Display device

Abstract

The invention relates to a display device. The display equipment comprises a display panel and a backlight module, wherein the display panel is used for displaying an image; the backlight module is used for providing a light source for the display panel; the backlight module comprises a substrate, a light-emitting driving circuit arranged on the substrate and a light-emitting device arranged on the substrate. The light-emitting device comprises a packaging support arranged on the substrate, and a first containing part, a second containing part and a third containing part are formed on the packaging support. The adjacent edges of the three containing parts are attached to each other. The three containing parts are each provided with at least one light-emitting chip, and the light-emitting chips are electrically connected with the drive circuit. The driving circuit is used for driving the light-emitting chip to emit light. The edges of the adjacent accommodating parts in the light-emitting device are attached, so that the overlapping degree of light spots generated by the light-emitting chips in the accommodating parts can be increased; and meanwhile, light rays generated by the light-emitting chips are better mixed and distributed at the junction. Therefore, the display uniformity of the backlight module can be improved, and the image quality of the display equipment is further improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device. Background Art

[0002] With the rapid development of display technology, the application of display devices is becoming more and more extensive. In display devices, such as LCD TVs or LCD monitors, key components include LCD panels and backlight modules. The backlight module is used to provide light sources, and the LCD panel controls the arrangement of liquid crystal molecules through electric fields, thereby adjusting the light transmittance to form images.

[0003] Among them, LED (Light Emitting Diode) devices have become the mainstream light source of the backlight panel in the backlight module due to their unique advantages. Precise regulation of LED devices can flexibly adjust the luminous intensity and color of LED devices, thereby improving the overall quality of the display screen.

[0004] Traditional LED devices often use a design where three-color chips, R (Red), G (Green), and B (Blue), are arranged side by side. This structure of LED devices can provide richer color performance, but because it is physically difficult for the light spots of the three-color chips to completely overlap, it affects the uniformity of the backlight panel display, further leading to the problem of poor display uniformity in display devices. Summary of the invention

[0005] Based on this, it is necessary to provide a display device to solve the technical problem of poor display uniformity of the display device.

[0006] A display device comprises a display panel and a backlight module, wherein the backlight module comprises: a substrate, a light-emitting driving circuit arranged on the substrate, and a light-emitting device arranged on the substrate; the light-emitting device comprises: a packaging bracket arranged on the substrate and at least three light-emitting chips; the packaging bracket is at least formed with a first accommodating portion, a second accommodating portion and a third accommodating portion; the first edge of the first accommodating portion is arranged in affixed relation with the first edge of the second accommodating portion, the second edge of the second accommodating portion is arranged in affixed relation with the first edge of the third accommodating portion, and the second edge of the third accommodating portion is arranged in affixed relation with the second edge of the first accommodating portion; the first accommodating portion, the second accommodating portion and the third accommodating portion are each provided with at least one light-emitting chip, the light-emitting chip is electrically connected to the driving circuit, and the driving circuit is used to drive the light-emitting chip to emit light.

[0007] The above-mentioned display device makes the adjacent edges of any two of the first, second, and third accommodating parts of the light-emitting device fit together so that there is no gap between the three accommodating parts, thereby making the overlap of the light spots generated by the light-emitting chips in the three accommodating parts higher. At the same time, the light generated by the light-emitting chips in each accommodating part can be better mixed and distributed at the junction. In this way, the illumination uniformity and consistency of the light-emitting device can be significantly improved, thereby improving the display uniformity of the backlight module. By enabling the backlight module to provide a more uniform and consistent backlight, the display uniformity of the display panel can be significantly improved, thereby improving the image quality of the display device.

[0008] In one embodiment, the first accommodation portion, the second accommodation portion and the third accommodation portion are arranged in sequence in a circumferential direction. The circumferentially arranged accommodation portions can make the distribution of light in the circumferential direction more uniform.

[0009] In one embodiment, the three light-emitting chips are respectively located at three vertices of the same triangle.

[0010] The arrangement of the three light-emitting chips at the three vertices of a triangle can reduce the distance between the three light-emitting chips, increase the overlap of the light spots, and improve the lighting quality compared to the side-by-side arrangement design.

[0011] In one embodiment, the angle between the first edge and the second edge of each receiving portion is 120°.

[0012] By fitting the first edges and the second edges of the three receiving parts at an angle of 120° respectively, the opening ends of the three receiving parts can be closely fitted to eliminate gaps, thereby eliminating dark areas at the junction and improving the display uniformity of the light-emitting device.

[0013] In one embodiment, the cross-sectional shape of the first accommodation portion, the second accommodation portion and the third accommodation portion in the first direction is a regular hexagon or a fan.

[0014] The hexagon is similar to a circle, and the light output angles in the horizontal and vertical directions are consistent, which can further improve the display uniformity of the light-emitting device. Three sectors can be assembled into a circle, and because the circular edge is smoother, the output light distribution can be more uniform.

[0015] In one embodiment, the cross-sectional dimensions of the opening ends of the first accommodation portion, the second accommodation portion, and the third accommodation portion in the first direction are equal.

[0016] By making the cross-sectional shape and size of the open ends of all the accommodating parts the same, the light spots generated by the light-emitting chips in each accommodating part are more consistent in shape, size and brightness, which can further improve the degree of superposition of the light spots and form a more uniform light distribution.

[0017] In one embodiment, the distance between the first surface of the first accommodating portion close to the substrate and the side wall of the packaging bracket is a first distance; the distance between the second surface of the first accommodating portion away from the substrate and the side wall is a second distance; the first distance is greater than the second distance.

[0018] By making the first distance greater than the second distance, the light emitted by the light emitting chip can be concentrated from the closed end to the open end, ensuring the light emission angle of the first receiving portion. At the same time, the closed end and the open end have the same cross-sectional shape, which helps to maintain the uniformity and consistency of the light.

[0019] In one of the embodiments, a color conversion material is disposed in at least two of the first accommodating portion, the second accommodating portion, and the third accommodating portion; the color conversion material forms a color conversion layer; a distance between the side of the color conversion layer away from the substrate and the substrate is greater than a distance between the side of the light-emitting chip away from the substrate and the substrate; the color conversion material is used to convert the wavelength of light emitted by the light-emitting chip.

[0020] By providing the color conversion material, the color conversion material and the light emitted by the light emitting chip can fully interact with each other to convert the color of the light emitted by the light emitting chip.

[0021] In one embodiment, the light-emitting device further includes an encapsulation layer, which is disposed on a side of the first accommodating portion, the second accommodating portion, and the third accommodating portion away from the substrate; a side of the encapsulation layer close to the substrate is at a third distance from the substrate, a side of the light-emitting chip away from the substrate is at a fourth distance from the substrate, and the third distance is greater than the fourth distance.

[0022] The encapsulation layer can encapsulate and protect the light-emitting chip and the color conversion layer inside, so that the light-emitting chip and the color conversion layer are protected from damage by the external environment. At the same time, the encapsulation layer can also provide mechanical support to enhance the structural stability of the receiving part.

[0023] In one embodiment, the light emitting device further comprises a light mixing layer, which is stacked with the encapsulation layer and located on a side of the encapsulation layer away from the substrate. The light mixing layer is used to mix light to make the light of the light emitting device more uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A schematic diagram of a cross-sectional structure of a display device provided in some embodiments of the present application;

[0026] Figure 2 A schematic diagram of a cross-sectional structure of a backlight module provided in some embodiments of the present application;

[0027] Figure 3 One of the schematic top views of the light emitting device provided in some embodiments of the present application;

[0028] Figure 4 A schematic top view of a light emitting device of a backlight module provided in some embodiments of the present application;

[0029] Figure 5 A second schematic top view of a light emitting device provided in some embodiments of the present application;

[0030] Figure 6 A third schematic top view of a light emitting device provided in some embodiments of the present application;

[0031] Figure 7 One of the cross-sectional schematic diagrams of the light emitting device provided in some embodiments of the present application;

[0032] Figure 8 The second cross-sectional schematic diagram of the light-emitting device provided in some embodiments of the present application.

[0033] Explanation of reference numerals: 100: backlight module; 200: display panel; 11: substrate; 12: light-emitting device; 13: packaging bracket; 121: first accommodating portion; 122: second accommodating portion; 123: third accommodating portion; 1211: light-emitting chip; 1212: color conversion layer; 1213: packaging layer; 1214: light mixing layer. DETAILED DESCRIPTION

[0034] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0036] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0037] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0038] It can be understood that “at least one” means one or more, “plurality” means two or more, and “at least a portion of an element” means a part or all of an element.

[0039] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0040] In one embodiment, a display device is provided, such as Figure 1 As shown, the display device includes a backlight module 100 .

[0041] The backlight module 100 is used to provide a light source and can emit light uniformly in the entire light emitting surface, so as to provide light with sufficient brightness and uniform distribution.

[0042] The display device further includes a display panel 200 , which is located at the light-emitting side of the backlight module 100 and is used to display an image based on the light incident from the backlight module 100 .

[0043] The above-mentioned display device can be a display product such as a liquid crystal display screen, a liquid crystal display, an instrument panel, etc., or a mobile terminal product such as a monitor, a mobile phone, a tablet computer, a smart photo album, etc. The display device uses a backlight module 100 to provide backlight, and the display panel 200 modulates the light emitted by the backlight module 100 to realize image display. In a specific application scenario, the display device can be a liquid crystal TV.

[0044] In actual implementation, the backlight module 100 can be divided into zones, and the light sources in each zone can be dimmed independently, thereby achieving more refined dynamic control and improving the dynamic contrast of the liquid crystal display.

[0045] Figure 2 A schematic diagram of a cross-sectional structure of a backlight module provided in an embodiment of the present invention is shown in FIG. Figure 2 As shown, the backlight module may include a substrate 11 , a light-emitting driving circuit (not shown) disposed on the substrate 11 , and a light-emitting device 12 disposed on the substrate 11 .

[0046] In actual implementation, the backlight module 100 may include multiple light bars, which may be arranged in parallel in a set direction, or arranged in a matrix or honeycomb pattern, etc. Each light bar includes a substrate 11, on which multiple light emitting devices 12 may be arranged as needed.

[0047] The substrate 11 has a bearing and supporting function. The shape of the substrate 11 can be selected according to the specific situation, for example, it can be a quadrilateral, a circle or a rectangle. The substrate 11 is a driving substrate, and is provided with wiring to realize the electrical connection between the light emitting device 12 and the light emitting driving circuit.

[0048] The light-emitting driving circuit is a key part for controlling the brightness and color of the light-emitting device 12, and is mainly responsible for receiving external signals and converting them into signals that can drive the light-emitting device 12 to emit light. The specific structure of the light-emitting driving circuit does not need to be limited, and those skilled in the art can set it according to specific circumstances.

[0049] The light emitting device 12 includes a packaging support disposed on a substrate, and the packaging support is at least formed with a first accommodating portion, a second accommodating portion and a third accommodating portion.

[0050] Each accommodating portion refers to a structure or component that can be used to accommodate a light-emitting chip. Exemplarily, each accommodating portion can be a groove formed by a package bracket, and the concave area of ​​the groove can accommodate the light-emitting chip. One side of the groove opening is arranged away from the substrate and can be used as the open end of the accommodating portion; the side of the groove opposite to the open end is arranged close to the substrate and can be used as the closed end of the accommodating portion.

[0051] The light emitting device 12 further comprises at least three light emitting chips, and each of the first receiving portion, the second receiving portion and the third receiving portion is provided with at least one light emitting chip. Each light emitting chip is electrically connected to a driving circuit, and the driving circuit is used to drive the light emitting chip to emit light.

[0052] The packaging bracket plays the role of supporting and protecting the light-emitting chip on the one hand, and transmitting electrical signals on the other hand.

[0053] In a specific implementation, a pad is provided on the package bracket, and the pad is used to connect each light-emitting chip and an external circuit (such as a light-emitting driving circuit). The pad is usually made of metal and has good electrical conductivity. The light-emitting chip can be fixed on the pad of the package bracket by flip-chip or gold wire bonding, and the external circuit is usually connected to the package bracket by wires, pins or other connection methods, so that the external circuit can stably transmit electrical signals to the package bracket, thereby realizing the light emission control of each light-emitting chip.

[0054] The first edge of the first accommodating portion is arranged to fit with the first edge of the second accommodating portion. By fitting the edges of the first accommodating portion with the edges of the second accommodating portion, a gap between the first accommodating portion and the second accommodating portion can be eliminated.

[0055] The second edge of the second accommodating portion is arranged to fit with the first edge of the third accommodating portion. By fitting the edges of the second accommodating portion and the third accommodating portion, the gap between the second accommodating portion and the third accommodating portion can be eliminated.

[0056] The second edge of the third accommodating portion is arranged to fit with the second edge of the first accommodating portion. By fitting the edges of the first accommodating portion and the third accommodating portion, the gap between the first accommodating portion and the third accommodating portion can be eliminated.

[0057] Thus, the adjacent edges of any two of the first accommodating portion, the second accommodating portion, and the third accommodating portion fit together, so that there is no gap between the three accommodating portions. At the same time, there is no gap at the common intersection of the three accommodating portions.

[0058] By making the three receiving parts free of gaps, the light spots generated by the light emitting chips in the three receiving parts can be overlapped more, thereby improving the overlap of the light spots and the uniformity of the overall illumination. At the same time, the light generated by the light emitting chips can be better mixed and distributed at the common intersection of the receiving parts, which helps to reduce the appearance of discontinuities and dark areas, thereby improving the consistency of illumination of the light emitting device 12.

[0059] In this embodiment, by fitting the adjacent edges of any two of the first, second, and third accommodating parts of the light-emitting device 12, there is no gap between the three accommodating parts, so that the overlap of the light spots generated by the light-emitting chips in the three accommodating parts is higher. At the same time, the light generated by the light-emitting chips in each accommodating part can be better mixed and distributed at the junction. In this way, the illumination uniformity and consistency of the light-emitting device 12 can be significantly improved, thereby improving the display uniformity of the backlight module 100. By enabling the backlight module 100 to provide a more uniform backlight, the display uniformity of the display panel 200 can be significantly improved, thereby improving the image quality of the display device.

[0060] It should be noted that, in each accommodating portion, the first edge and the second edge may form a certain angle. When the first edge and the second edge extend in the same direction, the first edge and the second edge may form the same edge.

[0061] For example, Figure 3 As shown, the package bracket is formed with a first accommodating portion 121, a second accommodating portion 122, and a third accommodating portion 123. The first accommodating portion 121 includes a first section a and a second section b, the first section a serving as a first edge of the first accommodating portion 121, and being in contact with a first edge (edge ​​c) of the second accommodating portion 122; the second section b serving as a second edge of the first accommodating portion 121, and being in contact with a second edge (edge ​​c) of the third accommodating portion 123.

[0062] In one embodiment, the first accommodation portion, the second accommodation portion and the third accommodation portion may also be arranged in sequence in a circumferential direction. The circumferentially arranged accommodation portions may make the distribution of light in the circumferential direction more uniform.

[0063] Among them, the number of accommodating parts in the packaging bracket can be set according to the specific needs such as the type of light-emitting chip, light-emitting requirements and cost. In an optional embodiment, the number of accommodating parts is three. The light-emitting device 12 with three accommodating parts can provide sufficient lighting effects and is more economical in manufacturing cost. Moreover, the configuration of three accommodating parts makes it easier to achieve a good heat dissipation design, which helps to extend the service life of the light-emitting device 12 and improve its stability. In other embodiments, the number of accommodating parts can also be more or less. For example, the number of accommodating parts can be two, four, five, etc.

[0064] When there are three accommodating parts, the number of light-emitting chips set in each accommodating part can be designed according to actual conditions, for example, combined with comprehensive factors such as the actual size of the accommodating part, light intensity requirements, heat dissipation requirements, and cost.

[0065] For example, a light-emitting chip is disposed in each housing. This method facilitates adjustment of parameters such as power, color, and arrangement of the light-emitting chip to meet different application scenarios and requirements, thereby improving the flexibility of controlling the light-emitting device 12. Moreover, it is easier to achieve efficient heat dissipation, ensuring that the light-emitting chip maintains stable performance under long-term operation, thereby improving the stability of the light-emitting device 12.

[0066] In one embodiment, the three light-emitting chips disposed in the three receiving portions are respectively located at three vertices of the same triangle.

[0067] The arrangement of the three light-emitting chips at the three vertices of a triangle can reduce the distance between the three light-emitting chips, increase the overlap of the light spots, and improve the lighting quality compared to the side-by-side arrangement design.

[0068] In one embodiment, by properly arranging the positions of the light emitting chips in the receiving portion, the three light emitting chips can be located at the three vertices of the same equilateral triangle. The light emitting chips arranged in an equilateral triangle can produce a more uniform light distribution and reduce the phenomenon of uneven light brightness.

[0069] The light emitting parameters of the three light emitting chips arranged in the three receiving parts need to be set according to actual needs. After the light emitting chips are arranged, the colors of the light emitted by the three receiving parts can be the same or different. Exemplarily, the light emitted by the three receiving parts can be red, green and blue respectively.

[0070] In other embodiments, when the number of the accommodating parts is four and a light emitting chip is disposed in each accommodating part, the lights emitted by the four light emitting chips may be red, green, blue and white, respectively.

[0071] The shape and size of each receiving portion are not unique, and the cross-sectional shape of each receiving portion in the first direction may be a polygon, or a shape surrounded by an arc, etc. The first direction may be a direction parallel to the substrate.

[0072] It should be noted that the cross-sectional shape of each receiving portion in the first direction cannot be circular. Figure 4 When the cross-sections of the three receiving parts in the first direction are all circular, the opening ends of the three receiving parts cannot be aligned at the edges, resulting in a large gap at the junction of the three receiving parts. The light generated in the three receiving parts often diffuses from the circular opening ends of the receiving parts to the surroundings, so it cannot effectively illuminate the area corresponding to the gap, forming a dark area at the junction, resulting in uneven display and affecting the display effect.

[0073] In one embodiment, the angle between the first edge and the second edge of each receiving portion is 120°.

[0074] It can be understood that the open end of the accommodating portion includes at least a third edge in addition to the first edge and the second edge, and the angle between the first edge and the third edge, and the angle between the second edge and the third edge do not need to be limited. In actual implementation, the open end of the accommodating portion may also include four edges, five edges, six edges, or multiple edges.

[0075] Since three 120° angles can form a complete 360° circle, by fitting the first edges and second edges of the three receiving parts at an angle of 120° respectively, the open ends of the three receiving parts can be closely fitted to eliminate gaps, thereby eliminating dark areas at the junction and improving the display uniformity of the light emitting device 12.

[0076] In actual implementation, the cross-sectional shapes of the accommodating portions in the first direction may be the same or different, and the arrangement is flexible.

[0077] When the cross-sectional shapes of the first accommodating portion, the second accommodating portion and the third accommodating portion in the first direction are the same, the light spots generated by the respective light-emitting chips can be more similar in shape and brightness, which helps to improve the degree of light spot superposition and achieve more uniform light distribution in the illumination area.

[0078] In one embodiment, Figure 5 As shown, the cross-sectional shape of the first accommodation portion 121 , the second accommodation portion 122 , and the third accommodation portion 123 in the first direction may be a regular hexagon.

[0079] Understandably, Figure 5 In the embodiment shown, the sides of the outer regular hexagon can represent the edges of the opening ends of the respective receiving parts. By making the edges of the receiving parts at an angle of 120° fit in pairs, on the one hand, the dark areas at the junctions between the three receiving parts can be eliminated; on the other hand, the hexagon is approximately circular, and the light output angles in the horizontal and vertical directions are consistent, which can further improve the display uniformity of the light emitting device 12.

[0080] In one embodiment, Figure 6 As shown, the cross-sectional shape of the first accommodation portion 121 , the second accommodation portion 122 , and the third accommodation portion 123 in the first direction may be a fan shape.

[0081] In this embodiment, the opening shapes of the open ends of the three receiving parts are fan-shaped, the central angle of each fan-shaped is 120°, and the two edges constituting the 120° angle are respectively the first edge and the second edge. By making the two edges constituting the central angle of the open ends of the three receiving parts fit in pairs, the open ends of the three receiving parts can be seamlessly spliced ​​together to eliminate the dark areas at the junction. Moreover, the three fan-shaped parts are spliced ​​into a circle, that is, the open ends of the three receiving parts are circular, and since the circular edges are smoother, the distribution of the emitted light can be made more uniform.

[0082] It should be noted that the cross-sectional shape of the receiving portion in the first direction is not limited to the regular hexagon and sector shape, but may be other shapes. For example, the cross-sectional shape of the receiving portion in the first direction may be a triangle with an angle of 120°.

[0083] In actual implementation, the cross-sectional dimensions of the opening ends of the accommodating portions in the first direction may be equal or unequal, and may be set according to specific circumstances.

[0084] In one embodiment, the cross sections of the opening ends of the first accommodation portion, the second accommodation portion, and the third accommodation portion in the first direction are of the same shape and the same size.

[0085] By making the cross-sectional shape and size of the open ends of all the accommodating parts the same, the light spots generated by the light-emitting chips 1211 in each accommodating part are more consistent in shape, size and brightness, which can further improve the degree of superposition of the light spots and form a more uniform light distribution.

[0086] In one embodiment, the cross-sectional shape of the closed end of the first receiving portion 121 is the same as the cross-sectional shape of the open end.

[0087] The distance between the first surface of the first accommodating portion 121 close to the substrate (i.e., the surface where the closed end is located) and the side wall of the packaging bracket 13 is a first distance L1. The distance between the second surface of the first accommodating portion 121 away from the substrate (i.e., the surface where the open end is located) and the side wall is a second distance L2. The first distance L1 is greater than the second distance L2.

[0088] Thus, the light emitted by the light emitting chip can be concentrated from the closed end to the open end, ensuring the light emission angle of the first receiving portion 121. At the same time, the closed end and the open end have the same cross-sectional shape, which helps to maintain the uniformity and consistency of the light.

[0089] It can be understood that when the first distance L1 is greater than the second distance L2, the size of the cross-section at the closed end of the first accommodating portion 121 is smaller than the size of the cross-section at the open end, and the cross-sectional size of the first accommodating portion 121 gradually increases from the closed end to the open end, parallel to the direction of the substrate, forming a gradually expanding shape.

[0090] For example, please refer again to Figure 5 When the cross-sectional shapes of the closed end and the open end of the first receiving portion 121 are both regular hexagons, the side length of the hexagon of the closed end cross section (the small regular hexagon inside the first receiving portion 121 in the figure) is smaller than the side length of the hexagon of the open end cross section (the large regular hexagon outside the first receiving portion 121 in the figure). Figure 7The size of the first accommodating portion 121 is gradually expanded from the closed end toward the open end, that is, the side length of the regular hexagon of the cross section of the first accommodating portion 121 parallel to the substrate direction gradually increases from the closed end to the open end.

[0091] In actual implementation, the structures of the second receiving portion 122 and the third receiving portion 123 can be the same as the first receiving portion 121. On the one hand, the three receiving portions have the same structure, which can improve the consistency of the light emitted from each receiving portion, so as to improve the light emitting effect of the light emitting device 12. On the other hand, the three receiving portions can adopt the same process to save costs.

[0092] In actual implementation, the cup walls of the three receiving parts are white cup walls. Since white is the color that reflects all colors of light, when the light from the light emitting chip 1211 is irradiated on the white cup wall, it will be widely scattered in all directions, which helps to achieve more uniform light distribution.

[0093] Furthermore, the cup wall of the receiving portion has a scattering and mixing effect on the light. When the light is emitted from the light emitting chip 1211 and irradiates the inner wall of the receiving portion, the light will be scattered and mixed, thereby changing the propagation direction and distribution of the light to achieve a more uniform lighting effect.

[0094] In some embodiments, the light emitting device 12 further includes a light diffusion material layer, and the light diffusion material layer is disposed on the inner side wall of the receiving portion.

[0095] Among them, the light diffusion material layer has the function of scattering and mixing light. By coating the light diffusion material layer on the inner side wall, the light emitted by the light emitting chip 1211 can be better regulated and distributed inside the housing. Since the light emitted by the light emitting chip 1211 can be more fully utilized, the light loss can be reduced and the light utilization rate of the light emitting device 12 can be improved. The specific parameters such as the light diffusion material, layer thickness, and process in the diffusion material layer do not need to be limited, and those skilled in the art can design according to specific circumstances.

[0096] In other embodiments, light diffusing material is mixed into the cup wall material of the receiving portion.

[0097] By mixing light diffusion materials into the cup wall material, light scattering and mixing effects can be achieved without the need for additional coatings or processing steps, thus simplifying the production process.

[0098] It should be noted that the light emitting chip 1211 can be set according to specific circumstances. In one embodiment, each light emitting chip 1211 is an LED chip. The LED chip has the characteristics of high brightness, color purity and good controllability, which can significantly improve the display effect of the light emitting device 12, and thus improve the display effect of the display device.

[0099] In one embodiment, the number of the housing parts is three, and an LED chip is disposed in each housing part. Thus, the cost can be reduced on the basis of meeting the use requirements. Moreover, an LED chip is disposed in each housing part, so that the LED chip can effectively dissipate heat, thereby achieving the effect of prolonging the service life of the light emitting device 12.

[0100] The light emitting colors of the LED chips in each light emitting chip 1211 may be the same or different. In one embodiment, the three LED chips are a red LED chip, a green LED chip and a blue LED chip.

[0101] The LED chips in each housing are red, green and blue, respectively, which is a combination of three primary colors and can cover the entire visible spectrum. By precisely controlling the brightness ratio of each color LED chip, any color can be mixed and adjusted.

[0102] In this embodiment, white light can be obtained by precisely controlling the LED chips of each color, and combined with the color filter film inside the display panel 200, full-color display can be achieved to meet the application requirements of various scenarios.

[0103] In one embodiment, the LED chip in each light emitting chip 1211 may be a blue light LED chip.

[0104] Since blue LED chips are cheaper and more mature in technology than red LED chips and green LED chips, the LED chips in each light-emitting chip 1211 all use blue LED chips, which can reduce the cost of the light-emitting device 12 and improve the reliability of the light-emitting device 12.

[0105] In one embodiment, the LED chip in each light emitting chip 1211 may be an ultraviolet LED chip.

[0106] Ultraviolet LED chips generally have a higher photoelectric conversion efficiency. Therefore, providing an ultraviolet LED chip in each light-emitting chip 1211 helps to reduce the energy consumption of the light-emitting device 12 and improve the overall energy efficiency of the backlight module 100 .

[0107] In other embodiments, part of the LED chips in the light emitting chip 1211 may be blue LED chips, part may be ultraviolet LED chips, or LED chips of other colors.

[0108] It can be understood that, when the LED chip in the light emitting chip 1211 is only a blue LED chip or an ultraviolet LED chip, a color conversion material is provided in at least two of the first accommodating portion 121, the second accommodating portion 122, and the third accommodating portion 123. The color conversion material is used to convert the wavelength of the light emitted by the light emitting chip 1211, so that the light emitting device 12 can achieve the desired color, such as white light.

[0109] Please refer to Figure 7 The color conversion material may form a color conversion layer 1212. The distance between the color conversion layer 1212 and the substrate, which is away from the substrate, is greater than the distance between the light emitting chip 1211 and the substrate, which is away from the substrate.

[0110] The color conversion material is used to convert the wavelength of the light emitted by the light emitting chip 1211. Therefore, by arranging the color conversion layer 1212 in the receiving portion to convert the wavelength of the light emitted by the light emitting chip 1211, the color of the emitted light can be converted.

[0111] In this embodiment, by making the distance between the side of the color conversion layer 1212 away from the substrate and the substrate greater than the distance between the side of the light emitting chip 1211 away from the substrate and the substrate, the color conversion material can cover the LED chip. As a result, the color conversion material and the light emitted by the LED chip can fully interact with each other to fully change the color of the light emitted by the light emitting chip 1211. By providing the color conversion material in at least two receiving portions of the light emitting device 12, the light emitting color range of the light emitting device 12 can be made wider.

[0112] In the case where the three LED chips in the three receiving parts are all blue LED chips, color conversion layers 1212 may be provided in two receiving parts, and the color conversion layers 1212 in the two receiving parts are used to convert the blue light emitted by the blue LED chips into green light and red light respectively. The color conversion layer 1212 may not be provided in the other receiving part, and the blue light emitted by the blue LED chip in the receiving part is mixed with the green light and red light emitted in the other two receiving parts to realize white light.

[0113] In the case where the three LED chips are all ultraviolet LED chips, a color conversion layer 1212 is respectively provided in the three receiving parts. This is because the ultraviolet LED chip itself does not directly emit visible light, but can be converted into visible light of various colors by the color conversion layer 1212. Therefore, by respectively providing the color conversion layer 1212 in the three receiving parts where the ultraviolet LED chips are provided, the light emitting device 12 can realize the required white light.

[0114] Therefore, by providing the color conversion layer 1212 in at least two receiving portions of the light-emitting device 12, there is no need to use separate red LED chips, green LED chips and blue LED chips, thereby reducing the cost of the light-emitting device 12 and further achieving the purpose of reducing the cost of the display device.

[0115] The type of the color conversion material is not unique. In one embodiment, the color conversion material includes a phosphor material.

[0116] Phosphor is a material that can emit light of another wavelength when excited by light of a specific wavelength. The principle of luminescence is that after the activator atoms in the phosphor absorb the excitation energy, they emit part of the energy in the form of light radiation, and transfer the other part of the energy to other atoms through the resonance transfer process, causing them to generate their own radiation.

[0117] Phosphor materials generally have good stability and cost-effectiveness, and can improve the stability and cost advantage of the light-emitting device 12 .

[0118] In one embodiment, the color converting material comprises a quantum dot material.

[0119] Quantum dots are nanoscale semiconductor materials with excellent optoelectronic properties, such as high color purity, adjustable luminescent color, and high fluorescence quantum yield. Quantum dots can be used as color conversion materials to achieve full-color display by absorbing light of a specific wavelength (such as blue light) and converting it into light of another wavelength (such as red or green light).

[0120] Quantum dots generally have a narrower light-emitting spectrum and a higher color saturation, which can improve the display quality of the light-emitting device 12 and further improve the display effect of the display panel 200 .

[0121] In one embodiment, the color conversion material may also include phosphor material and quantum dot material.

[0122] By using the phosphor material and the quantum dot material at the same time, the color conversion material can make up for each other's shortcomings in terms of luminous efficiency, light stability, cost, etc., and improve the overall performance. Among them, the specific parameters, mixing ratio and other details of the phosphor material and the quantum dot material can be set according to the specific situation, and this embodiment does not limit this.

[0123] In one embodiment, Figure 7 As shown, the light emitting device further includes an encapsulation layer 1213. The encapsulation layer 1213 is disposed on the side of the first accommodating portion, the second accommodating portion, and the third accommodating portion away from the substrate. The distance between the side of the encapsulation layer 1213 close to the substrate and the substrate is a third distance, and the distance between the side of the light emitting chip away from the substrate and the substrate is a fourth distance, and the third distance is greater than the fourth distance.

[0124] The encapsulation layer 1213 is an encapsulation adhesive layer formed by an encapsulation material. The encapsulation material does not need to be limited, and those skilled in the art can set it according to specific circumstances.

[0125] When the color conversion layer 1212 is disposed in the receiving portion, the encapsulation layer 1213 may be located on a side of the color conversion layer 1212 away from the light emitting chip 1211 .

[0126] The encapsulation layer 1213 is used to encapsulate and protect the light emitting chip 1211 and the color conversion layer 1212 in the receiving part, so as to protect the light emitting chip 1211 and the color conversion layer 1212 from damage by the external environment. At the same time, the encapsulation layer 1213 can also provide mechanical support to enhance the structural stability of the receiving part.

[0127] The thickness of the encapsulation layer 1213 needs to be set according to the actual situation. For example, the thickness of the encapsulation layer 1213 can be 5um-100um. The encapsulation layer 1213 can provide a certain light mixing distance to obtain a better light emitting effect.

[0128] In one embodiment, Figure 8 As shown, the light-emitting device further includes a light-mixing layer 1214 , which is stacked with the encapsulation layer 1213 and is located on a side of the encapsulation layer 1213 away from the substrate.

[0129] The light mixing layer 1214 is used to mix light to make the light of the light emitting device 12 more uniform. The light mixing layer 1214 may contain diffusion particles, such as SiO2 (silicon dioxide), TiO2 (titanium dioxide) and other inorganic particles, which can make the device mix light more fully.

[0130] In this embodiment, the thickness of the encapsulation layer 1213 may be 5 um-100 um.

[0131] In actual implementation, the thickness of the encapsulation layer 1213 can be appropriately thickened according to specific circumstances to increase the light mixing distance of the light mixing layer 1214 and obtain a better light mixing effect.

[0132] In order to better understand the above embodiment, a detailed explanation is given below in conjunction with a specific embodiment. In one embodiment, the display device includes a backlight module 100 and a display panel 200, wherein the backlight module 100 includes a substrate 11, a light-emitting driving circuit disposed on the substrate 11, and a light-emitting device 12 disposed on the substrate 11.

[0133] Please combine Figure 5 , Figure 7 and Figure 8The light emitting device 12 includes a packaging support 13, and the packaging support 13 is formed with a first accommodating portion 121, a second accommodating portion 122, and a third accommodating portion 123. The cross-sectional shapes of the open ends and the closed ends of the three accommodating portions in the first direction are all regular hexagons, and the cross-sectional shapes of the open ends and the closed ends of each accommodating portion in the first direction are the same. The size of the cross-sectional area of ​​the closed end of the accommodating portion is smaller than the size of the cross-sectional area of ​​the open end, and the distance between the first surface where the closed end is located and the side wall of the packaging support is a first distance, which is greater than the second distance between the second surface where the open end is located and the side wall.

[0134] The first edge of the opening end of the first accommodating portion 121 is fitted with the first edge of the opening end of the second accommodating portion 122, the second edge of the opening end of the second accommodating portion 122 is fitted with the first edge of the opening end of the third accommodating portion 123, and the second edge of the opening end of the third accommodating portion 123 is fitted with the second edge of the opening end of the first accommodating portion 121.

[0135] A light emitting chip 1211 is disposed in each of the three receiving portions, and the three blue LED chips are arranged in a triangle. The light emitting chip 1211 includes a blue LED chip. The three blue LED chips are electrically connected to the driving circuit through the pads of the packaging bracket 13; the driving circuit is used to drive each blue LED chip to emit light.

[0136] The second receiving portion 122 and the third receiving portion 123 are filled with a color conversion layer 1212, and are used in combination with a blue LED chip for color conversion to achieve white light, thereby eliminating the need for separate red and green LED chips, and reducing costs.

[0137] The edges of the opening ends of the three receiving parts are tightly fitted, so that the opening ends of the three receiving parts are seamlessly spliced ​​together, thereby eliminating the dark areas at the junctions. In addition, the edges of the three receiving parts are all fitted, with a large contact area, so that the overlap of the light spots is high.

[0138] After the light emitting device 12 is applied to the backlight panel of the backlight module 100 , a uniform light mixing effect can be achieved, thereby improving the display quality of the display device.

[0139] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic description of the above terms does not necessarily refer to the same embodiment or example.

[0140] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0141] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A display device, characterized in that: include: Display panel; Backlight module; Wherein, the backlight module comprises: substrate; A light-emitting driving circuit disposed on the substrate; and A light emitting device is provided on the substrate, and the light emitting device comprises: A packaging bracket is arranged on the substrate; the packaging bracket is formed with at least a first accommodating portion, a second accommodating portion and a third accommodating portion; a first edge of the first accommodating portion is arranged in abutment with a first edge of the second accommodating portion, a second edge of the second accommodating portion is arranged in abutment with a first edge of the third accommodating portion, and a second edge of the third accommodating portion is arranged in abutment with a second edge of the first accommodating portion; At least three light-emitting chips, the first accommodation portion, the second accommodation portion and the third accommodation portion are each provided with at least one light-emitting chip, the light-emitting chip is electrically connected to the driving circuit, and the driving circuit is used to drive the light-emitting chip to emit light.

2. The display device according to claim 1, characterized in that The first accommodation portion, the second accommodation portion and the third accommodation portion are arranged in sequence in a circumferential direction.

3. The display device according to claim 2, characterized in that The three light-emitting chips are respectively located at three vertices of the same triangle.

4. The display device according to claim 3, characterized in that The included angle between the first edge and the second edge of each accommodating portion is 120°.

5. The display device according to claim 3, characterized in that The cross-sectional shapes of the first accommodation portion, the second accommodation portion and the third accommodation portion in the first direction are regular hexagonal or fan-shaped.

6. The display device according to claim 5, characterized in that The cross-sectional dimensions of the opening ends of the first accommodation portion, the second accommodation portion, and the third accommodation portion in the first direction are equal.

7. The display device according to claim 6, characterized in that The distance between the first surface of the first accommodating portion close to the substrate and the side wall of the packaging bracket is a first distance; the distance between the second surface of the first accommodating portion away from the substrate and the side wall is a second distance; the first distance is greater than the second distance.

8. The display device according to claim 1, characterized in that A color conversion material is arranged in at least two of the first accommodating portion, the second accommodating portion and the third accommodating portion; the color conversion material forms a color conversion layer; the distance between the side of the color conversion layer away from the substrate and the substrate is greater than the distance between the side of the light-emitting chip away from the substrate and the substrate; the color conversion material is used to convert the wavelength of light emitted by the light-emitting chip.

9. The display device according to any one of claims 1 to 8, characterized in that: The light-emitting device also includes an encapsulation layer, which is arranged on the side of the first accommodating portion, the second accommodating portion and the third accommodating portion away from the substrate; the distance between the side of the encapsulation layer close to the substrate and the substrate is a third distance, and the distance between the side of the light-emitting chip away from the substrate and the substrate is a fourth distance, and the third distance is greater than the fourth distance.

10. The display device according to claim 9, characterized in that The light emitting device further comprises a light mixing layer, which is stacked with the encapsulation layer and is located on a side of the encapsulation layer away from the substrate.

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