Intelligent detection method and device for bonding area ratio of insulation board

Abstract

The invention belongs to the technical field of insulation board detection, and particularly relates to an intelligent detection method and device for the bonding area ratio of an insulation board, and the method comprises the steps: collecting an infrared image of an external insulation system of a building external wall, determining a plurality of segmentation thresholds according to local regions with different sizes of pixel points, obtaining a temperature characteristic value according to the size relation between the pixel value of the pixel point and each segmentation threshold value, dividing the infrared image into a plurality of super-pixel blocks according to the pixel value and the temperature characteristic value, and calculating the temperature anomaly degree according to the number of all the super-pixel blocks contained in each heat insulation board and the concentration trend and difference of the pixel value. And determining the bonding strength of the target insulation board according to the position and area ratio of the target sub-block of which the sound velocity is within the sound velocity range of the bonding part and the bonding state is bonded in the target insulation board of which the temperature abnormal degree is greater than a preset threshold value, and judging whether the target insulation board is qualified by combining the vertical height. According to the invention, the accuracy of insulation board quality detection is improved.

Description

Technical Field

[0001] The present invention relates to the field of thermal insulation board detection technology, and more specifically, to a thermal insulation board bonding area ratio intelligent detection method and device. Background Art

[0002] The External Thermal Insulation System (ETICS) of the building's exterior walls is a comprehensive system designed to improve the building's energy efficiency, reduce heat loss, and provide a good indoor environment. It mainly includes the following components: insulation board, bonding layer, plaster layer, anchor, protective layer, finishing layer, sealing material, breathable layer and fire isolation zone. Among them, the insulation board is the core of the external insulation system. The good bonding effect of the insulation board is the key to ensure that the external insulation system can fully exert its insulation function. Therefore, in order to prevent heat loss from the building's exterior walls, it is necessary to detect and determine the bonding effect of the insulation board.

[0003] In the related technology, for example, the Chinese patent application document with application publication number CN118858453A discloses an ultrasonic image detection method and device for exterior wall insulation boards, which belongs to the field of ultrasonic image detection technology. The method includes: determining a first detection area based on a surface thermal image of the exterior wall insulation board; obtaining an ultrasonic image of the first detection area; calculating the insulation board area and the bonding area based on the ultrasonic image; and evaluating the exterior wall insulation board based on the insulation board area and the bonding area. The ultrasonic image detection method and device for exterior wall insulation boards provided in the application can solve the problem that traditional exterior wall insulation board detection technology is difficult to meet actual needs.

[0004] In the related art, the quality of the insulation board is tested only by the bonding area ratio calculated by the bonding area and the insulation board area. The test result is inaccurate, which in turn affects the construction quality and building safety. Summary of the invention

[0005] In order to solve the above-mentioned technical problem of inaccurate test results of quality inspection of insulation boards by only calculating the bonding area ratio between the bonding area and the area of ​​the insulation board, the present invention provides solutions in the following aspects.

[0006] In the first aspect, the present invention provides an intelligent detection method for the bonding area ratio of insulation boards, comprising: collecting an infrared image of an external insulation system of a building's exterior wall, wherein the external insulation system includes a plurality of insulation boards of the same specifications that are bonded and fixed; for any pixel point in the infrared image: obtaining local areas of different sizes with the pixel point as the center, obtaining multiple segmentation thresholds according to the pixel values ​​of all pixels in each local area, obtaining multiple binary eigenvalues ​​of the pixel point according to the size relationship between the pixel value of the pixel point and different segmentation thresholds, and using the decimal data corresponding to the binary data composed of all binary eigenvalues ​​as the temperature eigenvalue of the pixel point; dividing the infrared image into multiple super-pixel blocks according to the pixel value and the temperature eigenvalue; and obtaining a plurality of super-pixel blocks according to the size relationship between the pixel value of the pixel point and the different segmentation thresholds. The temperature anomaly degree of each insulation board is calculated based on the number of all superpixel blocks and the central trend and difference of pixel values; the target insulation board with a temperature anomaly degree greater than a preset threshold is evenly divided into multiple target sub-blocks; ultrasonic detection is performed on the target insulation board to obtain the sound velocity of each target sub-block, and the bonding state of the target sub-block with a sound velocity within the sound velocity range of the bonding part is recorded as bonded; from the bonding strength detection values ​​of different bonding positions under different bonding area ratios, the bonding strength of the target insulation board is determined according to the proportion of the number of target sub-blocks in the bonded state and the position of all target sub-blocks; according to the vertical height of the target insulation board, the bonding strength threshold corresponding to the target insulation board is determined, and the target insulation board with a bonding strength less than the bonding strength threshold is judged as unqualified.

[0007] The present invention combines infrared thermal imaging with ultrasonic detection, and uses infrared thermal imaging to quickly locate a target insulation board with a large degree of temperature anomaly. Subsequently, ultrasonic detection is only performed on the target insulation board, and the bonding state of each target sub-block in the target insulation board is determined according to the sound velocity of each target sub-block in the target insulation board. Then, according to the number ratio and position of all target sub-blocks in the target insulation board that are bonded, detailed information on the area ratio and distribution position of the bonding area in the target insulation board is provided, so as to determine the bonding strength of the target insulation board from the bonding strength detection values ​​of different bonding positions under different bonding area ratios; at the same time, considering the different requirements for the bonding strength of insulation boards at different vertical heights, the bonding strength threshold value corresponding to the target insulation board is determined according to the vertical height of the target insulation board, and different standards are used to measure and detect insulation boards at different vertical heights; therefore, the present invention improves the accuracy of insulation board quality detection, and improves construction quality and building safety.

[0008] Preferably, the obtaining of local areas of different sizes with the pixel point as the center comprises: Each singular in the range , get the value centered at the pixel and equal to The local area of ​​​​ local areas of different sizes, and the first The size of the local region is equal to , .

[0009] Preferably, the step of obtaining multiple segmentation thresholds includes: recording any pixel point in the infrared image as a target pixel point; recording the target pixel point as a target pixel point; The maximum and minimum values ​​of the pixel values ​​of all pixels in the local area are recorded as and , ,when At that time, The segmentation threshold is equal to ,when At that time, The segmentation threshold is equal to the target pixel The pixel values ​​of all pixels in the local area percentile, and ; said Percentile refers to the number of pixels in the After the pixel values ​​of all pixels in the local area are arranged in ascending order, The pixel value at the location.

[0010] Preferably, the step of obtaining multiple binary feature values ​​of the pixel point comprises: when the pixel value of the pixel point is greater than or equal to the first When the segmentation threshold is The binary feature value of the pixel is 1, otherwise, The binary features are 0, .

[0011] The present invention obtains multiple segmentation thresholds through the distribution of pixel values ​​of all pixels in local areas of different sizes of pixel points, which are used to reflect the temperature distribution around the pixel points. Then, by comparing the pixel value of the pixel point with the multiple segmentation thresholds, the temperature characteristic value of the pixel point is obtained to reflect the difference in temperature distribution between the pixel point and the surrounding area, thereby improving the accuracy of subsequent division of the infrared image.

[0012] Preferably, dividing the infrared image into a plurality of super pixel blocks comprises: calculating the first pixels and The spatial distance of pixels , Respectively The horizontal and vertical coordinates of the pixel points, Respectively The horizontal and vertical coordinates of the pixel points; calculate the pixels and The color distance of pixels , Respectively pixels and The pixel value of a pixel, To take the absolute value; calculate the pixels and The feature distance of pixels , Respectively pixels and The temperature characteristic value of the pixel point; pixels and The distance measure between pixels The calculation formula is: , , is the size of the area corresponding to a single insulation board in the infrared image; based on the distance measurement between every two pixels, the infrared image is segmented into superpixels and the infrared image is divided into multiple superpixel blocks.

[0013] Preferably, the calculation of the temperature anomaly degree of each insulation board includes: all super pixel blocks contained in each insulation board refer to all super pixel blocks contained in the area corresponding to each insulation board in the infrared image; for any insulation board, the temperature anomaly degree of the insulation board The calculation formula is: ; In the formula, is the abnormal temperature degree of the insulation board, is the number of all superpixel blocks contained in the insulation board, is the variance of the representative pixel values ​​of all superpixel blocks contained in the insulation board, representing the difference in pixel values ​​of all superpixel blocks. is the mean value of the representative pixel values ​​of all superpixel blocks contained in the insulation board, which represents the central trend of the pixel values ​​of all superpixel blocks. is a natural exponential function; the representative pixel value of the superpixel block is the average of the pixel values ​​of all pixels in the superpixel block.

[0014] The present invention divides the infrared image and calculates the temperature anomaly degree of each insulation board according to the division result, so as to quickly locate the target insulation board with a larger temperature anomaly degree from all the insulation boards, and subsequently only performs ultrasonic detection on the target insulation board, thereby improving the detection speed.

[0015] Preferably, the method for obtaining the sound velocity range of the bonding part is: by performing ultrasonic testing on multiple insulation board samples, the sound velocity of each insulation board sample is obtained, and the minimum and maximum values ​​of the sound velocity constitute the sound velocity range of the bonding part. The process of ultrasonic testing is: using an adhesive sample to bond and fix the insulation board sample on a concrete cube specimen, and using an ultrasonic detector to measure the sound velocity of the insulation board sample.

[0016] Preferably, the method for obtaining the bonding strength test values ​​at different bonding positions under different bonding area ratios is: dividing the surface of the adhesive sample into Sub-blocks, is the preset quantity; from Select from the sub-blocks The sub-blocks are used as bonding positions. At this time, the bonding area ratio is equal to ,in, , then there are Different bonding area ratios; Select from the sub-blocks When the sub-blocks are used as bonding positions, there are different bonding positions; for bonding area ratio equal to Next Type of bonding position, , apply the adhesive sample to the bonding position, then bond and fix the insulation board sample to the concrete cube specimen, and then use the bonding strength tester to measure the bonding strength of the insulation board sample to obtain the bonding area ratio equal to Next The bonding strength test value of each bonding position.

[0017] The traditional method of evaluating the bonding quality of insulation boards by bonding area ratio cannot provide detailed information on the distribution position of the bonding area, and the distribution position of the bonding area is an important factor affecting the bonding strength. Therefore, the present invention performs bonding strength detection on insulation board samples at various bonding positions at different bonding area ratios to obtain bonding strength detection values ​​at different bonding positions at different bonding area ratios, so as to facilitate the subsequent determination of the bonding strength of the target insulation board according to the proportion of the number of target sub-blocks in the bonded state and their positions among all target sub-blocks, thereby improving the accuracy of insulation board quality detection.

[0018] Preferably, the calculation formula for the bonding strength threshold corresponding to the target insulation board is: ; In the formula, is the bonding strength threshold corresponding to the target insulation board, is the vertical height of the target insulation board, is the height reference value, is the reference value of bonding strength, and Equal to the bonding area ratio The average of the bond strength test values ​​of all bonding positions is: is the minimum value function.

[0019] Taking into account the different requirements for the bonding strength of insulation boards at different vertical heights, the present invention determines the bonding strength threshold corresponding to the target insulation board according to the vertical height of the target insulation board, and uses different standards to measure and detect insulation boards at different vertical heights, thereby improving the accuracy of insulation board quality detection.

[0020] In a second aspect, the present invention provides an intelligent detection device for the bonding area ratio of insulation boards, comprising a processor and a memory, wherein the memory stores computer program instructions, and when the computer program instructions are executed by the processor, the above-mentioned intelligent detection method for the bonding area ratio of insulation boards is implemented.

[0021] By adopting the above technical solution, the above-mentioned intelligent detection method for the bonding area ratio of the insulation board is generated into a computer program and stored in the memory to be loaded and executed by the processor, so that a terminal device is made according to the memory and the processor for easy use.

[0022] The beneficial effects of the present invention are: The present invention combines infrared thermal imaging with ultrasonic detection, and uses infrared thermal imaging to quickly locate a target insulation board with a large degree of temperature anomaly. Subsequently, ultrasonic detection is only performed on the target insulation board, and the bonding state of each target sub-block in the target insulation board is determined according to the sound velocity of each target sub-block in the target insulation board. Then, according to the number ratio and position of all target sub-blocks in the target insulation board that are bonded, detailed information on the area ratio and distribution position of the bonding area in the target insulation board is provided, so as to determine the bonding strength of the target insulation board from the bonding strength detection values ​​of different bonding positions under different bonding area ratios; at the same time, considering the different requirements for the bonding strength of insulation boards at different vertical heights, the bonding strength threshold value corresponding to the target insulation board is determined according to the vertical height of the target insulation board, and different standards are used to measure and detect insulation boards at different vertical heights; therefore, the present invention improves the accuracy of insulation board quality detection, and improves construction quality and building safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] By reading the following detailed description with reference to the accompanying drawings, the above and other objects, features and advantages of the exemplary embodiments of the present invention will become readily understood. In the accompanying drawings, several embodiments of the present invention are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein: Figure 1 is a flow chart schematically showing an intelligent detection method for the bonding area ratio of an insulation board in the present invention; Figure 2 is a flow chart schematically illustrating step S3; Figure 3 is a flow chart schematically illustrating step S4; Figure 4 is a schematic diagram showing that the bonding area ratio is equal to Schematic diagram of the insulation board in the next bonding position; Figure 5 is a schematic diagram showing that the bonding area ratio is equal to The following is a schematic diagram of an insulation board with another bonding position; Figure 6 is a schematic diagram showing that the bonding area ratio is equal to Schematic diagram of the insulation board in the next bonding position; Figure 7 is a schematic diagram showing that the bonding area ratio is equal to Schematic diagram of another bonding position of the insulation board. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0025] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0026] The embodiment of the present invention discloses an intelligent detection method for the bonding area ratio of an insulation board, referring to Figure 1 , comprising steps S1 to S6: S1. Collect infrared images of the external insulation system of the building's exterior wall.

[0027] It should be noted that the External Thermal Insulation System (ETICS) of the building's exterior wall is a comprehensive system designed to improve the energy efficiency of buildings, reduce heat loss, and provide a good indoor environment. It mainly includes the following components: insulation board, bonding layer, plastering layer, anchors, protective layer, finishing layer, sealing material, breathable layer and fire isolation zone; among them, the insulation board is the core of the external insulation system, usually including polystyrene foam board (EPS), extruded polystyrene foam board (XPS), polyurethane foam (PU), etc., which are used to reduce the heat conduction of the wall; the bonding layer is a binder used to fix the insulation board to the exterior wall, which can be mortar, adhesive or other special bonding materials; the plastering layer is a protective layer covering the outer layer of the insulation material, usually made of polymer It is made of mortar or cement-based materials to provide additional protection and decorative effects; anchors are used to enhance the connection strength between the insulation system and the wall, especially in areas with high wind pressure or earthquakes; the protective layer includes a waterproof and breathable membrane, a waterproof layer, etc., which are used to protect the insulation system from moisture intrusion while allowing water vapor to escape; the finishing layer is the outermost layer of the external insulation system, which can be a variety of materials such as paint, tiles, stone, metal plates, etc., used to provide an aesthetic appearance and additional protection; sealing materials are used to seal joints and edges to ensure the airtightness and waterproofness of the insulation system; the breathable layer is used to regulate the humidity inside the wall; a fire isolation zone refers to an isolation zone made of fireproof materials added to the insulation system, which is used to improve the fire resistance of the building.

[0028] Among them, good bonding effect of insulation board is the key to ensure that the external insulation system can fully exert its insulation function. Therefore, in order to prevent heat loss from the building's exterior wall, it is necessary to detect and determine the bonding effect of the insulation board. Infrared thermal imaging method is based on the infrared radiation emitted by the object for imaging, and displays the temperature change and heat distribution on the surface of the object by providing a temperature distribution map. Infrared thermal imaging method is a non-contact measurement, does not require destructive sampling, and can respond quickly. Therefore, it is considered to obtain the temperature characteristics of the external insulation system of the building's exterior wall through infrared thermal imaging method, and then identify the insulation board with poor bonding.

[0029] Specifically, an infrared camera is used to collect infrared images of an external insulation system of a building's exterior wall. The external insulation system includes a number of insulation boards of the same specifications that are bonded and fixed. The pixel values ​​of pixels in the infrared image can reflect the temperature of each position.

[0030] Among them, the infrared camera is required to have sufficient resolution and sensitivity to capture the temperature changes of the external insulation system of the building's exterior wall, and to choose suitable weather and time for shooting to avoid direct sunlight and extreme temperatures; in the process of collecting infrared images: first, plan the shooting route and viewing angle according to the layout and characteristics of the building's exterior wall; second, adjust the settings of the infrared camera according to environmental conditions, including parameters such as measurement range, emissivity, and reflected temperature; in addition, it is necessary to determine the shooting angle and distance to ensure that every part of the external insulation system of the building's exterior wall can be clearly captured, and a ladder or lifting platform can be used to approach the building's exterior wall in this process; finally, by moving the infrared camera smoothly, the entire outer surface of the building's exterior wall is covered to obtain an infrared image of the external insulation system of the building's exterior wall.

[0031] S2. Taking any pixel in the infrared image as the center, obtain local areas of different sizes of the pixel, obtain multiple segmentation thresholds according to the pixel values ​​of all pixels in each local area, and obtain the temperature characteristic value of the pixel according to the size relationship between the pixel value of the pixel and each segmentation threshold.

[0032] It should be noted that the pixel value of a pixel point in an infrared image represents the temperature characteristics of the location of the pixel point. The present invention obtains the temperature characteristic value of the pixel point by analyzing and comparing the pixel value of the pixel point with the pixel values ​​of other pixels in the local area of ​​the pixel point.

[0033] Specifically, for any pixel point in the infrared image, the pixel point is recorded as the target pixel point; taking the target pixel point as the center, obtaining local areas of different sizes of the target pixel point, including: according to Each singular in the range , get the value centered at the target pixel and equal to The local area of ​​​​ local areas of different sizes, and the first The size of the local region is equal to , , for example, the target pixel The size of the local region is equal to .

[0034] Further, different segmentation thresholds are calculated according to the local areas of different sizes of the target pixel. The pixel values ​​of all pixels in the local area are calculated The segmentation threshold includes: The maximum and minimum values ​​of the pixel values ​​of all pixels in the local area are recorded as and ,when At that time, The segmentation threshold is equal to ,when At that time, The segmentation threshold is equal to the target pixel The pixel values ​​of all pixels in the local area percentile, and ; said Percentile refers to the number of pixels in the After the pixel values ​​of all pixels in the local area are arranged in ascending order, The pixel value at the location.

[0035] It should be noted that, for the unbonded position on the insulation board, the insulation effect is not good, and its temperature is lower than other adjacent positions; conversely, the lower the temperature is compared with other adjacent positions, the more likely it is an abnormal temperature; when the difference between the maximum and minimum values ​​of the pixel values ​​of all pixels in the local area is small, it means that the difference in temperature of each position in the local area is small, and there is no abnormal temperature in the local area. Therefore, the minimum value of the pixel value is used as the segmentation threshold, so that the pixel value of the target pixel must be greater than or equal to the segmentation threshold, and the temperature of the target pixel is normal temperature; when the difference between the maximum and minimum values ​​of the pixel values ​​of all pixels in the local area is large, it means that the difference in temperature of each position in the local area is large, and there may be an abnormal temperature in the local area, and the larger the difference between the maximum and minimum values, the more abnormal temperatures may exist in the local area. Therefore, the segmentation threshold is determined according to the difference between the maximum and minimum values, and the larger the difference between the maximum and minimum values, the closer the determined segmentation threshold is to the larger pixel value among all pixel values, and then the temperature of the target pixel is determined by the determined segmentation threshold. Whether it is a normal temperature or an abnormal temperature.

[0036] Furthermore, according to the magnitude relationship between the pixel value of the target pixel and different segmentation thresholds, multiple binary eigenvalues ​​of the target pixel are obtained; and the decimal data corresponding to the binary data composed of all binary eigenvalues ​​is used as the temperature eigenvalue of the target pixel.

[0037] It should be noted that the present invention obtains multiple segmentation thresholds through the distribution of pixel values ​​of all pixels in local areas of different sizes of pixel points, which are used to reflect the temperature distribution around the pixel points, and then obtains the temperature characteristic value of the pixel point by comparing the pixel value of the pixel point with the multiple segmentation thresholds, which is used to reflect the difference in temperature distribution between the pixel point and the surrounding area, thereby improving the accuracy of subsequent division of the infrared image.

[0038] Among them, according to the pixel value of the target pixel and the The size relationship of the segmentation threshold is used to obtain the target pixel point binary feature values, including: when the pixel value of the target pixel is greater than or equal to the When the segmentation threshold is The binary feature value is 1; when the pixel value of the target pixel is less than When the segmentation threshold is The binary features are 0.

[0039] It should be noted that the smaller the pixel value of the target pixel, the lower the temperature of the target pixel, the more likely the obtained binary eigenvalue is 0, and the smaller the decimal data corresponding to the binary data composed of the binary eigenvalue, the smaller the temperature eigenvalue of the target pixel.

[0040] It should be further explained that since the target pixels have local areas of different sizes, so according to The pixel values ​​of the pixels in the local area are obtained The segmentation threshold is The size relationship of the segmentation thresholds is the total number of target pixels obtained. binary eigenvalues; then the length of the binary data composed of all binary eigenvalues ​​is 8, and the corresponding decimal data has a value range of , so the temperature characteristic value of the target pixel point ranges from .

[0041] For example, the pixel value of the target pixel is 109, and according to the The local areas of different sizes are calculated The segmentation thresholds are 107, 106, 108, 111, 114, 105, 100, and 99 respectively. The size relationship of the segmentation threshold is The binary eigenvalues ​​are 1, 1, 1, 0, 0, 1, 1, 1, The binary data composed of the binary eigenvalues ​​is 11100111, and the decimal data corresponding to the binary data 11100111 is 231, so the temperature eigenvalue of the target pixel is equal to 231.

[0042] S3. Divide the infrared image into multiple super-pixel blocks according to the pixel value and the temperature characteristic value, and calculate the temperature anomaly degree of each insulation board according to the division result, so as to screen out the target insulation board from all the insulation boards.

[0043] See the flowchart of step S3. Figure 2, including step S301 to step S302, specifically: S301, calculating the distance metric between every two pixels according to the difference in pixel value, temperature characteristic value and position relationship between every two pixels; dividing the infrared image into a plurality of super pixel blocks according to the distance metric between the pixels.

[0044] Specifically, the distance metric between each two pixels is calculated based on the difference in pixel value, temperature characteristic value and position relationship between each two pixels, wherein according to the first pixels and The difference in pixel value, temperature characteristic value and position relationship of each pixel is calculated. pixels and The distance measure between pixels ,but The calculation formula is: ; In the formula, For the pixels and The spatial distance of pixels, For the pixels and The color distance of pixels, For the pixels and The feature distance of pixels, is a parameter in the SLIC algorithm, representing the expected size of the superpixel block. , It is the size of the area corresponding to a single insulation board in the infrared image.

[0045] Among them, pixels and The spatial distance of pixels , Respectively The horizontal and vertical coordinates of the pixel points, Respectively The horizontal and vertical coordinates of the pixel points; pixels and The color distance of pixels , Respectively pixels and The pixel value of a pixel, To take the absolute value; pixels and The feature distance of pixels , Respectively pixels and The temperature characteristic value of each pixel, To take the absolute value.

[0046] Furthermore, according to the distance measurement between every two pixels, the infrared image is segmented into superpixels by the SLlC (Simple Linear Iterative Clustering) algorithm, and the infrared image is divided into multiple superpixel blocks as the segmentation result; the SLlC algorithm is a well-known technology and will not be described in detail here.

[0047] S302: Calculate the temperature anomaly degree of each insulation board according to the division result, so as to select the target insulation board from all insulation boards.

[0048] Specifically, according to the division results, all superpixel blocks contained in each insulation board are determined; according to the number of all superpixel blocks contained in each insulation board and the central trend and difference of pixel values, the temperature anomaly degree of each insulation board is calculated; all superpixel blocks contained in each insulation board refer to all superpixel blocks contained in the area corresponding to each insulation board in the infrared image; for any insulation board, the temperature anomaly degree of the insulation board The calculation formula is: ; In the formula, is the abnormal temperature degree of the insulation board, is the number of all superpixel blocks contained in the insulation board, is the variance of the representative pixel values ​​of all superpixel blocks contained in the insulation board, representing the difference in pixel values ​​of all superpixel blocks. is the mean value of the representative pixel values ​​of all superpixel blocks contained in the insulation board, which represents the central trend of the pixel values ​​of all superpixel blocks. is a natural exponential function; the representative pixel value of the superpixel block is the average of the pixel values ​​of all pixels in the superpixel block.

[0049] It should be noted that the larger the number of all superpixel blocks contained in the insulation board and the variance of the representative pixel values ​​of all superpixel blocks, the more chaotic the temperature distribution in the insulation board is, and the correspondingly greater the temperature anomaly of the insulation board is; the smaller the mean of the representative pixel values ​​of all superpixel blocks contained in the insulation board, the greater the temperature anomaly of the insulation board is.

[0050] Further, a target insulation board is screened out from all insulation boards according to the degree of temperature anomaly, including: recording an insulation board whose temperature anomaly degree is greater than a preset threshold as a target insulation board, the target insulation board.

[0051] The specific value of the preset threshold can be set according to the actual application scenario and requirements, and the value of the preset threshold is [0.5, 1). The present invention sets the preset threshold to 0.55.

[0052] It should be noted that the present invention divides the infrared image and calculates the temperature anomaly degree of each insulation board according to the division result, so as to quickly locate the target insulation board with a larger temperature anomaly degree from all insulation boards, and subsequently only performs ultrasonic detection on the target insulation board to improve the detection speed.

[0053] S4. By performing ultrasonic testing on the insulation board samples, the sound velocity range of the bonding part is obtained; by performing bonding strength testing on the insulation board samples, the bonding strength test values ​​of different bonding positions under different bonding area ratios are obtained.

[0054] See the flowchart of step S4. Figure 3 , including step S401 to step S402, specifically: S401. Obtain the sound velocity range of the bonding part by performing ultrasonic testing on the insulation board sample.

[0055] It should be noted that, since the wave speed of ultrasound is different when passing through different media, the bonding area can be determined through ultrasonic testing, thereby estimating the bonding condition of the insulation board; the present invention obtains the sound velocity range of the bonding part by performing ultrasonic testing on the insulation board sample, and then directly determines the bonding state of the target insulation board based on the relationship between the sound velocity of the target insulation board to be tested and the sound velocity range of the bonding part.

[0056] Specifically, ultrasonic testing is performed on multiple insulation board samples to obtain the sound velocity of each insulation board sample, and the minimum and maximum values ​​of the sound velocity are used to form the sound velocity range of the bonding part. The process of ultrasonic testing is: the insulation board sample is bonded and fixed on the concrete cube specimen with an adhesive sample, and the sound velocity of the insulation board sample is measured using an ultrasonic detector; when performing ultrasonic testing on the insulation board sample, it is required that the insulation board sample is consistent with the insulation board specification of the external insulation system of the building's exterior wall, and the adhesive sample is the same as the adhesive used in the bonding layer of the external insulation system of the building's exterior wall.

[0057] S402, performing a bonding strength test on the insulation board samples to obtain bonding strength test values ​​at different bonding positions under different bonding area ratios.

[0058] It should be noted that the traditional method of evaluating the bonding quality of insulation boards by the bonding area ratio is not accurate enough; this is because this method cannot provide detailed information on the distribution position of the bonding area, which is an important factor affecting the bonding strength.

[0059] Specifically, the surface of the adhesive sample is divided into Sub-blocks, is the preset quantity; from Select from the sub-blocks The sub-blocks are used as bonding positions. At this time, the bonding area ratio is equal to ,in, , then there are Different bonding area ratios; Select from the sub-blocks When the sub-blocks are used as bonding positions, there are different bonding positions; for bonding area ratio equal to Next Type of bonding position, , apply the adhesive sample to the bonding position, then bond and fix the insulation board sample to the concrete cube specimen, and then use the bonding strength tester to measure the bonding strength of the insulation board sample to obtain the bonding area ratio equal to Next The bonding strength test values ​​of different bonding positions are obtained by measuring the bonding strength of the bonding positions at different bonding area ratios.

[0060] Among them, when conducting bonding strength test on insulation board samples, it is required that the insulation board samples have the same specifications as the insulation boards of the external insulation system of the building's exterior walls, and the adhesive samples have the same adhesive used in the bonding layer of the external insulation system of the building's exterior walls.

[0061] The preset number The specific value can be set according to the actual application scenario and requirements, and the preset number The value of is [6,10]. The present invention sets the preset number Set to 8.

[0062] For example, Figure 4 The bonding area ratio is equal to Schematic diagram of the insulation board at the next bonding position, such as Figure 5 The bonding area ratio is equal to The following is a schematic diagram of another insulation board bonding position; Figure 6 The bonding area ratio is equal to Schematic diagram of the insulation board at the next bonding position, such as Figure 7 The bonding area ratio is equal to Schematic diagram of another bonding position of the insulation board.

[0063] It should be noted that the traditional method of evaluating the bonding quality of the insulation board by the bonding area ratio cannot provide detailed information on the distribution position of the bonding area, and the distribution position of the bonding area is an important factor affecting the bonding strength. Therefore, the present invention performs bonding strength detection on insulation board samples at multiple bonding positions under different bonding area ratios to obtain bonding strength detection values ​​at different bonding positions under different bonding area ratios, so as to facilitate the subsequent determination of the bonding strength of the target insulation board according to the proportion of the number of target sub-blocks in the bonded state and their positions among all target sub-blocks, thereby improving the accuracy of insulation board quality detection.

[0064] S5. Divide the target insulation board evenly into multiple target sub-blocks, determine the bonding state of the target sub-blocks according to the relationship between the sound velocity of each target sub-block and the sound velocity range of the bonding part, and determine the bonding strength of the target insulation board according to the number, proportion and position of the target sub-blocks in the bonded state from the bonding strength detection values ​​of different bonding positions under different bonding area ratios.

[0065] It should be noted that since ultrasonic testing is a contact test and requires contact with the object being tested, it is not suitable for the detection of external insulation systems on the exterior walls of high-rise buildings. Compared with infrared thermal imaging, ultrasonic testing has a small coverage area and a slower detection speed. Therefore, by combining infrared thermal imaging with ultrasonic testing, infrared thermal imaging is used to quickly locate target insulation boards with large temperature abnormalities, and subsequently only ultrasonic testing is performed on the target insulation boards to increase the detection speed.

[0066] Specifically, for any target insulation board, the target insulation board is evenly divided into target sub-blocks, is a preset number; performing ultrasonic testing on the target insulation board to obtain the sound velocity of each target sub-block of the target insulation board; recording the bonding state of the target sub-block whose sound velocity is within the sound velocity range of the bonding part as bonded, and recording the bonding state of the target sub-block whose sound velocity is within the sound velocity range of the unbonded part as unbonded.

[0067] Furthermore, the ratio of the number of target sub-blocks in the bonded state among all target sub-blocks of the target insulation board is taken as the bonding area of ​​the target insulation board; from the bonding strength detection values ​​of different bonding positions under different bonding area ratios, the bonding strength of the target insulation board is determined according to the bonding area of ​​the target insulation board and the positions of all target sub-blocks in the bonded state.

[0068] S6. Determine a bonding strength threshold corresponding to the target insulation board according to the vertical height of the target insulation board, and a target insulation board having a bonding strength less than the bonding strength threshold is judged as unqualified.

[0069] It should be noted that the traditional method of evaluating the bonding quality of insulation boards by bonding area ratio is not accurate enough; this is because this method ignores the fact that the requirements for the bonding strength of insulation boards at different vertical heights are different, and the same standard cannot be used to measure and test insulation boards at different vertical heights.

[0070] It should be further explained that insulation boards at higher positions are more susceptible to wind pressure, especially in high-rise buildings. Wind pressure may cause the insulation boards to fall off, so stronger bonding strength is required to resist this external force; and as the vertical height increases, the insulation boards will experience greater temperature changes, resulting in thermal expansion and contraction. If the bonding strength is insufficient, it may cause cracks or fall off due to stress caused by temperature changes; therefore, the higher the vertical height of the insulation board, the greater the impact of wind pressure and temperature changes it will be subject to, and the correspondingly higher the requirements for its bonding strength.

[0071] Specifically, according to the vertical height of the target insulation board, the bonding strength threshold corresponding to the target insulation board is determined; if the bonding strength of the target insulation board is less than the bonding strength threshold corresponding to the target insulation board, the target insulation board is judged to be unqualified and reported to the operation and maintenance personnel for repair or replacement; if the bonding strength of the target insulation board is greater than or equal to the bonding strength threshold corresponding to the target insulation board, the target insulation board is judged to be qualified.

[0072] It should be noted that, taking into account the different requirements for the bonding strength of insulation boards at different vertical heights, the present invention determines the bonding strength threshold corresponding to the target insulation board according to the vertical height of the target insulation board, and uses different standards to measure and detect insulation boards at different vertical heights, thereby improving the accuracy of insulation board quality detection.

[0073] Among them, the calculation formula of the corresponding bonding strength threshold of the target insulation board is: ; In the formula, is the bonding strength threshold corresponding to the target insulation board, is the vertical height of the target insulation board, is the height reference value, is the reference value of bonding strength, and Equal to the bonding area ratio The average of the bond strength test values ​​of all bonding positions is: is the minimum value function.

[0074] The height reference value The specific value of can be set according to the actual application scenario and requirements, and the unit is meter. The present invention uses the height reference value Set to 50 meters.

[0075] It should be noted that the present invention combines infrared thermal imaging with ultrasonic detection, and uses infrared thermal imaging to quickly locate target insulation boards with a large degree of temperature anomaly. Subsequently, only ultrasonic detection is performed on the target insulation boards, and the bonding state of each target sub-block in the target insulation board is determined according to the sound velocity of each target sub-block in the target insulation board. Then, according to the number ratio and position of all target sub-blocks in the target insulation board that are bonded, detailed information on the area ratio and distribution position of the bonding area in the target insulation board is provided, so as to facilitate determination of the bonding strength of the target insulation board from the bonding strength detection values ​​at different bonding positions at different bonding area ratios; at the same time, taking into account the different requirements for the bonding strength of insulation boards at different vertical heights, the bonding strength threshold corresponding to the target insulation board is determined according to the vertical height of the target insulation board, and different standards are used to measure and detect insulation boards at different vertical heights; therefore, the present invention improves the accuracy of insulation board quality detection, and improves construction quality and building safety.

[0076] An embodiment of the present invention also discloses an intelligent detection device for the bonding area ratio of insulation boards, including a processor and a memory, wherein the memory stores computer program instructions. When the computer program instructions are executed by the processor, an intelligent detection method for the bonding area ratio of insulation boards according to the present invention is implemented.

[0077] The above-mentioned device also includes other components well known to those skilled in the art, such as a communication bus and a communication interface, whose configuration and functions are known in the art and thus will not be described in detail here.

[0078] In the description of this specification, "plurality" or "several" means at least two, such as two, three or more, etc., unless otherwise clearly and specifically defined.

[0079] Although this specification has shown and described a number of embodiments of the present invention, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art will conceive of many modifications, changes and alternatives without departing from the ideas and spirit of the present invention. It should be understood that in the practice of the present invention, alternatives to the embodiments of the present invention described herein may be employed.

Claims

1. An intelligent detection method for the bonding area ratio of an insulation board, characterized in that: include: Collect an infrared image of an external insulation system of an external wall of a building, wherein the external insulation system includes a plurality of insulation boards of the same specifications that are bonded and fixed; for any pixel point in the infrared image: obtain local areas of different sizes with the pixel point as the center, obtain multiple segmentation thresholds according to the pixel values ​​of all the pixels in each local area, obtain multiple binary feature values ​​of the pixel point according to the size relationship between the pixel value of the pixel point and different segmentation thresholds, and use the decimal data corresponding to the binary data composed of all the binary feature values ​​as the temperature feature value of the pixel point; The infrared image is divided into multiple super-pixel blocks according to the pixel value and the temperature characteristic value; the temperature anomaly degree of each insulation board is calculated according to the number of all super-pixel blocks contained in each insulation board and the central trend and difference of the pixel values; The target insulation board with a temperature anomaly greater than a preset threshold is evenly divided into a plurality of target sub-blocks; ultrasonic testing is performed on the target insulation board to obtain the sound velocity of each target sub-block, and the bonding state of the target sub-block whose sound velocity is within the sound velocity range of the bonding part is recorded as bonded; the bonding strength of the target insulation board is determined according to the number ratio and position of the target sub-blocks in the bonded state among all the target sub-blocks from the bonding strength test values ​​at different bonding positions under different bonding area ratios; According to the vertical height of the target insulation board, a bonding strength threshold corresponding to the target insulation board is determined, and a target insulation board having a bonding strength less than the bonding strength threshold is judged as unqualified.

2. The intelligent detection method of the bonding area ratio of the thermal insulation board according to claim 1 is characterized in that: The obtaining of local areas of different sizes with the pixel point as the center includes: according to Each singular in the range , get the value centered at the pixel and equal to The local area of ​​​​ local areas of different sizes, and the first The size of the local region is equal to , .

3. The intelligent detection method of the bonding area ratio of the thermal insulation board according to claim 1 is characterized in that: The obtaining of multiple segmentation thresholds comprises: Any pixel in the infrared image is recorded as the target pixel; The maximum and minimum values ​​of the pixel values ​​of all pixels in the local area are recorded as and , ,when At that time, The segmentation threshold is equal to ,when At that time, The segmentation threshold is equal to the target pixel The pixel values ​​of all pixels in the local area percentile, and ; said Percentile refers to the number of pixels in the After the pixel values ​​of all pixels in the local area are arranged in ascending order, The pixel value at the location.

4. The intelligent detection method of the bonding area ratio of the thermal insulation board according to claim 1 is characterized in that: The step of obtaining a plurality of binary feature values ​​of the pixel point comprises: When the pixel value of the pixel is greater than or equal to When the segmentation threshold is The binary feature value of the pixel is 1, otherwise, The binary features are 0, .

5. The intelligent detection method of the bonding area ratio of the thermal insulation board according to claim 1 is characterized in that: The step of dividing the infrared image into a plurality of super pixel blocks comprises: Calculate the pixels and The spatial distance of pixels , Respectively The horizontal and vertical coordinates of the pixel points, Respectively The horizontal and vertical coordinates of the pixel points; calculate the pixels and The color distance of pixels , Respectively pixels and The pixel value of a pixel, To take the absolute value; calculate the pixels and The feature distance of pixels , Respectively pixels and The temperature characteristic value of each pixel; The first pixels and The distance measure between pixels The calculation formula is: , , is the size of the area corresponding to a single insulation board in the infrared image; According to the distance metric between every two pixels, the infrared image is segmented into superpixels and divided into multiple superpixel blocks.

6. The intelligent detection method of the bonding area ratio of the thermal insulation board according to claim 1 is characterized in that: The calculation of the temperature abnormality of each insulation board includes: All superpixel blocks contained in each insulation board refer to all superpixel blocks contained in the area corresponding to each insulation board in the infrared image; for any insulation board, the temperature anomaly degree of the insulation board The calculation formula is: ； In the formula, is the abnormal temperature degree of the insulation board, is the number of all superpixel blocks contained in the insulation board, is the variance of the representative pixel values ​​of all superpixel blocks contained in the insulation board, representing the difference in the pixel values ​​of all superpixel blocks. is the mean value of the representative pixel values ​​of all superpixel blocks contained in the insulation board, which represents the central trend of the pixel values ​​of all superpixel blocks. is a natural exponential function; the representative pixel value of the superpixel block is the average of the pixel values ​​of all pixels in the superpixel block.

7. The intelligent detection method of the bonding area ratio of the thermal insulation board according to claim 1 is characterized in that: The method for obtaining the sound velocity range of the bonding part is: By performing ultrasonic testing on multiple insulation board samples, the sound velocity of each insulation board sample is obtained, and the minimum and maximum sound velocity are used to form the sound velocity range of the bonding part. The process of ultrasonic testing is: the insulation board sample is bonded and fixed on the concrete cube specimen with an adhesive sample, and the sound velocity of the insulation board sample is measured using an ultrasonic detector.

8. The intelligent detection method of the bonding area ratio of the thermal insulation board according to claim 1 is characterized in that: The method for obtaining the bonding strength test values ​​at different bonding positions under different bonding area ratios is as follows: The surface of the adhesive sample is divided into Sub-blocks, is the preset quantity; from Select from the sub-blocks The sub-blocks are used as bonding positions. At this time, the bonding area ratio is equal to ,in, , then there are Different bonding area ratios; Select from the sub-blocks When the sub-blocks are used as bonding positions, there are different bonding positions; for bonding area ratio equal to Next The bonding position , apply the adhesive sample to the bonding position, then bond and fix the insulation board sample to the concrete cube specimen, and then use the bonding strength tester to measure the bonding strength of the insulation board sample to obtain the bonding area ratio equal to Next The bonding strength test value of each bonding position.

9. The intelligent detection method of the bonding area ratio of the thermal insulation board according to claim 1 is characterized in that: The calculation formula of the bonding strength threshold corresponding to the target insulation board is: ； In the formula, is the bonding strength threshold corresponding to the target insulation board, is the vertical height of the target insulation board, is the height reference value, is the reference value of bonding strength, and Equal to the bonding area ratio The average of the bond strength test values ​​of all bonding positions is: is the minimum value function.

10. An intelligent detection device for bonding area ratio of thermal insulation board, characterized in that: include: A processor and a memory, wherein the memory stores computer program instructions, and when the computer program instructions are executed by the processor, an intelligent detection method for the bonding area ratio of an insulation board according to any one of claims 1 to 9 is implemented.

Images