Component mounting system

Abstract

The component mounting system mounts an electronic component on a substrate. A component mounting system is provided with: a component mounting machine provided with a feeder holding unit; a component supply feeder which is detachably held by the feeder holding unit and supplies the electronic component to the component mounting machine; an adhesive supply device which is detachably held by the feeder holding unit and supplies an adhesive to the component mounting machine; a coating state confirmation device which is detachably held by the feeder holding unit, is provided with a sheet on which the adhesive supplied from the adhesive supply device can be applied, and confirms the coating state of the adhesive supplied from the adhesive supply device on the basis of the state of the adhesive applied to the sheet; a storage warehouse which accommodates the component supply feeder, the adhesive supply device, and the application state confirmation device; and a moving device configured to move the component feeder between the storage container and the feeder holding unit, and to move the adhesive supply device and the application state confirmation device between the storage container and the feeder holding unit.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a component mounting system for mounting electronic components on a substrate. Background Art

[0002] In a component mounting machine that mounts electronic components on a substrate, adhesive is sometimes applied to the substrate to mount the electronic components. For example, Japanese Patent Publication No. 9-75830 discloses a component mounting machine having an adhesive supply device that supplies adhesive. When applying adhesive to a substrate using an adhesive supply device, sometimes the adhesive cannot be properly applied to the substrate due to, for example, a small amount of adhesive applied. Therefore, before applying adhesive to the substrate, a trial application of the adhesive to a position different from the substrate is performed. In the component mounting machine of Japanese Patent Publication No. 9-75830, a coating state confirmation device for a sheet having an adhesive supply device for trial application is provided. Before applying adhesive to a circuit substrate, adhesive is trial-applied to the sheet of the coating state confirmation device. By confirming the state of the adhesive trial-applied to the sheet, it is confirmed whether the adhesive is properly supplied from the adhesive supply device. Summary of the invention

[0003] Problems to be solved by the invention

[0004] Depending on the production plan, the type of circuit substrate to be produced may change, and accordingly, the type of adhesive applied to the circuit substrate may be different, and sometimes a different type of adhesive must be replaced before starting production using the component mounting machine. In addition, when the adhesive surplus in the adhesive supply device is insufficient, the adhesive supply device needs to be replaced. Similarly, for the coating state confirmation device, when there is no part on the sheet that can be trial-coated, the coating state confirmation device needs to be replaced. Among them, in the component mounting machine of Japanese Patent Publication No. 9-75830, the adhesive supply device and the coating state confirmation device are set by the operator in the component mounting machine. Therefore, if it is necessary to replace the adhesive supply device and the coating state confirmation device, there is the following problem: before the operator's replacement operation is completed, the installation process of the component mounting machine stops, the productivity is reduced, and labor costs are consumed.

[0005] This specification discloses a technology for efficiently replacing or installing an apparatus used for applying an adhesive and an apparatus for confirming the application state of the adhesive.

[0006] Means for solving problems

[0007] The component mounting system disclosed in this specification mounts electronic components on a substrate. The component mounting system comprises: a component mounting machine, which is provided with a feeder holding part; a component supply feeder, which is held in the feeder holding part in a detachable manner and supplies electronic components to the component mounting machine; an adhesive supply device, which is held in the feeder holding part in a detachable manner and supplies adhesive to the component mounting machine; a coating state confirmation device, which is held in the feeder holding part in a detachable manner and has a sheet material to which the adhesive supplied from the adhesive supply device can be applied, and confirms the coating state of the adhesive supplied from the adhesive supply device based on the state of the adhesive applied to the sheet material; a storage room, which accommodates the component supply feeder, the adhesive supply device and the coating state confirmation device; and a moving device, which is configured to enable the component supply feeder to be moved between the storage room and the feeder holding part, and to enable the adhesive supply device and the coating state confirmation device to be moved between the storage room and the feeder holding part.

[0008] The component supply feeder, the adhesive supply device, and the coating state confirmation device can be arranged on the feeder holding portion, and they can be moved by the moving device. Thus, the adhesive supply device and the coating state confirmation device can be moved using the moving device that moves the component supply feeder, and the adhesive supply device and the coating state confirmation device can be automatically arranged on the component mounting machine. Therefore, it is not necessary for the operator to perform the replacement operation of the adhesive supply device and the coating state confirmation device, and productivity can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a diagram showing a schematic configuration of a component mounting system according to an embodiment.

[0010] Figure 2 This is a diagram showing a schematic structure of a component mounting machine.

[0011] Figure 3 yes Figure 2 Cross-sectional view at line III-III.

[0012] Figure 4 This is a block diagram showing a control system of a component mounting machine.

[0013] Figure 5 This is a diagram showing a schematic structure of a component feeder.

[0014] Figure 6 It is a diagram showing a schematic structure of an adhesive supply device.

[0015] Figure 7 It is a diagram showing a schematic configuration of a coating state confirmation device. DETAILED DESCRIPTION

[0016] The main features of the embodiments described below are listed. It should be noted that the technical elements described below are independent technical elements, and their technical usefulness is demonstrated by being used alone or in various combinations, and they are not limited to the combinations described in the claims at the time of application.

[0017] In the component mounting system disclosed in the present specification, the component supply feeder may store first identification information for identifying the component supply feeder. The adhesive supply device may store second identification information for identifying the adhesive supply device. The coating state confirmation device may store third identification information for identifying the coating state confirmation device. The component mounting machine may include: an acquisition unit capable of communicating with the component supply feeder, the adhesive supply device, and the coating state confirmation device held in the feeder holding portion, respectively, and acquiring the first identification information, the second identification information, and the third identification information from the component supply feeder, the adhesive supply device, and the coating state confirmation device, respectively; and an identification unit that identifies the component supply feeder, the adhesive supply device, and the coating state confirmation device held in the feeder holding portion based on the first identification information, the second identification information, and the third identification information acquired by the acquisition unit. According to such a structure, when a component supply feeder, an adhesive supply device, or a coating state confirmation device is provided in the feeder holding portion, it is possible to identify which of the component supply feeder, the adhesive supply device, and the coating state confirmation device is provided in the feeder holding portion. In addition, the type of the component supply feeder or the adhesive supply device can also be identified based on the identification information.

[0018] The component mounting system disclosed in this specification may also be provided with a management device for managing the component mounting machine and the mobile device. Alternatively, the adhesive supply device may be provided with a residual amount measuring unit for measuring the residual amount of the adhesive of the adhesive supply device. Alternatively, the component mounting machine may be provided with a communication unit for transmitting information related to the residual amount of the adhesive measured by the residual amount measuring unit of the adhesive supply device held in the feeder holding unit to the management device. Alternatively, when the residual amount of the adhesive of the adhesive supply device held in the feeder holding unit becomes less than a predetermined amount, the management device moves the adhesive supply device from the feeder holding unit to the storage warehouse through the mobile device, and moves other adhesive supply devices stored in the storage warehouse to the feeder holding unit. According to such a structure, when the residual amount of the adhesive of the adhesive supply device held in the feeder holding unit becomes less, the adhesive supply device can be automatically replaced.

[0019] The component mounting system disclosed in this specification may also be provided with a management device for managing the component mounting machine and the moving device. Alternatively, the coating state confirmation device may include: a winding section for winding the sheet; and a winding amount measuring section for measuring the winding amount of the sheet wound by the winding section. Alternatively, the component mounting machine may include a communication section, which transmits information related to the winding amount of the sheet measured by the winding amount measuring section of the coating state confirmation device held in the feeder holding section to the management device. Alternatively, when the winding amount of the sheet of the coating state confirmation device held in the feeder holding section becomes more than a predetermined amount, the management device moves the coating state confirmation device from the feeder holding section to the storage through the moving device, and moves other coating state confirmation devices stored in the storage section to the feeder holding section. According to such a structure, when the usable sheets of the coating state confirmation device held in the feeder holding section become less, the coating state confirmation device can be automatically replaced.

[0020] In the component mounting system disclosed in this specification, the feeder holding portion can be configured to hold a plurality of adhesive supply devices. According to such a structure, by providing a plurality of adhesive supply devices in the feeder holding portion, the time for stopping the mounting process for the replacement operation of the adhesive supply device can be shortened. In addition, a plurality of adhesive supply devices that supply different types of adhesives can be provided at the same time.

[0021] Example

[0022] Referring to the accompanying drawings, a component mounting system 1 according to an embodiment will be described. Figure 1 As shown, the component mounting system 1 includes a plurality of component mounting machines 10 , a management device 8 , a component feeder 30 , a loader 50 , a storage warehouse 54 , an adhesive supply device 60 , and a coating state confirmation device 80 .

[0023] like Figure 1 As shown, each component mounting machine 10 is connected to the management device 8 so as to be communicable. The management device 8 is connected to the plurality of component mounting machines 10 and the loader 50 so as to be communicable, and manages the plurality of component mounting machines 10 and the loader 50. The component mounting line 100 is constituted by the management device 8 and the plurality of component mounting machines 10. The management device 8 is constituted using a computer having a CPU and a storage device. The management device 8 controls the entire component mounting line 100 by controlling the operation of each component mounting machine 10. That is, the management device 8 determines the type and position of the electronic component 4 to be installed by the component mounting machine 10 on the circuit substrate 2 for each of the plurality of component mounting machines 10, and instructs the component mounting machine 10. Each component mounting machine 10 operates based on the instruction of the management device 8, thereby installing the required electronic component 4 on the circuit substrate 2.

[0024] The component mounting machine 10 mounts the electronic component 4 on the circuit substrate 2. The component mounting machine 10 is also called a surface mounting machine or a chip mounting machine. The circuit substrate 2 is transported from one end of the component mounting line 100 to the other end. In each component mounting machine 10, a predetermined electronic component 4 is mounted on the circuit substrate 2. The circuit substrate 2 transported to the other end of the component mounting line 100 is shipped as a final product, or transported to a subsequent process as a semi-finished product.

[0025] like Figure 2~Figure 4 As shown, the component mounting machine 10 includes a feeder holding unit 14 , a head 16 , an imaging device 20 , a moving device 18 for moving the head 16 and the imaging device 20 , a substrate conveyor 22 , an operation panel 24 , a communication unit 28 , and a control device 26 .

[0026] The feeder holding portion 14 has a plurality of slots, and the component feeders 30 can be detachably mounted in each of the plurality of slots. The feeder holding portion 14 can be fixed to the component mounting machine 10 or can be detachably mounted to the component mounting machine 10. Figure 3 As shown in FIG. 1 , the feeder holding portion 14 includes a connector 15. Figure 3 , a state in which the component feeder 30 (and the adhesive supply device 60 and the coating state confirmation device 80 described later) are not provided in the slot closest to the +X direction side is shown. The connector 15 is provided at a position to be connected to the connector 40 (described later) of the component feeder 30 when the component feeder 30 is provided in the feeder holding portion 14. In addition, the adhesive supply device 60 and the coating state confirmation device 80 may also be provided in a detachable manner on the feeder holding portion 14. It should be noted that the component feeder 30, the adhesive supply device 60 and the coating state confirmation device 80 will be described in detail later.

[0027] The head 16 is detachably mounted on a moving base 18a (described later) of the moving device 18. The head 16 has one or more suction nozzles 6 for sucking the electronic component 4. The suction nozzle 6 is detachably mounted on the head 16. The head 16 can move the suction nozzle 6 along the Z direction (here, the vertical direction) to move the suction nozzle 6 closer to and away from the component feeder 30 and the circuit substrate 2 provided on the feeder holding portion 14. The head 16 can use the suction nozzle 6 to suck the electronic component 4 supplied from the component feeder 30, and install the electronic component 4 sucked by the suction nozzle 6 on the circuit substrate 2. On the moving base 18a, different types of heads 16 can be installed corresponding to the types of electronic components 4. In addition, the head 16 capable of installing an adhesive tool 66 (described later) can also be installed on the moving base 18a.

[0028] The photographing device 20 is fixed to the moving base 18a (described later) and moves integrally with the moving base 18a. The photographing device 20 includes a camera and a light source. The camera is configured so that its photographing direction faces downward, and photographs the upper surface of the circuit substrate 2 and the upper surface of the sheet 84 (described later) provided in the coating state confirmation device 80. The camera uses, for example, a CCD camera. The light source is composed of an LED, and illuminates the upper surface of the circuit substrate 2 and the upper surface of the sheet 84. The image data of the image photographed by the photographing device 20 is stored in the memory (not shown) of the control device 26.

[0029] The moving device 18 moves the head 16 and the imaging device 20 between the component feeder 30 and the circuit substrate 2. The moving device 18 of this embodiment is an XY robot that moves the moving base 18a in the X direction and in the Y direction perpendicular to the X direction on the horizontal plane. The moving device 18 is composed of a guide rail that guides the moving base 18a, a moving mechanism that moves the moving base 18a along the guide rail, and a motor that drives the moving mechanism. The moving device 18 is arranged above the component feeder 30 and the circuit substrate 2. The head 16 and the imaging device 20 are mounted on the moving base 18a. The head 16 and the imaging device 20 are moved above the component feeder 30, the adhesive supply device 60 or the coating state confirmation device 80 set in the feeder holding part 14, and above the circuit substrate 2 by the moving device 18.

[0030] The substrate conveyor 22 conveys the circuit substrate 2 along the X direction. The substrate conveyor 22 of this embodiment is composed of a pair of belt conveyors, a support device installed on the belt conveyor and supporting the circuit substrate 2 from below, and a drive device that drives the belt conveyor. The substrate conveyor 22 receives the circuit substrate 2 from the substrate operation machine adjacent to one side and moves it into the component mounting machine 10, positioning the circuit substrate 2 at the component mounting position. When the installation of the electronic component 4 on the circuit substrate 2 is completed, the substrate conveyor 22 moves the circuit substrate 2 out of the component mounting machine 10 and hands it over to the substrate operation machine adjacent to the other side.

[0031] The control device 26 is constituted by a computer having a CPU and a storage device. The control device 26 controls the operation of each part of the component mounting machine 10 based on the production program sent from the management device 8. Figure 4As shown, the control device 26 is connected to the head 16, the moving device 18, the imaging device 20, the substrate conveyor 22, the operation panel 24, and the communication unit 28, and controls each of the head 16, the moving device 18, the imaging device 20, the substrate conveyor 22, the operation panel 24, and the communication unit 28. In addition, the control device 26 obtains information from the component feeder 30, the adhesive supply device 60, and the coating state confirmation device 80 provided in the feeder holding portion 14 via the connector 15. The information obtained from the component feeder 30 is, for example, identification information (described later) for identifying the component feeder 30 and information related to the remaining amount of the electronic component 4. The information obtained from the adhesive supply device 60 is, for example, identification information (described later) for identifying the adhesive supply device 60 and information related to the remaining amount of the adhesive in the adhesive tool 66 (described later). The information acquired from the coating state confirmation device 80 is, for example, identification information (described later) for identifying the coating state confirmation device 80 and information on the winding amount of the sheet 84 (described later).

[0032] The operation panel 24 is a display device that provides various information of the component mounting machine 10 to the operator, and is an input device that receives instructions and information from the operator.

[0033] The communication unit 28 transmits and receives information to and from the management device 8. Specifically, the communication unit 28 receives information related to the production program from the management device 8. In addition, the communication unit 28 transmits information related to the component feeder 30, the adhesive supply device 60, and the coating state confirmation device 80 provided in the feeder holding portion 14 to the management device 8. The information related to the component feeder 30 is, for example, identification information of the component feeder 30 and the remaining amount of the electronic component 4 stored in the component feeder 30. The information related to the adhesive supply device 60 is, for example, identification information of the adhesive supply device 60 and the remaining amount of the adhesive stored in the adhesive tool 66 (described later) of the adhesive supply device 60. The information related to the coating state confirmation device 80 is, for example, identification information of the coating state confirmation device 80 and the winding amount of the sheet 84 (described later) provided in the coating state confirmation device 80.

[0034] The component feeder 30 is detachably provided on the feeder holding portion 14, and supplies the electronic component 4 to the component mounting machine 10 (specifically, the suction nozzle 6). Figure 5 As shown, the component feeder 30 includes a main body 32 , a tape reel 34 detachably mounted on the main body 32 , a tape delivery mechanism 38 , a connector 40 , and a control device 42 .

[0035] A long tape 36 containing a plurality of electronic components 4 at a certain interval is wound on the tape reel 34. The tape delivery mechanism 38 delivers a certain amount of the tape 36 containing the electronic components 4 from the tape reel 34 at a time. The delivery amount of the tape 36 by the tape delivery mechanism 38 is set according to the interval of the electronic components 4 contained in the tape 36. The electronic components 4 on the delivered tape 36 are picked up by the head 16 at the component taking-out position 44. The tape reel 34 can be replaced with respect to the main body 32 of the component feeder 30.

[0036] The connector 40 is disposed on the side surface on the +Y direction side of the component feeder 30 (i.e., the side surface on the substrate conveyor 22 side when the component feeder 30 is set in the feeder holding part 14). When the component feeder 30 is set in the feeder holding part 14, the connector 40 is connected to the connector 15 of the feeder holding part 14.

[0037] The control device 42 controls each part of the component feeder 30. In addition, a memory (not shown) of the control device 42 stores identification information for identifying the component feeder 30. The identification information includes information related to the reel 34 provided in the component feeder 30 and the type of the electronic component 4 accommodated in the reel 34.

[0038] In addition, in the present embodiment, the component feeder 30 is a belt-type component feeder, but is not limited to such a structure. For example, the component feeder may also be a tray-type component feeder that accommodates a plurality of electronic components 4 on a tray, or a bulk-type component feeder that randomly accommodates a plurality of electronic components 4 in a container.

[0039] like Figure 1 As shown in FIG. 1 , the loader 50 is a device that automatically mounts and removes the component feeder 30 from the feeder holding portion 14. The loader 50 is configured to remove and recover the component feeder 30 to be replaced from the feeder holding portion 14, and to mount the component feeder 30 used in production on the feeder holding portion 14. The component mounting machines 10 constituting the component mounting line 100 are arranged in one direction, and the loader 50 is configured to move the component feeder 30 along the one direction ( Figure 3 The loader 50 is movable relative to each slot of the feeder holding section 14 of each component mounting machine 10 along the guide rails 52 provided therein (in the X direction). The loader 50 moves between the feeder holding section 14 of each component mounting machine 10 and the storage 54 along the guide rails 52. In addition, the loader 50 also moves the adhesive supply device 60 and the coating state confirmation device 80 between the feeder holding section 14 of each component mounting machine 10 and the storage 54, and attaches and detaches the adhesive supply device 60 and the coating state confirmation device 80 relative to the feeder holding section 14. The loader 50 is configured to be able to communicate with the management device 8.

[0040] The storage warehouse 54 is arranged on the upstream side of the component mounting machine 10 arranged at the most upstream of the component mounting line 100. The storage warehouse 54 stores a plurality of component feeders 30. Specifically, the storage warehouse 54 stores component feeders 30 that are not used in the mounting process, and stores component feeders 30 that have been used in the mounting process. A guide rail 52 is provided on the front surface of the storage warehouse 54. That is, the guide rail 52 is provided on the front surface of the storage warehouse 54 and the plurality of component mounting machines 10. The loader 50 moves the component feeders 30 stored in the storage warehouse 54 to the respective slots of the feeder holding portion 14 of each component mounting machine 10, and moves the component feeders 30 from the respective slots of the feeder holding portion 14 of each component mounting machine 10 to the storage warehouse 54. In addition, the storage warehouse 54 also stores an adhesive supply device 60 and a coating state confirmation device 80 together with the component feeders 30.

[0041] The adhesive supply device 60 is detachably provided on the feeder holding portion 14, and supplies adhesive to the component mounting machine 10. Figure 6 As shown, the adhesive supply device 60 includes a main body 62 , a groove 64 provided in the main body 62 , an adhesive tool 66 , a heater 68 , a connector 70 , and a control device 72 .

[0042] The main body 62 has a shape that can be set in the feeder holding part 14. That is, the main body 62 has a shape that imitates the slot of the feeder holding part 14. The dimension of the main body 62 in the X direction is larger than the dimension of the component feeder 30 in the X direction. Therefore, the adhesive supply device 60 is provided across a plurality of slots (two slots in this embodiment) of the feeder holding part 14.

[0043] The groove 64 is provided on the upper surface of the main body 62 on the +Y direction side. The groove 64 has a shape capable of accommodating the adhesive tool 66. The adhesive tool 66 is accommodated in the groove 64. An adhesive (such as glue, etc.) is accommodated in the adhesive tool 66. The adhesive tool 66 is mounted on the head 16 of a type capable of mounting the adhesive tool 66, and is moved between the adhesive supply device 60 and the circuit substrate 2 by the moving device 18 when mounted on the head 16. The adhesive tool 66 is used to apply adhesive to the circuit substrate 2. When the adhesive tool 66 is mounted on the head 16, pressure is applied to the adhesive in the adhesive tool 66 by a pressure applying device (not shown), and the adhesive in the adhesive tool 66 is discharged from the front end.

[0044] The heater 68 is arranged around the groove 64. The heater 68 adjusts the temperature of the adhesive tool 66 accommodated in the groove 64. In order to apply the adhesive to the circuit board 2 in a stable state, the adhesive needs to be adjusted to a predetermined temperature higher than the room temperature. By arranging the heater 68 near the groove 64, the temperature of the adhesive accommodated in the adhesive tool 66 can be appropriately adjusted while the adhesive tool 66 is accommodated in the groove 64.

[0045] The connector 70 is disposed on the side surface of the adhesive supply device 60 on the +Y direction side (i.e., the side surface on the substrate conveyor 22 side when the adhesive supply device 60 is disposed in the feeder holding portion 14). When the adhesive supply device 60 is disposed in the feeder holding portion 14, the connector 70 is connected to the connector 15 of the feeder holding portion 14.

[0046] The control device 72 controls each part of the adhesive supply device 60. In addition, the memory (not shown) of the control device 72 stores identification information for identifying the adhesive supply device 60. The identification information includes information related to the type of adhesive contained in the adhesive supply device 60. In addition, the control device 72 calculates the remaining amount of adhesive in the adhesive tool 66. Specifically, the control device 72 calculates the remaining amount of adhesive based on the amount of adhesive applied from the adhesive tool 66 and the number of times it is used. The calculated remaining amount of adhesive is stored in the memory of the control device 72. In addition, in the present embodiment, the control device 72 calculates the remaining amount of adhesive, but is not limited to such a structure. For example, the adhesive supply device may also be provided with a mass measuring device for measuring the mass of the adhesive in the adhesive tool 66, and the control device 72 may also store the mass of the adhesive obtained from the mass measuring device as the remaining amount of adhesive in the memory.

[0047] The coating state confirmation device 80 is used to confirm whether the adhesive is properly applied from the adhesive tool 66 accommodated in the adhesive supply device 60 (that is, the coating state of the adhesive). The coating state confirmation device 80 is provided in the feeder holding portion 14 in a detachable manner. Figure 7 As shown, the coating state confirmation device 80 includes a main body 82 , a sheet 84 , a supply unit 86 for supplying the sheet 84 , a winding unit 88 for winding the sheet 84 , a motor 89 , a connector 90 , and a control device 92 .

[0048] The main body 82 has a shape that can be installed in the feeder holding portion 14, similarly to the main body 62 of the adhesive supply device 60. The dimension of the main body 82 in the X direction is larger than the dimension of the component feeder 30 in the X direction. Therefore, the coating state confirmation device 80 is installed across a plurality of slots (two slots in this embodiment) of the feeder holding portion 14.

[0049] The sheet 84 is used to experimentally apply the adhesive (i.e., test-apply the adhesive) using the adhesive tool 66 accommodated in the adhesive supply device 60. The sheet 84 is supplied from the supply unit 86, exposed to the outside from the main body 82 at the test-applying position 85, and wound around the winding unit 88. The supply unit 86 and the winding unit 88 are rotatably supported by the main body 82. The winding unit 88 is connected to a motor 89, and the winding unit 88 is rotated in the direction of winding the sheet 84 (in the direction of the test-applying position 85). Figure 7 The winding section 88 rotates to wind up the sheet 84, the sheet 84 is stretched, and the supply section 86 also rotates.

[0050] The connector 90 is disposed on the side surface of the coating state confirmation device 80 on the +Y direction side (i.e., the side surface on the substrate conveyor 22 side when the coating state confirmation device 80 is disposed in the feeder holding portion 14). When the coating state confirmation device 80 is disposed in the feeder holding portion 14, the connector 90 is connected to the connector 15 of the feeder holding portion 14.

[0051] The control device 92 controls each part of the coating state confirmation device 80. In addition, the memory (not shown) of the control device 92 stores identification information for identifying the coating state confirmation device 80. In addition, the control device 92 calculates the winding amount of the sheet 84 wound on the winding section 88. Specifically, the winding amount of the sheet 84 is calculated based on the driving amount of the motor 89 connected to the winding section 88. The calculated winding amount of the sheet 84 is stored in the memory of the control device 92.

[0052] Here, the operation of confirming the application state of the adhesive using the application state confirmation device 80 is described. The operation of confirming the application state of the adhesive is performed in a state where the feeder holding portion 14 is provided with the adhesive supply device 60 and the application state confirmation device 80. In addition, the operation of confirming the application state of the adhesive is performed before the adhesive is applied to the circuit board 2.

[0053] First, the control device 26 of the component mounting machine 10 assembles the adhesive tool 66 accommodated in the adhesive supply device 60 to the head 16. Next, the control device 26 moves the adhesive tool 66 to the top of the trial coating position 85, and applies the adhesive in the adhesive tool 66 to the sheet 84 exposed at the trial coating position 85. Next, the control device 26 moves the photographing device 20 to the top of the trial coating position 85, and photographs the trial coating position 85 from above. Next, the control device 26 determines whether the size and shape of the applied adhesive are within a predetermined range based on the photographed image. Next, the control device 26 sends information to the coating state confirmation device 80 via the connectors 15 and 90 that the trial coating has been completed.

[0054] When the control device 92 of the coating state confirmation device 80 obtains information that the trial coating has been completed from the control device 26, it drives the motor 89 by a predetermined amount and winds up the sheet 84 using the winding portion 88. Then, the sheet 84 coated with the adhesive by the trial coating moves from the trial coating position 85 to the winding portion 88 side, and the sheet 84 not coated with the adhesive is exposed at the trial coating position 85.

[0055] In the present embodiment, the loader 50 moves the component feeder 30 between the storage 54 and each component mounting machine 10. When production starts on the component mounting line 100, the management device 8 moves the component feeder 30 required for each component mounting machine 10 through the loader 50 according to the production procedure. In addition, as described above, the loader 50 can also move the adhesive supply device 60 and the coating state confirmation device 80. According to the production procedure, adhesive is sometimes applied to the circuit substrate 2. In addition, different multiple adhesives are sometimes applied to the circuit substrate 2. When production starts on the component mounting line 100, the management device 8 moves the adhesive supply device 60 required for each component mounting machine 10 through the loader 50 according to the production procedure. In addition, on the component mounting machine 10 where the adhesive supply device 60 is provided, it is necessary to provide the coating state confirmation device 80 for trial coating. Before the management device 8 starts production on the component mounting line 100, in order to set up the component feeder 30, adhesive supply device 60 and coating status confirmation device 80 required for each component mounting machine 10, the loader 50 is used to move the appropriate type of component feeder 30, adhesive supply device 60 and coating status confirmation device 80 between the storage warehouse 54 and each component mounting machine 10.

[0056] At this time, if Figure 3 As shown, the management device 8 may also be provided with a plurality of adhesive supply devices 60 on a component mounting machine 10 as needed. For example, different types of adhesive supply devices 60 may be provided on a component mounting machine 10, or two or more adhesive supply devices 60 of the same type may be provided on a component mounting machine 10. In this case, the adhesive supply device 60 is also moved to the component mounting machine 10 by the loader 50. In this embodiment, the adhesive supply device 60 can be provided on the feeder holding portion 14. Therefore, more than two adhesive supply devices 60 can be provided on a component mounting machine 10. In addition, in Figure 3In the embodiment, two adhesive supply devices 60 are provided in the feeder holding portion 14, but the number of adhesive supply devices 60 provided in the feeder holding portion 14 is not particularly limited. The number of adhesive supply devices 60 provided in the feeder holding portion 14 may be one or more than three. By being able to provide a plurality of adhesive supply devices 60 in one component mounting machine 10, a production program in the component mounting line 100 can be flexibly generated. In addition, two or more coating state confirmation devices 80 may be provided in one component mounting machine 10.

[0057] When the component feeder 30, the adhesive supply device 60, and the coating state confirmation device 80 are respectively provided in the feeder holding part 14 of the component mounting machine 10, the identification information of the component feeder 30, the adhesive supply device 60, and the coating state confirmation device 80 provided in the feeder holding part 14 is output to the control device 26 of the component mounting machine 10 via the connector 15, the connector 40, the connector 70, and the connector 90. The control device 26 recognizes what kind of device is provided in each slot of the feeder holding part 14 based on the obtained identification information. For example, when the component feeder 30 is provided in the feeder holding part 14, the control device 26 determines that the device provided in the feeder holding part 14 is the component feeder 30 and the type of the electronic component 4 accommodated in the component feeder 30 based on the obtained identification information. In addition, when the adhesive supply device 60 is provided in the feeder holding portion 14, the control device 26 determines, based on the acquired identification information, that the device provided in the feeder holding portion 14 is the adhesive supply device 60 and the type of adhesive contained in the adhesive supply device 60. In addition, when the coating state confirmation device 80 is provided in the feeder holding portion 14, the control device 26 determines, based on the acquired identification information, that the device provided in the feeder holding portion 14 is the coating state confirmation device 80.

[0058] Furthermore, during the execution of the mounting process, the component mounting machine 10 provided with the adhesive supply device 60 and the coating state confirmation device 80 obtains information on the remaining amount of the adhesive from the adhesive supply device 60, and obtains information on the winding amount of the sheet 84 from the coating state confirmation device 80. When the component mounting machine 10 obtains the information on the remaining amount of the adhesive and the information on the winding amount of the sheet 84, it transmits the obtained information to the management device 8 via the communication unit 28. Thus, the management device 8 can grasp the remaining amount of the adhesive in the adhesive supply device 60 provided in each component mounting machine 10 and the remaining amount of the usable sheet 84 in the coating state confirmation device 80.

[0059] The management device 8 causes the loader 50 to replace the adhesive supply device 60 and the coating state confirmation device 80 based on the information on the remaining amount of the adhesive obtained from each component mounting machine 10 and the information on the winding amount of the sheet 84. Specifically, when the management device 8 determines that the remaining amount of the adhesive has become less than the predetermined amount based on the information on the remaining amount of the adhesive obtained, the management device 8 causes the loader 50 to move the adhesive supply device 60 having the adhesive tool 66 having the remaining amount of the adhesive less than the predetermined amount from the feeder holding part 14 to the storage 54. Then, the management device 8 causes the loader 50 to move the adhesive supply device 60 having the adhesive tool 66 containing a sufficient amount of adhesive from the storage 54 to the feeder holding part 14. Similarly, when the management device 8 determines that the remaining amount of the usable sheet 84 has become less than the predetermined amount based on the information related to the winding amount of the sheet 84 obtained, the management device 8 uses the loader 50 to move the coating state confirmation device 80 whose remaining amount of the sheet 84 is less than the predetermined amount from the feeder holding part 14 to the storage 54, and uses the loader 50 to move the coating state confirmation device 80 that fully accommodates the usable sheet 84 from the storage 54 to the feeder holding part 14. In this way, in this embodiment, not only the component feeder 30, but also the adhesive supply device 60 and the coating state confirmation device 80 can be moved between the feeder holding part 14 and the storage 54 using the loader 50, so that the adhesive supply device 60 and the coating state confirmation device 80 provided in the component mounting machine 10 can be automatically replaced. In addition, the adhesive supply device 60 and the coating status confirmation device 80 can be moved using the loader 50 that moves the component feeder 30, so there is no need to add a dedicated structure for replacing the adhesive supply device 60 and the coating status confirmation device 80, and the adhesive supply device 60 and the coating status confirmation device 80 can be automatically replaced.

[0060] The following describes the points of attention related to the component mounting system 1 described in the embodiment. The connector 15 of the embodiment is an example of an "acquisition unit", the control device 26 is an example of an "identification unit", the component feeder 30 is an example of a "component supply feeder", the loader 50 is an example of a "moving device", the control device 72 is an example of a "remaining amount measuring unit", and the control device 92 is an example of a "winding amount measuring unit".

[0061] The specific examples of the technology disclosed in this specification are described in detail above, but these are only examples and do not limit the claims. The technology described in the claims includes technologies obtained by various deformations and changes to the specific examples illustrated above. In addition, the technical elements described in this specification or the drawings exert technical usefulness alone or in various combinations, and are not limited to the combinations recorded in the claims at the time of application. In addition, the technology illustrated in this specification or the drawings achieves multiple purposes at the same time, and achieving one of the purposes itself has technical usefulness.

[0062] This specification also discloses a technical idea of ​​changing "the component mounting system described in claim 2" in claim 4 to "the component mounting system described in claim 2 or 3".

Claims

1. A component mounting system for mounting an electronic component on a substrate, wherein: The component mounting system comprises: A component mounting machine having a feeder holding portion; a component supply feeder, which is detachably held in the feeder holding portion and supplies the electronic component to the component mounting machine; an adhesive supply device detachably held in the feeder holding portion and supplying adhesive to the component mounting machine; a coating state confirmation device, which is detachably held on the feeder holding portion, and includes a sheet material to which the adhesive supplied from the adhesive supply device can be applied, and confirms the coating state of the adhesive supplied from the adhesive supply device based on the state of the adhesive applied to the sheet material; A storage warehouse for storing the component supply feeder, the adhesive supply device, and the coating state confirmation device; and The moving device is configured to move the component supply feeder between the storage and the feeder holding portion, and to move the adhesive supply device and the coating state confirmation device between the storage and the feeder holding portion.

2. The component mounting system according to claim 1, wherein: The component supply feeder stores first identification information for identifying the component supply feeder. The adhesive supply device stores second identification information for identifying the adhesive supply device. The coating state confirmation device stores third identification information for identifying the coating state confirmation device. The component mounting machine comprises: an acquisition unit capable of communicating with the component supply feeder, the adhesive supply device, and the coating state confirmation device held in the feeder holding unit, respectively, and acquiring the first identification information, the second identification information, and the third identification information from the component supply feeder, the adhesive supply device, and the coating state confirmation device, respectively; and The recognition section recognizes the component supply feeder, the adhesive supply device, and the coating state confirmation device held by the feeder holding section based on the first identification information, the second identification information, and the third identification information acquired by the acquisition section.

3. The component mounting system according to claim 2, wherein: The component mounting system further includes a management device for managing the component mounting machine and the mobile device. The adhesive supply device includes a remaining amount measuring unit for measuring a remaining amount of the adhesive in the adhesive supply device. The component mounting machine includes a communication unit that transmits information on the remaining amount of the adhesive measured by the remaining amount measuring unit of the adhesive supply device held by the feeder holding unit to the management device. When the remaining amount of the adhesive of the adhesive supply device held in the feeder holding portion becomes less than a predetermined amount, the management device moves the adhesive supply device from the feeder holding portion to the storage warehouse through the moving device, and moves other adhesive supply devices housed in the storage warehouse toward the feeder holding portion.

4. The component mounting system according to claim 2, wherein: The component mounting system further includes a management device for managing the component mounting machine and the mobile device. The coating state confirmation device comprises: a winding section that winds up the sheet; and a winding amount measuring section that measures the winding amount of the sheet wound by the winding section. The component mounting machine includes a communication unit that transmits information related to the winding amount of the sheet measured by the winding amount measuring unit of the coating state confirmation device held by the feeder holding unit to the management device. When the winding amount of the sheet of the coating status confirmation device held in the feeder holding portion becomes more than a predetermined amount, the management device moves the coating status confirmation device from the feeder holding portion to the storage warehouse through the moving device, and moves other coating status confirmation devices housed in the storage warehouse toward the feeder holding portion.

5. The component mounting system according to any one of claims 1 to 4, wherein: The feeder holding portion is configured to be able to hold a plurality of the adhesive supply devices.

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