Device aging device and method

Abstract

The invention provides a device aging device and method, and an aging plate in the device aging device is arranged in a heat preservation box, and is connected with a microwave test module and a power supply module outside the heat preservation box, so that the microwave test module and the power supply module provide microwave signals and power required by testing for the aging plate. The aging board is provided with a plurality of test stations, each test station is provided with a plurality of connecting terminals, the first end of each connecting terminal is connected with the connector of the heat preservation box, the aging board is connected with the microwave test module and the power supply module through the connecting terminals and the connector, and in the heat preservation box, the aging board is connected with the microwave test module and the power supply module through the connecting terminals and the connector. And aging at different environment temperatures can be realized. Each aging seat is used for installing a plurality of tested devices, after the plurality of tested devices are installed on the aging seats, the aging seats are installed on the test stations on the aging plate, and the aging plate is provided with the plurality of test stations, so that the plurality of aging seats can be arranged on the aging plate, and batch tested devices can be synchronously subjected to an aging experiment.

Description

Technical Field

[0001] The present application relates to the technical field of electronic device testing, and in particular to a device aging device and a testing method. Background Art

[0002] The aging test of microwave amplifiers is divided into static aging and dynamic aging. Static aging means that under set environmental conditions, only voltage is provided to the power supply end of the circuit, and microwave excitation is not provided to make it work normally; dynamic aging means that under set environmental conditions, microwave excitation of specified conditions is provided to the aging device to make it work normally. Therefore, compared with static aging, dynamic aging is more comprehensive and effective in eliminating microwave device failure modes. During the device development, application verification, and reliability evaluation stages, designers will independently build a small-scale dynamic aging system to perform life estimation, reliability evaluation, etc., but there is currently no universal batch dynamic aging device in the industry, and dynamic aging tests cannot be carried out in batches under mass production conditions. Summary of the invention

[0003] In view of this, the purpose of the present application is to propose a device aging apparatus to solve the problem in the prior art that device aging tests cannot be carried out in batches.

[0004] Based on the above purpose, the present application provides a device aging device, comprising:

[0005] The heat preservation box has a connector on its side wall, and one end of the connector facing the outer wall of the heat preservation box is connected to the microwave test module and the power supply module respectively;

[0006] An aging plate is arranged in the heat preservation box, and is provided with a plurality of test stations, each of which is provided with a plurality of connection terminals, and a first end of each of the connection terminals is connected to the connector;

[0007] A plurality of aging seats are provided, and the plurality of aging seats correspond one to one with the plurality of test stations. The top of each aging seat is provided with a plurality of mounting seats for mounting the device under test, and the bottom is provided with a connector connected to the device under test, and the connector is connected to the second end of the connecting terminal so that the device under test is connected to the microwave test module and the power supply module.

[0008] Optionally, the aging board is a circuit board, and conductive circuits corresponding one-to-one to the plurality of connection terminals are provided on the aging board, and the conductive circuits are connected to the connector.

[0009] Optionally, the connector is arranged through the thermal insulation box, and the connector includes a first microwave signal channel, a second microwave signal channel, and a power supply and current return detection channel, a first end of the first microwave signal channel is connected to a first end of the connection terminal, a first end of the second microwave signal channel is connected to a second end of the connection terminal, and a first end of the power supply and current return detection channel is connected to a third end of the connection terminal;

[0010] The second ends of the first microwave signal channel and the second microwave signal channel are both connected to the microwave test module, and the second end of the power supply and current feedback channel is connected to the power supply module.

[0011] Optionally, the microwave test module includes a microwave input submodule and a microwave output submodule, the microwave input submodule is connected to the first microwave signal channel, and the microwave output submodule is connected to the second microwave signal channel.

[0012] Optionally, the microwave input submodule includes a microwave signal source and a power divider, the output end of the microwave signal source is connected to the input end of the power divider, and the output end of the power divider is connected to the first microwave signal channel of the connector.

[0013] Optionally, the microwave output submodule includes a switch and a detector, the input end of the switch is connected to the second microwave signal channel of the connector, and the output end of the switch is connected to the input end of the detector.

[0014] Optionally, the microwave test module further includes an AD sampling submodule, and an input end of the AD sampling submodule is connected to an output end of the detector.

[0015] Optionally, the aging seat includes a shell, a plurality of mounting cavities arranged in an array are provided in the shell, a microwave board is provided in each mounting cavity, a plurality of the mounting seats correspond one-to-one to the microwave boards, and are respectively connected to the first end of the microwave boards through conductive devices, and the connector is connected to the second end of the microwave board.

[0016] Based on the same inventive concept, the present application also provides a device aging method, comprising:

[0017] Calibrate the microwave test module using a preset calibration board to obtain the calibrated microwave test module;

[0018] The calibrated microwave test module is used to perform an aging test on the device under test.

[0019] Optionally, the microwave module includes a microwave input submodule and a microwave output submodule;

[0020] The step of calibrating the microwave test module by using a preset calibration board to obtain the calibrated microwave test module comprises:

[0021] Connecting a power meter to the microwave input submodule, and using the microwave input submodule to input an excitation signal to the preset calibration board to obtain the power meter data;

[0022] Calibrate the microwave input submodule according to the power meter data;

[0023] After the microwave input submodule is calibrated, an initial excitation signal is sent to a preset calibration board using the calibrated microwave input submodule to obtain an output signal of the microwave output submodule;

[0024] The microwave output submodule is calibrated according to the output signal of the microwave output submodule and the initial excitation signal to obtain the calibrated microwave test module.

[0025] As can be seen from the above, the present application provides a device aging device and method, wherein the aging board in the device aging device is arranged in an incubator and connected to a microwave test module and a power supply module outside the incubator, so that the microwave test module and the power supply module provide the aging board with microwave signals and power required for testing. The aging board is provided with multiple test stations, each test station is provided with multiple connection terminals, and the first end of each connection terminal is connected to the connector of the incubator, so that the aging board is connected to the microwave test module and the power supply module through the connection terminals and the connector, and aging at different ambient temperatures can be achieved in the incubator. Each aging seat is used to install multiple devices under test. After the multiple devices under test are installed in the aging seat, the aging seat is installed on the test station on the aging board. The aging board is provided with multiple test stations, so multiple aging seats can be set on the aging board, so that batches of devices under test can be synchronously aging experiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A schematic diagram of the structural framework of a device aging device according to an embodiment of the present application;

[0028] Figure 2 This is a schematic diagram of the structure of a microwave test module according to an embodiment of the present application;

[0029] Figure 3This is a schematic diagram of the cross-sectional structure of an incubator according to an embodiment of the present application;

[0030] Figure 4 This is a schematic diagram of an explosion of an aging seat according to an embodiment of the present application;

[0031] Figure 5 This is a schematic diagram of the structure of the aging seat according to an embodiment of the present application;

[0032] Figure 6 This is a schematic diagram of the connector structure of an embodiment of the present application;

[0033] Figure 7 This is a schematic diagram of the structure of a power divider according to an embodiment of the present application;

[0034] Figure 8 This is a schematic diagram of the structure of the detection component of an embodiment of the present application;

[0035] Fig. 9 This is a schematic diagram of the calibration board structure of an embodiment of the present application;

[0036] Fig.10 A schematic diagram of a gain curve of an embodiment of the present application;

[0037] Fig.11 A schematic diagram of a device aging method flow chart of an embodiment of the present application;

[0038] Fig.12 A schematic diagram of the hardware structure of an electronic device according to an embodiment of the present application.

[0039] Reference numerals:

[0040] 1. Aging board; 2. Aging seat; 3. Insulation box; 4. Microwave test module; 5. Power supply module; 6. Connector; 7. AD sampling submodule; 11. Connecting terminal; 12. Conductive circuit; 41. Microwave input submodule; 42. Microwave output submodule; 8. Device under test; 21. Shell; 22. Mounting cavity; 23. Microwave board; 24. Connector; 25. Mounting seat; 26. Conductive device; 261. First conductive device; 262. Second conductive device; 61. First microwave signal channel; 62. Power supply and current return detection channel; 63. Second microwave signal channel; 31. Heating wire. DETAILED DESCRIPTION

[0041] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0042] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0043] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0044] Reference Figure 1 , the present application provides a device aging device, comprising:

[0045] The insulation box 3 has a connector 6 on its side wall, and one end of the connector 6 facing the outer wall of the insulation box 3 is connected to the microwave test module 4 and the power supply module 5 respectively;

[0046] The aging plate 1 is arranged in the heat preservation box 3, and is provided with a plurality of test stations, each of which is provided with a plurality of connection terminals 11, and a first end of each of the connection terminals 11 is connected to the connector 6;

[0047] There are multiple aging seats 2, and the multiple aging seats 2 correspond one to one with the multiple test stations. The top of each aging seat 2 is provided with multiple mounting seats 25 for mounting the device under test 8, and the bottom is provided with a connecting head 24 connected to the device under test 8. The connecting head 24 is connected to the second end of the connecting terminal 11 to connect the device under test 8 with the microwave test module 4 and the power supply module 5.

[0048] Specifically, a heater may be provided in the heat preservation box 3, and a heating wire 31 may be wound around the bottom or side wall of the heat preservation box 3 (eg, Figure 3As shown in the figure, the power supply end of the heater passes through the incubator 3 and is connected to the temperature controller located outside the incubator 3. The internal temperature of the incubator 3 can be controlled by setting a heating wire 31 inside the incubator 3. A temperature sensor can also be set inside the incubator 3 to measure the internal temperature of the incubator 3, and the measured temperature sensor is transmitted to the control system. The control system controls the temperature controller to heat or stop heating the incubator 3 according to the temperature value. When the internal temperature of the incubator 3 does not reach the test temperature, the incubator 3 can be heated by starting the temperature controller. If the internal temperature of the incubator 3 exceeds the test temperature, the heating of the incubator 3 is stopped, or the cover of the incubator 3 is opened to achieve a heat dissipation effect, and the test is performed after the heat is automatically dissipated.

[0049] The aging board 1 is arranged in the incubator 3 and connected to the microwave test module 4 and the power supply module 5 outside the incubator 3, so that the microwave test module 4 and the power supply module 5 provide the microwave signal and power required for the test for the aging board 1. The aging board 1 is provided with a plurality of test stations, each of which is provided with a plurality of connection terminals 11, and the first end of each connection terminal 11 is connected to the connector 6 of the incubator 3, so that the aging board 1 is connected to the microwave test module 4 and the power supply module 5 through the connection terminal 11 and the connector 6, and the aging at different ambient temperatures can be realized in the incubator 3. Each aging seat 2 is used to install a plurality of devices under test 8. After the plurality of devices under test 8 are installed in the aging seat 2, the aging seat 2 is installed on the test station on the aging board 1. The aging board 1 is provided with a plurality of test stations, so a plurality of aging seats 2 can be arranged on the aging board 1, so that batches of devices under test 8 can be subjected to synchronous aging experiments.

[0050] In some embodiments, Figure 1 and Figure 6 As shown, the connector 6 is arranged through the heat preservation box 3, and the connector 6 includes a first microwave signal channel 61, a second microwave signal channel 63, and a power supply and current return detection channel 62. The first end of the first microwave signal channel 61 is connected to the first end of the connection terminal 11, the first end of the second microwave signal channel 63 is connected to the second end of the connection terminal 11, and the first end of the power supply and current return detection channel 62 is connected to the third end of the connection terminal 11;

[0051] The second ends of the first microwave signal channel 61 and the second microwave signal channel 63 are both connected to the microwave test module 4 , and the second end of the power supply and current feedback channel 62 is connected to the power supply module 5 .

[0052] Specifically, the connector 6 in the present application adopts the SMP plug-in type. A hole corresponding to the connection size is opened on the side wall of the heat preservation box 3, and the connector 6 is located in the hole, so that the plug-in ends of the connector 6 protrude from the inner wall and the outer wall of the heat preservation box 3, which is convenient for plugging and unplugging the connector 6 and the line. Figure 6 As shown, the power supply and current feedback channel 62 is located between the first microwave signal channel 61 and the second microwave signal channel 63. The first microwave signal channel 61 is used to provide an excitation signal to the aging plate 1, and can also be called an excitation channel. The channel can provide 32 signals by way of example. The second microwave signal channel 63 is used to output the RF signal fed back by the aging plate 1, and can also be called an RF output channel. The channel can provide 32 signals by way of example. The first end of the first microwave signal channel 61 is connected to the first end of the connection terminal 11 through a line, which is equivalent to the first microwave signal channel 61 being connected to the signal input end of the connection terminal 11 (each channel exemplarily includes 32 lines, each line corresponds to an output end of the connection terminal 11, the line of the line can be routed under the circuit board, and the connection terminal 11 passes through the circuit board and is connected to the line), the first end of the second microwave signal channel 63 is connected to the second end of the connection terminal 11 through a line, which is equivalent to the second microwave signal channel 63 being connected to the signal output end of the connection terminal 11 (each channel exemplarily includes 32 lines, each line corresponds to an output end of the connection terminal 11, the line of the line can be routed under the circuit board, and the connection terminal 11 passes through the circuit board and is connected to the line), the second ends of the first microwave signal channel 61 and the second microwave signal channel 63 are connected to the microwave test module 4, so that the microwave test module 4 can send an excitation signal to the aging board 1 through the first microwave signal channel 61, and the device under test 8 arranged on the aging board 1 feeds back a radio frequency signal after receiving the excitation signal, and feeds back a radio frequency signal to the microwave test module 4 through the second microwave signal channel 63. In this way, the signal can be transmitted to the signal input end of the connection terminal 11 of the aging board 1, and then transmitted to the device under test 8 of the aging seat 2 connected to the connection terminal 11. When the device under test 8 feeds back the RF signal, it is fed back to the microwave test module 4 through the output end of the connection terminal 11. This connection method can realize that the sent excitation signal and the fed-back RF signal have independent channels without affecting the transmission between the signals.

[0053] In some embodiments, Figure 4 and Figure 5 As shown, the aging seat 2 includes a shell 21, and a plurality of array-arranged mounting cavities 22 are provided in the shell 21. Each mounting cavity 22 is provided with a microwave board 23 assembled together. A plurality of mounting seats 25 correspond to the microwave boards 23 one by one, and are respectively connected to the first ends of the microwave boards 23 through conductive devices 26, and the connector 24 is connected to the second end of the microwave board 23.

[0054] Specifically, the aging seat 2 includes a shell 21, and eight array-arranged mounting cavities 22 are provided in the shell 21. A microwave board 23 is provided inside each mounting cavity 22. There are eight connectors 24, and the eight connectors 24 are arranged at the bottom of each mounting cavity 22. The connecting terminals 11 on each test station on the aging board 1 correspond to the eight connectors 24 one by one, that is, eight connecting terminals 11 are included. Therefore, one aging seat 2 can realize the test of eight devices under test 8. The test of multiple aging boards 1 can be realized in the incubator 3, so batch testing can be realized to improve the test efficiency.

[0055] Furthermore, if Figure 4 As shown, the shell 21 includes a base, an intermediate shell and a top cover connected in sequence, the base is provided with a plurality of grooves, the intermediate shell is provided with cavities corresponding to the plurality of grooves, the grooves and the cavities form the mounting cavity 22, the microwave board 23 is located in the grooves, the conductive device 26 penetrates the cavity and is connected to the microwave board 23, the top cover is provided with a through hole, the conductive device 26 penetrates the through hole and is connected to the mounting seat 25.

[0056] Specifically, the conductive device 26 includes a first conductive device 26126 and a second conductive device 26226, wherein the first conductive device 26126 is located in the cavity of the intermediate shell and covered by the top cover, the second conductive device 26226 is located in the through hole of the top cover, one end of the second conductive device 26226 abuts against the first conductive device 26126 to achieve the connection between the second conductive device 26226 and the first conductive device 26126, and the other end of the second conductive device 26226 is connected to the mounting seat 25. The mounting seat 25 is arranged above the top cover to facilitate the installation of the device under test 8.

[0057] In some embodiments, Figure 1 As shown, the aging board 1 is a circuit board, and the aging board 1 is provided with conductive circuits 12 corresponding one-to-one to the plurality of connection terminals 11 , and the conductive circuits 12 are connected to the connector 6 .

[0058] Specifically, Figure 1In the figure, the aging board 1 is a circuit board, and the circuit board can be placed in the insulation box 3 or fixed in the insulation box 3 by bolts. Each test station of the aging board 1 corresponds to a group of conductive circuits 12. Exemplarily, the multiple connection terminals 11 on each test station include 8, and every two connection terminals 11 share a conductive circuit 12, which can save the layout space of the conductive circuits 12. All conductive circuits 12 are connected to the power supply and return inspection channels of the connector 6, so that the aging board 1 and the power supply module 5 are connected through the connector 6, and the connector 6 can be an SMP plug-in connection. In this way, the gold finger method in the traditional aging box is eliminated. During the test, the operator can install and disassemble the aging board 1 by plugging and unplugging, which is more convenient to operate.

[0059] In some embodiments, Figure 1 and Figure 2 As shown, the microwave test module 4 includes a microwave input submodule 41 and a microwave output submodule 42 . The microwave input submodule 41 is connected to the first microwave signal channel 61 , and the microwave output submodule 42 is connected to the second microwave signal channel 63 .

[0060] Specifically, based on the above embodiment, the first microwave signal channel 61 is used to transmit the channel of the emitted excitation signal, and the second microwave signal channel 63 is used to transmit the channel of the fed-back RF signal. Therefore, the microwave input submodule 41 is connected to the first microwave signal channel 61, so that the microwave test module 4 provides the excitation signal to the device under test 8 through the first microwave signal channel 61; the microwave output submodule 42 is connected to the second microwave signal channel 63, so that the microwave test module 4 receives the RF signal fed back by the device under test 8 through the second microwave signal channel 63.

[0061] In some embodiments, Figure 2 As shown, the microwave input submodule 41 includes a microwave signal source and a power divider, the output end of the microwave signal source is connected to the input end of the power divider, and the output end of the power divider is connected to the first microwave signal channel 61 of the connector 6.

[0062] Specifically, the microwave signal source can be a device that emits microwave signals. The power divider is a one-to-eight power divider. The microwave signal source is used to provide an excitation signal to the device under test 8 on the aging board 1. After the microwave signal source sends a signal, the signal is divided into eight paths by a one-to-eight power divider. Each power divider can provide an excitation signal for an aging base, so that eight devices under test 8 can be tested at the same time. Since the above embodiment includes 4 test stations, each test station includes 8 connection terminals 11, the microwave input submodule 41 in this embodiment includes 4 groups of microwave signal sources and power dividers, which correspond one-to-one to the 4 test stations, so as to achieve batch testing of the devices under test 8.

[0063] In some embodiments, Figure 1 and Figure 2 As shown, the microwave output submodule 42 includes a switch and a detector, the input end of the switch is connected to the second microwave signal channel 63 of the connector 6, and the output end of the switch is connected to the input end of the detector.

[0064] Specifically, the switch is a single-pole eight-throw switch such as Figure 7 As shown. After receiving the excitation signal, the device under test 8 feeds back the RF signal to the microwave test module 4. Since the aging base includes 8 mounting cavities 22, 8 devices under test 8 can be tested. Therefore, the microwave output submodule 42 adopts a single-pole eight-throw switch, which corresponds to each aging seat 2 one by one. And since the aging board 1 includes 4 test stations, the output submodule in this embodiment includes four sets of switches and detectors, which can ensure the accurate testing of each test station, avoid the influence between the signals of the test stations, and achieve stable testing. The RF signal fed back by the device under test 8 is transmitted to the detector through the boat, and the signal is converted into voltage by the detector.

[0065] In some embodiments, Figure 2 As shown, the microwave test module 4 further includes an AD sampling submodule 7, and an input end of the AD sampling submodule 7 is connected to an output end of the detector.

[0066] Specifically, on the basis of the above embodiment, after the detector receives the radio frequency signal and converts the voltage, it is transmitted to the AD sampling submodule 7, and the AD sampling submodule 7 performs voltage sampling, so that the test result is more accurate.

[0067] The specific implementation of this application is as follows:

[0068] This application plans the test capacity of 16 aging boards 1. The power supply, signal excitation, and signal acquisition of the 16 aging boards 1 are independent of each other. Different aging boards 1 can carry out aging tests under different test conditions, so the device can support up to 16 amplifiers of different specifications for aging tests at a time. A single aging board 1 can carry out aging tests on up to 32 devices, so the entire device supports up to 512 (16*32) devices for testing. This scale of batch dynamic aging capability is an innovative breakthrough in the industry.

[0069] The working principle of the whole device is briefly introduced with a single aging plate 1 as the starting point. Figure 2As shown, the principle block diagram can be divided into three parts: the excitation part, the test part, and the return inspection part, wherein the excitation part and the return inspection part are completed by the microwave test module 4. When conducting the dynamic aging test, it is necessary to provide environmental temperature conditions, so the test part needs to be placed in the incubator 3, and the excitation part and the return inspection part are outside the incubator. First, the excitation part is introduced. There are 32 test devices (that is, the device under test 8), so 32 microwave signal excitations are also required, which are mainly generated by the signal source + power division method. A 4-channel output signal source and 4 1-to-8 microwave power dividers are configured to generate 32 (4*8) microwave signals. In order to prevent the power divider from being unbalanced due to no-load, the forward transmission design is also carried out on each channel to achieve the effect of forward conduction and reverse isolation, which greatly reduces the power imbalance problem caused by no-load.

[0070] Next, the test part is introduced. The test part is mainly the aging board 1. The aging board 1 adopts a separate design and is divided into a microwave board 23. The two parts can be assembled together during the test. The microwave board 23 is mainly used to match the peripheral circuits of the test device to ensure that the device can work normally. The actual microwave board 23 is as follows Figure 4 As shown, in order to reduce costs, 8 microwave boards 23 are placed in an eight-station aging socket as a group. The aging socket is a cavity structure, which has a good electromagnetic shielding effect and can effectively avoid interference and oscillation between devices. It is an important measure in the large-scale aging test process. 8 groups of connectors 24 (also known as spring pins) are pre-buried under the aging seat 2, which are mainly used to connect the microwave board 23 and power the microwave board 23. The aging board 1 (which can be understood as a power supply board) mainly provides power for each device under test 8, and designs a current return detection circuit (the current return detection circuit can be understood as a circuit set at the power supply end of the power supply module 5 for detection, using existing technology), and transmits the return detection signal back to the driver board for collection. At the same time, the aging board 1 (which can be understood as a power supply board) is reserved with mounting holes and power supply pads to facilitate the installation and electrical connection of the microwave aging seat 2. One end of the connector 24 (i.e., spring pin) on the aging seat 2 is welded to the microwave board 23, and the other end is suspended. When the microwave board 23 is assembled together, the suspended end is connected to the power supply pad on the aging board 1 (which can be understood as a power supply board) to form a loop. The overall assembly effect of the aging board 1 is as follows: Figure 1 shown.

[0071] In the back detection part, a multi-port detection component was developed to meet the detection requirements of the output microwave signal power level. Figure 8 The detection component consists of a single-pole eight-throw microwave switch and a detector. The eight RF input terminals are connected to the RF output terminals of the test device. The RF signal enters the detector in turn through the switch for voltage conversion, and is finally transmitted to the A / D through the voltage output terminal for voltage sampling.

[0072] In summary, the beneficial effects of the present application are as follows: the aging device can provide power supply and microwave excitation for each test device separately and monitor the current and output power in real time: the microwave circuit and DC circuit are designed separately, which not only avoids the field-circuit coupling problem, but also allows different devices to reuse the power supply circuit board; the microwave excitation source can be calibrated to ensure the accuracy of the output power intensity of the excitation signal; the output power acquisition accuracy can be calibrated to ensure the accuracy of the acquisition accuracy.

[0073] Based on the same inventive concept, Fig.11 As shown, the present application also provides a device aging method, comprising the following steps:

[0074] Step 102: calibrating the microwave test module using a preset calibration board to obtain the calibrated microwave test module;

[0075] Step 104: Use the calibrated microwave test module to perform an aging test on the device under test.

[0076] Specifically, using a preset calibration package to calibrate the microwave test module can ensure that an accurate signal can be sent when testing the device under test, and after receiving a feedback signal, the problem of the device under test can be accurately determined, thereby improving the test effect.

[0077] In some embodiments, the microwave module includes a microwave input submodule and a microwave output submodule;

[0078] The step of calibrating the microwave test module by using a preset calibration board to obtain the calibrated microwave test module comprises:

[0079] Connecting a power meter to the microwave input submodule, and using the microwave input submodule to input an excitation signal to the preset calibration board to obtain the power meter data;

[0080] Calibrate the microwave input submodule according to the power meter data;

[0081] After the microwave input submodule is calibrated, an initial excitation signal is sent to a preset calibration board using the calibrated microwave input submodule to obtain an output signal of the microwave output submodule;

[0082] The microwave output submodule is calibrated according to the output signal of the microwave output submodule and the initial excitation signal to obtain the calibrated microwave test module.

[0083] Specifically, during use, the signal excitation may cause the output power level to drop, and the physical characteristics of the components inside the detection assembly may change over time, which may also cause the acquisition accuracy to drop. Therefore, the signal source and detection assembly need to be calibrated to ensure the accuracy and scientificity of the test device of the entire device. In response to the above problems, the following calibration method is designed:

[0084] First, design a calibration board, such as Fig. 9 As shown, terminals 72 and 74 are signal input terminals, terminals 71 and 73 are detection terminals, and the calibration board is made by removing the aging fixture on the aging board, and replacing the terminals 71, 72, 73, and 74 with flange-fixed installation on the board.

[0085] Secondly, the calibration process is designed based on the calibration board. The calibration process is divided into two parts: output signal calibration process and detection calibration process (also known as output calibration process). The main purpose of output signal calibration is to calibrate the output power of the excitation part, and the purpose of detection calibration is to calibrate the acquisition accuracy of the detection component.

[0086] Input end calibration: For example, connect the input interface at test station 1 (which can be understood as terminal 71) to the power meter, short-circuit the other ports to the corresponding station detection terminals, and then send the RF signal in the software calibration interface, using the point frequency calibration mode. If you want to perform power calibration in the range of 1-6GHz, you can freely set the frequency interval. If the interval is 250MHz, you need to calibrate at 20 (5000 / 250) frequency points; at a single frequency point, control the excitation part to send a 0dBm signal, read the value of the power meter as X, and the error between the sent value and the actual value is X. Repeat this operation at 20 different frequency points. After the calibration is completed, the calibration software saves the frequency point information and error data in the calibration data file. When the system is conducting a test, if a microwave excitation of 1GHz and 8dBm is required, the system retrieves the calibration data and finds the X value at the corresponding frequency point, then the control excitation part sets the output power to (8-X)dBm, and finally a high-precision 8dBm signal will be obtained. Since the 32 signals are all output by the power divider, only one signal needs to be calibrated.

[0087] Calibration of the detection end: After the output signal calibration is completed, short-circuit the input interface at the test station 1 and its detection end. At this time, the input signal is a standard power signal, which can be used as a benchmark to calibrate the 32-way detection power. Click on the detection calibration in the software, and the system will automatically calibrate and write the calibration data. At a fixed frequency point, there is a linear relationship between the input power and the conversion gain of the detection component. This feature can greatly simplify the workload of the detection calibration. The detection calibration adopts a single-point, fixed power value calibration mode. If the detection calibration is carried out between 1-6GHz, the frequency interval can be set freely. If the interval is 250MHz, it needs to be calibrated at 20 (5000 / 250) frequency points. When performing calibration at different powers at a certain frequency point, we regard the conversion gain of the detection component as ideal, but the actual situation is as follows Fig.10 As shown, the curve is linear as a whole and nonlinear locally. Therefore, in order to improve the calibration accuracy, it is necessary to segment the input power of the horizontal axis and treat it as an ideal curve within the segment. Suppose we calibrate the detection component at 1GHz, select three power points a, b, and c, inject the corresponding power signal into the detection component, and the data collected from the detection component are a', b', and c' respectively. Then the calibration data is a'-a, b'-b, and c'-c. The above data is saved in the calibration data. When the system is tested, the detection component detects a microwave signal with a frequency of 1GHz and a power of YdBm. If Y is between (a', b'), the detected power level is If Y is between (b', c'), the detected power level is

[0089] It should be noted that the method of the embodiment of the present application can be performed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present application, and the multiple devices will interact with each other to complete the described method.

[0090] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0091] Based on the same inventive concept, corresponding to any of the above-mentioned embodiments, the present application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, a device failure testing method described in any of the above embodiments is implemented.

[0092] Fig.12 A more specific schematic diagram of the hardware structure of an electronic device provided in this embodiment is shown, and the device may include: a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040 are connected to each other through the bus 1050 in the device.

[0093] The processor 1010 can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0094] The memory 1020 may be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 may store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program codes are stored in the memory 1020 and are called and executed by the processor 1010.

[0095] The input / output interface 1030 is used to connect the input / output module to realize information input and output. The input / output module can be configured in the device as a component (not shown in the figure), or it can be externally connected to the device to provide corresponding functions. The input device may include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output device may include a display, a speaker, a vibrator, an indicator light, etc.

[0096] The communication interface 1040 is used to connect a communication module (not shown) to realize communication interaction between the device and other devices. The communication module can realize communication through a wired mode (such as USB, network cable, etc.) or a wireless mode (such as mobile network, WIFI, Bluetooth, etc.).

[0097] The bus 1050 includes a path that transmits information between the various components of the device (eg, the processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040).

[0098] It should be noted that, although the above device only shows the processor 1010, the memory 1020, the input / output interface 1030, the communication interface 1040 and the bus 1050, in the specific implementation process, the device may also include other components necessary for normal operation. In addition, it can be understood by those skilled in the art that the above device may also only include the components necessary for implementing the embodiments of the present specification, and does not necessarily include all the components shown in the figure.

[0099] The electronic device of the above embodiment is used to implement a corresponding device failure test method in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0100] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute a device failure testing method as described in any of the above embodiments.

[0101] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.

[0102] The computer instructions stored in the storage medium of the above embodiment are used to enable the computer to execute a device failure testing method as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0103] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0104] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0105] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0106] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. A device aging device, characterized in that: include: The heat preservation box (3) has a connector (6) on its side wall, and one end of the connector (6) facing the outer wall of the heat preservation box (3) is respectively connected to a microwave test module (4) and a power supply module (5); An aging plate (1) is arranged in the heat preservation box (3), and is provided with a plurality of test stations (01), each of the test stations (01) is provided with a plurality of connection terminals (11), and a first end of each of the connection terminals (11) is connected to the connector (6); A plurality of aging seats (2), the plurality of aging seats corresponding to the plurality of test stations (01) one by one, a plurality of mounting seats (25) for mounting a device under test (8) are provided on the top of each aging seat, and a connector (24) connected to the device under test (8) is provided on the bottom, the connector (24) being connected to the second end of the connection terminal (11) so that the device under test (8) is connected to the microwave test module (4) and the power supply module (5).

2. A device aging device according to claim 1, characterized in that: The aging board (1) is a circuit board, and the aging board (1) is provided with conductive circuits (12) corresponding one-to-one to the plurality of connection terminals (11), and the conductive circuits (12) are connected to the connector (6).

3. A device aging device according to claim 1, characterized in that: The connector (6) is arranged to pass through the thermal insulation box (3), and the connector (6) comprises a first microwave signal channel (61), a second microwave signal channel (63), and a power supply and current return detection channel (62), wherein a first end of the first microwave signal channel (61) is connected to a first end of the connection terminal (11), a first end of the second microwave signal channel (63) is connected to a second end of the connection terminal (11), and first ends of the power supply and current return detection channel (62) are both connected to a third end of the connection terminal (11); The second ends of the first microwave signal channel (61) and the second microwave signal channel (63) are both connected to the microwave test module (4), and the second end of the power supply and current feedback channel (62) is connected to the power supply module (5).

4. A device aging device according to claim 3, characterized in that: The microwave test module (4) comprises a microwave input submodule (41) and a microwave output submodule (42); the microwave input submodule (41) is connected to the first microwave signal channel (61); and the microwave output submodule (42) is connected to the second microwave signal channel (63).

5. A device aging device according to claim 4, characterized in that: The microwave input submodule (41) comprises a microwave signal source and a power divider, the output end of the microwave signal source is connected to the input end of the power divider, and the output end of the power divider is connected to the first microwave signal channel (61) of the connector (6).

6. A device aging device according to claim 4, characterized in that: The microwave output submodule (42) comprises a switch and a detector, the input end of the switch is connected to the second microwave signal channel (62) of the connector (6), and the output end of the switch is connected to the input end of the detector.

7. A device aging device according to claim 6, characterized in that: The microwave test module (4) further comprises an AD sampling submodule (43), the input end of the AD sampling submodule (43) being connected to the output end of the detector.

8. A device aging apparatus according to claim 1, characterized in that: The aging seat (2) comprises a shell (21), wherein a plurality of mounting cavities (22) arranged in an array are provided in the shell (21), wherein each mounting cavity (22) is provided with an assembled microwave board (23), wherein a plurality of mounting seats (25) correspond one to one with the microwave board (23), and are respectively connected to the first end of the microwave board (23) through a conducting device (26), and wherein the connector (24) is connected to the second end of the microwave board (23).

9. A device aging method, characterized in that: include: Calibrate the microwave test module using a preset calibration board to obtain the calibrated microwave test module; The calibrated microwave test module is used to perform an aging test on the device under test.

10. The method according to claim 9, characterized in that The microwave module includes a microwave input submodule and a microwave output submodule; The step of calibrating the microwave test module by using a preset calibration board to obtain the calibrated microwave test module comprises: Connecting a power meter to the microwave input submodule, and using the microwave input submodule to input an excitation signal to the preset calibration board to obtain the power meter data; Calibrate the microwave input submodule according to the power meter data; After the microwave input submodule is calibrated, an initial excitation signal is sent to a preset calibration board using the calibrated microwave input submodule to obtain an output signal of the microwave output submodule; The microwave output submodule is calibrated according to the output signal of the microwave output submodule and the initial excitation signal to obtain the calibrated microwave test module.

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