Connection assembly and semiconductor process equipment

Abstract

The invention discloses a connecting assembly and semiconductor process equipment, and belongs to the technical field of semiconductor processing, the connecting assembly is connected between a process chamber and a transmission chamber, the connecting assembly comprises a connecting plate, a first sealing ring and a second sealing ring, the connecting plate is provided with a transmission port, and the transmission port penetrates through the connecting plate in the thickness direction of the connecting plate; a first sealing groove and a second sealing groove are formed in the first surface, facing the process cavity, of the connecting plate, the second sealing groove is formed outside the first sealing groove in a surrounding mode, the first sealing ring is arranged in the first sealing groove, and the second sealing ring is arranged in the second sealing groove. And the first sealing ring and the second sealing ring are both used for connecting the first surface of the connecting plate and the process chamber in a sealing manner. The connecting assembly can solve the problem that the sealing ring arranged between the process chamber and the connecting plate is easy to lose efficacy in the current semiconductor process equipment.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and specifically relates to a connection component and semiconductor process equipment. Background Art

[0002] Chemical vapor deposition is a commonly used process in semiconductor processing. During the deposition process, the wafer needs to be transferred from a transfer chamber to a process chamber. The transfer chamber is provided with a transfer valve, and the transfer valve is opened and closed according to demand.

[0003] During the deposition process, the transfer valve needs to be in a closed state, and in order to ensure that the sealing reliability of the process chamber is relatively high, a connecting plate is usually provided between the transfer valve and the process chamber, and a sealing groove is provided on the surface of the connecting plate, and a sealing ring is provided in the sealing groove, so that the sealing ring forms a sealed connection relationship between the mutually facing surfaces of the process chamber and the connecting plate. However, since the process temperature of the deposition process is usually relatively high, this will have a significant adverse effect on the sealing reliability of the sealing ring, thereby causing the process chamber to have sealing failure problems. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a connection component and a semiconductor process equipment to solve the problem that the sealing ring arranged between the process chamber and the connection plate in the current semiconductor process equipment is prone to failure.

[0005] In a first aspect, an embodiment of the present application discloses a connection component connected between a process chamber and a transfer chamber, the connection component including a connection plate, a first sealing ring and a second sealing ring, the connection plate being provided with a transfer port, the transfer port being arranged through the connection plate along a thickness direction of the connection plate, and a first sealing groove and a second sealing groove being arranged on a first surface of the connection plate facing the process chamber, the second sealing groove being arranged around the outside of the first sealing groove, the first sealing ring being arranged in the first sealing groove, the second sealing ring being arranged in the second sealing groove, and the first sealing ring and the second sealing ring being both used to seal and connect the first surface of the connection plate with the process chamber.

[0006] In the second aspect, an embodiment of the present application discloses a semiconductor process equipment, which includes a process chamber, a transfer chamber and the above-mentioned connecting assembly, the process chamber and the transfer chamber are respectively fixedly installed on opposite sides of the connecting assembly, and the first sealing ring and the second sealing ring are extruded between the process chamber and the connecting plate.

[0007] The embodiment of the present application discloses a connection assembly, which can be connected between a process chamber and a transmission chamber. A connection plate in the connection assembly is provided with a transmission port, and the transmission port is arranged through the connection plate along the thickness direction of the connection plate, so that the wafer can pass through the transmission port and be transferred between the process chamber and the transmission chamber. At the same time, a first sealing groove and a second sealing groove are provided on the first surface of the transmission plate facing the process chamber, and the second sealing groove is arranged around the outside of the first sealing groove. By setting the first sealing ring in the connection assembly in the first sealing groove and the second sealing ring in the connection assembly in the second sealing groove, the first sealing ring and the second sealing ring can be used to seal the connection between the first surface and the process chamber. In this case, even if the reliability of the first sealing ring relatively close to the transmission port is reduced by high temperature, since the second sealing ring is also provided outside the first sealing ring, the sealing reliability between the process chamber and the connection plate can be ensured to be always relatively high, thereby preventing the process chamber from sealing failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 This is a schematic diagram of the assembly of the connection assembly disclosed in the embodiment of the present application; Figure 2 It is a schematic diagram of assembling the connection assembly disclosed in the embodiment of the present application with the process chamber and the transfer chamber; Figure 3 It is a schematic cross-sectional view of the assembly of the connection assembly disclosed in the embodiment of the present application with the process chamber and the transfer chamber; Figure 4 for Figure 3 A magnified schematic diagram of the structure in the middle; Figure 5 It is a schematic cross-sectional view of the assembly of the connection assembly disclosed in the embodiment of the present application with the process chamber and the transfer chamber at another position; Figure 6 for Figure 5 A magnified schematic diagram of the structure in the middle; Figure 7 A schematic diagram of the structure of the connection assembly disclosed in the embodiment of the present application; Figure 8 This is a schematic diagram of the structure of the connection assembly disclosed in an embodiment of the present application in another direction.

[0009] Reference numerals: 100-connecting plate, 110-plate body, 111a-first sealing groove, 111b-second sealing groove, 112-transmission port, 113a-first purge channel, 113b-second purge channel, 113c-connecting channel, 116a-first sink, 116b-second sink, 116c-third sink, 117-mounting hole, 118a-first contact surface, 118b-second contact surface, 118c-mounting contact surface, 119-first suction channel, 120-heat sink, 210-first sealing ring, 220-second sealing ring, 230-third sealing ring, 240-fourth sealing ring, 300- thermal insulation, 400-process chamber, 410-first avoidance sink, 500 -transmission chamber, 510 -cavity, 511a -third sealing groove, 511b -fourth sealing groove, 513 -second suction channel, 514 -fourth sink, 515 -second avoidance sink, 520 -transmission valve. DETAILED DESCRIPTION

[0010] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0011] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0012] like Figure 1-Figure 8 As shown, an embodiment of the present application discloses a connection component, which can be applied to semiconductor process equipment. More specifically, the aforementioned semiconductor process equipment is used to perform a chemical vapor deposition process, and it also includes a process chamber 400 and a transfer chamber 500.

[0013] like Figures 1 to 3As shown, the connection assembly disclosed in the embodiment of the present application can be connected between the process chamber 400 and the transfer chamber 500, so that a connection relationship can be formed between the process chamber 400 and the transfer chamber 500. At the same time, in order to ensure that the process chamber 400 can be isolated from the transfer chamber 500 during the process, the transfer chamber 500 can include a cavity 510 and a transfer valve 520. The transfer valve 520 has an opening and closing function, and then before the process, the transfer valve 520 can be controlled to be closed first. Correspondingly, when the film transfer work is required, the transfer valve 520 can be controlled to be opened. In this case, in order to ensure that the process chamber 400 can form a sealed state, it is necessary to make the sealing effect between the connection assembly and the process chamber 400 relatively good.

[0014] Furthermore, in an embodiment of the present application, the connecting assembly may include a connecting plate 100, a first sealing ring 210 and a second sealing ring 220, wherein the connecting plate 100 is the main structure in the connecting assembly, which can generally be formed of materials with relatively high structural strength such as metal, and the connecting plate 100 is a plate-like structural member as a whole, which is clamped between the process chamber 400 and the transmission chamber 500, and the process chamber 400 and the transmission chamber 500 can both form a relatively reliable fixed connection relationship with the connecting plate 100 through connecting parts such as bolts.

[0015] Of course, in order to ensure that the connecting plate 100 does not hinder the normal operation of the film transmission, Figure 3 As shown, the connecting plate 100 is provided with a transfer port 112, and the transfer port 112 is arranged through the connecting plate 100 along the thickness direction of the connecting plate 100, so that when the wafer transfer work is required, the wafer in the transfer chamber 500 can be sent to the process chamber 400 through the transfer port 112. Specifically, the size and shape of the transfer port 112 can be flexibly selected according to the size of the wafer, and the actual parameters such as the shape and size of the transfer chamber 500 and the process chamber 400, which is not limited in this article.

[0016] At the same time, in order to ensure that the connecting plate 100 can form a more reliable sealing cooperation relationship with the process chamber 400, as described above, the connecting assembly includes a first sealing ring 210 and a second sealing ring 220, and in the embodiment of the present application, the first surface of the connecting plate 100 facing the process chamber 400 is also provided with a first sealing groove 111a and a second sealing groove 111b, and the second sealing groove 111b is arranged around the first sealing groove 111a. In this case, by setting the first sealing ring 210 in the first sealing groove 111a and the second sealing ring 220 in the second sealing groove 111b, the first surface of the connecting plate 100 and the process chamber 400 are sealed and connected by the first sealing ring 210 and the second sealing ring 220. Under the joint action of the nested first sealing ring 210 and the second sealing ring 220, the double sealing principle is utilized to make the sealing effect of the gap between the connecting plate 100 and the process chamber 400 relatively good.

[0017] Specifically, the first sealing ring 210 and the second sealing ring 220 can be formed of elastic materials such as rubber, so as to ensure that the first sealing ring 210 and the second sealing ring 220 can be squeezed by the process chamber 400 and the connecting plate 100 to a certain extent to achieve a good sealing purpose. Of course, the specific dimensions and other parameters of the first sealing ring 210 and the second sealing ring 220 can be flexibly selected according to actual conditions, and this document does not limit this.

[0018] In addition, the first sealing groove 111a and the second sealing groove 111b provided on the connecting plate 100 can be designed accordingly according to the specific shapes and sizes of the first sealing ring 210 and the second sealing ring 220, so that a part of the first sealing ring 210 can be embedded in the first sealing ring 210, and a part of the second sealing ring 220 can be embedded in the second sealing groove 111b in the thickness direction of the connecting plate 100, and then the first sealing groove 111a and the second sealing groove 111b are used to provide limiting functions for the first sealing ring 210 and the second sealing ring 220 respectively, so as to prevent the first sealing ring 210 and the second sealing ring 220 from rubbing during the sealing process, which would have an adverse effect on the sealing effect of the first sealing ring 210 and the second sealing ring 220.

[0019] At the same time, when the first sealing ring 210 and the second sealing ring 220 are provided, the contact area between the first sealing ring 210 and the second sealing ring 220 and the process chamber 400 can be reduced to a certain extent, thereby minimizing the adverse effect of high temperature on the service life of the first sealing ring 210 and the second sealing ring 220, thereby improving the service life of the first sealing ring 210 and the second sealing ring 220.

[0020] More specifically, the first sealing groove 111a and the second sealing groove 111b can both be grooves with rectangular cross-sections, that is, the first sealing groove 111a and the second sealing groove 111b are both rectangular grooves. In another embodiment of the present application, the first sealing groove 111a and the second sealing groove 111b can also be double dovetail grooves, which can enhance the limiting effect of the first sealing ring 210 and the second sealing ring 220.

[0021] In another embodiment of the present application, the first sealing groove 111a is a single-sided dovetail groove, that is, the first sealing groove 111a includes a rectangular groove portion and a dovetail groove portion, and the two portions are interconnected to form a complete first sealing groove 111a. More specifically, the aforementioned rectangular groove portion can be arranged around the outside of the dovetail groove portion, or the aforementioned dovetail groove portion can be arranged around the outside of the rectangular groove portion. In this case, the dovetail groove portion can provide a relatively stable limiting effect for the first sealing ring 210, and the rectangular groove portion can provide a relatively large accommodating space. Therefore, during the process, even if the heat conducted from the process chamber 400 to the first sealing ring 210 causes the first sealing ring 210 to expand, the rectangular groove portion in the first sealing groove 111a can be used to provide the first sealing ring 210 with a relatively sufficient expansion space to prevent the first sealing ring 210 from expanding due to heat and precipitating, thereby adversely affecting the sealing relationship between the process chamber 400 and the connecting plate 100. In addition, when the above technical solution is adopted, it is also convenient to remove the first sealing ring 210 from the first sealing groove 111 a, thereby facilitating the replacement of the first sealing ring 210 .

[0022] Similarly, in order to ensure that the second sealing ring 220 also has a good limiting effect while preventing the second sealing ring 220 from expanding and separating out due to heat, in a specific embodiment of the present application, the second sealing groove 111b is also a single-sided dovetail groove, which can also reduce the difficulty of replacing the second sealing ring 220.

[0023] An embodiment of the present application discloses a connection component, which can be connected between a process chamber 400 and a transfer chamber 500. The connection plate 100 in the connection component is provided with a transfer port 112, and the transfer port 112 is arranged through the connection plate 100 along the thickness direction of the connection plate 100, so that the wafer can pass through the transfer port 112 and be transferred between the process chamber 400 and the transfer chamber 500. At the same time, a first sealing groove 111a and a second sealing groove 111b are provided on the first surface of the transmission plate facing the process chamber 400, and the second sealing groove 111b is arranged around the first sealing groove 111a. By setting the first sealing ring 210 in the connecting component in the first sealing groove 111a, and setting the second sealing ring 220 in the connecting component in the second sealing groove 111b, the first sealing ring 210 and the second sealing ring 220 can be used to seal the connection between the first surface and the process chamber 400. In this case, even if the reliability of the first sealing ring 210 relatively close to the transmission port 112 is reduced due to high temperature, since the second sealing ring 220 is provided outside the first sealing ring 210, the sealing reliability between the process chamber 400 and the connecting plate 100 can be ensured to be always relatively high, thereby preventing the process chamber 400 from having a sealing failure.

[0024] As described above, the first sealing ring 210 and the second sealing ring 220 can both be formed of materials such as rubber. Optionally, in a specific embodiment of the present application, the first sealing ring 210 and the second sealing ring 220 can be formed of the same material. In order to further improve the sealing reliability between the connection assembly disclosed in the embodiment of the present application and the process chamber 400, in the embodiment of the present application, the corrosion resistance of the first sealing ring 210 can be higher than that of the second sealing ring 220, and the leakage rate of the second sealing ring 220 can be lower than that of the first sealing ring 210.

[0025] In the case of adopting the above technical solution, even if the first sealing ring 210 relatively close to the film transfer port frequently contacts with process gas and other materials in the process chamber 400, the aging rate of the first sealing ring 210 can be relatively slow, so that the service life of the first sealing ring 210 is relatively long. At the same time, by making the sealing performance of the second sealing ring 220 better than the sealing performance of the first sealing ring 210, the overall sealing reliability of the first sealing ring 210 and the second sealing ring 220 is still relatively high. Specifically, the first sealing ring 210 can be a perfluorinated sealing ring, and the second sealing ring 220 can be a fluororubber sealing ring.

[0026] In the above embodiment, by designing the materials of the first sealing ring 210 and the second sealing ring 220, the service life of the first sealing ring 210 and the second sealing ring 220 can be improved as a whole, thereby ensuring that the overall sealing performance of the first sealing ring 210 and the second sealing ring 220 is relatively good.

[0027] In another embodiment of the present application, the adverse effects of high temperature on the sealing ring can be reduced by cooling, thereby achieving the purpose of increasing the service life of the first sealing ring 210 and the second sealing ring 220.

[0028] In detail, in an embodiment of the present application, a plurality of first purge channels 113a may be provided on the connecting plate 100, and the plurality of first purge channels 113a are arranged around the transmission port 112, wherein a first end of each first purge channel 113a is connected to a purge gas source, and a second end of each first purge channel 113a is connected to the transmission port 112, so that the purge gas can be transported to the transmission port 112 through each first purge channel 113a, so that the purge gas can absorb the heat around the first purge channel 113a during the process of flowing in each first purge channel 113a, thereby enabling the temperature in the corresponding area of ​​the connecting plate 100 to be reduced accordingly, thereby achieving the purpose of cooling the first sealing ring 210 and the second sealing ring 220.

[0029] Of course, in order to make each first purge channel 113a relatively closer to the first sealing ring 210 and the second sealing ring 220 to improve the cooling efficiency of the first sealing ring 210 and the second sealing ring 220, in the embodiment of the present application, in the thickness direction of the connecting plate 100, the distance between the second end of each first purge channel 113a and the first surface can be made less than half the size of the connecting plate 100, that is, compared with the second surface of the connecting plate 100 facing the transfer chamber 500, each first purge channel 113a is relatively closer to the first surface of the connecting plate 100 facing the process chamber 400. In this case, the distance between the first sealing ring 210, the second sealing ring 220 and each first purge channel 113a is relatively smaller, thereby improving the cooling effect of the purge gas on the first sealing ring 210 and the second sealing ring 220.

[0030] Specifically, each first purge channel 113a may be a linear channel, and each first purge channel 113a may be formed by penetrating inward from the outer wall of the connecting plate 100. In another embodiment of the present application, an annular channel may be provided, and one end of each first purge channel 113a may be connected to the annular channel. In this case, by connecting the annular channel to the purge gas source, it is ensured that the plurality of first purge channels 113a may be indirectly connected to the purge gas source, thereby reducing the difficulty of assembly.

[0031] Moreover, in the embodiment of the present application, the plurality of first purge channels 113a are distributed in a ring shape, and one end of each first purge channel 113a extends to the transfer port 112, so that the gas blown out of the plurality of first purge channels 113a can form a gas wall, thereby preventing reactants and by-products from gathering at the transfer port 112, and preventing reactants and by-products from adhering to the inner wall of the transfer port 112 of the connecting plate 100, thereby ensuring a relatively high process effect of the wafer.

[0032] Accordingly, in order to maximize the cooling effect on the first sealing ring 210 and the second sealing ring 220, as well as the purging effect on the transfer port 112, in the embodiment of the present application, the number of first purge channels 113a can be as large as possible without affecting the structural strength of the connecting plate 100 and the quality change, and the second end of each first purge channel 113a can be as close to the first surface of the connecting plate 100 as possible in the axial direction of the transfer port 112 without hindering the sealing reliability between the first surface of the connecting plate 100 and the process chamber 400, thereby improving the comprehensiveness of the purging of the transfer port 112.

[0033] Accordingly, in the process of arranging the first sealing groove 111a, the distance between the first sealing groove 111a and the transmission port 112 can also be made relatively small, and under the condition that the structural strength of the first sealing groove 111a meets the requirements, the first sealing groove 111a can be made as close to the transmission port 112 as possible. In this case, the distance between the first sealing ring 210 and the first purge channel 113a is also made relatively small. More intuitively, in a specific embodiment of the present application, the minimum distance between each first purge channel 113a and the first sealing ring 210 can be made between 1.5 and 2 mm, which can ensure that the purge gas in the first purge channel 113a can provide a relatively good cooling effect for the first sealing ring 210, and also make the first sealing groove 111a have good structural stability. As described above, a relatively reliable sealing connection relationship can be formed between the connecting plate 100 and the process chamber 400 through the first sealing ring 210 and the second sealing ring 220, and a sealing connection relationship can also be formed between the connecting plate 100 and the transfer chamber 500 through the corresponding sealing rings to ensure that the sealing assembly relationship between the transfer chamber 500 and the process chamber 400 is relatively reliable.

[0034] To this end, in a specific embodiment of the present application, a third sealing ring 230 may be provided on the side of the connecting plate 100 facing away from the process chamber 400, and the third sealing ring 230 is used to seal the second surface of the connecting plate 100 facing the transmission chamber 500 and the transmission chamber 500. Specifically, the third sealing ring 230 may be formed of an elastic material such as rubber, and during the assembly process, the third sealing ring 230 may be squeezed between the connecting plate 100 and the transmission chamber 500 to ensure that the third sealing ring 230 can provide a good sealing effect.

[0035] As mentioned above, the third sealing ring 230 is located on the side of the connecting plate 100 away from the process chamber 400. In this case, although the third sealing ring 230 is not in direct contact with the process chamber 400, during the process, the heat of the process chamber 400 will also be transferred to the third sealing ring 230 through the connecting plate 100. Therefore, the third sealing ring 230 can also be cooled to increase the service life of the third sealing ring 230.

[0036] In detail, the connecting plate 100 may also be provided with a plurality of second purge channels 113b, and the plurality of second purge channels 113b are arranged around the transmission port 112, and the first end of each second purge channel 113b is connected to the purge gas source, and the second end of each second purge channel 113b is connected to the transmission port 112, and then similar to the first purge channel 113a, when the purge gas flows in the second purge channel 113b, it absorbs the heat around the second purge channel 113b, so as to reduce the temperature in the corresponding area of ​​the connecting plate 100, thereby achieving the purpose of cooling the third sealing ring 230.

[0037] Accordingly, in order to ensure that the gas in the second purge channel 113b has a relatively better cooling effect on the third sealing ring 230, in an embodiment of the present application, in the thickness direction of the connecting plate 100, the distance between the second end and the second surface of each second purge channel 113b can be made less than half the size of the connecting plate 100. In this case, each second purge channel 113b can also be as close as possible to the side where the third sealing ring 230 is located, thereby improving the cooling effect of the purge gas in the second purge channel 113b on the third sealing ring 230.

[0038] Similarly, in the axial direction of the transmission port 112, the second end of the second purge channel 113b can be as close to the second surface of the connecting plate 100 as possible, and the distance between the third sealing ring 230 and the transmission port 112 can be relatively small, so as to ensure that the purge gas in the second purge channel 113b can provide a better cooling effect for the third sealing ring 230. More intuitively, in a specific embodiment of the present application, the minimum distance between each second purge channel 113b and the third sealing ring 230 can be between 1.5 and 2 mm.

[0039] As described above, the first ends of the plurality of first purge channels 113a and the plurality of second purge channels 113b are each connected to a purge gas source. Based on this, in order to reduce the difficulty of assembly, in a specific embodiment of the present application, as shown in FIG. Figure 5 As shown, the connecting plate 100 is provided with a connecting channel 113c, and the connecting channel 113c is a closed ring structure. By making the first ends of each first purge channel 113a and each second purge channel 113b connected to the connecting channel 113c, and making the connecting channel 113c connected to the purge gas source, the connection difficulty between the multiple first purge channels 113a and the multiple second purge channels 113b and the purge gas source is relatively lower, thereby improving the assembly efficiency of the connecting components.

[0040] In order to further improve the sealing effect between the connecting plate 100 and the transmission chamber 500, in a specific embodiment of the present application, a fourth sealing ring 240 may also be provided on the side of the connecting plate 100 facing the transmission chamber 500, and the fourth sealing ring 240 is arranged around the third sealing ring 230. In this case, the third sealing ring 230 and the fourth sealing ring 240 are used to seal the second surface of the connecting plate 100 facing the transmission chamber 500 and the transmission chamber 500, thereby further improving the sealing reliability between the connecting plate 100 and the transmission chamber 500.

[0041] Specifically, the third sealing ring 230 and the fourth sealing ring 240 can both be formed of the same rubber material. In another embodiment of the present application, the corrosion resistance of the third sealing ring 230 can be higher than that of the fourth sealing ring 240, and the leakage rate of the fourth sealing ring 240 can be lower than that of the third sealing ring 230, thereby minimizing the aging efficiency of the third sealing ring 230 which is relatively closer to the transmission port 112 and improving the service life of the third sealing ring 230. At the same time, the fourth sealing ring 240 with relatively better sealing performance is used to provide a relatively more stable sealing effect on the outer periphery of the third sealing ring 230, so that the overall sealing reliability of the third sealing ring 230 and the fourth sealing ring 240 is relatively higher.

[0042] In order to prevent the third sealing ring 230 and the fourth sealing ring 240 from rubbing against each other, in an embodiment of the present application, a third sealing groove 511a and a fourth sealing groove 511b can also be formed on the second surface of the connecting plate 100 facing the transmission chamber 500, and the third sealing ring 230 can be installed in the third sealing groove 511a, and the fourth sealing ring 240 can be installed in the fourth sealing groove 511b. In this case, the third sealing groove 511a and the fourth sealing groove 511b can be used to provide limiting effects for the third sealing ring 230 and the fourth sealing ring 240 respectively, thereby ensuring that the assembly stability between the third sealing ring 230 and the fourth sealing ring 240 and the connecting plate 100 is relatively better.

[0043] Similarly, in order to make the third sealing groove 511a and the fourth sealing groove 511b have good limiting effect and accommodating capacity, in the embodiment of the present application, the third sealing groove 511a and the fourth sealing groove 511b are both single-sided dovetail grooves, which makes the replacement of the third sealing ring 230 and the fourth sealing ring 240 relatively easy. In the embodiment of the present application, the third sealing groove 511a and the fourth sealing groove 511b both include a rectangular groove portion and a dovetail groove portion, and the rectangular groove portion is arranged on the inner side or the outer side of the dovetail groove portion, and the two are connected to each other. Of course, the specific dimensions of the third sealing groove 511a and the fourth sealing groove 511b can be designed according to the actual dimensions of the third sealing ring 230 and the fourth sealing ring 240, which is not limited in this article.

[0044] As described above, the connection component disclosed in the embodiment of the present application is clamped between the process chamber 400 and the transfer chamber 500. To this end, the relative first surface and second surface of the connection plate 100 in the connection component need to be in contact with, or even fit with, the process chamber 400 and the transfer chamber 500, respectively, to ensure that a relatively good sealing connection relationship can be formed between the process chamber 400 and the transfer chamber 500 and the connection plate 100.

[0045] In this case, the heat of the process chamber 400 is transferred to the connecting plate 100, so that the first sealing ring 210 and the second sealing ring 220 are both in a high temperature environment, which will have an adverse effect on the service life of the first sealing ring 210 and the second sealing ring 220. Based on this, in a specific embodiment of the present application, the connecting assembly may further include a heat insulating member 300, so as to use the heat insulating member 300 to block the heat of the process chamber 400 from being transferred to the connecting plate 100 as much as possible.

[0046] At the same time, in order to prevent the heat insulation member 300 from hindering the film transmission process, the heat insulation member 300 is provided with an avoidance port, and the avoidance port is used to avoid the transmission port 112. In addition, as described above, the second sealing ring 220 is arranged around the outside of the first sealing ring 210, and further, a part of the heat insulation board can be sandwiched between the first sealing ring 210 and the second sealing ring 220, so as to further increase the heat insulation area of ​​the heat insulation member 300. It should be noted that the second sealing ring 220 is a closed ring structure. Therefore, when a part of the heat insulation board is sandwiched between the first sealing ring 210 and the second sealing ring 220, the aforementioned part of the heat insulation board and the part of the heat insulation board outside the second sealing ring 220 are separated from each other. In order to complete the installation process of the heat insulation board of the aforementioned structure, the heat insulation board and the connecting plate 100 can be formed into a bonding relationship, or the heat insulation board can be fixedly installed on the first surface of the connecting plate 100 using a connecting member such as a screw.

[0047] In another embodiment of the present application, considering that the area sandwiched between the first sealing ring 210 and the second sealing ring 220 is relatively small, it is no longer necessary to set a partial structure of the thermal insulation member 300 between the first sealing ring 210 and the second sealing ring 220. In this case, the thermal insulation member 300 can be arranged outside the second sealing ring 220, which makes the thermal insulation member 300 an integral structural member, thereby greatly reducing the difficulty of installing the thermal insulation member 300.

[0048] In addition, in the embodiment of the present application, the portion of the connecting plate 100 located between the first sealing ring 210 and the second sealing ring 220 can be recessed relative to other positions of the connecting plate 100, so that the portion of the connecting plate 100 located between the first sealing ring 210 and the second sealing ring 220 can form a gap with the process chamber 400, thereby preventing the heat of the process chamber 400 from being directly conducted to the portion of the connecting plate 100 located between the first sealing ring 210 and the second sealing ring 220, thereby reducing the service life of the first sealing ring 210 and the second sealing ring 220.

[0049] As described above, a sealing fit relationship is formed between the connection plate 100 and the process chamber 400 through the first sealing ring 210 and the second sealing ring 220. Therefore, during the assembly of the connection plate 100, even if the connection assembly includes the heat insulating member 300, in order to ensure that the connection plate 100 can provide a good extrusion effect for the first sealing ring 210 and the second sealing ring 220, the heat insulating member 300 cannot be completely sandwiched between the connection plate 100 and the process chamber 400. In other words, when the connection assembly includes the connection plate 100 and the heat insulating member 300, a part of the first surface of the connection plate 100 facing the process chamber 400 still directly contacts or fits with the process chamber 400.

[0050] Based on this, in the embodiment of the present application, the first surface of the connecting plate 100 can be provided with a first sinker 116a to accommodate the thermal insulation member 300 by utilizing the first sinker 116a. That is, in the embodiment of the present application, the first sinker 116a is embedded with the thermal insulation member 300. Accordingly, the portion of the first surface outside the edge of the first sinker 116a can still contact or fit with the surface of the process chamber 400, thereby ensuring that the connecting plate 100 can still normally apply an extrusion force to the process chamber 400, thereby ensuring that the first sealing ring 210 and the second sealing ring 220 can both provide a good sealing effect.

[0051] Accordingly, based on the thickness of the thermal insulation member 300, the recessed size of the first sink 116a relative to the first surface can be determined, wherein, in the process of designing the first sink 116a, the recessed size of the first sink 116a can be made larger than the thickness of the thermal insulation member 300, or the recessed size of the first sink 116a can be made equal to the thickness of the thermal insulation member 300, both of which can ensure that the thermal insulation member 300 can provide thermal insulation normally. That is, in the embodiment of the present application, in the thickness direction of the connecting plate 100, the surface of the thermal insulation member 300 facing the process chamber 400 can be flush with the first surface of the connecting plate 100, or the surface of the thermal insulation member 300 facing the process chamber 400 can also be recessed relative to the first surface of the connecting plate 100. In addition, when the surface of the thermal insulation member 300 facing the process chamber 400 can be set flush with the first surface of the connecting plate 100, a first avoidance platform 410 can be set on the side of the process chamber 400 facing the thermal insulation member 300, so that a gap can still be formed between the process chamber 400 and the thermal insulation member 300, thereby reducing the heat conduction efficiency between the two.

[0052] Of course, in order to ensure that the thermal insulation member 300 has good heat-blocking capability, the thermal insulation member 300 needs to be formed of a thermal insulation material, that is, a material with relatively low heat conduction efficiency. In a specific embodiment of the present application, a non-metallic material, such as polytetrafluoroethylene or polyetheretherketone, can be used to form the thermal insulation member 300. In addition, in the process of forming the first sinker 116a, the proportion of the first sinker 116a in the first surface can be made as large as possible. Of course, it is also necessary to ensure that a portion of the first surface is still in contact with the process chamber 400.

[0053] As described above, during the process of assembling the connection components, screws and other connecting parts can be used to form a fixed connection relationship between the connection plate 100 and the process chamber 400. During the process of inserting screws and other connecting parts, the connecting parts can be passed through the connection plate 100 and the insulation member 300 at the same time.

[0054] In order to improve the connection reliability between the connection plate 100 and the process chamber 400, and to improve the locking force of the aforementioned screws and other connectors on the first sealing ring 210 and the second sealing ring 220, in another embodiment of the present application, the connection assembly further includes a plurality of fixed connectors, the connection plate 100 is provided with a plurality of mounting holes 117, and the plurality of fixed connectors are correspondingly arranged in the plurality of mounting holes 117 and fixedly connected to the process chamber 400. The fixed connectors may be screws or bolts, etc., and accordingly, the mounting holes 117 may be threaded holes or through holes.

[0055] As described above, in the embodiment of the present application, the fixed connector is not disposed through the thermal insulation member 300, or in other words, the fixed connector is located outside the thermal insulation member 300. In this case, the fixed connector can directly act on the portion of the first surface of the connecting plate 100 that is directly in contact with or in contact with the process chamber 400, thereby making the connection reliability between the connecting plate 100 and the process chamber 400 relatively higher.

[0056] In order to further distinguish the part of the connecting plate 100 that is directly in contact with or in contact with the process chamber 400, and the part of the connecting plate 100 that cooperates with the process chamber 400 through the thermal insulation member 300, in detail, the connecting plate 100 includes a plate body 110, and the plate body 110 is provided with a transmission port 112, a first sealing groove 111a and a second sealing groove 111b. At the same time, the first surface of the plate body 110 includes a first contact surface 118a, a second contact surface 118b and a plurality of mounting contact surfaces 118c. The first contact surface 118a and the second contact surface 118b are both arranged around the transmission port 112, and the first sealing groove 111a and the second sealing groove 111b are sandwiched between the first contact surface 118a and the second contact surface 118b. The plurality of mounting contact surfaces 118c are all located at the outer edge of the first sink 116a, and each mounting contact surface 118c is provided with a mounting hole 117.

[0057] That is, in the embodiment of the present application, in the first surface of the connecting plate 100, a first contact surface 118a is provided between the first sealing groove 111a and the transfer port 112, and a second contact surface 118b is provided around the second sealing groove 111b, and then after the connecting plate 100 and the process chamber 400 are assembled with each other, the first sealing groove 111a and the second sealing groove 111b can be surrounded by the first contact surface 118a and the second contact surface 118b, thereby ensuring that the extrusion effect of the first sealing ring 210 and the second sealing ring 220 are relatively good, so that the sealing reliability between the first surface of the connecting plate 100 and the process chamber 400 is relatively high.

[0058] At the same time, by making the multiple mounting contact surfaces 118c all located at the outer edge of the first sink 116a, the spacing between the multiple mounting contact surfaces 118c and the first sealing ring 210 and the second sealing ring 220 is relatively large, so that the heat conducted by the process chamber 400 through the multiple mounting contact surfaces 118c can be minimized to act on the first sealing ring 210 and the second sealing ring 220. Of course, the heat of the process chamber 400 acting on the first sealing ring 210 and the second sealing ring 220 through the first contact surface 118a and the second contact surface 118b can be taken away by the above-mentioned purge gas to increase the service life of the first sealing ring 210 and the second sealing ring 220.

[0059] In addition, by providing the above-mentioned mounting holes 117 on the relatively outer mounting contact surfaces 118c, the locking effect provided by the fixed connection member on the connecting plate 100 is more reliable. More specifically, the connecting plate 100 can be substantially a rectangular plate-shaped structure, and for this reason, the mounting contact surface 118c can also be a rectangular structure as a whole, and the number of the mounting contact surfaces 118c can be four, and the four are distributed at the four corners of the plate body 110 of the connecting plate 100.

[0060] In order to further improve the locking effect between the connecting plate 100 and the process chamber 400, other mounting contact surfaces 118c may be provided on the outer periphery of the second contact surface 118b, and the mounting contact surface 118c may also be provided with mounting holes 117. In this case, by providing an additional fixing connecting member at a position closer to the first sealing ring 210 and the second sealing ring 220, the locking effect of the fixing connecting member on the first sealing ring 210 and the second sealing ring 220 is more obvious, so that the sealing performance of the first sealing ring 210 and the second sealing ring 220 is relatively better.

[0061] As described above, the first purge channel 113a can be used to transport purge gas to remove the heat conducted by the first contact surface 118a and the second contact surface 118b. For the heat conducted by the plurality of mounting contact surfaces 118c disposed on the outer edge of the first sink 116a, corresponding purge channels can also be provided.

[0062] In order to reduce the processing difficulty and further improve the heat dissipation efficiency of the entire board body 110, in a specific embodiment of the present application, a plurality of heat dissipation fins 120 can be set on the upper and lower sides of the board body 110, so that the heat of the board body 110 can be dissipated more quickly under the action of the plurality of heat dissipation fins 120, thereby reducing the temperature of the plurality of mounting contact surfaces 118c while reducing the temperature of the board body 110 as a whole, which can further improve the service life of the first sealing ring 210 and the second sealing ring 220.

[0063] As described above, a heat insulating member 300 may be provided on one side of the first surface of the connecting plate 100 facing the process chamber 400. Similarly, in a further embodiment of the present application, a second sink 116b may be provided on the second surface of the connecting plate 100 facing the transfer chamber 500, and a heat insulating member 300 is also embedded in the second sink 116b. In the thickness direction of the connecting plate 100, the surface of the heat insulating member 300 facing the transfer chamber 500 is flush with the second surface of the connecting plate 100, or the surface of the heat insulating member 300 facing the transfer chamber 500 is recessed relative to the second surface of the connecting plate 100. In this case, the amount of heat conduction between the connecting plate 100 and the transfer chamber 500 is relatively small, thereby making the service life of the third sealing ring 230 and even the fourth sealing ring 240 disposed between the connecting plate 100 and the transfer chamber 500 relatively long. Similarly, when the surface of the thermal insulation member 300 facing the transmission chamber 500 and the second surface of the connecting plate 100 are arranged flush, a second avoidance platform 515 can be set on the side of the transmission chamber 500 facing the connecting plate 100, so that a gap can still be formed between the transmission chamber 500 and the thermal insulation member 300, thereby reducing the heat conduction efficiency between the two.

[0064] Specifically, the materials of the heat insulating members 300 disposed on the opposite sides of the connecting plate 100 can be the same, and the shapes of the two can also be substantially the same. Similarly, in the case where the third sealing groove 511a and the fourth sealing groove 511b are disposed on the second surface of the connecting plate 100 facing the transmission chamber 500, the heat insulating member 300 embedded in the second sink 116b of the connecting plate 100 can be disposed around the outside of the fourth sealing groove 511b, and accordingly, the inner edge and the outer edge of the second sink 116b of the connecting plate 100 can also be correspondingly provided with a plurality of mounting contact surfaces 118c to ensure that the connecting plate 100 and the transmission chamber 500 can also form a fixed connection relationship through the fixed connection member.

[0065] More specifically, the mounting hole 117 in the connecting plate 100 for connecting to the process chamber 400 can be a through hole, and the mounting hole 117 in the connecting plate 100 for connecting to the transfer chamber 500 can be a threaded hole. At the same time, by making the upper and lower edges of the transfer chamber 500 extend respectively to the outside of the upper and lower edges of the connecting plate 100, during the process of assembling the connecting components, the connecting plate 100 can be first fixed to the process chamber 400 by using a fixed connecting piece, and then the process chamber 400 and the connecting plate 100 can be connected to the transfer chamber 500 as a whole.

[0066] In order to further improve the service life of the third sealing ring 230 and the fourth sealing ring 240, in a specific embodiment of the present application, a third sealing groove 511a and a fourth sealing groove 511b can be provided on the surface of the side of the transmission chamber 500 facing the connecting plate 100. That is, in the embodiment of the present application, the side of the connecting plate 100 facing the transmission chamber 500 is no longer provided with the third sealing groove 511a and the fourth sealing groove 511b, thereby reducing the contact area between the connecting plate 100 and the third sealing ring 230 and the fourth sealing ring 240, and further significantly reducing the heat acting on the third sealing ring 230 and the fourth sealing ring 240.

[0067] As described above, the first surface of the connecting plate 100 facing the process chamber 400 is provided with a first sealing groove 111a and a second sealing groove 111b. Considering that the first sealing ring 210 usually cannot completely fill the first sealing groove 111a, correspondingly, the second sealing ring 220 usually cannot completely fill the second sealing groove 111b, a certain amount of gas may remain in the first sealing groove 111a and the second sealing groove 111b, which may have an adverse effect on the process environment of the process chamber 400.

[0068] To this end, in a specific embodiment of the present application, a first suction channel 119 can be further provided on the connecting plate 100, and the first suction channel 119 is connected to the vacuum hole of the transfer chamber 500. Furthermore, by connecting the first sealing groove 111a and the second sealing groove 111b to the first suction channel 119, when the vacuum mechanism of the transfer chamber 500 is working, the vacuum hole can be used to perform vacuum operation on the first sealing groove 111a and the second sealing groove 111b, and there is no need to configure separate vacuum equipment for the first sealing groove 111a and the second sealing groove 111b, so as to reduce the overall cost of the connection components and the entire semiconductor process equipment. Specifically, the bottoms of the first sealing groove 111a and the second sealing groove 111b facing the process chamber 400 can be connected to the first suction channel 119, so that the vacuum mechanism of the transfer chamber 500 can perform vacuum operations on the first sealing groove 111a and the second sealing groove 111b through the vacuum hole and the first suction channel 119, which can also improve the sealing effect of the first sealing ring 210 and the second sealing ring 220.

[0069] In another embodiment of the present application, a third sinker 116c can be provided on the first surface, and the third sinker 116c is arranged around the first sealing groove 111a, and the second sealing groove 111b is arranged around the third sinker 116c. The third sinker 116c is recessed relative to the first surface, and the size of the recess can be determined according to parameters such as the depth of the first sealing groove 111a and the second sealing groove 111b. In this case, the third sinker 116c can form a first connecting cavity with the process chamber 400, and the edges of the third sinker 116c are extended to the first sealing groove 111a and the second sealing groove 111b correspondingly, so that the first sealing groove 111a and the second sealing groove 111b can be connected to the first connecting cavity. In this case, by connecting the first connecting cavity with the first suction channel 119, the first connecting cavity can be used to perform vacuum operations on the first sealing groove 111a and the second sealing groove 111b. In addition, when adopting the technical solution disclosed in the embodiment of the present application, the area where the third sink 116c in the connecting plate 100 is located can be isolated from the process chamber 400, thereby further reducing the heat conducted from the process chamber 400 to the first sealing ring 210 and the second sealing ring 220 through the connecting plate 100, thereby improving the service life of the first sealing ring 210 and the second sealing ring 220.

[0070] As described above, the connecting assembly may further include a third sealing ring 230 and a fourth sealing ring 240, and a third sealing groove 511a and a fourth sealing groove 511b may be provided on a surface of the transmission chamber 500 on one side facing the connecting plate 100. In this case, in order to prevent gas from being retained in the third sealing groove 511a and the fourth sealing groove 511b, which may adversely affect the sealing effect of the third sealing ring 230 and the fourth sealing ring 240, in a specific embodiment of the present application, a second suction channel 513 may also be provided on the transmission chamber 500, and the second suction channel 513 may be connected to the vacuum hole of the transmission chamber 500. In this case, by connecting the third sealing groove 511a and the fourth sealing groove 511b to the second suction channel 513, the vacuum mechanism of the transmission chamber 500 may also extract the gas in the third sealing groove 511a and the fourth sealing groove 511b through the second suction channel 513 and the vacuum hole.

[0071] Similarly, the second suction channel 513 can also be connected to the bottom of the third sealing groove 511a and the fourth sealing groove 511b. Alternatively, in another embodiment of the present application, a fourth sinker 514 can be provided on the side surface of the transmission chamber 500 facing the connecting plate 100. The fourth sinker 514 is arranged around the third sealing groove 511a, and the fourth sealing groove 511b is arranged around the fourth sinker 514. The fourth sinker 514 is used to form a second connecting cavity with the second surface of the connecting plate 100. The second connecting cavity is connected to the second suction channel 513, and the first suction channel 119, the third sealing groove 511a and the fourth sealing groove 511b are all connected to the second connecting cavity. In this case, by extending the edges of the fourth sink 514 to the third sealing groove 511a and the fourth sealing groove 511b respectively, the vacuum mechanism can perform vacuum operation on the third sealing groove 511a and the fourth sealing groove 511b through the second suction channel 513 and the second connecting cavity, and can further isolate the transfer chamber 500 and the connecting plate 100, thereby reducing the heat conducted from the connecting plate 100 to the third sealing ring 230 and the fourth sealing ring 240, and further improving the service life of the third sealing ring 230 and the fourth sealing ring 240.

[0072] Based on the connection assembly disclosed in any of the above embodiments, the embodiment of the present application further discloses a semiconductor process equipment, which includes a process chamber 400, a transfer chamber 500 and the above connection assembly, wherein the process chamber 400 and the transfer chamber 500 are respectively fixedly installed on opposite sides of the connection assembly, and the first sealing ring 210 and the second sealing ring 220 are extruded and arranged between the process chamber 400 and the connection plate 100. In addition, in order to ensure that the sealing effect between the connection plate 100 and the transfer chamber 500 in the connection assembly is relatively good, a third sealing ring 230 may be arranged between the connection plate 100 and the transfer chamber 500, and further, a fourth sealing ring 240 may be arranged. In addition, in order to improve the assembly stability of the third sealing ring 230 and the fourth sealing ring 240, a third sealing groove 511a and a fourth sealing groove 511b may be arranged on the side of the transfer chamber 500 facing the connection plate 100. Furthermore, a fourth sinker 514 and a second suction channel 513 can be set on the side of the transmission chamber 500 facing the connecting plate 100, and the third sealing groove 511a and the fourth sealing groove 511b are both connected to the fourth sinker 514. The fourth sinker 514 is also connected to the vacuum hole of the transmission chamber 500 through the second suction channel 513, and then the vacuum mechanism of the transmission chamber 500 can be used to perform vacuum operation with the third sealing groove 511a and the fourth sealing groove 511b through the vacuum hole and the second suction channel 513.

[0073] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0074] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A connection assembly connected between a process chamber (400) and a transfer chamber (500), characterized in that: The connection assembly comprises a connection plate (100), a first sealing ring (210) and a second sealing ring (220); the connection plate (100) is provided with a transmission port (112), the transmission port (112) is arranged along the thickness direction of the connection plate (100) and penetrates the connection plate (100); the first surface of the connection plate (100) facing the process chamber (400) is provided with a first sealing groove (111a) and a second sealing groove (111b); the second sealing groove (111b) is arranged around the outside of the first sealing groove (111a); the first sealing ring (210) is arranged in the first sealing groove (111a); the second sealing ring (220) is arranged in the second sealing groove (111b); and the first sealing ring (210) and the second sealing ring (220) are both used to seal and connect the first surface of the connection plate (100) and the process chamber (400).

2. The connection assembly according to claim 1, characterized in that: The corrosion resistance of the first sealing ring (210) is higher than that of the second sealing ring (220), and the leakage rate of the second sealing ring (220) is lower than that of the first sealing ring (210).

3. The connection assembly according to claim 1, characterized in that: The connecting plate (100) is provided with a plurality of first purge channels (113a), the plurality of first purge channels (113a) are arranged around the transmission port (112), and the first end of each first purge channel (113a) is connected to a purge gas source, and the second end of each first purge channel (113a) is connected to the transmission port (112), and in the thickness direction of the connecting plate (100), the distance between the second end of each first purge channel (113a) and the first surface is less than half the size of the connecting plate (100).

4. The connection assembly according to claim 3, characterized in that: A third sealing ring (230) is provided on a side of the connecting plate (100) facing away from the process chamber (400), and the third sealing ring (230) is used to seal and connect a second surface of the connecting plate (100) facing the transfer chamber (500) and the transfer chamber (500); The connecting plate (100) is provided with a plurality of second purge channels (113b), the plurality of second purge channels (113b) are arranged around the transmission port (112), and the first end of each second purge channel (113b) is connected to the purge gas source, and the second end of each second purge channel (113b) is connected to the transmission port (112), and in the thickness direction of the connecting plate (100), the distance between the second end of each second purge channel (113b) and the second surface is less than half the size of the connecting plate (100).

5. The connection assembly according to claim 4, characterized in that: The connecting plate (100) is provided with a connecting channel (113c), the connecting channel (113c) being a closed annular structure, and the first ends of each of the first purge channels (113a) and each of the second purge channels (113b) are connected to the purge gas source through the connecting channel (113c).

6. The connection assembly according to claim 4, characterized in that: The minimum distance between each of the first purge channels (113a) and the first sealing ring (210) is between 1.5 and 2 mm; and / or, The minimum distance between each of the second purge channels (113b) and the third sealing ring (230) is between 1.5 and 2 mm.

7. The connection assembly according to claim 1, characterized in that: The connection assembly further comprises a heat insulating member (300), the heat insulating member (300) being provided with an escape opening, the escape opening being used to escape the transmission opening (112), and the heat insulating member (300) being arranged around the outside of the second sealing ring (220); The first surface of the connecting plate (100) is further provided with a first sink (116a), the first sink (116a) having the thermal insulation member (300) embedded therein, and in the thickness direction of the connecting plate (100), the surface of the thermal insulation member (300) facing the process chamber (400) is flush with the first surface of the connecting plate (100), or the surface of the thermal insulation member (300) facing the process chamber (400) is recessed relative to the first surface of the connecting plate (100).

8. The connection assembly according to claim 7, characterized in that: The connection assembly further comprises a plurality of fixed connecting members, the connection plate (100) is provided with a plurality of mounting holes (117), and the plurality of fixed connecting members are passed through the plurality of mounting holes (117) in a one-to-one correspondence and are fixedly connected to the process chamber (400).

9. The connection assembly according to claim 8, characterized in that: The connecting plate (100) comprises a plate body (110), wherein the plate body (110) is provided with the transmission port (112), the first sealing groove (111a) and the second sealing groove (111b); The first surface of the plate body (110) comprises a first contact surface (118a), a second contact surface (118b) and a plurality of mounting contact surfaces (118c); the first contact surface (118a) and the second contact surface (118b) are both arranged around the transmission port (112); the first sealing groove (111a) and the second sealing groove (111b) are sandwiched between the first contact surface (118a) and the second contact surface (118b); the plurality of mounting contact surfaces (118c) are all located at the outer edge of the first sink (116a); and each mounting contact surface (118c) is provided with the mounting hole (117).

10. The connection assembly according to claim 7, characterized in that: The second surface of the connecting plate (100) facing the transmission chamber (500) is provided with a second sink (116b), the second sink (116b) is embedded with the heat insulating member (300), and in the thickness direction of the connecting plate (100), the surface of the heat insulating member (300) facing the transmission chamber (500) is flush with the second surface of the connecting plate (100), or the surface of the heat insulating member (300) facing the transmission chamber (500) is recessed relative to the second surface of the connecting plate (100).

11. The connection assembly according to claim 1, characterized in that The connecting plate (100) is further provided with a first suction channel (119), the first suction channel (119) being used to communicate with the vacuum hole of the transmission chamber (500), and the first sealing groove (111a) and the second sealing groove (111b) are both in communication with the first suction channel (119).

12. The connection assembly according to claim 11, characterized in that The first surface is also provided with a third sinker (116c), the third sinker (116c) is arranged around the first sealing groove (111a), and the second sealing groove (111b) is arranged around the third sinker (116c), the third sinker (116c) is used to form a first connecting cavity with the process chamber (400), the first sealing groove (111a) and the second sealing groove (111b) are both connected to the first connecting cavity, and the first connecting cavity is connected to the first suction channel (119).

13. The connection assembly according to claim 11, characterized in that A third sealing ring (230) and a fourth sealing ring (240) may be provided on the side of the connecting plate (100) facing away from the process chamber (400), and the fourth sealing ring (240) is arranged around the outside of the third sealing ring (230), and the third sealing ring (230) and the fourth sealing ring (240) are used to seal and connect the second surface of the connecting plate (100) facing the transfer chamber (500) and the transfer chamber (500).

14. The connection assembly according to claim 13, characterized in that The corrosion resistance of the third sealing ring (230) is higher than that of the fourth sealing ring (240), and the leakage rate of the fourth sealing ring (240) is lower than that of the third sealing ring (230).

15. The connection assembly according to claim 13, characterized in that A third sealing groove (511a) and a fourth sealing groove (511b) may be provided on a surface of one side of the transmission chamber (500) facing the connection plate (100), the third sealing ring (230) being installed in the third sealing groove (511a), and the fourth sealing ring (240) being installed in the fourth sealing groove (511b).

16. The connection assembly according to claim 15, characterized in that The third sealing groove (511a) and the fourth sealing groove (511b) are both single-sided dovetail grooves.

17. The connection assembly according to claim 15, characterized in that The transmission chamber (500) may also be provided with a second suction channel (513), the second suction channel (513) being connected to the vacuum hole of the transmission chamber (500), and the third sealing groove (511a) and the fourth sealing groove (511b) are both connected to the second suction channel (513).

18. The connection assembly according to claim 17, characterized in that A fourth sinker (514) may also be provided on one side surface of the transmission chamber (500) facing the connecting plate (100); the fourth sinker (514) is arranged around the third sealing groove (511a), and the fourth sealing groove (511b) is arranged around the fourth sinker (514); the fourth sinker (514) is used to form a second connecting cavity with the second surface of the connecting plate (100); the second connecting cavity is connected to the second suction channel (513); the first suction channel (119), the third sealing groove (511a) and the fourth sealing groove (511b) are all connected to the second connecting cavity.

19. The connection assembly according to claim 1, characterized in that The first sealing groove (111a) is a single-sided dovetail groove; and the second sealing groove (111b) is a single-sided dovetail groove.

20. A semiconductor process equipment, characterized in that: The invention comprises a process chamber (400), a transfer chamber (500) and a connection assembly according to any one of claims 1 to 19, wherein the process chamber (400) and the transfer chamber (500) are respectively fixedly mounted on opposite sides of the connection assembly, and the first sealing ring (210) and the second sealing ring (220) are extruded and arranged between the process chamber (400) and the connection plate (100).

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