Bare copper wire manufacturing control method and device

Abstract

The invention is suitable for the technical field of copper wire manufacturing, and particularly relates to a bare copper wire manufacturing control method and device. Wherein the manufacturing information comprises production data and mold parameters, the production data is used for reflecting the wire drawing speed and historical working time during production of the wire drawing device, and the mold parameters are used for reflecting initial size characteristics and current size characteristics of a wire drawing mold of the wire drawing device; acquiring a vibration signal; analyzing according to the vibration signal and the manufacturing information to obtain similarity information; and performing analysis according to the similarity information, the mold parameters and the production data to obtain maintenance information. According to the bare copper wire manufacturing control method and equipment, the wire drawing die can be replaced according to the abrasion degree, the remaining service life of the wire drawing die can be monitored in real time, a maintenance plan does not need to be made for the wire drawing equipment, and finally the wire drawing equipment can meet the production requirement for manufacturing high-quality bare copper wires.

Description

Technical Field

[0001] The present application belongs to the technical field of copper wire manufacturing, and in particular, relates to a bare copper wire manufacturing control method and equipment. Background Art

[0002] Bare copper wire manufacturing control can produce bare copper wire with excellent conductive properties through production steps such as melting, casting, drawing, annealing and dimensional inspection. It aims to provide accurate and stable control methods during the production of bare copper wire, so as to maintain the production requirements of manufacturing high-quality bare copper wire and efficient production.

[0003] In the related art, the production of bare copper wire requires the copper billet to be drawn into bare copper wire of the required size through a wire drawing die. During the drawing process, the wire drawing die (wear parts) will generate friction with the copper wire and cause the wear and tear of the wire drawing die, which will eventually cause the quality of the copper wire to deteriorate. In the actual production process, many factories will use the MES system to detect the working time of the wear parts in real time, and then use the difference between the expected working time and the working time of the wear parts as the remaining working time of the wear parts, and finally adjust the maintenance plan that has been formulated according to the remaining working time. However, due to different production environments for wear parts (for example, a sudden rise or fall in ambient temperature) or production problems in the production of wear parts (for example, insufficient purity of production materials, improper handling of production materials), the expected working time of the wear parts may change, which in turn causes the remaining working time obtained based on the difference between the expected working time and the working time to be inaccurate, and ultimately causes the remaining working time of the wear parts to be unable to accurately guarantee the smooth progress of the already formulated production plan. Therefore, the maintenance plan formulated according to the working time and expected working time of the wear parts cannot fully meet the production requirements of the wire drawing device. When the remaining working time of the wear parts is still remaining but the wear parts can no longer support the production needs of manufacturing high-quality bare copper wire, the quality of the bare copper wire will be reduced. Summary of the invention

[0004] The embodiments of the present application provide a bare copper wire manufacturing control method and device, which can improve the problem that the maintenance plan formulated according to the working time and expected working time of the wear parts cannot fully meet the production requirements of the wire drawing device, ultimately leading to the reduction of the quality of the bare copper wire.

[0005] In a first aspect, an embodiment of the present application provides a bare copper wire manufacturing control method, comprising:

[0006] Acquire manufacturing information; wherein the manufacturing information includes production data and die parameters, the production data is used to reflect the wire drawing speed and historical working time during the production of the wire drawing device, and the die parameters are used to reflect the initial size characteristics and current size characteristics of the wire drawing die of the wire drawing device;

[0007] Acquire a vibration signal; wherein the vibration signal is used to reflect the change in the vibration amplitude of the wire drawing die in the time domain during the current production process;

[0008] Analyze the vibration signal and the manufacturing information to obtain similarity information; wherein the similarity information is used to reflect the similarity between the mechanical vibration generated by the wire drawing die working under the initial size feature and the mechanical vibration generated by the wire drawing die working under the current size feature;

[0009] Maintenance information is obtained by analyzing the similarity information, the die parameters and the production data; wherein the maintenance information is used to reflect the maintenance timing of the wire drawing die in the wire drawing device.

[0010] The above technical solutions in the embodiments of the present application have at least the following technical effects:

[0011] The bare copper wire manufacturing control method provided in the embodiment of the present application first obtains production data reflecting the drawing speed and historical working time of the wire drawing device during production, and obtains mold parameters reflecting the initial size characteristics and current size characteristics of the wire drawing die of the wire drawing device, and uses the production data and mold parameters as manufacturing information, and then obtains a vibration signal reflecting the change of the vibration amplitude of the wire drawing die in the time domain during the current production process, and then analyzes the vibration signal and the manufacturing information to obtain similarity information reflecting the similarity between the mechanical vibration generated by the wire drawing die working under the initial size characteristics and the mechanical vibration generated under the current size characteristics, and judges through the similarity information to obtain first maintenance information reflecting the replacement of the wire drawing die, and obtains second maintenance information reflecting the adjustment of the working time of the wire drawing die through analysis of the similarity information, mold parameters and production data, and finally confirms the first maintenance information and the second maintenance information as maintenance information reflecting the maintenance timing of the wire drawing die in the wire drawing device.

[0012] The method can timely detect the degree of wear of the wire drawing die in the wire drawing device and the remaining service life of the wire drawing die, replace the wire drawing die according to the degree of wear, and monitor the remaining service life of the wire drawing die in real time. There is no need to formulate a maintenance plan for the wire drawing equipment, and ultimately the wire drawing equipment can maintain the production needs of manufacturing high-quality bare copper wire.

[0013] In a possible implementation manner of the first aspect, the obtaining similarity information by analyzing the vibration signal and the manufacturing information includes:

[0014] Performing characteristic analysis on the die parameters to obtain a stiffness value; wherein the stiffness value is used to reflect the ability of the wire drawing die to resist vibration during the production process;

[0015] Analyze the wire drawing speed and the stiffness value of the manufacturing information to obtain a simulated vibration signal; wherein the simulated vibration signal is used to reflect the change in the vibration amplitude in the time domain during the production process before the wire drawing die is worn;

[0016] The vibration signal and the simulated vibration signal are processed to obtain similarity information.

[0017] In a possible implementation manner of the first aspect, the obtaining similarity information by processing the vibration signal and the simulated vibration signal includes:

[0018] Plotting the vibration signal to obtain a vibration waveform diagram; wherein the vibration waveform diagram is used to reflect information about the vibration amplitude and direction of the vibration signal at different times;

[0019] Plotting the simulated vibration signal to obtain a simulated vibration waveform diagram; wherein the simulated vibration waveform diagram is used to reflect information about the vibration amplitude and direction of the simulated vibration signal at different times;

[0020] Performing period segmentation on the vibration waveform diagram to obtain period data; wherein the period data is used to reflect the data of the vibration waveform diagram in the first period;

[0021] Performing period segmentation on the simulated vibration waveform to obtain simulated period data; wherein the simulated period data is used to reflect the data of the simulated vibration waveform in the first period;

[0022] Similarity information is obtained by analyzing the periodic data and the simulated periodic data.

[0023] In a possible implementation manner of the first aspect, the obtaining similarity information by analyzing the periodic data and the simulated periodic data includes:

[0024] The periodic data is trend segmented to obtain a trend set; wherein the trend set is used to reflect the collection of rising data and falling data in the periodic data;

[0025] Analyze the trend set to obtain a first rising variance and a first falling variance; wherein the first rising variance is used to reflect the variance of rising data in the trend set, and the first falling variance is used to reflect the variance of falling data in the trend set;

[0026] The simulated periodic data is trend segmented to obtain a simulated trend set; wherein the simulated trend set is used to reflect the set of rising data and falling data in the simulated periodic data;

[0027] Analyze the simulated trend set to obtain a second rising variance and a second falling variance; wherein the second rising variance is used to reflect the variance of rising data in the simulated trend set, and the second falling variance is used to reflect the variance of falling data in the simulated trend set;

[0028] Compare the first rising variance with the second rising variance to obtain a rising variance ratio; wherein the rising variance ratio is used to reflect the ratio of the first rising variance to the second rising variance;

[0029] Comparing the first decreasing variance with the second decreasing variance to obtain a decreasing variance ratio; wherein the decreasing variance ratio is used to reflect the ratio of the first decreasing variance to the second decreasing variance;

[0030] Similarity information is obtained by analyzing the ascending variance ratio and the descending variance ratio.

[0031] In a possible implementation manner of the first aspect, the performing analysis according to the ascending variance ratio and the descending variance ratio to obtain similarity information includes:

[0032] Performing a mean operation on the rising variance ratio and the falling variance ratio to obtain a variance mean;

[0033] The variance mean is confirmed as similarity information.

[0034] In a possible implementation manner of the first aspect, the obtaining maintenance information by analyzing the similarity information, the mold parameters, and the production data includes:

[0035] When the similarity information is less than or equal to a threshold, obtaining first maintenance information of the maintenance information; wherein the first maintenance information is used to reflect that the wire drawing die is replaced;

[0036] And / or, when the similarity information is greater than the threshold, the second maintenance information of the maintenance information is obtained by analyzing the similarity information, the mold parameters and the production data; wherein the second maintenance information is used to reflect the working time of adjusting the wire drawing mold.

[0037] In a possible implementation manner of the first aspect, the obtaining the second maintenance information of the maintenance information by analyzing according to the similarity information, the mold parameters, and the production data includes:

[0038] The remaining life of the die is obtained by analyzing the similarity information, the die parameters and the production data; wherein the remaining life of the die is used to reflect the maximum working time that the wire drawing die can withstand;

[0039] The second maintenance information of the maintenance information is obtained by analyzing the remaining life of the mold.

[0040] In a possible implementation manner of the first aspect, the obtaining the remaining life of the mold by analyzing according to the similarity information, the mold parameters, and the production data includes:

[0041] Analyze the similarity information to obtain the degree of wear; wherein the degree of wear is used to reflect the degree of loss of the die area of ​​the wire drawing die due to the friction of the copper wire;

[0042] An initial roundness value, an initial area and a worn roundness value are obtained by analyzing the die parameters; wherein the initial roundness value is used to reflect the roundness value of the inner circle of the wire drawing die when it is not worn, the initial area is used to reflect the area of ​​the inner circle of the wire drawing die when it is not worn, and the worn roundness value is used to reflect the inner roundness value of the wire drawing die after it is worn;

[0043] The remaining life of the mold is obtained by analyzing the wear degree, the initial roundness value, the initial area, the wear roundness value and the production data.

[0044] In a possible implementation manner of the first aspect, analyzing the wear degree, the initial roundness value, the initial area, the wear roundness value, and the production data to obtain the remaining life of the mold includes:

[0045] Obtaining cumulative working time from the historical working time in the production data; wherein the cumulative working time is used to reflect the total working time of the wire drawing device;

[0046] The wear amount is obtained by analyzing the wear degree and the initial area; wherein the wear amount is used to reflect the increase in the inner diameter of the wire drawing die due to the friction force of the copper wire;

[0047] Analyze the wear amount and the cumulative working time to obtain a wear rate;

[0048] The remaining life of the mold is obtained by analyzing the wear rate, the initial roundness value and the worn roundness value.

[0049] In a possible implementation of the first aspect, analyzing according to the wear rate, the initial roundness value, and the worn roundness value to obtain the remaining life of the mold includes:

[0050] The roundness difference is obtained by comparing the initial roundness value with the worn roundness value; wherein the roundness difference is used to reflect the difference between the roundness value of the inner circle of the wire drawing die before wear and the roundness value of the inner circle after wear;

[0051] The wear allowance is obtained by comparing the roundness difference with the preset roundness difference; wherein the wear allowance is used to reflect the maximum allowable wear area that the wire drawing die can still accept;

[0052] The remaining life of the mold is obtained by processing the wear allowance and the wear rate.

[0053] In a second aspect, an embodiment of the present application provides a bare copper wire manufacturing control system, including:

[0054] The first acquisition module is used to acquire manufacturing information; wherein the manufacturing information includes production data and mold parameters, the production data is used to reflect the drawing speed and historical working time of the wire drawing device during production, and the mold parameters are used to reflect the initial size characteristics and current size characteristics of the wire drawing mold of the wire drawing device.

[0055] The second acquisition module is used to acquire a vibration signal; wherein the vibration signal is used to reflect the change in the vibration amplitude of the wire drawing die in the time domain during the current production process.

[0056] The first analysis module is used to analyze the vibration signal and the manufacturing information to obtain similarity information; wherein the similarity information is used to reflect the similarity between the mechanical vibration generated by the wire drawing die working under the initial size characteristics and the mechanical vibration generated by the wire drawing die working under the current size characteristics.

[0057] The second analysis module is used to analyze the similarity information, the die parameters and the production data to obtain maintenance information; wherein the maintenance information is used to reflect the maintenance timing of the wire drawing die in the wire drawing device.

[0058] In a third aspect, an embodiment of the present application provides a bare copper wire manufacturing device, comprising a wire drawing device and a control device, wherein the wire drawing device is electrically connected to the control device, and the control device comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements a method as described in any one of the first aspects above.

[0059] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method described in any one of the first aspects above is implemented.

[0060] In a fifth aspect, an embodiment of the present application provides a computer program. When the computer program is run on a bare copper wire manufacturing device, the bare copper wire manufacturing device executes the bare copper wire manufacturing control method described in any one of the above-mentioned first aspects.

[0061] It can be understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0063] Figure 1 It is a flow chart of a bare copper wire manufacturing control method provided by an embodiment of the present application;

[0064] Figure 2 This is a schematic diagram of the implementation process of a bare copper wire manufacturing control method provided in one embodiment of the present application;

[0065] Figure 3 It is a structural schematic diagram of a bare copper wire manufacturing control system provided by an embodiment of the present application;

[0066] Figure 4 It is a structural schematic diagram of a control device for bare copper wire manufacturing equipment provided in one embodiment of the present application. DETAILED DESCRIPTION

[0067] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0068] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0069] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0070] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0071] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0072] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0073] In the related art, the production of bare copper wire requires the copper billet to be drawn into a bare copper wire of the required size through a wire drawing die. During the drawing process, the wire drawing die (wear parts) will generate friction with the copper wire and cause the wear and tear of the wire drawing die, which will eventually cause the quality of the copper wire to deteriorate. In the actual production process, many factories will use the MES system to detect the working time of the wear parts in real time, and then use the difference between the expected working time and the working time of the wear parts as the remaining working time of the wear parts, and finally adjust the maintenance plan that has been formulated according to the remaining working time. However, due to different production environments for wear parts (for example, a sudden rise or fall in ambient temperature) or production problems in the production of wear parts (for example, insufficient purity of production materials, improper handling of production materials), the expected working time of the wear parts may change, which in turn causes the remaining working time obtained based on the difference between the expected working time and the working time to be inaccurate, and ultimately causes the remaining working time of the wear parts to be unable to accurately guarantee the smooth progress of the already formulated production plan. Therefore, the maintenance plan formulated according to the working time and expected working time of the wear parts cannot fully meet the production requirements of the wire drawing device. When the remaining working time of the wear parts is still remaining but the wear parts can no longer support the production needs of manufacturing high-quality bare copper wire, the quality of the bare copper wire will be reduced.

[0074] To solve the above problems, the embodiment of the present application provides a bare copper wire manufacturing control method and device. In the method, first, by obtaining production data reflecting the drawing speed and historical working time of the wire drawing device during production, and obtaining mold parameters reflecting the initial size characteristics and current size characteristics of the wire drawing die of the wire drawing device, the production data and the mold parameters are used as manufacturing information, and then a vibration signal reflecting the change of the vibration amplitude of the wire drawing die in the time domain during the current production process is obtained, and then the vibration signal and the manufacturing information are analyzed to obtain similarity information reflecting the similarity between the mechanical vibration generated by the wire drawing die under the initial size characteristics and the mechanical vibration generated under the current size characteristics, and the similarity information is used to judge and obtain the first maintenance information reflecting the replacement of the wire drawing die, and the similarity information, the mold parameters and the production data are analyzed to obtain the second maintenance information reflecting the adjustment of the working time of the wire drawing die, and finally the first maintenance information and the second maintenance information are confirmed as maintenance information reflecting the maintenance timing of the wire drawing die in the wire drawing device.

[0075] The bare copper wire manufacturing control method provided in the embodiment of the present application can be applied to bare copper wire manufacturing equipment. In this case, the bare copper wire manufacturing equipment is the executor of the bare copper wire manufacturing control method provided in the embodiment of the present application. The embodiment of the present application does not impose any restrictions on the specific type of bare copper wire manufacturing equipment.

[0076] The bare copper wire manufacturing equipment includes a wire drawing device and a control device. The wire drawing device is electrically connected to the control device. The wire drawing device is used to draw the copper billet into a bare copper wire of set specifications. The wire drawing device includes a wire drawing mechanism, a driving mechanism and a vibration detection mechanism. The wire drawing mechanism is used to gradually draw the copper wire or copper billet into a thin wire of a required diameter through a wire drawing die. The wire drawing mechanism includes a wire payer, a wire drawing die and a guide. The wire payer is used to store the thick copper wire or copper wire reel to be processed to ensure that the wire can be smoothly and continuously supplied to the wire drawing die. For example, the wire payer can be a single-column payer or a gantry payer. The wire drawing die is used to provide a channel with a gradually reduced aperture to the copper billet or group copper wire to reduce the cross-sectional size of the copper billet or thick copper wire. For example, the wire drawing die can be a carbide die or a natural diamond die. The guide is used to guide the copper billet or thick copper wire to enter the wire drawing mechanism according to a predetermined path and the copper wire to be transmitted out of the wire drawing mechanism according to a predetermined path to prevent the copper billet and the copper wire from deviating or getting stuck in the wire drawing mechanism. For example, the guide can be a guide wheel, a guide ring, etc. The driving mechanism is used to provide power to the wire drawing mechanism. For example, the driving mechanism can be a battery, a generator or a DC power supply. The vibration detection mechanism is used to monitor the vibration of the wire drawing die. For example, the vibration detection mechanism can be a speed sensor or a displacement sensor. The vibration detection mechanism is fixed near the outlet of the wire drawing die by a special mounting bracket or adhesive (it will not affect the normal production of bare copper wire). The control device is used to supervise and control the bare copper wire drawing process.

[0077] For example, the control device can be a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a smart large screen, a smart TV, a handheld device with wireless communication function, a desktop computer, a handheld device with wireless communication function, a computer, a laptop computer, a handheld computing device, etc.

[0078] In order to better understand the bare copper wire manufacturing control method provided in the embodiment of the present application, the specific implementation process of the bare copper wire manufacturing control method provided in the embodiment of the present application is exemplarily introduced below.

[0079] Figure 1 and Figure 2 A schematic flow chart of the bare copper wire manufacturing control method provided in the embodiment of the present application is shown. Figure 1 and Figure 2 , bare copper wire manufacturing control methods include:

[0080] S100, obtaining manufacturing information; wherein the manufacturing information includes production data and mold parameters, the production data is used to reflect the drawing speed and historical working time of the wire drawing device during production, and the mold parameters are used to reflect the initial size characteristics and current size characteristics of the wire drawing mold of the wire drawing device.

[0081] It can be understood that in the process of producing bare copper wire, the wire needs to enter the wire drawing device at a preset speed. The preset speed is the wire drawing speed. The historical working time refers to the cumulative running time of the wire drawing die since it was first put into use. The initial dimensional characteristics refer to the diameter, taper angle and other parameters of the die hole before the wire drawing die is put into use. The current dimensional characteristics refer to the diameter, taper angle and thickness of the die hole after the dimensional characteristics of the wire drawing die change after use.

[0082] Exemplarily, the wire drawing speed and historical working time can be obtained by manual input. The wire drawing speed and historical working time can also be obtained through a speed database. The speed database refers to a database containing the preset speeds corresponding to different copper wire sizes and the historical working time of the wire drawing die. These data can be obtained by laboratory experiments, on-site measurements and monitoring, and past experience. After obtaining, the collected data will be sorted, classified and archived, useful information and rules will be extracted, and the relevant data will be saved in the database to form a speed database. The historical working time can also be directly obtained through the work record library. The work record library refers to an information library containing the time of the work production of the wire drawing die. These data can be obtained by on-site measurements and monitoring and past experience. After obtaining, the collected data will be sorted, classified and archived, useful information and rules will be extracted, and the relevant data will be saved in the database to form a work record library. The aperture of the wire drawing die can be directly measured by a vernier caliper to obtain the die parameters. The die parameters can also be directly obtained by scanning the die aperture with a laser beam using a laser diameter gauge. And so on, but not limited to this.

[0083] S200, obtaining a vibration signal; wherein the vibration signal is used to reflect the change in the vibration amplitude of the wire drawing die in the time domain during the current production process.

[0084] It can be understood that when producing bare copper wire, as the wire continuously enters the wire drawing die and is drawn to the specified size, vibration will be generated due to the continuous squeezing of the wire and the wire drawing die. The time domain is composed of the time axis and the amplitude axis. The horizontal axis of the time domain represents time, and the vertical axis represents the amplitude of vibration.

[0085] For example, the displacement change of the drawing die surface can be detected by a displacement sensor and a vibration signal can be obtained. The laser Doppler effect can also be used to detect the surface vibration of the drawing die to obtain a vibration signal. The laser Doppler effect refers to the principle of the Doppler effect, using a laser velocity sensor to measure the movement speed of the surface vibration of the drawing die, and then simulating the movement speed of the surface vibration of the drawing die to finally obtain a vibration signal. The Doppler effect refers to the phenomenon that when there is relative motion between the drawing die and the laser velocity sensor, the frequency of the wave received by the laser velocity sensor changes.

[0086] S300, analyzing the vibration signal and the manufacturing information to obtain similarity information; wherein the similarity information is used to reflect the similarity between the mechanical vibration generated by the wire drawing die working under the initial size characteristics and the mechanical vibration generated by the wire drawing die working under the current size characteristics.

[0087] It can be understood that due to the accumulation of working time of the wire drawing die, there will be irreversible differences between the initial vibration signal of the wire drawing die and the vibration signal after it has participated in multiple production tasks, and the difference between the initial vibration signal and the vibration signal after it has participated in multiple production tasks will gradually increase. Therefore, by analyzing the similarity between the two signals, the usage of the wire drawing die can be judged.

[0088] Exemplarily, the ability of the wire drawing die to resist vibration during the production process can be obtained by analyzing the manufacturing information, and the wire drawing speed of the manufacturing information and the ability of the wire drawing die to resist vibration during the production process can be analyzed to obtain the change of the vibration amplitude in the time domain during the production process before the wire drawing die is worn. The change of the vibration amplitude in the time domain in the current production process obtained by the wire drawing die is analyzed with the change of the vibration amplitude in the time domain in the production process before the wire drawing die is worn, and finally the similarity information is obtained. The similarity information can also be obtained by training and establishing an analysis model. That is, the vibration signal and the manufacturing information are input into the analysis model, and the analysis model outputs the corresponding similarity information. The training process of the analysis model can be performed by analyzing the vibration signal and the manufacturing information and the corresponding similarity information as the training data set of the analysis model, and then the training data set of the analysis model is input into the analysis model for training and learning, and finally the analysis model is obtained.

[0089] In a possible implementation, in step S300, similarity information is obtained by analyzing the vibration signal and the manufacturing information, including:

[0090] S310, performing feature analysis on the die parameters to obtain a stiffness value; wherein the stiffness value is used to reflect the ability of the wire drawing die to resist vibration during the production process.

[0091] It can be understood that by analyzing the mold parameters, the geometric characteristics of the diameter and taper angle of the mold hole of the wire drawing mold are determined, and a three-dimensional model of the wire drawing mold is established through the modeling software. Then, by importing the three-dimensional model of the wire drawing mold into the analysis software (for example, ANSYS, ABAQUS, etc.), the three-dimensional model of the wire drawing mold is analyzed to obtain the deformation of the wire drawing mold under force, and finally the stiffness value is obtained through stiffness calculation. The formula for stiffness calculation can be K=F÷X, where K is the stiffness value, F is the applied force, and X is the displacement.

[0092] For example, if the diameter of the die hole of the wire drawing die is 5 mm and the taper angle is 6°, and the displacement of the wire drawing die is 0.1 mm when the applied force is 100 N, then the stiffness value is 1000 N / mm; if the diameter of the die hole of the wire drawing die is 6 mm and the taper angle is 6°, and the displacement of the wire drawing die is 0.05 mm when the applied force is 100 N, then the stiffness value is 2000 N / mm; if the diameter of the die hole of the wire drawing die is 5 mm and the taper angle is 7°, and the displacement of the wire drawing die is 0.1 mm when the applied force is 200 N, then the stiffness value is 2000 N / mm, and so on, but not limited to this.

[0093] S320, analyzing the drawing speed and stiffness value of the manufacturing information to obtain a simulated vibration signal; wherein the simulated vibration signal is used to reflect the change in the vibration amplitude in the time domain during the production process before the drawing die is worn.

[0094] It can be understood that different drawing speeds correspond to a vibration signal at different stiffness values. The vibration equation can be used to simulate the change in the displacement of the drawing die over time, thereby generating a simulated vibration signal. The displacement of the drawing die can be directly simulated by the vibration equation, and the vibration equation can be: m(dV÷dt)+KX=0, where m is the mass of the drawing die, X is the displacement, K is the stiffness value, V is the drawing speed, and t is the passing time. The mass of the drawing die refers to the weight of the entire drawing die. The mass of the drawing die can be obtained through manual input, and the passing time can be obtained by comparing the drawing speed with the die thickness.

[0095] S330, processing the vibration signal and the simulated vibration signal to obtain similarity information.

[0096] It can be understood that by plotting the vibration signal, a graph reflecting the vibration amplitude and direction of the vibration signal at different times is obtained, and then by plotting the simulated vibration signal, a graph reflecting the vibration amplitude and direction of the simulated vibration signal at different times is obtained, and similarity information is obtained by analyzing the vibration data of the vibration signal in the first period and the vibration data of the simulated vibration signal in the first period. The first period refers to the time required for the vibration signal to complete a complete oscillation. It is also possible to process the signal vectors of the vibration signal and the simulated vibration signal at the same time to obtain the Euclidean distance, and then finally obtain the similarity information through the Euclidean distance value and the similarity interval set. The calculation formula of the Euclidean distance can be: Where D is the Euclidean distance, X i is the signal vector in the vibration signal, Y iTo simulate the signal vector in the vibration signal, the similarity interval set includes multiple similarity intervals, and the similarity interval means that different Euclidean distances correspond to a similarity information. For example, if the similarity interval set is [(1, 2), (2, 3), (3, 4), (4, 5), (5, 6)], the similarity corresponding to the similarity interval (1, 2) is 90%, the similarity corresponding to the similarity interval (2, 3) is 80%, the similarity corresponding to the similarity interval (3, 4) is 70%, the similarity corresponding to the similarity interval (4, 5) is 60%, and the similarity corresponding to the similarity interval (5, 6) is 50%. When the Euclidean distance D is 4.5, the similarity information is 60%, when the Euclidean distance is 2.8, the similarity information is 80%, and so on, but not limited to this.

[0097] With this setting, through the analysis of stiffness value and vibration signal, the state of wire drawing die can be monitored and evaluated in real time, so that the wire drawing equipment can be maintained in the production of high-quality bare copper wire, reducing failure and maintenance costs, and ensuring the safety of the production process.

[0098] In a possible implementation, in step S330, the vibration signal and the simulated vibration signal are processed to obtain similarity information, including:

[0099] S331, plotting the vibration signal to obtain a vibration waveform diagram; wherein the vibration waveform diagram is used to reflect information about the vibration amplitude and direction of the vibration signal at different moments.

[0100] It can be understood that the corresponding amplitude value in the vibration signal can be extracted by performing a fast Fourier transform on the vibration signal, and then the vibration signal can be converted into a vibration waveform diagram. Fast Fourier transform (FFT) refers to an efficient algorithm for calculating discrete Fourier transform (DFT). Discrete Fourier transform (DFT) refers to the conversion of discrete signals from the time domain to the frequency domain in signal processing and digital signal analysis. It is also possible to obtain a vibration waveform diagram by directly drawing the vibration signal according to the parameters of the vibration signal (e.g., amplitude, time series, etc.) by calling the matplotlib library using Python code. The matplotlib library is a Python drawing tool for creating static, animated, and interactive visualizations.

[0101] S332, plotting the simulated vibration signal to obtain a simulated vibration waveform diagram; wherein the simulated vibration waveform diagram is used to reflect information about the vibration amplitude and direction of the simulated vibration signal at different moments.

[0102] It is understood that the analog vibration signal can be subjected to fast Fourier transform to extract the corresponding amplitude value in the analog vibration signal, and then the analog vibration signal can be converted into a simulated vibration waveform graph. The analog vibration signal can also be directly plotted to obtain a simulated vibration waveform graph by calling the matplotlib library using Python code according to the parameters of the vibration signal (e.g., amplitude, time series, etc.).

[0103] S333, performing period segmentation on the vibration waveform to obtain period data; wherein the period data is used to reflect the data of the vibration waveform in the first period.

[0104] It can be understood that the periodic data is data that reflects the failure of the wire drawing die to undergo deeper wear. Because the wire drawing die is constantly worn during the production process, the stiffness value of the wire drawing die slowly decreases, which leads to a decrease in the ability of the wire drawing die to resist the vibration generated by the force exerted by the wire on the wire drawing die. It can be explained that as the working time accumulates, the amplitude of the vibration waveform will increase. In the entire vibration waveform, the vibration data in the first cycle of the vibration waveform is the periodic data. Periodic segmentation refers to segmenting the vibration waveform according to the zero crossing frequency to form multiple periodic vibration graphs, and then extracting the vibration data of the first cycle from the multiple periodic vibration graphs, that is, the periodic data. The zero crossing frequency refers to the number of times the vibration waveform crosses the zero point. If the number of times the zero point is crossed is 2, it means that the period of the vibration waveform is the time to cross the zero point twice. The segmentation order of period segmentation can be based on the time sequence as the separation order. The periodic vibration graph refers to the graph within a single cycle range in the vibration waveform.

[0105] S334, performing period segmentation on the simulated vibration waveform to obtain simulated period data; wherein the simulated period data is used to reflect the data of the simulated vibration waveform in the first period.

[0106] It can be understood that the simulated periodic data can be obtained in a manner similar to the periodic data obtained in step S333, that is, after the simulated vibration waveform is divided into periods, the data in the first period of the vibration waveform is extracted as the simulated periodic data.

[0107] S335, analyzing the periodic data and the simulated periodic data to obtain similarity information.

[0108] It can be understood that there are data sets with different trends in the periodic data and the simulated periodic data. The variance between the data sets with different trends can be obtained by analyzing the variance between the periodic data and the data sets with corresponding trends in the simulated periodic data, and then the similarity information between the periodic data and the simulated periodic data can be finally obtained based on the variance between the data sets with different trends. The Pearson correlation coefficient between the periodic data and the simulated periodic data can also be calculated as the similarity information. The Pearson correlation coefficient is a statistic used to measure the linear relationship between the periodic data and the simulated periodic data. The calculation formula of the Pearson correlation coefficient can be: Where r is the Pearson correlation coefficient, is the average value of the periodic data, is the average value of the simulated periodic data, A i is the data at different times in the periodic data, B i is the data at different times in the simulated periodic data. For example, if the periodic data is (1, 2, 3, 2, 1) and the simulated periodic data is (2, 3, 4, 3, 2), the Pearson correlation coefficient is 0.357; if the periodic data is (1, 3, 5, 3, 1) and the simulated periodic data is (2, 4, 6, 4, 2), the Pearson correlation coefficient is 0.0893, and so on, but not limited thereto.

[0109] With this arrangement, the performance monitoring of the wire drawing die can be significantly improved through the graphical analysis, periodicity analysis and similarity comparison of the vibration signal and the simulated vibration signal. The wear state of the wire drawing die can be effectively monitored and predicted, thereby significantly improving the safety and economy of production.

[0110] In a possible implementation, in step S335, similarity information is obtained by analyzing the periodic data and the simulated periodic data, including:

[0111] S3351, segment the periodic data into trends to obtain a trend set; wherein the trend set is used to reflect the collection of rising data and falling data in the periodic data.

[0112] It can be understood that trend segmentation refers to segmenting periodic data according to the monotonicity of periodic data as a separation condition, and finally obtaining a trend set. Monotonicity means that in periodic data, as time increases, periodic data has a certain trend of change, that is, continuous increase (monotonically increasing) or continuous decrease (monotonically decreasing), and there will be no situation where periodic data increases first and then decreases, or periodic data decreases first and then increases. Rising data is monotonically increasing data in periodic data, and falling data is monotonically decreasing data in periodic data.

[0113] For example, if the periodic data is (1, 2, 3, 4, 5, 6, 5, 4, 3, 2, 1, 0, -1, -2), then the rising data in the trend concentration is (1, 2, 3, 4, 5, 6), the falling data in the trend concentration is (6, 5, 4, 3, 2, 1, 0, -1, -2), and so on.

[0114] S3352, analyzing the trend set to obtain a first rising variance and a first falling variance; wherein the first rising variance is used to reflect the variance of rising data in the trend set, and the first falling variance is used to reflect the variance of falling data in the trend set.

[0115] It can be understood that the variance operation is performed on the rising data and the falling data in the trend set respectively to obtain the first rising variance and the first falling variance. The variance operation refers to the degree of deviation of the rising data in the trend set from the average value of the rising data (or the degree of deviation of the falling data in the trend set from the average value of the falling data). The calculation formula of the variance operation can be: Among them, σ is the variance, n is the number of rising or falling data in the trend set, and a i For trend concentration rising or falling data, It is the average value of rising or falling data in the trend set.

[0116] Exemplarily, when the trend set is [(1, 2, 3, 4, 5, 6), (6, 5, 4, 3, 2, 1, 0, -1, -2)], the first rising variance is 1.848, the first falling variance is 2.582, and so on.

[0117] S3353, performing trend segmentation on the simulated periodic data to obtain a simulated trend set; wherein the simulated trend set is used to reflect the set of rising data and falling data in the simulated periodic data.

[0118] It can be understood that trend segmentation refers to segmenting the simulated periodic data according to the monotonicity of the simulated periodic data as a separation condition, and finally obtaining a simulated trend set. Monotonicity means that in the simulated periodic data, as time increases, the simulated periodic data has a certain change trend, that is, continuous increase (monotonically increasing) or continuous decrease (monotonically decreasing), and there will be no situation where the simulated periodic data increases first and then decreases, or the simulated periodic data decreases first and then increases. Rising data refers to monotonically increasing data in the simulated periodic data, and falling data refers to monotonically decreasing data in the simulated periodic data.

[0119] For example, if the simulated periodic data is (1, 3, 4, 6, 8, 6, 4, 3, 1, -1, -2), then the rising data in the simulated trend set is (1, 3, 4, 6, 8), the falling data in the simulated trend set is (8, 6, 4, 3, 1, -1, -2), and so on.

[0120] S3354, analyzing the simulated trend set to obtain a second rising variance and a second falling variance; wherein the second rising variance is used to reflect the variance of rising data in the simulated trend set, and the second falling variance is used to reflect the variance of falling data in the simulated trend set.

[0121] It can be understood that the variance operation is performed on the rising data and the falling data in the simulated trend set respectively to obtain the second rising variance and the second falling variance. The variance operation refers to the degree of deviation of the rising data in the simulated trend set from the average value of the rising data (or the degree of deviation of the falling data in the simulated trend set from the average value of the falling data). The calculation process of the variance operation can be similar to the first rising variance and the first falling variance obtained in step S3352 to obtain the second rising variance and the second falling variance, which will not be repeated here.

[0122] For example, if the simulated trend set is [(1, 3, 4, 6, 8), (8, 6, 4, 3, 1, -1, -2)], the second rising variance is 2.417, the second falling variance is 3.369, and so on.

[0123] S3355, comparing the first rising variance with the second rising variance to obtain a rising variance ratio; wherein the rising variance ratio is used to reflect the ratio of the first rising variance to the second rising variance.

[0124] It can be understood that by comparing the variance of the rising data in the trend set with the variance of the rising data in the simulated trend set, the rising variance ratio is obtained. By using the rising variance ratio, the rising similarity between the periodic data and the simulated periodic data can be judged. If the rising variance ratio is close to 1, it means that the rising fluctuation characteristics between the vibration waveform and the simulated vibration waveform are very similar; if the rising variance ratio deviates from 1 to a large extent, it can be said that the rising fluctuation characteristics between the vibration waveform and the simulated vibration waveform are quite different. The rising similarity refers to the similarity between the monotonically increasing data of the periodic data and the simulated periodic data in the first cycle. VR1=σ a1 ÷σ b1 , where VR1 refers to the rise variance ratio, σ a1 is the first ascent variance, σ b1 It refers to the second rise variance.

[0125] For example, if the first rising variance is 1.848 and the second rising variance is 2.417, the rising variance ratio is 0.765 (1.848÷2.417); if the first rising variance is 1.637 and the second rising variance is 2.492, the rising variance ratio is 0.657 (1.637÷2.492), and so on.

[0126] S3356, comparing the first decreasing variance with the second decreasing variance to obtain a decreasing variance ratio; wherein the decreasing variance ratio is used to reflect the ratio of the first decreasing variance to the second decreasing variance.

[0127] It can be understood that by comparing the variance of the decreasing data in the trend set with the variance of the decreasing data in the simulated trend set, the decreasing variance ratio is obtained. By using the decreasing variance ratio, the decreasing similarity between the periodic data and the simulated periodic data can be judged. If the decreasing variance ratio is close to 1, it means that the decreasing fluctuation characteristics between the vibration waveform and the simulated vibration waveform are very similar; if the decreasing variance ratio deviates from 1 to a large extent, it means that the decreasing fluctuation characteristics between the vibration waveform and the simulated vibration waveform are quite different. The decreasing similarity refers to the similarity between the monotonically decreasing data of the periodic data and the simulated periodic data in the first cycle. VR2=σ a2 ÷σ b2 , where VR2 refers to the variance reduction ratio, σ a2 is the first descent variance, σ b2 is the second descent variance.

[0128] For example, if the first drop variance is 2.582 and the second drop variance is 3.369, the drop variance ratio is 0.766 (2.582÷3.369); if the first drop variance is 2.637 and the second drop variance is 3.492, the drop variance ratio is 0.755 (2.637÷3.492), and so on.

[0129] S3357: Analyze the ascending variance ratio and the descending variance ratio to obtain similarity information.

[0130] It can be understood that the average value between the rising variance ratio and the falling variance ratio can be calculated and the average value can be confirmed as similarity information. The rising variance ratio indicates the similarity of the rising fluctuation characteristics between the vibration waveform and the simulated vibration waveform, and the falling variance ratio indicates the similarity of the falling fluctuation characteristics between the vibration waveform and the simulated vibration waveform. By calculating the average value of the rising variance ratio and the falling variance ratio, the similarity of the fluctuation characteristics between the vibration waveform and the simulated vibration waveform under different trends can be evaluated. Similarity information can also be obtained by training a similarity model. That is, the rising variance ratio and the falling variance ratio are input into the analysis model, and the analysis model outputs the corresponding similarity information. The training process of the similarity model can be performed by analyzing the rising variance ratio and the falling variance ratio and processing the corresponding similarity information as the training data set of the similarity model, and then the training data set of the similarity model is input into the similarity model for training and learning, and finally the similarity model is obtained.

[0131] With this setting, the difference between the vibration signal and its simulated vibration signal can be effectively captured through trend segmentation and variance analysis of periodic data. This can improve the monitoring capability of the wear state of the wire drawing die, and provide scientific analysis data for fault diagnosis, maintenance decision-making and production management, thereby improving the production safety of bare copper wire.

[0132] In a possible implementation, in step S3357, similarity information is obtained by analyzing the ascending variance ratio and the descending variance ratio, including:

[0133] S33571, perform mean operation on the rising variance ratio and the falling variance ratio to obtain the variance mean.

[0134] It can be understood that the calculation formula for the mean variance can be: VR=(VR1+VR2)÷2, where VR is the mean variance, VR1 is the rising variance ratio, and VR2 is the falling variance ratio.

[0135] For example, if the rising variance ratio is 0.765 and the falling variance ratio is 0.766, the mean variance is 0.7655 [(0.765+0.766)÷2], if the rising variance ratio is 0.657 and the falling variance ratio is 0.755, the mean variance is 0.706 [(0.657+0.755)÷2], and so on.

[0136] S33571, confirm the variance mean as similarity information.

[0137] It can be understood that by calculating the mean of the variance, the similarity between the vibration waveform and the simulated vibration waveform can be measured. Variance can be used to describe the degree of dispersion of data points relative to the average value of the data points. By calculating the mean of the variance, it can be inferred whether the vibration waveform and the simulated vibration waveform have similar fluctuation patterns.

[0138] In this way, by performing mean calculation on the rising variance ratio and the falling variance ratio, the variance mean is used as similarity information, which can enhance the evaluation ability of the wear state of the wire drawing die. It can effectively convert complex data into concise data and more intuitively reflect the wear degree of the wire drawing die.

[0139] S400, analyzing the similarity information, the die parameters and the production data to obtain maintenance information; wherein the maintenance information is used to reflect the maintenance timing of the wire drawing die in the wire drawing device.

[0140] It can be understood that the similarity information can reflect the degree of wear of the wire drawing die. The degree of wear of the wire drawing die can be judged by the similarity. When the similarity is lower than or equal to a certain degree, it indicates that the wire drawing die can no longer support the subsequent production plan, and the wire drawing die needs to be replaced. When the similarity is greater than a certain degree, the remaining service life of the wire drawing die can be obtained by analyzing the similarity information, die parameters and production data. The remaining service life of the wire drawing die can be monitored in real time, and the wire drawing equipment can maintain the production demand of manufacturing high-quality bare copper wire.

[0141] A prediction model can also be established by selecting a suitable machine learning algorithm. The prediction model inputs similarity information, mold parameters and production data, and then outputs maintenance information of the wire drawing die. The types of prediction models include but are not limited to linear regression, decision tree, random forest and support vector machine (SVM) models. The training process of the prediction model can be to analyze the similarity information, mold parameters and production data and the corresponding maintenance information as the training data set of the prediction model, and then input the training data set of the prediction model into the prediction model for training and learning, and finally obtain the prediction model.

[0142] With such a setting, the degree of wear of the wire drawing die in the wire drawing device and the remaining service life of the wire drawing die can be detected in time, the wire drawing die can be replaced according to the degree of wear, and the remaining service life of the wire drawing die can be monitored in real time. There is no need to formulate a maintenance plan for the wire drawing equipment, and ultimately the wire drawing equipment can maintain the production needs of manufacturing high-quality bare copper wire.

[0143] In a possible implementation, in step S400, the maintenance information is obtained by analyzing the similarity information, the mold parameters and the production data, including:

[0144] S410, when the similarity information is less than or equal to the threshold, obtaining first maintenance information of the maintenance information; wherein the first maintenance information is used to reflect that the wire drawing die is replaced.

[0145] It can be understood that the threshold refers to a pre-set similarity threshold, which can be obtained by manual input or directly obtained through a threshold database. The threshold database refers to a database containing similarity thresholds corresponding to wire drawing dies of different specifications. These data can be obtained through laboratory experiments, on-site measurements and monitoring, and previous experience. After obtaining, the collected data will be sorted, classified and archived, useful information and rules will be extracted, and the relevant data will be saved in the database to form a threshold database. When the similarity information is lower than or equal to the threshold, it means that the wire drawing die is seriously worn. If the wire drawing die continues to be used for wire drawing, the wire drawing quality of the bare copper wire will be lower than expected. Secondly, the wire drawing die may also wear the die hole of the wire drawing die in a non-circular wear mode, for example, the die hole of the wire drawing die is a circle with a roundness of 98% and wears to an ellipse with a roundness of 89%. When the wire drawing die is worn in a non-circular wear mode, the similarity information will be significantly reduced to below the threshold, and the wire drawing die needs to be replaced to ensure that the wire drawing equipment can maintain the production needs of manufacturing high-quality bare copper wire.

[0146] In a possible implementation, in step S400, the maintenance information is obtained by analyzing the similarity information, the mold parameters and the production data, and further includes:

[0147] S420, when the similarity information is greater than a threshold, the second maintenance information of the maintenance information is obtained by analyzing the similarity information, the mold parameters and the production data; wherein the second maintenance information is used to reflect the working time of adjusting the wire drawing die.

[0148] It is understandable that the wire drawing die may wear the die hole of the wire drawing die in a normal circular wear pattern, for example, the average diameter of the die hole of the wire drawing die is worn from 5mm to an average diameter of 5.3mm. When the wire drawing die wears the wire drawing die in a normal circular wear pattern, the similarity information will decrease. When the similarity information is greater than the preset similarity, it means that the wear of the wire drawing die is relatively light and can support the subsequent production of bare copper wire. The similarity information, die parameters and production data can be analyzed to obtain the maximum working time that the wire drawing die can withstand. Based on the maximum working time that the wire drawing die can withstand, there is no need to formulate a maintenance plan for the wire drawing equipment, which ultimately enables the wire drawing equipment to maintain the production needs of manufacturing high-quality bare copper wire.

[0149] A decision model can also be established by selecting a suitable machine learning algorithm. The decision model inputs similarity information, mold parameters and production data, and then outputs the second maintenance information of the wire drawing die. The types of decision models include but are not limited to linear regression, decision tree, random forest and support vector machine (SVM) models. The training process of the decision model can be to analyze the similarity information, mold parameters and production data and the corresponding second maintenance information as the training data set of the decision model, and then input the training data set of the decision model into the decision model for training and learning, and finally obtain the decision model.

[0150] With this setting, the maintenance information of the wire drawing die is classified by similarity information, which can more comprehensively cover the different wear conditions in the production and manufacturing process of bare copper wire, so that targeted maintenance strategies can be adopted according to different wear conditions.

[0151] In a possible implementation, in step S420, the second maintenance information of the maintenance information is obtained by analyzing the similarity information, the mold parameters and the production data, including:

[0152] S421, analyzing the similarity information, mold parameters and production data to obtain the remaining life of the mold; wherein the remaining life of the mold is used to reflect the maximum working time that the wire drawing die can withstand.

[0153] It can be understood that by analyzing the similarity information, the degree of loss of the die area of ​​the wire drawing die due to the friction of the copper wire can be obtained, and then the die parameters can be analyzed to obtain the roundness value of the inner circle of the wire drawing die before and after wear, and the area of ​​the inner circle when the wire drawing die is not worn. Then, the roundness value of the inner circle before and after wear, the degree of wear, production data and the area of ​​the inner circle of the wire drawing die when it is not worn are analyzed to finally obtain the remaining life of the die.

[0154] A life analysis model can also be established by selecting a suitable machine learning algorithm. The life analysis model inputs similarity information, mold parameters and production data, and then outputs the remaining life of the wire drawing die. The types of life analysis models include but are not limited to linear regression, decision tree, random forest and support vector machine (SVM) models. The training process of the life analysis model can be to analyze the similarity information, mold parameters and production data and the corresponding data after data processing of the remaining life of the mold as the training data set of the life analysis model, and then input the training data set of the life analysis model into the life analysis model for training and learning, and finally obtain the life analysis model.

[0155] In a possible implementation, in step S421, the remaining life of the mold is obtained by analyzing the similarity information, mold parameters and production data, including:

[0156] S4211, analyzing based on the similarity information to obtain the degree of wear; wherein the degree of wear is used to reflect the degree of loss of the die area of ​​the wire drawing die due to the friction of the copper wire.

[0157] It can be understood that the degree of wear can be obtained by matching the similarity information with the preset degree interval. The preset degree interval includes multiple similarity intervals, and each similarity interval corresponds to a degree of wear. The preset degree interval can be manually input. The preset degree interval can also be directly obtained through the degree database. The degree database refers to a database containing the degree of wear of the wire drawing dies corresponding to different similarities. These data can be obtained through laboratory experiments, on-site measurements and monitoring, and past experience. After obtaining, the collected data will be sorted, classified and archived, useful information and rules will be extracted, and the relevant data will be saved in the database to form a degree database.

[0158] Exemplarily, if the preset degree interval can be [(0.7, 0.8), (0.8, 0.9), (0.9, 1)], the degree of wear corresponding to the similarity interval (0.7, 0.8) can be 3, the degree of wear corresponding to the similarity interval (0.8, 0.9) can be 2, and the degree of wear corresponding to the similarity interval (0.9, 1) can be 1. When the similarity information is 0.765, the degree of wear is 3, when the similarity information is 0.846, the degree of wear is 2, and so on.

[0159] S4212, analyze according to the mold parameters to obtain the initial roundness value, initial area and wear roundness value; among which, the initial roundness value is used to reflect the roundness value of the inner circle of the wire drawing die when it is not worn, the initial area is used to reflect the area of ​​the inner circle of the wire drawing die when it is not worn, and the wear roundness value is used to reflect the inner roundness value of the wire drawing die after it is worn.

[0160] It can be understood that the roundness value refers to the difference between the maximum and minimum values ​​of the distance from all points on the inner circle of the wire drawing die to the geometric center of the inner circle. The initial size characteristics of the wire drawing die can be analyzed to determine the diameter of the initial die hole of the wire drawing die, and then feature extraction is performed based on the diameter of the initial die hole to obtain the maximum diameter and minimum diameter of the initial die hole. The difference between the maximum diameter and the minimum diameter is calculated to finally obtain the initial roundness value of the wire drawing die. The average area is obtained by averaging the diameter of the initial size of the wire drawing die, and then the initial area of ​​the wire drawing die is calculated using the area formula. The area formula can be Where S is the initial area, The average diameter of the initial size is obtained by analyzing the current size characteristics of the wire drawing die, determining the diameter of the current die hole of the wire drawing die, and then extracting features based on the current die hole diameter to obtain the maximum and minimum diameters of the current die hole, and then performing a difference operation between the maximum and minimum diameters to finally obtain the wear roundness value of the wire drawing die.

[0161] S4213, the remaining life of the mold is obtained by analyzing the wear degree, initial roundness value, initial area, wear roundness value and production data.

[0162] It can be understood that the historical working time in the production data can be analyzed to obtain the total working time of the wire drawing device, and then the wear degree and the initial area can be analyzed to obtain the increase in the inner circle area of ​​the wire drawing die due to the friction of the copper wire. The increase in the inner circle diameter of the wire drawing die due to the friction of the copper wire and the total working time of the wire drawing device can be analyzed to obtain the wear rate of the wire drawing die. The wear rate of the wire drawing die, the initial roundness value and the wear roundness value can be analyzed to finally obtain the remaining service life of the die.

[0163] The remaining life of the die can also be obtained by establishing a residual analysis model. The residual analysis model inputs the degree of wear, the initial roundness value, the initial area, and the wear roundness value, and then outputs the remaining life of the die of the wire drawing die. The training process of the residual analysis model can be to train and learn the residual analysis model by analyzing the degree of wear, the initial roundness value, the initial area, and the wear roundness value and processing the corresponding remaining life of the die as the training data set of the residual analysis model, and finally obtain the residual analysis model.

[0164] Such a setting can improve the accuracy of judging the degree of wear of the wire drawing die, ensure the safety and reliability of bare copper wire production, and also provide basic data for processing decisions of the wire drawing die.

[0165] In a possible implementation, in step S4213, the remaining life of the mold is obtained by analyzing the wear degree, the initial roundness value, the initial area, the wear roundness value and the production data, including:

[0166] S42131, obtaining the cumulative working time from the historical working time in the production data; wherein the cumulative working time is used to reflect the total working time of the wire drawing device.

[0167] It is understandable that the cumulative working time can be obtained by accumulating the working time of multiple periods of historical working information in the production data. For example, if the historical working time is (8h, 7.5h, 9h, 11h), the cumulative working time is 35.5h (8+7.5+9+11), and so on.

[0168] S42132, analyzing the wear degree and the initial area to obtain the wear amount; wherein the wear amount is used to reflect the increase in the inner diameter of the wire drawing die due to the friction of the copper wire.

[0169] It can be understood that the wear area can be obtained by multiplying the wear degree and the initial area, and then the wear area can be converted into the wear amount by the area formula. The conversion formula can be Among them, s is the wear area and d is the wear amount.

[0170] For example, if the wear degree is 98% and the initial area is 3mm 2 , then the wear amount is 1.935mm, and so on.

[0171] S42133, analyze the wear amount and the accumulated working time to obtain the wear rate.

[0172] It can be understood that wear rate = wear amount ÷ cumulative working time. For example, if the wear amount is 3 mm and the cumulative working time is 300 h, the wear rate is 0.01 (3 ÷ 300) mm / h; if the wear amount is 2 mm and the cumulative working time is 40 h, the wear rate is 0.05 (2 ÷ 40) mm / h, and so on.

[0173] S42134, based on the wear rate, initial roundness value and worn roundness value, the remaining life of the mold is obtained.

[0174] It can be understood that the initial roundness value can be compared with the worn roundness value to obtain the difference between the roundness value of the inner circle of the drawing die before wear and the roundness value of the inner circle after wear, and then the difference between the roundness value of the inner circle of the drawing die before wear and the roundness value of the inner circle after wear can be compared with a pre-set roundness threshold to obtain the wear allowance.

[0175] The remaining life of the die can also be obtained by establishing a residual model. The residual model inputs the wear rate, the initial roundness value and the wear roundness value, and then outputs the remaining life of the die of the wire drawing die. The training process of the residual model can be to train and learn the residual model by analyzing the wear rate, the initial roundness value and the wear roundness value and processing the corresponding remaining life of the die as the training data set of the residual model, and finally obtain the residual analysis model.

[0176] Such a setting can provide empirical data for the remaining life evaluation of the wire drawing die through the cumulative working time, wear amount and wear rate, and can improve the scientific nature of the remaining life of the wire drawing die.

[0177] In a possible implementation, in step S42134, the remaining life of the mold is obtained by analyzing the wear rate, the initial roundness value, and the worn roundness value, including:

[0178] S421341, according to the comparison between the initial roundness value and the worn roundness value, the roundness difference is obtained; wherein the roundness difference is used to reflect the difference between the roundness value of the inner circle of the wire drawing die before wear and the roundness value of the inner circle after wear.

[0179] For example, if the initial roundness value is 0.04 mm and the worn roundness value is 0.05 mm, the roundness difference is 0.01 (0.05-0.04) mm; if the initial roundness value is 0.01 mm and the worn roundness value is 0.035 mm, the roundness difference is 0.025 (0.035-0.01) mm, and so on.

[0180] S421342, the wear allowance is obtained by comparing the roundness difference with the preset roundness difference; wherein the wear allowance is used to reflect the maximum allowable wear area that the wire drawing die can still accept.

[0181] It can be understood that the preset roundness difference refers to a preset roundness threshold. The preset roundness value can be obtained by manual input or directly obtained through a roundness database. The roundness database refers to an information base containing different roundness thresholds. These data can be obtained through on-site measurement and monitoring as well as past experience. After obtaining, the collected data will be sorted, classified and archived, useful information and rules will be extracted, and the relevant data will be saved in the database to form a roundness database. The wear allowance can be obtained by performing a difference operation between the preset roundness difference and the roundness difference.

[0182] For example, if the preset roundness difference is 0.02 mm, the roundness difference is 0.01 mm, the wear allowance is 0.01 (0.02-0.01) mm, the roundness difference is 0.018 mm, the wear allowance is 0.002 (0.02-0.018) mm, and so on.

[0183] S421343, based on the wear allowance and wear rate, the remaining life of the mold is obtained.

[0184] It can be understood that the remaining life of the mold = wear allowance ÷ wear rate.

[0185] For example, if the wear allowance is 3 mm and the wear rate is 0.01 mm / h, the remaining life of the mold is 300 (3÷0.01) h. If the wear allowance is 2 mm and the wear rate is 0.05 mm / h, the remaining life of the mold is 40 (2÷0.05) h, and so on.

[0186] With this setting, the initial roundness value and the worn roundness value are compared to obtain the roundness difference, and the wear of the wire drawing die is quantified based on the roundness difference to obtain the wear allowance. Finally, the remaining life of the die is calculated by combining the wear allowance with the wear rate for analysis, thereby ensuring efficient management of the wire drawing die and monitoring the remaining service life of the wire drawing die.

[0187] S422, analyzing the remaining life of the mold to obtain second maintenance information.

[0188] It can be understood that the remaining working time of the wire drawing die needs to be controlled within the remaining life of the die, and the wire drawing die is monitored in real time according to the remaining life of the die, and there is no need to conduct regular inspection, maintenance and repair of the wire drawing die. For example, if the remaining life of the die is 30 hours, it means that the wire drawing die may still have 30 hours of stable working state. At this time, the production plan can be adjusted according to the remaining life of the die, or when the production plan cannot be adjusted, the wire drawing die can be replaced according to the production plan. That is, when the production plan that has been formulated requires continuous manufacturing for 40 hours, the wire drawing die may need to be replaced before starting the production plan, or when the production plan that has been formulated requires continuous manufacturing for 20 hours, there is no need to maintain the wire drawing die.

[0189] With such a setting, by real-time monitoring of the wear degree of the wire drawing die and obtaining the remaining life of the wire drawing die in real time, the accuracy of the wear degree assessment of the wire drawing die can be improved, the production safety during bare copper wire production can be more comprehensively improved, the economic loss of materials can be reduced, and the sustainable development of the enterprise can be promoted.

[0190] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0191] Corresponding to the bare copper wire manufacturing control method described in the above embodiment, the embodiment of the present application also provides a bare copper wire manufacturing control system, and each module of the bare copper wire manufacturing control system can implement each step of the bare copper wire manufacturing control method. Figure 3 A structural block diagram of a bare copper wire manufacturing control system provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0192] Reference Figure 3 , bare copper wire manufacturing control system includes:

[0193] The first acquisition module is used to acquire manufacturing information; wherein the manufacturing information includes production data and mold parameters, the production data is used to reflect the drawing speed and historical working time of the wire drawing device during production, and the mold parameters are used to reflect the initial size characteristics and current size characteristics of the wire drawing mold of the wire drawing device.

[0194] The second acquisition module is used to acquire a vibration signal; wherein the vibration signal is used to reflect the change in the vibration amplitude of the wire drawing die in the time domain during the current production process.

[0195] The first analysis module is used to analyze the vibration signal and the manufacturing information to obtain similarity information; wherein the similarity information is used to reflect the similarity between the mechanical vibration generated by the wire drawing die working under the initial size characteristics and the mechanical vibration generated by the wire drawing die working under the current size characteristics.

[0196] The second analysis module is used to analyze the similarity information, the die parameters and the production data to obtain maintenance information; wherein the maintenance information is used to reflect the maintenance timing of the wire drawing die in the wire drawing device.

[0197] It should be noted that the information interaction, execution process and other contents between the above-mentioned modules are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0198] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0199] The embodiment of the present application also provides a bare copper wire manufacturing device, including a wire drawing device and a control device, wherein the wire drawing device is electrically connected to the control device. Figure 4 This is a schematic diagram of the structure of a control device 4 provided in an embodiment of the present application. Figure 4As shown, the control device 4 of this embodiment includes: at least one processor 40 ( Figure 4 Only one is shown), at least one memory 41 ( Figure 4 Only one is shown) and a computer program 42 stored in the at least one memory 41 and executable on the at least one processor 40. When the processor 40 executes the computer program 42, the control device 4 implements the steps in any of the above-mentioned bare copper wire manufacturing control method embodiments, or the control device 4 implements the functions of each module / unit in the above-mentioned system embodiments.

[0200] Exemplarily, the computer program 42 may be divided into one or more modules / units, which are stored in the memory 41 and executed by the processor 40 to complete the present application. The one or more modules / units may be a series of computer program instruction segments capable of completing specific functions, which are used to describe the execution process of the computer program 42 in the electronic device 4.

[0201] The control device 4 may be a computing device such as a desktop computer, a notebook, a palm computer, etc. The control device 4 may include, but is not limited to, a processor 40 and a memory 41. Those skilled in the art will understand that Figure 4 It is only an example of the control device 4 and does not constitute a limitation on the control device 4. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access devices, buses, etc.

[0202] The processor 40 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0203] In some embodiments, the memory 41 may be an internal storage unit of the control device 4, such as a hard disk or memory of the control device 4. In other embodiments, the memory 41 may also be an external storage device of the control device 4, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the control device 4. Further, the memory 41 may also include both an internal storage unit and an external storage device of the control device 4. The memory 41 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as the program code of the computer program. The memory 41 may also be used to temporarily store data that has been output or is to be output.

[0204] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0205] An embodiment of the present application provides a computer program product. When the computer program product is run on a bare copper wire manufacturing device, the bare copper wire manufacturing device implements the steps in any of the above-mentioned method embodiments.

[0206] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. According to this understanding, the present application implements all or part of the process in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device that can carry the computer program code to the bare copper wire manufacturing equipment, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electrical carrier signal, telecommunication signal and software distribution medium. For example, a USB flash drive, a mobile hard disk, a disk or an optical disk.

[0207] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0208] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0209] In the embodiments provided in the present application, it should be understood that the disclosed bare copper wire manufacturing control system and equipment can be implemented in other ways. For example, the bare copper wire manufacturing control system embodiments described above are only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0210] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0211] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A bare copper wire manufacturing control method, characterized in that: include: Acquire manufacturing information; wherein the manufacturing information includes production data and die parameters, the production data is used to reflect the wire drawing speed and historical working time during the production of the wire drawing device, and the die parameters are used to reflect the initial size characteristics and current size characteristics of the wire drawing die of the wire drawing device; Acquire a vibration signal; wherein the vibration signal is used to reflect the change in the vibration amplitude of the wire drawing die in the time domain during the current production process; Analyze the vibration signal and the manufacturing information to obtain similarity information; wherein the similarity information is used to reflect the similarity between the mechanical vibration generated by the wire drawing die working under the initial size feature and the mechanical vibration generated by the wire drawing die working under the current size feature; Maintenance information is obtained by analyzing the similarity information, the die parameters and the production data; wherein the maintenance information is used to reflect the maintenance timing of the wire drawing die in the wire drawing device.

2. The bare copper wire manufacturing control method according to claim 1, characterized in that: The step of analyzing the vibration signal and the manufacturing information to obtain similarity information includes: Performing characteristic analysis on the die parameters to obtain a stiffness value; wherein the stiffness value is used to reflect the ability of the wire drawing die to resist vibration during the production process; Analyze the drawing speed and the stiffness value of the manufacturing information to obtain a simulated vibration signal; wherein the simulated vibration signal is used to reflect the change in the vibration amplitude in the time domain during the production process before the drawing die is worn; The vibration signal and the simulated vibration signal are processed to obtain similarity information.

3. The bare copper wire manufacturing control method according to claim 2, characterized in that: The step of processing the vibration signal and the simulated vibration signal to obtain similarity information includes: Plotting the vibration signal to obtain a vibration waveform diagram; wherein the vibration waveform diagram is used to reflect information about the vibration amplitude and direction of the vibration signal at different times; The simulated vibration signal is plotted to obtain a simulated vibration waveform diagram; wherein the simulated vibration waveform diagram is used to reflect information about the vibration amplitude and direction of the simulated vibration signal at different times; Performing period segmentation on the vibration waveform diagram to obtain period data; wherein the period data is used to reflect the data of the vibration waveform diagram in the first period; Performing period segmentation on the simulated vibration waveform to obtain simulated period data; wherein the simulated period data is used to reflect the data of the simulated vibration waveform in the first period; Similarity information is obtained by analyzing the periodic data and the simulated periodic data.

4. The bare copper wire manufacturing control method according to claim 3, characterized in that: The step of analyzing the periodic data and the simulated periodic data to obtain similarity information includes: The periodic data is trend segmented to obtain a trend set; wherein the trend set is used to reflect the collection of rising data and falling data in the periodic data; Analyze the trend set to obtain a first rising variance and a first falling variance; wherein the first rising variance is used to reflect the variance of rising data in the trend set, and the first falling variance is used to reflect the variance of falling data in the trend set; The simulated periodic data is trend segmented to obtain a simulated trend set; wherein the simulated trend set is used to reflect the set of rising data and falling data in the simulated periodic data; Analyze the simulated trend set to obtain a second rising variance and a second falling variance; wherein the second rising variance is used to reflect the variance of rising data in the simulated trend set, and the second falling variance is used to reflect the variance of falling data in the simulated trend set; Compare the first rising variance with the second rising variance to obtain a rising variance ratio; wherein the rising variance ratio is used to reflect the ratio of the first rising variance to the second rising variance; Comparing the first decreasing variance with the second decreasing variance to obtain a decreasing variance ratio; wherein the decreasing variance ratio is used to reflect the ratio of the first decreasing variance to the second decreasing variance; Similarity information is obtained by analyzing the ascending variance ratio and the descending variance ratio.

5. The bare copper wire manufacturing control method according to claim 4, characterized in that: The analyzing according to the ascending variance ratio and the descending variance ratio to obtain similarity information includes: Performing a mean operation on the rising variance ratio and the falling variance ratio to obtain a variance mean; The variance mean is confirmed as similarity information.

6. The bare copper wire manufacturing control method according to claim 1, characterized in that: The obtaining of maintenance information by analyzing the similarity information, the mold parameters and the production data includes: When the similarity information is less than or equal to a threshold, obtaining first maintenance information of the maintenance information; wherein the first maintenance information is used to reflect that the wire drawing die is replaced; And / or, when the similarity information is greater than the threshold, the second maintenance information of the maintenance information is obtained by analyzing the similarity information, the mold parameters and the production data; wherein the second maintenance information is used to reflect the working time of adjusting the wire drawing mold.

7. The bare copper wire manufacturing control method according to claim 6, characterized in that: The step of analyzing the similarity information, the mold parameters, and the production data to obtain the second maintenance information includes: The remaining life of the die is obtained by analyzing the similarity information, the die parameters and the production data; wherein the remaining life of the die is used to reflect the maximum working time that the wire drawing die can withstand; The second maintenance information of the maintenance information is obtained by analyzing the remaining life of the mold.

8. The bare copper wire manufacturing control method according to claim 7, characterized in that: The analyzing according to the similarity information, the mold parameters and the production data to obtain the remaining life of the mold includes: Analyze the similarity information to obtain the degree of wear; wherein the degree of wear is used to reflect the degree of loss of the die area of ​​the wire drawing die due to the friction of the copper wire; An initial roundness value, an initial area and a worn roundness value are obtained by analyzing the die parameters; wherein the initial roundness value is used to reflect the roundness value of the inner circle of the wire drawing die when it is not worn, the initial area is used to reflect the area of ​​the inner circle of the wire drawing die when it is not worn, and the worn roundness value is used to reflect the inner roundness value of the wire drawing die after it is worn; The remaining life of the mold is obtained by analyzing the wear degree, the initial roundness value, the initial area, the wear roundness value and the production data.

9. The bare copper wire manufacturing control method according to claim 8, characterized in that: The analysis based on the wear degree, the initial roundness value, the initial area, the wear roundness value and the production data to obtain the remaining life of the mold includes: Obtaining cumulative working time from the historical working time in the production data; wherein the cumulative working time is used to reflect the total working time of the wire drawing device; The wear amount is obtained by analyzing the wear degree and the initial area; wherein the wear amount is used to reflect the increase in the inner diameter of the wire drawing die due to the friction force of the copper wire; Analyze the wear amount and the cumulative working time to obtain a wear rate; Analyze the wear rate, the initial roundness value and the worn roundness value to obtain the remaining life of the mold; And / or, analyzing the wear rate, the initial roundness value and the worn roundness value to obtain the remaining life of the mold includes: The roundness difference is obtained by comparing the initial roundness value with the worn roundness value; wherein the roundness difference is used to reflect the difference between the roundness value of the inner circle of the wire drawing die before wear and the roundness value of the inner circle after wear; The wear allowance is obtained by comparing the roundness difference with the preset roundness difference; wherein the wear allowance is used to reflect the maximum allowable wear area that the wire drawing die can still accept; The remaining life of the mold is obtained by processing the wear allowance and the wear rate.

10. A bare copper wire manufacturing device, characterized in that: The invention comprises a wire drawing device and a control device, wherein the wire drawing device is electrically connected to the control device, the control device comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the method according to any one of claims 1 to 9 when executing the computer program.

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