Connecting module

Abstract

The invention provides a technology capable of realizing additional arrangement of a processing unit and facilitating maintenance of a carrying manipulator. The first processing module (3A) has processing units (SP1-SP6) and a first handover unit (PS1). The index plate section (2) is disposed on the-X side of the first processing module and supplies the substrate (W) to the first transfer section (PS1). The transfer module (3T) is disposed on the + X side of the first processing module, and has a first transfer robot (CR1) that transfers the substrate from the first transfer section in the + X direction and transfers the substrate into the processing unit. The transport module has a maintenance chamber (302T). A first bottom plate part (FL1) provided with a base part (41) of the first conveying robot and a second bottom plate part (FL2) arranged on the + Y side of the first bottom plate part are arranged in the maintenance chamber. And an inlet / outlet part (303T) for communicating the inner side of the maintenance chamber with the outside is arranged on the + Y side compared with the second bottom plate part.

Description

[0001] The present invention is based on a divisional application of an invention application with an application date of December 25, 2019 (the priority date is December 28, 2018), an application number of 201911356069.7, and an invention name of “Substrate processing device, conveying module and connection module”. Technical Field

[0002] The present invention relates to a substrate processing device for processing a substrate. The substrates to be processed include, for example, semiconductor substrates, liquid crystal display devices and organic EL (Electroluminescence) display devices such as FPD (Flat Panel Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, solar cell substrates, printed substrates, etc. Background Art

[0003] In the manufacturing process of semiconductor devices, a substrate processing apparatus having a single-wafer processing unit for processing substrates one by one is used. In addition, in order to improve production efficiency, a substrate processing apparatus in which a plurality of processing units are combined is used.

[0004] Patent Document 1 Figure 1 The substrate processing device disclosed in the invention includes a transfer robot for transferring substrates, including a dividing plate robot, a first main robot and a second main robot. These robots are arranged in sequence along one direction. A first and a second loading section for loading substrates are provided between the dividing plate robot and the first main robot, and between the first and the second main robots, respectively. Processing units are provided on both sides of each of the first and second main robots. The dividing plate robot takes out an unprocessed substrate from a box and transfers it to the first loading section. The first main robot takes out a substrate from the first loading section and transfers it to a surrounding processing unit or the second loading section. The second main robot takes out a substrate from the second loading section and transfers it to a surrounding processing unit. The substrates processed in each processing unit are returned to the box again via the opposite route.

[0005] In addition, in Patent Document 1 Fig.10 In the substrate processing apparatus disclosed in , the second mounting portion, the second main robot and the peripheral processing units are omitted, and the substrate processing apparatus is composed of a cassette mounting portion, an indexing table robot, a first mounting portion, a first main robot and the peripheral processing units.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2017-183447 Summary of the invention

[0009] In Patent Document 1 Figure 1 In a substrate processing apparatus, an opening is provided on the side opposite to the second loading portion across the second main robot. An operator can enter the substrate processing apparatus through the opening and approach the second main robot. However, since the first main robot is surrounded by the first and second loading portions and the processing unit, it is not easy for the operator to approach the first main robot.

[0010] In addition, in Patent Document 1 Fig.10 In a substrate processing apparatus, an opening is provided on the side opposite to the first loading portion across the first main robot. An operator can enter the substrate processing apparatus through the opening and approach the first main robot. However, in the case of this substrate processing apparatus, since the positions where the processing units can be arranged are limited to the two sides of the first main robot, the number of processing units is limited.

[0011] An object of the present invention is to provide a technology that enables the installation of additional processing units and facilitates the maintenance of a transport robot.

[0012] In order to solve the above-mentioned problems, the first scheme is a substrate processing device for processing a substrate, and the substrate processing device is characterized in that it includes: a first processing module, which has a first specified processing unit for performing specified processing on the substrate and a first delivery portion for temporarily holding the substrate; a substrate supply portion, which is arranged on a first direction side of the first processing module and supplies the substrate to the first delivery portion from the first direction side; and a conveying module, which is arranged on a second direction side of the first processing module opposite to the first direction and has a function of conveying the substrate from the first delivery portion along the second direction. The substrate is carried into the first transport device of the first specified processing unit, and the transport module includes: a frame, which defines a loading space for the first transport device to be loaded inside; a first bottom plate portion, which is arranged on the inner side of the loading space and is provided with a base portion of the first transport device; a second bottom plate portion, which is arranged on the inner side of the loading space, in a third direction side which is a horizontal direction orthogonal to the first direction compared to the first bottom plate portion; and an entrance and exit portion, which is arranged on the third direction side compared to the second bottom plate portion, so that the loading space is connected with the outside of the frame.

[0013] A second aspect is the substrate processing apparatus according to the first aspect, wherein the first transport device includes: a hand that holds the substrate; and a vertical drive unit including a vertical motor that moves the hand in a vertical direction.

[0014] A third aspect is the substrate processing apparatus according to the second aspect, wherein the first bottom plate portion is provided below the second bottom plate portion in a vertical direction.

[0015] The fourth scheme is based on the substrate processing device of the second or third scheme, wherein the first transport device includes a horizontal driving unit, the horizontal driving unit includes a moving motor that moves the hand in a horizontal direction away from or close to the base unit, and the first bottom plate unit is arranged on the side opposite to the third direction compared to the first junction unit.

[0016] A fifth aspect is the substrate processing apparatus according to the fourth aspect, wherein the first predetermined processing unit includes a nozzle for supplying a fluid to the substrate.

[0017] A sixth aspect is the substrate processing apparatus according to the fifth aspect, further comprising a supply pipe for supplying the fluid to the nozzle, the supply pipe being arranged across the transfer module and the first processing module.

[0018] The seventh scheme is based on the substrate processing device of the sixth scheme, and further includes a cylindrical bellows component on the inner side for the supply piping to be inserted, the first processing module includes a first piping chamber for the supply piping, the transport module includes a second piping chamber for the supply piping, an opening portion at one end side of the bellows component is connected to the first piping chamber, and an opening portion at the other end side is connected to the second piping chamber.

[0019] An eighth aspect is the substrate processing apparatus according to any one of the fifth to seventh aspects, wherein a pipe connection port for supplying the fluid is provided below the second bottom plate portion.

[0020] The 9th scheme is based on any one of the substrate processing devices in the 1st to 8th schemes, and includes: a second processing module, which is arranged on the second direction side of the conveying module, and has a second interface for temporarily holding the substrate moved in from the first direction side by the first conveying device, and a second specified processing unit for performing specified processing on the substrate; a third processing module, which is arranged on the second direction side of the second processing module, and has a third specified processing unit for performing specified processing on the substrate; and a second conveying device, which conveys the substrate between the second interface and the second specified processing unit and between the second interface and the third specified processing unit.

[0021] The tenth scheme is a conveying module for conveying the substrate in a substrate processing device including a first processing module having a first specified processing unit for performing specified processing on the substrate, the conveying module including: a first conveying device, which conveys the substrate from a second direction side to the first specified processing unit; a frame, which defines a loading space for the first conveying device to be loaded inside; a first bottom plate portion, which is arranged on the inner side of the loading space and is provided with a base portion of the first conveying device; a second bottom plate portion, which is arranged on the inner side of the loading space on the third direction side of the horizontal direction orthogonal to the second direction compared to the first bottom plate portion; and an entrance and exit portion, which connects the loading space with the outside of the frame via the second bottom plate portion.

[0022] The 11th scheme is a connection module arranged in a substrate processing device for processing a substrate, the connection module includes a first processing module and a conveying module connected to the first processing module on the second direction side, the first processing module has: a first prescribed processing unit, which performs prescribed processing on the substrate; and a first delivery portion, which temporarily holds the substrate, the conveying module has a first conveying device, which conveys the substrate out of the first delivery portion toward the second direction side and moves it into the first prescribed processing unit from the second direction side.

[0023] Effects of the Invention

[0024] According to the substrate processing device of the first scheme, when the operator performs maintenance on the first transport device, he can enter the second bottom plate portion through the entrance and exit portion of the transport module and approach the first transport device. In addition, the first processing module and the transport module can be alternately connected in the second direction. In this case, the transport device can receive the substrate from the first interface of the previous first processing module and hand it over to the first interface of the next first processing module. In this way, the substrate can be supplied to the subsequent first processing module. Therefore, by alternately connecting the first processing module and the transport module in the second direction, it is easy to add the first prescribed processing unit.

[0025] According to the substrate processing apparatus of the second aspect, the substrate held by the hand can be conveyed in the vertical direction.

[0026] According to the substrate processing apparatus of the third aspect, the hand can be moved to a low position by arranging the first bottom plate portion lower than the second bottom plate portion, thereby enabling the substrate to be conveyed to a low position.

[0027] According to the substrate processing apparatus of the fourth aspect, the base portion of the first transport device is arranged on the first bottom plate portion provided on the side opposite to the third direction. In addition, by moving the hand in a horizontal direction away from or approaching the base portion, the hand can enter from the side opposite to the third direction of the first interface.

[0028] According to the substrate processing apparatus of the fifth aspect, the substrate can be processed using the fluid.

[0029] According to the substrate processing apparatus of the sixth aspect, the fluid can be supplied from the transfer module side to the processing module side.

[0030] According to the seventh aspect of the substrate processing apparatus, the supply pipe disposed at the connection between the first processing module and the transport module can be surrounded by the bellows member. Thus, leakage of the atmosphere containing the fluid to the outside of the apparatus can be reduced by the connection between the first processing module and the transport module.

[0031] According to the substrate processing apparatus of the eighth aspect, since the pipe connection port is provided below the second bottom plate portion, the operator can perform maintenance without stepping on the pipe connection port.

[0032] According to the substrate processing apparatus of the ninth aspect, it is easy to approach the first transfer device, and the second predetermined processing unit and the third predetermined processing unit can be added.

[0033] According to the conveying module of the tenth aspect, when performing maintenance on the first conveying device, the operator can access the first conveying device by entering onto the second bottom plate portion through the entrance and exit portion of the conveying module.

[0034] According to the connection module of the eleventh aspect, by alternately connecting the first processing modules and the transfer modules in the second direction, it is possible to easily add the first predetermined processing unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic plan view for explaining the internal layout of the substrate processing apparatus 1 according to the embodiment.

[0036] Figure 2 It is shown along Figure 1 FIG. 1 is a schematic side cross-sectional view of the interior of the substrate processing apparatus 1 taken along line II-II.

[0037] Figure 3 It is shown along Figure 1 FIG. 1 is a schematic side cross-sectional view of the interior of the substrate processing apparatus 1 taken along line III-III.

[0038] Figure 4 It is shown along Figure 1 FIG. 1 is a schematic side cross-sectional view of the interior of the substrate processing apparatus 1 taken along line IV-IV.

[0039] Figure 5 It is a schematic diagram of the interior of liquid processing units P1 to P18 included in substrate processing apparatus 1 as viewed in the horizontal direction.

[0040] Figure 6 1 is a block diagram showing the connection between each element of the substrate processing apparatus 1 and the control unit 7 .

[0041] Figure 7 It is a schematic plan view for explaining the arrangement of pipes for supplying fluid to each of the liquid processing units P1 to P18.

[0042] Figure 8 1 is a schematic plan view showing a substrate processing apparatus 1A having two processing towers.

[0043] Fig. 9 1 is a schematic plan view showing a substrate processing apparatus 1B having four processing towers.

[0044] Fig.10 1 is a schematic plan view showing the substrate processing apparatus 1C.

[0045] Fig.11 It is a diagram showing the heat processing unit HP1.

[0046] Fig.12 1 is a schematic plan view showing the substrate processing apparatus 1D.

[0047] The following are the descriptions of the reference numerals:

[0048] 1. 1A~1D substrate processing equipment

[0049] 2 Indexing plate part (substrate supply part)

[0050] 20 substrate container

[0051] 21 indexing plate manipulator

[0052] 302T Maintenance Room

[0053] 303T entrance and exit

[0054] 304T Door

[0055] 32 substrate holding part

[0056] 36 Reciprocating transport device

[0057] 3A, 3AH 1st processing module

[0058] 3B 2nd processing module

[0059] 3C 3rd processing module

[0060] 3FT Framework

[0061] 3S upper surface FL5S, FL

[0062] 3T handling module

[0063] 41 abutment part

[0064] 42 horizontal drive unit

[0065] 43 vertical drive unit

[0066] 44A, 44B Hands

[0067] 50 treatment room

[0068] 51 Rotating chuck

[0069] 52 liquid nozzle

[0070] 7. Control Unit

[0071] 81A~81C, 82A~82C, 83A, 83C, 84A~84C Pipe connection port set

[0072] 831A piping (supply piping)

[0073] 861A piping room (first piping room)

[0074] 86T piping room (2nd piping room)

[0075] 91 bellows parts

[0076] CR1 No.1 handling robot (No.1 handling device)

[0077] CR2 Second transport robot (second transport device)

[0078] FL1 1st floor plate

[0079] FL2 2nd bottom plate

[0080] FL1S, FL2S upper surface

[0081] HP1~HP10 heating treatment unit

[0082] IR indexing plate robot

[0083] P1 to P6 liquid processing unit (first specified processing unit)

[0084] P7 to P12 liquid processing unit (second specified processing unit)

[0085] P13 to P18 liquid processing unit (third prescribed processing unit)

[0086] PS1 1st transfer section

[0087] PS2 2nd junction

[0088] TW1~TW6, TW1a, TW2a treatment tower

[0089] W substrate DETAILED DESCRIPTION

[0090] The following describes an embodiment of the present invention with reference to the accompanying drawings. In addition, the constituent elements described in the present embodiment are merely illustrative and are not intended to limit the scope of the present invention to this. In the accompanying drawings, for ease of understanding, the size and quantity of each part may be exaggerated or simplified as needed. In addition, in each figure, a right-handed XYZ orthogonal coordinate system is defined to illustrate the positional relationship of each element. Here, the X-axis and the Y-axis extend in the horizontal direction, and the Z-axis extends in the vertical direction. In addition, in the following description, the direction to which the front end of the arrow is directed is set to the + (positive) direction, and the opposite direction is set to the - (negative) direction. Here, the vertical direction upward is the + Z direction, and the vertical direction downward is the - Z direction.

[0091] Unless otherwise specified, expressions indicating relative or absolute positional relationships (such as "in one direction", "along one direction", "parallel", "orthogonal", "center", "concentric", "coaxial", etc.) not only strictly indicate the positional relationship, but also indicate the state after the angle or distance is relatively displaced within a tolerance or a range that can obtain the same degree of function. Expressions indicating the same state (such as "same", "equal", "homogeneous", etc.) not only quantitatively indicate the state of strict equality, but also indicate the state of difference with a tolerance or a range that can obtain the same degree of function, unless otherwise specified. Expressions indicating shapes (such as "quadrilateral" or "cylindrical shape", etc.) not only strictly indicate the shape geometrically, but also indicate that it has shapes such as concave-convex, chamfered corners, etc. within a range that can obtain the same degree of effect, unless otherwise specified. Expressions such as "including", "provided with", "having", "including" or "having" a constituent element are not exclusive expressions that exclude the existence of other constituent elements. Unless otherwise specified, "above" includes not only the situation where two elements are in contact, but also the situation where two elements are separated. Unless otherwise specified, “moving in a specific direction” includes not only moving in parallel with the specific direction but also moving in a direction including a component of the specific direction.

[0092] <1. Implementation Method>

[0093] Figure 1 It is a schematic plan view for explaining the internal layout of the substrate processing apparatus 1 according to the embodiment. Figure 2 It is shown along Figure 1 FIG. 1 is a schematic side cross-sectional view of the interior of the substrate processing apparatus 1 taken along line II-II. Figure 3 It is shown along Figure 1FIG. 1 is a schematic side cross-sectional view of the interior of the substrate processing apparatus 1 taken along line III-III. Figure 4 It is shown along Figure 1 FIG. 1 is a schematic side cross-sectional view of the interior of the substrate processing apparatus 1 taken along line IV-IV.

[0094] The substrate processing device 1 is a single-chip device that processes disc-shaped substrates W such as semiconductor wafers one by one. The substrate processing device 1 performs various processes such as cleaning and etching on the substrates W. Figure 1 As shown, the substrate processing apparatus 1 includes an index plate section 2 (substrate supply section) and a processing section 3 in this order toward the +X side.

[0095] The processing section 3 includes the first processing module 3A, the transport module 3T, the second processing module 3B and the third processing module 3C in sequence toward the +X side. The first processing module 3A and the transport module 3T and the transport module 3T and the second processing module 3B are connected by a connecting member not shown in the figure in a manner that can be connected and disconnected. That is, the first processing module 3A, the transport module 3T and the second processing module 3B can be separated from each other by releasing the connecting member not shown in the figure. The first processing module 3A and the transport module 3T are examples of connected modules of the substrate processing device 1.

[0096] The first processing module 3A includes a first interface PS1, and the index plate portion 2 supplies the substrate W to the first interface PS1. The index plate portion 2 is an example of a substrate supply portion. The processing portion 3 has liquid processing units P1 to P18 that perform a prescribed process on a substrate W that is supplied to the first interface PS1 and is not processed. The prescribed process can include various processes such as fluid processing using a liquid or gas for processing, processing using electromagnetic waves such as ultraviolet rays, and physical cleaning processing (brushing, spray nozzle cleaning, etc.). The index plate portion 2 receives the substrate W that has been processed in the processing portion 3 from the first interface PS1.

[0097] The indexing plate section 2 includes a plurality of (here, four) stages ST1 to ST4 and an indexing plate robot 21. The stages ST1 to ST4 are substrate container holding sections that can respectively hold substrate containers 20 that accommodate a plurality of substrates in a stacked state. The substrate container 20 may be a FOUP (Front Opening Unified Pod) that accommodates substrates W in a sealed state, or may be a SMIF (Standard Mechanical InterFace) wafer box, an OC (Open Cassette), or the like. For example, when the substrate container 20 is placed on the stages ST1 to ST4, a plurality of substrates W in a horizontal posture in the substrate container 20 are stacked in a vertical direction with intervals therebetween.

[0098] The indexing plate robot 21 includes, for example, a base portion 22, a multi-joint arm 23, and two hands 24A and 24B spaced apart in the vertical direction. The base portion 22 is, for example, fixed to a frame of the outer shape of the predetermined indexing plate portion 2 of the substrate processing device 1. The multi-joint arm 23 is formed by rotatably combining a plurality of arms that can rotate along a horizontal plane with each other, and is configured to flex and extend by changing the angle between the arms at the joint portion of the arms, i.e., the joint portion. The base end portion of the multi-joint arm 23 is combined with the base portion 22 in a manner that allows rotation around a vertical axis. In addition, the multi-joint arm 23 is combined with the base portion 22 in a manner that allows lifting and lowering. In other words, a lifting drive mechanism for lifting and lowering the multi-joint arm 23 and a rotation drive mechanism for rotating the multi-joint arm 23 around a vertical axis are built into the base portion 22. In addition, the multi-joint arm 23 has individual rotation drive mechanisms for independently rotating each arm. Hands 24A and 24B are connected to the front end of the multi-joint arm 23 so that they can rotate around the vertical axis and move forward and backward in the horizontal direction. The multi-joint arm 23 includes a hand rotation drive mechanism for rotating the hands 24A and 24B around the vertical axis and a hand advance and retreat mechanism for moving the hands 24A and 24B forward and backward in the horizontal direction. The hands 24A and 24B are configured to hold a substrate W respectively.

[0099] The indexing robot 21 uses the hand 24A to carry out an unprocessed substrate W from the substrate container 20 held on one of the stages ST1 to ST4, and delivers it to the first delivery portion PS1 from the -X side (first direction side). In addition, the indexing robot 21 uses the hand 24B to receive a processed substrate W from the first delivery portion PS1, and stores it in the substrate container 20 held on one of the stages ST1 to ST4.

[0100] <Processing part 3>

[0101] The first processing module 3A of the processing section 3 has a first interface PS1 for temporarily holding the substrate W supplied from the index plate section 2 and liquid processing units P1 to P6 (first predetermined processing units) for performing predetermined processing on the substrate W. The first processing module 3A has a frame 3FA forming an outer frame corresponding to each side of a rectangular parallelepiped, and the first interface PS1 and the liquid processing units P1 to P6 are fixed to the frame 3FA. The frame 3FA is a component that defines the outer shape of the first processing module 3A.

[0102] The first interface PS1 is provided at the center of the frame 3FA of the first processing module 3A in the Y-axis direction. The first interface PS1 holds the substrate W brought in from the -X side by the indexing plate robot 21. The liquid processing units P1 to P3 are arranged on the +Y side of the first interface PS1, and the liquid processing units P4 to P6 are arranged on the -Y side of the first interface PS1. The liquid processing units P1 to P3 and the liquid processing units P4 to P6 are overlapped in sequence along the +Z direction, respectively, to form the processing towers TW1 and TW2.

[0103] The transport module 3T is disposed adjacent to the +X side (second direction side) of the first processing module 3A. A first transport robot CR1 (first transport device) is provided inside the transport module 3T. The first transport robot CR1 carries out a substrate W from the first interface PS1 to the +X side, and carries the substrate W from the +X side to one of the liquid processing units P1 to P6. In addition, the first transport robot CR1 carries out a substrate W processed in the liquid processing units P1 to P6, and carries the substrate W from the +X side to the first interface PS1.

[0104] The first delivery portion PS1 has a cylindrical transport chamber 31 in which the +Z side, -Z side, +Y side and -Y side are surrounded by a partition wall 30. A substrate holding portion 32 for holding the substrate W in a horizontal posture is provided inside the transport chamber 31. The substrate holding portion 32 holds the substrate W by supporting a support member 321, for example, the peripheral portion of the substrate W from below. The substrate holding portion 32 can also hold a plurality of substrates W arranged in the vertical direction at the same time by arranging a plurality of support members 321 at intervals in the vertical direction. In this case, the interval of the gap between the substrates W arranged up and down is set to a size that the hands 24A, 24B of the indexing plate robot 21 or the hands 44A, 44B of the first transport robot CR1 can enter the gap in the horizontal direction, for example, it can be set to a value greater than the thickness of the hands 24A, 24B, 44A, 44B (the width in the vertical direction when the substrate W is held in a horizontal posture).

[0105] The substrate holding portion 32 is disposed on the +X side relative to the center of the transport chamber 31 in the X-axis direction. That is, the support member 321 of the substrate holding portion 32 is disposed at a position closer to the first transport robot CR1 than the indexing plate robot 21. The indexing plate robot 21 has a multi-jointed arm 23, so that the substrate W can be moved in the horizontal direction to a greater extent than the first transport robot CR1. Therefore, the indexing plate robot 21 can move the substrate W into or out of the substrate holding portion 32 of the first interface PS1 from a position farther than the first transport robot CR1.

[0106] The second processing module 3B of the processing section 3 is disposed adjacent to the transport module 3T on the +X side (second direction side). The second processing module 3B includes a second interface PS2 for temporarily holding the substrate W brought in from the -X side (first direction side) by the first transport robot CR1, and liquid processing units P7 to P12 (second predetermined processing units) for performing predetermined processing on the substrate W. The second processing module 3B includes a frame 3FB forming an outer frame corresponding to each side of a rectangular parallelepiped, and the second interface PS2 and the liquid processing units P7 to P12 are fixed to the frame 3FB.

[0107] Liquid processing units P7 to P9 are disposed adjacent to the +Y side of the second interface PS2, and liquid processing units P10 to P12 are disposed adjacent to the -Y side of the second interface PS2. Liquid processing units P7 to P9 and liquid processing units P10 to P12 are stacked in sequence along the +Z direction to form treatment towers TW3 and TW4.

[0108] The second delivery portion PS2 has a transport chamber 35 formed by a cylindrical partition wall 34 including a +Z side, a -Z side, a +Y side, and a -Y side. The shape and size of the transport chamber 35 are substantially the same as those of the transport chamber 31. A reciprocating transport device 36 is provided in the transport chamber 35. The reciprocating transport device 36 holds the substrate W in a horizontal posture and reciprocates it along the X-axis. The reciprocating transport device 36 includes a track 37 extending in the X-axis direction, a reciprocating main body 38 guided and moved along the track 37; a moving motor 381 that reciprocates the reciprocating main body 38 in the X-axis direction; and two substrate holders 39, which are arranged on the upper surface of the reciprocating main body 38 and hold the substrate W in a horizontal posture. The two substrate holders 39 hold the substrate W at different heights in the Z-axis direction. In this way, the reciprocating transport device 36 can hold two substrates W at the same time and transport them in the X-axis direction.

[0109] In the second delivery section PS2, the substrate W is transported between the -X side position close to the first transport robot CR1 and the +X side position close to the second transport robot CR2 (second transport device) by the reciprocating transport device 36. Therefore, even when the horizontal movement amount of the substrate W by the transport robots CR1 and CR2 is smaller than that of the indexing plate robot 21, the substrate W can be delivered between the transport robots CR1 and CR2.

[0110] The third processing module 3C of the processing section 3 is arranged adjacent to the +X side (second direction side) of the second processing module 3B. The third processing module 3C includes a second transport robot CR2 and liquid processing units P13 to P18 (third predetermined processing units). The third processing module 3C includes a frame 3FC forming an outer frame corresponding to each side of a rectangular parallelepiped, and the second transport robot CR2 and the liquid processing units P13 to P18 are fixed to the frame 3FC.

[0111] The second transport robot CR2 is disposed at the center of the third processing module 3C in the Y-axis direction. The liquid processing units P13 to P15 are disposed on the +Y side of the second transport robot CR2, and the liquid processing units P16 to P18 are disposed on the -Y side of the second transport robot CR2. The liquid processing units P13 to P15 and the liquid processing units P16 to P18 are stacked in sequence in the +Z direction to form processing towers TW5 and TW6.

[0112] The first transport robot CR1 and the second transport robot CR2 have the same configuration. The configuration of the first transport robot CR1 will be described below. It is not essential that the transport robots CR1 and CR2 have the same configuration.

[0113] The first transport robot CR1 has a base 41, a horizontal drive 42, a vertical drive 43, and two hands 44A and 44B. A support 411 extending in the vertical direction is erected on the upper surface of the base 41. The base 41 of the first transport robot CR1 is installed on the transport module 3T. Here, the base 41 is provided on the plate-shaped first bottom plate FL1 provided in the transport module 3T. The first bottom plate FL1 is installed on the frame 3FT on the -Y side of the transport module 3T by means of bolts or the like. The frame 3FT has an outer frame corresponding to each side of the rectangular parallelepiped, and is a component that defines the outer shape of the transport module 3T. The first bottom plate FL1 is provided at a position where the treatment towers TW2 and TW4 are sandwiched, and is located on the -Y side compared to the first handover PS1. That is, the base 41 of the first transport robot CR1 is provided on the -Y side compared to the first handover PS1. The base portion 41 of the second transport robot CR2 is fixed to the third processing module 3C (specifically, the fourth bottom plate portion FL4 described later).

[0114] The horizontal driving unit 42 moves the hands 44A and 44B in the horizontal direction. The horizontal driving unit 42 includes a carrier 421, a horizontal sliding unit 422 that reciprocates in the horizontal direction, and a horizontal motor 423 that moves the horizontal sliding unit 422. A track (not shown) extending in a straight line is provided on the upper surface of the carrier 421, and the moving direction of the horizontal sliding unit 422 is limited by the track. The movement of the horizontal sliding unit 422 is achieved by a well-known mechanism such as a linear motor mechanism or a ball screw mechanism. Two hands 44A and 44B are provided at the front end of the horizontal sliding unit 422. Under the action of the horizontal motor 423, the horizontal sliding unit 422 moves along the track, so that the hands 44A and 44B can move forward and backward in the horizontal direction. In other words, the horizontal driving unit 42 moves the hands 44A and 44B in the horizontal direction away from and close to the base 41 and the support 411.

[0115] The horizontal drive unit 42 has a rotary motor 424 that rotates the stage 421 around a rotary axis CA1 along the vertical direction. The rotary motor 424 allows the hands 44A and 44B to rotate around the rotary axis CA1 within a range that does not interfere with the support column 411.

[0116] The vertical drive unit 43 includes a vertical sliding portion 431, a vertical motor 432 and a connecting member 433. The vertical sliding portion 431 is engaged with a track (not shown) extending in the vertical direction provided on the support 411. The vertical motor 432 causes the vertical sliding portion 431 to reciprocate in the vertical direction along the track. The vertical motor 432 is, for example, provided on the base portion 41. The movement of the vertical sliding portion 431 is achieved by a well-known mechanism such as a linear motor mechanism or a ball screw mechanism. The connecting member 433 connects the vertical sliding portion 431 and the carrier 421, and supports the carrier 421 from below. The vertical sliding portion 431 is moved by the vertical motor 432, thereby causing the carrier 421 to move in the vertical direction. Thus, the hands 44A and 44B can be lifted and lowered in the vertical direction.

[0117] In addition, it is not necessary for the horizontal drive unit 42 to move the hands 44A and 44B parallel to the horizontal direction, and the hands 44A and 44B may be moved in a direction that is a composite of the horizontal direction and the vertical direction. That is, "moving in the horizontal direction" means moving in a direction that includes a component in the horizontal direction. Similarly, it is not necessary for the vertical drive unit 43 to move the hands 44A and 44B parallel to the vertical direction, and the hands 44A and 44B may be moved in a direction that is a composite of the vertical direction and the horizontal direction. That is, "moving in the vertical direction" means moving in a direction that includes a component in the vertical direction.

[0118] Figure 5 1 is a schematic diagram of the interior of the liquid processing units P1 to P18 provided in the substrate processing apparatus 1 as viewed from the horizontal direction. Each of the liquid processing units P1 to P18 includes: a box-shaped processing chamber 50 having an internal space; a spin chuck 51 that holds a substrate W in a horizontal posture in the processing chamber 50 and rotates the substrate W around a vertical rotation axis X1 passing through the center of the substrate W; and a cylindrical processing cup 511 that surrounds the spin chuck 51 around the rotation axis X1 of the substrate W.

[0119] The processing chamber 50 is surrounded by a box-shaped partition wall 50a. An opening 50b for carrying substrates W into and out of the processing chamber 50 is formed on the partition wall 50a. The opening 50b is opened and closed by a gate 50c. The gate 50c is moved in a closed position (closed position) covering the opening 50b by a gate lifting mechanism (not shown). Figure 5 The opening position (indicated by a two-dot chain line in FIG. 1 ) and the opening position ( Figure 5 The solid line in the figure indicates the rise and fall between them.

[0120] When loading and unloading the substrate W, the transport robot CR1 or CR2 enters the processing chamber 50 through the opening 50 b with the hands 44A, 44B. This allows an unprocessed substrate W to be placed on the spin chuck 51 or a processed substrate W to be removed from the spin chuck 51 .

[0121] like Figure 5 As shown, the spin chuck 51 includes: a disk-shaped spin base 51a formed in a horizontal posture; a plurality of chuck pins 51b protruding upward from the outer peripheral portion of the upper surface of the spin base 51a; a chuck opening and closing mechanism that presses the plurality of chuck pins 51b against the peripheral portion of the substrate W; a rotation shaft 51c extending downward from the central portion of the spin base 51a; and a rotation motor 51d that rotates the rotation shaft 51c to rotate the substrate W held by the plurality of chuck pins 51b. The spin chuck 51 is not limited to Figure 5 The clamping chuck shown may also be a vacuum chuck that holds the substrate in a horizontal posture by adsorbing the lower surface of the substrate onto the upper surface of the spin base.

[0122] like Figure 5 As shown, the liquid processing units P1 to P18 include: a liquid nozzle 52 that ejects liquid toward the upper surface of the substrate W held by the spin chuck 51; a liquid tank 53 that stores the liquid supplied to the liquid nozzle 52; a liquid pipe 54 that guides the liquid in the liquid tank 53 to the liquid nozzle 52; a liquid feeding device 55 (e.g., a pump) that feeds the liquid in the liquid tank 53 to the liquid pipe 54; and a liquid valve 56 that opens and closes the inside of the liquid pipe 54. The liquid processing units P1 to P18 further include: a circulation pipe 57 that connects the liquid pipe 54 and the liquid tank 53 on the upstream side (the liquid tank 53 side) of the liquid valve 56; a circulation valve 58 that opens and closes the inside of the circulation pipe 57; and a temperature adjustment device 59 that adjusts the temperature of the liquid flowing in the circulation pipe 57.

[0123] The opening and closing of the liquid medicine valve 56 and the circulation valve 58 are controlled by the control unit 7 (see Figure 6) control. When the liquid medicine in the liquid medicine tank 53 is supplied to the liquid medicine nozzle 52, the liquid medicine valve 56 is opened and the circulation valve 58 is closed. In this state, the liquid medicine transported from the liquid medicine tank 53 to the liquid medicine piping 54 by the liquid feeding device 55 is supplied to the liquid medicine nozzle 52. On the other hand, when the supply of liquid medicine to the liquid medicine nozzle 52 is stopped, the liquid medicine valve 56 is closed and the circulation valve 58 is opened. In this state, the liquid medicine transported from the liquid medicine tank 53 to the liquid medicine piping 54 by the liquid feeding device 55 is returned to the liquid medicine tank 53 via the circulation piping 57. Therefore, in the supply stop situation where the supply of liquid medicine to the liquid medicine nozzle 52 is stopped, the liquid medicine continues to circulate in the circulation path formed by the liquid medicine tank 53, the liquid medicine piping 54 and the circulation piping 57. The temperature regulating device 59 regulates the temperature of the liquid medicine flowing in the circulation piping 57. Therefore, when the supply of liquid medicine in the liquid medicine tank 53 is stopped, it is heated in the circulation path and maintained at a temperature higher than the room temperature.

[0124] The opening of the liquid medicine valve 56 can be adjusted so that a small amount of liquid medicine can be sprayed from the liquid medicine nozzle 52 for preliminary spraying. A liquid medicine recovery unit (not shown) is arranged near the liquid medicine nozzle 52 to recover the liquid medicine sprayed preliminarily from the liquid medicine nozzle 52.

[0125] In addition, if Figure 5 As shown, the liquid processing units P1 to P18 include: a rinse liquid nozzle 60 that sprays a rinse liquid toward the upper surface of the substrate W held on the spin chuck 51; a rinse liquid pipe 61 that supplies the rinse liquid from the rinse liquid supply source (not shown) to the rinse liquid nozzle 60; and a rinse liquid valve 62 that switches the supply and stop of the rinse liquid from the rinse liquid pipe 61 to the rinse liquid nozzle 60. DIW (Deionized Water) or the like is used as the rinse liquid. After the chemical liquid is supplied to the substrate W through the chemical liquid nozzle 52, the rinse liquid is supplied to the substrate W from the rinse liquid nozzle 60, so that the chemical liquid attached to the substrate W can be rinsed.

[0126] In addition, the liquid processing units P1 to P18 include: a cleaning liquid nozzle 64 for spraying cleaning liquid toward a predetermined portion (e.g., a spin base 51a) inside the processing chamber 50; a cleaning liquid piping 65 for supplying cleaning liquid from a cleaning liquid supply source (not shown) to the cleaning liquid nozzle 64; and a cleaning liquid valve 66 for switching the supply and stop of cleaning liquid from the cleaning liquid piping 65 to the cleaning liquid nozzle 64. DIW or the like is used as the cleaning liquid. The cleaning liquid nozzle 64 is installed on the inner wall of the processing chamber 50. In a state where a dummy substrate (not shown, a cleaning jig) or a substrate W is held on a plurality of chuck pins 51b, the spin base 51a and the chuck pins 51b are rotated, and cleaning liquid is sprayed from the cleaning liquid nozzle 64. The cleaning liquid sprayed from the cleaning liquid nozzle 64 rebounds on the upper surface of the dummy substrate or the upper surface of the substrate W held on the chuck pins 51b, and the cleaning liquid is scattered into the processing chamber 50. By scattering the cleaning liquid in this manner, various components (chuck pins 51 b and processing cups 511 ) disposed in the processing chamber 50 can be cleaned.

[0127] The processing cup 511 is arranged to surround the rotating chuck 51, and is lifted and lowered in the vertical direction by the action of a motor (not shown). The upper part of the processing cup 511 is lifted and lowered between an upper position at which its upper end is located above the substrate W held by the chuck pin 51b and a lower position at which its upper end is located below the height of the substrate W. The processing liquid scattered from the upper surface of the substrate W to the outside is received by the inner side surface of the processing cup 511. The processing liquid received by the processing cup 511 is appropriately discharged to the outside of the processing chamber 50 through a drain port 513 provided at the bottom of the processing chamber 50 and on the inner side of the processing cup 511. In addition, an exhaust port 515 is provided on the side of the processing chamber 50. The ambient gas in the processing chamber 50 is appropriately discharged to the outside of the processing chamber 50 through the exhaust port 515.

[0128] Figure 6 1 is a block diagram showing the connection between each element of the substrate processing apparatus 1 and the control unit 7. The hardware configuration of the control unit 7 is the same as that of a general computer. That is, the control unit 7 includes a CPU 71 that performs various calculations, a ROM 72 that is a read-only memory that stores basic programs, a RAM 73 that is a read-write memory that stores various information, and a non-temporary storage unit 74 that stores control application programs or data. The CPU 71, ROM 72, RAM 73, and storage unit 74 are connected to each other using a bus wiring 75.

[0129] The control application or data may be provided to the control unit 7 in a state recorded in a non-temporary recording medium (semiconductor memory, optical medium, magnetic medium, etc.). In this case, a reading device that reads the control application or data from the recording medium may be connected to the bus wiring 75. In addition, the control application or data may be provided to the control unit 7 from a controller or the like via a network. In this case, a communication unit that performs network communication with an external device may be connected to the bus wiring 75.

[0130] An input unit 76 and a display unit 77 are connected to the bus wiring 75. The input unit 76 includes various input devices such as a keyboard and a mouse. The operator inputs various information to the control unit 7 via the input unit 76. The display unit 77 is composed of a display device such as a liquid crystal monitor to display various information.

[0131] The control unit 7 is connected to the operating parts of the liquid processing units P1 to P18 (valves 56, 58, 62, 66, gate 50c and rotating motor 51d, etc.), the operating parts of the reciprocating conveying device 36 (moving motor 381, etc.), and the operating parts of the conveying robots CR1 and CR2 (horizontal motor 423, rotating motor 424 and vertical motor 432, etc.), and controls the operations of these components.

[0132] Figure 7 1 is a schematic top view for explaining the arrangement of pipes for supplying fluid to each of the liquid processing units P1 to P18. Figure 7 As shown, the processing section 3 is provided with a piping connection port group 81 (81A, 81B, 81C), a piping connection port group 82 (82A, 82B, 82C), a piping connection port group 83 (83A, 83C) and a piping connection port group 84 (84A, 84B, 84C) consisting of a plurality of connection ports. Specifically, the first processing module 3A is provided with piping connection port groups 81A, 82A, 84A, and the transport module 3T is provided with a piping connection port group 83A. In addition, the second processing module 3B is provided with piping connection port groups 81B, 82B, 84B, and the third processing module 3C is provided with piping connection port groups 81C, 82C, 83C, 84C.

[0133] Pipe connection port groups 81 to 84 are connected to pipes for fluids supplied from outside substrate processing apparatus 1. Pipe connection port groups 81 to 84 are connected to pipes connected to liquid processing units P1 to P18, respectively, so that processing liquids are supplied to liquid processing units P1 to P18.

[0134] A piping chamber 861A surrounded by a partition wall 851A is provided at the bottom of the frame 3FA of the first process module 3A. A piping chamber 86T surrounded by a partition wall 85T is provided at the bottom of the frame 3FT of the transfer module 3T. The partition walls 851A and 85T are attached to the frames 3FA and 3FT, respectively.

[0135] The piping chamber 861A is a rectangular parallelepiped extending along the X direction at the center of the Y-axis direction of the first processing module 3A, and is arranged below the first intersection PS1 of the first processing module 3A. The piping chamber 86T is arranged on the +Y side of the transport module 3T, and the top of the piping chamber 86T is covered by the plate-shaped second bottom plate portion FL2. The second bottom plate portion FL2 is mounted on the frame 3FT by means of bolts or the like. The second bottom plate portion FL2 is arranged adjacent to the +Y side (third direction side) of the first bottom plate portion FL1. The second bottom plate portion FL2 extends along the Y-axis direction from the +Y side end of the first bottom plate portion FL1 to the +Y side end of the frame 3FT. According to the above manner, the base portion 41 of the first transport robot CR1 is arranged on the first bottom plate portion FL1. That is, the inner side of the frame 3FT is an example of a loading space for the first transport robot CR1 (first transport device) to be loaded.

[0136] The upper surface FL2S of the second bottom plate FL2 is located at a lower position than the upper surface FL1S of the first bottom plate FL1. In this case, when the first transport robot CR1 is provided on the upper surface FL1S, the lower end of the first transport robot CR1 can be arranged at a position lower than the upper surface FL2S. Therefore, the first transport robot CR1 can also transport the substrate W to the processing unit (for example, the liquid processing unit P1, P4) arranged at a lower position.

[0137] The transport module 3T has a maintenance room 302T surrounded by a partition wall 301T. The partition wall 301T is mounted on the frame 3FT. The maintenance room 302T is in the shape of a rectangular parallelepiped and is disposed between the processing tower TW1 of the first processing module 3A and the processing tower TW3 of the second processing module 3B. In addition, the processing tower TW1 is disposed between the transport chamber 31 of the first interface PS1 and the transport chamber 35 of the second interface PS2. An entrance and exit portion 303T is provided on the +Y side of the partition wall 301T of the maintenance room 302T. The entrance and exit portion 303T is disposed on the +Y side (the third direction side) of the second bottom plate portion FL2. The maintenance room 302T has an opening that connects the inner side of the maintenance room 302T with the outside of the maintenance room 302T (frame 3FT), and the opening has a size that allows a person to pass to the inside. A door 304T that opens and closes the entrance and exit portion 303T is provided on the +Y side of the partition wall 301T. The lower end of the opening of the entrance / exit portion 303T and the upper surface FL2S of the second bottom plate portion FL2 are set at, for example, substantially the same height.

[0138] The operator manually opens the door 304T and passes through the inner side of the entrance and exit portion 303T to enter the maintenance room 302T. In addition, the operator can approach the first transport robot CR1 by stepping on the upper surface FL2S of the second bottom plate portion FL2 and moving in the -Y direction, so that the first transport robot CR1 can be maintained. In addition, the upper part of the piping chamber 86T is covered by the second bottom plate portion FL2, so the operator can approach the first transport robot CR1 without stepping on the piping connection port group 83A provided in the piping chamber 86T and the piping 831A (supply piping) connected thereto.

[0139] An opening corresponding to the transport port on the -X side of the transport chamber 35 of the second interface PS2 is formed at the center of the Y-axis direction on the +X side of the maintenance chamber 302T. The first transport robot CR1 carries the substrate W into the second interface PS2 of the second processing module 3B through the opening, and carries the substrate W out of the second interface PS2. In addition, there is no partition wall 301T on the upper side of the -X side of the maintenance chamber 302T compared to the second bottom plate FL2 and the first bottom plate FL1, and the inside of the maintenance chamber 302T is connected to the internal space of the first processing module 3A. In this way, since there is no partition wall 301T, the first transport robot CR1 can transport the substrate W to each liquid processing unit P1 to P6 in the processing towers TW1 and TW2.

[0140] The transport chamber 31 of the first delivery section PS1 and the transport chamber 35 of the second delivery section PS2 are open to the maintenance chamber 302T, so the operator can directly maintain the equipment in the second processing module 3B such as the shuttle device 36 from the maintenance chamber 302T. In addition, the operator can also carry out the detachable equipment such as the shuttle device 36 to the outside of the substrate processing apparatus 1 through the maintenance chamber 302T. In addition, the operator can also check the internal conditions of the processing towers TW1 to TW4 of the first processing module 3A and the second processing module 3B through the opening.

[0141] Pipe connection port groups 81A and 82A are provided inside the piping chamber 861A of the first process module 3A. The piping connection port group 81A is provided near the center of the piping chamber 861A in the X-axis direction, and the piping connection port group 82A is provided on the +X side of the piping connection port group 81A.

[0142] A piping connection port group 83A is provided inside the piping chamber 86T of the transport module 3T. The piping connection port group 83A is provided closer to the +Y side than the center of the piping chamber 86T. Here, the piping connection port group 83A is provided below the second bottom plate FL2, and the top of the piping connection port group 83A is covered by the second bottom plate FL2.

[0143] The pipe connection port groups 81A, 82A, and 83A are respectively a collection of a plurality of independent pipe connection ports. Each pipe connection port has a structure capable of connecting one end of a pipe connected to each liquid processing unit P1 to P18. The pipe connection port groups 81A, 82A, and 83A are respectively connected to the supply sources of the first processing liquid, the second processing liquid, and the third processing liquid arranged outside the substrate processing device 1. The pipe connection port group 81A is connected to the supply source of the first processing liquid adjusted to a relatively low temperature, the pipe connection port group 82A is connected to the supply source of the second processing liquid adjusted to a relatively high temperature, and the pipe connection port group 83A is connected to the supply source of the third processing liquid.

[0144] The pipe connection port groups 81A, 82A, and 83A are connected to at least two pipes 811A, 821A, and 831A, respectively. The pipes 811A and 821A connected to the pipe connection port groups 81A and 82A, respectively, are arranged in the pipe chamber 861A, and the pipe 831A connected to the pipe connection port group 83A is arranged across the pipe chambers 86T and 861A. That is, the pipe 831A is an example of a supply pipe arranged across the transport module 3T and the first processing module 3A.

[0145] A piping chamber 862A surrounded by a partition wall 852A is provided on the +Y side and the -Y side of the first processing module 3A. The two piping chambers 862A are provided adjacent to the -X sides of the processing towers TW1 and TW2, and a piping chamber 861A is provided between the two piping chambers 862A.

[0146] The pipe chamber 862A is a rectangular parallelepiped extending in the vertical direction, and pipes 811A, 821A, and 831A are arranged inside (see Figure 2 , Figure 4 , Figure 7 ) Openings through which the pipes 811A, 821A, and 831A are inserted are provided at the lower portion of the pipe chamber 862A on the +Y side and at the +Y side portion of the pipe chamber 861A.

[0147] The front end side of the piping 811A passes through the piping chamber 861A and extends to the piping chamber 862A on the +Y side or the -Y side, and extends vertically upward in the piping chamber 862A. In addition, the front end side of the piping 811A changes direction downward at the upper part of the piping chamber 862A and extends vertically downward, and passes through the piping chamber 861A again. And, the front end of the piping 811A is connected to one of the piping connection port groups 81A in the piping chamber 861A. In this way, the piping connection port group 81A includes, in addition to the connection port for supplying the first processing liquid toward the inside of the substrate processing device 1, a circulation piping (for example, a connection port for supplying the first processing liquid supplied to the substrate processing device 1 to an external supply source) Figure 5 The same is true for the pipe connection port groups 81B and 81C.

[0148] Similar to the piping 811A, the front end side of the piping 821A extends through the piping chamber 861A to the piping chamber 862A on the +Y side or the -Y side, and extends vertically upward in the piping chamber 862A. In addition, the front end side of the piping 821A changes direction downward at the upper part of the piping chamber 862A and extends vertically downward, and passes through the piping chamber 861A again. Then, the front end of the piping 821A is connected to the piping connection port group 82A in the piping chamber 861A. In this way, the piping connection port group 82A includes, in addition to the connection port for supplying the second processing liquid toward the inside of the substrate processing device 1, a circulation piping (for example, a connection port) that returns the second processing liquid supplied to the substrate processing device 1 to an external supply source. Figure 5 The same is true for the pipe connection port groups 82B and 82C.

[0149] The front end side of the pipe 831A passes through the pipe chambers 86T and 861A in sequence and extends to the pipe chamber 862A on the +Y side or the -Y side, and extends vertically upward in the pipe chamber 862A (see Figure 2 , Figure 4 ). Each portion of the pipes 811A, 821A, and 831A extending upward in the pipe chamber 862A is connected to the pipes extending toward the liquid processing units P1 to P3 or P4 to P6 (see Figure 2 , Figure 4 ). Thus, the first to third processing liquids are supplied from the pipes 811A, 821A, and 831A to the nozzles of the liquid processing units P1 to P6.

[0150] A piping connection port group 84A is provided inside the piping chamber 861A of the first processing module 3A. The piping connection port group 84A includes two connection ports, one of which is provided between the processing tower TW1 and the piping connection port group 81A, and the other of which is provided between the processing tower TW2 and the piping connection port group 81A. Each connection port of the piping connection port group 84A is connected to a supply source of the fourth processing liquid arranged outside the substrate processing apparatus 1. The piping connection port group 84A is connected to the piping 841A toward the liquid processing units P1 to P3 or P4 to P6. Thus, the fourth processing liquid is supplied from the piping 841A to each of the liquid processing units P1 to P6.

[0151] The front end side of the pipe 831A extends from the pipe connection port group 83A to the -Y side, and the extending direction is converted to the -X direction at the center of the Y-axis direction of the transport module 3T. Then, the front end side of the pipe 831A passes through the pipe chamber 86T and is arranged inside from the outside of the +X side of the pipe chamber 861A of the first processing module 3A. The portion of the pipe 831A that spans the pipe chamber 86T and the pipe chamber 861A is inserted into the inner side of the cylindrical bellows component 91. The bellows component 91 is formed into a cylindrical ring that can be telescopically deformed along the central axis extending in the X-axis direction. The -X side opening of the bellows component 91 is connected to the next wall 851A of the pipe chamber 861A (the first pipe chamber) by bolts, etc., and the +X side opening of the bellows component 91 is connected to the next wall 85T of the pipe chamber 86T (the second pipe chamber) by bolts, etc. The openings at both ends of the bellows member 91 are preferably connected to the partition walls 851A and 85T using, for example, a sealing member, etc. Thus, the bellows member 91 is mounted in a state where the inside is sealed.

[0152] In this case, the portion of the pipe 831A provided at the connection portion between the first processing module 3A and the transport module 3T can be surrounded by the bellows member 91. Thus, the connection portion between the first processing module 3A and the transport module 3T can be used to reduce leakage of the atmosphere of the processing liquid flowing in the pipe 831A to the outside of the substrate processing apparatus 1.

[0153] <Arrangement of Pipes in Process Modules 3B and 3C>

[0154] like Figure 7 As shown, a piping chamber 861B surrounded by a partition wall 851B is provided at the lower part of the center in the Y-axis direction of the second processing module 3B. The piping chamber 861B is arranged between the processing towers TW3 and TW4. A piping chamber 861C surrounded by a partition wall 851C is provided at the lower part of the center in the Y-axis direction of the third processing module 3C. The piping chamber 861C is arranged between the processing towers TW5 and TW6.

[0155] A cylindrical bellows member 91 is provided between the piping chamber 861B and the piping chamber 861C. The -X side opening of the bellows member 91 is connected to the partition wall 851B on the +X side of the piping chamber 861B, and the +X side opening of the bellows member 91 is connected to the partition wall 851C on the -X side of the piping chamber 861C.

[0156] The top of the piping chamber 861C is covered by the third bottom plate FL3. The partition wall 851C on the +Y side of the piping chamber 861C is formed with a rectangular recessed portion that is recessed toward the -Y side. The top of the recessed portion is covered by the fourth bottom plate FL4, and the base 41 of the second transport robot CR2 is set on the upper surface FL4S of the fourth bottom plate FL4. That is, the partition wall 851C of the piping chamber 861C is set in a manner that surrounds the +X side, -X side, and -Y side of the base 41.

[0157] The third processing module 3C has a maintenance room 302C surrounded by a partition wall 301C. The maintenance room 302C is a rectangular parallelepiped and is arranged adjacent to the +X side of the processing towers TW5 and TW6. An entrance and exit part 303C communicating with the inner side of the maintenance room 302C is provided at the center of the +X side part of the partition wall 301C of the maintenance room 302C in the Y-axis direction. In addition, a door 304C for opening and closing the entrance and exit part 303C is provided at the +X side part of the partition wall 301C.

[0158] The top of the piping chamber 862C is covered by the plate-shaped fifth bottom plate FL5. That is, the maintenance chamber 302C is divided into upper and lower parts by the fifth bottom plate FL5. The upper surface FL5S of the fifth bottom plate FL5 is set below the upper end of the entrance and exit part 303C, and is set at the same height as the lower end of the entrance and exit part 303C. In addition, the upper surface FL5S of the fifth bottom plate FL5 is set at the same height as the upper surface FL3S of the third bottom plate FL3.

[0159] The operator can enter the maintenance room 302C by manually opening the door 304C and passing through the inner side of the entrance 303C. In addition, the operator can approach the second transport robot CR2 by stepping on the upper surfaces FL5S and FL3S of the fifth bottom plate FL5 and the third bottom plate FL3 and moving along the -X direction inside the maintenance room 302C and between the processing towers TW5 and TW6. In this way, the operator can perform maintenance on the second transport robot CR2.

[0160] In addition, various electric components including the control unit 7 may be provided inside the maintenance room 302C. In this case, the space occupied by the substrate processing apparatus 1 can be reduced.

[0161] A pipe chamber 862C surrounded by a partition wall 852C is provided at the lower part of the maintenance chamber 302C of the third processing module 3C. An opening is provided at the center of the -X side of the pipe chamber 862C in the Y-axis direction and at the +X side end of the pipe chamber 861C so that the insides of the pipe chambers 861C and 862C communicate with each other. The pipes 811C and 821C are inserted into the inner side of the opening.

[0162] Two pipe chambers 863C surrounded by a partition wall 853C are provided on the +Y side and the -Y side of the third processing module 3C. One of the two pipe chambers 863C is provided on the +Y side of the liquid processing units P13 to P15, and the other is provided on the +Y side of the liquid processing units P14 to P18. A pipe chamber 861C is provided between the two pipe chambers 863C. Openings for inserting pipes 811C, 821C, and 831C to the inside are provided at the lower part of the pipe chamber 863C on the +Y side and at the +X side of the pipe chamber 861C.

[0163] Pipe connection port groups 81B and 82B are provided inside the pipe chamber 861B. At least two pipes 811B and 821B are connected to each of the pipe connection port groups 81B and 82B. The pipes 811B and 821B are provided in the pipe chamber 861B.

[0164] A piping chamber 862B surrounded by a partition wall 852B is provided on the +Y side and the -Y side of the second processing module 3B. The two piping chambers 862B are disposed adjacent to the -X sides of the processing towers TW3 and TW4, and a piping chamber 861B is disposed between the two piping chambers 862B.

[0165] The pipe chamber 862B is a rectangular parallelepiped extending in the vertical direction, and pipes 811B, 821B, and 831B are arranged inside (see Figure 2 , Figure 4 , Figure 7 Openings for inserting the pipes 811B, 821B, and 831B are provided at the lower portion of the pipe chamber 862B on the +Y side, the +Y side portion of the pipe chamber 861B, the lower portion of the pipe chamber 862B on the -Y side, and the -Y side portion of the pipe chamber 861B.

[0166] The front end side of the pipe 811B passes through the pipe chamber 861B and extends to the pipe chamber 862B on the +Y side or the -Y side, and extends vertically upward in the pipe chamber 862B (see Figure 7 ). In addition, the front end side of the pipe 811B changes direction downward at the upper part of the pipe chamber 862B and extends vertically downward, and then extends to the pipe chamber 861B again. In addition, the front end of the pipe 811B is connected to one of the pipe connection port group 81B in the pipe chamber 861B.

[0167] Similar to the piping 811B, the front end side of the piping 821B passes through the piping chamber 861B and extends to the piping chamber 862B on the +Y side or the -Y side (see Figure 7 ), extending vertically upward in the piping chamber 862B (refer to Figure 2 , Figure 4). In addition, the front end side of the piping 821B changes direction downward at the upper part of the piping chamber 862B and extends vertically downward, and then extends to the piping chamber 861B again. The front end of the piping 821B extending to the piping chamber 861B is connected to the piping connection port group 82B.

[0168] A pipe connection port group 83C is provided inside the pipe chamber 861C of the third processing module 3C. At least two pipes 831B for supplying the third processing liquid to the liquid processing units P7 to P12 of the processing towers TW3 and TW4 and a pipe 831C for supplying the processing liquid to the liquid processing units P13 to P18 of the processing towers TW5 and TW6 are connected to the pipe connection port group 83C.

[0169] The front end side of the pipe 831B extends in the -X direction and passes through the pipe chambers 861C and 861B to the pipe chamber 862B on the +Y side or the -Y side (see Figure 7 The front end of the pipe 831B extends vertically upward in the pipe chamber 862B (see Figure 2 , Figure 4 ).

[0170] A cylindrical bellows member 91 is connected between the +X side of the piping chamber 861B and the -X side of the piping chamber 861C. The portion of the piping 831B arranged across the piping chambers 861B and 861C is inserted into the inner side of the bellows member 91. The bellows member 91 is attached to each partition wall 851B and 851C using bolts or the like.

[0171] Each portion of the pipes 811B, 821B, and 831B extending upward in the pipe chamber 862B is connected to the pipes extending toward the liquid processing units P7 to P9 or P10 to P12 (see Figure 2 , Figure 4 ). Thus, the first to third processing liquids are supplied from the pipes 811B, 821B, and 831B to the nozzles of the liquid processing units P7 to P12.

[0172] Pipe connection port groups 81C and 82C are provided inside the pipe chamber 862C of the third processing module 3C. At least two pipes 811C and 821C for supplying the first and second processing liquids to the liquid processing units P13 to P18 of the processing towers TW5 and TW6 are connected to each of the pipe connection port groups 81C and 82C.

[0173] The front end side of the pipe 811C passes through the pipe chambers 862C and 861C in sequence and extends to the pipe chamber 863C on the +Y side or the -Y side, and extends vertically upward in the pipe chamber 863C. In addition, the front end side of the pipe 811C changes direction downward at the upper part of the pipe chamber 863C and extends vertically downward, and passes through the pipe chamber 861C again and extends to the pipe chamber 862C (see Figure 2 , Figure 4 Then, the front end of the pipe 811C is connected to any one of the pipe connection port groups 81C in the pipe chamber 862C.

[0174] Similar to the piping 811C, the front end side of the piping 821C passes through the piping chambers 862C and 861C to extend to the piping chamber 863C on the +Y side or the -Y side, and extends vertically upward in the piping chamber 863C. In addition, the front end side of the piping 821C changes direction downward at the upper part of the piping chamber 863C and extends vertically downward, and passes through the piping chamber 861C again to extend to the piping chamber 862C (see Figure 2 , Figure 4 Then, the front end of the pipe 821C is connected to the pipe connection port group 82C in the pipe chamber 862C.

[0175] The front end of the pipe 831C extends in the +X direction and passes through the pipe chamber 861C to the pipe chamber 862B on the +Y side or the -Y side. The front end of the pipe 831B extends vertically upward in the pipe chamber 862C (see Figure 2 , Figure 4 ).

[0176] Each portion of each pipe 811C, 821C, and 831C extending upward in the pipe chamber 863C is connected to the pipe extending toward the liquid processing units P13 to P15 or P16 to P18 (see Figure 2 , Figure 4 ). Thus, the first to third processing liquids are supplied from the pipes 811C, 821C, and 831C to the nozzles of the liquid processing units P13 to P18.

[0177] In the substrate processing device 1, the processing modules 3A, 3B, and 3C are respectively provided with a piping connection port group 81 (81A to 81C) for supplying the first processing liquid. Therefore, it is possible to suppress a large difference in the piping length between the piping 811A to 811C for supplying the first processing liquid to each processing unit. In addition, the distance from each connection port to the processing unit can be shortened. In this case, when the temperature of the first processing liquid is adjusted, for example, outside the substrate processing device 1, the temperature change when the first processing liquid passes through the piping 811A to 811C can be reduced. The same effect can also be obtained for the piping connection port group 82 (82A to 82C) for supplying the third processing liquid.

[0178] In addition, the supply source of the third processing liquid may also supply a plurality of mixed processing liquids near the nozzles provided in the liquid processing units P1 to P18. For example, the piping connection ports for independently supplying sulfuric acid and hydrogen peroxide may be provided in the piping connection port group 83 (83A, 83C) to supply each liquid to each liquid processing unit P1 to P18. Then, in each liquid processing unit P1 to P18, these liquids may be mixed before being supplied to the substrate W to generate SPM (sulfuric acid / hydrogen peroxide mixture).

[0179] A piping connection port group 84B is provided at the center of the X-axis direction in the piping chamber 861B. The piping connection port group 84B includes two connection ports, one of which is provided between the processing tower TW3 and the piping connection port group 81B, and the other connection port is provided between the processing tower TW4 and the piping connection port group 81B. In addition, a piping connection port group 84C is provided at a position on the -X side relative to the center of the X-axis direction in the piping chamber 861C. The piping connection port group 84C includes two connection ports, one of which is provided between the processing tower TW5 and the piping connection port group 83C, and the other connection port is provided between the processing tower TW6 and the piping connection port group 83C.

[0180] Each connection port of the pipe connection port group 84B and 84C is also connected to the supply source of the fourth processing liquid in the same manner as the pipe connection port group 84A. The pipe 841B connected to the liquid processing units P7 to P9 or P10 to P12 is connected to the pipe connection port group 84B, and the pipe 841C connected to the liquid processing units P13 to P15 or P16 to P18 is connected to the pipe connection port group 84C. Thus, the fourth processing liquid is supplied from the pipes 841B and 841C to the liquid processing units P7 to P18.

[0181] like Figure 2 and Figure 4 As shown, a pipe chamber 871A is provided below each of the liquid processing units P1 and P4 provided in the first processing module 3A. The two pipe chambers 871A are provided with a liquid discharge port 881A. The liquid discharge port 881A is connected to a liquid discharge pipe 882A connected to the liquid processing units P1 to P3 or P4 to P6. The liquid discharge pipe 882A is connected to the liquid discharge port 513 provided in each processing chamber 50 of the liquid processing units P1 to P6, and the processing liquid discharged from the liquid processing units P1 to P6 is discharged to the outside of the substrate processing apparatus 1 through the liquid discharge port 881A.

[0182] In addition, three exhaust ports 891A are provided in each of the two pipe chambers 871A. Exhaust pipes (not shown) connected to the liquid processing units P1 to P3 or P4 to P6 are provided in the exhaust ports 891A. Each exhaust pipe is connected to an exhaust port 515 provided in each processing chamber 50 of the liquid processing units P1 to P3 or P4 to P6, and the atmosphere exhausted from each liquid processing unit P1 to P6 is exhausted to the outside of the substrate processing apparatus 1 through the exhaust ports 891A.

[0183] like Figure 2 and Figure 4 As shown, in the processing modules 3B and 3C, similarly to the first processing module 3A, pipe chambers 871B and 871C are provided below the liquid processing units P7 and P10 and below the liquid processing units P13 and P16, respectively. Liquid discharge ports 881B and 881C are provided in the pipe chambers 871B and 871C, respectively, and the liquid discharge ports 881B and 881C are connected to liquid discharge pipes 882B and 882C, respectively. The liquid discharge pipes 882B and 882C are connected to the liquid processing units P7 to P9, P10 to P12, P13 to P15, or P16 to P18, respectively, and the processing liquid discharged from each liquid processing unit P7 to P18 is discharged to the outside of the substrate processing apparatus 1 through the liquid discharge ports 881B and 881C. In addition, exhaust ports 891B and 891C are provided in the pipe chambers 871B and 871C, respectively, and the exhaust ports 891B and 891C are connected to exhaust pipes (not shown). The exhaust pipes are connected to the liquid processing units P7 to P9, P10 to P12, P13 to P15, or P16 to P18, respectively, and the atmosphere exhausted from each liquid processing unit P7 to P18 is exhausted to the outside of the substrate processing apparatus 1 through the exhaust ports 891B and 891C.

[0184] When the processing modules 3A, 3B, 3C and the transport module 3T are used, it is easy to increase or reduce the number of processing towers (that is, the number of processing units). Figure 8 to Figure 10 In the following description, elements having the same functions as those of already described elements are denoted by the same reference numerals or reference numerals with alphabetical letters, and detailed description thereof may be omitted.

[0185] Figure 8 1 is a schematic plan view showing a substrate processing apparatus 1A having two processing towers. Figure 8The substrate processing apparatus 1A shown has one first processing module 3A and one transport module 3T. That is, compared with the substrate processing apparatus 1, the second and third processing modules 3B and 3C are omitted in the substrate processing apparatus 1A. Since the substrate processing apparatus 1A includes two processing towers TW1 and TW2, it includes a total of 6 liquid processing units P1 to P6. According to the above method, the supply of the first to fourth processing liquids to each liquid processing unit P1 to P6 can be carried out from the piping connection port group 81A, 81B, 81D provided in the first processing module 3A and 81C provided in the transport module 3T (refer to Figure 7 ) In this way, by simply omitting the processing modules 3B and 3C, it is possible to easily construct the substrate processing apparatus 1A with only two processing towers.

[0186] Fig. 9 FIG. 1 is a schematic top view showing a substrate processing apparatus 1B having four processing towers. Fig. 9 In the substrate processing apparatus 1B shown, the processing section 3 has two first processing modules 3A and two conveying modules 3T. More specifically, in the processing section 3, the first processing modules 3A and the conveying modules 3T are alternately connected toward the +X side. Hereinafter, the first processing module 3A adjacent to the +X side of the index plate section 2 and the conveying module 3T adjacent to the +X side of the first processing module 3A are set as the first group, and the first processing module 3A and the conveying module 3T adjacent to the +X side of the conveying module 3T of the first group are set as the second group.

[0187] The substrate holding unit 32 is provided in the transport chamber 31 of the first delivery interface PS1 of the first group, and the shuttle device 36 is provided in the transport chamber 31 of the second group. The shuttle device 36 moves linearly in the X-axis direction along a rail 37 provided in the transport chamber 31.

[0188] In the substrate processing apparatus 1B, the substrate W supplied from the indexing plate portion 2 to the first interface PS1 (substrate holding portion 32) of the first group is handed over to the shuttle device 36 of the first interface PS1 of the second group by the first transport robot CR1 of the first group. Then, the shuttle device 36 transports the substrate W to the +X side, so that the substrate W is close to the first transport robot CR1 of the second group. Thus, the first transport robot CR1 of the second group can receive the substrate W from the shuttle device 36 and carry it to one of the liquid processing units P1 to P6 of the second group. The substrate W that has been subjected to a predetermined process by the liquid processing units P1 to P6 is handed over to the shuttle device 36 of the first interface PS1 by the first transport robot CR1 of the second group, and is transported to the -X side by the shuttle device 36. Next, the first transport robot CR1 of the first group receives the processed substrate W and hands it over to the first interface PS1 of the first group. Thus, the processed substrate W returns to the indexing plate portion 2. Even when the number of processing towers is four, as shown in the substrate processing apparatus 1B, the substrate W can be supplied to the processing units of the respective processing towers.

[0189] Furthermore, by alternately connecting the first processing modules 3A and the transfer modules 3T each including the first transfer robot CR1 on the +X side of the index plate portion 2, additional processing towers can be easily installed.

[0190] Fig.10 1 is a schematic top view showing a substrate processing apparatus 1C. The substrate processing apparatus 1C is formed by further connecting the second and third processing modules 3B and 3C to the substrate processing apparatus 1B. In this way, by connecting the first processing module 3A and the transport module 3T, each of which is a plurality of units, respectively, and connecting the second and third processing modules 3B and 3C, it is possible to increase the processing unit.

[0191] Liquid processing units P1 to P18 are all as follows Figure 5 The processing of the substrate W using the processing liquid shown is not essential, and may be replaced by a processing unit that performs other predetermined processing. Fig.11 1 is a diagram showing a heat treatment unit HP1. The heat treatment unit HP1 is a device for performing heat treatment on a substrate W. The heat treatment unit HP1 includes a processing chamber 93 surrounded by a partition wall 92. An opening 94 for carrying a substrate W into and out of the processing chamber 93 is provided at a portion of a side wall of the processing chamber 93. In addition, the processing chamber 93 is provided with a gate 95 for opening and closing the opening 94. The gate 95 is moved in a closed position (closed position) to close the opening 94 by a gate lifting mechanism (not shown). Fig.11 The opening position (indicated by a two-dot chain line in FIG. 1 ) and the opening position ( Fig.11 The solid line in the figure indicates the rise and fall between them.

[0192] A stage 96 for supporting the substrate W in a horizontal posture is provided in the processing chamber 93. A heater 97 is provided inside the stage 96. The heater 97 includes a resistance wire and a power supply for applying a voltage to the resistance wire. Here, by providing a resistance wire of the heater 97 in the hollow stage 96 and applying a voltage to the resistance wire, radiant heat is radiated from the upper surface of the stage 96. The substrate W supported on the stage 96 is heated by the radiant heat. In addition, the scheme for heating the substrate W in the processing chamber 93 is not limited to the example shown in the figure. For example, a fan heater for ejecting hot air heated by a heat source may be provided inside the processing chamber 93, and the substrate W may be heated directly or indirectly by the hot air.

[0193] Fig.12 1D is a schematic plan view showing a substrate processing apparatus 1D. The substrate processing apparatus 1D includes a first processing module 3AH instead of the first processing module 3A. Figure 1 The first processing module 3AH is different from the substrate processing apparatus 1 shown. The first processing module 3AH is different from the first processing module 3A in that it has processing towers TW1a and TW2a instead of processing towers TW1 and TW2. The processing towers TW1a and TW2a are respectively composed of five heating processing units HP1 to HP5 and HP6 to HP10 stacked in the vertical direction. The heating processing units HP2 to HP10 have the same structure as the heating processing unit HP1.

[0194] The number of stacked heat treatment units HP1 can be set according to the vertical height of the substrate W that the first transport robot CR1 can transport. Here, the vertical height of the heat treatment unit HP1 is smaller than that of the liquid treatment unit P1. Therefore, the number of stacked heat treatment units HP1 to HP5 in the processing tower TW1a (5) is greater than the number of stacked liquid treatment units P1 to P3 in the processing tower TW1 (3).

[0195] Thus, by providing the first processing module 3AH, for example, a substrate W that has been subjected to liquid treatment in one of the liquid treatment units P7 to P18 of the processing modules 3B and 3C can be carried into one of the heating treatment units HP1 to HP10 of the first processing module 3AH and subjected to heat treatment. By this heat treatment, water and the like attached to the substrate W can be dispersed. Thus, in the substrate processing apparatus 1D, substrate treatment including a liquid treatment process and a heating process after the liquid treatment process can be performed on one substrate W.

[0196] <2. Modifications>

[0197] Although the embodiments have been described above, the present invention is not limited to the above contents and various modifications are possible.

[0198] For example, a turning device for turning over the upper and lower surfaces of the substrate W may be provided in the substrate processing apparatus 1. By turning over the substrate W using the turning device, the main surfaces on both sides of the substrate W can be processed in the substrate processing apparatus 1. Such a turning device may be provided, for example, at the upper portion of the first interface PS1 in the first processing module 3A, and the substrate W may be moved into or out of the turning device using the indexing plate robot IR or the first transport robot CR1.

[0199] For example, both or one of the first transport robot CR1 and the second transport robot CR2 may be a multi-joint robot. In the above embodiment, the number of stacked heat treatment units HP1 to HP5 in the processing tower TW1a is five, so the transport robot is configured with a vertical drive unit 43 that is easy to move in the vertical direction. However, if it is possible to transport substrates to the stacked processing towers, the base unit 41 is unnecessary by setting the transport robot to a multi-joint robot. As a result, in particular, the space of the maintenance room 302T in the transport module 3T can be expanded, so the operator's maintenance efficiency is further improved.

[0200] The present invention has been described, but the above description is illustrative in all aspects, and the present invention is not limited thereto. It should be considered that other modifications not illustrated are easily conceivable without departing from the scope of the invention. As long as the various structures described in the above embodiments and various modifications do not contradict each other, they can be appropriately combined or omitted.

Claims

1. A connection module provided in a substrate processing device for processing a substrate, wherein the connection module is characterized in that: a first processing module; and a transport module connected to the first processing module on the second direction side, The first processing module comprises: a first prescribed processing unit, which performs prescribed processing on the substrate; a first interface portion temporarily holding the substrate; a first frame which defines the outer shape of the first processing module and forms an outer frame corresponding to each side of the rectangular parallelepiped; The transport module comprises: a first transport device that carries out the substrate toward the second direction relative to the first interface and carries in the substrate from the second direction relative to the first predetermined processing unit; a second frame defining a loading space in which the first transport device is loaded and forming an outer frame corresponding to each side of the rectangular parallelepiped; The second frame and the first frame have the same length of sides in a third direction, and the third direction is a horizontal direction orthogonal to the second direction. The first processing module and the transport module are connected together in a state where the second frame and the end of the side in the third direction of the first frame are aligned. The first predetermined processing unit has a nozzle for supplying a fluid to the substrate. The connection module further includes a supply pipe arranged across the transfer module and the first processing module, and the supply pipe supplies the fluid to the nozzle.

2. The connection module according to claim 1, characterized in that: The first transport device comprises: a hand holding the substrate; and The vertical driving unit includes a vertical motor for moving the hand in a vertical direction.

3. The connection module according to claim 1, characterized in that: It also has a cylindrical bellows component inside which the supply pipe is inserted. The first processing module has a first piping chamber in which the supply piping is arranged. The transport module has a second pipe chamber in which the supply pipe is arranged. An opening portion at one end side of the bellows member is connected to the first pipe chamber, and an opening portion at the other end side is connected to the second pipe chamber.

4. The connection module according to claim 1, characterized in that: include: a first bottom plate portion, which is arranged inside the loading space and is provided with a base portion of the first transport device; a second bottom plate portion disposed inside the loading space and on the third direction side relative to the first bottom plate portion; and An entrance and exit portion connects the loading space on the second bottom plate portion with the outside of the second frame.

5. A connection module provided in a substrate processing device for processing a substrate, wherein the connection module is characterized in that: a first processing module; and a transport module connected to the first processing module on the second direction side, The first processing module comprises: a first prescribed processing unit, which performs prescribed processing on the substrate; a first interface that temporarily holds the substrate; and a first frame which is a component defining the outer shape of the first processing module and forms an outer frame corresponding to each side of the rectangular parallelepiped; The first interface and the first predetermined processing unit are fixed to the first frame. The transport module comprises: a first transport device that carries out the substrate toward the second direction relative to the first interface and carries in the substrate from the second direction relative to the first predetermined processing unit; a second frame which defines a loading space in which the first transport device is loaded and defines an outer shape of the transport module and forms an outer frame corresponding to each side of a rectangular parallelepiped; The second frame and the first frame have the same length of sides in a third direction, and the third direction is a horizontal direction orthogonal to the second direction. The first processing module and the transfer module are coupled together in a state where the second frame and the end portions of the sides of the first frame in the third direction are aligned.

6. The connection module according to claim 5, characterized in that: include: a first bottom plate portion, which is arranged inside the loading space and is provided with a base portion of the first transport device; a second bottom plate portion disposed inside the loading space and on the third direction side relative to the first bottom plate portion; and An entrance and exit portion connects the loading space on the second bottom plate portion with the outside of the second frame.

Images