Display panel and display device

Abstract

The invention discloses a display panel and a display device.The display panel comprises an array substrate, an oppositely-arranged substrate and frame glue, the display panel comprises a display area and a non-display area on the periphery of the display area, and the non-display area is provided with an array substrate, an oppositely-arranged substrate and frame glue; the array substrate comprises a substrate, and a metal wiring layer, an insulating layer, a transparent conductive layer and an alignment film which are positioned on one side, close to an opposite substrate, of the substrate and are laminated; a plurality of via holes are formed in the insulating layer, penetrate through the insulating layer and expose part of the metal wiring layer; the metal wiring layer at least comprises a first metal wiring and a second metal wiring which are arranged at an interval, and the second metal wiring is located on the side, close to the display area, of the first metal wiring; an insulating layer, a transparent conductive layer and an alignment film are arranged on the side, away from the substrate, of the second metal wire, and at least one insulating layer and an alignment film are arranged on the side, away from the substrate, of the first metal wire. By means of the arrangement, the problem that the metal wiring layer of a narrow-frame or frameless display panel is prone to being corroded due to electrochemical reaction can be solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] TFT-LCD (Thin Film Transistor Liquid Crystal Display) can occupy an unshakable position in the field of large, medium and small flat panel displays, thanks to the following characteristics of TFT-LCD: ① low voltage and low power consumption; ② flat panel structure; ③ passive display (no glare, no stimulation to the eyes, independent control of dedicated light source, that is, product brightness can be adjusted); ④ large amount of displayed information; ⑤ easy to colorize; ⑥ no electromagnetic radiation; ⑦ long service life, etc. As consumer requirements continue to increase, TFT-LCD products need to be continuously upgraded. For example, TFT-LCD products are moving towards a narrower frame design, and the narrow frame or frameless design puts forward more stringent requirements for the high temperature and humidity test of the LCD panel.

[0003] For narrow-border products or borderless products, due to the narrow product borders, the alignment film spreads to the frame glue coating position and exceeds the frame glue boundary. Due to the poor bonding ability between the alignment film and the frame glue and the weakened anti-moisture absorption ability of the alignment film under high temperature and high humidity conditions, when performing high temperature and high humidity tests, water vapor can easily enter the display panel along the bonding point between the alignment film and the frame glue, causing an electrochemical reaction in the metal wiring layer at high temperature, which in turn makes the metal wiring layer susceptible to corrosion. Summary of the invention

[0004] The present application mainly provides a display panel and a display device to solve the problem in the prior art that the metal wiring layer of a narrow-frame or frameless display panel is prone to electrochemical reaction and corrosion.

[0005] In order to solve the above technical problems, a technical solution adopted by the present application is: providing a display panel, comprising an array substrate and an opposing substrate arranged opposite to each other, and a frame glue connected between the array substrate and the opposing substrate; the display panel comprises a display area and a non-display area arranged outside the display area;

[0006] In the non-display area, the array substrate includes a substrate and a metal wiring layer, an insulating layer, a transparent conductive layer and an alignment film which are located on a side of the substrate close to the counter substrate and are stacked in sequence; a plurality of via holes are arranged in the insulating layer, and the via holes penetrate the insulating layer and expose a portion of the metal wiring layer;

[0007] The metal wiring layer at least includes a first metal wiring and a second metal wiring arranged at intervals, the first metal wiring is arranged close to the edge of the array substrate, and the second metal wiring is located on a side of the first metal wiring close to the display area;

[0008] The insulating layer, the transparent conductive layer and the alignment film are disposed on a side of the second metal wiring facing away from the substrate, and at least the insulating layer and the alignment film are disposed on a side of the first metal wiring facing away from the substrate.

[0009] In some embodiments, the transparent conductive layer is disposed on a side of the first metal wiring facing away from the substrate; the transparent conductive layer covers a side of the insulating layer away from the substrate and extends into the via hole to contact the first metal wiring.

[0010] In some embodiments, the transparent conductive layer is not disposed on a side of the first metal trace facing away from the substrate.

[0011] In some embodiments, the metal routing layer further includes a third metal routing, the third metal routing is located between the first metal routing and the second metal routing, and is spaced apart from the first metal routing and the second metal routing;

[0012] The insulating layer, the transparent conductive layer and the alignment film are arranged on a side of the third metal wiring facing away from the substrate.

[0013] In some embodiments, an outer edge of the transparent conductive layer located on a side of the third metal trace facing away from the substrate is located on a side of the frame glue away from the display area.

[0014] In some embodiments, the gap between the first metal trace and the third metal trace is located on a side of the frame glue away from the display area;

[0015] The gap between the second metal wiring and the third metal wiring is located on a side of the frame glue close to the display area, or is located on a side of the frame glue away from the display area, or is covered by the frame glue.

[0016] In some embodiments, the metal routing layer includes only first metal routing and second metal routing that are spaced apart;

[0017] The outer edge of the transparent conductive layer located on the side of the second metal wiring facing away from the substrate is covered by the frame glue.

[0018] In some embodiments, the via hole at the outer edge of the insulating layer located on the side of the first metal trace facing away from the substrate is a long hole, which passes through the insulating layer and has a length direction extending along the extension direction of the first metal trace.

[0019] In some embodiments, the alignment film is at least partially located between the frame glue and the substrate, and the material of the alignment film is polyimide; and the material of the transparent conductive layer is indium tin oxide.

[0020] In order to solve the above technical problems, another technical solution adopted by the present application is: to provide a display device, comprising:

[0021] Any display panel as described above;

[0022] A backlight source is arranged on one side of the display panel and is used to provide backlight for the display panel.

[0023] The beneficial effects of the present application are as follows: Different from the prior art, the present application discloses a display panel and a display device, wherein the display panel comprises an array substrate and an opposing substrate arranged oppositely, and a frame glue connected between the array substrate and the opposing substrate; the display panel comprises a display area and a non-display area arranged outside the display area, in which the array substrate comprises a substrate and a metal wiring layer, an insulating layer, a transparent conductive layer and an alignment film which are stacked and located on the side of the substrate close to the opposing substrate; a plurality of vias are arranged in the insulating layer, the vias penetrate the insulating layer and expose part of the metal wiring layer; wherein the metal wiring layer comprises at least a first metal wiring and a second metal wiring which are arranged at intervals, the first metal wiring is arranged close to the edge of the array substrate, and the second metal wiring is located on the side of the first metal wiring close to the display area; an insulating layer, a transparent conductive layer and an alignment film are arranged on the side of the second metal wiring away from the substrate, and at least an insulating layer and an alignment film are arranged on the side of the first metal wiring away from the substrate. Through the above arrangement, the problem that the metal wiring layer of the narrow-frame or frameless display panel in the prior art is prone to electrochemical reaction and corrosion can be effectively solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0025] Figure 1 is a schematic structural diagram of an embodiment of a display panel provided by the present application;

[0026] Figure 2 yes Figure 1 A partial enlarged schematic diagram of a first embodiment of a region S of a display panel is provided;

[0027] Figure 3 yes Figure 2 A1-A2 cross-sectional schematic diagram of a display panel is provided;

[0028] Figure 4 Figure 2 A schematic diagram of the A3-A4 cross section of the display panel provided;

[0029] Figure 5 yes Figure 1 A partial enlarged schematic diagram of a second embodiment of a region S of a display panel is provided;

[0030] Figure 6 yes Figure 5 A schematic diagram of a B1-B2 cross section of a display panel is provided;

[0031] Figure 7 Figure 5 A schematic diagram of a B3-B4 cross section of a display panel is provided;

[0032] Figure 8 yes Figure 1 A partial enlarged schematic diagram of a third embodiment of a region S of a display panel is provided;

[0033] Fig. 9 yes Figure 1 A partial enlarged schematic diagram of a fourth embodiment of a region S of a display panel is provided;

[0034] Fig.10 It is a schematic structural diagram of an embodiment of a display device provided in the present application.

[0035] Figure Number:

[0036] Display device 300; backlight source 200; display panel 100; array substrate 1; substrate 11; metal routing layer 12; first metal routing 121; second metal routing 122; third metal routing 123; insulating layer 13; transparent conductive layer 14; alignment film 15; via 131; long hole 132; opposing substrate 2; frame glue 3; circuit board 4; display area X; non-display area F; bonding area B. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0038] The terms "first", "second", "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0039] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0040] See also Figures 1 to 4 , Figure 1 is a schematic structural diagram of an embodiment of a display panel provided by the present application, Figure 2 yes Figure 1 A partial enlarged schematic diagram of a first embodiment of a region S of a display panel is provided, Figure 3 yes Figure 2 A1-A2 cross-sectional schematic diagram of the display panel provided, Figure 4 Figure 2 A schematic diagram of the A3-A4 cross section of the provided display panel.

[0041] See also Figures 1 to 4 The present application provides a display panel 100, which includes an array substrate 1 and an opposing substrate 2 arranged opposite to each other, and a sealant 3 connected between the array substrate 1 and the opposing substrate 2. The display panel 100 includes a display area X and a non-display area F arranged outside the display area X. Specifically, as Figure 1As shown, in one embodiment, the size of the array substrate 1 is larger than the size of the counter substrate 2, and one side of the array substrate 1 protrudes from the counter substrate 2 to form a bonding area B, which is used to bond other components such as the circuit board 4.

[0042] like Figure 3 and Figure 4 As shown, in the non-display area F, the array substrate 1 includes a substrate 11 and a metal wiring layer 12, an insulating layer 13, a transparent conductive layer 14 and an alignment film 15 which are located on a side of the substrate 11 close to the counter substrate 2 and are stacked in sequence. A plurality of vias 131 are provided in the insulating layer 13, and the vias 131 penetrate the insulating layer 13 and expose a portion of the metal wiring layer 12.

[0043] The metal wiring layer 12 at least includes a first metal wiring 121 and a second metal wiring 122 arranged at intervals. Specifically, the first metal wiring 121 and the second metal wiring 122 are arranged at intervals and insulated, and are not electrically connected through other components. In some embodiments, the second metal wiring 122 is a VCOM wiring of the display panel 100, and the second metal wiring 122 and the first metal wiring 121 are prepared using the same metal layer. The first metal wiring 121 is located in the non-display area F and is arranged close to the edge of the array substrate 1, and the second metal wiring 122 is located on the side of the first metal wiring 121 close to the display area X, that is, the first metal wiring 121 is located on the outside of the second metal wiring 122. Specifically, the side of the second metal wiring 122 facing away from the substrate 11 is provided with an insulating layer 13, a transparent conductive layer 14 and an alignment film 15, and the side of the first metal wiring 121 facing away from the substrate 11 is at least provided with an insulating layer 13 and an alignment film 15.

[0044] It can be understood that in the present application, by setting the metal wiring layer 12 of the array substrate 1 of the non-display area F to include a first metal wiring 121 and a second metal wiring 122 that are spaced and insulated, and setting the first metal wiring 121 on the outside of the second metal wiring 122, a via 131 is provided in the insulating layer 13 above the metal wiring layer 12, and the via 131 penetrates the insulating layer 13 and exposes a portion of the metal wiring layer 12. Even when the display panel 100 is subjected to a high temperature and high humidity test, external water vapor enters the display panel 100 and first contacts the alignment film 15 on the side of the first metal wiring 121 away from the substrate 11, enters along the alignment film 15 to the position of the via 131, and undergoes a chemical reaction or an electrochemical reaction with the first metal wiring 121 at the position of the via 131, thereby causing corrosion of the first metal wiring 121. Since the first metal wiring 121 and the second metal wiring 122 are arranged at intervals and insulated, the corrosion of the first metal wiring 121 will not affect the second metal wiring 122, that is, after the water vapor is consumed by the first metal wiring 121, the second metal wiring 122 close to the display area X side will not be corroded again, and the remaining metal wirings in the display area X are not easily corroded, so as to avoid the corrosion from entering the display area along the metal wiring layer, and the phenomenon of metal corrosion in the display area causing abnormal images during the high temperature and high humidity test. Through the above arrangement, the problem that the metal wiring layer 12 of the narrow frame or borderless display panel 100 is prone to electrochemical reaction and corrosion can be improved, and the problem that the narrow frame or borderless display panel 100 is prone to abnormal images due to electrochemical corrosion during the high temperature and high humidity test can be solved, and the corrosion resistance of the metal wiring layer 12 of the narrow frame or borderless display panel 100 is effectively improved, thereby improving the display performance of the display panel 100, and no mask plate needs to be added, and the corrosion resistance of the display panel 100 can be improved at a lower cost.

[0045] Specifically, in some embodiments, the alignment film 15 is at least partially located between the frame glue 3 and the substrate 11, that is, the alignment film 15 extends to the coating position of the frame glue 3. Specifically, the material of the alignment film 15 is PI (Polyimide), and the display panel 100 can be a narrow-frame or frameless display panel 100. Since the frame of the display panel 100 is narrow, when the alignment film 15 is coated with a coating device with low precision, the alignment film 15 is easy to spread to the connection position between the frame glue 3 and the array substrate 1 in the non-display area F and exceed the boundary of the frame glue 3, that is, the alignment film 15 is easy to spread to the side of the frame glue 3 away from the display area X. The alignment film 15 is a low hygroscopic material. Under high temperature and high humidity conditions, the anti-hygroscopic ability of the alignment film 15 is weakened, that is, the hygroscopic ability of the alignment film 15 in a high temperature and high humidity environment is enhanced, and it is easy to absorb water vapor. When the display panel 100 is subjected to a high temperature and high humidity test, water vapor is easy to contact the alignment film 15 and enter the display panel 100. In the present application, even if water vapor enters the display panel 100 along the alignment film 15, it will only react chemically or electrochemically with the first metal wiring 121 at the position of the via 131 of the insulating layer 13 on the side of the first metal wiring 121 away from the substrate 11, thereby corroding the first metal wiring 121. The first metal wiring 121 and the second metal wiring 122 are insulated and spaced apart, and corrosion will not spread from the first metal wiring 121 to the position of the second metal wiring 122. The second metal wiring 122 and the remaining wirings in the display area X will not be corroded. Only by sacrificing the first metal wiring 121, the corrosion resistance of the narrow-frame or frameless display panel 100 can be improved, and the display performance of the display panel 100 can be improved.

[0046] Therefore, for a display panel 100 with a narrow frame or no frame, by setting the metal routing layer 12 to the above-mentioned structure in the present application, the alignment film 15 can be coated with a low-precision coating equipment. Even if the alignment film 15 spreads to the coating position of the frame glue 3, it will not have a significant impact on the corrosion resistance of the display panel 100 with a narrow frame or no frame. The accuracy requirements of the coating equipment for the alignment film 15 can be effectively reduced, and the production cost can be reduced. Optimization and improvement have been made at the design level, which solves the limitation of large fluctuations in the coating of the alignment film 15 for narrow frame or no frame products using PI Inject equipment, and realizes that the alignment film 15 can be coated on narrow frame or no frame products using PI Inject equipment.

[0047] Specifically, in some embodiments, other structures such as a driving circuit layer (not shown) and a thin film transistor layer (not shown) are further provided in the display area X of the array substrate 1, and the driving circuit layer and the thin film transistor layer both include other metal wirings. By setting the metal wiring layer 12 in the non-display area F of the array substrate 1 to include spaced and insulated first metal wirings 121 and second metal wirings 122, the first metal wirings 121 located on the outside are sacrificed to protect the second metal wirings 122 from corrosion. At the same time, the remaining metal wirings inside other structures such as the driving circuit layer and the thin film transistor layer in the display area X can also be effectively protected from corrosion, which is beneficial to improving the display performance of the display panel 100.

[0048] In some embodiments, the length directions of the first metal routing 121 and the second metal routing 122 can extend along the circumference of the array substrate 1. Specifically, the first metal routing 121 and the second metal routing 122 can be set corresponding to the side of the array substrate 1. For example, the first metal routing 121 and the second metal routing 122 can be set only corresponding to one side of the array substrate 1, and the shapes of the first metal routing 121 and the second metal routing 122 are both roughly I-shaped; or, they can also be set corresponding to multiple side edges of the array substrate 1. For example, they can be set corresponding to two side edges of the array substrate 1, and the shapes of the first metal routing 121 and the second metal routing 122 are both roughly L-shaped. In a specific embodiment, the first metal trace 121 and the second metal trace 122 are both arranged corresponding to the three sides of the array substrate 1, and the first metal trace 121 and the second metal trace 122 may not be arranged on one side corresponding to the bonding area B of the array substrate 1. The shapes of the first metal trace 121 and the second metal trace 122 are both roughly U-shaped, and the first metal trace 121 is located outside the second metal trace 122. By arranging the first metal trace 121 and the second metal trace 122 at positions corresponding to multiple sides of the array substrate 1, a certain degree of corrosion resistance can be achieved at multiple positions on the circumference of the display panel 100, which is more conducive to preventing water vapor from entering the display panel 100 to corrode the remaining metal traces.

[0049] In other embodiments, the first metal trace 121 and the second metal trace 122 may not be set at the same time. For example, the position corresponding to one or more sides of the array substrate 1 may only be provided with the first metal trace 121 independent of other metal traces, without providing the second metal trace 122. The corrosion resistance may be achieved only by sacrificing the first metal trace 121. For example, the shape of the first metal trace 121 is roughly U-shaped, and the shape of the second metal trace 122 is roughly I-shaped or L-shaped; or the shape of the first metal trace 121 is roughly L-shaped, and the shape of the second metal trace 122 is roughly I-shaped.

[0050] In some embodiments, Figures 2 to 4 As shown, the first metal wiring 121 and the second metal wiring 122 are spaced apart and insulated, and a transparent conductive layer 14 is disposed on the side of the first metal wiring 121 facing away from the substrate 11, as shown in FIG. Figure 3 and Figure 4 As shown, the transparent conductive layer 14 is disposed on the side of the insulating layer 13 away from the substrate 11 and is located between the insulating layer 13 and the alignment film 15. Specifically, the transparent conductive layer 14 covers the surface of the insulating layer 13 away from the substrate 11. A plurality of vias 131 are disposed in the insulating layer 13. The vias 131 penetrate the insulating layer 13 and expose a portion of the first metal wiring 121. The transparent conductive layer 14 on the side of the first metal wiring 121 away from the substrate 11 extends into the vias 131 and is disposed in contact with the first metal wiring 121. The alignment film 15 covers the surface of the transparent conductive layer 14 away from the substrate 11. Specifically, the material of the transparent conductive layer 14 may be indium tin oxide (ITO).

[0051] In this embodiment, since the transparent conductive layer 14 is disposed on the side of the first metal trace 121 facing away from the substrate 11, and the transparent conductive layer 14 on the side of the first metal trace 121 facing away from the substrate 11 extends into the via 131 and contacts the first metal trace 121, Figure 3 and Figure 4 As shown, during the high temperature and high humidity test, after the water vapor contacts the alignment film 15, it enters along the alignment film 15 to the via 131 of the insulating layer 13. At the via 131, the water vapor introduced by the alignment film 15 contacts the transparent conductive layer 14 and the first metal wiring 121, so that the transparent conductive layer 14, the water vapor and the first metal wiring 121 undergo an electrochemical reaction, causing the first metal wiring 121 to be corroded. Since the first metal wiring 121 and the second metal wiring 122 are spaced and insulated, the first metal wiring 121 is located outside the second metal wiring 122 and is close to the edge of the display panel 100. Even if the first metal wiring 121 undergoes an electrochemical reaction and is corroded, the corrosion will not proceed along the first metal wiring 121 toward the display area X. Most of the water vapor is absorbed and consumed by the first metal wiring 121 and the alignment film 15 located on the top thereof at the edge position close to the display panel 100, which can effectively protect the second metal wiring 122 and the remaining wirings from being corroded, improve the corrosion phenomenon of the VCOM wiring of the narrow-frame or frameless display panel 100, and enhance the corrosion resistance of the display panel 100.

[0052] In this embodiment, the gap between the first metal trace 121 and the second metal trace 122 can be located on the side of the frame glue 3 close to the display area X, that is, the gap can be located on the inner side of the frame glue 3; or, the gap between the first metal trace 121 and the second metal trace 122 can also be covered by the frame glue 3, that is, the gap can be located within the range of the frame glue 3 coating; or, the gap between the first metal trace 121 and the second metal trace 122 can also be located on the side of the frame glue 3 away from the display area X, that is, the gap can also be located outside the frame glue 3, which can be designed as needed. Preferably, the gap between the first metal trace 121 and the second metal trace 122 can be located on the side of the frame glue 3 away from the display area X or covered by the frame glue 3, and the frame glue 3 can effectively block water vapor from entering the inner side of the frame glue 3, which can more effectively avoid the corrosion of the first metal trace 121 during the high temperature and high humidity test, which affects the corrosion of the remaining metal traces of the array substrate 1, and is more conducive to improving the corrosion resistance of the display panel 100.

[0053] In some other embodiments, the transparent conductive layer 14 may not be provided on the side of the first metal trace 121 of the array substrate 1 facing away from the substrate 11 , but only the insulating layer 13 and the alignment film 15 are stacked in sequence.

[0054] See also Figures 5 to 8 , Figure 5 yes Figure 1 A partial enlarged schematic diagram of a second embodiment of a region S of a display panel is provided, Figure 6 yes Figure 5 The B1-B2 cross-sectional diagram of the display panel provided, Figure 7 Figure 5 The B3-B4 cross-sectional diagram of the display panel provided, Figure 8 yes Figure 1 A partial enlarged schematic diagram of a third embodiment of an area S of a display panel is provided.

[0055] For details, see Figures 5 to 8 In some embodiments, the transparent conductive layer 14 is not disposed on the side of the first metal trace 121 of the array substrate 1 facing away from the substrate 11 .

[0056] See also Figures 5 to 7In one embodiment, specifically, the metal routing layer 12 also includes a third metal routing 123, the third metal routing 123 is located between the first metal routing 121 and the second metal routing 122, and is spaced apart from the first metal routing 121 and the second metal routing 122. Specifically, the third metal routing 123 is insulated from the first metal routing 121 and the second metal routing 122 and is spaced apart from each other, and the third metal routing 123 is not electrically connected to the first metal routing 121 and the second metal routing 122 through other components. Among them, the second metal wiring 122 is located on the side of the third metal wiring 123 close to the display area X, and the side of the second metal wiring 122 facing away from the substrate 11 is stacked with an insulating layer 13, a transparent conductive layer 14 and an alignment film 15 in sequence, and the side of the third metal wiring 123 facing away from the substrate 11 is stacked with an insulating layer 13, a transparent conductive layer 14 and an alignment film 15 in sequence, that is, the second metal wiring 122 and the third metal wiring 123 have the same structure on the side facing away from the substrate 11, and the transparent conductive layer 14 is not set on the side of the first metal wiring 121 facing away from the substrate 11, and only the insulating layer 13 and the alignment film 15 are stacked in sequence.

[0057] It can be understood that in this embodiment, the second metal trace 122 and the third metal trace 123 are both provided with an insulating layer 13, a transparent conductive layer 14 and an alignment film 15 on the side facing away from the substrate 11, while the first metal trace 121 is not provided with a transparent conductive layer 14 on the side facing away from the substrate 11, and the first metal trace 121 and the third metal trace 123 are spaced apart and insulated. Since the first metal trace 121 is located outside the third metal trace 123, when performing a high temperature and high humidity test, Figure 6 and Figure 7As shown, after the alignment film 15 on the side of the first metal wiring 121 facing away from the substrate 11 comes into contact with water vapor, the water vapor flows along the alignment film 15 into the via 131 of the insulating layer 13 on the top of the first metal wiring 121. Since the transparent conductive layer 14 is not provided on the side of the first metal wiring 121 facing away from the substrate 11, the alignment film 15 directly comes into contact with the first metal wiring 121 at the via 131. Therefore, at the via 131, the water vapor directly comes into contact with the first metal wiring 121 to generate a chemical reaction, so that the first metal wiring 121 is corroded. Most of the water vapor is consumed by the first metal wiring 121, so that the remaining metal wirings are not easily corroded by coming into contact with water vapor, which is beneficial to improving the corrosion resistance of the display panel 100. At the same time, a third metal wiring 123 is arranged between the first metal wiring 121 and the second metal wiring 122. Even if the water vapor is not completely consumed by the first metal wiring 121, it can also undergo an electrochemical reaction with the third metal wiring 123 to cause the third metal wiring 123 to be corroded. Since the third metal wiring 123 and the second metal wiring 122 are spaced and insulated, even if the third metal wiring 123 is corroded, it will not affect the second metal wiring 122, thereby protecting the second metal wiring 122 from corrosion.

[0058] Specifically, in one embodiment, the outer edge of the transparent conductive layer 14 on the side of the third metal wiring 123 facing away from the substrate 11, that is, the side of the transparent conductive layer 14 on the side of the third metal wiring 123 facing away from the substrate 11 away from the display area X, is located on the side of the frame glue 3 away from the display area X, that is, located on the outside of the frame glue 3. It can be understood that by setting the outer edge of the transparent conductive layer 14 on the side of the third metal wiring 123 away from the substrate 11 on the side of the frame glue 3 away from the display area X, the outer edge of the transparent conductive layer 14 on the side of the third metal wiring 123 away from the substrate 11 is exposed. When performing a high temperature and high humidity test, the transparent conductive layer 14 on the side of the third metal wiring 123 away from the substrate 11 is more likely to contact with water vapor, so that water vapor is more likely to enter the position of the via 131 of the insulating layer 13 on the side of the third metal wiring 123 away from the substrate 11. At the position of the via 131, the transparent conductive layer 14, water vapor and the third metal wiring 123 undergo an electrochemical reaction, thereby corroding the third metal wiring 123, which is more conducive to consuming water vapor, preventing water vapor from contacting the second metal wiring 122 and corroding the second metal wiring 122, and is more conducive to improving the corrosion resistance of the display panel 100.

[0059] That is, in this embodiment, during the high temperature and high humidity test, the first metal trace 121 arranged on the outside of the third metal trace 123 can come into contact with water vapor to produce a chemical reaction so that the first metal trace 121 is corroded, so as to consume the water vapor and protect the second metal trace 122 from coming into contact with the water vapor to prevent the second metal trace 122 from being corroded. At the same time, the third metal trace 123 arranged between the first metal trace 121 and the second metal trace 122 can also come into contact with water vapor. At the position of the via 131 of the insulating layer 13 on the side of the third metal trace 123 away from the substrate 11, the transparent conductive layer 14, the water vapor and the third metal trace 123 undergo an electrochemical reaction so that the third metal trace 123 is corroded, and the water vapor not consumed by the first metal trace 121 is further consumed to further protect the second metal trace 122 from coming into contact with the water vapor, so as to better prevent the second metal trace 122 from being corroded. Through the above configuration, the second metal wiring 122 is less likely to react with water vapor. By sacrificing the first metal wiring 121 and the third metal wiring 123, the remaining metal wirings in the display panel 100 are effectively protected from corrosion, thereby more effectively improving the corrosion resistance of the display panel 100.

[0060] Specifically, in the present embodiment, the gap between the first metal trace 121 and the third metal trace 123 is located on the side of the frame glue 3 away from the display area X, that is, located on the outside of the frame glue 3. The gap between the second metal trace 122 and the third metal trace 123 can be located on the side of the frame glue 3 close to the display area X, that is, it can be located on the inside of the frame glue 3, or it can also be located on the side of the frame glue 3 away from the display area X, that is, it can also be located on the outside of the frame glue 3, or it can also be covered by the frame glue 3, which can be designed as needed. It can be understood that the gap between the first metal trace 121 and the third metal trace 123 is located on the side of the frame glue 3 away from the display area X. When performing a high temperature and high humidity test, the first metal trace 121 and the third metal trace 123 can be made to be more susceptible to contact with water vapor to react and be corroded, thereby protecting the second metal trace 122 from corrosion. Preferably, the gap between the second metal wiring 122 and the third metal wiring 123 is located on the side of the frame glue 3 close to the display area X or is covered by the frame glue 3. The frame glue 3 can also block water vapor from entering the display area X side of the display panel 100 to better protect the second metal wiring 122 from corrosion and improve the corrosion resistance of the display panel 100.

[0061] In this embodiment, the arrangement of the first metal routing 121 and the second metal routing 122 can be the same as the arrangement in the first embodiment. For example, the length directions of the first metal routing 121 and the second metal routing 122 can extend along the circumference of the array substrate 1, and the first metal routing 121 and the second metal routing 122 can be arranged corresponding to one or more side edges of the array substrate 1; the length direction of the third metal routing 123 can also extend along the circumference of the array substrate 1. For example, the third metal routing 123 can be arranged corresponding to one or more side edges of the array substrate 1, and the shape of the third metal routing 123 can be roughly I-shaped, L-shaped or U-shaped, which can be designed as needed.

[0062] In another embodiment, Figure 8 As shown, the metal wiring layer 12 of the array substrate 1 may also only include the first metal wiring 121 and the second metal wiring 122 arranged at intervals, but not the third metal wiring 123. Different from the first embodiment, in this embodiment, the transparent conductive layer 14 is not provided on the side of the first metal wiring 121 of the array substrate 1 away from the substrate 11, and only the insulating layer 13 and the alignment film 15 are stacked in sequence. The structure at the corresponding position of the second metal wiring 122 is the same as that in the first embodiment, and the cross-sectional structure at the corresponding position of the first metal wiring 121 can refer to Figure 6 and Figure 7 The structure shown.

[0063] Specifically, in this embodiment, the outer edge of the transparent conductive layer 14 located on the side of the second metal wiring 122 away from the substrate 11 is covered by the frame glue 3, that is, the side of the transparent conductive layer 14 located on the side of the second metal wiring 122 away from the substrate 11 away from the display area X is wrapped by the frame glue 3 and will not be exposed. It can be understood that in this embodiment, since the metal wiring layer 12 only includes the first metal wiring 121 and the second metal wiring 122 arranged at intervals, and the transparent conductive layer 14 is not provided on the side of the first metal wiring 121 away from the substrate 11, the alignment film 15 on the side of the first metal wiring 121 away from the substrate 11 is in contact with water vapor, and the water vapor enters along the alignment film 15 to the position of the via 131 of the insulating layer 13 on the side of the first metal wiring 121 away from the substrate 11. At the position of the via 131, the water vapor contacts the first metal wiring 121 and a chemical reaction occurs, causing the first metal wiring 121 to be corroded; at the same time, by The outer edge of the transparent conductive layer 14 is covered by the frame glue 3, so that the transparent conductive layer 14 on the side of the second metal wiring 122 away from the substrate 11 will not be exposed to the outside and contact with water vapor, and water vapor is not easy to contact with the transparent conductive layer 14 and the alignment film 15 on the side of the second metal wiring 122 away from the substrate 11. It is not easy for water vapor to enter the position of the via 131 of the insulating layer 13 on the side of the second metal wiring 122 away from the substrate 11, and it is not easy to cause electrochemical reaction with the transparent conductive layer 14 and the second metal wiring 122 to cause the second metal wiring 122 to be corroded. Through the above configuration, the second metal wiring 122 can be effectively protected from corrosion, and the corrosion resistance of the display panel 100 can be effectively improved.

[0064] In other embodiments, the outer edge of the transparent conductive layer 14 located on the side of the second metal wiring 122 away from the substrate 11 may also be located on the side of the frame glue 3 close to the display area X, that is, the second metal wiring 122 and the transparent conductive layer 14 on the side away from the substrate 11 are both located on the inner side of the frame glue 3. The frame glue 3 can block water vapor from entering the side close to the display area X, and can also prevent water vapor from contacting the transparent conductive layer 14 and the second metal wiring 122 to cause an electrochemical reaction, resulting in corrosion of the second metal wiring 122.

[0065] See also Fig. 9 , Fig. 9 yes Figure 1 A partial enlarged schematic diagram of a fourth embodiment of an area S of a display panel is provided.

[0066] See also Fig. 9In some embodiments, the via hole 131 at the outer edge of the first metal trace 121 of the insulating layer 13 located on the side away from the substrate 11 of the first metal trace 121 is a long hole 132, the long hole 132 penetrates the insulating layer 13 and exposes a portion of the first metal trace 121, and the length direction of the long hole 132 extends along the extension direction of the first metal trace 121. Specifically, the first metal trace 121 extends along the circumference of the array substrate 1, and the length direction of the long hole 132 also extends along the circumference of the array substrate 1. It should be noted that the long hole 132 here means that the length dimension of the via hole 131 is much larger than its width dimension.

[0067] That is, Fig. 9 As shown, a plurality of vias 131 are provided in the insulating layer 13 on the side of the first metal wiring 121 away from the substrate 11. The vias 131 at the positions corresponding to the portions of the first metal wiring 121 away from the side of the display area X are long holes 132, and the vias 131 at the remaining positions are vias 131 of normal sizes. Specifically, the length and width dimensions of the vias 131 at the remaining positions are not much different.

[0068] It can be understood that in this embodiment, the via 131 at the outer edge of the first metal wiring 121 of the insulating layer 13 located on the side of the first metal wiring 121 away from the substrate 11 is set as a long hole 132, so that the part of the first metal wiring 121 away from the display area X (that is, the outer edge of the first metal wiring 121) is exposed as much as possible by the long hole 132 in the insulating layer 13. At the position of the long hole 132, the contact area between the outer edge of the first metal wiring 121 and the alignment film 15 or the transparent conductive layer 14 on the side of the first metal wiring 121 away from the substrate 11 is larger, and when the high temperature and high humidity test is performed, the water vapor and the first metal wiring are not in contact. When 121 contacts the alignment film 15 on the side away from the substrate 11, water vapor enters the position of the long hole 132 along the alignment film 15, and is more likely to contact the first metal wiring 121 to produce a chemical or electrochemical reaction, causing the first metal wiring 121 to be corroded. That is, by increasing the contact area between the water vapor and the first metal wiring 121, the water vapor is absorbed and consumed by the first metal wiring 121 as much as possible, so that the water vapor can be consumed more effectively, and it is more conducive to preventing the second metal wiring 122 from being corroded by contact with the water vapor, so as to further enhance the corrosion resistance of the display panel 100 and improve the corrosion phenomenon of the VCOM wiring of narrow-frame or borderless products.

[0069] like Fig. 9As shown, in a specific embodiment, the metal routing layer 12 and the remaining film layer structure on the side away from the substrate 11 are the same as the structure in the second embodiment, and the only difference is that, in this embodiment, the insulating layer 13 located on the side of the first metal routing 121 away from the substrate 11, the via 131 corresponding to the outer edge of the first metal routing 121 is a long hole 132, while the size of the via 131 in the second embodiment is a normal size.

[0070] Specifically, Fig. 9 As shown, the metal wiring layer 12 includes a first metal wiring 121, a second metal wiring 122 and a third metal wiring 123. The third metal wiring 123 is located between the first metal wiring 121 and the second metal wiring 122, and is spaced apart from and insulated from the first metal wiring 121 and the second metal wiring 122. The second metal wiring 122 and the third metal wiring 123 are both provided with an insulating layer 13, a transparent conductive layer 14 and an alignment film 15 on the side facing away from the substrate 11, while the first metal wiring 121 is not provided with a transparent conductive layer 14 on the side facing away from the substrate 11. The cross-sectional structure at the corresponding position of the first metal wiring 121 can be referred to Figure 6 and Figure 7 At the positions of the long hole 132 and the remaining vias 131 , the first metal wiring 121 is in direct contact with the alignment film 15 . At the positions of the vias 131 , water vapor is in direct contact with the first metal wiring 121 and chemically reacts, causing the first metal wiring 121 to be corroded.

[0071] In other embodiments, a transparent conductive layer 14 may also be provided on the side of the first metal trace 121 facing away from the substrate 11, and water vapor enters the position of the via 131 along the alignment film 15. At the position of the via 131, the transparent conductive layer 14, water vapor and the first metal trace 121 undergo an electrochemical reaction, so that the first metal trace 121 is corroded. Alternatively, the metal trace layer 12 and the remaining film layer structure on the side facing away from the substrate 11 may also be the same as the structure in the first embodiment or the third embodiment, the only difference being that the insulating layer 13 is located on the side of the first metal trace 121 facing away from the substrate 11, and the via 131 at the outer edge corresponding to the first metal trace 121 is a long hole 132, while the size of the via 131 in the first embodiment and the third embodiment is a normal size. The design can be made as needed, and this application does not limit this.

[0072] In some embodiments, the long hole 132 may be arranged corresponding to the entire position of the outer edge of the first metal trace 121, or may be arranged corresponding to a part of the outer edge of the first metal trace 121, that is, the length of the long hole 132 may be substantially equal to the extension length of the outer edge of the first metal trace 121, or may be much smaller than the extension length of the outer edge of the first metal trace 121. For example, the first metal trace 121 extends along the circumference of the array substrate 1, and may be arranged corresponding to one or more side edges of the array substrate 1. When the first metal trace 121 is arranged corresponding to multiple side edges of the array substrate 1, for example, when the shape of the first metal trace 121 is L-shaped or U-shaped, the long hole 132 arranged corresponding to the outer edge of the first metal trace 121 may be I-shaped, that is, the long hole 132 may be arranged corresponding to only one side edge of the array substrate 1. Alternatively, the length of the long hole 132 may be substantially equal to the extension length of the outer edge of the first metal trace 121. For example, when the first metal trace 121 is in an I-shape, L-shape or U-shape, the long hole 132 corresponding to the outer edge of the first metal trace 121 may also be correspondingly set to be I-shape, L-shape or U-shape. The design may be based on actual needs, and the present application does not limit this.

[0073] In the present application, by setting the display panel 100 to any one of the structures described above, the corrosion resistance of the display panel 100 can be effectively improved, and the problem in the prior art that the metal wiring layer 12 of the narrow-frame or borderless display panel 100 is easily corroded by electrochemical reaction can be solved. At the same time, it is also beneficial to reduce the coating accuracy requirements of the coating equipment of the alignment film 15 of the narrow-frame or borderless display panel 100, thereby reducing the production cost, so that even if low-precision coating equipment is used to coat the alignment film 15, the alignment film 15 spreads to the coating position of the frame glue 3, and the corrosion resistance of the narrow-frame or borderless display panel 100 can still be effectively guaranteed.

[0074] See also Fig.10 , Fig.10 It is a schematic structural diagram of an embodiment of a display device provided in the present application.

[0075] See also Fig.10 The present application also provides a display device 300, which includes a display panel 100 and a backlight source 200. The backlight source 200 is arranged on one side of the display panel 100, and the backlight source 200 is used to provide backlight for the display panel 100 so that the display panel 100 can realize a picture display function.

[0076] Specifically, the specific structure of the display panel 100 may be any one of the display panels 100 in the above embodiments, and may be designed or selected as needed.

[0077] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, comprising an array substrate and an opposing substrate arranged opposite to each other, and a sealant connected between the array substrate and the opposing substrate; the display panel comprises a display area and a non-display area arranged outside the display area; characterized in that: In the non-display area, the array substrate includes a substrate and a metal wiring layer, an insulating layer, a transparent conductive layer and an alignment film which are located on a side of the substrate close to the counter substrate and are stacked in sequence; a plurality of via holes are arranged in the insulating layer, and the via holes penetrate the insulating layer and expose a portion of the metal wiring layer; The metal wiring layer at least includes a first metal wiring and a second metal wiring arranged at intervals, the first metal wiring is arranged close to the edge of the array substrate, and the second metal wiring is located on a side of the first metal wiring close to the display area; The insulating layer, the transparent conductive layer and the alignment film are disposed on a side of the second metal wiring facing away from the substrate, and at least the insulating layer and the alignment film are disposed on a side of the first metal wiring facing away from the substrate.

2. The display panel according to claim 1, characterized in that: The transparent conductive layer is disposed on a side of the first metal wiring facing away from the substrate; the transparent conductive layer covers a side of the insulating layer away from the substrate and extends into the via hole to contact the first metal wiring.

3. The display panel according to claim 1, characterized in that: The transparent conductive layer is not disposed on a side of the first metal wiring facing away from the substrate.

4. The display panel according to claim 3, characterized in that: The metal routing layer further includes a third metal routing, wherein the third metal routing is located between the first metal routing and the second metal routing, and is spaced apart from the first metal routing and the second metal routing; The insulating layer, the transparent conductive layer and the alignment film are arranged on a side of the third metal wiring facing away from the substrate.

5. The display panel according to claim 4, characterized in that: The outer edge of the transparent conductive layer located on the side of the third metal wiring facing away from the substrate is located on the side of the frame glue away from the display area.

6. The display panel according to claim 5, characterized in that: The gap between the first metal wiring and the third metal wiring is located on a side of the frame glue away from the display area; The gap between the second metal wiring and the third metal wiring is located on a side of the frame glue close to the display area, or is located on a side of the frame glue away from the display area, or is covered by the frame glue.

7. The display panel according to claim 3, characterized in that: The metal wiring layer only includes first metal wiring and second metal wiring that are spaced apart from each other; The outer edge of the transparent conductive layer located on the side of the second metal wiring facing away from the substrate is covered by the frame glue.

8. The display panel according to any one of claims 1 to 7, characterized in that: The via hole located on the insulating layer on the side of the first metal trace away from the substrate and corresponding to the outer edge of the first metal trace is a long hole that penetrates the insulating layer and has a length direction extending along the extension direction of the first metal trace.

9. The display panel according to claim 1, characterized in that: The alignment film is at least partially located between the frame glue and the substrate, and the material of the alignment film is polyimide; the material of the transparent conductive layer is indium tin oxide.

10. A display device, characterized in that: include: The display panel according to any one of claims 1 to 9; A backlight source is arranged on one side of the display panel and is used to provide backlight for the display panel.

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