Wafer edge washing device and edge washing method

Abstract

The invention discloses a wafer edge washing device and method, the wafer edge washing device comprises a wafer carrying table used for supporting a wafer, a liquid supply device and a nozzle device communicated with the liquid supply device, the liquid supply device comprises two liquid outlets, and the nozzle device comprises a first nozzle opening and a second nozzle opening which are respectively communicated with the two liquid outlets. The first nozzle opening is provided with a first projection point which is orthographically projected on the wafer along the vertical direction, the second nozzle opening is provided with a second projection point which is orthographically projected on the wafer along the vertical direction, and a first distance is formed between the first projection point and the circle center of the wafer; a second distance is formed between the second projection point and the circle center of the wafer, and the first distance is smaller than the second distance. The wide edge of the wafer can be cleaned at a time, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing, and in particular to a wafer edge cleaning device and an edge cleaning method. Background Art

[0002] With the diversification and complexity of wafer products, the requirements for the edge cleaning process after wafer coating are getting higher and higher. In the existing technology, when cleaning the edge of a certain width of the wafer, the nozzle device needs to move back and forth in the radial position of the wafer to wash the 2mm or 3mm position of the wafer. During actual cleaning, the wafer is also rotating at a high speed, and the nozzle device is moving back and forth in the radial direction at the same time. After the liquid is sprayed onto the surface of the wafer, there is a serious splashing phenomenon, which may cause secondary contamination of the wafer. Summary of the invention

[0003] One of the purposes of the present invention is to provide a wafer edge cleaning device to solve the technical problem of serious backsplash contamination during wafer edge cleaning in the prior art.

[0004] One of the purposes of the present invention is to provide a wafer edge cleaning method.

[0005] To achieve one of the above-mentioned purposes of the invention, an embodiment of the present invention provides a wafer edge cleaning device for cleaning the edge area of ​​a wafer, comprising: a wafer carrier for supporting the wafer, a liquid supply device and a nozzle device connected to the liquid supply device, the liquid supply device comprising two liquid outlets, the nozzle device comprising a first nozzle port and a second nozzle port respectively connected to the two liquid outlets, the first nozzle port having a first projection point projected onto the wafer along the vertical direction, the second nozzle port having a second projection point projected onto the wafer along the vertical direction, a first distance between the first projection point and the center of the wafer, a second distance between the second projection point and the center of the wafer, and the first distance being smaller than the second distance.

[0006] As a further improvement of an embodiment of the present invention, the opening size of the first nozzle opening is larger than the opening size of the second nozzle opening.

[0007] As a further improvement of an embodiment of the present invention, the opening size of the first nozzle opening ranges from 20G to 23G, and the opening size of the second nozzle opening ranges from 23G to 27G.

[0008] As a further improvement of one embodiment of the present invention, the nozzle device includes a first nozzle and a second nozzle connected to a liquid supply device, the first nozzle opening is arranged at the first nozzle, and the second nozzle opening is arranged at the second nozzle; the length of the first nozzle is smaller than the length of the second nozzle.

[0009] As a further improvement of one embodiment of the present invention, the nozzle device includes a mounting seat arranged outside the liquid outlet, a first nozzle and a second nozzle arranged on the mounting seat, and the position of the first nozzle and / or the position of the second nozzle is movable relative to the mounting seat to adjust the relative position of the first projection point and / or the second projection point.

[0010] As a further improvement of an embodiment of the present invention, the arrangement direction between the first nozzle and the second nozzle is a first direction, the mounting seat includes a plurality of mounting holes arranged along the first direction, and the first nozzle / or the second nozzle can be detachably mounted on the mounting hole.

[0011] As a further improvement of an embodiment of the present invention, along the first direction, the distance between two adjacent mounting holes ranges from 0.5 mm to 1 mm.

[0012] As a further improvement of one embodiment of the present invention, the mounting seat includes an avoidance cavity, the liquid inlet of the first nozzle and the liquid inlet of the second nozzle face the avoidance cavity, the liquid outlet of the liquid supply device is made of flexible material, and the liquid outlet of the liquid supply device is located in the avoidance cavity to connect the first nozzle and the second nozzle.

[0013] As a further improvement of an embodiment of the present invention, a first angle is defined between the nozzle device and the cleaning surface of the wafer, and the first angle is adjustable.

[0014] As a further improvement of one embodiment of the present invention, the wafer edge cleaning device has a reference plane perpendicular to the cleaning surface, the first projection point and the second projection point are located on the reference plane, and there is a second angle between the nozzle device and the reference plane, and the second angle can be adjusted.

[0015] As a further improvement of one embodiment of the present invention, the wafer edge washing device is configured as follows: when the nozzle device is deflected clockwise, the wafer carrier drives the wafer to rotate clockwise; when the nozzle device is deflected counterclockwise, the wafer carrier drives the wafer to rotate counterclockwise.

[0016] As a further improvement of an embodiment of the present invention, the liquid supply device includes a flexible connecting pipe connected to the nozzle device.

[0017] As a further improvement of one embodiment of the present invention, the nozzle device is connected to the first end of the flexible connecting pipe through a first pivot member, and / or the second end of the flexible connecting section is connected to the upstream pipe of the liquid supply device through a second pivot member, and the first end and the second end of the flexible connecting pipe are oppositely arranged.

[0018] To achieve one of the above-mentioned purposes of the invention, an embodiment of the present invention provides a wafer edge cleaning method for cleaning the edge area of ​​a wafer, comprising the steps of:

[0019] Placing a wafer on a wafer stage;

[0020] Providing a preset nozzle device, including a first nozzle opening and a second nozzle opening connected to a liquid outlet of a liquid supply device, and moving the nozzle device to a pre-spraying position at the periphery of the wafer;

[0021] Turn on the wafer stage to rotate the wafer;

[0022] Open the nozzle device and move the nozzle device above the wafer; the first nozzle opening is used to clean the first edge area of ​​the wafer, and the second nozzle opening is used to clean the second edge area of ​​the wafer, the first edge area and the second edge area are annular and cocentric with the wafer, and at least part of the first edge area is located on the inner side of the second edge area.

[0023] Compared with the prior art, the present invention provides a wafer edge cleaning device, wherein the nozzle device comprises a first nozzle opening and a second nozzle opening, wherein the first nozzle opening and the second nozzle opening respectively correspond to a first projection point and a second projection point on the wafer, and the first projection point and the second projection point are at different distances from the center of the wafer, so as to clean different edge areas of the wafer, and clean a wider wafer edge area at one time, thereby improving the cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of a wafer edge cleaning device according to one embodiment of the present invention.

[0025] Figure 2 2 is a schematic diagram of a wafer edge cleaning device from another angle according to an embodiment of the present invention.

[0026] Figure 3 yes Figure 2 Schematic diagram of the exploded structure of the middle part.

[0027] Figure 4 FIG. 4 is a cross-sectional view of a wafer edge cleaning device according to an embodiment of the present invention.

[0028] Figure 5 FIG. 1 is a top view of a wafer edge cleaning device according to an embodiment of the present invention.

[0029] Figure 6 FIG. 1 is a top view of a wafer edge cleaning device in another state according to an embodiment of the present invention. DETAILED DESCRIPTION

[0030] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0031] It should be noted that the term "comprises" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In addition, the terms "first", "second", "third", "fourth", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0032] The terms "connected", "connected to" or any other variants are intended to cover various relative positions in a connection relationship, so as to include direct connection or indirect connection. Among them, the direct connection can be formed by a gas pipeline, the indirect connection can be a connection relationship established by a device such as a valve body, a sensor, etc., can be a connection relationship established by a gas circuit component such as a brake control unit, or can be a connection relationship established by any other medium such as air.

[0033] See also Figure 1 , is a schematic structural diagram of a wafer edge cleaning device 100 provided in one embodiment of the present invention, which is used to clean the photoresist in the edge area of ​​the wafer 300.

[0034] In one embodiment, the wafer edge cleaning device 100 includes a wafer stage 10 for supporting a wafer 300 , a liquid supply device 20 , and a nozzle device 30 connected to the liquid supply device 20 , which together realize the function of cleaning the wafer 300 while rotating.

[0035] The wafer stage 10 supports and fixes the wafer 300. The wafer stage 10 is configured to be rotatable to drive the wafer 300 to rotate. In a specific embodiment, the wafer stage 10 can be a vacuum adsorption platform. The liquid supply device 20 provides cleaning liquid to the nozzle device 30, and the nozzle device 30 is used to clean the photoresist on the surface of the wafer 300.

[0036] In one embodiment, combining Figure 2 , 4 As shown, the liquid supply device 20 includes two liquid outlets 201 and at least one liquid supply barrel 21 located upstream of the liquid outlets 201 . The liquid comes from the liquid supply barrel 21 and is transported to the liquid outlets 201 through pipelines. The liquid outlets 201 are equivalent to the end of the liquid supply device 20 .

[0037] In one embodiment, the liquid supply device 20 may further include a debubbling device 22, a water bath temperature control device 23, and a flow meter 24, wherein the debubbling device 22, the water bath temperature control device 23, and the flow meter 24 are located downstream of the liquid supply barrel 21 and upstream of the liquid outlet 201. The debubbling device 22, the water bath temperature control device 23, and the flow meter 24 may be sequentially arranged between the liquid supply barrel 21 and the liquid outlet 201, and the positional relationship may also be adjusted according to actual needs.

[0038] In one embodiment, the liquid supply device 20 includes at least two liquid supply barrels 21, and at least two of the liquid supply barrels 21 are switched to achieve uninterrupted liquid supply. In practical applications, nitrogen needs to be flushed into each liquid supply barrel 21 to press out the liquid, so the liquid supply barrel 21 is in a state of high gas pressure, and it is impossible to supply liquid while replenishing liquid. It can be seen that if only one liquid supply barrel 21 is set, there may be a situation where the liquid capacity of the liquid supply barrel 21 is insufficient during one cleaning, and the cleaning needs to be stopped to replenish the liquid supply barrel 21, which wastes time and energy.

[0039] In one embodiment, the nozzle device 30 includes a first nozzle opening 310 and a second nozzle opening 320 respectively connected to the two liquid outlets 201, Figure 3 As shown, the liquid from the liquid outlet 201 is further transported to the first nozzle opening 310 and the second nozzle opening 320 , and then the wafer 300 is cleaned through the first nozzle opening 310 and the second nozzle opening 320 .

[0040] The first nozzle opening 310 has a first projection point O1 orthogonally projected on the wafer 300 in the vertical direction, and the second nozzle opening 320 has a second projection point O2 orthogonally projected on the wafer 300 in the vertical direction, and there is a first distance between the first projection point O1 and the center C of the wafer, and there is a second distance between the second projection point O2 and the center C of the wafer, and the first distance is smaller than the second distance, so as to realize cleaning of a wider edge area of ​​the wafer.

[0041] Continue to combine Figure 4 For ease of understanding, without considering the actual cleaning area of ​​the liquid sprayed from each nozzle, it can be understood that when the liquid from the first nozzle 310 is sprayed onto the surface of the wafer 300, the surface of the wafer 300 must have a first cleaning point. When the position of the first nozzle 310 is fixed, the positions of the first projection point O1 and the first cleaning point are also fixed, which is equivalent to the first projection point O1 being fixed and the first cleaning point having a corresponding fixed position. It can be understood that the first projection point and the first cleaning point can coincide with each other or be at a distance from each other.

[0042] As above, when the liquid of the second nozzle opening 320 is sprayed onto the surface of the wafer 300, the surface of the wafer 300 must have a second cleaning point. When the position of the second nozzle opening 320 is fixed, the positions of the second projection point O2 and the second cleaning point are also fixed, which is equivalent to that the position of the second projection point O2 is fixed and the second cleaning point has a corresponding fixed position. It can be understood that the second projection point O2 and the second cleaning point can overlap with each other or be at a distance from each other.

[0043] Specifically, when the first nozzle opening 310 is facing the surface of the wafer 300, the first projection point O1 and the first cleaning point coincide with each other, and when the first nozzle opening 310 is tilted toward the edge of the wafer, the first cleaning point is located on the outside relative to the first projection point O1; similarly, when the second nozzle opening 320 is facing the surface of the wafer 300, the second projection point O2 and the second cleaning point coincide with each other, and when the second nozzle opening 320 is tilted toward the edge of the wafer, the second cleaning point is located on the outside relative to the second projection point O2.

[0044] It can be seen that the first projection point O1 and the second projection point O2 are at different distances from the center C of the wafer, which is equivalent to that the first cleaning point and the second cleaning point are at different distances from the center C of the wafer. In this way, when the nozzle device 30 does not move, the wafer edge cleaning device 100 can also clean a certain width of the wafer edge area at one time.

[0045] It is understandable that, in the actual cleaning process, the wafer 300 rotates at a high speed, and the liquid sprayed onto the surface of the wafer 300 is inevitably moved outward from the first cleaning point and the second cleaning point due to the centrifugal force. Figure 5 As shown, the liquid discharged from the first nozzle opening 310 can actually spread outward from the first cleaning point for a distance, and actually cleans a circular ring area of ​​a certain width. The same is true for the second nozzle opening 320.

[0046] Assume that the 4 mm edge area of ​​wafer 300 needs to be cleaned. In the prior art, a nozzle is set to move repeatedly between 2 mm and 4 mm away from the edge of the wafer. When a nozzle moves between 2 mm and 4 mm from the edge of the wafer, the 4 mm edge area can be cleaned due to the swing of centrifugal force. However, in the prior art, the wafer 300 rotates at a high speed and the nozzle also moves back and forth at a high speed, which will cause liquid splashing and contaminate the inner surface of the wafer. Even a small part of the liquid will be atomized and contaminate the wafer to be cleaned.

[0047] In the present case, the first cleaning point of the first nozzle port 310 can be set to correspond to 4 mm from the edge of the wafer, and the second cleaning point of the second nozzle port 320 can be set to correspond to 2 mm from the edge of the wafer. When the wafer 300 rotates at high speed, the nozzle device 30 remains stationary. The first nozzle port 310 can at least clean a circular area with a width of 2 mm, and the second nozzle port 320 can also at least clean a circular area with a width of 2 mm. In this way, the edge area of ​​the wafer 300 with a width of 4 mm can be cleaned.

[0048] In this way, on the one hand, the cleaning efficiency is improved; on the other hand, during the cleaning process, since the first nozzle opening 310 and the second nozzle opening 320 themselves can clean a certain width of the edge area, the nozzle device 30 does not need to reciprocate with the edge of the wafer, which is beneficial to reduce splash contamination during the cleaning process.

[0049] In one embodiment, the opening size of the first nozzle opening 310 is larger than the opening size of the second nozzle opening 320. This means that the first nozzle opening 310 located on the inner side sprays more liquid. In the actual cleaning process, since the wafer 300 is rotating at a high speed, the liquid sprayed onto the wafer 300 will be naturally thrown to the outer edge due to the centrifugal force. Therefore, the first nozzle opening 310 located on the inner side sprays more liquid, which can increase the area cleaned outward by the first nozzle opening 310 to a certain extent.

[0050] On the other hand, the first nozzle opening 310 located on the inner side sprays more liquid, has a stronger cleaning power on the wafer, and the corresponding edge area can be cleaned more thoroughly.

[0051] In a specific embodiment, the opening size of the first nozzle opening 310 ranges from 20G to 23G, and the opening size of the second nozzle opening 320 ranges from 23G to 27G.

[0052] In one embodiment, the nozzle device 30 includes a first nozzle 31 and a second nozzle 32 connected to the liquid supply device 20, the first nozzle opening 310 is arranged on the first nozzle 31, and the second nozzle opening 320 is arranged on the second nozzle 32; the length of the first nozzle 31 is smaller than the length of the second nozzle 32.

[0053] Specifically, the first nozzle opening 310 is a liquid spraying end of the first nozzle 31 , and the second nozzle opening 320 is a liquid spraying end of the second nozzle 32 .

[0054] In actual applications, the nozzle device 30 is tilted relative to the wafer 300. Compared with placing the nozzle device 30 perpendicular to the surface of the wafer 300, the tilted setting can allow the sprayed liquid to have a tendency to tilt toward the outer edge, so that a wider range of edges can be cleaned outward, preventing the liquid from splashing inward, and preventing the liquid from falling directly and splashing around.

[0055] In this way, under the condition that the first nozzle 31 and the second nozzle 32 are both tilted outward, it is necessary to shorten the first nozzle 31 located on the inner side so that the first projection point O1 of the first nozzle opening 310 is moved inward a little, lengthen the distance between the first projection point O1 and the second projection point O2, and reduce the space occupied between the surface of the wafer 300 and the nozzle device 30.

[0056] In one embodiment, the nozzle device 30 includes a mounting seat 33 disposed outside the liquid outlet 201, the first nozzle 31 and the second nozzle 32 are disposed on the mounting seat 33, and the position of the first nozzle 31 and / or the position of the second nozzle 32 are movable relative to the mounting seat 33 to adjust the relative position of the first projection point O1 and / or the second projection point O1. In this way, the range of the first nozzle opening 310 and the second nozzle opening 320 corresponding to the cleaning of the wafer edge area can be adjusted to adapt to more types of wafer edge cleaning.

[0057] In a specific embodiment, it is possible to set only the position of the first nozzle 31 to be movable, and the first nozzle located on the inner side is movable to adjust the cleaning area of ​​the first nozzle 31 to achieve cleaning adapted to edges of different widths; or it is possible to set only the position of the second nozzle 32 to be movable, and the second nozzle 32 located on the outer side is movable to adjust the cleaning area of ​​the second nozzle 32 to achieve fine cleaning of edges of a certain width; it is also possible to set both the positions of the first nozzle 31 and the second nozzle 32 to be movable to adapt to more cleaning scenarios.

[0058] The arrangement direction between the first nozzle 31 and the second nozzle 32 is a first direction. The mounting seat 33 includes a plurality of mounting holes 330 arranged along the first direction. The first nozzle 31 and / or the second nozzle 32 can be detachably mounted in the mounting holes 330 .

[0059] In a specific embodiment, the first nozzle 31 may be coupled to the mounting hole 330 by means of screws or other detachable snap-fitting means, and / or the second nozzle 32 may be coupled to the mounting hole 330 by means of screws or other detachable snap-fitting means.

[0060] Specifically, when the first nozzle 31 needs to be movable, the first nozzle 31 is detachably installed; when the second nozzle 32 needs to be movable, the second nozzle 32 is detachably installed; when the first nozzle 31 and the second nozzle 32 need to be movable, the first nozzle 31 and the second nozzle 32 are detachably installed. In actual applications, the first nozzle 31 and the second nozzle 32 are detachably installed, which improves the flexibility of the nozzle device 30 in position adjustment, increases the range of the edge area that can be cleaned, and adapts to more application scenarios.

[0061] Along the first direction, the distance between two adjacent mounting holes 330 ranges from 0.5mm to 1mm. It is understandable that the cleaning range of the wafer edge area is usually very small, generally between 2mm and 5mm, so the adjustment between adjacent mounting holes 330 should not be too large, otherwise it is impossible to achieve small width range adjustment.

[0062] In one embodiment, the mounting seat 33 includes an avoidance cavity 331, the liquid inlet of the first nozzle 31 and the liquid inlet of the second nozzle 32 face the avoidance cavity 331, the liquid outlet 201 of the liquid supply device 20 is a flexible material, and the liquid outlet 201 of the liquid supply device 20 is located in the avoidance cavity 331 to connect the first nozzle 31 and the second nozzle 32. It is convenient to adjust the position of the first nozzle 31 and the second nozzle 32.

[0063] Combination Figure 3 As shown, the two liquid outlets 201 of the liquid supply device 20 extend into the avoidance cavity 331, and the two liquid outlets 201 are respectively connected to the liquid inlet of the first nozzle 31 and the liquid inlet of the second nozzle 32, which is equivalent to that, during the wafer cleaning process, the liquid from the liquid outlet 201 enters the liquid inlet of the first nozzle 31 and the liquid inlet of the second nozzle 32, and then is ejected through the first nozzle port 310 and the second nozzle port 320.

[0064] When the first nozzle 31 is set to be position-adjustable, the first nozzle 31 is disassembled and moved to the left or right by the distance of a mounting hole 310. At this time, it is necessary to ensure the connection between the first nozzle 31 and the liquid inlet 201. The liquid inlet 201 is soft. When the first nozzle 31 moves and the moving distance is small, the liquid inlet 201 can be slightly bent and deformed to adapt to the movement of the first nozzle 31.

[0065] Similarly, when the second nozzle 32 is set to be position-adjustable, the second nozzle 32 is disassembled and moved to the left or right by the distance of a mounting hole 310. At this time, it is necessary to ensure the connection between the second nozzle 32 and the liquid inlet 201. The liquid inlet 201 is soft. When the second nozzle 32 moves, and the moving distance is small, the liquid inlet 201 can be slightly bent and deformed to adapt to the movement of the second nozzle 32.

[0066] In one embodiment, a first angle a is formed between the nozzle device 30 and the cleaning surface of the wafer 300, and the first angle a can be adjusted. Figure 4 As shown, the nozzle device 30 is tilted toward the outer edge of the wafer at a certain angle, which is conducive to the liquid being tilted outward for cleaning and preventing the liquid from splashing inward; compared with the vertical drop of the liquid, the inclined setting has a relatively small impact force and improves the splashing phenomenon.

[0067] The first angle a can be adjusted in the range of 30-60°, preferably 45°.

[0068] The first nozzle 31 and the second nozzle 32 are parallel to each other, and a first angle a is formed between the nozzle device 30 and the cleaning surface of the wafer 300, which is equivalent to a first angle a is formed between the first nozzle 31 and the cleaning surface of the wafer 300, and a first angle a is formed between the second nozzle 32 and the cleaning surface of the wafer 300.

[0069] In one embodiment, the wafer edge cleaning device 100 has a reference surface perpendicular to the cleaning surface, the first projection point O1 and the second projection point O2 are located on the reference surface, and there is a second angle between the nozzle device 30 and the reference surface, and the second angle can be adjusted.

[0070] Combination Figure 5-6 As shown, the nozzle device 30 is deflected by a certain angle in the clockwise direction or counterclockwise direction. When the second angle is 0°, the nozzle device 30 is equivalent to not being deflected. At this time, the first projection point O1 and the second projection point O2 are exactly located on the radius of the wafer. When the second angle is deflected between ±10°, the first projection point O1 and the second projection point O2 are not necessarily located on the radius of the wafer.

[0071] There is a second angle between the nozzle device 30 and the reference surface, which is equivalent to there being a second angle between the first nozzle 31 and the reference surface, and there being a second angle between the second nozzle 32 and the reference surface.

[0072] The wafer edge cleaning device 100 is configured such that when the nozzle device 30 is deflected clockwise by the second angle, the wafer stage 10 drives the wafer 300 to rotate clockwise; when the nozzle device 30 is deflected counterclockwise by the second angle, the wafer stage 10 drives the wafer 300 to rotate counterclockwise. In this way, the deflection direction of the nozzle device 30 complies with the rotation direction of the wafer 300, thereby improving the backsplash phenomenon.

[0073] The liquid supply device 20 includes a flexible connecting pipe 25 connected to the nozzle device 30, and the flexible connecting pipe 25 includes the liquid outlet 201. In this way, in the process of adjusting the second angle of the nozzle device 30, the flexible connecting pipe 25 has a flexible deformation space, and the flexible connecting pipe 25 can be gently manually operated to deflect a certain angle to set the second angle.

[0074] The nozzle device 30 is connected to the first end of the flexible connecting pipe 25 via the first pivot member 40, and / or the second end of the flexible connecting section 25 is connected to the upstream pipe of the liquid supply device 20 via the second pivot member 50, and the first end and the second end of the flexible connecting pipe 25 are oppositely arranged.

[0075] Combination Figure 1-2As shown, the first pivot axis of the first pivot member 40 is a vertical axis, and the nozzle device 30 can be rotated and adjusted around the vertical axis to adjust the position of the nozzle device 30 corresponding to the outer edge of the wafer 300; when the second angle is 0, the second pivot axis of the second pivot member 50 is a horizontal axis, and the second pivot axis is perpendicular to the above-mentioned first direction, and the nozzle device 30 can be rotated and adjusted around the second pivot axis to adjust the first angle a between the nozzle device 30 and the wafer 300.

[0076] This case also protects a wafer edge cleaning method for cleaning the edge area of ​​a wafer 300, comprising the steps of:

[0077] The wafer 300 is placed on the wafer stage 10 ; the wafer stage 10 is a high-speed rotating platform and has a vacuum adsorption function.

[0078] Provide a preset nozzle device 30, including a first nozzle opening 310 and a second nozzle opening 320 connected to the liquid outlet 201 of the liquid supply device 20, and move the nozzle device 30 to the pre-spraying position outside the wafer; this step is mainly used to set the distance between the first nozzle 31 and the second nozzle 32 in advance, and set the first angle a and the second angle between the nozzle device 30 and the wafer 300. You can first move to the simulated cleaning position above the wafer for setting. After setting, the nozzle device 30 needs to be moved away from above the wafer to ensure that when the nozzle device 30 is opened, it cannot be opened directly above the wafer 300.

[0079] The wafer stage 10 is turned on to rotate to drive the wafer 300 to rotate; in order to ensure uniformity during instant cleaning, the wafer 300 needs to be put into a high-speed rotation state first.

[0080] Open the nozzle device 30 and move it above the wafer; when the nozzle device 30 is outside the outer edge of the wafer 300, the nozzle device 30 must be opened first to enter the liquid spraying state. At this time, the liquid spraying flow rate can be set to be smaller. When the nozzle device 30 has moved to the corresponding cleaning position, the flow rate is increased. The above steps can ensure the uniformity of instant cleaning and reduce the back splashing phenomenon.

[0081] The first nozzle opening 310 is used to clean the first edge area S1 of the wafer, and the second nozzle opening 320 is used to clean the second edge area S1 of the wafer. The first edge area S1 and the second edge area S2 are annular and have the same center as the wafer, and at least part of the first edge area S1 is located on the inner side of the second edge area S2.

[0082] It can be understood that, as described above, without considering the actual cleaning process of the nozzle device 30 spraying liquid, we define a relatively static state. In this state, the wafer 300 has a first projection point and a first cleaning point corresponding to the first nozzle opening 310, and has a second projection point and a second cleaning point corresponding to the second nozzle opening 320. The first projection point and the second projection point are at different distances from the center C in order to describe the key points of the present invention in a more concise angle and manner.

[0083] Combination Figure 5 As shown, during the actual cleaning process, the wafer 300 rotates at a high speed, and the first nozzle opening 310 and the second nozzle opening 320 respectively correspond to a section of the circular arc area on the edge of the cleaning wafer, and at least part of the first edge area S1 is located on the inner side of the second edge area S2, so that the edge area of ​​the wafer with a certain width can be cleaned, for example, 2mm-5mm in width.

[0084] In practice, the first edge region S1 and the second edge region S2 must have a certain overlapping range. During actual cleaning, the liquid will inevitably pass through the second edge region S2 when swung outward.

[0085] The beneficial effect of the present invention is that the first projection point O1 and the second projection point O2 are at different distances from the center C of the wafer, which is equivalent to that the first cleaning point and the second cleaning point are at different distances from the center C of the wafer. In this way, when the nozzle device 30 does not move, the wafer edge cleaning device 100 can also clean a certain width of the wafer edge area at one time; the first nozzle 31 and the second nozzle 32 are movably arranged relative to the mounting seat to adjust the positions of the first projection point O1 and the second projection point O2 to adapt to more cleaning scenarios.

[0086] It can be formed by referring to any of the technical solutions provided above, and will not be described in detail here.

[0087] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0088] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer edge cleaning device for cleaning the edge area of ​​a wafer, characterized in that: include: A wafer carrier for supporting a wafer, a liquid supply device and a nozzle device connected to the liquid supply device, the liquid supply device including two liquid outlets, the nozzle device including a first nozzle port and a second nozzle port respectively connected to the two liquid outlets, the first nozzle port having a first projection point projected onto the wafer along a vertical direction, the second nozzle port having a second projection point projected onto the wafer along a vertical direction, a first distance between the first projection point and the center of the wafer, a second distance between the second projection point and the center of the wafer, and the first distance being smaller than the second distance.

2. The wafer edge cleaning device according to claim 1, characterized in that: The opening size of the first nozzle opening is larger than the opening size of the second nozzle opening.

3. The wafer edge cleaning device according to claim 2, characterized in that: The opening size of the first nozzle opening ranges from 20G to 23G, and the opening size of the second nozzle opening ranges from 23G to 27G.

4. The wafer edge cleaning device according to claim 1, characterized in that: The nozzle device comprises a first nozzle and a second nozzle connected to a liquid supply device, the first nozzle opening is arranged at the first nozzle, and the second nozzle opening is arranged at the second nozzle; the length of the first nozzle is smaller than the length of the second nozzle.

5. The wafer edge cleaning device according to claim 1, characterized in that: The nozzle device includes a mounting seat arranged outside the liquid outlet, a first nozzle and a second nozzle arranged on the mounting seat, and the position of the first nozzle and / or the position of the second nozzle is movable relative to the mounting seat to adjust the relative position of the first projection point and / or the second projection point.

6. The wafer edge cleaning device according to claim 5, characterized in that: The arrangement direction between the first nozzle and the second nozzle is a first direction, the mounting seat includes a plurality of mounting holes arranged along the first direction, and the first nozzle and / or the second nozzle can be detachably mounted on the mounting holes.

7. The wafer edge cleaning device according to claim 6, characterized in that: Along the first direction, the distance between two adjacent mounting holes ranges from 0.5 mm to 1 mm.

8. The wafer edge cleaning device according to claim 6, characterized in that: The mounting seat includes an avoidance cavity, the liquid inlet of the first nozzle and the liquid inlet of the second nozzle face the avoidance cavity, the liquid outlet of the liquid supply device is made of flexible material, and the liquid outlet of the liquid supply device is located in the avoidance cavity to connect the first nozzle and the second nozzle.

9. The wafer edge cleaning device according to claim 1, characterized in that: There is a first angle between the nozzle device and the cleaning surface of the wafer, and the first angle is adjustable.

10. The wafer edge cleaning device according to claim 1, characterized in that: The wafer edge cleaning device has a reference surface perpendicular to the cleaning surface, the first projection point and the second projection point are located on the reference surface, and a second angle is formed between the nozzle device and the reference surface, and the second angle is adjustable.

11. The wafer edge cleaning device according to claim 10, characterized in that: The wafer edge cleaning device is configured as follows: when the nozzle device is deflected clockwise, the wafer carrier drives the wafer to rotate clockwise; when the nozzle device is deflected counterclockwise, the wafer carrier drives the wafer to rotate counterclockwise.

12. The wafer edge cleaning device according to claim 1, characterized in that: The liquid supply device includes a flexible connecting pipe connected to the nozzle device.

13. The wafer edge cleaning device according to claim 12, characterized in that: The nozzle device is connected to the first end of the flexible connecting pipe through a first pivot member, and / or the second end of the flexible connecting section is connected to the upstream pipe of the liquid supply device through a second pivot member, and the first end and the second end of the flexible connecting pipe are oppositely arranged.

14. A wafer edge cleaning method for cleaning the edge area of ​​a wafer, characterized in that: Includes steps: Placing a wafer on a wafer stage; Providing a preset nozzle device, including a first nozzle opening and a second nozzle opening connected to a liquid outlet of a liquid supply device, and moving the nozzle device to a pre-spraying position at the periphery of the wafer; Turn on the wafer stage to rotate the wafer; Open the nozzle device and move the nozzle device above the wafer; the first nozzle opening is used to clean the first edge area of ​​the wafer, and the second nozzle opening is used to clean the second edge area of ​​the wafer, the first edge area and the second edge area are annular and cocentric with the wafer, and at least part of the first edge area is located on the inner side of the second edge area.

Images