Electromagnetic interference shielding and sealing of spring screw mounted assemblies

Abstract

An electronic device package includes a spring screw mounting assembly having a screw, a spring, a gasket, an electromagnetic shield, and a seal. The seal is operable to prevent fluid or particles from entering the electronic device package at a location where the screw engages a housing forming an exterior of the electronic device package. The electromagnetic shield is operable to prevent electromagnetic interference or emissions through the aperture opening on the housing. The spring is operable to provide a controllable accurate load between the processing unit and the housing to ensure sufficient or minimal thermal contact between components of the electronic device package, including the housing and the processing unit housed within the housing. The electronics package may include a stiffener operable to engage with the screw, wherein the stiffener is positioned proximate to the processing units.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of and priority under 35 U.S.C. §119(e) to U.S. Provisional Application Serial No. 63 / 414,838, filed on October 10, 2022, entitled “EMI / WATERSEALING FOR SPRING SCREW MOUNTED ASSEMBLIES,” and U.S. Provisional Application Serial No. 63 / 407,451, filed on September 16, 2022, entitled “EMI / WATER SEALINGFOR SPRING SCREW MOUNTED ASSEMBLIES,” the entire disclosures of which are incorporated herein by reference in their entirety for all their teachings and for all purposes. Technical Field

[0002] The present disclosure relates generally to electronic packaging, and more particularly to electromagnetic interference shielding and sealing of spring screw mounted assemblies. Background Art

[0003] Modern electronic component assemblies or electronic device packages (such as printed circuit board assemblies) may include one or more processing units (e.g., microprocessors, chips, integrated circuits, systems on chips (SOCs), etc.) on a printed circuit board (PCB) or other circuit substrate. Many electronic component assemblies generate heat when in use, including heat generated by current flowing through one or more resistive elements and / or components (such as processing units) in the assembly. When the heat generated by these elements and / or components is not removed efficiently, the temperature of the electronic device may exceed the normal operating range. Operating electronic devices at temperatures outside the normal operating range (even periodically) may cause premature failure and result in shorter component life. Efficient thermal management of electronic components and devices generally requires one or more cooling systems / elements. For example, the heat generated can be directed to the surrounding environment and / or dissipated into the surrounding environment.

[0004] A selected component of a modern electronic component assembly may be a spring screw mounting assembly, or an assembly including spring loaded screws operable to apply an accurate and controllable load of the processing unit against the heat sink. For example, the spring loaded screws may provide a force to ensure contact between the processing component and the heat sink / cold plate or between the processing component and the housing. In some cases, where the processing component is generating heat, the force may be used to ensure that at least minimal contact is maintained between the processing component and the housing, including through an intermediate thermal interface connection (such as thermal grease or paste).

[0005] Due to device size limitations, the screws and springs may need to be outside the housing, thus requiring access to through-apertures in the housing. In certain environments, spring-screw mounting assemblies may be susceptible to electromagnetic interference and / or leakage (including fluids and / or particulates). In particular, these assemblies may be susceptible to leakage through screw holes in the housing (the housing forming the exterior of the assembly). In addition, these assemblies may be susceptible to electromagnetic interference from other components or assemblies located close to these assemblies. Summary of the invention

[0006] Example aspects of this disclosure include:

[0007] A spring screw mounting assembly for electromagnetic interference shielding and sealing an electronic device package, the spring screw mounting assembly comprising: a screw, the screw comprising a head and a shaft; an electromagnetic interference (EMI) shielding element, the electromagnetic interference shielding element being positioned between the head of the screw and a housing; a seal, the seal being positioned between the head of the screw and the housing; and a washer, the washer being positioned between the head of the screw and the housing. The shaft is operable to be inserted into a hole of a housing of the electronic device package. The EMI shielding element is operable to prevent electromagnetic interference from passing through the hole of the housing to a processing unit housed in the housing. The seal is operable to prevent at least one of a fluid or a particle from passing through the hole of the housing to the processing unit housed in the housing. When the shaft of the screw is inserted into the hole of the housing, the shaft of the screw is at least partially surrounded by the washer, the EMI shielding element, and the seal.

[0008] According to any aspect of the present invention, a spring is also included, which is operable to provide a force against the housing. The shaft of the screw is operable to be inserted through the spring and into the hole of the housing. The spring is positioned between the head of the screw and the washer. The washer is operable to transfer the force applied by the spring against at least a portion of the housing.

[0009] According to any aspect of the present disclosure, wherein the EMI shielding element is positioned between the gasket and the housing. The seal is positioned between the EMI shielding element and the housing.

[0010] According to any aspect of the present invention, the gasket and the EMI shielding element are operable to fit within a first cutout in a surface of the housing, the first cutout having a first diameter and a first depth. The seal is operable to fit within a second cutout in the surface of the housing, the second cutout having a second diameter less than the first diameter and a second depth less than the first depth.

[0011] According to any aspect herein, wherein the seal is press-fit into the housing and is operable to engage the shaft of the screw with an interference fit to prevent at least one of fluid or particles from passing through the aperture of the housing to reach a processing unit housed within the housing.

[0012] According to any aspect herein, wherein the gasket, EMI shielding element, and seal include coaxially aligned apertures through which the shaft of the screw passes when the shaft is inserted into the hole of the housing.

[0013] According to any aspect of the present disclosure, wherein the shaft of the screw comprises at least a first shaft section and a second shaft section.

[0014] According to any aspect of the present invention, wherein the first shaft section includes a first shaft diameter corresponding to a first hole diameter of the hole. The second shaft section includes a second shaft diameter that is smaller than the first shaft diameter and corresponds to a second hole diameter of the second hole, wherein the second hole diameter is smaller than the first hole diameter.

[0015] An electronic device package includes: a housing, a processing unit housed in the housing, and a spring screw mounting assembly for electromagnetic interference shielding and sealing. The spring screw mounting assembly includes: a screw including a head and a shaft; an electromagnetic interference (EMI) shielding element positioned between the head of the screw and the housing; a seal positioned between the head of the screw and the housing; and a washer positioned between the head of the screw and the housing. The shaft is operable to be inserted into a hole in the housing. The EMI shielding element is operable to prevent electromagnetic interference from passing through the hole in the housing to reach the processing unit. The seal is operable to prevent at least one of a fluid or a particle from passing through the hole in the housing to reach the processing unit. When the shaft of the screw is inserted into the hole in the housing, the shaft of the screw is at least partially surrounded by the washer, the EMI shielding element, and the seal.

[0016] According to any aspect of the present invention, the housing further comprises a shell and a reinforcement member operable to evenly distribute force to the processing unit, wherein the reinforcement member comprises threads corresponding to the threads of the shaft, the shaft is operable to be inserted into the hole of the shell, into a printed circuit board (PCB), and the threads on the shaft are operable to engage with the threads on the reinforcement member after being inserted into the hole of the shell and into the PCB.

[0017] According to any aspect of the present invention, a spring is also included, which is operable to provide a force against the housing. The shaft of the screw is operable to be inserted through the spring and into the hole of the housing. The spring is positioned between the head of the screw and the washer. The washer is operable to transfer the force applied by the spring against at least a portion of the housing.

[0018] According to any aspect of the present disclosure, wherein the EMI shielding element is positioned between the gasket and the housing. The seal is positioned between the EMI shielding element and the housing.

[0019] According to any aspect of the present invention, the gasket and the EMI shielding element are operable to fit within a first cutout in a surface of the housing, the first cutout having a first diameter and a first depth. The seal is operable to fit within a second cutout in the surface of the housing, the second cutout having a second diameter less than the first diameter and a second depth less than the first depth.

[0020] According to any aspect herein, wherein the seal is press-fit into the upper housing and is operable to engage the shaft of the screw with an interference fit to prevent at least one of fluid or particulates from passing through the aperture of the upper housing to reach the processing unit.

[0021] According to any aspect herein, wherein the gasket, EMI shielding element, and seal include coaxially aligned apertures through which the shaft of the screw passes when the shaft is inserted into the bore of the housing.

[0022] According to any aspect of the present disclosure, wherein the shaft of the screw comprises at least a first shaft section and a second shaft section.

[0023] According to any aspect of the present invention, the first shaft section includes a first shaft diameter corresponding to a first section of the hole having a first hole diameter. The second shaft section includes a second shaft diameter smaller than the first shaft diameter, and the second shaft diameter corresponds to a second section of the hole having a second hole diameter smaller than the first hole diameter.

[0024] A method for constructing an electronic device package including a spring screw mounting assembly, the method comprising: positioning a seal on a housing of the electronic device package; positioning an electromagnetic interference (EMI) shielding element on the housing; positioning a gasket on the housing; and inserting a screw including a head and a shaft into a hole in the housing. The gasket is positioned between the head of the screw and the housing. The EMI shielding element is positioned between the head of the screw and the housing. The EMI shielding element is operable to prevent electromagnetic interference from passing through the hole of the housing to a processing unit housed in the housing. The seal is positioned between the head of the screw and the housing. The seal is operable to prevent at least one of a fluid or a particle from passing through the hole of the housing to the processing unit housed in the housing. When the shaft of the screw is inserted into the hole of the housing, the shaft of the screw is at least partially surrounded by the gasket, the EMI shielding element, and the seal. The gasket, the seal, the EMI shielding element, and the screw form a spring screw mounting assembly.

[0025] According to any aspect of the present invention, a spring operable to provide a force against the housing is also positioned. The shaft of the screw is operable to be inserted through the spring and into the hole of the housing. The spring is positioned between the head of the screw and the washer. The washer is operable to transfer the force applied by the spring against at least a portion of the housing. The washer, seal, EMI shielding element, spring and screw form a spring screw mounting assembly.

[0026] According to any aspect of the present invention, the gasket and the EMI shielding element are operable to fit within a first cutout in a surface of the housing, the first cutout having a first diameter and a first depth. The seal is operable to fit within a second cutout in the surface of the housing, the second cutout having a second diameter less than the first diameter and a second depth less than the first depth.

[0027] The above is a simple summary of the disclosure to provide an understanding of some aspects of the disclosure. This summary is neither a broad overview nor an exhaustive overview of the disclosure and its various aspects, embodiments, and configurations. It is neither intended to identify the key or important elements of the disclosure nor to describe the scope of the disclosure, but rather to present the selected concepts of the disclosure in a simple form as an introduction to the more detailed description presented below. As will be understood, other aspects, embodiments, and configurations of the disclosure may utilize one or more of the features described above or below in detail, either individually or in combination.

[0028] Numerous additional features and advantages of the present disclosure will become apparent to those skilled in the art after considering the description of the embodiments provided below. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A perspective cutaway view of an electronic device package including a spring screw mounting assembly having spring loaded screws and aspects related to electromagnetic interference shielding and sealing according to an embodiment of the present disclosure is shown.

[0030] Figure 2 A perspective cutaway view of an electronic device package including a plurality of spring screw mounting assemblies each having a spring loaded screw and aspects related to electromagnetic interference shielding and sealing is shown according to an embodiment of the present disclosure.

[0031] Figure 3 An elevational cross-sectional view of an electronic device package including a plurality of spring screw mounting assemblies each having a spring loaded screw and aspects related to electromagnetic interference shielding and sealing is shown according to an embodiment of the present disclosure.

[0032] Figure 4 is a flow chart of a method or process for assembling an electronic device package including at least one spring screw mounting assembly, each assembly having a spring loaded screw and aspects related to electromagnetic interference shielding and sealing, according to an embodiment of the present disclosure.

[0033] Figure 5is a flow chart of a method or process for disassembling an electronic device package including at least one spring screw mounting assembly each having a spring loaded screw and aspects relating to electromagnetic interference shielding and sealing according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0034] Embodiments of the present disclosure will be described in conjunction with electronic device packages and, in some embodiments, in conjunction with the construction, structure, and arrangement of components that make up electronic device packages, such as spring screw mounting assemblies including electromagnetic interference shielding and sealing aspects.

[0035] In some embodiments, the present disclosure describes a spring screw mounting assembly, which includes a housing (e.g., a rack, a housing, a shell, etc.) that accommodates one or more processing units and is held together at least in part by one or more spring-loaded screws. For example, the one or more processing units may include, but are not limited to, microprocessors, chips, integrated circuits, systems on chips (SOCs), etc. on a printed circuit board (PCB) or other circuit substrate. For example, a SOC may include a processing unit having all the necessary electronic circuits and parts for a given system (such as a computer chip) on a single integrated circuit. In some embodiments, an electronic device package may be used in a vehicle, for example, to assist in the autonomous manipulation and driving of a vehicle, wherein the SOC provides computing and / or other features for operating the vehicle. However, although described in the context of a vehicle, it should be noted that the electronic device package described herein may be used for other purposes without departing from the scope of the present disclosure. In addition, the spring screw mounting assembly described herein may be used for any given electronic device package including one or more processing units, which electronic device package requires at least a cooling system, which includes but is not limited to contacting a radiator or radiator assembly to operate efficiently.

[0036] Thermal management of processing units has been around for some time. That is, most electronic devices or electronic device packages generate heat when in use (e.g., heat typically generated by current flowing through one or more resistive elements and / or components (such as a processing unit) in the electronic device or electronic device package). When the heat generated by these elements and / or components is not efficiently removed, the temperature of the electronic device may exceed a normal operating range, wherein operating the electronic device at temperatures outside of the normal operating range (even periodically) may cause the electronic device to fail prematurely and / or result in a shorter life of components in the electronic device. Efficient thermal management of electronic components and devices generally requires one or more cooling systems / elements. For example, the heat generated may be directed to and / or dissipated into the surrounding environment.

[0037] As described herein, a spring screw mounting assembly is provided that includes spring loaded screws designed to thermally connect one or more processing units (e.g., a SOC or SOC processor) in an electronic device package to a cooling device (e.g., a heat sink) of the electronic device package. In some embodiments, the electronic device package includes a thermal interface connection or thermal interface material (TIM), such as thermal grease, thermal paste, and / or one or more heat transfer devices or pads (e.g., "spreader" pads, heat spreaders, cooling pads, etc.) positioned between a surface (e.g., an inner surface) of the housing and a processing unit contained within the housing. The spring loaded screws are operable to provide an accurately controllable load of the processing unit against the heat sink, thereby ensuring sufficient or minimal thermal contact between the housing and the processing unit, including via an intermediate thermal interface connection. For purposes of the present disclosure, "thermal contact" includes actual physical contact or gaps between components that allow sufficient heat transfer to occur via a thermal interface connection or TIM positioned within the gap and between the components.

[0038] In selected environments, such as where the electronics package is mounted within a vehicle operable in dust, dirt, mud, rain, or snow conditions, the hole through a portion of the housing is susceptible to particle or fluid leakage, and the spring-loaded screw extends into the hole and engages with the rest of the housing. In some embodiments, the spring screw mounting assembly can include a seal or sealant (e.g., such as a gasket, etc.) proximate the hole in the first portion of the housing through which the screw passes to engage the reinforcement while positioning the processing unit between the housing and the reinforcement.

[0039] Additionally, where the electronics package is installed in a vehicle, the electronics package and / or components housed therein may be susceptible to electromagnetic interference (EMI) from surrounding components within the vehicle and / or from other sources within the surrounding environment. In some embodiments, the spring screw mounting assembly may include a shielding element, such as an EMI shield, operable to protect internal components (e.g., a processing unit, etc.) housed within the housing from electromagnetic interference.

[0040] In the case of spring mounting, the spring screw mounting assembly applies a controlled and accurate pressure between the thermal processing unit and the heat sink. Furthermore, the reinforcement on the other dimensions of the processing unit helps to apply a uniform load around the entire processing unit and prevent strain critical points while maintaining a minimum space between the processing unit and the heat sink. It should be noted that Figures 1 to 3 An exemplary z-direction of a spring screw mounting assembly is shown in FIG.

[0041] In some embodiments, the electronic component assembly or electronic device package includes a spring screw mounting assembly, which has a seal operable to prevent fluid or particles from leaking into the electronic component assembly, wherein the seal is compressed into a groove in the upper housing. The spring screw mounting assembly also includes an EMI shield (or EMI shielding), which is positioned in the same or another groove in the upper housing to allow electrical connection between the screw and the housing. The spring screw mounting assembly also includes a screw passing through the EMI shield and the seal. The seal is operable so that once the screw passes through the seal, the seal conforms to the screw to prevent fluid or particles from leaking into the electronic component assembly. The gasket is positioned between the EMI shield and the head of the screw and / or the spring through which the screw passes, so as to distribute the force from the head of the screw and / or the spring through which the screw passes relative to the EMI shield and / or the seal. Typically, the gasket can be directly or indirectly (e.g., via the EMI shield) in contact with the housing to distribute the force from the spring to the housing and to the EMI shield and / or the seal around and provide electrical connection.

[0042] Embodiments of the present disclosure provide solutions to one or more of the problems of (1) providing adequate protection using seals to prevent fluids or particles from leaking into an electronic component assembly, and (2) providing adequate protection or shielding to shield components within an electronic component assembly from electromagnetic emissions or electromagnetic interference (EMI). A sealant can prevent fluids or particles from leaking into an electronic component assembly from an external source. An EMI shield can prevent EMI from external sources at internal components within an electronic component assembly, and / or prevent internal components from generating EMI that propagates outward and interferes with other external components.

[0043] Now go to Figure 1, a three-dimensional cross-sectional view 100 of an electronic device package 101 according to an embodiment of the present disclosure is provided. In some embodiments, the electronic device package 101 can be designed to provide functions to a vehicle and / or assist in the operation of the vehicle. For example, the electronic device package 101 can be a computer module for a vehicle. In some examples, the functions provided by the electronic device package 101 may include key functions of the vehicle, such as autonomous driving operations, navigation, radar (RADAR), vehicle control, communication (e.g., vehicle-to-vehicle (V2V) or vehicle-to-everything (V2X) communication), etc. Additionally, the vehicle described herein may include any vehicle or vehicle model, wherein the vehicle is designed for the purpose of moving one or more tangible objects (such as people, animals, cargo, etc.). The term "vehicle" does not require that the vehicle moves or is capable of moving. Typical vehicles may include, but are by no means limited to, electric vehicles, cars, trucks, motorcycles, buses, automobiles, bicycles, scooters, paved or unpaved ground transportation, trains, rail transportation, boats, ships, marine transportation, underwater transportation, airplanes, spacecraft, aircraft, human-powered transportation, etc.

[0044] As described herein, the electronic device package 101 may include a first housing or upper housing 102. The electronic device package 101 may include a second housing or lower housing 104. The electronic device package 101 may include an interior volume or package envelope 106 defined between the upper housing 102 and the lower housing 104.

[0045] In some embodiments, one or more processing units 108 may be positioned within the package envelope 106. It should be noted that the processing unit may be referred to as an SOC or an integrated circuit, or may include an SOC. The SOC may be a microchip having all the necessary electronic circuits and parts for a given system, such as a computer chip or a chip that enables / provides a system in a vehicle on a single integrated circuit. For example, the SOC may perform calculations and / or provide other features for operating a vehicle. In some examples, multiple SOCs may operate together (e.g., or in subset form) to provide features for operating a vehicle, and / or a separate SOC may provide separate features for operating a vehicle. Although described in the context of a vehicle, the electronic device package 101 described herein may be used to provide other purposes and in other contexts not explicitly described herein.

[0046] It should be noted herein that processing unit 108 may be configured in one or more subassemblies within package envelope 106, wherein each subassembly includes one or more processing units (e.g., microprocessors, chips, integrated circuits, systems on a chip (SOC), etc.) on a printed circuit board (PCB) or other circuit substrate. In some examples, the one or more subassemblies may be attached to and electrically coupled to a main PCB or motherboard (e.g., such as a motherboard). Figure 1 ) and / or portions of the same daughter card. The daughter card(s) may provide supplementary or complementary functions for the main PCB or motherboard stored in the electronic device package 101. For example, the daughter card(s) may be a type of circuit board that is inserted into or attached to a motherboard or similar expansion card (e.g., a main PCB) to expand the features and services of the motherboard or similar expansion card. That is, the daughter card may supplement or complement the existing functions of the motherboard or expansion card. The daughter card(s) (and / or the main PCB) may partially provide functions for a vehicle (e.g., an electric vehicle), but is not limited to such examples. In addition, the daughter card(s) may require a large amount of power to provide the supplementary / complementary functions, which may result in the heat generated having to be dissipated to prevent the temperature of the electronic device package 101 from exceeding the normal operating temperature, thereby reducing the possibility of premature failure of the electronic device package 101 and / or components within the electronic device package 101. Further, the daughter card(s) may be at the same or different heights within the package envelope 106 , such that additional care must be taken to ensure adequate or minimal thermal contact between the processing unit 108 and the upper housing 102 .

[0047] Depending on the arrangement, orientation, and / or configuration of the processing unit 108 within the package envelope 106, it is noted herein that, throughout the present disclosure, various discussions regarding the interfacing between the processing unit 108 and the upper housing 102 may be understood similarly to the explanation regarding the processing unit 108 and the lower housing 104, without departing from the scope of the present disclosure. Although not explicitly shown in the various figures, it is noted that the package envelope 106 may include, but is by no means limited to, a plurality of other components that fit between or around the other components described herein. For example, the electronic device package 101 may include one or more gaskets, O-rings, thermal shields, clamps, and / or other components between the upper housing 102 and the lower housing 104, between the processing unit 108 and the upper housing 102, between the processing unit 108 and the lower housing 104, between the processing units 108, and the like.

[0048] As referenced in this article Figures 2 to 5Described in more detail, the electronic device package 101 may include a spring screw mounting assembly 110. In an embodiment, the spring screw mounting assembly 110 may include one or more of a screw 112, a spring 114, a washer 116, an electromagnetic interference (EMI) shield 118 (or an EMI shielding element 118), and / or a seal 120 (or a sealing element 120). For example, at least a first portion 122 of the screw is positioned outside the upper housing 102, and at least a second portion 124 of the screw is operable to be inserted into the upper housing 102. For example, at least the second portion 124 of the screw may engage with the upper housing 102, a reinforcement 126, and / or with a component housed within the electronic device package 101 to secure the electronic device package 101 together. Although not shown, it should be noted that the upper shell 102 and the lower shell 104 can be directly connected together (e.g., via fasteners) or indirectly connected together (e.g., both connected to an intermediate member or frame portion, reinforcement 126, etc.) without departing from the scope of the present disclosure.

[0049] Figure 2 A perspective cross-sectional view 200 of an electronic device package 101 according to an embodiment of the present disclosure is depicted. In some examples, reference Figure 2 The depicted perspective cross-sectional view 200 may be implemented Figure 1 For example, the perspective cross-sectional view 200 of the electronic device package 101 can be as shown in FIG. Figure 1 A view of the different components included in the depicted electronic device package 101 .

[0050] When in use, the electronic device package 101 may generate heat, for example, heat typically generated by current flowing through one or more resistive elements and / or components (such as the processing unit described above) of the electronic device package 101. If the heat generated in the electronic device package 101 (e.g., via the processing unit) is not removed efficiently, the temperature of the electronic device package 101 may exceed the normal operating range. In some examples, operating the electronic device package 101 (even periodically) at a temperature outside the normal operating range can cause premature failure of the electronic device package 101 and / or result in a shorter life of components in the electronic device package 101.

[0051] The upper housing 102 and / or the lower housing 104 of the electronic device package 101 may include a cooling structure 202. For example, the cooling structure 202 may include, but is by no means limited to, heat dissipation fins, etc. It should be noted that the cooling structure 202 is not limited to, for example, Figure 2 The shapes and / or configurations shown, and other shapes and / or configurations of the cooling structure 202 are possible without departing from the scope of the present disclosure.

[0052] The upper housing 102 and / or the lower housing 104 of the electronic device package 101 may include an area 204 without cooling structures 202, such as where the spring screw mounting assembly 110 is positioned on the electronic device package 101. In an embodiment, the area 204 includes raised structures 206 that are adjacent to the spring screw mounting assembly 110 and / or into which the spring screw mounting assembly 110 is inserted. For example, as described herein with reference to Figure 3 As described in detail, the raised structures 206 can help retain selected components of the spring screw mounting assembly 110 at defined locations on the electronic device package 101. However, it should be noted that the spring screw mounting assembly 110 can be inserted into the upper housing 102 and / or the lower housing 104 at a substantially flat portion of the surface of the respective housings without departing from the scope of the present disclosure, making the raised structures 206 optional.

[0053] For purposes of the present disclosure, the combination of the upper housing 102 , the lower housing 104 , and the package envelope 106 may be considered together as portions of the housing 208 of the electronic device package 101 .

[0054] Generally, the positioning of the spring screw mounting assemblies 110 can be anywhere on the electronic device package 101, so long as these spring screw mounting assemblies 110 provide an accurate and controllable load of the processing unit against the heat sink to ensure sufficient or minimal thermal contact between portions of the housing 208 (e.g., the upper housing 102) and the processing unit housed within portions of the housing 208 (e.g., within the package envelope 106) to dissipate heat from the processing unit 108 via the cooling structure 202. In the event that a thermal interface connection is positioned between the processing unit 108 and the housing 208, the positioning of the spring screw mounting assemblies 110 should also prevent movement of the thermal interface connection and generally ensure sufficient or minimal thermal contact between the housing 208, the thermal interface connection, and the processing unit 108. In this regard, the positioning of the spring screw mounting assemblies 110 relative to the cooling structure 202 is provided for illustration only and should not be considered limiting for purposes of the present disclosure.

[0055] Figure 3 An elevational cross-sectional view 300 of an electronic device package 101 in an assembled state according to an embodiment of the present disclosure is depicted. In some examples, such as reference Figure 3 The described elevational section 300 may be implemented Figure 1 and Figure 2 For example, the elevational cross-sectional view 300 of the electronic device package 101 may be as shown in FIG. Figure 1 and / or Figure 2 A view of an electronic device package 101 is depicted.

[0056] It should be noted that the following discussion generally refers to one spring screw mounting assembly 110, but it should be understood that it can be extended to some or all of the multiple spring screw mounting assemblies 110 of the electronic device package 101 (e.g., Figure 2 and Figure 3 It should be noted that for the purpose of clarity only, Figure 3 The lower housing 104 is not shown in FIG. 1 , and the absence of the lower housing 104 is not intended to limit the present disclosure.

[0057] The screw 112 may include a head 302 at the proximal end. The head 302 (and / or the screw 112 in general) may include one or more tool engagement features 304. The tool engagement feature 304 may be operable to receive a tool and transmit the force applied to the tool to the screw 112 when the spring screw mounting assembly 110 is installed in the electronic device package 101. For example, the tool engagement feature 304 may be configured to receive a tool received from the outside (e.g., a surface or a set of surfaces operable to engage with a wrench, a socket, etc.). By way of another example, the tool engagement feature 304 may be configured to receive a tool received from the inside (e.g., a slot, hole, or other orifice operable to engage with a hexagonal wrench, a screwdriver, or a drill bit (including a flat drill bit, a Phillips drill bit, a square drill bit, or a torx or star drill bit, etc.)

[0058] The screw 112 can include a shaft 306 having one or more segments along an axial length (e.g., in the z-direction) of the screw 112. In one non-limiting example, the shaft 306 can be a single shaft segment 308 having a single diameter 310. The shaft segment 308 can form both the first portion 122 and the second portion 124 of the screw 112.

[0059] In a second non-limiting example, the shaft can have a plurality of sections including, but in no way limited to, a first shaft section 308 having a first shaft diameter 310, a second shaft section 312 having a second shaft diameter 314, a third shaft section 316 having a third shaft diameter 318, ..., up to N shaft sections having N shaft diameters. For example, some or all of the first shaft sections 308 can form the first portion 122 of the screw 112, while some or all of the second shaft sections 312 and the third shaft sections 316 can form the second portion 124 of the screw 112. However, it should be noted herein that the first shaft section 308 and the second shaft section 312 can have the same diameter, and / or the second shaft section 312 and the third shaft section 316 can have the same diameter without departing from the scope of the present disclosure.

[0060] It should be noted that there may be one or more transition regions between each shaft segment 308, shaft segment 312, and shaft segment 316. The one or more transition regions may produce a sudden diameter change, a constant slope diameter change, a diameter change that is contoured to conform to an arc shape between adjacent regions, or a combination thereof. For example, a transition region may connect a first shaft segment 308 with a second shaft segment 312, wherein the transition region includes an outer sidewall having a substantially constant slope. By way of another example, a transition region may connect a second shaft segment 312 with a third shaft segment 316, wherein the transition includes a sudden diameter change. However, these examples are provided for illustration only and are not intended to limit the present disclosure.

[0061] In a second non-limiting example, a first shaft segment 308 having a first shaft diameter 310 is operable to receive a spring 114, wherein the first shaft diameter 310 is selected to accommodate the size of the available spring 114 selected based on the desired load. Additionally, a second shaft segment 312 may enter or pass through a first hole 320 having a diameter substantially similar to or greater than a diameter 314 of the second shaft segment 312 to allow for smooth or interference-free passage of the second shaft segment 312. In some cases, the second shaft segment 312 may contact a surface of a PCB within the package envelope 106.

[0062] Also in a second non-limiting example, the third shaft segment 316 can enter or pass through a second hole 322 having a diameter substantially similar to or greater than the diameter 318 of the second shaft segment 316 to allow for smooth or interference-free passage of the second shaft segment 316. Alternatively, the third shaft segment 316 can pass through a second hole 322 having a diameter less than the diameter 318 of the second shaft segment 316, such that the third shaft segment 316 is screwed into the second hole 322. In some cases, the first hole 320 is on the upper housing 102, and the second hole 322 is on the reinforcement 126, wherein the threads in the hole 322 correspond to the threads on the third shaft segment 316 to secure the screw 112 to the reinforcement 126.

[0063] It should be noted herein that the hole 320 can be considered a hole in the upper housing 102 (or the housing 208 in general). Additionally, it should be noted herein that the hole 322 can be considered a hole through at least one of the PCB or the other PCB and / or the stiffener 126 (e.g., through a bracket of the stiffener 126). In some examples, the PCB 321 (e.g., Figure 3320) includes an aperture 323 that at least partially forms the hole 322, or alternatively the aperture is before the hole and leads from the hole 320 to the hole 322. The aperture 323 can be in the surface of the PCB 321 that contacts the second shaft segment 312, and the aperture 323 can be operable to receive the third shaft segment 316. It should be noted that the PCB 321 can be the same as or separate from the one or more processing units 108. In some cases, the one or more processing units 108 include a daughter card that communicates with the main PCB 321 (e.g., a motherboard or mother card).

[0064] In general, the various shaft diameters may be the same or different. In the second non-limiting example as discussed above, the first shaft diameter 310 is greater than the second shaft diameter 314, and the second shaft diameter 314 is greater than the third shaft diameter 318. However, it should be noted that this example is provided for illustrative purposes only and should not be construed as limiting.

[0065] Although not shown, it is understood that second shaft segment 312 may include threads complementary to threads in first hole 320. Alternatively, where there is only a single shaft segment 308, at least a portion of the single shaft segment 308 may include threads complementary to a corresponding hole in electronic device package 101.

[0066] It should be noted that a portion of the first hole 320 and / or a portion of the second hole 322 may be formed by the reinforcement member 126. In an embodiment, the reinforcement member 126 may include a bracket (e.g., such as a bracket) that separates or divides the layers within the package envelope 106 and / or separates the upper shell 102 from the lower shell 104. Figure 1 In an embodiment, the reinforcement members 126 may help distribute loads beneath the processing unit 108 within other layers of the package envelope 106 .

[0067] Additionally, it should be noted that the first hole 320 may pass through the upper shell 102 and / or through one or more layers contained within the enclosure envelope 106. It should also be noted that the second hole 322 may pass through one or more layers contained within the enclosure envelope 106 and / or within the stiffener 126.

[0068] The screw 112 can include a tip 324 at the distal end. The tip 324 can be flat or can be pointed without departing from the scope of the present disclosure. In some examples, when the screw 112 is inserted into the electronic device package 101, the tip 324 can be positioned within a groove or cavity within the reinforcement member 126 and / or within the lower housing 104 (e.g., as shown in FIG. Figure 1 shown).

[0069] When the screw 112 is inserted into the electronic device package 101, one or more of the shaft segments 308, shaft segments 312, and shaft segments 316 can pass through the coils of the spring 114 and / or be positioned within the coils of the spring. The spring 114 can be configured to exert a directional force on the washer 116 and / or on the head 302 of the screw 112 when the electronic device package 101 is fully assembled, so that the upper housing 102 moves to form thermal contact with the processing unit 108 within the package envelope 106 of the electronic device package 101. Subsequently, based on the directional force exerted by the spring 114, the thermal energy generated by the processing unit 108 of the electronic device package 101 can be transferred through the upper housing 102 and the cooling structure 202. For example, the directional force exerted by the spring 114 is designed to move the upper housing 102 toward the processing unit 108 to achieve thermal contact, wherein the heat generated by the processing unit 108 is absorbed by the upper housing 102 and dispersed by the cooling structure 202.

[0070] The spring 114 may directly or indirectly exert a force on the head 302 of the screw 112 and the upper housing 302. For example, the spring 114 may exert a force on the head 302 and the washer 116, wherein the washer 116 transfers the force to the upper housing 302. In this example, the washer 116 provides uniform loading from the spring 114 to the EMI shield 118 and to the upper housing 102. Moreover, the washer 116 provides increased electrical contact between the spring 114 and the EMI shield 118 while preventing damage to the EMI shield 118 that may be caused by the spring 114.

[0071] In an embodiment, the gasket 116 can be made of a material that can withstand the force applied to the gasket 116 by the spring 114. For example, the gasket can be made of a material including, but by no means limited to, a metal. In some examples, the gasket 116 can be made of steel, galvanized steel, stainless steel, copper, brass, titanium, aluminum, or an alloy containing any of the foregoing metals. In general, the gasket 116 can be made of any material with sufficient conductive properties to provide contact between the EMI shield 118, the screw 112, the spring 114, and the upper housing 102 (and therefore the housing 208).

[0072] EMI shield 118 may be made of foam or other biasable or resilient material. EMI shield 118 should have sufficient properties to shield internal components within electronic device enclosure 101 from electromagnetic interference that may radiate from external components through hole 322 and / or through hole 320, and / or shield external components from electromagnetic interference that may radiate from internal components within electronic device enclosure 101 through hole 322 and / or through hole 320. EMI shield 118 may be at least partially compressible due to applied forces from one or more surfaces of gasket 116, seal 120, and / or upper housing 102.

[0073] The seal 120 may be made of a material including, but not limited to, a biasable or resilient plastic or a biasable or elastomer (or a resilient polymer including thermosets and thermoplastics) such as rubber. The seal 120 may be configured to secure fluids such as air or water (e.g., rain or snow) and particulates (e.g., dust, dirt, or mud). The seal 120 may be at least partially compressible due to applied forces from the EMI shield 118 and / or from one or more surfaces of the upper housing 102.

[0074] Gasket 116, EMI shield 118, and / or seal 120 may be located within cutouts in surface 326 of upper housing 102. For example, surface 326 may be an upper surface proximate cooling structure 202 and / or a lower surface proximate package envelope 106.

[0075] The cutouts may have one or more diameters at one or more depths (e.g., having a selected height) within the thickness of upper housing 102, thereby allowing one or more of gasket 116, EMI shield 118, and / or seal 120 to be stacked flush with or below surface 326 and within the body of upper housing 102. Where there are multiple different diameters, the cutouts may be considered stepped cavities for purposes of the present disclosure.

[0076] In one non-limiting example, there may be multiple cutouts including, but by no means limited to, a first cutout 328 having a first cutout diameter 330 and a first depth 332 in which the gasket 116 and the EMI shielding element 118 are located, and a second cutout 334 having a second cutout diameter 336 and a second depth 338 in which the seal 120 is located.

[0077] In general, the various cutout diameters and / or heights may be the same or different. In the above non-limiting example, the first cutout diameter 330 is larger than the second cutout diameter 336. This allows the EMI shield 118 and / or gasket 116 to have a larger diameter than the seal 120, thereby allowing the EMI shield 118 and / or gasket 116 to make physical and electrical contact with a surface 340 that is substantially parallel to the surface 326 of the upper housing 102 and angled or substantially perpendicular to the axis through the screw 112, rather than being prevented from being contacted by the seal 120. Additionally, when the seal 120 below the EMI shield 118 and gasket 116 positioned within the first cutout 328 is pressed into the second cutout 334 of the smaller cutout diameter 330, the second cutout diameter 336 being smaller than the first cutout diameter 330 helps seal the hole 320. Further, the decreasing diameter along the axial length of the screw 112 ensures that the washer 116 covers and / or protects the EMI shield 118, and the EMI shield 118 similarly covers and / or protects the seal 120. However, it should be noted that this example is provided for illustrative purposes only and should not be construed as limiting the present disclosure. Moreover, in a second non-limiting example, the height of the first cutout depth 332 can be greater than the height of the second cutout depth 338.

[0078] Moreover, in the above non-limiting example, when the screw 112 is inserted into the electronic device package 101, the cross-sectional shaft portion 312 and the third shaft portion 316 of the screw 112 can be at least partially surrounded by the gasket 116, the EMI shield 118 and / or the seal 120. For example, when the screw 112 is inserted into the electronic device package 101, one or more portions of the screw 112 can at least partially pass through the inner apertures or openings of the gasket 116, the EMI shield 118 and the seal 120. The gasket 116 and the EMI shield 118 can rest within the first cutout 328, and the seal 120 can be press-fit within the second cutout 334. The force exerted by the gasket 116 on the EMI shield 118 (e.g., the force transmitted from the spring 114) can cause the EMI shield 118 to expand slightly outward, i.e., compress. The seal 120 may also be sized to have an inner diameter that is smaller than the second shaft diameter 314 of the second shaft portion 312, such that the seal 120 further forms an interference fit with the screw 112. It should be noted that the EMI shield 118 may also be sized to have an inner diameter that is smaller than the second shaft diameter 314 of the second shaft portion 312, such that the EMI shield 118 also forms an interference fit with the screw 112.

[0079] In some cases, the thickness of seal 120 is greater than the depth 338 of second cutout 334. Seal 120 compresses such that the top surface of seal 120 becomes flush with surface 340 during expansion of seal 120 to fill second cutout 334 and the dispensing of additional material provided by the increased thickness of seal 120. Additionally, EMI shield 118 may have a thickness capable of expanding and at least partially filling first cutout 328 with force exerted on EMI shield 118 by gasket 116 (e.g., as transferred from spring 114).

[0080] It should be noted that the cutouts 328, 334, and / or the gasket 116, EMI shield 118, and seal 120 may be substantially circular in plan cross-section, or alternatively may be any polygonal shape in plan cross-section without departing from the scope of the present disclosure. Additionally, while the embodiments relate to the gasket 116 and EMI shield 118 being located in the same cutout 328, it should be noted that the gasket 116 and EMI shield 118 may have different corresponding cutouts without departing from the scope of the present disclosure.

[0081] Figure 4 A flow chart of a method or process 400 for assembling an electronic device package 101 according to an embodiment of the present disclosure is depicted. For example, the method or process 400 can be used to form and assemble an electronic device package 101 that includes at least one of the components described herein and with reference to the components. Figures 1 to 3 The spring screw mounting assembly 110 described. Although Figure 4 The general order of steps of method or process 400 is shown in FIG. 1 , but method or process 400 may include more or fewer steps, or may be combined with steps in the same manner as described above. Figure 4 The steps shown in the figure may be arranged in different (including simultaneously, substantially simultaneously or sequentially) order of the steps. Generally, the method or process 400 begins at step 402 with a start operation and ends at step 414 with an end operation. The method or process 400 may be performed, but is not limited to, as a set of computer executable instructions executed by an assembly machine (e.g., a robotic assembly system, an automated assembly system, a computer-aided drafting (CAD) machine, etc.) and encoded or stored on a computer-readable medium. Hereinafter, reference will be made to the method or process 400 in conjunction with the method or process 400. Figures 1 to 3 The components, devices, assemblies, environments, etc. are described to explain the method or process 400.

[0082] In step 404, the upper housing 102 is aligned with the processing unit 108 and the reinforcement 126. The processing unit 108 may be positioned between the upper housing 102 and the reinforcement 126. It should be noted that the upper housing 102, the processing unit 108, and / or the reinforcement 126 may include one or more auxiliary features (such as, but not limited to, alignment grooves and pins, etc.) to increase the likelihood of proper alignment. Although not shown, additional gaskets or seals may be positioned between adjacent flanges or mating surfaces of the upper housing 102 and the reinforcement 126 during alignment.

[0083] At step 406, seal 120 is positioned on upper housing 102. In one non-limiting example, seal 120 may be press fit into second cutout 334 to ensure a proper seal to prevent fluid or particulate leakage proximate aperture 322 and / or aperture 320.

[0084] At step 408, the EMI shield 118 is positioned on the upper housing 102. In one non-limiting example, the EMI shield 118 may be positioned on the seal 120 and in the first cutout 328. The corresponding internal apertures or openings in the EMI shield 118 and the seal 120 may be coaxially aligned.

[0085] In step 410, the gasket 116 is positioned on the upper housing 102. In one non-limiting example, the gasket 116 may be positioned on the EMI shield 118 and in the first cutout 328. The corresponding internal apertures or openings within the gasket 116, EMI shield 118, and seal 120 may be coaxially aligned.

[0086] Although steps 406, 408, 410 are described as stacking the seal 120, EMI shield 118, and gasket 116 on the upper surface of the upper housing 102, it should be noted that the seal 120, EMI shield 118, and gasket 116 may alternatively be stacked or positioned within a cutout in the lower surface of the upper housing 102. For example, the upper housing 102 may be flipped over and the gasket 116 and EMI shield 118 may be positioned in the lower surface prior to aligning the processing unit 108 and the stiffener 126. In this regard (and generally), step 404, which includes aligning the upper housing 102 with the processing unit 108 and the lower housing 104, may occur after steps 406, 408, 410 without departing from the scope of the present disclosure.

[0087] In step 412, the upper housing 102, the processing unit 108, and the reinforcement 126 are coupled with the screw 112 and the spring 114. The screw 112 is inserted into the spring 114 and then through the gasket 116, the EMI shield 118, and the seal 120, and then into the hole 322 and / or the hole 320 of the electronic device package 101 (e.g., in the upper housing 102, the processing unit 108, and the reinforcement 126). The screw 112 is turned (e.g., via the tool engagement feature 304) until a desired or predetermined torque value is reached. This allows the spring 114 to always apply and maintain an accurately controllable load on the head 302 of the screw 112 and on the gasket 116, thereby ensuring that sufficient or minimal thermal contact occurs between the processing unit 108 and the upper housing 102. It should be noted that the step of connecting the upper shell 102 and the reinforcement 126 with the screw 112 and the spring 144 may include sub-steps, such as but not limited to: positioning a spring that is operable to provide a force against the upper shell 102 or the outer shell 208, and inserting the screw 112 into the spring 114 and into the hole of the upper shell 102 or the outer shell 208.

[0088] It should be noted that installing the screw 112 and the spring 114 completes the spring screw mounting assembly 110 having the washer 116, the EMI shield 118, and the seal 120. Steps 406, 408, 410, and 412 may then be repeated as needed to install additional spring screw mounting assemblies 110 in the electronic device package 101.

[0089] It should be noted that without departing from the scope of the present disclosure, the method or process 400 may include one or more steps involving coupling the upper housing 102 and / or the stiffener 126 (e.g., depending on the components on the electronic device package 101) to the lower housing 104. For example, the lower housing 104 may be coupled to the upper housing 102 at any point in time before, between, or after steps 406, 408, 410, and 412. For example, the lower housing 104 may be coupled to the upper housing 102 after step 412 is completed.

[0090] Figure 5 A flow chart of a method or process 500 for assembling an electronic device package 101 according to an embodiment of the present disclosure is depicted. For example, the method or process 500 can be used to disassemble an electronic device package 101 that includes at least one of the components described herein and with reference to FIG. Figures 1 to 3 as well as Figure 4 The method or process 400 described herein is a spring screw mounting assembly 110. Although in Figure 5 The general order of steps of method or process 500 is shown in FIG. 1 , but method or process 500 may include more or fewer steps, or may be combined with steps in the same manner as described above. Figure 5 The steps shown in the figure may be arranged in different (including simultaneously, substantially simultaneously or sequentially) order of the steps. Generally, the method or process 500 begins at step 502 with a start operation and ends at step 514 with an end operation. The method or process 500 may be performed, but is not limited to, as a set of computer executable instructions executed by an assembly machine (e.g., a robotic assembly system, an automated assembly system, a computer-aided drafting (CAD) machine, etc.) and encoded or stored on a computer-readable medium. Hereinafter, reference will be made to the method or process 500 in conjunction with the method or process 500. Figures 1 to 3 as well as Figure 4 The method or process 500 is explained with reference to the components, devices, assemblies, environments, etc. described in the method or process.

[0091] In step 504, the screw 112 and spring 114 are removed to decouple the upper housing 102, the processing unit 108, and the reinforcement 126. Decoupling the upper housing 102 allows access to the processing unit 108 and the reinforcement 126 positioned in the enclosure envelope 106 within the upper housing 102 (e.g., such as for inspection, repair, replacement, etc.). It should be noted that removing the screw 112 may disrupt the interference fit between the screw 112 and the seal 120. Although not shown, additional gaskets or seals may be positioned between adjacent flanges or mating surfaces of the upper housing 102 and the lower housing 104, which may need to be removed.

[0092] In step 506, the gasket 116 is removed from the upper housing 102. The gasket 116 may be removed from the first cutout 328.

[0093] At step 508, the EMI shield 118 is removed from the upper housing 102. The EMI shield may be removed from the first cutout 328.

[0094] In step 510, the seal 120 is removed from the upper housing 102. The seal 120 may be removed from the second cutout 334. It should be noted that the seal 120 may be press fit into the second cutout 334.

[0095] It should be noted that removing the screw 112, spring 114, washer 116, EMI shield 118, and seal 120 removes the spring screw mounting assembly 110 from the electronic device package 101. Steps 504, 506, 508, and 510 may then be repeated as needed to remove any additional spring screw mounting assemblies 110 from the electronic device package 101.

[0096] In step 512, one or more steps of method or process 400 are performed to reassemble electronic device package 101. It should be noted that some components (e.g., EMI shield 118 and / or seal 120) may need to be replaced, while other components (e.g., screws 112, springs 114, washers 116, and / or EMI shield 118) may be reused during reassembly.

[0097] It should be noted that without departing from the scope of the present disclosure, the method or process 500 may include one or more steps involving decoupling the upper housing 102 and / or the stiffener 126 (e.g., depending on the components on the electronic device package 101) from the lower housing 104. For example, the lower housing 104 may be decoupled from the upper housing 102 at any point in time before, between, or after step 504, step 506, step 508, and step 510. For example, the lower housing 104 may be decoupled from the upper housing 102 before step 504 is completed.

[0098] Although the drawings show a set of exemplary coordinate axes, it should be noted that these axes may be oriented differently without departing from the scope of the present disclosure. For example, these axes may reflect the situation that the electronic device package 101 is oriented in a vertical, substantially vertical, angled, substantially horizontal, or horizontal manner when installed and used in a specific environment (e.g., such as in a vehicle). In general, the axes provided in the figures are included only to illustrate selected aspects of the stacking properties of the spring screw mounting assembly 110 and are not intended to be limited in other ways.

[0099] Exemplary systems and methods of the present disclosure have been described with respect to electronic packaging and EMI shielding, sealing of fluids or particles, and thermal control of sealed electronic devices (such as processing units). However, in order to avoid unnecessarily obscuring the present disclosure, the foregoing description omits many known structures and devices. This omission should not be construed as a limitation on the scope of the disclosure claimed. Many specific details are set forth to provide an understanding of the present disclosure. However, it should be understood that the present disclosure can be practiced in various ways beyond the specific details set forth herein.

[0100] Many variations and modifications of the disclosure may be used. Some features of the disclosure may be provided without providing other features. In some embodiments, the disclosure provides an electrical interconnect that may be used between any power source and destination.

[0101] References in the specification to "one embodiment," "an embodiment," "an example embodiment," "some embodiments," etc. indicate that the described embodiments may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. Further, when a particular feature, structure, or characteristic is described in conjunction with one embodiment, it is indicated that the description of such feature, structure, or characteristic may apply to any other embodiment unless so stated and / or unless it is obvious to a person skilled in the art from the specification.

[0102] Although the present disclosure describes the components and functions implemented in the embodiments with reference to specific standards and protocols, the present disclosure is not limited to such standards and protocols. Other similar standards and protocols not mentioned herein exist and are considered to be included in the present disclosure. In addition, the standards and protocols mentioned herein and other similar standards and protocols not mentioned herein are regularly replaced by faster or more effective equivalents with substantially the same functions. Such alternative standards and protocols with the same functions are considered to be equivalents included in the present disclosure.

[0103] The present disclosure includes, in various embodiments, configurations, and aspects, components, methods, processes, systems, and / or devices substantially as depicted and described herein, including various embodiments, subcombinations, and subsets thereof. Those skilled in the art will understand how to make and use the systems and methods disclosed herein after understanding the present disclosure. The present disclosure includes, in various different embodiments, configurations, and aspects, in the absence of matters not depicted and / or described herein, or in its different embodiments, configurations, or aspects, in the absence of such matters that may have been used in previous devices or processes, providing devices and processes, for example, for improving performance, achieving convenience, and / or reducing implementation costs.

[0104] The foregoing discussion of the disclosure has been presented for the purpose of illustration and description. The foregoing is not intended to limit the disclosure to one or more forms disclosed herein. In the above-mentioned specific embodiments, for the purpose of streamlining the disclosure, various features of the disclosure are combined in one or more embodiments, configurations or aspects. The features of the embodiments, configurations or aspects of the disclosure may be combined in alternative embodiments, configurations or aspects other than those discussed above. This approach to the disclosure should not be interpreted as reflecting the following intention: the disclosure claimed for protection requires more features than those explicitly stated in the claims. Rather, as reflected in the appended claims, the creative aspects rely on less than all the features of a single aforementioned disclosed embodiment, configuration or aspect. Therefore, the appended claims are hereby combined in the present specific embodiments, wherein each claim relies on itself as an independent preferred embodiment of the disclosure.

[0105] Moreover, although the description of the present disclosure has included descriptions of one or more embodiments, configurations, or aspects and certain variations and modifications, other variations, combinations, and modifications are also within the scope of the present disclosure, for example, as may be within the skill and knowledge of a person skilled in the art after understanding the present disclosure. It is intended to obtain rights to include alternative embodiments, configurations, or aspects to the extent permitted, including alternative, interchangeable, and / or equivalent structures, functions, ranges, or steps to those claimed, regardless of whether such alternative, interchangeable, and / or equivalent structures, functions, ranges, or steps are disclosed herein, and it is not intended to publicly dedicate any patentable subject matter.

[0106] The phrases "at least one", "one or more", and "and / or" are open-ended expressions that are both conjunctive and disjunctive in operation. For example, each of the expressions "at least one of A, B, and C", "at least one of A, B, or C", "one or more of A, B, and C", "one or more of A, B, or C", and "A, B, and / or C" means A alone, B alone, C alone, A and B together, A and C together, B and C together, or A, B, and C together. When each of A, B, and C in the above expressions refers to an element (such as X, Y, and Z) or a class of elements (such as X1-X n 、Y1-Y m and Z1-Z o ), the phrase is intended to mean a single element selected from X, Y, and Z, a combination of elements selected from the same class (e.g., X1 and X2), and a combination of elements selected from two or more classes (e.g., Y1 and Z o ).

[0107] The term "a" or "an" entity refers to one or more of that entity. Thus, the terms "a" (or "an"), "one or more" and "at least one" are used interchangeably herein. It should also be noted that the terms "includes," "comprising," and "having" are used interchangeably.

[0108] As used herein, the terms "determine," "calculate," "infer," and variations thereof are used interchangeably and include any type of methodology, process, mathematical operation, or technique.

Claims

1. A spring screw mounting assembly for electromagnetic interference shielding and sealing an electronic device package, the spring screw mounting assembly comprising: a screw comprising a head and a shaft, wherein the shaft is operable to be inserted into a hole of a housing of the electronic device enclosure; an electromagnetic interference (EMI) shielding element positioned between the head of the screw and the housing, wherein the EMI shielding element is operable to prevent electromagnetic interference from passing through the aperture of the housing to a processing unit housed within the housing; a seal positioned between the head of the screw and the housing, wherein the seal is operable to prevent at least one of fluid or particulates from passing through the aperture of the housing to the processing unit housed within the housing; and a washer positioned between the head of the screw and the housing, Wherein, when the shaft of the screw is inserted into the hole of the housing, the shaft of the screw is at least partially surrounded by the washer, the EMI shielding element and the seal.

2. The spring screw mounting assembly of claim 1, further comprising: A spring operable to provide a force against the housing, wherein the shaft of the screw is operable to be inserted through the spring and into the hole of the housing, wherein the spring is positioned between the head of the screw and the washer, and wherein the washer is operable to transfer the force applied by the spring against at least a portion of the housing.

3. The spring screw mounting assembly of claim 1, wherein: The EMI shielding element is positioned between the gasket and the housing, and wherein the seal is positioned between the EMI shielding element and the housing.

4. The spring screw mounting assembly of claim 1, wherein: The gasket and the EMI shielding element are operable to fit within a first cutout in a surface in the housing, the first cutout having a first diameter and a first depth, and Wherein, the seal is operable to fit within a second cutout in the surface of the housing, the second cutout having a second diameter less than the first diameter and a second depth less than the first depth.

5. The spring screw mounting assembly of claim 1, wherein: The seal is press-fit into the housing and is operable to engage the shaft of the screw with an interference fit to prevent at least one of fluid or particulates from passing through the aperture of the housing to the processing unit housed within the housing.

6. The spring screw mounting assembly of claim 1, wherein: The gasket, the EMI shielding element, and the seal include coaxially aligned apertures through which the shaft of the screw passes when the shaft is inserted into the hole of the housing.

7. The spring screw mounting assembly of claim 1, wherein: The shaft of the screw comprises at least a first shaft section and a second shaft section.

8. The spring screw mounting assembly of claim 8, wherein: The first shaft section comprises a first shaft diameter corresponding to a first bore diameter of the bore, and Therein, the second shaft section comprises a second shaft diameter, which is smaller than the first shaft diameter and corresponds to a second hole diameter of a second hole, wherein the second hole diameter is smaller than the first hole diameter.

9. An electronic device package, comprising: shell; a processing unit housed within the housing; as well as A spring screw mounting assembly for electromagnetic interference shielding and sealing, the spring screw mounting assembly comprising: a screw comprising a head and a shaft, wherein the shaft is operable to be inserted into the hole of the housing; an electromagnetic interference (EMI) shielding element positioned between the head of the screw and the housing, wherein the EMI shielding element is operable to prevent electromagnetic interference from passing through the hole of the housing to reach the processing unit; a seal positioned between the head of the screw and the housing, wherein the seal is operable to prevent at least one of fluid or particulates from passing through the aperture of the housing to the processing unit; and a washer positioned between the head of the screw and the housing, Wherein, when the shaft of the screw is inserted into the hole of the housing, the shaft of the screw is at least partially surrounded by the washer, the EMI shielding element and the seal.

10. The electronic device package according to claim 9, wherein: The housing also includes: a housing; and a reinforcement member operable to evenly distribute force to the processing unit, the reinforcement member comprising threads corresponding to the threads on the shaft, wherein the shaft is operable to be inserted into the hole of the housing, into a printed circuit board (PCB), and wherein the threads on the shaft are operable to engage with the threads on the reinforcement after the shaft is inserted into the hole of the housing and into the PCB.

11. The electronic device package of claim 10, further comprising: A spring operable to provide a force against the housing, wherein the shaft of the screw is operable to be inserted through the spring and into the hole in the housing, wherein the spring is positioned between the head of the screw and the washer, and wherein the washer is operable to transfer the force applied by the spring against at least a portion of the housing.

12. The electronic device package according to claim 10, wherein: The EMI shielding element is positioned between the gasket and the housing, and wherein the seal is positioned between the EMI shielding element and the housing.

13. The electronic device package according to claim 10, wherein: The gasket and the EMI shielding element are operable to fit within a first cutout in a surface of the housing, the first cutout having a first diameter and a first depth, and Wherein, the seal is operable to fit within a second cutout in the surface of the housing, the second cutout having a second diameter less than the first diameter and a second depth less than the first depth.

14. The electronic device package according to claim 10, wherein: The seal is press-fit into the housing and is operable to engage the shaft of the screw with an interference fit to prevent at least one of fluid or particulates from passing through the aperture of the housing to reach the processing unit.

15. The electronic device package according to claim 10, wherein: The gasket, the EMI shielding element, and the seal include coaxially aligned apertures through which the shaft of the screw passes when the shaft is inserted into the hole of the housing.

16. The electronic device package of claim 10, wherein: The shaft of the screw comprises at least a first shaft section and a second shaft section.

17. The electronic device package of claim 10, wherein: The first shaft section includes a first shaft diameter corresponding to a first section of the bore having a first bore diameter, and Therein, the second shaft section comprises a second shaft diameter that is smaller than the first shaft diameter, and the second shaft diameter corresponds to a second section of the bore having a second bore diameter that is smaller than the first bore diameter.

18. A method for constructing an electronic device package including a spring screw mounting assembly, the method comprising: positioning a seal on a housing of the electronic device package; positioning an electromagnetic interference (EMI) shielding element on the housing; positioning a gasket on the housing; and Inserting a screw including a head and a shaft into the hole of the housing, wherein the washer is positioned between the head of the screw and the housing, wherein the EMI shielding element is positioned between the head of the screw and the housing, wherein the EMI shielding element is operable to prevent electromagnetic interference from passing through the hole of the housing to a processing unit housed within the housing, wherein the seal is positioned between the head of the screw and the housing, wherein the seal is operable to prevent at least one of fluid or particles from passing through the hole of the housing to the processing unit contained within the housing, wherein, when the shaft of the screw is inserted into the hole of the housing, the shaft of the screw is at least partially surrounded by the washer, the EMI shielding element and the seal, and Wherein, the gasket, the seal, the EMI shielding element and the screw form the spring screw mounting assembly.

19. The method of claim 18, further comprising: positioning a spring operable to provide a force against the housing, wherein the shaft of the screw is operable to be inserted through the spring and into the hole of the housing, wherein the spring is positioned between the head of the screw and the washer, wherein the washer is operable to transfer the force applied by the spring against at least a portion of the housing, and Wherein, the gasket, the seal, the EMI shielding element, the spring and the screw form the spring screw mounting assembly.

20. The method of claim 18, wherein: The gasket and the EMI shielding element are operable to fit within a first cutout in a surface in the housing, the first cutout having a first diameter and a first depth, and Wherein, the seal is operable to fit within a second cutout in the surface of the housing, the second cutout having a second diameter less than the first diameter and a second depth less than the first depth.

Images