Light transmission device of optical measuring instrument and semiconductor processing equipment

Through the design of adapter components and light-shielding components, the problems of parts damage and RF energy transmission in the high temperature environment of the three-dimensional spiral coil are solved, and the flexible installation of the optical measuring instrument and normal transmission of RF energy are realized.

CN119882206APending Publication Date: 2025-04-25BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
CN202510045721.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-10
Publication Date
2025-04-25

AI Technical Summary

Technical Problem

In the prior art, the interference end point measuring instrument (IEP) is easily damaged by radio frequency power due to installation in a high temperature environment, and at the same time, it affects the normal transmission of radio frequency energy in a three-dimensional spiral coil environment.

Method used

The design of the adapter assembly and light-shielding component is adopted to convert the light ray of the optical measuring instrument from the first direction to the second direction to propagate, and penetrate the light-transmitting window through the light transmission channel of the light-shielding component to avoid installation in the high-temperature environment of the three-dimensional spiral coil, and adjust the light direction through the adjustment structure.

Benefits of technology

It realizes the flexible installation angle design of the optical measuring instrument, avoids damage to parts, ensures the normal transmission of RF energy, reduces the bending demand of optical fibers, and reduces the impact on RF energy transmission.

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Abstract

The invention provides a light transmission device of an optical measuring instrument and semiconductor processing equipment, and the device comprises a switching assembly which is used for being installed in an upper space of a coil box of the semiconductor processing equipment, and the switching assembly is used for converting light outputted by the optical measuring instrument along a first direction into light transmitted along a second direction; the first direction and the second direction form an included angle; the shading part is used for being installed in the lower space of the coil box and arranged between the switching assembly and a light inlet window, located at the top of the process chamber, of the semiconductor processing equipment, the shading part is provided with a light transmission channel extending in the second direction, and the two ends of the light transmission channel are opposite to the outlet end of the switching assembly and the light inlet window respectively.
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Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a light transmission device of an optical measuring instrument and semiconductor processing equipment. Background Art

[0002] With the rapid development of integrated circuits, chip size continues to decrease and the number of etching process steps continues to increase. The requirements for semiconductor processing accuracy and the degree of control over the process are also becoming higher and higher. This requires the use of real-time monitoring to control the key steps in the process.

[0003] The interferometer endpoint (IEP) in the endpoint detection (EPD) system uses laser to detect the change in thickness of a transparent film, and determines that the etching endpoint has been reached when the thickness change stops. The working principle of IEP is: when the laser enters the film surface vertically, it will be reflected on the upper and lower surfaces of the film. During the etching process, the etched film layer is constantly thinning, and the optical path difference between the two reflected lights is also constantly changing. When the thickness change is sufficient, the characteristics will be observed on the timing signal of a specific wavelength.

[0004] However, the IEP in the prior art is directly installed above the nozzle at the top of the process chamber and is surrounded by a coil (for example, a three-dimensional spiral coil). Since the mounting structure used to install the IEP is generally made of metal, the coil located above the chamber will be loaded with RF power during the process, causing the above-mentioned mounting structure to be easily damaged due to the high temperature of the RF environment. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a light transmission device for an optical measuring instrument and a semiconductor processing equipment, which can avoid damage to components caused by installation in a high-temperature environment and ensure the normal transmission of radio frequency energy.

[0006] In order to achieve the purpose of the present invention, a light transmission device of an optical measuring instrument is provided, which is applied to semiconductor processing equipment, comprising:

[0007] An adapter assembly, used for installation in the upper space of the coil box of the semiconductor processing equipment, the adapter assembly is used for converting the light outputted by the optical measuring instrument along a first direction to propagate along a second direction; the first direction and the second direction form an angle; and

[0008] A light-shielding component is used to be installed in the lower space of the coil box and is arranged between the adapter component and the light-transmitting window located at the top of the process chamber of the semiconductor processing equipment. The light-shielding component has a light transmission channel extending along the second direction, and the two ends of the light transmission channel are respectively opposite to the outlet end of the adapter component and the light-transmitting window.

[0009] In some embodiments, the adapter assembly has a steering channel for transmitting light, the inlet end of the steering channel is used to be arranged opposite to the light output end of the optical measuring instrument, and the outlet end of the steering channel is used to be arranged opposite to the light transmission channel;

[0010] A reflective component is disposed in the turning channel, for converting the light propagating in the first direction in the turning channel into light propagating in the second direction.

[0011] In some embodiments, the adapter assembly includes a channel component and a fixing component, wherein the turning channel is provided in the channel component, and an opening is formed on the outer surface of the channel component, and the reflecting component is provided on the outer surface of the channel component, and the reflecting surface of the reflecting component is exposed in the turning channel through the opening;

[0012] The fixing component is covered at the opening, and a limiting groove is provided on a surface of the fixing component opposite to the opening, and at least a part of the reflecting component is provided in the limiting groove.

[0013] In some embodiments, a surface of the channel component opposite to the light output end of the optical measuring instrument is further provided with a positioning groove for accommodating a portion of the optical measuring instrument.

[0014] In some embodiments, the first direction is parallel to a horizontal plane; the first direction and the second direction are perpendicular to each other.

[0015] In some embodiments, the light transmission device further comprises:

[0016] An adjustment structure is fixedly connected to the adapter assembly, the adjustment structure is used to install the optical measuring instrument on the adapter assembly, and is configured to be able to adjust the direction of light output by the optical measuring instrument.

[0017] In some embodiments, the adjustment structure includes a fixed bracket, a movable component, and at least three adjustment parts, wherein the fixed bracket is fixedly connected to the adapter assembly and is located on a side of the adapter assembly adjacent to the light output end of the optical measuring instrument;

[0018] The movable component is connected to the fixed bracket through at least three adjusting parts, and the movable component is arranged opposite to the fixed bracket, and a supporting hole for the optical measuring instrument to pass through is arranged on the movable component;

[0019] At least three of the adjusting portions are distributed at different positions on the circumference of the supporting hole, and each of the adjusting portions is used to adjust the distance between the movable component and the fixed bracket at the position where the adjusting portion is located.

[0020] In some embodiments, corresponding to each of the adjusting parts, the fixed bracket is provided with a bracket mounting hole and a first threaded hole, the movable component is provided with a second threaded hole, and the second threaded hole is coaxially arranged with the bracket mounting hole;

[0021] Each of the adjustment parts includes a first adjustment screw and a second adjustment screw, wherein the first adjustment screw passes through the bracket mounting hole along the first direction and is threadedly connected to the second threaded hole; by tightening the first adjustment screw, the distance can be reduced; the second adjustment screw is threadedly connected to the first threaded hole along the first direction, and one end of the second adjustment screw is abutted against the movable part; by tightening the second adjustment screw, the distance can be increased.

[0022] In some embodiments, the movable component is provided with an outer peripheral surface in the circumferential direction of the support hole, and the movable component is provided with a third threaded hole, one end of the third threaded hole is located on the outer peripheral surface, and the other end is located on the hole wall of the support hole;

[0023] The adjustment structure further includes a set screw, which is threadedly connected to the third threaded hole, and one end of the set screw is used to abut against the optical measuring instrument.

[0024] As another technical solution, the present invention further provides a semiconductor processing device, comprising a process chamber, an upper electrode device and an optical measuring instrument arranged above the process chamber, and also comprising the above-mentioned light transmission device provided by the present invention;

[0025] The upper electrode device includes a coil and a coil box, wherein the coil box is arranged at the top of the process chamber, and the interior of the coil box is divided into an upper space and a lower space by a conductive shielding plate, and the coil is arranged in the lower space; the optical measuring instrument is arranged in the upper space; the two ends of the shading component in the light transmission device are respectively connected to the conductive shielding plate and the light-transmitting window, and the upper end of the light transmission channel is opposite to the outlet end of the adapter assembly through a through hole in the conductive shielding plate.

[0026] In some embodiments, the process chamber includes a cavity, an annular bracket arranged on the top of the cavity, and a dielectric cover supported by the annular bracket; the coil box is fixedly connected to the annular bracket and electrically connected; the annular bracket is fixedly connected to the cavity and electrically connected; and the cavity is grounded.

[0027] In some embodiments, an air intake device is also included, which includes a nozzle penetrating the top wall of the process chamber and an air intake component stacked above the nozzle, wherein a first center hole and at least one air intake hole are provided in the nozzle; the air intake component is provided with a second center hole and an air intake channel; the first center hole is coaxially arranged with the second center hole, and the light-transmitting window is arranged between the first center hole and the second center hole; the air intake channel is connected to each of the air intake holes and is used to connect to a gas source.

[0028] In some embodiments, the surfaces of the nozzle and the air intake component facing each other are correspondingly provided with accommodating grooves, and the accommodating grooves of the nozzle and the air intake component are connected to form a space for accommodating the light-transmitting window; the bottom surface of the accommodating groove forms an angle with the surfaces of the nozzle and the air intake component facing each other.

[0029] In some embodiments, it further comprises a fixing flange and a nozzle cover, wherein an annular mounting groove is provided on the upper surface of the top wall of the process chamber, the annular mounting groove surrounds the nozzle, and a limited recess is formed on the inner circumference of the annular mounting groove;

[0030] The fixing flange is annular, and a limiting convex portion is formed on the inner circumference of the fixing flange. The fixing flange is arranged in the annular mounting groove, and the limiting convex portion and the limiting concave portion cooperate in a limiting position in the vertical direction;

[0031] The nozzle upper cover is arranged on the upper surface of the top wall of the process chamber, and the air intake component is covered therein; the nozzle upper cover is fixedly connected to the fixing flange to press the air intake component onto the nozzle.

[0032] In some embodiments, the coil is a three-dimensional spiral coil, and the three-dimensional spiral coil surrounds the light-shielding component; the light-shielding component is made of insulating material.

[0033] The present invention has the following beneficial effects:

[0034] In the light transmission device of the optical measuring instrument provided by the present invention, the light outputted by the optical measuring instrument along the first direction can be converted to propagate along the second direction by the adapter component, and by making the two ends of the light transmission channel in the light shielding component respectively opposite to the outlet end of the adapter component and the light-transmitting window, the light after the direction conversion by the adapter component can be passed through the light transmission channel along the second direction through the light transmission window and transmitted to the process chamber to achieve the measurement of the corresponding parameters. By using the adapter component to convert the direction of the light outputted by the optical measuring instrument, the optical measuring instrument can be allowed to output light from a direction different from the direction in which the light penetrates the light-transmitting window (i.e., the second direction), so that the installation angle of the optical measuring instrument can be designed more flexibly, especially for the application scenario of setting a three-dimensional spiral coil above the process chamber, by setting the adapter component in the upper space of the coil box, it can be avoided that the parts of the adapter component are damaged due to the adapter component being installed in the high temperature environment where the three-dimensional spiral coil is located (i.e., the lower space of the coil box). At the same time, by setting the optical measuring instrument located in the upper space of the coil box horizontally or tilted, the optical fiber of the optical measuring instrument can be led out from one side of the coil box without bending or with a slight bending, thereby eliminating the need to reserve more vertical installation space for the optical fiber. At the same time, the horizontally or tilted optical measuring instrument also reduces its own occupied space in the vertical direction, thereby preventing the upper space of the coil box from being too large in the vertical direction, thereby ensuring the normal transmission of radio frequency energy.

[0035] The semiconductor processing equipment provided by the present invention, by adopting the above-mentioned light transmission device provided by the present invention, can realize the transmission of the light output by the optical measuring instrument to the process chamber, while avoiding the installation of the adapter component in the high temperature environment where the three-dimensional spiral coil is located (i.e., the lower space of the coil box), which may cause damage to the parts of the adapter component, and at the same time will not cause the upper space of the coil box to be too large in the vertical direction, thereby ensuring the normal transmission of radio frequency energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 The installation structure diagram of the IEP installation structure adopted by the relevant technology;

[0037] Figure 2 The installation cross-section diagram of the IEP installation structure adopted in the related art;

[0038] Figure 3 A cross-sectional view of an upper electrode device arranging a three-dimensional spiral coil above a process chamber;

[0039] Figure 4 A cross-sectional view of a semiconductor processing device provided by an embodiment of the present invention;

[0040] Figure 5 A cross-sectional view of a light transmission device of an optical measuring instrument provided by an embodiment of the present invention on a vertical cross section;

[0041] Figure 6 An exploded view of the structure of a light transmission device of an optical measuring instrument provided in an embodiment of the present invention;

[0042] Figure 7 A structural diagram of a channel component used in an embodiment of the present invention at a viewing angle;

[0043] Figure 8 A structural diagram of a channel component used in an embodiment of the present invention at another viewing angle;

[0044] Fig. 9 A cross-sectional view of a channel component used in an embodiment of the present invention;

[0045] Fig.10 A side view of a light transmission device of an optical measuring instrument provided by an embodiment of the present invention at a viewing angle;

[0046] Fig.11 A cross-sectional view of a light transmission device of an optical measuring instrument provided by an embodiment of the present invention on a horizontal cross section;

[0047] Fig.12 The structure diagram of the movable components used in the embodiment of the present invention from two perspectives;

[0048] Fig.13 It is a structural diagram of the fixing bracket used in the embodiment of the present invention at two viewing angles;

[0049] Fig.14 A side view of the light transmission device of the optical measuring instrument provided by an embodiment of the present invention at another viewing angle;

[0050] Fig.15 for Figure 4 Enlarged view of the middle I area;

[0051] Fig.16 The structure diagram of the air intake component used in the embodiment of the present invention from two perspectives;

[0052] Fig.17 The structure diagram of the nozzle used in the embodiment of the present invention at two viewing angles;

[0053] Fig.18 A structural diagram of one of the semi-circular flanges in the fixed flange used in an embodiment of the present invention at two viewing angles;

[0054] Fig.19 This is a structural exploded view of the fixed flange, air intake component and nozzle cover used in an embodiment of the present invention. DETAILED DESCRIPTION

[0055] In order to enable those skilled in the art to better understand the technical solution of the present invention, the light transmission device of the optical measuring instrument and the semiconductor processing equipment provided by the present invention are described in detail below with reference to the accompanying drawings.

[0056] For related technologies, please refer to Figure 1 and Figure 2 The installation structure for installing an interferometer endpoint (IEP) generally includes a mounting bracket 01, which is used to fix the IEP directly above the medium cover 05 on the top of the process chamber, specifically to fix the IEP on the nozzle 02, and a light-transmitting window 03 (which can be called an IEP observation window) is provided in the central hole of the nozzle 02, and the light output end of the IEP is opposite to the light-transmitting window, so that the light output by the IEP penetrates the light-transmitting window 03 at a preset angle to the light-transmitting window 03 into the process chamber, and then vertically enters the surface of the film.

[0057] The above-mentioned method of installing IEP is only applicable to the scenario where a planar coil is set above the process chamber. This is because: Figure 1 and Figure 2 As shown, the IEP and mounting bracket 01 can be located above the planar coil 06 to avoid damage to components due to being in a high temperature environment. Figure 3 As shown, for a scenario where a three-dimensional spiral coil 11 is arranged above the process chamber, if Figure 1 and Figure 2 The IEP mounting bracket 01 and installation method shown are used to install the IEP on Figure 3 On the nozzle 12 shown, the IEP and the mounting bracket 01 will be surrounded by the three-dimensional spiral coil 11. Since the mounting bracket 01 is generally made of metal, the three-dimensional spiral coil 11 located above the chamber will be loaded with RF power during the process, causing the mounting bracket 01 to be easily damaged due to the high temperature of the RF environment where the three-dimensional spiral coil 11 is located.

[0058] Furthermore, in order to avoid installing the mounting bracket 01 on Figure 3In the high temperature environment where the three-dimensional spiral coil 11 is located, although the IEP can be fixed in the space where the connecting strip 15 for connecting the matcher 13 and the three-dimensional spiral coil 11 is located in the coil box 14, in order to make the light output by the IEP penetrate the light-transmitting window 03 at a preset angle to the light-transmitting window 03 and enter the process chamber, the light output end of the IEP faces downward. At this time, the height of the IEP itself is about 180mm, and the bending radius of the optical fiber 04 needs to be at least 120mm. In this case, in order to have enough space to accommodate the IEP and the optical fiber 04, the height of the space where the connecting strip 15 is located must be not less than 300mm. This height will affect the transmission of the RF energy output by the matcher 13, resulting in the RF power loaded on the three-dimensional spiral coil 11 being much less than the output power of the matcher 13, thereby affecting the etching rate of the machine. Therefore, the above-mentioned method of installing the IEP cannot be applied to the scene where the three-dimensional spiral coil 11 is set above the process chamber.

[0059] To solve the above problems, see Figure 4 The light transmission device 2 of the optical measuring instrument 3 provided in the embodiment of the present invention is applied to the semiconductor processing equipment 100, and is used to transmit the light output by the optical measuring instrument 3 to the process chamber 101 of the semiconductor processing equipment 100 to achieve the measurement of the corresponding parameters. The optical measuring instrument 3 includes, for example, an IEP. The working principle of the IEP is: when the laser enters the surface of the wafer 103 on the base 102 in the process chamber 101 vertically, it will be reflected on the upper and lower surfaces of the thin film of the wafer 103. During the etching process, the etched film layer is continuously thinning, and the optical path difference of the two beams of reflected light is also continuously changing. When the thickness change is satisfied, the characteristics will be observed on the timing signal of a specific wavelength. Of course, in practical applications, the light transmission device 2 provided in the embodiment of the present invention can also be applied to optical measuring instruments 3 with other functions, and the light output by the optical measuring instrument 3 can also enter the process chamber 101 along other directions under the transmission of the light transmission device 2. In practical applications, the direction can be set according to specific needs.

[0060] In some embodiments, the semiconductor processing equipment 100 includes a process chamber 101, an upper electrode device and an optical measuring instrument 3 arranged above the process chamber 101, wherein the upper electrode device includes a coil and a coil box 14, wherein the coil is, for example, a three-dimensional spiral coil 11, and the three-dimensional spiral coil 11 includes, for example, an inner spiral coil and an outer spiral coil, the coil box 14 is arranged at the top of the process chamber 101, and the interior of the coil box 14 is separated by a conductive shielding plate 16 to form an upper space 141 and a lower space 142, and the three-dimensional spiral coil 11 is arranged in the lower space 142. In addition, a matcher 13 is arranged at the top of the coil box 14, and the three-dimensional spiral coil 11 is electrically connected to a radio frequency power supply (not shown in the figure) through the matcher 13, and the radio frequency power output by the radio frequency power supply is loaded to the three-dimensional spiral coil 11 through the matcher 13, and the matcher 13 is used to achieve impedance matching. The two ends of the matcher 13 are electrically connected to one end of the inner spiral coil and the outer spiral coil in the three-dimensional spiral coil 11 through two connecting bars 15, a part of the connecting bar 15 is located in the upper space 141, and the other part is located in the lower space 142. The other ends of the inner spiral coil and the outer spiral coil in the three-dimensional spiral coil 11 are grounded by being electrically connected to a conductive shielding plate 16, for example.

[0061] Please also read Figure 4 , Figure 5 and Figure 6 The light transmission device 2 includes an adapter component 21 and a light shielding component 24, wherein the adapter component 21 is used to be installed in the upper space 141 of the coil box 14 of the semiconductor processing equipment 100, and the optical measuring instrument 3 can also be installed in the upper space 141, for example, fixed in the upper space 141 through the adapter component 21. The adapter component 21 is used to convert the light outputted by the optical measuring instrument 3 along the first direction X into light propagating along the second direction Y; the first direction X and the second direction Y form an angle a. The light shielding component 24 is used to be installed in the lower space 142 of the coil box 14, and is arranged between the adapter component 21 and the light-transmitting window 17 located at the top of the process chamber 101, and the light-transmitting component 24 has a light transmission channel 241 extending along the second direction Y, and the two ends of the light transmission channel 241 are respectively opposite to the outlet end of the adapter component 21 for outputting light along the second direction and the light-transmitting window 17.

[0062] In the light transmission device 2 of the optical measuring instrument provided in the embodiment of the present invention, the light output by the optical measuring instrument 3 along the first direction X can be converted by the adapter component 21 to propagate along the second direction Y, and by making the two ends of the light transmission channel 241 in the light shielding component 24 respectively opposite to the outlet end of the adapter component 21 and the light-transmitting window 17, the light after the direction is converted by the adapter component 21 can pass through the light transmission channel 24 along the second direction Y to penetrate the light-transmitting window 17, and be transported to the process chamber 101 to achieve the measurement of the corresponding parameters. By converting the direction of the light output by the optical measuring instrument 3 with the help of the adapter component 21, the optical measuring instrument 3 can be allowed to output light from a direction different from the direction in which the light passes through the light-transmitting window 17 (i.e., the second direction Y), so that the installation angle of the optical measuring instrument 3 can be designed more flexibly, especially for the application scenario where a three-dimensional spiral coil is set above the process chamber 101, such as Figure 4 As shown, by arranging the adapter assembly 21 in the upper space 141 of the coil box 14, it is possible to avoid damage to the components of the adapter assembly 21 caused by installing the adapter assembly 21 in a high temperature environment (i.e., the lower space 142 of the coil box 14) where the three-dimensional spiral coil 11 is located. At the same time, by arranging the optical measuring instrument 3 located in the upper space 141 of the coil box 14 horizontally or tilted, the optical fiber 31 of the optical measuring instrument 3 can be led out from one side of the coil box 14 without bending or with a slight bend, so that there is no need to reserve more installation space in the vertical direction for the optical fiber 31. At the same time, the optical measuring instrument 3 arranged horizontally or tilted also reduces its own occupied space in the vertical direction, and thus does not cause the size of the upper space 141 of the coil box 14 to be too large in the vertical direction, thereby ensuring the normal transmission of radio frequency energy.

[0063] The adapter component 21 for realizing the above functions may have various structures. For example, the adapter component 21 has a deflection channel 23 for transmitting light. The inlet end 23a of the deflection channel 23 is used to be arranged opposite to the light output end 32 of the optical measuring instrument 3. For example, the inlet end 23a abuts against the light output end 32. A reflective component 22 is arranged in the deflection channel 23 for converting the light propagating in the first direction X in the deflection channel 23 to propagate in the second direction Y. The propagation direction is as follows: Figure 5 As indicated by the arrow in .

[0064] The light output end 32 is the end of the optical measuring instrument 3 for outputting light. Figure 4 and Figure 5As shown, the optical measuring instrument 3 includes, for example, a measuring instrument body and an optical fiber 31. The measuring instrument body is, for example, cylindrical, and the light output end 32 is located at one end of the measuring instrument body in its axial direction, and the optical fiber 31 is located at the other end. In this case, the measuring instrument body can be arranged horizontally, and its light output end 32 faces the adapter assembly 21. The light output from the light output end 32 can propagate in the horizontal direction (i.e., the first direction X) and enter the turning channel 23 from the entrance end 23a of the turning channel 23. The optical fiber 31 is located at one end of the measuring instrument body away from the adapter assembly 21, and can be led out from the coil box 14 in the horizontal direction. In this way, the space occupied by the optical measuring instrument 3 in the vertical direction can be made smaller, so that there is no need to reserve more installation space in the vertical direction for the optical fiber 31. At the same time, the horizontally arranged optical measuring instrument 3 also reduces its own space occupied in the vertical direction, and thus does not cause the upper space 141 of the coil box 14 to be too large in the vertical direction, thereby ensuring the normal transmission of radio frequency energy.

[0065] The outlet end 23b of the turning channel 23 is used to be arranged opposite to the light transmission channel 241, so that the light output from the outlet end 23b of the turning channel 23 along the second direction Y can enter the light transmission channel 241, and then propagate toward the light-transmitting window 17 through the light transmission channel 241. The light output from the light transmission channel 241 can penetrate the light-transmitting window 17 along the second direction Y and enter the process chamber 101.

[0066] In some embodiments, Figure 5 As shown, the first direction X is parallel to the horizontal plane, and the second direction Y forms an angle a with the first direction X, and the angle a is, for example, 90°, that is, the second direction Y is perpendicular to the first direction X. In this way, the light output from the outlet end 23b of the turning channel 23 enters the light transmission channel 241 vertically downward, so that the light can pass through the light-transmitting window 17 and vertically enter the film surface. It should be noted that the angle between the second direction Y and the light-transmitting window 17 can be 90°, or an angle less than 90°, for example, the second direction Y is parallel to the vertical direction, and the light-transmitting window 17 is inclined relative to the horizontal plane.

[0067] Specifically, by arranging the inlet end 23a of the turning channel 23 opposite to the light output end 32 of the optical measuring instrument 3, the light outputted from the light output end 32 of the optical measuring instrument 3 can enter the turning channel 23 via the inlet end 23a along the first direction X. The light entering the turning channel 23 can be transformed from the original direction of propagation along the first direction X to propagation along the second direction Y under the reflection effect of the reflecting component 22, and outputted via the outlet end 23b, and then enter the light shielding component 24. The angle a between the second direction Y and the first direction X is consistent with the angle between the incident light and the reflected light of the reflecting component 22.

[0068] The light shielding component 24 is, for example, a light shielding barrel with open ends at both ends, and the interior of the light shielding barrel is a light transmission channel 241. The light output from the outlet end 23b of the turning channel 23 can be transmitted to the light transmission window 17 along the second direction Y via the light transmission channel 241 in the light shielding component 24. For the application scenario where the three-dimensional spiral coil 11 is arranged above the process chamber 101, in order to avoid installing the optical measuring instrument 3 and the adapter assembly 21 in the high-temperature environment where the three-dimensional spiral coil 11 is located (i.e., the lower space 142 of the coil box 14), the optical measuring instrument 3 and the adapter assembly 21 can be installed in the space where the connecting strip 15 for connecting the matcher 13 and the three-dimensional spiral coil 11 of the coil box 14 is located (i.e., the upper space 141 of the coil box 14). On this basis, the light shielding component 24 can be inserted into the high-temperature environment where the three-dimensional spiral coil 11 is located, so that the light can pass through the high-temperature environment where the three-dimensional spiral coil 11 is located to reach the light transmission window 17, and at the same time, the influence of the glow on the light during the RF ignition can be avoided. In this case, the light shielding member 24 is made of insulating material, for example, ceramics with a relatively high breakdown voltage.

[0069] In some embodiments, please refer to Figures 6 to 9 The adapter assembly 21 includes a channel component 211 and a fixing component 212, wherein the turning channel 23 is arranged on the channel component 211, and an opening 223 is formed on the outer surface of the channel component 211, and the reflecting component 22 is arranged on the outer surface of the channel component 211, and the reflecting surface 221 (such as Figure 6 The fixing member 212 is covered at the opening 223, and a limiting groove is provided on the surface of the fixing member 212 opposite to the opening 223, and at least a part of the reflecting member 22 is provided in the limiting groove. The above-mentioned opening 223 is opened at the position of the turning channel 23 where the light needs to be turned. By providing the opening 223, the reflecting surface 221 of the reflecting member 22 can be exposed to the turning channel 23, so that the passing light can be reflected to convert the light propagating along the first direction X in the turning channel 23 into propagating along the second direction Y. On this basis, with the help of the above-mentioned limiting groove of the fixing member 212, the reflecting member 22 can be limited at the opening 223. In addition, the combined use of the above-mentioned channel member 211 and the fixing member 212 can more conveniently realize the installation and removal of the reflecting member 22. The reflecting surface 221 of the reflecting member 22 is, for example, a mirror surface.

[0070] Furthermore, in some embodiments, the outer surface of the channel component 211 includes a first surface 218 and a second surface 220 at an angle d, and the angle d is equal to the angle a, for example; the first surface 218 is used to be arranged opposite to the light output end 32 of the optical measuring instrument 3; the second surface 220 is used to be arranged opposite to the light transmission channel 241; the channel component 211 also has a third surface 222, and the third surface 222 forms an angle c with the first surface 218, and the third surface 222 forms an angle b with the second surface 220. Moreover, the turning channel 23 includes a first sub-channel 231 and a second sub-channel 232, wherein the first sub-channel 231 is extended along the first direction X, and the second sub-channel 232 is extended along the second direction Y; one end of the first sub-channel 231 is the inlet end 23a, and is located on the first surface 218, and the other end of the first sub-channel 231 is connected to one end of the second sub-channel 232, and the other end of the second sub-channel 232 is the outlet end 23b, and is located on the second surface 220; one end of the first sub-channel 231 and the second sub-channel 232 connected to each other forms an opening 223 on the third surface 222.

[0071] In this case, when the reflective component 22 is disposed on the third surface 222, the angle of the reflective surface 221 of the reflective component 22 can be limited, that is, the reflective surface 221 of the reflective component 22 is parallel to the third surface 222. In this way, based on the principle of light refraction, when the light passing through the first sub-channel 231 along the first direction X is incident on the reflective surface 221, the reflected light after being reflected by the reflective surface 221 will pass through the second sub-channel 232 along the second direction Y, and finally be output from the outlet end 23b along the second direction Y. Therefore, the reflective component 22 can convert the light propagating along the first direction X in the first sub-channel 231 into the light propagating along the second direction Y in the second sub-channel 232. On this basis, by limiting the angle of the reflective surface 221 of the reflective component 22 through the third surface 222, the desired angle can be obtained by simply placing the reflective component 22 on the third surface 222, so that the installation of the reflective component 22 can be realized more conveniently.

[0072] In a specific embodiment, Figure 4 , Figure 5 and Fig. 9As shown, the light-transmitting window 17 is arranged at the top of the process chamber 101. In order to allow the optical fiber 31 to be led out from one side of the coil box 14 without bending or with a slight bending, the optical measuring instrument 3 is arranged horizontally, so that the optical fiber 31 can be horizontally led out from one side of the coil box 14. In this case, the inlet end 23a of the turning channel 23 is arranged opposite to the light output end 32 of the optical measuring instrument 3, and the first direction X is parallel to the horizontal plane; the angle a is 90°, and the angle c between the third surface 222 and the first surface 218 and the angle b between the third surface 222 and the second surface 220 are both 45°. Specifically, the first sub-channel 231 is arranged horizontally, the second sub-channel 232 is arranged vertically, the third surface 222 is at an angle of 45° relative to the extension direction of the first sub-channel 231, the opening 223 is arranged at the connection between the first sub-channel 231 and the second sub-channel 232, the reflective component 22 is placed on the third surface 222, and its reflective surface 221 is at an angle of 45° relative to the extension direction of the first sub-channel 231, and is exposed to the first sub-channel 231 and the second sub-channel 232 through the opening 223.

[0073] It should be noted that the embodiment of the present invention is not limited to setting the light-transmitting window 17 at the top of the process chamber 101. In practical applications, it can also be set at the side or bottom of the process chamber 101 according to specific needs. The first direction X and the second direction Y can be determined according to the angle of the light-transmitting window 17, as long as the light can be emitted into the process chamber 101 through the light-transmitting window 17 in a direction at a preset angle to the light-transmitting window 17.

[0074] Furthermore, in some embodiments, in order to more conveniently realize that the inlet end 23a of the turning channel 23 is arranged opposite to the light output end 32 of the optical measuring instrument 3, a positioning groove 219 is further provided on the surface of the channel component 211 opposite to the light output end 32 of the optical measuring instrument 3 (i.e., the first surface 218), for accommodating part of the optical measuring instrument 3. With the help of the positioning groove 219, when installing the optical measuring instrument 3, the relative position of the light output end 32 of the optical measuring instrument 3 and the inlet end 23a of the turning channel 23 can be limited by extending part of the optical measuring instrument 3 into the positioning groove 219, so that the installation can be made simpler.

[0075] In some embodiments, the light transmission device 2 further includes an adjustment structure 25, which is fixedly connected to the adapter assembly 21. The adjustment structure 25 is used to install the optical measuring instrument 3 on the adapter assembly 21, and is configured to be able to adjust the direction of the light output by the optical measuring instrument 3 so that it can be consistent with the target direction (i.e., the set first direction X). In addition, with the help of the adjustment structure 25, the optical measuring instrument 3 can be installed on the adapter assembly 21, thereby achieving the fixation of the optical measuring instrument 3, so as to facilitate the assembly of the optical measuring instrument 3 and the adapter assembly 21 into a whole.

[0076] The regulating structure 25 for realizing the above functions can have various structures, for example, Figure 6 , Fig.10 and Fig.11 As shown, the adjustment structure 25 includes a fixed bracket 251, a movable component 252 and at least three adjustment parts 253, wherein the fixed bracket 251 is fixedly connected to the adapter assembly 21 and is located on a side of the adapter assembly 21 adjacent to the light output end 32 of the optical measuring instrument 3, that is, the side where the inlet end 23a of the turning channel 23 is located; the movable component 252 is connected to the fixed bracket 251 through at least three adjustment parts 253, and the movable component 252 is arranged opposite to the fixed bracket 251, as shown in FIG. Fig.12 As shown, the movable component 252 is provided with a support hole 252a for the optical measuring instrument 3 to pass therethrough; at least three adjustment parts 253 are distributed at different positions on the circumference of the support hole 252a, and each adjustment part 253 is used to adjust the distance between the movable component 252 and the fixed bracket 251 at the position where the adjustment part 253 is located.

[0077] Specifically, the fixing bracket 251 and the adapter assembly 21 can be fixedly connected in a detachable manner by fasteners such as screws. In an embodiment where the adapter assembly 21 includes a channel component 211 and a fixing component 212, Figures 6 to 10 As shown in FIG. 2 , a mounting portion 214 is provided on the top of the surface (i.e., the first surface 218) where the inlet end 23a of the turning channel 23 of the channel component 211 is located. The mounting portion 214 is, for example, a plate-shaped protrusion protruding in a direction perpendicular to the first surface 218 relative to the first surface 218. The mounting portion 214 is provided with a fixing hole 215, and as shown in FIG. Fig.13 As shown, a threaded hole 251a is correspondingly provided on the fixing bracket 251. Figure 6 As shown, the adjustment structure 25 also includes a fastening screw 216, which passes through the fixing hole 215 on the mounting portion 214 and is threadedly connected to the threaded hole 251a on the fixing bracket 251, so that the fixing bracket 251 can be fixed to the mounting portion 214. The fastening screw 216 is, for example, a countersunk screw, and the above-mentioned fixing hole 215 is, for example, a countersunk hole. With the help of the above-mentioned mounting portion 214, the fixing bracket 251 can be arranged opposite to the surface (i.e., the first surface 218) where the inlet end 23a of the steering channel 23 of the channel component 211 is located, and a certain distance is maintained to reserve sufficient space for the installation of the movable component 252 and at least three adjustment parts 253. Further, in some embodiments, such as Figure 6 and Fig. 9 As shown, in order to more conveniently install the fixing bracket 251, a positioning pin 217 is also provided on the mounting portion 214, and as shown in FIG. Fig.13As shown, a positioning hole 251b is correspondingly provided on the fixing bracket 251. When installing the fixing bracket 251, the positioning pin 217 can be inserted into the positioning hole 251b to define the relative position of the fixing bracket 251 and the mounting portion 214. For example, there are two positioning pins 217, which are located on both sides of the fixing hole 215; correspondingly, the number of the positioning holes 251b is the same as the number of the positioning pins 217, and they are coaxially arranged one by one.

[0078] like Fig.14 As shown, at least three adjustment parts 253 are distributed at different positions on the circumference of the support hole 252a (i.e., around the optical measuring instrument 3), and each adjustment part 253 is used to adjust the distance between the movable part 252 and the fixed bracket 251 at the position where the adjustment part 253 is located. That is to say, the distance between the movable part 252 and the fixed bracket 251 can be adjusted at at least three different positions, so that the parallelism of the movable part 252 relative to the fixed bracket 251 can be adjusted. Specifically, the optical measuring instrument 3 is inserted into the supporting hole 252a of the movable component 252, and the light output end 32 of the optical measuring instrument 3 is perpendicular to the axial direction of the supporting hole 252a, and the axial direction of the supporting hole 252a is perpendicular to the surface of the movable component 252 relative to the fixed bracket 251. In this case, by adjusting the parallelism of the movable component 252 relative to the fixed bracket 251, the axial direction of the supporting hole 252a can be adjusted, so that the angle of the optical measuring instrument 3 can be adjusted to adjust the direction of the light output by the optical measuring instrument 3, so as to ensure that the direction of the light output by the optical measuring instrument 3 is consistent with the target direction (i.e., the set first direction X).

[0079] Furthermore, in some embodiments, Fig.13 As shown, the fixing bracket 251 is, for example, an L-shaped flat plate, that is, composed of two mutually perpendicular strip plates, and the movable component 252 is, for example, a rectangular flat plate, and a chamfered surface is formed at one corner of the rectangular flat plate, such as Fig.10 and Fig.11 As shown, the "L"-shaped flat plate is arranged opposite to the rectangular flat plate along the first direction X, and the "L"-shaped flat plate is located on the side of the rectangular flat plate away from the channel component 211. Of course, the embodiment of the present invention is not limited to this. In practical applications, the "L"-shaped flat plate can also be located on the side of the rectangular flat plate close to the channel component 211. Fig.14 As shown, there are three adjustment parts 253, one of which is located at a position corresponding to the middle position of the "L"-shaped flat plate, and the other two adjustment parts 253 are located at positions corresponding to the two end positions of the "L"-shaped flat plate. The movable part 252 can avoid the optical measuring instrument 3 passing through the support hole 252a of the movable part 252 by adopting the "L"-shaped flat plate, thereby avoiding interference with the installation of the optical measuring instrument 3.

[0080] In addition, in some embodiments, Figures 6 to 9 As shown, the channel component 211 includes, for example, an integrally formed first plate, a second plate and a channel body. The first plate and the second plate form an angle, the size of the angle being equal to the angle a, and the first plate is provided with the first surface 218, and the second plate is provided with the second surface 220. The channel body is provided between the first plate and the second plate, and together with the first plate and the second plate, forms a turning channel 23. On this basis, in an embodiment where the mounting portion 214 is a plate-like protrusion protruding in a direction perpendicular to the first surface 218 relative to the first surface 218, the plate-like protrusion is integrally formed with the first plate and the second plate, and together form a "Z"-shaped plate. As shown Figure 4 and Figure 8 As shown, a plurality of plate mounting holes 224 are provided on the second plate, and the second plate can be mounted on the conductive shielding plate 16 of the coil box 14 by a plurality of fasteners passing through the plurality of plate mounting holes 224 accordingly.

[0081] The structure of the adjusting portion 253 capable of adjusting the distance between the movable component 252 and the fixed bracket 251 at the position where the adjusting portion 253 is located can be various. For example, corresponding to each adjusting portion 253, Fig.13 As shown, the fixing bracket 251 is provided with a bracket mounting hole 251c and a first threaded hole 251d. Fig.12 As shown, the movable component 252 is provided with a second threaded hole 252c, and the second threaded hole 252c is coaxially arranged with the bracket mounting hole 251c; Fig.11 and Fig.14 As shown, each adjusting portion 253 includes a first adjusting screw 253a and a second adjusting screw 253b, wherein the first adjusting screw 253a passes through the bracket mounting hole 251c along the first direction X and is threadedly connected with the second threaded hole 252c; specifically, as shown in FIG. Fig.11As shown, the stud of the first adjusting screw 253a passes through the bracket mounting hole 251c from the left side of the fixed bracket 251 along the first direction X and is screwed into the second threaded hole 252c, so that the fixed bracket 251 can be connected to the movable component 252. When it is necessary to adjust the parallelism of the movable component 252 relative to the fixed bracket 251, by tightening the first adjusting screw 253a, that is, rotating the first adjusting screw 253a in the direction in which it can be screwed into the second threaded hole 252c, the movable component 252 can be moved toward the direction close to the fixed bracket 251 relative to the first adjusting screw 253a, thereby reducing the distance between the movable component 252 and the fixed bracket 251 at the position where the adjusting portion 253 is located. Since the head of the first adjusting screw 253a abuts against the surface on the left side of the fixed bracket 251, the first adjusting screw 253a can only rotate without moving along the first direction X, so that the movable component 252 can be moved relative to the first adjusting screw 253a.

[0082] The second adjusting screw 253b is threadedly connected to the first threaded hole 251d along the first direction X, and one end of the second adjusting screw 253b abuts against the movable component 252. Fig.11 As shown, the second adjusting screw 253b is screwed into the first threaded hole 251d from the left side of the fixed bracket 251 along the first direction X and abuts against the movable part 252. When the parallelism of the movable part 252 relative to the fixed bracket 251 needs to be adjusted, by tightening the second adjusting screw 253b, that is, rotating the second adjusting screw 253b in the direction in which it can be screwed into the first threaded hole 251d, the length of the part of the second adjusting screw 253b extending from the right side of the fixed bracket 251 can be increased, so that the distance between the movable part 252 and the fixed bracket 251 at the position where the adjusting part 253 is located can be increased. Therefore, by combining the first adjusting screw 253a and the second adjusting screw 253b, the distance between the movable part 252 and the fixed bracket 251 at the position where the adjusting part 253 is located can be adjusted, so that the parallelism of the movable part 252 relative to the fixed bracket 251 can be adjusted. At the same time, with the help of the first adjusting screw 253a, the fixed connection between the movable part 252 and the fixed bracket 251 can be achieved.

[0083] Furthermore, in some embodiments, in order to limit the optical measuring instrument 3 in the support hole 252a and prevent the optical measuring instrument 3 from moving relative to the support hole 252a, as shown in FIG. Fig.12 As shown, the movable part 252 is provided with an outer peripheral surface in the circumferential direction of the support hole 252a, and the movable part 252 is provided with a third threaded hole 252b1, one end of the third threaded hole 252b1 is located on the outer peripheral surface, and the other end is located on the hole wall of the support hole 252a; Figure 6As shown, the adjustment structure 25 further includes a set screw 254, which is threadedly connected to the third threaded hole 252b1, and one end of the set screw 254 is used to abut against the optical measuring instrument 3. With the help of the set screw 254, the optical measuring instrument 3 can be clamped and fixed together with the hole wall of the support hole 252a, so as to limit the optical measuring instrument 3 in the support hole 252a. The third threaded hole 252b1, for example, extends in the radial direction of the support hole 252a. In an embodiment where the fixing bracket 251 is a rectangular flat plate and a chamfered surface is formed at one corner of the rectangular flat plate, the third threaded hole 252b1 can be arranged on the chamfered surface to provide sufficient space for the installation of the set screw 254, and at the same time, it can provide convenience for the processing of the third threaded hole 252b1.

[0084] As another technical solution, Figure 4 As shown, an embodiment of the present invention further provides a semiconductor processing equipment 100, including a process chamber 101, an upper electrode device and an optical measuring instrument 3 arranged above the process chamber 101, the optical measuring instrument 3 is, for example, an interferometer endpoint (IEP), and also includes the above-mentioned light transmission device 2 provided in an embodiment of the present invention.

[0085] The upper electrode device includes a coil and a coil box 14, wherein the coil is, for example, a three-dimensional spiral coil 11, and the three-dimensional spiral coil 11 includes, for example, an inner spiral coil and an outer spiral coil, the coil box 14 is arranged at the top of the process chamber 101, and the interior of the coil box 14 is divided by a conductive shielding plate 16 to form an upper space 141 and a lower space 142, and the three-dimensional spiral coil 11 is arranged in the lower space 142; the adapter component 21 and the optical measuring instrument 3 in the light transmission device 2 are both arranged in the upper space 141; the shading component 24 in the light transmission device 2 is located in the lower space 142, and the two ends of the shading component 24 are respectively connected to the conductive shielding plate 16 and the light-transmitting window 17 at the top of the process chamber 101, as shown in FIG. Figure 5 As shown, the upper end of the optical transmission channel 241 is opposite to the outlet end of the adapter assembly 21 (ie, the outlet end 23 b of the turning channel 23 ) through the through hole 161 in the conductive shielding plate 16 .

[0086] Specifically, the coil box 14 is used to provide an installation base and accommodation space for the three-dimensional spiral coil 11 and the light transmission device 2, and can be radio frequency shielded inside the coil box 14. With the help of the conductive shielding plate 16, the adapter component 21 and the optical measuring instrument 3 in the light transmission device 2 can be placed in the upper space 141 and the lower space 142 with the three-dimensional spiral coil 11, respectively, so as to separate the adapter component 21 and the optical measuring instrument 3 from the three-dimensional spiral coil 11, so that the radio frequency energy loaded on the three-dimensional spiral coil 11 can only be transmitted downward, and at the same time, the optical measuring instrument 3 and the adapter component 21 are prevented from being installed in the high temperature environment (i.e., the lower space 142) where the three-dimensional spiral coil 11 is located. In addition, a matcher 13 is provided on the top of the coil box 14, and the three-dimensional spiral coil 11 is electrically connected to the radio frequency power supply (not shown in the figure) through the matcher 13, and the radio frequency power output by the radio frequency power supply is loaded to the three-dimensional spiral coil 11 through the matcher 13, and the matcher 13 is used to achieve impedance matching. The two ends of the matcher 13 are electrically connected to one end of the inner spiral coil and the outer spiral coil in the three-dimensional spiral coil 11 through two connecting bars 15, a part of the connecting bar 15 is located in the upper space 141, and the other part is located in the lower space 142. The other ends of the inner spiral coil and the outer spiral coil in the three-dimensional spiral coil 11 are grounded by being electrically connected to a conductive shielding plate 16, for example.

[0087] In some embodiments, the grounding method of the coil box 14 and the conductive shielding plate 16 is, for example, as follows: the process chamber 101 includes a cavity 101a, an annular bracket 104 disposed on the top of the cavity 101a, and a dielectric cover 105 supported by the annular bracket 104, the dielectric cover 105 being made of, for example, ceramic; the coil box 14 is fixedly connected to the annular bracket 104 and electrically connected; the annular bracket 104 is fixedly connected to the cavity 101a and electrically connected; the cavity 101a is grounded. Specifically, the annular bracket 104 is made of conductive material, which is used to provide an installation base for the coil box 14, so as to fix the coil box 14 on the top of the cavity 101a, and is also used to electrically connect the coil box 14 to the cavity 101a, so that the coil box 14 and the conductive shielding plate 16 can be grounded through the cavity 101a, thereby achieving the above-mentioned radio frequency shielding effect. In addition, in some embodiments, in order to ensure close contact between the two conductive contact surfaces, the conductive contact surface between the coil box 14 and the annular support 104, and the conductive contact surface between the annular support 104 and the cavity 101a are provided with an inductive coil.

[0088] The material of the light-transmitting window 17 can transmit the light output by the optical measuring instrument 3, for example, a transparent sapphire material. In some embodiments, the semiconductor processing equipment 100 further includes an air intake device, such as Fig.15As shown, the air intake device includes a nozzle 12 that penetrates the top wall of the process chamber 101, and an air intake component 31 that is stacked above the nozzle 12, wherein the nozzle 12 is provided with a first central hole 121 and at least one air intake hole 122; Fig.16 As shown, the air intake component 31 is provided with a second central hole 311 and an air intake channel 312; the first central hole 121 and the second central hole 311 are coaxially arranged, and the light-transmitting window 17 is arranged between the first central hole 121 and the second central hole 311, and the first central hole 121 and the second central hole 311 are used to form a light channel for the light output by the light-shielding component 24 to pass through. The air intake channel 312 is connected with each air intake hole 122 and is used to communicate with the air source. With the help of the above-mentioned nozzle 12 and the air intake component 31, both the installation of the light-transmitting window 17 and the air intake can be realized. In some embodiments, in order to ensure the uniformity of air intake, there are multiple air intake holes 122, and they are evenly distributed along the circumference of the first central hole 121. In this case, the air intake channel 312 is used to connect the air source with each air intake hole 122, and the air intake channel, for example, includes an annular channel surrounding the circumference of the first central hole 121 to achieve communication with each air intake hole 122.

[0089] In some embodiments, in order to prevent the process gas from igniting in the gas inlet holes 122 , the ratio of the diameter to the length of each gas inlet hole 122 is less than or equal to 1:7.

[0090] In some embodiments, in order to achieve the positioning of the nozzle 12 and the air intake component 31, as shown in FIG. Fig.16 and Fig.17 As shown, two positioning holes (123, 314) are respectively provided on the surfaces of the nozzle 12 and the air intake component 31 facing each other, and as shown in FIG. Fig.15 As shown, positioning pins 32 are arranged in the two positioning holes (123, 314). The positioning pins 32 are, for example, corrosion-resistant resin positioning pins.

[0091] In a specific embodiment, Fig.15 As shown, a nozzle mounting hole is provided on the upper surface of the medium cover 105, and the nozzle mounting hole is a step hole, and an annular mounting flange 124 is provided on the outer peripheral surface of the nozzle 12, and a retaining ring 33 is provided between the mounting flange 124 and the step surface of the step hole, so as to form a gap between the lower surface of the mounting flange 124 and the step surface of the step hole, and a first sealing ring 34 is provided in the gap, so as to achieve a seal between the lower surface of the mounting flange and the step surface of the step hole. In addition, a second sealing ring 35 is provided between the surfaces of the nozzle 12 and the air inlet component 31 facing each other, and is located at the periphery of all the air inlet holes 122, so as to achieve a seal between the surfaces of the nozzle 12 and the air inlet component 31 facing each other. The retaining ring 33 is, for example, a corrosion-resistant resin retaining ring.

[0092] In some embodiments, Fig.16 and Fig.17 As shown, two accommodating grooves (124, 313) are respectively provided on the surfaces of the nozzle 12 and the air intake component 31 facing each other, and the two accommodating grooves (124, 313) are connected to form a space for accommodating the light-transmitting window 17. In addition, the bottom surfaces of the two accommodating grooves (124, 313) are parallel to each other, and both form an angle with the surfaces of the nozzle 12 and the air intake component 31 facing each other. The angle is, for example, greater than or equal to 3° and less than or equal to 5°. By making the bottom surfaces of the two accommodating grooves (124, 313) form an angle with the surfaces of the nozzle 12 and the air intake component 31 facing each other, the light-transmitting window 17 can be tilted at the above angle relative to the surfaces of the nozzle 12 and the air intake component 31 facing each other, so as to ensure that the light will not be reflected when passing through the light-transmitting window 17, thereby ensuring the light transmittance of the light-transmitting window 17. Furthermore, in some embodiments, in order to ensure the vacuum resistance of the light-transmitting window 17 and reduce the refraction of light when passing through the light-transmitting window 17 , the thickness of the light-transmitting window 17 is, for example, greater than or equal to 3 mm and less than or equal to 5 mm.

[0093] Furthermore, in some embodiments, Fig.15 As shown, a third sealing ring 36 for sealing the light-transmitting window 17 is provided between the bottom surface of the groove of the receiving groove 124 of the nozzle 12. The third sealing ring 36 can also play a buffering role for the light-transmitting window 17 to prevent it from being damaged when the tightening force is large when it directly contacts the nozzle 12. The third sealing ring 36 is, for example, a corrosion-resistant resin sealing ring. A fourth sealing ring 37 for sealing the light-transmitting window 17 is provided between the bottom surface of the groove of the receiving groove 313 of the air intake component 31 and the light-transmitting window 17.

[0094] Furthermore, in some embodiments, Fig.15 , Fig.18 and Fig.19As shown, the semiconductor processing equipment 100 further includes a fixed flange 42 and a nozzle upper cover 41, wherein an annular mounting groove 151 is provided on the upper surface of the top wall (i.e., the medium cover 105) of the process chamber 101, the annular mounting groove 151 surrounds the nozzle 12, and the inner circumference of the annular mounting groove 151 forms a limited position recess; the fixed flange 42 is annular, and the inner circumference of the fixed flange 42 forms a limited position convex portion 421, the fixed flange 42 is arranged in the annular mounting groove 151, and the limited position convex portion 421 and the limited position recess cooperate in the vertical direction; the nozzle upper cover 41 is arranged on the upper surface of the top wall of the process chamber 101, and the air intake component 31 is covered therein; the nozzle upper cover 41 is fixedly connected to the fixed flange 42, for example, by a plurality of fixing screws 43 threadedly connected, so as to press the air intake component 31 onto the nozzle 12. Specifically, the fixed flange 42 is composed of two semi-annular flange parts, which are butted to form a complete ring body for easy installation. In addition, in order to make the first to fourth sealing rings in a compressed state to achieve a sealing effect, the depth of the space in which the nozzle upper cover 41 is used to cover the air intake component 31 is less than or equal to the thickness of the air intake component 31. In this way, when the nozzle upper cover 41 is fixedly connected to the fixing flange 42, the pressure applied by the nozzle upper cover 41 to the air intake component 31 can ensure that the lower surface of the air intake component 31 is tightly fitted with the upper surface of the nozzle 12, so that the first to fourth sealing rings can be in a compressed state. In addition, a limiting hole is also provided on the nozzle upper cover 41, and a positioning protrusion 422 is correspondingly provided on the fixing flange 42. The positioning protrusion 422 cooperates with the limiting hole to limit the relative position of the nozzle upper cover 41 and the fixing flange 42.

[0095] In some embodiments, Figure 4As shown, the coil is a three-dimensional spiral coil 11, which surrounds the shading member 24. In this case, the optical measuring instrument 3 can be arranged horizontally or tilted so that the optical fiber 31 can be led out from one side of the coil box 14 without bending or with a slight bending, so that there is no need to reserve more installation space in the vertical direction for the optical fiber 31. At the same time, the optical measuring instrument 3 arranged horizontally or tilted also reduces its own occupied space in the vertical direction. In order to avoid installing the optical measuring instrument 3 and the adapter component 21 in the high temperature environment (i.e., the lower space 421) where the three-dimensional spiral coil 11 is located, the optical measuring instrument 3 and the adapter component 21 can be installed in the space (i.e., the upper space 141) of the coil box 14 where the connecting strip 15 for connecting the matcher 13 and the three-dimensional spiral coil 11 is located, and at the same time, the size of the space in the vertical direction will not be too large, so that the normal transmission of radio frequency energy can be ensured. On this basis, the shading component 24 can be installed in the high temperature environment (i.e., the lower space 142) where the three-dimensional spiral coil 11 is located, so that the light can pass through the high temperature environment where the three-dimensional spiral coil 11 is located to reach the shading window 17, and at the same time, the influence of the glow on the light during the RF ignition can be avoided. In this case, the shading component 24 is made of insulating material, for example, ceramics with a relatively high breakdown voltage can be used.

[0096] The semiconductor processing equipment provided by the embodiment of the present invention, by adopting the above-mentioned light transmission device provided by the embodiment of the present invention, can realize the transmission of the light output by the optical measuring instrument to the process chamber, while avoiding the installation of the adapter component in the high temperature environment where the three-dimensional spiral coil is located (i.e., the lower space of the coil box), which may cause damage to the parts of the adapter component, and at the same time will not cause the upper space of the coil box to be too large in the vertical direction, thereby ensuring the normal transmission of radio frequency energy.

[0097] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A light transmission device for an optical measuring instrument, applied to semiconductor processing equipment, characterized in that: include: An adapter assembly, used for installation in the upper space of the coil box of the semiconductor processing equipment, the adapter assembly is used for converting the light outputted by the optical measuring instrument along a first direction to propagate along a second direction; the first direction and the second direction form an angle; as well as A light-shielding component is used to be installed in the lower space of the coil box and is arranged between the adapter component and the light-transmitting window located at the top of the process chamber of the semiconductor processing equipment. The light-shielding component has a light transmission channel extending along the second direction, and the two ends of the light transmission channel are respectively opposite to the outlet end of the adapter component and the light-transmitting window.

2. The light transmission device according to claim 1, characterized in that: The adapter assembly has a turning channel for transmitting light, the inlet end of the turning channel is used to be arranged opposite to the light output end of the optical measuring instrument, and the outlet end of the turning channel is used to be arranged opposite to the light transmission channel; A reflective component is disposed in the turning channel, for converting the light propagating in the first direction in the turning channel into light propagating in the second direction.

3. The light transmission device according to claim 2, characterized in that: The adapter assembly includes a channel component and a fixing component, wherein the turning channel is arranged on the channel component, and an opening is formed on the outer surface of the channel component, and the reflecting component is arranged on the outer surface of the channel component, and the reflecting surface of the reflecting component is exposed in the turning channel through the opening; The fixing component is covered at the opening, and a limiting groove is provided on a surface of the fixing component opposite to the opening, and at least a part of the reflecting component is provided in the limiting groove.

4. The light transmission device according to claim 3, characterized in that: A positioning groove is also provided on the surface of the channel component opposite to the light output end of the optical measuring instrument, for accommodating a part of the optical measuring instrument.

5. The light transmission device according to claim 1, characterized in that: The first direction is parallel to a horizontal plane; the first direction and the second direction are perpendicular to each other.

6. The light transmission device according to claim 1-5, characterized in that: The light transmission device further comprises: An adjustment structure is fixedly connected to the adapter assembly, the adjustment structure is used to install the optical measuring instrument on the adapter assembly, and is configured to be able to adjust the direction of light output by the optical measuring instrument.

7. The light transmission device according to claim 6, characterized in that: The adjustment structure comprises a fixed bracket, a movable component and at least three adjustment parts, wherein the fixed bracket is fixedly connected to the adapter assembly and is located on a side of the adapter assembly adjacent to the light output end of the optical measuring instrument; The movable component is connected to the fixed bracket through at least three adjusting parts, and the movable component is arranged opposite to the fixed bracket, and a supporting hole for the optical measuring instrument to pass through is arranged on the movable component; At least three of the adjusting portions are distributed at different positions on the circumference of the supporting hole, and each of the adjusting portions is used to adjust the distance between the movable component and the fixed bracket at the position where the adjusting portion is located.

8. The light transmission device according to claim 7, characterized in that: Corresponding to each of the adjusting parts, the fixed bracket is provided with a bracket mounting hole and a first threaded hole, the movable component is provided with a second threaded hole, and the second threaded hole is coaxially arranged with the bracket mounting hole; Each of the adjustment parts includes a first adjustment screw and a second adjustment screw, wherein the first adjustment screw passes through the bracket mounting hole along the first direction and is threadedly connected to the second threaded hole; by tightening the first adjustment screw, the distance can be reduced; the second adjustment screw is threadedly connected to the first threaded hole along the first direction, and one end of the second adjustment screw is abutted against the movable part; by tightening the second adjustment screw, the distance can be increased.

9. The light transmission device according to claim 7, characterized in that: The movable component is provided with an outer peripheral surface in the circumferential direction of the supporting hole, and the movable component is provided with a third threaded hole, one end of the third threaded hole is located on the outer peripheral surface, and the other end is located on the hole wall of the supporting hole; The adjustment structure further includes a set screw, which is threadedly connected to the third threaded hole, and one end of the set screw is used to abut against the optical measuring instrument.

10. A semiconductor processing device, comprising a process chamber, an upper electrode device disposed above the process chamber and an optical measuring instrument, characterized in that: Also includes a light transmission device as described in any one of claims 1-9; The upper electrode device comprises a coil and a coil box, wherein the coil box is arranged at the top of the process chamber, and the interior of the coil box is divided into an upper space and a lower space by a conductive shielding plate, and the coil is arranged in the lower space; The optical measuring instrument is arranged in the upper space; the two ends of the shading component in the light transmission device are respectively connected to the conductive shielding plate and the light-transmitting window, and the upper end of the light transmission channel is opposite to the outlet end of the adapter component through the through hole in the conductive shielding plate.

11. The semiconductor processing equipment according to claim 10, characterized in that: The process chamber comprises a cavity, an annular support arranged on the top of the cavity, and a dielectric cover supported by the annular support; the coil box is fixedly connected to the annular support and electrically connected; the annular support is fixedly connected to the cavity and electrically connected; the cavity is grounded.

12. The semiconductor processing equipment according to claim 10, characterized in that It also includes an air intake device, which includes a nozzle penetrating the top wall of the process chamber and an air intake component stacked above the nozzle, wherein the nozzle is provided with a first center hole and at least one air intake hole; the air intake component is provided with a second center hole and an air intake channel; the first center hole is coaxially arranged with the second center hole, and the light-transmitting window is arranged between the first center hole and the second center hole; the air intake channel is connected with each of the air intake holes and is used to connect with a gas source.

13. The semiconductor processing equipment according to claim 12, characterized in that: The surfaces of the nozzle and the air intake component facing each other are correspondingly provided with accommodating grooves, and the accommodating grooves of the nozzle and the air intake component are butted to form a space for accommodating the light-transmitting window; The bottom surface of the accommodating groove forms an angle with the surfaces of the nozzle and the air intake component facing each other.

14. The semiconductor processing equipment according to claim 12, characterized in that: It also includes a fixing flange and a nozzle cover, wherein an annular mounting groove is provided on the upper surface of the top wall of the process chamber, the annular mounting groove surrounds the nozzle, and a limited position recess is formed on the inner circumference of the annular mounting groove; The fixing flange is annular, and a limiting convex portion is formed on the inner circumference of the fixing flange. The fixing flange is arranged in the annular mounting groove, and the limiting convex portion and the limiting concave portion cooperate in a limiting position in the vertical direction; The nozzle upper cover is arranged on the upper surface of the top wall of the process chamber, and the air intake component is covered therein; the nozzle upper cover is fixedly connected to the fixing flange to press the air intake component onto the nozzle.

15. The semiconductor processing equipment according to claim 10, characterized in that The coil is a three-dimensional spiral coil, and the three-dimensional spiral coil surrounds the shading component; the shading component is made of insulating material.

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