Filling member and substrate processing apparatus

Abstract

Disclosed is a substrate processing apparatus, comprising: a chamber in which a processing space is provided; a substrate support member located within the chamber and configured to support a substrate; a supply port for supplying a processing fluid into the processing space of the chamber; and a filling member located between the supply port and the substrate to fill a portion of the volume of the processing space, where the filling member has perforations, and the perforations are disposed in a collision shape such that the processing fluids passing through the perforations collide with each other.

Description

Technical Field

[0001] The present invention provides a substrate processing apparatus and a filling member provided in the substrate processing apparatus. Background Art

[0002] In order to manufacture semiconductor devices, a desired pattern is formed on a substrate such as a wafer through various processes such as photography, etching, ashing, ion implantation, and thin film deposition. Various processing solutions and processing gases are used in each process, and particles and process by-products are generated during the process. A cleaning process is performed before and after each process to remove these particles and process by-products from the substrate.

[0003] A typical cleaning process includes treating the substrate with chemicals and a rinse solution, followed by drying. An example of a drying process is a spin drying process, in which the substrate is spun at high speed to remove any residual rinse solution from the substrate. However, the aforementioned spin drying method may damage the pattern formed on the substrate.

[0004] Recently, a supercritical drying process has been utilized, in which a residual rinsing solution on a substrate is replaced with an organic solvent by supplying an organic solvent having a low surface tension, such as isopropyl alcohol (IPA), to the substrate, and then a supercritical drying gas (e.g., carbon dioxide) is supplied to the substrate to remove the residual organic solvent from the substrate. In the supercritical drying process, a drying gas is supplied to a process chamber having a sealed interior, and the drying gas is heated and pressurized. As a result, both the temperature and pressure of the drying gas rise to a critical point or higher, and the drying gas undergoes a phase change to a supercritical state.

[0005] In a substrate processing apparatus that performs a supercritical drying process, an upper body and a lower body are combined with each other to form an internal space, and in a state where a substrate (such as a wafer) is supported by a supporting member in the internal space, the pressure of the internal space is maintained at a high pressure, and a drying gas is supplied to dry the substrate.

[0006] The substrate processing apparatus performing the supercritical drying process has a filling member installed in the inner space, and the filling member is a simple plate shape, which has a limitation in increasing the turbulence intensity of the drying gas. Summary of the invention

[0007] The present invention is directed to providing a substrate processing apparatus capable of increasing the disposal efficiency of residual fluid on a substrate by increasing the turbulence intensity of a processing fluid supplied to a processing space, and a filling member provided in the substrate processing apparatus.

[0008] The present invention is also directed to providing a substrate processing apparatus capable of improving atomization efficiency of a processing fluid by causing collision of the processing fluid, and a filling member provided in the substrate processing apparatus.

[0009] Problems to be solved by the present invention are not limited to the above-mentioned problems, and unmentioned problems will be clearly understood by those skilled in the art through the following description.

[0010] An exemplary embodiment of the present invention provides a substrate processing device, which includes: a chamber in which a processing space is arranged; a substrate supporting member, which is located in the chamber and is used to support the substrate; a supply port, which is used to supply a processing fluid into the processing space of the chamber; and a filling member, which is located between the supply port and the substrate to fill a part of the volume of the processing space, wherein the filling member has a perforation, and the perforation is set in a collision shape so that the processing fluids passing through the perforation collide with each other.

[0011] Furthermore, the packing member may comprise a plate having a plurality of perforation groups, and the perforation groups may be arranged such that the perforations have collision points at which the discharge paths of the treatment fluid intersect.

[0012] Furthermore, at least one of the perforations constituting the perforation group may be arranged to be inclined.

[0013] Furthermore, the perforations constituting the perforation group may be arranged in a straight line.

[0014] Furthermore, the perforations forming the perforation group may be arranged on the same radius.

[0015] Furthermore, the perforations may have any one of a circular, oval, square, and irregular circular cross section.

[0016] Furthermore, the plate may be provided with a central region and an edge region surrounding the central region, the edge region having perforation groups with different arrangement densities.

[0017] Furthermore, the filling member may provide a buffer space separated from the process space between the supply port and the plate, and the process fluid supplied through the supply port may stay in the buffer space and then may be supplied into the process space through the perforation group in the plate.

[0018] In addition, the supply port may include: an upper supply port, which is used to supply the processing fluid onto the top surface of the substrate; and a lower supply port, which is used to supply the processing fluid onto the bottom surface of the substrate, and the filling member may be arranged at least one of between the upper supply port and the substrate and between the lower supply port and the substrate.

[0019] Furthermore, the process fluid may be a supercritical fluid.

[0020] Another exemplary embodiment of the present invention provides a filling member for filling a portion of the volume of a processing space in a chamber body, the chamber body including a supply port for supplying a processing fluid to a sealed processing space, the filling member including: a plate having a predetermined thickness; and a perforation group formed on the plate, wherein the perforation group is arranged so as to cause turbulence when the processing fluids passing through the perforations collide with each other.

[0021] Furthermore, the groups of perforations may be arranged such that the perforations have collision points at which the discharge paths of the treatment fluid intersect.

[0022] Furthermore, at least one of the perforations constituting the perforation group may be arranged to be inclined.

[0023] Furthermore, the perforations constituting the perforation group may be arranged in a straight line.

[0024] Furthermore, the perforations forming the perforation group can be arranged on the same radius.

[0025] Furthermore, the plate may be provided with a central region and an edge region surrounding the central region, the edge region having perforation groups with different arrangement densities.

[0026] Furthermore, the filling member may further include a side wall portion extending from an edge of the plate, wherein a buffer space may be provided by the side wall portion and the plate.

[0027] Yet another exemplary embodiment of the present invention provides a substrate processing device, comprising: a chamber in which a processing space is arranged; a substrate supporting member located in the chamber and used to support the substrate; an upper supply port for supplying a supercritical fluid to a top surface of the substrate; a lower supply port for supplying a supercritical fluid to a bottom surface of the substrate; and a filling member located at least one of between the upper supply port and the substrate and between the lower supply port and the substrate to fill a portion of the volume of the processing space, wherein the filling member may include a plate having perforations, and the perforations are arranged to have a collision point, at which fluid discharge paths of the perforations intersect, so that the supercritical fluid passing through the perforations generates turbulence.

[0028] Furthermore, at least one of the perforations constituting the perforation group may be arranged obliquely, and the perforations constituting the perforation group may be arranged in a straight line or on the same radius.

[0029] In addition, the plate can be provided with a central area and an edge area surrounding the central area, wherein the edge area has a perforation group with different arrangement densities, the filling member can provide a buffer space separated from the processing space between the supply port and the plate, and the processing fluid supplied through the supply port can stay in the buffer space and then be supplied to the processing space through the perforation group in the plate.

[0030] According to an exemplary embodiment of the present invention, a substrate may be uniformly dried by causing a collision of a process fluid supplied to a process space to increase turbulence intensity of the process fluid, thereby increasing replacement efficiency with residual fluid on a surface of the substrate.

[0031] The effects of the present invention are not limited to the above-mentioned effects, and those skilled in the art can clearly understand unmentioned effects from the present specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a diagram illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0033] Figure 2 is a schematic diagram showing a Figure 1 Diagram of the liquid handling chamber.

[0034] Figure 3 is a schematic diagram showing a Figure 1 Diagram of the drying chamber.

[0035] Figure 4 It is shown Figure 3 Figure 2 shows an upper body and a lower body in a closed position.

[0036] Figure 5 It is shown Figure 3 FIG. 1 shows a first clamping body and a second clamping body in a clamped position.

[0037] Figure 6 is a top view showing a filling member provided in a supercritical processing apparatus according to a first exemplary embodiment.

[0038] Figure 7a yes Figure 6 A cross-sectional view of the filling member shown.

[0039] Figure 7b is a cross-sectional view showing a modified example of the filling member.

[0040] Figure 8a and Figure 8b 2 is a diagram showing another example of a perforation group.

[0041] Fig. 9 is a diagram showing a modified example of a punching group.

[0042] Fig.10 are diagrams showing various cross sections of a perforation.

[0043] Fig.11 is a diagram showing a modified example of the punching.

[0044] Fig.12 is a diagram showing an arrangement structure of perforation groups in a filling member.

[0045] Fig.13 is a diagram showing the flow of a supercritical fluid.

[0046] Fig.14 is a diagram showing another example of the filling member.

[0047] Fig.15 is a diagram showing a filling member installed in the upper space. DETAILED DESCRIPTION

[0048] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. Exemplary embodiments are provided so that the present disclosure will be exhaustive and will fully convey the scope to those skilled in the art. Many specific details, such as examples of specific components, devices, and methods, are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that exemplary embodiments may be embodied in many different forms, and that neither should be construed as limiting the scope of the present disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known techniques are not described in detail.

[0049] The terms used herein are only used for the purpose of describing specific exemplary embodiments, and are not restrictive. As used herein, unless the context clearly indicates otherwise, when the quantity is not specified, "described" may also be intended to include plural forms. The terms "include", "comprise" and "have" are inclusive, and therefore specify the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups thereof. Unless specifically identified as an execution order, the method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or described. It should also be understood that additional or alternative steps may be adopted.

[0050] When an element or layer is referred to as being "on," "engaged," "connected," or "coupled" to another element or layer, it may be directly "on," "engaged," "connected," or "coupled" to the other element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0051] Although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer and / or section from another region, layer or section. Unless the context clearly indicates, the terms such as "first", "second" and other numerical terms used herein do not imply sequence or order. Therefore, without departing from the teaching of the exemplary embodiment, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section.

[0052] For ease of describing the relationship of one element or feature to another element or feature as shown in the figure, spatial relative terms such as "inside", "outside", "below", "below", "below", "below", "above", and "above", etc. may be used herein. In addition to the orientations described in the figures, spatial relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the accompanying drawings is flipped, the elements described as "below" or "below" other elements or features will be oriented "above" the other elements or features. Therefore, the exemplary term "below" can cover both the above and below orientations. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used in this article are interpreted accordingly.

[0053] When the terms "same" or "equivalent" are used in the description of exemplary embodiments, it should be understood that some imprecision may exist. Therefore, when one element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0054] When the term "about" or "substantially" is used in conjunction with a numerical value, it is understood that the relevant numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "generally" and "substantially" are used in conjunction with geometric shapes, it is understood that the accuracy of the geometric shape is not required, but the latitude of the shape is within the scope of the present disclosure.

[0055] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present exemplary embodiments belong. It should also be understood that terms (including those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0056] In the following, reference will be made to Figures 1 to 15 Exemplary embodiments of the present invention are described in detail.

[0057] Figure 1 is a diagram illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0058] refer to Figure 1 , the substrate processing apparatus includes an indexing module 10, a processing module 20, and a controller 30. When viewed from above, the indexing module 10 and the processing module 20 are arranged in one direction. Hereinafter, when viewed from above, the direction in which the indexing module 10 and the processing module 20 are arranged is referred to as a first direction X, a direction perpendicular to the first direction X is referred to as a second direction Y, and a direction perpendicular to both the first direction X and the second direction Y is referred to as a third direction Z.

[0059] The index module 10 transfers the substrate W from the container C in which the substrate W is accommodated to the process module 20, and accommodates the substrate W that has been completely processed in the process module 20 in the container C. The longitudinal direction of the index module 10 is set in the second direction Y. The index module 10 includes a loading port 12 and an index frame 14. Based on the index frame 14, the loading port 12 is located at the side opposite to the process module 20. The container C in which the substrate W is accommodated is placed in the loading port 12. A plurality of loading ports 12 may be provided, and the plurality of loading ports 12 may be arranged along the second direction Y.

[0060] A sealed container such as a front-opening unified pod FOUP may be used for the container C. The container C may be placed on the load port 12 by a transfer device (not shown) such as an overhead conveyor, an overhead conveyor, or an automated guided vehicle, or by an operator.

[0061] The indexing robot 120 is provided to the indexing frame 14. A guide rail 124 whose longitudinal direction is provided in the second direction Y is provided in the indexing frame 14, and the indexing robot 120 may be provided to be movable on the guide rail 124. The indexing robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 may be provided to be movable in the front-rear direction, rotatable about the third direction Z, and movable in the third direction Z. A plurality of hands 122 are provided to be spaced apart in the vertical direction, and the hands 122 may be movable back and forth independently of each other.

[0062] The controller 30 can control the substrate processing equipment. The controller 30 may include a process controller formed by a microprocessor (computer) that performs control of the substrate processing equipment, a user interface formed by a keyboard that performs command input operations, etc. to manage the substrate processing equipment, a display for visualizing and displaying the operating conditions of the substrate processing equipment, and a storage unit that stores a control program for executing a process executed in the substrate processing equipment under the control of the process controller or a program for executing a process in each component according to various data and processing conditions, i.e., a treatment scheme. In addition, the user interface and the storage unit may be connected to the process controller. The treatment scheme may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, and may also be a portable disk, such as a CD-ROM or a DVD, or a semiconductor memory, such as a flash memory.

[0063] The processing module 20 includes a buffer unit 200, a transfer chamber 300, a liquid processing chamber 400, and a drying chamber 500. The buffer unit 200 provides a space in which a substrate W loaded into the processing module 20 and a substrate W unloaded from the processing module 20 temporarily stay. The liquid processing chamber 400 performs a liquid processing process for processing the substrate W with liquid by supplying liquid onto the substrate W. The drying chamber 500 may perform a drying process for removing liquid remaining on the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200, the liquid processing chamber 400, and the drying chamber 500.

[0064] The longitudinal direction of the transfer chamber 300 may be disposed in the first direction X. The buffer unit 200 may be disposed between the index module 10 and the transfer chamber 300. The liquid processing chamber 400 and the drying chamber 500 may be disposed on a side portion of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 may be disposed along the second direction Y. The drying chamber 500 and the transfer chamber 300 may be disposed along the second direction Y. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0065] According to an example, the liquid processing chamber 400 is disposed on both sides of the transfer chamber 300, and the drying chamber 500 is disposed on both sides of the transfer chamber 300, and the liquid processing chamber 400 may be disposed closer to the buffer unit 200 than the drying chamber 500. At one side of the transfer chamber 300, the liquid processing chamber 400 may be disposed in a layout of A×B (each of A and B is a natural number of 1 or greater than 1) in the first direction X and the third direction Z. In addition, at one side of the transfer chamber 300, the drying chamber 500 may be disposed in the number of C×D (each of C and D is a natural number of 1 or greater than 1) in the first direction 92 and the third direction 96. Different from the above, only the liquid processing chamber 400 may be disposed at one side of the transfer chamber 300, and only the drying chamber 500 may be disposed at the other side of the transfer chamber 300.

[0066] The transfer chamber 300 includes a transfer robot 320. A guide rail 324 whose longitudinal direction is set in the first direction X is provided in the transfer chamber 300, and the transfer robot 320 may be provided to be movable on the guide rail 324. The indexing robot 320 includes a hand 322 on which a substrate W is placed, and the hand 322 may be provided to be movable in the front-rear direction, rotatable about a third direction Z, and movable in the third direction Z. A plurality of hands 322 are provided to be spaced apart from each other in the vertical direction, and are capable of independently moving back and forth.

[0067] The buffer unit 200 includes a plurality of buffers 220 on which the substrates W are placed. The buffers 220 may be arranged to be spaced apart from each other along the third direction Z. The front and rear of the buffer unit 200 are open. The front is a face facing the indexing module 10, and the rear is a face facing the transfer chamber 300. The indexing robot 120 may approach the buffer unit 200 through the front, and the transfer robot 320 may approach the buffer unit 200 through the rear.

[0068] Figure 2 is a schematic diagram showing a Figure 1 Diagram of the liquid handling chamber.

[0069] refer to Figure 2 , the liquid processing chamber 400 includes a housing 410 , a cup 420 , a supporting unit 440 , a liquid supply unit 460 , and a lifting unit 480 .

[0070] The housing 410 may have an internal space in which the substrate W is processed. The housing 410 may have a substantially hexahedral shape. For example, the housing 410 may have a cubic shape. In addition, the housing 410 may have an opening (not shown) through which the substrate W is loaded or unloaded. In addition, the housing 410 may be equipped with a door (not shown) that selectively opens and closes the opening.

[0071] The cup 420 may have a cylindrical shape with an open top. The cup 420 has a processing space, and the substrate W may be liquid-processed in the processing space. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies a processing solution to the substrate W supported on the support unit 440. The processing solution may be provided in a plurality of types and may be supplied to the substrate W in sequence. The lifting unit 480 adjusts the relative height between the cup 420 and the support unit 440.

[0072] According to an example, the cup 420 includes a plurality of collection containers 422, 424, and 426. Each of the collection containers 422, 424, and 426 has a collection space for collecting liquid for processing a substrate. Each of the collection containers 422, 424, and 426 is provided in an annular shape around the support unit 440. When a liquid treatment process is performed, a treatment solution dispersed by the rotation of the substrate W enters the collection space through the inlets 422a, 424a, and 426a of the corresponding collection containers 422, 424, and 426. According to an example, the cup 420 includes a first collection container 422, a second collection container 424, and a third collection container 426. The first collection container 422 is provided around the support unit 440, the second collection container 424 is provided around the first collection container 422, and the third collection container 426 is provided around the second collection container 424. The second inlet 424a introducing liquid into the second collection container 424 may be located above the first inlet 422a introducing liquid into the first collection container 422, and the third inlet 426a introducing liquid into the third collection container 426 may be located above the second inlet 424a.

[0073] The support unit 440 includes a support plate 442 and a drive shaft 444. The top surface of the support plate 442 may be set to a generally circular shape and may have a diameter greater than the diameter of the substrate W. In the central portion of the support plate 442, a support pin 442a is provided to support the rear surface of the substrate W, and the support pin 442a is provided to protrude from the support plate 442 with its upper end so that the substrate W is spaced a certain distance from the support plate 442. A chuck pin 442b is provided to the edge of the support plate 442. The chuck pin 442b is provided to protrude upward from the support plate 442 and support the outer portion of the substrate W so that when the substrate W rotates, the substrate W does not separate from the support unit 440. The drive shaft 444 is driven by a driver 446, is connected to the center of the bottom surface of the substrate W, and rotates the support plate 442 relative to its central axis.

[0074] In one example, the liquid supply unit 460 may include a nozzle 462. The nozzle 462 may supply a treatment liquid to the substrate W. The treatment solution may be a chemical, a rinsing solution, or an organic solvent. The chemical may be a chemical having a strong acid or a strong base property. In addition, the rinsing solution may be pure. In addition, the organic solvent may be isopropyl alcohol (IPA). In addition, the liquid supply unit 460 may include a plurality of nozzles 462, each of which may supply a different type of treatment liquid. For example, one of the nozzles 462 may supply a chemical, another of the nozzles 462 may supply a rinsing solution, and another of the nozzles 462 may supply an organic solvent. In addition, the controller 30 may control the liquid supply unit 460 to supply an organic solvent to the substrate W from another of the nozzles 462 after supplying a rinsing solution from another of the nozzles 462. Therefore, the rinsing liquid supplied to the substrate W may be replaced by an organic solvent having a low surface tension.

[0075] The lifting unit 480 moves the cup 420 in the vertical direction. By the vertical movement of the cup 420, the relative height between the cup 420 and the substrate W changes. Therefore, since the collection containers 422, 424, and 426 for collecting the processing solution are changed according to the type of liquid supplied to the substrate, the liquid can be separated and collected. Different from the description, the cup 420 may be fixedly installed, and the lifting unit 480 may move the support unit 440 in the vertical direction.

[0076] Figure 3 is a schematic diagram showing a Figure 1 Diagram of the drying chamber, Figure 4 It is shown Figure 3 of the upper body and the lower body in the closed position, and Figure 5 It is shown Figure 3 FIG. 1 shows a first clamping body and a second clamping body in a clamped position.

[0077] refer to Figures 3 to 5 The drying chamber 500 according to an exemplary embodiment of the present invention can remove any residual processing solution on the substrate W by using a drying fluid in a supercritical state. For example, the drying chamber 500 can remove any residual processing solution on the substrate W by using carbon dioxide (CO 2 ) to perform a drying process to remove the organic solvent remaining on the substrate W. For example, the supercritical process may include a cleaning process, a drying process, or an etching process using a supercritical fluid. The supercritical fluid may be a substance whose temperature and pressure are equal to or greater than the critical point, and which has the diffusivity, viscosity, and surface tension like a gas and the solubility like a liquid. For example, the supercritical fluid may include carbon dioxide (CO 2 ), water (H 2 O), methane (CH4 ), ethane (C 2 H 6 ), propane (C 3 H 8 ), ethylene (C 2 H 4 ), propylene (C 3 H 6 ), methanol (CH 3 OH), ethanol (C 2 H 5 OH), sulfur hexafluoride (SF 6 ) and acetone (C 3 H 6 O) etc.

[0078] The drying chamber 500 may include a chamber body 510, a clamping body 520, a fluid supply unit 530, a fluid exhaust line 540, a support member 550, a first moving unit 560, a second moving unit 570, and a filling member 600. The chamber body 510 and the clamping body 520 may be collectively referred to as a body.

[0079] The chamber body 510 may include an upper body 512 and a lower body 514. The upper body 512 and the lower body 514 may be combined with each other to form a processing space 501. With respect to a substrate placed on a support member, the processing space 501 may include an upper space 502 corresponding to an upper portion and a lower space 503 corresponding to a lower portion. The upper body 512 may include a bottom surface 513. The bottom surface 513 of the upper body 512 may be set as an upper wall of the chamber body 510. The lower body 514 may include a top surface 515. The top surface 515 of the lower body 514 may be set as a lower wall of the chamber body 110.

[0080] Any one of the upper body 512 and the lower body 514 can be configured to be movable relative to the other. For example, any one of the upper body 512 and the lower body 514 can be moved by the first moving unit 560. The first moving unit 560 may include a lifting drive 562 and a lifting plate 564. A plurality of lifting drives 562 may be provided, and the lifting drive may be coupled to the lifting plate 564. The lifting plate 564 may be coupled to the lower body 514. When the lifting drive 562 lifts the lifting plate 564, the lower body 514 may be lifted together with the lifting plate 564. A heater for heating the drying fluid supplied to the processing space 512 may be buried in the chamber body 510. In addition, when the upper body 512 and the lower body 514 are in the closed position, in order to increase the airtightness of the processing space 501, a groove may be formed in the lower body 514, and an O-ring 516 as a sealing member may be inserted into the groove.

[0081] The position of the upper body 512 is fixed, and the lower body 514 can be lifted by the first moving unit 560 in the third direction Z. Hereinafter, a position in which the lower body 514 rises and contacts with the upper body 512 to form the processing space 501 is referred to as a closed position, and a position in which the lower body 514 descends and is spaced apart from the upper body 512 is referred to as an open position.

[0082] The clamping body 520 may include a first clamping body 522 and a second clamping body 524. The first clamping body 522 and the second clamping body 524 may clamp the chamber body 510 at opposite positions. The inner surfaces of the first clamping body 522 and the second clamping body 524 may have a shape substantially corresponding to the outer surface of the chamber body 510 located at the closed position. The first clamping body 522 and the second clamping body 524 may be moved by the second moving unit 570. A plurality of second moving units 570 may be provided.

[0083] The support member 550 may support the substrate W in the process space 501 . The support member 550 may support an edge region of the substrate W in the process space 501 . The support member 550 may support a lower side of the edge region of the substrate W. The support member 550 may be installed on the upper body 512 .

[0084] The supply port 518 may supply the supercritical fluid to the inside of the chamber body 510. The supply port 518 may include a first supply port 518a and a second supply port 518b.

[0085] The first supply port 518a may be disposed at a central area of ​​the lower wall of the lower body 514. In an exemplary embodiment, the first supply port 518a may be disposed at a position deviated from the center of the lower wall by a predetermined distance. In an exemplary embodiment, when the substrate W is supported on the support member 550, the center of the lower wall may be located at a position corresponding to the center of the substrate W on a vertical line to the center of the substrate W. The first supply port 518a supplies the supercritical fluid to the lower space 503 below the substrate W in the processing space 501.

[0086] The second supply port 518b is disposed at a central area of ​​an upper wall of the upper body 512. The second supply port 518b supplies the supercritical fluid to an upper space 502 above the substrate W in the processing space 501. The supercritical fluid supplied from the second supply port 518b may be provided to a top surface of the substrate W.

[0087] The discharge port 518c discharges the fluid remaining inside the chamber body 510 to the outside. The discharge port 518c is arranged in the lower wall of the lower body. The discharge port 518c can be positioned adjacent to the first supply port 518a. The discharge port 518c can be arranged in the central area of ​​the lower wall on the lower body. The diameter of the discharge port 518c can be set to be smaller than the diameter of the first supply port 518a. The fluid discharged from the discharge port 518c may include a supercritical fluid in which an organic solvent is dissolved. The fluid discharged from the discharge port 518c may be directed to a regeneration device (not shown). In the regeneration device, the fluid can be separated into a supercritical fluid and an organic solvent. On the contrary, the fluid discharged from the discharge port 518c can be released into the atmosphere via the discharge line 519.

[0088] The fluid supply unit 530 supplies a processing fluid to the processing space 501 of the chamber body 510. In one example, the processing fluid may be supplied to the processing space 501 in a supercritical state. Alternatively, the processing fluid may be supplied to the processing space 501 in a gaseous state and phase-changed to a supercritical state within the processing space 501. In one example, the fluid supply unit 530 may include a main supply line 532, an upper branch line 534, and a lower branch line 536. The upper branch line 534 and the lower branch line 536 branch from the main supply line 532. The upper branch line 534 is connected to the second supply port 518b to supply the processing fluid from the top of the substrate W placed on the support member 550. The lower branch line 536 is connected to the first supply port 518a to supply the processing fluid from the portion below the substrate W placed on the support member 550. The fluid exhaust line 540 is connected to the exhaust port 518c. The supercritical fluid in the processing space 501 of the chamber body 510 is discharged to the outside through the fluid discharge line 540. The fluid discharge line 540 can be connected to a decompression member (not shown) that provides decompression to the processing space. The decompression member can be a pump. However, non-limitingly, the decompression member can be any known device that can provide decompression to the processing space.

[0089] The filling member 600 is located below the support member 550. The filling member 600 includes a plate 610. The filling member 600 may block the supercritical fluid supplied from the first supply port 518a from being directly ejected onto the rear surface of the substrate W. In addition, the volume of the processing space 501 may be reduced by the filling member 600. In addition, the filling member 600 may cause a collision of the processing fluid supplied into the processing space to increase the turbulence intensity of the processing fluid.

[0090] Therefore, the filling member 600 can reduce the amount of supercritical fluid used in the drying process and reduce the processing time while maintaining the processing performance.

[0091] Figure 6is a top view showing a filling member provided in a supercritical processing apparatus according to a first exemplary embodiment, and Figure 7a yes Figure 6 A cross-sectional view of a filling member is shown.

[0092] refer to Figure 5 , and further reference Figure 6 and Figure 7a , the filling member 600 will be described.

[0093] The plate 610 may be provided in a plate shape having a predetermined thickness. The plate 610 may be in a form having internal filling. The plate 610 may have a top surface 612, a bottom surface 614, and a side surface 616. The top surface 612 may be provided side by side with the bottom surface 614 while facing the bottom surface 614. As the interior of the chamber body 510 is sealed, the top surface 612 of the plate 610 may maintain a predetermined interval with the bottom surface of the substrate W. The bottom surface 614 of the plate 610 may be provided to face the bottom surface 515 of the chamber body 510. The bottom surface 614 is spaced a predetermined distance from the bottom surface 515 of the chamber body 510.

[0094] The plate is supported by a support rod 690. A plurality of support rods 690 may be provided and may be spaced apart from each other. The upper end of the support rod 690 is coupled to the plate 610, and the lower end is supported on the bottom surface 515 of the chamber body 510.

[0095] The plate 610 has a perforation group 620. The perforation group 620 may include at least two perforations 622. The perforations 622 of the perforation group 620 may be provided in a collision configuration so that the treatment fluids passing through the perforations collide with each other. The perforations 622 of the perforation group 620 may be arranged to have a collision point P, at which the discharge paths L of the treatment fluids intersect. At least one of the perforations 622 constituting the perforation group 620 may be arranged to be inclined.

[0096] like Figure 6 and Figure 7a As shown, the perforation group 620 may include a double collision structure including two inclined perforations 622. The collision point P of the perforation group 620 may be spaced a predetermined distance from the top surface of the plate 610 and spaced apart from the bottom surface of the substrate.

[0097] Figure 7b is a cross-sectional view showing a modified example of the filling member.

[0098] like Figure 7b As shown, the perforation group 620a of the filling member 600a according to the modified example may be provided with two inclined perforations 622 intersecting each other on the top surface of the plate 610, and the collision point P of the perforation group 620a having this structure may be the top surface of the plate 610a.

[0099] Figure 8a and Figure 8b 2 is a diagram showing another example of a perforation group.

[0100] like Figure 8a and Figure 8b As shown, the filling member 600B may include a triple collision structure, wherein the perforation group 620B of the plate 610B includes three perforations 622B and 623B, which are two inclined perforations 622B and one vertical perforation 623B. The three perforations 622b and 623b may be arranged in a straight line.

[0101] In another example, Fig. 9 As shown, the perforations 622c of the perforation group 620c of the triple collision structure are arranged at the same radius and may include inclined perforations 622c.

[0102] Although the exemplary embodiment is illustrated and described as having two or three perforations in a perforation group, the number of perforations in a perforation group is not limited.

[0103] Fig.10 are diagrams showing various cross sections of a perforation.

[0104] like Fig.10 As shown, the cross-section of the perforation may be set to various shapes, such as oval (A), square (B) and (C), and irregular circle (D), instead of circle.

[0105] Furthermore, the perforations may be arranged to have different cross-sectional areas at the inlet and outlet. Fig.11 As shown, the perforations may have a funnel shape with a narrow inlet and a widened outlet, and the supercritical fluid passing through the perforations has a lower flow velocity to achieve a desired turbulence intensity.

[0106] like Fig.12 As shown, the filling member 600 may be provided with perforation groups 620 having different arrangement densities in the central area A1 of the plate 610 and in the edge area A2 surrounding the central area A1 . Fig.12 It is shown that the arrangement density of the perforation group 620 in the edge area A2 is relatively higher than that in the center area A1, but the present invention is not limited to this, and depending on the process characteristics, the arrangement density of the perforation group in the center area can be relatively higher than that in the edge area.

[0107] Fig.13 is a diagram showing the flow of a supercritical fluid.

[0108] like Fig.13As shown, a portion of the supercritical fluid supplied through the first supply port 518a travels along the edge of the filling member to both sides and then flows to the lower side of the substrate, and another portion flows through the perforations of the perforation group and then collides at the collision point and flows to the lower side of the substrate after the collision. At this time, the supercritical fluid has a higher turbulence intensity due to the collision, and the replacement efficiency with the fluid on the substrate is higher.

[0109] Fig.14 is a diagram showing another example of the filling member.

[0110] like Fig.14 As shown, the filling member 600e may include a plate 610e and a side wall portion 630. Here, the plate 610e has a Figure 6 The plates 610 shown are of substantially the same construction and will not be described in detail. The side wall portion 630 provides a buffer space 602 between the first supply port 518a and the plate 610e, which is separated from the processing space 501. Therefore, the supercritical fluid supplied through the first supply port 518a can be supplied to the lower space 503 only through the perforation group 620 of the plate 610e after staying in the buffer space 602.

[0111] At the same time, if Fig.15 As shown, these filling members 600 may be disposed opposite to the substrate W in the upper space 502 between the upper supply port 518 b and the substrate W.

[0112] The foregoing detailed description illustrates the present invention. In addition, the above content illustrates and describes exemplary embodiments of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, within the scope of the inventive concept disclosed in this specification, the scope equivalent to the present invention and / or the scope of the art or knowledge, the foregoing content can be modified or amended. The foregoing exemplary embodiments describe the best state for realizing the technical spirit of the present invention, and the various changes required for the specific application field and use of the present invention are all possible. Therefore, the above detailed description of the present invention is not intended to limit the present invention to the disclosed exemplary embodiments. In addition, the attached claims should be interpreted as also including other exemplary embodiments.

Claims

1. A substrate processing device, comprising: a chamber in which a processing space is disposed; a substrate supporting member, which is located in the chamber and is used to support a substrate; a supply port for supplying a process fluid into the process space of the chamber; a filling member located between the supply port and the substrate for filling a portion of the volume of the processing space, The filling member has perforations, and the perforations are arranged in a collision shape so that the treatment fluids passing through the perforations collide with each other.

2. The substrate processing apparatus according to claim 1, wherein the filling member comprises a plate having a plurality of perforation groups, and The perforation groups are arranged such that the perforations have collision points at which the discharge paths of the treatment fluid intersect. 3 . The substrate processing apparatus according to claim 2 , wherein at least one of the through holes constituting the through hole group is provided to be inclined. 4 . The substrate processing apparatus according to claim 2 , wherein the through holes constituting the through hole group are arranged in a straight line.

5. The substrate processing apparatus according to claim 2, wherein the through holes constituting the through hole group are arranged on the same radius. 6 . The substrate processing apparatus according to claim 2 , wherein the through-hole has a cross-section of any one of a circular shape, an elliptical shape, a square shape, and an irregular circular shape. 7 . The substrate processing apparatus according to claim 2 , wherein the plate is provided with a central area and an edge area surrounding the central area, the edge area having the perforation groups with different arrangement densities.

8. The substrate processing apparatus according to claim 2, wherein the filling member provides a buffer space separated from the processing space between the supply port and the plate, and The process fluid supplied through the supply port stays in the buffer space and is then supplied into the process space through the perforation group in the plate.

9. The substrate processing apparatus according to claim 2, wherein the supply port comprises: an upper supply port for supplying a process fluid onto a top surface of the substrate; as well as a lower supply port for supplying the process fluid onto the bottom surface of the substrate, and The filling member is provided at least one of between the upper supply port and the substrate and between the lower supply port and the substrate.

10. The substrate processing apparatus according to claim 2, wherein the processing fluid is a supercritical fluid.

11. A filling member for filling a portion of the volume of a processing space in a chamber body, the chamber body comprising a supply port for supplying a processing fluid to the sealed processing space, the filling member comprising: a plate having a predetermined thickness; as well as a set of perforations formed in the plate, The perforations are arranged such that turbulence is induced when the treatment fluids passing through the perforations collide with each other.

12. A packing member according to claim 11, wherein the perforation groups are arranged such that the perforations have collision points at which the discharge paths of the treatment fluid intersect. 13 . The filling member according to claim 12 , wherein at least one of the perforations constituting the perforation group is arranged to be inclined. The filling member according to claim 12 , wherein the perforations constituting the perforation group are arranged in a straight line.

15. The filling member according to claim 12, wherein the perforations constituting the perforation group are arranged on the same radius.

16. The packing member of claim 12, wherein the plate is provided with a central region and an edge region surrounding the central region, the edge region having the perforation groups with different arrangement densities.

17. The filling member according to claim 12, further comprising: a side wall portion extending from an edge of the plate, A buffer space is provided by the side wall portion and the plate.

18. A substrate processing device comprising: a chamber in which a processing space is disposed; a substrate supporting member, which is located in the chamber and is used to support a substrate; an upper supply port for supplying a supercritical fluid to a top surface of the substrate; a lower supply port for supplying the supercritical fluid onto a bottom surface of the substrate; as well as a filling member located at least one of between the upper supply port and the substrate and between the lower supply port and the substrate to fill a portion of the volume of the processing space, The packing member includes a plate having perforations, and the perforations are arranged to have collision points at which fluid discharge paths of the perforations intersect, so that the supercritical fluid passing through the perforations generates turbulence.

19. The substrate processing apparatus according to claim 18, wherein at least one of the through holes constituting the through hole group is arranged to be inclined, and The perforations constituting the perforation group are arranged in a straight line or on the same radius.

20. The substrate processing apparatus according to claim 18, wherein the plate is provided with a central area and an edge area surrounding the central area, the edge area having the perforation groups with different arrangement densities, The filling member provides a buffer space separated from the processing space between the supply port and the plate, and The process fluid supplied through the supply port stays in the buffer space and is then supplied into the process space through the perforation group in the plate.

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