10Gbps ONU end transmitting and receiving integrated chip based on XGSPON matched with VCSEL laser

Abstract

The invention discloses a 10Gbps ONU (Optical Network Unit) end receiving and transmitting integrated chip based on XGSPON (XGSPON) matched with a VCSEL (Vertical Cavity Surface Emitting Laser), belongs to the field of integrated circuits and vehicle-mounted all-optical network optical communication, and aims to solve the problem that the existing vehicle-mounted all-optical PON network scheme cannot meet the low power consumption requirement. The chip is used for short-distance optical transmission of a vehicle-mounted all-optical network and is manufactured by a continuous mode receiving unit CM RX, a burst mode transmitting unit BM TX, a digital control unit Digital and a power management unit POWER on the same wafer substrate. The POWER converts an external 3.3 V voltage into a 1V voltage, and provides a working voltage for an on-chip main channel; the BM TX drives a VCSEL laser to emit an optical signal through a burst mode laser driver so as to send uplink burst data to an automobile control unit; the CM RX is used for continuously receiving optical signals by using a photodiode PD and receiving downlink continuous data of an automobile control unit; and the Digital is communicated with an automobile control unit through two signal lines SCL and SDA, so that the control of internal parameters of a chip and the optimization of data transmission quality are realized.

Description

Technical Field

[0001] The present invention relates to a 10Gbps ONU end transceiver integrated chip based on XGSPON and VCSEL laser, belonging to the field of integrated circuits and vehicle-mounted all-optical network optical communications. Background Art

[0002] The automobile industry has a long upstream and downstream industrial chain, which can drive the continuous expansion and development of employment, economy and technology. The fuel vehicles of joint ventures have accumulated hundreds of years of technology and patents in internal combustion engines. It is almost impossible for China, a latecomer in the automobile industry, to catch up with foreign fuel vehicles in a short period of time. Therefore, only by increasing R&D efforts and financial support for new energy vehicles can we achieve overtaking foreign car companies.

[0003] Compared with fuel vehicles, new energy vehicles have unique advantages in electrification and intelligence. Relying on battery support, new energy vehicles can be equipped with many sensors equipped for intelligent driving: 500-meter long-distance detection uses laser radar to generate 3D point cloud; 150-meter medium- and long-distance detection uses millimeter-wave radar; 50-meter short-distance external scene recognition uses on-board cameras; parking uses ultrasonic radar; real-time detection of ground road conditions uses suspension scanning, etc. With the improvement of sensor performance and the increase in in-vehicle data transmission rate, the level of new energy intelligent driving has jumped from the earliest L1 to L3.

[0004] Smart driving cars use a large number of sensors and AI algorithms to accelerate the processing of complex and changeable road environments during driving. Therefore, the real-time collected data needs to be quickly transmitted to the vehicle processing chip so that the processing chip can control the vehicle's driving posture in time. Traditional internal car data transmission is based on Ethernet, using copper or aluminum wires to transmit back sensors to detect vehicle driving information. This method has many disadvantages: ① The metal wire is long, large in size, and heavy; ② The transmission bandwidth is narrow and slow at 10Mbps, with high latency; ③ The metal routing is also susceptible to electromagnetic interference. Faced with massive information transmission and processing, smart driving cars must use an all-optical PON network to meet the technical indicators of smart driving. The all-optical PON network has the advantages of high bandwidth (10Gbps), high resistance to electromagnetic interference, low loss, and light weight.

[0005] like Figure 1In the vehicle-mounted all-optical PON network shown in the figure, the laser radar as a sensor will monitor the distance between the vehicle and the object in real time. After the initial information processing in the sensor group, the vertical cavity surface emitting laser VCSEL (Vertical Cavity Surface Emitting Laser) at the burst transmitting end of the ONU converts the high and low level information into flickering light information, which is then transmitted to the data interface OLT of the vehicle control unit by the optical fiber bundle. The OLT converts the light information into electrical information, which is then transmitted to the AI ​​algorithm acceleration module, and the electrical information is turned into a visual 3D image presented on the display screen inside the car. If the vehicle is about to collide with the object, the microcontroller will control the car to avoid or emergency brake. The continuous receiving end of the ONU uses a low-cost photodiode PD to convert the received light information into current information, the front-end transimpedance amplifier TIA converts the current information into electrical information, and the limiting amplifier LA inside the ONU further amplifies the electrical information, which includes the laser radar's scanning method for the object.

[0006] In the vehicle-mounted all-optical PON network solution, the optical module ONU includes two functional chips, the receiving chip RX and the transmitting chip TX. The receiving chip RX completes the reception of high-speed optical signals, and the transmitting chip TX quickly generates modulated current to drive the laser to transmit optical signals. It is common to separate the two functional chips and design them separately. Finally, both are fixed on a PCB board at the same time, and the peripheral devices are connected with metal to realize the transceiver function of optical signals. The transceiver process is as follows: TIA (transimpedance amplifier) ​​converts the received weak optical signal into an electrical signal and amplifies it into the receiving chip RX. The limiting amplifier LA in the receiving chip RX further amplifies the electrical signal to the limiting state. In the transmitting chip TX, the LDD laser driver generates a modulated current to drive the laser to emit or extinguish to transmit the optical signal. The power supply part of the all-optical PON solution still uses 3.3V to directly power RX and TX, with a total current of 300mA and an overall power consumption of 990mW, far exceeding the latest power consumption standard of 400mW for vehicle-mounted all-optical PON networks. For new energy vehicles, low-power design is the key point, and the existing vehicle-mounted all-optical PON network solutions cannot meet the low-power requirements. Summary of the invention

[0007] In order to solve the problem that the existing vehicle-mounted all-optical PON network solution cannot meet the low power consumption requirement, the present invention provides a 10Gbps ONU-end transceiver integrated chip based on XGSPON with VCSEL laser.

[0008] The 10Gbps ONU transceiver integrated chip based on XGSPON with VCSEL laser of the present invention is used for short-distance optical transmission of vehicle-mounted all-optical network. The ONU transceiver integrated chip is manufactured by a continuous mode receiving unit CM RX, a burst mode transmitting unit BM TX, a digital control unit Digital and a power management unit POWER on the same wafer substrate;

[0009] The power management unit POWER converts the external 3.3V voltage into 1V voltage to provide working voltage for the main channel on the chip;

[0010] The burst mode transmitting unit BM TX drives the on-board low-power VCSEL laser to emit optical signals through the burst mode laser driver, thereby sending uplink burst data to the vehicle control unit;

[0011] The continuous mode receiving unit CM RX uses the photodiode PD to continuously receive the optical signal, thereby receiving the continuous downlink data from the vehicle control unit;

[0012] The digital control unit Digital communicates with the vehicle control unit through two signal lines SCL and SDA to control the internal parameters of the ONU transceiver chip and optimize the data transmission quality.

[0013] Preferably, the transmission rates between the continuous mode receiving unit CM RX, the burst mode sending unit BM TX and the vehicle control unit are all 10 Gbps.

[0014] Preferably, the continuous mode receiving unit CM RX includes a preamplifier Gain, a multi-stage limiting amplifier LA_stgs, a peak detection module peak detector and a current mode logic output buffer CML Buffer; the preamplifier Gain enhances the attenuated electrical signal output by the upper-stage TIA, and the output of the preamplifier Gain is divided into two paths, one of which is directly transmitted to the next module multi-stage limiting amplifier LA_stgs, and the multi-stage limiting amplifier LA_stgs is used to gradually amplify the small-valued electrical signal into a high and low-level signal with a full swing; the other path is transmitted to the peak detection module peak detector, which synchronously performs amplitude detection on the small-valued electrical signal. Only when the amplitude meets the threshold requirement, the module outputs an instruction to start the output driver stage CMLBuffer, and at the same time transmits the judgment result to the vehicle control unit outside the chip.

[0015] Preferably, the burst mode transmission unit BM TX includes a signal input pre-buffer Pre Buffer, a TX multi-stage amplifier TX_stgs, a TX channel control module TX control, a burst 10G VCSEL laser driver Burst 10G VCSELDRIVER and a bias current control module Bias Current Control; the data stream first passes through the pre-buffer Pre Buffer through the chip pins TXINP and TXINN to re-bias the DC value of the signal, and after the signal is preliminarily amplified, the TX multi-stage amplifier TX_stgs performs additional functional operations on the signal, including but not limited to CTLE linear equalization, CPA eye diagram cross point adjustment and EYE_SHAPING eye diagram shaping; the burst 10G VCSEL laser driver Burst 10G VCSEL DRIVER quickly generates a 20mA modulation current to drive the short-distance optical transmission VCSEL laser according to the signal processed by the TX multi-stage amplifier TX_stgs;

[0016] A TX path control module TX control is set between the TX multi-stage amplifier TX_stgs and the burst 10G VCSEL laser driver Burst 10G VCSEL DRIVER. The TX path control module TX control is controlled by the chip pin BEN and is used for the vehicle control unit to quickly shut down the TX main channel;

[0017] The bias current control module Bias Current Control is used to provide bias current for the VCSEL laser.

[0018] Preferably, the power management unit POWER comprises a DC chopper DC / DC, resistors R33 and R44;

[0019] The output terminal VOUT of the DC chopper DC / DC is connected to one end of the resistor R33 and the chip pin CAP at the same time;

[0020] The other end of the resistor R33 is connected to one end of the resistor R44 and the feedback signal terminal FB at the same time;

[0021] The other end of the resistor R44 is connected to the ground;

[0022] A DC / DC switch input port SW1 of the DC chopper is connected to a chip pin SW1;

[0023] Another port SW2 of the DC / DC switch input of the DC chopper is connected to the chip pin SW2;

[0024] The power supply voltage port VCC is connected to the chip pin VCC;

[0025] The enable port EN is connected to the chip pin EN;

[0026] The 1V voltage outputted from the VOUT pin of the DC / DC chopper is supplied to the CM RX, BM TX, and DG parts respectively;

[0027] The chip's IO uses a 3.3V power supply.

[0028] Preferably, the digital control unit Digital includes a control register digital core Register ControlDigital Core, a high-precision analog-to-digital converter ADC and a slave I 2 C Slave I2C,

[0029] High-precision analog-to-digital converter ADC is used to convert quantifiable data into digital quantity and then pass it from I 2 C Slave I2C data signal line SDA is read into the external or internal register of the chip. The quantifiable data includes but is not limited to the ambient temperature, monitoring current value, bias current value and modulation current value;

[0030] The register control digital core Register Control Digital Core communicates with the vehicle control unit through two signal lines SCL and SDA. The register digital core also configures the continuous mode receiving unit CM RX and the burst mode transmitting unit BM TX through the control port.

[0031] Preferably, the control ports configured in the digital control unit Digital for the continuous mode receiving unit CM RX include a rate selection port RS, a temperature compensation port TC, an eye crossing point adjustment port CPA, a received signal strength indication gain port RSSIGAIN, a jitter optimization port EQ, a signal loss threshold setting port LOS_TH, an output swing adjustment port OP_SWING, a pre-emphasis adjustment port pre_Emphasis, and a pre-delay adjustment port pre_delay;

[0032] Preferably, the control ports of the burst mode transmitting unit BM TX configured in the digital control unit Digital include a linear equalizer CTLE, a TX signal detection port TX_SD, an automatic optical power control / extinction ratio control port APC / ERC, an eye diagram crossing point adjustment port CPA, a bias current adjustment port IBIAS, a modulation current adjustment port IMOD and an eye diagram shaping port EYE_SHAPING.

[0033] Beneficial effects of the invention: The invention proposes an overall framework structure of a 10Gbps ONU transceiver integrated chip based on XGSPON with VCSEL laser. After overcoming related technical difficulties, the continuous mode RX part, burst mode TX part, Digital part, and POWER part are integrated into the same wafer substrate to construct a transceiver integrated chip.

[0034] The low-power laser driver in the TX part can drive VCSEL lasers for short-distance applications (suitable for in-vehicle optical transmission). Reasonable settings of the laser's bias current and modulation current can increase the laser's service life.

[0035] The built-in high-efficiency power management unit DCDC can save peripheral hardware costs and space occupation, and is also conducive to controlling the overall power consumption of the optical transceiver chip within 400mW, which is more suitable for the strict requirements of new energy vehicles on power consumption and heat dissipation. The built-in power management unit DCDC converts the external 3.3V voltage into an internally available 1V voltage, providing a high-efficiency (90%) working voltage for the RX and TX circuits and the digital circuit DG. Under the condition that the overall 300mA current remains unchanged, the overall power consumption of the transceiver chip is (1V*300mA) / 90%=334mW, which controls the overall power consumption of the chip well, meets the strict requirements of the vehicle-mounted chip for power consumption less than 400mW and heat dissipation, reduces the hardware cost of the optical module, and facilitates the installation of miniaturized optical modules on the vehicle. In general, the integrated transceiver chip reduces the total area required for the two discrete chips and reduces the overall power consumption while maintaining high-speed performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is a schematic diagram of an application scenario of a 10Gbps ONU-end transceiver integrated chip based on XGSPON with VCSEL laser according to the present invention;

[0037] Figure 2 It is a specific structural schematic diagram of the 10Gbps ONU-end transceiver integrated chip based on XGSPON with VCSEL laser according to the present invention. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0040] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0041] Specific implementation method 1: The following is combined Figure 1 and Figure 2 This embodiment is described. The 10Gbps ONU transceiver integrated chip based on XGSPON and VCSEL laser in this embodiment is used for short-distance optical transmission of vehicle-mounted all-optical network. It will be applied to the interior of smart driving cars. After solving the existing technical problems, it is integrated on the same wafer substrate for manufacturing. The continuous mode 10Gbps rate CM RX and the burst mode 10Gbps rate BM TX are integrated on the same wafer in the chip framework, and the eye diagram transmission quality is optimized with the digital module, which greatly reduces the bit error rate of the output signal; the embedded power management DCDC reduces the external 3.3V power supply to 1V for the main channel in the chip, and accurately controls the power consumption of the entire chip. The receiving end and the transmitting end of the chip are respectively equipped with low-cost photodiodes PD and VCSEL lasers. This combination is suitable for ONU signal transmission inside smart driving cars with short-distance optical transmission.

[0042] See also Figure 1 , multiple ONU transceiver chips located at the user side (sensor group) correspond to an OLT at the local end, so the receiving end RX of the ONU transceiver chip continuously receives electrical signals with a stable amplitude from the OLT end at a rate of 10Gbps.

[0043] The ONU-end transceiver integrated chip is manufactured on the same wafer substrate by a continuous mode receiving unit CM RX, a burst mode sending unit BM TX, a digital control unit Digital and a power management unit POWER;

[0044] The power management unit POWER converts the external 3.3V voltage into 1V voltage to provide working voltage for the main channel on the chip;

[0045] The burst mode transmitting unit BM TX drives the on-board low-power VCSEL laser to emit optical signals through the burst mode laser driver, thereby sending uplink burst data to the vehicle control unit;

[0046] The continuous mode receiving unit CM RX uses the photodiode PD to continuously receive the optical signal, thereby receiving the continuous downlink data from the vehicle control unit;

[0047] The digital control unit Digital communicates with the vehicle control unit through two signal lines SCL and SDA to control the internal parameters of the ONU transceiver chip and optimize the data transmission quality.

[0048] The transmission rate between the continuous mode receiving unit CM RX, the burst mode transmitting unit BM TX and the vehicle control unit is 10Gbps. At the receiving end CM RX, the transmission rate is 10Gbps. The external TIA is matched with the low-cost photodiode PD to receive the optical signal from the short-distance optical fiber in the car and convert it into an electrical signal. The pre-amplifier Gain inside the CM RX pre-amplifies the electrical signal and passes it to the peak detection module peak detector to check whether the signal size meets the threshold standard. If it does not meet the threshold standard, the output buffer CML BUFF will be closed. The electrical signal transmitted from the BM TX end is amplified and shaped by the main channel and finally converted into a current signal by the Burst 10G VCSEL DRIVER. It is matched with the low-cost VCSEL laser outside the chip and transmitted to the vehicle control unit over a short distance through the optical fiber. The digital circuit DG adjusts the performance parameters of each module, and finally optimizes the data transmission quality and overall power consumption. The built-in power management unit DCDC converts the external 3.3V voltage into an internally available 1V voltage, providing a high-efficiency (90%) working voltage for the CM RX and BM TX circuits and the digital circuit DG. Under the condition that the overall current of 300mA remains unchanged, the overall power consumption of the transceiver chip is (1V*300mA) / 90%=334mW, which controls the overall power consumption of the chip well and meets the strict requirements of the vehicle-mounted chip for power consumption less than 400mW and heat dissipation. In general, the integrated transceiver chip reduces the total area required for the two discrete chips and reduces the overall power consumption while maintaining high-speed performance.

[0049] The continuous mode receiving unit CM RX includes a preamplifier Gain, a multi-stage limiting amplifier LA_stgs, a peak detection module peak detector and a current mode logic output buffer CML Buffer; the preamplifier Gain enhances the attenuated electrical signal output by the upper stage TIA, and the output of the preamplifier Gain is divided into two paths, one of which is directly transmitted to the next module multi-stage limiting amplifier LA_stgs, which is used to gradually amplify the electrical signal with a small assignment into a high and low level signal with a full swing; the other path is transmitted to the peak detection module peak detector, which synchronously detects the amplitude of the electrical signal with a small assignment. Only when the amplitude meets the threshold requirement, the module outputs an instruction to start the output driver level CMLBuffer, and transmits the judgment result to the vehicle control unit outside the chip. The current mode logic output buffer CMLBuffer improves the output drive capability of the full swing signal, and its internal terminal impedance matching reduces the back reflection of the signal, thereby reducing high-frequency distortion.

[0050] The burst mode transmission unit BM TX includes a signal input pre-buffer Pre Buffer, a TX multi-stage amplifier TX_stgs, a TX channel control module TX control, a burst 10G VCSEL laser driver Burst 10G VCSEL DRIVER and a bias current control module Bias Current Control; the data stream first passes through the chip pins TXINP and TXINN through the pre-buffer Pre Buffer to re-bias the DC value of the signal. After the signal is initially amplified, the TX multi-stage amplifier TX_stgs performs additional functional operations on the signal, including but not limited to CTLE linear equalization, CPA eye diagram cross point adjustment and EYE_SHAPING eye diagram shaping; the burst 10G VCSEL laser driver Burst 10G VCSEL DRIVER quickly generates a 20mA modulation current to drive the short-distance optical transmission VCSEL laser according to the signal processed by the TX multi-stage amplifier TX_stgs;

[0051] A TX path control module TX control is set between the TX multi-stage amplifier TX_stgs and the burst 10G VCSEL laser driver Burst 10G VCSEL DRIVER. The TX path control module TX control is controlled by the chip pin BEN and is used for the automobile control module to quickly shut down the TX main channel;

[0052] The bias current control module Bias Current Control is used to provide bias current for the VCSEL laser.

[0053] VCSEL lasers support short-distance (<100m) data transmission, so a driver Burst 10G VCSEL DRIVER with a small output current is required inside the TX. The laser bias current IBIAS and modulation current IMOD need to be adjusted in real time according to the ambient temperature, laser luminous efficiency, and laser aging. Therefore, the CurrentControl module cooperates with the APC / ERC optical power control module to feed back the laser luminous power information collected by the monitoring photodiode MPD, and then configure a reasonable current value by writing the digital part of the data; or load the internal data of the EEPROM.

[0054] The power management unit POWER includes a DC chopper DC / DC, resistors R33 and R44;

[0055] The output terminal VOUT of the DC chopper DC / DC is connected to one end of the resistor R33 and the chip pin CAP at the same time;

[0056] The other end of the resistor R33 is connected to one end of the resistor R44 and the feedback signal terminal FB at the same time;

[0057] The other end of the resistor R44 is connected to the ground;

[0058] A DC / DC switch input port SW1 of the DC chopper is connected to a chip pin SW1;

[0059] Another port SW2 of the DC / DC switch input of the DC chopper is connected to the chip pin SW2;

[0060] The power supply voltage port VCC is connected to the chip pin VCC;

[0061] The enable port EN is connected to the chip pin EN;

[0062] The 1V voltage outputted from the VOUT pin of the DC / DC chopper is supplied to the CM RX, BM TX, and DG parts respectively;

[0063] The chip's IO uses a 3.3V power supply.

[0064] The digital control unit Digital includes a control register digital core Register Control Digital Core, a high-precision analog-to-digital converter ADC and a slave I 2 C Slave I2C; can complete the configuration of RX and TX internally.

[0065] High-precision analog-to-digital converter ADC is used to convert quantifiable data into digital quantity and then pass it from I 2 C Slave I2C data signal line SDA is read into the external or internal register of the chip. The quantifiable data includes but is not limited to the ambient temperature, monitoring current value, bias current value and modulation current value;

[0066] The Register Control Digital Core communicates with the vehicle control unit through two signal lines SCL and SDA. The Register Control Digital Core also configures the burst mode receiver RX and the continuous mode transmitter TX through the control port.

[0067] The control ports of the continuous mode receiving unit CM RX configured in the digital control unit Digital include a rate selection port RS, a temperature compensation port TC, an eye crossing point adjustment port CPA, a received signal strength indication gain port RSSI GAIN, a jitter optimization port EQ, a signal loss threshold setting port LOS_TH, an output swing adjustment port OP_SWING, a pre-emphasis adjustment port pre_Emphasis, and a pre-delay adjustment port pre_delay;

[0068] The control ports of the burst mode transmitting unit BM TX configured in the digital control unit Digital include a linear equalizer CTLE, a TX signal detection port TX_SD, an automatic optical power control / extinction ratio control port APC / ERC, an eye diagram crossing point adjustment port CPA, a bias current adjustment port IBIAS, a modulation current adjustment port IMOD, and an eye diagram shaping port EYE_SHAPING.

[0069] The digital part also adds a digital diagnostics monitoring (DDM) function to monitor light level, chip temperature, power supply voltage and other data in real time.

[0070] See also Figure 2 , the present invention provides an example: the ONU end transceiver integrated chip includes a continuous mode receiving unit CMRX, a burst mode sending unit BM TX, a digital control unit Digital and a power management unit POWER;

[0071] The continuous mode receiving unit CM RX includes a pre-amplifier Gain, a multi-stage limiting amplifier LA_stgs, a peak detector peak detector and a current mode logic output buffer CML Buffer;

[0072] The positive input pin RXINP of the CM RX part is connected to one input terminal of the pre-amplifier Gain;

[0073] The inverting input pin RXINN of the CM RX part is connected to the other input terminal of the pre-amplifier Gain;

[0074] The two output ends of the pre-amplifier Gain are simultaneously connected to the two input ends of the peak detection module peak detector and the two input ends of the multi-stage limiting amplifier LA_stgs;

[0075] The two output ends of the multi-stage limiting amplifier LA_stgs are connected to the chip pins RXOUTP and RXOUTN;

[0076] The output end of the peak detector module is connected to the control end of the on / off of the stream mode logic output buffer CMLBuffer and the chip pin RX_LOS at the same time;

[0077] The burst mode transmission unit BM TX includes a signal input pre-buffer Pre Buffer, a TX multi-stage amplifier TX_stgs, a TX channel control module TX control, a burst 10G VCSEL laser driver Burst 10G VCSEL DRIVER and a bias current control module Bias Current Control;

[0078] The chip pins TXINP and TXINN are respectively connected to the two input terminals of the input pre-buffer of the BM TX part;

[0079] Two output ends of the input pre-buffer Pre Buffer are connected to two input ends of the TX multi-stage amplifier TX_stgs;

[0080] The two output ends of the TX multi-stage amplifier TX_stgs are connected to the two input ends of the TX signal path control module TX control;

[0081] The control end of the TX signal path control module TX control is connected to the chip pin BEN;

[0082] Two output ends of the TX signal path control module TX control are connected to two input ends of the burst 10G VCSEL laser driver Burst10G VCSEL DRIVER;

[0083] The two output ends of the Burst 10G VCSEL DRIVER are connected to the chip pins TXOUTP and TXOUTN; TXOUTP and TXOUTN are respectively connected to the two ends of the VCSEL laser, monitor the average optical power information of the VCSEL laser collected by the photodiode MPD and feed it back, and then configure a reasonable current value by writing the data of the digital part.

[0084] The output end of the bias current control module Bias Current Control is connected to the chip pin IBIAS;

[0085] The digital control unit Digital (DG) includes a control register digital core Register Control DigitalCore, a high-precision analog-to-digital converter ADC and a slave I 2 C Slave I2C, from I 2 The input end of C Slave I2C is connected to the chip pin SCL;

[0086] From I 2 C Slave I2C input and output port connects to chip pin SDA;

[0087] The output port TEMP of the temperature sensor Temp Sensor (omitted in the figure) is connected to the input port of the digital-to-analog converter ADC;

[0088] The output port of the RSSI monitoring current is connected to the input port of the digital-to-analog converter ADC;

[0089] The output port of the MPD monitoring current is connected to the input port of the digital-to-analog converter ADC;

[0090] The IBIAS bias current output port is connected to the input port of the digital-to-analog converter ADC;

[0091] The sampling output of the power supply voltage VCC is connected to the input port of the digital-to-analog converter ADC;

[0092] From I 2 The output port of C Slave I2C is directly connected to the input port of the control register digital core Register ControlDigital Core;

[0093] The input end of the automatic optical power control module APC is connected to the chip pin monitoring current MPD;

[0094] The DDM digital diagnosis module is embedded in the Register Control Digital Core, uses ADC to collect key information, and then transmits the information to the outside of the chip through the SDA pin.

[0095] The power management unit POWER includes a DC chopper DC / DC, resistors R33 and R44;

[0096] The output terminal VOUT of the DC chopper DC / DC is connected to one end of the resistor R33 and the chip pin CAP at the same time;

[0097] The other end of the resistor R33 is connected to one end of the resistor R44 and the feedback signal terminal FB at the same time;

[0098] The other end of the resistor R44 is connected to the ground;

[0099] A DC / DC switch input port SW1 of the DC chopper is connected to a chip pin SW1;

[0100] Another port SW2 of the DC / DC switch input of the DC chopper is connected to the chip pin SW2;

[0101] The power supply voltage port VCC is connected to the chip pin VCC;

[0102] The enable port EN is connected to the chip pin EN;

[0103] The 1V voltage outputted from the VOUT pin of the DC / DC chopper is supplied to the CM RX, BM TX, and DG parts respectively;

[0104] The chip's IO uses a 3.3V power supply.

[0105] The 10Gbps ONU transceiver integrated chip based on XGSPON and VCSEL laser proposed in this invention is applied to smart driving cars. The peak detection is used at the 10Gbps continuous receiving end RX to determine whether the input signal meets the transmission protocol requirements. The built-in high-speed laser driver at the 10Gbps burst transmitting end TX can output large current in conjunction with the bias current and modulation current modules; the digital part has built-in multi-bit registers and high-precision ADC and slave I 2 C, all kinds of key data are transmitted to the outside through the SDA signal line, and the digital quantity of the relevant modules for optimizing performance can also be written through this line to ensure the high quality of the receiving signal and sending model of the transceiver chip. The DDM module reads the key working information in the chip in real time, and the transceiver chip can be shut down when the threshold is exceeded to avoid damage to the chip and laser. This chip is used in the optical network inside the smart driving car. The optical transmission distance is short. The chip is equipped with a photodiode PD and a VCSEL laser to effectively reduce the hardware cost. The built-in DCDC reduces the external 3.3V power supply voltage to 1V for the main channel. Compared with directly using 3.3V voltage for power supply and using LDO for voltage reduction, the overall power consumption is only 334mW, which saves the car's power.

[0106] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that the features described in conjunction with a single embodiment may be used in other described embodiments.

Claims

1. A 10Gbps ONU transceiver integrated chip based on XGSPON with VCSEL laser, characterized by: The ONU-end transceiver integrated chip is used for short-distance optical transmission in an on-board all-optical network. The ONU-end transceiver integrated chip is manufactured on the same wafer substrate by a continuous mode receiving unit CM RX, a burst mode transmitting unit BM TX, a digital control unit Digital and a power management unit POWER; The power management unit POWER converts the external 3.3V voltage into 1V voltage to provide working voltage for the main channel on the chip; The burst mode transmitting unit BM TX drives the on-board low-power VCSEL laser to emit optical signals through the burst mode laser driver, thereby sending uplink burst data to the vehicle control unit; The continuous mode receiving unit CM RX uses the photodiode PD to continuously receive the optical signal, thereby receiving the continuous downlink data from the vehicle control unit; The digital control unit Digital communicates with the vehicle control unit through two signal lines SCL and SDA to control the internal parameters of the ONU transceiver chip and optimize the data transmission quality.

2. According to claim 1, the 10Gbps ONU transceiver integrated chip based on XGSPON with VCSEL laser is characterized in that: The transmission rate between the continuous mode receiving unit CM RX, the burst mode transmitting unit BM TX and the vehicle control unit is 10Gbps.

3. According to claim 1, the 10Gbps ONU transceiver integrated chip based on XGSPON with VCSEL laser is characterized in that: The continuous mode receiving unit CM RX includes a preamplifier Gain, a multi-stage limiting amplifier LA_stgs, a peak detection module peak detector and a current mode logic output buffer CML Buffer; the preamplifier Gain enhances the attenuated electrical signal output by the upper-stage TIA, and the output of the preamplifier Gain is divided into two paths, one of which is directly transmitted to the next module multi-stage limiting amplifier LA_stgs, which is used to gradually amplify the small-valued electrical signal into a high and low-level signal with a full swing; the other path is transmitted to the peak detection module peak detector, which synchronously detects the amplitude of the small-valued electrical signal. Only when the amplitude meets the threshold requirement, the module outputs an instruction to start the output driver level CMLBuffer, and at the same time transmits the judgment result to the vehicle control unit outside the chip.

4. According to claim 2, the 10Gbps ONU transceiver integrated chip based on XGSPON with VCSEL laser is characterized in that: The burst mode transmission unit BM TX includes a signal input pre-buffer Pre Buffer, a TX multi-stage amplifier TX_stgs, a TX channel control module TX control, a burst 10G VCSEL laser driver Burst 10GVCSEL DRIVER and a bias current control module Bias Current Control; The data stream first passes through the chip pins TXINP and TXINN and passes through the pre-buffer Pre Buffer to re-bias the DC value of the signal. After the signal is initially amplified, the TX multi-stage amplifier TX_stgs performs additional functional operations on the signal, including but not limited to CTLE linear equalization, CPA eye diagram cross point adjustment and EYE_SHAPING eye diagram shaping; the Burst 10G VCSEL laser driver Burst 10GVCSEL DRIVER quickly generates a 20mA modulation current to drive the short-distance optical transmission VCSEL laser according to the signal processed by the TX multi-stage amplifier TX_stgs; A TX path control module TX control is set between the TX multi-stage amplifier TX_stgs and the burst 10G VCSEL laser driver Burst 10G VCSEL DRIVER. The TX path control module TX control is controlled by the chip pin BEN and is used for the vehicle control unit to quickly shut down the TX main channel; The bias current control module Bias Current Control is used to provide bias current for the VCSEL laser.

5. The 10Gbps ONU transceiver integrated chip based on XGSPON with VCSEL laser according to claim 1, characterized in that: The power management unit POWER includes a DC chopper DC / DC, resistors R33 and R44; The output terminal VOUT of the DC chopper DC / DC is connected to one end of the resistor R33 and the chip pin CAP at the same time; The other end of the resistor R33 is connected to one end of the resistor R44 and the feedback signal terminal FB at the same time; The other end of the resistor R44 is connected to the ground; A DC / DC switch input port SW1 of the DC chopper is connected to a chip pin SW1; Another port SW2 of the DC / DC switch input of the DC chopper is connected to the chip pin SW2; The power supply voltage port VCC is connected to the chip pin VCC; The enable port EN is connected to the chip pin EN; The 1V voltage outputted from the VOUT pin of the DC / DC chopper is supplied to the CM RX, BM TX, and DG parts respectively; The chip's IO uses a 3.3V power supply.

6. The 10Gbps ONU transceiver integrated chip based on XGSPON with VCSEL laser according to claim 1, characterized in that: The digital control unit Digital includes a control register digital core Register Control DigitalCore, a high-precision analog-to-digital converter ADC and a slave I 2 C Slave I2C, High-precision analog-to-digital converter ADC is used to convert quantifiable data into digital quantity and then pass it from I 2 C Slave I2C data signal line SDA is read into the external or internal register of the chip. The quantifiable data includes but is not limited to the ambient temperature, monitoring current value, bias current value and modulation current value; The register control digital core Register Control Digital Core communicates with the vehicle control unit through two signal lines SCL and SDA. The register digital core also configures the continuous mode receiving unit CM RX and the burst mode transmitting unit BM TX through the control port.

7. The 10Gbps ONU transceiver integrated chip based on XGSPON and VCSEL laser according to claim 6, characterized in that: The control ports of the continuous mode receiving unit CM RX configured in the digital control unit Digital include a rate selection port RS, a temperature compensation port TC, an eye crossing point adjustment port CPA, a received signal strength indication gain port RSSI GAIN, a jitter optimization port EQ, a signal loss threshold setting port LOS_TH, an output swing adjustment port OP_SWING, a pre-emphasis adjustment port pre_Emphasis, and a pre-delay adjustment port pre_delay.

8. The 10Gbps ONU transceiver integrated chip based on XGSPON and VCSEL laser according to claim 6, characterized in that: The control ports of the burst mode transmitting unit BM TX configured in the digital control unit Digital include a linear equalizer CTLE, a TX signal detection port TX_SD, an automatic optical power control / extinction ratio control port APC / ERC, an eye diagram crossing point adjustment port CPA, a bias current adjustment port IBIAS, a modulation current adjustment port IMOD, and an eye diagram shaping port EYE_SHAPING.

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