Deposition equipment for preparing ultrathin loose film and working method of deposition equipment

Abstract

The invention discloses deposition equipment for preparing an ultrathin loose film and a working method of the deposition equipment, the deposition equipment comprises a main body unit, the main body unit comprises a power supply placing box and a deposition box fixedly mounted on the upper surface of the power supply placing box, and swing grooves are formed in the two sides of the deposition box. By utilizing a limiting frame, a first spring, a rubber buffer pad, a connecting rod, a pump body, an air guide plate, a clamping air groove, an exhaust plate, a sealing top plate and an air guide groove, the limiting frame, the first spring and the connecting rod are used for carrying out auxiliary buffer treatment on the sealing plate in the overturning process of the sealing plate, the protection effect on equipment is prevented from being improved to a certain extent, and furthermore, the sealing plate is prevented from being damaged. The pump body is used for discharging gas raw materials into the deposition box through the gas guide groove, and the inclined gas groove is used for accelerating entering gas, so that the gas is accelerated to a certain extent when entering the deposition box.

Description

Technical Field

[0001] The present invention relates to the technical field of deposition equipment structure for preparing ultra-thin loose films, and in particular to a deposition equipment for preparing ultra-thin loose films and a working method thereof. Background Art

[0002] Chemical vapor deposition technology is a process that uses gas-phase chemical reactions to deposit solid thin films on the surface of a substrate. Some CVD deposition processes, such as chemical vapor deposition of metal organic compounds, require control of the film to achieve epitaxial growth and have high requirements for film uniformity. With the advancement of science and technology, deposition technology has gradually become an important means of preparing ultra-thin loose films.

[0003] When existing deposition equipment is used to prepare ultra-thin loose films, the gas entering the equipment will diffuse, causing the equipment to have insufficient chemical reaction with the wafer surface during the deposition process, thereby causing uneven distribution of the film on the wafer surface, which will reduce the production quality of the equipment to a certain extent and easily increase the film production cost and operation complexity. Summary of the invention

[0004] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0005] In view of the above-mentioned problems existing in the existing deposition equipment for preparing ultra-thin loose films and the working method thereof, the present invention is proposed.

[0006] Therefore, the object of the present invention is to provide a deposition device for preparing an ultra-thin loose film and a working method thereof, which is suitable for solving the problem of uneven distribution of thin films on the wafer surface caused by gas diffusion effect.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a deposition device for preparing an ultra-thin loose film, wherein the deposition device working method uses a deposition device, and the deposition device comprises:

[0008] The main unit includes a power supply placement box and a deposition box fixedly installed on the upper surface of the power supply placement box, swing grooves are provided on both sides of the deposition box, a protective shell is fixedly connected to one side of the deposition box, and an inert gas inlet pipe is fixedly connected to the side of the protective shell away from the deposition box;

[0009] An air intake placement unit, comprising two groups of symmetrically distributed fixed shafts fixedly connected to the inner upper surface of a deposition box and a sealing plate fixedly connected to the outer surface of the fixed shafts, the upper surface of the deposition box is fixedly connected to a plurality of equidistantly distributed mounting plates by bolts, the upper surface of the mounting plate is fixedly connected to a fixed frame, the fixed frame is fixedly connected to a sealing top plate, the lower surface of the mounting plate is fixedly connected to an air guide plate, and the lower surface of the air guide plate is fixedly connected to an exhaust plate;

[0010] The cooling annealing unit includes infrared heating grooves on both sides of the inner surface of the deposition box and a sliding groove at the connection between the power supply placement box and the deposition box, a deposition transmission module is rollingly connected in the sliding groove, a heat conduction plate is fixedly connected to the side of the inner surface of the deposition box close to the infrared heating groove, and a medium heat pipe is fixedly connected to the side of the heat conduction plate away from the infrared heating groove.

[0011] As a preferred solution of a deposition equipment device for preparing ultra-thin loose films described in the present invention, wherein: one side of the power supply placement box is fixedly connected to a box door through a hinge, the inner surface of the power supply placement box is fixedly connected to a partition plate, one side of the deposition box is fixedly connected to an observation window frame, a transparent isolation plate is fixedly connected to the observation window frame, one side of the deposition box is fixedly connected to a pressure relief valve, the side of the deposition box close to the pressure relief valve is fixedly connected to an electromagnetic valve, a power supply storage compartment is opened in the power supply placement box, and the partition plate is fixedly connected to the inner surface of the power supply storage compartment.

[0012] As a preferred solution of the deposition equipment device for preparing ultra-thin loose films described in the present invention, wherein: a first connecting shaft is fixedly connected to one side of the sealing plate, and the outer surface of the first connecting shaft is rotatably connected to the limiting frame, a second connecting shaft is fixedly connected to one side of the swinging groove, and the outer surface of the second connecting shaft is rotatably connected to a connecting rod, and the connecting rod is fixedly connected to a first spring at one end close to the limiting frame.

[0013] As a preferred solution of the deposition equipment device for preparing ultra-thin loose films described in the present invention, wherein: a rubber buffer pad is fixedly connected to one side of the connecting rod, a sealing reinforcement plate is fixedly connected to the lower surface of the sealing plate, a clamping plate is fixedly connected to the lower surface of the sealing plate, a handle is fixedly connected to one side of the clamping plate, a placement groove and a clamping air groove are respectively opened on the upper surface of the deposition box, a sealing extrusion pad is fixedly connected to the inner surface of the placement groove, and the upper surface of the outer surface of the air guide plate is clamped and connected to the inner surface of the clamping air groove.

[0014] As a preferred solution of the deposition equipment device for preparing ultra-thin loose films described in the present invention, wherein: a carrying handle is fixedly connected to the upper surface of the mounting plate, a pump body is fixedly connected to the upper surface of the mounting plate, a pipeline frame is fixedly connected to the side of the fixed frame away from the pressure relief valve, a guide pipe and a carrying-out pipe are respectively fixedly connected to the side of the deposition box close to the pipeline frame, an air guide groove is opened in the air guide plate, and an inclined air groove is fixedly connected in the exhaust plate.

[0015] As a preferred solution of the deposition equipment device for preparing ultra-thin loose films described in the present invention, the deposition transmission module includes a rolling wheel rollingly connected to the inner surface of a sliding groove and a holding block placed on the inner surface of the sliding groove, a plug-in block is fixedly connected to the lower surface of the holding block, one side of the rolling wheel is fixedly connected to one end of the output shaft of the driving motor, and an arc-shaped buffer pad is fixedly connected above the outer surface of the driving motor.

[0016] As a preferred solution of the deposition equipment device for preparing ultra-thin loose films described in the present invention, wherein: the upper surface of the arc-shaped buffer pad is fixedly connected to a mounting frame, the upper surface of the mounting frame is fixedly connected to a base plate, an insertion groove is opened in the base plate, a locking spring piece is fixedly connected in the insertion groove, a locking block is locked in the insertion groove, and both sides of the locking block are in contact with the locking spring piece.

[0017] As a preferred solution of the deposition equipment device for preparing ultra-thin loose films described in the present invention, wherein: the upper surface of the containing block is rotatably connected to a rotating shaft rod, the upper surface of the rotating shaft rod is fixedly connected to a rotating disk, the lower surface of the rotating disk is fixedly connected to an auxiliary rod, a rotating groove is opened in the containing block, an auxiliary rod is slidably connected in the rotating groove, and the upper surface of the rotating disk is fixedly connected to a containing table.

[0018] As a preferred solution of the deposition equipment device for preparing ultra-thin loose films described in the present invention, wherein: an adjustment seat is fixedly connected to the upper surface of the rotating disk, a toggle plate is rotatably connected to the upper surface of the adjusting seat, a fixed block is fixedly connected to the upper surface of the rotating disk, a telescopic plate is fixedly connected to the side of the fixed block close to the placing table, the plane where the lower surface of the telescopic plate is located is in the same plane as the upper surface of the placing table, sliding rail rods are fixedly connected to both sides of the base plate, a second spring is fixedly connected to the inner surface of the sliding groove, and a rubber extrusion rod is fixedly connected to the end of the second spring close to the sliding rail rod.

[0019] A method for working a deposition device for preparing an ultra-thin loose film, the deposition device working method being applicable to any of the above deposition devices, and the deposition device working method comprising the following steps:

[0020] Step 1: Place the wafer on the upper surface of the holding table and perform vacuum treatment inside the deposition box;

[0021] Step 2: Use the air guide plate and the solenoid valve to keep the vacuum inside the deposition box during the air intake process;

[0022] Step 3: multiple gas guide plates are arranged at equal intervals, so that when the placing table moves to the position where the corresponding gas guide plate is downward, different gas raw materials are separated by inert gas;

[0023] Step 4: During the air intake process of the air guide plate, the paddle plate on the upper surface of the rotating disk is used to contact the gas, so that the paddle plate pushes the rotating disk to rotate, and during the movement of the rotating disk, a part of the gas is fully in contact with the wafer on the upper surface of the placing table;

[0024] Step 5: The wafers are moved to the lower surface of the air guide plate in sequence under the driving of the placing table, so that different thin films are deposited in sequence;

[0025] Step 6: During the wafer deposition process, the wafer is annealed and strengthened using a cooling annealing unit;

[0026] Step 7: Once deposition is complete, remove the wafer for subsequent processing.

[0027] Beneficial effects of the present invention:

[0028] The swing trough is used to stretch the sealing plate by using the swing trough, the protective shell, the inert gas inlet pipe, the pressure relief valve, the observation window frame, the transparent isolation plate and the electromagnetic valve, so as to improve the connection effect between the sealing plate and the deposition box to a certain extent. Furthermore, the inert gas inlet pipe is used to separate the raw materials when the equipment is working, and the observation window frame and the transparent isolation plate are used to facilitate the operator to observe the internal working state of the equipment in real time;

[0029] 1. Using the limit frame, the first spring, the rubber cushion, the connecting rod, the pump body, the air guide plate, the locking gas groove, the exhaust plate, the sealing top plate and the air guide groove, the limit frame, the first spring and the connecting rod are used for auxiliary buffering during the flipping process of the sealing plate to prevent it from improving the protection effect of the equipment to a certain extent. Further, the pump body is used to discharge the gas raw material into the deposition box through the gas guide groove, and the inclined gas groove is used to accelerate the incoming gas, so that it is accelerated to a certain extent when entering the deposition box;

[0030] 2. Utilize the heat conduction plate, dielectric heat pipe, infrared heating tank and deposition transmission module, so that the paddle in the deposition transmission module drives the rotating disk to rotate during the blowing process of the gas raw material, and then the dielectric heat pipe and infrared heating tank heat the inside of the equipment, so as to ensure the deposition effect of the equipment to a certain extent, and further utilize the rotation of the rotating disk to make the gas contact with the wafer surface, and make the gas particles evenly distributed on the wafer surface during the rotation of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0032] Figure 1 This is a schematic diagram of the overall structure of a deposition device for preparing an ultra-thin loose film proposed by the present invention;

[0033] Figure 2 This is a schematic diagram of the overall cross-sectional structure of a deposition device for preparing an ultra-thin loose film proposed by the present invention;

[0034] Figure 3 A schematic diagram of the structure of a deposition transmission module of a deposition device for preparing an ultra-thin loose film proposed by the present invention;

[0035] Figure 4 A schematic diagram of the structure of a rotating tank of a deposition device for preparing an ultra-thin loose film proposed by the present invention;

[0036] Figure 5 A schematic diagram of the internal structure of a deposition box of a deposition device for preparing an ultra-thin loose film proposed by the present invention;

[0037] Figure 6 A schematic diagram of the structure of an air intake placement unit of a deposition device for preparing an ultra-thin loose film proposed by the present invention;

[0038] Figure 7 A schematic diagram of the plug-in block structure of a deposition device for preparing an ultra-thin loose film proposed by the present invention;

[0039] Figure 8 This is a schematic diagram of the overall cross-sectional structure of an air guide plate and an exhaust plate of a deposition device for preparing an ultra-thin loose film proposed by the present invention;

[0040] Fig. 9 This is a cross-sectional enlarged structural schematic diagram of a deposition transmission module of a deposition device for preparing an ultra-thin loose film proposed by the present invention;

[0041] Fig.10 A schematic diagram of the back structure of a deposition box of a deposition device for preparing an ultra-thin loose film proposed by the present invention;

[0042] Fig.11 This is a flow chart of the working method of a deposition device for preparing an ultra-thin loose film proposed by the present invention.

[0043] Description of the drawings: 100, main unit; 101, power supply placement box; 102, deposition box; 103, box door; 104, power supply storage compartment; 105, partition plate; 106, swing groove; 107, protective shell; 108, inert gas inlet pipe; 109, pressure relief valve; 110, observation window frame; 111, transparent isolation plate; 112, solenoid valve; 200, air intake placement unit; 201, fixed shaft; 202, mounting plate; 203, fixed frame ; 204, carrying handle; 205, sealing plate; 206, locking plate; 207, handle; 208, first connecting shaft; 209, sealing compression pad; 210, pump body; 211, air guide plate; 212, limit frame; 213, first spring; 214, rubber buffer pad; 215, connecting rod; 216, second connecting shaft; 217, placement slot; 218, carrying tube; 219, inclined gas slot; 220, pipeline frame; 221, locking gas slot; 222, Exhaust plate; 223, sealing top plate; 224, air guide groove; 225, sealing reinforcement plate; 226, guide pipe; 300, cooling annealing unit; 301, heat conduction plate; 302, medium heat pipe; 303, infrared heating tank; 304, deposition transmission module; 30401, toggle plate; 30402, fixed block; 30403, adjustment seat; 30404, holding block; 30405, base plate; 30406, second spring; 30407, rubber Extrusion rod; 30408, slide rail rod; 30409, rotating disk; 30410, telescopic plate; 30411, placing table; 30412, auxiliary rod; 30413, rotating groove; 30414, plug-in block; 30415, rotating shaft rod; 30416, rolling wheel; 30417, insertion groove; 30418, snap-fit ​​spring piece; 30419, mounting frame; 30420, arc-shaped buffer pad; 30421, driving motor; 305, sliding groove. DETAILED DESCRIPTION

[0044] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0045] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0046] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it an embodiment that is mutually exclusive with other embodiments, either individually or selectively.

[0047] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0048] Embodiment 1:

[0049] Reference Figure 1 - Fig.11 , which is an embodiment of the present invention, provides a deposition equipment device for preparing an ultra-thin loose film, including a main unit 100, an air intake placement unit 200, and a cooling annealing unit 300.

[0050] The main unit 100 includes a power supply placement box 101 and a deposition box 102 fixedly installed on the upper surface of the power supply placement box 101. Swinging grooves 106 are provided on both sides of the deposition box 102. A protective shell 107 is fixedly connected to one side of the deposition box 102. An inert gas inlet pipe 108 is fixedly connected to the side of the protective shell 107 away from the deposition box 102.

[0051] Secondly, the air intake placement unit 200 includes two groups of symmetrically distributed fixed shafts 201 fixedly connected to the upper surface of the sedimentation box 102 and a sealing plate 205 fixedly connected to the outer surface of the fixed shaft 201. The upper surface of the sedimentation box 102 is fixedly connected to multiple groups of equidistantly distributed mounting plates 202 by bolts. The upper surface of the mounting plate 202 is fixedly connected to a fixed frame 203, and a sealing top plate 223 is fixedly connected to the fixed frame 203. The lower surface of the mounting plate 202 is fixedly connected to an air guide plate 211, and the lower surface of the air guide plate 211 is fixedly connected to an exhaust plate 222.

[0052] Secondly, the cooling annealing unit 300 includes infrared heating grooves 303 on both sides of the inner surface of the deposition box 102 and a sliding groove 305 opened at the connection between the power supply placement box 101 and the deposition box 102, and a deposition transmission module 304 is rollingly connected in the sliding groove 305. A heat conducting plate 301 is fixedly connected to the inner surface of the deposition box 102 close to the infrared heating groove 303, and a medium heat pipe 302 is fixedly connected to the side of the heat conducting plate 301 away from the infrared heating groove 303.

[0053] Furthermore, a box door 103 is fixedly connected to one side of the power supply placement box 101 through a hinge, a partition plate 105 is fixedly connected to the inner surface of the power supply placement box 101, an observation window frame 110 is fixedly connected to one side of the deposition box 102, a transparent isolation plate 111 is fixedly connected to the inside of the observation window frame 110, a pressure relief valve 109 is fixedly connected to one side of the deposition box 102, and a solenoid valve 112 is fixedly connected to the side of the deposition box 102 close to the pressure relief valve 109, a power supply storage bin 104 is opened in the power supply placement box 101, and the partition plate 105 is fixedly connected to the inner surface of the power supply storage bin 104, wherein the interior of the equipment is vacuum treated by the solenoid valve 112, and the solenoid valve 112 is used to extract an equal amount of gas raw materials entering the interior of the equipment during normal operation of the equipment, thereby maintaining a vacuum degree inside the equipment.

[0054] Furthermore, a first connecting shaft 208 is fixedly connected to one side of the sealing plate 205, and the outer surface of the first connecting shaft 208 is rotatably connected to a limiting frame 212. A second connecting shaft 216 is fixedly connected to one side of the swinging groove 106, and the outer surface of the second connecting shaft 216 is rotatably connected to a connecting rod 215. The connecting rod 215 is fixedly connected to one end close to the limiting frame 212 with a first spring 213, wherein the connecting rod 215 is moved by the limiting frame 212, and then the first spring 213 is used to buffer the sealing plate 205 during its flipping process, thereby preventing the sealing plate 205 from colliding with the upper surface of the sedimentation box 102 to a certain extent.

[0055] Furthermore, a rubber buffer pad 214 is fixedly connected to one side of the connecting rod 215, a sealing reinforcement plate 225 is fixedly connected to the lower surface of the sealing plate 205, a locking plate 206 is fixedly connected to the lower surface of the sealing plate 205, a handle 207 is fixedly connected to one side of the locking plate 206, and a placement groove 217 and a locking air groove 221 are respectively opened on the upper surface of the deposition box 102, a sealing extrusion pad 209 is fixedly connected to the inner surface of the placement groove 217, and the upper surface of the air guide plate 211 is locked and connected to the inner surface of the locking air groove 221, wherein each connecting part of the equipment is provided with a sealing rubber pad, so that the equipment can maintain the vacuum degree of the equipment to a certain extent to prevent it from affecting the working quality of the equipment.

[0056] Furthermore, a carrying handle 204 is fixedly connected to the upper surface of the mounting plate 202, a pump body 210 is fixedly connected to the upper surface of the mounting plate 202, a pipe frame 220 is fixedly connected to the fixed frame 203 on the side away from the pressure relief valve 109, a guide pipe 226 and a carrying pipe 218 are respectively fixedly connected to the side of the sedimentation box 102 close to the pipe frame 220, a gas guide groove 224 is opened in the gas guide plate 211, and an inclined gas groove 219 is fixedly connected in the exhaust plate 222, wherein the inclined gas groove 219 is in the shape of an hourglass, so that the gas raw material can be accelerated through the exhaust plate 222. Further, the upper surface of the mounting plate 202 is protected by the fixing frame, and the carrying handle 204 is used to enable the mounting plate 202 and its surface connection parts to be quickly disassembled and maintained.

[0057] Then, the swing trough is used to stretch the sealing plate by using the swing trough, the protective shell, the inert gas inlet pipe, the pressure relief valve, the observation window frame, the transparent isolation plate and the electromagnetic valve, so as to improve the connection effect between the sealing plate and the deposition box to a certain extent. Furthermore, the inert gas inlet pipe is used to separate the raw materials when the equipment is working, and the observation window frame and the transparent isolation plate are used to facilitate the operator to observe the internal working state of the equipment in real time.

[0058] The limit frame, the first spring, the rubber cushion, the connecting rod, the pump body, the air guide plate, the engaging air groove, the exhaust plate, the sealing top plate and the air guide groove are used to perform auxiliary buffering treatment on the limit frame, the first spring and the connecting rod during the flipping process of the sealing plate, thereby preventing the sealing plate from being overturned to a certain extent and improving the protection effect on the equipment. Furthermore, the pump body is used to discharge the gas raw material into the deposition box through the air guide groove, and the inclined air groove is used to accelerate the incoming gas, so that the gas is accelerated to a certain extent when entering the deposition box.

[0059] By utilizing a heat conducting plate, a dielectric heat pipe, an infrared heating tank and a deposition transmission module, the paddle in the deposition transmission module drives the rotating disk to rotate during the blowing of the gas raw material, thereby causing the dielectric heat pipe and the infrared heating tank to heat the inside of the equipment, thereby ensuring the deposition effect of the equipment to a certain extent. The rotation of the rotating disk is further utilized to make the gas contact with the wafer surface, and the gas particles are evenly distributed on the wafer surface during the rotation of the wafer.

[0060] A method for working a deposition device for preparing an ultra-thin loose film, the deposition device working method being applicable to any of the above deposition devices, and the deposition device working method comprising the following steps:

[0061] Step 1: Place the wafer on the upper surface of the holding table 30411 and perform vacuum treatment inside the deposition box 102;

[0062] Step 2: Using the air guide plate 211 and the solenoid valve 112, the deposition box 102 is kept vacuum during the air intake process;

[0063] Step 3: multiple gas guide plates 211 are arranged at equal intervals, so that when the placing platform 30411 moves to the position where the corresponding gas guide plate 211 is facing downward, different gas raw materials are separated by using inert gas;

[0064] Step 4: During the air intake process of the air guide plate 211, the paddle plate 30401 on the upper surface of the rotating disk 30409 is used to contact the gas, so that the paddle plate 30401 pushes the rotating disk 30409 to rotate, and during the movement of the rotating disk 30409, a part of the gas is fully in contact with the wafer on the upper surface of the placing table 30411;

[0065] Step 5: The wafers are moved to the lower surface of the air guide plate 211 in sequence under the drive of the placing table 30411, so as to be deposited with different thin films in sequence;

[0066] Step 6: During the wafer deposition process, the wafer is subjected to annealing and strengthening treatment by using the cooling annealing unit 300;

[0067] Step 7: Once deposition is complete, remove the wafer for subsequent processing.

[0068] Embodiment 2

[0069] Reference Figure 3 - Figure 4 , Figure 6 - Figure 7 and Fig. 9 , compared with the first embodiment, the difference is that: the deposition transmission module 304 includes a rolling wheel 30416 rollingly connected to the inner surface of the sliding groove 305 and a holding block 30404 placed on the inner surface of the sliding groove 305, the lower surface of the holding block 30404 is fixedly connected to the plug-in block 30414, one side of the rolling wheel 30416 is fixedly connected to one end of the output shaft of the driving motor 30421, and an arc-shaped buffer pad 30420 is fixedly connected above the outer surface of the driving motor 30421, wherein the rolling wheel 30416 is driven by the output shaft of the driving motor 30421 to roll inside the sliding groove 305, and then the holding block 30404 is driven to move by the rolling wheel 30416, so that the holding block 30404 drives the wafer to move to the bottom of the exhaust plate 222, so that the wafer can be deposited.

[0070] Furthermore, a mounting frame 30419 is fixedly connected to the upper surface of the arc-shaped buffer pad 30420, and a base plate 30405 is fixedly connected to the upper surface of the mounting frame 30419. An insertion slot 30417 is provided in the base plate 30405, and a locking spring piece 30418 is fixedly connected in the insertion slot 30417. A plug-in block 30414 is locked in the insertion slot 30417, and both sides of the plug-in block 30414 are in contact with the locking spring piece 30418, wherein the locking spring piece 30418 and the insertion slot 30417 cooperate with each other to make the base plate 30405 and the containing block 30404 locked and connected, so that the containing block 30404 and the components above it can be quickly taken out for maintenance and cleaning.

[0071] Furthermore, a rotating shaft 30415 is rotatably connected to the upper surface of the containing block 30404, a rotating disk 30409 is fixedly connected to the upper surface of the rotating shaft 30415, an auxiliary rod 30412 is fixedly connected to the lower surface of the rotating disk 30409, a rotating groove 30413 is provided in the containing block 30404, the auxiliary rod 30412 is slidably connected in the rotating groove 30413, and a containing table 30411 is fixedly connected to the upper surface of the rotating disk 30409, wherein the auxiliary rod 30412 and the rotating groove 30413 assist the rotating disk 30409 in rotating, so that the rotating disk 30409 can be kept stable during the rotation process under the blowing of gas raw materials, and the containing table 30411 is further used to contain and process the wafers.

[0072] Further, the upper surface of the rotating disk 30409 is fixedly connected to the adjusting seat 30403, the upper surface of the adjusting seat 30403 is rotatably connected to the toggle piece 30401, the upper surface of the rotating disk 30409 is fixedly connected to the fixing block 30402, the fixed block 30402 is fixedly connected to the telescopic plate 30410 on the side close to the placing table 30411, the lower surface of the telescopic plate 30410 is in the same plane as the upper surface of the placing table 30411, both sides of the base plate 30405 are fixedly connected to the slide rail rod 30408, and the inner surface of the sliding groove 305 is fixedly connected to The second spring 30406 is fixedly connected with a rubber extrusion rod 30407 at one end of the second spring 30406 close to the slide rod 30408, wherein the toggle piece 30401 on the upper surface thereof is rotated by adjusting the seat 30403, thereby adjusting the angle of the toggle piece 30401 to make it fully contact the gas raw material, and then after the gas raw material is connected with the toggle piece 30401, a part of the gas raw material passes through the upper surface of the guide wafer of the toggle piece 30401, thereby pushing the toggle piece 30401 to rotate, so that the wafer is synchronously subjected to a rotational deposition process.

[0073] Working principle: The power supply box 101 is used to store and provide the power required by the equipment, while the deposition box 102 is the main place for thin film deposition. The swing slots 106 opened on both sides of the deposition box 102 are used to install and adjust the sealing plate 205 to ensure the sealing of the gas during the deposition process. The protective shell 107 and the inert gas inlet pipe 108 together constitute the air intake system of the equipment. The inert gas inlet pipe 108 is responsible for introducing the inert gas into the deposition box 102 to provide a stable gas environment for the deposition process, and use the inert gas to separate different gas raw materials to avoid mutual influence between the gas raw materials to reduce the deposition quality;

[0074] The solenoid valve 112 is used to perform vacuum treatment inside the device to ensure that there is no interference from impurities during the deposition process. At the same time, during the normal operation of the device, the solenoid valve 112 can also extract an equal amount of gas raw materials entering the device to maintain a constant vacuum inside the device, thereby effectively controlling the diffusion speed of the gas in the deposition box 102 and avoiding the problem of insufficient chemical reaction on the wafer surface.

[0075] The gas guide groove 224 in the gas guide plate 211 allows the gas raw material to flow evenly into the deposition box 102, while the inclined gas groove 219 on the exhaust plate 222 accelerates the incoming gas, ensuring that the gas is quickly and evenly distributed in the deposition box 102. This design effectively solves the problem of uneven distribution of thin films on the wafer surface caused by uneven gas diffusion, and uses multiple groups of different gas guide plates to allow different gases to enter the equipment separately, so that the equipment can deposit different thin films;

[0076] The rolling wheel 30416 is driven by the driving motor 30421 to roll in the sliding groove 305, thereby driving the holding block 30404 and the wafer above it to move to the bottom of the exhaust plate 222 for deposition processing. The rotating disk 30409 on the holding block 30404 rotates under the blowing of the gas raw material, so that the wafer is fully in contact with the gas particles during the rotation process, and the uniform deposition of the film is achieved. By adjusting the angle of the toggle plate 30401, it can be fully in contact with the gas raw material, and a part of the gas raw material is guided to the upper surface of the wafer, thereby driving the toggle plate 30401 and the wafer to rotate synchronously for deposition processing. This design not only improves the deposition efficiency, but also ensures the uniformity and consistency of the film.

[0077] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A deposition device for preparing an ultra-thin loose film, characterized in that: The deposition device comprises: The main unit (100) comprises a power supply placement box (101) and a deposition box (102) fixedly mounted on the upper surface of the power supply placement box (101), wherein swing grooves (106) are provided on both sides of the deposition box (102), a protective shell (107) is fixedly connected to one side of the deposition box (102), and an inert gas inlet pipe (108) is fixedly connected to the side of the protective shell (107) away from the deposition box (102); An air intake placement unit (200) comprises a deposition box (102) having two groups of symmetrically distributed fixed shafts (201) fixedly connected to the inner upper surface thereof and a sealing plate (205) fixedly connected to the outer surface of the fixed shafts (201); the deposition box (102) having a plurality of groups of equidistantly distributed mounting plates (202) fixedly connected to the upper surface thereof by bolts; a fixing frame (203) fixedly connected to the upper surface of the mounting plate (202); a sealing top plate (223) fixedly connected to the inner surface of the fixing frame (203); an air guide plate (211) fixedly connected to the lower surface of the mounting plate (202); and an exhaust plate (222) fixedly connected to the lower surface of the air guide plate (211); The cooling annealing unit (300) comprises infrared heating grooves (303) provided on both sides of the inner surface of a deposition box (102) and a sliding groove (305) provided at the connection between the power supply placement box (101) and the deposition box (102), a deposition transmission module (304) being rollingly connected in the sliding groove (305), a heat conducting plate (301) being fixedly connected to the inner surface of the deposition box (102) on the side close to the infrared heating groove (303), and a medium heat pipe (302) being fixedly connected to the side of the heat conducting plate (301) away from the infrared heating groove (303).

2. The deposition device for preparing an ultra-thin loose film according to claim 1, characterized in that: One side of the power source storage box (101) is fixedly connected to a box door (103) via a hinge, the inner surface of the power source storage box (101) is fixedly connected to a partition plate (105), one side of the sedimentation box (102) is fixedly connected to an observation window frame (110), a transparent isolation plate (111) is fixedly connected inside the observation window frame (110), one side of the sedimentation box (102) is fixedly connected to a pressure relief valve (109), and the side of the sedimentation box (102) close to the pressure relief valve (109) is fixedly connected to an electromagnetic valve (112), a power source storage compartment (104) is provided in the power source storage box (101), and the partition plate (105) is fixedly connected to the inner surface of the power source storage compartment (104).

3. The deposition device for preparing an ultra-thin loose film according to claim 1, characterized in that: A first connecting shaft (208) is fixedly connected to one side of the sealing plate (205), and the outer surface of the first connecting shaft (208) is rotatably connected to a limit frame (212). A second connecting shaft (216) is fixedly connected to one side of the swing groove (106), and the outer surface of the second connecting shaft (216) is rotatably connected to a connecting rod (215). One end of the connecting rod (215) close to the limit frame (212) is fixedly connected to a first spring (213).

4. The deposition device for preparing an ultra-thin loose film according to claim 3, characterized in that: A rubber buffer pad (214) is fixedly connected to one side of the connecting rod (215), a sealing reinforcement plate (225) is fixedly connected to the lower surface of the sealing plate (205), a locking plate (206) is fixedly connected to the lower surface of the sealing plate (205), a handle (207) is fixedly connected to one side of the locking plate (206), a placement groove (217) and a locking gas groove (221) are respectively provided on the upper surface of the deposition box (102), a sealing extrusion pad (209) is fixedly connected to the inner surface of the placement groove (217), and the upper surface of the outer surface of the air guide plate (211) is locked and connected to the inner surface of the locking gas groove (221).

5. The deposition device for preparing an ultra-thin loose film according to claim 4, characterized in that: A carrying handle (204) is fixedly connected to the upper surface of the mounting plate (202), a pump body (210) is fixedly connected to the upper surface of the mounting plate (202), a pipeline frame (220) is fixedly connected to the side of the fixed frame (203) away from the pressure relief valve (109), a guide pipe (226) and a carrying pipe (218) are fixedly connected to the side of the sedimentation box (102) close to the pipeline frame (220), an air guide groove (224) is opened in the air guide plate (211), and an inclined air groove (219) is fixedly connected in the exhaust plate (222).

6. The deposition device for preparing an ultra-thin loose film according to claim 1, characterized in that: The deposition transmission module (304) includes a rolling wheel (30416) rollingly connected to the inner surface of the sliding groove (305) and a holding block (30404) placed on the inner surface of the sliding groove (305), a plug-in block (30414) fixedly connected to the lower surface of the holding block (30404), one side of the rolling wheel (30416) fixedly connected to one end of the output shaft of the driving motor (30421), and an arc-shaped buffer pad (30420) fixedly connected above the outer surface of the driving motor (30421).

7. The deposition device for preparing an ultra-thin loose film according to claim 6, characterized in that: The upper surface of the arc-shaped buffer pad (30420) is fixedly connected to a mounting frame (30419), the upper surface of the mounting frame (30419) is fixedly connected to a base plate (30405), an insertion slot (30417) is provided in the base plate (30405), a snap-fit ​​spring piece (30418) is fixedly connected in the insertion slot (30417), an insertion block (30414) is snap-fitted in the insertion slot (30417), and both sides of the insertion block (30414) are in contact with the snap-fit ​​spring piece (30418).

8. The deposition device for preparing an ultra-thin loose film according to claim 7, characterized in that: The upper surface of the holding block (30404) is rotatably connected to a rotating shaft (30415), the upper surface of the rotating shaft (30415) is fixedly connected to a rotating disk (30409), the lower surface of the rotating disk (30409) is fixedly connected to an auxiliary rod (30412), a rotating groove (30413) is provided in the holding block (30404), the rotating groove (30413) is slidably connected to an auxiliary rod (30412), and the upper surface of the rotating disk (30409) is fixedly connected to a holding platform (30411).

9. The deposition device for preparing an ultra-thin loose film according to claim 8, characterized in that: The upper surface of the rotating disk (30409) is fixedly connected with an adjustment seat (30403), and the upper surface of the adjustment seat (30403) is rotatably connected with a toggle plate (30401). The upper surface of the rotating disk (30409) is fixedly connected with a fixed block (30402), and the fixed block (30402) is fixedly connected with a telescopic plate (30410) on the side close to the placing table (30411). The plane where the lower surface of the telescopic plate (30410) is located is in the same plane as the upper surface of the placing table (30411). Both sides of the base plate (30405) are fixedly connected with slide rails (30408), and the inner surface of the sliding groove (305) is fixedly connected with a second spring (30406), and the second spring (30406) is fixedly connected with a rubber extrusion rod (30407) on one end close to the slide rail (30408).

10. A method for working a deposition device for preparing an ultra-thin loose film, the deposition device working method being applicable to any one of the deposition devices in claims 1 to 9 above, characterized in that: The deposition device working method comprises the following steps: Step 1: placing a wafer on the upper surface of the holding table (30411) and subjecting the interior of the deposition box (102) to vacuum treatment; Step 2: using the air guide plate (211) and the electromagnetic valve (112) to maintain a vacuum inside the deposition box (102) during the air intake process; Step 3: multiple gas guide plates (211) are arranged at equal intervals, so that when the placing platform (30411) moves to the position where the corresponding gas guide plate (211) is facing downward, different gas raw materials are separated by using inert gas; Step 4: During the air intake process of the air guide plate (211), the paddle plate (30401) on the upper surface of the rotating disk (30409) is used to contact the gas, so that the paddle plate (30401) pushes the rotating disk (30409) to rotate, and during the movement of the rotating disk (30409), a portion of the gas is fully in contact with the wafer on the upper surface of the placing table (30411); Step 5: The wafers are moved to the lower surface of the air guide plate (211) in sequence under the drive of the holding platform (30411), so as to be subjected to deposition treatment of different thin films in sequence; Step 6: During the wafer deposition process, the wafer is subjected to annealing and strengthening treatment using a cooling annealing unit (300); Step 7: Once deposition is complete, remove the wafer for subsequent processing.

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