Light-emitting substrate, backlight module and display device

Abstract

The invention discloses a light-emitting substrate, a backlight module and a display device, and belongs to the technical field of display. The light-emitting substrate comprises a back plate, a driving circuit layer and a plurality of light-emitting units, each light-emitting unit comprises a reflecting layer, a bedding layer and a light-emitting chip, due to the fact that the light-emitting faces of the light-emitting chips face the reflecting layers, light emitted by the light-emitting chips is firstly transmitted to one side of the back plate and then is reflected by the reflecting layers arranged on the inner walls of counter bores in the back plate, and the light emitted by the light-emitting chips is transmitted to the other side of the back plate. The path of light emitted by the light-emitting chip can be prolonged. Thus, after the light-emitting substrate is integrated on the backlight module, it can be guaranteed that the backlight module has a good light mixing effect without increasing the distance between the light-emitting substrate and a diffusion plate in the backlight module, and the overall thickness of the backlight module is small.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting substrate, a backlight module and a display device. Background Art

[0002] Liquid Crystal Display (LCD) is a flat ultra-thin display device, which usually includes a liquid crystal display panel and a backlight module, wherein the backlight module provides light source for the liquid crystal display panel. The backlight module usually includes: a housing, a light-emitting substrate and a diffuser installed in the housing, and the diffuser is located on the light-emitting side of the light-emitting substrate.

[0003] The light-emitting substrate includes: a backplane, and a plurality of light-emitting chips located on one side of the backplane, and the light-emitting surface of each light-emitting chip faces the side away from the backplane. That is, the light-emitting surface of each light-emitting chip can face the diffuser. Since the light emitted by each light-emitting chip in the light-emitting substrate needs to pass a certain distance to be effectively mixed, the distance between the diffuser and the light-emitting substrate is usually referred to as the light mixing distance.

[0004] In order to ensure that the brightness of the light source provided by the backlight module is uniform and improve the display effect of the LCD, the light mixing effect is usually improved by increasing the light mixing distance between the diffusion plate and the light emitting substrate. However, increasing the light mixing distance will increase the thickness of the backlight module, thereby significantly increasing the overall thickness of the LCD. Summary of the invention

[0005] The embodiments of the present application provide a light-emitting substrate, a backlight module and a display device, which can solve the problem of poor light mixing of the light-emitting substrate in the prior art. The technical solution is as follows:

[0006] In one aspect, a light-emitting substrate is provided, the light-emitting substrate comprising: a backplane, a driving circuit layer and a plurality of light-emitting units;

[0007] One side of the back plate has a plurality of countersunk holes;

[0008] The driving circuit layer is located on a side of the back plate having the countersunk hole, and the orthographic projection of the driving circuit layer on the back plate does not overlap with the area where the countersunk hole is located;

[0009] The plurality of light-emitting units are all located on a side of the back plate having the countersunk holes, and the plurality of light-emitting units correspond to the plurality of countersunk holes; the light-emitting units include: a reflective layer, a padding layer and a light-emitting chip;

[0010] Among them, the reflective layer in the light-emitting unit is attached to the inner wall of the corresponding countersunk hole; the cushion layer in the light-emitting unit is at least partially filled into the corresponding countersunk hole; the light-emitting chip in the light-emitting unit is located on the side of the cushion layer away from the back plate, and the light-emitting surface of the light-emitting chip faces the reflective layer, and the light-emitting chip is electrically connected to the driving circuit layer.

[0011] Optionally, the orthographic projection of the light-emitting chip in the light-emitting unit on the back plate is located in the area where the corresponding countersunk hole is located.

[0012] Optionally, the inner wall surface of the countersunk hole is an arc-shaped concave surface.

[0013] Optionally, a portion of the cushion layer is filled into the countersunk hole, and another portion of the cushion layer is located outside the countersunk hole;

[0014] Wherein, a side of the cushion layer facing away from the back plate is parallel to the back plate, and a side of the cushion layer facing away from the back plate is bonded to the light emitting surface of the light emitting chip.

[0015] Optionally, the cushion layer has a positioning groove on a side facing away from the back plate, and the bottom surface of the positioning groove is parallel to the back plate;

[0016] A portion of the light emitting chip is located in the positioning groove.

[0017] Optionally, the light-emitting substrate further includes: an encapsulation layer, the encapsulation layer is located on a side of the plurality of light-emitting units away from the back plate, and the encapsulation layer wraps the plurality of light-emitting units.

[0018] Optionally, the encapsulation layer includes: a plurality of encapsulation units that are separately arranged, the plurality of encapsulation units correspond to the plurality of light-emitting units, and the encapsulation units wrap the corresponding light-emitting units.

[0019] Optionally, a side of the packaging unit facing away from the back plate is an arc-shaped convex surface.

[0020] Optionally, the encapsulation unit is in direct contact with a region of the cushion layer on a side facing away from the back plate where the light-emitting chip is not disposed;

[0021] The refractive index of the encapsulation layer is greater than the refractive index of the pad layer, or the refractive index of the encapsulation layer is less than the refractive index of the pad layer.

[0022] Optionally, the driving circuit layer has a plurality of first hollow areas, the plurality of first hollow areas correspond to the plurality of countersunk holes, and the area where the countersunk holes are located is located within the orthographic projection of the corresponding first hollow areas on the back plate;

[0023] The light-emitting substrate further includes: a first electrode and a second electrode distributed in the first hollow area, wherein the first electrode and the second electrode are both electrically connected to the driving circuit layer;

[0024] The light-emitting chip has a first soldering foot and a second soldering foot on a side facing away from the pad layer, the first soldering foot is electrically connected to the first electrode, and the second soldering foot is electrically connected to the second electrode.

[0025] Optionally, when the light-emitting substrate includes a plurality of packaging units, the plurality of packaging units correspond to the plurality of first hollow areas, and the packaging units wrap the first electrode and the second electrode in the corresponding first hollow areas.

[0026] Optionally, the light-emitting substrate further includes: a first connecting lead and a second connecting lead, the first soldering foot is electrically connected to the first electrode via the first connecting lead, and the second soldering foot is electrically connected to the second electrode via the second connecting lead.

[0027] Optionally, the light-emitting substrate also includes: a reflective ink layer, wherein the reflective ink layer is located on the side of the driving circuit layer away from the back panel, the reflective ink layer has a plurality of second hollow areas, the plurality of second hollow areas correspond to the plurality of first hollow areas, and the orthographic projection of the first hollow area on the back panel is located within the orthographic projection of the corresponding second hollow area on the back panel.

[0028] On the other hand, a backlight module is provided, comprising: a housing, and a light-emitting substrate installed in the housing, wherein the light-emitting substrate is any of the light-emitting substrates described above.

[0029] On the other hand, a display device is provided, comprising: a liquid crystal display panel and a backlight module, and the backlight module is the backlight module described above.

[0030] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least:

[0031] Since the light emitting surface of the light emitting chip faces the reflective layer, the light emitted by the light emitting chip is first transmitted to one side of the back plate, and then reflected by the reflective layer arranged on the inner wall of the countersunk hole on the back plate, so that the path of the light emitted by the light emitting chip can be extended. In this way, after the light emitting substrate is integrated into the backlight module, there is no need to increase the distance between the light emitting substrate and the diffusion plate in the backlight module, so that the backlight module can have a better light mixing effect, making the overall thickness of the backlight module lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 It is a schematic diagram of a top view structure of a light-emitting substrate provided in the present application;

[0034] Figure 2 yes Figure 1 A schematic diagram of a film structure of a light-emitting substrate at position AA' is shown;

[0035] Figure 3 is a top view of a single light-emitting unit provided in an embodiment of the present application;

[0036] Figure 4 yes Figure 3 A schematic diagram of a film structure of a light-emitting unit at position BB' is shown;

[0037] Figure 5 is a schematic diagram of a light path in a light-emitting unit provided in the present application;

[0038] Figure 6 is a schematic diagram of a light path in another light-emitting unit provided in the present application;

[0039] Figure 7 yes Figure 1 A schematic diagram of a partial film structure of a light-emitting substrate at position AA' is shown;

[0040] Figure 8 is a schematic diagram of a light path in another light-emitting unit provided in the present application;

[0041] Fig. 9 is a schematic diagram of a light path in another light-emitting unit provided in the present application;

[0042] Fig.10 yes Figure 1 Another schematic diagram of the film structure of the light-emitting substrate at position AA' is shown;

[0043] Fig.11 It is a structural schematic diagram of a backlight module provided in this application. DETAILED DESCRIPTION

[0044] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0045] Please refer to Figure 1 and Figure 2 , Figure 1 is a schematic diagram of a top view structure of a light-emitting substrate provided in the present application, Figure 2 yes Figure 1 A schematic diagram of a film structure of a light emitting substrate at AA′ is shown. The light emitting substrate 000 may include: a back plate 100 , a driving circuit layer 200 and a plurality of light emitting units 300 .

[0046] One side of the back plate 100 has a plurality of countersunk holes 101 .

[0047] The driving circuit layer 200 is located on the side of the back plate 100 having the countersunk hole 101 , and the orthographic projection of the driving circuit layer 200 on the back plate 100 does not overlap with the area where the countersunk hole 101 is located.

[0048] The plurality of light emitting units 300 are all located on the side of the back plate 100 having the countersunk holes 101, and the plurality of light emitting units 300 correspond to the plurality of countersunk holes 101. For example, Figure 1 and Figure 2 As shown, a plurality of light emitting units 300 are arranged in an array on one side of the back plate 100 having the countersunk holes 101, and the plurality of light emitting units 300 correspond one to one to the plurality of countersunk holes 101. Here, the orthographic projection of each light emitting unit 300 on the back plate 100 may overlap with the corresponding countersunk hole 101.

[0049] The light-emitting unit 300 may include: a reflective layer 301, a cushion layer 302 and a light-emitting chip 303. The reflective layer 301 in the light-emitting unit 300 is attached to the inner wall of the corresponding countersunk hole 101; the cushion layer 302 in the light-emitting unit 300 at least partially fills the corresponding countersunk hole 101; the light-emitting chip 303 in the light-emitting unit 300 is located on the side of the cushion layer 302 away from the back plate 100, and the light-emitting surface of the light-emitting chip 303 faces the reflective layer 301, and the light-emitting chip 303 can be electrically connected to the driving circuit layer 200. Here, the driving circuit layer 200 in the light-emitting substrate 000 can drive the light-emitting chip 303 to emit light.

[0050] In the embodiment of the present application, under the driving action of the driving circuit layer 200, the light emitting chip 303 can emit light in the direction toward the back plate 100, and after passing through the pad layer 302, the light can be reflected by the reflective layer 301 disposed on the inner wall of the countersunk hole 101, so that the reflected light can pass through the pad layer 302 and then be emitted in a direction away from the back plate 100. It should be noted that the material of the pad layer 302 in the light emitting unit 300 can be a transparent organic material to ensure that the light emitted from the light emitting surface of the light emitting chip 303 and the light reflected by the reflective layer 301 can both pass through the pad layer 302 normally.

[0051] Here, the light emitted by the light emitting chip 303 is first transmitted to one side of the back plate 100, and then reflected by the reflective layer 301 provided on the inner wall of the countersunk hole 101 on the back plate 100, so that the path of the light emitted by the light emitting chip 303 can be extended. In this way, after the light emitting substrate 000 is integrated into the backlight module, it is not necessary to increase the distance between the light emitting substrate 000 and the diffusion plate in the backlight module, so that the backlight module can have a better light mixing effect, and the overall thickness of the backlight module is low.

[0052] In summary, the light-emitting substrate provided by the present application includes: a backplane, a driving circuit layer and a plurality of light-emitting units, wherein the light-emitting unit includes: a reflective layer, a padding layer and a light-emitting chip. Since the light-emitting surface of the light-emitting chip faces the reflective layer, the light emitted by the light-emitting chip is first transmitted to one side of the backplane, and then reflected by the reflective layer arranged on the inner wall of the countersunk hole on the backplane, so that the path of the light emitted by the light-emitting chip can be extended. In this way, after the light-emitting substrate is integrated into the backlight module, there is no need to increase the distance between the light-emitting substrate and the diffuser in the backlight module, so that the backlight module can have a better light mixing effect, making the overall thickness of the backlight module lower.

[0053] In the examples of this application, please refer to Figure 3 , Figure 3 is a top view of a single light-emitting unit provided in an embodiment of the present application, Figure 4 yes Figure 3 A schematic diagram of a film structure of a light-emitting unit at BB' is shown. The orthographic projection of the light-emitting chip 303 in the light-emitting unit 300 on the back plate 100 is located in the area where the corresponding countersunk hole 101 is located. In this case, it can be ensured that the light emitted by the light-emitting chip 303 can be more reflected by the reflective layer 301 attached to the inner wall of the countersunk hole 101, thereby improving the utilization rate of the light.

[0054] The inner wall surface of the counterbore 101 may be an arc-shaped concave surface. Accordingly, the reflective layer 301 attached to the inner wall of the counterbore 101 may also be an arc-shaped concave surface. For incident light at different angles, the reflective layer 301 may adjust its emission angle to optimize the range of the light emission viewing angle of the light-emitting unit 300. When the inner wall surface of the counterbore 101 is an arc-shaped concave surface, the optical axis M of the light-emitting chip 303 may coincide with the central axis N of the arc-shaped concave surface. In this case, the light emitted by the light-emitting chip 303 may be uniformly emitted around the light-emitting chip 303 after being reflected by the reflective layer 301, thereby ensuring the overall light-emitting effect of the light-emitting unit 300.

[0055] It should be noted that, when the inner wall surface of the counterbore 101 is an arc-shaped concave surface, the range of the light viewing angle of the light emitting unit 300 can be adjusted by adjusting the curvature of the arc-shaped concave surface. Figure 5 and Figure 6 , Figure 5is a schematic diagram of a light path in a light-emitting unit provided in the present application, Figure 6 Schematic diagram of the light path in another light-emitting unit provided in the present application. Figure 5 As shown, when the curvature of the arc-shaped concave surface is relatively large, the light emitted by the light emitting chip 303 has a larger viewing angle after passing through the reflective layer 301; Figure 6 As shown, when the curvature of the arc-shaped concave surface is relatively small, among the light emitted by the light emitting chip 303 , the light emitted after passing through the reflective layer 301 has a smaller viewing angle.

[0056] In the light-emitting substrate 000, the curvature of the countersunk hole 101 can be adjusted according to actual needs. For example, for the light-emitting substrate 000 of the same specification, when the number of light-emitting units 300 of the light-emitting substrate 000 is relatively small, the distance between adjacent light-emitting units 300 is relatively large, and the curvature of the countersunk hole 101 corresponding to each light-emitting unit 300 can be relatively large. In this way, the range of the light output angle of each light-emitting unit 300 is relatively large, which can ensure that the brightness of the area where the light-emitting unit 300 is located is not much different from the brightness of the area between adjacent light-emitting units 300, avoid the obvious light shadow in the area where the light-emitting unit 300 is located, and improve the display effect of the display device. When the number of light-emitting units 300 of the light-emitting substrate 000 is relatively large, the distance between adjacent light-emitting units 300 is relatively small, and the curvature of the countersunk hole 101 corresponding to each light-emitting unit 300 can be relatively small. In this way, even if the light emitting viewing angle range of each light emitting unit 300 is relatively small, it can ensure that the brightness of the area where the light emitting unit 300 is located is not much different from the brightness of the area between adjacent light emitting units 300, thereby avoiding the appearance of obvious light shadows in the area where the light emitting unit 300 is located. At the same time, it can also improve the display brightness of the display device at the positive viewing angle, thereby improving the display effect of the display device.

[0057] Please refer again Figure 4 , the cushion layer 302 is located on the side of the reflective layer 301 away from the back plate 100, and the cushion layer 302 is at least partially filled into the corresponding countersunk hole 101. In a possible case, a portion of the cushion layer 302 is filled into the countersunk hole 101, and another portion of the cushion layer 302 is located outside the countersunk hole 101. Among them, the side of the cushion layer 302 away from the back plate 100 is parallel to the back plate 100, and the side of the cushion layer 302 away from the back plate 100 is bonded to the light emitting surface of the light emitting chip 303.

[0058] In this way, the light emitting surface of the light emitting chip 303 can be ensured to be parallel to the back plate 100, so that the light emitted from the light emitting surface of the light emitting chip 303 can be evenly emitted in a direction away from the back plate 100 after being reflected by the reflective layer 301 set on the inner wall of the countersunk hole 101.

[0059] In this application, please refer to Figure 7 , Figure 7 yes Figure 1 The schematic diagram of the partial film layer structure of the light-emitting substrate at AA' is shown, and the padding layer 302 may have a positioning groove 302a on the side facing away from the back plate 100, and a part of the light-emitting chip 303 may be located in the positioning groove 302a. Here, the bottom surface of the positioning groove 302a is parallel to the back plate 100, and the light-emitting surface of the light-emitting chip 303 may be bonded to the bottom surface of the positioning groove 302a to ensure that the light-emitting surface of the light-emitting chip 303 is parallel to the back plate 100, thereby ensuring the uniformity of the light emission of the light-emitting unit 300.

[0060] Exemplarily, an adhesive film may be provided in the positioning groove 302 a , and the cushioning layer 302 is bonded to the light emitting surface of the light emitting chip 303 via the adhesive film.

[0061] It should be noted that, in order to ensure that the light-emitting chip 303 can be accurately fixed on the side of the cushion layer 302 away from the back plate 100, a positioning groove 302a can be pre-set on the side of the cushion layer 302 away from the back plate 100. Here, the orthographic projection of the positioning groove 302a on the back plate 100 can be located in the area where the countersunk hole 101 is located, and the center point of the orthographic projection of the positioning groove 302a on the back plate 100 can coincide with the center axis N of the countersunk hole 101. In this way, in the subsequent process of transferring the light-emitting chip 303 to the side of the cushion layer 302 away from the back plate 100 through the solid crystal process, it is only necessary to allow a part of the light-emitting chip 303 to be located in the positioning groove 302a, so as to ensure that the orthographic projection of the light-emitting chip 303 on the back plate 100 is located in the area where the countersunk hole 101 is located, and it can ensure that the optical axis M of the light-emitting chip 303 coincides with the center axis N of the countersunk hole 101.

[0062] Optional, such as Figure 4 As shown, the light emitting chip 303 has a first solder pin 3031 and a second solder pin 3032 on the side away from the pad layer 302, and the first solder pin 3031 and the second solder pin 3032 of the light emitting chip 303 are respectively electrically connected to the driving circuit layer 200, so that the light emitting substrate 000 can drive the light emitting chip 303 to emit light through the driving circuit layer 200. Here, one of the first solder pin 3031 and the second solder pin 3032 can be a positive solder pin, and the other can be a negative solder pin.

[0063] The driving circuit layer 200 has a plurality of first hollow areas 200a, and the plurality of first hollow areas 200a correspond to the plurality of countersunk holes 101, and the area where the countersunk holes 101 are located is located within the orthographic projection of the corresponding first hollow area 200a on the back plate 100. The light-emitting substrate 000 may further include: a first electrode 501 and a second electrode 502 distributed in the first hollow area 200a, and the first electrode 501 and the second electrode 502 are both electrically connected to the driving circuit layer 200.

[0064] The first solder foot 3031 is electrically connected to the first electrode 501 to achieve electrical connection between the first solder foot 3031 and the driving circuit layer 200 , and the second solder foot 3032 is electrically connected to the second electrode 502 to achieve electrical connection between the second solder foot 3022 and the driving circuit layer 200 .

[0065] Exemplarily, the light-emitting substrate 000 may further include: a first connection lead 601 and a second connection lead 602, the first solder foot 3031 is electrically connected to the first electrode 501 through the first connection lead 601, and the second solder foot 3032 is electrically connected to the second electrode 502 through the second connection lead 602. That is, one end of the first connection lead 601 is connected to the first solder foot 3031, and the other end of the first connection lead 601 is connected to the first electrode 501; one end of the second connection lead 602 is connected to the second solder foot 3032, and the other end of the second connection lead 602 is connected to the second electrode 502.

[0066] The first connection lead 601 and the second connection lead 602 may be made of conductive metal material. Exemplarily, the first connection lead 601 is connected to the first soldering foot 3031 and the first electrode 501 by welding, and the second connection lead 602 is connected to the second soldering foot 3032 and the second electrode 502 by welding.

[0067] Optionally, the light-emitting substrate 000 further includes: an encapsulation layer 400, which is located on the side of the plurality of light-emitting units 300 away from the back plate 100, and the encapsulation layer 400 wraps the plurality of light-emitting units 300. The encapsulation layer 400 also wraps the first electrode 501 and the second electrode 502 electrically connected to the driving circuit layer 200, and the first connecting lead 601 and the second connecting lead 602, so that the encapsulation layer 400 can not only protect the electrical connection between the light-emitting unit 300 and the driving circuit layer 200, but also improve the structural stability of the light-emitting substrate 000 and extend the service life of the light-emitting substrate 000.

[0068] There are many possible implementations of the encapsulation layer 400. In one possible case, the encapsulation layer 400 can be integrally encapsulated on the side of the multiple light-emitting units 300 away from the back plate 100. In another possible case, the encapsulation layer 400 can include a plurality of separately arranged encapsulation units 401, the plurality of encapsulation units 401 correspond to the plurality of light-emitting units 300, and the encapsulation units 401 wrap the corresponding light-emitting units 300. This application will be further described by taking the encapsulation layer 400 including the plurality of separately arranged encapsulation units 401 as an example.

[0069] like Figure 4As shown, in the case where the encapsulation layer 400 includes a plurality of encapsulation units 401 that are separately arranged, the plurality of encapsulation units 401 may correspond to the plurality of light-emitting units 300, and the encapsulation units 401 wrap the corresponding light-emitting units 300. Here, the plurality of encapsulation units 401 also correspond to the plurality of first hollow areas 200a in the driving circuit layer 200, and the encapsulation units 401 wrap the first electrodes 501 and the second electrodes 502 in the corresponding first hollow areas 200a, and the first connection leads 601 and the second connection leads 602.

[0070] The side of the packaging unit 401 facing away from the back panel 100 can be an arc-shaped convex surface, and since the refractive index of the packaging unit 401 is greater than the refractive index of the air outside the light-emitting substrate 000, in this case, the light can be further evenly diverged after being emitted from the packaging unit 401, thereby further improving the light mixing effect.

[0071] Exemplarily, the encapsulation unit 401 may be a light-transmitting adhesive layer, for example, the encapsulation unit 401 may be, but not limited to, silicone or epoxy resin. In one possible implementation, when forming the encapsulation unit 401, a recess corresponding to the encapsulation unit 401 may be pre-formed on a release film, and then the encapsulation unit 401 may be formed by embossing the release film on the surface of the epoxy resin layer or silicone layer in a semi-cured state. It should be noted that in some other possible implementations, the encapsulation unit 401 may also be formed by, but not limited to, at least one of an etching process, a physical sandblasting process, and an exposure and development process, which will not be described one by one here.

[0072] The packaging unit 401 is in direct contact with the area on the side of the cushion layer 302 away from the back plate 100 where the light emitting chip 303 is not provided. Here, the area on the side of the cushion layer 302 away from the back plate 100 where the light emitting chip 303 is not provided is the area where the light is emitted after being reflected by the reflective layer 301. When the refractive index of the packaging layer 400 is different from that of the cushion layer 302, the light will be refracted when entering the packaging layer 400 from the cushion layer 302, further adjusting the range of the light output angle of the light emitting unit 300. For examples, please refer to Figure 8 and Fig. 9 , Figure 8 is a schematic diagram of a light path in another light-emitting unit provided in the present application, Fig. 9 This is a schematic diagram of the light path in another light-emitting unit provided in the present application.

[0073] In one possible case, the refractive index of the encapsulation layer 400 is greater than the refractive index of the pad layer 302, such as Figure 8As shown, at the interface where the pad layer 302 contacts the encapsulation layer 400, the light of the first viewing angle emitted at the light emitting angle X will be refracted into the light of the second viewing angle after entering the encapsulation layer 400, and the light emitting angle Z1 of the light of the second viewing angle is smaller than the light emitting angle X of the light of the first viewing angle. That is, when the refractive index of the encapsulation layer 400 is greater than the refractive index of the pad layer 302, the range of the light emitting viewing angle of the light emitting unit 300 will be narrowed, which is suitable for the light emitting substrate 000 with a large number of light emitting units 300 and a small distance between adjacent light emitting units 300, and can improve the display brightness of the display device at the normal viewing angle, and improve the display effect of the display device.

[0074] In another possible case, the refractive index of the encapsulation layer 400 is less than the refractive index of the pad layer 302. Fig. 9 As shown, at the interface where the pad layer 302 contacts the encapsulation layer 400, the light of the first viewing angle emitted at the light emitting angle X will be refracted into the light of the third viewing angle after entering the encapsulation layer 400, and the light emitting angle Z2 of the light of the third viewing angle is greater than the light emitting angle X of the light of the first viewing angle. That is, when the refractive index of the encapsulation layer 400 is less than the refractive index of the pad layer 302, the range of the light emitting viewing angle of the light emitting unit 300 will be increased, which is suitable for the light emitting substrate 000 with a small number of light emitting units 300 and a large distance between adjacent light emitting units 300. It can ensure that the brightness of the area where the light emitting unit 300 is located is not much different from the brightness of the area between the adjacent light emitting units 300, avoid the obvious light shadow in the area where the light emitting unit 300 is located, and improve the display effect of the display device.

[0075] It should be noted that the light will also be refracted when it is emitted from the encapsulation layer 400 to the outside of the light-emitting substrate 000, which is not shown in the optical path schematic diagram provided in the present application.

[0076] Optional, please refer again Figure 4 The light-emitting substrate 000 may further include: a reflective ink layer 700, the reflective ink layer 700 is located on the side of the driving circuit layer 200 away from the back plate 100, the reflective ink layer 700 has a plurality of second hollow areas 700a, the plurality of second hollow areas 700a correspond to the plurality of first hollow areas 200a, and the orthographic projection of the first hollow area 200a on the back plate 100 is located within the orthographic projection of the corresponding second hollow area 700a on the back plate 100.

[0077] It should be noted that the reflective ink layer 700 can be a white ink layer, through which part of the light emitted to the area between adjacent light-emitting units 300 in the light-emitting substrate 000 can be reflected toward the light-emitting direction of the light-emitting substrate 000, so as to improve the utilization rate of the light and improve the display brightness of the display device.

[0078] In addition, the reflective ink layer 700 is formed before welding the first connecting lead 601 and the second connecting lead 602. The reflective ink layer 700 can be used to protect the wiring in the driving circuit layer 200. The protective effect of the reflective ink layer 700 can prevent the parts of the driving circuit layer 200 that do not need to be welded from being damaged, thereby improving the welding efficiency of the light-emitting chip 303 and the yield of the light-emitting substrate 000.

[0079] Please refer to Fig.10 , Fig.10 yes Figure 1 Another schematic diagram of the film layer structure of the light-emitting substrate at AA' is shown. In some possible implementations, the light-emitting substrate 000 may also include: an insulating layer 800, the insulating layer 800 is located between the driving circuit layer 200 and the reflective ink layer 700, and the orthographic projection of the insulating layer 800 on the back plate 100 overlaps with the orthographic projection of the reflective ink layer 700 on the back plate 100. That is, the insulating layer 800 has a plurality of third hollow areas 800a, the plurality of third hollow areas 800a correspond to the plurality of second hollow areas 700a, and the orthographic projection of the third hollow area 800a on the back plate 100 overlaps with the orthographic projection of the corresponding second hollow area 700a on the back plate 100. The insulating layer 800 can be used to protect the wiring in the driving circuit layer 200 and improve the yield of the light-emitting substrate 000.

[0080] In summary, the light-emitting substrate provided by the present application includes: a backplane, a driving circuit layer and a plurality of light-emitting units, wherein the light-emitting unit includes: a reflective layer, a padding layer and a light-emitting chip. Since the light-emitting surface of the light-emitting chip faces the reflective layer, the light emitted by the light-emitting chip is first transmitted to one side of the backplane, and then reflected by the reflective layer arranged on the inner wall of the countersunk hole on the backplane, so that the path of the light emitted by the light-emitting chip can be extended. In this way, after the light-emitting substrate is integrated into the backlight module, there is no need to increase the distance between the light-emitting substrate and the diffuser in the backlight module, so that the backlight module can have a better light mixing effect, making the overall thickness of the backlight module lower.

[0081] This application also provides a backlight module 900, please refer to Fig.11 , Fig.11 The backlight module 900 may include: a housing 1000 and a light-emitting substrate 000 installed in the housing 1000. The light-emitting substrate 000 may be any of the light-emitting substrates given above.

[0082] The backlight module 900 may also include: an inner plastic frame 1100, a diffuser plate 1200 and an optical film material 1300 installed in the housing 1000. The diffuser plate 1200 and the optical film material 1300 are stacked on the light-emitting side of the light-emitting substrate 000, and the diffuser plate 1200 is closer to the light-emitting substrate 000 than the optical film material 1300. The distance between the light-emitting substrate 000 and the diffuser plate 1200 is the light mixing distance d. The inner plastic frame 1200 is used to support the diffuser plate 1200 and the optical film material 1300, so that there is a certain light mixing distance d between the diffuser plate 1200 and the light-emitting substrate 000. In the case where the light-emitting substrate 000 is the light-emitting substrate provided in the embodiment of the present application, even if the light mixing distance d is small, the light mixing property of the backlight module can be good, so that the requirement of a small thickness of the backlight module can be met while ensuring the light mixing effect.

[0083] It should be noted that the optical film material 1300 in the backlight module 900 may include: at least one of a lower prism sheet, an upper prism sheet and a diffusion sheet stacked in a direction vertically and away from the diffusion plate 1200 .

[0084] The present application also provides a display device, which includes: a liquid crystal display panel and a backlight module 900, wherein the backlight module 900 is the backlight module described above, and the back of the liquid crystal display panel can be connected to the backlight module 900. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, an advertising machine, a display screen, a digital photo frame, etc.

[0085] Optionally, the liquid crystal display panel may be fixedly connected to the backlight module 900 via a connecting layer, and the connecting layer may be a material with buffering capability such as foam or rubber.

[0086] In the embodiment of the present application, the liquid crystal display panel may include: an array substrate and a color filter substrate arranged opposite to each other, and a liquid crystal layer located between the array substrate and the color filter substrate. The array substrate is closer to the backlight module 900 than the color filter substrate, that is, the backlight module may be distributed on the side of the array substrate away from the color filter substrate.

[0087] It should be noted that, since the liquid crystal molecules in the liquid crystal layer only have a regulating effect on polarized light, it is also necessary to set a first polarizer on the side of the array substrate away from the color filter substrate, and set a second polarizer on the side of the color filter substrate away from the array substrate. Here, the polarization direction of the first polarizer can be perpendicular to the polarization direction of the second polarizer.

[0088] In this case, after the light emitted from the backlight module 900 passes through the first polarizer, the first polarizer can convert the light emitted from the backlight module 900 into the first polarized light. The array substrate and the color filter substrate and the liquid crystal layer therebetween can regulate the first polarized light.

[0089] For example, through the adjustment of the array substrate, the color filter substrate and the liquid crystal layer located therebetween, the polarization direction of the first polarized light can be deflected to be parallel to the polarization direction of the second polarizer, and the light can be transmitted through the second polarizer.

[0090] For another example, through the adjustment of the array substrate, the color filter substrate and the liquid crystal layer located therebetween, the polarization direction of the first polarized light can be made perpendicular to the polarization direction of the second polarizer, and this light cannot be transmitted through the second polarizer.

[0091] Since each pixel region in the liquid crystal display panel can adjust the incident light, after each pixel region adjusts the light, the liquid crystal display panel can present a corresponding display image.

[0092] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0093] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0094] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A light-emitting substrate, characterized in that: The light-emitting substrate comprises: a backplane, a driving circuit layer and a plurality of light-emitting units; One side of the back plate has a plurality of countersunk holes; The driving circuit layer is located on a side of the back plate having the countersunk hole, and the orthographic projection of the driving circuit layer on the back plate does not overlap with the area where the countersunk hole is located; The plurality of light-emitting units are all located on a side of the back plate having the countersunk holes, and the plurality of light-emitting units correspond to the plurality of countersunk holes; the light-emitting units include: a reflective layer, a padding layer and a light-emitting chip; Among them, the reflective layer in the light-emitting unit is attached to the inner wall of the corresponding countersunk hole; at least a part of the padding layer in the light-emitting unit is filled into the corresponding countersunk hole; the light-emitting chip in the light-emitting unit is located on the side of the padding layer away from the back plate, and the light-emitting surface of the light-emitting chip faces the reflective layer, and the light-emitting chip is electrically connected to the driving circuit layer.

2. The light-emitting substrate according to claim 1, characterized in that: The orthographic projection of the light emitting chip in the light emitting unit on the back plate is located in the area where the corresponding countersunk hole is located.

3. The light-emitting substrate according to claim 2, characterized in that: The inner wall surface of the countersunk hole is an arc-shaped concave surface.

4. The light-emitting substrate according to claim 1, characterized in that: A portion of the cushion layer is filled into the countersunk hole, and another portion of the cushion layer is located outside the countersunk hole; Wherein, a side of the cushion layer facing away from the back plate is parallel to the back plate, and a side of the cushion layer facing away from the back plate is bonded to the light emitting surface of the light emitting chip.

5. The light-emitting substrate according to claim 4, characterized in that: The cushion layer has a positioning groove on a side facing away from the back plate, and the bottom surface of the positioning groove is parallel to the back plate; A portion of the light emitting chip is located in the positioning groove.

6. The light-emitting substrate according to any one of claims 1 to 5, characterized in that: The light-emitting substrate further includes: a packaging layer, the packaging layer is located on a side of the plurality of light-emitting units away from the back plate, and the packaging layer wraps the plurality of light-emitting units.

7. The light-emitting substrate according to claim 6, characterized in that: The encapsulation layer includes: a plurality of encapsulation units that are separately arranged, the plurality of encapsulation units correspond to the plurality of light-emitting units, and the encapsulation units wrap the corresponding light-emitting units.

8. The light-emitting substrate according to claim 7, characterized in that: A side of the packaging unit facing away from the back plate is an arc-shaped convex surface.

9. The light-emitting substrate according to claim 7, characterized in that: The packaging unit is in direct contact with a region of the cushion layer on a side facing away from the back plate where the light-emitting chip is not disposed; The refractive index of the encapsulation layer is greater than the refractive index of the pad layer, or the refractive index of the encapsulation layer is less than the refractive index of the pad layer.

10. The light-emitting substrate according to any one of claims 1-5, 7-9, characterized in that: The driving circuit layer has a plurality of first hollow areas, the plurality of first hollow areas correspond to the plurality of countersunk holes, and the area where the countersunk holes are located is located within the orthographic projection of the corresponding first hollow area on the back plate; The light-emitting substrate further includes: a first electrode and a second electrode distributed in the first hollow area, wherein the first electrode and the second electrode are both electrically connected to the driving circuit layer; The light-emitting chip has a first soldering foot and a second soldering foot on a side facing away from the pad layer, the first soldering foot is electrically connected to the first electrode, and the second soldering foot is electrically connected to the second electrode.

11. The light emitting substrate according to claim 10, characterized in that: In the case where the light-emitting substrate includes a plurality of packaging units, the plurality of packaging units correspond to the plurality of first hollow areas, and the packaging units wrap the first electrode and the second electrode in the corresponding first hollow areas.

12. The light emitting substrate according to claim 10, characterized in that: The light emitting substrate further includes: a first connecting lead and a second connecting lead, the first soldering foot is electrically connected to the first electrode via the first connecting lead, and the second soldering foot is electrically connected to the second electrode via the second connecting lead.

13. The light emitting substrate according to claim 10, characterized in that: The light-emitting substrate also includes: a reflective ink layer, which is located on the side of the driving circuit layer away from the back panel, and the reflective ink layer has a plurality of second hollow areas, and the plurality of second hollow areas correspond to the plurality of first hollow areas, and the orthographic projection of the first hollow area on the back panel is located within the orthographic projection of the corresponding second hollow area on the back panel.

14. A backlight module, characterized in that: The backlight module comprises: a housing, and a light-emitting substrate installed in the housing, and the light-emitting substrate is the light-emitting substrate according to any one of claims 1-13.

15. A display device, characterized in that: include: A liquid crystal display panel and a backlight module, wherein the backlight module is the backlight module according to claim 14.

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