Substrate processing apparatus and particle removal method

Abstract

The substrate processing apparatus (100) includes a substrate processing unit (10), piping (32), a filter unit (140), and a pump (114). The substrate processing unit (10) processes a substrate (W). The piping (32) allows processing liquid to flow to the substrate processing unit (10). The filter unit (140) is disposed on the piping (32). The filter unit (140) includes a filter (141) that captures particles in the processing liquid. The pump (114) pressurizes the liquid containing the processing liquid, thereby passing the liquid through the filter (141). In substrate processing, the pump (114) pressurizes the processing liquid such that the pressure of the processing liquid relative to the filter (141) becomes a first pressure. In non-substrate processing, the pump (114) pressurizes the liquid such that the pressure of the liquid relative to the filter (141) becomes a second pressure higher than the first pressure.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a particle removal method. Background Technology

[0002] Conventionally, a substrate processing apparatus for processing substrates is known. This substrate processing apparatus is suitable for manufacturing semiconductor substrates. The substrate processing apparatus uses a processing liquid such as a chemical solution to process the substrate. The processing liquid flows through piping equipped with filters and valves, and processes the substrate. The filter captures particles contained in the processing liquid passing through the piping. Filters that have been used for a predetermined time are replaced with new filters. As such a substrate processing apparatus, a liquid processing apparatus is known, comprising: a tank for storing the processing liquid; and a circulation line for pulling out from and returning to the tank; and supplying the processing liquid to the liquid processing unit via the circulation line (see, for example, Patent Document 1). The liquid processing apparatus includes: a filter for removing particles contained in the processing liquid. The filter is disposed in the circulation line. When the filter is supplied with processing liquid for an extended period, the filter may become clogged due to particles. Therefore, in the liquid processing apparatus of Patent Document 1, a cleaning fluid is passed through the filter from the downstream side to the upstream side, thereby removing particles from the filter.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent document 1: Japanese Patent Application Publication No. 2015-204302. Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, with the miniaturization of semiconductors in recent years, filters now possess electrostatic capture capabilities in addition to physical capture functions. Specifically, filters capture particles larger than their pores, as well as smaller particles using electrostatic effects. Therefore, as in Patent Document 1, when cleaning fluid is passed through the filter from downstream to upstream, particles larger than their pores can be removed. On the other hand, particles captured by electrostatic effects are difficult to remove even when cleaning fluid is passed through the filter from downstream to upstream. Therefore, when a filter becomes clogged, it needs to be replaced with a new one.

[0008] However, since replacing filters increases the environmental burden, it is desirable to reduce the frequency of filter replacement from the perspective of reducing the environmental burden.

[0009] The present invention addresses the aforementioned issues and aims to provide a substrate processing apparatus and a particle removal method capable of suppressing the frequency of filter replacement.

[0010] [Methods used to solve problems]

[0011] According to one aspect of the present invention, a substrate processing apparatus includes a substrate processing unit, a processing liquid piping, a filter unit, and a pressurizing unit. The substrate processing unit processes a substrate. The processing liquid piping supplies processing liquid to the substrate processing unit. The filter unit is disposed on the processing liquid piping. The filter unit includes a filter for capturing particles in the processing liquid. The pressurizing unit pressurizes a liquid containing the processing liquid, causing the liquid to pass through the filter. The pressurizing unit is capable of changing the pressure of the liquid relative to the filter. In substrate processing where the substrate is processed by the processing liquid, the pressurizing unit pressurizes the processing liquid such that the pressure of the processing liquid relative to the filter becomes a first pressure. In non-substrate processing where the substrate is not processed by the processing liquid, the pressurizing unit pressurizes the liquid such that the pressure of the liquid relative to the filter becomes a second pressure higher than the first pressure.

[0012] In one embodiment, the substrate processing apparatus further includes a heating unit for heating the liquid passing through the filter. In the substrate processing, the temperature of the processing liquid passing through the filter is a first temperature. In the non-substrate processing, the heating unit heats the liquid such that the temperature of the liquid passing through the filter becomes a second temperature higher than the first temperature.

[0013] In one embodiment, the substrate processing apparatus further includes an upstream side pipe, a downstream side pipe, and a removal liquid supply unit. The upstream side pipe is connected to the processing liquid pipe upstream of the filter. The downstream side pipe is connected to the processing liquid pipe downstream of the filter. The removal liquid supply unit is connected to one of the upstream side pipe and the downstream side pipe. The removal liquid supply unit supplies removal liquid, used to remove particles clogging the filter, to one of the upstream side pipe and the downstream side pipe. The liquid contains the removal liquid. In the non-substrate processing, the substrate processing apparatus allows the removal liquid to pass from one of the upstream side pipe and the downstream side pipe through the filter and then through the other of the upstream side pipe and the downstream side pipe.

[0014] In one embodiment, the substrate processing apparatus further includes a first valve, a second valve, a third valve, and a fourth valve. The first valve is disposed upstream of the filter in the processing fluid piping. The second valve is disposed downstream of the filter in the processing fluid piping. The third valve is disposed in the upstream piping. The fourth valve is disposed in the downstream piping. During substrate processing, the substrate processing apparatus closes the third and fourth valves and opens the first and second valves, thereby allowing the processing fluid to flow from the upstream side of the processing fluid piping through the filter to the downstream side of the processing fluid piping. During non-substrate processing, the substrate processing apparatus closes the first and second valves and opens the third and fourth valves, thereby allowing the removal fluid to flow from one of the upstream and downstream piping through the filter to the other of the upstream and downstream piping.

[0015] In one embodiment, the removal liquid is a liquid of a different type than the treatment liquid.

[0016] In one embodiment, the substrate processing apparatus, during the non-substrate processing, causes the removal liquid to pass from the downstream piping through the filter into the upstream piping.

[0017] In one embodiment, the substrate processing apparatus further includes a downstream piping. The downstream piping is connected to the processing liquid piping downstream of the filter. During the non-substrate processing, the substrate processing apparatus allows the liquid to pass from upstream of the filter through the filter and then through the downstream piping.

[0018] In one embodiment, the filter unit further includes: an upstream chamber disposed upstream of the filter; and a downstream chamber disposed downstream of the filter. The downstream piping is connected to the treated fluid piping via the downstream chamber.

[0019] In one embodiment, the substrate processing apparatus further includes a detector. The detector is disposed in the processing liquid piping. The detector detects the pressure or flow rate of the processing liquid passing through the filter. If the detected value is less than a threshold, the pressurizing unit pressurizes the liquid in such a way that the pressure of the liquid relative to the filter becomes the second pressure.

[0020] In one embodiment, the pressurizing unit periodically pressurizes the liquid in such a way that the pressure of the liquid relative to the filter becomes the second pressure.

[0021] According to another aspect of the present invention, the particle removal method includes: a substrate processing step in which a processing liquid flows through a filter of a filter unit disposed in a processing liquid piping connected to a substrate processing unit and passes through the substrate processing unit, and processes the substrate through the processing liquid; and a non-substrate processing step in which the substrate is not processed through the processing liquid; in the substrate processing step, the processing liquid is flowed through the filter such that the pressure of the processing liquid relative to the filter becomes a first pressure; and in the non-substrate processing step, the liquid is flowed through the filter such that the pressure of the liquid relative to the filter becomes a second pressure higher than the first pressure.

[0022] In one embodiment, during the substrate processing step, the temperature of the processing liquid passing through the filter is a first temperature; during the non-substrate processing step, the liquid at a second temperature higher than the first temperature flows through the filter.

[0023] In one embodiment, the liquid includes a removal liquid for removing particles clogging the filter; in the non-substrate processing step, the removal liquid is passed from one of an upstream side pipe and a downstream side pipe through the filter and the other of the upstream side pipe and the downstream side pipe, the upstream side pipe being connected to the processing liquid pipe upstream of the filter and the downstream side pipe being connected to the processing liquid pipe downstream of the filter.

[0024] In one embodiment, the removal liquid is a liquid of a different type than the treatment liquid.

[0025] In one embodiment, during the non-substrate processing step, the removal liquid is passed from the downstream piping through the filter and then through the upstream piping.

[0026] In one embodiment, during the non-substrate processing step, the liquid is transported from the upstream side of the filter through the filter via a downstream pipe connected to the processing liquid piping at the downstream side of the filter.

[0027] In one embodiment, the filter unit has: an upstream chamber disposed upstream of the filter; and a downstream chamber disposed downstream of the filter; the downstream piping is connected to the treatment fluid piping via the downstream chamber.

[0028] In one embodiment, during the substrate processing step, if the pressure or flow rate of the processing liquid passing through the filter is less than a threshold, the non-substrate processing step is performed.

[0029] In one embodiment, the non-substrate processing step is performed periodically.

[0030] Invention Effects

[0031] According to the present invention, a substrate processing apparatus and a particle removal method are provided that can suppress the frequency of filter replacement. Attached Figure Description

[0032] Figure 1 This is a schematic top view of the substrate processing apparatus according to the first embodiment.

[0033] Figure 2 This is a schematic diagram of the substrate processing unit in the substrate processing apparatus of the first embodiment.

[0034] Figure 3 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the first embodiment.

[0035] Figure 4 This is a block diagram of the substrate processing apparatus according to the first embodiment.

[0036] Figure 5 This is a flowchart illustrating the particle removal method of the filter according to the first embodiment.

[0037] Figure 6A This is a schematic diagram illustrating the particle removal method of the first embodiment, and an arrow indicating the flow of liquid around the filter unit.

[0038] Figure 6B This is a schematic diagram illustrating the particle removal method of the first embodiment, and an arrow indicating the flow of liquid around the filter unit.

[0039] Figure 7 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the second embodiment.

[0040] Figure 8 This is a flowchart illustrating the particle removal method of the filter according to the second embodiment.

[0041] Figure 9 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the third embodiment.

[0042] Figure 10 This is a flowchart illustrating the particle removal method of the filter according to the third embodiment.

[0043] Figure 11A This is a schematic diagram illustrating the particle removal method of the third embodiment, and an arrow indicating the flow of liquid around the filter unit.

[0044] Figure 11BThis is a schematic diagram illustrating the particle removal method of the third embodiment, and an arrow indicating the flow of liquid around the filter unit.

[0045] Figure 12 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the first variation example.

[0046] Figure 13 This is a flowchart illustrating a particle removal method for a filter in a first variation example.

[0047] Figure 14 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the fourth embodiment.

[0048] Figure 15 This is a flowchart illustrating the particle removal method of the filter according to the fourth embodiment.

[0049] Figure 16A This is a schematic diagram illustrating the particle removal method of the fourth embodiment, and an arrow indicating the flow of liquid around the filter unit.

[0050] Figure 16B This is a schematic diagram illustrating the particle removal method of the fourth embodiment, and an arrow indicating the flow of liquid around the filter unit.

[0051] Figure 17 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the second variation example.

[0052] Figure 18 This is a flowchart illustrating a particle removal method for a filter in a second variation example.

[0053] Figure 19 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the third variation example.

[0054] Figure 20 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus of the fourth variation.

[0055] Figure 21 This is a flowchart illustrating the particle removal method of the filter according to the fifth embodiment.

[0056] Figure 22 This is a schematic diagram showing the piping configuration in the substrate processing apparatus according to the sixth embodiment. Detailed Implementation

[0057] Hereinafter, embodiments of the substrate processing apparatus and particle removal method of the present invention will be described with reference to the accompanying drawings. Furthermore, the same reference numerals are used for the same or equivalent parts in the drawings, and descriptions will not be repeated. In addition, for ease of understanding of the present invention, the X-axis, Y-axis, and Z-axis will be described as orthogonal to each other in the specification. In this embodiment, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0058] [First Implementation Method]

[0059] Reference Figures 1 to 5 , Figure 6A as well as Figure 6B The substrate processing apparatus 100 of the first embodiment of the present invention will be described. Figure 1 This is a schematic top view of the substrate processing apparatus 100 according to the first embodiment.

[0060] The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by means of at least one of etching, surface treatment, property imparting, processing film formation, removal of at least a portion of the film, and cleaning.

[0061] The substrate W is used as a semiconductor substrate. The substrate W contains a semiconductor wafer. For example, the substrate W is generally circular. Here, the substrate processing apparatus 100 processes the substrate W one by one.

[0062] like Figure 1 As shown, the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid tank 110, a processing liquid reservoir 120, a plurality of load ports LP, an indexer robot IR, a center robot CR, and a control device 101. The control device 101 controls the load ports LP, the indexer robot IR, and the center robot CR. The control device 101 includes a control unit 102 and a storage unit 104.

[0063] Loading ports LP stack and accommodate multiple substrates W. A sorting robot IR moves substrates W between loading ports LP and a central robot CR. The central robot CR moves substrates W between the sorting robot IR and the substrate processing unit 10. The substrate processing unit 10 sprays processing liquid onto each substrate W to process it. The processing liquid includes, for example, a chemical solution, a cleaning solution, and / or a water-repellent agent. A processing liquid tank 110 contains the processing liquid. Additionally, the processing liquid tank 110 may also contain gas.

[0064] Specifically, a plurality of substrate processing units 10 form a plurality of towers TW (in) Figure 1There are four towers (TWs) in the center, and multiple towers (TWs) are arranged around the central robotic arm (CR) when viewed from above. Each tower (TW) contains multiple substrate processing units 10 stacked vertically. Figure 1 There are three substrate processing units 10 in the middle. Processing liquid tanks 120 correspond to a plurality of towers TW. Liquid in the processing liquid tank 110 is supplied via a certain processing liquid tank 120 to all the substrate processing units 10 contained in the tower TW corresponding to that processing liquid tank 120. Furthermore, gas in the processing liquid tank 110 is supplied via any one of the processing liquid tanks 120 to all the substrate processing units 10 contained in the tower TW corresponding to that processing liquid tank 120.

[0065] In the substrate processing apparatus 100, an interface wall BW is disposed between the area where the central robot arm CR and the substrate processing unit 10 are provided and the area where the processing liquid tank 110 is provided. The processing liquid tank 110 divides a portion of the space of the outer part of the interface wall BW in the substrate processing apparatus 100.

[0066] Typically, the processing fluid tank 110 has a conditioning tank (cylindrical tank) for conditioning the processing fluid. The processing fluid tank 110 may have a conditioning tank for one type of processing fluid or multiple conditioning tanks for different types of processing fluids. In addition, the processing fluid tank 110 may also have a pump, nozzle, and / or filter for circulating the processing fluid.

[0067] Here, the processing liquid tank 110 has a first processing liquid tank 110A and a second processing liquid tank 110B. The first processing liquid tank 110A and the second processing liquid tank 110B are arranged facing each other.

[0068] The control device 101 controls various operations of the substrate processing device 100.

[0069] The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 has a processor. The control unit 102 has, for example, a central processing unit (i.e., a CPU). Alternatively, the control unit 102 may also have a general-purpose arithmetic unit.

[0070] Storage unit 104 stores data and computer programs. The data includes recipe data. The recipe data contains information representing a plurality of recipes. The plurality of recipes respectively specify the processing content and processing order of the substrate W.

[0071] Storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. Storage unit 104 may also include removable media. Control unit 102 executes the computer program stored in storage unit 104 and performs board processing operations.

[0072] Next, refer to Figure 2 The substrate processing unit 10 in the substrate processing apparatus 100 of the first embodiment will be described. Figure 2 This is a schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100 of the first embodiment.

[0073] The substrate processing unit 10 includes a chamber 11, a substrate holding section 20, and a processing liquid supply section 30.

[0074] The chamber 11 is generally box-shaped with an internal space. The chamber 11 houses the substrate W. Here, the substrate processing apparatus 100 is a monolithic type for processing substrates W one by one, and the substrates W are housed one by one in the chamber 11. The substrate W is housed in the chamber 11 and processed in the chamber 11. At least a portion of the substrate holding part 20 and the processing liquid supply part 30 are housed in the chamber 11.

[0075] The substrate holding portion 20 holds the substrate W. The substrate holding portion 20 holds the substrate W horizontally with its upper surface (surface) Wa facing upwards and its back surface (lower surface) Wb facing vertically downwards. Furthermore, the substrate holding portion 20 rotates the substrate W while holding it. For example, a laminated structure with recesses is provided on the upper surface Wa of the substrate W. The substrate holding portion 20 rotates the substrate W while holding it.

[0076] For example, the substrate holding portion 20 can also be a clamping type for holding the end of the substrate W. Alternatively, the substrate holding portion 20 can also have any mechanism for holding the substrate W from the back surface Wb. For example, the substrate holding portion 20 can also be a vacuum type. In this case, the substrate holding portion 20 adsorbs the central portion of the back surface Wb of the substrate W, which belongs to the non-device forming surface, onto the upper surface, thereby holding the substrate W horizontally. Alternatively, the substrate holding portion 20 can also combine a clamping type and a vacuum type for contacting a plurality of chuck pins with the peripheral end face of the substrate W.

[0077] For example, the substrate holding portion 20 includes a spin base 21, a chuck member 22, a shaft 23, an electric motor 24, and a housing 25. The chuck member 22 is disposed on the spin base 21. The chuck member 22 clamps the substrate W. Typically, a plurality of chuck members 22 are disposed on the spin base 21.

[0078] Shaft 23 is a hollow shaft. Shaft 23 extends vertically along the axis of rotation Ax. A rotating base 21 is attached to the upper end of shaft 23. The substrate W is placed above the rotating base 21.

[0079] The rotating base 21 is a circular plate used to horizontally support the substrate W. A shaft 23 extends downward from the center of the rotating base 21. An electric motor 24 applies rotational force to the shaft 23. The electric motor 24 causes the shaft 23 to rotate in the rotational direction, thereby rotating the substrate W and the rotating base 21 around the rotation axis Ax. A housing 25 surrounds the shaft 23 and the electric motor 24.

[0080] The processing liquid supply unit 30 supplies processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies processing liquid to the upper surface Wa of the substrate W. At least a portion of the processing liquid supply unit 30 is housed within the chamber 11.

[0081] The processing liquid supply unit 30 supplies processing liquid to the upper surface Wa of the substrate W. The processing liquid may also contain a so-called chemical solution. The solution may also contain, for example, diluted hydrofluoric acid (DHF), hydrofluoric acid (HF), hydrofluoric acid and nitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (hydrofluorine ethylene glycol) (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia, hydrogen peroxide, organic acids (e.g., citric acid, oxalic acid), organic bases (e.g., TMAH (tetramethyl ammonium hydroxide)), sulfuric acid / hydrogen peroxide mixture (SPM), ammonia-hydrogen peroxide mixture (SC1 (standard clean-1), hydrochloric acid-hydrogen peroxide mixture). The mixture contains (SC2 (standardclean-2); isopropyl alcohol (IPA); surfactants; corrosion inhibitors; and hydrophobic agents.

[0082] Alternatively, the treatment solution may also include a so-called rinse solution. For example, the rinse solution may include any of the following: deionized water (DIW), carbonated water, electrolyzed water, ozone water, ammonia water, hydrochloric acid diluted to a concentration of approximately 10 ppm to 100 ppm, or reduced water (hydrogen water).

[0083] The processing fluid supply unit 30 includes a piping 32, a nozzle 34, and a valve 36. Furthermore, the piping 32 is an example of the "processing fluid piping" of the present invention. The nozzle 34 sprays processing fluid onto the upper surface Wa of the substrate W. The nozzle 34 is connected to the piping 32. Processing fluid is supplied to the piping 32 from a supply source. The valve 36 opens and closes the flow path within the piping 32. The nozzle 34 is preferably configured to be movable relative to the substrate W.

[0084] Valve 36 opens and closes the flow path within piping 32. Valve 36 regulates the opening degree of piping 32, thereby adjusting the flow rate of the treatment fluid supplied to piping 32. Specifically, valve 36 includes: a valve body (not shown) with a valve seat disposed internally; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between the open and closed positions.

[0085] Nozzle 34 is also movable. Nozzle 34 can move in the horizontal and / or vertical directions via a moving mechanism controlled by control unit 102. Furthermore, it should be noted that the moving mechanism has been omitted in this specification to avoid making the drawings overly complex.

[0086] The substrate processing unit 10 also includes a cup 80. The cup 80 collects the processing liquid that spills from the substrate W. The cup 80 moves up and down. For example, the cup 80 rises vertically to the side of the substrate W during the entire period during which the processing liquid supply unit 30 supplies processing liquid to the substrate W. In this case, the cup 80 collects the processing liquid that spills from the substrate W due to the rotation of the substrate W. Furthermore, when the period during which the processing liquid supply unit 30 supplies processing liquid to the substrate W ends, the cup 80 descends vertically from the side of the substrate W.

[0087] As described above, the control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 controls the substrate holding unit 20, the processing liquid supply unit 30, and / or the cup 80. In one example, the control unit 102 controls the electric motor 24, the valve 36, and / or the cup 80.

[0088] The substrate processing apparatus 100 of this embodiment is suitable for manufacturing semiconductor components in which semiconductors are disposed. Typically, a conductive layer and an insulating layer are stacked on a substrate in the semiconductor component. The substrate processing apparatus 100 is suitable for cleaning and / or processing (e.g., etching, property modification, etc.) of the conductive layer and / or the insulating layer during the manufacture of the semiconductor component.

[0089] In addition, Figure 2 In the substrate processing unit 10 shown, the processing liquid supply unit 30 can supply one type of processing liquid. However, this embodiment is not limited to this. The processing liquid supply unit 30 can also supply multiple types of processing liquids. For example, the processing liquid supply unit 30 can sequentially supply multiple types of processing liquids with different uses to the substrate W. Alternatively, the processing liquid supply unit 30 can simultaneously supply multiple types of processing liquids with different uses to the substrate W.

[0090] Next, refer to Figures 1 to 3 The piping configuration of the substrate processing apparatus 100 according to the first embodiment will be explained. Figure 3This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 according to the first embodiment. Furthermore, as shown in... Figure 1 as well as Figure 2 As understood, it is preferable that the substrate processing apparatus 100 has a plurality of substrate processing units 10, and the substrate W can be processed by a plurality of processing liquids. However, to avoid excessive complexity, this description will focus on supplying one type of processing liquid to one substrate processing unit 10.

[0091] like Figure 3 As shown, the substrate processing apparatus 100 includes a modulation tank 112, a pump 114, a valve 115, a filter unit 140, a detector 116, and a valve 117. Furthermore, the pump 114 is an example of the "pressurization unit" of the present invention. The valve 115 is an example of the "first valve" of the present invention. The valve 117 is an example of the "second valve" of the present invention.

[0092] The preparation tank 112 stores the processing liquid. The processing liquid is supplied to the substrate processing unit 10 to process the substrate W. Typically, the processing liquid is a chemical solution. However, the processing liquid may also be a cleaning solution. The processing liquid is prepared in the preparation tank 112. Typically, the preparation tank 112 is disposed in the processing liquid tank 110.

[0093] Piping 32 connects to the modulation tank 112 and the substrate processing unit 10. A pump 114, valve 115, filter unit 140, detector 116, valve 117, and valve 36 are installed on piping 32. Pump 114, valve 115, filter unit 140, detector 116, valve 117, and valve 36 constitute the processing fluid supply unit 30. Furthermore, in... Figure 3 Although only one valve 36 is depicted, valve 36 is provided in each nozzle 34. Therefore, a plurality of valves 36 are configured for one filter unit 140.

[0094] The processing liquid tank 110 has a frame 111. Typically, the frame 111 houses a modulation tank 112, a pump 114, a valve 115, a filter unit 140, a detector 116, and a valve 117.

[0095] The processing fluid tank 120 has a housing 121. Typically, the valve 36 is housed in the housing 121.

[0096] Piping 32 extends from the processing liquid tank 110 through the processing liquid reservoir 120 to the substrate processing unit 10. The processing liquid is prepared in the preparation tank 112 and then flows from the preparation tank 112 to the substrate processing unit 10 through piping 32. Piping 32 is formed of resin, for example.

[0097] Pump 114 delivers the processing liquid from the modulation tank 112 toward nozzle 34. In the first embodiment, pump 114 can change the pressure applied to the processing liquid. That is, pump 114 can change the output. Furthermore, in the first embodiment, as described later, pump 114 pressurizes the processing liquid in a manner that the pressure of the processing liquid relative to filter 141 becomes a first pressure during substrate processing of the substrate W through the processing liquid. Furthermore, pump 114 pressurizes the processing liquid in a manner that the pressure of the processing liquid relative to filter 141 becomes a second pressure higher than the first pressure during non-substrate processing that does not pass through the substrate W through the processing liquid. Furthermore, there is no particular limitation as long as the second pressure is higher than the first pressure; however, the second pressure may also be, for example, the minimum pressure withstand value of the component or machine, etc., under the pressure of the processing liquid. In other words, the second pressure may also be, for example, the same magnitude as the pressure withstand value of the component or machine, etc., with the lowest pressure withstand capability among valve 115, filter unit 140, detector 116, and valve 117. Specifically, for example, if the pressure resistance of the component or machine with the lowest pressure resistance in valve 115, filter unit 140, detector 116 and valve 117 is 0.5 MPa, the second pressure may also be 0.5 MPa.

[0098] Valve 115 is connected to piping 32 upstream of filter 141 (described later). Valve 115 opens and closes the flow path within piping 32. Specifically, valve 115 opens and closes the flow path of the upstream portion 32a of piping 32, which is upstream of filter unit 140. Valve 115 regulates the opening degree of piping 32, thereby adjusting the flow rate of the treatment fluid supplied to piping 32. Specifically, valve 115 includes: a valve body (not shown) with a valve seat disposed therein; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0099] Filter unit 140 is installed on piping 32. Filter unit 140 can be installed and removed relative to piping 32. When filter unit 140 is installed on piping 32, the treatment fluid flows through filter unit 140. On the other hand, filter unit 140 can be removed from piping 32. Therefore, filter unit 140 is replaced when it deteriorates.

[0100] The filter unit 140 is formed of resin, for example. Typically, the filter unit 140 is formed by resin molding. In one example, the filter unit 140 is manufactured by cutting a resin formation with a metal processing tool. Alternatively, the filter unit 140 may also be formed of metal.

[0101] Filter unit 140 filters the processing liquid flowing within piping 32. Filter unit 140 includes a filter 141 and a filter housing 142. Filter 141 is disposed within piping 32. Filter 141 has, for example, a porous shape. Filter 141 allows the liquid components of the processing liquid to pass through. On the other hand, filter 141 captures particles contained in the processing liquid. Specifically, filter 141 has numerous pores. In the first embodiment, filter 141 captures particles not only physically but also electrostatically. That is, filter 141 captures particles larger than its pores, and also captures particles smaller than its pores using electrostatic effects. Furthermore, the particles are, for example, solids. The particles are not particularly limited and may be made of, for example, resin or metal.

[0102] The filter housing 142 houses the filter 141. The filter housing 142 has an upstream chamber 142a, disposed upstream of the filter 141, and a downstream chamber 142b, disposed downstream of the filter 141. Furthermore, an vent pipe for discharging gas to the outside and a drain pipe for discharging liquid to the outside can be connected to the upstream chamber 142a and the downstream chamber 142b.

[0103] Detector 116 detects the pressure or flow rate of the processed liquid passing through filter 141. That is, detector 116 can be, for example, a pressure gauge to detect the pressure of the processed liquid passing through filter 141, or a flow meter to detect the flow rate of the processed liquid passing through filter 141. In the first embodiment, detector 116 is a flow meter. Furthermore, detector 116 is preferably disposed downstream of filter 141, but it can also be disposed upstream of filter 141.

[0104] Valve 117 is connected to piping 32 downstream of filter 141. Valve 117 opens and closes the flow path within piping 32. Specifically, valve 117 opens and closes the flow path in the downstream portion 32b of piping 32, which is further downstream of filter unit 140. Valve 117 regulates the opening degree of piping 32, thereby adjusting the flow rate of the processed fluid supplied to piping 32. Specifically, valve 117 includes: a valve body (not shown) with a valve seat disposed therein; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0105] The substrate processing apparatus 100 includes a downstream piping 161 and a valve 162.

[0106] Downstream piping 161 is connected to piping 32 downstream of filter 141. Downstream piping 161 is connected to the downstream portion 32b of piping 32 downstream of filter 141. In the first embodiment, downstream piping 161 is directly connected to piping 32. In other words, downstream piping 161 is connected to piping 32 without passing through filter unit 140.

[0107] Valve 162 is disposed on downstream piping 161. Valve 162 regulates the opening degree of the flow path within downstream piping 161, thereby regulating the flow rate of liquid through downstream piping 161. Specifically, valve 162 includes: a valve body (not shown) with a valve seat disposed therein; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position. Furthermore, valve 162 is an example of the "fourth valve" of the present invention.

[0108] Next, refer to Figures 1 to 4 The substrate processing apparatus 100 of the first embodiment will be described. Figure 4 This is a block diagram of the substrate processing apparatus 100 according to the first embodiment.

[0109] like Figure 4 As shown, the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the indexing robot IR, the central robot CR, the substrate holding unit 20, the processing liquid supply unit 30, and the valve 162. Specifically, the control device 101 sends control signals to the indexing robot IR, the central robot CR, the substrate holding unit 20, the processing liquid supply unit 30, and the valve 162, thereby controlling these components.

[0110] More specifically, the control unit 102 controls the indexing robot IR to pick up and transfer the substrate W.

[0111] The control unit 102 controls the central robot CR, which picks up and transfers the substrate W. For example, the central robot CR picks up the unprocessed substrate W and moves it into any one of the plurality of substrate processing units 10. In addition, the central robot CR picks up the processed substrate W from the substrate processing unit 10 and moves it out.

[0112] The control unit 102 controls the substrate holding unit 20, thereby controlling the substrate W to start rotating, change its rotation speed, and stop rotating. For example, the control unit 102 controls the substrate holding unit 20, thereby changing its rotational speed. Specifically, the control unit 102 changes the rotational speed of the electric motor 24 of the substrate holding unit 20, thereby changing the rotational speed of the substrate W.

[0113] The control unit 102 controls valves 115, 117, and 36, thereby switching their states to open and closed states. Specifically, the control unit 102 sets valve 115 to an open or closed state, thereby allowing or preventing liquid from passing through the upstream portion 32a of the piping 32. Similarly, the control unit 102 sets valve 117 to an open or closed state, thereby allowing or preventing liquid from passing through the downstream portion 32b of the piping 32. Furthermore, the control unit 102 sets valve 36 to an open or closed state, thereby allowing or preventing liquid that has passed through valve 117 from being supplied to nozzle 34.

[0114] The control unit 102 controls the pump 114 to transport the liquid in the modulation tank 112 to the downstream side. Specifically, the control unit 102 drives the pump 114, thereby sending the liquid in the modulation tank 112 toward the nozzle 34. The measurement results of the detector 116 are transmitted to the control unit 102.

[0115] The control unit 102 controls the valve 162, thereby switching the state of the valve 162 to an open state and a closed state. Specifically, the control unit 102 sets the valve 162 to an open state or a closed state, thereby allowing liquid in the downstream piping 161 to pass through or preventing liquid in the downstream piping 161 from passing through.

[0116] As described above, the storage unit 104 can also store a plurality of procedure data. The plurality of procedures can also specify the processing content and processing sequence for removing particles clogging the filter unit 140. The procedure for removing particles can also be included in, for example, a procedure for specifying the operation content and operation sequence of the processing liquid tank 110.

[0117] The substrate processing apparatus 100 of the first embodiment is suitable for use in forming semiconductor components. For example, the substrate processing apparatus 100 is suitable for use with a substrate W for processing a semiconductor component as a stacked structure. The semiconductor component is a so-called 3D (three-dimensional) memory (storage device). As an example, the substrate W is suitable for use as a NAND (NOT-AND) type flash memory.

[0118] Next, refer to Figure 5 , Figure 6A as well as Figure 6B The particle removal method of the filter 141 of the substrate processing apparatus 100 of the first embodiment is described. Figure 5 This is a flowchart illustrating the particle removal method of the filter 141 according to the first embodiment. Figure 6A as well as Figure 6B This is a schematic diagram illustrating the particle removal method of the first embodiment, and an arrow indicating the flow of liquid around the filter unit 140. The particle removal method of the filter 141 of the first embodiment includes steps S101 to S104. Steps S101 to S104 are executed by the control unit 102. Furthermore, step S101 is an example of the "substrate processing step" of the present invention. Furthermore, step S103 is an example of the "non-substrate processing step" of the present invention.

[0119] like Figure 5 As shown, in step S101, the control unit 102 determines whether the flow rate of the treatment fluid through the piping 32 is less than a threshold. The threshold is a predetermined value. Specifically, in step S101, valves 115 and 117 are turned on, and valve 162 is turned off (see reference). Figure 6A The timing of valve 36 spraying processing liquid onto substrate W is switched between an open and closed state. That is, in step S101, the processing liquid is allowed to flow through filter 141 disposed on pipe 32. Furthermore, in step S101, the processing liquid is allowed to flow through pipe 32 and supplied to substrate processing unit 10, thereby enabling substrate W to be processed by the processing liquid. In addition, in step S101 (substrate processing step), the pressure of the processing liquid relative to filter 141 is a first pressure.

[0120] In step S101, the control unit 102 determines whether the measured value of the detector 116 is less than a threshold when the processing liquid can pass through the piping 32 (e.g., valve 36 is open). Furthermore, for example, when the filter 141 is new, the measured value of the detector 116 is above the threshold. On the other hand, when particles clog the filter 141, the flow rate of the processing liquid through the filter 141 decreases, thus lowering the measured value of the detector 116. Moreover, when the amount of particles clogging the filter 141 becomes more than a predetermined amount, the measured value of the detector 116 becomes less than the threshold. Furthermore, the measured value is an example of the "detection value" of the present invention.

[0121] In step S101, if the control unit 102 determines that the flow rate of the processing liquid through the piping 32 is above a threshold, step S101 is repeated. In other words, if the measured value of the detector 116 is above the threshold, step S101 is repeated.

[0122] On the other hand, in step S101, if the control unit 102 determines that the flow rate of the processing liquid through the piping 32 is less than a threshold, the process proceeds to step S102. In other words, if the measured value of the detector 116 is less than the threshold, the process proceeds to step S102.

[0123] Next, in step S102, the control unit 102 stops supplying the processing fluid. Specifically, the control unit 102 switches the valve 117 from the open state to the closed state.

[0124] Next, in step S103, the control unit 102 pressurizes the liquid to cause it to flow through the filter 141. In the first embodiment, the control unit 102 pressurizes the processing liquid to cause it to flow through the filter 141. Specifically, the control unit 102 switches the valve 162 from a closed state to an open state. Furthermore, the control unit 102 sets the output of the pump 114 to be higher than that in step S101 (substrate processing step). Thus, as... Figure 6B As shown, the processing liquid in the modulation tank 112 passes through the piping 32 and the filter unit 140, and is then discharged via the downstream piping 161. At this time, the pressure of the processing liquid relative to the filter 141 (the second pressure) is higher than the pressure of the processing liquid relative to the filter 141 in step S101 (the first pressure). Therefore, the processing liquid passes through the filter 141, thereby removing particles that clog the filter 141. That is, the performance of liquid flow and passage through the filter 141 is restored. Furthermore, in step S103 (non-substrate processing process), the pressure of the processing liquid relative to the filter 141 is the second pressure. Next, the control unit 102 returns the valve 162 from the open state to the closed state after a predetermined time. In addition, the control unit 102 sets the output of the pump 114 to the same level as the output of the pump 114 in step S101.

[0125] Next, in step S104, the control unit 102 resumes supplying the processing fluid. Specifically, the control unit 102 switches valve 117 from the closed state to the open state. Thus, as... Figure 6A As shown, the treatment liquid in the modulation tank 112 passes through the filter unit 140 and the valve 117.

[0126] As described above, the particle removal of the filter 141 in the first embodiment is completed.

[0127] Above, refer to Figures 1 to 5 , Figure 6A as well as Figure 6B The first embodiment of the present invention will be described. As described above, in the first embodiment, the pump 114 pressurizes the processing liquid in a non-substrate processing (e.g., step S103) where the pressure of the processing liquid relative to the filter 141 becomes a second pressure higher than the first pressure in the substrate processing (e.g., step S101). Therefore, particles clogging the filter 141 can be removed. That is, the performance of liquid flow through the filter 141 can be restored. Therefore, the replacement frequency of the filter 141 can be suppressed. As a result, the environmental burden can be reduced.

[0128] Furthermore, the reason why setting the pressure of the treatment liquid relative to the filter 141 to a second pressure can restore the performance of liquid flow through the filter 141 is believed to be due to the following reason: that setting the pressure of the treatment liquid to a second pressure that is higher than the first pressure results in a force greater than the force by which the filter 141 electrostatically captures particles acting on the particles, thereby allowing the particles to pass through the pores of the filter 141.

[0129] Furthermore, by suppressing the replacement frequency of filter 141, the time required for filter 141 replacement and restoration (also known as downtime) can be reduced.

[0130] Furthermore, as described above, in non-substrate processing, the processing liquid is supplied from the upstream side of filter 141 via filter 141 and then through the downstream side piping 161. Therefore, the processing liquid can be used to remove particles clogging filter 141. Thus, unlike the case where a removal liquid is used as described later, there is no need to install piping for supplying the removal liquid. Furthermore, unlike the case where a removal liquid is used, the processing liquid and the removal liquid do not mix or come into contact.

[0131] Furthermore, as described above, the flow rate of the treatment liquid passing through filter 141 is measured. Therefore, the blockage of particles that are difficult to observe directly can be easily confirmed using detector 116. Moreover, when the flow rate of the treatment liquid is less than a threshold, the removal liquid can be passed from the conditioning tank 112 through filter 141 to the downstream piping 161. Therefore, particle removal can be performed before a large amount of particle blockage occurs. Therefore, during particle removal, the flow of the treatment liquid and the time it takes to pass through filter 141 can be reduced.

[0132] [Second Implementation]

[0133] Next, refer to Figure 7 as well as Figure 8 The substrate processing apparatus 100 of the second embodiment of the present invention will be described. Figure 7 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 according to the second embodiment. In the second embodiment, an example is described where a heater 113 is provided in the upstream portion 32a of the piping 32.

[0134] like Figure 7 As shown, the substrate processing apparatus 100 includes a heater 113. Furthermore, the heater 113 is an example of the "heating section" of the present invention.

[0135] Heater 113 heats the liquid passing through filter 141. In the second embodiment, heater 113 heats the processed liquid passing through filter 141. Furthermore, in the second embodiment, heater 113 is disposed upstream of piping 32, at the upstream portion 32a. Additionally, in the second embodiment, although heater 113 is disposed upstream of pump 114, its placement is not particularly limited as long as it is disposed upstream of filter 141. That is, for example, heater 113 may also be disposed between pump 114 and valve 115, or between valve 115 and filter 141.

[0136] Furthermore, in the second embodiment, the heater 113 heats the processing liquid in the substrate processing such that the temperature of the processing liquid passing through the filter 141 becomes a first temperature. Additionally, in the second embodiment, if the processing liquid from the mixing tank 112 is at the first temperature, the heater 113 may not heat the processing liquid. Furthermore, in non-substrate processing, the heater 113 heats the processing liquid such that the temperature of the processing liquid passing through the filter 141 becomes a second temperature higher than the first temperature. The second temperature is, for example, a temperature 5°C or higher but less than 15°C higher than the first temperature. The heater 113 is controlled by the control unit 102. Furthermore, the first temperature and the second temperature may each have a predetermined temperature range.

[0137] The other components of the second embodiment are the same as those of the first embodiment.

[0138] Next, refer to Figure 6A , Figure 6B as well as Figure 8 The particle removal method of the filter 141 of the substrate processing apparatus 100 of the second embodiment is described. Figure 8 This is a flowchart illustrating the particle removal method of the filter 141 according to the second embodiment. The particle removal method of the filter 141 according to the second embodiment includes steps S101, S102, S1021, S103, S1031, and S104.

[0139] like Figure 8 As shown, in step S101, the control unit 102 determines whether the flow rate of the processing liquid through the piping 32 is less than a threshold. Furthermore, in step S101 (substrate processing step), which belongs to the substrate processing, the heater 113 heats the processing liquid such that the temperature of the processing liquid passing through the filter 141 becomes a first temperature. Additionally, in step S101, the pressure of the processing liquid relative to the filter 141 is a first pressure.

[0140] In step S101, if the control unit 102 determines that the flow rate of the treatment liquid through the piping 32 is above a threshold, step S101 is repeated.

[0141] On the other hand, in step S101, if the control unit 102 determines that the flow rate of the processing liquid through the piping 32 is less than the threshold, the process is transferred to step S102.

[0142] Next, in step S102, the control unit 102 stops supplying the processing fluid.

[0143] Next, in step S1021, the control unit 102 controls the heater 113 to heat the liquid. In the second embodiment, the control unit 102 controls the heater 113 to heat the processing liquid. Specifically, the control unit 102 sets the output of the heater 113 to be higher than that in step S101 (during substrate processing). As a result, the temperature of the processing liquid becomes a second temperature or a temperature higher than the second temperature.

[0144] Next, in step S103, the control unit 102 pressurizes the liquid to cause it to flow through the filter 141. In the second embodiment, the control unit 102 pressurizes the processing liquid to cause it to flow through the filter 141. Thus, the processing liquid in the conditioning tank 112, heated by the heater 113 and pressurized by the pump 114, passes through the filter unit 140 and is then discharged via the downstream piping 161. At this time, the temperature of the processing liquid passing through the filter 141 is higher than the temperature of the processing liquid passing through the filter 141 in step S101. Therefore, the increased temperature of the filter 141 causes the pore size to increase, making it easier for particles to pass through the pores. Furthermore, the increased temperature of the particles makes them more prone to deformation, making them easier to pass through the pores. Therefore, as the processing liquid passes through the filter 141, particles clogging the filter 141 can be removed.

[0145] Next, in step S1031, the control unit 102 returns the output of the heater 113 to the output in step S101. That is, the control unit 102 sets the output of the heater 113 to the same value as the output of the heater 113 in step S101.

[0146] Next, in step S104, the control unit 102 starts supplying the processing fluid again.

[0147] As described above, the particle removal of filter 141 in the second embodiment is completed.

[0148] As described above, in the second embodiment, the heater 113 heats the processing liquid in the non-substrate processing (step S103) to a second temperature, where the temperature of the processing liquid passing through the filter 141 is higher than the first temperature. Therefore, it becomes easier to remove particles clogging the filter 141. Consequently, particles clogging the filter 141 can be easily removed. That is, the ability of liquid flow through the filter 141 can be easily restored. Therefore, the frequency of filter 141 replacement can be reduced. As a result, the environmental burden can be reduced.

[0149] The other particle removal methods and other effects of the second embodiment are the same as those of the first embodiment.

[0150] [Third Implementation Method]

[0151] Next, refer to Figure 9 , Figure 10 , Figure 11A as well as Figure 11B The substrate processing apparatus 100 of the third embodiment of the present invention will be described. Figure 9 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 according to the third embodiment. The third embodiment describes an example that differs from the first and second embodiments, specifically an example where the substrate processing apparatus 100 further includes an upstream piping 151 and a removal liquid supply unit 165.

[0152] like Figure 9 As shown, the substrate processing apparatus 100 also includes an upstream piping 151 and a descaling liquid supply unit 165. Furthermore, the pump 114 and the descaling liquid supply unit 165 are examples of the "pressurization unit" of the present invention.

[0153] Upstream piping 151 is connected to piping 32 upstream of filter 141. Upstream piping 151 is connected to the upstream portion 32a of piping 32 upstream of filter 141. In the third embodiment, upstream piping 151 is directly connected to piping 32. In other words, upstream piping 151 is connected to piping 32 without passing through filter unit 140.

[0154] The substrate processing apparatus 100 includes a valve 152. The valve 152 is disposed on an upstream side pipe 151. The valve 152 regulates the opening degree of the flow path within the upstream side pipe 151, thereby regulating the flow rate of liquid through the upstream side pipe 151. Specifically, the valve 152 includes: a valve body (not shown) with a valve seat disposed therein; a valve core for opening and closing the valve seat; and an actuator (not shown) for moving the valve core between an open position and a closed position. Furthermore, the valve 152 is an example of the "third valve" of the present invention.

[0155] A removal fluid supply unit 165 is connected to one of the upstream piping 151 and the downstream piping 161. The removal fluid supply unit 165 supplies removal fluid, used to remove particles clogging the filter 141, to one of the upstream piping 151 and the downstream piping 161. In a third embodiment, the removal fluid supply unit 165 is connected to the upstream piping 151 and supplies removal fluid to it. The removal fluid supply unit 165 may include, for example, a pump for pressurizing and discharging the removal fluid. The removal fluid supply unit 165 may also include a tank for storing the removal fluid. The removal fluid is any liquid used to remove particles and is not particularly limited, such as deionized water (DIW), a liquid containing hydrochloric acid, IPA (isopropanol), or PGMEA (propylene glycol monomethyl ether acetate). In the third embodiment, the removal fluid contains DIW.

[0156] Furthermore, the remover is preferably a different type of liquid from the treatment liquid. For example, when using DIW as the remover, the amount of treatment liquid used to remove particles clogging the filter 141 can be reduced. Therefore, the environmental burden can be further reduced. Alternatively, the remover can be a liquid used to dissolve particles that cannot be dissolved by the treatment liquid. In this case, by flowing the remover through the filter 141, the particles can be dissolved, thus efficiently removing particles clogging the filter 141.

[0157] The other components of the third embodiment are the same as those of the first embodiment.

[0158] Next, refer to Figure 10 , Figure 11A as well as Figure 11B The particle removal method of the filter 141 of the substrate processing apparatus 100 of the third embodiment is described. Figure 10 This is a flowchart illustrating the particle removal method of the filter 141 according to the third embodiment. Figure 11A as well as Figure 11B This is a schematic diagram illustrating the particle removal method of the third embodiment, and an arrow indicating the flow of liquid around the filter unit 140. The particle removal method of the filter 141 of the third embodiment includes steps S101, S102, S103a, and S104. Step S103a of the third embodiment corresponds to step S103 of the first embodiment. Furthermore, step S103a is an example of the "non-substrate processing step" of the present invention.

[0159] like Figure 10As shown, in step S101, the control unit 102 determines whether the flow rate of the treatment fluid through the piping 32 is less than a threshold. Furthermore, in step S101, valves 115 and 117 are in the open state, and valves 152 and 162 are in the closed state (see reference). Figure 11A ).

[0160] In step S101, if the control unit 102 determines that the flow rate of the treatment liquid through the piping 32 is above a threshold, step S101 is repeated.

[0161] On the other hand, in step S101, if the control unit 102 determines that the flow rate of the processing liquid through the piping 32 is less than the threshold, the process is transferred to step S102.

[0162] Next, in step S102, the control unit 102 stops supplying the processing fluid.

[0163] Next, in step S103a, the control unit 102 pressurizes the removal liquid, causing it to flow through the filter 141. Specifically, the control unit 102 switches valves 152 and 162 from the closed state to the open state. Thus, as... Figure 11B As shown, the removal fluid supplied by the removal fluid supply unit 165 passes through the upstream piping 151 and the filter unit 140, and is then discharged through the downstream piping 161. At this time, the removal fluid supply unit 165 pressurizes the removal fluid such that the pressure of the removal fluid relative to the filter 141 becomes higher than the pressure of the processing fluid relative to the filter 141 in step S101. Therefore, the removal fluid passes through the filter 141, thereby removing particles clogging the filter 141. Next, the control unit 102 returns valves 152 and 162 from the open state to the closed state after a predetermined time.

[0164] Next, in step S104, the control unit 102 resumes supplying the processing fluid. Specifically, the control unit 102 switches valves 115 and 117 from the closed state to the open state. Thus, as... Figure 11A As shown, the treatment liquid in the modulation tank 112 passes through the filter unit 140 and the valve 117.

[0165] As described above, the particle removal of filter 141 in the third embodiment is completed.

[0166] The other particle removal methods in the third embodiment are the same as those in the first embodiment.

[0167] As described above, in the third embodiment, the removal liquid is a different type of liquid from the treatment liquid. That is, when removing particles clogging the filter 141, a removal liquid different from the treatment liquid flows through the filter 141. Therefore, the amount of treatment liquid used can be reduced. Thus, the environmental burden can be further reduced.

[0168] Furthermore, as described above, the third embodiment includes an upstream pipe 151 connected to pipe 32 on the upstream side of filter 141, and a downstream pipe 161 connected to pipe 32 on the downstream side of filter 141; thereby, a removal liquid of a different type than the treatment liquid can be easily flowed through filter 141.

[0169] The other effects of the third embodiment are the same as those of the first embodiment.

[0170] [First Variation Example]

[0171] Next, refer to Figure 12 as well as Figure 13 The substrate processing apparatus 100 of the first variation of the present invention will be described. Figure 12 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 of the first variation. In the first variation, an example different from the third embodiment is described, that is, an example in which a heater 113 is provided in the upstream portion 32a of the piping 32 and a heater 153 is provided in the upstream side piping 151 is described.

[0172] like Figure 12 As shown, the substrate processing apparatus 100 includes a heater 113 and a heater 153. Furthermore, the heater 113 and the heater 153 are examples of the "heating section" of the present invention.

[0173] The configuration of heater 113 is the same as that of heater 113 in the second embodiment. However, in the first variation, the output of heater 113 in non-substrate processing may also be the same as the output of heater 113 in substrate processing.

[0174] Heater 153 heats the removed liquid passing through filter 141. Furthermore, heater 153 is disposed on upstream piping 151. In the first variation, although heater 153 is disposed upstream of valve 152, its placement is not particularly limited as long as it is disposed upstream of filter 141. That is, heater 153 may also be disposed, for example, downstream of valve 152.

[0175] Furthermore, in the first variation, the heater 153 heats the removal liquid during non-substrate processing in such a way that the temperature of the removal liquid passing through the filter 141 becomes a second temperature higher than the first temperature. Additionally, the heater 153 is controlled by the control unit 102.

[0176] The other configurations of the first variation are the same as those of the third embodiment.

[0177] Next, refer to Figure 13The particle removal method of the filter 141 of the substrate processing apparatus 100 in the first variation example is described. Figure 13 This is a flowchart illustrating the particle removal method of the filter 141 in the first variation example. The particle removal method of the filter 141 in the first variation example includes steps S101, S102, S1022, S103a, S1032, and S104.

[0178] like Figure 13 As shown, steps S101 and S102 are the same as in the second embodiment. After step S102, the process proceeds to step S1022.

[0179] Next, in step S1022, the control unit 102 activates the heater 153 to heat the removal liquid. Specifically, in non-substrate processing, the control unit 102 heats the removal liquid to a second temperature, which is higher than the first temperature, by changing the temperature of the removal liquid passing through the filter 141. For example, the output of the heater 153 may also be higher than the output of the heater 113.

[0180] Next, in step S103a, the control unit 102 pressurizes the removal liquid, causing it to flow through the filter 141. Specifically, the control unit 102 switches valves 152 and 162 from a closed state to an open state. As a result, the removal liquid from the removal liquid supply unit 165 passes through the upstream piping 151 and the filter unit 140 before being discharged via the downstream piping 161. At this time, the heater 153 heats the removal liquid so that the temperature of the removal liquid passing through the filter 141 is higher than the temperature of the processed liquid passing through the filter 141 in step S101. Therefore, the removal liquid, heated by the heater 153 and pressurized by the removal liquid supply unit 165, passes through the filter unit 140 and is then discharged via the downstream piping 161. Furthermore, at this time, the temperature of the removal liquid passing through the filter 141 is higher than the temperature of the processed liquid passing through the filter 141 in step S101. Therefore, the increased temperature of the filter 141 causes the pore size to increase, making it easier for particles to pass through the pores. Furthermore, the increased temperature of the particles makes them more prone to deformation and easier to pass through pores. Therefore, the removal liquid passes through filter 141, thereby removing particles that are clogging the filter 141. Then, after a predetermined time, control unit 102 returns valves 152 and 162 from the open state to the closed state.

[0181] Next, in step S1032, the control unit 102 stops driving (OFF) the heater 153, thereby stopping the heating of the removal liquid.

[0182] Next, in step S104, the control unit 102 starts supplying the processing fluid again.

[0183] As described above, the particle removal of filter 141 in the first variation example is completed.

[0184] The other particle removal methods and other effects of the first variation are the same as those of the second and third embodiments.

[0185] [Fourth Implementation Method]

[0186] Next, refer to Figure 14 , Figure 15 , Figure 16A as well as Figure 16B The substrate processing apparatus 100 of the fourth embodiment of the present invention will be described. Figure 14 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 according to the fourth embodiment. An example different from the third embodiment will be described in the fourth embodiment, specifically an example of the removal liquid flowing from the downstream piping 161 towards the upstream piping 151.

[0187] like Figure 14 As shown, similar to the third embodiment, the substrate processing apparatus 100 includes an upstream side pipe 151, a downstream side pipe 161, and a removal liquid supply unit 165.

[0188] In the fourth embodiment, the removal fluid supply unit 165 is connected to the downstream piping 161 and supplies the removal fluid to the downstream piping 161. That is, in the fourth embodiment, the removal fluid flows from the downstream piping 161 toward the upstream piping 151.

[0189] The other components of the fourth embodiment are the same as those of the third embodiment.

[0190] Next, refer to Figure 15 , Figure 16A as well as Figure 16B The particle removal method of the filter 141 of the substrate processing apparatus 100 according to the fourth embodiment is described. Figure 15 This is a flowchart illustrating the particle removal method of the filter 141 according to the fourth embodiment. Figure 16A as well as Figure 16B This is a schematic diagram illustrating the particle removal method of the fourth embodiment, and an arrow indicating the flow of liquid around the filter unit 140. The particle removal method of the filter 141 of the fourth embodiment includes steps S101, S102, S103b, and S104. Step S103b of the fourth embodiment corresponds to step S103a of the third embodiment. Furthermore, step S103b is an example of the "non-substrate processing step" of the present invention.

[0191] like Figure 15As shown, steps S101 and S102 are the same as in the third embodiment. Furthermore, in step S101, valves 115 and 117 are in the open state, and valves 152 and 162 are in the closed state (see reference). Figure 16A After step S102, the process proceeds to step S103b.

[0192] Next, in step S103b, the control unit 102 pressurizes the removal liquid, causing it to flow through the filter 141. Specifically, the control unit 102 switches valves 152 and 162 from the closed state to the open state. Thus, as... Figure 16B As shown, the removal fluid from the removal fluid supply unit 165 passes through the downstream piping 161 and the filter unit 140, and then is discharged through the upstream piping 151. At this time, the removal fluid supply unit 165 pressurizes the removal fluid such that the pressure of the removal fluid relative to the filter 141 becomes higher than the pressure of the processing fluid relative to the filter 141 in step S101. Therefore, the removal fluid passes through the filter 141, thereby removing particles clogging the filter 141. Next, the control unit 102 returns valves 152 and 162 from the open state to the closed state after a predetermined time.

[0193] Next, in step S104, the control unit 102 resumes supplying the processing fluid. Specifically, the control unit 102 switches valves 115 and 117 from the closed state to the open state. Thus, as... Figure 16A As shown, the treatment liquid in the modulation tank 112 passes through the filter unit 140 and the valve 117.

[0194] As described above, the particle removal of filter 141 in the fourth embodiment is completed.

[0195] The other particle removal methods in the fourth embodiment are the same as those in the third embodiment.

[0196] As described above, in the fourth embodiment, during non-substrate processing, the removal liquid is passed from the downstream piping 161 through the filter 141 and then through the upstream piping 151. Therefore, particles larger than the pores of the filter 141 and physically trapped can also be removed from the filter 141.

[0197] The other effects of the fourth embodiment are the same as those of the third embodiment.

[0198] [Second Variation Example]

[0199] Next, refer to Figure 17 as well as Figure 18 The substrate processing apparatus 100 of the second variation of the present invention will be described. Figure 17This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 of the second variation. In the second variation, an example different from the fourth embodiment is described, that is, an example in which a heater 113 is provided in the upstream portion 32a of the piping 32 and a heater 163 is provided in the downstream piping 161 is described.

[0200] like Figure 17 As shown, the substrate processing apparatus 100 includes heater 113 and heater 163. Furthermore, heater 113 and heater 163 are examples of the "heating section" of the present invention.

[0201] The configuration of heater 113 is the same as that of heater 113 in the second embodiment. However, in the second variation, the output of heater 113 in non-substrate processing may also be the same as the output of heater 113 in substrate processing.

[0202] Heater 163 heats the removed liquid passing through filter 141. Furthermore, heater 163 is disposed on downstream piping 161. In a second variation, although heater 163 is disposed upstream of valve 162, its placement is not particularly limited as long as it is disposed upstream of filter 141. That is, heater 163 can also be disposed, for example, downstream of valve 162.

[0203] Furthermore, in the second variation, the heater 163 heats the removal liquid during non-substrate processing to a second temperature, where the temperature of the removal liquid passing through the filter 141 becomes higher than the first temperature. Additionally, the heater 163 is controlled by the control unit 102.

[0204] The other configurations of the second variation are the same as those of the fourth embodiment.

[0205] Next, refer to Figure 18 The particle removal method of the filter 141 of the substrate processing apparatus 100 of the second variation of the present invention will be described. Figure 18 This is a flowchart illustrating the particle removal method of the filter 141 in the second variation. The particle removal method of the filter 141 in the second variation includes steps S101, S102, S1023, S103b, S1033, and S104.

[0206] like Figure 18 As shown, steps S101 and S102 are the same as in the fourth embodiment. After step S102, the process proceeds to step S1022.

[0207] Next, in step S1023, the control unit 102 activates the heater 163 to heat the removal liquid. Specifically, in non-substrate processing, the control unit 102 heats the removal liquid to a second temperature, which is higher than the first temperature, by changing the temperature of the removal liquid passing through the filter 141. For example, the output of the heater 163 may also be higher than the output of the heater 113.

[0208] Next, in step S103b, the control unit 102 pressurizes the removal liquid, causing it to flow through the filter 141. Specifically, the control unit 102 switches valves 152 and 162 from a closed state to an open state. As a result, the removal liquid from the removal liquid supply unit 165 passes through the downstream piping 161 and the filter unit 140 before being discharged via the upstream piping 151. At this time, the heater 163 heats the removal liquid so that the temperature of the removal liquid passing through the filter 141 is higher than the temperature of the processed liquid passing through the filter 141 in step S101. Therefore, the removal liquid, heated by the heater 163 and pressurized by the removal liquid supply unit 165, passes through the filter unit 140 and is then discharged via the upstream piping 151. Furthermore, at this time, the temperature of the removal liquid passing through the filter 141 is higher than the temperature of the processed liquid passing through the filter 141 in step S101. Therefore, the increased temperature of the filter 141 causes the pore size to increase, making it easier for particles to pass through the pores. Furthermore, the increased temperature of the particles makes them more prone to deformation and easier to pass through pores. Therefore, the removal liquid passes through filter 141, thereby removing particles that are clogging the filter 141. Then, after a predetermined time, control unit 102 returns valves 152 and 162 from the open state to the closed state.

[0209] Next, in step S1033, the control unit 102 stops driving (OFF) the heater 163, thereby stopping the heating of the removal liquid.

[0210] Next, in step S104, the control unit 102 starts supplying the processing fluid again.

[0211] As described above, the particle removal of filter 141 in the second variation example is completed.

[0212] The other particle removal methods and other effects of the second variation are the same as those of the second and fourth embodiments.

[0213] [Third variation example]

[0214] Next, refer to Figure 19 The substrate processing apparatus 100 of the third variation of the present invention will be described. Figure 19This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 of the third variation. In this third variation, an example different from the first to fourth embodiments is described, specifically an example where the downstream piping 161 is connected to the filter unit 140. Furthermore, although here, although... Figure 3 The piping configuration shown in the first embodiment will be described in this description; however, other parts of the piping configuration besides those in the first embodiment may also be modified.

[0215] like Figure 19 As shown, in the third variation of the substrate processing apparatus 100, the downstream piping 161 is connected to the downstream portion 32b of the piping 32 at the downstream side of the filter 141. Specifically, the downstream piping 161 is connected to the piping 32 via the filter unit 140. The downstream piping 161 is connected to the piping 32 via the downstream chamber 142b of the filter unit 140.

[0216] In the third variation, similar to the first to third embodiments, the liquid passing through the filter 141 can be discharged via the downstream piping 161.

[0217] The downstream piping 161 is connected, for example, to the lower part of the downstream chamber 142b. For example, in a configuration where the downstream chamber 142b of the filter unit 140 is connected to a discharge pipe for discharging liquid passing through the filter 141 to the outside, the discharge pipe can also be used as the downstream piping 161. In other words, a pre-installed discharge pipe can also serve as the downstream piping 161. With this configuration, since there is no need to separately install the downstream piping 161, the increase in the number of components in the substrate processing apparatus 100 can be suppressed.

[0218] The other components, particle removal methods, and other effects of the third variation are the same as those of the first to third embodiments.

[0219] [Fourth Variation Example]

[0220] Next, refer to Figure 20 The substrate processing apparatus 100 of the fourth variation of the present invention will be described. Figure 20 This is a schematic diagram illustrating the piping configuration in the substrate processing apparatus 100 of the fourth variation. The fourth variation differs from the third variation in that a downstream side piping 161 is connected to the upper part of the downstream chamber 142b of the filter unit 140. Furthermore, although this variation... Figure 3 The piping configuration shown in the first embodiment will be described in this description; however, other parts of the piping configuration besides those in the first embodiment may also be modified.

[0221] like Figure 20As shown, in the fourth variation of the substrate processing apparatus 100, similarly to the third variation, the downstream piping 161 is connected to the piping 32 via the downstream chamber 142b of the filter unit 140. In the fourth variation, similarly to the third variation, the liquid passing through the filter 141 can be discharged via the downstream piping 161.

[0222] In the fourth variation, the downstream piping 161 is connected, for example, to the upper part of the downstream chamber 142b. For example, in a configuration where the downstream chamber 142b of the filter unit 140 is connected to an exhaust pipe for discharging gas passing through the filter 141 to the outside, the exhaust pipe can also be used as the downstream piping 161. In other words, a pre-installed exhaust pipe can also serve as the downstream piping 161. With this configuration, since there is no need to separately install the downstream piping 161, the increase in the number of components in the substrate processing apparatus 100 can be suppressed.

[0223] The other components, particle removal methods, and other effects of the fourth variation are the same as those of the third variation.

[0224] Furthermore, while examples of downstream piping 161 being connected to piping 32 via filter unit 140 were described in the third and fourth variations, the present invention is not limited thereto. For example, upstream piping 151 may be connected to piping 32 via filter unit 140. Specifically, upstream piping 151 may also be connected to piping 32 via upstream chamber 142a of filter unit 140. Furthermore, in a configuration where upstream chamber 142a of filter unit 140 is connected to a discharge pipe or vent pipe, a discharge pipe or vent pipe may also be used as upstream piping 151. Additionally, similarly to the fourth embodiment, the removed liquid may pass through downstream piping 161 and filter 141 before being discharged via upstream piping 151.

[0225] [Fifth Implementation]

[0226] Next, refer to Figure 21 The substrate processing apparatus 100 according to the fifth embodiment of the present invention will be described. In the fifth embodiment, an example different from the first to fourth embodiments will be described, that is, an example in which particle removal is performed periodically. Furthermore, although changes are made here... Figure 5 The particle removal method of the first embodiment shown will be described in part, but a part of the particle removal method other than the first embodiment may also be modified.

[0227] The substrate processing apparatus 100 of the fifth embodiment is configured the same as that of the first embodiment. However, in the fifth embodiment, the substrate processing apparatus 100 may also omit the detector 116.

[0228] Figure 21This is a flowchart illustrating the particle removal method of the filter 141 according to the fifth embodiment. The particle removal method of the filter 141 according to the fifth embodiment includes steps S201 and S102 to S104. Furthermore, step S201 is an example of the "substrate processing step" of the present invention. In step S201, similar to step S101 described above, the processing liquid is allowed to flow through the filter 141. Furthermore, in step S201, the processing liquid is allowed to flow to the piping 32 and supplied to the substrate processing unit 10, thereby enabling the substrate W to be processed by the processing liquid. Furthermore, in step S201 (substrate processing step), the pressure of the processing liquid relative to the filter 141 is a first pressure.

[0229] like Figure 21 As shown, in step S201, the control unit 102 determines whether a predetermined period has elapsed. The predetermined period is a pre-determined period. The predetermined period can be, for example, the elapsed time since the last replacement or particle removal of filter 141, or the cumulative driving time of the substrate processing apparatus 100. Alternatively, the predetermined period can also be, for example, the cumulative time during which the processing liquid flows through since the last replacement or particle removal of filter 141. The cumulative time during which the processing liquid flows through corresponds to the flow rate of the processing liquid. To measure the aforementioned predetermined period, the substrate processing apparatus 100 preferably includes a timer or a flow meter.

[0230] Furthermore, the predetermined period for the previous replacement of filter 141 may differ from the predetermined period for the previous particulate removal of filter 141. In such cases, the predetermined period for the replacement of filter 141 may be set to be longer than the predetermined period for the particulate removal of filter 141.

[0231] In step S201, if the control unit 102 determines that the predetermined period has not elapsed, step S201 is repeated.

[0232] On the other hand, in step S201, if the control unit 102 determines that a predetermined period has elapsed, the process is transferred to step S102.

[0233] Next, proceed with steps S102 to S104.

[0234] The other particle removal methods in the fifth embodiment are the same as those in the first embodiment.

[0235] As described above, in the fifth embodiment, the removal fluid is periodically supplied from the upstream piping 151 through the filter 141 and then through the downstream piping 161. Therefore, particle removal can be performed before a large amount of particles become clogged. Consequently, the time required for the treatment fluid or removal fluid to flow through the filter 141 is prevented from becoming excessive.

[0236] The other effects of the fifth embodiment are the same as those of the first embodiment. Furthermore, step S201 of the fifth embodiment can also be applied to the second to fourth embodiments.

[0237] [Sixth Implementation Method]

[0238] Next, refer to Figure 22 The substrate processing apparatus 100 of the sixth embodiment of the present invention will be described. Figure 22 This is a schematic diagram showing the piping configuration in the substrate processing apparatus 100 according to the sixth embodiment. In the sixth embodiment, an example is described where a portion of the processing liquid that has passed through valve 117 is returned to the modulation tank 112. That is, in the sixth embodiment, an example is described where the piping 32 is configured to circulate the processing liquid. Furthermore, although variations are made here... Figure 3 The piping configuration shown in the first embodiment will be described in this description; however, other parts of the piping configuration besides those in the first embodiment may also be modified.

[0239] like Figure 22 As shown, in the sixth embodiment, piping 32 includes a common piping 32c, branch piping 32d, return piping 32e, common piping 32f, and branch piping 32g. The common piping 32c is connected to the downstream portion 32b of piping 32. A plurality of (four in this case) branch piping 32ds are connected to the common piping 32c. Branch piping 32ds branch off from the common piping 32c. Branch piping 32ds supply the processed fluid, which has passed through valve 117, to the processed fluid tank 120.

[0240] Return pipe 32e is connected to common pipe 32c. Return pipe 32e extends to conditioning tank 112. Return pipe 32e returns the treated liquid that has passed through common pipe 32c to conditioning tank 112.

[0241] A common piping 32f is disposed, for example, within the treatment fluid tank 120. The common piping 32f is connected to the branch piping 32d. Furthermore, a plurality of branch piping 32g (three in this case) are connected to the common piping 32f. The branch piping 32g branches off from the common piping 32f. The branch piping 32g supplies the treatment fluid that has passed through the common piping 32f to the nozzle 34.

[0242] In the sixth embodiment, when switching valve 117 from the open state to the closed state, valve 117 is switched from the open state to the closed state after all the substrate processing steps in the substrate processing unit 10 have been completed.

[0243] The other components, other particle removal methods, and effects of the sixth embodiment are the same as those of the first embodiment. Furthermore, the piping configuration of the sixth embodiment can also be applied to the second through fifth embodiments.

[0244] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and can be implemented in various ways without departing from the spirit of the present invention. Furthermore, various inventions can be formed by appropriately combining the plurality of constituent elements disclosed in the above embodiments. For example, some of the constituent elements shown in all embodiments may be deleted. Moreover, constituent elements in different embodiments may be appropriately combined. For ease of understanding of the present invention, the accompanying drawings represent the constituent elements principally and schematically, and the thickness, length, number, spacing, etc. of the constituent elements shown may differ from the actual figures due to the nature of the drawings. In addition, the material, shape, size, etc. of the constituent elements shown in the above embodiments are examples and are not particularly limited; various modifications can be made without substantially departing from the effectiveness of the present invention.

[0245] For example, in the first and second embodiments, examples were described where the treatment liquid in the preparation tank 112 was consumed to remove particles; however, the present invention is not limited to this. For example, particles can be removed without substantially consuming the treatment liquid in the preparation tank 112. Specifically, the treatment liquid in the preparation tank 112 is replaced with new treatment liquid periodically, for example. When replacing the treatment liquid in the preparation tank 112 with new treatment liquid, the treatment liquid to be discharged can also be used to remove particles. With this configuration, it is not necessary to consume the treatment liquid in the preparation tank 112 for particle removal. As a result, since the amount of treatment liquid used can be suppressed, the environmental burden can be further reduced.

[0246] Furthermore, although examples of using a removal liquid of a different type than the treatment liquid were shown in the third and fourth embodiments, the present invention is not limited thereto. For example, a removal liquid of the same type as the treatment liquid or a removal liquid with the same composition as the treatment liquid may also be used.

[0247] Furthermore, while the embodiments described above illustrate valves 36, 115, 117, 152, and 162 as examples of valves capable of adjusting the flow rate of liquid, the present invention is not limited thereto. For example, valves 36, 115, 117, 152, and 162 may also be valves that cannot adjust the flow rate of liquid. That is, valves 36, 115, 117, 152, and 162 may simply switch the flow path to an open or closed state.

[0248] Furthermore, while the above embodiments illustrate the use of a pump 114 as a pressurizing unit for pressurizing the treatment liquid, the present invention is not limited thereto. For example, in a configuration where compressed gas is introduced into the conditioning tank 112 and the treatment liquid in the conditioning tank 112 is discharged to the piping 32 using compressed gas, a device such as a compressor for introducing compressed air into the conditioning tank 112 may also be used as the pressurizing unit.

[0249] Industrial availability

[0250] This invention is suitable for use in substrate processing apparatus and particle removal methods.

[0251] [Explanation of Labels in the Attached Image]

[0252] 10: Substrate Processing Unit

[0253] 32: Piping (treatment fluid piping)

[0254] 100: Substrate processing apparatus

[0255] 113, 153, 163: Heater (Heating Unit)

[0256] 114: Pump (pressurization unit)

[0257] 115: Valve (First Valve)

[0258] 116: Detector

[0259] 117: Valve (Second Valve)

[0260] 140: Filter Unit

[0261] 141: Filter

[0262] 142a: Upstream chamber

[0263] 142b: Downstream chamber

[0264] 151: Upstream side piping

[0265] 152: Valve (Third Valve)

[0266] 161: Downstream piping

[0267] 162: Valve (Fourth Valve)

[0268] 165: Deionizing fluid supply unit (pressurization unit)

[0269] S101, S201: Steps (Substrate Processing)

[0270] S103, S103a, S103b: Steps (non-substrate processing steps)

[0271] W: Substrate

Claims

1. A substrate processing apparatus, wherein, Possessing: a substrate processing unit for processing a substrate; a processing liquid pipe through which a processing liquid flows to the substrate processing unit; a filter unit provided in the processing liquid pipe and having a filter for capturing particles in the processing liquid; a pressurizing section for pressurizing a liquid including the processing liquid so that the liquid passes through the filter; and a heating section for heating the liquid that has passed through the filter, the pressurizing section is capable of changing the pressure of the liquid with respect to the filter; in substrate processing in which the substrate is processed by the processing liquid, the pressurizing section pressurizes the processing liquid so that the pressure of the processing liquid with respect to the filter of the filter unit provided in the processing liquid pipe becomes a first pressure; in non-substrate processing in which the substrate is not processed by the processing liquid, the pressurizing section pressurizes the liquid so that the pressure of the liquid with respect to the filter of the filter unit provided in the processing liquid pipe becomes a second pressure higher than the first pressure, in the substrate processing, the temperature of the processing liquid that has passed through the filter of the filter unit provided in the processing liquid pipe is a first temperature; and in the non-substrate processing, the heating section heats the liquid so that the temperature of the liquid that has passed through the filter of the filter unit provided in the processing liquid pipe becomes a second temperature higher than the first temperature. Further possessing:

2. The substrate processing apparatus of claim 1, wherein, an upstream side pipe connected to the processing liquid pipe at an upstream side of the filter; a downstream side pipe connected to the processing liquid pipe at a downstream side of the filter; and a removal liquid supply section connected to one of the upstream side pipe and the downstream side pipe and supplying a removal liquid for removing particles clogging the filter to the one of the upstream side pipe and the downstream side pipe; the liquid includes the removal liquid; the substrate processing apparatus passes the removal liquid from the one of the upstream side pipe and the downstream side pipe through the other of the upstream side pipe and the downstream side pipe via the filter in the non-substrate processing. Further possessing: a first valve provided in the processing liquid pipe at an upstream side of the filter; 3. The substrate processing apparatus of claim 2, wherein, a second valve provided in the processing liquid pipe at a downstream side of the filter; a third valve provided in the upstream side pipe; and a fourth valve provided in the downstream side pipe; the substrate processing apparatus closes the third valve and the fourth valve and opens the first valve and the second valve in the substrate processing, thereby passing the processing liquid from an upstream side of the processing liquid pipe through a downstream side of the processing liquid pipe via the filter; the substrate processing apparatus closes the first valve and the second valve and opens the third valve and the fourth valve in the non-substrate processing, thereby passing the removal liquid from one of the upstream side pipe and the downstream side pipe through the other of the upstream side pipe and the downstream side pipe via the filter. The removal liquid is a liquid of a different kind from the processing liquid. The removal liquid is a liquid of a different kind from the processing liquid. ​ 4. The substrate processing apparatus of claim 2, wherein, ​ 5. The substrate processing apparatus of claim 2, wherein, The substrate processing apparatus passes the removal liquid from the downstream-side pipe through the upstream-side pipe via the filter in the non-substrate processing.

6. The substrate processing apparatus of claim 1, wherein, Further provided are: a discharge pipe connected to the processing liquid pipe or the filter unit, in the non-substrate processing, the liquid that has passed through the filter of the filter unit provided in the processing liquid pipe is discharged through the discharge pipe.

7. The substrate processing apparatus of claim 6, wherein, The filter unit further has: an upstream chamber provided on the upstream side of the filter; and a downstream chamber provided on the downstream side of the filter; the discharge pipe is connected to the downstream chamber.

8. The substrate processing apparatus as recited in Claim 1 or 2, wherein, Further provided is a detector provided in the processing liquid pipe that detects the pressure or flow rate of the processing liquid that has passed through the filter; in a case where the detected value of the detector is less than a threshold value, the pressurizing section pressurizes the liquid so that the pressure of the liquid with respect to the filter becomes the second pressure.

9. The substrate processing apparatus as recited in Claim 1 or 2, wherein, The pressurizing section periodically pressurizes the liquid so that the pressure of the liquid with respect to the filter becomes the second pressure.

10. A particle removal method wherein, Comprise: a substrate processing step of flowing a processing liquid through a filter of a filter unit provided in a processing liquid pipe connected to a substrate processing unit and passing the processing liquid through the substrate processing unit, and processing a substrate with the processing liquid; and a non-substrate processing step of not processing the substrate with the processing liquid; in the substrate processing step, the processing liquid is caused to flow through the filter of the filter unit provided in the processing liquid pipe so that the pressure of the processing liquid with respect to the filter becomes a first pressure; in the non-substrate processing step, a liquid containing the processing liquid is caused to flow through the filter of the filter unit provided in the processing liquid pipe so that the pressure of the liquid with respect to the filter becomes a second pressure higher than the first pressure, in the substrate processing step, the temperature of the processing liquid that has passed through the filter of the filter unit provided in the processing liquid pipe is a first temperature; in the non-substrate processing step, a liquid of a second temperature higher than the first temperature is caused to flow through the filter of the filter unit provided in the processing liquid pipe.

11. The particle removal method according to claim 10, wherein the liquid contains a removal liquid used to remove particles that have clogged the filter; in the non-substrate processing step, the removal liquid is caused to pass through the upstream-side pipe and the downstream-side pipe from one of the upstream-side pipe and the downstream-side pipe via the filter, the upstream-side pipe being connected to the processing liquid pipe at the upstream side of the filter, the downstream-side pipe being connected to the processing liquid pipe at the downstream side of the filter.

12. The particle removal method of claim 11, wherein, the removal liquid is a liquid of a different kind from the processing liquid.

13. The particle removal method of claim 11, wherein, in the non-substrate processing step, the removal liquid is caused to pass through the upstream-side pipe from the downstream-side pipe via the filter.

14. The particle removal method according to claim 10, wherein In the non-substrate processing process, the liquid that has passed through the filter of the filter unit provided to the processing liquid pipe is discharged through a discharge pipe connected to the processing liquid pipe or the filter unit.

15. The particle removal method of claim 14, wherein, The filter unit has: an upstream chamber provided on an upstream side of the filter; and a downstream chamber provided on a downstream side of the filter. The discharge pipe is connected to the downstream chamber.

16. The particle removal method of claim 10 or 11, wherein, In the substrate processing process, in a case where the pressure or the flow rate of the processing liquid that has passed through the filter is less than a threshold value, the non-substrate processing process is executed.

17. The particle removal method of claim 10 or 11, wherein, The non-substrate processing process is executed periodically.

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