Vacuum chamber pressure balancing device
By setting a balanced connection channel and an isolation valve between the vacuum chambers, and balancing is achieved by using the pressure difference between the chambers, the problem of high power consumption and failure to effectively utilize the pressure difference in the vacuum chamber in the prior art is solved, and a more efficient pressure balance is achieved.
Patent Information
- Application Number
- CN202510092391.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2025-04-29
AI Technical Summary
The existing vacuum chamber pressure balance method requires a lot of vacuum pump power consumption and does not effectively use the pressure difference between chambers to balance.
A vacuum chamber pressure balance device is designed, by setting a balanced connection channel and an isolation valve between the process chamber and the transmission chamber, the on and off of the balanced connection channel is controlled, and the pressure difference between the chambers is used for balance.
The impact on the low-pressure cavity caused by the pressure difference is significantly reduced, the efficiency of pressure balance is improved, and the power consumption of vacuum pump is reduced.
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Figure CN119905431A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the field of vacuum technology, and in particular, relates to a vacuum chamber pressure balancing device. Background Art
[0002] Coating, etching, etc. in semiconductor processes are generally carried out in a vacuum chamber, which mainly includes a front-end module, a load lock module, a transfer chamber, and one or more process chambers connected to the transfer chamber.
[0003] The transfer chamber 2 is separated from the process chamber 1 by a slit valve 3. During process treatment, both the transfer chamber and the process chamber are in a high vacuum state. The slit valve is opened, and the wafer is transferred to the process chamber by a robot placed in the transfer chamber. The robot then returns to the transfer chamber, the slit valve is closed, and the process chamber performs process treatment on the wafer.
[0004] The slit valve 3 includes a valve body installed outside the vacuum chamber and a valve stem connected to the valve body. A valve plate is connected to the end of the valve stem, and the valve plate is used to control the on-off of the process connection channel between the transmission chamber and the process chamber. Before the slit valve is opened, although the transmission chamber and the process chamber are both in a high vacuum state, there is a pressure difference between the two. When the slit valve is opened, the process connection channel is usually larger in size, and the chamber with high pressure will have a relatively large impact on the chamber with low pressure. In order to balance the pressure of the transmission chamber and the process chamber, the transmission chamber and the process chamber are currently vacuumed separately, and when the operation is completed and the current pressure difference between the process chamber and the transmission chamber is greater than the preset threshold, the vacuum operation is continued for the chamber with the higher current pressure until the pressure difference between the process chamber and the transmission chamber is no greater than the preset threshold.
[0005] However, the applicant found that although the pressures of the transfer chamber and the process chamber can be controlled to be balanced by evacuating the chamber separately, there are the following defects:
[0006] (1) Requires more vacuum pump power consumption;
[0007] (2) When the pressure difference is greater than a preset threshold, only the chamber with higher pressure is vacuumed, without effectively utilizing the pressure difference between the two chambers to balance the pressures of the two chambers.
[0008] Therefore, it is necessary to study a method that can fully utilize the pressure difference between the transfer chamber and the process chamber to balance the pressure so that the pressure difference reaches a preset threshold range. Summary of the invention
[0009]
Technical issues
[0010] In order to solve the above-mentioned problems, the purpose of the present invention is to provide a vacuum chamber pressure balancing device, which can first balance the pressure of the transmission chamber and the process chamber before the slit valve is opened, and can significantly reduce the impact on the low-pressure chamber caused by the pressure difference.
[0011]
Technical solution
[0012] The present application provides a vacuum chamber pressure balancing device, comprising:
[0013] A balanced connecting channel is connected between the process chamber and the transfer chamber, and the balanced connecting channel has a smaller cross section than a process connecting channel between the process chamber and the transfer chamber controlled by the slit valve;
[0014] An isolation valve, installed on the balancing connection channel,
[0015] Among them, if the pressure difference between the transfer chamber and the process chamber is less than a preset threshold, the slit valve opens the process connection channel, and wafers are transferred through the process connection channel; if the pressure difference is greater than or equal to the preset threshold, the isolation valve opens the balance connection channel until the pressure difference is less than the preset threshold, and then the slit valve opens the process connection channel, and wafers are transferred through the process connection channel.
[0016] Optionally, the balancing connecting channel is a connecting pipeline, the isolation valve is installed on the connecting pipeline, and the connecting pipeline is connected between the transfer chamber and the process chamber through a connecting flange.
[0017] Optionally, the connecting flange is one of a KF flange, a CF flange, and an ISO flange.
[0018] Optionally, the isolation valve is a diaphragm valve or a bellows valve.
[0019] Optionally, a cavity 202 surrounding the valve stem is provided on the valve body 200 of the slit valve, an isolation valve is installed on the side wall of the cavity, the isolation valve has a valve body inlet and a valve body outlet, a continuous second channel 103 is provided on the valve stem 104 and the valve plate 100, and the second channel 103 extends to the inside of the process chamber;
[0020] A third hose 208 and a fourth hose 209 are also provided in the cavity 202. One end of the fourth hose 209 is connected to the valve body outlet, and the other end is connected to the second channel 103.
[0021] The valve body and the valve stem have a matching gap on their peripheries. A first channel 206 is provided on the valve body between the cavity 202 and the transmission chamber. The first channel 206 extends to the matching gap 102 between the valve body 200 and the valve stem 104. The matching gap 102 is communicated with the interior of the transmission chamber. One end of the third hose 208 is communicated with the valve body inlet, and the other end is connected to the first channel 206.
[0022] Wherein, a bellows for sealing the transmission chamber is fixedly connected to the outer periphery of the valve stem in the front end of the cavity.
[0023] Optionally, a first pressure sensor is installed on the valve body, and a sensing end of the first pressure sensor extends into the cavity and is connected to the first channel 206 through a hose;
[0024] A second pressure sensor is also mounted on the valve body. The sensing end of the second pressure sensor extends into the cavity and is connected to the second channel 103 via a second hose.
[0025] Optionally, a cavity 202 surrounding the valve stem is provided on the valve body 200 of the slit valve, an isolation valve is installed on the side wall of the cavity, the isolation valve has a valve body inlet and a valve body outlet, a continuous second channel 103 is provided on the valve stem 104 and the valve plate 100, and the second channel 103 extends to the inside of the process chamber;
[0026] The valve body and the valve stem have a matching gap on their peripheries, and the valve body inlet of the isolation valve is connected to the cavity, so that the valve body inlet is connected to the transmission chamber through the matching gap. A fourth hose 209 is also provided in the cavity 202, and one end of the fourth hose 209 is connected to the valve body outlet, and the other end is connected to the second channel 103;
[0027] A double-layer sealing ring structure for sealing the transmission chamber is fixedly connected to the outer periphery of the valve stem at the rear end of the cavity.
[0028] Optionally, a first pressure sensor is installed on the valve body, and the sensing end of the first pressure sensor extends into the cavity. A second pressure sensor is also installed on the valve body, and the sensing end of the second pressure sensor extends into the cavity and is connected to the second channel 103 through a second hose.
[0029] Optionally, the transfer chamber is connected to the process chamber via a plurality of connecting pipes.
[0030] Optionally, the transfer chamber is connected to the process chamber through a plurality of connecting pipes branching out from the main pipe.
[0031]
Beneficial Effects
[0032] By constructing a balancing connection channel other than the process connection channel controlled by the slit valve, the present application can first balance the pressure of the transmission chamber and the process chamber before the slit valve is opened, which can significantly reduce the impact on the low-pressure chamber caused by the pressure difference. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] Figure 1 Schematic diagram of the vacuum chamber pressure balancing device of the first embodiment of the present application Figure 1 .
[0034] Figure 2 Schematic diagram of the vacuum chamber pressure balancing device of the first embodiment of the present application Figure 2 .
[0035] Figure 3 This is a schematic diagram of the first embodiment of the present application using multiple connecting pipelines.
[0036] Figure 4 This is a schematic diagram of the first embodiment of the present application using a main pipe to branch off multiple connecting pipes.
[0037] Figure 5a It is a schematic diagram of the vacuum chamber pressure balancing device of the second embodiment of the present application when the slit valve is closed.
[0038] Figure 5b It is a schematic diagram of the vacuum chamber pressure balancing device of the second embodiment of the present application when the slit valve is opened.
[0039] Figure 6a It is a schematic diagram of the vacuum chamber pressure balancing device of the third embodiment of the present application when the slit valve is closed.
[0040] Figure 6b It is a schematic diagram of the vacuum chamber pressure balancing device of the third embodiment of the present application when the slit valve is opened.
[0041] Figure 7 It is a schematic diagram of the bellows valve of an embodiment of the present application being opened.
[0042] Figure 8 It is a schematic diagram of the bellows valve of an embodiment of the present application being closed.
[0043] Fig. 9 It is a schematic diagram of the diaphragm valve of an embodiment of the present application being opened.
[0044] Fig.10 It is a schematic diagram of the diaphragm valve of an embodiment of the present application being closed.
[0045] [Brief Description of Reference Numerals]
[0046] 1: Process chamber 2: Transfer chamber
[0047] 3: Slit valve 11: Connecting flange
[0048] 12: Connecting pipe 13: Isolation valve
[0049] 100: Valve plate 101: Sealing ring
[0050] 102: Fitting clearance 103: Second channel
[0051] 104: valve stem 130: first body
[0052] 131: Valve body inlet 132: Valve body outlet
[0053] 133: Second bellows 134: First plunger
[0054] 135: First vent 136: First spring
[0055] 137: First mounting plate 138: Pressing plate
[0056] 140: Second body 141: Diaphragm
[0057] 144: Second plunger 145: Second vent
[0058] 146: Second spring 147: Second mounting plate
[0059] 200: valve body 201: first pressure sensor
[0060] 202: cavity 204: second pressure sensor
[0061] 205: First hose 206: First channel
[0062] 207: Second hose 208: Third hose
[0063] 209: Fourth hose 211: Second control air path
[0064] 212: First control air path 214: Double-layer sealing ring structure
[0065] 300: First bellows DETAILED DESCRIPTION
[0066] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0067] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship after the connection remains unchanged. The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "inner", "outer", "valve body inlet", "valve body outlet", etc., are only referenced to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.
[0068] The vacuum chamber pressure balancing device of the present application includes a balancing connection channel connected between a process chamber and a transmission chamber; an isolation valve installed on the balancing connection channel, and controls the on-off of the balancing connection channel to control the pressure difference between the process chamber and the transmission chamber to be less than a preset threshold. The preset threshold can be set according to industry experience, and its description is omitted here.
[0069] The balancing connection channel may be a pipeline independent of the slit valve, or a pipeline and a channel provided on the slit valve, and the balancing connection channel may have a smaller cross section than the process connection channel between the process chamber controlled by the slit valve and the transfer chamber. The process connection channel is used for wafer transfer, and may be used to transfer the wafer from the transfer chamber to the process chamber for process treatment, or may be used to transfer the wafer after process treatment from the process chamber to the transfer chamber. The following three embodiments are used to respectively illustrate the vacuum chamber pressure balancing device.
[0070] Embodiment 1
[0071] Please refer to Figure 1 , Figure 2 The vacuum chamber pressure balancing device of this embodiment includes a connecting pipeline 12, an isolation valve 13 and two connecting flanges 11, wherein the isolation valve 13 is installed on the connecting pipeline 12 to control the on-off of the connecting pipeline 12. Both ends of the connecting pipeline 12 are connected to the corresponding chambers through the connecting flanges 11, specifically, one end of the connecting pipeline 12 is connected to the transfer chamber 2 through a connecting flange 11, and the other end of the connecting pipeline 12 is connected to the process chamber 1 through a connecting flange 11.
[0072] like Figure 1In the embodiment, one transfer chamber 2 is connected to five process chambers 1, and the transfer chamber 2 and each process chamber 1 can be connected via a vacuum chamber pressure balance device. A first pressure sensor 201 is provided on the transfer chamber 2, and a second pressure sensor 204 is provided on the process chamber 1.
[0073] The connection flange 11 may be a KF flange (a quick-install and disassemble connection used in a vacuum system, usually a rubber ring seal), a CF flange (a flange connection used in ultra-high vacuum, a metal static seal that can withstand high temperature baking) or an ISO flange (ISO flanges and piping can be used in various applications from atmospheric pressure to high vacuum, often installed and disassembled). The isolation valve 13 may be a diaphragm valve or a bellows seal. The diameter of the connection pipeline 12 is smaller than the cross-section of the process connection channel between the transmission chamber and the process chamber controlled by the slit valve.
[0074] Before the wafer is transferred, the slit valve and the isolation valve are both in a closed state, and the vacuum degree of each chamber is measured by the pressure sensor on the chamber, so that the pressure difference between the transfer chamber and the process chamber can be obtained. If the pressure difference is less than the preset threshold, the slit valve can be directly opened to transfer the wafer through the process connection channel. The wafer transfer can be to transfer the wafer from the transfer chamber to the process chamber for process treatment, or to return the wafer after process treatment from the process chamber to the transfer chamber. If the pressure difference is greater than or equal to the preset threshold, the isolation valve 13 can be opened first to balance the pressure of the transfer chamber and the process chamber. For example, if the pressure of the process chamber is high, the pressure in the process chamber is transmitted to the transfer chamber, so that the pressure difference between the process chamber and the transfer chamber can be fully utilized to quickly balance the pressure. Since the diameter of the connecting pipeline 12 is smaller than the cross-section of the process connection channel between the transfer chamber and the process chamber controlled by the slit valve, the impact on the low-pressure chamber caused by the pressure difference is significantly reduced. After the pressure difference reaches less than the preset threshold, the slit valve can be opened to transfer the wafer.
[0075] In some embodiments, each pipeline connecting the transfer chamber 2 to the process chamber 1 can be led out separately or through one port. Figure 3 In the embodiment, different parts of the transmission chamber are connected to the connection pipeline 12 through the connection flange 11, for example Figure 4 In the embodiment, a main pipe is connected to the same part of the transfer chamber through a connecting flange, and then five connecting pipes 12 are branched out from the main pipe to be connected to the process chamber.
[0076] Embodiment 2
[0077] Embodiment 2 is suitable for use in medium and high vacuum systems. A first bellows is used to seal the transfer chamber 2, and the transfer chamber and the process chamber are connected by constructing a channel and a hose. The on-off of the isolation valve is controlled to connect the transfer chamber 2 and the process chamber 1 when the slit valve is closed, so as to achieve the purpose of a pressure difference less than a preset threshold.
[0078] Please refer to Figure 5a , 5b , the valve body 200 is installed at the bottom of the transfer chamber 2, and a valve stem 104 is installed in the valve body 200. The end of the valve stem 104 is fixedly connected to the valve plate 100, and the valve plate 100 is sealed with the process chamber 1 through the sealing ring 101. When the valve stem 104 descends, the valve plate 100 can open the process connection channel between the transfer chamber 2 and the process chamber 1. When the valve stem 104 rises, the valve plate 100 can close the process connection channel between the transfer chamber 2 and the process chamber 1. The vacuum chamber pressure balancing device of this embodiment controls the opening and closing of the isolation valve 13 according to the pressure difference between the transfer chamber 2 and the process chamber 1 when the slit valve 3 is closed (that is, when the valve stem 104 rises), so that the pressure balance between the transfer chamber 2 and the process chamber 1 is achieved.
[0079] The valve stem 104 can be raised and lowered by controlling the gas circuit, wherein the first control gas circuit 212 is used to control the valve stem 104 to rise upward, and the second control gas circuit 211 is used to control the valve stem 104 to descend. Controlling the valve stem 104 by controlling the gas circuit is a conventional structure of the slit valve and will not be discussed here.
[0080] The valve body 200 has a cavity 202 surrounding the valve stem 104, and a first bellows 300 is fixedly connected to the outer periphery of the valve stem 104 at the front end of the cavity 202 (i.e., the end of the cavity close to the valve plate 100). The connection between the first bellows and the valve stem 104 can be welded, or connected by fasteners. Specifically, the first bellows 300 can be arranged on the side of the cavity 202 close to the valve plate 100. Due to the elastic effect of the first bellows, during the operation of the switch valve, although the valve stem 104 has an axial movement, the first bellows 300 can seal the matching gap between the valve stem and the valve body, ensuring that the transmission chamber 2 is only connected to the inside of the first bellows 300.
[0081] A first pressure sensor 201 may be installed on the outside of the cavity 202 of the valve body 200, the sensing end of the first pressure sensor 201 extends into the cavity 202 and is connected to one end of the first hose 205, a first channel 206 is provided on the valve body between the cavity 202 and the transmission chamber 2, the other end of the first hose 205 is connected to one end of the first channel 206, and the other end of the first channel 206 extends to the matching gap 102 between the valve body 200 and the valve stem 104. It should be noted that the matching gap 102 is connected to the inside of the transmission chamber 2. Therefore, the first pressure sensor 201 can establish communication with the inside of the transmission chamber 2 through the first hose 205 and the first channel 206, so as to detect the pressure in the transmission chamber 2.
[0082] A second pressure sensor 204 may also be installed outside the cavity 202 of the valve body 200, the sensing end of the second pressure sensor 204 extends into the cavity 202 and is connected to one end of the second hose 207. A continuous second channel 103 is provided on the valve stem 104 and the valve plate 100, the other end of the second hose 207 is connected to one end of the second channel 103, and the other end of the second channel 103 extends to the inside of the process chamber. Therefore, the second pressure sensor 204 can establish communication with the inside of the process chamber 1 through the second hose 207 and the second channel 103, so as to detect the pressure in the process chamber 1.
[0083] The pressures in the transfer chamber 2 and the process chamber 1 can be obtained respectively through the first pressure sensor 201 and the second pressure sensor 204 , so as to determine the pressure difference between the transfer chamber 2 and the process chamber 1 .
[0084] An isolation valve 13 is also installed on the side wall of the cavity 202, and a third hose 208 and a fourth hose 209 are also arranged in the cavity 202. The isolation valve 13 has a valve body inlet and a valve body outlet. The opening and closing of the valve body inlet and the valve body outlet can be controlled by controlling the gas path, that is, controlling the opening and closing of the isolation valve 13. One end of the third hose 208 is connected to the valve body inlet, and the other end is connected to the first channel 206, so as to establish communication with the inside of the transmission chamber 2. Or it can also be connected to the first hose 205, and establish communication with the inside of the transmission chamber 2 through the first hose 205. Establish communication with the inside of the transmission chamber 2. One end of the fourth hose 209 is connected to the valve body outlet, and the other end is connected to the one end of the second channel 103, so as to establish communication with the inside of the process chamber 1. Controlling the opening and closing of the isolation valve 13 is to control the opening and closing of the third hose 208 and the fourth hose 209, that is, to control the opening and closing between the process chamber 1 and the transmission chamber 2.
[0085] Before wafer transmission, the slit valve and the isolation valve are both in a closed state. The pressure difference between the transmission chamber 2 and the process chamber 1 is determined by the first pressure sensor 201 and the second pressure sensor 204. If the pressure difference is less than the preset threshold, the slit valve 3 can be directly opened to perform wafer transmission. The wafer transmission can be to transmit the wafer from the transmission chamber to the process chamber for process treatment, or to return the wafer after process treatment from the process chamber to the transmission chamber. If the pressure difference is greater than or equal to the preset threshold, the isolation valve 13 can be opened first, and the transmission chamber 2 and the process chamber 1 are connected through the second channel 103, the fourth hose 209, the third hose 208, and the first channel 206 to balance the pressure of the transmission chamber and the process chamber. For example, if the pressure of the process chamber 1 is high, the pressure in the process chamber 1 is transmitted to the transmission chamber 2, so that the pressure difference between the process chamber 1 and the transmission chamber 2 can be fully utilized to quickly balance the pressure. Since the matching gap 102 is smaller than the cross section of the process connection channel between the transfer chamber and the process chamber controlled by the slit valve 3, the impact on the low-pressure chamber caused by the pressure difference is significantly reduced. After the pressure difference reaches less than the preset threshold, the slit valve 3 can be opened to transfer the wafer through the process connection channel.
[0086] The isolation valve 13 is a bellows valve, which is a normally closed structure. Figure 7 The bellows valve is in the open state. Figure 8 The bellows valve is in the closed state. The bellows valve includes a first body 130, the first body 130 has a valve cavity inside, and the valve body inlet 131 and the valve body outlet 132 are both connected to the valve cavity. A first plunger 134 is installed in the valve cavity, and the first plunger 134 passes through a first mounting plate 137. A pressure plate 138 is fixedly connected to the lower end of the first plunger 134. A first spring 136 is sleeved on the outer periphery of the first plunger 134. The upper end of the first spring contacts the first mounting plate 137. Under the action of the spring force, the pressure plate 138 is pressed on the valve body inlet 131, so that the valve body inlet 131 and the valve body outlet 132 are not connected under normal conditions. A first air vent 135 is provided on the main body above the first mounting plate 137 , through which air is ventilated to the top of the first mounting plate 137 , and gas pressure causes the first plunger to move upward, so that the pressure plate 137 does not close the valve body inlet 131 , and the valve body inlet 131 is connected to the valve body outlet 132 .
[0087] Among them, a second bellows 133 is fixedly connected between the pressure plate 138 and the first mounting plate 137. During the movement of the plunger, the second bellows can seal the inside of the second bellows and prevent it from being connected to the valve chamber, thereby ensuring the vacuum degree of the transmission chamber 2 and the process chamber.
[0088] Embodiment 3
[0089] Embodiment 3 is suitable for use in medium and low vacuum systems. It uses a double-layer sealing ring structure to seal the transmission chamber 2, and connects the transmission chamber and the process chamber by constructing a channel and a hose. By controlling the on and off of the isolation valve, the transmission chamber 2 and the process chamber 1 are connected when the slit valve is closed, so that the pressure difference is less than the preset threshold. The double-layer sealing ring structure includes a first layer of sealing ring between the valve stem and the collar, and the collar is coaxially installed on the periphery of the valve stem. A second layer of sealing ring is also provided between the periphery of the collar and the valve body. Double-layer sealing ring sealing is a common structure in the vacuum industry and will not be described in detail here.
[0090] Please refer to FIG6 , the valve body 200 is installed at the bottom of the transmission chamber 2, and the valve stem 104 is installed in the valve body 200, and the end of the valve stem 104 is fixedly connected to the valve plate 100, and the valve plate 100 is sealed with the process chamber 1 through the sealing ring 101. The valve stem 104 seals the gap between the valve stem 104 and the valve body 100 through the double-layer sealing ring structure 214. Specifically, the double-layer sealing ring structure 214 can be set on the side of the cavity away from the valve plate 100 (i.e., the rear end of the cavity). This makes the matching gap 102 between the valve stem 104 and the valve body 200 connected to the cavity (that is, the transmission chamber 2 is connected to the cavity), which is essentially different from the way of using the first bellows in the second embodiment.
[0091] When the valve stem 104 descends, the process connection channel between the transfer chamber 2 and the process chamber 1 can be opened. When the valve stem 104 rises, the process connection channel between the transfer chamber 2 and the process chamber 1 can be closed. The vacuum chamber pressure balancing device of this embodiment controls the opening and closing of the isolation valve according to the pressure difference between the transfer chamber 2 and the process chamber 1 when the slit valve is closed (i.e., when the valve plate 100 rises), so that the pressure between the transfer chamber 2 and the process chamber 1 is balanced.
[0092] The rise and fall of the valve stem 104 can be controlled by controlling the air circuit, wherein the first control air circuit 212 is used to control the rise of the valve stem 104, and the second control air circuit 211 is used to control the descent of the valve stem 104. Controlling the rise and fall of the valve plate by controlling the air circuit is a conventional structure of a slit valve and will not be discussed here. Among them, there is a cavity 202 surrounding the valve stem 104 on the valve body 200, and a first pressure sensor 201 is installed on the outer side of the cavity 202 of the valve plate 200, and the sensing end of the first pressure sensor 201 extends into the cavity 202. It should be noted that the fitting gap 102 is connected to the inside of the transmission chamber 2 and is also connected to the cavity 202. Therefore, the first pressure sensor 201 can establish communication with the inside of the transmission chamber 2 through the fitting gap, so that the pressure in the transmission chamber 2 can be detected.
[0093] A second pressure sensor 204 is installed outside the cavity 202 of the valve plate 200, and the sensing end of the second pressure sensor 204 extends into the cavity 202 and is connected to one end of a second hose 207. A second channel 103 is provided on the valve plate 100, and the other end of the second hose 207 is connected to one end of the second channel 103, and the other end of the second channel 103 extends to the inside of the process chamber. Therefore, the second pressure sensor 204 can establish communication with the inside of the process chamber 1 through the second hose 207 and the second channel 103, so as to detect the pressure in the process chamber 1.
[0094] The pressures in the transfer chamber 2 and the process chamber 1 can be obtained respectively through the first pressure sensor 201 and the second pressure sensor 204 , so as to determine the pressure difference between the transfer chamber 2 and the process chamber 1 .
[0095] An isolation valve 13 is also installed on the side wall of the cavity 202, and a fourth hose 209 is also arranged in the cavity 202. The isolation valve 13 has a valve body inlet and a valve body outlet. The opening and closing of the valve body inlet and the valve body outlet can be controlled by controlling the gas path, that is, controlling the opening and closing of the isolation valve 13. The valve body inlet extends into the cavity 202, so that it can be connected with the inside of the transmission chamber 2. One end of the fourth hose 209 is connected with the valve body outlet, and the other end is connected with the one end of the second channel 103, so that it can be connected with the inside of the process chamber 1. Controlling the opening and closing of the isolation valve 13, that is, controlling the opening and closing of the valve body inlet and the fourth hose 209, that is, controlling the opening and closing between the process chamber 1 and the transmission chamber 2.
[0096] Before wafer transmission, the slit valve and the isolation valve are both in a closed state. The pressure difference between the transmission chamber 2 and the process chamber 1 is determined by the first pressure sensor 201 and the second pressure sensor 204. If the pressure difference is less than the preset threshold, the slit valve 3 can be directly opened to perform wafer transmission. The wafer transmission can be to transmit the wafer from the transmission chamber to the process chamber for process treatment, or to return the wafer after process treatment from the process chamber to the transmission chamber. If the pressure difference is greater than or equal to the preset threshold, the isolation valve 13 can be opened first, and the transmission chamber 2 and the process chamber 1 are connected through the second channel 103, the fourth hose 209, the third hose 208, and the first channel 206 to balance the pressure of the transmission chamber and the process chamber. For example, if the pressure of the process chamber 1 is high, the pressure in the process chamber 1 is transmitted to the transmission chamber 2, so that the pressure difference between the process chamber 1 and the transmission chamber 2 can be fully utilized to quickly balance the pressure. Since the matching gap 102 is smaller than the cross section of the process connection channel between the transfer chamber and the process chamber controlled by the slit valve 3, the impact on the low-pressure chamber caused by the pressure difference is significantly reduced. After the pressure difference reaches less than the preset threshold, the slit valve 3 can be opened to transfer the wafer through the process connection channel.
[0097] Wherein, the isolation valve 13 can be a diaphragm valve, such as Fig. 9 The diaphragm valve is in the open state. Fig.10 The diaphragm valve is in the closed state. The diaphragm valve includes a second body 140, and the second body 140 has a valve cavity inside. The valve body inlet 131 and the valve body outlet 132 are both connected to the valve cavity. A second plunger 144 is installed in the valve cavity. The second plunger 144 passes through the second mounting plate 147. The lower end of the second plunger 144 is fixedly connected with a diaphragm 141. A second spring 146 is connected between the upper end of the second plunger 144 and the top of the valve cavity. Under the action of the spring force, the diaphragm 141 is pressed on the valve body inlet 131, so that the valve body inlet 131 and the valve body outlet 132 are not connected under normal conditions. A second vent 145 is provided on the body above the second mounting plate 147. The second vent 145 is used to vent air to the top of the second mounting plate 147. The gas pressure causes the second plunger 144 to move upward, so that the diaphragm 141 does not close the valve body inlet 131, and the valve body inlet 131 and the valve body outlet 132 are connected.
[0098] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and deformations according to the present invention, but these corresponding changes and deformations shall fall within the protection scope of the claims of the present invention.
Claims
1. A vacuum chamber pressure balancing device, characterized in that: include: A balanced connecting channel is connected between the process chamber and the transfer chamber, and the balanced connecting channel has a smaller cross section than a process connecting channel between the process chamber and the transfer chamber controlled by the slit valve; An isolation valve, installed on the balancing connection channel, Among them, if the pressure difference between the transfer chamber and the process chamber is less than a preset threshold, the slit valve opens the process connection channel, and wafers are transferred through the process connection channel; if the pressure difference is greater than or equal to the preset threshold, the isolation valve opens the balance connection channel until the pressure difference is less than the preset threshold, and then the slit valve opens the process connection channel, and wafers are transferred through the process connection channel.
2. The vacuum chamber pressure balancing device according to claim 1, characterized in that: The balancing connecting channel is a connecting pipeline, the isolation valve is installed on the connecting pipeline, and the connecting pipeline is connected between the transfer chamber and the process chamber through a connecting flange.
3. The vacuum chamber pressure balancing device according to claim 2, characterized in that: The connecting flange is one of a KF flange, a CF flange and an ISO flange.
4. The vacuum chamber pressure balancing device according to claim 1, characterized in that: The isolation valve is a diaphragm valve or a bellows valve.
5. The vacuum chamber pressure balancing device according to claim 1, characterized in that: The valve body (200) of the slit valve is provided with a cavity (202) surrounding the valve stem, an isolation valve is installed on the side wall of the cavity, the isolation valve has a valve body inlet and a valve body outlet, a continuous second channel (103) is provided on the valve stem (104) and the valve plate (100), and the second channel (103) extends to the interior of the process chamber; A third hose (208) and a fourth hose (209) are also provided in the cavity (202); one end of the fourth hose (209) is connected to the valve body outlet, and the other end is connected to the second channel (103); The valve body and the valve stem have a matching gap at their outer peripheries. A first channel (206) is provided on the valve body between the cavity (202) and the transmission chamber. The first channel (206) extends to the matching gap (102) between the valve body (200) and the valve stem (104). The matching gap (102) is communicated with the interior of the transmission chamber. One end of the third hose (208) is communicated with the valve body inlet, and the other end is connected to the first channel (206). Wherein, a bellows for sealing the transmission chamber is fixedly connected to the outer periphery of the valve stem in the front end of the cavity.
6. The vacuum chamber pressure balancing device according to claim 5, characterized in that: A first pressure sensor is installed on the valve body, and a sensing end of the first pressure sensor extends into the cavity and is connected to the first channel (206) through a hose; A second pressure sensor is also installed on the valve body, and the sensing end of the second pressure sensor extends into the cavity and is connected to the second channel (103) through a second hose.
7. The vacuum chamber pressure balancing device according to claim 1, characterized in that: The valve body (200) of the slit valve is provided with a cavity (202) surrounding the valve stem, an isolation valve is installed on the side wall of the cavity, the isolation valve has a valve body inlet and a valve body outlet, a continuous second channel (103) is provided on the valve stem (104) and the valve plate (100), and the second channel (103) extends to the interior of the process chamber; The valve body and the valve stem have a matching gap at their peripheries, the valve body inlet of the isolation valve is in communication with the cavity, so that the valve body inlet is in communication with the transmission chamber through the matching gap, and a fourth hose (209) is further arranged in the cavity (202), one end of the fourth hose (209) is in communication with the valve body outlet, and the other end is in communication with the second channel (103); A double-layer sealing ring structure for sealing the transmission chamber is fixedly connected to the outer periphery of the valve stem at the rear end of the cavity.
8. The vacuum chamber pressure balancing device according to claim 7, characterized in that: A first pressure sensor is mounted on the valve body, the sensing end of the first pressure sensor extends into the cavity. A second pressure sensor is also mounted on the valve body, the sensing end of the second pressure sensor extends into the cavity and is connected to the second channel (103) via a second hose.
9. The vacuum chamber pressure balancing device according to claim 2, characterized in that: The transfer chamber is connected to the process chamber through a plurality of connecting pipes.
10. The vacuum chamber pressure balancing device according to claim 2, characterized in that: The transfer chamber is connected to the process chamber through a plurality of connecting pipelines branched from the main pipe.