Preparation method of display device, display device and electronic equipment

Abstract

The invention is applicable to the field of display panels, and provides a preparation method of a display device, the display device and electronic equipment, and the preparation method of the display device comprises the following steps: providing a substrate which is provided with a through hole penetrating through the substrate and a first surface; filling the through hole and arranging a fan-out wiring layer on the first surface, wherein the fan-out wiring layer is provided with a mounting surface far away from the substrate; and mounting a plurality of LED chips on the mounting surface, so that the electrodes of the LED chips are electrically connected with the conductive circuit in the fan-out wiring layer. According to the application, the fan-out wiring layer is arranged on the first surface of the substrate, then the LED chips are mounted on the mounting surface of the fan-out wiring layer, and the LED chips are located on the outermost side, so that when any LED chip fails, the failed LED chip can be quickly determined, and then repair or maintenance is carried out.

Description

Technical Field

[0001] The present application belongs to the technical field of display panels, and in particular, relates to a method for manufacturing a display device, a display device, and an electronic device. Background Art

[0002] LED display is a display screen that controls the display mode of semiconductor light emitting diodes to display various information such as text, graphics, images, animations, market conditions, videos and video signals.

[0003] LED displays currently on the market usually mount LED chips directly onto glass substrates, and then carry out subsequent processes, such as preparing RDL, etc. However, when an LED chip in an LED display produced in this way fails, it is impossible to quickly identify the failed LED chip, which is not conducive to subsequent maintenance and repair. Summary of the invention

[0004] The embodiment of the present application provides a method for preparing a display device, aiming to solve the problem that the existing display device cannot quickly identify the faulty LED chip, which is not conducive to subsequent maintenance and repair.

[0005] The embodiment of the present application is implemented by providing a method for preparing a display device, comprising:

[0006] Providing a substrate, the substrate having a through hole penetrating the substrate and a first surface;

[0007] filling the through hole and providing a fan-out wiring layer on the first surface, the fan-out wiring layer having a mounting surface away from the substrate;

[0008] A plurality of LED chips are mounted on a mounting surface so that electrodes of the LED chips are electrically connected to conductive lines in the fan-out wiring layer.

[0009] Further, the step of providing a fan-out wiring layer on the first surface includes:

[0010] M conductive circuit layers and N insulating layers are prepared on the first surface, and windows are opened on each insulating layer. The conductive circuit layers and the insulating layers are arranged at intervals, and two adjacent conductive circuit layers are electrically connected through the windows, wherein N is greater than or equal to 1, and M is greater than or equal to 1.

[0011] Further, the step of preparing M layers of conductive circuit layers on the first surface includes:

[0012] The through hole is filled to form a conductive column and a first conductive circuit layer is formed on the first surface. The first conductive circuit layer is the first layer of the M conductive circuit layers. The first conductive circuit layer and the conductive column in the through hole are manufactured in the same process.

[0013] Furthermore, the fan-out wiring layer is attached to the first surface and electrically connected to the first end of the conductive column.

[0014] Further, the substrate has a second surface opposite to the first surface;

[0015] A semiconductor element is mounted on the second surface so that an electrode of the semiconductor element is electrically connected to the second end of the conductive column.

[0016] Furthermore, the substrate is a glass substrate.

[0017] Furthermore, the aperture of the through hole ranges from 5 micrometers to 50 micrometers, and the distance between two adjacent through holes ranges from 5 micrometers to 50 micrometers.

[0018] In a second aspect, the present application also provides a display device, which is manufactured by adopting the manufacturing method of the display device as described above.

[0019] In a third aspect, the present application further provides a display device, comprising:

[0020] A substrate having a through hole and a first surface, wherein the through hole penetrates the substrate;

[0021] A fan-out wiring layer disposed on the first surface and partially filling the through hole, the fan-out wiring layer having a mounting surface away from the substrate; and

[0022] A plurality of LED chips mounted on a mounting surface.

[0023] The electrodes of the LED chip are electrically connected to the conductive lines in the fan-out wiring layer.

[0024] In a fourth aspect, the present application also provides an electronic device, which includes the display device as described above.

[0025] Beneficial effects of the present application: The manufacturing method of the display device provided by the present application includes providing a substrate, the substrate having a through hole penetrating the substrate and a first surface; filling the through hole and setting a fan-out wiring layer on the first surface, the fan-out wiring layer having a mounting surface away from the substrate; mounting a plurality of LED chips on the mounting surface so that the electrodes of the LED chips and the conductive lines in the fan-out wiring layer are electrically connected. The present application sets a fan-out wiring layer on the first surface of the substrate, and then mounts the LED chip on the mounting surface of the fan-out wiring layer, with the LED chip being located on the outermost side. When any LED chip fails, the failed LED chip can be quickly identified, and then repaired or maintained. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic flow chart of an embodiment of a method for preparing a display device provided in the present application;

[0027] Figure 2 is a schematic structural diagram of an embodiment of a display device provided by the present application;

[0028] Figure 3 is a structural schematic diagram of a manufacturing process of an embodiment of a display device provided in the present application;

[0029] Figure 4 is a structural schematic diagram of another embodiment of the display device provided by the present application;

[0030] Figure 5 is a structural schematic diagram of a manufacturing process of another embodiment of a display device provided in the present application;

[0031] Figure 6 It is a structural schematic diagram of removing the substrate during the preparation process of an embodiment of the display device provided in the present application.

[0032] Explanation of the reference numerals: 100 - substrate, 110 - through hole, 200 - fan-out wiring layer, 210 - first insulating layer, 220 - first conductive circuit layer, 230 - second insulating layer, 240 - second conductive circuit layer, 250 - third insulating layer, 260 - third conductive circuit layer, 270 - base conductive layer, 300 - LED chip, 400 - protective layer, 500 - semiconductor element. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of embodiments are shown in the accompanying drawings, in which the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application. In addition, it should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0034] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0038] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference values ​​and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0039] The manufacturing method of the display device provided by the present application includes providing a substrate, the substrate having a through hole penetrating the substrate and a first surface; filling the through hole and setting a fan-out wiring layer on the first surface, the fan-out wiring layer having a mounting surface away from the substrate; mounting a plurality of LED chips on the mounting surface so that the electrodes of the LED chips and the conductive lines in the fan-out wiring layer are electrically connected. The present application sets a fan-out wiring layer on the first surface of the substrate, and then mounts the LED chip on the mounting surface of the fan-out wiring layer, with the LED chip being located on the outermost side. When any LED chip fails, the failed LED chip can be quickly identified, and then repaired or maintained.

[0040] like Figures 1 to 6 As shown, one embodiment of the present application provides a method for preparing a display device, comprising:

[0041] S1100, providing a substrate, wherein the substrate has a through hole penetrating the substrate and a first surface;

[0042] The preparation method provided in the present application is used to prepare a display device, wherein the substrate 100 can be regarded as a carrier of the display device, used to carry circuits or various components. For example, the substrate 100 can be used to carry LED chips 300, ICs (integrated circuits, referred to as chips, wafers, etc.), resistors and inductors, etc., without limitation.

[0043] Optionally, the substrate 100 is a glass substrate 100 or a transparent plate.

[0044] The substrate 100 is provided with a through hole 110, and the through hole 110 penetrates the substrate 100. In other words, the two side surfaces of the substrate 100 can be regarded as the first surface and the second surface respectively, and the through hole 110 connects the first surface and the second surface. Figure 3 As shown in (a) and (b) in .

[0045] Optionally, the pore size range of the through hole 110 is 5 μm-50 μm, for example, the pore size range of the through hole 110 is 5 μm, 8 μm, 9 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm or any value between 5 μm and 50 μm, and the spacing range between two adjacent through holes 110 is 5 μm-50 μm, for example, the spacing range between two adjacent through holes 110 is 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 15 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm or any value between 5 μm and 50 μm.

[0046] S1200, filling the through hole and providing a fan-out wiring layer on the first surface, wherein the fan-out wiring layer has a mounting surface away from the substrate;

[0047] After providing the substrate 100, a fan-out wiring layer 200 is set on the first surface of the substrate 100. During implementation, the fan-out wiring layer 200 can be prepared by an RDL process. The RDL process refers to depositing a metal layer and a corresponding insulating layer on the surface of a target object (such as the substrate 100 of the present application), and forming metal wiring, re-layouting the line ports, and laying them out in a new and more spacious area to form a surface array arrangement.

[0048] In some possible embodiments, the step of providing the fan-out wiring layer 200 on the first surface includes:

[0049] M conductive circuit layers and N insulating layers are prepared on the first surface, and windows are opened on each insulating layer. The conductive circuit layers and the insulating layers are arranged at intervals, and two adjacent conductive circuit layers are electrically connected through the windows, wherein N is greater than or equal to 1, and M is greater than or equal to 1.

[0050] The spacing between the conductive circuit layer and the insulating layer means that an insulating layer is disposed between two conductive circuit layers, and similarly, a conductive circuit layer is disposed between two insulating layers.

[0051] It should be noted that the values ​​of N and M can be set according to actual usage requirements. For example, the values ​​of N and M can be 2, 3, 4, 5, 6, 7, 8, 9 or any value greater than or equal to 1, without limitation.

[0052] When preparing the fan-out wiring layer 200, the insulating layers are prepared layer by layer, and each time a layer of insulating layer is prepared, a layer of conductive circuit layer is prepared. Exemplarily, the steps of forming the fan-out wiring layer 200 include:

[0053] A first insulating layer 210 is formed on the first surface. Figure 3 As shown in (c), the insulating layer has insulating properties. For example, the insulating layer can be made of PI layer (Polyimide Film), PSPI (Photosensitive Polyimide) or other materials with insulating properties. For example, taking the PI layer as an example, the PI layer is a high-performance thin film material with excellent heat resistance, mechanical properties and electrical insulation properties.

[0054] In practice, the insulating layer can be made by coating or spraying an insulating material (such as the above-mentioned polyimide material). Of course, a finished insulating film can also be used, and the insulating layer is obtained by pasting the finished insulating film to the first surface.

[0055] Then, a window is opened on the first insulating layer 210, such as Figure 3As shown in (d) in FIG. 1 , the opening corresponds to the through hole 110 on the substrate 100 . The opening is filled with a conductive material to form a first metal column, which passes through the opening of the first insulating layer 210 and the through hole 110 of the substrate 100 .

[0056] Then, a first conductive circuit layer 220 is formed on the first insulating layer 210 , and the first conductive circuit layer 220 is electrically connected to the first metal pillar.

[0057] In some possible embodiments, the first metal pillar and the first conductive circuit layer 220 are generated simultaneously, that is, while the first conductive circuit layer 220 is prepared on the first insulating layer 210, the first metal pillar is filled into the opening to form the first metal pillar. Figure 3 As shown in (e) in .

[0058] Next, a second insulating layer 230 is formed on the first insulating layer 210, and then a window is opened on the second insulating layer 230. The window opening position is set according to the wiring requirements, such as Figure 3 As shown in (f) in .

[0059] After the window is opened, a conductive material is filled to form a second metal column, and one end of the second metal column is electrically connected to the first conductive circuit layer 220. Then, a second conductive circuit layer 240 is prepared on the second insulating layer 230, and the second conductive circuit layer 240 is electrically connected to the second end of the second metal column. Similarly, the second metal column and the second conductive circuit layer 240 can be generated at the same time, such as Figure 3 As shown in (g) in .

[0060] The fan-out wiring layer 200 is obtained by repeatedly performing the above steps to prepare multiple insulating layers and conductive circuit layers.

[0061] For example, a fourth insulating layer 250 is then formed on the second insulating layer 230, and then a window is opened on the fourth insulating layer 250, and the window position is set according to the routing requirements, and then a third conductive line layer 260 is prepared on the fourth insulating layer 250, and at the same time, a metal column is filled into the window of the fourth insulating layer 250 to form a metal column, such as Figure 3 The above steps are repeated until the desired number of layers is obtained.

[0062] The first conductive circuit layer 220 can also be regarded as the first layer of the M conductive circuit layers.

[0063] As a possible implementation manner, a conductive circuit layer may be prepared on the first surface first, and then an insulating layer may be prepared. Then, the step of preparing M layers of conductive circuit layers on the first surface includes:

[0064] Fill the through hole 110 to form a conductive column and form a base conductive layer 270 on the first surface. Figure 4 and Figure 5 As shown in (m), Figure 3 compared to, Figure 5 There is one more step (m). At this time, the base conductive layer 270 can be regarded as the first layer of the M conductive circuit layers, and the base conductive layer 270 starts from the substrate 100 .

[0065] Furthermore, the fan-out wiring layer 200 is attached to the first surface and electrically connected to the first end of the conductive pillar.

[0066] Exemplarily, the steps of forming the fan-out wiring layer 200 include:

[0067] A base conductive layer 270 is formed on the first surface, and at the same time, the through hole 110 is filled to form a conductive column, such as Figure 5 As shown in (m) in .

[0068] A first insulating layer 210 is formed on the first surface. Figure 5 Then, a window is opened on the first insulating layer 210, as shown in (c). Figure 5 As shown in (d) in .

[0069] Then, a first conductive circuit layer 220 is prepared on the first insulating layer 210, and the first metal pillar is filled into the opening at the same time. The first conductive circuit layer 220 can be formed by electroplating a metal layer and then etching the metal layer. When the first conductive circuit layer 220 is prepared, a first metal pillar is also generated in the opening of the first insulating layer 210. The first end of the first metal pillar is electrically connected to the first conductive circuit layer 220, and the second end of the first metal pillar is electrically connected to the base conductive layer 270. Figure 5 As shown in (e) in .

[0070] Next, a second insulating layer 230 is formed on the first insulating layer 210, and then a window is opened on the second insulating layer 230. The window opening position is set according to the wiring requirements, such as Figure 5 As shown in (f) in .

[0071] Then, a second conductive circuit layer 240 is prepared on the second insulating layer 230 and a second metal column is formed in the opening of the second insulating layer 230. The second conductive circuit layer 240 is electrically connected to the first conductive circuit layer 220 through the second metal column. Figure 5 As shown in (g) in .

[0072] Then, a third insulating layer 250 is prepared on the second insulating layer 230 , and a window is opened on the third insulating layer 250 , and a third conductive circuit layer 260 is further prepared. The third conductive circuit layer 260 is electrically connected to the second conductive circuit layer 240 .

[0073] The fan-out wiring layer 200 is obtained by repeatedly performing the above steps to prepare multiple insulating layers and conductive circuit layers.

[0074] S1300, mounting a plurality of LED chips on a mounting surface so that electrodes of the LED chips are electrically connected to conductive circuits in a fan-out wiring layer.

[0075] After the fan-out wiring layer 200 is prepared, the LED chip 300 is further mounted on the mounting surface of the fan-out wiring layer 200. Figure 3 and Figure 5 As shown in (i), the electrodes of the LED chip 300 are electrically connected to the conductive circuits in the fan-out wiring layer 200. In subsequent use, the conductive circuits in the fan-out wiring layer 200 can also be used to electrically connect to a PCB (Printed Circuit Board), a semiconductor component 500 (such as a chip) or other electronic modules to drive the LED chip 300 to work through the PCB, the semiconductor component 500 or other electronic modules, which will not be described in detail.

[0076] Optionally, after a window is opened in the last insulating layer, a soldering pad is made at the window of the last insulating layer to directly mount the LED chip 300 on the soldering pad, thereby simplifying the mounting and soldering process of the LED chip 300 and improving production efficiency.

[0077] The manufacturing method of the display device provided in the present application includes providing a substrate 100, the substrate 100 having a through hole 110 penetrating the substrate 100 and a first surface; filling the through hole 110 and arranging a fan-out wiring layer 200 on the first surface, the fan-out wiring layer 200 having a mounting surface away from the substrate 100; mounting a plurality of LED chips 300 on the mounting surface so that the electrodes of the LED chips 300 are electrically connected to the conductive lines in the fan-out wiring layer 200. The present application arranges the fan-out wiring layer 200 on the first surface of the substrate 100, and then mounts the LED chip 300 on the mounting surface of the fan-out wiring layer 200, with the LED chip 300 being located at the outermost side. When any LED chip 300 fails, the failed LED chip 300 can be quickly identified, and then repaired or maintained.

[0078] Optionally, after the step of mounting the LED chip 300 on the mounting surface, the method for preparing the display device provided by the present application further includes:

[0079] A protective layer 400 is prepared on the mounting surface to wrap the LED chip 300, such as Figure 3 and Figure 5 As shown in (j) in FIG. 4 , the protective layer 400 is a transparent shell that transmits light while protecting the LED chip 300 .

[0080] Optionally, the protection layer 400 may be made of PSPI, transparent plastic, glass or other inorganic and organic light-transmitting materials.

[0081] In some optional embodiments, the substrate 100 has a second surface opposite to the first surface;

[0082] The semiconductor element 500 is mounted on the second surface so that the electrode of the semiconductor element 500 is electrically connected to the second end of the conductive column. Figure 3 and Figure 5 As shown in (k) in .

[0083] The two side surfaces of the substrate 100 are respectively the first surface and the second surface. When preparing the first conductive circuit layer in the fan-out wiring layer 200, a conductive column is simultaneously generated in the through hole 110 of the substrate 100, and the first end of the conductive column is electrically connected to the first conductive circuit layer.

[0084] Semiconductor element 500 refers to an electronic device with conductivity between good conductors and insulators, which uses the special electrical properties of semiconductor materials to complete specific functions. Semiconductor element 500 can be used to generate, control, receive, transform, amplify signals and perform energy conversion. For example, semiconductor element 500 can be an LED driver chip.

[0085] When the semiconductor element 500 is mounted on the second surface, the electrode of the semiconductor element 500 is electrically connected to the second end of the conductive column, thereby achieving electrical connection between the semiconductor element 500 and the LED chip 300, so as to drive the LED chip 300 to work through the semiconductor element 500.

[0086] In some possible embodiments, before mounting the semiconductor element 500, the substrate 100 may be removed, and then the semiconductor element 500 may be mounted on the fan-out wiring layer 200. Figure 6 Through the above arrangement, the electrodes of the semiconductor element 500 can be electrically connected to the circuits in the fan-out wiring layer 200, thereby reducing hardware investment and production costs.

[0087] In some embodiments, the present application also provides a display device, which is manufactured by adopting the manufacturing method of the display device as described above.

[0088] The manufacturing method of the display device provided in the present application includes providing a substrate 100, the substrate 100 having a through hole 110 penetrating the substrate 100 and a first surface; filling the through hole 110 and arranging a fan-out wiring layer 200 on the first surface, the fan-out wiring layer 200 having a mounting surface away from the substrate 100; mounting a plurality of LED chips 300 on the mounting surface so that the electrodes of the LED chips 300 are electrically connected to the conductive lines in the fan-out wiring layer 200. The present application arranges the fan-out wiring layer 200 on the first surface of the substrate 100, and then mounts the LED chip 300 on the mounting surface of the fan-out wiring layer 200, with the LED chip 300 being located at the outermost side. When any LED chip 300 fails, the failed LED chip 300 can be quickly identified, and then repaired or maintained.

[0089] In some embodiments, the present application further provides a display device, including:

[0090] A substrate 100, the substrate 100 has a through hole 110 and a first surface, and the through hole 110 penetrates the substrate 100;

[0091] A fan-out wiring layer 200 disposed on the first surface and partially filling the through hole 110 , the fan-out wiring layer 200 having a mounting surface away from the substrate 100 ; and

[0092] A plurality of LED chips 300 are mounted on the mounting surface.

[0093] The electrodes of the LED chip 300 are electrically connected to the conductive lines in the fan-out wiring layer 200 .

[0094] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the structure and implementation principle of the display device described above can refer to the corresponding structure and implementation principle in the aforementioned embodiments, and will not be repeated here.

[0095] The manufacturing method of the display device provided in the present application includes providing a substrate 100, the substrate 100 having a through hole 110 penetrating the substrate 100 and a first surface; filling the through hole 110 and arranging a fan-out wiring layer 200 on the first surface, the fan-out wiring layer 200 having a mounting surface away from the substrate 100; mounting a plurality of LED chips 300 on the mounting surface so that the electrodes of the LED chips 300 are electrically connected to the conductive lines in the fan-out wiring layer 200. The present application arranges the fan-out wiring layer 200 on the first surface of the substrate 100, and then mounts the LED chip 300 on the mounting surface of the fan-out wiring layer 200, with the LED chip 300 being located at the outermost side. When any LED chip 300 fails, the failed LED chip 300 can be quickly identified, and then repaired or maintained.

[0096] In some optional embodiments, the present application also provides an electronic device, which includes the display device as described above.

[0097] During implementation, electronic equipment includes but is not limited to communication equipment, smart devices, power supplies, or related devices such as automotive electrical equipment, medical equipment, and household appliances, without specific limitation.

[0098] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the structure and implementation principle of the electronic device described above can refer to the corresponding structure and implementation principle in the aforementioned embodiments, and will not be repeated here.

[0099] The manufacturing method of the display device provided in the present application includes providing a substrate 100, the substrate 100 having a through hole 110 penetrating the substrate 100 and a first surface; filling the through hole 110 and arranging a fan-out wiring layer 200 on the first surface, the fan-out wiring layer 200 having a mounting surface away from the substrate 100; mounting a plurality of LED chips 300 on the mounting surface so that the electrodes of the LED chips 300 are electrically connected to the conductive lines in the fan-out wiring layer 200. The present application arranges the fan-out wiring layer 200 on the first surface of the substrate 100, and then mounts the LED chip 300 on the mounting surface of the fan-out wiring layer 200, with the LED chip 300 being located at the outermost side. When any LED chip 300 fails, the failed LED chip 300 can be quickly identified, and then repaired or maintained.

[0100] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for preparing a display device, characterized in that: include: Providing a substrate, the substrate having a through hole penetrating the substrate and a first surface; filling the through hole and providing a fan-out wiring layer on the first surface, the fan-out wiring layer having a mounting surface away from the substrate; A plurality of LED chips are mounted on the mounting surface so that electrodes of the LED chips are electrically connected to the conductive lines in the fan-out wiring layer.

2. The method for preparing a display device according to claim 1, wherein: The step of providing a fan-out wiring layer on the first surface comprises: M layers of conductive circuit layers and N layers of insulating layers are prepared on the first surface, and windows are opened on each of the insulating layers. The conductive circuit layers and the insulating layers are arranged at intervals, and two adjacent conductive circuit layers are electrically connected through the windows, wherein N is greater than or equal to 1, and M is greater than or equal to 1.

3. The method for preparing a display device according to claim 2, wherein: The step of preparing M layers of conductive circuit layers on the first surface comprises: The through hole is filled to form a conductive column and a first conductive circuit layer is formed on the first surface. The first conductive circuit layer is the first layer of the M conductive circuit layers. The first conductive circuit layer and the conductive column in the through hole are made in the same process.

4. The method for preparing a display device according to claim 3, characterized in that: The fan-out wiring layer is attached to the first surface and electrically connected to the first end of the conductive column.

5. The method for preparing a display device according to claim 4, characterized in that: The substrate has a second surface opposite to the first surface; A semiconductor element is mounted on the second surface so that an electrode of the semiconductor element is electrically connected to the second end of the conductive column.

6. The method for manufacturing a display device according to claim 1, wherein: The substrate is a glass substrate.

7. The method for manufacturing a display device according to claim 1, characterized in that: The aperture of the through hole ranges from 5 micrometers to 50 micrometers, and the distance between two adjacent through holes ranges from 5 micrometers to 50 micrometers.

8. A display device, characterized in that: The display device is manufactured by adopting the method for manufacturing a display device according to any one of claims 1 to 7.

9. A display device, comprising: A substrate, the substrate having a through hole and a first surface, the through hole passing through the substrate; a fan-out wiring layer disposed on the first surface and partially filling the through hole, the fan-out wiring layer having a mounting surface away from the substrate; as well as A plurality of LED chips are mounted on the mounting surface. The electrodes of the LED chip are electrically connected to the conductive lines in the fan-out wiring layer.

10. An electronic device, characterized in that: The electronic device comprises the display device according to claim 9.

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