SIC wafer appearance testing device and use method

Abstract

The invention discloses an SIC wafer appearance testing device and a use method, and belongs to the technical field of SIC wafer processing equipment.The SIC wafer appearance testing device comprises a detection table body, a support is installed at the top of the detection table body, and during use, a wafer plate needing to be detected is placed above a feeding table, then the feeding table is driven by an electric push rod to horizontally slide to a designated position along a sliding groove, and the wafer plate is placed on the support; a lifting motor is controlled to drive a telescopic table to push a wafer plate upwards to the horizontal position of a clamping groove, then a transmission motor is controlled to drive a transmission rod to rotate, the transmission rod and a sliding table are in threaded transmission, the sliding table is driven to move horizontally, and the wafer plate is rapidly clamped by a clamping plate; after the contact type inductor confirms that the clamping plate is completely closed, the synchronous motor is started to drive the clamping plate to turn over, and finally the scanning detector is controlled to detect the front face and the back face of the wafer plate, so that the detection operation of the wafer plate is completed, and the SIC wafer appearance testing device and the using method are completed.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a SIC wafer appearance testing device and a use method thereof. Background Art

[0002] In today's era of rapid technological development, the semiconductor industry plays a vital role and is widely used in many fields such as electronic equipment, communications, new energy, and automobiles. Among them, the production process of SIC wafers is relatively complicated, and it is easy to produce surface scratches, cracks and other defects. Appearance inspection is required before use. When the existing SIC wafer appearance inspection device is used, only the single-sided appearance of the SIC wafer is inspected in the early stage, and manual loading is required, and the inspection efficiency is low. Therefore, we need a SIC wafer appearance test device and a method of use.

[0003] The existing SIC wafer testing device cannot perform double-sided flipping inspection and automatic loading during operation, and therefore a SIC wafer appearance testing device and a method for using the same are urgently needed. Summary of the invention

[0004] The object of the present invention is to provide a SIC wafer appearance test device and a method for using the same to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A SIC wafer appearance test device and a use method, comprising a test platform body, a bracket installed on the top of the test platform body, a scanning detector installed on the outer wall of the bracket, a slide groove opened on the inner wall of the test platform body, a transmission motor installed on the outer wall of the transmission motor, a transmission rod installed on the outer wall of the transmission rod, a slide table installed on the outer wall of the transmission rod, a synchronous motor installed on the outer wall of the slide table, a clamping plate installed on the outer wall of the synchronous motor, a card slot opened on the inner wall of the clamping plate, a contact sensor installed on the side wall of the clamping plate, an electric push rod installed on the side wall of the test platform body, a loading platform installed on the outer wall of the electric push rod, a round wafer plate installed on the outer wall of the loading platform, a lifting motor installed on the bottom of the test platform body, and a telescopic platform installed on the top of the lifting motor.

[0007] Preferably, the bracket is welded to the main body of the detection platform, and the slide groove is symmetrically arranged with the central axis of the main body of the detection platform as the center.

[0008] Preferably, the transmission rod is threadedly connected to the slide, and the slide is snap-fittedly connected to the detection platform body.

[0009] Preferably, the clamping plate forms a rotating structure with the slide table through a synchronous motor, and the clamping plate is arranged in a C shape.

[0010] Preferably, the card slot is engaged and connected with the wafer plate, and the contact sensor is tightly fitted with the clamping plate.

[0011] Preferably, the loading platform is tightly fitted to the round wafer, and the loading platform is slidably connected to the slide groove.

[0012] A SIC wafer appearance test device and a method for using the same include the following steps:

[0013] S1. Place the wafer to be inspected on the loading platform, and then use the electric push rod to drive the loading platform to slide horizontally along the slide to the specified position;

[0014] S2, control the lifting motor to drive the telescopic table to push the round wafer upward to the horizontal position of the card slot to realize automatic loading;

[0015] S3, controlling the transmission motor to drive the transmission rod to rotate, so that the transmission rod and the slide table are threaded, thereby driving the slide table to move horizontally, so that the clamping plate can quickly clamp the wafer plate;

[0016] S4, when the clamping plate clamps the wafer through the clamping slot and confirms that the clamping plate is completely closed through the contact sensor, the synchronous motor is started to drive the clamping plate to flip;

[0017] S5. Finally, the scanning detector is controlled to detect the front and back sides of the round wafer to complete the detection operation of the round wafer.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The transmission motor, transmission rod and slide are set up. The transmission motor is started to drive the transmission rod to rotate, so that the transmission rod and the slide are threaded, thereby driving the slide to move horizontally, which is convenient for the clamping plate to quickly clamp the wafer.

[0020] 2. The synchronous motor, clamp, slot and contact sensor are set. When the clamp clamps the wafer through the slot and the contact sensor confirms that the clamp is completely closed, the synchronous motor is started to drive the clamp to flip, so that the scanning detector can detect the front and back sides of the wafer, thereby improving the detection efficiency.

[0021] 3. Use the set slide, electric push rod, loading table, wafer, lifting motor and telescopic table to place the wafer to be tested on the loading table, and then use the electric push rod to drive the loading table to slide horizontally along the slide to the specified position, and then use the lifting motor to drive the telescopic table to push the wafer upward to the horizontal position of the slot, and then fix it with a clamp to achieve automatic loading and reduce labor intensity. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the front view appearance of a SIC wafer appearance testing device and a method of using the present invention;

[0023] Figure 2 A schematic structural diagram of a disassembled slide assembly of a SIC wafer appearance test device and a method for using the present invention;

[0024] Figure 3 A schematic structural diagram showing details of components around a clamping plate of a SIC wafer appearance testing device and a method for using the present invention;

[0025] Figure 4 A schematic structural diagram showing the disassembled components around the loading platform of a SIC wafer appearance testing device and a method for using the present invention;

[0026] In the figure: 1. Inspection table body; 2. Bracket; 3. Scanning detector; 4. Slide; 5. Transmission motor; 6. Transmission rod; 7. Slide; 8. Synchronous motor; 9. Clamp; 10. Card slot; 11. Contact sensor; 12. Electric push rod; 13. Loading table; 14. Wafer plate; 15. Lifting motor; 16. Telescopic table. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] See also Figure 1-4 The present invention provides a SIC wafer appearance test device and a method of using the technical solution:

[0029] A SIC wafer appearance test device and a use method thereof, comprising a test platform body 1, a bracket 2 is installed on the top of the test platform body 1, a scanning detector 3 is installed on the outer wall of the bracket 2, a slide groove 4 is provided on the inner wall of the test platform body 1, a transmission motor 5 is installed on the outer wall of the transmission motor 5, a transmission rod 6 is installed on the outer wall of the transmission rod 6, a slide table 7 is installed on the outer wall of the transmission rod 6, a synchronous motor 8 is installed on the outer wall of the slide table 7, a clamping plate 9 is installed on the outer wall of the synchronous motor 8, a card slot 10 is provided on the inner wall of the clamping plate 9, a contact sensor 11 is installed on the side wall of the clamping plate 9, an electric push rod 12 is installed on the side wall of the test platform body 1, a loading platform 13 is installed on the outer wall of the electric push rod 12, a round wafer plate 14 is installed on the outer wall of the loading platform 13, a lifting motor 15 is installed on the bottom of the test platform body 1, and a telescopic platform 16 is installed on the top of the lifting motor 15.

[0030] The bracket 2 is welded to the detection platform body 1 , and the slide groove 4 is symmetrically arranged with the central axis of the detection platform body 1 as the center.

[0031] The transmission rod 6 is threadedly connected to the slide 7 , and the slide 7 is snap-connected to the detection platform body 1 .

[0032] The clamping plate 9 forms a rotating structure with the slide 7 through the synchronous motor 8, and the clamping plate 9 is arranged in a C shape.

[0033] The card slot 10 is connected with the wafer plate 14 by card engagement, and the contact sensor 11 is closely attached to the clamping plate 9 .

[0034] The loading platform 13 is tightly fitted with the round wafer 14 , and the loading platform 13 is slidably connected with the slide chute 4 .

[0035] A SIC wafer appearance test device and a method for using the same include the following steps:

[0036] S1, placing the wafer 14 to be inspected on the loading platform 13, and then driving the loading platform 13 to slide horizontally along the slide 4 to a specified position through the electric push rod 12;

[0037] S2, control the lifting motor 15 to drive the telescopic table 16 to push the round wafer 14 upward to the horizontal position of the card slot 10 to realize automatic loading;

[0038] S3, controlling the transmission motor 5 to drive the transmission rod 6 to rotate, so that the transmission rod 6 and the slide 7 are threadedly transmitted, thereby driving the slide 7 to move horizontally, so that the clamping plate 9 can quickly clamp the wafer 14;

[0039] S4, when the clamping plate 9 clamps the wafer 14 through the clamping slot 10, and after the contact sensor 11 confirms that the clamping plate 9 is completely closed, the synchronous motor 8 is started to drive the clamping plate 9 to flip;

[0040] S5 , finally controlling the scanning detector 3 to detect the front and back sides of the round wafer 14 , and completing the detection operation of the round wafer 14 .

[0041] It should be noted that the present invention is a SIC wafer appearance test device and a method of use. When in use, the wafer plate 14 to be tested is placed above the loading platform 13, and then the electric push rod 12 drives the loading platform 13 to slide horizontally along the slide slot 4 to a specified position, and the lifting motor 15 is controlled to drive the telescopic platform 16 to push the wafer plate 14 upward to the horizontal position of the card slot 10, and then the transmission motor 5 is controlled to drive the transmission rod 6 to rotate, so that the transmission rod 6 and the slide 7 are threadedly transmitted, and the slide 7 is driven to move horizontally, so that the clamp 9 quickly clamps the wafer plate 14. When the clamp 9 clamps the wafer plate 14 through the card slot 10, after confirming that the clamp 9 is completely closed through the contact sensor 11, the synchronous motor 8 is started to drive the clamp 9 to flip, and finally the scanning detector 3 is controlled to detect the front and back sides of the wafer plate 14 to complete the detection operation of the wafer plate 14. In this way, a SIC wafer appearance test device and a method of use are completed.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A SIC wafer appearance test device, characterized in that: The invention comprises a detection platform body (1), a bracket (2) is installed on the top of the detection platform body (1), a scanning detector (3) is installed on the outer wall of the bracket (2), a slide groove (4) is opened on the inner wall of the detection platform body (1), a transmission motor (5) is installed on the outer wall of the transmission motor (5), a transmission rod (6) is installed on the outer wall of the transmission rod (6), a slide table (7) is installed on the outer wall of the transmission rod (6), a synchronous motor (8) is installed on the outer wall of the slide table (7), and the outer wall of the synchronous motor (8) is provided with a plurality of transmission rods (6). A clamping plate (9) is installed on the wall, a slot (10) is opened on the inner wall of the clamping plate (9), a contact sensor (11) is installed on the side wall of the clamping plate (9), an electric push rod (12) is installed on the side wall of the detection platform body (1), a loading platform (13) is installed on the outer wall of the electric push rod (12), a wafer plate (14) is installed on the outer wall of the loading platform (13), a lifting motor (15) is installed at the bottom of the detection platform body (1), and a telescopic platform (16) is installed on the top of the lifting motor (15).

2. The SIC wafer appearance test device according to claim 1, characterized in that: The bracket (2) is welded to the detection platform body (1), and the slide groove (4) is symmetrically arranged with the central axis of the detection platform body (1) as the center.

3. The SIC wafer appearance test device according to claim 1, characterized in that: The transmission rod (6) is threadedly connected to the slide table (7), and the slide table (7) is snap-connected to the detection table body (1).

4. The SIC wafer appearance test device according to claim 1, characterized in that: The clamping plate (9) forms a rotating structure with the slide table (7) through a synchronous motor (8), and the clamping plate (9) is arranged in a C shape.

5. The SIC wafer appearance test device according to claim 1, characterized in that: The card slot (10) is card-engaged with the circular wafer (14), and the contact sensor (11) is tightly fitted with the clamping plate (9).

6. The SIC wafer appearance test device according to claim 1, characterized in that: The loading platform (13) is tightly fitted with the round wafer (14), and the loading platform (13) is slidably connected with the slide groove (4).

7. A method for using a SIC wafer appearance test device, characterized in that: The following steps are involved: S1. Place the round wafer (14) to be inspected on the loading platform (13), and then drive the loading platform (13) to slide horizontally along the slide groove (4) to a designated position by means of the electric push rod (12); S2, controlling the lifting motor (15) to drive the telescopic platform (16) to push the round wafer plate (14) upward to the horizontal position of the card slot (10), thereby realizing automatic loading; S3, controlling the transmission motor (5) to drive the transmission rod (6) to rotate, so that the transmission rod (6) and the slide table (7) are threadedly transmitted, thereby driving the slide table (7) to move horizontally, so that the clamping plate (9) can quickly clamp the round wafer (14); S4, when the clamping plate (9) clamps the wafer (14) through the clamping slot (10), and after the contact sensor (11) confirms that the clamping plate (9) is completely closed, the synchronous motor (8) is started to drive the clamping plate (9) to flip; S5. Finally, the scanning detector (3) is controlled to detect the front and back sides of the round wafer (14), thereby completing the detection operation of the round wafer (14).

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