The invention belongs to the technical field of
chip heat dissipation, and particularly relates to a
chip heat dissipation device based on a thermoelectric sheet driven electrostatic fan. The shell is used for loading the
electrostatic motor and is internally provided with a flow guide channel for guiding the
airflow direction; one end of the heat dissipation piece is provided with a
chip attaching surface which is used for being attached to an external chip; one end of the thermoelectric sheet is connected with one end, deviating from the chip binding surface, of the heat dissipation piece, and the other end of the thermoelectric sheet is exposed in the air; wherein the thermoelectric piece is electrically connected with the
electrostatic motor through the boost circuit board and used for outputting high-
voltage direct current to the
electrostatic motor, and the shell is located on one side outside the heat dissipation piece. The chip heat dissipation device has the advantages that the chip heat dissipation device is flexible and variable in structural
layout, the whole device is flatter, the requirement for the space in
electronic equipment can be met, the structure and principle are simple, complex components and control circuits are not needed,
passive control over the chip temperature can be achieved, and the chip heat dissipation device is efficient, saves energy and is suitable for large-scale popularization and application. No extra energy is consumed, and the heat dissipation efficiency is higher.