Exposure device for improving exposure uniformity

Abstract

The invention provides an exposure device for improving exposure uniformity, which comprises a fixing platform for fixing a wafer, a jacking assembly in sliding connection with the fixing platform, a driving mechanism for driving the jacking assembly to vertically slide along the fixing platform, and an exposure structure positioned above the fixing platform, the jacking assembly is tightly attached to the lower portion of the edge of the wafer, the driving mechanism comprises a connecting piece fixedly connected with the jacking assembly and a vertical lifting assembly driving the connecting piece to move vertically, and the vertical lifting assembly drives the connecting piece to ascend. Therefore, the connecting piece and the jacking assembly lift the edge of the wafer. According to the invention, the exposure structure can be accurately regulated and controlled, the yield of the wafer is improved, the process is simplified, and the production cost of the wafer is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of gallium arsenide (GaAs) HBT production equipment, and in particular to an exposure device for improving exposure uniformity. Background Art

[0002] In the manufacturing process of gallium arsenide (GaAs) HBT products, the control requirements for critical dimensions (CD) are extremely high. Due to the large height difference between the wafer surface and the wafer edge, the critical dimensions after exposure are usually uneven, which in turn affects the performance and yield of the components. This unevenness has a negative impact on the final performance of the product. In order to improve this problem, it is crucial to optimize the design of the exposure platform to improve the uniformity of the critical dimensions.

[0003] In traditional processes, in order to deal with this problem, different exposure parameters Focus (focus depth) or Dose (exposure energy) are often used to process the wafer edge shot and other shot areas respectively to improve the uniformity of CD. However, this method not only increases the complexity of the process, but also has an adverse effect on production efficiency and product consistency. Summary of the invention

[0004] In view of the shortcomings of the prior art, the purpose of the present invention is to provide an exposure device with improved exposure uniformity, aiming to solve the problem in the prior art that different exposure parameters Focus (focus depth) or Dose (exposure energy) are often used to process the wafer edge shot and other shot areas respectively to improve the CD uniformity. However, this method not only increases the complexity of the process, but also has an adverse effect on production efficiency and product consistency.

[0005] In order to achieve the above object, the present invention is implemented by the following technical solutions:

[0006] An exposure device for improving exposure uniformity includes a fixed platform for fixing a wafer, a lifting assembly slidably connected to the fixed platform, a driving mechanism for driving the lifting assembly to slide vertically along the fixed platform, and an exposure structure located above the fixed platform, wherein the lifting assembly is closely attached to the bottom of the edge of the wafer, the driving mechanism includes a connecting piece fixedly connected to the lifting assembly, and a vertical lifting assembly that drives the connecting piece to move vertically, and the vertical lifting assembly drives the connecting piece to rise so that the connecting piece together with the lifting assembly lifts the edge of the wafer.

[0007] According to one aspect of the above technical solution, the fixed platform has a placement position, a surface of which is provided with a plurality of vacuum adsorption holes at intervals, and the middle portion of the wafer is adsorbed in the vacuum adsorption holes.

[0008] According to one aspect of the above technical solution, the lifting assembly is an annular lifting platform, and the annular lifting platform fits tightly against the edge of the wafer.

[0009] According to one aspect of the above technical solution, the fixed platform is recessed with an annular sliding groove for accommodating the annular lifting platform, and the annular lifting platform moves vertically along the annular sliding groove so that the annular lifting platform lifts up the edge of the wafer. The upper end of the annular lifting platform is at the same horizontal height as the upper surface of the fixed platform.

[0010] According to one aspect of the above technical solution, the connecting member includes a plurality of support rods connected to the bottom of the annular jacking platform, and a synchronization rod connecting the plurality of support rods.

[0011] According to one aspect of the above technical solution, the vertical lifting assembly includes upper and lower connecting rods located below the synchronization rod, rollers located below the upper and lower connecting rods, and a linkage structure that drives the upper and lower connecting rods to move up and down.

[0012] According to one aspect of the above technical solution, the linkage structure includes an oblique support, a ball screw threadedly connected to the oblique support, and a motor driving the ball screw to rotate, and the roller is slidably arranged on the inclined surface of the oblique support.

[0013] According to one aspect of the above technical solution, the maximum moving distance of the upper and lower connecting rods is 2um.

[0014] According to one aspect of the above technical solution, the placement position is arranged in a circular shape, the diameter of the placement position is 145mm-150mm, and the width of the annular jacking platform is 0.4mm-0.6mm.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The wafer is fixed by setting a fixed platform, and a lifting assembly slidably connected to the fixed platform is set. When the surface of the wafer needs to be evenly exposed, the vertical lifting assembly is started, so that the vertical lifting assembly drives the lifting assembly to rise through the connecting piece, so that the lifting assembly slightly lifts the edge of the wafer until the edge and the middle of the wafer reach the same horizontal line, thereby eliminating the problem of uneven height between the middle and the edge of the wafer. Then, the wafer can be evenly exposed through the exposure structure, and the exposure accuracy is also improved. This improvement directly improves the quality and consistency of products in the manufacturing process of HBT components, and reduces the scrap rate caused by improper adjustment of exposure parameters;

[0017] The present invention can achieve precise control of the exposure structure, can adjust the height of the wafer edge in real time and accurately, and ensure exposure flatness; it can also improve the yield of the wafer, reduce product defects caused by uneven exposure, and significantly improve the yield of the product; it simplifies the process, avoids complex exposure parameter settings and adjustments, and makes the process flow simpler and more efficient; and by improving exposure accuracy, it reduces multiple corrections and tests in the lithography process, thereby reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of an exposure device for improving exposure uniformity in a first embodiment of the present invention;

[0019] Figure 2 for Figure 1 Exploded diagram of the structure;

[0020] Figure 3 It is a structural diagram of the vertical lifting assembly in the first embodiment of the present invention;

[0021] Description of main component symbols:

[0022] Fixed platform 10 Annular lifting platform 20 Wafer 30 motor 47 Annular sliding groove 21 Vacuum adsorption hole 31 Support rod 41 Synchronous rod 42 Upper and lower connecting rod 43 Scroll Wheel 44 Diagonal brace 45 Ball Screw 46

[0023] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] See also Figures 1 to 3 , shown is an exposure device for improving exposure uniformity in the first embodiment of the present invention, including a fixed platform 10 for fixing a wafer 30, a lifting component slidably connected to the fixed platform 10, a driving mechanism for driving the lifting component to slide vertically along the fixed platform 10, and an exposure structure located above the fixed platform 10, wherein the lifting component is closely attached to the bottom of the edge of the wafer 30, the driving mechanism includes a connecting member fixedly connected to the lifting component, and a vertical lifting component that drives the connecting member to move vertically, and the vertical lifting component drives the connecting member to rise so that the connecting member together with the lifting component lifts the edge of the wafer 30.

[0028] It can be understood that the present invention fixes the wafer 30 by setting a fixed platform 10, and sets a lifting component slidably connected to the fixed platform 10. When the surface of the wafer 30 needs to be uniformly exposed, the vertical lifting component is started, so that the vertical lifting component drives the lifting component to rise through the connecting piece, so that the lifting component slightly lifts the edge of the wafer 30 until the height of the edge and the middle of the wafer 30 reaches the same horizontal line, thereby eliminating the problem of uneven height between the middle and the edge of the wafer 30. Then, the wafer 30 can be uniformly exposed through the exposure structure, and the exposure accuracy is also improved. This improvement directly improves the quality and consistency of the products in the manufacturing process of the HBT components, and reduces the scrap rate caused by improper adjustment of the exposure parameters;

[0029] The present invention can achieve precise control of the exposure structure, can adjust the height of the wafer edge in real time and accurately, and ensure exposure flatness; it can also improve the yield of the wafer 30, reduce product defects caused by uneven exposure, and significantly improve the yield of the product; simplify the process, avoid complex exposure parameter settings and adjustments, and make the process flow simpler and more efficient; and by improving exposure accuracy, it reduces multiple corrections and tests in the lithography process, thereby reducing production costs.

[0030] Specifically, in the present embodiment, the fixing platform 10 has a placement position, and a plurality of vacuum adsorption holes 31 are arranged at intervals on the surface of the placement position, and the middle portion of the wafer 30 is adsorbed in the vacuum adsorption holes 31 .

[0031] It can be understood that the wafer 30 is placed in the placement position, and then a vacuum is drawn toward the vacuum adsorption hole 31 through a vacuum adsorption machine (not shown in the figure), and then the wafer 30 is firmly adsorbed in the placement position through the vacuum adsorption hole 31 to avoid the middle part of the wafer 30 being shifted when the edge of the wafer 30 is lifted by the lifting assembly, thereby causing poor exposure.

[0032] Further, the lifting assembly is an annular lifting platform 20, and the annular lifting platform 20 is closely fitted with the edge of the wafer 30; the fixed platform 10 is recessed with an annular sliding groove 21 for accommodating the annular lifting platform 20, and the annular lifting platform 20 moves vertically along the annular sliding groove 21, so that the annular lifting platform 20 lifts the edge of the wafer 30. The upper end of the annular lifting platform 20 is at the same level as the upper surface of the fixed platform 10.

[0033] It can be understood that by setting an annular sliding groove 21 for the vertical movement of the annular lifting platform 20 on the fixed platform 10, the annular lifting platform 20 can be driven to move up and down stably through the vertical lifting assembly, thereby preventing the annular lifting platform 20 from deviation during movement, resulting in inconsistent heights at various positions when the edge of the wafer 30 is lifted, thereby causing poor exposure effect.

[0034] Specifically, the connecting member includes a plurality of support rods 41 connected to the bottom of the annular jacking platform 20, and a synchronization rod 42 connecting the plurality of support rods 41; the vertical lifting assembly includes an upper and lower connecting rod 43 located below the synchronization rod 42, a roller 44 located below the upper and lower connecting rods 43, and a linkage structure driving the upper and lower connecting rods 43 to move up and down; the linkage structure includes a diagonal brace 45, a ball screw 46 threadedly connected to the diagonal brace 45, and a motor 47 driving the ball screw 46 to rotate, and the roller 44 is slidably arranged on the inclined surface of the diagonal brace 45.

[0035] It can be understood that when it is necessary to lift the edge of the wafer 30, the motor 47 drives the ball screw 46 to rotate, so that the diagonal support 45 moves horizontally, and then the upper and lower connecting rods 43 are driven to rise vertically through the roller 44. The upper and lower connecting rods 43 drive the synchronization rod 42 and multiple support rods 41 to rise synchronously, so as to lift the edge of the wafer 30 through the annular lifting platform 20 to achieve uniform exposure; it should be noted that the slope of the diagonal support 45 cannot be too high to prevent the diagonal support 45 from moving slightly, which will cause a large displacement of the upper and lower connecting rods 43, which is not conducive to the fine lifting of the wafer 30 and may easily cause the wafer 30 to break.

[0036] Exemplarily, the maximum moving distance of the upper and lower connecting rods 43 is 2um to avoid edge breakage of the wafer 30 caused by excessive moving distance; the placement position is arranged in a circular shape, the diameter of the placement position is 145mm~150mm, and the width of the annular lifting platform 20 is 0.4mm~0.6mm.

[0037] In summary, the exposure device for improving exposure uniformity in the above-mentioned embodiments of the present invention can realize precise control of the exposure structure, and can adjust the height of the wafer edge in real time and accurately to ensure exposure flatness; it can also improve the yield of the wafer, reduce product defects caused by uneven exposure, and significantly improve the yield of the product; it simplifies the process, avoids complex exposure parameter settings and adjustments, and makes the process flow simpler and more efficient; and by improving exposure accuracy, it reduces multiple corrections and tests in the lithography process, thereby reducing production costs.

[0038] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0039] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An exposure device for improving exposure uniformity, characterized in that: It includes a fixed platform for fixing a wafer, a lifting component slidably connected to the fixed platform, a driving mechanism for driving the lifting component to slide vertically along the fixed platform, and an exposure structure located above the fixed platform. The lifting component is tightly attached to the bottom of the edge of the wafer. The driving mechanism includes a connecting part fixedly connected to the lifting component and a vertical lifting component that drives the connecting part to move vertically. The vertical lifting component drives the connecting part to rise so that the connecting part together with the lifting component lifts the edge of the wafer.

2. The exposure device for improving exposure uniformity according to claim 1, characterized in that: The fixed platform has a placement position, a surface of which is provided with a plurality of vacuum adsorption holes at intervals, and the middle part of the wafer is adsorbed in the vacuum adsorption holes.

3. The exposure device for improving exposure uniformity according to claim 2, characterized in that: The lifting component is an annular lifting platform, and the annular lifting platform is tightly fitted with the edge of the wafer.

4. The exposure device for improving exposure uniformity according to claim 3, characterized in that: The fixed platform is recessed with an annular sliding groove for accommodating the annular lifting platform. The annular lifting platform moves vertically along the annular sliding groove so that the annular lifting platform lifts the edge of the wafer. The upper end of the annular lifting platform is at the same horizontal height as the upper surface of the fixed platform.

5. The exposure device for improving exposure uniformity according to claim 3, characterized in that: The connecting member includes a plurality of supporting rods connected to the bottom of the annular lifting platform and a synchronous rod connecting the plurality of supporting rods.

6. The exposure device for improving exposure uniformity according to claim 5, characterized in that: The vertical lifting assembly includes an upper and lower connecting rod located below the synchronization rod, a roller located below the upper and lower connecting rods, and a linkage structure driving the upper and lower connecting rods to move up and down.

7. The exposure device for improving exposure uniformity according to claim 6, characterized in that: The linkage structure includes an oblique support, a ball screw threadedly connected to the oblique support, and a motor driving the ball screw to rotate, and the roller is slidably arranged on the inclined surface of the oblique support.

8. The exposure device for improving exposure uniformity according to claim 6, characterized in that: The maximum moving distance of the upper and lower connecting rods is 2um.

9. The exposure device for improving exposure uniformity according to claim 3, characterized in that: The placement position is arranged in a circular shape, the diameter of the placement position is 145mm-150mm, and the width of the annular jacking platform is 0.4mm-0.6mm.

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