Circuit board module and electronic device including same

Abstract

An electronic device according to one embodiment of the present disclosure may include: a housing; a circuit board disposed in the housing; a first part and a second part disposed on one surface of the circuit board; a shielding mold disposed on one side of the circuit board to cover a top surface and a side surface of the first component; and an open structure disposed on the one surface of the circuit board and surrounding a side surface of the second component. In the open structure, the top may be open to expose a portion of the circuit board or the second component, the inner surface may be spaced apart from the second component, and the outer surface may be in contact with the shielding mold.

Description

Technical Field

[0001] The present disclosure relates to a circuit board module and an electronic device including the circuit board module. Background Art

[0002] Due to the remarkable development of information and communication technology and semiconductor technology, various electronic devices have been increasingly proliferating and used. In particular, electronic devices for communicating while being carried are being developed.

[0003] An electronic device may refer to a device that performs a specific function according to a loaded program, such as a household appliance, an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet personal computer (PC), a video / audio device, a desktop / laptop computer, or a car navigation device. For example, these electronic devices can output stored information as sound or images. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become common, a single electronic device such as a mobile communication terminal can be equipped with various functions. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions (such as mobile banking, schedule management), and electronic wallet functions are integrated into one electronic device. Such electronic devices are miniaturized so that users can carry them conveniently. Summary of the invention

[0004] An electronic device according to an embodiment of the present disclosure includes a housing, a circuit board disposed in the housing, a first component and a second component disposed on one surface of the circuit board, a shielding mold disposed on one surface of the circuit board to cover the top surface and side surface of the first component, and an open structure disposed on the one surface of the circuit board to surround the side surface of the second component. In the open structure, the top is open and exposes a portion of the second component or the circuit board, the inner surface is spaced apart from the second component, and the outer surface is disposed to contact the shielding mold.

[0005] According to an embodiment of the present disclosure, a method for manufacturing a circuit board module includes: a process of preparing a circuit board, a metal mask and a solder paste and soldering the solder paste on a portion of the circuit board; a mounting and reflow process of setting a plurality of components and an open structure on the circuit board; a full molding process of setting a mold frame on the circuit board and injecting molding into the mold frame; and a process of removing the mold frame.

[0006] However, the problems to be solved in the present disclosure are not limited to the above-mentioned problems and can be expanded in various ways without departing from the spirit and scope of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a block diagram illustrating electronic devices in a network environment according to an embodiment of the present disclosure.

[0008] Figure 2 is a perspective view showing a wearable electronic device according to an embodiment of the present disclosure.

[0009] Figure 3 is a perspective view showing an internal configuration of an electronic device according to an embodiment of the present disclosure.

[0010] Figure 4 is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0011] Figure 5 is a cross-sectional view showing a circuit board module according to an embodiment of the present disclosure.

[0012] Figure 6 is a top view showing an area of ​​a circuit board module according to an embodiment of the present disclosure.

[0013] Figure 7 is a perspective view illustrating an open structure in a circuit board module according to an embodiment of the present disclosure.

[0014] Figure 8 is a flow chart illustrating a process of manufacturing a circuit board module including an open structure according to an embodiment of the present disclosure.

[0015] Fig. 9 is a diagram illustrating a process of a circuit board module including an open structure according to an embodiment of the present disclosure.

[0016] Fig.10 is a cross-sectional view illustrating a circuit board module including an open structure according to an embodiment of the present disclosure.

[0017] Fig.11 is a cross-sectional view illustrating a circuit board module including an open structure according to an embodiment of the present disclosure.

[0018] Fig.12 is a cross-sectional view illustrating a circuit board module including an open structure according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0019] The electronic device according to an embodiment of the present disclosure may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0020] It should be understood that the embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with another element (e.g., the second element)”, “coupled to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0021] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0022] According to an embodiment, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately arranged in different components. According to an embodiment, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to an embodiment, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components performing one or more functions before integration. According to various embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in a different order, or one or more other operations may be added.

[0023] Figure 1 is a block diagram illustrating electronic devices in a network environment according to an embodiment of the present disclosure.

[0024] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In an embodiment, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0025] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0026] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0027] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0028] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0029] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0030] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0031] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0032] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0033] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0034] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0035] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0037] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0038] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0039] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0041] The wireless communication module 192 may support 5G networks after 4G networks and next generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low latency communications (URLLC). The wireless communication module 192 may support high frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 may support various technologies for ensuring performance on high frequency bands, such as, for example, beamforming, massive multiple input multiple output (massive MIMO), full dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0042] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiation element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as a part of the antenna module 197.

[0043] According to an embodiment, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specific high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specific high frequency band.

[0044] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0045] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0046] Figure 2 is a perspective view showing a wearable electronic device according to an embodiment.

[0047] refer to Figure 2 , an embodiment of the electronic device 101 may be a wearable electronic device in the form of glasses, and when wearing the electronic device 101, the user may visually recognize objects or environments around the user. For example, the electronic device 101 may be a head mounted display (HMD) or smart glasses that can provide an image directly in front of the user's eyes. Figure 2 The configuration of the electronic device 101 shown can be Figure 1 The configurations of the electronic devices 101 shown are completely or partially the same.

[0048] According to an embodiment, the electronic device 101 may include a housing 210 forming the exterior of the electronic device 101. The housing 210 may provide a space in which components of the electronic device 101 may be arranged. For example, the housing 210 may include a lens frame 202 and at least one wearing member 203.

[0049] According to an embodiment, the electronic device 101 may include at least one display member 201 capable of providing visual information to a user. For example, the display member 201 may include a module equipped with a lens, a display, a waveguide and / or a touch circuit. According to an embodiment, the display member 201 may be formed to be transparent or translucent. According to an embodiment, the display member 201 may include a translucent glass or a window member having a light transmittance that can be adjusted by adjusting the color concentration. According to an embodiment, when the electronic device 101 is worn on the user's body, a pair of display members 201 may be provided and arranged to correspond to the user's left eye and right eye, respectively.

[0050] According to an embodiment, the lens frame 202 may accommodate at least a portion of the display member 201. For example, the lens frame 202 may surround at least a portion of the edge of the display member 201. According to an embodiment, the lens frame 202 may position at least one display member 201 to correspond to the user's eyes. According to an embodiment, the lens frame 202 may be in the form of a rim of a general eyeglass structure. According to an embodiment, the lens frame 202 may have at least one closed curved shape surrounding the display member 201.

[0051] According to an embodiment, the wear member 203 may extend from the lens frame 202. For example, the wear member 203 may extend from an end of the lens frame 202 and be supported or positioned on the user's body (e.g., ear) together with the lens frame 202. According to an embodiment, the wear member 203 may be rotatably coupled to the lens frame 202 by a hinge structure 229. According to an embodiment, the wear member 203 may include an inner surface 231c configured to face the user's body and an outer surface 231d opposite to the inner surface 231c.

[0052] According to an embodiment, the electronic device 101 may include a hinge structure 229 configured to fold the wearing member 203 relative to the lens frame 202. The hinge structure 229 may be provided between the lens frame 202 and the wearing member 203. In a state where the electronic device 101 is removed, the user may carry or store the electronic device 101 by folding the wearing member 203 to partially overlap with the lens frame 202.

[0053] Figure 3 is a perspective view showing an internal configuration of an electronic device according to an embodiment of the present disclosure.

[0054] Figure 4 is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0055] refer to Figure 3 and Figure 4 , an embodiment of the electronic device 101 may include components (e.g., at least one circuit board 241 (e.g., a printed circuit board (PCB), a printed board assembly (PBA), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)) housed in a housing 210, at least one battery 243, at least one speaker module 245, at least one power transmission structure 246, and a camera module 250). Figure 3 and Figure 4 The configuration of the housing 210 shown in Figure 2 The configurations of the display member 201, the lens frame 202, the wearing member 203, and the hinge structure 229 shown in FIG. 2 are completely or partially the same. Figure 3 and Figure 4 The structure can be optionally combined with Figure 2 structural combination.

[0056] According to an embodiment, the electronic device 101 may use a camera module 250 (eg, Figure 1 The camera module 180) obtains and / or recognizes a visual image of an object or environment in a direction (eg, -Y direction) viewed by the user or facing the electronic device 101, and transmits the image to the user through a network (eg, Figure 1 The electronic device 101 may receive information about an object or environment from an external electronic device (the first network 198 or the second network 199). In an embodiment, the electronic device 101 may provide the received information about the object or environment to the user in the form of sound or vision. The electronic device 101 may use a display module (e.g., Figure 1 The display module 160 of the electronic device 101 provides the received information about the object or environment to the user in a visual form through the display member 201. For example, the electronic device 101 can realize augmented reality (AR) by visually realizing the information about the object or environment and combining the information with a real image of the user's surrounding environment.

[0057] According to an embodiment, the display member 201 may include a first surface F1 facing a direction in which external light is incident (e.g., a -Y direction) and a second surface F2 facing a direction opposite to the first surface F1 (e.g., a +Y direction). In a state where a user wears the electronic device 101, at least a portion of the light or image incident through the first surface F1 may be introduced to the left eye and / or right eye of the user through the second surface F2 of the display member 201 disposed to face the left eye and / or right eye of the user.

[0058] According to an embodiment, the lens frame 202 may include at least two frames. For example, the lens frame 202 may include a first frame 202a and a second frame 202b. According to an embodiment, when a user wears the electronic device 101, the first frame 202a may be a portion facing the user's face, and the second frame 202b may be a portion of the lens frame 202 spaced apart from the first frame 202a in the user's gaze direction (e.g., -Y direction).

[0059] According to an embodiment, the light output module 211 may provide an image and / or video to a user. For example, the light output module 211 may include a display panel (not shown) capable of outputting an image and a lens (not shown) corresponding to the user's eyes and guiding the image to the display member 201. For example, the user may obtain an image output from the display panel of the light output module 211 through the lens of the light output module 211. According to an embodiment, the light output module 211 may include a device configured to display various information. For example, the light output module 211 may include at least one of a liquid crystal display (LCD), a digital mirror device (DMD), a liquid crystal on silicon (LCoS), an organic light emitting diode (OLED), or a micro light emitting diode (micro LED). According to an embodiment, when the light output module 211 and / or the display member 201 include one of an LCD, a DMD, and an LCoS, the electronic device 101 may include a light source that radiates light to the display area of ​​the output module 211 and / or the display member 201. According to another embodiment, when the light output module 211 and / or the display member 201 includes one of an OLED and a micro LED, the electronic device 101 may provide a virtual image to the user without including a separate light source.

[0060] According to an embodiment, at least a portion of the light output module 211 may be disposed in the housing 210. For example, the light output module 211 may be disposed in the wear member 203 or the lens frame 202 to correspond to the right eye and the left eye of the user, respectively. According to an embodiment, the light output module 211 may be connected to the display member 201 and provide an image to the user through the display member 201. For example, the image output from the light output module 211 may be incident on the display member 201 through an input optical member located at one end of the display member 201, and radiated toward the user's eyes through a waveguide and an output optical member located in at least a portion of the display member 201. According to an embodiment, the waveguide may be made of glass, plastic, or polymer, and include a nano pattern formed on one surface inside or outside the waveguide, such as a polygonal or curved grating structure. According to an embodiment, the waveguide may include at least one of at least one diffraction element (e.g., a diffraction optical element (DOE) or a holographic optical element (HOE)) or a reflective element (e.g., a reflector).

[0061] According to an embodiment, the circuit board 241 may include components driving the electronic device 101. For example, the circuit board 241 may include at least one integrated circuit (IC) chip, and Figure 1 At least one of the processor 120, the memory 130, the power management module 188, or the communication module 190 shown may be provided on an IC chip. According to an embodiment, the circuit board 241 may be provided inside the wear member 203 of the housing 210. According to an embodiment, the circuit board 241 may be electrically connected to the battery 243 through the power transmission structure 246. According to an embodiment, the circuit board 241 may be connected to a flexible printed circuit board (FPCB) 205, and transmit electrical signals to electronic components (e.g., the light output module 211, the camera module 250, and the light emitter of the electronic device) through the FPCB 205. According to an embodiment, the circuit board 241 may be an interposer.

[0062] According to various embodiments, the FPCB 205 may extend from the circuit board 241 across the hinge structure 229 into the lens frame 202 , and may be disposed on at least a portion of a periphery of the display member 201 within the lens frame 202 .

[0063] According to an embodiment, the battery 243 (e.g., Figure 1 The battery 189 ) may be electrically connected to components of the electronic device 101 (eg, the light output module 211 , the circuit board 241 , the speaker module 245 , the microphone module 247 , and / or the camera module 250 ) and provide power to the components of the electronic device 101 .

[0064] According to an embodiment, at least a portion of the battery 243 may be disposed in the wear member 203. According to an embodiment, the battery 243 may be disposed adjacent to the ends 203a and 203b of the wear member 203. For example, the battery 243 may include a first battery 243a disposed at a first end 203a of at least one wear member 203 and a second battery 243b disposed at a second end 203b of at least one wear member 203.

[0065] According to various embodiments, the speaker module 245 (eg, Figure 1 The audio module 170 or the sound output module 155 of the housing 210 may convert the electrical signal into sound. At least a portion of the speaker module 245 may be disposed inside the wear member 203 of the housing 210. According to an embodiment, the speaker module 245 may be located inside the wear member 203 to correspond to the ear of the user. According to an embodiment (for example, Figure 3 ), the speaker module 245 can be disposed on the circuit board 241. For example, the speaker module 245 can be disposed between the circuit board 241 and the inner shell (eg, Figure 4According to an embodiment, the speaker module 245 may be disposed close to the circuit board 241. For example, the speaker module 245 may be disposed between the circuit board 241 and the battery 243.

[0066] According to an embodiment, the electronic device 101 may include a connecting member 248 connected to the speaker module 245 and the circuit board 241. The connecting member 248 may transmit at least a portion of the sound and / or vibration generated from the speaker module 245 to the circuit board 241. According to an embodiment, the connecting member 248 may be formed integrally with the speaker module 245. For example, a portion extending from a speaker frame of the speaker module 245 may be interpreted or defined as the connecting member 248. According to an embodiment, the connecting member 248 may be omitted. For example, in an embodiment in which the speaker module 245 is disposed on the circuit board 241, the connecting member 248 may be omitted.

[0067] According to an embodiment, the power transmission structure 246 may transmit power from the battery 243 to the electronic components (e.g., the light output module 211) of the electronic device 101. For example, the power transmission structure 246 may be electrically connected to the battery 243 and / or the circuit board 241, and the circuit board 241 may transmit the power received through the power transmission structure 246 to the light output module 211.

[0068] According to an embodiment, the power transmission structure 246 may be configured to transmit power. For example, the power transmission structure 246 may include an FPCB or an electric wire. For example, the electric wire may include a plurality of cables (not shown). In various embodiments, the shape of the power transmission structure 246 may be modified in various ways in consideration of the number and / or type of cables.

[0069] According to an embodiment, the microphone module 247 (eg, Figure 1 The input module 150 and / or the audio module 170 of the electronic device 101 can convert the sound into an electrical signal. According to an embodiment, the microphone module 247 can be provided on at least a portion of the lens frame 202. For example, at least one microphone module 247 can be provided at the lower end (e.g., in the direction toward the -X axis) and / or the upper end (e.g., in the direction toward the X axis) of the electronic device 101. According to an embodiment, using the voice information (e.g., sound) obtained from at least one microphone module 247, the electronic device 101 can more clearly recognize the user's voice. For example, the electronic device 101 can distinguish the voice information from the ambient noise based on the obtained voice information and / or additional information (e.g., low-frequency vibrations of the user's skin and bones). For example, the electronic device 101 can perform a function of clearly recognizing the user's voice and reducing the ambient noise (e.g., noise cancellation).

[0070] According to an embodiment, the camera module 250 may capture still images and / or videos. The camera module 250 may include at least one of a lens, at least one image sensor, an image signal processor, or a flash. According to an embodiment, the camera module 250 may be disposed inside the lens frame 202 and disposed around the display member 201.

[0071] According to an embodiment, the camera module 250 may include at least one first camera module 251. According to an embodiment, the first camera module 251 may capture the user's eyes (e.g., pupils) or the trajectory of gaze. For example, the first camera module 251 may capture a reflection pattern of light emitted from a light emitter to the user's eyes. For example, the light emitter may emit light in an infrared (IR) band for tracking the trajectory of gaze using the first camera module 251. For example, the light emitter may include an IR LED. According to an embodiment, the processor (e.g., Figure 1 The processor 120 of the display member 201 may adjust the position of the virtual image so that the virtual image projected on the display member 201 corresponds to the gaze direction of the user's pupil. According to an embodiment, the first camera module 251 may include a global shutter (GS) type camera, and a plurality of first camera modules 251 of the same standard and / or performance may be used to track the trajectory of the user's eyes or gaze.

[0072] According to various embodiments, the first camera module 251 may periodically or aperiodically transmit information related to the trajectory of the user's eyes or gaze (eg, trajectory information) to the processor (eg, Figure 1 According to another embodiment, when the first camera module 251 detects that the user's gaze has changed based on the trajectory information (eg, when the eyes move beyond a reference value while the head is still), the first camera module 251 may transmit the trajectory information to the processor.

[0073] According to an embodiment, the camera module 250 may include a second camera module 253. According to an embodiment, the second camera module 253 may capture an external image. According to an embodiment, the second camera module 253 may be a GS type camera or a rolling shutter (RS) type camera. According to an embodiment, the second camera module 253 may capture an external image through a second optical hole 223 defined or formed in the second frame 202b. For example, the second camera module 253 may include a high-resolution color camera, and may be a high-resolution (HR) or photo video (PV) camera. In addition, the second camera module 253 may provide an auto focus (AF) function and an optical image stabilizer (OIS) function.

[0074] According to an embodiment, although not shown, the electronic device 101 may include a flash (not shown) located near the second camera module 253. For example, when the second camera module 253 acquires an external image, the flash (not shown) may provide light to increase the ambient brightness (e.g., illumination) of the electronic device 101 and reduce the difficulty of acquiring an image caused by a dark environment, a mixture of various light sources, and / or light reflection.

[0075] According to an embodiment, the camera module 250 may include at least one third camera module 255. According to an embodiment, the third camera module 255 may shoot a user action through the first optical hole 221 defined or formed in the lens frame 202. For example, the third camera module 255 may shoot a user posture (e.g., a hand gesture). The third camera module 255 and / or the first optical hole 221 may be defined or formed at opposite side ends of the lens frame 202 (e.g., the second frame 202b), for example, in the X direction, respectively. According to an embodiment, the third camera module 255 may be a GS-type camera. For example, the third camera module 255 may provide 360-degree spatial (e.g., omnidirectional) recognition, position recognition, and / or movement recognition using a camera supporting 3 degrees of freedom (3DoF) or 6 degrees of freedom (6DOF). According to an embodiment, the third camera module 255 may perform a simultaneous localization and mapping (SLAM) function and a user movement recognition function using a plurality of GS-type cameras having the same standard and performance as a stereo camera. According to an embodiment, the third camera module 255 may include an IR camera (eg, a time-of-flight (TOF) camera or a structured light camera). For example, the IR camera may be used as a sensor module (eg, Figure 1 to operate with at least a portion of the sensor module 176).

[0076] According to an embodiment, at least one of the first camera module 251 or the third camera module 255 may be a sensor module (eg, Figure 1 The sensor module 176 may be replaced by a sensor module 176). For example, the sensor module may include at least one of a vertical cavity surface emitting laser (VCSEL), an IR sensor, and / or a photodiode. For example, the photodiode may include a positive intrinsic negative (PIN) photodiode or an avalanche photodiode (APD). The photodiode may also be referred to as a photodetector or a photo sensor.

[0077] According to an embodiment, at least one of the first camera module 251, the second camera module 253, or the third camera module 255 may include a plurality of camera modules (not shown). For example, the second camera module 253 may include a plurality of lenses (e.g., wide-angle and telephoto lenses) and an image sensor, and may be disposed on one surface of the electronic device 101 (e.g., a surface facing the -Y axis). For example, the electronic device 101 may include a plurality of camera modules having different properties (e.g., angle of view (AOV)) or functions from each other, and may be controlled to change the AOV of the camera module based on user selection and / or trajectory information. For example, at least one of the plurality of camera modules may be a wide-angle camera, and at least another one may be a telephoto camera.

[0078] According to various embodiments, a processor (e.g., Figure 1 The processor 120 may use the sensor module (e.g., Figure 1 The processor may determine the movement of the electronic device 101 and / or the user movement based on information about the electronic device 101 obtained by at least one of a gesture sensor, a gyro sensor, or an acceleration sensor of the sensor module 176 of the present invention and a user action (e.g., the user's body approaches the electronic device 101) detected by the third camera module 255. According to an embodiment, the electronic device 101 may include a magnetic (geomagnetic) sensor capable of measuring an orientation using a magnetic field and magnetic lines of force, and / or a Hall sensor capable of obtaining movement information (e.g., a moving direction or a moving distance) using magnetic field strength. For example, the processor may determine the movement of the electronic device 101 and / or the user movement based on information obtained from the magnetic (geomagnetic) sensor and / or the Hall sensor.

[0079] According to various embodiments, although not shown, the electronic device 101 may perform an input function (e.g., a touch and / or pressure sensing function) to achieve interaction with the user. For example, a component configured to perform a touch and / or pressure sensing function (e.g., a touch sensor and / or a pressure sensor) may be provided in at least a portion of the wearable member 203. The electronic device 101 may control a virtual image output through the display member 201 based on information obtained through the component. For example, sensors related to the touch and / or pressure sensing function may be configured as various types, such as a resistive type, a capacitive type, an electromagnetic (EM) type, or an optical type. According to an embodiment, the component configured to perform a touch and / or pressure sensing function may be configured with Figure 1 The components of the input module 150 are completely or partially identical.

[0080] According to an embodiment, the electronic device 101 may include a reinforcement member 260 disposed in an inner space of the lens frame 202 and formed to have higher rigidity than the lens frame 202 .

[0081] According to an embodiment, the electronic device 101 may include a lens structure 270. The lens structure 270 may refract at least a portion of the light passing therethrough. For example, the lens structure 270 may be a prescription lens having a specified refractive power. According to an embodiment, the lens structure 270 may be disposed behind a second window member (not shown) of the display member 201 (e.g., in the +Y direction). For example, the lens structure 270 may be located between the display member 201 and the user's eyes. For example, the lens structure 270 may face one surface of the display member.

[0082] According to an embodiment, the housing 210 may include a hinge cover 227 that may hide a portion of the hinge structure 229. Another portion of the hinge structure 229 may be accommodated or hidden between an inner case 231 and an outer case 233, which will be described later.

[0083] According to various embodiments, the wearing member 203 may include an inner shell 231 and an outer shell 233. The inner shell 231 (for example, a shell configured to face the user's body or directly contact the user's body) may be made of a material having low thermal conductivity (for example, a synthetic resin). According to an embodiment, the inner shell 231 may include an inner surface facing the user's body (for example, Figure 2 The outer shell 233 may include, for example, a material that can at least partially transfer heat (for example, a metal material), and may be coupled to the inner shell 231 to face the inner shell 231. According to an embodiment, the outer shell 233 may include an outer surface (for example, Figure 2 231d). In an embodiment, at least one of the circuit board 241 or the speaker module 245 may be accommodated in a space separated from the battery 243 inside the wear member 203. In the illustrated embodiment, the inner shell 231 may include a first shell 231a and a second shell 231b, the first shell 231a including the circuit board 241 and / or the speaker module 245, and the second shell 231b accommodating the battery 243. The outer shell 233 may include a third shell 233a and a fourth shell 233b, the third shell 233a is coupled to the first shell 231a to face the first shell 231a, and the fourth shell 233b is coupled to the second shell 231b to face the second shell 231b. For example, the first shell 231a and the third shell 233a may be coupled to each other (hereinafter, referred to as "first shell parts 231a and 233a") to accommodate the circuit board 241 and / or the speaker module 245. The second case 231 b and the fourth case 233 b may be coupled to each other (hereinafter, referred to as “second case portions 231 b and 233 b ”) to accommodate the battery 243 .

[0084] According to an embodiment, the first shell parts 231a and 233a may be rotatably coupled to the lens frame 202 by a hinge structure 229, and the second shell parts 231b and 233b may be connected to or mounted on the ends of the first shell parts 231a and 233a by a connecting structure 235. In a certain embodiment, the part of the connecting structure 235 that contacts the user's body may be made of a material with low thermal conductivity, for example, silicon, polyurethane, or an elastic material such as rubber, and the part of the connecting structure 235 that does not contact the user's body may be made of a material with high thermal conductivity (for example, a metal material). For example, when heat is generated from the circuit board 241 or the battery 243, the connecting structure 235 may prevent the heat from being transferred to the part in contact with the user's body, and disperse or release the heat through the part that does not contact the user's body. According to an embodiment, the part of the connecting structure 235 that is configured to contact the user's body may be interpreted or defined as a part of the inner shell 231, and the part of the connecting structure 235 that does not contact the user's body may be interpreted or defined as a part of the outer shell 233. According to an embodiment (not shown), the first shell 231a and the second shell 231b may be integrally configured without the connection structure 235, and the third shell 233a and the fourth shell 233b may be integrally configured without the connection structure 235. According to various embodiments, other components (e.g., Figure 1 antenna module 197), and can use the communication module 190 to communicate over a network (e.g., Figure 1 The first network 198 or the second network 199) from an external electronic device (eg, Figure 1 The electronic device 102 or 104 or the server 108) provides information about the object or environment.

[0085] Although the above reference Figures 2 to 4 An embodiment in which the electronic device 101 is a wearable electronic device in the form of glasses is described by way of example, but is not limited thereto. For example, the electronic device 101 may refer to a device that performs a specific function according to a loaded program, such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet personal computer (PC), a video / audio device, a desktop / laptop computer, and a vehicle navigation system, and the present disclosure is applicable to all electronic devices equipped with a circuit board among these electronic devices.

[0086] Figure 5 is a cross-sectional view showing a circuit board module according to an embodiment of the present disclosure.

[0087] Figure 6 is a top view showing an area of ​​a circuit board module according to an embodiment of the present disclosure.

[0088] Figure 7 is a perspective view illustrating an open structure in a circuit board module according to an embodiment of the present disclosure.

[0089] According to an embodiment, the electronic device 101 may include a housing (eg, Figure 2 The housing 210 of the embodiment of the present invention and the circuit board module 400 disposed inside the housing. The circuit board module 400 may include a circuit board 410, a plurality of components 450 (eg, a first component 451 and a second component 452), a shielding mold 420, and an open structure 430. Here, the open structure 430 may be an opening ( Figure 7 The structure of P). Figure 5 , Figure 6 and Figure 7 The circuit board 410 may be partially or completely connected to Figure 2 and Figure 3 The same as the circuit board 241. Figure 5 , Figure 6 and Figure 7 The structure can be optionally combined with Figure 2 , Figure 3 and Figure 4 structural combination.

[0090] exist Figure 5 , Figure 6 and Figure 7 In the embodiment of the present disclosure, the “Z-axis direction” may represent the thickness direction of the circuit board module 400. In addition, based on the user wearing the electronic device, the “+Z-axis direction” may represent the direction in which the circuit board module 400 faces the user (e.g., the first direction), and the “-Z-axis direction” may represent the direction in which the circuit board module 400 faces the opposite direction to the user (e.g., the second direction). However, the directions are merely exemplary, and the opposite direction to the user may be the +Z-axis direction, and the direction toward the user may be the -Z-axis direction.

[0091] According to an embodiment, the circuit board module 400 may include a plurality of stacked substrates. At least one conductive layer and at least one dielectric layer may be alternately stacked on each substrate. According to an embodiment, in the circuit board module 400, a plurality of electrical components may be disposed on one circuit board 410 having a plurality of stacked substrates.

[0092] According to an embodiment, at least one of the plurality of components 450 may be a first component 451 that is desired to be shielded from the outside. For example, the first component 451 may be a heat source that generates electromagnetic waves or heat, such as at least one of a power management integrated circuit (PMIC), a power amplifier (PAM), an application processor (AP) or a communication processor (CP), a charger integrated circuit (IC), a display driver integrated circuit (DDI), or a communication circuit (e.g., a transceiver, an active communication element, or a passive communication element).

[0093] According to an embodiment, at least another one of the plurality of components 450 may be a second component 452 that is desired to be exposed to the outside. When describing that an electrical component is exposed to the outside, this may mean that the electrical component is not shielded or hidden by a shielding structure, and when viewed from above the circuit board, at least a portion of the component is exposed and connected to an external component, or is set at a position capable of radiating light or electromagnetic waves to the outside. For example, the second component 452 may be at least one of a 6-axis sensor (e.g., a gyro sensor, an acceleration sensor, and a temperature sensor), a global positioning system (GPS), a Con to Con connector, a clip-type connector, a radio frequency (RF) switch, an RF tuning passive component (LC), an identification mark, a test point, a microphone, an embedded user identification module (eSIM), or a stainless steel (SUS) mechanism.

[0094] According to an embodiment, the circuit board 410 may include a first area S1 and a second area S2 extending from the first area S1. The first area S1 may be defined or formed to surround the second area S2. The first component 451 may be disposed in the first area S1 of the circuit board 410, and the second component 452 may be disposed in the second area S2 of the circuit board 410.

[0095] According to an embodiment, a plurality of first pads 411 may be provided in a first region S1 of a circuit board 410 to provide (e.g., install) a first component 451 thereon. The first component 451 in the first region S1 and the plurality of first pads 411 may be electrically connected to each other by welding using a solder paste. The plurality of first pads 411 may include or be formed of a copper foil. According to an embodiment, a plurality of second pads 412 may be provided in a second region S2 of a circuit board 410 to provide a second component 452 thereon. The second component 452 of the second region S2 and the plurality of second pads 412 may be electrically connected to each other by a welding process using a solder paste. The plurality of second pads 412 may include or be formed of a copper foil. Depending on the type of component, the plurality of first pads 411 and the plurality of second pads 412 may be provided in the same shape or in a shape different from each other using the same material or different materials from each other.

[0096] According to an embodiment, the shielding mold 420 may be formed to surround at least a portion of the first component 451. The shielding mold 420 is a structure disposed in the entire first region S1 of the circuit board 410 and may be formed by a full molding process. According to the full molding process, for example, in the case where the first component 451 is disposed in the first region S1 of the circuit board 410, a mold frame formed to surround the entire region of the circuit board 410 may be provided. After the mold frame is provided, the shielding mold 420 that may cover the first region S1 and the electrical component (e.g., the first component 451) disposed in the first region S1 may be formed by injecting the mold into the mold frame. The shielding mold 420 may be formed to completely surround the top surface and the side surface of the first component 451. The shielding mold 420 may cover the top surface and the side surface of the first component 451 in contact with the top surface and the side surface of the first component 451.

[0097] According to an embodiment, since the second component 452 disposed in the second area S2 of the circuit board 410 is surrounded by the open structure 430, the second component 452 may not be shielded by the shielding mold 420. The open structure 430 is a structure whose top and bottom are open, and may be disposed in the second area S2 of the circuit board 410. The open structure 430 may include a top 431 that is at least partially open as indicated by P, and a side wall 433 extending in a direction perpendicular to the top 431 (e.g., a ±Z-axis direction). The side wall 433 may have a height greater than that of the second component 452 (e.g., a height in the ±Z-axis direction), and is disposed to cover all side surfaces of the second component 452. For example, in the case where the second component 452 has a hexahedral shape, the side wall 433 of the open structure 430 may include four walls.

[0098] According to an embodiment, the sidewalls 433 of the open structure 430 may be disposed along an edge of the second region S2 of the circuit board 410. Each sidewall 433 may include an outer surface 433a, an inner surface 433b, and a bottom surface 433c, and the bottom surface 433c may be electrically connected to one of the plurality of second pads 412 in the second region S2 by a soldering process using solder paste.

[0099] According to an embodiment, the open structure 430 may be formed into an integral structure by a mold. The open structure 430 may include stainless steel or aluminum, or may be formed of stainless steel or aluminum.

[0100] According to an embodiment, the outer surface 433a of each side wall 433 of the open structure 430 may contact the shielding mold 420, and the inner surface 433b thereof may be set to be spaced apart from the second part 452. For example, since the inner space of the open structure 430 is a space for isolating the second area S2 from the first area S1, so that the shielding mold 420 may not be introduced, the shielding mold 420 may extend to and contact the outer surface 433a of each side wall 433 of the open structure 430, and may be separated from the inner surface 433b. For example, the separation distance between the inner surface 433b of each side wall 433 and the second part 452 may be approximately 0.15 millimeters (mm) or less. The space between the inner surface 433b of each side wall 433 and the second part 452 may be filled with air. "Approximately" or "approximately" as used herein includes the stated value and means within the acceptable deviation range of the specific value as determined by a person of ordinary skill in the art, taking into account the measurement in question and the error associated with the measurement of the specific quantity (i.e., the limitation of the measurement system). For example, "about" may mean within one or more standard deviations, or within ±30%, 20%, 10%, or 5% of the stated value.

[0101] According to an embodiment, the sidewall 433 of the open structure 430 may be formed to have a specific thickness. For example, the sidewall 433 of the open structure 430 may be designed to correspond to the size of the second pad 412. The length (or area) of one side of the bottom surface 433c of each sidewall 433 of the open structure 430 may be substantially the same as the length (or area) of one side of each second pad 412, and the length may be approximately 0.4 mm or less.

[0102] According to an embodiment, when the second component 452 is exposed, the open structure 430 may be formed to be electrically connected to an external component. Therefore, when the open structure 430 is viewed from above or in a top view, at least a portion of the second component 452 and / or the circuit board 410 (e.g., the second region S2) may be formed to be exposed (e.g., visible) through the opening P of the top 431. In the open structure 430, the side walls 433 may be continuously connected to provide a closed loop shape, and the shielding mold 420 may be limited from being introduced into the second region S2.

[0103] According to an embodiment, before performing the full molding process, the second component 452 and the open structure 430 may be disposed in the second region S2 of the circuit board 410, and a mold frame may be disposed. When the mold is injected into the mold frame, the top 431 of the open structure 430 may be disposed to contact the mold and be sealed, and the bottom surface 433c of each side wall 433 of the open structure 430 may be coupled with the circuit board 410 and sealed by welding to prevent the mold from being introduced toward the second region S2 and the second component 452 disposed in the second region S2. According to an embodiment, when the top 431 of the open structure 430 extends in an outward direction (e.g., in a direction toward the second region S2), the top 431 may be formed to have a larger area or width than the side wall 433 when viewed from above. Therefore, the top 431 of the open structure 430 may increase the sealing strength according to the increased contact area with the mold frame, and effectively prevent the mold from entering the second region S2 of the circuit board 410.

[0104] Figure 8 is a flow chart illustrating a process of manufacturing a circuit board module including an open structure according to an embodiment of the present disclosure.

[0105] Fig. 9 is a diagram illustrating a process of a circuit board module including an open structure according to an embodiment of the present disclosure.

[0106] According to an embodiment, the electronic device 101 may include a housing (eg, Figure 2 The housing 210 of the present invention and the circuit board module 400 disposed in the housing. The circuit board module 400 may include a circuit board 410, a plurality of components 450 (eg, a first component 451 and a second component 452), a shielding mold 420, and an open structure 430.

[0107] Figure 8 and Fig. 9 The circuit board 410, the plurality of components 450 (eg, the first component 451 and the second component 452), the shielding mold 420, and the open structure 430 may be partially or entirely connected to the Figure 5 , Figure 6 and Figure 7 The circuit board 410 , the plurality of components 450 (eg, the first component 451 and the second component 452 ), the shielding mold 420 , and the open structure 430 are the same. Figure 8 and 9 The structure can be optionally combined with Figure 5 , Figure 6 and Figure 7 structural combination.

[0108] Hereinafter, a description will be given of the plurality of components 450 (eg, the first component 451 and the second component 452 ) provided on the circuit board 410 , the shielding mold 420 , and the open structure 430 .

[0109] According to process 10, a circuit board 410, a metal mask 501, and a solder paste pile 502 on which a plurality of pads (e.g., first pads 411 and second pads 412) are disposed may be prepared, and soldering may be performed to dispose a plurality of components 450 on the circuit board 410. The circuit board 410 may include a first region S1 and a second region S2 extending from the first region S1, a plurality of first pads 411 may be disposed in the first region S1, and a plurality of second pads 412 may be disposed in the second region S2. The plurality of first pads 411 and the plurality of second pads 412 may include copper foil or be formed of copper foil.

[0110] A metal mask 501 having a size corresponding to that of the circuit board 410 may be disposed on the circuit board 410 on which a plurality of pads (e.g., first pads 411 and second pads 412) are disposed. A solder paste pile 502 may pass through an opening defined or formed through the metal mask 501, and a certain amount of solder paste may be disposed at a specific position of the circuit board 410. For example, some solder paste may be disposed on the plurality of first pads 411 of the first region S1 of the circuit board 410, and other solder paste may be disposed on the plurality of second pads 412 of the second region S2 of the circuit board 410.

[0111] According to process 20, a mounting and reflow process may be performed to arrange a plurality of components 450 (e.g., first components 451 and second components 452) and an open structure 430 on a circuit board 410. Solder paste disposed on each of a plurality of first pads 411 in a first region S1 of the circuit board 410 may be connected to the first component 451. Solder paste disposed on each of a plurality of second pads 412 in a second region S2 of the circuit board 410 may be connected to the second component 452 and / or the open structure 430. The mounting and reflow process may be performed at a temperature in the range of approximately 230 to 250 degrees Celsius.

[0112] According to an embodiment, the open structure 430 is a structure whose top and bottom are open, and may be provided in the second region S2 of the circuit board 410. The open structure 430 may include a side wall 433 provided to surround the second component 452 and extend in a direction (e.g., ±Z-axis direction) perpendicular to one surface of the circuit board 410. The open structure 430 may be manufactured as an integral structure by molding. The open structure 430 may include stainless steel or aluminum, or be made of stainless steel or aluminum.

[0113] According to the process 30, the mold frame 503 may be disposed on the circuit board 410 on which the plurality of components 450 (e.g., the first component 451 and the second component 452) and the open structure 430 are disposed, and a full molding process of injecting molding into the mold frame 503 may be performed. The mold frame 503 may be disposed to cover the entire area of ​​the circuit board 410, the plurality of components 450 (e.g., the first component 451 and the second component 452) disposed on the circuit board 410, and the open structure 430.

[0114] Due to the full molding process, the first area S1 of the circuit board 410 and the first component 451 disposed in the first area S1 may be completely covered by the shielding mold 420. For example, the shielding mold 420 may completely contact and cover the top surface of the first area S1 of the circuit board 410. For example, the shielding mold 420 may cover the top surface and the side surface of the first component 451 and be in complete contact with the top surface and the side surface of the first component 451.

[0115] When the full molding process is performed, the second component 452 disposed in the second area S2 of the circuit board 410 may be covered by the open structure 430 and may not be covered or shielded by the shielding mold 420. The bottom of the open structure 430 disposed along the edge of the second area S2 of the circuit board 410 may contact the second pad 412 including or made of a continuous copper foil, thereby limiting the introduction of molding. The top of the open structure 430 may be sealed in contact with the bottom surface of the mold frame 503 so that molding may not be introduced into the second area S2 of the circuit board 410.

[0116] According to process 40, when the full molding process is completed and the mold frame is removed, the second component 452 may be located inside the open structure 430 to be exposed, and a portion of the circuit board 410 other than the second region S2 may be covered by the shielding mold 420. According to an embodiment, the open structure 430 may be connected to the ground through the second pad 412 in the second region S2 of the circuit board 410, thereby serving as a shield.

[0117] Fig.10 is a cross-sectional view illustrating a circuit board module including an open structure according to an embodiment of the present disclosure.

[0118] According to an embodiment, the electronic device 101 may include a housing (eg, Figure 2 The housing 210 of the present invention and the circuit board module 400 disposed in the housing. The circuit board module 400 may include a circuit board 410, a second component 452, a shielding mold 420 and an open structure 430.

[0119] Fig.10 The circuit board 410, the second component 452, the shielding mold 420 and the open structure 430 may be partially or completely connected with Figure 5, Figure 6 , Figure 7 , Figure 8 and / or Fig. 9 The circuit board 410, the second component 452, the shielding mold 420 and the open structure 430 are the same. Fig.10 The structure can be optionally combined with Figure 5 , Figure 6 , Figure 7 , Figure 8 and / or Fig. 9 structural combination.

[0120] Fig.10 is a diagram showing a state in which the open structure 430 and the mold frame 503 are set to contact each other, which may be Figure 8 and Fig. 9 The completed circuit board module 400 may be in a state where the mold frame 503 has been removed.

[0121] According to an embodiment, the circuit board 410 may include a first area S1 and a second area S2 extending from the first area S1. The first area S1 may be formed to surround the second area S2. A first component (not shown) may be disposed in the first area S1 of the circuit board 410, and a second component 452 may be disposed in the second area S2 of the first circuit board 410.

[0122] According to an embodiment, since the second component 452 disposed in the second area S2 of the circuit board 410 is covered by the open structure 430, the second component 452 may not be shielded by the shielding mold 420. The second component 452 and the open structure 430 may be disposed to be connected to the plurality of second pads 412 disposed in the second area S2 of the circuit board 410.

[0123] According to an embodiment, the open structure 430 is a structure whose top and bottom are open, and may be disposed in the second region S2 of the circuit board 410. The open structure 430 may include stainless steel or aluminum or be formed of stainless steel or aluminum as an integral structure.

[0124] According to an embodiment, the open structure 430 may include a top 431, a bottom 435, and a side wall 433 extending in a direction perpendicular to the top 431 (or the bottom 435) (e.g., the ±Z axis direction). The cross-section of the open structure 430 may have a stepped or curved shape. For example, the top 431 and the side wall 433 may be in a "ㄱ" shape, and the side wall 433 and the bottom 435 may be in a "ㄴ" shape. Since the top 431 of the open structure 430 protrudes more outward than the side wall 433 (e.g., in a direction toward the shielding mold 420), the area of ​​the contact mold frame 503 may be increased. Since the top 431 of the open structure 430 is formed to directly contact the mold frame 503, the height error between the open structure 430 and the mold frame 503 can be offset, and the sealing strength can be increased. Since the bottom 435 of the open structure 430 protrudes inward more than the side wall 433 (for example, in the direction opposite to the shielding mold 420), the area of ​​one of the second pads 412 of the circuit board 410 having a closed loop shape that contacts and connects to the pad 412a can be increased, and the sealing strength can be increased. Therefore, the shape of the protruding top 431 and bottom 435 of the open structure 430 can improve the barrier performance of preventing the mold from being introduced into the second area S2 in the molding injection process.

[0125] According to an embodiment, the side wall 433 of the open structure 430 may be designed to have a thickness in the range of approximately 0.1 mm to 0.15 mm or less, and the top 431 and the bottom 435 of the open structure 430 may be designed to have a thickness of approximately 0.4 mm or less. Among the second pads 412 of the circuit board 410, one pad 412a having a closed loop shape corresponding to the bottom 435 of the open structure 430 may be designed to have a width of 0.4 mm or less. Compared to a typical internal shielding structure (e.g., a shielding case) of a portable electronic device, since the top 431, the bottom 435, and the side wall 433 of the open structure 430 form a thinner structure, the arrangement space inside the electronic device can be reduced.

[0126] Fig.11 is a cross-sectional view illustrating a circuit board module including an open structure according to an embodiment of the present disclosure.

[0127] According to an embodiment, the electronic device 101 may include a housing (eg, Figure 2 The housing 210 of the present invention and the circuit board module 400 disposed in the housing. The circuit board module 400 may include a circuit board 410, a second component 452, a shielding mold 420 and an open structure 430.

[0128] Fig.11 The circuit board 410, the second component 452, the shielding mold 420 and the open structure 430 may be partially or completely connected with Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 and / or Fig.10 The circuit board 410, the second component 452, the shielding mold 420 and the open structure 430 are the same. Fig.11 The structure can be optionally combined with Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 and / or Fig.10 structural combination.

[0129] According to an embodiment, the circuit board 410 may include a first area S1 and a second area S2 extending from the first area S1. The first area S1 may be formed to surround the second area S2. A first component (not shown) may be disposed in the first area S1 of the circuit board 410, and a second component 452 may be disposed in the second area S2 of the first circuit board 410.

[0130] According to an embodiment, since the second part 452 disposed in the second area S2 of the circuit board 410 is covered by the open structure 430, it may not be shielded by the shielding mold 420. The second part 452 and the open structure 430 may be disposed to be connected to the plurality of second pads 412 disposed in the second area S2 of the circuit board 410.

[0131] According to an embodiment, the second component 452 is an exposed component and can be electrically connected to other components in the electronic device. For example, in the case where the second component 452 is provided as a connector, the second component 452 can be electrically connected to a connector of another component.

[0132] According to an embodiment, the open structure 430 is a structure whose top and bottom are open and may be disposed in the second region S2 of the circuit board 410. The open structure 430 may include a top 431 at least partially open and sidewalls 433 extending in a direction perpendicular to the top 431 (eg, ±Z-axis directions).

[0133] According to an embodiment, a mechanism 504 (e.g., a back cover) may be provided on the circuit board module 400. In an embodiment where the mechanism 504 is provided in the second region S2 of the circuit board 410, the mechanism 504 may help shield the second component 452 together with the open structure 430. For example, the side surface of the second component 452 may be shielded by the open structure 430, and the top surface of the second component 452 may be shielded by the mechanism 504.

[0134] According to an embodiment, the mechanism 504 disposed in the second region S2 may include a ground pad 507 connected to the top 431 of the open structure 430. The ground pad 507 may have a shape corresponding to the top 431 of the open structure 430 (e.g., a closed loop shape), and may be a part of a laser direct structuring (LDS) pattern located inside or outside the mechanism 504. When the ground pad 507 of the mechanism 504 is connected to the top 431 of the open structure 430, shielding performance may be improved.

[0135] Fig.12 is a cross-sectional view illustrating a circuit board module including an open structure according to an embodiment of the present disclosure.

[0136] According to an embodiment, the electronic device 101 may include a housing (eg, Figure 2 The housing 210 of the present invention and the circuit board module 400 disposed in the housing. The circuit board module 400 may include a circuit board 410, a second component 452, a shielding mold 420 and an open structure 430.

[0137] Fig.12 The circuit board 410, the second component 452, the shielding mold 420 and the open structure 430 may be partially or completely connected with Figure 5 , Figure 6 , Figure 7 , Figure 8 and / or Fig. 9 The circuit board 410, the second component 452, the shielding mold 420 and the open structure 430 are the same. Fig.12 The structure can be optionally combined with Figure 5 , Figure 6 , Figure 7 , Figure 8 and / or Fig. 9 structural combination.

[0138] According to an embodiment, the circuit board 410 may include a first area S1 and a second area S2 extending from the first area S1. The first area S1 may be formed to surround the second area S2. A first component (not shown) may be disposed in the first area S1 of the circuit board 410, and a second component 452 may be disposed in the second area S2 of the first circuit board 410.

[0139] According to an embodiment, since the second component 452 disposed in the second area S2 of the circuit board 410 is covered by the open structure 430, the second component 452 may not be shielded by the shielding mold 420. The second component 452 and the open structure 430 may be disposed to be connected to the plurality of second pads 412 disposed in the second area S2 of the circuit board 410.

[0140] According to an embodiment, the open structure 430 is a structure whose top and bottom are open and may be disposed in the second region S2 of the circuit board 410. The open structure 430 may include a top 431 that is at least partially open, and sidewalls 433 extending in a direction perpendicular to the top 431 (eg, ±Z-axis directions).

[0141] Fig.12 FIG. 4 shows a circuit board module 400 in which a full molding process (eg, Figure 8 In an embodiment of performing grinding and laser cutting after the process 30 of the shielding mold 420. For example, when the height of the shielding mold 420 is inevitably increased due to the height difference between the components disposed in the first area S1 of the circuit board 410 in the full molding process, the thermal conductive member 509 may be disposed on the open structure 430, and then a portion of the thermal conductive member 509 together with the top of the shielding mold 420 may be ground and / or laser cut.

[0142] According to an embodiment, in addition to the first portion 431a protruding toward the shielding mold 420, the top 431 of the open structure 430 may further include a second portion 431b for disposing the heat conductive member 509 thereon. The second portion 431b may protrude in a direction opposite to the first portion 431a and form a step with the side wall 433 to prevent the heat conductive member 509 from falling downward (e.g., in the -Z axis direction). The heat conductive member 509 may be a high heat resistant composite material, for example, that can withstand reflow (e.g., Figure 8 The process 20) is performed at a process temperature (roughly 230 to 250 degrees Celsius) of the polyimide.

[0143] A printed circuit board assembly (PBA) placed inside a small electronic device may use a shielding can or molding (and conformal shielding) process in the areas where shielding is desired. The outer volume of the shielding can may take up a lot of space, so a structure formed by molding may be ideal.

[0144] For a component (e.g., a sensor or a connector) that is expected to be exposed among the components set on the PBA, the component may be set on a surface opposite to the surface to which the molding process is applied, which may make it difficult to manufacture miniaturized and lightweight electronic devices. When the component expected to be exposed is set on the surface to which the molding process is applied, a partial molding process can be used. However, because the structure produced by partial molding reduces the side grounding area of ​​the PBA, the electromagnetic interference (EMI) shielding performance may be reduced. In addition, the partial molding structure may be weaker than the ordinary molding (e.g., full molding) structure, and the height error of the material itself and the height difference depending on the presence or absence of the copper foil pattern and the solder resist may cause molding leakage failure. In addition, because the mold frame used for the partial molding process should be changed for each product, it may take a lot of time to manufacture the mold frame.

[0145] The technical objectives to be achieved by the present disclosure are not limited to the above-mentioned technical objectives, and those skilled in the art can clearly understand other unmentioned technical objectives.

[0146] According to an embodiment of the present disclosure, since an area for shielding and an area for arranging components to be exposed are provided on one surface of a PBA in an electronic device, arrangement space efficiency may be improved.

[0147] According to an embodiment of the present invention, since the open structure surrounding the part to be exposed is provided on the circuit board, the part to be exposed can be provided on the same surface together with the shielding part, and a full molding process is adopted. Therefore, compared with a structure formed by a partial molding process, EMI shielding performance and strength can be improved, molding leakage failure can be effectively prevented, and the time spent on manufacturing the mold frame can be reduced.

[0148] The effects that can be achieved by the present disclosure are not limited to the above-mentioned effects, and those skilled in the art can clearly understand other technical effects that are not mentioned.

[0149] The electronic device 101 according to an embodiment of the present disclosure may include a housing 210, a circuit board 410 disposed in the housing, a first component 451 and a second component 452 disposed on one surface of the circuit board, a shielding mold 420 disposed on one surface of the circuit board to cover the top surface and side surfaces of the first component, and an open structure 430 disposed on one surface of the circuit board to surround the side surface of the second component. In the open structure, the top 431 may be opened and expose a portion of the second component or the circuit board, the inner surface 433b may be spaced apart from the second component, and the outer surface 433a may contact the shielding mold.

[0150] According to an embodiment, the circuit board may include a first area S1 and a second area S2 surrounded by the first area. The first part 451 may be disposed on the first area, and the second part 452 spaced apart from the first part may be disposed on the second area.

[0151] According to an embodiment, a plurality of first pads 411 may be disposed on a first region S1 of a circuit board 410, and the first component and the plurality of first pads may be connected to each other by welding. A plurality of second pads 412 may be disposed in a second region S2 of the circuit board 410, and the second component and the open structure may be connected to the plurality of second pads by welding.

[0152] According to an embodiment, one pad 412 a among the plurality of second pads 412 may be connected to the open structure and have a closed loop shape.

[0153] According to an embodiment, the open structure may include a plurality of sidewalls 433 extending vertically from the top 431 and disposed around the second part 452. The plurality of sidewalls may have a closed loop shape disposed along an edge of the second region S2 of the circuit board.

[0154] According to an embodiment, a bottom surface of each of the plurality of side walls 433 may be disposed to be in contact with the circuit board.

[0155] According to an embodiment, the second component may be at least one of a sensor, a GPS, a Con to Con connector, a clip type connector, an RF switch, a passive element (LC) for RF tuning, an identification mark, a test point, a microphone, an eSIM, or a SUS mechanism.

[0156] According to an embodiment, the separation space between the inner surface of the open structure and the second component may be filled with air.

[0157] According to an embodiment, the open structure may include a metallic material.

[0158] According to an embodiment, the top of the open structure may extend outwardly toward the first member. A first portion of the top may be connected to the plurality of side walls, and a second portion extending from the first portion is configured to contact the shielding mold.

[0159] According to an embodiment, a top of the open structure and a plurality of sidewalls extending from the top may have a stepped shape.

[0160] According to an embodiment, the top of the open structure may protrude toward the shielding mold, and the top of the open structure and the shielding mold may jointly define a same flat surface.

[0161] According to an embodiment, a bottom 432 of the open structure 430 may extend inwardly toward the second component, and the bottom of the open structure may be connected to one of the second pads of the circuit board.

[0162] According to an embodiment, the electronic device may further include a mechanism 505 disposed on the open structure 430. A ground pad 507 may be disposed on a bottom surface of the mechanism 505, contacting a top of the open structure, and providing shielding for the second component.

[0163] According to an embodiment, the electronic device may further include a thermal conductive member 509 disposed on the open structure 430. The top of the open structure may include a first portion 431a extending toward the shielding mold and a second portion 431b extending toward the second part in an opposite direction of the first portion and supporting the thermal conductive member.

[0164] According to an embodiment, the electronic device may be a wearable electronic device.

[0165] According to an embodiment of the present disclosure, the method for manufacturing a circuit board module in an electronic device 101 may include a process of preparing a circuit board 410, a metal mask 501 and a solder paste 502 and soldering the solder paste on a portion of the circuit board (process 10), a mounting and reflow process of setting a plurality of components 451 and 452 and an open structure 430 on the circuit board (process 20), a full molding process of setting a mold frame 503 on the circuit board and injecting molding into the mold frame (process 30), and a process of removing the mold frame (process 40).

[0166] According to an embodiment, the installation and reflow process of setting multiple components and open structures on a circuit board may include setting a first component 451 on a first area S1 of a circuit board 410, and setting a second component 452 and an open structure 430 on a second area S2 of the circuit board, and the open structure may be set to surround the side surface of the second component.

[0167] According to an embodiment, the top 431 of the open structure 430 may be open and expose a portion of the second component 451 or the circuit board 410 , the inner surface 433 b of the open structure 430 may be spaced apart from the second component, and the outer surface 433 b of the open structure 430 may be configured to contact the shielding mold 420 .

[0168] According to an embodiment, the open structure may be connected to the plurality of pads 412 of the circuit board on the second region, and one pad 412 a of the plurality of pads 412 may be connected to the open structure 430 and have a closed loop shape.

Claims

1. An electronic device (101), comprising: Housing (210); A circuit board disposed in the housing (410); A first component (451) and a second component (452) disposed on one surface of the circuit board; A shielding mold (420) is arranged on the one surface of the circuit board to cover the top surface and the side surface of the first component; and an open structure (430) disposed on the one surface of the circuit board to surround a side surface of the second component, wherein the top (431) of the open structure is open and exposes a portion of the second component or the circuit board, The inner surface (433b) of the open structure is spaced apart from the second component, and The outer surface (433a) of the open structure contacts the shielding mold.

2. The electronic device according to claim 1, wherein the circuit board (410) comprises a first area (S1) and a second area (S2) surrounded by the first area, wherein the first component (451) is arranged on the first area, and The second component (452) is spaced apart from the first component and is arranged on the second area.

3. The electronic device according to claim 1 and 2, wherein a plurality of first pads (411) are provided on the first region (S1) of the circuit board (410), and the first component and the plurality of first pads are connected to each other by welding, and A plurality of second solder pads (412) are arranged on the second region (S2) of the circuit board (410), and the second component and the open structure are connected to the plurality of second solder pads by welding.

4. The electronic device according to any one of claims 2 and 3, wherein one of the plurality of second pads (412) is connected to the open structure and has a closed loop shape.

5. The electronic device according to any one of claims 2 and 3, wherein the open structure comprises a plurality of side walls (433) extending vertically from the top (431) and arranged to surround the second component, and The plurality of side walls have a closed loop shape disposed along an edge of the second region (S2) of the circuit board.

6. The electronic device according to claim 5, wherein a bottom surface of each of the plurality of side walls (433) is arranged to be in contact with the circuit board.

7. The electronic device according to any one of claims 1 to 6, wherein the second component is at least one of a sensor, a global positioning system (GPS), a Con to Con connector, a clip type connector, a radio frequency (RF) switch, a passive component (LC) for RF tuning, an identification mark, a test point, a microphone, an embedded subscriber identity module (eSIM), or a stainless steel (SUS) mechanism. 8 . The electronic device according to claim 1 , wherein a separation space between the inner surface of the open structure and the second component is filled with air.

9. The electronic device according to any one of claims 1 to 8, wherein the open structure comprises a metallic material.

10. The electronic device according to any one of claims 1 to 9, wherein the top of the open structure extends outwardly toward the first component, and A first portion of the top portion is connected to the plurality of side walls, and a second portion extending from the first portion is configured to contact the shielding mold. 11 . The electronic device according to claim 1 , wherein the top of the open structure and the sidewalls extending from the top have a stepped shape. 12 . The electronic device according to claim 1 , wherein the top of the open structure protrudes toward the shielding mold, and the top of the open structure and the shielding mold together define a same flat surface.

13. The electronic device according to any one of claims 1 to 12, wherein a bottom portion (432) of the open structure (430) protrudes in a direction opposite to the top portion, and The bottom of the open structure is connected to one of the second pads of the circuit board.

14. The electronic device according to any one of claims 1 to 8, further comprising a mechanism (505) arranged on the open structure (430), A ground pad (507) is disposed on the bottom surface of the mechanism (505), contacts the top of the open structure, and provides shielding for the second component.

15. The electronic device according to any one of claims 1 to 8, further comprising a heat conducting member (509) disposed on the open structure (430), The top of the open structure includes a first portion (431a) extending toward the shielding mold and a second portion (431b) extending in an opposite direction of the first portion and supporting the thermal conductive member.

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