Amorphous nanocrystalline sheet and preparation method thereof

Abstract

The invention provides an amorphous nanocrystalline sheet and a preparation method thereof. The preparation method of the amorphous nanocrystalline sheet comprises the following steps: winding an amorphous nanocrystalline ribbon into an amorphous nanocrystalline ring; pressing the amorphous nanocrystalline ring into a plane structure; the plane structure is placed in a mold and fixed, and then magnetic field annealing treatment and gum dipping treatment are conducted on the plane structure; performing glue layer curing treatment on the plane structure subjected to magnetic field annealing treatment and glue dipping treatment; and removing the mold, and cutting the plane structure after the glue layer is cured, so as to form the amorphous nanocrystalline sheet with internal layering. According to the preparation method of the amorphous nanocrystalline sheet, the interlayer eddy current effect is effectively reduced, the flatness and high magnetic conductivity of the amorphous nanocrystalline sheet are ensured, and the amorphous nanocrystalline sheet can be conveniently applied to various power electronic magnetic elements.

Description

Technical Field

[0001] The invention relates to the technical field of amorphous nanocrystalline magnetic materials and preparation thereof, and in particular to an amorphous nanocrystalline thin slice and a preparation method thereof. Background Art

[0002] Amorphous nanocrystalline alloys have become important soft magnetic materials due to their excellent properties, such as high saturation magnetic induction, high magnetic permeability and low loss, and are widely used in power electronic products such as power electronic transformers, inductors and motors. However, in medium and high frequency applications, amorphous nanocrystalline ribbons are prone to serious interlayer eddy current effects due to their good electrical conductivity, resulting in a significant increase in eddy current losses. In addition, amorphous nanocrystalline raw materials are usually thin, with a thickness of about 10 microns to 30 microns, making machining difficult. Summary of the invention

[0003] Based on this, it is necessary to provide an amorphous nanocrystalline sheet and a preparation method thereof to address the above problems.

[0004] The technical solution is as follows:

[0005] In one aspect, a method for preparing an amorphous nanocrystalline sheet is provided, comprising the following steps:

[0006] winding the amorphous nanocrystal ribbon into an amorphous nanocrystal ring;

[0007] pressing the amorphous nanocrystalline ring into a planar structure;

[0008] The planar structure is placed in a mold and fixed, and then the planar structure is subjected to magnetic field annealing and resin dipping treatments;

[0009] Performing a glue layer curing process on the planar structure that has completed the magnetic field annealing process and the glue dipping process;

[0010] The mold is removed and the planar structure after the glue layer is cured is cut to form an amorphous nanocrystalline sheet with internal stratification.

[0011] The technical solution is further described below:

[0012] In one embodiment, the step of pressing the amorphous nanocrystalline ring into a planar structure includes:

[0013] The amorphous nanocrystalline rings are pressed into a planar structure using two pressing sheets.

[0014] In one embodiment, the width of the pressed sheet is greater than the width of the amorphous nanocrystalline ring;

[0015] And / or, the length of the pressing sheet is smaller than the circumference of the amorphous nanocrystalline ring, so that after the two pressing sheets press the amorphous nanocrystalline ring into a planar structure, the edge portion of the planar structure where stress is concentrated extends out of the edge of the pressing sheet.

[0016] In one embodiment, the steps of placing the planar structure in a mold and fixing it, and then performing magnetic field annealing and resin dipping on the planar structure include:

[0017] stacking at least two of the pressed sheets and at least one of the planar structures in sequence to form a multilayer structure;

[0018] fixing the multilayer structure in a mold;

[0019] Performing magnetic field annealing on the planar structure to achieve crystallization;

[0020] The planar structure is subjected to a dipping treatment.

[0021] In one embodiment, after the step of fixing the multilayer structure in the mold, the method further comprises:

[0022] The mold is adjusted according to the number and thickness of the pressed sheets, and the number and required thickness of the planar structures, so that the mold presses the thickness of the multilayer structure to a preset thickness.

[0023] In one embodiment, the mold includes two pressing plates and at least one bolt, each of the bolts is penetrated through the two pressing plates and is threadedly connected to the two pressing plates; the step of adjusting the mold according to the number and thickness of the pressing sheets, and the number and required thickness of the planar structures so that the mold presses the thickness of the multilayer structure to a preset thickness includes:

[0024] The bolts are adjusted according to the thickness of the two pressing plates, the number and thickness of the pressing sheets, and the number and required thickness of the planar structures, so that the two pressing plates move towards or away from each other until the thickness of the whole formed by the two pressing plates and the multi-layer structure is the sum of the thickness of the two pressing plates and the preset thickness.

[0025] In one embodiment, before the step of performing the resin dipping treatment on the planar structure, the method further comprises:

[0026] After the planar structure has completed the magnetic field annealing treatment, the mold is removed, and a release paper film is attached to the pressed sheet;

[0027] The pressing sheet and the planar structure are reassembled to form a multi-layer structure, and the multi-layer structure is then re-fixed in the mold.

[0028] In one embodiment, the number of windings of the amorphous nanocrystalline ribbon is greater than 1 and less than or equal to 25;

[0029] And / or, the inner diameter of the amorphous nanocrystalline ring is greater than 100 mm.

[0030] In one embodiment, after the step of removing the mold and cutting the planar structure to form an amorphous nanocrystalline sheet with internal stratification, the method further includes:

[0031] The amorphous nanocrystalline thin slice is further processed so that the thickness of the amorphous nanocrystalline thin slice is 0.2 mm to 1 mm to meet the machining requirements.

[0032] On the other hand, an amorphous nanocrystalline thin sheet is provided, which is prepared according to the amorphous nanocrystalline thin sheet preparation method.

[0033] The amorphous nanocrystalline thin film and its preparation method in the present application have at least the following advantages: 1. By laminating the amorphous nanocrystalline rings and forming a planar structure, it is ensured that when the planar structure is subsequently dipped in glue, the two adjacent layers of amorphous nanocrystalline ribbons in the planar structure are evenly covered with glue, achieving effective interlayer insulation, thereby reducing eddy current losses under high-frequency applications and improving the magnetic permeability and quality of the amorphous nanocrystalline thin film. 2. The planar structure is formed by pressing the amorphous nanocrystalline rings, and the amorphous nanocrystalline ribbons will not be broken during the processing process, and the planar structure has a high flatness, ensuring the flatness and high magnetic permeability of the amorphous nanocrystalline thin film, and facilitating application in various power electronic magnetic components. 3. The amorphous nanocrystalline ribbon is firstly wound and laminated to change its shape and form a planar structure, and then subjected to magnetic field annealing and resin dipping. The planar structure does not need to be disassembled after magnetic field annealing and resin dipping, ensuring that the amorphous nanocrystalline ribbon can still maintain integrity after annealing, thereby avoiding the problem of breakage, achieving a non-breakage and machinable effect, and improving the operability of the amorphous nanocrystalline thin film preparation method and the stability of the obtained amorphous nanocrystalline thin film. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application.

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1The present invention is a flow chart of a method for preparing an amorphous nanocrystalline sheet according to an embodiment of the present invention.

[0037] Figure 2 The figure is a schematic diagram of the structure of an amorphous nanocrystalline ribbon during winding according to an embodiment.

[0038] Figure 3 The diagram is a schematic diagram of the structure of an amorphous nanocrystalline ring when it is pressed by two pressing sheets according to an embodiment.

[0039] Figure 4 The present invention is a flow chart of a method for preparing an amorphous nanocrystalline sheet according to another embodiment.

[0040] Figure 5 It is a schematic diagram of the structure when the multilayer structure of an embodiment is fixed in a mold.

[0041] Figure 6 The schematic diagram is a structural diagram of a pressing plate after a release paper film is attached to the pressing plate of an embodiment. DETAILED DESCRIPTION

[0042] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0043] like Figure 1 As shown, in one embodiment, a method for preparing an amorphous nanocrystalline thin slice is provided, comprising at least the following steps:

[0044] S100, winding the amorphous nanocrystalline ribbon 1 into an amorphous nanocrystalline ring.

[0045] It should be noted that the width of the amorphous nanocrystalline ribbon 1 can be flexibly adjusted according to actual needs.

[0046] like Figure 2 As shown, specifically in this embodiment, the amorphous nanocrystalline ribbon 1 can be wound into an amorphous nanocrystalline ring by any winding device in the prior art that can wind the amorphous nanocrystalline ribbon 1.

[0047] It should be noted that the number of windings of the amorphous nanocrystalline ribbon 1 and the inner diameter of the amorphous nanocrystalline ring after winding can be flexibly adjusted according to actual needs.

[0048] Optionally, the number of windings of the amorphous nanocrystalline ribbon 1 is greater than 1 and less than or equal to 25.

[0049] Specifically in this embodiment, the number of windings of the amorphous nanocrystalline ribbon 1 is greater than or equal to 5 and less than or equal to 25.

[0050] Optionally, the inner diameter of the amorphous nanocrystalline ring is greater than 100 mm.

[0051] S200, pressing the amorphous nanocrystalline ring into a planar structure. In this way, by laminating the amorphous nanocrystalline ring and forming a planar structure, it is ensured that when the planar structure is subsequently dipped in glue, the two adjacent layers of amorphous nanocrystalline ribbons 1 in the planar structure are evenly covered with glue, thereby achieving effective interlayer insulation, thereby reducing eddy current losses under high-frequency applications and improving the magnetic permeability and quality of the amorphous nanocrystalline sheet. In addition, the planar structure is formed by pressing the amorphous nanocrystalline ring, and the amorphous nanocrystalline ribbon 1 will not be broken during the processing process, and the planar structure has a high flatness, which ensures the flatness and high magnetic permeability of the amorphous nanocrystalline sheet, and is easy to use in various power electronic magnetic components.

[0052] It should be noted that a planar structure refers to a structure that is planar in the middle and circular at both ends along the length direction (e.g. Figure 3 as shown).

[0053] like Figure 3 and Figure 4 As shown, optionally, S210, the amorphous nanocrystalline ring is pressed into a planar structure using two pressing sheets 2. In this way, the amorphous nanocrystalline ring is pressed by the planar pressing sheet 2 to ensure the flatness of the planar structure, thereby ensuring the flatness of the amorphous nanocrystalline sheet.

[0054] Specifically in this embodiment, two pressing sheets 2 are pressed against each other on both radial sides of the amorphous nanocrystalline ring to press the amorphous nanocrystalline ring into a planar structure.

[0055] Optionally, the width of the pressing sheet 2 is greater than the width of the amorphous nanocrystalline ring, so as to ensure that both sides of the amorphous nanocrystalline ring along its width direction can be flattened by the pressing sheet 2.

[0056] Specifically in this embodiment, the width of the pressing sheet 2 is slightly greater than the width of the amorphous nanocrystalline ring.

[0057] Optionally, the length of the pressing sheet 2 is smaller than the circumference of the amorphous nanocrystalline ring, so that after the two pressing sheets 2 press the amorphous nanocrystalline ring into a planar structure, the edge portion of the planar structure where stress is concentrated extends out of the edge of the pressing sheet 2. In this way, the pressing sheet 2 can resist the stress inside the planar structure and ensure the pressing effect on the planar structure, while also facilitating the subsequent cutting of the planar structure.

[0058] Specifically in this embodiment, the pressing sheet 2 can be set as a stainless steel sheet. In other embodiments, the pressing sheet 2 can also be made of other materials.

[0059] S300, placing the planar structure in the mold and fixing it, and then performing magnetic field annealing and glue dipping on the planar structure. In this way, the amorphous nanocrystalline ribbon 1 is firstly wound and laminated to change its shape and form a planar structure, and then subjected to magnetic field annealing and glue dipping. The planar structure does not need to be disassembled after magnetic field annealing and glue dipping (after glue dipping, the amorphous nanocrystalline ribbon will be unable to be effectively disassembled due to the effect of glue curing. Even if strong means are used for disassembly, the physical properties of the annealed amorphous nanocrystalline ribbon 1 are extremely fragile and will be directly broken during the disassembly process), ensuring that the amorphous nanocrystalline ribbon 1 can still maintain integrity after annealing, thereby avoiding the problem of breakage, achieving the effect of non-breakage and machinability, and improving the operability of the amorphous nanocrystalline thin sheet preparation method and the stability of the obtained amorphous nanocrystalline thin sheet.

[0060] like Figure 2 As shown, optionally, S310, at least two pressed sheets 2 and at least one planar structure are sequentially stacked to form a multilayer structure. In this way, multiple planar structures can be processed at the same time, thereby improving the preparation efficiency of amorphous nanocrystalline sheets.

[0061] It should be noted that the multi-layer structure refers to a structure in which the outermost two sides are both pressed sheets 2, and the middle is a structure in which the pressed sheets 2 and the planar structure are alternately stacked in sequence.

[0062] S320, fixing the multilayer structure in the mold.

[0063] In other embodiments, a plurality of pressed sheets 2 and a plurality of planar structures may also be directly stacked in sequence in the mold to form a multi-layer structure.

[0064] It should be noted that the mold can be set to any structure in the prior art that can adjust the pressing thickness of the multi-layer structure.

[0065] like Figure 5 As shown, optionally, the mold includes two pressing plates 4 and at least one bolt, and each bolt is passed through the two pressing plates 4 and is threadedly connected to the two pressing plates 4 accordingly.

[0066] Specifically, the two pressing plates 4 have the same shape and size. The four corners and the middle of the four sides of the two pressing plates 4 are provided with threaded holes. When in use, the multi-layer structure is placed in one pressing plate 4, and then the other pressing plate 4 is used to cover the top of the multi-layer structure, and each bolt is screwed into each threaded hole to fix the multi-layer structure and ensure the processing accuracy.

[0067] Specifically in this embodiment, the pressing plate 4 can be set as a stainless steel plate. The size of the pressing plate 4 is slightly larger than the size of the pressing plate 2. The thickness of the pressing plate 4 can be flexibly adjusted according to the actual needs of use. The bolt is in the shape of a long strip, and the length of the bolt is greater than the height of the multi-layer structure. The thread accuracy of the threaded hole is 0.1mm.

[0068] S330, adjusting the mold according to the number and thickness of the pressed tablets 2, and the number and required thickness of the planar structures, so that the mold presses the thickness of the multilayer structure to a preset thickness. In this way, the pressed thickness of the multilayer structure is adjusted by the mold, and the thickness of the pressed tablet 2 is controlled, so that the pressed thickness of the planar structure is controllable, thereby improving the preparation accuracy of the amorphous nanocrystalline thin sheet.

[0069] Specifically in this embodiment, the thickness of the planar structure can be controlled within the range of 0.01 mm.

[0070] Optionally, the bolts are adjusted according to the thickness of the two pressing plates 4, the number and thickness of the pressing sheets 2, and the number and required thickness of the planar structures, so that the two pressing plates 4 move toward or away from each other until the thickness of the whole formed by the two pressing plates 4 and the multi-layer structure is the sum of the thickness of the two pressing plates 4 and the preset thickness. In this way, the convenience of measuring the thickness of the multi-layer structure is improved.

[0071] Specifically in this embodiment, the thickness of the pressing plate 4 is set to 30 mm, and the thickness of the pressing sheet 2 is set to 3 mm.

[0072] S340, performing magnetic field annealing treatment on the planar structure to achieve crystallization.

[0073] It should be noted that any device and method in the prior art that can perform magnetic field annealing on the amorphous nanocrystalline ribbon 1 to achieve crystallization can be used to perform magnetic field annealing on the planar structure.

[0074] Specifically in this embodiment, after the multilayer structure is pressed to a preset thickness, the mold with the multilayer structure fixed thereon is placed in a magnetic field annealing furnace, the direction of the applied magnetic field is the long side direction of the planar structure, the annealing temperature is set at 400°C to 600°C, and the temperature is kept for 5 to 8 hours to complete the crystallization treatment of the planar structure. Subsequently, the planar structure is cooled to 100°C to 200°C, and then to room temperature to eliminate internal stress.

[0075] like Figure 6 As shown, S350, after the planar structure completes the magnetic field annealing treatment, the mold is removed, and a release paper film 3 is attached to the pressed sheet 2. In this way, the release paper film 3 is located between the pressed sheet 2 and the planar structure, so that the pressed sheet 2 and the planar structure can be easily separated in the subsequent dipping process, and the surface of the planar structure is kept intact.

[0076] It should be noted that after the planar structure has been subjected to magnetic field annealing and the mold has been removed, the planar structure can remain flat. Specifically in this embodiment, the release paper film 3 can be made of Teflon high temperature resistant material.

[0077] S360, reassemble the pressed sheet 2 and the planar structure to form a multi-layer structure, and then re-fix the multi-layer structure in the mold.

[0078] S370, the planar structure is subjected to a glue dipping treatment.

[0079] It should be noted that any device and method in the prior art that can perform resin dipping on the amorphous nanocrystalline ribbon 1 can be used to perform resin dipping on the planar structure.

[0080] Specifically in this embodiment, during the dipping process, a two-component water-soluble glue is used as the glue, the dipping time is 30 minutes to 60 minutes, and the dipping environment is vacuumed to ensure that the upper and lower surfaces of each layer of amorphous nanocrystalline ribbon 1 in the planar structure are evenly covered with the glue layer.

[0081] S400, performing glue layer curing treatment on the planar structure that has completed the magnetic field annealing treatment and the glue dipping treatment.

[0082] It should be noted that any device and method in the prior art that can implement adhesive layer curing can be used to perform adhesive layer curing treatment on the planar structure.

[0083] It should be noted that when the planar structure is subjected to magnetic field annealing, resin dipping and glue layer curing, the multilayer structure is fixed in the mold to form a whole. Specifically in this embodiment, the multilayer structure and the mold after the resin dipping are placed in a heating device, the heating temperature is set at 80°C to 160°C, and the heating time is 1 hour to 2 hours, so that the glue layer is cured for subsequent cutting operations.

[0084] S500, removing the mold and cutting the planar structure after the adhesive layer is cured to form an amorphous nanocrystalline sheet with internal stratification.

[0085] It should be noted that after the adhesive layer is cured and the mold is removed, the planar structure is completely separated from the pressed sheet 2 by the release paper film 3, and there is no broken crack on the surface of the planar structure. The planar structure is then cut along the long side (preferably the circular edge) to form an internal multi-layer, non-broken, machinable, and thickness-controllable amorphous nanocrystalline sheet.

[0086] S600, further processing the amorphous nanocrystalline thin slice so that the thickness of the amorphous nanocrystalline thin slice is 0.2 mm to 1 mm to meet machining requirements.

[0087] In one embodiment, an amorphous nanocrystalline thin sheet is provided. The amorphous nanocrystalline thin sheet is prepared according to the amorphous nanocrystalline thin sheet preparation method in any of the above embodiments.

[0088] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0089] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0090] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0091] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0092] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0093] It should also be understood that when explaining the connection relationship or positional relationship of elements, although not explicitly described, the connection relationship and positional relationship are interpreted as including an error range, which should be within the acceptable deviation range of a specific value determined by those skilled in the art. For example, "approximately", "approximately" or "substantially" may mean within one or more standard deviations, which are not limited here.

[0094] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0095] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A method for preparing an amorphous nanocrystalline sheet, characterized in that: The following steps are involved: winding the amorphous nanocrystal ribbon into an amorphous nanocrystal ring; pressing the amorphous nanocrystalline ring into a planar structure; The planar structure is placed in a mold and fixed, and then the planar structure is subjected to magnetic field annealing and resin dipping treatments; Performing a glue layer curing process on the planar structure that has completed the magnetic field annealing process and the glue dipping process; The mold is removed and the planar structure after the glue layer is cured is cut to form an amorphous nanocrystalline sheet with internal stratification.

2. The method for preparing an amorphous nanocrystalline sheet according to claim 1, characterized in that: The step of pressing the amorphous nanocrystalline ring into a planar structure includes: The amorphous nanocrystalline rings are pressed into a planar structure using two pressing sheets.

3. The method for preparing an amorphous nanocrystalline sheet according to claim 2, characterized in that: The width of the pressed sheet is greater than the width of the amorphous nanocrystalline ring; And / or, the length of the pressing sheet is smaller than the circumference of the amorphous nanocrystalline ring, so that after the two pressing sheets press the amorphous nanocrystalline ring into a planar structure, the edge portion of the planar structure where stress is concentrated extends out of the edge of the pressing sheet.

4. The method for preparing an amorphous nanocrystalline sheet according to claim 2, characterized in that: The step of placing the planar structure in a mold and fixing it, and then performing magnetic field annealing and resin dipping treatment on the planar structure includes: stacking at least two of the pressed sheets and at least one of the planar structures in sequence to form a multilayer structure; fixing the multilayer structure in a mold; Performing magnetic field annealing on the planar structure to achieve crystallization; The planar structure is subjected to a dipping treatment.

5. The method for preparing an amorphous nanocrystalline sheet according to claim 4, characterized in that: After the step of fixing the multilayer structure in the mold, the method further comprises: The mold is adjusted according to the number and thickness of the pressed sheets, and the number and required thickness of the planar structures, so that the mold presses the thickness of the multilayer structure to a preset thickness.

6. The method for preparing an amorphous nanocrystalline sheet according to claim 5, characterized in that: The mold includes two pressing plates and at least one bolt, each of the bolts is penetrated through the two pressing plates and is threadedly connected to the two pressing plates; the step of adjusting the mold according to the number and thickness of the pressing sheets and the number and required thickness of the planar structures so that the mold presses the thickness of the multilayer structure to a preset thickness includes: The bolts are adjusted according to the thickness of the two pressing plates, the number and thickness of the pressing sheets, and the number and required thickness of the planar structures, so that the two pressing plates move towards or away from each other until the thickness of the whole formed by the two pressing plates and the multi-layer structure is the sum of the thickness of the two pressing plates and the preset thickness.

7. The method for preparing an amorphous nanocrystalline sheet according to claim 4, characterized in that: Before the step of performing the resin dipping treatment on the planar structure, the method further comprises: After the planar structure has completed the magnetic field annealing treatment, the mold is removed, and a release paper film is attached to the pressed sheet; The pressing sheet and the planar structure are reassembled to form a multi-layer structure, and the multi-layer structure is then re-fixed in the mold.

8. The method for preparing an amorphous nanocrystalline sheet according to any one of claims 1 to 7, characterized in that: The number of windings of the amorphous nanocrystalline ribbon is greater than 1 and less than or equal to 25; And / or, the inner diameter of the amorphous nanocrystalline ring is greater than 100 mm.

9. The method for preparing an amorphous nanocrystalline sheet according to any one of claims 1 to 7, characterized in that: After the step of removing the mold and cutting the planar structure after the glue layer is cured to form an amorphous nanocrystalline sheet with internal stratification, the method further includes: The amorphous nanocrystalline thin slice is further processed so that the thickness of the amorphous nanocrystalline thin slice is 0.2 mm to 1 mm to meet the machining requirements.

10. An amorphous nanocrystalline sheet, characterized in that: It is prepared according to the method for preparing an amorphous nanocrystalline sheet as described in any one of claims 1 to 9.

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