Capacitor

By designing specific capacitor components and terminal board structures in capacitors and connecting the outer leads and terminal boards through welding, the challenges of existing capacitors in reducing ESL and miniaturization are solved, and efficient current path optimization and magnetic field cancellation are achieved, achieving low ESL and miniaturization effects.

CN119895521APending Publication Date: 2025-04-25PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
CN202380065912.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-09-28
Filing Date
2023-09-07
Publication Date
2025-04-25

AI Technical Summary

Technical Problem

Existing capacitors have challenges in reducing ESL (Equivalent Series Inductance) and miniaturizing.

Method used

A capacitor is designed, including a first capacitor element and a second capacitor element, and is reduced in size and reduced in size by a specific structural arrangement and resin portion covering. Specific measures include providing a first anode terminal board, a second anode terminal board, a first cathode terminal board and a second cathode terminal board in the capacitor, and connecting the outer lead portion and the terminal board through welding to ensure optimization of the current path and cancellation of the magnetic field.

Benefits of technology

Through this design, capacitors can effectively reduce ESL, achieve miniaturization, and increase capacity per unit volume while reducing production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The capacitor includes a first capacitor element, a second capacitor element, a first anode terminal plate, a second anode terminal plate, a first cathode terminal plate, a second cathode terminal plate, and a resin portion. The second capacitor element is adjacent to the first capacitor element in a second direction orthogonal to the first direction. In the first capacitor element, in the first direction, a first outer lead portion of a first anode lead and a first cathode are arranged in the order of the first outer lead portion and the first cathode. In the second capacitor element, a second cathode and a second outer lead portion of a second anode lead are arranged in the order of the second cathode and the second outer lead portion in the first direction. The first outer lead portion overlaps the second cathode in a side view from the second direction. The second outer lead portion overlaps the first cathode in a side view.
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Description

Technical Field

[0001] The present disclosure generally relates to a capacitor, and more particularly, to a capacitor having a plurality of capacitor elements. Background Art

[0002] Conventionally, as a capacitor, there is known a decoupling device including a first capacitor element, a second capacitor element, a pair of anode terminals, a cathode terminal, and a resin layer (resin portion) (Patent Document 1). The first capacitor element includes an anode body (first anode), an anode portion (first anode lead), a dielectric layer (first dielectric layer), and a cathode portion (first cathode). The second capacitor element includes an anode body (second anode), an anode portion (second anode lead), a dielectric layer (second dielectric layer), and a cathode portion (second cathode).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. 2010 / 023990 Summary of the invention

[0006] A capacitor of one aspect of the present disclosure comprises a first capacitor element, a second capacitor element, a first anode terminal plate, a second anode terminal plate, a first cathode terminal plate, a second cathode terminal plate, and a resin portion. The first capacitor element comprises a first anode, a first dielectric layer, a first cathode, and a first anode lead. The first anode has an outer peripheral surface and a first end surface and a second end surface separated from each other in a first direction. The first dielectric layer covers the first end surface, the second end surface, and the outer peripheral surface of the first anode. The first cathode covers the first dielectric layer. The first anode lead has a first outer lead portion protruding from the first end surface of the first anode. The second capacitor element is adjacent to the first capacitor element in a second direction orthogonal to the first direction. The second capacitor element comprises a second anode, a second dielectric layer, a second cathode, and a second anode lead. The second anode has an outer peripheral surface and a first end surface and a second end surface separated from each other in the first direction. The second dielectric layer covers the first end face, the second end face, and the outer peripheral face of the second anode. The second cathode covers the second dielectric layer. The second anode lead has a second outer lead portion protruding from the first end face of the second anode. The first anode terminal plate has a first anode terminal portion. The first anode terminal plate is connected to the first outer lead portion. The second anode terminal plate has a second anode terminal portion. The second anode terminal plate is connected to the second outer lead portion. The first cathode terminal plate has a first cathode terminal portion. The first cathode terminal plate is connected to the first cathode. The second cathode terminal plate has a second cathode terminal portion. The second cathode terminal plate is connected to the second cathode. The resin portion covers the first capacitor element and the second capacitor element. The resin portion exposes the first anode terminal portion, the second anode terminal portion, the first cathode terminal portion, and the second cathode terminal portion. In the first capacitor element, the first outer lead portion and the first cathode are arranged in the order of the first outer lead portion and the first cathode in the first direction. In the second capacitor element, the second cathode and the second outer lead portion are arranged in the order of the second cathode and the second outer lead portion in the first direction. When viewed from the side in the second direction, the first outer lead portion overlaps with the second cathode. When viewed from the side, the second outer lead portion overlaps with the first cathode.

[0007] A capacitor according to one aspect of the present disclosure can achieve low ESL and miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a perspective view of the capacitor according to the first embodiment.

[0009] Figure 2 This is a front view of the capacitor according to the first embodiment.

[0010] Figure 3 This is a top view of the capacitor according to Embodiment 1.

[0011] Figure 4 This is a bottom view of the capacitor according to Embodiment 1.

[0012] Figure 5 This is a side view of the capacitor according to Embodiment 1.

[0013] Figure 6 The capacitor of the first embodiment Figure 3 Cross-sectional view of the Y1-Y1 line.

[0014] Figure 7 The capacitor of the first embodiment Figure 3 Cross-sectional view of the Y2-Y2 line.

[0015] Figure 8 The capacitor of the first embodiment Figure 3 A cross-sectional view along the line X1-X1.

[0016] Fig. 9 A~ Fig. 9 C is an explanatory diagram of the method for manufacturing the capacitor according to the first embodiment.

[0017] Fig.10 This is a diagram for explaining the operation of the capacitor according to the first embodiment.

[0018] Fig.11 This is a front view of a capacitor according to Modification 1 of Embodiment 1.

[0019] Fig.12 This is a perspective view of a capacitor according to Modification 2 of Embodiment 1.

[0020] Fig.13 This is a front view of a capacitor according to Modification 2 of Embodiment 1.

[0021] Fig.14 It is a top view of a capacitor according to Modification 3 of Embodiment 1.

[0022] Fig.15 This is a bottom view of a capacitor according to Modification 3 of Embodiment 1.

[0023] Fig.16 This is a front view of a capacitor according to Modification 3 of Embodiment 1.

[0024] Fig.17 This is a top view of the capacitor according to the second embodiment.

[0025] Fig.18 This is a bottom view of the capacitor according to Embodiment 2.

[0026] Fig.19 This is a top view of the capacitor according to the third embodiment.

[0027] Fig. 20 This is a bottom view of the capacitor according to Embodiment 3.

[0028] Fig.21 The capacitor of Embodiment 3 is Fig.19 A cross-sectional view along the line X1-X1.

[0029] Fig. 22 The capacitor of Embodiment 3 is Fig.19 Cross-sectional view along line X2-X2.

[0030] Fig.23 The capacitor of Embodiment 3 is Fig.19 Cross-sectional view along line X3-X3.

[0031] Fig.24 This is a bottom view of a capacitor according to Modification 4 of Embodiment 1.

[0032] Fig.25 This is a bottom view of a capacitor according to Modification 5 of Embodiment 1.

[0033] Fig.26 This is a bottom view of a capacitor according to variation 6 of embodiment 1.

[0034] Fig. 27 This is a front view of a capacitor according to a seventh variation of the first embodiment.

[0035] Fig.28 This is a front view of a capacitor according to Variation 8 of Embodiment 1.

[0036] Fig.29 This is a front view of a capacitor according to variation 9 of embodiment 1. DETAILED DESCRIPTION

[0037] In addition to reducing ESL (Equivalent Series Inductance), capacitors are also sometimes required to be miniaturized. The present disclosure provides a capacitor capable of achieving both low ESL and miniaturization.

[0038] Each drawing described in the following embodiment is a schematic drawing, and the size and thickness ratios of each component in the drawing do not necessarily reflect the actual dimensional ratio.

[0039] (Implementation Method 1)

[0040] The following is based on Figures 1 to 10 Capacitor 10 according to Embodiment 1 will be described.

[0041] (1) Summary

[0042] like Figure 1 to Figure 5 As shown, the capacitor 10 of the first embodiment includes a first capacitor element 1 and a second capacitor element 2. The capacitor 10 is, for example, a surface mount electrolytic capacitor, and includes a first anode terminal plate 5, a second anode terminal plate 6, a first cathode terminal plate 7, and a second cathode terminal plate 8 as a plurality of external terminals for mounting on a circuit board such as a motherboard. The first anode terminal plate 5, the second anode terminal plate 6, the first cathode terminal plate 7, and the second cathode terminal plate 8 are joined to the circuit board using solder or the like.

[0043] The first capacitor element 1 is a solid electrolytic capacitor having a first anode lead 14 and a first cathode 13. The second capacitor element 2 is a solid electrolytic capacitor having a second anode lead 24 and a second cathode 23. In the capacitor 10, the first anode lead 14 of the first capacitor element 1 is connected to the first anode terminal plate 5, and the first cathode 13 of the first capacitor element 1 is connected to the first cathode terminal plate 7. In addition, in the capacitor 10, the second anode lead 24 of the second capacitor element 2 is connected to the second anode terminal plate 6, and the second cathode 23 is connected to the second cathode terminal plate 8. The resin portion 9 covers the first capacitor element 1 and the second capacitor element 2. Figure 6 to Figure 8 As shown, resin portion 9 exposes a portion of first anode terminal plate 5 , a portion of second anode terminal plate 6 , a portion of first cathode terminal plate 7 , and a portion of second cathode terminal plate 8 .

[0044] (2) Details

[0045] Reference Figures 1 to 10 The structure of capacitor 10 according to Embodiment 1 will be described in detail.

[0046] like Figures 1 to 8 As shown, capacitor 10 includes first capacitor element 1 , second capacitor element 2 , first anode terminal plate 5 , second anode terminal plate 6 , first cathode terminal plate 7 , second cathode terminal plate 8 , and resin portion 9 .

[0047] (2.1) First capacitor element

[0048] like Figure 6 and Figure 8 As shown in FIG. 1 , the first capacitor element 1 includes a first anode (first anode body) 11, a first dielectric layer 12, a first solid electrolyte layer 15, a first cathode 13, and a first anode lead 14. Figure 1 to Figure 5 In the figures, etc., illustration of the first solid electrolyte layer 15 is omitted.

[0049] The first anode 11 has conductivity. The material of the first anode 11 includes, for example, tantalum. The material of the first anode 11 is not limited to tantalum, and may be, for example, aluminum, niobium, titanium, zirconium, or hafnium, or may be an alloy including one or more metals selected from the group consisting of tantalum, aluminum, niobium, titanium, zirconium, and hafnium.

[0050] The first anode 11 is in the shape of a rectangular parallelepiped and has an outer peripheral surface 113 and a first end surface 111 and a second end surface 112 separated from each other in a first direction D1. The outer peripheral surface 113 includes, for example, four side surfaces 113a to 113d (hereinafter also referred to as the first side surface 113a, the second side surface 113b, the third side surface 113c, and the fourth side surface 113d) connecting the outer edge of the first end surface 111 and the outer edge of the second end surface 112, and does not include the first end surface 111 and the second end surface 112. The first anode 11 is, for example, a porous body containing a valve metal, and more specifically, a porous sintered body containing tantalum. The first anode 11 is not limited to a porous sintered body, and may be, for example, a metal foil whose surface side is partially porous.

[0051] The first dielectric layer 12 covers the first end face 111, the second end face 112, and the outer peripheral surface 113 of the first anode 11. More specifically, the first dielectric layer 12 covers the surface of the porous body constituting the first anode 11. The material of the first dielectric layer 12 includes, for example, tantalum oxide. The first dielectric layer 12 can be formed, for example, by anodizing the first anode 11. The material of the first dielectric layer 12 is not limited to tantalum oxide, and may be, for example, aluminum oxide, niobium oxide, titanium oxide, zirconium oxide, or hafnium oxide. The first dielectric layer 12 is formed along the surface of the porous body constituting the first anode 11.

[0052] The first solid electrolyte layer 15 covers the first dielectric layer 12. The material of the first solid electrolyte layer 15 includes, for example, a conductive polymer. As the conductive polymer, for example, polypyrrole, polythiophene, polyaniline, and derivatives thereof can be used. The material of the first solid electrolyte layer 15 is not limited to the conductive polymer, and may be, for example, a manganese compound.

[0053] The first cathode 13 covers the first solid electrolyte layer 15. That is, the first cathode 13 covers the first dielectric layer 12 via the first solid electrolyte layer 15. The first cathode 13 includes, for example, a first conductive layer 13b covering the first solid electrolyte layer 15 and a first cathode layer 13c covering the first conductive layer 13b.

[0054] The first conductive layer 13b is, for example, a carbon layer having electrical conductivity. The carbon layer having electrical conductivity includes, for example, a conductive carbon material such as graphite.

[0055] The first cathode layer 13c includes, for example, a metal (eg, silver) and a resin. The first cathode layer 13c is formed using a conductive paste (eg, a silver paste).

[0056] The first cathode 13 has an outer peripheral surface 133 and an end surface 132 overlapping with the second end surface 112 of the first anode 11 in the first direction D1. The outer peripheral surface 133 of the first cathode 13 includes a first side surface 133a opposite to the first cathode terminal plate 7, a second side surface 133b parallel to the first side surface 133a, a third side surface 133c opposite to the second capacitor element 2, and a fourth side surface 133d parallel to the third side surface 133c. The first side surface 133a is a surface along the first side surface 113a of the first anode 11. The second side surface 133b is a surface along the second side surface 113b of the first anode 11. The third side surface 133c is a surface along the third side surface 113c of the first anode 11. The fourth side surface 133d is a surface along the fourth side surface 113d of the first anode 11.

[0057] The material of the first anode lead 14 is metal. The material of the first anode lead 14 may be the same material as that of the first anode 11, or may be a material different from that of the first anode 11. The first anode lead 14 includes a first inner lead portion 141 embedded in the first anode 11 and a first outer lead portion 142 protruding from the first end surface 111 of the first anode 11. The first anode lead 14 is linear, and a cross section perpendicular to the first direction D1 is circular.

[0058] (2.2) Second capacitor element

[0059] like Figure 7 and Figure 8 As shown in FIG. 1 , in the second direction D2 orthogonal to the first direction D1, the second capacitor element 2 is adjacent to the first capacitor element 1. In other words, the second capacitor element 2 is arranged to be aligned with the first capacitor element 1 in the second direction D2.

[0060] The second capacitor element 2 includes a second anode (second anode body) 21, a second dielectric layer 22, a second solid electrolyte layer 25, a second cathode 23, and a second anode lead 24. Figure 1 , Figure 3 and Figure 4 The second solid electrolyte layer 25 is omitted in the illustration.

[0061] The second anode 21 has conductivity. The material of the second anode 21 is the same as that of the first anode 11 .

[0062] The second anode 21 has an outer peripheral surface 213 and a first end surface 211 and a second end surface 212 separated from each other in the first direction D1. The outer peripheral surface 213 includes, for example, four side surfaces 213a to 213d (hereinafter also referred to as the first side surface 213a, the second side surface 213b, the third side surface 213c, and the fourth side surface 213d) connecting the outer edge of the first end surface 211 and the outer edge of the second end surface 212, and does not include the first end surface 211 and the second end surface 212. The second anode 21 is, for example, a porous body containing a valve metal, and more specifically, a porous sintered body containing tantalum. The second anode 21 is not limited to a porous sintered body, and may be, for example, a metal foil whose surface side is partially porous.

[0063] The second dielectric layer 22 covers the first end face 211, the second end face 212, and the outer peripheral surface 213 of the second anode 21. More specifically, the second dielectric layer 22 covers the surface of the porous body constituting the second anode 21. The material of the second dielectric layer 22 is the same as that of the first dielectric layer 12, for example.

[0064] The second solid electrolyte layer 25 covers the second dielectric layer 22. The material of the second solid electrolyte layer 25 is the same as that of the first solid electrolyte layer 15, for example.

[0065] The second cathode 23 covers the second solid electrolyte layer 25. That is, the second cathode 23 covers the second dielectric layer 22 via the second solid electrolyte layer 25. The second cathode 23 includes, for example, a second conductive layer 23b covering the second solid electrolyte layer 25 and a second cathode layer 23c covering the second conductive layer 23b.

[0066] The second conductive layer 23b is, for example, a carbon layer having electrical conductivity. The carbon layer having electrical conductivity includes, for example, a conductive carbon material such as graphite. The material of the second conductive layer 23b is the same as that of the first conductive layer 13b.

[0067] The second cathode layer 23c includes, for example, a metal (eg, silver) and a resin. The second cathode layer 23c is formed using a conductive paste (eg, a silver paste). The material of the second cathode layer 23c is the same as that of the first cathode layer 13c.

[0068] The second cathode 23 has an outer peripheral surface 233 and an end surface 232 overlapping with the second end surface 112 of the second anode 21 in the first direction D1. The outer peripheral surface 233 of the second cathode 23 includes a first side surface 233a opposite to the second cathode terminal plate 8, a second side surface 233b parallel to the first side surface 233a, a third side surface 233c opposite to the first capacitor element 1, and a fourth side surface 233d parallel to the third side surface 233c. The first side surface 233a is a surface along the first side surface 213a of the second anode 21. The second side surface 233b is a surface along the second side surface 213b of the second anode 21. The third side surface 233c is a surface along the third side surface 213c of the second anode 21. The fourth side surface 233d is a surface along the fourth side surface 213d of the second anode 21.

[0069] The material of the second anode lead 24 is the same as that of the first anode lead 14. The second anode lead 24 has a second inner lead portion 241 embedded in the second anode 21 and a second outer lead portion 242 protruding from the first end surface 211 of the second anode 21. The second anode lead 24 is linear, and a cross section perpendicular to the first direction D1 is circular.

[0070] (2.3) 1st anode terminal plate, 2nd anode terminal plate, 1st cathode terminal plate and 2nd cathode terminal plate

[0071] The first anode terminal plate 5, the second anode terminal plate 6, the first cathode terminal plate 7 and the second cathode terminal plate 8 (see Figure 3 and Figure 4 ) includes, for example, copper or a copper alloy. The thicknesses of the first anode terminal plate 5, the second anode terminal plate 6, the first cathode terminal plate 7, and the second cathode terminal plate 8 are the same as each other. The first anode terminal plate 5, the second anode terminal plate 6, the first cathode terminal plate 7, and the second cathode terminal plate 8 are formed, for example, from one lead frame, but are not limited thereto.

[0072] In the capacitor 10, in the first direction D1, the first anode terminal plate 5 and the first cathode terminal plate 7 are arranged in the order of the first anode terminal plate 5 and the first cathode terminal plate 7. In addition, in the capacitor 10, in the first direction D1, the second cathode terminal plate 8 and the second anode terminal plate 6 are arranged in the order of the second cathode terminal plate 8 and the second anode terminal plate 6. In addition, in the capacitor 10, in the second direction D2, the first anode terminal plate 5 and the second cathode terminal plate 8 are arranged in the order of the first anode terminal plate 5 and the second cathode terminal plate 8. In addition, in the capacitor 10, in the second direction D2, the first cathode terminal plate 7 and the second anode terminal plate 6 are arranged in the order of the first cathode terminal plate 7 and the second anode terminal plate 6.

[0073] The first anode terminal plate 5 is connected to the first outer lead portion 142 of the first anode lead 14. The first anode terminal plate 5 is, for example, in the shape of a letter L, and includes a first anode terminal portion 51 disposed along the lower surface 91 of the resin portion 9 and a first rising portion 52 protruding in the third direction D3 from the first anode terminal portion 51 toward the first outer lead portion 142 of the first anode lead 14. The first anode terminal portion 51 is exposed from the lower surface 91 of the resin portion 9. A first positioning groove 52b into which a part of the first outer lead portion 142 enters is formed at the top end 52a of the first rising portion 52. The first rising portion 52 and the first outer lead portion 142 of the first anode lead 14 are connected, for example, by welding.

[0074] The second anode terminal plate 6 is connected to the second outer lead portion 242 of the second anode lead 24. The second anode terminal plate 6 is, for example, in the shape of a letter L, and includes a second anode terminal portion 61 disposed along the lower surface 91 of the resin portion 9 and a second rising portion 62 protruding in the third direction D3 from the second anode terminal portion 61 toward the second outer lead portion 242 of the second anode lead 24. The second anode terminal portion 61 is exposed from the lower surface 91 of the resin portion 9. A second positioning groove 62b into which a part of the second outer lead portion 242 enters is formed at a top end 62a of the second rising portion 62. The second rising portion 62 and the second outer lead portion 242 of the second anode lead 24 are connected, for example, by welding.

[0075] The first cathode terminal plate 7 is electrically connected to the first cathode 13 of the first capacitor element 1. The first cathode terminal plate 7 has a first cathode terminal portion 71, a first mounting portion 72, and a first protruding portion 73.

[0076] The first cathode terminal portion 71 is disposed along the lower surface 91 of the resin portion 9 and is exposed from the lower surface 91 of the resin portion 9. The first cathode terminal portion 71 is, for example, a quadrilateral shape in a plan view, but is not limited thereto.

[0077] The first mounting portion 72 extends from the top of the first step portion 75 protruding obliquely upward from the first cathode terminal portion 71 in the direction opposite to the first direction D1. The first mounting portion 72 is located between the lower surface 91 of the resin portion 9 and the first cathode 13 of the first capacitor element 1 in the third direction D3. The first mounting portion 72 is separated from the lower surface 91 of the resin portion 9 and the first cathode 13 of the first capacitor element 1. The first mounting portion 72 is, for example, a quadrilateral shape when viewed from above. In the first direction D1, the length of the first mounting portion 72 is shorter than the length of the first cathode 13 of the first capacitor element 1. The first mounting portion 72 overlaps with the first cathode 13 in the third direction D3 orthogonal to the first direction D1 and the second direction D2, and the first capacitor element 1 is mounted. The capacitor 10 further includes a first bonding portion (adhesive layer) 19 existing between the first cathode 13 of the first capacitor element 1 and the first mounting portion 72. The first bonding portion 19 has conductivity. The first bonding portion 19 includes, for example, a metal (for example, silver) and a resin. The first bonding portion 19 is formed using, for example, a conductive paste (for example, a silver paste).

[0078] The first protrusion 73 protrudes from the first mounting portion 72 in the third direction D3 and is located between the first cathode 13 and the second cathode 23. The first protrusion 73 has a function as a positioning portion in the second direction D2 of the first capacitor element 1. In the capacitor 10, the first protrusion 73 is in contact with the third side surface 133c of the first cathode 13 of the first capacitor element 1, but the present invention is not limited thereto, and the first joining portion 19 may extend between the first protrusion 73 and the third side surface 133c of the first cathode 13 of the first capacitor element 1. In addition, in the capacitor 10, the first protrusion 73 and the third side surface 233c of the second cathode 23 of the second capacitor element 2 are separated from each other and do not contact each other.

[0079] The second cathode terminal plate 8 is electrically connected to the second cathode 23 of the second capacitor element 2. The second cathode terminal plate 8 has a second cathode terminal portion 81, a second mounting portion 82, and a second protruding portion 83.

[0080] The second cathode terminal portion 81 is arranged along the lower surface 91 of the resin portion 9 and is exposed from the lower surface 91 of the resin portion 9. The second cathode terminal portion 81 is, for example, a quadrilateral shape in a plan view, but is not limited thereto.

[0081] The second mounting portion 82 extends from the top end of the second step portion 85 protruding obliquely upward from the second cathode terminal portion 81 in the first direction D1. The second mounting portion 82 is located between the lower surface 91 of the resin portion 9 and the second cathode 23 of the second capacitor element 2 in the third direction D3. The second mounting portion 82 is separated from the lower surface 91 of the resin portion 9 and the second cathode 23 of the second capacitor element 2. The second mounting portion 82 is, for example, a quadrilateral shape when viewed from above. In the first direction D1, the length of the second mounting portion 82 is shorter than the length of the second cathode 23 of the second capacitor element 2. The second mounting portion 82 overlaps with the second cathode 23 in the third direction D3 and mounts the second capacitor element 2. The capacitor 10 further includes a second bonding portion (adhesive layer) 29 existing between the second cathode 23 of the second capacitor element 2 and the second mounting portion 82. The second bonding portion 29 has conductivity. The second bonding portion 29 contains, for example, a metal (for example, silver) and a resin. The second bonding portion 29 is formed using, for example, a conductive paste (for example, silver paste).

[0082] The second protrusion 83 protrudes from the second mounting portion 82 in the third direction D3 and is located between the second cathode 23 and the first cathode 13. The second protrusion 83 has a function as a positioning portion in the second direction D2 of the second capacitor element 2. In the capacitor 10, the second protrusion 83 is in contact with the third side surface 233c of the second cathode 23 of the second capacitor element 2, but the present invention is not limited thereto, and the second joining portion 29 may extend between the second protrusion 83 and the third side surface 233c of the second cathode 23 of the second capacitor element 2. In addition, in the capacitor 10, the second protrusion 83 and the third side surface 133c of the first cathode 13 of the first capacitor element 1 are separated from each other and do not contact each other.

[0083] In the capacitor 10 , the lower surface of the first anode terminal 51 , the lower surface of the second anode terminal 61 , the lower surface of the first cathode terminal 71 , and the lower surface of the second cathode terminal 81 are located on the same plane.

[0084] In the capacitor 10 of the first embodiment, the first cathode terminal plate 7 and the second cathode terminal plate 8 are integrated. In other words, in the capacitor 10 of the first embodiment, the first cathode terminal plate 7 and the second cathode terminal plate 8 are formed integrally by one conductive plate. That is, in the capacitor 10 of the first embodiment, the first cathode terminal plate 7 and the second cathode terminal plate 8 are connected without the aid of another member.

[0085] The first anode terminal plate 5 and the second anode terminal plate 6 are disposed apart from each other and are electrically insulated from each other.

[0086] (2.4) Resin part

[0087] like Figure 6 to Figure 8As shown, the resin portion 9 covers the first capacitor element 1 and the second capacitor element 2. In addition, the resin portion 9 covers the first rising portion 52 of the first anode terminal plate 5, the second rising portion 62 of the second anode terminal plate 6, the first mounting portion 72 and the first protruding portion 73 of the first cathode terminal plate 7, and the second mounting portion 82 and the second protruding portion 83 of the second cathode terminal plate 8.

[0088] The resin portion 9 is a molded portion having a substantially rectangular parallelepiped shape. The resin portion 9 has a lower surface 91, an upper surface 92, a first side surface 93, a second side surface 94, a third side surface 95, and a fourth side surface 96. The lower surface 91 and the upper surface 92 of the resin portion 9 are located on opposite sides to each other in the third direction D3 when viewed from the first capacitor element 1 and the second capacitor element 2. The lower surface 91 and the upper surface 92 of the resin portion 9 intersect with the third direction D3. The first side surface 93 and the second side surface 94 of the resin portion 9 are located on opposite sides to each other in the first direction D1 when viewed from the first capacitor element 1 and the second capacitor element 2. The third side surface 95 and the fourth side surface 96 of the resin portion 9 are located on opposite sides to each other in the second direction D2 when viewed from the first capacitor element 1 and the second capacitor element 2. Regarding the resin portion 9 , in consideration of mold release properties in the molding process of the resin portion 9 , the angles formed by the first side surface 93 , the second side surface 94 , the third side surface 95 , and the fourth side surface 96 with the lower surface 91 may be smaller than 90 degrees.

[0089] The resin portion 9 exposes the first anode terminal portion 51 , the second anode terminal portion 61 , the first cathode terminal portion 71 , and the second cathode terminal portion 81 on a lower surface 91 of the resin portion 9 .

[0090] The resin portion 9 has electrical insulation. The material of the resin portion 9 includes a resin (for example, an epoxy resin). The resin portion 9 may also include a filler in addition to the resin. The resin is not limited to epoxy resins, and may be, for example, a phenolic resin, a urea-formaldehyde resin, a polyimide, a polyamide-imide, a polyurethane, a diallyl phthalate, an unsaturated polyester, polyphenylene sulfide (PPS), a polybutylene terephthalate (PBT), and the like. As fillers, for example, insulating particles and / or fibers are preferred. As insulating materials constituting the fillers, for example, insulating compounds (oxides, etc.) such as silica and alumina, glass, mineral materials (talc, mica, clay, etc.) and the like can be cited. The resin portion 9 may include one of these fillers, or may include two or more.

[0091] (3) Method for manufacturing capacitor

[0092] After the first capacitor element 1 and the second capacitor element 2 are prepared, the first step, the second step, and the third step are performed in order. The materials of the first anode 11, the first dielectric layer 12, the first solid electrolyte layer 15, the first cathode 13, and the first anode lead 14 of the first capacitor element 1 are the same as the materials of the second anode 21, the second dielectric layer 22, the second solid electrolyte layer 25, the second cathode 23, and the second anode lead 24 of the second capacitor element 2. In addition, the sizes of the first anode 11, the first dielectric layer 12, the first solid electrolyte layer 15, the first cathode 13, and the first anode lead 14 of the first capacitor element 1 are the same as the sizes of the second anode 21, the second dielectric layer 22, the second solid electrolyte layer 25, the second cathode 23, and the second anode lead 24 of the second capacitor element 2. The dimensions of components having the same function in first capacitor element 1 and second capacitor element 2 are not limited to being strictly the same, as long as the dimensions of the components of second capacitor element 2 are 90% to 110% of the dimensions of the components of first capacitor element 1 .

[0093] In the first step, conductive pastes 19a and 29a are applied to the first mounting portion 72 of the first cathode terminal plate 7 and the second mounting portion 82 of the second cathode terminal plate 8, respectively (see Fig. 9 A).

[0094] In the second step, the second outer lead portion 242 of the second anode lead 24 of the second capacitor element 2 is placed on the second positioning groove 62b of the top end 62a of the second rising portion 62 of the second anode terminal plate 6, and the second capacitor element 2 is placed on the conductive paste 29a on the second mounting portion 82 (see Fig. 9 In the second step, the first outer lead portion 142 of the first anode lead 14 of the first capacitor element 1 is placed on the first positioning groove 52b of the top end 52a of the first rising portion 52 of the first anode terminal plate 5, and the first capacitor element 1 is placed on the conductive paste 19a on the first mounting portion 72 (see Fig. 9 B). In the second step, conductive paste 19a is cured to form first bonding portion 19, and conductive paste 29a is cured to form second bonding portion 29.

[0095] In the third step, the welding electrode is brought into contact with the first outer lead portion 142, and a current is passed while applying a predetermined pressing force from above, thereby welding the first outer lead portion 142 and the first rising portion 52 of the first anode terminal plate 5 (see Fig. 9C). Thus, the first outer lead portion 142 and the first rising portion 52 of the first anode terminal plate 5 are mechanically and electrically connected. In the third step, the welding electrode is brought into contact with the second outer lead portion 242, and a current is passed while applying a predetermined pressing force from above, thereby welding the second outer lead portion 242 and the second rising portion 62 of the second anode terminal plate 6 (see Fig. 9 C). Thus, the second outer lead portion 242 and the second rising portion 62 of the second anode terminal plate 6 are mechanically and electrically connected.

[0096] (4) Summary

[0097] The capacitor 10 of the first embodiment includes a first capacitor element 1, a second capacitor element 2, a first anode terminal plate 5, a second anode terminal plate 6, a first cathode terminal plate 7, a second cathode terminal plate 8, and a resin portion 9. The first capacitor element 1 includes a first anode 11, a first dielectric layer 12, a first cathode 13, and a first anode lead 14. The first anode 11 has an outer peripheral surface 113 and a first end surface 111 and a second end surface 112 separated from each other in a first direction D1. The first dielectric layer 12 covers the first end surface 111, the second end surface 112, and the outer peripheral surface 113 of the first anode 11. The first cathode 13 covers the first dielectric layer 12. The first anode lead 14 has a first outer lead portion 142 protruding from the first end surface 111 of the first anode 11. The second capacitor element 2 is adjacent to the first capacitor element 1 in a second direction D2 orthogonal to the first direction D1. The second capacitor element 2 includes a second anode 21, a second dielectric layer 22, a second cathode 23, and a second anode lead 24. The second anode 21 has an outer peripheral surface 213 and a first end surface 211 and a second end surface 212 separated from each other in the first direction D1. The second dielectric layer 22 covers the first end surface 211, the second end surface 212, and the outer peripheral surface 213 of the second anode 21. The second cathode 23 covers the second dielectric layer 22. The second anode lead 24 has a second outer lead portion 242 protruding from the first end surface 211 of the second anode 21. The first anode terminal plate 5 has a first anode terminal portion 51. The first anode terminal plate 5 is connected to the first outer lead portion 142. The second anode terminal plate 6 has a second anode terminal portion 61. The second anode terminal plate 6 is connected to the second outer lead portion 242. The first cathode terminal plate 7 has a first cathode terminal portion 71. The first cathode terminal plate 7 is connected to the first cathode 13. The second cathode terminal plate 8 has a second cathode terminal portion 81. The second cathode terminal plate 8 is connected to the second cathode 23. The resin portion 9 covers the first capacitor element 1 and the second capacitor element 2. The resin portion 9 exposes the first anode terminal portion 51, the second anode terminal portion 61, the first cathode terminal portion 71, and the second cathode terminal portion 81. In the first capacitor element 1, the first outer lead portion 142 and the first cathode 13 are arranged in the order of the first outer lead portion 142 and the first cathode 13 in the first direction D1. In the second capacitor element 2, the second cathode 23 and the second outer lead portion 242 are arranged in the order of the second cathode 23 and the second outer lead portion 242 in the first direction D1. When viewed from the side in the second direction D2, the first outer lead portion 142 overlaps the second cathode 23. The second outer lead portion 242 overlaps with the first cathode 13 in a side view.

[0098] According to the capacitor 10 of the first embodiment, low ESL (Equivalent Series Inductance) and miniaturization can be achieved. More specifically, in the capacitor 10 of the first embodiment, the first outer lead portion 142 and the first cathode 13 of the first capacitor element 1 are arranged in the order of the first outer lead portion 142 and the first cathode 13, and the second cathode 23 and the second outer lead portion 242 of the second capacitor element 2 are arranged in the order of the second cathode 23 and the second outer lead portion 242. Thus, in the capacitor 10 of the first embodiment, the direction of the current flowing from the first cathode terminal portion 71 to the first anode terminal portion 51 in the first capacitor element 1 and the direction of the current flowing from the second cathode terminal portion 81 to the second anode terminal portion 61 in the second capacitor element 2 are opposite. Therefore, in the capacitor 10 of the first embodiment, the magnetic field generated by the current flowing through the first capacitor element 1 and the magnetic field generated by the current flowing through the second capacitor element 2 are offset, so that the magnetic flux generated in the first capacitor element 1 and the second capacitor element 2 are reduced. Thus, the capacitor 10 of embodiment 1 can reduce ESL (Equivalent Series Inductance) and achieve low impedance. In addition, in the capacitor 10 of embodiment 1, when viewed from the side in the second direction D2, the first outer lead portion 142 overlaps with the second cathode 23, and when viewed from the side, the second outer lead portion 242 overlaps with the first cathode 13, so that the useless space where the first capacitor element 1 and the second capacitor element 2 are not configured can be reduced, and miniaturization can be achieved. Thus, the capacitor 10 of embodiment 1 can increase the capacity per unit volume of the capacitor 10. In addition, the capacitor 10 of embodiment 1 can form a current path from the first anode terminal portion 51 to the second cathode terminal portion 81, and can shorten the current path from the second anode terminal portion 61 to the first cathode terminal portion 71, and can further reduce ESL by simultaneously obtaining the shortening effect of the current path. In addition, in Fig.10 In FIG. 8 , the current I12 flowing through the current path from the first anode terminal portion 51 to the second cathode terminal portion 81 and the current I21 flowing through the current path from the second anode terminal portion 61 to the first cathode terminal portion 71 are indicated by arrows.

[0099] Furthermore, in the capacitor 10 of the first embodiment, the first anode terminal portion 51, the first outer lead portion 142, the first cathode 13, and the first cathode terminal portion 71 are arranged in the first direction D1 in the order of the first anode terminal portion 51, the first outer lead portion 142, the first cathode 13, and the first cathode terminal portion 71. Furthermore, in the capacitor 10 of the first embodiment, the second cathode terminal portion 81, the second cathode 23, the second outer lead portion 242, and the second anode terminal portion 61 are arranged in the first direction D1 in the order of the second cathode terminal portion 81, the second cathode 23, the second outer lead portion 242, and the second anode terminal portion 61. Thus, as Fig.10 As shown, in the capacitor 10 of embodiment 1, the first current I1 flowing from the first anode terminal portion 51 to the first cathode terminal portion 71 becomes a direction along the first direction D1, and the second current I2 flowing from the second anode terminal portion 61 to the second cathode terminal portion 81 becomes a direction along the direction opposite to the first direction D1, thereby being able to enhance the canceling effect of the magnetic field generated by the first current I1 and the magnetic field generated by the second current I2, and being able to further reduce the ESL.

[0100] In the capacitor 10 of the first embodiment, since the first cathode terminal plate 7 and the second cathode terminal plate 8 are integrated, the first capacitor element 1 and the second capacitor element 2 can be connected in parallel by connecting the first anode terminal portion 51 and the second anode terminal portion 61 on the motherboard, for example.

[0101] Furthermore, in the capacitor 10 of the first embodiment, the first anode terminal portion 51 and the second anode terminal portion 61 are arranged along the lower surface 91 of the resin portion 9. The first anode terminal plate 5 has a first rising portion 52 protruding from the first anode terminal portion 51 toward the first outer lead portion 142, and the second anode terminal plate 6 has a second rising portion 62 protruding from the second anode terminal portion 61 toward the second outer lead portion 242. A first positioning groove 52b into which a part of the first outer lead portion 142 enters is formed at the top end 52a of the first rising portion 52, and a second positioning groove 62b into which a part of the second outer lead portion 242 enters is formed at the top end 62a of the second rising portion 62. Thus, the capacitor 10 of the first embodiment can improve the positional accuracy of the first outer lead portion 142 of the first anode lead 14 and the second outer lead portion 242 of the second anode lead 24, and can improve the accuracy of ESL.

[0102] In addition, the capacitor 10 of the first embodiment can improve the position accuracy of the first capacitor element 1 by having the first protrusion 73 on the first cathode terminal plate 7, and can improve the position accuracy of the second capacitor element 2 by having the second protrusion 83 on the second cathode terminal plate 8. Therefore, the capacitor 10 of the first embodiment can reduce the deviation of the distance between the first capacitor element 1 and the second capacitor element 2 in the second direction D2, and can improve the parallelism between the first capacitor element 1 and the second capacitor element 2, and can improve the accuracy of ESL.

[0103] (5) Modification of Implementation Example 1

[0104] (5.1) Modification 1

[0105] like Fig.11 As shown, the capacitor 10 of the first modification example is different from the capacitor 10 of the first embodiment in that the first cathode terminal plate 7 further includes a third protrusion 74 , and the second cathode terminal plate 8 further includes a fourth protrusion 84 .

[0106] The third protrusion 74 protrudes from the first mounting portion 72 in the third direction D3, and is opposed to the first protrusion 73 across the first capacitor element 1. The third protrusion 74 and the first protrusion 73 are opposed to each other in the second direction D2. The third protrusion 74 and the first protrusion 73 function as two first positioning pieces that limit the configuration range of the first capacitor element 1 in the second direction D2. In the capacitor 10 of the modification example 1, the third protrusion 74 may be in contact with the fourth side surface 133d of the first cathode 13 of the first capacitor element 1, or the first bonding portion 19 may extend between the third protrusion 74 and the fourth side surface 133d of the first cathode 13 of the first capacitor element 1.

[0107] The fourth protrusion 84 protrudes from the second mounting portion 82 in the third direction D3, and is opposed to the second protrusion 83 across the second capacitor element 2. The fourth protrusion 84 and the second protrusion 83 are opposed to each other in the second direction D2. The fourth protrusion 84 and the second protrusion 83 function as two second positioning pieces that limit the configuration range of the second capacitor element 2 in the second direction D2. In the capacitor 10 of the modification example 1, the fourth protrusion 84 may be in contact with the fourth side surface 233d of the second cathode 23 of the second capacitor element 2, or the second bonding portion 29 may extend between the fourth protrusion 84 and the fourth side surface 233d of the second cathode 23 of the second capacitor element 2.

[0108] The capacitor 10 of the modification example 1 further includes the third protrusion 74 through the first cathode terminal plate 7, thereby improving the position accuracy of the first capacitor element 1 in the second direction D2. In addition, the capacitor 10 of the modification example 1 further includes the fourth protrusion 84 through the second cathode terminal plate 8, thereby improving the position accuracy of the second capacitor element 2 in the second direction D2. As a result, the capacitor 10 of the modification example 1 can improve the accuracy of the distance between the first capacitor element 1 and the second capacitor element 2 in the second direction D2, and can improve the accuracy of ESL.

[0109] (5.2) Modification 2

[0110] like Fig.12 and Fig.13 As shown, the capacitor 10 of the second modification example is different from the capacitor 10 of the first embodiment in that it further includes a conductive portion 98 existing between the first cathode 13 of the first capacitor element 1 and the second cathode 23 of the second capacitor element 2. The conductive portion 98 exists between the third side surface 133c of the first cathode 13 and the third side surface 233c of the second cathode 23. The conductive portion 98 has conductivity. The conductive portion 98 electrically connects the first cathode 13 and the second cathode 23. The conductive portion 98 includes, for example, a metal (for example, silver) and a resin. The conductive portion 98 is formed using a conductive paste (for example, a silver paste).

[0111] Capacitor 10 according to Modification 2 can further reduce ESL and further lower impedance by including conductive portion 98 .

[0112] (5.3) Modification 3

[0113] like Figure 14 to Figure 16 As shown, the capacitor 10 of the modification example 3 is different from the capacitor 10 of the embodiment 1 in that it further includes a third capacitor element 3, a fourth capacitor element 4, a third anode terminal plate 50, a fourth anode terminal plate 60, a third cathode terminal plate 70 and a fourth cathode terminal plate 80.

[0114] In the capacitor 10 of the third modification, the first capacitor element 1 , the second capacitor element 2 , the third capacitor element 3 , and the fourth capacitor element 4 are arranged in this order in the second direction D2 .

[0115] The third capacitor element 3 includes a third anode (not shown), a third dielectric layer 32, a third solid electrolyte layer (not shown), a third cathode 33, and a third anode lead 34. The materials of the third anode 31, the third dielectric layer 32, the third solid electrolyte layer, the third cathode 33, and the third anode lead 34 of the third capacitor element 3 and the first anode 11 of the first capacitor element 1 (see Figure 6 and Figure 8 ), the first dielectric layer 12, the first solid electrolyte layer 15, the first cathode 13 and the first anode lead 14 are made of the same materials. In addition, the sizes of the third anode, the third dielectric layer 32, the third solid electrolyte layer, the third cathode 33 and the third anode lead 34 of the third capacitor element 3 are the same as the sizes of the first anode 11, the first dielectric layer 12, the first solid electrolyte layer, the first cathode 13 and the first anode lead 14 of the first capacitor element 1. The sizes of the components having the same functions in the third capacitor element 3 and the first capacitor element 1 are not limited to being strictly the same, as long as the sizes of the components of the third capacitor element 3 are not less than 90% and not more than 110% of the sizes of the components of the first capacitor element 1.

[0116] The fourth capacitor element 4 includes a fourth anode (not shown), a fourth dielectric layer 42, a fourth solid electrolyte layer (not shown), a fourth cathode 43, and a fourth anode lead 44. The materials of the fourth anode, the fourth dielectric layer 42, the fourth solid electrolyte layer, the fourth cathode 43, and the fourth anode lead 44 of the fourth capacitor element 4 are the same as the materials of the first anode 11, the first dielectric layer 12, the first solid electrolyte layer 15, the first cathode 13, and the first anode lead 14 of the first capacitor element 1. In addition, the dimensions of the fourth anode, the fourth dielectric layer 42, the fourth solid electrolyte layer, the fourth cathode 43, and the fourth anode lead 44 of the fourth capacitor element 4 are the same as the dimensions of the first anode 11, the first dielectric layer 12, the first solid electrolyte layer 15, the first cathode 13, and the first anode lead 14 of the first capacitor element 1. The dimensions of components having the same function in fourth capacitor element 4 and first capacitor element 1 are not limited to being strictly the same, as long as the dimensions of the components of fourth capacitor element 4 are 90% to 110% of the dimensions of the components of first capacitor element 1 .

[0117] The third anode terminal plate 50 has a third anode terminal portion 501 disposed along the lower surface 91 of the resin portion 9, and a third rising portion 502 protruding from the third anode terminal portion 501 in the third direction D3 and connected to the third outer lead portion 342 of the third anode lead 34. The third anode terminal portion 501 and the third rising portion 502 of the third anode terminal plate 50 are respectively the same shape as the first anode terminal portion 51 and the first rising portion 52 of the first anode terminal plate 5.

[0118] The fourth anode terminal plate 60 has a fourth anode terminal portion 601 disposed along the lower surface 91 of the resin portion 9, and a fourth rising portion 602 protruding from the fourth anode terminal portion 601 in the third direction D3 and connected to the fourth outer lead portion 442 of the fourth anode lead 44. The fourth anode terminal portion 601 and the fourth rising portion 602 of the fourth anode terminal plate 60 are respectively the same shape as the second anode terminal portion 61 and the second rising portion 62 of the second anode terminal plate 6.

[0119] The third cathode terminal plate 70 includes a third cathode terminal portion 701 disposed along the lower surface 91 of the resin portion 9 and a third mounting portion 702 joined to the third cathode 33 of the third capacitor element 3 via a third joining portion 39 .

[0120] Fourth cathode terminal plate 80 includes fourth cathode terminal portion 801 disposed along lower surface 91 of resin portion 9 and fourth mounting portion 802 joined to fourth cathode 43 of fourth capacitor element 4 via fourth joining portion 49 .

[0121] In the capacitor 10 of the third modification, the resin portion 9 covers the first capacitor element 1, the second capacitor element 2, the third capacitor element 3, and the fourth capacitor element 4. In addition, the resin portion 9 covers the first rising portion 52 of the first anode terminal plate 5, the second rising portion 62 of the second anode terminal plate 6, the third rising portion 502 of the third anode terminal plate 50, the fourth rising portion 602 of the fourth anode terminal plate 60, the first mounting portion 72 of the first cathode terminal plate 7, the second mounting portion 82 of the second cathode terminal plate 8, the third mounting portion 702 of the third cathode terminal plate 70, and the fourth mounting portion 802 of the fourth cathode terminal plate 80.

[0122] The resin portion 9 exposes the first anode terminal 51 , the second anode terminal 61 , the third anode terminal 501 , the fourth anode terminal 601 , the first cathode terminal 71 , the second cathode terminal 81 , the third cathode terminal 701 , and the fourth cathode terminal 801 on the lower surface 91 of the resin portion 9 .

[0123] In the third capacitor element 3, in the first direction D1, the third outer lead portion 342 and the third cathode 33 are arranged in the order of the third outer lead portion 342 and the third cathode 33. In the fourth capacitor element 4, in the first direction D1, the fourth cathode 43 and the fourth outer lead portion 442 are arranged in the order of the fourth cathode 43 and the fourth outer lead portion 442. When viewed from the side in the second direction D2, the third outer lead portion 342 overlaps with the fourth cathode 43. When viewed from the side, the fourth outer lead portion 442 overlaps with the third cathode 33.

[0124] In the capacitor 10 of the modification example 3, since the first cathode terminal plate 7 and the second cathode terminal plate 8 are integrated, the first capacitor element 1 and the second capacitor element 2 can be connected in parallel by, for example, connecting the first anode terminal portion 51 and the second anode terminal portion 61 on the motherboard. In addition, in the capacitor 10 of the modification example 3, since the third cathode terminal plate 70 and the fourth cathode terminal plate 80 are integrated, the third capacitor element 3 and the fourth capacitor element 4 can be connected in parallel by, for example, connecting the third anode terminal portion 501 and the fourth anode terminal portion 601 on the motherboard.

[0125] (Implementation Method 2)

[0126] Reference Fig.17 and Fig.18 The capacitor 10A of the second embodiment will be described. The capacitor 10A of the second embodiment is similar to the capacitor 10 of the first embodiment (see Figures 1 to 8 ) The same components are marked with the same figure numbers and the description is omitted.

[0127] In the capacitor 10A of the second embodiment, the second cathode terminal plate 8 is a conductive plate independent of the first cathode terminal plate 7. In the capacitor 10A of the second embodiment, the first anode terminal plate 5, the second anode terminal plate 6, the first cathode terminal plate 7 and the second cathode terminal plate 8 are also formed by, for example, one lead frame, but are not limited thereto.

[0128] In the capacitor 10A, the second mounting portion 82 of the second cathode terminal plate 8 and the first mounting portion 72 of the first cathode terminal plate 7 are separated in the second direction D2, and a part of the resin portion 9 is present between the second mounting portion 82 and the first mounting portion 72. Therefore, in the capacitor 10A, the first cathode terminal plate 7 and the second cathode terminal plate 8 are electrically insulated.

[0129] With respect to the capacitor 10A of embodiment 2, when the capacitor 10A is mounted on, for example, a motherboard for use, the user can choose to use it in either a first form in which the first cathode terminal plate 7 and the second cathode terminal plate 8 are connected on the motherboard or a second form in which the first cathode terminal plate 7 and the second cathode terminal plate 8 are not connected on the motherboard.

[0130] (Implementation method 3)

[0131] Reference Figure 19 to Figure 23 The capacitor 10B according to the third embodiment will be described. The capacitor 10B according to the third embodiment is similar to the capacitor 10 (see Figures 1 to 8 ) The same components are marked with the same figure numbers and the description is omitted.

[0132] In the capacitor 10B, the first anode terminal plate 5 and the second anode terminal plate 6 are integrated, and the first cathode terminal plate 7 and the second cathode terminal plate 8 are integrated.

[0133] In addition, in the capacitor 10B, the first anode terminal portion 51 of the first anode terminal plate 5 and the second anode terminal portion 61 of the second anode terminal plate 6 are composed of one anode terminal portion, and the first cathode terminal portion 71 of the first cathode terminal plate 7 and the second cathode terminal portion 81 of the second cathode terminal plate 8 are composed of one cathode terminal portion. Therefore, in the capacitor 10B, the first anode terminal portion 51 and the second anode terminal portion 61 are a common anode terminal portion, and the first cathode terminal portion 71 and the second cathode terminal portion 81 are a common cathode terminal portion. In the capacitor 10B, one anode terminal portion connects the first rising portion 52 and the second rising portion 62. In the capacitor 10B, the second cathode terminal portion 81 also serves as the first cathode terminal portion 71. Therefore, the capacitor 10B constitutes a two-terminal structure capacitor including one anode terminal portion and one cathode terminal portion as a plurality of external terminal portions for mounting on a circuit board such as a motherboard.

[0134] In the capacitor 10B, one anode terminal portion and one cathode terminal portion are located at positions separated from each other in the second direction D2. In the first direction D1, the length of one anode terminal portion is the same as the length of one cathode terminal portion.

[0135] In the capacitor 10B of the third embodiment, the first outer lead portion 142 and the first cathode 13 of the first capacitor element 1 are arranged in the order of the first outer lead portion 142 and the first cathode 13 in the first direction D1, and the second cathode 23 and the second outer lead portion 242 of the second capacitor element 2 are arranged in the order of the second cathode 23 and the second outer lead portion 242 in the first direction D1. Thus, in the capacitor 10B of the third embodiment, the direction of the current flowing from the first cathode terminal portion 71 to the first anode terminal portion 51 in the first capacitor element 1 is opposite to the direction of the current flowing from the second cathode terminal portion 81 to the second anode terminal portion 61 in the second capacitor element 2. Therefore, in the capacitor 10B of the third embodiment, the magnetic field generated by the current flowing through the first capacitor element 1 and the magnetic field generated by the current flowing through the second capacitor element 2 are offset, so that the magnetic flux generated in the first capacitor element 1 and the second capacitor element 2 are reduced. Thus, the capacitor 10B of the third embodiment can reduce ESL and achieve low impedance. In addition, in the capacitor 10B of the third embodiment, when viewed from the side in the second direction D2, the first outer lead portion 142 overlaps with the second cathode 23, and when viewed from the side, the second outer lead portion 242 overlaps with the first cathode 13, so that the useless space where the first capacitor element 1 and the second capacitor element 2 are not configured can be reduced, and miniaturization can be achieved. Thus, the capacitor 10B of the third embodiment can increase the capacitance per unit volume of the capacitor 10B.

[0136] Furthermore, in the capacitor 10B of the third embodiment, the first capacitor element 1 and the second capacitor element 2 are connected in parallel, and a two-terminal structure is formed similarly to a general-purpose capacitor, so that the usability can be improved.

[0137] (Other Modifications)

[0138] The above-mentioned Embodiments 1 to 3 are merely one of various embodiments of the present disclosure. The above-mentioned Embodiments 1 to 3 can be variously modified according to design and the like as long as the object of the present disclosure can be achieved.

[0139] For example, in the capacitor 10 of the first embodiment, the first anode terminal plate 5 , the second anode terminal plate 6 , the first cathode terminal plate 7 , and the second cathode terminal plate 8 may have different shapes.

[0140] For example, in another example of the capacitor 10 of embodiment 1, it may also be a portion connecting the first cathode terminal plate 7 and the second cathode terminal plate 8, which portion is integral with the first cathode terminal plate 7 and the second cathode terminal plate 8, and the portion and the first cathode terminal plate 7 and the second cathode terminal plate 8 are formed by one lead frame.

[0141] In addition, it can also be, like Fig.24 Modification 4 shown, Fig.25 Modification 5 shown, Fig.26 As in any of the modified examples 6 shown in the figure, the first anode terminal plate 5 and the second anode terminal plate 6 are shaped to overlap with both the first capacitor element 1 and the second capacitor element 2 when viewed from the third direction D3. Figure 24 to Figure 26 In the embodiment, the impedance of the first anode terminal plate 5 and the second anode terminal plate 6 can be reduced. Fig.25 In the capacitor 10 of the fifth modification shown in FIG. 1 , the length ratio of the first cathode terminal plate 7 to the second cathode terminal plate 8 in the first direction D1 is Fig.24 The lengths of the first cathode terminal plate 7 and the second cathode terminal plate 8 in the first direction D1 of the capacitor 10 of the modified example 4 shown are long, and the impedance between the first cathode terminal plate 7 and the second cathode terminal plate 8 can be reduced. Fig.25 The capacitor 10 of the fifth modification shown in FIG. Fig.26 In the capacitor 10 of the modification 6 shown in FIG. 1 , the first cathode terminal plate 7 and the second cathode terminal plate 8 are symmetrically axially symmetrical with respect to the center line perpendicular to the second direction D2. Figure 24 to Figure 26 , the first cathode terminal plate 7 is shown in the shape before the portion that will become the first protrusion 73 is bent, and the second cathode terminal plate 8 is shown in the state before the portion that will become the second protrusion 83 is bent.

[0142] In addition, the first anode terminal plate 5 may also be a shape without the first rising portion 52. In this case, for example, it is sufficient to have a first connecting member that connects the first anode terminal portion 51 of the first anode terminal plate 5 and the first outer lead portion 142. The first connecting member has conductivity. The first connecting member may be formed using, for example, a conductive paste, or may be a first metal plate joined to the first anode terminal portion 51.

[0143] In addition, the second anode terminal plate 6 may also be a shape without the second rising portion 62. In this case, for example, it is sufficient to have a second connecting member that connects the second anode terminal portion 61 of the second anode terminal plate 6 and the second outer lead portion 242. The second connecting member has conductivity. The second connecting member may be formed using, for example, a conductive paste, or may be a second metal plate joined to the second anode terminal portion 61.

[0144] In the capacitor 10 of the first embodiment, the first outer lead portion 142 is located at the center of the first capacitor element 1 in the third direction D3, and the second outer lead portion 242 is located at the center of the second capacitor element 2 in the third direction D3, but the present invention is not limited thereto. Fig. 27 As shown in the capacitor 10 of the modified example 7, the first outer lead portion 142 is located at the lower end of the first capacitor element 1 in the third direction D3, and the second outer lead portion 242 is located at the lower end of the second capacitor element 2 in the third direction D3. In the capacitor 10 of the modified example 7, when used for example by being mounted on a circuit board such as a motherboard, the distance between the first outer lead portion 142 and the circuit board can be shortened compared to the first embodiment, and the distance between the second outer lead portion 242 and the circuit board can be shortened compared to the first embodiment, so that the current path can be shortened and the ESL can be further reduced.

[0145] In addition, you can also Fig.28 The capacitor 10 of the modification 8 shown in FIG. Fig.29 As shown in the capacitor 10 of the modification 9, the first outer lead portion 142 and the second outer lead portion 242 are quadrilateral in shape when viewed from the first direction D1. In other words, the first anode lead 14 and the second anode lead 24 are not limited to linear shapes, but may be plate-shaped, foil-shaped, or quadrangular-shaped.

[0146] In the capacitor 10 of the first embodiment, the first cathode terminal plate 7 has the first protrusion 73, but the present invention is not limited to this, and the first cathode terminal plate 7 may have a structure without the first protrusion 73, or the first protrusion 73 formed by a member different from the first cathode terminal plate 7 may be fixed to the first cathode terminal plate 7. The second cathode terminal plate 8 has the second protrusion 83, but the present invention is not limited to this, and the second cathode terminal plate 8 may have a structure without the second protrusion 83, or the second protrusion 83 formed by a member different from the second cathode terminal plate 8 may be fixed to the second cathode terminal plate 8.

[0147] (plan)

[0148] Based on the above-described Embodiments 1 to 3, etc., the following aspects are disclosed in this specification.

[0149] The capacitor (10; 10A; 10B) of the first embodiment comprises a first capacitor element (1), a second capacitor element (2), a first anode terminal plate (5), a second anode terminal plate (6), a first cathode terminal plate (7), a second cathode terminal plate (8) and a resin portion (9). The first capacitor element (1) comprises a first anode (11), a first dielectric layer (12), a first cathode (13) and a first anode lead (14). The first anode (11) has an outer peripheral surface (113) and a first end surface (111) and a second end surface (112) separated from each other in a first direction (D1). The first dielectric layer (12) covers the first end surface (111), the second end surface (112) and the outer peripheral surface (113) of the first anode (11). The first cathode (13) covers the first dielectric layer (12). The first anode lead (14) has a first outer lead portion (142) protruding from the first end face (111) of the first anode (11). The second capacitor element (2) is adjacent to the first capacitor element (1) in a second direction (D2) orthogonal to the first direction (D1). The second capacitor element (2) includes a second anode (21), a second dielectric layer (22), a second cathode (23) and a second anode lead (24). The second anode (21) has an outer peripheral surface (213) and a first end face (211) and a second end face (212) separated from each other in the first direction (D1). The second dielectric layer (22) covers the first end face (211), the second end face (212) and the outer peripheral surface (213) of the second anode (21). The second cathode (23) covers the second dielectric layer (22). The second anode lead (24) has a second outer lead portion (242) protruding from the first end surface (211) of the second anode (21). The first anode terminal plate (5) has a first anode terminal portion (51). The first anode terminal plate (5) is connected to the first outer lead portion (142). The second anode terminal plate (6) has a second anode terminal portion (61). The second anode terminal plate (6) is connected to the second outer lead portion (242). The first cathode terminal plate (7) has a first cathode terminal portion (71). The first cathode terminal plate (7) is connected to the first cathode (13). The second cathode terminal plate (8) has a second cathode terminal portion (81). The second cathode terminal plate (8) is connected to the second cathode (23). The resin portion (9) covers the first capacitor element (1) and the second capacitor element (2). The resin portion (9) exposes a first anode terminal portion (51), a second anode terminal portion (61), a first cathode terminal portion (71), and a second cathode terminal portion (81). In the first capacitor element (1), in the first direction (D1), a first external lead portion (142) and a first cathode (13) are arranged in the order of the first external lead portion (142) and the first cathode (13).In the second capacitor element (2), in the first direction (D1), the second cathode (23) and the second outer lead portion (242) are arranged in the order of the second cathode (23) and the second outer lead portion (242). When viewed from the side in the second direction (D2), the first outer lead portion (142) overlaps with the second cathode (23). When viewed from the side, the second outer lead portion (242) overlaps with the first cathode (13).

[0150] According to this configuration, low ESL and miniaturization can be achieved.

[0151] In the capacitor (10; 10B) of the second aspect, based on the first aspect, the first cathode terminal plate (7) and the second cathode terminal plate (8) are integrated.

[0152] According to this aspect, the first capacitor element (1) and the second capacitor element (2) can be connected in parallel by connecting the first anode terminal portion (51) and the second anode terminal portion (61).

[0153] The capacitor (10) of the third aspect is the capacitor of the second aspect, and further comprises a conductive portion (98). The conductive portion (98) exists between the first cathode (13) and the second cathode (23), and connects the first cathode (13) and the second cathode (23).

[0154] According to this aspect, it is possible to further reduce ESL and further reduce impedance.

[0155] In the capacitor (10A) of the fourth aspect, in addition to the first aspect, the second cathode terminal plate (8) is a conductive plate independent of the first cathode terminal plate (7).

[0156] According to this scheme, for example, when the capacitor (10A) is installed on a motherboard, for example, a user can choose to use it in either a first form in which the first cathode terminal plate (7) and the second cathode terminal plate (8) are connected on the motherboard or a second form in which the first cathode terminal plate (7) and the second cathode terminal plate (8) are not connected on the motherboard.

[0157] In the capacitor (10; 10A; 10B) of the fifth embodiment, based on any one of the first to fourth embodiments, the resin portion (9) has a lower surface (91) and an upper surface (92) intersecting a third direction (D3), and the third direction (D3) is orthogonal to the first direction (D1) and the second direction (D2). The first anode terminal portion (51) and the second anode terminal portion (61) are arranged along the lower surface (91) of the resin portion (9). The first anode terminal plate (5) has a first rising portion (52) protruding from the first anode terminal portion (51) in the third direction (D3). A first positioning groove (52b) is formed at the top end (52a) of the first rising portion (52) for a portion of the first outer lead portion (142) to enter. The second anode terminal plate (6) has a second rising portion (62) protruding from the second anode terminal portion (61) in the third direction (D3). A second positioning groove (62b) into which a part of the second outer lead portion (242) enters is formed at the top end (62a) of the second rising portion (62).

[0158] According to this aspect, the positional accuracy of the first outer lead portion (142) of the first anode lead (14) and the second outer lead portion (242) of the second anode lead (24) can be improved, and the accuracy of ESL can be improved.

[0159] In the capacitor (10; 10A) of the sixth aspect, in addition to any one of the first to fifth aspects, the first anode terminal portion (51), the first outer lead portion (142), the first cathode (13), and the first cathode terminal portion (71) are arranged in the order of the first anode terminal portion (51), the first outer lead portion (142), the first cathode (13), and the first cathode terminal portion (71) in the first direction (D1). The second cathode terminal portion (81), the second cathode (23), the second outer lead portion (242), and the second anode terminal portion (61) are arranged in the order of the second cathode terminal portion (81), the second cathode (23), the second outer lead portion (242), and the second anode terminal portion (61) in the first direction (D1).

[0160] According to this scheme, the flow direction of the first current (I1) flowing from the first anode terminal portion (51) toward the first cathode terminal portion (71) becomes along the first direction (D1), and the flow direction of the second current (I2) flowing from the second anode terminal portion (61) toward the second cathode terminal portion (81) becomes along the direction opposite to the first direction (D1), thereby being able to enhance the cancelling effect of the magnetic field generated by the first current (I1) and the magnetic field generated by the second current (I2), and being able to further reduce the ESL.

[0161] In the capacitor (10; 10A; 10B) of the seventh embodiment, in addition to any one of the first to sixth embodiments, the first cathode terminal plate (7) further comprises a first mounting portion (72) and a first protruding portion (73). The first mounting portion (72) overlaps with the first cathode (13) in a third direction (D3) orthogonal to the first direction (D1) and the second direction (D2), and carries the first capacitor element (1). The first protruding portion (73) protrudes from the first mounting portion (72) in the third direction (D3) and is located between the first cathode (13) and the second cathode (23). The second cathode terminal plate (8) further comprises a second mounting portion (82) and a second protruding portion (83). The second mounting portion (82) overlaps with the second cathode (23) in the third direction (D3), and carries the second capacitor element (2). The second protrusion (83) protrudes from the second mounting portion (82) in a third direction (D3) and is located between the first cathode (13) and the second cathode (23).

[0162] According to this scheme, the deviation of the distance between the first capacitor element (1) and the second capacitor element (2) in the second direction (D2) can be reduced, and the parallelism between the first capacitor element (1) and the second capacitor element (2) can be improved, thereby improving the accuracy of ESL.

[0163] Description of Reference Numerals

[0164] 1. 1st capacitor element; 11. 1st anode; 111. 1st end face; 112. 2nd end face; 113. outer peripheral surface; 12. 1st dielectric layer; 13. 1st cathode; 14. 1st anode lead; 141. 1st inner lead portion; 142. 1st outer lead portion; 15. 1st solid electrolyte layer; 2. 2nd capacitor element; 21. 2nd anode; 211. 1st end face; 212. 2nd end face; 213. outer peripheral surface; 22. 2nd dielectric layer; 23. 2nd cathode; 24. 2nd anode lead; 241. 2nd inner lead portion; 242. 2nd outer lead portion; 25. 2nd solid electrolyte layer; 3. 3rd capacitor element; 4. 4th capacitor element; 5. 1st anode terminal plate; 51. 1st anode terminal portion ; 52, the first rising portion; 52a, the top; 52b, the first positioning groove; 6, the second anode terminal plate; 61, the second anode terminal portion; 62, the second rising portion; 62a, the top; 62b, the second positioning groove; 7, the first cathode terminal plate; 71, the first cathode terminal portion; 72, the first mounting portion; 73, the first protrusion; 74, the third protrusion; 8, the second cathode terminal plate; 81, the second cathode terminal portion; 82, the second mounting portion; 83, the second protrusion; 84, the fourth protrusion; 9, the resin portion; 91, the lower surface; 92, the upper surface; 98, the conductive portion; 10, 10A, 10B, the capacitor; D1, the first direction; D2, the second direction; D3, the third direction; I1, the first current; I2, the second current.

Claims

1. A capacitor, wherein: The capacitor has: a first capacitor element comprising a first anode having an outer peripheral surface and a first end surface and a second end surface separated from each other in a first direction, a first dielectric layer covering the first end surface, the second end surface and the outer peripheral surface of the first anode, a first cathode covering the first dielectric layer, and a first anode lead having a first outer lead portion protruding from the first end surface of the first anode; a second capacitor element adjacent to the first capacitor element in a second direction orthogonal to the first direction, comprising a second anode having an outer peripheral surface and a first end surface and a second end surface separated from each other in the first direction, a second dielectric layer covering the first end surface, the second end surface and the outer peripheral surface of the second anode, a second cathode covering the second dielectric layer, and a second anode lead having a second outer lead portion protruding from the first end surface of the second anode; a first anode terminal plate having a first anode terminal portion, the first anode terminal plate being connected to the first outer lead portion; a second anode terminal plate having a second anode terminal portion, the second anode terminal plate being connected to the second outer lead portion; a first cathode terminal plate having a first cathode terminal portion, the first cathode terminal plate being connected to the first cathode; a second cathode terminal plate having a second cathode terminal portion, the second cathode terminal plate being connected to the second cathode; as well as a resin portion covering the first capacitor element and the second capacitor element and exposing the first anode terminal portion, the second anode terminal portion, the first cathode terminal portion, and the second cathode terminal portion, In the first capacitor element, In the first direction, the first outer lead portion and the first cathode are arranged in the order of the first outer lead portion and the first cathode. In the second capacitor element, In the first direction, the second cathode and the second outer lead are arranged in this order. When viewed from the side in the second direction, the first outer lead portion overlaps the second cathode. In the side view, the second outer lead portion overlaps the first cathode.

2. The capacitor according to claim 1, wherein: The first cathode terminal plate and the second cathode terminal plate are integrated.

3. The capacitor according to claim 2, wherein: The capacitor further includes a conductive portion that exists between the first cathode and the second cathode and connects the first cathode and the second cathode.

4. The capacitor according to claim 1, wherein The second cathode terminal plate is a conductive plate independent of the first cathode terminal plate.

5. The capacitor according to any one of claims 1 to 4, wherein: The resin portion has a lower surface and an upper surface intersecting a third direction, the third direction being orthogonal to the first direction and the second direction, The first anode terminal portion and the second anode terminal portion are arranged along the lower surface of the resin portion, The first anode terminal plate has a first rising portion protruding from the first anode terminal portion toward the third direction. A first positioning groove is formed at the top end of the first rising portion, into which a part of the first outer lead portion enters. The second anode terminal plate has a second rising portion protruding from the second anode terminal portion toward the third direction. A second positioning groove into which a part of the second outer lead portion enters is formed at a tip end of the second rising portion.

6. The capacitor according to any one of claims 1 to 5, wherein: The first anode terminal portion, the first outer lead portion, the first cathode, and the first cathode terminal portion are arranged in the order of the first anode terminal portion, the first outer lead portion, the first cathode, and the first cathode terminal portion in the first direction. The second cathode terminal portion, the second cathode, the second outer lead portion, and the second anode terminal portion are arranged in the order of the second cathode terminal portion, the second cathode, the second outer lead portion, and the second anode terminal portion in the first direction.

7. The capacitor according to any one of claims 1 to 6, wherein: The first cathode terminal plate further comprises: a first mounting portion on which the first capacitor element is mounted, the first mounting portion overlapping the first cathode in a third direction orthogonal to the first direction and the second direction; as well as a first protrusion protruding from the first mounting portion toward the third direction and located between the first cathode and the second cathode, The second cathode terminal plate further comprises: a second mounting portion on which the second capacitor element is mounted, the second mounting portion overlapping the second cathode in the third direction; as well as A second protrusion protrudes from the second mounting portion toward the third direction and is located between the first cathode and the second cathode.

Citation Information

Patent Citations

  • Decoupling device and mounting body

    WO2010023990A1