Crystal circle factory cross-regional production planning method, equipment, medium and product

Abstract

The embodiment of the invention relates to the field of wafer production planning, and discloses a wafer factory cross-regional production planning method and device, a medium and a product. A POLY etch equipment scheduling algorithm is called, and a POLY etch equipment scheduling result is obtained; according to a preset inventory level and the POLY etch equipment scheduling result, obtaining a lot of first batch commissioning; according to the lot of the first batch of commissioning, calling an LITHO equipment scheduling algorithm and adding a first constraint condition to obtain a lot of a second batch of commissioning; and according to the lot of the second batch of commissioning, calling a BARC equipment scheduling algorithm and adding a second constraint condition to obtain a lot of a third batch of commissioning. By calling the scheduling algorithm of each area and setting corresponding constraint conditions, the production rhythms of different processing areas can be effectively coordinated. The technical problem of product scrapping caused by low equipment utilization rate can be at least solved.

Description

Technical Field

[0001] The present application relates to the field of wafer production planning, and in particular to a wafer fab cross-regional production planning method, equipment, medium and product. Background Art

[0002] In the manufacturing process of semiconductor wafers, the graphic structure on the surface of the wafer is gradually formed through multi-layer processing technology, involving complex production processes in multiple areas, including lithography (LITHO) process, etching (ETCH) process, etc. These areas are usually processed by different equipment, and each process step and equipment scheduling in the production process has a direct impact on the final quality of the wafer.

[0003] Among them, DOMA (Dose Mapper) is a technology in ASML lithography machines. By correcting the exposure dose, it can significantly improve the critical dimension uniformity (CDU), including the line width uniformity between exposure areas (inter-field) and within exposure areas (intra-field). However, due to the strict process binding and equipment dependence of multiple processes in the semiconductor manufacturing process, especially the long q-time (process waiting time) limit between lithography and subsequent etching processes (such as POLYEtch) in the DOMA process path, the complexity of production scheduling has increased significantly.

[0004] In the prior art, in order to ensure the stability of key processes, some wafer fabs have adopted the practice of binding the lithography machine (LithoScanner) with the subsequent etching machine (such as POLY Etch Chamber) to maintain consistency in key dimension control. However, this bound DOMA production path often has the problem of long q-time, which leads to the priority of long q-time processes during production scheduling, which in turn causes the accumulation of lots in the front of subsequent equipment, especially the equipment load in the POLY Etch area, increasing the risk of equipment overload and scrapping of work-in-progress. Existing production scheduling methods are difficult to effectively solve these problems, resulting in low equipment utilization and limited production efficiency. Summary of the invention

[0005] One purpose of the present application is to provide a wafer fab cross-regional production planning method, equipment, medium and product, at least to solve the technical problem of low equipment utilization leading to product scrapping.

[0006] To achieve the above objectives, some embodiments of the present application provide the following aspects:

[0007] In the first aspect, some embodiments of the present application also provide a method for cross-regional production planning in a wafer fab, including calling a POLY etch equipment scheduling algorithm to obtain a POLY etch equipment scheduling result; obtaining a first batch of lots put into production based on a preset inventory level and the POLY etch equipment scheduling result; based on the first batch of lots put into production, calling a LITHO equipment scheduling algorithm and adding a first constraint condition to obtain a second batch of lots put into production; based on the second batch of lots put into production, calling a BARC equipment scheduling algorithm and adding a second constraint condition to obtain a third batch of lots put into production.

[0008] In a second aspect, some embodiments of the present application further provide an electronic device, comprising: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, cause the processor to perform the steps of the method described above.

[0009] In a third aspect, some embodiments of the present application further provide a computer-readable medium having computer program instructions stored thereon, wherein the computer program instructions can be executed by a processor to implement the method as described above.

[0010] In a fourth aspect, some embodiments of the present application further provide a computer program product, comprising a computer program / instruction, which implements the steps of the method described above when executed by a processor.

[0011] Compared with the related art, the solution provided in the embodiment of the present application can effectively coordinate the production rhythm of different processing areas by calling the scheduling algorithm of each area and setting corresponding constraints, especially controlling the production rate of POLY etch equipment, LITHO equipment and BARC equipment under the DOMA path, thereby avoiding lot accumulation in front of downstream equipment and reducing the risk of scrapping caused by q-time exceeding the limit. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0013] Figure 1 A schematic diagram of a process flow of a wafer fab cross-regional production planning method provided according to an embodiment of the present application;

[0014] Figure 2 A schematic diagram of wafer scheduling provided according to an embodiment of the present application;

[0015] Figure 3A schematic diagram of a production plan provided according to an embodiment of the present application;

[0016] Figure 4 The present invention is a schematic diagram of an exemplary process of an electronic device provided according to an embodiment of the present application. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0018] The following terms are used in this article.

[0019] 1) DOMA: dose mapper, exposure dose correction;

[0020] 2) CDU: Critical dimension uniformity, critical dimension uniformity / line width uniformity;

[0021] 3) BARC: bottom anti-reflective coating process;

[0022] 4) Litho: photolithography process;

[0023] 5) Scanner: Scanning imaging device in lithography equipment;

[0024] 6) Etch: etching process;

[0025] 7)POLY Etch: a special Etch process;

[0026] 8) Chamber: chamber, a processing unit in semiconductor equipment;

[0027] 9) Wafer: wafer;

[0028] 10) Lot: The unit where wafers are stored;

[0029] 11) q-time: The allowed waiting time from the completion of a step to the next step of the lot.

[0030] First embodiment

[0031] The first embodiment of the present application relates to a method for planning cross-regional production in a wafer fab. Figure 1 As shown, the method may include the following steps:

[0032] S101, calling the POLYetch device scheduling algorithm to obtain the POLYetch device scheduling result;

[0033] S102, obtaining the first batch of lots to be put into production according to the preset inventory level and the POLYetch equipment scheduling result;

[0034] S103, according to the lots put into production in the first batch, calling the LITHO equipment scheduling algorithm and adding the first constraint condition to obtain the lots put into production in the second batch;

[0035] S104: Based on the second batch of lots put into production, call the BARC equipment scheduling algorithm and add the second constraint condition to obtain the third batch of lots put into production.

[0036] For the wafer processing flow in semiconductor production, a layer-by-layer stacking method is used to form a graphical structure on the wafer surface. The production and processing of each layer is mainly processed in the BARC area, LITHO area and ETCH area in turn. In order to effectively control the inventory level of POLY etch equipment, production scheduling is carried out in a reverse manner, that is, starting from the downstream POLYetch equipment, the scheduling results of each area are transmitted forward until the source area of ​​q-time limitation, the BARC area, is reached, thereby controlling the production rate of the lot and avoiding backlog and overload of downstream equipment.

[0037] Part of the data comes from the production scheduling algorithm of semiconductor equipment. The scheduling algorithm and the production planning method of this application are both periodically called, and the algorithm results are updated in each cycle. For the sake of convenience, this application will take a specific calling cycle as an example to describe its working steps and operation process in detail.

[0038] For step S101, the POLY etch equipment is usually composed of multiple independently operated chambers. The production capacity of each chamber can be independently scheduled. By calling the scheduling algorithm, the capacity utilization of each chamber is maximized. The processing batch arrangement of the POLY etch equipment is determined according to the current production status and process requirements of the equipment.

[0039] For step S102, the preset inventory level here is determined based on the actual capacity of each device and historical production data, which is used to ensure that when the production equipment capacity is sufficient, there will be no equipment idleness or production overload. Combined with the scheduling results, the first batch of lots that can be put into production is determined. Taking the LITHO area and the Poly etch area as an example, the equipment capacity is used as the basis. If the capacity of the Poly etch equipment is higher, the inventory level should be higher. When the supply is insufficient, the inventory can still keep the polyetch from being idle for a considerable period of time, and vice versa.

[0040] When the inventory level is insufficient, the replenishment speed of the inventory must be greater than the consumption, that is, the output of the LITHO area within a certain period of time must be greater than the output of the Poly Etch area. Since the production process is dynamically changing, the output rate is also changing in real time. It is not reasonable to control production by detecting the rate. Therefore, the production rate index is converted into a production quantity index within a certain period of time to control production activities. According to the preset inventory water level and the results of the POLY etch equipment scheduling algorithm, the lot that can be put into production is selected.

[0041] For step S103, the first constraint condition is to ensure that the processing order and priority of the first batch of lots in the LITHO equipment are consistent with those of the POLYetch equipment, thereby ensuring the coordination of subsequent processes. The scheduling algorithm of the LITHO equipment also optimizes the production schedule by maximizing the capacity utilization of the equipment and recording the newly put into production lots that can be scheduled in the LITHO area.

[0042] For step S104, the second constraint condition requires that the processing order and priority of the second batch of lots in the BARC equipment be consistent with those of the LITHO equipment. Since there is no q-time limit after the lot arrives at the BARC area, there is no need to transmit the scheduling results upstream. In this way, the entire production process forms a close connection between different equipment, avoiding lot accumulation or q-time overrun problems caused by inconsistent production rhythms.

[0043] It is not difficult to find that compared with the related art, the scheme provided by the embodiment of the present application, the pre-planned and automated scheduling process can reduce human errors, which may occur when quick decisions are needed; through the periodic semiconductor equipment scheduling algorithm, it is ensured that the lot is always in the right place and the right time, which means that the idle time of the equipment is reduced, further improving the utilization rate of the equipment; it can provide a clear production and scheduling view for the management team, helping them to better understand the progress and possible bottlenecks of the production process. In the event of production changes or emergencies, the pre-generated scheduling tasks can be quickly adjusted to improve the flexibility of the manufacturing process; according to the predicted scheduling needs, human and other resources can be allocated more reasonably to ensure the smooth process.

[0044] Second embodiment

[0045] The second embodiment of the present application relates to a method for planning cross-regional production in a wafer fab. The second implementation is an improvement made on the basis of the first embodiment, and the specific improvements are:

[0046] like Figure 2 As shown in Figure 1, three different production scenarios related to Q-time (process waiting time) in the semiconductor production process. By comparing the safety stock level with the Q-time limit, the risks that may be faced under different production strategies are explained:

[0047] At the start of production, the inventory level reaches the safety stock line and the lot processing process is running smoothly. At this time, the lot can be completed within the Q-time limit, there is no idle equipment, and there is no risk of Q-time exceeding the limit. This is an ideal production state, the lot quantity just meets the processing capacity of the equipment, the inventory level is sufficient, and the equipment is running normally.

[0048] The safety stock level is not reached, and the equipment begins to be idle (Risk of machine idle). Due to insufficient inventory, the equipment has no lot to process for a period of time, resulting in the risk of equipment idleness. At this time, the number of lots is insufficient, and the continuous operation of the equipment cannot be guaranteed, which may lead to a decrease in equipment utilization.

[0049] The inventory level exceeds the safety line, and the production rate is too fast, resulting in too many lots, and the Q-time limit is exceeded (Risk of overQT). In this case, the excess lots cannot be processed within the specified Q-time, increasing the risk of production scrapping. At this time, the production rate is too high, the lots are piled up, and the Q-time limit is exceeded, which may cause a large number of products to be scrapped, resulting in production losses.

[0050] The POLYetch process is a key step for etching the graphic structure on the surface of the wafer. The process is usually run in parallel by multiple etching chambers, and each chamber independently processes different lots (wafer batches), so the scheduling of the equipment is crucial. In order to maximize production efficiency, the scheduling algorithm of the POLY etch equipment is called to coordinate the operating status of each chamber, and a reasonable production plan is formulated based on the current production load and process requirements of the equipment.

[0051] like Figure 3 As shown in the figure, the production scheduling relationship between the three process steps of BARC, LITHO and POLY Etch in the semiconductor wafer manufacturing process, as well as the constraints between each process. It reflects the production planning strategy of different process areas, especially the linkage and scheduling mode between each process under the DOMA path.

[0052] Poly Etch: The production scheduling of POLY Etch equipment in the loop needs to be arranged strictly according to the order of the area. Each lot is arranged to enter the Poly Etch process according to the preset order to avoid production confusion. Before the standby lot outside the loop comes from the Barc area, it serves as a production supplement to fill the gap in production or the idle time of the Poly Etch equipment.

[0053] Litho constraints: In the Litho area, production must be carried out under the relationship of satisfying the DOMA path, which means that the production sequence needs to be controlled according to the requirements of the DOMA process to ensure that the lots before Etch have completed Litho processing in sequence.

[0054] Barc constraints: The lot arrangement in the Barc area must be completed before entering the Litho process, and the production sequence must be followed to maintain production continuity.

[0055] Candidate lot & loop lot: In the Poly Etch area, the scheduling of candidate lot and loop lot corresponds to different lot processing orders. Loop lot is based on the strict regional order arrangement in production planning, while candidate lot is used as fill-in or supplement when needed.

[0056] In the Poly Etch equipment, according to the production needs of different areas, the Poly Etch scheduling algorithm is first called to determine the production batch arrangement. The lot processing of the Poly Etch equipment strictly complies with the process requirements, and the loop batch (Looplot) is processed in a predetermined order to avoid confusion in production. The candidate lot (Candidate lot) comes from the Barc area to supplement the idle time.

[0057] According to the production plan of the Poly Etch equipment, the constraints are transmitted to the upstream Litho and Barc areas. For the Litho area, the production constraint is that the processing must be completed under the corresponding relationship of the DOMA path to ensure that each lot has passed the correct lithography process before entering the Poly Etch. In the production scheduling of the Barc area, the lot arrangement must be carried out before the Litho process is completed to ensure the continuity of production.

[0058] If there is a production gap or equipment is idle in the Poly Etch equipment, a candidate lot will be selected from the Barc area to fill it to prevent the equipment from being idle for too long and affecting production efficiency. The lots in the Barc area not only serve as a production supplement, but also support the continuous production of the Poly Etch area through a candidate method. In the entire production process, the order of lots in each area will be dynamically adjusted according to the real-time production status and equipment utilization to ensure smooth production. For Poly Etch equipment, loop lots are always given priority, while candidate lots are used to flexibly fill the gaps in production to avoid production interruptions.

[0059] It is not difficult to find that in the embodiment of the present application, the production sequence between the Poly Etch, Litho and Barc areas can be effectively coordinated to ensure that the lots in each area are processed within the q-time limit, improve equipment utilization, reduce the risk of scrap in the production process, and improve the overall production efficiency of the wafer fab.

[0060] The step division of the above methods is only for the purpose of clear description. When implemented, they can be combined into one step or some steps can be split and decomposed into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this patent; adding insignificant modifications to the algorithm or process or introducing insignificant designs without changing the core design of the algorithm and process are all within the scope of protection of this patent.

[0061] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital processing, a cellular phone, a smart phone, a wearable device, and other similar computing devices.

[0062] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the method provided in any one or more of the above embodiments. Figure 4 An exemplary structural diagram of the electronic device is disclosed. Figure 4 As shown, the electronic device includes: one or more processors 1101, memory 1102, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only used as examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0063] The electronic device may further include: an input device 1103 and an output device 1104. The processor 1101, the memory 1102, the input device 1103 and the output device 1104 may be connected via a bus or other means. Figure 4 The example of connecting through bus is taken in the following.

[0064] The input device 1103 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 1104 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0065] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0066] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0067] The memory 1102 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 1101 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 1102, so as to implement the program instructions / modules corresponding to the method provided by any one or more embodiments in the embodiments of the present application.

[0068] The memory 1102 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 1102 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1102 may optionally include a memory remotely arranged relative to the processor 1101, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0069] It should be noted that the computer-readable medium described in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.

[0070] Computer readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0071] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0072] In the above-described embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. For example, it can be implemented by using an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device. In certain embodiments, the software program of the present application can be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including relevant data structures) can be stored in a computer-readable recording medium, for example, a RAM memory, a magnetic or optical drive or a floppy disk and similar devices. In addition, some steps or functions of the present application can be implemented by hardware, for example, as a circuit that cooperates with a processor to perform each step or function.

[0073] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from a computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid state disk (SSD)), etc.

[0074] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0075] The scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the device claim may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used to distinguish the description, and do not indicate any particular order, nor can they be understood as indicating or implying relative importance.

[0076] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A wafer fab cross-regional production planning method, characterized in that: The method comprises: Call the POLY etch device scheduling algorithm to obtain the POLY etch device scheduling result; According to the preset inventory level and the POLY etch equipment scheduling result, the first batch of lots for production are obtained; According to the lots put into production in the first batch, the LITHO equipment scheduling algorithm is called and the first constraint condition is added to obtain the lots put into production in the second batch; According to the second batch of lots put into production, the BARC equipment scheduling algorithm is called and the second constraint condition is added to obtain the third batch of lots put into production.

2. The method according to claim 1, characterized in that The POLY etch equipment scheduling algorithm includes: treating each independently running chamber as a separate scheduling object to maximize equipment capacity.

3. The method according to claim 2, characterized in that The preset stock levels include: According to the capacity settings of each device, the preset inventory level of the POLY etch device is higher than the preset inventory level of the L ITHO device.

4. The method according to claim 3, characterized in that The first constraint condition is to keep the order and priority of the first batch of lots put into production consistent in the L ITHO device and the POLY etch device.

5. The method according to claim 4, characterized in that The second constraint condition is to keep the order and priority of the lots put into production in the second batch consistent in the BARC device and the L ITHO device.

6. The method according to claim 5, characterized in that The POLY etch equipment scheduling algorithm, the LITHO equipment scheduling algorithm and the BARC equipment scheduling algorithm dynamically adjust the number of lots put into production in each area by real-time monitoring the production rate of each equipment to prevent the current inventory level from being lower than the preset inventory level.

7. The method according to any one of claims 1 to 6, characterized in that: The method further includes: when the inventory level of any equipment is lower than a preset value, increasing the number of production lots of the equipment, and coordinating through a scheduling algorithm of adjacent areas.

8. An electronic device, characterized in that: The electronic device comprises: one or more processors; and A memory storing computer program instructions, which, when executed, cause the processor to perform the steps of the method as claimed in any one of claims 1 to 7.

9. A computer readable medium having a computer program / instruction stored thereon, characterized in that: When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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