Method for measuring temperature of mold

Abstract

The invention discloses a method for measuring the temperature of a mold. The method comprises the steps that temperature measuring holes are formed in a mold, temperature measuring sensors are installed in the temperature measuring holes, temperature measuring data of the temperature measuring sensors are obtained, the temperature measuring data are the internal temperature of the mold, and the distances from the bottoms of the temperature measuring holes to the surface of a mold cavity are consistent; an infrared imaging thermodetector is installed to obtain a thermal image of the surface of the mold, infrared temperature measurement data of the periphery of each temperature measurement hole are obtained according to the thermal image, and the infrared imaging thermodetector keeps a measurement distance from the surface of the mold; the mapping relation between the internal temperature and the external temperature corresponding to the mold is obtained; and when the mold corresponding to the mapping relation is used for production, mold temperature data are displayed. According to the invention, the problems of high difficulty in mold temperature measurement and inaccurate measurement data in the production processes of casting, injection molding and the like in the prior art are solved.

Description

Technical Field

[0001] The invention relates to the technical field of mold temperature measurement, and in particular to a method for measuring mold temperature. Background Art

[0002] In the process of injection molding, die casting, low-pressure casting, etc., which use molds to shape molten materials, the control of mold temperature is one of the core factors affecting product quality and production efficiency. During the process of molten material filling, if the mold temperature is too low, the molten material will not flow smoothly and condense prematurely, which may cause product defects such as cold shut, looseness, and pores. Therefore, it is necessary to control the mold temperature not to be lower than a certain set process temperature; during the filling process, the molten material will transfer a large amount of heat to the mold, causing the mold temperature to rise; after the filling is completed, the high-temperature mold needs to be cooled so that the product in the cavity can be solidified and formed according to the process time curve. Too fast cooling speed may cause quality defects, and too slow cooling speed may reduce production efficiency. In order to achieve accurate mold temperature control, the mold temperature must be accurately measured. At present, there is no convenient and accurate mold temperature measurement method.

[0003] The following related patent documents introduce various methods for measuring mold temperature, but none of them can achieve accurate measurement.

[0004] The Chinese patent with the patent announcement number CN116275005 B proposes a mold temperature detection method, that is, directly judging the mold temperature through infrared images. The directly acquired infrared image can only reflect the temperature of the outer surface of the mold, and the thickness of the mold (the distance from the outer surface to the cavity surface) is different. Therefore, the error of using the infrared image of the outer surface as the measurement value of the mold temperature is large, and accurate temperature measurement and control cannot be achieved.

[0005] A Chinese patent with patent announcement number CN118392351 B proposes a temperature measuring device for a tire mold. The device uses a temperature conducting rod for indirect measurement. Since there will be a temperature drop during the heat transfer process through the temperature conducting rod, this method cannot accurately obtain the internal temperature of the mold.

[0006] The Chinese patent with the patent announcement number CN118268535 B proposes a high-pressure die-casting mold temperature control device, in which the mold temperature is measured directly by a thermometer. This method can only perform fixed-point measurement and cannot comprehensively monitor the temperature of the entire mold. When multiple thermometers are used for distributed measurement, there is a problem of high failure rate caused by too many measuring components.

[0007] Therefore, in the related art, the technical problem that mold temperature measurement in production processes such as casting and injection molding is difficult and the measurement data is inaccurate has not yet been effectively solved. Summary of the invention

[0008] The purpose of the present invention is to provide a method for measuring mold temperature to solve the problem in the related art that mold temperature measurement in production processes such as casting and injection molding is difficult and the measurement data is inaccurate.

[0009] In order to achieve the above object, the present invention adopts the following technical solutions:

[0010] A method for measuring mold temperature comprises: opening a temperature measuring hole on the mold, installing a temperature measuring sensor in the temperature measuring hole, obtaining temperature measuring data of the temperature measuring sensor, wherein the temperature measuring data is the internal temperature of the mold, and the distance from the bottom of each temperature measuring hole to the surface of the mold cavity is consistent; installing an infrared imaging thermometer to obtain a thermal imaging image of the mold surface, and obtaining infrared temperature measuring data around each temperature measuring hole based on the thermal imaging image, the infrared imaging thermometer maintains a measuring distance from the mold surface, wherein the infrared temperature measuring data is the external temperature of the mold, and the measuring distance is the distance at which the infrared imaging thermometer can measure the temperature values ​​around all the temperature measuring holes on the mold surface; obtaining a mapping relationship between the internal temperature and the external temperature corresponding to the mold; and displaying the mold temperature data when the mold corresponding to the mapping relationship is used for production.

[0011] Furthermore, when the mold is used to start production, the internal temperature and time corresponding to each temperature measuring hole are recorded; when the mold is used to start production, the external temperature and time corresponding to each temperature measuring hole are recorded.

[0012] Furthermore, a time-temperature curve of the internal temperature corresponding to each temperature measuring hole is obtained according to the internal temperature and time; and a time-temperature curve of the external temperature corresponding to each temperature measuring hole is obtained according to the external temperature and time.

[0013] Furthermore, the time-temperature curve of the internal temperature and the time-temperature curve of the external temperature corresponding to a temperature measuring hole are merged into the same time-temperature coordinate system.

[0014] Furthermore, the data of the time-temperature coordinate system is interpolated to obtain the mapping relationship between the internal temperature and the external temperature.

[0015] Furthermore, an internal temperature thermal imaging image is obtained according to the external temperature of the external temperature thermal imaging image and a mapping relationship.

[0016] Furthermore, the external temperature thermal imaging image and the internal temperature thermal imaging image are displayed through the human-computer interaction interface; the external temperature thermal imaging image and the internal temperature thermal imaging image are updated in real time.

[0017] Furthermore, the mold temperature data at a specific point is viewed by selecting the coordinates of the external temperature thermal imaging image and the internal temperature thermal imaging image, wherein the mold temperature data includes the internal temperature and the external temperature.

[0018] Compared with the prior art, the beneficial technical effects of the present invention are:

[0019] 1. After completing the mapping and comparison of the temperature sensor's measurement data and the thermal imaging image, the temperature sensor can be removed, and only the infrared imaging thermometer can be used to complete the real-time temperature measurement of the mold during the production process.

[0020] 2. It can intuitively display the temperature distribution inside the mold and the temperature data at any point, which is conducive to accurately controlling the mold temperature.

[0021] 3. The actual production measurement process is non-contact, which avoids the loss of temperature sensors and has a low failure rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A flow chart of a method for measuring mold temperature according to the present invention;

[0024] Figure 2 A schematic diagram of installing a temperature sensor according to the present invention;

[0025] Figure 3 is a schematic diagram of internal temperature and external temperature;

[0026] Figure 4 It is a curve diagram of the internal temperature and external temperature of the temperature measuring hole.

[0027] Figure numerals: 1. mold; 2. temperature sensor; 3. infrared imaging thermometer; 4. human-computer interaction interface; 5. control system. DETAILED DESCRIPTION

[0028] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Example

[0032] Reference Figure 1 , is a method for measuring the temperature of a mold 1 disclosed in the present invention, the invention comprising:

[0033] Step S101, a temperature measuring hole is opened on the mold 1, a temperature measuring sensor 2 is installed in the temperature measuring hole, and temperature measurement data of the temperature measuring sensor 2 is obtained, wherein the temperature measurement data is the internal temperature of the mold 1, and the distance from the bottom of each temperature measuring hole to the surface of the mold cavity 1 is consistent;

[0034] Specifically, the temperature measuring holes should be roughly evenly distributed on the projection surface of the mold cavity 1. In addition, measuring holes are set at the maximum and minimum wall thickness positions of the mold 1 and at heat concentration locations such as the pouring riser and the cavity corner. Several temperature measuring holes are opened on the mold 1, and temperature measuring sensors 2 are installed in the holes to obtain temperature data of each temperature measuring point. The cavity surface is the inner surface of the mold.

[0035] Step S102, installing an infrared imaging thermometer 3 to obtain a thermal imaging image of the surface of the mold 1, and obtaining infrared temperature measurement data around each temperature measuring hole based on the thermal imaging image. The infrared imaging thermometer 3 maintains a measurement distance from the surface of the mold 1, wherein the infrared temperature measurement data is the external temperature of the mold 1, and the measurement distance is the distance at which the infrared imaging thermometer 3 can measure the temperature values ​​around all the temperature measuring holes on the surface of the mold 1;

[0036] An infrared imaging thermometer 3 is installed at a certain distance from the surface of the mold 1 to obtain a thermal image of the surface of the mold 1. The control system 5 maps and compares the temperature measurement data of the temperature sensor 2 with the thermal image of the surface of the mold 1, and can derive an image reflecting the temperature field inside the mold 1 through interpolation calculation, and display the actual temperature of any point in the image.

[0037] The infrared imaging thermometer 3 measures the temperature of the mold 1 in a non-contact manner, avoiding direct contact between the temperature sensor 2 and the mold 1 in the traditional temperature measurement method, thereby reducing errors and losses caused by contact and improving the accuracy and stability of the measurement. The infrared imaging thermometer 3 can monitor the temperature distribution on the surface of the mold 1 in real time and present it intuitively in the form of a thermal image. This enables the staff to quickly capture the temperature changes on the surface of the mold 1, discover problems in time and take measures to adjust them, thereby ensuring the stable operation of the mold 1 and the product quality. The infrared imaging thermometer 3 can measure the temperature of the mold 1 within a certain measurement distance, which allows the staff to operate in a safe position and avoid the safety risks caused by approaching the high-temperature mold 1.

[0038] like Figure 2 As shown, several temperature measuring holes are opened on the mold 1, and temperature measuring sensors 2 are installed in the holes to measure the temperature of each point inside the mold 1; the distance from the bottom of each temperature measuring hole to the surface of the mold 1 cavity is consistent. The location of the temperature measuring holes should evenly cover the entire range of the cavity, and additional temperature measuring points should be added in the heat gathering area of ​​the mold 1 cavity; the location of the temperature measuring points in the gradual thickness change area of ​​the mold 1 should be distributed in the maximum, minimum and intermediate transition areas of the wall thickness.

[0039] Step S103, obtaining a mapping relationship between the internal temperature and the external temperature corresponding to the mold 1;

[0040] Specifically, the control system 5 maps and compares the measurement data of each temperature sensor 2 and the temperature values ​​around each temperature measuring hole obtained through the thermal imaging image, and draws an image reflecting the temperature distribution inside the mold 1 after interpolation correction calculation.

[0041] Step S104, when the mold 1 corresponding to the mapping relationship is used for production, the temperature data of the mold 1 is displayed.

[0042] Specifically, the human-computer interaction interface 4 is used to display the internal thermal image of the mold 1 drawn by the control system 5, and to display the temperature value of any point selected by the operator. When the mold is used for production, the mold surface temperature is measured by an infrared imaging thermometer, and after conversion through a mapping relationship, the internal temperature of the mold is displayed.

[0043] Furthermore, when the mold 1 is used to start production, the internal temperature and time corresponding to each temperature measuring hole are recorded; when the mold 1 is used to start production, the external temperature and time corresponding to each temperature measuring hole are recorded.

[0044] Specifically, this process is to record the temperature of the experimental mold 1 at the stage of obtaining the mapping relationship. By recording the internal temperature and the external temperature of the temperature measuring hole, it is convenient to obtain the mapping relationship between the internal temperature and the external temperature in the subsequent operation process.

[0045] Furthermore, the time-temperature curve of the internal temperature corresponding to each temperature measuring hole is obtained according to the internal temperature and time; the time-temperature curve of the external temperature corresponding to each temperature measuring hole is obtained according to the external temperature and time. The time-temperature curve of the internal temperature and the time-temperature curve of the external temperature corresponding to a temperature measuring hole are merged into the same time-temperature coordinate system. The data of the time-temperature coordinate system is interpolated to obtain the mapping relationship between the internal temperature and the external temperature.

[0046] Specifically, the time-temperature curve of the internal temperature and the time-temperature curve of the external temperature can be obtained to obtain the relationship between the internal temperature and the external temperature of the mold 1 according to the change of time. The mapping relationship between the internal temperature and the external temperature of the mold 1 during the production process can be observed more intuitively. Regarding interpolation calculation: In the scheme, some temperature measurement points are selected to install temperature sensors. For the areas between these points on the entire surface, no temperature sensors are installed. The data of any point in these intermediate areas can only be obtained through interpolation calculation using the data of each temperature measurement point.

[0047] Further, the internal temperature thermal imaging image is obtained according to the external temperature of the external temperature thermal imaging image and the mapping relationship. The external temperature thermal imaging image and the internal temperature thermal imaging image are displayed through the human-computer interaction interface 4; the external temperature thermal imaging image and the internal temperature thermal imaging image are updated in real time. The temperature data of the mold 1 at a specific point is viewed by selecting the coordinates of the external temperature thermal imaging image and the internal temperature thermal imaging image, wherein the temperature data of the mold 1 includes the internal temperature and the external temperature.

[0048] Specifically, the user can visually observe the internal temperature and external temperature of each position on the thermal image, and the thermal image generated by the control system 5 is directly displayed in the human-computer interaction interface 4. In order to allow the user to observe more conveniently, the user can also obtain the internal temperature and external temperature of the clicked position by clicking on the position of the mold 1 in the thermal image.

[0049] like Figure 3 as well as Figure 4As shown, the internal temperature data of the mold 1 measured by each temperature sensor 2 are t1~t7 respectively, and the peripheral temperatures of the temperature measuring hole measured by the infrared imaging thermometer 3 are t01~t07 respectively. Taking the first temperature measuring hole as an example, during the entire working process of the mold 1, the control system 5 can record the temperature value change at the bottom of the temperature measuring hole to form a curve in the time-temperature coordinate system; at the same time, the control system 5 reads the data of the thermal imaging image obtained by the infrared imaging thermometer 3 to obtain the time-temperature curve around the temperature measuring hole. The two curves are merged into the same time-temperature coordinate system, and a mapping relationship t1=f(t01) can be established for any temperature value. The same method can be used to obtain the temperature mapping relationship tn=f(t0n) at all temperature measuring points; then, through interpolation calculation, the mapping relationship between the internal and external temperatures of the mold 1 in the area between each temperature measuring point can be obtained.

[0050] The temperature sensors 2 in each temperature measuring hole are only used to establish a mapping relationship. After the mapping relationship is established, all temperature sensors 2 can be removed. When measuring the internal temperature of the mold 1, it is only necessary to use an infrared imaging thermometer 3 to obtain a thermal image of the mold 1. The control system 5 uses the mapping relationship obtained above to map and convert the temperature of each point on the thermal image to obtain a thermal image reflecting the temperature distribution inside the mold 1, and displays it on the human-machine interface 4 (HMI). When continuous measurement is performed during the production process, the thermal image displayed on the HMI can also update data in real time, and can intuitively display the temperature changes inside the mold 1. The operator can display the temperature data of a specific point by clicking the mouse or entering coordinates.

[0051] The working principle and beneficial effects of the present invention are:

[0052] (1) After accurately mapping and comparing the measurement data of the temperature sensor 2 with the thermal image captured by the infrared imaging thermometer 3, it is confirmed that the accuracy and reliability of the infrared imaging thermometer 3 meet the production monitoring standards. At this time, the traditional temperature sensor 2 can be removed and only the efficient infrared imaging thermometer 3 can be used to complete the real-time temperature measurement of the mold 1 during the production process. This transformation not only simplifies the operation process, but also significantly improves the measurement efficiency, further improving the automation and intelligence level of the production line.

[0053] (2) The advantage of the infrared imaging thermometer 3 is that it can intuitively display the temperature distribution of the mold 1 and present it in the form of a thermal image. This visual temperature monitoring method enables the staff to quickly capture any abnormally high or low temperature areas on the mold 1, so as to take timely measures to make adjustments. In addition, the infrared imaging thermometer 3 can also provide accurate temperature data at any point on the mold 1, which is of great significance for accurately controlling the temperature of the mold 1, optimizing production process parameters, and improving product quality.

[0054] (3) In the actual production process, the infrared imaging thermometer 3 uses a non-contact measurement method, which greatly avoids the use loss of the traditional temperature sensor 2 caused by long-term contact with the high-temperature mold 1. At the same time, since physical contact is reduced, the risk of production line shutdown due to sensor failure is also reduced. This non-contact measurement method not only improves the safety and stability of the measurement, but also extends the service life of the temperature measuring equipment and reduces the company's maintenance costs. Therefore, the application of the infrared imaging thermometer 3 in the field of mold 1 temperature monitoring has broad prospects and far-reaching significance.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for measuring mold temperature, characterized in that: include: A temperature measuring hole is opened on the mold (1), a temperature measuring sensor (2) is installed in the temperature measuring hole, and temperature measurement data of the temperature measuring sensor (2) is obtained, wherein the temperature measurement data is the internal temperature of the mold (1), and the distance from the bottom of each temperature measuring hole to the surface of the mold cavity (1) is consistent; An infrared imaging thermometer (3) is installed to obtain a thermal imaging image of the surface of the mold (1), and infrared temperature measurement data around each temperature measuring hole is obtained based on the thermal imaging image. The infrared imaging thermometer (3) maintains a measurement distance from the surface of the mold (1), wherein the infrared temperature measurement data is the external temperature of the mold (1), and the measurement distance is the distance at which the infrared imaging thermometer (3) can measure the temperature values ​​around all the temperature measuring holes on the surface of the mold (1); Acquire a mapping relationship between the internal temperature and the external temperature corresponding to the mold (1); When the mold (1) corresponding to the mapping relationship is used for production, the temperature data of the mold (1) is displayed.

2. A method for measuring mold temperature according to claim 1, characterized in that: Obtaining a mapping relationship between the internal temperature and the external temperature corresponding to the mold (1), comprising: When the mold (1) is used to start production, the internal temperature and time corresponding to each temperature measuring hole are recorded; When the mold (1) is used to start production, the external temperature and time corresponding to each temperature measuring hole are recorded.

3. A method for measuring mold temperature according to claim 2, characterized in that: Obtaining a mapping relationship between the internal temperature and the external temperature corresponding to the mold (1), comprising: Obtaining a time-temperature curve of the internal temperature corresponding to each temperature measuring hole according to the internal temperature and time; The time-temperature curve of the external temperature corresponding to each temperature measuring hole is obtained according to the external temperature and time.

4. A method for measuring mold temperature according to claim 3, characterized in that: Obtaining a mapping relationship between the internal temperature and the external temperature corresponding to the mold (1), comprising: The time-temperature curve of the internal temperature and the time-temperature curve of the external temperature corresponding to one of the temperature measuring holes are merged into the same time-temperature coordinate system.

5. A method for measuring mold temperature according to claim 4, characterized in that: Obtaining a mapping relationship between the internal temperature and the external temperature corresponding to the mold (1), comprising: The data of the time-temperature coordinate system is interpolated to obtain a mapping relationship between the internal temperature and the external temperature.

6. A method for measuring mold temperature according to claim 1, characterized in that: When the mold (1) corresponding to the mapping relationship is used for production, the temperature data of the mold (1) is displayed, including: The internal temperature thermal imaging image is obtained according to the external temperature of the external temperature thermal imaging image and the mapping relationship.

7. A method for measuring mold temperature according to claim 6, characterized in that: When the mold (1) corresponding to the mapping relationship is used for production, the temperature data of the mold (1) is displayed, including: The external temperature thermal imaging image and the internal temperature thermal imaging image are displayed through a human-computer interaction interface (4); The external temperature thermal imaging image and the internal temperature thermal imaging image are updated in real time.

8. A method for measuring mold temperature according to claim 7, characterized in that: When the mold (1) corresponding to the mapping relationship is used for production, the temperature data of the mold (1) is displayed, including: The temperature data of the mold (1) at a specific point is viewed by selecting the coordinates of the external temperature thermal imaging image and the internal temperature thermal imaging image, wherein the temperature data of the mold (1) includes the internal temperature and the external temperature.

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