Chip heat dissipation device based on electrostatic fan driven by thermoelectric sheet

Abstract

The invention belongs to the technical field of chip heat dissipation, and particularly relates to a chip heat dissipation device based on a thermoelectric sheet driven electrostatic fan. The shell is used for loading the electrostatic motor and is internally provided with a flow guide channel for guiding the airflow direction; one end of the heat dissipation piece is provided with a chip attaching surface which is used for being attached to an external chip; one end of the thermoelectric sheet is connected with one end, deviating from the chip binding surface, of the heat dissipation piece, and the other end of the thermoelectric sheet is exposed in the air; wherein the thermoelectric piece is electrically connected with the electrostatic motor through the boost circuit board and used for outputting high-voltage direct current to the electrostatic motor, and the shell is located on one side outside the heat dissipation piece. The chip heat dissipation device has the advantages that the chip heat dissipation device is flexible and variable in structural layout, the whole device is flatter, the requirement for the space in electronic equipment can be met, the structure and principle are simple, complex components and control circuits are not needed, passive control over the chip temperature can be achieved, and the chip heat dissipation device is efficient, saves energy and is suitable for large-scale popularization and application. No extra energy is consumed, and the heat dissipation efficiency is higher.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and in particular to a chip heat dissipation device based on a thermoelectric sheet driving an electrostatic fan. Background Art

[0002] Existing electronic device chip cooling methods include passive cooling technology (such as graphite heat sinks, heat pipes, thermally conductive metals, thermally conductive adhesives, etc.) and active cooling technology (such as fans, liquid cooling, VC cooling, etc.). Among them, fan cooling, as an active cooling method, generates airflow through the operation of the fan to take heat away from the inside of the electronic device, thereby reducing the temperature of the chip.

[0003] The fan heat dissipation method can maintain a good heat dissipation effect, but the existing fan heat dissipation structure mostly adopts a stacked structure layout of chips and electromagnetic fans, and the overall volume tends to become larger. Due to the limited thickness design of electronic equipment, the fan heat dissipation structure may not be able to fully adapt to the space requirements, resulting in excessive thickness of the electronic equipment, affecting the appearance and feel. In addition, the heat dissipation structure makes the layout and position of the fan relatively fixed. Due to the high coupling of the chip and the fan position, the layout of the fan cannot be flexibly adjusted, which limits the layout flexibility of other components, especially in the case of space-constrained electronic equipment.

[0004] In addition, electromagnetic fans consume a lot of power and need to be powered by batteries of electronic devices, which will further increase the power consumption of electronic devices. At the same time, electromagnetic fans generate severe heat in small sizes and confined spaces, which will reduce their heat dissipation efficiency and affect the heat dissipation effect of the chip.

[0005] Therefore, there is an urgent need to develop a chip cooling device based on a thermoelectric sheet driven electrostatic fan. Summary of the invention

[0006] In view of the deficiencies in the prior art, an object of the present invention is to provide a chip cooling device based on a thermoelectric sheet driving an electrostatic fan to solve the above problems.

[0007] The technical solution of the present invention is implemented as follows: a chip heat dissipation device based on a thermoelectric sheet driving an electrostatic fan, comprising: Electrostatic motor; The housing is used to load the electrostatic motor and has a guide channel inside to guide the airflow direction; A heat sink, one end of which is provided with a chip bonding surface for bonding with an external chip; A thermoelectric sheet, one end of which is connected to an end of the heat sink facing away from the chip bonding surface, and the other end is exposed to the air; The thermoelectric sheet is electrically connected to the electrostatic motor through a boost circuit board to output high-voltage direct current to the electrostatic motor, and the housing is located on one side outside the heat sink; Among them, electrostatic motors include: The stator component includes a positive electrode and a negative electrode connected to the boost circuit board, and an electrostatic field is formed between the positive electrode and the negative electrode. There are multiple positive electrodes and multiple negative electrodes, which are cross-distributed in the circumferential direction of the stator component; A rotor component is located inside the stator component, and the rotor component includes a fan assembly and a conductive sheet; Among them, the conductive sheet of the rotor component can obtain charges from the positive electrode and the negative electrode of the stator component, so that the rotor component is driven to rotate by the stator component to drive the fan assembly to rotate and disturb the airflow so that the airflow flows along the guide channel to the heat sink.

[0008] Furthermore, the stator component also includes: The upper support frame is a ring structure; The lower support frame is a ring structure; The upper support frame and the lower support frame are connected by a plurality of vertical fins arranged along the circumferential direction. The fins are cross-distributed between the upper support frame and the lower support frame in the circumferential direction as positive electrodes and negative electrodes. The positive electrode is electrically connected to the positive electrode of the boost circuit board through the positive electrode connection line, and the negative electrode is electrically connected to the negative electrode of the boost circuit board through the negative electrode connection line. An angle is formed between the fins and the upper support frame and the lower support frame.

[0009] Furthermore, the rotor assembly also includes: a frame assembly rotatable and at least partially located within the stator component; A plurality of conductive sheets are provided and distributed on the circumferential outer side of the frame assembly and can pass through the corona zones of the positive electrode and the negative electrode; The fan assembly is fixedly connected to the frame assembly.

[0010] Furthermore, the framework components include: The outer frame includes an outer frame 1 and an outer frame 2, both of which are ring-shaped, and the conductive sheet is located between the outer frame 1 and the outer frame 2; The inner frame includes an inner frame 1 and an inner frame 2, and the inner frame 1 and the inner frame 2 are both regular polygons; The fan assembly includes a plurality of wind guide blades circumferentially distributed between the outer frame and the inner frame. The wind guide blades are fixedly installed on the outer edge of the inner frame. A support beam is fixedly installed between the outer corner of the inner frame and the inner edge of the outer frame.

[0011] Furthermore, it also includes: The brush is located on the positive electrode, the negative electrode and / or the conductive sheet and is capable of softly connecting the electrode to the conductive sheet.

[0012] Furthermore, the brush is a silver wire and is located on the electrode, and its cantilever end is radially inwardly in contact with the conductive sheet.

[0013] Furthermore, the housing comprises: An air inlet is provided on one side of the upper end of the shell; The air outlet is provided on the side of the shell body facing the heat sink, and a guide channel is formed between the air inlet and the air outlet; The lower support frame is installed at the bottom of the shell, and the upper support frame is installed on the air inlet at the upper end of the shell.

[0014] Furthermore, the boost circuit board is located below the shell and adjacent to the shell.

[0015] Furthermore, the heat sink includes: A heat sink, wherein the chip bonding surface is arranged on a side outside the heat sink; A plurality of heat-conducting fins are provided, and are arranged on a side of the heat sink away from the chip bonding surface, and the plurality of heat-conducting fins are distributed at equal intervals; The thermoelectric sheet is installed at one end of the heat-conducting fin away from the heat sink.

[0016] The beneficial effects of the present invention are: The chip heat dissipation device of the present invention has a flexible structural layout, and the device as a whole is flatter, which can meet the space requirements of small electronic devices. The structure and principle are simple, and no complicated components and control circuits are required. It can also achieve passive control of chip temperature, is highly efficient and energy-saving, does not require additional energy consumption, and has higher heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 This is a schematic diagram of the overall structure of a chip heat dissipation device according to a specific embodiment of the present invention; Figure 2 An exploded view of a chip heat dissipation device according to a specific embodiment of the present invention; Figure 3 It is an exploded view of the rotor component and the stator component of a specific embodiment of the present invention; Figure 4 This is a schematic diagram of an electrostatic fan according to a specific embodiment of the present invention; Figure 5 This is a schematic diagram of an electrical module according to a specific embodiment of the present invention. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] In the description of the present application, it should be noted that the terms used herein are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. For ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0021] Embodiment 1: like Figures 1 to 5 As shown, the present invention discloses a chip heat dissipation device based on a thermoelectric sheet driving an electrostatic fan, comprising: Electrostatic motor 100; The housing 200 is used to load the electrostatic motor 100 and has a guide channel inside to guide the airflow direction; The heat sink 300 has a chip bonding surface at one end for bonding with an external chip; The thermoelectric sheet 400 has one end connected to the end of the heat sink 300 away from the chip bonding surface, and the other end exposed to the air; The thermoelectric sheet 400 is electrically connected to the electrostatic motor 100 through the boost circuit board 500 to output high-voltage direct current to the electrostatic motor 100, and the housing 200 is located outside the heat sink 300; The electrostatic motor 100 includes: The stator component 110 includes a positive electrode 111 and a negative electrode 112 connected to the boost circuit board 500, and an electrostatic field is formed between the positive electrode 111 and the negative electrode 112. There are multiple positive electrodes 111 and negative electrodes 112, which are cross-distributed in the circumferential direction of the stator component 100; The rotor component 120 is located in the stator component 110 , and the rotor component 120 includes a fan assembly 121 and a conductive sheet 122 ; Among them, the conductive sheet 122 of the rotor component 120 can obtain charges from the positive electrode 111 and the negative electrode 112 of the stator component 110, so that the rotor component 120 is driven to rotate by the stator component 110 to drive the fan assembly 121 to rotate and disturb the airflow so that the airflow flows along the guide channel to the heat sink 300.

[0022] In this embodiment, the working principle of the electrostatic motor is as follows: Figure 4 As shown, when a high DC voltage is applied to the positive and negative electrodes respectively, an electrostatic field is formed between the positive and negative electrodes, and a corona zone is formed near the positive and negative electrodes (the electric field strength near the electrodes is very large, which can ionize the nearby air to form a corona zone, so that the air near the electrodes carries the same charge as the electrode plates); when the conductive sheet (which can carry charge in the electric field) on the rotor component passes through the positive electrode (or negative electrode), the conductive sheet will carry the same charge as the electrode plate, so a repulsive force will be generated between the conductive sheet and the electrode (positive electrode), pushing the rotor component to move, and at the same time, the rotor carrying the charge will rush to the next level (negative electrode) under the action of the electric field, and the charge on the conductive sheet will be neutralized first and then introduced into the same charge as the negative electrode, so a repulsive force will be generated between the conductive sheet and the electrode (negative electrode), pushing the rotor component to move, and this cycle forms a continuous driving force; In the wiring method of this embodiment, the output end of the thermoelectric sheet is connected to the input end of the boost circuit board. The DC electromotive force generated by the thermoelectric sheet can reach the voltage range required to drive the electrostatic fan after being amplified by the boost circuit board. The output end of the boost circuit board is connected to the electrostatic motor. The structure and principle are simple, and no complicated components and control circuits are required. In this embodiment, the working principle of the thermoelectric sheet is as follows: the thermoelectric sheet generates electricity by utilizing the Seebeck effect, which refers to the thermoelectric phenomenon that the voltage difference between two substances is caused by the temperature difference between two different electrical conductors or semiconductors. The specific basic principle is that in different metals, the concentration of carriers (here, electrons) is different. For the same metal, when the temperatures at both ends are different, the movement speed of the electrons at both ends is also different, so the diffusion rate of the electrons at both ends to the other end is also different, so a potential difference is generated at both ends of the same metal conductor, and a potential difference is also generated for another metal. The two potential differences are different, so there is an additional potential difference in the circuit to generate current; In this embodiment, the thermoelectric sheet may be other types of thermoelectric materials, and its size and thickness may also be adjusted; The heat sink is attached to the chip through the chip connection surface. Most of the heat generated by the chip during operation can be transferred to the heat sink through heat conduction. One side of the thermoelectric sheet is attached to the heat sink, and the other side is exposed to the air. A large temperature difference can be generated between the two surfaces of the thermoelectric sheet when the chip is running, and an electromotive force is generated under the action of the temperature difference at both ends by using the Seebeck effect. By adopting the above technical solution, the chip heat dissipation device formed by the cooperation of the thermoelectric sheet, the heat sink and the electrostatic motor can be more flexible in structural layout compared with the traditional chip and electromagnetic fan stacked up and down. The device is flatter as a whole, which can meet the space requirements of electronic equipment. The structural parameters of the electrostatic motor, such as size, thickness, number of fan blades, shape, installation angle, etc., can be adjusted according to different installation requirements. By connecting high-voltage direct current, an alternating electric field is formed in the circumferential direction. The charged conductive sheet will be forced to move in the high-voltage electric field, thereby driving the fan assembly to rotate, disturbing the airflow so that the airflow flows along the guide channel and is discharged from the air outlet to the heat sink to take away the heat; Compared with traditional electromagnetic fans, electrostatic motors have the characteristics of low current in the microampere level, low noise, high energy conversion efficiency, high power density, and almost no heat. The cooling fan driven by electrostatic motors can be more miniaturized and flat. Compared with electromagnetic motors, electrostatic motors are more suitable for working under low speed conditions and have extremely low power consumption. Under the same radiator size, the power consumption is about 0.2W or less. Compared with the traditional electromagnetic motor, the present embodiment does not need to set a flat motor to drive the fan assembly to rotate, eliminating the physical obstruction of the motor, allowing the airflow to flow more freely, improving the overall efficiency of the fan, and at the same time, without the interference of the motor, the working noise of the fan is lower; The electromotive force generated by the temperature difference at both ends of the thermoelectric sheet is used to drive the electrostatic motor to dissipate heat from the chip. Since the electrostatic motor has extremely low power consumption, the power consumption is only 10-20mW when the fan diameter is 2cm, which is much lower than that of an electromagnetic fan of the same size. Therefore, the electric energy generated by the thermoelectric sheet is sufficient to drive the electrostatic fan. On the one hand, no additional battery energy is consumed. On the other hand, the size of the thermoelectric sheet required can be reduced compared to the electromagnetic fan, so that the entire device can be built into electronic equipment. In addition, the present invention can realize passive control of chip temperature. The heat generation power of the thermoelectric sheet is related to the temperature difference between its two surfaces. Therefore, the temperature of the chip will affect the power generation power of the thermoelectric sheet. When the chip operating temperature is high, the power generation power is increased. When the chip operating temperature is low, the power generation power is low. Then, the speed and heat dissipation effect of the electrostatic fan are adjusted, and finally the temperature of the chip is stabilized within a certain range. In summary, the chip heat dissipation device of the present invention has a flexible structural layout, and the overall device is flatter, which can meet the space requirements of small electronic devices (such as mobile phones, etc.). The structure and principle are simple, and no complicated components and control circuits are required. It can also achieve passive control of chip temperature, high efficiency and energy saving, no need to consume additional energy, and has higher heat dissipation efficiency.

[0023] Embodiment 2: This embodiment provides a chip cooling device based on a thermoelectric sheet driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0024] Furthermore, the stator component 110 further includes: The upper support frame 113 is a ring-shaped structure; The lower support frame 114 is a ring-shaped structure; The upper support frame 113 and the lower support frame 114 are connected by a plurality of vertical fins arranged in the circumferential direction. The fins are cross-distributed between the upper support frame 113 and the lower support frame 114 as the positive electrode 111 and the negative electrode 112 in the circumferential direction. The positive electrode 111 is electrically connected to the positive electrode of the boost circuit board 500 through the positive electrode connection line, and the negative electrode 112 is electrically connected to the negative electrode of the boost circuit board 500 through the negative electrode connection line. An angle is formed between the fins and the upper support frame 113 and the lower support frame 114 .

[0025] In this embodiment, the upper support frame and the lower support frame are insulators, and the adjacent positive electrodes and negative electrodes will not transfer charges due to being fixed on the upper support frame and the lower support frame; In this embodiment, a cross-shaped frame structure is provided on the radial inner side of the upper support frame and the lower support frame to ensure the stability of the upper support frame and the lower support frame structure; In this embodiment, the fins are made of carbon fiber sheets, which have better structural strength and are lighter; In this embodiment, the positive and negative electrodes are inclined carbon fiber thin plates evenly distributed along the circumference, and are alternately connected to the positive and negative poles of high-voltage direct current, so that a high-voltage electric field can be formed between the thin plates.

[0026] By adopting the above technical solution, the function of the conductive sheet is to carry electric charge and thus be forced to move between the electrodes, so that the rotor component obtains torque. The fan assembly is a component that rotates and disturbs the airflow to make the airflow flow along the guide channel. It is arranged in the electrostatic motor, which is more miniaturized and can improve the structural utilization rate. At the same time, the annular frame that fixes the conductive sheet strengthens the structural strength of the entire rotor.

[0027] Embodiment 3: This embodiment provides a chip cooling device based on a thermoelectric sheet driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0028] Furthermore, the rotor assembly 120 further includes: a frame assembly that is rotatable and at least partially located within the stator component 110; Conductive sheets 122, which are provided in plurality and are distributed on the circumferential outer side of the frame assembly and can pass through the corona zones of the positive electrode 111 and the negative electrode 112; The fan assembly 121 is fixedly connected to the frame assembly.

[0029] In this embodiment, the conductive sheet is a carbon fiber sheet; By adopting the above technical solution, a conductive sheet is used, which can carry more charges. The conductive sheet is a carbon fiber sheet. Carbon fiber can conduct electricity and has very high strength and is lighter.

[0030] In addition, according to actual needs, the length of the conductive sheet in the vertical direction can continue to increase, so as to obtain a greater electrostatic driving torque.

[0031] Embodiment 4: This embodiment provides a chip cooling device based on a thermoelectric sheet driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0032] Furthermore, the framework components include: The outer frame includes an outer frame 123 and an outer frame 124 . The outer frame 123 and the outer frame 124 are both ring-shaped. The conductive sheet 122 is located between the outer frame 123 and the outer frame 124 . The inner frame includes an inner frame 125 and an inner frame 2 126, and the inner frame 125 and the inner frame 2 126 are both regular polygons; The fan assembly 121 includes a plurality of wind guide blades circumferentially distributed between the outer frame and the inner frame. The wind guide blades are fixedly installed on the outer edge of the inner frame. A support beam is fixedly installed between the outer corner of the inner frame and the inner edge of the outer frame.

[0033] In this embodiment, the air guide blades of the fan assembly may be provided with more or fewer blades according to the requirements, and the shape of the fan blades may be other shapes besides the shapes shown in the drawings of this application; In this embodiment, the inner frame is connected to the cross-shaped frames on the upper and lower sides thereof through bearings and a rotating shaft, so that the fan assembly can rotate freely; By adopting the above technical solution, when the conductive sheet is pushed, the rotor will be moved by the electrostatic force and rotate with the outer frame. Since the inner frames are connected by support beams, the inner frames can drive the air guide blades to rotate together. In addition, the setting of the support beam between the inner frame and the outer frame makes the rotor assembly more stable and reliable during movement. When the electronic device loaded with the chip heat dissipation device is subjected to external impact, the rotor assembly inside is not easily affected.

[0034] Embodiment 5: This embodiment provides a chip cooling device based on a thermoelectric sheet driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0035] Furthermore, it also includes: The brush 2000 is located on the positive electrode 111 , the negative electrode 112 and / or the conductive sheet 122 , and can softly connect the electrodes to the conductive sheet 122 .

[0036] Furthermore, the brush 2000 is a silver wire and is located on the electrode, and its cantilever end is radially inwardly in contact with the conductive sheet 122 .

[0037] By adopting the above technical solution, the size of the electrostatic driving force of the electrostatic motor also depends on the gap between the rotor and the stator. The smaller the gap, the closer the rotor is to the electrode (the closer to the electrode, the stronger the corona field), and thus the more charge can be obtained. In order to avoid collision and friction, at the same time, in order to obtain a larger electrostatic driving torque, the gap between the rotor component and the stator component must be reduced. However, due to the precision problems of processing and assembly, the gap cannot be made very small. By inserting a silver wire brush obliquely into the electrode radially, soft contact between the rotor and the electrode is achieved, and the gap between the rotor conductive sheet and the electrode is made 0. Although the use of a brush will increase the resistance of the rotor, the increase in electrostatic force is greater than the increase in resistance, and a larger electrostatic driving torque is obtained, which effectively improves the starting performance, operating stability, efficiency and energy consumption, noise and vibration control of the heat dissipation device.

[0038] Embodiment 6: This embodiment provides a chip cooling device based on a thermoelectric sheet driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0039] Furthermore, the housing 200 includes: An air inlet is provided on one side of the upper end of the housing 200; The air outlet is provided on the side of the housing 200 facing the heat sink 300, and a guide channel is formed between the air inlet and the air outlet; The lower support frame 114 is installed on the bottom of the shell 200 , and the upper support frame 113 is installed on the air inlet at the upper end of the shell 200 .

[0040] In this embodiment, the housing can be connected and fixed to the mainboard of the electronic device to which it is adapted, or connected and fixed to the outer shell of the electronic device to which it is adapted, so that the housing can be fixed on any side of the periphery of the heat sink, and the layout position can be adjusted and is flexible; By adopting the above technical solution, the air guide blades can rotate to draw external air into the air inlet and then blow it toward the heat sink through the air outlet.

[0041] Embodiment 7: This embodiment provides a chip cooling device based on a thermoelectric sheet driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0042] Furthermore, the boost circuit board 500 is located below the housing 200 and adjacent to the housing 200 .

[0043] By adopting the above technical solution and arranging the positions of the boost circuit board and the shell, the boost circuit board will generate some heat when working, and the electrostatic motor can take away some of the heat generated by the boost circuit board to maintain the normal working temperature of the boost circuit board.

[0044] Embodiment 8: This embodiment provides a chip cooling device based on a thermoelectric sheet driving an electrostatic fan. In addition to the technical solutions of the above embodiments, it also has the following technical features.

[0045] Furthermore, the heat sink 300 includes: A heat sink, wherein the chip bonding surface is arranged on a side outside the heat sink; A plurality of heat-conducting fins are provided, and are arranged on a side of the heat sink away from the chip bonding surface, and the plurality of heat-conducting fins are distributed at equal intervals; The thermoelectric sheet 400 is installed at one end of the heat conducting fin away from the heat sink.

[0046] In the above technical solution, the heat sink can be adjusted at different installation angles to adjust the position of the air inlet end of the heat conducting fins. For example, when the heat conducting fins are arranged in a horizontal line as shown in FIG. Figure 2 As shown, both ends of the heat sink fins can be used as air inlet ends, and the housing can be placed on the left or right side of the heat sink. When the heat-conducting fins are arranged longitudinally, the housing can be placed in front of or behind the heat sink. In addition to the above two heat sink layout positions, the installation angle of the heat sink can be adjusted according to actual needs. The housing can be installed according to the actual air inlet position, and the installation layout is flexible and variable. By adopting the above technical solution, a plurality of air inlet channels can be formed between the thermoelectric sheet and the heat sink through the arrangement of the heat-conducting fins, and the air blown out through the air outlet of the shell passes through the air inlet channels, which can effectively dissipate the heat of the chip.

[0047] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip cooling device based on a thermoelectric sheet driving an electrostatic fan, characterized in that: include: Electrostatic motor (100); A housing (200) is used to load the electrostatic motor (100), and has a guide channel inside for guiding the direction of airflow; A heat sink (300) having a chip bonding surface at one end thereof for bonding with an external chip; A thermoelectric sheet (400), one end of which is connected to an end of the heat sink (300) that is away from the chip bonding surface, and the other end of which is exposed to the air; The thermoelectric sheet (400) is electrically connected to the electrostatic motor (100) via a boost circuit board (500) to output high-voltage direct current to the electrostatic motor (100), and the housing (200) is located on one side outside the heat sink (300); Wherein, the electrostatic motor (100) comprises: The stator component (110) includes a positive electrode (111) and a negative electrode (112) connected to the boost circuit board (500), wherein an electrostatic field is formed between the positive electrode (111) and the negative electrode (112). There are multiple positive electrodes (111) and multiple negative electrodes (112), which are cross-distributed in the circumferential direction of the stator component (100); A rotor component (120) located inside the stator component (110), the rotor component (120) comprising a fan assembly (121) and a conductive sheet (122); The conductive sheet (122) of the rotor component (120) can obtain electric charge from the positive electrode (111) and the negative electrode (112) of the stator component (110), so that the rotor component (120) is driven to rotate by the stator component (110), thereby driving the fan assembly (121) to rotate and disturb the airflow so that the airflow flows along the guide channel toward the heat sink (300).

2. A chip cooling device based on a thermoelectric sheet driving an electrostatic fan according to claim 1, characterized in that: The stator component (110) further comprises: The upper support frame (113) is a ring-shaped structure; The lower support frame (114) is a ring-shaped structure; The upper support frame (113) and the lower support frame (114) are connected via a plurality of vertical fins arranged in a circumferential direction, the fins are cross-distributed between the upper support frame (113) and the lower support frame (114) as positive electrodes (111) and negative electrodes (112) in a circumferential direction, the positive electrode (111) is electrically connected to the positive electrode of the boost circuit board (500) via a positive electrode connection line, and the negative electrode (112) is electrically connected to the negative electrode of the boost circuit board (500) via a negative electrode connection line; An included angle is formed between the fin and the upper support frame (113) and the lower support frame (114).

3. A chip cooling device based on a thermoelectric sheet driving an electrostatic fan according to claim 2, characterized in that: The rotor assembly (120) further comprises: a frame assembly that is rotatable and at least partially located within the stator component (110); A plurality of conductive sheets (122) are provided and distributed on the circumferential outer side of the frame assembly and are capable of passing through the corona zones of the positive electrode (111) and the negative electrode (112); A fan assembly (121) is fixedly connected to the frame assembly.

4. A chip cooling device based on a thermoelectric sheet driving an electrostatic fan according to claim 3, characterized in that: Framework components include: An outer frame, comprising an outer frame 1 (123) and an outer frame 2 (124), wherein the outer frame 1 (123) and the outer frame 2 (124) are both ring-shaped, and the conductive sheet (122) is located between the outer frame 1 (123) and the outer frame 2 (124); The inner frame includes an inner frame 1 (125) and an inner frame 2 (126), wherein the inner frame 1 (125) and the inner frame 2 (126) are both regular polygons; The fan assembly (121) comprises a plurality of wind guide blades distributed circumferentially between the outer frame and the inner frame, the wind guide blades are fixedly mounted on the outer edge of the inner frame, and a support beam is fixedly mounted between the outer corner of the inner frame and the inner edge of the outer frame.

5. A chip cooling device based on a thermoelectric sheet driving an electrostatic fan according to claim 4, characterized in that: Also includes: The brush (2000) is located on the positive electrode (111), the negative electrode (112) and / or the conductive sheet (122), and is capable of softly connecting the electrodes to the conductive sheet (122).

6. A chip cooling device based on a thermoelectric sheet driving an electrostatic fan according to claim 5, characterized in that: The brush (2000) is a silver wire and is located on the electrode, with its cantilever end radially inwardly contacting the conductive sheet (122).

7. The chip cooling device based on thermoelectric sheet driving electrostatic fan according to claim 1, characterized in that: The housing (200) comprises: An air inlet is provided on one side of the upper end of the housing (200); An air outlet is provided on a side of the housing (200) facing the heat sink (300), with a guide channel formed between the air inlet and the air outlet; The lower support frame (114) is installed on the bottom of the shell (200), and the upper support frame (113) is installed on the air inlet at the upper end of the shell (200).

8. The chip cooling device based on thermoelectric sheet driving electrostatic fan according to claim 1, characterized in that: The boost circuit board (500) is located below the housing (200) and adjacent to the housing (200).

9. The chip cooling device based on thermoelectric sheet driving electrostatic fan according to claim 1, characterized in that: The heat sink (300) comprises: A heat sink, wherein the chip bonding surface is arranged on a side outside the heat sink; A plurality of heat-conducting fins are provided, and are arranged on a side of the heat sink away from the chip bonding surface, and the plurality of heat-conducting fins are distributed at equal intervals; The thermoelectric sheet (400) is installed at one end of the heat-conducting fin facing away from the heat sink.

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