Compatible open type wafer box loading device

Abstract

The invention relates to the technical field of semiconductor equipment, and discloses a compatible open type wafer box loading device which comprises a supporting bottom plate, a wafer box positioning assembly, a wafer box in-place detection assembly and a wafer protrusion detection assembly. The compatible open type wafer cassette loading device can be compatible with wafer cassettes of different specifications, when the wafer cassettes are replaced, the wafer cassette positioning assembly does not need to be replaced or the position of the wafer cassette positioning assembly does not need to be adjusted, the position of the wafer cassette in-place detection assembly does not need to be adjusted, and the position of the wafer protruding detection assembly does not need to be adjusted. The wafer protruding detection assembly is not affected, the specification of the wafer box can be automatically identified only by placing the wafer box at the corresponding position on the supporting bottom plate, manual participation and confirmation are not needed in the whole process basically, and therefore the operation difficulty and the error probability are reduced, and follow-up wafer taking and placing of a mechanical arm are facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a compatible open wafer box loading device. Background Art

[0002] At present, a latest development trend in the semiconductor manufacturing field, especially in the third-generation emerging semiconductor manufacturing field of silicon carbide, is that customer production lines are gradually upgrading from six-inch wafer manufacturing to eight-inch wafer manufacturing, while still retaining six-inch wafer manufacturing, that is, achieving co-production of six- and eight-inch wafers.

[0003] However, the existing open cassette (CST) loading devices widely used in semiconductor manufacturing are often designed for six-inch CSTs and are not compatible with eight-inch CSTs. Even if they are compatible with two sizes of CSTs, the following problems still exist:

[0004] 1) When replacing CST of different specifications, it is necessary to manually replace the corresponding block or adjust its position;

[0005] 2) When replacing CST of different specifications, it is necessary to manually adjust the position of the corresponding in-situ detection sensor;

[0006] 3) When replacing CST of different specifications, it is necessary to manually adjust the position of the wafer protrusion detection sensor;

[0007] 4) When changing to a different specification of CST, the system cannot automatically identify the specification of the current CST, and manual confirmation is required to inform the system of the current CST specification;

[0008] 5) The accuracy of the wafer protrusion detection sensor is affected by the wafer style. There are two types of wafers: notch type (usually eight-inch wafers have notch in English) and flat edge type (usually six-inch wafers have flat in English). In the prior art, whether the wafer is protruding is usually determined by detecting the edge of the notch type wafer. However, when a flat wafer is replaced, if the sensor is facing the flat edge of the flat wafer, then when a part of the wafer protrudes and the flat edge of the wafer does not reach the sensor position, the sensor cannot detect the wafer and will mistakenly judge that the wafer is not protruding, thereby causing inaccurate wafer protrusion detection.

[0009] The above problems result in a large amount of manual adjustment and confirmation of the CST loading device when switching between six-inch and eight-inch CSTs, and there are cases of false detection of wafer protrusions, which increases the difficulty of operation and the probability of error, and requires technical improvements. Summary of the invention

[0010] In view of the above problems, the purpose of the present invention is to provide a compatible open wafer box loading device, so that the replacement process of wafer boxes of different specifications basically does not require manual adjustment and confirmation, thereby reducing the difficulty of operation and the probability of error.

[0011] To achieve the above object, the present invention adopts the following technical solutions:

[0012] A compatible open wafer box loading device comprises a supporting base plate, a wafer box positioning assembly mounted on the supporting base plate, a wafer box in-situ detection assembly and a wafer protrusion detection assembly, wherein:

[0013] The wafer box positioning assembly includes a first positioning block, a second positioning block and a third positioning block. The first positioning block cooperates with the second positioning block to position a wafer box of a first specification, and the second positioning block cooperates with the third positioning block to position a wafer box of a second specification.

[0014] The wafer box in-place detection component includes a plurality of in-place sensors, which are used to determine whether the wafer box is placed in place;

[0015] The wafer protrusion detection assembly includes at least two protrusion detection sensors, the light spots of the two protrusion detection sensors are simultaneously tangent to the outer contours of wafers in wafer boxes of different specifications, and the center distance of the light spots of the two protrusion detection sensors is not less than the length of the positioning edge of the wafer.

[0016] As an optional solution, the first positioning block, the second positioning block and the third positioning block are arranged in sequence along the center line of the supporting base plate, and the two protrusion detection sensors are symmetrically distributed on both sides of the center line of the supporting base plate.

[0017] As an optional solution, the wafer box positioning assembly further includes at least one fourth positioning block, and the fourth positioning block is used to position the side edge of the wafer box of the first specification.

[0018] As an optional solution, two fourth positioning blocks are provided, and the two fourth positioning blocks are symmetrically distributed on both sides of the center line of the supporting base plate, and are used to position the two side edges of the wafer box of the first specification.

[0019] As an optional solution, the wafer box positioning assembly further includes at least one fifth positioning block, and the fifth positioning block is used to position the side edge of the wafer box of the second specification.

[0020] As an optional solution, two fifth positioning blocks are provided, and the two fifth positioning blocks are symmetrically distributed on both sides of the center line of the supporting base plate, and are used to position the two side edges of the wafer box of the second specification.

[0021] As an optional solution, the fourth positioning block and / or the fifth positioning block is an L-shaped block, the side surface of the side edge of the wafer box is abutted against a right angle edge of the L-shaped block, and the end face of the side edge of the wafer box is abutted against another right angle edge of the L-shaped block.

[0022] As an optional solution, the wafer box in-situ detection component includes a first in-situ sensor and a second in-situ sensor, wherein:

[0023] At least one first in-position sensor is arranged in the gap between the first positioning block and the second positioning block, for detecting whether the middle edge of the bottom of the wafer box of the first specification is in position;

[0024] At least one second in-situ sensor is arranged in the gap between the second positioning block and the third positioning block, and is used to detect whether the middle edge of the bottom of the wafer box of the second specification is in place.

[0025] As an optional solution, the wafer box in-situ detection component also includes a third in-situ sensor, which is located at a position where the side edges of the wafer box of the first specification and the wafer box of the second specification overlap when the wafer box are placed in place, and is used to detect whether the side edge of the wafer box of the first specification or the side edge of the wafer box of the second specification is in place.

[0026] As an optional solution, the in-position sensor includes a mounting bracket, a sensing block and a proximity switch, wherein:

[0027] The mounting bracket is arranged on the lower surface of the supporting base plate;

[0028] The first end of the induction pressure block passes through the supporting bottom plate, the second end of the induction pressure block passes through the mounting bracket, a protrusion is arranged in the middle of the induction pressure block, and a compression spring is arranged between the protrusion and the mounting bracket;

[0029] The proximity switch is located below the mounting bracket. When the first end of the sensing pressure block is pressed into the supporting bottom plate and the second end of the sensing pressure block is close to the proximity switch, the proximity switch sends an in-position signal.

[0030] Beneficial effects of the present invention:

[0031] The compatible open wafer box loading device is compatible with wafer boxes of different specifications. Taking six-inch wafer boxes and eight-inch wafer boxes as examples, when replacing the wafer box, at least two specifications of wafer boxes are adapted through the first positioning block, the second positioning block and the third positioning block. There is no need to replace the wafer box positioning component or adjust its position, there is no need to adjust the position of the wafer box in-situ detection component, there is no need to adjust the position of the wafer protrusion detection component, and no matter whether it is a notched wafer or a flat-edge wafer, it can be ensured that the light spot of at least one protrusion detection sensor is tangent to the outer contour of the wafer, so that the wafer protrusion detection component is not affected. The wafer box only needs to be placed on the corresponding position on the supporting base plate to automatically identify the specifications of the wafer box. The entire process basically does not require manual participation and confirmation, thereby reducing the difficulty of operation and the probability of error, and is more conducive to subsequent robotic arms to pick up and place wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a schematic structural diagram of a compatible open wafer box loading device provided by an embodiment of the present invention;

[0033] Figure 2 It is a schematic diagram of protrusion detection of a six-inch wafer and an eight-inch wafer by a wafer protrusion detection assembly involved in an embodiment of the present invention;

[0034] Figure 3 is a schematic diagram of placing a six-inch wafer box on a supporting base plate involved in an embodiment of the present invention;

[0035] Figure 4 is a schematic diagram of placing an eight-inch wafer box on a supporting base plate according to an embodiment of the present invention;

[0036] Figure 5 It is a schematic diagram of the structure of an in-situ sensor involved in an embodiment of the present invention.

[0037] In the attached figure:

[0038] 1. Support the bottom plate;

[0039] 2. Wafer box positioning assembly; 21. First positioning block; 22. Second positioning block; 23. Third positioning block; 24. Fourth positioning block; 25. Fifth positioning block;

[0040] 3. Wafer box in-place detection assembly; 31. First in-place sensor; 311. Mounting bracket; 312. Inductive pressure block; 313. Proximity switch; 314. Compression spring; 32. Second in-place sensor; 33. Third in-place sensor;

[0041] 4. Wafer protrusion detection component; 41. Protrusion detection sensor;

[0042] 5. Six-inch wafer box;

[0043] 6. Eight-inch wafer box;

[0044] 7. Side edges;

[0045] 8. Middle edge. DETAILED DESCRIPTION

[0046] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0047] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0049] In the description of this embodiment, terms such as "up", "down", "left", and "right" and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0050] In addition, the terms "first", "second", etc. are merely used to distinguish in description and have no special meanings.

[0051] Embodiment 1:

[0052] See also Figure 1 and Figure 2As shown, this embodiment provides a compatible open wafer box loading device, including a supporting base plate 1, a wafer box positioning component 2 installed on the supporting base plate 1, a wafer box in-situ detection component 3 and a wafer protrusion detection component 4. Among them, the wafer box positioning component 2 is used to position the wafer box placed on the supporting base plate 1. Several wafers can be stacked in the wafer box, and there are positioning notches or positioning edges on the wafers. The wafer box positioning component 2 includes a first positioning block 21, a second positioning block 22 and a third positioning block 23. The first positioning block 21 cooperates with the second positioning block 22 to position the wafer box of the first specification, and the second positioning block 22 cooperates with the third positioning block 23 to position the wafer box of the second specification; the wafer box in-place detection component 3 includes several in-place sensors, and the in-place sensors are used to determine whether the wafer box is placed in place; the wafer protrusion detection component 4 includes at least two protrusion detection sensors 41, and the light spots of the two protrusion detection sensors 41 are tangent to the outer contours of the wafers in wafer boxes of different specifications at the same time, and the center distance of the light spots of the two protrusion detection sensors 41 is not less than the length of the positioning edge of the wafer.

[0053] In this embodiment, the first specification of the wafer box is taken as an example of a six-inch wafer box 5, and the second specification of the wafer box is taken as an example of an eight-inch wafer box 6, which are explained in detail. The six-inch wafers in the six-inch wafer box 5 are provided with positioning edges, and the eight-inch wafers in the eight-inch wafer box 6 are provided with positioning notches.

[0054] The center distance A of the light spots of the two protrusion detection sensors 41 is greater than the length B of the positioning edge of the six-inch wafer, so that no matter at what angle the wafers in the wafer box are placed, it can be ensured that the light spot of at least one of the two protrusion detection sensors 41 is tangent to the outer contour of the wafer, such as Figure 2 As shown, this ensures that protrusion detection will not cause false detection and is compatible with the detection of flat and notch wafers.

[0055] In addition, the wafer boxes are not limited to these two specifications, but can also be wafer boxes of other specifications. It is only necessary to adjust the position and quantity of the wafer box positioning component 2 and the wafer box in-situ detection component 3 on the supporting base plate 1 according to the specific size and characteristics of the wafer box to achieve compatible loading of wafer boxes of different specifications.

[0056] Therefore, the compatible open wafer box loading device can be compatible with wafer boxes of different specifications. When replacing the wafer box, at least two specifications of wafer boxes can be adapted through the first positioning block 21, the second positioning block 22 and the third positioning block 23. There is no need to replace the wafer box positioning component 2 or adjust its position, there is no need to adjust the position of the wafer box in-situ detection component 3, there is no need to adjust the position of the wafer protrusion detection component 4, and no matter whether it is a notch-type wafer or a flat-edge wafer, it can be ensured that the light spot of at least one protrusion detection sensor 41 is tangent to the outer contour of the wafer, so that the wafer protrusion detection component 4 is not affected. It only needs to place the wafer box at the corresponding position on the supporting base plate 1 to automatically identify the specifications of the wafer box. The whole process basically does not require manual participation and confirmation, thereby reducing the difficulty of operation and the probability of error, and is more conducive to subsequent robot pick-up and placement of wafers.

[0057] Embodiment 2:

[0058] See also Figure 1 and Figure 2 As shown, this embodiment provides a compatible open wafer box loading device. On the basis of Example 1, the first positioning block 21, the second positioning block 22 and the third positioning block 23 are arranged in sequence along the center line of the supporting base plate 1, and the two protrusion detection sensors 41 are symmetrically distributed on both sides of the center line of the supporting base plate 1.

[0059] Specifically, the six-inch wafer box 5 and the eight-inch wafer box 6 both include two side edges 7 and a middle edge 8 connecting the two side edges 7. The middle edge 8 of the six-inch wafer box 5 is clamped between the first positioning block 21 and the second positioning block 22 to form a positioning, and the middle edge 8 of the eight-inch wafer box 6 is clamped between the second positioning block 22 and the third positioning block 23 to form a positioning.

[0060] Therefore, through the combination of different positioning blocks, wafer boxes of different specifications can be accurately adapted to limit the position of the wafer box on the supporting base plate 1, especially the design of the shared second positioning block 22, which simplifies the structure of the wafer box positioning assembly 2, and when switching wafer boxes of different specifications, there is no need to remove the idle positioning blocks, which is flexible and convenient to use. In addition, placing the wafer box and the wafer symmetrically on the supporting base plate 1 can ensure the balance and accuracy of the detection, reduce the error caused by asymmetry, and further improve the stability and reliability of wafer box loading and detection.

[0061] Embodiment 3:

[0062] See also Figures 1 to 3 As shown, this embodiment provides a compatible open wafer box loading device. On the basis of Example 2, the wafer box positioning assembly 2 also includes at least one fourth positioning block 24, and the fourth positioning block 24 is used to position the side edge 7 of the six-inch wafer box 5.

[0063] Furthermore, two fourth positioning blocks 24 are provided, and the two fourth positioning blocks 24 are symmetrically distributed on both sides of the center line of the supporting base plate 1 , and are used to position the two side edges 7 of the six-inch wafer box 5 .

[0064] In addition, the fourth positioning block 24 is preferably an L-shaped block, and the side surface of the side edge 7 of the six-inch wafer box 5 is in contact with a right angle edge of the L-shaped block, and the end surface of the side edge 7 of the six-inch wafer box 5 is in contact with another right angle edge of the L-shaped block.

[0065] Therefore, by using the fourth positioning block 24 in cooperation with the first positioning block 21 and the second positioning block 22, the six-inch wafer box 5 is precisely positioned in all directions, ensuring the stability and detection accuracy of the six-inch wafer box 5 during the loading process.

[0066] Embodiment 4:

[0067] See also Figure 1 , Figure 2 and Figure 4 As shown, this embodiment provides a compatible open wafer box loading device. On the basis of Embodiment 2, the wafer box positioning assembly 2 further includes at least one fifth positioning block 25, and the fifth positioning block 25 is used to position the side edge 7 of the eight-inch wafer box 6.

[0068] Furthermore, two fifth positioning blocks 25 are provided, and the two fifth positioning blocks 25 are symmetrically distributed on both sides of the center line of the supporting base plate 1 , and are used to position the two side edges 7 of the eight-inch wafer box 6 .

[0069] In addition, the fifth positioning block 25 is preferably an L-shaped block, and the side surface of the side edge 7 of the eight-inch wafer box 6 is in contact with a right angle edge of the L-shaped block, and the end surface of the side edge 7 of the eight-inch wafer box 6 is in contact with another right angle edge of the L-shaped block.

[0070] Therefore, by using the fifth positioning block 25 in conjunction with the second positioning block 22 and the third positioning block 23, the eight-inch wafer box 6 is accurately positioned in all directions, ensuring the stability and detection accuracy of the eight-inch wafer box 6 during the loading process.

[0071] It should be noted that, in other embodiments, Embodiment 3 and Embodiment 4 may be combined to achieve simultaneous precise positioning of a six-inch wafer box and an eight-inch wafer box.

[0072] Embodiment 5:

[0073] See also Figures 1 to 4As shown, this embodiment provides a compatible open wafer box loading device. On the basis of Embodiment 1, the wafer box in-place detection component 3 includes a first in-place sensor 31 and a second in-place sensor 32. At least one first in-place sensor 31 is arranged in the gap between the first positioning block 21 and the second positioning block 22. The first in-place sensor 31 is used to detect whether the middle edge 8 of the six-inch wafer box 5 is in place; at least one second in-place sensor 32 is arranged in the gap between the second positioning block 22 and the third positioning block 23. The second in-place sensor 32 is used to detect whether the middle edge 8 of the eight-inch wafer box 6 is in place.

[0074] Furthermore, this embodiment takes the example of setting two first in-place sensors 31 and two second in-place sensors 32. The two first in-place sensors 31 are located at both ends of the gap between the first positioning block 21 and the second positioning block 22, and the two second in-place sensors 32 are located at both ends of the gap between the second positioning block 22 and the third positioning block 23, so as to fully ensure the accuracy of the detection results.

[0075] Therefore, the middle edge 8 of the wafer box is accurately detected through multiple in-situ sensors to monitor the in-situ status of the wafer box in real time. At the same time, according to the triggering conditions of the in-situ sensors at different positions, the specifications of the currently loaded wafer box can be automatically identified, ensuring the intelligence and efficiency of the detection system and further improving the automation level of the production line.

[0076] Embodiment 6:

[0077] See also Figures 1 to 4 As shown, this embodiment provides a compatible open wafer box loading device. On the basis of Example 5, the wafer box in-situ detection component 3 also includes a third in-situ sensor 33. The third in-situ sensor 33 is located at a position where the side edges 7 of the six-inch wafer box 5 and the eight-inch wafer box 6 overlap when the six-inch wafer box 5 and the eight-inch wafer box 6 are placed in place. The third in-situ sensor 33 is used to detect whether the side edge 7 of the six-inch wafer box 5 or the side edge 7 of the eight-inch wafer box 6 is in place.

[0078] Thus, by sharing the third in-situ sensor 33, dual verification of the side edges 7 of the six-inch wafer box 5 and the side edges 7 of the eight-inch wafer box 6 is achieved, reducing the number of in-situ sensors, optimizing the detection layout, and reducing costs.

[0079] When detecting the six-inch wafer box 5, the two first in-position sensors 31 are triggered by the middle edge 8 of the six-inch wafer box 5, and the third in-position sensor 33 is triggered by the side edge 7 of the six-inch wafer box 5. When the two first in-position sensors 31 and the third in-position sensor 33 are triggered at the same time, the system determines that the six-inch wafer box 5 is completely placed in place. For details, see Figure 3 .

[0080] When detecting the eight-inch wafer box 6, the two second in-position sensors 32 are triggered by the middle edge 8 of the eight-inch wafer box 6, and the third in-position sensor 33 is triggered by the side edge 7 of the eight-inch wafer box 6. When the two second in-position sensors 32 and the third in-position sensor 33 are triggered at the same time, the system determines that the eight-inch wafer box 6 is completely placed in place, see Figure 4 .

[0081] Embodiment 7:

[0082] See also Figure 5 As shown, this embodiment provides a compatible open wafer box loading device. On the basis of Example 1, the structures of various in-situ sensors can be the same or different. Taking the first in-situ sensor 31 as an example, it includes a mounting bracket 311, a sensing pressure block 312 and a proximity switch 313. The mounting bracket 311 is arranged on the lower surface of the supporting base plate 1; the first end of the sensing pressure block 312 passes through the supporting base plate 1, and the second end of the sensing pressure block 312 passes through the mounting bracket 311. A protrusion is arranged in the middle of the sensing pressure block 312, and a compression spring 314 is arranged between the protrusion and the mounting bracket 311; the proximity switch 313 is located below the mounting bracket 311. When the first end of the sensing pressure block 312 is pressed into the supporting base plate 1 and the second end of the sensing pressure block 312 is close to the proximity switch 313, the proximity switch 313 sends an in-situ signal.

[0083] Therefore, the touch detection method is adopted to ensure the high sensitivity and stability of the sensor. When the sensing block 312 is pressed by the contact of the wafer box, the sensing block 312 overcomes the elastic force of the compression spring 314 and retracts downward into the supporting base plate 1, thereby triggering the proximity switch 313 and sending a signal of being in place; when the wafer box is removed, the sensing block 312 is reset under the action of the compression spring 314, and the second end of the sensing block 312 is away from the proximity switch 313, sending a signal of not being in place.

[0084] In summary, the compatible open wafer box loading device is interdependent, interrelated and coordinated with the wafer box positioning component 2, the wafer box in-situ detection component 3 and the wafer protrusion detection component 4. It can be compatible with six-inch wafer boxes 5, eight-inch wafer boxes 6 and even wafer boxes of other specifications. There is no need to adjust the device structure when replacing the wafer box. It is only necessary to place the wafer box in the corresponding position, and the device can automatically identify the specifications of the currently placed wafer box. Compared with the prior art that requires a large amount of manual adjustment and manual confirmation of the wafer box carrier device, and there is a false detection of wafer protrusion detection, the compatible open wafer box loading device realizes rapid positioning, automatic judgment, and accurate identification of wafer box replacement, with higher efficiency, higher accuracy and higher safety.

[0085] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A compatible open wafer box loading device, characterized in that: The invention comprises a supporting base plate (1), a wafer box positioning component (2) installed on the supporting base plate (1), a wafer box in-situ detection component (3) and a wafer protrusion detection component (4), wherein: The wafer box positioning assembly (2) comprises a first positioning block (21), a second positioning block (22) and a third positioning block (23); the first positioning block (21) cooperates with the second positioning block (22) to position a wafer box of a first specification, and the second positioning block (22) cooperates with the third positioning block (23) to position a wafer box of a second specification; The wafer box in-place detection component (3) comprises a plurality of in-place sensors, and the in-place sensors are used to determine whether the wafer box is in place; The wafer protrusion detection assembly (4) comprises at least two protrusion detection sensors (41), the light spots of the two protrusion detection sensors (41) are simultaneously tangent to the outer contours of wafers in wafer boxes of different specifications, and the center distance of the light spots of the two protrusion detection sensors (41) is not less than the length of the positioning edge of the wafer.

2. The compatible open wafer box loading device according to claim 1, characterized in that: The first positioning block (21), the second positioning block (22) and the third positioning block (23) are arranged in sequence along the center line of the supporting base plate (1), and the two protrusion detection sensors (41) are symmetrically distributed on both sides of the center line of the supporting base plate (1).

3. The compatible open wafer box loading device according to claim 2, characterized in that: The wafer box positioning assembly (2) further comprises at least one fourth positioning block (24), wherein the fourth positioning block (24) is used to position the side edge of a wafer box of the first specification.

4. The compatible open wafer box loading device according to claim 3, characterized in that: Two fourth positioning blocks (24) are provided, and the two fourth positioning blocks (24) are symmetrically distributed on both sides of the center line of the supporting base plate (1) and are used to position the two side edges of the wafer box of the first specification.

5. The compatible open wafer box loading device according to claim 2, characterized in that: The wafer box positioning assembly (2) further comprises at least one fifth positioning block (25), wherein the fifth positioning block (25) is used to position the side edge of the wafer box of the second specification.

6. The compatible open wafer box loading device according to claim 5, characterized in that: Two fifth positioning blocks (25) are provided, and the two fifth positioning blocks (25) are symmetrically distributed on both sides of the center line of the supporting base plate (1) and are used to position the two side edges of the wafer box of the second specification.

7. The compatible open wafer box loading device according to claim 4 or 6, characterized in that: The fourth positioning block (24) and / or the fifth positioning block (25) are L-shaped clamping blocks, the side surface of the side edge of the wafer box is in contact with a right angle side of the L-shaped clamping block, and the end surface of the side edge of the wafer box is in contact with another right angle side of the L-shaped clamping block.

8. The compatible open wafer box loading device according to claim 1, characterized in that: The wafer box in-situ detection component (3) comprises a first in-situ sensor (31) and a second in-situ sensor (32), wherein: At least one first in-position sensor (31) is arranged in the gap between the first positioning block (21) and the second positioning block (22), and is used to detect whether the middle edge of the bottom of the wafer box of the first specification is in position; At least one second in-situ sensor (32) is arranged in the gap between the second positioning block (22) and the third positioning block (23) to detect whether the middle edge of the bottom of the wafer box of the second specification is in place.

9. The compatible open wafer box loading device according to claim 8, characterized in that: The wafer box in-situ detection component (3) also includes a third in-situ sensor (33), which is located at a position where the side edges of the wafer box of the first specification and the wafer box of the second specification overlap when the wafer box is in place, and is used to detect whether the side edge of the wafer box of the first specification or the side edge of the wafer box of the second specification is in place.

10. The compatible open wafer box loading device according to claim 1, characterized in that: The in-position sensor comprises a mounting bracket (311), an induction pressure block (312) and a proximity switch (313), wherein: The mounting bracket (311) is arranged on the lower surface of the supporting base plate (1); The first end of the sensing pressure block (312) passes through the supporting base plate (1), and the second end of the sensing pressure block (312) passes through the mounting bracket (311). A protrusion is provided in the middle of the sensing pressure block (312), and a compression spring (314) is provided between the protrusion and the mounting bracket (311); The proximity switch (313) is located below the mounting bracket (311), and when the first end of the sensing pressure block (312) is pressed into the supporting base plate (1) and the second end of the sensing pressure block (312) is close to the proximity switch (313), the proximity switch (313) sends an in-position signal.

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