a ball joint, and the lower connecting end is connected to the lower hinge seat 604 through a Hook's joint or a ball joint, so that the posture adjustment mechanism 6 has six degrees of freedom, and can translate along the X-axis, Y-axis and Z-axis and rotate around the X-axis, Y-axis and Z-axis, so as to meet the movement requirements of the resin mold during packaging, that is, it can translate along the front and back, left and right, and up and down, and perform rolling, pitching and yaw rotation movements. The movement mode of the plurality of driving cylinders 603 is an application of the prior art, and will not be repeated here;

[0050] There are six drive cylinders 603, which are arranged in pairs in a V shape and evenly distributed in the circumferential direction of the base 601; there are six drive cylinders 603, which are arranged in pairs in a V shape when viewed from top to bottom and in an eight-shaped arrangement when viewed from bottom to top, that is, the support platform 602 and the base 601 respectively have six hinge points, and the six hinge points are connected in sequence to form a regular hexagon, in which three groups of opposite sides are equal, thereby improving the stability of the posture adjustment mechanism 6.

[0051] In this embodiment, a support frame 1 is also included for forming a support. The support frame 1 is a stepped structure, including a first step surface 101 and a second step surface 102, wherein the second step surface 102 is higher than the first step surface 101, and the base 601 is arranged on the first step surface 101; the support frame 1 is a stepped structure. Of course, the support frame 1 can also be other shapes, so as to facilitate the installation of the posture adjustment mechanism 6 and the mold constraint mechanism, and form support for the posture adjustment mechanism 6 and the mold constraint mechanism, the first step surface 101 is lower than the second step surface 102, and the first step surface 101 and the second step surface 102 are flat, that is, relative to Figure 1 In the up-down direction, the first step surface 101 is located obliquely below the second step surface 102 , and the base 601 is disposed on the first step surface 101 , thereby forming support for the posture adjustment mechanism 6 .

[0052] In this embodiment, a linear slide mechanism 2 is also included, and the linear slide mechanism 2 includes a sliding drive mechanism, a column 201 and two guide bearing seat assemblies 206. The column 201 is arranged on the second step surface 102, and two slide rails 203 are arranged on the column 201 at intervals. The two guide bearing seat assemblies 206 are respectively arranged at the bottom and the top of the column 201 and are located between the two slide rails 203; the column 201 is a flat plate-like structure, and the column 201 is provided with a left-right direction (relative to the left and right direction) of the column 201. Figure 6 Two guide rails 203 are arranged at intervals along the vertical direction of the column 201 (relative to the left and right direction in the figure), and two guide bearing seat assemblies 206 are arranged along the vertical direction of the column 201 (relative to the left and right direction in the figure). Figure 6 The column 201 is provided with a U-shaped opening groove along the vertical direction, the U-shaped opening groove is arranged between the two slide rails 203, and two guide bearing seat assemblies 206 are arranged in the U-shaped opening groove. The guide bearing seat assembly 206 includes a guide bearing seat, and the guide bearing seat is fixedly connected to the column 201 by bolts. It is an application of the prior art and will not be repeated here;

[0053] The sliding drive mechanism includes a driving motor II 202, a coupling 205 and a sliding screw 204. The driving motor II 202 is arranged on the second step surface 102 and the output shaft passes through the second step surface 102 and is connected to the sliding screw 204 through the coupling 205. The sliding screw 204 passes through two guide bearing seats and a slider 207 is arranged on the sliding screw 204. The slider 207 is provided with a slide groove 209 that cooperates with the slide rail 203. The slider 207 can be driven to slide along the slide rail 203. In this structure, a through hole is provided on the guide bearing seat for the sliding screw 204 to pass through. The structure and shape of the guide bearing seat are not limited. The upper and lower ends of the sliding screw 204 (the upper and lower ends are relative to each other) can be adjusted by two guide bearing seat assemblies 206. Figure 6The output shaft of the driving motor II 202 is connected to the sliding screw 204 through a coupling 205, so as to facilitate driving the sliding cylinder 401 to rotate. A slider 207 is arranged on the sliding screw 204, and the slider 207 is respectively provided with slide grooves 209 cooperating with the two slide rails 203, that is, there are two slide grooves 209, and the slider 207 is provided with a connecting block 208 cooperating with the sliding screw 204. The sliding screw 204 can pass through the connecting block 208, so as to connect the slider 207 with the sliding screw 204, and can be driven to move up and down along the slide rail 203. The matching mode of the slide groove 209 and the slide rail 203 is the application of the existing technology, which will not be repeated here.

[0054] In this embodiment, the winding mechanism 3 can be driven to move, including a packaging part 302, and the packaging part 302 can be operated to be wound on the resin mold and can be cut; the winding mechanism 3 can be driven to move, and by changing the position of the winding mechanism 3, it can adapt to resin molds of different shapes and sizes. The packaging part 302 can be a tape, etc. When in use, one end of the tape is manually fixedly connected to the resin mold, and through the movement of the posture adjustment mechanism 6 and / or the mold constraint mechanism, while driving the resin mold to adjust its posture, the tape can be driven to be wound on the resin mold. When the encapsulation of the resin mold is completed, the connection between the packaging part 302 and the resin mold is disconnected. At this time, the encapsulated resin mold can be removed, so there is no need to set up a special packaging part winding drive device. The packaging part 302 can be driven to be wound on the resin mold by adjusting the posture of the resin mold;

[0055] The winding mechanism 3 also includes a placement rack, a tool assembly and a tool driving mechanism III. The placement rack is fixedly connected to the slider 207. The package 302 is arranged on the placement rack. One end of the placement rack is provided with two spaced guide posts 304. An accommodating gap is formed between the two guide posts 304. One end of the package 302 can pass through the accommodating gap. The placement rack is a Z-shaped structure, including an upper bending portion 301, a horizontal portion 311 and a lower bending portion 303. The upper bending portion 301 is fixedly connected to the slider 207, so that the position of the placement rack can be adjusted by moving the slider 207 up and down, thereby adjusting the position of the package 302. The package 302 is placed on the horizontal portion 311, and a mounting position for placing the package 302 is provided on the horizontal portion 311. A through hole is opened on the mounting position, and the axis of the through hole is coaxial with the axis of the package 302 (the package 302 is generally a tape roll, and the tape roll is generally a ring structure). , provided with a placement hole), a tension adjustment motor for adjusting the tension of the package 302 is provided below the installation position, and the output shaft of the tension adjustment motor (not shown in the figure) passes through the through hole (the tension of the package wrapped around the surface of the object can be adjusted by adjusting the rotation speed of the tension adjustment motor, etc.), when the package 302 is in use, the placement hole on the package 302 passes through the output shaft, so that it is installed in the installation position, and the tension adjustment motor is provided, so that the packaging effect of the resin mold can be improved, especially for special-shaped resin molds, two guide columns 304 are provided at one end of the horizontal part 311 away from the slider 207, and a receiving gap is formed between the two guide columns 304 for accommodating one end of the package 302 (i.e., one end of the tape), when in use, one end of the package 302 passes through the receiving gap and is bonded to the resin mold, so that it is convenient to complete the packaging of the resin mold with the movement of the posture adjustment mechanism 6 and the mold constraint mechanism;

[0056] The tool assembly includes a tool holder 307 and a tool 306 fixedly mounted on the tool holder 307, a mounting lug 309 for mounting the tool holder 307 is arranged on the placement rack, the tool holder 307 is sleeved on the mounting lug 309 and can be driven to move, so as to drive the tool 306 to cut the package 302; in this structure, the mounting lug 309 is arranged on the lower bending portion 303, the mounting lug 309 and the lower bending portion 303 form a T-shaped structure, a through groove is arranged on the mounting lug 309 (that is, the mounting lug 309 is a door-shaped structure, fixed on the lower bending portion 303), the tool holder 307 is provided with a sliding groove 3071 cooperating with the mounting lug 309, and the length of the sliding groove 3071 is greater than the length of the mounting lug 309 The tool holder 307 is provided with a limit block 308, which is provided on the outer side of the tool holder 307 (the outer side is the side away from the package 302, and the inner side is the side close to the package 302). The limit block 308 is inserted into the through slot and fixed to the lower bending portion 303 by bolts, so as to limit the tool holder 307 to prevent the tool holder 307 from being separated from the mounting lug 309 during the movement. The tool holder 307 is a T-shaped structure as a whole, and the tool 306 is provided above the tool holder 307. At the same time, a distance is formed between the tool 306 and the guide column 304, so that the tool 306 can be driven to move by the movement of the tool holder 307 (that is, the movement route of the tool holder 307 is approximately parallel to the lower bending portion 303), thereby completing the cutting of the package 302.

[0057] The tool drive mechanism III includes a drive motor III 305 and a cam 310, and the cam 310 is movably connected to the tool holder 307 for driving the tool holder 307 to move; the tool holder 307 is provided with a cam accommodating space, the drive motor III 305 is arranged on the lower bending portion 303 and the output shaft passes through the lower bending portion 303 and is connected to the cam 310, the cam 310 is arranged in the cam accommodating space and is movably connected to the tool holder 307, so that the tool holder 307 can be driven to move within a certain range through the movement of the cam 310, and the length of the sliding groove 3071 can be set according to the movement trajectory of the cam 310, so that the overall structure is simple and easy to operate, and the guide column 304 can also be set to prevent the tool 306 from tilting during cutting, which can ensure the smoothness and accuracy of the cutting process and ensure that the size and shape of each cutting are basically consistent.

[0058] In this embodiment, a control mechanism is also included, including a visual recognition unit, an encoder 504 and a control unit. The encoder 504 is set corresponding to the drive motor I 503, and is used to monitor the rotation angle and rotation speed of the motor shaft of the drive motor I 503 and transmit the acquired information to the control unit. The visual recognition unit is used to collect point cloud data of the resin mold and transmit the acquired point cloud data to the control unit. The control unit is used to issue operation commands to the drive motor I 503, the drive motor II 202, the drive motor III 305, the drive cylinder 603 and the cylinder 401; the control unit can be a combination of a CPU and a peripheral circuit, and the air pressure control valve is also controlled by the control unit. The control input end of the air pressure control valve is connected to the control output end of the control unit. The encoder 504 transmits the acquired information of the rotation angle and rotation speed of the motor shaft of the drive motor I 503 to the control unit, so that the rotation angle and rotation speed of the turntable 501 can be obtained. The visual recognition unit is set on the second step surface 1 02 or the top of the column 201, the visual recognition unit is a depth camera, and the visual recognition unit can also be replaced by a laser radar, etc.; a three-dimensional coordinate system is established around the resin mold, and the depth camera is used to collect point cloud data of the resin mold (when the resin mold is placed on the turntable 501, the turntable 501 completes the point cloud data collection of the resin mold after one rotation), and the acquired point cloud data is divided into a group according to the Z-axis coordinate, and each interval (such as 10mm) is divided into a group, and the point cloud data center coordinates of each group of point cloud data are obtained by calculating the X, Y and Z coordinates of each group of point cloud data. Each group of point cloud data center coordinates are connected to obtain a broken line, which is the approximate central axis of the resin mold. The resin mold is set to have a winding center line. In order to ensure the winding quality, the position adjustment mechanism 6, the rotating table assembly 5 and the placement frame position are adjusted so that the central axis of the resin mold and the winding center line always coincide, that is, when the resin mold is packaged, the resin mold is placed on the Z axis (relative to the Figure 1The resin mold is divided into sections (in the up and down directions), and the central axis of each section is calculated. When the section is wound, the control unit controls the operation of the drive motor I 503, the drive motor II 202, the cylinder 401 and the drive cylinder 603, so that when each section of the resin mold is wound, the central axis of each section always coincides with the winding center line, thereby ensuring the winding quality of the section. When the control unit controls the operation of the drive cylinder 603, the control unit performs data calculations based on the posture of the resin mold to be achieved (i.e., the position that the drive cylinder 603 needs to reach after being extended and retracted from the initial position, at which the central axis and the winding center line can coincide with each other). For example, the length that each drive cylinder 603 needs to reach is obtained through kinematic inverse solution, and then the initial length of the drive cylinder 603 is subtracted to obtain the length that the drive cylinder 603 needs to reach. The amount of extension and retraction, so that the control unit controls the drive cylinder 603 to extend and retract to reach the specified length, completes the posture change of the resin mold, the coordinate change required for the posture change of the posture adjustment mechanism 6 can be obtained through the existing technology, for the application of the existing technology, here, no further details, when winding, the position of the placement rack needs to be kept flush with each section of the resin mold when winding, and at the same time, because the resin mold is a special-shaped, when winding this section, in order to improve the winding quality, the control unit can control the tension adjustment motor (the control unit controls the output speed of the tension adjustment motor) to adjust the winding tension of the package 302, thereby ensuring the winding quality of this section, after completing the winding, the control unit controls the drive motor III 305 to run, cut the package 302, and complete the packaging of the resin mold.

[0059] The encapsulation device for resin molds of the present invention, when working, places the resin mold on the turntable 501, and presses the resin mold by the pressing member 403. Then, the control unit segments the resin mold according to the point cloud data of the resin mold obtained by the visual recognition unit and obtains the central axis of each section of the resin mold, controls the rotation of the turntable 501 and the movement of the posture adjustment mechanism 6, and combines the movement of the linear slide mechanism 2 to complete the segmented encapsulation of the resin mold. When the encapsulation of each section is completed, the control unit controls the drive motor III 305 to run, and completes the encapsulation of the encapsulated parts. 302 is cut, and then the work is repeated again. When the overall packaging of the resin mold is completed, the drive motor I503, the drive motor II202, the drive motor III305 and the drive cylinder 603 are controlled to stop running, and then a running command is issued to the cylinder 401, and the clamping part 403 moves upward to release the resin mold. The resin mold can be removed. When the overall equipment starts to wind the resin mold, one end of the packaging part 302 needs to be fixed on the resin mold first. The whole process can realize automatic packaging, which can improve work efficiency and packaging quality compared with manual packaging.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

Claims

1. A packaging device for a resin mold, characterized in that: include: A mold restraining mechanism, used to fix the resin mold and enable the resin mold to be driven to rotate when in use; A posture adjustment mechanism, used for driving the mold constraint mechanism to convert a set orientation when the resin mold is in place, thereby adjusting the posture of the resin mold; The winding mechanism is used to encapsulate the resin mold.

2. The encapsulation device for resin mold according to claim 1, characterized in that: The mold restraint mechanism includes a loading platform, a rotating table assembly and a clamping mechanism. The rotating table assembly is arranged on the loading platform. When in use, the resin mold is placed on the rotating table assembly and can be driven to rotate. The clamping mechanism is used to press the resin mold onto the rotating table assembly.

3. The encapsulation device for resin mold according to claim 2, characterized in that: The rotating table assembly includes a rotating table, a rotating table bracket and a rotating table driving mechanism, wherein the rotating table bracket is fixedly connected to the loading platform, the rotating table is used to place the resin mold and is rotatably arranged on the rotating table bracket, and the rotating table driving mechanism is used to drive the rotating table to rotate; The turntable driving mechanism includes a driving motor I, and the output shaft of the driving motor I is connected to the turntable through a belt drive to drive the turntable to rotate.

4. The encapsulation device for resin mold according to claim 2, characterized in that: The clamping mechanism includes a gantry, a clamping piece and a cylinder. The gantry is arranged on the loading platform and spans across both sides of the rotating table assembly. The cylinder is arranged on the top of the gantry and the piston rod of the cylinder is fixedly connected to the clamping piece for driving the clamping piece to move and clamp the resin mold by moving.

5. The encapsulation device for resin mold according to claim 3, characterized in that: The posture adjustment mechanism includes a support platform and a plurality of drive cylinders. The plurality of drive cylinders change the posture of the support platform by changing the drive length, thereby driving the mold constraint mechanism to switch to a set orientation.

6. The encapsulation device for resin mold according to claim 5, characterized in that: The support platform and the loading platform are detachably connected via a flange; The posture adjustment mechanism further includes a base, the base is used to support the plurality of drive cylinders, and the two ends of the plurality of drive rods are respectively hinged to the base and the support platform; There are six driving cylinders in total, which are arranged in pairs in a V shape and evenly distributed in the circumferential direction of the base.

7. The encapsulation device for resin mold according to claim 6, characterized in that: It also includes a support frame for forming a support, the support frame is a stepped structure, including a first step surface and a second step surface, the second step surface is higher than the first step surface, and the base is arranged on the first step surface.

8. The encapsulation device for resin mold according to claim 7, characterized in that: It also includes a linear slide mechanism, which includes a sliding drive mechanism, a column and two guide bearing seat assemblies, wherein the column is arranged on the second step surface, two slide rails are arranged on the column at intervals, and the two guide bearing seat assemblies are respectively arranged at the bottom and the top of the column and located between the two slide rails; The sliding drive mechanism includes a drive motor II, a coupling and a sliding screw. The drive motor II is arranged on the second step surface and the output shaft passes through the second step surface and is connected to the sliding screw through a coupling. The sliding screw passes through two guide bearing seats and a slider is arranged on the sliding screw. The slider is provided with a sliding groove that cooperates with the sliding rail, and the slider can be driven to slide along the sliding rail.

9. The encapsulation device for resin mold according to claim 8, characterized in that: The winding mechanism can be driven to move, including a packaging member, and the packaging member can be operated to be wound on the resin mold and can be cut; The winding mechanism further includes a placing frame, a tool assembly and a tool driving mechanism III, the placing frame is fixedly connected to the slider, the packaging member is arranged on the placing frame, one end of the placing frame is provided with two guide pillars arranged at intervals, and an accommodation gap is formed between the two guide pillars, and one end of the packaging member can pass through the accommodation gap; The tool assembly includes a tool holder and a tool fixedly mounted on the tool holder, the placement rack is provided with a mounting lug for mounting the tool holder, the tool holder is sleeved on the mounting lug and can be driven to move, and is used to drive the tool to cut the package; The tool driving mechanism III includes a driving motor III and a cam, and the cam is movably connected to the tool holder to drive the tool holder to move.

10. The encapsulation device for resin mold according to claim 9, characterized in that: It also includes a control mechanism, including a visual recognition unit, an encoder and a control unit. The encoder is set corresponding to the drive motor I, and is used to monitor the rotation angle and rotation speed of the motor shaft of the drive motor I and transmit the acquired information to the control unit. The visual recognition unit is used to collect point cloud data of the resin mold and transmit the acquired point cloud data to the control unit. The control unit is used to issue operation commands to the drive motor I, the drive motor II, the drive motor III, the drive cylinder and the cylinder.

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